CN110310905A - Processing chamber housing and processor including it - Google Patents
Processing chamber housing and processor including it Download PDFInfo
- Publication number
- CN110310905A CN110310905A CN201910216260.5A CN201910216260A CN110310905A CN 110310905 A CN110310905 A CN 110310905A CN 201910216260 A CN201910216260 A CN 201910216260A CN 110310905 A CN110310905 A CN 110310905A
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- Prior art keywords
- gas
- air supply
- operating mode
- processing chamber
- gas flow
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to processing chamber housing and including its processor.The processing chamber housing of an embodiment according to the present invention is formed with the flowable inner space of gas, comprising: gas flow means are discharged gas from the inner space of processing chamber housing, and supply a gas to inner space；Passage portion, passage portion include: access main body；Outflux is formed in access main body, and gas is discharged from inner space；And inflow entrance, it is formed in access main body, supplies a gas to inner space；And gas flow paths adjustment unit, the gas flow paths of passage portion are controlled, gas flow paths adjustment unit includes the first operating mode, opens the first flow path between inflow entrance and outflux, closes the second flow path between the outside of processing chamber housing and inner space；Second operating mode opens second flow path, and gas flow paths adjustment unit is selectively with any operating mode driving in the first operating mode and the second operating mode.
Description
Technical field
The present invention relates to a kind of processing chamber housing and including its processor.
Background technique
Processor (handler) is partly led by tester to what is manufactured by defined manufacturing process for supporting
Volume elements part is tested, and according to test result, is classified according to grade to semiconductor element and be loaded into client's pallet
Equipment.
In this processor, it is provided with the multiple test pallets recycled along transmitting path.This test pallet
Transmitting path, can through loading (loading) device, thermostatic chamber, test chamber, remove hot chamber and discharge mechanism.
Before being tested, semiconductor element is set to the temperature based on test condition in advance by thermostatic chamber, after being tested,
Except semiconductor element is restored to the temperature of regulation level by hot chamber in advance before unloading semiconductor element.This thermostatic chamber
With except hot chamber is by the running rate of raising tester (TESTER) and discharge mechanism, finally to can be improved the processing energy of equipment
Power.In addition, in the processor, multiple test pallets logical are contained in thermostatic chamber or except hot chamber in the state of goes forward side by side biography one
It send, during going forward side by side transmission in this way, the semiconductor element for being loaded into test pallet can rest on thermostatic chamber and except hot chamber
Trip temperature of going forward side by side in room adjustment.
However, recently, the quantity of the electronic component of unit time domestic demand processing tends to the trend continued to increase, accordingly,
Testing time in test chamber also tends to the trend gradually decreased.Therefore, with the reduction of testing time accordingly for such as
Except the cooling of the electronic component in the processing chamber housing of hot chamber, the temperature for heating or being restored to room temperature restore technique speed and
Efficiency also becomes extremely important.
In addition, recently, when testing under various test conditions electronic component, whenever temperature condition occurs
When variation, needs to cooperate the test condition changed rapidly and be tested.
Summary of the invention
The embodiment of the present invention is proposed in view of the prior art as described above, and the purpose of the present invention is to provide one
It kind being capable of the processing chamber housing that is adjusted of the temperature more quickly and effectively to the object as temperature regulating object.
Additionally, it is provided it is a kind of, even if the temperature condition of test changes, in the equipment or structure for being changed without processing chamber housing
In the case where can also change the processing chamber housing of internal temperature environment inlet air flow path.
According to an aspect of the present invention, a kind of processing chamber housing is provided, the inside sky that gas is able to carry out flowing is formed with
Between, comprising: gas flow means are used to that gas to be discharged from the inner space of the processing chamber housing, and are used for gas
Body is supplied to the inner space；Passage portion comprising access main body, outflux and inflow entrance, the outflux are formed in
The access main body, and for gas to be discharged from the inner space, the inflow entrance is formed in the access main body, and
For supplying a gas to the inner space；And gas flow paths adjustment unit, to the gas stream of the passage portion
Dynamic path is controlled, and the gas flow paths adjustment unit includes the first operating mode, opens the inflow entrance and institute
State the first flow path between outflux, and close between the outside of the processing chamber housing and the inner space second
Flow path；Second operating mode opens the second flow path, and the gas flow paths adjustment unit is selectively
It is driven with any one operating mode in first operating mode and second operating mode.
Furthermore it is possible to provide a kind of processing chamber housing, wherein the gas flow means include gas supply unit, described
Gas supply unit is set to the inflow entrance side, for supplying gas, the gas supply unit packet to the inner space
Include: the first main air supply fan is configured at the inner space side on the basis of the inflow entrance in the access main body；With
And first helping air supply fan, be configured at the phase of the inner space on the basis of the inflow entrance in the access main body
Toss about, and with the described first main air supply fan interval accessories, and, the gas stream opposite with the described first main air supply fan
Dynamic path adjustment unit includes gas flow paths adjustment member, and the gas flow paths adjustment member proceeds as follows
Movement, under first operating mode, guidance is moved to the stream from the gas that the outflux is flowed into the passage portion
Entrance side, under second operating mode, blocking is moved to described from the gas that the outflux is flowed into the passage portion
Inflow entrance side.At this point, gas flow paths adjustment member can also proceed as follows movement, in first operating mode
Under, it blocks and is flowed into the described first main air supply fan side from the gas that first helping air supply is fanned, in the second running mould
Under formula, guide the gas fanned from first helping air supply to be moved to the described first main air supply fan side.
Furthermore it is possible to provide a kind of processing chamber housing, wherein the access main body and the gas flow paths adjustment member
The gas flow space extended from the outflux side towards the inflow entrance side is provided, so that gas is flowed, the gas
Body flow path adjustment member be in first operating mode when by being moved towards outflux side, to guide from institute
It states outflux and is flowed into the gas of the passage portion and be moved to the inflow entrance side via the gas flow space, be in
By being moved towards the inflow entrance side when second operating mode, described lead to is flowed into block from the outflux
The gas in road portion is moved to the inflow entrance side.
Furthermore it is possible to provide a kind of processing chamber housing, wherein the gas supply unit further include: the second main air supply fan,
Be configured at the inner space side on the basis of the inflow entrance in the access main body, and with the described first main gas supply
Fan separates predetermined distance and configures；And second helping air supply fan, be configured in the access main body with the inflow entrance
On the basis of the inner space opposite side, the gas flow paths adjustment unit further includes the lock for being formed with gate access
Door component, the component of the strobe are constituted are as follows: under first operating mode, block the gas fanned from first helping air supply
Body is flowed into the described first main air supply fan side, and blocks and be flowed into described second from the gas that second helping air supply is fanned
Main air supply fan side, under second operating mode, by fanning the gate access with first helping air supply and described
In second helping air supply fan at least any one is opposite, to allow from first helping air supply fan and second auxiliary
The gas of air supply fan accordingly flows to the described first main air supply fan and the second main air supply fan.
Additionally, it is provided a kind of processing chamber housing, wherein the gas flow paths adjustment unit further includes being formed with lid perforation
The The lid component in hole, the component of the strobe drive as follows, under first operating mode, cover the lid through hole,
Under second operating mode, the lid through hole and the gate access is made to communicate with each other.
Furthermore it is possible to provide a kind of processor, comprising: loading attachment is used to load electronic component；Processing chamber,
It will terminate the electronic component loaded preheating or be cooled to testing setup temperature in advance；Test chamber, to warmed-up or pre-cooling
The electronic component is tested；The processing chamber housing reverts to the temperature for terminating the electronic component of the test
The temperature of predetermined level；And discharge mechanism, the electronic component of the temperature of recovery to the predetermined level is unloaded
It carries.
According to an embodiment of the invention, processing chamber housing can be more quickly and effectively to as required temperature regulating object
The temperature of object is adjusted.
In addition, processing chamber housing is included by changing inlet air flow path in the case where no replacement is required its equipment or structure,
The effect of changed test temperature condition can be coped with rapidly.
Detailed description of the invention
Fig. 1 is the concept map for showing the processor of one embodiment of the invention.
Fig. 2 is the concept map of the processing chamber housing for the processor being set in Fig. 1.
Fig. 3 is the perspective view of the gas flowing device for the processing chamber housing being set in Fig. 2.
Fig. 4 is the rearview of the gas flowing device in Fig. 3.
Fig. 5 is the stereogram exploded view of the gas flowing device in Fig. 3.
Fig. 6 is the stereogram exploded view of the gas discharge unit in Fig. 5.
Fig. 7 is the stereogram exploded view of the gas supply unit in Fig. 5.
Fig. 8 is standing for the gas flowing device of processing chamber housing when gas flow paths adjustment unit is in the first operating mode
Body exploded view.
Fig. 9 is standing for the gas flowing device of processing chamber housing when gas flow paths adjustment unit is in the second operating mode
Body exploded view.
Description of symbols
1: processor 10: loading attachment
20: processing chamber 30: test chamber
40: processing chamber housing 41: cavity
42: gas flows device 50: discharge mechanism
100: passage portion 101: access main body
102: inboard channel wall 103: outboard channel wall
111: outflux 115: outflow via hole
116: guiding piece 117: setting unit
121: inflow entrance 125: flowing into via hole
200: gas flow means 210: gas discharge unit
211: exhaust fan 211-1: inside discharge fan
211-2: outside discharge fan 212: spacer
220: gas supply unit 222: air supply fan
222-1: the first main air supply fan of main air supply fan 222-2: the second
223-1: the first helping air supply fans the 223-2: the second helping air supply fan
300: gas flow paths adjustment unit 320: gas flow paths adjustment member
321: inside adjustment section 321-1: the first is open
321-2: the second opening 322: outside adjustment section
330: The lid component 331: lid through hole
331-1: the first lid through hole the 331-2: the second lid through hole
340: component of the strobe 341: gate access
350: actuator (actuator)
Specific embodiment
In the following, being explained in detail with reference to the accompanying drawings for realizing the specific embodiment of thought of the invention.
During illustrating the present invention, if judgement obscures this hair for relevant known features or illustrating for function
Bright main idea, then description is omitted.
In addition, it is to be understood that when refer to some structural element " connection ", " supply " when another structural element,
It can be and be directly connected to, be supplied in another structural element, there may be have other structures element between these.
Term used in this specification is merely to illustrate specific embodiment, and non-limiting is of the invention.Unless up and down
It is explicitly pointed out in text, singular statement includes the statement of plural number.
In addition, it is necessary to it is clear that, upside, downside in this specification etc. are illustrated based on the diagram in attached drawing, if
The direction of corresponding object is changed, then can be stated with different expression ways.
Hereinafter, being illustrated referring to Fig.1 to the specific structure of the processor of one embodiment of the invention 1.
Referring to Fig.1, electronic component can be to be loaded into the state of the test pallet T of processor 1, along passing through processing chamber
20, test chamber 30 and processing chamber housing 40 and the biography of processing chamber 20 is successively come back to by unloading position and " loaded " position
Path C is sent to be recycled.This transmitting path C is configured to closed loop.
This processor 1 may include loading attachment 10, processing chamber 20, test chamber 30, processing chamber housing 40, unload and carry
Set 50.Processing chamber 20 can play thermostatic chamber (soak chamber) in the test process of electronic component and except hot chamber
The effect of any one in (desoak chamber), processing chamber housing 40 can play thermostatic chamber (soak chamber) and
Except the effect of any one in hot chamber (desoak chamber).
Loading attachment 10, which is used to for the not tested electronic component for being loaded into client's pallet (not shown) being loaded into, to be located at
The test pallet T of loading position.
Processing chamber 20 is formed in the interior thereof the space that can accommodate test pallet T, and can play thermostatic chamber
(soak chamber) or the effect for removing hot chamber (desoak chamber).For example, being thermostatic chamber in processing chamber 20
In the case of, processing chamber 20 can make electricity before the electronic component for being loaded into test pallet T to arrive to transmission is tested
Subassembly preheating is cooled to testing setup temperature in advance.
Test chamber 30 is received from processing chamber 20 is loaded into test pallet T's in the state for preheating or being pre-chilled
Electronic component.In test chamber 30, the test for being directed to this electronic component is executed, the electronic component tested is transmitted to processing
Chamber 40.
Processing chamber housing 40 could be formed with the space that can accommodate test pallet T inside it, and play thermostatic chamber
Or the effect except hot chamber.For example, processing chamber housing 40 is to from test chamber 30 in the case where processing chamber housing 40 is except hot chamber
The electronic component in test end state for being loaded into test pallet T for transmitting and arriving is cooled down, and electronic component is thus made
There can be the temperature not caused problems when room temperature or unloading.Alternatively, processing chamber housing 40 can terminate shape in test
The electronic component of state is heated, and so that electronic component is had room temperature or will not be generated the temperature of moisture condensation.
Discharge mechanism 50 according to test result, can by the electronic component in the test pallet T for being located at unloading position according to
Grade is classified, and the electronic component is unloaded to empty client's pallet.
Hereinafter, being illustrated referring to structure of the Fig. 2 to processing chamber housing 40 as described above.
Referring to Fig. 2, processing chamber housing 40 may include: cavity 41, be formed in the interior thereof the sky that can accommodate electronic component
Between (inner space S1)；Gas flows device 42, and the gas in the S1 of inner space can be made to be transmitted；And heater 43,
It being capable of heat gas.The gas of inner space S1 to be heated or cooled by being flowed by flowing machine 42
The temperature of electronic component is restored to room temperature or fixed level.On the other hand, the internal gas of processing chamber housing 40 can be air.
The gas flowing device 42 of processing chamber housing 40 can be by a module composition.In addition, gas flowing device 42 can also be by
Be connected to cavity 41 door constitute so that can internal volume S1 be opened and closed.In order to be restored to the temperature of electronic component
Room temperature, this gas flowing device 42 can be acted with the first operating mode or the second operating mode to carry out to electronic component
Cooling or heating.For example, gas flows the heating electronic component under the first operating mode of device 42, and it is cold under the second operating mode
But electronic component, so as to so that the temperature of electronic component is restored to room temperature.In addition, gas flows device 42 in the second operating mode
Under, air can be made to flow between processing chamber housing 40 is inside and outside.On the other hand, in the present specification, simultaneously by " room temperature "
The single temperature value that non-a defined is 20 DEG C may include the temperature range (for example, 20 ± 5 DEG C) higher or lower than 20 DEG C.Hereinafter,
It is illustrated with further reference to structure of the Fig. 3 to Fig. 9 to the gas flowing device 42.
With further reference to Fig. 3 to Fig. 9, this gas flowing device 42 may include: passage portion 100；Gas flow means
200；It may be at the gas flow paths adjustment unit 300 of the first operating mode or the second operating mode；And control unit is (not
Diagram).
Passage portion 100 provides: the gas in the inner space S1 of processing chamber housing 40 can be made to be discharged to the outside, or can
The gas outside processing chamber housing 40 is set to be flowed into the access of inner space S1.This passage portion 100 can also be configured at processing chamber
The frame of room 40 simultaneously plays the role of shell.
This passage portion 100 may include: access main body 101, be provided with the stream that gas is able to carry out flowing inside it
Road；Outflux 111 is formed in access main body 101, for gas to be discharged from inner space S1；Via hole 115 is flowed out, is used
In the outside for making the gas inside access main body 101 be discharged to processing chamber housing 40；Inflow entrance 121 is formed in access main body 101,
For making gas be flowed into inner space S1；And via hole 125 is flowed into, the gas being used to make outside processing chamber housing 40 flows into
To the inside of access main body 101.
Access main body 101 may include: inboard channel wall 102, be configured at the inner space side S1；And outboard channel wall
103, it is configured at the outer side of processing chamber housing 40.In inside, the setting unit with plate shape is can be set in channel wall 102
102a, aftermentioned main air supply fan 222 are set to the setting unit (Fig. 3, Fig. 5).It could be formed in setting unit 102a: inflow entrance
121；With the setting unit through hole 117 (Fig. 3, Fig. 5) for flowing into gas.On the other hand, inboard channel wall 102 and outside are logical
Road wall 103 can be configured to toward each other, and can have plate shape.In inside channel wall 102 and outboard channel wall 103 it
Between gas flow space S2 can be set.
On the other hand, the gas of inner space S1 can be discharged to via the first flowing path P 1 or second flow path P2
The outside of inner space S1, the gas outside the S1 of inner space can be flowed via the first flowing path P 1 or second flow path P2
Enter to the inside of inner space S1.First flowing path P 1 is defined as, and is connected to from outflux 111 via gas flow space S2
The path of inflow entrance 121 (referring to Fig. 8)；Second flow path P2 is defined as, including from outflux 111 not via inflow entrance 121
The path of outflow via hole 115 is connected to and from via hole 125 is flowed into not via outflux 111 with via hole 125 is flowed into
The path of inflow entrance 121 is connected to outflow via hole 115 (referring to Fig. 9).Include to the second flow path P2 property of can choose,
The path for flowing into via hole 125 is connected to via the outside of processing chamber housing 40 from outflow via hole 115.
Inner space S1 is connected to the gas flow space S2 of access main body 101 via outflux 111.Therefore, internal empty
Between the gas of S1 can flow out to gas flow space S2 via outflux 111.It is logical that this outflux 111 can be formed in inside
Road wall 102, and can have circular shape.In addition, outflux 111 can be configured at the upside of processing chamber housing 40, and can
It is multiple to be provided with.
The outside of gas flow space S2 and processing chamber housing 40 communicates with each other via outflow via hole 115.Therefore, gas stream
Gas in dynamic space S 2 can flow out to the outside of processing chamber housing 40 via outflow via hole 115.This outflow via hole 115
It can be formed in outboard channel wall 103, and can have slit (slit) shape.In addition, outflow via hole 115 can configure
In the upside of processing chamber housing 40.In addition, outflow via hole 115 can be set at position corresponding with outflux 111.Separately
Outside, outflow via hole 115 can be the slit being laterally extended, and in this lateral slit, can be set and has prolonged towards outer upper side
The guiding piece 116 (Fig. 4) stretched.Extended through guiding piece 116 towards outer upper side, to flow what device 42 discharged by gas
Gas can be discharged upwards without directly blowing to operator.
In addition, inner space S1 is connected to the gas flow space S2 of access main body 101 via inflow entrance 121.Gas stream
Gas in dynamic space S 2 can be flowed into inner space S1 via inflow entrance 121.This inflow entrance 121 can be formed in inside
Channel wall 102, and can have circular shape.In addition, inflow entrance 121 can be configured at the downside of processing chamber housing 40, and
It can be set multiple.
This inflow entrance 121 may include the first inflow entrance 121-1 and the second inflow entrance 121-2.First inflow entrance 121-1
It can be configured at than the second inflow entrance 121-2 closer to the position of outflux 111.For example, the first inflow entrance 121-1 can be configured
In the position for being closer to upside than the second inflow entrance 121-2.
Outboard channel wall 10 can be formed in by flowing into via hole 125, and gas flow space S2 and processing chamber housing 40
Outside can be connected to via via hole 125 is flowed into.Therefore, the gas outside processing chamber housing 40 can be via inflow via hole 125
It is flowed into gas flow space S2.This inflow via hole 125 can on the outside channel wall 103 be formed with it is multiple, and can be with
With shape of slit extended in the vertical direction.In addition, flow into via hole 125 can be formed in outboard channel wall 103 with
The corresponding region setting unit 102a of inboard channel wall 102.
Gas can be discharged from the inner space S1 of processing chamber housing 40 in gas flow means 200, and gas can be supplied
Inner space S1 should be arrived.This gas flow means 200 may include gas discharge unit 210 and gas supply unit 220.
Gas discharge unit 210 is used for the gas being discharged in the S1 of inner space.This gas discharge unit 210 can configure
In the inner space side S1 of outflux 111, and can be configured in the mode opposite with outflux 111.Therefore, gas is from stream
Gas discharge unit 210 is passed through before 111 discharge of outlet.Hereinafter, Fig. 6 will be referred to further to the knot of gas discharge unit 210
Structure is illustrated.
Referring to Fig. 6, gas discharge unit 210 may include exhaust fan 211 and spacer 212.Exhaust fan 211 can wrap
It includes: exhaust rotary shaft 211a；Exhausting blade 211b, rotatably to be supported by exhaust rotary shaft 211a；And exhaust casing
211c, support exhaust rotary shaft 211a, and surround the side of exhausting blade 211b.Exhaust casing 211c can be tubular
The section of shape, this tube shape can be circle.In addition, exhaust casing 211c can cover exhausting blade 211b, to prevent gas
Body is flowed into from the side of exhausting blade 211b.Therefore, axially A is flowed into or along essence the gas around exhaust fan 211
The upper direction parallel with axial direction A flows into, rather than flows into from the direction vertical with axial A.
This exhaust fan 211 may include inboard exhaust fan 211-1 and outboard exhaust fan 211-2.With gas flow paths
Independently, this inboard exhaust fan 211-1 and outboard exhaust fan 211-2 can drive the operating mode of adjustment unit 300 together
Or stop driving.In addition, inboard exhaust fan 211-1 and outboard exhaust fan 211-2 can in a manner of toward each other arranged in series.
By being arranged in series for this multiple exhaust fans 211, that exhaust fan 211 can effectively be arranged even if narrow space, and
And gas more effectively can be discharged from inner space S1.In addition, inside exhaust fan 211-1 and outboard exhaust fan 211-2 it
Between can be configured with spacer 212 so that inboard exhaust fan 211-1 and outboard exhaust fan 211-2 be separated from each other specified interval.Outside
Side exhaust fan 211-2, which can be configured at, fans 211-1 further from the position of outflux 111 than inboard exhaust.For example, inboard exhaust is fanned
211-1 can be configured at the inner space side S1 of outflux 111, and outboard exhaust fan 211-2 can connect to be fanned in inboard exhaust
The inner space side S1 of 211-1.Therefore, the gas in the S1 of inner space fans 211-2 and interior via outboard exhaust from outflux 111
Side exhaust fan 211-1 is flowed into flowing space S2.
Gas supply unit 220 supplies gas for internally space S 1.When being in the first operating mode, gas supply
Unit 220, which is supplied, flows through the gas of the first flowing path P 1, and when being in the second operating mode, gas supply unit 220 can be with
Supply flows through the gas of second flow path P2.Gas supply unit 220 can be configured at inflow entrance 121 and flow into via hole
125 sides.Hereinafter, being illustrated with further reference to structure of the Fig. 7 to gas supply unit 220.
With further reference to Fig. 7, gas supply unit 220 may include air supply fan 221.Air supply fan 221 may include: gas supply
Rotary shaft 221a；Blade 221b is supplied, is rotatably supported by gas supply rotary shaft 221a；And gas supply shell 221c, branch
Support gas supply rotary shaft 221a, and surround the side of supply blade 221b.Gas supply shell 221c can have tube shape, this pipe
The section of shape can be circle.In addition, gas supply shell 221c can cover supply blade 221b, to prevent gas from supply leaf
The side of piece 221b flows into.Therefore, axially A is flowed into or along substantial and axial A the gas around air supply fan 221
Parallel direction flows into, rather than flows into from the direction vertical with axial A.On the other hand, since this air supply fan 221 not must
Must be identical as exhaust fan 211 above-mentioned, therefore, it can have the size different from exhaust fan 211, shape.
This air supply fan 221 may include main air supply fan 222 and helping air supply fan 223.
Independently with the operating mode of gas flow paths adjustment unit 300, main air supply fan 222 can supply gas to
Inner space S1.This main air supply fan 222 can be disposed adjacently with inflow entrance 121.For example, main air supply fan 222 can be set
In the inner space side S1 of inflow entrance 121.In other words, main air supply fan 222 can connect logical in the inside for being formed with inflow entrance 121
Road wall 102.
Main air supply fan 222 can be set multiple, and may include the first main main air supply fan of air supply fan 222-1 and second
222-2.First main air supply fan 222-1 and the first inflow entrance 121-1 is adjacent to configuration, and the second main air supply fan 222-2 can be with
Two inflow entrance 121-2 are adjacent to configuration.In addition, the first main main air supply fan 222-2 of air supply fan 222-1 and second can parallel connection match
It sets.By can more effectively supply a gas to inner space S1 for this multiple main 222 parallel configurations of air supply fan.The
One main air supply fan 222-1 can be configured with the second main air supply fan 222-2 interval, and can be set in confession more main than second
Gas fans 222-2 closer to the position of outflux 111.The distance between first main main air supply fan 222-2 of air supply fan 222-1 and second
The size (diameter) of inflow entrance 121 can be greater than, and can be between air supply fan 222-1 main less than first and outflux 111
Distance.
When gas flow paths adjustment unit 300 is in the first operating mode, helping air supply fan 223 can be supplied gas
Inner space S1 should be arrived, and only driving when in the first operating mode can be controlled so as to.This helping air supply fan 223
It can be disposed adjacently with via hole 125 is flowed into.For example, helping air supply fan 223 can be set in the gas for flowing into via hole 125
The side flowing space S2.In other words, helping air supply fan 223 is arranged between inside channel wall 102 and outboard channel wall 103, and
It is connected to the outboard channel wall 103 for being formed with and flowing into via hole 125.
Helping air supply fan 223 can be set it is multiple, and may include the first helping air supply fan 223-1 and second auxiliary
Air supply fan 223-2.First helping air supply fan 223-1 and the second helping air supply fan 223-2 respectively can with the first main air supply fan
The main air supply fan 222-2 of 222-1 and second opposite mode configures.In addition, the first helping air supply fan 223-1 and the second helping air supply
Fanning 223-2 can be with parallel configuration.First helping air supply fan 223-1 can fan 223-2 interval with the second helping air supply and match
Set, and can be set in than the second helping air supply fan 223-2 closer to outflow via hole 115 position.
Gas flow paths adjustment unit 300 is, in order to what is controlled the gas flow paths in passage portion 100.
Gas flow paths adjustment unit 300 may include: the first operating mode, be used to that gas to be made to carry out along the first flow path
Flowing；And second operating mode, it is used to that gas to be made to be flowed along second flow path.This gas flow paths tune
Whole unit 300 may include gas flow paths adjustment member 320, gate (gate) component 340 and The lid component 330.
Gas flow paths adjustment member 320 can provide the gas extended from 111 side of outflux towards 121 side of inflow entrance
The flowing space so that gas is flowed inside it, and can execute the function of subsidiary conduit.In addition, gas flows road
Diameter adjustment member 320 can flow to gas flow space S2's to from outflux 111 by being moved along up and down direction
The path of gas changes.Gas flow paths adjustment member 320 may include inside adjustment section 321 and outside adjustment section
322.When being in the second operating mode, gas flow paths adjustment member 320 is compared with the case where being in the first operating mode
More it is moved to lower section.
Inside adjustment section 321 can be configured to have: the first opening 321-1 is opened towards inboard channel wall 102；With
Second opening 321-2, opens (Fig. 5) towards gas supply unit 220.For example, inside adjustment section 321 may be constructed are as follows:
Upper part is formed with the opening open towards the inner space side S1, and is formed with from the upside of upper side opening towards inner space
The bending section that the outside inclination of S1 extends, and its downside end is formed as open pipeline.As more detailed an example, when from
When side is observed, the bending section of inside adjustment section 321 be can have: be extended from upper side end towards downside, and it is internal empty
Between gradually broaden after the shape that becomes narrow gradually once more.This bending section can be formed in corresponding with the first opening 321-1
Part.When being in the first operating mode, the inside adjustment section 321 of gas flow paths adjustment member 320 is to from outflux
111 gases for being flowed into gas flow space S2 guide, and flow into so that the gas is flowed to via gas flow space S2
Mouth 121, and flowed into gas can be blocked to flow out from outflow via hole 115.On the other hand, " blocking " in this specification
Be defined as, not only include the case where being fully sealed so that gas is without flowing, further include blocking or the flowing of blanketing gas and
The case where hindering gas to be flowed.
Outside adjustment section 322 can cover the upside of inside adjustment section 321.Outside adjustment section 322 can be adjusted with inside
Portion 321 is connected and is moved together.Outside adjustment section 322 may be constructed are as follows: when being in the second operating mode, from outflow
The lower end of the lower end of mouth 111 towards outflow via hole 115 extends.In addition, outside adjustment section 322 is in the second running mould
When formula, the gas for being flowed into gas flow space S2 from outflux 111 is guided, so that the gas is assisted via outflow
Hole 115 is discharged to outside, and stops flowed into gas flow inflow entrance 121.
Covering member 330 can cover around helping air supply fan 223.In addition, The lid component 330 is configured to, substantially
It is parallel to inboard channel wall 102 or outboard channel wall 103 and extends, and cover in addition to fanning 223 opposite portions with helping air supply
Part except position.This The lid component 330 can be set to and assist between inside channel wall 102 and outboard channel wall 103
The adjacent position of air supply fan 223.
In addition, The lid component 330 may include lid through hole 331, the lid through hole 331 is formed in be fanned with helping air supply
223 opposite positions.The size of this lid through hole 331 can have the size with the supply blade 222b of main air supply fan 222
Essentially identical size.In addition, quantity corresponding with the quantity of main air supply fan 222 can be set in lid through hole 331.Lid structure
Part 330 can be fixedly installed on outboard channel wall 103, also, even if the operating mode of gas flow paths adjustment unit 300 is sent out
Raw change will not be moved.
In addition, lid through hole 331 may include the first lid through hole 331-1 and the second lid through hole 331-2.First lid passes through
Through-hole 331-1 can be formed in and be formed with the position corresponding of the first inflow entrance 121-1, the second lid through hole 331-
2 can be formed in position corresponding with the second inflow entrance 121-2.
In addition, The lid component 330 also can have size corresponding with inboard channel wall 102 or outboard channel wall 103.?
In the case that The lid component 330 is constituted as described above, the gas that outflux 111 is flowed under the first operating mode can flow
Space between channel wall 102 and The lid component 330 inwardly, and can be discharged from inflow entrance 121.Therefore, in such case
Under, the gas that outflux 111 is flowed under the first operating mode can be blocked by The lid component 330, to make the gas not
The space between outboard channel wall 103 and The lid component 330 can be flowed to.
Component of the strobe 340 is configured to, and when being in the first operating mode, is placed in the position for closing second flow path P2
Set, and be in the second operating mode when, can be placed in open second flow path P2 position, and two positions it
Between can be moved.Component of the strobe 340 can fan position and The lid component 330 between 223 in main air supply fan 222 and helping air supply
It is adjacent to configuration.Component of the strobe 340 can be, the plate configured in parallel with inboard channel wall 102 or outboard channel wall 103.Separately
Outside, component of the strobe 340 is also configured to, can be flat towards the direction extended with inboard channel wall 102 or outboard channel wall 103
It is slided in capable direction.
It could be formed with gate access 341 (Fig. 5) in this component of the strobe 340.Gate access 341 can be perforation gate
The through hole of component 340, and can be set into corresponding with via hole 125 is flowed into.In addition, gate access 341 can be formed
To be placed in the position opposite with via hole 125 is flowed into when being in the second operating mode.In addition, gate access 341 can be with shape
Cheng Yuyu the first inflow entrance 121-1 and the second inflow entrance 121-2 opposite position.In addition, gate access 341 can have,
It is enough the size covered by The lid component 330 when in the first operating mode.In other words, when from side be in first running mould
When the gas flow paths adjustment unit 300 of formula, gate access 341 can be only fitted to the lid of the first lid through hole 331-1 and second
Between through hole 331-2.In other words, when being in the first operating mode, the first lid through hole 331-1 and the second lid through hole
331-2 can be covered by component of the strobe 340, without being exposed to gate access 341.
Actuator 350 can be such that gas flow paths adjustment member 320 and component of the strobe 340 is moved.In the
When one operating mode, actuator 350 carries out gas flow paths adjustment member 320, so that gas flow paths adjustment member
320 inside is connected to outflux 111, also, moves component of the strobe 340, is flowed into mouth 121 and is flowed into via hole
125 are not connected to mutually.In addition, actuator 350 makes gas flow paths adjustment member 320 when being in the second operating mode
It is moved, to block the inside of gas flow paths adjustment member 320 to be connected to outflux 111, and makes 111 He of outflux
Outflow via hole 115 communicates with each other, moreover, moving component of the strobe 340, flowing into mouth 121 and flowing into via hole 125
It communicates with each other.This actuator 350 for example may include: the first piston for being connected to gas flow paths adjustment member 320；With
It is connected to the second piston of component of the strobe 340, still, technical idea of the invention is without being limited thereto.
Control unit can control the driving of actuator 350.For control unit, in order to make to carry out under low-temperature condition
The temperature of the electronic component of test is restored, and can drive actuator 350 and gas flow paths adjustment unit 300 is made to be in the
One operating mode；In order to restore the temperature for the electronic component being tested at high operating temperatures, actuator 350 can be driven
And gas flow paths adjustment unit 300 is made to be in the second operating mode.Since the first operating mode and the second operating mode have
There is flow path different from each other, therefore, the temperature for the electronic component that processing chamber housing 40 is tested in the case where making low-temperature condition
When and when making the temperature for the electronic component being tested under the condition of high temperature, flow path different from each other can be provided.It is this
Control unit can by including that the arithmetic unit of microprocessor is realized, implementation be to those skilled in the art it is aobvious and
It is clear to, therefore omits its more detailed description.
Hereinafter, with further reference to Fig. 8 and Fig. 9, to the manner of execution of processing chamber housing 40 with structure as described above into
Row explanation.
Firstly, the case where being in the first operating mode to processing chamber housing 40 referring to Fig. 8 is illustrated.Processing chamber housing 40 passes through
The electronic component (temperature regulating object) for being contained in inner space S1 is heated, the electronic component being cooled can be made
Temperature be restored to room temperature, and for this purpose, the gas in the S1 of inner space can be made to be flowed under the first operating mode.When
When gas flow paths adjustment unit 300 is in the first operating mode, gas flow paths adjustment member 320 is carried out towards upside
It is mobile, it is thus connected to outflux 111, so that the gas in the S1 of inner space is flowed into gas flowing sky via outflux 111
Between S2.
On the other hand, it is moved and is covered towards downside in the component of the strobe 340 of gas flow paths adjustment unit 300
In the case where lid through hole 331, the gas in gas flow space S2 can be flowed into inner space S1 via inflow entrance 121.
Control unit controls the movement of gas flow paths adjustment member 320 and component of the strobe 340 by the driving of actuator 350
System, so that the inside of gas flow paths adjustment member 320 is connected to outflux 111, and covers the gate of component of the strobe 340
Access 341 and lid through hole 331.
Then, the case where being in the second operating mode to processing chamber housing 40 referring to Fig. 9 is illustrated.Processing chamber housing 40 passes through
The electronic component (temperature regulating object) for being contained in inner space S1 is cooled down, the electronic component being heated can be made
Temperature be restored to room temperature, and for this purpose, gas in the S1 of inner space can be made to be flowed under the second operating mode.Work as gas
When body flow path adjustment unit 300 is in the second operating mode, gas flow paths adjustment member 320 towards moving downward,
It is connected to outflux 111 with outflow via hole 115, to make the gas in the S1 of inner space via 101 row of access main body
The outside (the second flow path P2 of 111 side of outflux) of processing chamber housing 40 is arrived out.
On the other hand, it carries out mobile towards upside in the component of the strobe 340 of gas flow paths adjustment unit 300 and makes to cover
Through hole 331 is connected to gate access 341, so that the gas outside processing chamber housing 40 be enable to flow via access main body 101
Enter to inner space S1 (the second flow path P2 of 121 side of inflow entrance).Control unit flows road to gas by actuator 350
The movement of diameter adjustment member 320 and component of the strobe 340 is controlled, so that the inside of gas flow paths adjustment member 320 is not
It is connected to outflux 111, and the gate access 341 of component of the strobe 340 and lid through hole 331 is made to communicate with each other.
More than, it is only to illustrate although the embodiment of the present invention is illustrated by specific embodiment, this
It invents without being limited thereto, the widest range based on basic thought disclosed in this specification should be interpreted as having.This field skill
Art personnel can by disclosed embodiment combination/displacement come by way of realizing shape (not shown), but its without departing from
The scope of the present invention.In addition, those skilled in the art, which are based on this specification, easily to be changed disclosed embodiment
Or deformation, it is understood that, this change or deformation also belong in interest field of the invention.
Claims (6)
1. a kind of processing chamber housing is formed with the flowable inner space of gas, wherein the processing chamber housing includes:
Gas flow means, for gas to be discharged from the inner space of the processing chamber housing, and for supplying gas
To the inner space；
Passage portion, the passage portion include: access main body；Outflux is formed in the access main body, for empty from the inside
Between gas is discharged；And inflow entrance, it is formed in the access main body, for supplying a gas to the inner space；And
Gas flow paths adjustment unit controls the gas flow paths in the passage portion,
The gas flow paths adjustment unit includes the first operating mode, opens between the inflow entrance and the outflux
The first flow path, and close the second flow path between the outside of the processing chamber housing and the inner space；The
Two operating modes open the second flow path,
The gas flow paths adjustment unit is selectively in first operating mode and second operating mode
Any one operating mode is driven.
2. processing chamber housing according to claim 1, wherein
The gas flow means include gas supply unit, and the gas supply unit is set to the inflow entrance side, are used for
Gas is supplied to the inner space,
The gas supply unit includes:
First main air supply fan is configured at the inner space side on the basis of the inflow entrance in the access main body；
First helping air supply fan, is configured at the phase of the inner space on the basis of the inflow entrance in the access main body
It tosses about, and opposite with the described first main air supply fan,
The gas flow paths adjustment unit includes gas flow paths adjustment member, the gas flow paths adjustment member
Movement is proceeded as follows,
Under first operating mode, guidance is moved to the inflow from the gas that the outflux is flowed into the passage portion
Mouth side,
Under second operating mode, blocks from the gas that the outflux is flowed into the passage portion and be moved to the inflow
Mouth side.
3. processing chamber housing according to claim 2, wherein
The access main body and the gas flow paths adjustment member are provided from the outflux side towards the inflow entrance side
The gas flow space of extension, so that gas is able to carry out flowing,
The gas flow paths adjustment member is when being in first operating mode by carrying out towards the outflux side
It is mobile, to guide the gas for being flowed into the passage portion from the outflux to be moved to the stream via the gas flow space
Entrance side,
The gas flow paths adjustment member is when being in second operating mode by carrying out towards the inflow entrance side
It is mobile, to block the gas for being flowed into the passage portion from the outflux to be moved to the inflow entrance side.
4. processing chamber housing according to claim 2, wherein
The gas supply unit further include:
Second main air supply fan is configured at the inner space side on the basis of the inflow entrance in the access main body, and
And predetermined distance is separated with the described first main air supply fan and is configured；And
Second helping air supply fan, is configured at the phase of the inner space on the basis of the inflow entrance in the access main body
It tosses about,
The gas flow paths adjustment unit further includes component of the strobe, and the component of the strobe is arranged to:
Under first operating mode, gas is blocked to fan from first helping air supply corresponding with the second helping air supply fan
Ground flows to the described first main air supply fan and the second main air supply fan,
Under second operating mode, gas is allowed to fan from first helping air supply corresponding with the second helping air supply fan
Ground flows to the described first main air supply fan and the second main air supply fan.
5. processing chamber housing according to claim 4, wherein
The gas flow paths adjustment unit further includes the The lid component for being formed with lid through hole,
Be formed with gate access in the component of the strobe, the gate access be arranged under second operating mode with it is described
Any one in first helping air supply fan and second helping air supply fan is opposite,
The component of the strobe proceeds as follows driving,
The lid through hole is covered under first operating mode, make under second operating mode lid through hole and
The gate access communicates with each other.
6. a kind of processor, wherein include:
Loading attachment, for loading electronic component；
Processing chamber will terminate the electronic component loaded preheating or be cooled to testing setup temperature in advance；
Test chamber tests warmed-up or pre-cooling the electronic component；
Processing chamber housing described in any one of claims 1 to 5, the temperature for being arranged to terminate the electronic component of test are extensive
It is again preset temperature；And
Discharge mechanism unloads the electronic component for being restored to the preset temperature by the processing chamber housing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180035154A KR102469918B1 (en) | 2018-03-27 | 2018-03-27 | Treatment chamber and handler comprising same |
| KR10-2018-0035154 | 2018-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110310905A true CN110310905A (en) | 2019-10-08 |
| CN110310905B CN110310905B (en) | 2023-05-26 |
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ID=68074338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910216260.5A Active CN110310905B (en) | 2018-03-27 | 2019-03-21 | Processing chamber and processor comprising same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102469918B1 (en) |
| CN (1) | CN110310905B (en) |
| TW (1) | TWI714032B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6448537B1 (en) * | 2000-12-11 | 2002-09-10 | Eric Anton Nering | Single-wafer process chamber thermal convection processes |
| KR20150121372A (en) * | 2014-04-18 | 2015-10-29 | (주)테크윙 | Test handler |
| CN105032776A (en) * | 2012-03-16 | 2015-11-11 | 泰克元有限公司 | Test sorting machine |
| KR20160062336A (en) * | 2014-11-24 | 2016-06-02 | 엘지디스플레이 주식회사 | Heat Treatment Apparatus for Manufacturing Display Panel |
| CN107078052A (en) * | 2014-09-30 | 2017-08-18 | 株式会社日立国际电气 | The manufacture method and recording medium of lining processor, semiconductor devices |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6844717B2 (en) * | 2001-10-12 | 2005-01-18 | Techwing Co., Ltd. | Test handler |
| KR101207891B1 (en) * | 2010-10-26 | 2012-12-04 | (주) 예스티 | Burn in test chamber for semiconductor component |
| KR102072390B1 (en) * | 2013-06-18 | 2020-02-04 | (주)테크윙 | Test handler |
| KR102123052B1 (en) * | 2014-06-23 | 2020-06-15 | (주)테크윙 | Test handler |
| KR102254494B1 (en) * | 2015-04-30 | 2021-05-24 | (주)테크윙 | Handler for testing semiconductor device |
-
2018
- 2018-03-27 KR KR1020180035154A patent/KR102469918B1/en active IP Right Grant
-
2019
- 2019-03-21 TW TW108109824A patent/TWI714032B/en active
- 2019-03-21 CN CN201910216260.5A patent/CN110310905B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6448537B1 (en) * | 2000-12-11 | 2002-09-10 | Eric Anton Nering | Single-wafer process chamber thermal convection processes |
| CN105032776A (en) * | 2012-03-16 | 2015-11-11 | 泰克元有限公司 | Test sorting machine |
| KR20150121372A (en) * | 2014-04-18 | 2015-10-29 | (주)테크윙 | Test handler |
| CN107078052A (en) * | 2014-09-30 | 2017-08-18 | 株式会社日立国际电气 | The manufacture method and recording medium of lining processor, semiconductor devices |
| KR20160062336A (en) * | 2014-11-24 | 2016-06-02 | 엘지디스플레이 주식회사 | Heat Treatment Apparatus for Manufacturing Display Panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110310905B (en) | 2023-05-26 |
| TW201946191A (en) | 2019-12-01 |
| KR102469918B1 (en) | 2022-11-23 |
| TWI714032B (en) | 2020-12-21 |
| KR20190113031A (en) | 2019-10-08 |
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