KR101312006B1 - Chamber for high temperature testing of semiconductor devices - Google Patents

Abstract

The present invention relates to a chamber for high temperature testing of semiconductor devices, in which the test socket in the convection form of the chamber distributes the controlled hot air to the docking plate and scatters to minimize the temperature deviation between the socket, liquid nitrogen and air By using a vortex tube, which is an air cooling apparatus, rather than mixing and cooling the mixture, the purpose of the test environment is to be actively controlled when the test environment is changed.
In order to achieve the above object, the present invention includes a discharge port for discharging hot air by an air heater and a branching hole provided for each socket so that hot air is scattered to the socket so as to enable local heating and exhaust to the test socket. Localized heated docking plate; .

Description

CHAMBER FOR HIGH TEMPERATURE TESTING OF SEMICONDUCTOR DEVICES

The present invention relates to a chamber for a high temperature test of a semiconductor device, and more particularly, in the semiconductor test, the heating of the socket, rather than the increase of the capacity of the heater or the direct heating method, to enable local heating of the socket, the heat generation of the test board or the surrounding environment When a difference occurs with the environmental temperature that requires a test, the technology relates to a chamber that can control the heating or cooling of the surrounding environment.

In order to test a semiconductor device at a high temperature and a constant temperature, a heater according to the heating of the device is required, and a cooling device is required to cool the change of the test environment.

Conventionally, the heater is mounted and the element is heated only in consideration of the high temperature test of the semiconductor element, but it is not designed to cool the environmental temperature (25 ° C. or the user set temperature). When the environmental temperature was changed by this, it was common that there was no provision for the device to actively control the temperature. Therefore, in order to test at a high temperature and a constant temperature in a test socket, the apparatus for heating a test socket and cooling according to the change of environmental temperature is needed.

The most common horizontal method (horizontal to the test board material) is a high temperature test, a preheater that preheats the device to create a high temperature environment in the device and test socket, a high temperature shuttle and test to maintain the temperature during transfer. A high temperature chamber was used to heat the environment, the socket and the surrounding environment.

The method of not using some chambers uses a method of directly heating heat directly by attaching a heater to an adsorption mechanism object that absorbs the device using a vacuum as a method of maintaining only a high temperature state of the device.

On the other hand, with respect to the chamber for testing a semiconductor device, a number of applications and publications other than Korea Patent Publication No. 10-2010-0022168 (hereinafter referred to as "prior literature") has been disclosed.

The chamber according to the prior document, the test room for creating a high temperature and low temperature environment by lowering or raising the temperature inside the chamber using a plurality of heaters and evaporators; A PC room directly connected to the semiconductor device under test in the test room by wire and performing actual reliability tests, and a PC room on which the PC rack is mounted; A refrigerating device unit installed in plural outside the test room and connected to an evaporator provided in the test room and including a freezer for discharging heat of the evaporator to the outside; Located between the test room and the PC room to prevent the heat and heat inside the test room to be transferred to the outside of the test room, including a connector for directly connecting the semiconductor elements introduced into the chamber and the computers of the PC room The wall; A door part for maintaining the airtightness of the inner space of the chamber and opening and closing the chamber when the test is performed in the test room; A detachment unit provided between the test room and the heat insulation wall to securely detach the semiconductor device storage device introduced when the test room is inspected; It is provided on the front of the detachable unit and provided as a guide rail when the semiconductor element accommodating device introduced into the chamber is moved to settle in the test room or transported to the outside of the chamber after the completion of the inspection. A roller unit provided with a plurality of rollers; A control device provided outside the chamber to control the operation of the test room, the PC room, the freezer unit, the door unit, the roller unit, and the detachable unit by receiving an input value from the user, and outputting the state of each chamber through the display device. And a circulation motor for transferring air heated by a heater or cooled by an evaporator to the respective parts of the test room, and for effectively transferring the flow of air generated from the circulation motor to each part of the test room. The duct is additionally included, and the water-soluble urethane foam insulation and heat-resistant silicon are applied to the inner joint of the test room for airtightness and insulation reinforcement.

In the case of a chamber type including the prior literature, a heater having a high power consumption must be used as the set temperature is increased in order to radiate high temperature hot air. Thus, the production cost for testing the semiconductor device is increased.

Specifically, in the case of the chamber heating type (typically when there is no interfering structure), even heat distribution is achieved by convection in the volume, but in the case of semiconductor device testing, the device is transported, loaded into the test socket, and pressed. The mechanical contactor, such as a contactor (Contactor) is interfered by the convection, and because the apparatus constituting the contactor, the peripheral apparatus itself emits heat to absorb outside, it is difficult to have a uniform heat distribution for each test socket. In addition, when the contactor is in contact with the socket to test the device, convection of hot air is blocked in the socket, resulting in a change in the set temperature required by the user. In addition, since a larger amount of heat is required to increase the set temperature, the capacity W of the heater must be appropriately adjusted. Since the capacity of the heater is proportional to the amount of heat, it is difficult to miniaturize the equipment because the volume of the hot air supply side, which functions to generate hot air in the chamber, is increased.

And, in case of direct heating type by absorbing element, heater and sensor should be installed according to test socket. In this case, heater and sensor and multiple controllers should be used for each socket. As the cost increases, as the overall power consumption increases as in the chamber, the production cost increases as in the chamber.

Specifically, in the case of the direct contact heating method, the problem of temperature uniformity between sockets, which is a disadvantage of the chamber method, can be solved, but in order to heat the semiconductor device, a heater and a sensor must be attached to each part of the vacuum suction device. A temperature control controller must be installed to control the heater.

As a result, the structure of the contactor incorporating the direct heating heater becomes complicated, and there are many things to consider, such as increasing its own load, electrical connection, and heat transfer picker. The semiconductor device test method, which increases the output per unit time by increasing the tester socket, which is a trend in recent years, has a problem in the direct heating method. Further supplementary measures, such as the increase in the capacity of the motor of the drive body according to the need.

Meanwhile, in order to test the semiconductor device at a constant temperature, an apparatus capable of heating or cooling the surrounding environment is required. Conventionally, liquefied nitrogen was mixed with air and used as a refrigerant to lower the temperature of the chamber. Other accessories are needed to bring the liquefied nitrogen to the set temperature of the test and the cost of constructing it is necessary. In addition, since nitrogen is supplied through the filling process, the cost required for cooling is required.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to distribute a controlled hot air to a docking plate in a convection form of a chamber and to scatter the test socket, thereby minimizing temperature variation between the sockets.

In addition, the present invention has an object to use the vortex tube, which is an air cooling device, not to mix and cool liquid nitrogen and air, so that the test environment temperature can be actively controlled when the test environment is changed.

The present invention for achieving the technical problem relates to a chamber for a high temperature test of the semiconductor device, the discharge port for discharging the hot air by the air heater and the hot air socket to enable local heating and exhaust to the test socket A locally heated docking plate having branching holes provided for each socket so as to be scattered thereon; .

In addition, the air heater, a compressed air input unit through which compressed air is input, a T-shaped branch, a second intake port for re-suctioning the air discharged through the discharge port, the compressed air and the second intake port input through the compressed air input unit It characterized in that it comprises a heating unit for heating the air sucked through and the outlet for discharging the heated air.

In addition, the air heated through the air heater is discharged through the outlet, to locally heat the socket of the local heating docking plate, the air intake to the first intake port of the local heating docking plate is the feedback of the air heater through the input unit Characterized in that it is used as a feedback input.

In addition, by using a fast flow path and a T-shaped branch, the vacuum of the second inlet is formed first, and the air sucked in the second inlet and the air input from the T-shaped branch are used as inputs of the air heater. As a result, the secondary air is circulated internally by discharging, scattering, and inhaling the hot air at a local heating point.

And a cooling control device using compressed air as a refrigerant using a vortex tube, and controlling a supply amount of the refrigerant to maintain a constant temperature; And further comprising:

According to the present invention as described above, it is possible to minimize the temperature difference between the socket during the high temperature test, to uniform the temperature, and to minimize the increase in production cost by using a localized high temperature method, rather than increasing the capacity of the heater or direct heating method. It has an effect.

In addition, according to the present invention, by using only high pressure compressed air instead of liquefied nitrogen to be used as the refrigerant, as a refrigerant, it is also possible to reduce the investment cost of the facility due to the use of liquefied nitrogen.

1 is an exemplary view showing a general chamber heating or direct heating method.
Figure 2 is an exemplary view showing a configuration and a local heating arrangement for a local heating docking plate according to the present invention.
Figure 3 is an exemplary view showing a configuration and intake and exhaust with respect to the air heater according to the present invention.
4 is an exemplary view of a cooling control device according to the present invention.

Specific features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. It is to be noted that the detailed description of known functions and constructions related to the present invention is omitted when it is determined that the gist of the present invention may be unnecessarily blurred.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

A chamber for testing a high temperature of a semiconductor device according to the present invention will be described with reference to FIGS. 2 to 4 as follows.

First, FIG. 1 is an exemplary view showing a general chamber heating method or a direct heating method, and includes a docking plate 1 that allows the test socket of the test head and the contactor to be fastened as shown.

The docking plate 1 has a primary physical connection between the handler and the test head, positioning and adjustment by the guide pins during seating and electrical contact in the socket of the semiconductor device, and a hard stop to prevent socket breakage by the contactor. Perform the function of instrument placement.

In a typical chamber heating method, the connecting rod (2) part of the contactor and other mechanical accessories, a damper (3) for seating the semiconductor element in the socket and pressing with constant force, the guide pin (4) of the docking plate and the hard stopper (5) It is a structure that is difficult to uniformly distribute in the socket under the docking plate due to air convection caused by the) structure. According to the problems listed above, it is difficult to reduce the temperature variation as the number of sockets tested at the same time increases, and the increase in the number of sockets increases the capacity of the heater 6 and the blower 7 as the volume of the chamber increases in proportion. Should also be large.

In order to solve the uniform distribution of heat, there is a direct heating method in which a heater is installed at the bottom of the damper of the contactor to conduct the heat generated from this to the metallic adsorption device to heat the device, but according to the recent expansion of the parallel test method. Due to the increase in heaters, sensors, and controllers, there is a drawback that new investment costs outside the facility, such as the increase in the price of equipment and peripheral parts, increase.

The chamber (hereinafter, referred to as 'chamber') 100 for the high temperature test of the semiconductor device according to the present invention includes a locally heated docking plate 8 and a cooling control device 20.

Specifically, as shown in FIG. 2, the locally heated docking plate 8 is provided with a hot air moving conduit 9 so as to enable local heating and exhausting in the test socket, and is coupled to an existing docking plate. It is produced in the form. At this time, the local heating docking plate 8 uses the air heater A as a heat source of the semiconductor element.

In addition, the locally heated docking plate 8 is provided for each socket so that the discharge port 10 for discharging the hot air by the air heater A and the hot air are scattered to the socket of the locally heated docking plate 8. Branched openings 11 are included.

Meanwhile, as shown in FIG. 3, the air heater A re-intakes the air discharged through the compressed air input unit 16, the T-shaped branch 14, and the discharge port 18 through which compressed air is input. The second intake port 15, the compressed air input through the compressed air input unit 16 and the heating unit 17 for heating the intake air through the second intake port 15, the outlet for discharging the heated air ( 18).

That is, the air heated through the air heater 17 is discharged through the discharge port 18 to locally heat the socket of the locally heated docking plate 8, and the first intake port of the locally heated docking plate 8. The air sucked into 12 is used as a feedback input of the air heater A through the feedback input unit 13.

In addition, the compressed air input through the compressed air input unit 16 is through the T-shaped branch (14). At this time, as the compressed air passes through the passage larger than the outlet 18, the pressure in the pipe is lowered, the second inlet 15 is in a vacuum state, and the hot air is re-intaked through the second inlet 15. do.

As described above, the air discharged and scattered through the discharge port 18 is re-intaked through the second intake port 15 again, and hot air is not diffused except for the local heating portion through this circulation.

On the other hand, the present invention uses a method of localized heating by directly supplying the hot air from the air heater (A) to the test socket through the manifold as a method of uniformizing the temperature of the test socket.

That is, the temperature of the air is measured by the sensor mounted on the discharge port 10 near the test socket for the high temperature air supplied to the socket. The feedback is fed back to the error of the temperature set by the temperature controller. To control.

The hot air controlled at the set temperature is moved through the heat-insulated heat passage conduit 9 to fly to the socket, so that the temperature of the socket is kept uniform.

When the contactor descends on the test socket for electrical contact with the device in electrical contact with the socket, high temperature hot air is continuously supplied, creating a hot vortex inside the socket. Therefore, it is necessary to arrange an outlet for discharging the vortex.

At this time, Bernoulli's theorem is used, and as described above, the vacuum of the second intake port 15 is first formed by using the fast-flowing pipe and the T-shaped branch 14, and the second intake port By using the air sucked in the (15) and the air input from the T-shaped branch 14 as the input of the air heater (A), the secondary hot air is discharged and scattered to the local heating point, and scattered again To cycle internally. In addition, an increase in the environmental temperature inside the semiconductor inspection apparatus can be suppressed by sucking the hot air scattered on the socket through the second intake port 15.

4 is an exemplary view of a cooling control device 20 according to the present invention. As shown, the air in the chamber is cooled by using a vortex tube.

The principle of the vortex tube is that when compressed air is supplied to the vortex tube through a pipe, it is first introduced into the vortex rotation chamber 21 to rotate at 1,000,000 RPM. This rotating air is moved toward the warmth outlet 22 of the tail, and some air is returned again to form a secondary vortex, and exits to the cold air outlet 23, which flows in the primary vortex by the secondary vortex flow. The heat is lost while passing through the low pressure region inside the heat discharge chamber and discharged toward the cold air discharge port.

Due to the difference in the movement speed, the kinetic energy is decreased and the energy lost is lower than the air temperature of the first vortex rotation.

In the present invention, since only the compressed air and the vortex tube are used without using liquid nitrogen or chiller which is generally used as the refrigerant or cold of the chamber, maintenance is easy and additional material purchase cost does not occur.

In the control of the vortex tube, the input air of the temperature controller and the vortex tube is controlled by using an on / off valve, and the air in the chamber can be cooled to a set value.

Such a method may be limited in case of cryogenic temperature, but the temperature rise in the chamber is suppressed by the high temperature of the test head mounted on the test socket during the room temperature test of the semiconductor device, and the semiconductor device is controlled at a controlled set temperature of room temperature. You can proceed with the test.

In addition, when the target semiconductor element is changed after the high temperature test through the cooling control, the rapid cooling cold air supply (see 24) of the chamber becomes possible, so that the test head 25 and the change kit 26 can be quickly replaced. Can contribute to

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be appreciated by those skilled in the art that numerous changes and modifications may be made without departing from the invention. Accordingly, all such appropriate modifications and changes, and equivalents thereof, should be regarded as within the scope of the present invention.

8: Locally heated docking plate 9: Air movement line
10: discharge port 11: branch port
12: first intake port 13: feedback input unit
A: Air heater 14: T-shaped branch
15: second intake port 16: compressed air input unit
17: heating part 18: outlet
20: cooling control device 21: vortex rotation chamber
22: warmth outlet 23: cold air outlet
24: rapid cooling cold air supply to the chamber 25: test head
26: change kit

Claims (5)

In order to enable local heating and exhaust to the test socket, a hot air moving path 9 is arranged, and the outlet 10 for discharging the hot air by the air heater A and the hot air are scattered in the socket. A locally heated docking plate (8) provided with a branch (11) provided for each socket; Including;
Air heated through the air heater (A) is discharged through the outlet 18 to locally heat the socket of the localized docking plate (8), the first intake port of the localized docking plate (8) ( Air sucked into 12) is used as a feedback input of the air heater (A) through the feedback input unit 13,
By using the fast flow path and the T-shaped branch 14, the vacuum of the second inlet 15 is first formed, and the air sucked in the second inlet 15 and the T-shaped branch 14 The high temperature test of the semiconductor device, characterized in that the air input from the air is used as the input of the air heater A, and the air is circulated internally by discharging, scattering, and inhaling the second hot air to the local heating point. Chamber.
The method of claim 1,
The air heater (A),
Compressed air input unit 16 through which the compressed air is input, the T-shaped branch 14, the second inlet 15 for re-suctioning the air discharged through the discharge port 18, the compressed air input unit 16 For the high temperature test of the semiconductor device, characterized in that it comprises a heating unit 17 for heating the air sucked through the compressed air and the second inlet 15 and the outlet 18 for discharging the heated air input through the chamber.
delete delete The method of claim 1,
A cooling control device 20 using compressed air as a refrigerant using a vortex tube, and controlling a supply amount of the refrigerant to maintain a constant temperature; Chamber for high temperature test of the semiconductor device further comprises.

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