KR102098564B1 - Semiconductor Test Chamber - Google Patents

Abstract

The present invention relates to a semiconductor component test chamber. More specifically, provided is the semiconductor component test chamber which can prevent condensation from occurring when testing a semiconductor component or the like by varying the temperature inside the test chamber. The semiconductor component test chamber includes a housing, a burn-in board rack accommodating unit, a feed rack accommodating unit, a temperature adjusting unit, and an external condensation preventing unit.

Description

Semiconductor Component Test Chamber {Semiconductor Test Chamber}

The present invention relates to a semiconductor component test chamber, and more particularly, to a semiconductor component test chamber capable of preventing the occurrence of condensation when testing semiconductor components or the like by varying the temperature inside the test chamber.

In general, after the manufacturing process for a semiconductor component or battery is completed, the product is inspected for quality.

In the case of semiconductor parts, it is possible to check whether or not they operate normally under severe conditions according to temperature changes, and in the case of batteries, it can be tested whether they have explosiveness under severe conditions.

As such, one of the devices used for reliability testing such as a semiconductor component or a battery corresponds to a test chamber.

However, in the case of performing a test or inspection on a semiconductor component or a battery using the test chamber, the test may be performed under severe conditions by varying the temperature or pressure as described above. In this case, it is necessary to perform the experiment by keeping the temperature uniform to ensure the accuracy of the test results.

However, when the temperature difference between the inside and the outside of the test chamber is severe, condensation may occur inside or outside the test chamber, and a problem that the temperature inside the test chamber cannot be uniformly maintained may occur.

In order to solve the above problems, the present invention is a semiconductor component test capable of preventing the occurrence of condensation when testing or inspecting a semiconductor component by setting the temperature of the burn-in board receiving portion of the semiconductor component test chamber to an extreme condition. It is an object to provide a chamber.

An object of the present invention as described above is a burn-in board (Burn-In Board) housing a housing forming an exterior, a plurality of burn-in boards are mounted on the housing, and a plurality of burn-in boards are mounted. Rack) to accommodate the burn-in board rack receiving part, the feed for receiving a feed rack (Feed Rack), which is electrically connected to the burn-in board and supplies a feed-through board for supplying power to the burn-in board. A rack accommodating part, a temperature regulating part adjusting the temperature of the accommodating part of the burn-in board rack, and an internal condensation preventing part provided inside the housing to prevent condensation from occurring inside the housing, and the housing provided outside the housing It is achieved by a semiconductor component test chamber characterized in that it has an external condensation preventing portion for preventing the occurrence of condensation from the outside.

Here, the internal condensation preventing portion includes an insulating material surrounding the burn-in board rack receiving portion, and the insulating material may include insulating plates on both sides of the insulating filler.

In addition, the heat insulating material may include at least one of a silicone pad or an insulating coating film between the heat insulating filler and the heat insulating plate.

On the other hand, the internal condensation prevention unit may further include a dry air injection unit for spraying clean dry air inside the burn-in board rack receiving portion.

Furthermore, the external condensation preventing unit may include a heater unit provided on at least one of the upper and lower surfaces of the housing to heat at least one of the upper and lower surfaces.

In addition, the external condensation prevention unit may include a fan unit provided to be movable on the upper or lower surface of the upper surface of the housing to provide wind toward the upper or lower surface.

In this case, the fan unit includes a movable fan plate, a plurality of fans provided on the fan plate to provide wind toward the upper or lower surface, a plurality of wheels provided on the fan plate, and the fan plate. It may be provided with a connecting portion connected to the upper or lower surface.

Meanwhile, the external condensation preventing unit may include a dry air supply unit provided on an upper or lower surface of the upper surface of the housing to supply dry air toward the upper surface or lower surface.

In this case, the dry air supply unit may be provided at an upper portion or a lower portion of a lower surface of the upper surface of the housing, and may include a plurality of injection parts for supplying dry air toward the upper or lower surface.

On the other hand, the dry air supply unit may be provided to be movable above or below the upper surface of the housing.

For example, the dry air supply unit includes a movable movable plate, a plurality of nozzles provided on the movable plate for spraying dry air toward the upper or lower surface, and a distributor for supplying the dried air to the plurality of nozzles And, it may be provided with a plurality of wheels provided on the movable plate.

In addition, the fan unit or the dry air supply unit may be provided below the lower surface corresponding to the burn-in board rack receiving portion.

According to the present invention having the above-described configuration, it is possible to prevent condensation from occurring when testing or inspection of the semiconductor component is performed by setting the temperature of the burn-in board accommodating portion of the semiconductor component test chamber to an extreme condition.

1 is an external perspective view of a semiconductor component test chamber,
Figure 2 is a view showing a burn-in board receiving portion by omitting the door in the semiconductor component test chamber,
3 is a cross-sectional plan view of a semiconductor component test chamber,
Figure 4 is a cross-sectional view showing the configuration of a heat insulating material according to various embodiments,
Figure 5 is a partial cross-sectional view showing an area to which the feed-through board of the semiconductor component test chamber is connected,
6 is a view showing a burn-in board accommodating part by omitting a door from the semiconductor component test chamber,
7 is a view showing a top surface in the semiconductor component test chamber,
8 is a perspective view showing a state in which the fan unit is connected to the lower surface of the semiconductor component test chamber,
9 is a perspective view showing the fan unit,
10 is a view showing a state in which the injection portion is disposed on the lower surface of the semiconductor component test chamber,
11 is a view showing a state in which the dry air supply unit is disposed on the lower surface of the semiconductor component test chamber,
12 is a perspective view showing the dry air supply unit,
13 is an exploded perspective view showing the distributor.

Hereinafter, the structure of the semiconductor component test chamber 1000 according to an embodiment of the present invention will be described in detail with reference to the drawings.

1 is an external perspective view of the semiconductor component test chamber 1000, FIG. 2 is a front view showing a burn-in board rack accommodating part 200 of the semiconductor component test chamber 1000, and FIG. 3 is a plan view of FIG. It is a cross-sectional view.

1 to 3, the semiconductor component test chamber 1000 is provided in a housing 100 forming an exterior and in the housing 100, and a plurality of semiconductor components (not shown) to be tested are mounted. Burn-in board rack accommodating part 200 accommodating the burn-in board rack 210 in which two burn-in boards 212 are stored, and electrically connected to the burn-in board 212 Feed rack accommodating portion 264 for accommodating a feed rack 262 in which a feed-through board 260 for supplying power to the burn-in board 212 is received, the burn-in The temperature control unit 300 for controlling the temperature of the board rack accommodating unit 200 and an internal condensation prevention unit provided inside the housing 100 to prevent condensation from occurring inside the housing 100, and the housing It is provided outside of the (100) to prevent external condensation to prevent condensation from occurring outside the housing (100) It can be provided with wealth.

The semiconductor component test chamber 1000 corresponds to a chamber for testing whether a defect occurs after a predetermined time has elapsed by applying thermal stress to a battery or a semiconductor component under harsh environments such as various temperature conditions.

First, the semiconductor component test chamber 1000 forms an exterior and may include a housing 100 having various components described below therein.

The housing 100 has an upper surface 110, a side surface 115, and a lower surface 140, and thus may have a substantially hexahedral shape as a whole.

The burn-in board rack accommodating part 200 and the feed rack accommodating part 264 described above may be provided inside the housing 100. A fan 112 is provided on the upper surface 110 to circulate air inside the housing 100. In addition, a leg 142 may be provided on the lower surface 140 of the housing 100 to provide a separation space of a predetermined distance between the lower surface 140 and the ground (not shown). An external condensation preventing unit may be disposed in the spaced apart space as described below, which will be described in detail later.

Meanwhile, the burn-in board rack accommodating part 200 may be disposed on the left side from the front side of the housing 100, and on the right side includes various manipulation parts, a display part, and the like for controlling the operation of the semiconductor component test chamber 1000. The control panel 120 may be provided. In addition, the feed rack receiving portion 264 may be disposed behind the burn-in board rack receiving portion 200. The arrangement of the burn-in board rack accommodating part 200, the control panel 120, and the feed rack accommodating part 264 is merely described as an example, and may be appropriately modified and arranged.

The burn-in board rack accommodating part 200 may be configured to open and close its internal space with a door 130 or the like. A burn-in board rack 210 may be accommodated in the burn-in board rack accommodating part 200, and a plurality of burn-in boards 212 in which a plurality of semiconductor components to be tested are mounted may be accommodated in the burn-in board rack 210. have.

That is, a battery or semiconductor component corresponding to the test object of the test chamber 1000 according to the present invention is mounted on the burn-in board 212, and the burn-in board 212 is stored in the burn-in board rack 210. . The burn-in board rack 210 in which the plurality of burn-in boards 212 are accommodated may be accommodated in the burn-in board rack accommodating part 200.

Meanwhile, a feed rack 262 may be accommodated in the feed rack accommodating part 264, and a feed through board 260 electrically connected to the burn-in board 212 to supply power to the feed rack 262 is supplied. Can be stored.

That is, the feed-through board 260 is electrically connected to the above-described burn-in board 212 to supply power to the burn-in board 212, so that a plurality of semiconductor components mounted on the burn-in board 212 are tested. You can do

As described above, the semiconductor component test chamber 1000 includes a burn-in board rack 210 in which a plurality of burn-in boards 212 in which a plurality of semiconductor components to be tested are mounted are accommodated in the burn-in board rack accommodating unit 200. Next, the environmental conditions of the burn-in board rack accommodating part 200 may be adjusted to test the semiconductor component.

Here, the environmental condition of the burn-in board rack accommodating part 200 corresponds to a temperature condition or a pressure condition of the burn-in board rack accommodating part 200. That is, the semiconductor component may be tested while the temperature or pressure of the burn-in board rack accommodating part 200 is changed. As described above, an adjusting unit may be provided to adjust the environmental conditions of the burn-in board rack accommodating unit 200, that is, temperature conditions or pressure conditions.

For example, as illustrated in FIGS. 2 and 3, a temperature control unit 300 may be provided inside the burn-in board rack receiving unit 200. The temperature control unit 300 controls the temperature of the burn-in board rack accommodating unit 200 to perform testing under severe temperature conditions for the semiconductor component. The temperature control unit 300 may, for example, change the temperature of the burn-in board rack accommodating unit 200 from a high temperature of 150 degrees Celsius to a low temperature of minus 40 degrees Celsius.

As described above, when the temperature of the burn-in board rack accommodating part 200 is changed by the temperature control part 300, the temperature at which the test is performed is uniformly maintained in order to test the semiconductor component under the same conditions. It is important to do.

In particular, when the temperature control unit 300 is composed of a refrigeration system to lower the temperature of the burn-in board rack accommodating unit 200 to zero, the inside and outside of the housing 100 due to the temperature difference between the inside and the outside. Condensation may occur. In order to prevent such condensation and reduce heat loss, a test chamber according to the prior art is provided with an insulating material. However, since the total volume of the test chamber is limited, there is a limit in increasing the thickness of the insulating material.

The semiconductor component test chamber 1000 according to the present invention may be provided with various anti-condensation parts to uniformly maintain the temperature of the burn-in board rack accommodating part 200 and further prevent heat loss and condensation.

The condensation prevention unit may be configured as an internal condensation prevention unit that prevents condensation from occurring inside the housing 100 and an external condensation prevention unit that prevents condensation from occurring outside the housing 100.

The internal condensation prevention unit may be provided inside the housing 100 to prevent heat loss due to temperature differences between the inside and outside of the housing 100. In addition, the external condensation preventing unit is provided outside the housing 100 to prevent condensation from occurring outside the housing 100. Hereinafter, with reference to the drawings will be described in detail with respect to the configuration of the heat insulating structure and the condensation preventing portion.

2 and 3, the internal condensation prevention unit may include an insulating material 500 surrounding the burn-in board rack receiving unit 200.

In this case, the heat insulating material 500 may be disposed to surround both the side and the top and bottom of the burn-in board rack receiving portion 200. In addition, the door 130 that opens and closes the burn-in board rack accommodating part 200 may be provided with an insulating material 500.

The heat insulating material 500 is disposed to completely surround the burn-in board rack receiving portion 200 to maintain a uniform temperature inside the burn-in board rack receiving portion 200, and further prevent heat loss or heat transfer. .

On the other hand, in the present invention, the heat insulating material 500 may have a structure for enhancing the heat insulating effect even when disposed in a relatively narrow space inside the test chamber 1000. 4 is a view showing a cross-sectional structure of the heat insulating material 500 according to various embodiments.

Referring to (a) of FIG. 4, the heat insulating material 500 may include heat insulating plates 512 on both sides of the heat insulating filler 510.

In this case, the insulating filler 510 may be made of a ceramic fiber (ceramic fiber) or the like to increase the insulating effect, the insulating plate 512 may be made of a metal such as stainless (stainless), iron (steel) .

On the other hand, looking at (b) of Figure 4, the insulating material 500 'according to this embodiment is provided with insulating plates 512 on both sides of the insulating filler 510, the insulating filler 510 and the insulating plate ( 512) may be provided with an insulating coating film (514).

In this case, the heat insulating coating film 514 may be provided toward the outside of the test chamber 1000 from the side of the heat insulating filler (510). That is, when the left side of the drawing in FIG. 4B is the inside of the burn-in board rack accommodating part 200 and the right side is the outside of the burn-in board rack accommodating part 200, the insulating coating film 514 is It may be provided between the insulating plate 512 on the right side of the insulating filler 510.

On the other hand, looking at (c) of Figure 4, the insulating material according to this embodiment (500 ``) is provided with insulating plates 512 on both sides of the insulating filler 510, the insulating filler 510 and the insulating plate A silicon pad 516 may be provided between 512.

In this case, the silicon pad 516 may be provided toward the inside of the test chamber 1000 from the side of the heat insulating filler 510. That is, when the left side of the drawing in FIG. 4C is the inside of the burn-in board rack receiving portion 200 and the right side is the outside of the burn-in board rack receiving portion 200, the silicon pad 516 is On the left side of the heat insulating filler 510 may be provided between the heat insulating plate (512).

In addition, as shown in Figure 4 (d), the insulating material according to the present embodiment (500 '' ') is provided with insulating plates 512 on both sides of the insulating filler 510, the insulating filler 510 and the insulating An insulating coating film 514 and a silicon pad 516 may be provided between the plates 512, respectively.

In this case, the heat insulating coating film 514 may be provided toward the outside of the test chamber 1000 from the side of the heat insulating filler 510, the silicon pad 516 is the side of the heat insulating filler 510 In may be provided toward the inside of the test chamber (1000).

That is, when the left side of the drawing in FIG. 4D is the inside of the burn-in board rack accommodating part 200 and the right side is the outside of the burn-in board rack accommodating part 200, the insulating coating film 514 is On the right side of the heat insulating filler 510 may be provided between the heat insulating plate 512, the silicon pad 516 between the heat insulating plate 512 on the left side of the heat insulating filler 510. It may be provided.

As described above, in the test chamber 1000 according to the present invention, the insulating materials 500, 500 ', 500' ', and 500' '' are provided with insulating plates 512 on both sides of the insulating filler 510, and further , By providing an insulating coating film 514 or a silicon pad 516 between the insulating filler 510 and the insulating plate 512, compared to the thickness of the insulating materials 500, 500 ', 500' ', 500' '' The insulation effect can be significantly improved.

On the other hand, Figure 5 is the test chamber 1000 in the rear of the burn-in board rack accommodating unit 200, the feed-through board 260 is inserted and connected to the area (area 'A' in FIG. 3) insulation structure It is a sectional view.

Referring to Figure 5, the internal condensation prevention unit sequentially from the rear of the burn-in board rack accommodating unit 200 toward the inner heat insulating member 620, heater unit 610, heat insulating air layer 630 and silicon foam layer ( 640).

The heater unit 610 may be formed of a rubber heater or the like in consideration of thickness. In addition, air is injected toward the adiabatic air layer 630 to form an adiabatic air layer. On the other hand, the inside of the insulating air layer 630 may be provided with a silicone foam layer 640 foamed with silicone.

In addition, FIG. 6 is a front view showing the inside of the burn-in board rack accommodating part 200 because the door 130 of the burn-in board rack accommodating part 200 is omitted.

Referring to FIG. 6, the internal condensation prevention unit may further include a dry air injection unit 700 inside the burn-in board rack accommodating unit 200.

The dry air injection unit 700 may be located inside the lower portion of the burn-in board rack accommodating part 200, and preferably may be located below the temperature control part 300.

For example, a fixed plate 710 may be provided at an inner lower portion of the burn-in board rack accommodating part 200, and a spray nozzle 712 may be provided at the fixed plate 710.

The dry air injection unit 700 may supply dry air, for example, clean dry air (CDA) to the inside of the burn-in board rack accommodating part 200. In this case, dew point temperature is lowered inside the burn-in board rack accommodating part 200, thereby preventing condensation from occurring inside the burn-in board rack accommodating part 200.

Meanwhile, FIGS. 7 to 13 are views illustrating an external condensation preventing unit that prevents condensation from occurring outside the housing 100.

7 illustrates a configuration provided on the upper surface of the housing 100 to prevent condensation.

Referring to FIG. 7, the external condensation preventing unit is provided on at least one of the upper surface 110 and the lower surface 140 of the housing 100 to heat at least one of the upper surface 110 and the lower surface 140. (730, 740).

In FIG. 7, although it is illustrated as being provided on the upper surface of the housing 100, the present invention is not limited thereto and may be provided on the lower surface of the housing 100 or both on the upper and lower surfaces of the housing 100. It might be.

When the heater units 730 and 740 are provided, condensation may be prevented by heating the upper or lower surfaces of the housing 100 by the heater units 730 and 740.

At this time, the heater unit (730, 740) is a heater coil (heater coil) 730 disposed on the upper surface 110 ((a) of FIG. 7), or a rubber heater disposed on the upper surface 110 (rubber) heater) 740 (FIG. 7 (b)).

The types of the heater units 730 and 740 shown in FIG. 7 are merely described as an example, and the present invention is not limited to the types of the heater units 730 and 740.

On the other hand, the external condensation preventing unit according to the present invention may be configured to be movable under the upper or lower surface 140 of the upper surface 110 of the housing 100. As described above, when the condensation preventing portion is configured to be movable, the external condensation preventing portion is disposed in an area where condensation occurs a lot when the test chamber 1000 is driven, thereby effectively suppressing condensation.

8 is a perspective view showing the lower surface of the housing 100, and FIG. 9 is a perspective view showing the fan units 4000 and 4500.

8 and 9, the external condensation preventing part is provided to be movable below or above the upper or lower surface 140 of the upper surface 110 of the housing 100 to cover the upper surface 110 or the lower surface 140. It may include a fan unit (4000, 4500) for providing wind toward.

8 illustrates the state in which the fan units 4000 and 4500 are disposed under the lower surface 140 of the housing 100, but is not limited thereto and is not illustrated, but the upper surface of the housing 100 ( 110). Hereinafter, the case where the fan units 4000 and 4500 are disposed below the lower surface 140 of the housing 100 is assumed.

8 and 9 illustrate the first fan unit 4000 and the second fan unit 4500 by varying sizes.

Specifically, the first fan unit 4000 is provided on the movable first fan plate 4100 and the first fan plate 4100 to provide wind toward the upper surface 110 or the lower surface 140. A plurality of fans (4300), a plurality of wheels (4200) provided on the first fan plate (4100), and the first fan plate (4100) on the upper surface (110) or the lower surface (140) A connecting portion 4400 for connecting may be provided.

The first fan plate 4100 may be provided in a flat shape, and may be configured to be movable by being connected to a plurality of wheels 4200 at the bottom. In this case, the fan units 4000 and 4500 may be provided below the lower surface 140 corresponding to the burn-in board rack accommodating part 200.

That is, looking at the operation of the semiconductor component test chamber 1000, a high temperature or a low temperature may be maintained inside the burn-in board rack accommodating part 200. Therefore, there is a high possibility that condensation occurs on the lower surface 140 of the housing 100 corresponding to the burn-in board rack accommodating part 200. Therefore, the fan units 4000 and 4500 may be disposed at positions corresponding to the burn-in board rack accommodating part 200 on the lower surface 140 of the housing 100.

The size of the first fan plate 4100 may be appropriately modified according to the number of fans 4300 installed. That is, when comparing the first fan unit 4000 and the second fan unit 4500, the number of the fans 4300 installed in the first fan unit 4000 is installed in the second fan unit 4500. There will be more than the number of fans 4600. In this case, the first fan plate 4100 of the first fan unit 4000 may be formed larger than the second fan plate 4800 of the second fan unit 4500.

On the other hand, the first fan plate 4100 is a planar shape is shown in a rectangular or square shape, but is not limited thereto. For example, a long elongated rectangle, such as the second fan plate 4800, or a circular or curved shape is also possible.

A plurality of fans 4300 and 4600 are mounted on the first fan plate 4100 or the second fan plate 4800. The condensation may be prevented by providing wind toward the upper surface 110 or the lower surface 140 of the housing 100 by driving the fans 4300 and 4600.

In this case, a power supply unit (not shown) that provides power to the fans 4300 and 4600 may be provided in the first fan plate 4100 or the second fan plate 4800. The power supply unit may supply power to the fans 4300 and 4600 using a battery or the like, or may be connected to an external power supply unit in a wired manner to supply power to the fans 4300 and 4600.

On the other hand, the first fan plate 4100 or the second fan plate 4800 is provided with wheels 4200 and 4900 to move, but if it is located in the condensation prevention area, it is necessary to fix the position. Therefore, one side of the first fan plate 4100 or the second fan plate 4800 may be provided with connecting portions 4400 and 4700 detachably connected to the housing 100.

For example, when the position of the first fan plate 4100 or the second fan plate 4800 is determined, the first fan plate 4100 is connected to the housing 100 through the connecting parts 4400 and 4700 ) Or the movement of the second fan plate 4800. In addition, when it is necessary to change the position of the first fan plate 4100 or the second fan plate 4800, release the connection between the connecting parts 4400 and 4700 and the housing 100 and the first fan plate 4100. Alternatively, the second fan plate 4800 may be moved to reconnect.

On the other hand, when the connection portion (4400, 4700) provides wind toward the upper surface (110) or the lower surface (140) of the housing (100) by the fans (4300, 4600), the wind does not leak to the side, etc. It can also serve as a guide to be provided toward the upper surface 110 or the lower surface 140.

In FIG. 9, it is illustrated that the connecting portions 4400 and 4700 are provided only on one side of the first fan plate 4100 or the second fan plate 4800, but the connection portions 4400 and 4700 are not limited thereto. It may be formed to surround the edge of the first fan plate 4100 or the second fan plate 4800. As described above, when the connecting portions 4400 and 4700 are disposed to completely surround the edges of the first fan plate 4100 or the second fan plate 4800, the wind provided from the fans 4300 and 4600 is directed to the side. It can be supplied to the top surface 110 or the bottom surface 140 without spilling.

Meanwhile, FIGS. 10 to 13 show a configuration of an external condensation preventing unit according to another embodiment.

10 to 13, the external condensation prevention unit is provided on the upper or lower surface 140 of the upper surface 110 of the housing 100 and cleanly dried toward the upper surface 110 or the lower surface 140. The air may include a dry air supply unit.

For example, as shown in FIG. 10, the dry air supply unit is provided at an upper portion of the upper surface 110 or a lower surface 140 of the upper surface 110 of the housing 100, or the lower surface 140. It may be provided with a plurality of injection units (2100, 2200) for supplying clean dry air toward.

The injection parts 2100 and 2200 may be provided in the form of a diffuser 2100 or a tube 2200 provided on the lower surface 140 of the housing 100, for example. In this case, the diffuser 2100 or the tube 2200 may be disposed adjacent to an area to prevent condensation from occurring, for example, a lower surface 140 corresponding to the burn-in board rack accommodating part 200.

In addition, the injection units 2100 and 2200 may be connected to a CDA supply unit (not shown) for supplying clean dry air through a hose or the like to spray clean dry air. In this case, the injection parts 2100 and 2200 may be disposed at different positions on the upper surface 110 or the lower surface 140 of the housing 100.

Meanwhile, referring to FIGS. 11 to 13, the dry air supply unit 3000 may be movably provided at an upper portion of the upper surface 110 or a lower portion of the lower surface 140 of the housing 100.

For example, the dry air supply unit 3000 includes a movable movable plate 3100 and a plurality of provided on the movable plate 3100 to spray dry air toward the upper surface 110 or the lower surface 140. A nozzle unit 3200, a distributor 5000 for supplying the dry air to the plurality of nozzle units 3200, and a plurality of wheels 3300 provided on the movable plate 3100 may be provided.

The movable plate 3100 may be provided in a flat shape, and may be configured to be movable by connecting a plurality of wheels 3300 to the lower portion. In this case, the dry air supply unit 3000 may be provided below the lower surface 140 corresponding to the burn-in board rack accommodating part 200.

That is, looking at the operation of the semiconductor component test chamber 1000, a high temperature or a low temperature may be maintained inside the burn-in board rack accommodating part 200. Therefore, there is a high possibility that condensation occurs on the lower surface 140 of the housing 100 corresponding to the burn-in board rack accommodating part 200. Therefore, the dry air supply unit 3000 may be disposed at a position corresponding to the burn-in board rack accommodating part 200 on the lower surface 140 of the housing 100.

The size of the movable plate 3100 may be appropriately modified according to the number of nozzle units 3200 to be installed. In addition, the movable plate 3100 has a planar shape shown in a rectangular or square shape, but is not limited thereto. For example, elongated rectangles, circular or curved shapes are also possible.

The moving plate 3100 is equipped with a plurality of nozzle units 3200. It is possible to prevent condensation from occurring by providing clean dry air toward the upper surface 110 or the lower surface 140 of the housing 100 through the nozzle unit 3200.

The nozzle unit 3200 may include a fixture 3220 fixed to the movable plate 3100 and a nozzle part 3210 mounted to the fixture 3220.

The fixture 3220 may be connected to the movable plate 3100 through a bolt or the like, and an appropriate quantity may be arranged according to the number of nozzle units required. In addition, the drawing shows a case in which the nozzle unit 3200 is disposed at the same interval on the moving plate 3100, but is not limited thereto, and at least a part of the nozzle unit 3200 may be disposed at different intervals. It might be.

Meanwhile, the nozzle part 3210 may include an inlet 3214 through which clean dry air flows through a hose 5600, and a supply hole 3212 spraying the clean dry air toward the lower surface 140. have. The clean dry air supplied through the hose 5600 may be supplied to a desired area of the lower surface 140 through the supply port 3212.

In this case, a distributor 5000 for distributing clean dry air to the plurality of nozzle units 3200 may be provided in the housing 100. When the movable plate 3100 is provided on the upper surface 110 of the housing 100, the distributor 5000 is also connected to the upper surface 110, on the contrary, the movable plate 3100 is the housing 100 When provided in the lower surface 140 of the distributor 5000 may also be connected to the lower surface 140.

The distributor 5000 serves to distribute clean dry air supplied from an external CDA supply unit (not shown) toward the plurality of nozzle units 3200.

As shown in FIG. 13, the distributor 5000 includes a connection plate 5100 connected to the upper surface 110 or the lower surface 140 of the housing 100, and a plurality of connection plates 5100 provided in the connection plate 5100. Connection ports 5400 and 5500 and connection valves 5200 and 5300 connected to the connection ports 5400 and 5500 may be provided.

The connection valves 5200 and 5300 are connected to the nozzle unit 3200 through a hose 5600 or the like. Accordingly, the amount of clean dry air supplied to the nozzle unit 3200 through the hose 5600 may be controlled by the operation of the connection valves 5200 and 5300.

In addition, the amount of clean dry air supplied from at least a portion of the plurality of nozzle units 3200 may be varied by operating the connection valves 5200 and 5300. That is, when the plurality of nozzle units 3200 are disposed on the movable plate 3100, dew condensation may occur intensively in a partial area of the lower surface 140 or the upper surface 110 of the housing 100.

In this case, the connection valves 5200 and 5300 may be operated such that the amount of clean dry air supplied from the nozzle unit 3200 disposed toward an area where condensation is intensively generated is greater than other nozzles.

In addition, in some areas of the lower surface 140 or the upper surface 110 of the housing 100, the amount of condensation may be relatively small or not. In this case, the amount of clean dry air supplied from the nozzle unit 3200 disposed toward the corresponding area may be less or not supplied compared to other nozzles.

On the other hand, the movable plate 3100 is provided with a wheel 3300 to move, but if it is located in the anti-condensation area, it is necessary to fix the position. Therefore, one side of the movable plate 3100 may be provided with a connection part (not shown) detachably connected to the housing 100.

For example, when the position of the moving plate 3100 is determined, it is possible to prevent the movement of the moving plate 3100 by connecting to the housing 100 through the connecting portion. In addition, when it is necessary to change the position of the movable plate 3100, the connection part and the housing 100 may be disconnected and the movable plate 3100 may be moved to reconnect.

On the other hand, when the connection unit provides clean dry air toward the upper surface 110 or the lower surface 140 of the housing 100 by the nozzle unit 3200, the clean dry air does not leak to the side, etc. It may also serve as a guide to be provided toward the 110 or the lower surface 140.

That is, the connecting portion may be formed to surround the edge of the movable plate 3100. As described above, when the connecting portion is disposed to completely surround the edge of the movable plate 3100, clean dry air provided from the nozzle unit 3200 is not leaked to the side but is supplied to the upper surface 110 or the lower surface 140. Can be.

Although described above with reference to preferred embodiments of the present invention, those skilled in the art variously modify and change the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will be able to. Therefore, if the modified implementation basically includes the components of the claims of the present invention, it should be considered that all are included in the technical scope of the present invention.

100..Housing
200..Burn-in board rack accommodation
264..Feed rack receiving part
300 .. Temperature control
500 .. Insulation
730, 740 .. Heater Unit
3000..Dry air supply unit
4000..First fan unit
4500..2nd fan unit

Claims (12)

A housing forming an exterior;
A burn-in board rack accommodating part provided in the housing and accommodating a burn-in board rack in which a plurality of burn-in boards in which a plurality of semiconductor components to be tested are mounted;
A feed rack accommodating part for accommodating a feed rack in which a feed-through board for electrically connecting to the burn-in board and supplying power to the burn-in board is accommodated;
A temperature control unit for controlling the temperature of the burn-in board rack receiving unit; And
It is provided in the interior of the housing to prevent condensation from occurring inside the housing, and an external condensation prevention unit provided outside the housing to prevent condensation from occurring outside the housing.
The external condensation preventing unit is provided to be movable at the lower portion of the lower surface of the housing, and is provided to be movable at the lower portion of the lower surface of the housing or a fan unit to provide wind toward the lower surface. Equipped with an air supply unit,
The fan unit or the dry air supply unit is provided in the lower portion of the lower surface corresponding to the burn-in board rack receiving portion, a semiconductor component test chamber. According to claim 1,
The internal condensation prevention unit
A semiconductor component test chamber comprising an insulating material surrounding the burn-in board rack receiving portion, wherein the insulating material includes insulating plates on both sides of the insulating filler. According to claim 2,
The insulating material is provided with at least one of a silicon pad or an insulating coating film between the insulating filler and the insulating plate semiconductor component test chamber. According to claim 1,
The internal condensation prevention unit
A semiconductor component test chamber further comprising a dry air injection unit for spraying clean dry air inside the burn-in board rack receiving portion. According to claim 1,
The external condensation prevention unit
And a heater unit provided on at least one of the upper and lower surfaces of the housing to heat at least one of the upper and lower surfaces. delete According to claim 1,
The fan unit
It includes a movable fan plate, a plurality of fans provided on the fan plate to provide wind toward the lower surface, a plurality of wheels provided on the fan plate, and a connecting portion connecting the fan plate to the lower surface Characteristic semiconductor component test chamber. delete According to claim 1,
The dry air supply unit
A semiconductor component test chamber, which is provided at a lower portion of the lower surface of the housing and includes a plurality of injection parts for supplying dry air toward the lower surface. delete According to claim 1,
The dry air supply unit
A movable movable plate, a plurality of nozzles provided on the movable plate for spraying dry air toward the lower surface, a distributor for supplying the dried air to the plurality of nozzles, and a plurality of wheels provided on the movable plate Semiconductor component test chamber, characterized in that provided.


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