KR20050024395A - A system for burn-in testing of electronic devices - Google Patents

Abstract

The power current is provided individually to one electronic device each, and a system 10 is provided that allows burn-in inspection of the electronic device. The system includes a variety of connectors, cables, and configurations that allow for a large amount of power current to be provided to an electronic device. It includes a housing 12, a plurality of burn-in test driver board assemblies 14, a plurality of feedthrough assemblies 16 and a plurality of burn-in board assemblies 18, a heater 20 and a computer system 22.

Description

A SYSTEM FOR BURN-IN TESTING OF ELECTRONIC DEVICES

Background of the Invention

One). Technical Field of the Invention

The present invention generally relates to a system for burn-in inspection of electronic devices.

2). Description of the related technology

When the manufacture of electronic devices, such as computer processors and memory, is complete, the electronic devices must be burned in and subjected to electrical inspection to identify and remove defective devices before shipping to the customer. The term "burn-in" relates to the operation of an integrated circuit at a predetermined temperature or temperature profile, typically at elevated temperatures in an oven. The predetermined operating electrical bias level and / or signal is supplied to the electronic device while the electronic device is at elevated temperature. By the use of elevated temperatures, the pressure governed during the burn-in of the device is accelerated, and in other situations, the device at the border which will not work immediately after being provided with the service becomes inoperable during burn-in and is discarded before transport.

In general, the electronic device is located inside a burn-in socket mounted to a burn-in board substrate. The burn-in board substrate is then inserted into the oven, and the edge fingers on the burn-in board substrate are inserted into the edge finger socket at the end of the oven. The driver board assembly is located outside of the five parts and is connected to the edge finger socket on the feedthrough board. The signal current is provided from the driver board assembly to the electronics in the socket on the burn-in board substrate through the feed through board, the edge finger socket on the feed through board and the edge finger. In addition, power current is provided from the driver board assembly to the electronic device through the socket and the edge finger.

The amount of power that can be provided through the edge finger is generally relatively small, typically on the order of 3 to 5 A per finger. Certain devices, for example computer processors, require a power current with a magnitude greater than what can currently be practically achieved via an edge finger connector. In many cases, power current may also be required to monitor the power current provided to each individual device. However, existing systems are not configured to provide individual power currents to individual devices, and thus also do not power the monitoring of power currents individually provided to each electronic device per finger.

Another disadvantage of using edge finger connectors is that they are only located on the edge of the substrate, thus providing a finite amount of area for adding additional signal, power, ground and other lines.

Summary of the invention

Generally, a system is provided that allows burn-in inspection of an electronic device, wherein a power current is provided separately for each one of the electronic devices. The system also includes various connectors, cables, and other configurations that allow large power currents to be provided to electronic devices.

According to one aspect of the invention, a burn-in board assembly is provided. The burn-in board assembly has a burn-in board substrate, a plurality of burn-in sockets on the burn-in board substrate, each substrate containing a separate electronic device. The burn-in board assembly also has a plurality of burn-in board signal connectors on the burn-in board substrate. Each burn-in board signal connector has a surface that detachably engages with each surface of each signal contact. Each signal connector may carry a maximum direct current having a first magnitude. (The connectors featured herein can carry either direct current or alternating current, but direct current ratings are used throughout this specification.) The burn-in board assembly also has a plurality of burn-in board signal conductors. Each signal conductor connects a burn-in signal connector to a signal contact on the device. The burn-in board assembly also has a plurality of burn-in board power connectors fastened to the burn-in board substrate. Each burn-in board power connector has a surface that detachably engages with each surface of each power contact. Each power connector may carry a maximum direct current with a second size that is greater than the first size. The burn-in board assembly also has a plurality of burn-in board power conductors. Each burn-in board power conductor connects each burn-in power connector to each burn-in board power contact on one device respectively.

The second size may be at least 7 A. The second size may be at least 1.5 times the first size. The second size may be at least 4 A larger than the first size.

The burn-in board power conductor is preferably capable of delivering a maximum direct current of a magnitude larger than the first magnitude.

The burn-in board power conductors are preferably individually connected to at least five burn-in board power connectors with at least five devices. More preferably, the burn-in board power conductors individually connect at least 10 burn-in board power connectors to at least 10 devices.

The burn-in board signal connector and the burn-in board power connector may be different types of connectors. For example, the burn-in board signal connector may be an edge finger. For example, the surface of each burn-in board power connector is cylindrical, preferably annular cylindrical, such as when the burn-in board power connector is each pin.

The burn-in board signal connector and burn-in board power connector may be in two separate groups. For example, the burn-in board assembly includes a burn-in board power connector block where the burn-in board power connector is fastened to the burn-in board power block, wherein the burn-in board power connector block is fastened to the burn-in board substrate independent from the burn-in board signal connector. The burn-in board assembly may also include a burn-in board daughter card, the burn-in board power connector is fastened to the burn-in board daughter card, and the burn-in board daughter card is fastened to a substrate independent from the burn-in board signal connector. Some of the burn-in board power conductors may form a trace, which extends from each other from the burn-in board power connector to where the burn-in board power conductor leaves the burn-in board daughter card. Traces can be extended by at least 25%.

Preferably, the signal contacts and burn-in board signal connectors are coupled by the movement of the burn-in board substrate in the insertion direction, and the power contacts and burn-in board power connectors are coupled. In this case, the burn-in board power connector may be a pin and the burn-in board signal connector may be an edge finger.

Preferably, the signal contacts are in the same location on at least two devices, and the power contacts are in the same location on these two devices.

According to another aspect of the present invention, a burn-in board assembly is provided having different types of connectors. The plurality of burn-in board signal edge finger connectors and the plurality of burn-in board power conductors may be fastened to the burn-in board substrate, each burn-in board power conductor having a cylindrical contact surface. For example, the cylindrical contact surface may be annular cylindrical. In one embodiment, the burn-in board power conductor may be a pin. The embodiment is also expected to be a hole where the burn-in board power conductor engages the pin, but this embodiment has the disadvantage that the pin cannot be maintained as easily as if the pin is located on the burn-in board substrate.

According to another aspect of the present invention, a burn-in test driver assembly is provided. The burn-in test driver assembly includes a driver substrate, a plurality of driver signal connectors fastened to the driver substrate, signal electronics, a plurality of driver power connectors fastened to the driver substrate, and a power source. Each driver signal connector has a surface that detachably engages with each signal contact. Each driver signal connector may carry a maximum direct current having a first magnitude. Each driver power connector has a surface that detachably engages with each power contact. Each driver power connector may carry a maximum direct current with a second size that is greater than the first size. The power supply is connected to the driver power connector.

The second size may be at least 7 A, for example. The second size may be at least 1.5 times the first size, for example. The second size may be at least 4 A greater than the first size, for example.

The driver signal connector and the driver power connector may be different types of connectors. The driver signal connector may be inside the edge finger connector block, for example. The surface of each driver power connector may be substantially annular, for example, where each driver power connector is a respective pin.

The driver signal connector and the driver power connector may be in two separate groups. The burn-in test driver includes, for example, a driver power connector block, wherein the driver power connector is fastened to the driver power connector block, and the driver power connector block can be fastened to a driver substrate independent from the driver signal connector. The burn-in test driver may further comprise a driver power board, for example, the driver power connector may be fastened to the driver power board, and the driver power board may be fastened to a driver substrate independent from the driver signal connector.

Preferably, the signal contact and driver signal connector are coupled by the movement of the driver substrate in the insertion direction and the power contact and driver power connector are coupled.

The burn-in test driver may further comprise a plurality of driver current detectors and output devices. Each detector may communicate with one driver power connector, respectively, to separately detect current through one driver power connector. The output device may be in communication with a driver current detector to provide an output of each current through each driver power connector.

According to another aspect of the present invention, a burn-in test driver assembly is provided having a driver substrate, a plurality of driver signal connectors, signal electronics, a plurality of driver power connectors, a power source, a plurality of driver current detectors, and an output device. The driver signal connector is fastened to the driver substrate. Each driver signal connector has a surface that detachably engages with each signal contact. Signal electronics are connected to the driver signal connector. The driver power connector is fastened to the driver substrate. Each driver power connector has a surface that detachably engages with each power contact. The power supply is connected to the driver power connector. Each detector communicates with one driver power connector each to separately detect current through one driver power connector. The output device communicates with the driver current detector to provide an output of each current through each driver connector. The output device may be, for example, a microcontroller providing an output indicative of the magnitude of each current to the computer.

Preferably, when the current detected by the single driver current detector exceeds a predetermined maximum, the power current provided to the plurality of driver power connectors by the power supply is cut off. Preferably, the power currents of at least 10 driver power connectors are cut off. By shutting off the power supply the power current can be cut off.

Brief description of the drawings

The invention is described by way of example with reference to the accompanying drawings.

1 is a side view illustrating a system, according to an embodiment of the present invention, used for burn-in inspection of an electronic device.

2 is a perspective view showing a portion of a burn-in board assembly that forms part of a system.

3 is a plan view illustrating other components of the burn-in board assembly.

4 is a plan view illustrating a contact layout on two electronic devices.

FIG. 5 is a plan view showing a portion of the burn-in board assembly and the feed-through assembly and a portion of the burn-in test driver board assembly forming part of the system.

FIG. 6 is a side view of a component or part of the component shown in FIG. 5.

7 is a plan view illustrating other components of the driver board assembly.

Detailed description of the invention

System overview

1 of the accompanying drawings shows a system 10 used for burn-in inspection of an electronic device according to an embodiment of the present invention. The system 10 includes a housing 12, a plurality of burn-in inspection driver board assemblies 14, a plurality of feedthrough assemblies 16, a plurality of burn-in board assemblies 18, a heater 20 and a computer system 22. Include.

The housing 12 has an outer wall 24, two inner walls 26 and 28 and a door 30. The oven region 32 is defined together by a portion of the inner wall 26, the door 30 and the outer wall 24. Wall cavity 34 is defined together by inner walls 26 and 28 and other portions of outer wall 24. The driver cabinet 36 is defined together by another part of the outer wall 24 on one side of the wall cavity 34 opposite the inner wall 28 and the oven region 32.

Each burn-in board assembly 18 has a respective burn-in board substrate 38 and a plurality of burn-in sockets 40 mounted to the burn-in board substrate 38. Each burn-in socket 40 may house each electronic device for the purpose of burn-in and / or inspection of the electronic device. Each burn-in board assembly 18 also has a respective electronic interface 42 on its left side.

Each feedthrough assembly 16 has a respective feedthrough board 46, additional feedthrough cables 48 mounted to the feedthrough board 46, and opposing electronic interfaces 50 and 52. The feedthrough assembly 16 is located inside the wall cavity 34 and forms a bridge between the oven region 32 and the driver cabinet 36. The electronic interface 50 is located on the right side of the feedthrough assembly 16 in the oven region 32, and the electronic interface 52 is located on the left side in the driver cabinet 36.

Each burn-in test driver board assembly 14 has an electronics (not shown) mounted directly or indirectly to each driver board substrate 56 and the driver board substrate 56. Electronics include grounded electronics that can be used to inspect signals, power, and electronic devices installed by burn-in socket 40. Each driver board assembly 14 also has a respective electronic interface 58 on its right side.

When assembling the system 10, each driver board assembly 14 is moved in the insertion direction 60 into the driver cabinet 36. The electronic interface 58 of each driver board assembly 14 couples with the electronic interface 52 of each feedthrough assembly 16. The feedthrough assembly 16, together with the driver board assembly 14 connected thereto, forms a permanent or semi-permanent driver subsystem, which subsystem is subsequently received by the burn-in board assembly 18. Used to check the set.

Thereafter, the door 30 is opened and any burn-in board assembly 18 in the oven region 32 is removed from the oven region 32. Each electronic device is then inserted into one burn-in socket 40, respectively. Thereafter, the burn-in board assembly 18 is moved again in the insertion direction 62 inside the oven region 32. Each electronic interface 42 of each burn-in board assembly 18 couples with an electronic interface 50 of each feedthrough assembly 16.

Thereafter, the heater 20 is operated so that the oven region 32 heats to the temperature necessary to burn in and / or inspect the electronic device. The heater 20 is shown as being inside the oven region 32 for simplicity, but is actually located in a separate dedicated area that is in communication with the oven region 32. The electronics of the driver board assembly 14 are insulated and protected from heat by wall cavities 34 in the oven region 32. Computer system 22 is each connected to one driver board assembly 14, respectively. Computer system 22 is used to operate the electronics in the driver board assembly 14 such that the electronics of each driver board assembly 14 pass through each feedthrough assembly 16 and each burn-in board assembly 18. An electronic device held by the socket 40 of each burn-in board assembly 18 to provide signals, current, and ground. The electronic device is inspected while being pressured by the heat from the heater 20 and at the same time the performance of each electronic device is monitored by the computer system 22. The success / failure of monitoring and detection is performed by circuitry on the driver board assembly 14, with the result reported back to the computer system 22.

After the burn-in check is completed, the burn-in board assembly 18 is disengaged from the feedthrough assembly 16 and the electronic device is replaced with a subsequent set of devices to be inspected.

System 10 includes components that allow power current to be provided separately to each one electronic device mounted to socket 40 of each burn-in board assembly 18, as will be described in more detail below. Components that allow power current to be provided to each electronic device individually also allow monitoring power current to be provided to each electronic device individually. In addition, the component allows for a larger magnitude of current to be provided by the electronic device than would be possible without the component.

Burn-in Board Assembly

2 shows a portion of one burn-in board assembly 18.

Burn-in board assembly 18 is added to burn-in board substrate 38 to provide burn-in board daughter card 68, 24 conductive power posts 70P, conductive ground post 70G, burn-in board signal edge finger connector 72. And burn-in board power / ground connector 74.

The lower end of the conductive power post 70P is fastened to the burn-in board substrate 38. The burn-in board daughter card 68 is fastened to the upper end of the conductive power post 70P such that the burn-in board daughter card 68 is spaced apart from the burn-in board substrate 38.

Burn-in board power / ground connector 74 includes 46 burn-in board conductor pins 78 that are fastened to burn-in board power / ground connector block 76 and burn-in board power / ground connector block 76. (In fact, there is a 47th pin, but can be ignored for further explanation.) The 46 burn-in board conductor pins 78 are 24 burn-in board power conductor pins 78P and 22 burn-in board ground conductor pins 78G. It includes. Burn-in board conductor pins 78P and 78G both have an annular cylindrical outer surface. Burn-in board power / ground connector block 76 is fastened to the top surface of burn-in board daughter card 68. The spacing between the first conductive power post and the last conductive power post 70P is approximately twice the spacing between the first burn-in board power conductor pin and the last burn-in board power conductor pin 78P.

Burn-in board signal edge finger connector 72 is located on both the top and bottom surfaces at the edge of burn-in board substrate 38. The burn-in board signal edge finger connector 72 can carry a maximum direct current of 3 A or 5 A, respectively. Burn-in board conductor pins 78P and 78G are capable of delivering a maximum direct current of approximately 10 A each.

The edge finger socket block 80 can be mounted on the side opposite the burn-in board substrate. Edge finger socket block 80 may be used with edge finger connector 72 to form a high density interconnect scheme, as described in US Pat. No. 5,429,510.

3 shows a burn-in board assembly 18 having 24 electronic devices 82 positioned on top in this embodiment. In this embodiment, the electronic devices 82 are located in six rows at increasing distances from the burn-in board daughter card 68, and there are four electronic devices 82 in each row.

Power trace 84 is formed on burn-in board daughter card 68. Each trace 84 connects each burn-in board power conductor pin 78P to each conductive power post 70P. Trace 84 extends from the position at which current burned board conductor pin 78P enters burn-in board daughter card 68 to the position where current leaves burn-in board daughter card 68 at conductive power post 70P. .

Each power trace 86 is formed in a burn-in board substrate 38. One trace 86 each connects one conductive power post 70P to each power contact of one electronic device 82, respectively. Since the power current is provided to each electronic device 82 independently, there are a total of 24 traces 86, each trace 86 directing each post 70 to each electronic device 82. Connect. The extension of the current promoted by the traces 84 reduces the need for many power planes to accommodate a relatively large number of traces 86.

Note that each burn-in board power conductor pin 78P is each formed by one trace 84, one conductive power post 70P, and one trace 86 each. Independent power is supplied to each of the electronic devices 82 through the burn-in board power conductor. There is a one-to-one relationship between the number of burn-in board power conductor pins 78P and the number of electronic devices 82. Each individual burn-in board power conductor may each deliver a maximum direct current of 10 A to one electronic device 82.

Thus, the burn-in board power conductor pins 78P allow bypass of the limited current carrying capacity of the burn-in board signal edge finger connector 72.

Three ground shunt bars 88 are formed in spaced positions along the width of the burn-in board daughter card 68. Each one of the twenty-two burn-in board ground conductor pins 78G is connected to one ground shunt bar 88. Each ground shunt bar 88 is connected to a plurality of conductive ground posts 70G (FIG. 2). The ground trace 90 is formed in the burn-in board substrate 38 and is all connected to the conductive ground post 70G. In addition, the traces 90 are connected to each other such that the burn-in board ground conductor pins 78G form a common terminal. Trace 90 is also connected to ground conductors on one electronic device 82, respectively.

Signal traces 92 in the burn-in board substrate 38 each connect one burn-in board signal edge finger connector 72 in parallel with the signal contacts on all electronic devices 82. Each burn-in board signal edge finger connector 72 is each connected to a separate contact on one electronic device 82. In addition, some signal traces (not shown) are individually connected to individual output pins, typically to one or two pins of electronic device 82 to provide success / failure results for each device separately.

4 illustrates a contact layout on two electronic devices 82. The contact layout can be represented the same. Two electronic devices 82 have power contacts at the same location, and separate power currents are provided to each electronic device 82. The two electronic devices 82 have ground contacts at the same location, and a common ground is provided to the two electronic devices 82. In addition, the two electronic devices 82 have signal contacts at the same location. The first signal (signal 1) is provided at the same location on the electronic device 82. Similarly, the second signal (signal 2) is provided at the same location on the two electronic devices 82 and the third signal (signal 3) is provided at the same location on the two electronic devices 82.

Feedthrough Assembly

5 and 6, in addition to the feedthrough board 46 and the feedthrough cable 48, each feedthrough assembly 16 includes a feedthrough edge finger connector block 94, a feedthrough edge finger ( 96) and right and left feedthrough socket blocks 98 and 100, respectively.

Feedthrough edge finger connector block 94 is mounted to the right edge of feedthrough board 46. The feedthrough edge fingers 96 are all on the top and bottom surfaces near the left edge of the feedthrough board 46. The feedthrough edge finger connector block 94 has a slot 102 formed therein. Feedthrough signal contacts 104 are formed on the inner surface of the slot 102. Each feedthrough edge finger 96 can deliver a maximum direct current having a size of 3 A or 5 A. A plurality of signal traces 106 are formed on the feedthrough board 46. Each trace 106 independently connects one feedthrough signal contact 104 to each feedthrough edge finger 96, respectively. In addition, some signal contacts 104 are shorted together to provide higher current.

The right feedthrough socket block 98 is mounted to the feedthrough board 46 via the intermediate component 108 and is located slightly above the feedthrough edge finger connector block 94. The left feedthrough socket block 100 is mounted to the feedthrough board 46 via the intermediate component 110 and is positioned above some feedthrough edge finger 96. Each socket block 98 and 100 has a plurality of annular cylindrical openings 112 formed therein. Each annular cylindrical opening 112 is defined by an annular cylindrical conductive contact 114 (FIG. 5) inside each socket block 98 or 100.

Each cable 48 has one end attached to the right feedthrough socket block 98 and the opposite end attached to the left feedthrough socket block 100. In addition, each individual cable 48 connects each conductive contact 114 in the right feedthrough socket block 98 with each conductive contact 114 in the left feedthrough socket block 100.

As described above with reference to FIG. 1, the burn-in board assembly 18 is moved in the insertion direction 62. Movement of the burn-in board assembly 18 in the insertion direction 62 moves one burn-in board conductor pin 78P and 78G, respectively, into one annular cylindrical opening 112 in the right feedthrough socket block 98, respectively. Let's do it. For the purpose of controlling the insertion force of the edges into the slot 112, the burn-in board signal edge finger connector 72 is conveyed just before the burn-in board conductor pin 78 begins to enter the annular cylindrical opening 112. The edge of the burn-in board substrate 38 enters the slot 102. There are two additional alignment pins 116 that engage first. The additional alignment pins are only mechanical and carry no current. Another movement of the burn-in board assembly 18 in the insertion direction 62 also moves the burn-in board conductor pins 78 into the annular cylindrical opening 112, while the burn-in board signal edge finger connector 72 has a slot ( 102) Move inside. Then, each surface of each one burn-in board signal edge finger connector 72 contacts each surface of one feedthrough signal contact 104, respectively. In addition, the conductive annular cylindrical outer surface of each burn-in board conductor pin 78 contacts each of the annular cylindrical conductive contacts 114 in the right feedthrough socket block 98. Thereafter, each feedthrough edge finger 96 is individually connected to one burn-in board signal edge finger connector 72, respectively.

In addition, each annular cylindrical conductive contact 114 in the left feedthrough socket block 100 is individually connected to one burn-in board conductive pin 78P and 78G, respectively. The annular cylindrical conductive contacts 114 in the two feedthrough socket blocks 98 and 100 can be divided into two groups. The first group consists of conductive contacts 114P connected to the burn-in board power conductor pins 78P. Each one conductive contact 114P in the left feedthrough socket block 100 may each be used to individually provide power current to one of the separate electronic devices. The second group consists of a conductive contact 114G that is connected to the burn-in board ground conductive pin 78G to provide ground to the electronic device.

The conductive contacts 114P and 114G can both carry a maximum direct current having a size of 10 A. For example, on the opposite side of the trace, the advantage of connecting the conductive contacts 114P and 114G with the cable 48 is that the cable generates less noise due to the passive parameters associated with them. The cable 48 has a lower resistance than the trace on the circuit board, thus minimizing the voltage drop. The absolute value of the nominal voltage is very important, especially since it falls below 1V.

Driver Board Assembly

5 and 6 also show a portion of one driver board assembly 14. Components of the driver board assembly 14 shown include a driver board 120, a driver power board 122, a driver edge finger connector block 124 and a driver power / ground connector 126.

The driver edge finger connector block 124 is fastened to the edge of the driver substrate 120. The driver edge finger connector block 124 has a slot 130 in its side. Driver signal connector 132 (FIG. 5) is located inside slot 130.

Driver power / ground connector 126 includes a plurality of driver connector pins 136 fastened to driver power / ground connector block 134 and driver power / ground connector block 134. The driver power / ground connector block 134 is fastened to the driver power board 122, and the driver power board 122 is fastened to the driver substrate 120 through the intermediate component 138.

As described above with reference to FIG. 1, the driver board assembly 14 is moved in the insertion direction 60. The driver connector pin 136 moves into the annular cylindrical opening 112 in the left feedthrough socket block 100. After the end of the connector pin 136 is inserted into the annular cylindrical opening 112 in the left feedthrough socket block 100, the slot 130 feeds through the feedthrough edge finger 96. Start to move over the edge of. Subsequent movement of the driver board assembly 14 in the insertion direction 60 further moves the connector pin 136 into the opening 112 and the slot 130 moves all the way over the feedthrough edge finger 96. . Each driver signal connector 132 has a respective surface making a contact with each surface of one feedthrough edge finger 96, respectively. Each one connector pin 136 has a conductive annular cylindrical outer surface that makes contact with one annular cylindrical conductive contact 114 in the left feedthrough socket block 100, respectively.

Driver connector pins 136 may be divided into two groups. The first group consists of driver power connector pins 136P that couple with conductive power contacts 114P of the left feedthrough socket block 100. The second group consists of a driver ground contact pin 136G that couples with a conductive ground contact 114G of the left feedthrough socket block 100. Since each driver power connector pin 136P each individually provides power current to one electronic device, there may be a one-to-one relationship between the number of driver power connector pins 136P and the number of electronic devices. have.

FIG. 7 shows a driver board assembly 14 including a signal electronics 144, a power source 146, an electrical ground 148, and a device 150 for monitoring the current provided individually to each electronic device. Other components are also shown.

The power source 146 is connected to one driver power connector pin 136P, respectively, through each resistor 152. There is a total of 24 resistors 152, one for each electronic device. Driver ground connector pins 136G are all connected to electrical ground 148. The power current can flow from the power supply 146 through each of the one resistor 152 individually to one driver power connector pin 136P, and subsequently individually into one electronic device each to 10A. . Return current can flow from the electronic device to electrical ground 148 at 10A.

Signal electronics 144 is connected to the driver board signal contact connector 132. Individual signals may be provided separately from signal electronics 144 to one driver signal connector 132, respectively. In general, each driver signal connector 132 provides signal current in parallel for the same location on all electronic devices (see FIG. 4).

Apparatus 150 includes 24 amplifiers 156, multiplexer 160, 8-bit analog-to-digital converter 162, registers 164, bus 166, and microcontroller 168.

Each amplifier 156 is connected by two detector lines 170 through one resistor 152 each. The change in current through each resistor 152 causes a change in voltage through each resistor according to the equation ΔV = ΔIR. Thus, the voltage difference provided to the amplifier 156 via the detector line 170 represents the magnitude of the current flowing through each resistor 152 to each electronic device to which each resistor 152 is connected.

Amplifier 156 provides linear amplification of the voltage difference detected through detector line 170 and provides a voltage output to multiplexer 160. The voltage output provided by the amplifier 156 to the multiplexer 160 has a magnitude that represents the magnitude of the current flowing through each resistor 152. Multiplexer 160 receives a total of 24 voltages V1, V2, V3,... V24. Each voltage input input into the multiplexer 160 has a magnitude representing a respective current flowing to each electronic device.

Multiplexer 160 has an output connected to analog-to-digital converter 162. Five selector lines 172 are connected to the multiplexer 160. The signal through selector line 172 causes multiplexer 160 to select one of the voltages provided to analog-to-digital converter 162 (eg, V3). While only one of the voltages V1 to V24 is provided to the analog-to-digital converter 162 at the instant of a predetermined time, the signal to the selector line 172 repeatedly steps the voltage provided to the analog-to-digital converter 162 from V1 to V24. Alternately to step on.

Analog-to-digital converter 162 converts the voltage received from multiplexer 160 into 8-bit digital data and provides this data to register 164. The digital data held by the register 164 indicates the magnitude of the voltage provided by the multiplexer 160 to the analog to digital converter 162.

The register 164 is connected to the microcontroller 168 via the bus 166. Also, other registers 174 can be connected to the microcontroller 168 via the bus 166. To control the data supplied to the bus 166, the microcontroller 168 provides a read command to one selected register 164 or 174. When a read command is provided to the register 164, the digital data stored in the register 164 is provided to the microcontroller 168 via the bus 166.

The computer system 22 is connected to the microcontroller 168. Microcontroller 168 provides digital data to computer system 22. Computer system 22 can be used to monitor and report digital data, and thus can indirectly monitor the current provided to one electronic device each.

In addition, the user can program computer system 22 to a reference high level and a reference low level for individual channels. Computer system 22 continuously compares the currents and measures each driver power connector pin 136P as a reference value. Computer system 22 does not perform any operation while the power current in all power connector pins 136P is between the reference values, respectively. Computer system 22 begins to operate when the power current through one power connector pin 136P is above or below the reference high value. The computer system 22 then sends a command to the power supply 146 via the microcontroller 168, the bus 166 and the register 174. The command sent to power source 146 shuts off power source 146. Thereafter, no power current is provided to either driver power connector pin 136P. A short circuit on one electronic device 82 (FIG. 3) will not damage the electronic device or other components of the burn-in board assembly 18. Each of these overall current detections is very important because the power supply is rated at a relatively high 200A compared to the previous system, which is rated at about 25A, which can cause significant damage to the burn-in board in a short circuit condition.

Thus, it can be seen that the system allows high power current to be provided separately to each one electronic device. The current is provided individually by one electronic device, each monitored individually.

While certain exemplary embodiments have been described and shown in the accompanying drawings, these embodiments are intended to be illustrative only and are not intended to limit the invention, and modifications may be made by those skilled in the art, and therefore, the present invention is directed to specific configurations and It is not limited to an array.

Claims (42)

As a burn-in board assembly, Burn-in board substrate; A burn-in socket on a burn-in board substrate, comprising: a plurality of said burn-in sockets each containing a separate electronic device; A burn-in board signal connector fastened to the burn-in board, each of the burn-in board signal connectors having a surface for removably mating with a respective surface of each signal contact, each signal connector having a first size having a maximum A plurality of said burn-in board signal connectors capable of carrying a direct current; A plurality of burn-in board signal conductors for connecting the burn-in board signal connectors to signal contacts on the device; A burn-in board power connector fastened to the burn-in board substrate, wherein each burn-in board power connector has a surface that detachably engages with each surface of each power contact, each power connector being larger than the first size A plurality of said burn-in board power connectors capable of delivering a maximum direct current having a second size; And A burn-in board assembly comprising a plurality of burn-in board power conductors that individually connect each burn-in board power connector to each power contact on one of the devices. The method of claim 1, And the second size is at least 7 A. The method of claim 1, And said second size is at least 1.5 times greater than said first size. The method of claim 1, And said second size is at least 4 A greater than said first size. The method of claim 1, And the second size is at least 1.5 times the first size and at least 4 A greater than the first size, wherein the second size is at least 7 A. The method of claim 1, Each burn-in board power conductor is capable of carrying a maximum direct current of magnitude greater than the first size. The method of claim 1, And said burn-in board power conductor individually connects at least five said burn-in board power connectors to at least five said devices. The method of claim 7, wherein And said burn-in board power conductor individually connects at least 10 said burn-in board power connectors to at least 10 said devices. The method of claim 1, And said burn-in board signal connector and said burn-in board power connector are connectors of different types. The method of claim 9, And the burn-in board signal connector is an edge finger. The method of claim 10, The surface of each burn-in board power connector is cylindrical, burn-in board assembly. The method of claim 11, Wherein said surface of each burn-in board power connector is an annular cylindrical shape. The method of claim 11, Each burn-in board power connector is a separate pin-in, burn-in board assembly. The method of claim 1, And said burn-in board signal connector and said burn-in board power connector are in two separate groups. The method of claim 10, Further comprising a burn-in board power connector block, wherein the burn-in board power connector block is fastened to the burn-in board power connector block, and the burn-in board power connector block is fastened to the burn-in board substrate independent of the burn-in board signal connector, Burn-in board assembly. The method of claim 15, Further comprising a burn-in board daughter card, wherein the burn-in board power connector is fastened to the burn-in board daughter card, and the burn-in board daughter card is fastened to the burn-in board board independent of the burn-in board signal connector. . The method of claim 16, The portion of the burn-in board power conductor forms a trace, wherein the trace extends from each other from the burn-in board power connector to a position where the burn-in board power conductor leaves the burn-in board daughter card. The method of claim 17, And the trace extends by at least 25%. The method of claim 1, A burn-in board assembly, wherein a signal contact and the burn-in board signal connector are coupled by movement of the burn-in board substrate in an insertion direction, and the power contact and the burn-in board power connector are coupled. The method of claim 19, And said burn-in board power connector is a pin and said burn-in signal connector is an edge finger. The method of claim 1, And the signal contact is in the same location on at least two of the devices, and the power contact is in the same location on the device. As a burn-in board assembly, Burn-in board substrate; A burn-in socket on the burn-in board substrate, comprising: a plurality of the burn-in sockets each containing a separate electronic device; A plurality of burn-in board signal edge finger connectors fastened to the burn-in board substrate, each burn-in board signal edge finger connector having a surface for removably mating with a respective surface of each signal contact Finger connector; A plurality of said burn-in board signal conductors connecting said burn-in board signal edge finger connector to signal contacts on said device; A burn-in board power connector fastened to the burn-in board substrate, each burn-in board power connector having a cylindrical contact surface detachably coupled with a respective surface of each power contact; And A burn-in board assembly comprising a plurality of burn-in board power conductors connecting each burn-in board power connector to a power contact on the device. The method of claim 22, And the cylindrical contact surface is an annular cylindrical contact surface. The method of claim 22, The burn-in board power connector is a pin-in, burn-in board assembly. Driver substrate; A driver signal connector fastened to the driver substrate, each driver signal connector having a surface detachably coupled with each signal contact, each driver signal connector being capable of delivering a maximum direct current having a first magnitude The driver signal connector; Signal electronics connected to the driver signal connector; A driver power connector fastened to the driver substrate, each driver power connector having a surface detachably coupled with a respective power contact and capable of delivering a maximum direct current having a second size greater than the first size; The driver power connector; And And a single power source connected to the driver power connector. The method of claim 25, The driver assembly, wherein the second size is at least 7 A. The method of claim 25, And the second size is at least 1.5 times the first size. The method of claim 25, And the second size is at least 4 A larger than the first size. The method of claim 25, And the second size is at least 7 A, at least 1.5 times the first size, and at least 4 A larger than the first size. The method of claim 25, And the driver signal connector and the driver power connector are different types of connectors. The method of claim 30, Wherein the driver signal connector is inside an edge finger connector block. The method of claim 31, wherein The surface of each driver power connector is substantially annular. The method of claim 32, Each driver power connector is a respective pin. The method of claim 25, The driver signal connector and the driver power connector in two separate families. The method of claim 34, wherein Further comprising a driver power connector block, Wherein the driver power connector is coupled to the driver power connector block, and the driver power connector block is coupled to the driver substrate independent of the driver signal connector. 36. The method of claim 35 wherein Further comprising a driver power board, Wherein the driver power connector is fastened to the driver power board, and the driver power board is fastened to the driver substrate independent of the driver signal connector. The method of claim 25, Wherein the signal contact and the driver signal connector are coupled by movement of the driver substrate in an insertion direction, and the power contact and the driver power connector are coupled. The method of claim 25, A driver current detector, comprising: a plurality of said driver current detectors, each detector being in communication with one said driver power connector, respectively for detecting current separately through one said driver power connector; And And an output device in communication with the driver current detector to provide an output of the respective current through the respective driver power connector. Driver substrate; A driver signal connector fastened to the driver substrate, each driver signal connector having a surface for removably mating with each signal contact; Signal electronics connected to the driver signal connector; A driver power connector fastened to the driver substrate, each driver power connector having a surface for removably coupling with a respective power contact; A power source connected to the driver power conductor; A driver current detector, comprising: a plurality of said driver current detectors, each detector in communication with one said driver power connector, respectively for detecting current separately through one said driver power connector; And And an output device in communication with the driver current detector to provide an output of each current through the respective driver power connector. The method of claim 39, Wherein if a single driver current detector exceeds a predetermined maximum value, the power current provided to the plurality of driver power connectors is cut off by the power source. The method of claim 40, The driver assembly of which power current to at least ten of the driver power connectors is isolated. The method of claim 40, And the power source is cut off.