KR100942187B1 - Inter-connection Apparatus between Boards for Semiconductor Device Test System - Google Patents

Abstract

The present invention reduces the volume by using a substrate printed with a wiring pattern instead of a cable in connecting a tester having various test circuits mounted thereon in a semiconductor device test system to a test board equipped with a semiconductor device to be tested. The present invention relates to a board connection device of a semiconductor device test system which can reduce impedance and maintain uniform impedance.

The board connection device of the semiconductor device test system of the present invention includes a test head having a plurality of testers made of printed circuit boards arranged horizontally at intervals up and down, and a test board equipped with a plurality of test sockets on which semiconductor devices to be tested are mounted. In a semiconductor device test system comprising a test chamber which is inserted into and taken out in a horizontal state and an insulating portion interposed between the test head and the test chamber and thermally disconnects them, A head-side connection board made of a printed circuit board, having a head facing connector coupled to a head connector installed on the tester on a surface facing the tester, and a board facing connector installed on a surface facing the test chamber; It is made of a printed circuit board fixed to the inside and outside of the test chamber through the heat insulating part horizontally, the head-side connector is installed at the end of the substrate outside the test chamber is joined to the board-side connector of the head-side connection board, A board-to-board connection board having a connection member coupled to the connector connected to the test board at the bottom of the substrate inside the test chamber; It includes a forward and backward transfer means for moving the head-side connection board forward and backward toward the connection board between the board and the lifting transfer means for lifting the test board toward the connection board between the board.

Semiconductor, device, test, connection, cable, connector, wiring, print, board

Description

Inter-connection Apparatus between Boards for Semiconductor Device Test System}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board connection device of a semiconductor device test system. In particular, in a semiconductor device test system, a wiring pattern is printed instead of a cable in connecting a tester having various test circuits mounted thereon to a test board on which a semiconductor device to be tested is mounted. The present invention relates to a board connection device of a semiconductor device test system, which reduces the volume and maintains a uniform impedance by using a substrate.

As is well known, in the manufacturing process of various semiconductor devices, a semiconductor device (hereinafter, simply referred to as a device) manufactured through a predetermined assembly process is finally subjected to a test process for checking whether a specific function is performed. The overall configuration of a conventional semiconductor device test system includes a test head for testing a semiconductor device, a handler and a test head for carrying a predetermined number of semiconductor devices to be tested and classifying and loading the semiconductor devices according to the test results. Interposed between the handlers can include a high-fix (HIFIX) board to establish an electrical connection between the semiconductor device and the test head.

Meanwhile, a contact method for signal transmission between the test head, which is commonly called an automatic test equipment (ATE) and a test board on which a device to be tested is mounted, is a connector to cable or a connector to cable to connector. to cable to connector (IP) is widely used, and these methods have many limitations in the current trend of an increasing number of devices being tested simultaneously.

In other words, even if a large number of signals are generated by each tester at the same time, the contact method that delivers the signal is a connector-to-cable method or a connector-to-cable-to-connector method, which is used for intermediate connection from the tester to the test board. The number of cables to be made is so large that the volume becomes enormous and there are many problems in the mounting.

For example, when configuring a system that tests approximately 3,000 devices simultaneously, the test head can generate more than 69,000 signals, which adds to the volume of the test system. As it is used, the cost of building a system also increased. Moreover, the test head has a problem that it is not easy to ensure that many cables that electrically connect the tester and test board have the same impedance, even if the signal and impedance can be maintained.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and in a semiconductor device test system, in connection with a tester having various test circuits mounted thereon to a test board on which a semiconductor device to be tested is mounted, a board having a printed wiring pattern instead of a cable may be used. Its purpose is to provide a board connection device for a semiconductor device test system that can reduce its volume, reduce the cost of building a system, and maintain a uniform impedance.

Board connection device of the semiconductor device test system of the present invention for solving the above object is a test head consisting of a plurality of testers made of a printed circuit board horizontally arranged at intervals up and down, a plurality of semiconductor devices to be tested In a semiconductor device test system comprising a test chamber in which a test board equipped with a test socket is withdrawn in a horizontal state and an insulating portion interposed between the test head and the test chamber to thermally disconnect them, It consists of a printed circuit board disposed perpendicular to the tester, the head facing the tester is fitted with a head-connected connector to the head connector installed in the tester, the board facing the test chamber is provided head Side connection board; It is made of a printed circuit board fixed to the inside and outside of the test chamber through the heat insulating part horizontally, the head-side connector is installed at the end of the substrate outside the test chamber is joined to the board-side connector of the head-side connection board, A board-to-board connection board having a connection member connected to the connector connected to the test board at the bottom of the substrate inside the test chamber; It includes a forward and backward transfer means for moving the head-side connection board forward and backward toward the connection board between the board and the lifting transfer means for lifting the test board toward the connection board between the board.

In the above-described configuration, the connection member of the board-to-board connection board may be formed in a contact pattern that is in contact with or separated from the pogo pin block installed on the rear end of the test board. The insulation board is provided with a connection board fixture for fixing the connection board between the boards.

On the other hand, the head-side connection board and the heat insulating portion is further provided with alignment means for guiding the correct coupling of the board-side connector of the head-side connection board and the head-side connector of the board-to-board connection board, the board-to-board connection Preferably between the board and the test board is further provided with alignment means for guiding the correct contact between the contact pattern and the pogo pin block.

According to the board connection device of the semiconductor device test system of the present invention, a wiring pattern is printed in place of an expensive coaxial cable in connecting a tester mounted with various test circuits in a semiconductor device test system to a test board equipped with a semiconductor device to be tested. By using the prepared substrates, the volume can be reduced, the cost of constructing the system can be reduced, and the uniform impedance can be maintained.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the board connection apparatus of the semiconductor device test system of the present invention.

1 is a perspective view schematically showing an overall configuration of a semiconductor device test system to which a board connection device of the present invention can be applied. As shown in FIG. 1, a schematic overall configuration of a semiconductor device test system to which a board connection device of the present invention is applied is a test head 100 and a test board 600 mounted with a plurality of testers 400. It may include a test chamber 300 and the heat insulating part 200 interposed between the test head 100 and the test chamber 600 to thermally disconnect them.

In the above-described configuration, the test head 100 is arranged with a plurality of testers 400 spaced up and down, preferably arranged in two rows. In the embodiment of Figure 1 illustrates a test head 100 having a total of 48 testers 400, 24 sheets per column, one tester 400 in a single operation when testing 64 devices A total of 3,072 (48 * 64) devices can be tested simultaneously. Therefore, although only a part of the test chamber 300 is shown in the drawing to clearly show its structure, assuming that the tester 400 and the test board 600 correspond to one-to-one, the test board 600 is also total. 48 sheets will be required, and the volume of the test chamber 300 will be increased to accommodate all of them.

The thermal insulation 200 is interposed therebetween to thermally disconnect between the test head 100 and the test chamber 300. The test chamber 300 is a device in which the device is subjected to harsh conditions, for example, significantly lower than room temperature. In order to test whether it operates normally even at a high temperature, the test is maintained at a temperature lower than a normal temperature or a high temperature, and is interposed to prevent cold or hot air from the test chamber 300 from being transmitted to the test head 100.

FIG. 2 is a side view schematically showing a major configuration of a semiconductor device test system to which a board connection device of the present invention can be applied, and illustrates a structure in which two upper and lower testers 400 correspond to one test board 600. have. As shown in FIG. 2, the configuration of the semiconductor device test system of the present invention includes a test head 100 including a plurality of testers 400 and a test chamber 300 in which a test board 600 mounted with a device to be tested is put in and taken out. ) And a heat insulating part 200 interposed therebetween.

In the above-described configuration, the test board 600 is mounted on the printed circuit board 610 and the printed circuit board 610 in a matrix form, and the test socket 620 and the rear end of the printed circuit board 610 to which the device is attached or detached ( When the right side is the tip, it is the same below.) And one or more pogo pin block 630 is electrically connected to the test socket 620 by the printed wiring of the printed circuit board 610. have. 7 is a plan view of the test board in FIG. 2, in this embodiment, a total of 64 test sockets 620 may be arranged in a matrix form of 8 * 8 in one test board 600, and a printed circuit is provided at a rear end thereof. A total of four pogo pin blocks 630 are electrically connected to these test sockets 620 through the printed wirings of the substrate 610. Here, the pogo pin refers to a terminal pin that is elastically stretched in the vertical direction because an elastic member such as a spring (not shown) is provided therein, and one pogo pin block 630 includes hundreds of pogos. Pins may be provided.

In the drawings, reference numeral 640 denotes an alignment pin for guiding accurate connection when the pogo pin block 630 is electrically contacted with a board-to-board connection board to be described later. 2, the head connector (described later) electrically connected to the printed wiring of the printed circuit board (described later) on which the test circuit is mounted is mounted at the tip of each tester 400. FIG. Meanwhile, in the present invention, the head-side connection board 800 and the board-to-board connection board 500 are used to electrically connect the tester 400 and the test board 600.

FIG. 3 is an enlarged side view illustrating a configuration of an insulation part and a test chamber part in a state in which the head-side connection board and the board-to-board connection board are in contact with each other.

4 is an enlarged side view illustrating a state in which a test board is located below a board-to-board connection board in FIG. 2;

FIG. 5 is an enlarged side view illustrating a state in which a test board is electrically contacted with a board-to-board connection board in FIG. 2;

FIG. 6 is an enlarged side view of the tester coupled to the head side connection board in FIG. 2.

As shown in Figure 3 to 6, the head-side connection board 800 is made of a printed circuit board 810 is fixed to be perpendicular to each tester 400 inside the test head 100, the tester The head facing connector 830 coupled to the head connector 420 is mounted on the surface facing the 400, and the board facing connector 820 is installed on the surface facing the test board 600. In the drawing, reference numeral 840 denotes an alignment pin.

On the other hand, the board-to-board connection board 500 is also made of a printed circuit board 510 penetrating the heat insulating part 200, one end, that is, the end facing the tester 400 is exposed to the outside of the test chamber 300 The remaining part is disposed inside the test chamber 300. A head facing connector 520 is installed at the exposed end, and the head facing connector 520 is joined to the board facing connector 820 of the head side connection board 800 as shown in FIG. 3. On the other hand, a contact pattern 530 is formed at the bottom of the printed circuit board 510 located inside the test chamber 300 to contact or separate one-to-one with each pogo pin of the pogo pin block 630 described above. The contact pattern 530 is electrically connected to the heading connector 520 by the printed wiring of the printed circuit board 510.

In the drawings, reference numeral 210 denotes an alignment ball formed in the heat insulating part 200, and this alignment ball 210 is connected to the head side connection board 800 and the board-to-board connection board 500, that is, a board facing connector. When connecting the 820 and the head-oriented connector 520 guides the alignment pin 840 installed in the head-side connection board 800 to guide the correct coupling. Reference numerals 220 and 230 denote connection board fixtures for reliably fixing the board-to-board connection board 500 that penetrates the heat insulating part 200 to the heat insulating part 200.

On the other hand, the test chamber 300 is also installed so that the socket pusher 700 for opening each test socket can be lifted, this socket pusher 700 is a test plate 710 and the lower portion of the support plate 710 The socket 620 may correspond to a one-to-one correspondence with a pressing protrusion 720 protrudingly installed.

In the drawings, reference numeral 900 denotes a cylinder for elevating the test board 600 to electrically connect or disconnect the test board 600 to the board-to-board connection board 500, and 910 denotes a socket pusher 700 for the test socket ( 620 represents a cylinder for elevating, and finally 920 represents a cylinder for advancing and retreating the head-side connecting board 800 to couple or separate the head-side connecting board 800 to the board-to-board connecting board 500, respectively. .

Hereinafter, the operation of the semiconductor device test system to which the board connection device of the present invention is applied will be described in detail.

First, when the head side connection board 800 is advanced by operating the cylinder 920, as shown in FIG. 3, the alignment pins 840 installed on the head side connection board 800 are aligned on the heat insulating part 200. Guided by the ball 210, the board-side connector 820 of the head-side connection board 800 is accurately coupled to the head-side connection board 520 of the board-to-board connection board 500. In this state, the head connector 420 of the tester 400 is manually or automatically engaged with the head facing connector 830 of the head-side connection board 800 (shown in FIG. 6 only for convenience) to test the test. All electrical connections are completed, and these connections remain until dismantled for future maintenance.

Next, the test board 600 carried into the test chamber 300 with the device to be tested mounted on each test socket 620 is transported by a transfer mechanism not shown in FIG. 4. As described above, the position fixing tool 650 is positioned below the board-to-board connection board 500 while its position is fixed. That is, the position fixing tool 650 is a test board (so that each contact pattern 530 of the bottom surface of the printed circuit board 510 of the board-to-board connection board 500 is placed directly below each pogo pin of the pogo pin block 630) Fix the position of 600).

In this state, as shown in FIG. 5, the cylinder 900 raises the test board 600 so that each pogo pin of the pogo pin block 630 is connected to each contact pattern 530 of the board-to-board connection board 500. In this process, even though the contact pattern 530 is slightly displaced with respect to the pogo pin, the alignment pin 640 is guided by an alignment hole (not shown) so that each pogo pin contacts the contact pattern 530 accurately.

Finally, in this state, a predetermined function test is performed by applying various signals to the device mounted on the test board 600. In this manner, when one test is completed, the test board 600 is removed from the test chamber 300 after the test board 600 is separated from the board-to-board connection board 500.

The board connection device of the semiconductor device test system of the present invention is not limited to the above-described embodiments, and can be modified in various ways within the scope of the technical idea of the present invention. For example, a pogo pin block may be installed on the bottom of the board-to-board connection board, while a contact pattern may be formed on the test board. Furthermore, the order of connection of each board or connector described above may also be changed as appropriate.

1 is a perspective view schematically showing an overall configuration according to an embodiment of a semiconductor device test system to which the board connection device of the present invention may be applied;

FIG. 2 is a side view schematically showing some main components of a semiconductor device test system to which a board connection device of the present invention can be applied; FIG.

FIG. 3 is an enlarged side view illustrating a configuration of an insulation part and a test chamber part in a state in which the head-side connection board and the board-to-board connection board are in contact with each other; FIG.

4 is an enlarged side view illustrating a state in which a test board is located below a board-to-board connection board in FIG. 2;

5 is an enlarged side view illustrating a state in which a test board is electrically contacted with a board-to-board connection board in FIG. 2;

Figure 6 is an enlarged side view showing a state in which the tester is coupled to the head-side connection board in FIG.

7 is a plan view of the test board in FIG. 2.

*** Explanation of symbols for the main parts of the drawing ***

100: test head, 200: thermal insulation,

210: alignment ball, 220, 230: connection board fixture,

300: test chamber, 400: tester,

410: printed circuit board, 420: head connector,

500: board connection board, 510: printed circuit board,

520: connector for test head, 530: contact pattern,

600: test board, 610: substrate,

620: socket, 630: pogo pin block,

640: alignment pin, 650: positioning fixture,

700: socket pusher, 710: support plate,

720: push projection, 800: head side connection board,

810: printed circuit board, 820: connector for the test board,

830: heading connector, 840: alignment pin,

900, 910, 920: cylinder

Claims (5)

A test head comprising a plurality of testers made of a printed circuit board horizontally arranged at intervals up and down, a test chamber in which a test board equipped with a plurality of test sockets on which a semiconductor device to be tested is mounted is placed in and out of a horizontal state, and the test head And a thermal insulation interposed between the test chamber and thermally disconnecting the test chamber. It consists of a printed circuit board arranged in a vertical state with the tester at the tip of the test head, the head facing the tester is fitted with a head-to-head connector to be fitted to the head connector installed in the tester, the face facing the test chamber Head-side connection board is provided with a board-side connector is installed; It is made of a printed circuit board fixed to the inside and outside of the test chamber through the heat insulating part horizontally, the head-side connector is installed at the end of the substrate outside the test chamber is joined to the board-side connector of the head-side connection board, A board-to-board connection board having a connection member coupled to the connector connected to the test board at the bottom of the substrate inside the test chamber; Front and rear conveying means for advancing the head-side connection board back and forth toward the connection board between the board and And a lift transfer means for lifting and lowering the test board toward the board-to-board connection board. The method of claim 1, The connecting member of the board-to-board connection board is a board connection device of the semiconductor device test system, characterized in that made of a contact pattern that is in contact with or separated from the pogo pin block installed on the rear end of the test board. The method of claim 2, The board connecting device of the semiconductor device test system, characterized in that the insulating board is provided with a connection board fixture for fixing the connection board between the board. The method of claim 3, wherein The head-side connection board and the heat insulating part are further provided with a semiconductor device test, characterized in that the alignment means for guiding the correct coupling of the board-side connector of the head-side connection board and the head-side connector of the board-to-board connection board Board-attachment in the system. The method according to any one of claims 2 to 4, And a means for aligning the contact pattern and the pogo pin block between the connection board and the test board between the boards.

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