KR102523725B1 - Hander for testing electronic components - Google Patents

Abstract

The present invention relates to a handler for low-temperature testing that supports testing of electronic components in a low-temperature environment.
The handler for a low temperature test according to the present invention has a structure capable of local cooling by configuring an environment holding chamber and maintaining the environment holding chamber in a dry state.
According to the present invention, there is an effect of improving the reliability of a test for an electronic component and saving energy while improving cooling efficiency.

Description

Handler for testing electronic components {HANDER FOR TESTING ELECTRONIC COMPONENTS}

The present invention relates to a handler for testing electronic parts that supports electronic parts such as semiconductor devices to be tested by a tester.

In some cases, electronic components such as semiconductor devices are produced through numerous processes. Even if each process is performed under standardized conditions, it is currently virtually impossible to produce only good products because electronic products that require sophisticated work are more affected by minute fluctuations in conditions. In other words, generation of defective products is unavoidable. Therefore, after being tested by a tester, the produced electronic parts are divided into good products and defective products, and only good products are shipped.

Testing of electronic components is possible only when the electronic components are electrically connected to the tester. At this time, the handler is a device that electrically connects the socket of the tester and the electronic component.

Meanwhile, electronic components may be used in thermally diverse environments. Accordingly, when testing electronic components, it is necessary to test them in a state in which a special temperature environment is established. Therefore, the handler needs to electrically connect the electronic component to the tester while maintaining the electronic component at a high temperature, low temperature, or normal temperature according to the required test conditions. Among them, the present invention relates to a handler capable of supporting a test while maintaining an electronic component at a low temperature.

In general, methods for cooling electronic components include a chamber method and a plate method.

The chamber method is a method of cooling an electronic component by constructing a chamber capable of creating a low-temperature environment and accommodating the electronic component in the chamber. This chamber method has disadvantages in that energy consumption is high in order to maintain the temperature inside the chamber having a large space at a low temperature, and a long time is consumed for cooling the electronic parts.

The plate method is a method of cooling an electronic component through conduction by placing an electronic component on a plate cooled by a cooling fluid. Since this plate method directly cools electronic parts through conduction, the cooling time is short, but since it is localized cooling, there is a disadvantage in that dew condensation or freezing occurs due to the influence of relatively high temperature ambient air. In particular, if condensation or freezing occurs when electronic components are pre-cooled prior to testing, defects in electrical contact between the electronic components and the tester tend to occur during the test process, and furthermore, due to condensation or freezing, Damage may occur to parts constituting the handler.

Of course, it is possible to mix the chamber method and the plate method, but since it is virtually impossible to completely block the inside of the chamber from the outside in the path along which electronic components move, energy consumption is inevitably high. Moreover, it is practically difficult to prevent dew condensation or icing from occurring when relatively humid external air is introduced into the chamber.

Republic of Korea Patent Publication No. 10-2003-0023213 Republic of Korea Patent Publication No. 10-2004-0026456 Republic of Korea Patent Publication No. 10-2014-0125465

An object of the present invention is to provide a technology that does not cause dew condensation or freezing during a low temperature test while using a plate method.

A handler for testing an electronic component according to the present invention includes a test support part supporting a low-temperature test of an electronic component; a stacker unit supplying customer trays loaded with electronic components to be tested to the test support unit and collecting customer trays loaded with electronic components that have been tested; The test support part includes: a loader located in a supply area for supplying electronic components to a test area and having a first temperature control loading plate capable of adjusting the temperature of the loaded electronic components; A second temperature control loading plate for moving electronic components that have passed through the first temperature control loading plate to a test area or moving electronic components that have been tested from the test area to a recovery area and controlling the temperature of the loaded electronic components. Shuttle machine having; Moving the electronic component to be tested from the customer tray that has come to the supply position from the stacker part to the first temperature control loading plate, or moving the electronic component from the first temperature control loading plate to the second temperature control loading plate at least one first mover; a connector electrically connecting the electronic component moved from the supply area to the test area by the second temperature control loading plate to a tester so that the electronic component can be tested by the tester; a recovery plate located in the recovery area and recovering an electronic component that has been tested and brought from the test area to an unloading position of the recovery area by the second temperature control loading plate; at least one second mover for moving the electronic parts moved to the recovery area by the second temperature control loading plate to the recovery plate; It is provided to maintain a dry environment in the space where the first temperature control loading plate and the second temperature control loading plate exist, and a passage through which a customer tray loaded with electronic components to be tested can be moved from the stacker portion. an environment holding chamber having at least one supply hole providing; a humidity measuring sensor for measuring humidity inside the environmental maintenance chamber; a dryer for supplying dry air into the environment holding chamber; a cooler supplying a cooling fluid to cool the first temperature control loading plate and the second temperature control loading plate; and a controller controlling the supply amount of dry air by controlling the dryer according to the information measured by the humidity measuring sensor. Including, the first loading plate for temperature control and the second loading plate for temperature control can be loaded with electronic components, respectively, the temperature of the loaded electronic components is controlled through conduction, and the cooling fluid supplied by the cooler has a cooling path functioning as a moving path through which the stacker passes, and the stacker includes: a first heater for applying heat to the electronic components loaded on the first temperature control stacking plate; and a first temperature sensor for measuring the temperature of the first temperature control loading plate. The shuttle unit further includes a second heater for applying heat to the electronic components loaded on the second temperature control loading plate; And a second temperature measuring sensor for measuring the temperature of the loading plate for the second temperature control; The controller further includes, by controlling the cooler and the heater according to the information measured by the first temperature measuring sensor and the second temperature measuring sensor, the first temperature control loading plate and the second temperature control loading plate adjust the temperature of

At least one of the cooling pipes for supplying or recovering the cooling fluid cooled by the cooler to the cooling furnace is provided as a double pipe, and dry air is supplied between the inner and outer pipes of the double pipe by the dryer, The cooling fluid supplied and recovered by the cooler is moved to the inner tube of the double tube.

The environment maintenance chamber has at least one opening/closing door capable of opening and closing the inside by a worker, and the opening/closing door includes: a first door capable of opening and closing a first open area; and a second door installed on the first door to open and close a second open area narrower than the first open area. includes

The connector presses the electronic component toward the socket of the tester and includes a pusher having a fluid passage through which the cooling fluid supplied from the cooler passes; a heating element installed in the pusher to apply heat to the pusher; a temperature measurement element installed on the pusher to measure the temperature of the pusher; and cooling tubes for supplying the cooling fluid cooled by the cooler to the pusher or returning the cooling fluid discharged from the pusher to the cooler through the fluid passageway. At least one cooling tube among the cooling tubes is provided in a spiral shape to secure the mobility of the pusher, and the controller controls the cooler and the heating element by the temperature measured by the temperature measuring element to Adjust the temperature of the pusher.

The loading device may include a spacer element for fixing the first temperature control loading plate at a predetermined distance from the base surface; and provided around the first temperature control loading plate to be spaced apart from the lower end and the side end of the first temperature control loading plate so that the air around the first temperature control loading plate is loaded on the first temperature control loading plate. A shielding wall to minimize the effect on electronic components; Further, a point at which dry air is supplied by the dryer is a point spaced apart between the loading plate and the base surface.

Spray holes are formed in the shielding wall through which dry air supplied to a spaced apart point between the shielding wall and the first temperature control stacking plate can be sprayed to the periphery.

The shuttle unit includes a base plate provided to be movable by a moving source; a separation element for fixing the second temperature control mounting plate at a predetermined distance from the base plate; and provided around the second temperature control loading plate to be spaced apart from the lower end and the side end of the second temperature control loading plate so that the air around the second temperature control loading plate is loaded on the second temperature control loading plate. A shielding wall to minimize the effect on electronic components; Further, a point at which dry air is supplied by the dryer is a point spaced apart between the second temperature control loading plate and the base plate.

Spray holes through which dry air supplied to a spaced apart point between the second temperature control loading plate and the base plate may be sprayed to the surroundings are formed in the shielding wall.

an opener that opens and closes the supply hole; and the controller controls the opening/closing device to open the supply hole only when the customer tray moves through the supply hole.

The dry air supplied by the dryer is supplied to at least one of the supply area and the test area, so that a pressure difference is generated between the test area and the recovery area so that the air in the recovery area enters the test area. prevent that

The second loading plate for temperature control includes a loading portion in which an electronic component to be tested is loaded; and an unloading area in which the tested electronic components are loaded. Including, the shuttle includes a cooling element for cooling the loading portion; and a heating element for heating the loading and unloading portions. Including, the unloading portion can only be heated according to the control.

According to the present invention, there are the following effects.

First, since condensation or icing is prevented during low-temperature testing by preventing outside air from penetrating into the chamber while using the plate method, reliability of testing of electronic components can be improved and damage to equipment can be prevented.

Second, energy can be saved by improving cooling efficiency and minimizing the outflow of cold air through local cooling by the plate.

Third, since the heat that may be generated from the electronic component during the test can be quickly controlled, the reliability of the test for the electronic component is further improved.

1 is a schematic perspective view of a handler for testing an electronic component according to an embodiment of the present invention.
FIG. 2 is a conceptual plan view of a handler for testing an electronic component of FIG. 1 .
3 is a schematic excerpted perspective view of a loader applied to the handler of FIG. 1;
4 is a conceptual side view of the loader of FIG. 3;
5 is a schematic excerpt schematic diagram of a shuttle applied to the handler of FIG. 1;
6 is another example of a loader that can be applied to the handler of FIG. 1 .
7 is an excerpt of a cooling pipe applied to the shuttle of FIG. 5;
FIG. 8 is a schematic excerpted perspective view of a connector applied to the handler of FIG. 2 .
9 is a schematic cut-away perspective view of a pusher applied to the connector of FIG. 8;
Figure 10 is a schematic excerpt overview of a variant of the shuttle of Figure 5;

Preferred embodiments according to the present invention will be described with reference to the accompanying drawings, but for brevity of description, descriptions of overlapping or substantially identical configurations will be omitted or compressed as much as possible.

1 is a schematic perspective view of a handler (100, hereinafter referred to as 'handler') for testing electronic components according to an embodiment of the present invention.

As shown in FIG. 1, the handler 100 according to the present embodiment includes a test support part (TSP) capable of supporting tests on electronic components and a stacker supplying or collecting customer trays (CT) to the test support part (TSP). part (SKP). Here, the customer tray (CT) supplied from the stacker part (SKP) to the test support part (TSP) is loaded with electronic parts to be tested, and the customer tray is returned from the test support part (TSP) to the stacker part (SKP) (CT) contains electronic components that have been tested.

Continuously, with reference to FIG. 2 , which is a conceptual plan view of the handler 100 of FIG. 1 , detailed components constituting the handler 100 will be described in detail.

The test support part (TSP) includes a loading machine 110, a shuttle machine 120, a first moving machine 130, a connector 140, a recovery plate 150, a second moving machine 160, an environment maintenance chamber 170, It includes a first switch 181, a second switch 182, a humidity sensor (SS), a dryer 190, a cooler (CA), and a controller (MA).

The loader 110 is located in the supply area SA for supplying electronic components to the test area TA, and is cooled by the cooling fluid supplied by the cooler CA to directly cool the loaded electronic components by conduction. let it That is, the handler 100 according to the present embodiment has a structure in which the electronic component can be pre-cooled before being tested using the loader 110 . To this end, the loader 110 includes a first temperature control loading plate 111, a first heater 112, a first temperature sensor 113, as shown in the schematic exploded perspective view of FIG. 3 and the conceptual side view of FIG. 4, A first separation element 114 and a first shielding wall 115 are included.

The first temperature control loading plate 111 has loading grooves LS on the top surface of which electronic components can be placed and loaded. In addition, two cooling paths (CW) are formed inside the first temperature control loading plate 111, starting from both front and rear ends and ending at the middle, and bypassing the cooling path (CW), the heater groove (HS) and A sensor groove (SG) is formed. To this end, the first temperature control loading plate 111 may include an upper plate 111a and a lower plate 111b that are closely coupled to each other.

The cooling fluid supplied by the cooler (CA) flows into the cooling path (CW) through the starting points (S) at both ends of the first temperature control loading plate 111, and then flows into the first temperature control loading plate 111. It is preferable to be configured to flow out of the cooling furnace (CW) through the end point (E) to the intermediate region. The reason for configuring the cooling furnace (CW) in this way is due to confirmation through research accompanying various experiments. In an example of an experiment, the temperature of the cooling fluid at minus 70 degrees injected to the starting point (S) increases toward the ending point (E). In this case, it was confirmed that the middle portion of the first temperature control loading plate 111, where the end point E was located, did not drop to a temperature of minus 65 degrees or less because the surface exposed to the surrounding air was small. On the other hand, the both ends of the first temperature control loading plate 111 where the starting point (S) where the cooling fluid of minus 70 degrees is injected is located has many surfaces exposed to the ambient air, and it was confirmed that the temperature was -65 degrees. Of course, this example is a specific experimental example, and may have a temperature deviation of +/-1 degree.

The first heater 112 is embedded in the heater groove HS and applies heat to the electronic components loaded on the first temperature control loading plate 111 through surface contact. Specifically, the heat generated by the first heater 112 heats the first temperature control loading plate 111, and the electronic components loaded on the first temperature control loading plate 111 are heated by heat conduction. The first heater 112 may be used when performing a high-temperature test, and may be used for precise temperature control even during a low-temperature test. In addition, the first heater 112 returns the first temperature control loading plate 111 to room temperature when a jam occurs after a low-temperature test or when the handler 100 is stopped for the next operation, Can be used to prevent freezing.

The first temperature measuring sensor 113 is installed in the sensor groove SG to measure the temperature of the first temperature control mounting plate 111 . According to the temperature information measured by the first temperature sensor 113, the controller MA controls the first heater 112, the dryer 190, and the cooler CA.

The first separation element 114 is the base surface (BF, bottom surface) of the handler 100 on which the loader 110 is installed and the bottom of the first shielding wall 115 to be described below. It is provided to space it apart from the part. The reason why the first separation element 114 is provided is to minimize the escape of cold air or heat of the first temperature control loading plate 111 that is locally cooled or heated to the base surface BF by conduction. Therefore, the first spacer element 114 needs to be provided with a minimum number of materials having low thermal conductivity (a material such as resin rather than metal), and its thickness can support the first temperature control mounting plate 111 It is desirable to have a minimum in degree.

And, in the handler 100 according to the present invention, the dryer ( 190) to supply dry air. In this way, it is possible to intensively supply dry air to the area where the supply of dry air is most needed and where there is concern about dew condensation or freezing. In addition, dry air is supplied whenever necessary and functions as an insulation means.

The first shielding wall 115 is provided around the first temperature control loading plate 111 in the form of a substantially rectangular frame to be spaced apart from the side end of the first temperature control loading plate 111 . Accordingly, the first shielding wall 114 blocks the first temperature control loading plate 111 and the electronic components loaded thereon from the surrounding air to a certain extent, while forming a shielding film by dry air in the vertical direction so that the surrounding air is The influence on the first temperature control loading plate 111 and electronic components loaded thereon is minimized. To this end, it is preferable that the upper end of the first shielding wall 115 is higher than the first temperature control loading plate 111 and the electronic components loaded thereon, so that the upper end of the shielding wall 115 has a first temperature control loading plate 111. A replacement groove 115a is formed to facilitate replacement of the upper plate 111a of 111. Of course, in the shielding wall 115, in addition to the replacement groove 115a, a plurality of passage holes through which cooling pipes for supplying and recovering cooling fluid to and from the cooling path CW of the first temperature control loading plate 111 can pass ( 115b) are also formed.

In addition, dry air supplied to the first temperature control loading plate 111 and the point A of the base surface BF is supplied to the inner wall surface and the bottom surface of the first shielding wall 115, and the first temperature control loading plate 111 ) are formed with small-diameter injection holes 115c that enable injection toward the inside, which is the side. Through the first shielding wall 115, the movement of ambient humid air to the first temperature control loading plate 111 or electronic components loaded thereto is further blocked, so that condensation or freezing can be further prevented. . Preferably, the injection holes 115c and the points where the dry air is injected through the injection holes 115c are located below the uppermost surface of the first loading plate 111, so that the first mover 130 grips or grips them. It is necessary to prevent the possibility of defective transfer or separation of electronic components that are released.

In addition, the inner surface of the lateral portion of the first shielding wall 115 is spaced apart from the side end of the first temperature control loading plate 111, and the bottom surface of the first shielding wall 115 is the first temperature control loading plate 111. ), it can be seen that it is spaced apart from the lower end of This structure is to prevent the cold air or heat of the first temperature control loading plate 111 from escaping through the first shielding wall 111, and to form the above-described spray hole 115c so that the first temperature control loading plate 111 This is to provide dried air around (111).

The shuttle 120 moves electronic components that have passed through the loader 110 to the test area TA or moves electronic components whose tests have been completed from the test area TA to the recovery area RA. To this end, the shuttle 120 includes a second temperature control loading plate 121, a second heater 122, a second temperature measurement sensor 123, a second separation element 124, and a second shield, as shown in FIG. It has a wall 125, a base plate 126, special structured cooling pipes 127 and a moving source 128.

The second temperature control loading plate 121 can load electronic components, and as in Patent Publication No. 10-2014-0125465 (hereinafter referred to as 'prior art'), the loading part 121a, in the prior art, 'loading pocket' It can be divided into) and an unloading part (121b, named 'unloading pocket' in the prior art). The loading part 121a is a part where the electronic component to be tested is loaded, and the unloading part 121b is a part where the electronic part to be tested is loaded. Like the prior art, the second temperature control loading plate 121 can be moved by the moving source 128, and at this time, the loading part 121a moves between the loading position LP and the test position TP, and The loading part 121b moves between the test position TP and the unloading position UP. Of course, depending on the implementation, only one loading area is provided without distinction between the loading area (121a) and the unloading area (121b), and the moving section of the loading area is divided into the loading position (LP), the test position (TP) and the unloading area. A configuration that expands to the position UP may also be sufficiently considered. The second temperature control loading plate 121 also has a cooling passage through which cooling fluid passes, a heater groove, and a sensor groove, and their roles are the cooling passage CW of the first temperature control loading plate 111, the heater groove ( HS) and the sensor home (SG), the description thereof is omitted.

In addition, the second heater 122, the second temperature measuring sensor 123, the second separation element 124, and the second shielding wall 125 are also the first heater 112 of the mounting plate 111 for adjusting the first temperature. , The first temperature measuring sensor 113, the first separation element 114, and the first shielding wall 115 and its functions are the same, so a detailed description thereof will be omitted.

The base plate 126 is provided to be movable by a moving source 128 . In addition, the second temperature control loading plate 121 is installed to be spaced apart from the base plate 126 by the second separation element 124, so that the second temperature control loading plate 121 also moves by the operation of the moving source 128. And, the dry air is supplied to a spaced point (B) between the second temperature control loading plate 121 and the base plate 126.

For reference, it may be sufficiently considered that the loading machine 110 described above also has the first temperature control loading plate 111 movably provided as in the shuttle machine 120. Also, since the loader 110 needs to load more electronic components or rapidly cool the electronic components at normal temperature, as shown in FIG. It can be formed in a larger number than the number of cooling furnaces of the temperature control loading plate 121, and accordingly, unlike the example of FIG. It may be configured to be divided and arranged on both left and right sides of.

The cooling pipes 127 are provided to supply the cooling fluid supplied from the cooler CA to the second temperature control loading plate 121 or to recover the cooling fluid from the second temperature control loading plate 121 . As shown in FIG. 7, these cooling pipes 127 are preferably provided as double pipes having an outer pipe 127a and an inner pipe 127b inside the outer pipe 127a. Condensation or freezing may occur on the outer surface of the inner pipe 172b through which the low-temperature cooling fluid moves therein. And this is because such dew condensation or freezing can damage the inner pipe 127b that bends when the second temperature control loading plate 127 moves. Therefore, an outer pipe 127a that can protect the inner pipe 127b from being directly exposed to the outside air is provided. Here, it may be considered more preferable that the inner pipe 127b is provided as a spiral pipe like the cooling tube of the coupler 140 to be described later. In addition, it may be considered preferable that dry air coming from the dryer 190 is supplied to the space S between the inner pipe 127b and the outer pipe 127a. Due to these structures, damage to the cooling pipe 122 caused by frequent movement of the second temperature control loading plate 121 can be minimized. Of course, if the first temperature control loading plate 111 of the loading machine 110 is also movably provided, it is preferable that the cooling pipe provided in the loading machine 110 is also provided as a double pipe.

The first mover 130 moves the electronic component to be tested from the customer tray CT, which has come from the stacker part SKP to the supply position SP, to the first temperature control loading plate 111, or The electronic component is moved from the loading plate 111 for adjustment to the loading portion 121a of the second temperature control loading plate 121 . Of course, according to the implementation, the function of moving electronic components from the customer tray (CT) to the first temperature control loading plate 111 and from the first temperature control loading plate 111 to the second temperature control loading plate 121 A plurality of first movers 130 may be provided to each take charge of a function of moving.

The connector 140 adsorbs and holds the electronic component of the loading part 121a at the test position TP with vacuum pressure, and then electrically connects the electronic component to the test socket TS of the tester, and the test completed electronic component The parts are moved to the unloading part 121b. Here, the electrical connection between the electronic component and the test socket TS is made by pressing the electronic component with the test socket TS. To this end, the connector 140 includes a head 141, eight pushers 142, a heating element HD, a first temperature measuring element TD ₁ , and a second It includes a degree measuring device (TD ₂ ), cooling tubes 143, a vertical mover 144 and a horizontal mover 145.

The head 141 is provided to be able to move up and down by the vertical mover 143 . This head 141 has a passage structure or valve structure for providing vacuum pressure to the eight pushers 142 . Of course, vacuum pressure may be provided to the pusher 142 using a separate tube structure or the like.

Each of the eight pushers 142 is provided to press the electronic component. Thus, eight electronic components are electrically connected to the tester at once. Naturally, the number of pushers 412 may vary depending on the embodiment of the equipment. The pusher 142 has a 'T' shape in cross section and is divided into an upper coupling portion 142a and a lower contact portion 142b.

The coupling portion 142a is coupled to the head 141. A guide hole GH into which a guide pin (not shown) for precisely guiding the position of the pusher 142 is inserted is formed in the coupling portion 142a.

The contact portion 142b is narrower than the coupling portion 142a, and the contact end CE, which is the lower surface thereof, is in contact with the electronic component to pressurize the electronic component, and to the vacuum pressure coming from the vacuum furnace VW. It also grips electronic components by

The vacuum furnace (VW) is formed for the purpose of applying a vacuum pressure to the electronic component in order to adsorb and hold the electronic component. Here, the vacuum pressure may be supplied from the outside, or the handler 100 may be provided with a regulator that generates the vacuum pressure and supplied from the regulator.

Further, a fluid passage TW through which the cooling fluid supplied by the cooler CA passes is formed in the pusher 212 .

The fluid passage (TW) is formed so that the cooling fluid entering through the inlet (IH) in the coupling portion (142a) moves to the contact portion (142b) and then exits through the outlet (OH) in the coupling portion (142a). has been Therefore, the cooling fluid coming from the cooler CA to the pusher 142 passes through the fluid passage TW and exits the pusher 142.

The heating element HD is provided to heat the electronic component ultimately pressed by the pusher 142 by heating the pusher 142 . Like the first heater 112 and the second heater 122, the heating element HD may be used for high-temperature testing, heating for fine temperature control, heating for turning cooled electronic components to room temperature, and the like.

The first temperature measuring device TD ₁ is provided to measure the temperature of the pusher 142, and the second temperature measuring device TD ₂ is provided to directly measure the temperature of the electronic component. Therefore, it is preferable that the second temperature measuring device TD ₂ is provided on the contact end CE side of the contact portion 142b so as to come into contact with the electronic component.

As can be seen in the drawing, the heating element HD, the first temperature measuring element TD ₁ , and the second temperature measuring element TD ₂ are installed on the pusher 142 .

The cooling tube 143 supplies the cooling fluid cooled by the cooler CA to the pushers 142 or passes through the fluid passage TW to pass the cooling fluid from the pushers 142 to the cooler CA. set up for recovery. The cooling tube 143 is preferably provided in a spiral shape to have flexible bending due to elastic deformability and restorability in order to secure the mobility of the pusher 142 moving in the horizontal and vertical directions according to their installation position.

The vertical mover 144 raises and lowers the head 141 (see arrow a). Accordingly, the head 141 in which the pusher 142 is installed can descend or ascend, and when descending, the pusher 142 becomes a position to hold the electronic component or press the electronic component to the test socket TS side. becomes

The horizontal mover 145 moves the head 141 in the horizontal direction (see arrow b).

That is, the head 141 in which the pusher 142 is installed by the operation of the vertical mover 144 and the horizontal mover 145 grips the electronic component from the loading portion 121a of the second temperature control loading plate 121 and then The gripped electronic component may be electrically connected to the test socket TS, and the electronic component on which the test has been completed may be moved to the unloading portion 121b of the second temperature control loading plate 121 .

The recovery plate 150 is located in the recovery area RA for recovering the tested electronic parts, and is an unloading position of the recovery area RA in the test area TA by the second temperature control loading plate 121. (UP) is provided to recover electronic components that have been tested on. Therefore, the recovery plate 150 is also configured to have a structure capable of loading electronic components, and the customer tray CT may simply replace the role of the recovery plate 150 . If the customer plate (CT) replaces the role of the recovery plate 150, it may be implemented so that it can be moved to the recovery position (RP) by a separate mover like the above second temperature control loading plate 121. .

The second mover 160 moves the electronic components of the unloading area 121b from the test area TA to the unloading position UP of the recovery area RA by the movement of the second temperature control loading plate 121. It is moved to the collection plate 150, or the electronic components in the collection plate 150 are moved to the front empty customer tray CT located in the collection position RP. Of course, if the recovery plate 150 is implemented as a customer plate CT and has a structure in which the customer tray CT can be moved to the front recovery position RP by a separate mover, the second mover 160 suffices to have only a function of moving the electronic component from the second temperature control loading plate 121 to the recovery plate 150.

The environment holding chamber 170 has a corresponding configuration in order to maintain a dry environment in the space where the first temperature control loading plate 111, the second temperature control loading plate 121, the pusher 142, and the test socket TS exist. isolate them from the outside air. In this embodiment, at least the head 141 of the first temperature control loading plate 111, the second temperature control loading plate 121, the first mover 130, and the connector 140 is installed inside the environment holding chamber 170. And the pushers 142, the recovery plate 150, the second mover 160, and the test socket TS are accommodated. However, the environmental holding chamber 170 in the present invention is not provided to cool the space therein, but has a great difference from conventional technologies in that it is provided to provide a dry environment therein. This environment holding chamber 170 has an opening and closing door 171, a supply hole (SH) and a recovery hole (RH).

The opening and closing door 171 is provided to open and close the inside of the environment maintenance chamber 170 by a worker, and is provided as a double door.

The first door 171a may open and close a wide first open area.

The second door 171b is installed near the center of the first door 171a and can open and close a second open area narrower than the first open area.

That is, when manual work is required inside the environment holding chamber 170 due to jams, etc., the operator selectively opens the first door 171a according to the level of the manual work, or inserts only the operator's arm. Two doors (171b) can be opened. At this time, when only the second door 171b is opened, it is necessary for the operator to visually check the inside of the environment holding chamber 170, so there is no separation between the frame of the first door 171a and the second door 171b. It is necessary to be composed of a transparent panel such as In addition, even when the second door 171b is opened, a separate air curtain capable of forming an air film is configured to minimize the loss of cold air in the environment holding chamber 170, or the arms can enter but the outflow of cold air It may also be considered to densely block with thin threads like a brush or to configure other blocking members to maximize blocking.

For reference, it is preferable that the opening and closing door 171 is provided in a required number at a required location.

The supply hole SH provides a passage through which the customer tray CT in the stacker part SKP can be moved to the supply position SP.

The recovery hole RH provides a passage through which the customer tray CT in the recovery position RP can be moved to the stacker part SKP.

Naturally, an appropriate number of supply holes SH or recovery holes RH may be formed according to the capacity of the handler 100 or the shape of other implementation structures.

For reference, although the environment maintenance chamber 170 is provided, a test chamber TC for providing a separate test chamber in the test area TA may be further provided as in the present embodiment. Also, it may be desirable to separate the supply area SA and the recovery area RA by a separate blocking film.

The first opener 181 opens and closes the supply hole SH.

The second opener 182 opens and closes the recovery hole RH.

Similarly, in addition to the first switch 181 and the second switch 182, a means for forming a separate air curtain may be further provided when the supply hole SH and the return hole RH are opened.

Of course, the above first switch 181 and the second switch 182 are provided in numbers corresponding to the number of supply holes SH and return holes RH.

The humidity measuring sensor SS measures the humidity inside the environment holding chamber 170, especially the humidity of the supply area SA and the test area TA, where the occurrence of dew condensation or freezing is required to be precisely controlled. set up to measure In particular, since the humidity of the space where the first temperature control loading plate 111 and the second temperature control loading plate 121 exist is important, the humidity measurement sensor SS is used to measure the first temperature control loading plate 111 and the second temperature control It is preferable to be provided near the loading plate 121 for adjustment. Here, it may be considered preferable that the humidity measurement sensor SS installed on the second temperature control loading plate 121 is movably installed together with the second temperature control loading plate 121 .

The dryer 190 is provided to supply dry air into the environment maintenance chamber 170 . The dryer 190 may be configured in the form of a moving circuit that moves dry air coming from an external supply to the inside of the environment maintenance chamber 170, and as in the present embodiment, the handler 100 itself supplies dry air. may be configured to generate Here, supply points of the dry air supplied into the environment holding chamber 170 by the dryer 190 are preferably located in the supply area SA and the test area TA. As described above, in the present invention, the dry air supplied by the dryer 190 is supplied through the loader 110 in the supply area SA and the shuttle 120 at least partially located in the test area TA. It can be seen that this was done. In addition, the handler 100 according to the present invention supplies dry air to a fixed point C of the test area TA, which is most sensitive to test conditions, through a separate injection nozzle, and for its efficiency, a separate test A chamber (TC) was configured. Therefore, since the test area TA has a higher pressure than the adjacent recovery area RA, the air pressure difference between the two areas can prevent humid air from the recovery area RA from entering the test area TA as much as possible. .

Let's take a closer look at the point that the dryer 190 as above should be provided. In general, condensation occurs when the atmospheric temperature decreases and the amount of saturated water vapor in the atmosphere decreases. In particular, condensation generated in sub-zero temperature conditions freezes and causes freezing. However, in the case of a handler capable of low-temperature testing, since the electronic parts must be rapidly cooled to a cryogenic temperature of minus 10 degrees or less, the temperature of other instruments is also maintained at a very low state. In this state, the temperature of the atmosphere near the instruments is also lowered, so that the amount of saturated water vapor becomes very low. For example, the amount of saturated water vapor in the air at room temperature is 22.830 g/m ³ , but the amount of saturated water vapor in the atmosphere at minus 10 degrees is 2.156 g/m ³ . Therefore, condensation and freezing of water vapor may occur on the surface of electronic components or instruments, and thus the operation of the equipment may become impossible or serious damage may be caused to the equipment. This led to the present invention through continued experiments and research.

The cooler CA supplies cooling fluid to the first temperature control loading plate 111 , the second temperature control loading plate 121 and the pusher 142 . Similarly, the cooling module of the cooler CA may be provided in the handler 100 itself or may be separately provided in the system of the factory depending on implementation. If the cooling module is provided separately from the handler 100, the concept of the cooler CA provided in the handler 100 can be interpreted as a cooling circuit that moves cooling fluid from an external cooling module to a required location.

The controller MA controls components requiring control among the above configurations. In particular, the controller MA adjusts the supply of dry air by controlling the dryer 190 according to the humidity information measured by the humidity measurement sensor SS, and minimizes the loss of cold air inside the environment maintenance chamber 170. The first switch 181 and the second switch 182 are set so that the supply hole SH or the return hole RH is opened only when the customer tray CT moves through the supply hole SH or the return hole RH. Control. In addition, the controller MA determines the cooling degree or temperature of the first temperature control loading plate 111, the loading portion 121a of the second temperature control loading plate 121, the pusher 142, and the temperature information of the electronic components. Adjust the degree of heating.

On the other hand, the stacker part (SKP) is a supply stacker (PS) for supplying customer trays (CT) to the supply position (SP) and a collection stacker for recovering customer trays (CT) coming from the recovery position (RP) (RS).

Subsequently, the handler 100 having the above structure will be described.

Customer trays (CT) in the supply stacker (PS) are sequentially supplied to the supply position (SP) one by one. At this time, while the customer tray CT is moving, the first opener 181 opens the supply hole SH, and when the customer tray CT enters the environment holding chamber 170, the supply hole SH ) is closed.

The first mover 130 moves the electronic components from the customer tray CT at the supply position SP to the first temperature control loading plate 111 . As a result, the electronic components loaded on the first temperature control loading plate 111 are cooled by contact with the first temperature control loading plate 111 in a cooled state by the cooler CA.

When the electronic component is loaded on the first temperature control loading plate 111, the first mover 130 moves from the first temperature control loading plate 111 to the second temperature control loading plate 121 at the loading position LP. Pre-cooled electronic components are moved to the loading part 121a. When the electronic component is loaded on the loading part 121a, the second temperature control loading plate 121 is moved to the right by the moving source 123, and the loading part 121a of the second temperature control loading plate 121 is moved to the test position ( TP) to be placed. Then, the coupler 140 is operated and the electronic component is gripped from the loading part 121a by vacuum pressure using the pusher 142, and then the pusher 142 is moved by the operation of the vertical mover 144 and the horizontal mover 145. Electrically connect the electronic component gripped to the test socket (TS). Of course, since the loading portion 121a and the pusher 142 are cooled to a temperature suitable for the test condition by the cooler CA, the electronic component does not deviate from the temperature suitable for the test condition during the moving process. In addition, heat may be generated in the electronic component during the test process, but the controller MA controls the cooler CA to maintain the electronic component in a required temperature condition.

When the test on the electronic component is finished, the connector 140 moves the electronic component to the unloading part 121b of the second temperature control loading plate 121 at the test position TP. At this time, since the loading portion 121a of the second temperature control loading plate 121b is at the loading position LP, electronic components to be tested next are loaded on the loading portion 121a. When the electronic component for which the test has been completed is loaded onto the unloading part 121b, the second temperature control loading plate 121 moves to the right and the unloading part 121b moves to the unloading position UP. 2 The mover 160 moves the electronic component from the unloading part 121b to the recovery plate 150. Then, the electronic parts on the collection plate 150 are moved to the customer tray CT in the front collection position RP by the second mover 160 . At this time, the electronic components whose tests have been completed may be classified and moved according to grades according to the test results. Subsequently, when the customer tray (CT) in the recovery position (RP) is filled with electronic parts, the second switch 182 operates to open the recovery hole (RH), and the customer tray (CT) is stacked at the recovery position (RP). moved to the cursor (RS).

On the other hand, while the above-described movement and testing of the electronic parts are continuously performed, the humidity measurement sensor (SS) is located inside the environment maintenance chamber 170 (more specifically, near the first temperature control loading plate in the supply area) while the test is in progress. and near the second temperature control loading plate in the test area) are continuously measured at regular time intervals, and the controller MA controls the amount of dry air based on the information and supplies the dry air to the points described above. . Of course, the inside of the environment maintenance chamber 170 can maintain a required dryness level by supplying dry air.

Moreover, the inside of the environment maintenance chamber 170, to which dry air is continuously supplied by the dryer 190, has a constant high pressure compared to the outside. As a result, the air inside the environment holding chamber 170 is discharged to the supply hole (SH) or recovery hole (RH) or other parts where sealing is not achieved, which functions to block external air from entering the inside .

In addition, since most of the dry air is injected into the supply area SA and the test area TA, the supply area SA and test area TA, where the dryness needs to be precisely adjusted, are higher than the recovery area RA. more high pressure Therefore, when the supply area SA and the recovery area RA are blocked from each other by the barrier film, air is recovered by the air pressure difference in the supply area SA and the test area TA, which does not require much precision in drying. Since it mainly moves to the area RA, the air in the recovery area RA is prevented from affecting the air in the supply area SA, and this also allows the dryness of the supply area SA to be precisely controlled. become a factor

In addition, the dryer 190 prevents damage to the aforementioned cooling pipe 122 by supplying dry air between the outer pipe 122a and the inner pipe 122b of the cooling pipe 122 provided as a double pipe.

<Example of modification>

In the previous embodiment, the second temperature control loading plate 121 configured in the shuttle 120 is divided into a loading part 121a and an unloading part 121b, and the second heater 122 as a heating element and a cooling element Both the loading part 121a and the unloading part 121b are heated or cooled by the cooling pipe 127.

However, as shown in FIG. 10, the shuttle 120 may be provided to be deformed.

Referring to FIG. 10, the second heater 122 is installed to heat both the loading portion 121a and the unloading portion 121b, but the cooling pipe 127 is installed to cool only the loading portion 121a. . Accordingly, the loading portion 121a may be heated or cooled by the second heater 122 and the cooling pipe 127, but the unloading portion 121b may only be heated by the second heater 122. Hereinafter, the reason for implementing this modified example will be described.

In general, types of tests for electronic components include high-temperature tests, room-temperature tests, and low-temperature tests.

In a high-temperature test, the test must be performed while maintaining the electronic component at a high temperature, and in the case of a low-temperature test, the test must be performed in a state in which the electronic component is maintained at a low temperature. In the room temperature test, the test is performed while the electronic component is maintained at room temperature. Therefore, the second heater 122 and the cooling pipe 127 are used only in high-temperature tests or low-temperature tests except for special circumstances.

In most cases, an unloading operation is performed by a picker for electronic components that have been tested. At this time, it is necessary to cool the high-temperature electronic parts and heat the low-temperature electronic parts in order to perform an appropriate unloading operation that does not cause damage to the picker or the electronic parts.

First, for a low-temperature test, the loading part 121a must be cooled, and for precise temperature control, the loading part 121a must be heated by the second heater 122 . In addition, the unloading portion 121b must be heated by the second heater 122 to increase the temperature of the loaded electronic component.

If the electronic components loaded in the unloading part 121b are not heated close to room temperature, frost may occur, which may interfere with the picking operation of the picker according to the operation of the second mover 160 or may cause picking marks. problems may arise.

Therefore, in the low-temperature test, both cooling and heating are required for the loading portion 121a, but only heating is required for the unloading portion 121b.

Meanwhile, for high-temperature testing, the loading part 121a must be heated, and often needs to be cooled for precise temperature control. However, depending on the equipment, the high temperature may be implemented at a relatively low temperature (100 degrees +/- 50 degrees), and in this case, there is no need to cool the electronic parts for the unloading operation.

Therefore, in the high-temperature test, both heating and cooling of the loading part 121a are required, but cooling of the unloading part 121b is not required depending on the equipment.

That is, even when the equipment is implemented to perform both a low-temperature test and a high-temperature test, both cooling and heating are required for the loading part 121a. However, depending on the equipment, since the unloading part 121b requires heating only during the cooling test and does not need to be cooled, a separate cooling element for cooling the unloading part 121b may not be provided. In this case, the unloading portion 121b can only be heated by control according to the test mode.

Although the handler according to the above embodiment has a concise configuration for clarity of description, the loader 110, the shuttle 120, the first mover 130, the recovery plate 150, and the second mover according to the processing capacity. 160, a supply hole (SH) and a recovery hole (RH), etc. may be provided in plurality.

In addition, in the above embodiment, the loading part 121a and the unloading part 121b are arranged in separate areas on one second temperature control loading plate 121, and are designed to be moved together. may be implemented so that the loading part 121a and the unloading part 121b are disposed on separate plates and can be moved independently by a separate moving source. That is, the second temperature control loading plate is two, one second temperature control loading plate has a loading portion 121a, and the other second temperature control loading plate has an unloading portion 121b. .

That is, since the above embodiment is only the most basic example of the present invention, it should not be understood that the present invention is limited only to the above embodiment, and the scope of the present invention is to the following claims and their equivalents. will have to be understood

100: Handler for testing electronic components
TSP: test support part SKP: stacker part
110: loader
111: first temperature control loading plate
112: first heater 113: first temperature sensor
114: first separation element
115: shielding wall
115c: injection hole
120: shuttle machine
121: loading plate for second temperature control
122: second heater 123: second temperature sensor
124: second separation element 125: shielding wall
126: base plate
127: cooling pipe
127a: outer piping 127b: outer piping
130: first mover
140: connector
142: pusher
TW: fluid passage
143: cooling tube
HD : Heating element
TD ₁ : first temperature measuring element TD ₂ : second temperature measuring element
150: recovery plate
160: second mover
170: environmental maintenance chamber
171: opening and closing door
171a: first door 171b: second door
SH: supply hole
SS: Humidity sensor
181: first switch 190: dryer
CA: Chiller MA: Controller
SP: supply location

Claims (12)

A test support part that supports low-temperature testing of electronic components;
a stacker unit supplying customer trays loaded with electronic components to be tested to the test support unit and collecting customer trays loaded with electronic components that have been tested; including,
The test support part,
a loader located in a supply area for supplying electronic components to a test area and having a first temperature control loading plate capable of adjusting the temperature of the loaded electronic components;
A second temperature control loading plate for moving electronic components that have passed through the first temperature control loading plate to a test area or moving electronic components that have been tested from the test area to a recovery area and controlling the temperature of the loaded electronic components. Shuttle machine having;
Moving the electronic component to be tested from the customer tray that has come to the supply position from the stacker part to the first temperature control loading plate, or moving the electronic component from the first temperature control loading plate to the second temperature control loading plate at least one first mover;
a connector electrically connecting the electronic component moved from the supply area to the test area by the second temperature control loading plate to a tester so that the electronic component can be tested by the tester;
a recovery plate located in the recovery area and recovering an electronic component that has been tested and brought from the test area to an unloading position of the recovery area by the second temperature control loading plate;
at least one second mover for moving the electronic parts moved to the recovery area by the second temperature control loading plate to the recovery plate;
It is provided to maintain a dry environment in the space where the first temperature control loading plate and the second temperature control loading plate exist, and a passage through which a customer tray loaded with electronic components to be tested can be moved from the stacker portion. an environment holding chamber having at least one supply hole providing;
a cooler supplying a cooling fluid to cool the first temperature control loading plate and the second temperature control loading plate; and
a controller controlling the cooler; including,
The first loading plate for temperature control and the second loading plate for temperature control can be loaded with electronic components, the temperature of the loaded electronic components is controlled through conduction, and the cooling fluid supplied by the cooler passes. It has a cooling furnace that functions as
The shuttle,
a second heater for applying heat to the electronic components loaded on the second temperature control loading plate; and
a second temperature measuring sensor for measuring the temperature of the loading plate for the second temperature control; Including more,
The controller controls the temperature of the second temperature control loading plate by controlling the cooler and the second heater according to the information measured by the second temperature sensor.
Handler for testing electronic components. A test support part that supports low-temperature testing of electronic components;
a stacker unit supplying customer trays loaded with electronic components to be tested to the test support unit and collecting customer trays loaded with electronic components that have been tested; including,
The test support part,
a loader located in a supply area for supplying electronic components to a test area and having a first temperature control loading plate capable of adjusting the temperature of the loaded electronic components;
A second temperature control loading plate for moving electronic components that have passed through the first temperature control loading plate to a test area or moving electronic components that have been tested from the test area to a recovery area and controlling the temperature of the loaded electronic components. Shuttle machine having;
Moving the electronic component to be tested from the customer tray that has come to the supply position from the stacker part to the first temperature control loading plate, or moving the electronic component from the first temperature control loading plate to the second temperature control loading plate at least one first mover;
a connector electrically connecting the electronic component moved from the supply area to the test area by the second temperature control loading plate to a tester so that the electronic component can be tested by the tester;
a recovery plate located in the recovery area and recovering an electronic component that has been tested and brought from the test area to an unloading position of the recovery area by the second temperature control loading plate;
at least one second mover for moving the electronic parts moved to the recovery area by the second temperature control loading plate to the recovery plate;
It is provided to maintain a dry environment in the space where the first temperature control loading plate and the second temperature control loading plate exist, and a passage through which a customer tray loaded with electronic components to be tested can be moved from the stacker portion. an environment holding chamber having at least one supply hole providing;
a cooler supplying a cooling fluid to cool the first temperature control loading plate and the second temperature control loading plate; and
a controller controlling the cooler; including,
The first loading plate for temperature control and the second loading plate for temperature control can be loaded with electronic components, the temperature of the loaded electronic components is controlled through conduction, and the cooling fluid supplied by the cooler passes. It has a cooling furnace that functions as
The second temperature control loading plate,
a loading area in which electronic parts to be tested are loaded; and
an unloading area in which electronic components that have been tested are loaded; including,
The shuttle,
a cooling element for cooling the loading portion;
a heating element for heating the loading and unloading portions; and
a second temperature measuring sensor for measuring the temperature of the loading plate for the second temperature control; Including more,
The controller adjusts the temperature of the second temperature control loading plate by controlling the cooler and the heating element according to the information measured by the second temperature sensor, but the unloading portion can only be heated.
Handler for testing electronic components. According to claim 1,
The loader,
a separation element for fixing the first temperature control mounting plate at a predetermined distance from the base surface; and
Electrons provided around the first temperature control loading plate and spaced apart from the lower and side ends of the first temperature control loading plate so that the air around the first temperature control loading plate is loaded on the first temperature control loading plate A shielding wall to minimize the effect on parts; Including more,
Dry air is supplied to the environment holding chamber, and a point at which the dry air is supplied is a point spaced apart between the first temperature control loading plate and the base surface.
Handler for testing electronic components. According to claim 3,
The shielding wall is formed with spray holes through which dry air supplied to a spaced apart point between the shielding wall and the first temperature control loading plate can be sprayed to the surroundings.
Handler for testing electronic components. A test support part that supports low-temperature testing of electronic components;
a stacker unit supplying customer trays loaded with electronic components to be tested to the test support unit and collecting customer trays loaded with electronic components that have been tested; including,
The test support part,
a loader located in a supply area for supplying electronic components to a test area and having a first temperature control loading plate capable of adjusting the temperature of the loaded electronic components;
A second temperature control loading plate for moving electronic components that have passed through the first temperature control loading plate to a test area or moving electronic components that have been tested from the test area to a recovery area and controlling the temperature of the loaded electronic components. Shuttle machine having;
Moving the electronic component to be tested from the customer tray that has come to the supply position from the stacker part to the first temperature control loading plate, or moving the electronic component from the first temperature control loading plate to the second temperature control loading plate at least one first mover;
a connector electrically connecting the electronic component moved from the supply area to the test area by the second temperature control loading plate to a tester so that the electronic component can be tested by the tester;
a recovery plate located in the recovery area and recovering an electronic component that has been tested and brought from the test area to an unloading position of the recovery area by the second temperature control loading plate;
at least one second mover for moving the electronic parts moved to the recovery area by the second temperature control loading plate to the recovery plate;
It is provided to maintain a dry environment in the space where the first temperature control loading plate and the second temperature control loading plate exist, and a passage through which a customer tray loaded with electronic components to be tested can be moved from the stacker portion. an environment holding chamber having at least one supply hole providing;
a cooler supplying a cooling fluid to cool the first temperature control loading plate and the second temperature control loading plate; and
a controller controlling the cooler; including,
The first loading plate for temperature control and the second loading plate for temperature control can be loaded with electronic components, the temperature of the loaded electronic components is controlled through conduction, and the cooling fluid supplied by the cooler passes. It has a cooling furnace that functions as
The shuttle,
a second heater for applying heat to the electronic components loaded on the second temperature control loading plate;
a second temperature measuring sensor for measuring the temperature of the loading plate for the second temperature control;
A base plate movably provided by a moving source;
a separation element for fixing the second temperature control mounting plate at a predetermined distance from the base plate; and
Electrons provided around the second temperature control loading plate to be spaced apart from the lower and side ends of the second temperature control loading plate so that the air around the second temperature control loading plate is loaded on the second temperature control loading plate A shielding wall to minimize the effect on parts; Including more,
Dry air is supplied to the environment holding chamber, and a point at which the dry air is supplied is a point spaced apart between the second temperature control loading plate and the base plate,
The controller controls the temperature of the second temperature control loading plate by controlling the cooler and the second heater according to the information measured by the second temperature sensor.
Handler for testing electronic components. According to claim 5,
Spray holes are formed in the shield wall through which dry air supplied to a spaced apart point between the second temperature control loading plate and the base plate can be sprayed to the surroundings.
Handler for testing electronic components. The method of any one of claims 1, 2 and 5,
an opener that opens and closes the supply hole; Including more,
The controller controls the switch so that the supply hole is opened only when the customer tray moves through the supply hole.
Handler for testing electronic components. The method of any one of claims 1, 2 and 5,
Dry air is supplied to the environment maintenance chamber, and the supplied dry air is supplied to at least one of the supply area and the test area, so that a difference in air pressure is generated between the test area and the recovery area, thereby generating air in the recovery area. Preventing from entering the test area
Handler for testing electronic components. The method of any one of claims 1, 2 and 5,
The loader,
a first heater for applying heat to the electronic components loaded on the first temperature control loading plate; and
a first temperature measuring sensor for measuring the temperature of the first temperature control loading plate; Including more,
The controller controls the temperature of the first temperature control loading plate by controlling the cooler and the first heater according to the information measured by the first temperature sensor.
Handler for testing electronic components. According to any one of claims 1, 2 and 3,
At least one of the cooling pipes for supplying or recovering the cooling fluid cooled by the cooler to the cooling path is provided as a double pipe,
Dry air is supplied between the inner tube and the outer tube of the double tube, and the cooling fluid supplied and recovered by the cooler is moved to the inner tube of the double tube.
Handler for testing electronic components. According to any one of claims 1, 2 and 3,
The environment holding chamber has at least one opening and closing door capable of opening and closing the inside by a worker,
The opening door,
a first door capable of opening and closing the first open area; and
a second door installed on the first door to open and close a second open area narrower than the first open area; containing
Handler for testing electronic components. According to any one of claims 1, 2 and 3,
The connector presses the electronic component toward the socket of the tester and includes a pusher having a fluid passage through which the cooling fluid supplied from the cooler passes;
a heating element installed in the pusher to apply heat to the pusher;
a temperature measurement element installed on the pusher to measure the temperature of the pusher; and
cooling tubes for supplying the cooling fluid cooled by the cooler to the pusher or for returning the cooling fluid discharged from the pusher to the cooler through the fluid passageway; Including,
At least one of the cooling tubes is provided in a spiral shape to secure the mobility of the pusher,
The controller controls the temperature of the pusher by controlling the cooler and the heating element according to the temperature measured by the temperature measuring element.
Handler for testing electronic components.

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