JP2022069823A - Device conveyor and method for returning from jam - Google Patents

Abstract

To provide a device conveyor having small consumption of dry air.SOLUTION: An electronic component conveyor 2 includes a first window 49a to a seventh window 56a and a first blow-out port 125 to a sixth blow-out port 120 of dry air 104, a memory 43 that stores a plurality of returning modes having different combinations between a blow-out amount of the dry air 104 and the blow-out port that blows out the dry air 104, and a control unit 4 that selects one of the returning modes executed after the window is closed from the plurality of returning modes of the memory 43 on the basis of the number of the opened windows and a time when the window is opened on the occurrence of a jam. The control unit 4 further adjusts the temperature and humidity specified in the selected returning mode.SELECTED DRAWING: Figure 8

Description

The present invention relates to a device transfer device and a method for recovering from jam.

In the electrical characteristic inspection of electronic parts such as ICs (Integrated Circuits) and semiconductor devices, there is a device transfer device that classifies and stores electronic parts according to the inspection results of non-defective products and defective products.

One of the inspection items of IC is inspection performed at a temperature lower than the freezing point. A transfer error of the transfer device may occur during the handling of the IC. A transfer error in a transfer device is called a jam. When a jam occurs, the user opens the window and repositions the IC in place. At this time, high-humidity air enters the device through the window, so that frost is generated inside the device.

When the user determines that frost has formed in the device, the user operates the defrost instruction button. Dry air is supplied into the device to defrost. The user visually confirmed the frost condition and resumed the IC inspection work. The user supplies a large amount of dry air into the device to ensure that frost is removed. Therefore, there is a problem that the consumption of dry air is large.

The device transfer device is a device transfer device provided with a plurality of covers and dry air injection ports, and is a storage unit that stores a plurality of return modes in which the combination of the dry air ejection amount and the injection port for ejecting the dry air is different. A plurality of the return modes of the storage unit, which is executed after the cover is closed, based on the number of the covers opened and the opening time when a jam occurs. It has a control unit for selecting from the modes, and the control unit further adjusts the temperature and humidity specified for the selected return mode.

The recovery processing method from jam is a recovery processing method from jam executed by the control unit of the device transport device, and the cover corresponding to the location where the jam of the device to be inspected occurs is specified and the jam occurs. The cover is unlocked corresponding to the location where the cover is opened, the number of the covers opened by the user is recognized, the time when the cover is opened is measured, and the cover is opened based on the number of the covers and the time when the cover is opened. Select one of the plurality of return modes to be executed after closing, and automatically execute the selected return mode.

The schematic perspective view which looked at the electronic component inspection apparatus which concerns on 1st Embodiment from the front side. The schematic plan view which shows the operating state of an electronic component inspection apparatus. The schematic plan view for demonstrating the arrangement of an opening / closing part. Schematic side sectional view showing the structure of an air curtain device and an opening / closing part. Schematic side sectional view showing the structure of the soak plate. A piping diagram showing the flow path structure of dry air. A piping diagram for explaining the flow path during operation. Electrical block diagram of electronic component inspection equipment. Flowchart of recovery processing method from jam. The figure for demonstrating the correspondence between the jam occurrence place and the candidate of the window part to open. The figure for demonstrating the selection method of the return mode. A piping diagram for explaining the flow path of the minimum mode and the jam recovery mode. A piping diagram for explaining the flow path of the rapid return mode.

First Embodiment As shown in FIG. 1, three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is in the vertical direction. Further, the direction parallel to the X axis is defined as the X direction. The direction parallel to the Y axis is defined as the Y direction. The direction parallel to the Z axis is defined as the Z direction. The direction in which the arrows in each direction point is "positive", and the opposite direction is "negative".

The term "horizontal" is not limited to perfect horizontal, and includes a state of being slightly tilted with respect to horizontal as long as the transportation of electronic components is not hindered. The term "vertical" is not limited to perfect verticality, and includes a state of being slightly tilted with respect to verticality as long as the transportation of electronic components is not hindered. The tilt angle in the slightly tilted state is less than 5 °.

The upper side in FIG. 1, that is, the positive side in the Z direction may be referred to as "up" or "upper", and the lower side, that is, the negative side in the Z direction may be referred to as "down" or "downward". The negative side in the Y direction may be referred to as the "front side", and the positive side in the Y direction may be referred to as the "back side".

The electronic component inspection device 1 including the electronic component transfer device 2 as a device transfer device is a device for inspecting and testing the electrical characteristics of electronic components such as an IC (Integrated Circuit) device which is a BGA (Ball Grid Array) package. .. The inspection of electrical characteristics is called the electrical special inspection. As shown in FIG. 1, the electronic component inspection device 1 includes an electronic component transfer device 2 inside. The electronic component transport device 2 is a device that transports electronic components.

The electronic component transfer device 2 is covered with an exterior 3. The electronic component inspection device 1 includes a control unit 4 on the negative side in the Y direction and the negative side in the X direction. The control unit 4 controls the operation of the electronic component inspection device 1. A speaker 5 is arranged near the control unit 4. The electronic component inspection device 1 has a monitor 6, an operation panel 7, and a mouse base 8 arranged on the negative side in the Y direction and the positive side in the X direction. Various information is displayed on the display screen 6a of the monitor 6. The monitor 6 has a display screen 6a composed of, for example, a liquid crystal screen, and is arranged in the upper part on the front side of the electronic component inspection device 1. A mouse table 8 on which a mouse is placed is provided on the positive side of the tray removal area 12 in the X direction. The user operates the mouse on the mouse table 8 and the operation panel 7, sets the operating conditions and the like of the electronic component inspection device 1, and inputs the instruction contents. The operation panel 7 is an interface for instructing the electronic component inspection device 1 to perform a desired operation.

The electronic component inspection device 1 includes a signal lamp 9 on the negative side in the Y direction and the negative side in the X direction. The signal lamp 9 and the speaker 5 notify the operating state and the like of the electronic component inspection device 1. The signal lamp 9 notifies the operating state and the like of the electronic component inspection device 1 by the combination of the colors emitted. The signal lamp 9 is arranged on the upper part of the electronic component inspection device 1.

The electronic component inspection device 1 is provided with a tray supply area 11 and a tray removal area 12 on the negative side in the Y direction. The user supplies the tray in which the electronic components are arranged to the tray supply area 11. The electronic component inspection device 1 takes in the tray from the tray supply area 11 and performs an electric special inspection. The electronic component inspection device 1 discharges the tray in which the electronic components for which the electrical inspection has been completed are arranged to the tray removal area 12.

The electronic component inspection device 1 includes a refrigerator 10 on the positive side in the X direction. The refrigerator 10 supplies a refrigerant that cools the inside of the exterior 3. The refrigerant is cold dry air. Dry air is dry air. The refrigerator 10 is arranged near the exterior 3. A dry purge 20 is arranged on the positive side of the refrigerator 10 in the Y direction. The dry purge 20 heats the low-temperature dry air charged from the refrigerator 10 to bring the dry air to a predetermined temperature. A dryer 30 is arranged on the positive side of the dry purge 20 in the Y direction. The dryer 30 produces dry air.

As shown in FIG. 2, for convenience of explanation, a case where the IC device 13 as a device is used as an inspection target will be described as a representative. The IC device 13 has a flat plate shape. A plurality of hemispherical terminals are arranged on the lower surface of the IC device 13.

Examples of the IC device 13 include an LSI (Large Scale Integration), a CMOS (Complementary Metal Oxide Semiconductor), a CCD (Charge Coupled Device), a module IC in which a plurality of modules are packaged, a crystal device, a pressure sensor, and an inertial sensor. Examples include an acceleration sensor, a gyro sensor, and a fingerprint sensor.

The electronic component transfer device 2 includes a tray supply area 11, a device supply area 14, an inspection area 15, a device collection area 16, and a tray removal area 12. Each of these areas is separated by a wall. The IC device 13 passes through each of the areas from the tray supply area 11 to the tray removal area 12 in order in the direction of the first arrow 17, and is inspected in the inspection area 15 in the middle. In addition, the electronic component transport device 2 is a control composed of a transport unit 18 that transports the IC device 13 so as to pass through each region, a socket area 19 that performs inspection in the inspection region 15, and an industrial computer. A unit 4 is provided. The socket area 19 is an area in which a socket that conducts the IC device 13 and is inspected is arranged.

The electronic component inspection device 1 is on the front side when the tray supply area 11 and the tray removal area 12 are arranged. The side on which the inspection area 15 is arranged is the back side.

The electronic component transfer device 2 is used by mounting in advance what is called a "change kit" that is exchanged for each type of IC device 13. The change kit includes, for example, a soak plate 21, a shuttle 22, and a device recovery unit 23. Apart from the change kit, there are, for example, a tray 24, a collection tray 25, and a socket area 19 that are exchanged for each type of IC device 13. The tray 24 is a container on which the IC device 13 is mounted.

The tray supply area 11 is a material supply unit to which a tray 24 in which a plurality of uninspected IC devices 13 are arranged is supplied. In the tray supply area 11, a plurality of trays 24 are stacked and mounted. A plurality of recesses are arranged in a matrix in each tray 24. One IC device 13 is housed in each recess.

In the device supply area 14, the plurality of IC devices 13 on the tray 24 transported from the tray supply area 11 are each conveyed to the shuttle 22. The IC device 13 is transported from the device supply area 14 to the inspection area 15 by the shuttle 22. A first tray transfer mechanism 26 and a second tray transfer mechanism 27 that horizontally transfer the trays 24 one by one are provided so as to straddle the tray supply area 11 and the device supply area 14. The first tray transport mechanism 26 is a part of the transport unit 18. The first tray transport mechanism 26 moves the tray 24 on which the IC device 13 is mounted on the positive side in the Y direction, that is, in the direction of the second arrow 28 in FIG. As a result, the IC device 13 is sent to the device supply area 14. Further, the second tray transport mechanism 27 moves the empty tray 24 on the negative side in the Y direction, that is, in the direction of the third arrow 29 in FIG. The second tray transfer mechanism 27 moves the empty tray 24 from the device supply area 14 to the tray supply area 11.

The device supply area 14 is provided with a soak plate 21, a first device transfer head 31, a tray transfer mechanism 32, and a shuttle 22. The English notation of the soak plate 21 is "soak plate", and the Chinese notation is "soaking plate". The soak plate 21 adjusts the temperature of the IC device 13. The soak plate 21 adjusts the temperature of the IC device 13 during the inspection standby. The shuttle 22 moves across the device supply area 14 and the inspection area 15. The shuttle 22 transports the IC device 13 from the soak plate 21 to the movable range of the test hand 36.

A plurality of IC devices 13 are placed on the soak plate 21. The soak plate 21 collectively heats or cools the mounted IC device 13. The soak plate 21 heats or cools the IC device 13 in advance to adjust the temperature to a temperature suitable for the electric special inspection. In this embodiment, for example, the soak plate 21 can cool the IC device 13 to −55 degrees or less.

In this embodiment, for example, the soak plate 21 includes a first soak plate 21a and a second soak plate 21b. The first soak plate 21a and the second soak plate 21b are arranged side by side in the Y direction. The first soak plate 21a and the second soak plate 21b have the same structure. The IC device 13 on the tray 24 carried in from the tray supply area 11 by the first tray transfer mechanism 26 is conveyed to one of the soak plates 21.

The first device transfer head 31 includes a mechanism for holding the IC device 13. The first device transfer head 31 moves the IC device 13 in the X direction, the Y direction, and the Z direction within the device supply area 14. The first device transport head 31 is a part of the transport unit 18. The first device transport head 31 transports the IC device 13 between the tray 24 and the soak plate 21 carried in from the tray supply area 11. The first device transport head 31 transports the IC device 13 between the soak plate 21 and the shuttle 22. In FIG. 2, the movement of the first device transfer head 31 in the X direction is indicated by the fourth arrow 33, and the movement of the first device transfer head 31 in the Y direction is indicated by the fifth arrow 34.

The IC device 13 whose temperature is adjusted by the soak plate 21 is placed on the shuttle 22. The shuttle 22 transports the IC device 13 to the vicinity of the socket area 19. The shuttle 22 is also referred to as a "supply shuttle plate" or a "supply shuttle". The shuttle 22 is also a part of the transport unit 18. The shuttle 22 has a recess in which the IC device 13 is stored and placed.

The shuttle 22 reciprocates between the device supply area 14 and the inspection area 15 in the X direction, that is, in the direction of the sixth arrow 35. As a result, the shuttle 22 conveys the IC device 13 from the device supply area 14 to the vicinity of the socket area 19 of the inspection area 15. After the IC device 13 is removed by the test hand 36 in the inspection area 15, the shuttle 22 returns to the device supply area 14 again.

Two shuttles 22 are arranged in the Y direction. The shuttle 22 on the positive side in the Y direction is the first shuttle 22a. The shuttle 22 on the negative side in the Y direction is the second shuttle 22b. Then, the IC device 13 on the soak plate 21 is conveyed to the first shuttle 22a or the second shuttle 22b within the device supply area 14 by the first device transfer head 31. The shuttle 22 can heat or cool the IC device 13 mounted on the shuttle 22. The temperature-controlled IC device 13 on the soak plate 21 is conveyed to the vicinity of the socket area 19 of the inspection area 15 while maintaining the temperature-controlled state. Further, the shuttle 22 and the soak plate 21 are electrically grounded to the chassis.

A rotary stage 40 is arranged between the first shuttle 22a and the second shuttle 22b. The rotation stage 40 rotates the IC device 13 to change the direction of the IC device 13.

The tray transport mechanism 32 is a mechanism for transporting an empty tray 24 in a state where all IC devices 13 have been removed in the device supply area 14 on the positive side in the X direction, that is, in the direction of the seventh arrow 32a. After transporting in the direction of the seventh arrow 32a, the empty tray 24 is returned from the device supply region 14 to the tray supply region 11 by the second tray transport mechanism 27.

The inspection area 15 is an area for inspecting the electrical characteristics of the IC device 13. The inspection area 15 is provided with a socket area 19 for inspecting the IC device 13 and a test hand 36. The test hand 36 presses the IC device 13 into the socket.

The test hand 36 is a part of the transport unit 18 and can heat or cool the held IC device 13. The test hand 36 conveys the IC device 13 while maintaining the temperature controlled state in the inspection area 15.

The test hand 36 is supported so as to be reciprocally movable in the Y direction and the Z direction within the inspection area 15, and is a part of a mechanism called an “index arm”. The test hand 36 lifts the IC device 13, transports it from the shuttle 22 onto the socket area 19, and places it.

In FIG. 2, the reciprocating movement of the test hand 36 in the Y direction is indicated by the eighth arrow 36c. The test hand 36 is responsible for transporting the IC device 13 from the first shuttle 22a to the socket area 19 and transporting the IC device 13 from the second shuttle 22b to the socket area 19 within the inspection area 15. Further, the test hand 36 is supported so as to be reciprocally movable in the Y direction.

Two test hands 36 are arranged in the Y direction. The test hand 36 on the positive side in the Y direction is the first test hand 36a. The test hand 36 on the negative side in the Y direction is the second test hand 36b. The first test hand 36a is responsible for transporting the IC device 13 from the first shuttle 22a to the socket area 19. The second test hand 36b is responsible for transporting the IC device 13 from the second shuttle 22b to the socket area 19. The first test hand 36a is responsible for transporting the IC device 13 from the socket area 19 to the first device recovery unit 23a. The second test hand 36b is responsible for transporting from the socket area 19 to the second device recovery unit 23b.

The IC device 13 is placed in the socket area 19, and the socket area 19 inspects the electrical characteristics of the IC device 13. The socket area 19 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 13. Then, the terminal of the IC device 13 and the probe pin are electrically connected. Then, the socket area 19 inspects the IC device 13. The inspection of the IC device 13 is performed based on a program stored in the inspection control unit included in the tester electrically connected to the socket area 19. The IC device 13 can also be heated or cooled in the socket area 19 to adjust the temperature of the IC device 13 to a temperature suitable for inspection. Therefore, the electronic component transfer device 2 includes a soak plate 21 for heating or cooling the IC device 13 and a socket area 19. The IC device 13 can be inspected at high or low temperatures.

The device recovery area 16 is an area in which a plurality of IC devices 13 for which inspection has been completed are collected. The device collection area 16 is provided with a collection tray 25, a second device transfer head 37, and a third tray transfer mechanism 38. A device recovery unit 23 that moves so as to straddle the inspection area 15 and the device recovery area 16 is also provided. An empty tray 24 is also prepared in the device collection area 16.

The IC device 13 for which the inspection has been completed is placed in the device collection unit 23. The device recovery unit 23 transports the IC device 13 to the device recovery area 16. The device collection unit 23 is also referred to as a “collection shuttle plate” or simply a “collection shuttle”. The device collection unit 23 is also a part of the transport unit 18.

The device recovery unit 23 is supported so as to be reciprocally movable between the inspection area 15 and the device recovery area 16 in the X direction, that is, in the direction of the ninth arrow 23c. Two device collection units 23 are arranged in the Y direction. The device recovery unit 23 on the positive side in the Y direction is the first device recovery unit 23a. The device recovery unit 23 on the negative side in the Y direction is the second device recovery unit 23b. The IC device 13 on the socket area 19 is conveyed to and placed on the first device recovery unit 23a or the second device recovery unit 23b. The test hand 36 is responsible for transporting the IC device 13 from the socket area 19 to the first device recovery unit 23a and transporting the IC device 13 from the socket area 19 to the second device recovery unit 23b. Further, the device recovery unit 23 is electrically grounded to the chassis.

The IC device 13 inspected in the socket area 19 is placed on the collection tray 25. The IC device 13 is fixed to the collection tray 25 so as not to move within the device collection area 16. Even in the device collection area 16 in which various movable parts such as the second device transfer head 37 are arranged in a relatively large number, the inspected IC device 13 is stably placed on the collection tray 25. Three collection trays 25 are arranged along the X direction.

Four empty trays 24 are also arranged along the X direction. The inspected IC device 13 is placed on the empty tray 24. The IC device 13 on the device collection unit 23 is transported to and placed on either the collection tray 25 or the empty tray 24. The IC device 13 is classified according to the inspection result and collected.

The second device transfer head 37 is movably supported in the device recovery area 16 in the X and Y directions. The second device transfer head 37 has a portion that can be moved in the Z direction as well. The second device transfer head 37 is a part of the transfer unit 18. The second device transfer head 37 transfers the IC device 13 from the device collection unit 23 to the collection tray 25 or the empty tray 24. In FIG. 2, the movement of the second device transfer head 37 in the X direction is indicated by the tenth arrow 37a, and the movement of the second device transfer head 37 in the Y direction is indicated by the eleventh arrow 37b.

The third tray transport mechanism 38 is a mechanism for transporting the empty tray 24 carried in from the tray removal area 12 in the device recovery area 16 in the X direction, that is, in the direction of the twelfth arrow 38a. After the transfer, the empty tray 24 is arranged at a position where the IC device 13 is collected.

In the tray removal area 12, the tray 24 in which the plurality of IC devices 13 in the inspected state are arranged is collected and removed. A large number of trays 24 are stacked in the tray removal area 12.

A fourth tray transfer mechanism 39 and a fifth tray transfer mechanism 41 are provided to transfer the trays 24 one by one in the Y direction so as to straddle the device collection area 16 and the tray removal area 12. The fourth tray transport mechanism 39 is a part of the transport unit 18 and reciprocates the tray 24 in the Y direction, that is, in the direction of the thirteenth arrow 39a. The fourth tray transport mechanism 39 transports the inspected IC device 13 from the device recovery area 16 to the tray removal area 12. The fifth tray transfer mechanism 41 moves the empty tray 24 for collecting the IC device 13 on the positive side in the Y direction, that is, in the direction of the 14th arrow 41a. The fifth tray transfer mechanism 41 moves the empty tray 24 from the tray removal area 12 to the device recovery area 16.

The control unit 4 includes a first tray transfer mechanism 26, a second tray transfer mechanism 27, a soak plate 21, a first device transfer head 31, a shuttle 22, a tray transfer mechanism 32, a socket area 19, and a test hand. It controls the operations of 36, the device recovery unit 23, the second device transfer head 37, the third tray transfer mechanism 38, the fourth tray transfer mechanism 39, and the fifth tray transfer mechanism 41. The electronic component transfer device 2 has a control unit 4 and a memory 43 as a storage unit. The control unit 4 includes a CPU 42 (Central Processing Unit). The CPU 42 reads various information such as a determination program, an instruction / instruction program, etc. stored in the memory 43, and executes a determination or an instruction.

The control unit 4 may be built in the electronic component inspection device 1 or the electronic component transfer device 2, or may be provided in an external device such as an external computer. The external device may be, for example, communicated with the electronic component inspection device 1 via a cable or the like, may be wirelessly communicated, may be connected to the electronic component inspection device 1 via a network, and the like.

In the electronic component inspection device 1, the tray supply area 11 and the device supply area 14 are separated by a first partition wall 44. A shutter is provided on the first partition wall 44. The shutter opens when the tray 24 moves. The shutter is normally closed. The device supply area 14 and the inspection area 15 are separated by a second partition wall 45. The inspection area 15 and the device recovery area 16 are separated by a third partition wall 46. The device recovery area 16 and the tray removal area 12 are separated by a fourth partition wall 47. A shutter is provided on the fourth partition wall 47. The shutter opens when the tray 24 moves. The shutter is normally closed. The device supply area 14 and the device recovery area 16 are also separated by a fifth partition wall 48.

A hole for the shuttle 22 to pass through is formed in the second partition wall 45. A hole is formed in the third partition wall 46 for the device recovery unit 23 to pass through. Therefore, the device supply area 14 and the device recovery area 16 lead to the inspection area 15.

As shown in FIG. 3, a first opening / closing portion 49 and a second opening / closing portion 51 are arranged on the side surface of the device supply region 14 on the negative side in the X direction. The first opening / closing portion 49 has a first window portion 49a as a cover. The second opening / closing portion 51 has a second window portion 51a as a cover. The first window portion 49a and the second window portion 51a move to the positive side in the Y direction and the negative side in the Y direction to be opened and closed.

A third opening / closing portion 52 is arranged on the side surface of the device supply area 14 on the positive side in the Y direction. A fourth opening / closing portion 53 is arranged on the side surface of the inspection region 15 on the positive side in the Y direction. A fifth opening / closing portion 54 is arranged on the side surface of the device recovery area 16 on the positive side in the Y direction. The third opening / closing portion 52 has a third window portion 52a as a cover. The fourth opening / closing portion 53 has a fourth window portion 53a as a cover. The fifth opening / closing portion 54 has a fifth window portion 54a as a cover. The third window portion 52a, the fourth window portion 53a, and the fifth window portion 54a move to the positive side in the X direction and the negative side in the X direction to be opened and closed.

The sixth opening / closing portion 55 and the seventh opening / closing portion 56 are arranged on the side surface of the device recovery area 16 on the positive side in the X direction. The sixth opening / closing portion 55 has a sixth window portion 55a as a cover. The seventh opening / closing portion 56 has a seventh window portion 56a as a cover. The sixth window portion 55a and the seventh window portion 56a move to the positive side in the Y direction and the negative side in the Y direction to be opened and closed. As described above, the first window portion 49a to the seventh window portion 56a include a sliding door that moves along one axis. As described above, the electronic component transfer device 2 includes a plurality of covers.

The structure of the first window portion 49a to the seventh window portion 56a is not limited to the structure of the sliding door, and may be a double-door structure.

The first open / close lock 57 is arranged on the negative side in the X direction of the first window portion 49a. The first open / close lock 57 locks or unlocks the first window portion 49a that opens and closes in a closed state. A second open / close lock 58 is arranged on the positive side of the second window portion 51a in the X direction. The second open / close lock 58 locks or unlocks the second window portion 51a that opens and closes in a closed state.

A third open / close lock 59 is arranged on the positive side of the third window portion 52a in the Y direction. The third open / close lock 59 locks or unlocks the third window portion 52a that opens and closes in a closed state. A fourth open / close lock 61 is arranged on the negative side of the fourth window portion 53a in the Y direction. The fourth open / close lock 61 locks or unlocks the fourth window portion 53a that opens and closes in a closed state. A fifth open / close lock 62 is arranged on the positive side of the fifth window portion 54a in the Y direction. The fifth open / close lock 62 locks or unlocks the fifth window portion 54a that opens and closes in a closed state.

A sixth open / close lock 63 is arranged on the negative side of the sixth window portion 55a in the X direction. The sixth open / close lock 63 locks or unlocks the sixth window portion 55a that opens and closes in a closed state. A seventh open / close lock 64 is arranged on the positive side of the seventh window portion 56a in the X direction. The seventh open / close lock 64 locks or unlocks the seventh window portion 56a that opens and closes in a closed state.

A first air curtain device 65 is arranged outside the first opening / closing portion 49. A second air curtain device 66 is arranged outside the second opening / closing portion 51. A third air curtain device 67 is arranged outside the third opening / closing portion 52. A fourth air curtain device 68 is arranged outside the fourth opening / closing portion 53. A fifth air curtain device 69 is arranged outside the fifth opening / closing portion 54. A sixth air curtain device 71 is arranged outside the sixth opening / closing portion 55. A seventh air curtain device 72 is arranged outside the seventh opening / closing portion 56. The first air curtain device 65 to the seventh air curtain device 72 eject the gas from which the dust has been removed. The gas to be ejected is not particularly limited, but a dry gas is preferable. In this embodiment, for example, dry air is used as the gas.

A first humidity sensor 73 is arranged between the first window portion 49a and the first air curtain device 65. The first humidity sensor 73 detects the humidity of the first opening / closing unit 49. A second humidity sensor 74 is arranged between the second window portion 51a and the second air curtain device 66. The second humidity sensor 74 detects the humidity of the second opening / closing unit 51. A third humidity sensor 75 is arranged between the third window portion 52a and the third air curtain device 67. The third humidity sensor 75 detects the humidity of the third opening / closing unit 52. A fourth humidity sensor 76 is arranged between the fourth window portion 53a and the fourth air curtain device 68. The fourth humidity sensor 76 detects the humidity of the fourth opening / closing unit 53.

A fifth humidity sensor 77 is arranged between the fifth window portion 54a and the fifth air curtain device 69. The fifth humidity sensor 77 detects the humidity of the fifth opening / closing unit 54. A sixth humidity sensor 78 is arranged between the sixth window portion 55a and the sixth air curtain device 71. The sixth humidity sensor 78 detects the humidity of the sixth opening / closing portion 55. A seventh humidity sensor 79 is arranged between the seventh window portion 56a and the seventh air curtain device 72. The seventh humidity sensor 79 detects the humidity of the seventh opening / closing portion 56.

The first open / close sensor 81 is arranged on the negative side in the Z direction of the first open / close lock 57. The first open / close sensor 81 detects the open / close of the first open / close portion 49. The second open / close sensor 82 is arranged on the negative side in the Z direction of the second open / close lock 58. The second open / close sensor 82 detects the open / close of the second open / close portion 51. The third open / close sensor 83 is arranged on the negative side in the Z direction of the third open / close lock 59. The third open / close sensor 83 detects the open / close of the third open / close portion 52. The fourth open / close sensor 84 is arranged on the negative side in the Z direction of the fourth open / close lock 61. The fourth opening / closing sensor 84 detects the opening / closing of the fourth opening / closing unit 53. The fifth open / close sensor 85 is arranged on the negative side in the Z direction of the fifth open / close lock 62. The fifth opening / closing sensor 85 detects the opening / closing of the fifth opening / closing unit 54. The sixth open / close sensor 86 is arranged on the negative side in the Z direction of the sixth open / close lock 63. The sixth open / close sensor 86 detects the open / close of the sixth open / close portion 55. The seventh open / close sensor 87 is arranged on the negative side in the Z direction of the seventh open / close lock 64. The seventh opening / closing sensor 87 detects the opening / closing of the seventh opening / closing portion 56.

The first open / close sensor 81 to the seventh open / close sensor 87 are proximity sensors. The detection method of the proximity sensor is not particularly limited. Optical type, electromagnetic type, capacitance type and the like can be used.

The first release button 112 to the seventh release button 118 are arranged side by side in the Z direction between the second opening / closing portion 51 and the third opening / closing portion 52. The first release button 112 to the seventh release button 118 are input devices that receive instructions for releasing the locks of the first open / close lock 57 to the seventh open / close lock 64, respectively. For example, when the user presses the first release button 112, the first open / close lock 57 unlocks the first open / close portion 49, so that the first open / close portion 49 can be opened.

The device supply area 14, the inspection area 15, and the device recovery area 16 each include a third outlet 119 as an injection port and a sixth outlet 120 as an injection port. The third outlet 119 and the sixth outlet 120 are nozzles for blowing dry air. In the device supply area 14, the third outlet 119 and the sixth outlet 120 are the negative side in the Y direction and the negative side in the X direction of the first soak plate 21a, the positive side in the Y direction and the negative side in the X direction of the second soak plate 21b, and the third. The two shuttles 22b are arranged on the negative side in the Y direction and the first shuttle 22a on the positive side in the Y direction. In the inspection area 15, the third outlet 119 and the sixth outlet 120 are on the negative side in the Y direction and the positive side in the X direction of the second device recovery unit 23b, and on the positive side in the Y direction and the positive side in the X direction of the first device collection unit 23a. Be placed. In the device recovery area 16, the third outlet 119 and the sixth outlet 120 are arranged on the negative side in the Y direction of the second shuttle 22b and the positive side in the Y direction of the first shuttle 22a. At each location, the third outlet 119 and the sixth outlet 120 are arranged alternately side by side.

The structures of the first opening / closing portion 49 to the seventh opening / closing portion 56 are substantially the same. The structure of the fourth opening / closing part 53 will be described, and the description of the structure of the first opening / closing part 49 to the third opening / closing part 52 and the fifth opening / closing part 54 to the seventh opening / closing part 56 will be omitted.

As shown in FIG. 4, the electronic component transfer device 2 includes a base 88. The socket area 19, the shuttle 22, the device recovery unit 23, and the like are arranged on the base 88. A ceiling plate 89 is arranged on the positive side of the base 88 in the Z direction. The ceiling plate 89 faces the base 88.

A first groove 91 and a second groove 92 are arranged on the base 88. The first groove 91 and the second groove 92 are parallel to each other. A third groove 93 and a fourth groove 94 are arranged on the ceiling plate 89. The third groove 93 and the fourth groove 94 are parallel to each other. The first groove 91 and the third groove 93 face each other.

The fourth window portion 53a of the fourth opening / closing portion 53 is arranged between the first groove 91 and the third groove 93. When the user moves the fourth window portion 53a to the positive side in the X direction or the negative side in the X direction, the fourth window portion 53a slides along the first groove 91 and the third groove 93.

Similarly, the second groove 92 and the fourth groove 94 face each other. The fifth window portion 54a is arranged between the second groove 92 and the fourth groove 94. When the user moves the fifth window portion 54a to the positive side in the X direction or the negative side in the X direction, the fifth window portion 54a slides along the second groove 92 and the fourth groove 94. As described above, the fourth window portion 53a of the fourth opening / closing portion 53 and the fifth window portion 54a of the fifth opening / closing portion 54 are provided with sliding doors.

The fourth open / close sensor 84 and the fifth open / close sensor 85 are arranged on the base 88. The fourth open / close sensor 84 is arranged inside the fourth open / close portion 53. The fifth open / close sensor 85 is arranged outside the fifth open / close portion 54.

The fourth open / close lock 61 and the fifth open / close lock 62 are arranged on the surface of the ceiling plate 89 on the negative side in the Z direction. The fourth open / close lock 61 is arranged inside the fourth window portion 53a. The fifth open / close lock 62 is arranged outside the fifth window portion 54a.

An ionizer 95 is arranged on the surface of the ceiling plate 89 on the negative side in the Z direction. The ionizer 95 releases ionized air 96. The ionizer 95 is arranged inside the fourth opening / closing portion 53 and outside the fourth air curtain device 68. In addition, the ionizer 95 is arranged near the soak plate 21, the shuttle 22, the device recovery unit 23, and the socket area 19. As described above, the electronic component transfer device 2 includes the ionizer 95 in the inspection area 15, the device supply area 14, and the device recovery area 16. Since static electricity is neutralized in the fourth opening / closing section 53, the soak plate 21, the shuttle 22, the device recovery section 23, and the socket area 19, dust and dirt are less likely to adhere to the fourth opening / closing section 53, the soak plate 21, the shuttle 22, and the socket area 19.

The fourth air curtain device 68 includes a nozzle 97. The nozzle 97 is connected to the curtain solenoid valve 98 by a first pipe 99. The curtain solenoid valve 98 is connected to the air filter 101 by a second pipe 102. The air filter 101 is connected to the dry purge 20 by a third pipe 103.

The dry purge 20 heats the cold dry air 104 to adjust the temperature to a predetermined temperature. The dry air 104 is supplied from the dry purge 20 to the air filter 101 via the third pipe 103. The air filter 101 includes a hollow fiber membrane filter for removing moisture and a HEPA filter (High Efficiency Particulate Air Filter) for cleaning.

The dry air 104 reaches the curtain solenoid valve 98 through the second pipe 102. The opening and closing of the curtain solenoid valve 98 is controlled by the control unit 4. When the curtain solenoid valve 98 opens the valve, the dry air 104 is injected from the nozzle 97 through the first pipe 99. The dry air 104 injected from the nozzle 97 forms the air curtain 100. The air between the fourth air curtain device 68 and the fourth window portion 53a is moved to the negative side in the Z direction by the dry air 104. The air between the fourth air curtain device 68 and the fourth window portion 53a is replaced with the dry air 104.

By installing the air curtain device outside the window, the outside air does not affect the space inside the window. The air curtain 100 prevents external humidity from entering. By setting the supply dry air pressure to 0.3 MPa or more, an ideal air curtain state can be formed.

As shown in FIG. 5, in the device supply area 14, the first soak plate 21a and the second soak plate 21b are arranged on the base 88. The first soak plate 21a and the second soak plate 21b have substantially the same structure. The first soak plate 21a will be mainly described, and a part of the description of the second soak plate 21b will be omitted.

The first soak plate 21a includes an internal heater 122 and an internal pipe 123 inside. A silicon rubber heater or the like is used for the internal heater 122. The positional relationship between the internal heater 122 and the internal pipe 123 in the Z direction may be reversed, and is not particularly limited. Cooled dry air 104 flows through the internal piping 123.

A side cover 124 is installed around the first soak plate 21a. The side cover 124 is provided with an opening 124a at a location facing the location where the IC device 13 is arranged. The first device transfer head 31 moves the IC device 13 from the soak plate 21 through the opening 124a and onto the first shuttle 22a.

A first outlet 125 as an injection port and a fourth outlet 126 as an injection port are installed between the first soak plate 21a and the side cover 124. Similarly, a second outlet 127 as an injection port and a fifth outlet 128 as an injection port are installed between the second soak plate 21b and the side cover 124.

When the soak plate 21 cools the IC device 13, the cooled dry air 104 is supplied to the internal pipe 123, the first outlet 125, the fourth outlet 126, the second outlet 127, and the fifth outlet 128. The internal pipe 123 directly cools the soak plate 21. The first outlet 125, the fourth outlet 126, the second outlet 127, and the fifth outlet 128 cool and dehumidify the air around the soak plate 21.

When the soak plate 21 heats the IC device 13, the heated dry air 104 is supplied to the internal pipe 123, the first outlet 125, the fourth outlet 126, the second outlet 127, and the fifth outlet 128. The internal pipe 123 directly heats the soak plate 21. The first outlet 125, the fourth outlet 126, the second outlet 127, and the fifth outlet 128 heat the air around the soak plate 21.

A side cover 124 is arranged around the shuttle 22, the test hand 36, and the socket area 19. The first outlet 125, the fourth outlet 126, the second outlet 127, and the fifth outlet 128 are arranged inside the side cover 124.

As shown in FIG. 6, the fifth pipe 131 connects the refrigerator 10 and the first branch portion 129. The sixth pipe 132, the seventh pipe 133, and the eighth pipe 134 are connected to the first branch portion 129. The sixth pipe 132 connects the first branch portion 129 and the dry purge 20 via the first solenoid valve 135. The seventh pipe 133 connects the first branch portion 129 and the dry purge 20 via the second solenoid valve 136 and the first soak plate 21a. The eighth pipe 134 connects the first branch portion 129 and the dry purge 20 via the third solenoid valve 137 and the second soak plate 21b.

The third outlet 119 is connected to the dry purge 20 by the ninth pipe 138. The ninth pipe 138 includes a fourth solenoid valve 139 between the third outlet 119 and the dry purge 20. The first outlet 125 is connected to the dry purge 20 by the tenth pipe 141. The tenth pipe 141 includes a fifth solenoid valve 142 between the first outlet 125 and the dry purge 20. The second outlet 127 is connected to the dry purge 20 by the eleventh pipe 143. The eleventh pipe 143 includes a sixth solenoid valve 144 between the second outlet 127 and the dry purge 20.

A twelfth pipe 146 connects between the dryer 30 and the second branch portion 145. The 13th pipe 147 and the 14th pipe 148 are connected to the second branch portion 145.

The fourth outlet 126 is connected to the second branch portion 145 by the thirteenth pipe 147. The thirteenth pipe 147 includes a seventh solenoid valve 151 between the fourth outlet 126 and the second branch portion 145. The fifth outlet 128 is connected to the second branch portion 145 by the 14th pipe 148. The 14th pipe 148 includes an 8th solenoid valve 152 between the 5th outlet 128 and the 2nd branch portion 145. The sixth outlet 120 is connected to the dryer 30 by the fifteenth pipe 149. The fifteenth pipe 149 includes a ninth solenoid valve 153 between the sixth outlet 120 and the dryer 30. As described above, the electronic component transfer device 2 includes a plurality of injection ports for the dry air 104.

As shown in FIG. 7, in the normal cooling mode, the control unit 4 opens the second solenoid valve 136 and the third solenoid valve 137. The control unit 4 closes the first solenoid valve 135, the fourth solenoid valve 139, the fifth solenoid valve 142, the sixth solenoid valve 144, the seventh solenoid valve 151, the eighth solenoid valve 152, and the ninth solenoid valve 153. “(O)” in the figure indicates that the valve is open. “(C)” in the figure indicates that the valve is closed. The arrows in the figure indicate the direction in which the dry air 104 flows.

A part of the dry air 104 supplied from the refrigerator 10 enters the first soak plate 21a and the second soak plate 21b. The dry air 104 is cooled to, for example, about −100 ° C. to cool the first soak plate 21a and the second soak plate 21b. The control unit 4 controls the opening and closing of the second solenoid valve 136 and the third solenoid valve 137 so that the soak plate 21 maintains a predetermined temperature. The dry air 104 emitted from the first soak plate 21a and the second soak plate 21b enters the dry purge 20.

Even in the normal cooling mode, the fourth solenoid valve 139, the fifth solenoid valve 142, and the sixth solenoid valve 144 are opened for dehumidification and cooling, and the first outlet 125, the second outlet 127, and the third solenoid valve are opened. Dry air 104 may be ejected from 119.

In the shuttle 22, the test hand 36, and the socket area 19, the configurations of the pipes connecting the first outlet 125 to the fifth outlet 128, the refrigerator 10, the dry purge 20, and the dryer 30 are the same as those of the soak plate 21. be.

In FIG. 8, the electronic component transfer device 2 includes a control unit 4 that controls the operation of the electronic component transfer device 2, and a memory 43 that stores various information. The control unit 4 includes a CPU 42 (central processing unit) that performs various arithmetic processes as a processor. The valve drive unit 154, curtain drive unit 155, open / close lock drive unit 156, temperature sensor drive unit 157, humidity sensor drive unit 158, and open / close sensor drive unit 159 are connected to the CPU 42 via the input / output interface 161 and the data bus 162. .. In addition, a refrigerator 10, a dryer 30, a dry purge 20, a heater drive unit 163, an input device 164, and a display device 165 are connected to the CPU 42 via an input / output interface 161 and a data bus 162.

The valve drive unit 154 drives the first solenoid valve 135 to the ninth solenoid valve 153. The valve drive unit 154 inputs an instruction signal of the CPU 42. The instruction signal contains information on whether to open or close the valve. Then, the valve drive unit 154 switches the opening and closing of the solenoid valve corresponding to the instruction signal.

The curtain driving unit 155 drives the curtain solenoid valve 98. The curtain drive unit 155 inputs an instruction signal of the CPU 42. The instruction signal contains information on whether to open or close the curtain solenoid valve 98. Then, the curtain driving unit 155 switches the opening and closing of the curtain solenoid valve 98 corresponding to the instruction signal.

The open / close lock drive unit 156 drives the first open / close lock 57 to the seventh open / close lock 64. The open / close lock drive unit 156 inputs an instruction signal of the CPU 42. The instruction signal contains information on whether each open / close lock locks or unlocks the corresponding window in the closed state. Then, the open / close lock drive unit 156 switches the locked state of the open / close lock corresponding to the instruction signal.

The temperature sensor driving unit 157 drives the temperature sensors installed in the device supply area 14 and the inspection area 15. In addition, the temperature sensor drive unit 157 drives the temperature sensor installed in the device recovery area 16. The temperature sensor drive unit 157 inputs an instruction signal of the CPU 42. The indicator signal contains information requesting temperature data detected by each temperature sensor. Then, the temperature sensor driving unit 157 drives the temperature sensor corresponding to the instruction signal, and transmits the temperature data detected by the temperature sensor to the CPU 42.

The humidity sensor driving unit 158 drives the first humidity sensor 73 to the seventh humidity sensor 79. In addition, it drives humidity sensors installed in the device supply area 14 and the inspection area 15. In addition, it drives a humidity sensor installed in the device recovery area 16. The humidity sensor drive unit 158 inputs an instruction signal of the CPU 42. The indicator signal contains information requesting humidity data detected by each humidity sensor. Then, the humidity sensor driving unit 158 drives the humidity sensor corresponding to the instruction signal, and transmits the humidity data detected by the humidity sensor to the CPU 42.

The open / close sensor drive unit 159 drives the first open / close sensor 81 to the seventh open / close sensor 87. The open / close sensor drive unit 159 inputs an instruction signal of the CPU 42. The instruction signal includes information requesting data on the open / closed state of the open / close portion detected by each open / close sensor. Then, the open / close sensor drive unit 159 drives the open / close sensor corresponding to the instruction signal, and transmits the open / close state data of the window portion detected by the open / close sensor to the CPU 42. The open / close sensor drive unit 159 transmits data on the open / closed state of the first window unit 49a to the seventh window unit 56a to the CPU 42.

The heater drive unit 163 drives the heater and the internal heater 122 included in the dry purge 20. The input device 164 is a device such as an operation panel 7, a first release button 112 to a seventh release button 118, a keyboard, and a mouse. The display device 165 is a device that displays measurement results and information related to measurement. The display device 165 includes a monitor 6 and a signal lamp 9. As the display device 165, a liquid crystal display device, an organic electroluminescence display, a plasma display, and a surface electric field display can be used.

The input device 164 and the display device 165 are devices for the user to give various instructions such as operation start and operation end, measurement conditions, etc. to the electronic component inspection device 1 and the electronic component transfer device 2. The input device 164 is a device for the user to input an instruction of a window portion to be opened / closed when a jam occurs. A transfer error of the electronic component transfer device 2 is called a jam.

The memory 43 includes a semiconductor memory such as RAM and ROM, and a storage device such as a hard disk. The memory 43 stores a program 166 in which the operation control procedure and the measurement procedure of the electronic component inspection device 1 and the electronic component transfer device 2 are described. In addition, the memory 43 stores valve data 167 indicating opening / closing settings of the first solenoid valve 135 to the ninth solenoid valve 153 in various operation modes. In addition, the memory 43 stores mode data 168 related to various return modes. The mode data 168 includes data of a plurality of return modes in which the combination of the blowout amount of the dry air 104 and the first outlet 125 to the sixth outlet 120 for ejecting the dry air 104 is different.

In addition, the memory 43 stores the inspection temperature data 169 indicating the temperature at the time of performing the electrical characteristic inspection of the IC device 13. In addition, it includes a work area for operating the CPU 42, a storage area that functions as a temporary file, and various other storage areas.

The CPU 42 drives the electronic component transfer device 2 according to the program 166 stored in the memory 43. The control unit 4 functions as a computer equipped with an input device 164, a display device 165, a CPU 42, and the like. The CPU 42 on which the program 166 operates has a valve control unit 171 as a specific function realization unit. The valve control unit 171 controls the first solenoid valve 135 to the ninth solenoid valve 153 to control the flow of the dry air 104 flowing through each pipe. The valve control unit 171 controls the opening and closing of the valve according to the selected mode among the plurality of modes provided for performing the return mode.

In addition, the CPU 42 has a time measuring unit 172. The time measuring unit 172 measures the time when the first window unit 49a to the seventh window unit 56a are open. In addition, the CPU 42 has a mode selection unit 173. The mode selection unit 173 of the control unit 4 sets the memory 43 as one of the return modes to be executed after the window unit is closed, based on the number of window units opened and the opening time when a jam occurs. Select from multiple return modes of.

In addition, the CPU 42 has a mode control unit 174. When the instruction input from the input device 164 is a return mode instruction, the mode control unit 174 transmits an instruction to open / close the valve according to the type of the instructed mode to the valve control unit 171 according to the instructed return mode. .. The mode control unit 174 of the control unit 4 further adjusts the temperature and humidity specified for the selected return mode.

According to this configuration, the mode selection unit 173 selects one of the return modes according to changes in temperature and humidity. When the change in temperature and humidity is large, the valve control unit 171 increases the consumption of the dry air 104. When the change in temperature and humidity is small, the valve control unit 171 reduces the consumption of the dry air 104. Therefore, the consumption of the dry air 104 can be reduced as compared with the case of performing the return mode in which the consumption of the dry air 104 is always large.

The recovery mode has a minimum mode, a rapid recovery mode, and a jam recovery mode. The minimum mode is selected when the number of opened windows is small and the opening time is short. The rapid return mode is selected when the number of opened windows is large and the opening time is long. The jam recovery mode is an intermediate mode between the rapid recovery mode and the minimum mode.

According to this configuration, the mode selection unit 173 of the control unit 4 selects one of the minimum mode, the jam recovery mode, and the rapid recovery mode according to the change in temperature and humidity. When the change in temperature and humidity is large, the consumption of the dry air 104 is increased. When the change in temperature and humidity is small, the consumption of dry air 104 is reduced. Therefore, the consumption of the dry air 104 can be reduced as compared with the case of performing the rapid return mode in which the consumption of the dry air 104 is always large.

In addition, the CPU 42 has an air curtain control unit 175. The air curtain control unit 175 drives the solenoid valve 98 on the curtain drive unit 155 to control the formation of the air curtain 100 by some of the first air curtain devices 65 to the seventh air curtain device 72.

In addition, the CPU 42 has an open / close lock control unit 176. The open / close lock control unit 176 controls the first open / close lock 57 to the seventh open / close lock 64 to control the locked state of the first open / close portion 49 to the seventh open / close portion 56.

In addition, the CPU 42 has a temperature measuring unit 177. The temperature measuring unit 177 drives the temperature sensor driving unit 157 to drive the temperature sensor. The temperature sensor drive unit 157 measures the temperature of the device supply area 14, the inspection area 15, and the like.

In addition, the CPU 42 has a humidity measuring unit 178. The humidity measurement unit 178 drives the humidity sensor drive unit 158 to drive the humidity sensor. The humidity measuring unit 178 measures the humidity between the air curtain device and the window unit, and the humidity of the device supply area 14, the inspection area 15, and the like.

In addition, the CPU 42 has a heater control unit 179. The heater control unit 179 drives the heater drive unit 163 to drive the heater and the internal heater 122 included in the dry purge 20. The heater control unit 179 controls heating by the dry purge 20 and the internal heater 122. The mode control unit 174 transmits a temperature instruction according to the type of mode to the heater control unit 179. The heater control unit 179 adjusts the dry air 104 to a temperature at which defrosting is possible.

In addition, the CPU 42 has a jam detection unit 180. The jam detection unit 180 detects the occurrence of a jam state. The jam detection unit 180 identifies the place where the jam state occurs. The jam detection unit 180 identifies the window unit corresponding to the place where the jam has occurred.

In addition, the CPU 42 has a display control unit 181. The display control unit 181 controls the message to be displayed on the display device 165. When a jam occurs, a message including the location of the window corresponding to the IC device 13 in the jammed state is displayed on the display device 165. The jam state indicates a state in which the IC device 13 is displaced from the proper place.

Next, a method for recovering from the jam of the electronic component transfer device 2 described above will be described.
In the flowchart of FIG. 9, step S1 is an operation stop step. Jam occurs irregularly in the electronic component transfer device 2. For example, when the first device transfer head 31 cannot grip the IC device 13, the jam detection unit 180 stops the operation of the electronic component transfer device 2. The jam detection unit 180 detects the place where the jam state occurs. Next, the process proceeds to step S2.

Step S2 is a corresponding window display step. In this step, the jam detection unit 180 identifies the window unit corresponding to the place where the jam of the IC device 13 to be inspected occurs. The window candidate is a window candidate that can be opened when the user maintains the jam condition. The display control unit 181 outputs the information of the candidate of the window unit to the monitor 6 of the display device 165. The monitor 6 displays candidates for windows to be opened. Next, the process proceeds to step S3.

Step S3 is a jam repairing step. In this process, the window portion to be opened by the user is selected by referring to the window portion candidates. The user presses the release button corresponding to the selected window. The air curtain control unit 175 inputs the signal of the pressed release button, and outputs an instruction signal for forming the air curtain 100 to the curtain drive unit 155. The curtain drive unit 155 forms the air curtain 100 at the designated place. A humidity sensor detects the humidity between the window and the air curtain device. When the humidity between the window unit and the air curtain device drops below a predetermined humidity, the open / close lock control unit 176 outputs an instruction signal for releasing the lock of the predetermined window unit to the open / close lock drive unit 156. The open / close lock drive unit 156 unlocks the designated window unit. In this way, the control unit 4 releases the lock of the window unit corresponding to the place where the jam occurs.

The user opens the unlocked window. The time measuring unit 172 starts measuring the time when the window unit is open. The control unit 4 recognizes the number of windows opened by the user and measures the opening time. The user moves the IC device 13 to eliminate the jam state. The user closes the opened window when the maintenance is completed. The open / close sensor drive unit 159 detects that the window unit is closed. The time measurement unit 172 ends the measurement of the time when the window unit is open. The open / close lock drive unit 156 locks the closed window unit. The air curtain device stops the formation of the air curtain 100.

If the user is out of the window candidates and opens the window, the air curtain 100 will be supplied according to the total number of activated air curtains 100 within the range of the total usable dry air amount after alerting the concern about frost formation. The pressure is calculated and the air flow of the air curtain 100 is generated under low pressure. Next, the process proceeds to step S4.

Step S4 is a return mode selection step. In this step, the mode selection unit 173 selects the return mode. The mode selection unit 173 selects one of the minimum mode, the rapid recovery mode, and the jam recovery mode according to the number, location, and time of the opened windows. That is, the mode selection unit 173 of the control unit 4 selects one of the plurality of return modes to be executed after the window unit is closed, based on the number of opened windows and the time of the opened windows. Next, the process proceeds to step S5.

Step S5 is a return mode implementation step. In this step, the mode control unit 174 outputs an instruction signal to the valve control unit 171 and the heater control unit 179. The mode control unit 174 ejects the dry air 104 corresponding to the selected mode. The control unit 4 automatically executes the selected return mode. Next, the process proceeds to step S6.

Step S6 is an operation restarting process. In this process, the electronic component transfer device 2 resumes operation. The recovery process from jam is completed by the above steps.

According to this method, the window corresponding to the place where the jam occurred can be opened. The mode selection unit 173 of the control unit 4 selects one return mode according to the length of time that the window unit is opened. If the opening time of the window portion is long, the temperature and humidity inside the device change greatly, so that there is a high concern about frost formation. When the window portion is opened for a long time, a large amount of dry air 104 is consumed at the place where the window portion is opened. When the window portion is opened for a short time, the consumption of the dry air 104 is reduced. Therefore, it is possible to reduce the amount of dry air 104 used as compared with the case of performing a return mode in which the consumption of dry air 104 is large in the entire device at all times.

FIG. 10 shows a table of data used when the jam detection unit 180 selects a candidate for a window unit to be opened in the corresponding window display step of step S2. The left column of the table shows where the jam occurred. Candidates for open windows are shown in the center column. The right column shows non-candidate selection examples. The jam detection unit 180 selects a candidate for a window unit to be opened using this data. The number of candidate windows is limited to two. Therefore, it is possible to reduce the intrusion of air into the device.

FIG. 11 shows a table of data referred to when the mode selection unit 173 selects the return mode in the return mode selection step of step S4. This data is part of the mode data 168. Weighting coefficients are set in the first window portion 49a to the seventh window portion 56a, respectively. For example, the weighting coefficient of the first window portion 49a to the fourth window portion 53a is 1. The weighting coefficients of the fifth window portion 54a to the seventh window portion 56a are 0.8 to 0.6. Since the first window portion 49a to the fourth window portion 53a are more affected by humidity than the fifth window portion 54a to the seventh window portion 56a, the weighting coefficient is high.

For example, when the user opens the third window portion 52a and the fourth window portion 53a for 180 seconds, the calculation formula of the evaluation time is 1 × 180 + 1 × 180 = 360 seconds. The calculation result of the evaluation time is 360 seconds. When the evaluation time is 300 seconds or more and less than 600 seconds, the minimum mode is set. When the evaluation time is 600 seconds or more and less than 1200 seconds, the jam recovery mode is set. When the evaluation time is 1200 seconds or more, the rapid return mode is set.

When the jam is repaired or the air curtain 100 is operated, the inside of the window can be maintained in a low humidity state within 300 seconds. As a result, even if the window portion is closed and the electronic component transfer device 2 resumes the handler operation of the IC device 13 after the jam repair work is completed, frost does not occur. On the other hand, in the case of 300 seconds or more, it becomes difficult to maintain the inside of the window portion in a low humidity state. There is a possibility that the outside high humidity air may be mixed into the window. In this case, the control unit 4 issues an alert for the return mode for defrosting before restarting the handler operation of the IC device 13, and the return mode is performed. In the return mode, the dry air 104 is supplied into the window to remove the high humidity area and suppress frost formation. In addition, the dry air 104 melts the frost on the already frosted portion to remove water.

The amount of dry air 104 used is not particularly limited, but is 50 liters in the minimum mode, 100 liters in the jam recovery mode, and 200 liters in the rapid recovery mode. The time for performing the recovery mode is not particularly limited, but is 5 to 10 minutes in the minimum mode, 10 to 15 minutes in the jam recovery mode, and 15 to 20 minutes in the rapid recovery mode. In either mode, the humidity after the return mode is less than 0.1%.

For the selection of the return mode, whether the mode selection unit 173 automatically selects or the user selects it is set in advance. When the user selects it, the recommended return mode is displayed on the monitor 6 and the user selects it on the operation panel 7.

When the mode selection unit 173 is set to automatically select, in step S4 of selecting one of the return modes, the number of windows opened, the time opened, and the location of the windows are weighted. The mode selection unit 173 of the control unit 4 selects one of the return modes based on the calculation result.

According to this method, the mode selection unit 173 selects one of the return modes by performing an operation including parameters of the number of windows, the time opened, and the weighting corresponding to the location of the windows. Therefore, the control unit 4 can select a return mode according to changes in temperature and humidity.

Next, in the return mode implementation step of step S5, the implementation contents in each mode will be described with an example of the soak plate 21. Since the same return mode is implemented in other places, the description thereof will be omitted.

FIG. 12 shows the flow of the dry air 104 in the soak plate 21 in the minimum mode and the jam recovery mode. “(O)” of the solenoid valve indicates a state in which the solenoid valve is open. “(C)” of the solenoid valve indicates a state in which the solenoid valve is closed. The seventh solenoid valve 151, the eighth solenoid valve 152, and the ninth solenoid valve 153 are closed. The other solenoid valves are open.

In the minimum mode and the jam recovery mode, a part of the dry air 104 supplied by the refrigerator 10 passes through the first soak plate 21a and the second soak plate 21b and enters the dry purge 20. A part of the dry air 104 supplied by the refrigerator 10 directly enters the dry purge 20 through the sixth pipe 132. Dry air 104 is supplied from the dry purge 20 to the first outlet 125, the second outlet 127, and the third outlet 119. The first outlet 125, the second outlet 127, and the third outlet 119 inject dry air 104. Since the air around the soak plate 21 is replaced by the injection of the dry air 104, the humidity is lowered.

For example, the temperature of the dry air 104 ejected from the first outlet 125 and the second outlet 127 is −10 ° C. to −20 ° C., and the dry air 104 keeps the soak plate 21 at a low temperature. The temperature of the dry air 104 ejected from the third outlet 119 is 10 degrees. The dry purge 20 can adjust the temperature of the dry air 104 and supplies the defrostable dry air 104.

Jam recovery mode takes longer to recover than minimum mode. Specifically, the jam recovery mode takes 1.5 times longer than the minimum mode.

FIG. 13 shows the flow of the dry air 104 in the soak plate 21 in the rapid return mode. All solenoid valves are open. In the rapid return mode, the first outlet 125, the second outlet 127, and the third outlet 119 inject dry air 104. Further, the dry air 104 is supplied from the dryer 30 to the fourth outlet 126, the fifth outlet 128, and the sixth outlet 120. The fourth outlet 126, the fifth outlet 128, and the sixth outlet 120 inject dry air 104.

The temperature of the dry air 104 ejected from the fourth outlet 126 and the fifth outlet 128 is −10 ° C. to −20 ° C., and the dry air 104 keeps the soak plate 21 at a low temperature. The temperature of the dry air 104 ejected from the sixth outlet 120 is 10 degrees. Although not particularly limited, the dryer 30 supplies up to 200 liters of dry air 104. When the capacity of the refrigerator 10 is high, it is not necessary to install the fourth outlet 126 and the fifth outlet 128.

The first outlet 125 to the sixth outlet 120 inject dry air 104. Therefore, the air around the soak plate 21 is replaced by the injected dry air 104, so that the humidity drops even faster.

The valve control unit 171 of the control unit 4 may change the blowout amount of the dry air 104 depending on each mode. According to this configuration, the consumption of the dry air 104 is reduced when the change in temperature and humidity is small. Therefore, the amount of dry air 104 used can be reduced as compared with the case where the rapid return mode, which consumes a large amount of dry air 104, is constantly performed.

The valve control unit 171 of the control unit 4 may change the injection port for blowing out the dry air 104 depending on each mode. According to this configuration, the injection port of the dry air 104 changes in the minimum mode, the jam recovery mode, and the rapid recovery mode. In the rapid return mode, the dry air 104 is concentrated in the place where the dry air 104 is required. Therefore, the electronic component transfer device 2 can suppress the occurrence of problems such as frost formation and dew condensation due to changes in humidity.

The heater control unit 179 of the control unit 4 may change the temperature at which the dry air 104 is blown out depending on each mode. According to this configuration, the temperature of the dry air 104 changes in the minimum mode, the jam recovery mode, and the rapid recovery mode. In the rapid return mode, dry air is supplied at a temperature that restores the temperature when a problem occurs due to a temperature change. Therefore, the electronic component transfer device 2 can suppress the occurrence of problems due to changes in temperature.

Second Embodiment In the first embodiment, the first release button 112 to the seventh release button 118 are arranged on the back side of the electronic component transfer device 2. There may be only one release button on the back side. Set the window that opens when the release button on the back side is pressed on the monitor 6. When the IC device 13 requiring maintenance is detected by the sensor and the release button on the back side is pressed, the window portion in a place where maintenance is easy may be opened. Specifically, the window portion shown in the column of “Candidate for window portion to be opened when jam occurs” in FIG. 10 may be opened. Since there are few release buttons, operability can be improved.

Third Embodiment In the first embodiment, a large number of third outlets 119 and sixth outlets 120 are installed in each area. The number of the third outlet 119 and the sixth outlet 120 installed in each area may be small. Dry air 104 may be supplied to each region.

Fourth Embodiment In the first embodiment, the ionizer 95 is arranged inside the fourth opening / closing portion 53 and outside the fourth air curtain device 68. When charging the opening / closing portion is not a problem, the ionizer 95 may be installed only inside the opening / closing portion. The number of ionizers 95 installed can be reduced.

Fifth Embodiment In the first embodiment, the dry air 104 supplied to the internal pipe 123 directly heated the soak plate 21. The soak plate 21 may include a heater. The soak plate 21 may be heated only by the dry air 104, or may be heated only by the heater. Both the dry air 104 and the heater may heat the soak plate 21. The electronic component transfer device 2 can select a method of heating the soak plate 21 according to the temperature rise time.

2 ... Electronic component transfer device as a device transfer device, 4 ... Control unit, 13 ... IC device as a device, 43 ... Memory as a storage unit, 49a ... First window unit as a cover, 51a ... Second as a cover. Window portion, 52a ... 3rd window portion as a cover, 53a ... 4th window portion as a cover, 54a ... 5th window portion as a cover, 55a ... 6th window portion as a cover, 56a ... 7th window portion as a cover Window, 104 ... dry air, 119 ... third outlet as an injection port, 120 ... sixth outlet as an injection port, 125 ... first outlet as an injection port, 126 ... fourth outlet as an injection port 127 ... Second outlet as an injection port, 128 ... Fifth outlet as an injection port.

Claims (7)

A device transfer device with multiple covers and dry air injection ports.
A storage unit that stores a plurality of return modes in which the combination of the dry air ejection amount and the injection port for ejecting the dry air is different, and
When a jam occurs, one of the return modes executed after the cover is closed based on the number of the covers opened and the opening time is one of the return modes of the storage unit. Has a control unit to select from
The control unit is a device transfer device that further adjusts the temperature and humidity specified in the selected return mode. The device transporting device according to claim 1.
The return mode is the minimum mode selected when the number of opened covers is small and the opening time is short.
The rapid return mode, which is selected when the number of opened covers is large and the opening time is long,
A device transfer device comprising a jam return mode intermediate between the minimum mode and the rapid return mode. The device transfer device according to claim 2.
A device transfer device characterized in that the amount of dry air blown out is changed according to each mode. The device transfer device according to claim 2.
A device transfer device characterized in that the injection port for blowing out dry air is changed depending on each mode. The device transfer device according to claim 2.
A device transfer device characterized by changing the temperature at which dry air is blown out depending on each mode. It is a recovery processing method from jam executed by the control unit of the device transfer device.
Identify the cover that corresponds to the location of the jam on the device to be inspected.
Unlock the cover corresponding to the location where the jam occurred and
Recognize the number of covers opened by the user, measure the time opened, and
Based on the number of covers and the time they have been opened, select one of the multiple return modes to perform after closing the covers.
A method for recovering from a jam, which comprises automatically executing the selected recovery mode. The method for recovering from jam according to claim 6.
In the step of selecting one of the return modes, an operation including parameters of the number of opened covers, the time opened, and the weight corresponding to the location of the cover is performed, and the return is performed based on the calculation result. A method of recovering from a jam, which comprises selecting one of the modes.

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