JPH09153530A - Inspection device with high cleanliness - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently remove particles from the inside of a device main body by providing a blowing means for making a horizontal air flow which flows through the internal space of the device main body from its one side toward its opposite side in its one side and providing a means for discharging the horizontal air flow in its opposite side. SOLUTION: A first FFU 14 for making a side flow which flows from a receiving space 2 to a conveyance space 4 is provided in front of the receiving space 2, and at the same time a second FFU 15 for making an air side flow which flows from the front side of an inspection space 6 to the rear side is provided on the front side of the inspection space 6, and also a discharge duct 16 for discharging the side flow of the respective spaces is provided in the conveyance space 4 and the inspection space 6. Therefore, even when there is a resistant body such as a pin set 3 and a, wafer chuck 5, a resistance area is small and turbulence in the side flow can be suppressed, and even when particles are generated from a driving part which is inside a device main body 7, the particles are efficiently removed through the discharge duct 16, thereby being able to enhance the cleanliness.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection device having a high degree of cleanliness, and more particularly to an inspection device in which the degree of cleanliness of the internal space of the inspection device for electrically inspecting an object to be processed such as a semiconductor wafer is improved. .

[0002]

2. Description of the Related Art A conventional inspection apparatus normally contains a storage unit for storing an object to be processed such as a semiconductor wafer loaded in a cassette unit and an object to be processed in a cassette adjacent to the rear of the storage unit. It comprises tweezers, a mounting table for receiving and transferring the object to be processed conveyed by the tweezers, and a probe card for making an electrical inspection by bringing a contact such as a probe needle into contact with the object to be processed on the mounting table. Has been done. Then, the object to be processed is taken out from the cassette by tweezers and pre-aligned. Next, the object to be processed is transferred to the mounting table by tweezers, and the mounting table is further moved to X, Y,
And the θ direction to align the object to be inspected with the inspection position, and then overdrive the mounting table in the Z direction to bring the object into contact with the contactor and receive a signal from the tester to receive a predetermined electric signal. Conducting a physical examination.

Conventionally, an inspection apparatus has been used for electrically inspecting an integrated circuit formed in a previous step such as a film forming step or an etching step as described above. However, it is desirable to inspect the object to be processed in an inspection environment in which particles are not generated as much as possible. However, since a transport mechanism, a drive mechanism for the mounting table, and the like are present in the inspection apparatus, particles such as dust are generated from these drive mechanisms, although they are small. Therefore, conventionally, the inspection apparatus is equipped with an exhaust fan or the like to exhaust the air in the apparatus body and prevent heat accumulation in the apparatus body.

Further, the inspection apparatus generally inspects the object having the integrated circuit formed on the surface as described above, but some inspection apparatuses have special uses. For example, in order to check whether or not the equipment of each process operates according to its original performance before constructing a semiconductor manufacturing plant and starting up the pre-process to put it into full operation The body may be sampled and the object to be processed may be inspected. In such a case, the object to be processed may be returned to the original process after the inspection by the inspection device, and the subsequent processing may be subsequently performed. Therefore, if particles adhere to the object returned to the processing step, there is a possibility that the subsequent processing cannot be evaluated properly. In the case of the inspection device which is used in this way, special measures against particles are required. Therefore, for example, there is a device in which a downward flow of air is created in the apparatus body to prevent particles in the apparatus body from adhering to the object to be processed. The particles are dust, metal, organic matter,
It is a general term for suspended particles such as dust generated from the human body.

[0005]

However, in the case of the conventional inspection device that creates a downward flow of air in the main body of the device,
Although a downward flow of air is created to exhaust particles, the cassette, tweezers, mounting table, etc. occupy most of the area inside the main body of the device, and these act as resistors of the downward flow and disturb the downward flow. There is a problem that a flow is generated, and the particles flow up due to this turbulent flow, and the particles cannot be effectively discharged and removed from the inside of the apparatus main body. In addition, since the particles that have soared in the apparatus main body cannot be effectively removed, even if the particles of the object to be processed are blown off and removed by the downward flow, the particles that have soared are reattached, and eventually the particles adhere to the object to be treated. There was a problem.

The present invention has been made to solve the above problems, and even if particles such as dust are generated in the main body of the apparatus or the particles enter the main body of the apparatus, the particles are not It is an object of the present invention to provide an inspection device having a high degree of cleanliness, which can be effectively discharged and removed from the main body and can prevent particles from adhering to the object to be processed.

[0007]

DISCLOSURE OF THE INVENTION As a result of various studies on the cause and behavior of particles such as dust in an inspection apparatus, the inventors of the present invention created an air flow in a specific direction in the apparatus main body. It was found that particles can be effectively removed from inside.

The present invention has been made on the basis of the above findings, and an inspection apparatus according to a first aspect of the present invention includes a storage section for storing the object to be processed, and a transfer mechanism for transferring the object to be processed in the storage section. In a testing device provided with a mounting table on which the processing target transported by this transportation mechanism is mounted, and a contactor for contacting the processing target on the mounting stage and performing an electrical test of the processing target in the apparatus main body, A blower means for producing a horizontal air flow flowing from the one side surface to the opposite side surface in the space in the apparatus main body is provided on the one side surface, and at least the opposite side surface is provided with an exhaust means for discharging the horizontal air flow. It is characterized by that.

The inspection apparatus according to a second aspect of the present invention is the inspection apparatus according to the first aspect, wherein the apparatus body is
An accommodation space for accommodating an object to be processed, a transfer space arranged behind the accommodation space and for transferring the object to be processed by a transfer mechanism, and an object to be processed are transferred on a mounting table via a transfer mechanism in the transfer space. And an inspection space for electrically inspecting the object to be processed on the mounting table, and the blower means is a first blower means arranged on the front side of the storage space and the front side of the inspection space. And a second air blower disposed in the.

The inspection apparatus according to a third aspect of the present invention is the inspection apparatus according to the second aspect, characterized in that a partition member is provided to partition the storage space and the transfer space from the inspection space. It is a thing.

The inspection apparatus according to a fourth aspect of the present invention is the inspection apparatus according to the first or third aspect of the present invention, in which a dust removing chamber surrounding the apparatus main body is provided, and the dust removing chamber is located below the top surface of the dust removing chamber. It is characterized in that a third blower means for producing a dust-free air flow flowing toward the side is provided.

The inspection apparatus according to a fifth aspect of the present invention is the inspection apparatus according to any one of the second to fourth aspects, wherein an air introducing member is provided in an opening on the upper surface of the storage space. The air is taken in through the air introduction portion and the opening.

Further, an inspection apparatus according to a sixth aspect of the present invention is characterized in that, in the invention according to the fifth aspect, the pressure inside the dust removing chamber is set higher than the pressure outside thereof. .

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below based on the embodiments shown in FIGS. As shown in FIG. 1, the inspection apparatus according to the present embodiment is provided with a storage space 2 for storing a cassette K in which, for example, 25 semiconductor wafers 1 are stored as objects to be processed, and is arranged behind the storage space 2. A semiconductor wafer 1 is transferred to and from the wafer chuck 5 via the tweezers 3 in the carrier space 4 for carrying the semiconductor wafer by a carrier mechanism, for example, two upper and lower tweezers 3, and the semiconductor wafer 1 on the wafer chuck 5. And an inspection space 6 for performing an electrical inspection by bringing a contactor (not shown) such as a probe into contact therewith, and is installed in a clean room. A space inside the apparatus main body 7 is formed by the spaces 2, 4, and 6. The storage space 2 and the transportation space 4 are separated from the inspection space 6 by a plastic partition plate 8 made of a transparent acrylic plate or the like. The drive mechanism such as the tweezers 3 and the wafer chuck 5 is driven under the control of a controller (not shown).

An indexer (not shown) is arranged in the storage space 2 so as to be able to move up and down, and the indexer 3 moves the semiconductor wafer 1 in the cassette K with the tweezers 3 at a position where the indexer moves up and down by a predetermined amount under the control of the controller. The semiconductor wafer 1 is transferred in and out of the wafer chuck 5. Further, a rectangular opening 2A is formed on the upper surface of the storage space 2, and the opening 1A on the front side (front side in FIG. 1) of the opening 2A is formed.
Partitions 9 are erected as air introducing members on three sides excluding the sides, and a downward flow of air (arrow A in FIG. 1) is introduced into the storage space 2 through the partition 9 and the opening 2A. ing. Further, when the cassette K is placed on the indexer at the ascending end, the partition 9 surrounds three surfaces other than the front surface of the cassette K.

The tweezers 3 in the transfer space 4 are configured to be movable back and forth and rotatable in the θ direction so that the semiconductor wafer 1 in and out of the cassette K can be taken in and out and the wafer chuck 5 in the adjacent inspection space 6 can be moved. The semiconductor wafer 1 is conveyed between the wafers, and the semiconductor wafer 1 is exchanged with the wafer chuck 5. Although not shown, a sub-chuck is arranged in the transfer space 4, the semiconductor wafer 1 taken out by the tweezers 3 is placed on the sub-chuck, and the semiconductor wafer 1 is transferred to the inspection space 6 immediately before the transfer. The wafer 1 is pre-aligned.

The wafer chuck 5 can be moved up and down and θ
It is configured to be rotatable in the direction, and is arranged on the X table 10. The X table 10 can be moved back and forth in the X direction Y
It is arranged on the table 11, and the Y table 11 is arranged on the base 12 so as to be capable of reciprocating in the Y direction. Further, in the inspection space 6, an alignment bridge 13 which constitutes an alignment mechanism is disposed so as to traverse above and below the wafer chuck 5 in the left-right direction and to be capable of reciprocating in the front-rear direction, and the semiconductor wafer 1 is placed on the wafer chuck 5. When the wafer chuck 5 is moved, the alignment bridge 13 advances above the wafer chuck 5, and while the wafer chuck 5 moves in the X, Y, and θ directions, the semiconductor wafer 1 is aligned with a predetermined inspection position by using a CCD camera or the like (not shown). I am doing it.

By the way, as shown in FIG.
As shown in FIG. 1, first and second fan filter units (hereinafter, referred to as “FFU”) 1 as the first and second air blowing means.
4 and 15 are provided, and these FFUs 14 and 15 create a horizontal flow from the front side to the back side in the space inside the apparatus main body 7. The first and second FFUs 14 and 15 are composed of the same constituent members. In addition, a horizontal flow in the device body 7 (see FIG.
Of the first and second FFUs 14 and 15 are exhaust ducts 16 as exhaust means for exhausting the arrow B and the arrow C) of FIG.
It is arranged so as to substantially match the height of. This exhaust means has an exhaust fan (not shown), and the exhaust fan exhausts the horizontal airflow in the apparatus main body 7 through the exhaust duct 16.

The first FFU 14 is, for example, as shown in FIG. 2, a blower 14 for blowing air from the lower side to the upper side.
A and a filter arranged in front of the storage space 2, for example, a ULPA filter (Ultra Low Penetoration Air-fil)
ter) 14B and a casing 14C for accommodating them, the air blown from the blower 14A is dedusted by the ULPA filter 14B, and the air after dedusting is conveyed from the front of the accommodating space 2 as indicated by the arrow in the figure. It is configured to create a so-called side flow of air that flows horizontally behind the space 4. Further, the second FFU 15 is adapted to create a side flow of air in the inspection space 6 from the front side to the back side. The flow velocity of the air flow by the first and second FFUs 14 and 15 is controlled by the control device to be a flow velocity suitable for removing particles, for example, 0.3 to 0.5 m / sec. Although not shown, an opening through which the dust-removed air flows is formed on the wall surface in front of the storage space 2. In FIG. 2, internal components are omitted and only the air flow is shown.

Further, the exhaust duct 16 is provided in the storage space 2
Is formed in a substantially L shape so as to extend from the right side surface to the entire rear surface of the transport space 4 and the inspection space 6. The boundary surface between the exhaust duct 16 and the apparatus main body 7 is formed by, for example, the punching plate 16A.
The horizontal airflow is discharged via the flow path as shown by arrows D, E, and F in FIG. That is, the dust-free air blown into the storage space 2 passes through the cassette K and the partition 9
The air that has flowed in from the chamber is entrained, and is discharged to the outside from the punching plate on the right side surface of the transfer space 4 via the exhaust duct 16. This exhaust flow merges with the exhaust flow flowing from the inspection space 6 through the punching plate 16A and the exhaust duct 16, and is discharged to the outside of the apparatus main body 7 as indicated by an arrow F. The exhaust duct 16
May be connected to another exhaust duct to be discharged to the outside of the clean room. If necessary, the first FFU
It is also possible to remove the dust of the air by 14 and then return it to the inside of the apparatus main body 7 for recycling.

Further, as shown in FIG. 3, a separating plate 18 for separating the tweezers 3 from the board 17 is arranged on the back side of the tweezers 3, and the separating plate 18 allows the air flow in the carrying space 4 to flow on the right side surface thereof. The particles are discharged to the exhaust duct 16 to isolate thermal convection due to heat generation of the board 17 and prevent particles from adhering to the semiconductor wafer 1 from the board 17.

Further, as shown in FIG. 6, the partition plate 8 for partitioning the storage space 2 and the transfer space 4 from the inspection space 6 is used by the tweezers 3 to transfer the semiconductor wafer 1 to the wafer chuck 5 or the wafer chuck 5. Upper semiconductor wafer 1
Is formed with an opening 8A for receiving. In the opening 8A, for example, a single-sided door 8B hinged on the lower side is attached so as to be openable and closable as shown by an arrow in the figure, and the tweezers 3 transfer the semiconductor wafer 1 to and from the wafer chuck 5. Only at this time is the door 8B opened by a drive mechanism such as an air cylinder under the control of the controller. Therefore, when the semiconductor wafer 1 is not exchanged between the tweezers 3 and the wafer chuck 5, the door 8B is closed to partition the storage space 2, the transfer space 4 and the inspection space 6, and the air flow in the space on both sides of the partition 8 is generated. It can be controlled individually.

As shown in FIG. 5, a thin (for example, 35 mm) HEPA filter (High Efficiency Particulate Air-filter) 20 is provided in the opening of the bottom surface 19 of the inspection space 6.
The HEPA filter 20 removes dust from the descending flow disturbed by the resistor such as the wafer chuck 5 and then discharges it to the outside (clean room).

Further, as shown in FIG. 6, rounded portions 21 are provided at four corners of the inspection space 6, and the rounded portions 21 allow the side flow to smoothly flow along the inner surface of the inspection space 6. It is designed to prevent the accumulation of particles in the. Although not shown, such a roundness 20 is also provided at the corners of the storage space 2 and the transfer space 4.

Around the wafer chuck 5 shown in FIG.
As shown in FIG. 4, by mounting the ring-shaped flow straightening member 22 whose wall thickness gradually increases from the outer circumference to the inner circumference, the laminar flow state of the side flow in the inspection space 6 is moved to the downstream side without disturbing as much as possible. It is possible to smoothly flow and suppress the scattering of particles in the inspection space 6.

Next, the operation will be described. First, for example, an operator places the cassette K on the indexer in the storage space 2. After that, when the blower 14A of the first and second FFUs 14 and 15 is driven, the air in the clean room is sucked from the blower 14A into the housing 14C. The air is dusted by the ULPA filter 14B and the like, and then blown into the respective spaces from the openings of the storage space 2 and the inspection space 6. After the indexer moves up and down in the storage space 2 and stops at a predetermined position, the tweezers 3 are driven to take out the predetermined semiconductor wafer 1 from the cassette K.

At this time, the storage space 2 is formed by the first FFU 14.
Inside, a side flow of air is formed from the front to the back. This side flow traverses the cassette K in the storage space 2 in the front-rear direction, and also traverses the tweezers 3 in the transport space 4 in the front-rear direction with the air in the clean room introduced from the partition 9 to isolate the rear side of the tweezers 3. It collides with the plate 18. At this time, since the partition plate 8 is located on the left side of the transfer space 4, the side flow is turned to the right side surface to move from the punching plate 16A to the exhaust duct 16
Leaks to

Even if particles are generated in the drive mechanism such as the tweezers 3, such particles flow to the downstream side of the semiconductor wafer 1 by the side flow, and moreover, at the corners of the storage space 2 and the transfer space 4. Since it is rounded, it flows along the roundness at the corner,
The particles are smoothly discharged to the exhaust duct 16 without staying in the transfer space 4.

As described above, since the air flow is a side flow in the storage space 2 and the transfer space 4, the cassette K
Disturbance of side flow due to or tweezers 3 is suppressed,
The particles can be smoothly discharged to the exhaust duct 16. Further, even if particles such as dust caused by an operator intrude through the opening 2A or particles are generated by driving the tweezers 3 or the like, these particles adhere to the semiconductor wafer 1 along with the side flow of air. The particles will soon be discharged to the exhaust duct 16 and the particles can be prevented from staying in the storage space 2 and the transfer space 4. Tweezers 3 in this state
When is transferred from the cassette K to the inspection space 6, the door 8B of the partition plate 8 is opened and the opening 8A is opened.

At this time, the wafer chuck 5 is placed in the inspection space 6.
Is already waiting at the position for receiving the semiconductor wafer 1.
Therefore, when the tweezers 3 rotate 90 ° in the θ direction to change the direction from the cassette K to the inspection space 6 and advance from the opening 8A of the partition plate 8 into the inspection space 6, the semiconductor wafer 1 is directly above the wafer chuck 5. I come to. At this time, the lifting pins (not shown) of the wafer chuck 5 are raised, and the wafer chuck 5 receives the semiconductor wafer 1 from the tweezers 3.

At this time, in the inspection space 6, the second FFU 15
Thus, a side flow of air is formed in the inspection space 6 from the front surface to the back surface. This side flow crosses the tweezers 3 and the wafer chuck 5 when the semiconductor wafer 1 is transferred, and flows out from the punching plate 16A to the exhaust duct 16. Further, since the corner 21 of the inspection space 6 is provided with the roundness 21, the side flow flows along the roundness 21 at the corner, and the flow smoothly flows to the exhaust duct 16 without staying. Further, as shown in FIG. 7, by mounting the rectifying member 22 on the outer periphery of the wafer chuck 5, the side flow above and below the wafer chuck 5 smoothly flows along the surface of the semiconductor wafer 1 without being disturbed.

Since the side flow of air is formed in the inspection space 6 as described above, the resistance due to the wafer chuck 5 and the tweezers 3 is relatively small, the disturbance of the side flow in the inspection space 6 is suppressed, and the particles are suppressed. Is smoothly discharged to the exhaust duct 16. Also, the wafer chuck 5
Even if particles such as dust are generated by driving the
Such particles flow to the downstream side of the semiconductor wafer 1 by the side flow, and since the corners of the storage space 2 and the transfer space 4 are rounded, the particles flow along the roundness 21 at the corners. The exhaust gas is discharged to the exhaust duct 16 along with the side flow without staying in the inspection space 6. Further, the wafer chuck 5,
Even if the side flow is disturbed by the resistance of the X and Y tables 10 and 11, a part of the side flow is the HEPA filter 1 on the bottom surface 18.
Since it flows out from the outside, the influence of turbulence is reduced.

As described above, according to the present embodiment,
The first FFU 14 that creates a side flow that flows from the storage space 2 toward the transport space 4 is provided in the front of the storage space 2, and the second FFU 15 that creates a side flow of air that flows from the front to the rear of the inspection space 6 is included in the inspection space 6. Since the exhaust duct 16 provided on the front side and discharging the side flow of each space is provided in the transport space 4 and the inspection space 6,
Even if there are resistors such as the tweezers 3 and the wafer chuck 5, the resistance area is small, and the turbulent side flow can be suppressed. As a result, dust from the drive unit such as the tweezers 3 and the wafer chuck 5 can be suppressed in the apparatus main body 7. Even if particles such as the above are generated, the particles can be effectively removed from the inside of the apparatus main body through the exhaust duct 16 by the side flow, and the cleanliness can be improved.
It is possible to effectively prevent particles from adhering to the surface. Therefore, it is possible to prevent particles from adhering to the semiconductor wafer 1 after the inspection, and it can be effectively used for performance evaluation of various devices in the pre-process of semiconductor manufacturing.

Further, according to this embodiment, since the partition plate 8 for partitioning the storage space 2 and the transfer space 4 from the inspection space 6 is provided, the flow velocity of the side flow of the storage space 2 and the transfer space 4 and the side of the inspection space 6 are increased. The flow velocity of the flow can be controlled individually, and the flow velocity of the side flow in each space can be optimally controlled.

Further, according to this embodiment, since the partition 9 is provided in the opening 2A on the upper surface of the storage space 2 and the air is taken in through the partition 9 and the opening 2A, the storage space 2 and the transfer space are formed. First in four
The air volume of the FFU 14 can be reduced.

Further, the inspection apparatus of the above-mentioned embodiment, as shown in FIG. 8, is a dust removing chamber (hereinafter referred to as "clean booth").
The cleanliness inside the apparatus main body 7 can be more effectively enhanced by configuring the closed system disposed inside 30. That is, the clean booth 30 includes a frame body 31 surrounding the apparatus body 7 and the frame body 3 as shown in FIG.
1, a side plate 32 made of a transparent acrylic plate or the like attached to the periphery of 1, and a plurality of FFUs 34 arranged on the top surface 33,
With a blower 35 that blows air to these FFUs 34,
For example, the cleanliness class 10 is maintained. These FFU34 and blower 3
The third blower means 36 is constituted by 5. Further, the exhaust duct 16 of the inspection apparatus is connected to the suction duct of the blower 35 so that the air exhausted from the inside of the apparatus main body 7 is circulated and used.

Although not shown, an opening / closing door is provided on the side plate 32 on the front side of the apparatus main body 7, and the opening / closing door is opened when the semiconductor wafer 1 is taken in and out of the apparatus main body 7. The cassette K can be carried in and out at a portion. The pressure in the clean booth 30 is slightly higher than that in the clean room, for example, 0.2 to 0.3 m.
Only mH ₂ O can be set to a high positive pressure.

Therefore, in the case of the present embodiment, when the third blowing means 36 of the clean booth 30 is driven and the blowers of the first and second FFUs 14 and 15 of the inspection device are driven, the dust removal by the FFU 34 is performed inside the clean booth 30. The rear air flows downward from the top surface 33 to create a downflow. At this time, the air inside the clean booth 30 is adjusted to the cleanliness class 10 by the FFU 34 of the third blowing means 36. Further, since the pressure inside the clean booth 30 is higher than that of the clean room, it is possible to prevent the inflow of air from the clean room, and the cleanliness inside is set to the cleanliness class 10 without being influenced by the cleanliness of the clean room. Can be held.

On the other hand, in the device body 7 of the inspection device, the first,
The second FFUs 14 and 15 form a side flow. In the storage space 2 of the apparatus main body 7, the downflow of air in the clean booth 30 flows from the opening 2A, merges with the sideflow there, and flows into the transfer space 4 as described above. Since the side flow behaves in the same manner as the case described above, its description is omitted.

Therefore, according to this embodiment, the clean booth 30 surrounding the apparatus main body 7 of the inspection apparatus is provided, and
Since the clean booth 30 is provided with the third blower means 36 that creates a downflow of the dust-removed air flowing downward from the top surface 33 of the clean booth 30, the inside of the clean booth 30 is maintained at a higher degree of cleanliness than the clean room, As a result, the cleanliness of the air in the device body 7 can be further improved, and the same effect as that of the above-described embodiment can be expected. Further, since the pressure in the clean booth 30 is set higher than the pressure in the clean room, it is possible to prevent the inflow of air from the clean room into the clean booth 30, and the inside of the clean booth 30 depends on the installation environment of the inspection device. The cleanliness class 10 can be maintained without being damaged. Further, since it is a closed system in which the air in the apparatus body 7 is circulated and used, even if particles are generated in the apparatus body 7, there is no possibility of being discharged into the clean room.

In order to more surely prevent the particles from adhering to the semiconductor wafer 1 during the inspection, for example, as shown in FIG.
A PA filter 41 may be additionally provided, and air may be sent to the ULPA filter 41 from the air pipe 42 so that the dust-removed air is blown onto the semiconductor wafer 1 on the wafer chuck 5. Alternatively, the ULPA filter may be formed in a ring shape, and the ULPA filter may be attached above the wafer chuck 5 to blow the dust-removed air to the entire circumference of the semiconductor wafer 1.

Further, in order to prevent scattering of particles from the particle generation source in the inspection space 6, for example, as shown in FIG. 10, a sliding portion 12A such as a guide rail of the alignment bridge 12 in the inspection space 6 is provided. On cover 5
1, the cover 51 may prevent particles generated in the sliding portion 12A from scattering. Similar measures can be taken for other sliding parts. In addition, a tape made of tetrafluoride resin or the like, which does not easily generate dust, may be attached to a sliding portion such as a cable bear received by the control cable of the wafer chuck 5 to prevent dust generation.

Further, the wafer chuck 5 is the semiconductor wafer 1
In the case of the hot chuck 5A that heats the semiconductor wafer 1 to a predetermined temperature and performs an electrical inspection thereof, the side flow of the air in the inspection space 6 causes a temperature distribution on the semiconductor wafer 1, which may prevent an accurate inspection at the predetermined temperature. There is. In such a case, as shown in FIGS. 11A and 11B, the windbreak cover 6 is provided on the upstream side of the side flow of the hot chuck 5A.
1, the windshield cover 61 prevents the side flow from directly hitting the semiconductor wafer 1 so that the temperature distribution of the semiconductor wafer 1 can be prevented.

[0044]

EXAMPLE In this example, a test was conducted to observe the particle removing effect of the inspection apparatus of the present invention. In this test, the measurement points a to h (in the storage space and the transfer space) and the measurement points 1 to 9 (in the inspection space) shown in FIGS. 12A and 12B of the conventional inspection apparatus and the inspection apparatus of the present invention are used.
Then, the distribution of particles in the air was measured, and the particles attached to the semiconductor wafer left in each space were measured. The measurement environment was measured under the installation conditions shown in FIG. 13, and the following measuring instruments were used for the measurement. The measurement results are shown in FIGS. 14 to 18. 13 to 18
In the above, A and C show the installation conditions of the conventional inspection apparatus, and B and D show the installation conditions of the inspection apparatus of the present invention. Further, as a conventional inspection device, a device provided with an exhaust fan on the back side of the device body was used.

[Measuring Equipment] Laser Particle Counter μLPC-110 (P
MS) air is aspirated at a suction rate of 1.0 ft ³ / min,
Air particles of 0.1 μm or more were measured twice per minute. Hot wire anemometer model 6521 (manufactured by Japan Canomax) Wafer surface defect inspection device Surfscan 6200
Particles of 0.2 μm or more on the surface of a semiconductor wafer (manufactured by Tencor) were measured with an edge cut of 5 mm.

FIG. 14 shows the measurement results of the number of particles in the air at each measurement point shown in FIG. 12 under the installation conditions A and B shown in FIG. According to this result, in the indexer in the storage space, almost no particles were detected in the conventional device and the device of the present invention with the cover open. However, when the cover is closed, it can be seen that the device of the present invention has a smaller number of particles. Further, in the transfer space or the inspection space having a driving mechanism such as tweezers or a wafer chuck, a significant difference in the number of particles between the conventional device and the device of the present invention is recognized. In the device of the present invention, most of the particles are exhausted and remain. On the other hand, in the case of the conventional apparatus, it is understood that the particles are difficult to be exhausted and many particles remain.

FIG. 15 shows the measurement results of the number of particles in the air at each measurement point shown in FIG. 12 under the installation conditions C and D shown in FIG. According to this result, in the indexer of the storage space, a large number of particles were detected by the particles entering the storage space in both the conventional device and the device of the present invention with the cover open. But,
When the cover is closed, the number of particles is reduced in both the conventional device and the device of the present invention, but it can be seen that the device of the present invention is significantly reduced and the particles are discharged. Also,
The same tendency as in FIG. 14 is recognized in the transfer space and the inspection space, and in the case of the device of the present invention, most of the particles are exhausted and the number of residual particles is extremely small.

FIGS. 16A and 16B show a semiconductor wafer for 12 hours on the indexer (storage space), tweezers (transfer space) and wafer chuck (inspection space) under the installation conditions A and B of FIG. 13, respectively. The measurement result of the number of particles attached to the abandoned semiconductor wafer is shown.
The inspection is 2 for each of the conventional device and the present invention device.
Each time, the results and the average value of two times are shown.
According to this result, as is clear from (b) of the figure showing the result of the device of the present invention, in comparison with (a) of the figure showing the result of the conventional device, any of the storage space, the transfer space and the inspection space is shown. Also, it can be seen that the number of particles attached to the semiconductor wafer is remarkably small. From this, it is understood that in the case of the device of the present invention, the particles are effectively discharged in any space and the particles hardly adhere to the semiconductor wafer.

FIG. 17 shows the case of the installation conditions A and B of FIG. 13 in which 25 semiconductor wafers are sequentially taken out from the respective cassettes, inspected for each, and then returned to the original position of the cassette. , The number of particles adhering to each of the semiconductor wafers at the cassette slot numbers 1, 13 and 24 (the bottom position of the cassette, the 13th position from the bottom and the 24th position from the bottom) is measured twice, The average value of the measurement results is shown.
For comparison, the wafer was left in a clean room for 60 minutes, and the measurement results of the number of particles attached to the wafer are shown. In this measurement, monitor wafers were used as the three semiconductor wafers, and dummy wafers were used as the other remaining wafers. According to the measurement results, the number of particles adhering to the wafer in the device of the present invention is considerably smaller than that in the conventional device, and the adhering amount is almost independent of the position in the cassette. Also,
It can be seen that the number of adhered particles is smaller than that left in the clean room.

FIG. 18 shows the measurement results obtained by performing the same measurement as in FIG. 17 for the installation conditions C and D in FIG. According to this result, it can be seen that the device of the present invention exhibits a remarkable effect as the cleanliness of the clean room is poor.

The present invention is not limited to the above embodiment. The point is that one side of the device body of the inspection apparatus is provided with a blowing means for producing a horizontal air flow flowing from that side to the opposite side, and at least an exhaust means for discharging the horizontal air is provided on the opposite side. if there is,
Included in the present invention.

[0052]

According to the first and second aspects of the present invention, even if particles such as dust are generated in the main body of the apparatus or the particles enter the main body of the apparatus. Further, it is possible to provide a highly clean inspection device capable of effectively discharging and removing the particles from the inside of the apparatus main body and preventing the particles from adhering to the object to be processed.

According to the third aspect of the present invention, it is possible to provide a highly clean inspection device capable of individually controlling the horizontal air flow in the storage space and the transfer space and the horizontal air flow in the inspection space. .

Further, according to the invention described in claim 4 of the present invention, it is possible to provide an inspection apparatus having a high degree of cleanliness and independent of the clean room.

Further, according to the invention described in claim 5 of the present invention, it is possible to provide a highly clean inspection device in which the amount of air blown in the storage space and the transfer space is reduced.

Further, according to the invention described in claim 6 of the present invention, it is possible to provide an inspection apparatus having a high degree of cleanliness in which particles are not likely to enter from the outside.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an inspection apparatus of the present invention.

FIG. 2 is a cross-sectional view for explaining an air flow of the inspection device shown in FIG.

FIG. 3 is a partial perspective view showing a main part of a transfer space of the inspection device shown in FIG.

FIG. 4 is a perspective view showing a partition plate between an inspection space and a storage space of the inspection device shown in FIG.

5 is a perspective view showing a bottom surface of an inspection space of the inspection device shown in FIG.

6 is a plan view showing an outline of an inspection space of the inspection device shown in FIG.

7 is a partial cross-sectional view showing a wafer chuck of the inspection device shown in FIG.

FIG. 8 is a perspective view showing another embodiment of the inspection device of the present invention.

FIG. 9 is a perspective view showing a wafer chuck that can be suitably applied to the inspection apparatus of the present invention.

FIG. 10 is a front view showing an alignment mechanism preferably applicable to the inspection device of the present invention.

11 (a) and 11 (b) are perspective views showing a wafer chuck that can be suitably applied to the inspection apparatus of the present invention.

12A is a plan view showing a plane position of a particle measurement point, and FIG. 12B is a front view showing a height position of a particle measurement point of FIG. 12A.

FIG. 13 is a list showing installation conditions of the inspection device of the present invention and the conventional inspection device when measuring particles.

14 is a graph showing measurement results of airflow particles under the installation conditions A and B shown in FIG.

15 is a graph showing measurement results of airflow particles under the installation conditions C and D shown in FIG.

16A is a graph showing the measurement results of particles adhering to the semiconductor wafer left in each space under the installation condition A shown in FIG. 13, and FIG. 16B is left in each space under the installation condition B shown in FIG. 7 is a graph showing the measurement results of particles attached to the formed semiconductor wafer.

FIG. 17 is a graph showing a result of measuring particles adhering to the semiconductor wafer in each slot in the cassette when the inspection apparatus under the installation conditions A and B shown in FIG. 13 is driven.

FIG. 18 is a graph showing a result of measuring particles adhering to the semiconductor wafer in each slot in the cassette when the inspection device under the installation conditions C and D shown in FIG. 13 is driven.

[Explanation of symbols]

 1 Semiconductor Wafer 2 Storage Space 2A Opening 3 Tweezers (Transfer Mechanism) 4 Transfer Space 5 Wafer Chuck (Mounting Table) 6 Inspection Space 7 Device Main Body 8 Partition Plate (Partitioning Member) 9 Partition (Air Introducing Member) 14 First Blower Means 15 Second blower means 16 Exhaust duct (exhaust means) 30 Clean booth (dust removal chamber) 36 Third blower means

Claims (6)

[Claims] 1. A storage unit for storing a target object, a transfer mechanism for transferring the target object in the storage unit, a mounting table for mounting the target object transferred by the transfer mechanism, and the mounting table. In an inspection apparatus equipped with a contactor for making an electrical inspection of the object to be processed on the inside of the apparatus main body, a horizontal air flow that flows through the space in the apparatus main body from one side surface to the opposite side surface. And an exhaust means for discharging the horizontal air flow on at least the opposite side surface. 2. The apparatus main body comprises a storage space for storing an object to be processed, a transfer space arranged behind the storage space and for transferring the object to be processed by a transfer mechanism, and a transfer mechanism for the transfer space. And a blower means provided on the front side of the accommodating space. The inspection apparatus according to claim 1, further comprising: an air blowing unit and a second air blowing unit disposed on a front side of the inspection space. 3. The inspection apparatus according to claim 2, further comprising a partition member for partitioning the storage space and the transfer space from the inspection space. 4. A dust removing chamber that surrounds the apparatus main body is provided, and a third blower means that creates a dust-free air flow that flows downward from the top surface of the dust removing chamber is provided. Alternatively, the inspection device according to claim 3. 5. The air introducing member is provided in an opening on the upper surface of the storage space, and air is taken in through the air introducing member and the opening. Inspection device described in. 6. The inspection apparatus according to claim 5, wherein the pressure inside the dust removing chamber is set higher than the pressure outside thereof.