TWI572869B - Electronic parts conveyor and electronic parts inspection device - Google Patents
Electronic parts conveyor and electronic parts inspection device Download PDFInfo
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- TWI572869B TWI572869B TW104122797A TW104122797A TWI572869B TW I572869 B TWI572869 B TW I572869B TW 104122797 A TW104122797 A TW 104122797A TW 104122797 A TW104122797 A TW 104122797A TW I572869 B TWI572869 B TW I572869B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
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Description
本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。 The present invention relates to an electronic component conveying device and an electronic component inspection device.
先前以來,已知有例如對IC(Integrated Circuit,積體電路)器件等電子零件之電氣特性進行檢查之電子零件檢查裝置,於該電子零件檢查裝置,組入有用以將IC器件搬送至檢查部之保持部之電子零件搬送裝置。於檢查IC器件時,將IC器件配置於保持部,使設置於保持部之複數個探針接腳與IC器件之各端子接觸。 In the prior art, for example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (Integrated Circuit) device is known, and the electronic component inspection device is incorporated to transfer the IC device to the inspection portion. The electronic component conveying device of the holding portion. When the IC device is inspected, the IC device is placed in the holding portion, and the plurality of probe pins provided in the holding portion are brought into contact with the respective terminals of the IC device.
關於此種IC器件之檢查,有將IC器件冷卻至特定溫度進行之情形。此情形時,將配置有IC器件之配置構件冷卻而將IC器件冷卻,並且使上述配置構件之周圍之環境之濕度(裝置內之濕度)降低,以不產生結露或結冰(覆冰)。 Regarding the inspection of such an IC device, there is a case where the IC device is cooled to a specific temperature. In this case, the arrangement member in which the IC device is disposed is cooled to cool the IC device, and the humidity of the environment around the above-described arrangement member (humidity in the device) is lowered to prevent condensation or ice formation (ice coating).
且說,有於電子零件搬送裝置之內部產生結露之情況,此情形時,作業者對結露進行確認,藉由作業者之操作,而進行用以去除該結露之加熱。藉此,可去除上述結露。 Further, there is a case where condensation occurs inside the electronic component conveying device. In this case, the operator confirms the condensation and performs heating to remove the condensation by the operator's operation. Thereby, the above condensation can be removed.
又,於專利文獻1中,記載有以如下方式構成之零件測試裝置(電子零件搬送裝置),即:具備腔室,該腔室係於內部具有用以將零件冷卻至低溫並進行測試之測試台,於腔室內產生溫度異常之情形時,停止冷卻,對腔室內進行加熱而恢復至常溫。於該專利文獻1中,藉由對腔室內進行加熱以恢復至常溫,可抑制腔室內產生結露。 Further, Patent Document 1 discloses a component testing device (electronic component conveying device) configured to have a chamber having a test for cooling a component to a low temperature and performing a test inside. When the temperature is abnormal in the chamber, the cooling is stopped, and the chamber is heated to return to normal temperature. In Patent Document 1, by heating the chamber to return to normal temperature, dew condensation in the chamber can be suppressed.
[專利文獻1]日本專利特開2000-9793號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-9793
然而,關於當在電子零件搬送裝置之內部產生結露時,藉由作業者之操作,進行用以去除該結露之加熱之情形,若作業者無法發現結露或判斷錯誤,則會於產生有結露之狀態仍進行IC器件之搬送。因此,有如下之虞:水附著於IC器件而導致短路,從而無法檢查,又,IC器件損壞。又,若於產生有結露之狀態下進行冷卻,則會產生結冰。 However, when condensation occurs inside the electronic component conveying device, the operator removes the heating of the condensation by the operation of the operator, and if the operator cannot find condensation or judges an error, condensation may occur. The state is still being transferred by the IC device. Therefore, there is a problem that water adheres to the IC device and causes a short circuit, so that it cannot be inspected, and the IC device is damaged. Further, if cooling is performed in a state where condensation is generated, ice formation occurs.
又,於上述專利文獻1中所記載之零件測試裝置中,於腔室內產生溫度異常之情形時,一律停止冷卻,對腔室內進行加熱以恢復至常溫,故而於原本無需使腔室內恢復至常溫之情形時、即於未產生結露之情形時,亦恢復至常溫。因此,有在重新開始動作之前需要較長時間之問題。 Further, in the component testing device described in Patent Document 1, when a temperature abnormality occurs in the chamber, the cooling is uniformly stopped, and the chamber is heated to return to the normal temperature, so that it is not necessary to return the chamber to the normal temperature. In the case of the case, that is, when condensation does not occur, the temperature is also restored to normal temperature. Therefore, there is a problem that it takes a long time before restarting the action.
又,由於在專利文獻1中所記載之零件測試裝置中,於腔室內產生溫度異常之情形時,使腔室內恢復至常溫,故而於因其他原因導致腔室內產生結露之情形時,無法去除該結露。 Further, in the component testing device described in Patent Document 1, when a temperature abnormality occurs in the chamber, the chamber is returned to the normal temperature. Therefore, when condensation occurs in the chamber due to other reasons, the removal cannot be performed. Condensation.
本發明之目的在於提供一種可自動地事先防止結露或結冰,又,於產生有結露或結冰之情形時,可將其去除的電子零件搬送裝置及電子零件檢查裝置。 An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can automatically prevent condensation or icing in advance and which can be removed when condensation or icing occurs.
本發明係為了解決上述問題之至少一部分而完成者,可作為以下之形態或應用例而實現。 The present invention has been made in order to solve at least a part of the above problems, and can be realized as the following aspects or application examples.
[應用例1] [Application Example 1]
本發明之電子零件搬送裝置之特徵在於包括:構成裝置之構 件;加熱部,其將上述構件加熱;濕度檢測部,其檢測濕度;及溫度檢測部,其檢測溫度;且於利用上述溫度檢測部所檢測出之溫度成為露點溫度之2倍以下之情形時,將上述構件加熱。 The electronic component conveying device of the present invention is characterized by comprising: a structure constituting the device a heating unit that heats the member, a humidity detecting unit that detects humidity, and a temperature detecting unit that detects a temperature; and when the temperature detected by the temperature detecting unit is twice or less the dew point temperature , heating the above components.
藉此,可自動地事先防止於構成電子零件搬送裝置之構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, condensation or icing can be prevented from being generated in advance in the member constituting the electronic component conveying device, and can be removed when condensation or icing occurs.
[應用例2] [Application Example 2]
於本發明之電子零件搬送裝置中,較佳為於利用上述溫度檢測部所檢測出之溫度成為露點溫度之0.5倍以上且2倍以下之情形時,將上述構件加熱。 In the electronic component conveying apparatus of the present invention, it is preferable that the member is heated when the temperature detected by the temperature detecting unit is 0.5 times or more and twice or less the dew point temperature.
藉此,可自動地事先防止於構成電子零件搬送裝置之構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, condensation or icing can be prevented from being generated in advance in the member constituting the electronic component conveying device, and can be removed when condensation or icing occurs.
[應用例3] [Application Example 3]
於本發明之電子零件搬送裝置中,較佳為與上述構件接觸之空氣之濕度低於與上述濕度檢測部接觸之空氣之濕度。 In the electronic component conveying apparatus of the present invention, it is preferable that the humidity of the air in contact with the member is lower than the humidity of the air in contact with the humidity detecting portion.
藉此,於溫度檢測部未安裝於上述構件之情形等時,當設定為上述構件之溫度低於溫度檢測部之周圍之溫度時,產生結露或結冰之概率變高,但藉由使上述構件之周圍之空氣之濕度變低,可使產生結露或結冰之概率變低。 Therefore, when the temperature detecting portion is not attached to the member or the like, when the temperature of the member is lower than the temperature around the temperature detecting portion, the probability of occurrence of dew condensation or icing becomes high, but by the above The humidity of the air around the component becomes low, which reduces the probability of condensation or icing.
[應用例4] [Application Example 4]
於本發明之電子零件搬送裝置中,較佳為上述溫度檢測部配置於上述構件。 In the electronic component conveying apparatus of the present invention, it is preferable that the temperature detecting unit is disposed in the member.
藉此,可直接測定上述構件之溫度,又,可藉由於忌結露之部分配置上述溫度檢測部,而事先防止於該忌結露之部分產生結露或結 冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, the temperature of the member can be directly measured, and the temperature detecting portion can be disposed by the portion where the condensation is prevented, thereby preventing condensation or knot from being formed in the portion of the condensation. Ice, in addition, can be removed in the event of condensation or icing.
[應用例5] [Application 5]
於本發明之電子零件搬送裝置中,較佳為上述構件配置於上述電子零件搬送裝置之被控制為特定濕度之室內。 In the electronic component conveying apparatus of the present invention, it is preferable that the member is disposed in a room controlled to a specific humidity of the electronic component conveying device.
藉此,可事先防止於尤其不欲產生結露或結冰之上述構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, condensation or icing can be prevented in advance in the above-mentioned members which are not particularly intended to cause condensation or icing, and can be removed when condensation or icing occurs.
[應用例6] [Application Example 6]
於本發明之電子零件搬送裝置中,較佳為上述加熱部包含電熱線。 In the electronic component conveying apparatus of the present invention, it is preferable that the heating unit includes a heating wire.
藉此,可容易且迅速地去除結露或結冰。 Thereby, condensation or icing can be easily and quickly removed.
[應用例7] [Application Example 7]
於本發明之電子零件搬送裝置中,較佳為上述加熱部包含送風源。 In the electronic component conveying apparatus of the present invention, it is preferable that the heating unit includes a blower.
藉此,可更容易且迅速地去除結露或結冰。 Thereby, condensation or icing can be removed more easily and quickly.
[應用例8] [Application Example 8]
於本發明之電子零件搬送裝置中,較佳為上述加熱係於上述電子零件搬送裝置之室內之濕度成為特定之第1閾值以下之情形時停止。 In the electronic component conveying apparatus of the present invention, it is preferable that the heating is stopped when the humidity in the room of the electronic component conveying device is equal to or lower than a specific first threshold value.
藉此,可事先防止於上述構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, dew condensation or icing can be prevented from occurring in the above-mentioned members in advance, and when condensation or icing occurs, it can be removed.
[應用例9] [Application Example 9]
於本發明之電子零件搬送裝置中,較佳為上述加熱係於經過特定時間之情形時停止。 In the electronic component conveying apparatus of the present invention, it is preferable that the heating is stopped when a certain period of time elapses.
藉此,事先防止於上述構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, condensation or icing is prevented from occurring in the above-mentioned members in advance, and when condensation or icing occurs, it can be removed.
[應用例10] [Application Example 10]
本發明之電子零件搬送裝置之特徵在於包括:構成裝置之構件;及加熱部,其將上述構件加熱;且於成為預定之條件之情形時,將上述構件加熱。 The electronic component conveying apparatus of the present invention is characterized by comprising: a member constituting the device; and a heating portion that heats the member; and when the predetermined condition is satisfied, the member is heated.
藉此,可自動地事先防止於構成電子零件搬送裝置之構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, condensation or icing can be prevented from being generated in advance in the member constituting the electronic component conveying device, and can be removed when condensation or icing occurs.
[應用例11] [Application Example 11]
於本發明之電子零件搬送裝置中,較佳為上述構件具有可配置電子零件且可進行冷卻之冷卻構件。 In the electronic component conveying apparatus of the present invention, it is preferable that the member has a cooling member that can dispose an electronic component and can be cooled.
藉此,可事先防止於上述冷卻構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, dew condensation or icing can be prevented from occurring in the above-described cooling member, and it can be removed when condensation or icing occurs.
[應用例12] [Application Example 12]
於本發明之電子零件搬送裝置中,較佳為上述條件係上述冷卻構件於已冷卻之狀態下被切斷電源、其後接通上述電源之情形。 In the electronic component conveying apparatus of the present invention, preferably, the condition is such that the cooling member is turned off in a cooled state, and then the power source is turned on.
藉此,可事先防止於上述冷卻構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, dew condensation or icing can be prevented from occurring in the above-described cooling member, and it can be removed when condensation or icing occurs.
[應用例13] [Application Example 13]
於本發明之電子零件搬送裝置中,較佳為上述條件係上述冷卻構件於已冷卻之狀態下被切斷電源,且自上述電源被切斷時起在預先設定之時間以內接通上述電源之情形。 In the electronic component conveying apparatus of the present invention, preferably, the cooling condition is that the cooling member is turned off in a cooled state, and the power source is turned on within a predetermined time from when the power source is turned off. situation.
藉此,可事先防止於上述冷卻構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, dew condensation or icing can be prevented from occurring in the above-described cooling member, and it can be removed when condensation or icing occurs.
[應用例14] [Application Example 14]
於本發明之電子零件搬送裝置中,較佳為上述冷卻構件之冷卻係使用液氮,且上述條件係上述液氮洩漏之情形。 In the electronic component conveying apparatus of the present invention, it is preferable that the cooling of the cooling member uses liquid nitrogen, and the above condition is a case where the liquid nitrogen leaks.
藉此,可事先防止預想外之部分被冷卻,於該部分產生結露或結冰之情況,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, it is possible to prevent the unexpected portion from being cooled in advance, and to cause condensation or icing in the portion, and to remove it when condensation or icing occurs.
[應用例15] [Application Example 15]
於本發明之電子零件搬送裝置中,較佳為上述條件係上述電子零件搬送裝置之至少一個室內之濕度為特定之第2閾值以上之情形。 In the electronic component conveying apparatus of the present invention, it is preferable that the humidity in at least one of the indoor components of the electronic component conveying device is equal to or greater than a specific second threshold.
藉此,可事先防止於上述構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, dew condensation or icing can be prevented from occurring in the above-mentioned members in advance, and when condensation or icing occurs, it can be removed.
[應用例16] [Application Example 16]
於本發明之電子零件搬送裝置中,較佳為對上述電子零件搬送裝置之至少一個室內供給經乾燥之氣體,且上述條件係上述氣體之供給停止或上述氣體之流量降低為特定值以下之情形。 In the electronic component conveying apparatus of the present invention, it is preferable that the dried gas is supplied to at least one of the chambers of the electronic component conveying device, and the condition is that the supply of the gas is stopped or the flow rate of the gas is decreased to a specific value or less. .
藉此,可事先防止於上述構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, dew condensation or icing can be prevented from occurring in the above-mentioned members in advance, and when condensation or icing occurs, it can be removed.
[應用例17] [Application Example 17]
於本發明之電子零件搬送裝置中,較佳為具有控制上述電子零件搬送裝置之動作之複數個控制模式,且包括顯示部,該顯示部顯示與上述複數個控制模式中當前所設定之控制模式對應之圖像。 Preferably, the electronic component transporting apparatus of the present invention has a plurality of control modes for controlling the operation of the electronic component transporting device, and includes a display unit that displays a control mode currently set in the plurality of control modes. Corresponding image.
藉此,藉由於顯示部顯示例如與結露或結冰相關之資訊或應對方法等,作業者可將其掌握,而可容易且迅速地應對。 Thereby, the operator can grasp the information, the countermeasures, and the like related to condensation or icing, for example, and the operator can grasp it easily and quickly.
[應用例18] [Application Example 18]
本發明之電子零件檢查裝置之特徵在於包括:構成裝置之構件;加熱部,其將上述構件加熱;濕度檢測部,其檢測濕度; 溫度檢測部,其檢測溫度;及檢查部,其檢查電子零件;且於利用上述溫度檢測部所檢測出之溫度成為露點溫度之2倍以下之情形時,將上述構件加熱。 The electronic component inspection apparatus of the present invention is characterized by comprising: a member constituting the device; a heating portion that heats the member; and a humidity detecting portion that detects the humidity; The temperature detecting unit detects the temperature; and the inspection unit checks the electronic component; and when the temperature detected by the temperature detecting unit is twice or less the dew point temperature, the member is heated.
藉此,可自動地事先防止於構成電子零件檢查裝置之構件產生結露或結冰,又,於產生有結露或結冰之情形時,可將其去除。 Thereby, condensation or icing can be prevented from being generated in advance in the members constituting the electronic component inspection device, and can be removed when condensation or icing occurs.
1‧‧‧檢查裝置(電子零件檢查裝置) 1‧‧‧Inspection device (electronic parts inspection device)
6‧‧‧操作部 6‧‧‧Operation Department
11A‧‧‧第1托盤搬送機構 11A‧‧‧1st pallet transport mechanism
11B‧‧‧第2托盤搬送機構 11B‧‧‧2nd tray transport mechanism
12‧‧‧溫度調整部(均熱板) 12‧‧‧Temperature adjustment unit (soaking plate)
13‧‧‧第1器件搬送頭 13‧‧‧1st device transport head
14‧‧‧器件供給部(供給梭) 14‧‧‧Device Supply Department (Supply Shuttle)
15‧‧‧第3托盤搬送機構 15‧‧‧3rd pallet transport mechanism
16‧‧‧檢查部 16‧‧‧Inspection Department
17‧‧‧第2器件搬送頭 17‧‧‧2nd device transport head
18‧‧‧器件回收部(回收梭) 18‧‧‧Device Recycling Department (Recycling Shuttle)
19‧‧‧回收用托盤 19‧‧‧Recycling tray
20‧‧‧第3器件搬送頭 20‧‧‧3rd device transport head
21‧‧‧第6托盤搬送機構 21‧‧‧6th tray transport mechanism
22A‧‧‧第4托盤搬送機構 22A‧‧‧4th tray transport mechanism
22B‧‧‧第5托盤搬送機構 22B‧‧‧5th pallet transport mechanism
41‧‧‧溫度感測器 41‧‧‧Temperature Sensor
42、45‧‧‧濕度感測器 42, 45‧‧‧ Humidity Sensor
43‧‧‧流量感測器 43‧‧‧Flow sensor
44‧‧‧洩漏感測器 44‧‧‧Leak sensor
51‧‧‧加熱機構 51‧‧‧ heating mechanism
52‧‧‧冷卻機構 52‧‧‧Cooling mechanism
53‧‧‧乾燥空氣供給機構 53‧‧‧Dry air supply mechanism
61‧‧‧輸入部 61‧‧‧ Input Department
62‧‧‧顯示部 62‧‧‧Display Department
71‧‧‧警報器 71‧‧‧Alarm
80‧‧‧控制部 80‧‧‧Control Department
90‧‧‧IC器件 90‧‧‧IC devices
200‧‧‧托盤 200‧‧‧Tray
620‧‧‧畫面 620‧‧‧ screen
621‧‧‧第1圖像 621‧‧‧1st image
622‧‧‧第2圖像 622‧‧‧2nd image
623、624‧‧‧圖框 623, 624‧‧‧ frame
625‧‧‧圓形記號 625‧‧‧round mark
801‧‧‧記憶部 801‧‧‧Memory Department
802‧‧‧計時器 802‧‧ ‧timer
803‧‧‧判別部 803‧‧‧Discrimination Department
A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area
A2‧‧‧器件供給區域(供給區域) A2‧‧‧Device supply area (supply area)
A3‧‧‧檢查區域 A3‧‧‧ inspection area
A4‧‧‧器件回收區域(回收區域) A4‧‧‧Device recycling area (recycling area)
A5‧‧‧托盤去除區域 A5‧‧‧Tray removal area
R1‧‧‧第1室 Room R1‧‧‧
R2‧‧‧第2室 Room R2‧‧‧
R3‧‧‧第3室 Room R3‧‧‧3
S101~S118‧‧‧步驟 S101~S118‧‧‧Steps
S201~S210‧‧‧步驟 S201~S210‧‧‧Steps
S301~S305‧‧‧步驟 S301~S305‧‧‧Steps
X‧‧‧方向 X‧‧‧ direction
Y‧‧‧方向 Y‧‧‧ direction
Z‧‧‧方向 Z‧‧‧ direction
圖1係表示本發明之電子零件檢查裝置之第1實施形態之概略俯視圖。 Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.
圖2係圖1所示之電子零件檢查裝置之方塊圖。 Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1.
圖3係表示圖1所示之電子零件檢查裝置之顯示部之顯示畫面之圖。 Fig. 3 is a view showing a display screen of a display unit of the electronic component inspection device shown in Fig. 1;
圖4係表示圖1所示之電子零件檢查裝置之顯示部之顯示畫面之圖。 Fig. 4 is a view showing a display screen of a display unit of the electronic component inspection device shown in Fig. 1;
圖5係表示圖1所示之電子零件檢查裝置之顯示部之顯示畫面之圖。 Fig. 5 is a view showing a display screen of a display unit of the electronic component inspection device shown in Fig. 1;
圖6係表示圖1所示之電子零件檢查裝置之控制動作之流程圖。 Fig. 6 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.
圖7係表示圖1所示之電子零件檢查裝置之控制動作之流程圖。 Fig. 7 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.
圖8係表示圖1所示之電子零件檢查裝置之控制動作之流程圖。 Fig. 8 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.
圖9係表示本發明之電子零件檢查裝置之第2實施形態之方塊圖。 Fig. 9 is a block diagram showing a second embodiment of the electronic component inspection device of the present invention.
圖10係表示本發明之電子零件檢查裝置之第3實施形態之概略俯視圖。 Fig. 10 is a schematic plan view showing a third embodiment of the electronic component inspection device of the present invention.
以下,基於隨附圖式所示之實施形態,對本發明之電子零件搬送裝置及電子零件檢查裝置進行詳細說明。 Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on the embodiments shown in the drawings.
<第1實施形態> <First embodiment>
圖1係表示本發明之電子零件檢查裝置之第1實施形態之概略俯視圖。圖2係圖1所示之電子零件檢查裝置之方塊圖。圖3~圖5分別係表示圖1所示之電子零件檢查裝置之顯示部之顯示畫面之圖。圖6~圖8分別係表示圖1所示之電子零件檢查裝置之控制動作之流程圖。 Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1. 3 to 5 are views showing display screens of the display unit of the electronic component inspection device shown in Fig. 1, respectively. 6 to 8 are flowcharts showing the control operation of the electronic component inspection device shown in Fig. 1, respectively.
再者,以下,為便於說明,而如圖1所示,將相互正交之3軸設為X軸、Y軸及Z軸。又,包含X軸與Y軸之XY平面成為水平,Z軸成為鉛直。又,亦將與X軸平行之方向稱為「X方向」,將與Y軸平行之方向稱為「Y方向」,將與Z軸平行之方向稱為「Z方向」。又,將X軸、Y軸及Z軸之各軸之箭頭之方向稱為正側,將與箭頭相反之方向稱為負側。又,亦將電子零件之搬送方向之上游側簡稱為「上游側」,將下游側簡稱為「下游側」。又,本案說明書中所提及之「水平」並不限定於完全水平,只要不妨礙電子零件之搬送,則亦包含相對於水平略微(例如未達5°左右)傾斜之狀態。 In the following, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is referred to as "X direction", the direction parallel to the Y axis is referred to as "Y direction", and the direction parallel to the Z axis is referred to as "Z direction". Further, the direction of the arrow of each of the X-axis, the Y-axis, and the Z-axis is referred to as a positive side, and the direction opposite to the arrow is referred to as a negative side. Moreover, the upstream side of the conveyance direction of the electronic component is also simply referred to as "upstream side", and the downstream side is simply referred to as "downstream side". Moreover, the "level" mentioned in the specification of the present invention is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as it does not hinder the conveyance of the electronic component.
圖1所示之檢查裝置(電子零件檢查裝置)1例如為用以對BGA(Ball grid array,球柵陣列)封裝或LGA(Land grid array,平台柵格陣列)封裝等IC器件、LCD(Liquid Crystal Display,液晶顯示器)、CIS(CMOS(Complementary Metal Oxide Semiconductor)Image Sensor,互補金氧半導體影像感測器)等電子零件之電氣特性進行檢查、測試(以下簡稱為「檢查」)之裝置。再者,以下,為便於說明,代表性地對使用IC器件作為進行檢查之上述電子零件之情形進行說明,將其設為「IC器件90」。 The inspection device (electronic component inspection device) 1 shown in FIG. 1 is, for example, an IC device such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package, and an LCD (Liquid). A device for inspecting and testing (hereinafter referred to as "inspection") for electrical characteristics of electronic components such as a crystal display (Crystal Display), a CIS (CMOS (Complementary Metal Oxide Semiconductor) Image Sensor, and a complementary MOS image sensor). In the following, for convenience of explanation, a case where the IC device is used as the electronic component to be inspected is typically described, and this is referred to as "IC device 90".
如圖1所示,檢查裝置1被分為托盤供給區域A1、器件供給區域(以下簡稱為「供給區域」)A2、檢查區域A3、器件回收區域(以下簡稱為「回收區域」)A4、及托盤去除區域A5。該等各區域相互被未圖示之壁部或擋板等分隔。而且,供給區域A2成為由壁部或擋板等劃 分形成之第1室R1,又,檢查區域A3成為由壁部或擋板等劃分形成之第2室R2,又,回收區域A4成為由壁部或擋板等劃分形成之第3室R3。又,第1室R1(供給區域A2)、第2室R2(檢查區域A3)及第3室R3(回收區域A4)分別構成為可確保氣密性或隔熱性。藉此,第1室R1、第2室R2及第3室R3分別可儘可能地維持濕度或溫度。再者,第1室R1及第2室R2內分別被控制為特定之濕度及特定之溫度。 As shown in FIG. 1, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a device collection area (hereinafter simply referred to as "recovery area") A4, and The tray removes the area A5. These regions are separated from each other by a wall portion, a baffle or the like (not shown). Further, the supply region A2 is formed by a wall portion or a baffle plate or the like. In the first chamber R1 which is formed separately, the inspection area A3 is the second chamber R2 which is divided by the wall portion, the baffle plate, or the like, and the recovery region A4 is the third chamber R3 which is formed by the wall portion, the baffle plate or the like. Further, the first chamber R1 (supply area A2), the second chamber R2 (inspection area A3), and the third chamber R3 (recovery area A4) are each configured to ensure airtightness or heat insulation. Thereby, the humidity in the first chamber R1, the second chamber R2, and the third chamber R3 can be maintained as much as possible. Further, the first chamber R1 and the second chamber R2 are controlled to have specific humidity and a specific temperature, respectively.
IC器件90係自托盤供給區域A1至托盤去除區域A5依序經由上述各區域、且於中途之檢查區域A3被進行檢查。如此,檢查裝置1具備:電子零件搬送裝置,其於各區域搬送IC器件90,且具有控制部80;檢查部16,其於檢查區域A3內進行檢查;以及未圖示之檢查控制部。再者,於檢查裝置1中,電子零件搬送裝置包含除檢查部16及檢查控制部以外之構成。 The IC device 90 is inspected sequentially from the tray supply area A1 to the tray removal area A5 via the above-described respective areas and in the middle of the inspection area A3. In this way, the inspection apparatus 1 includes an electronic component transport apparatus that transports the IC device 90 in each area and has a control unit 80; the inspection unit 16 performs inspection in the inspection area A3; and an inspection control unit (not shown). Further, in the inspection apparatus 1, the electronic component conveying apparatus includes a configuration other than the inspection unit 16 and the inspection control unit.
托盤供給區域A1係供給托盤200之區域,該托盤200排列有未檢查狀態之複數個IC器件90。於托盤供給區域A1中,可堆疊多個托盤200。 The tray supply area A1 is an area for supplying the tray 200, and the tray 200 is arranged with a plurality of IC devices 90 in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked.
供給區域A2係將來自托盤供給區域A1之托盤200上之複數個IC器件90分別供給至檢查區域A3之區域。再者,以橫跨托盤供給區域A1與供給區域A2之方式,設置有將托盤200逐片搬送之第1托盤搬送機構11A、第2托盤搬送機構11B。 The supply area A2 supplies a plurality of IC devices 90 from the tray 200 of the tray supply area A1 to the area of the inspection area A3. In addition, the first tray transport mechanism 11A and the second tray transport mechanism 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.
於供給區域A2,設置有作為配置IC器件90之配置部之溫度調整部(均熱板)12、第1器件搬送頭(搬送構件)13、及第3托盤搬送機構15。 In the supply region A2, a temperature adjustment unit (soaking plate) 12, a first device transfer head (transport member) 13, and a third tray transfer mechanism 15 as arrangement portions of the IC device 90 are provided.
溫度調整部12係將複數個IC器件90加熱或冷卻,而將該IC器件90調整(控制)為適於檢查之溫度之裝置。即,溫度調整部12為可配置IC器件90且可進行冷卻之冷卻構件(構件)。於圖1所示之構成中,溫度調整部12係於Y方向配置、固定有2個。而且,由第1托盤搬送機構 11A自托盤供給區域A1搬入(搬送而來)之托盤200上之IC器件90被搬送、載置於任一個溫度調整部12。 The temperature adjustment unit 12 heats or cools a plurality of IC devices 90 to adjust (control) the IC device 90 to a temperature suitable for inspection. That is, the temperature adjustment unit 12 is a cooling member (member) that can dispose the IC device 90 and can be cooled. In the configuration shown in FIG. 1, the temperature adjustment unit 12 is disposed and fixed in the Y direction. Moreover, the first tray transport mechanism The IC device 90 on the tray 200 that has been carried in (transferred) from the tray supply area A1 is transported and placed on any one of the temperature adjustment units 12.
第1器件搬送頭13被支持為可於供給區域A2內移動。藉此,第1器件搬送頭13可擔負自托盤供給區域A1搬入之托盤200與溫度調整部12之間的IC器件90之搬送、及溫度調整部12與下述器件供給部14之間的IC器件90之搬送。再者,第1器件搬送頭13具有固持IC器件90之複數個固持部(未圖示),各固持部具備吸附嘴,藉由吸附而將IC器件90固持。 The first device transfer head 13 is supported to be movable in the supply region A2. Thereby, the first device transfer head 13 can carry the IC device 90 between the tray 200 loaded from the tray supply region A1 and the temperature adjustment unit 12, and the IC between the temperature adjustment unit 12 and the device supply unit 14 described below. Transfer of device 90. Further, the first device transfer head 13 has a plurality of holding portions (not shown) for holding the IC device 90, and each of the holding portions includes a suction nozzle for holding the IC device 90 by suction.
第3托盤搬送機構15係將已去除所有IC器件90之狀態之空托盤200沿X方向搬送之機構。而且,於該搬送後,空托盤200藉由第2托盤搬送機構11B而自供給區域A2返回至托盤供給區域A1。 The third tray transport mechanism 15 is a mechanism that transports the empty tray 200 in a state in which all of the IC devices 90 have been removed in the X direction. Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transport mechanism 11B.
檢查區域A3係檢查IC器件90之區域。於該檢查區域A3,設置有作為搬送IC器件90之電子零件搬送部之器件供給部(供給梭)14、檢查部16、第2器件搬送頭(抵接部)17、及器件回收部(回收梭)18。 The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14 as an electronic component transport unit for transporting the IC device 90, an inspection unit 16, a second device transfer head (contact portion) 17, and a device recovery unit (recycling) are provided. Shuttle) 18.
器件供給部14係將經溫度調整(溫度控制)之IC器件90搬送至檢查部16附近之裝置。該器件供給部14被支持為可於供給區域A2與檢查區域A3之間沿X方向移動。又,於圖1所示之構成中,器件供給部14沿Y方向配置有2個,溫度調整部12上之IC器件90被搬送、載置於任一個器件供給部14。再者,於器件供給部14中,可與溫度調整部12同樣地,將IC器件90加熱或冷卻,而將該IC器件90調整為適於檢查之溫度。即,器件供給部14為可配置IC器件90且可進行冷卻之冷卻構件(構件)。 The device supply unit 14 transports the temperature-adjusted (temperature-controlled) IC device 90 to a device in the vicinity of the inspection unit 16. The device supply portion 14 is supported to be movable in the X direction between the supply region A2 and the inspection region A3. Further, in the configuration shown in FIG. 1, the device supply unit 14 is disposed in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported and placed on any of the device supply units 14. Further, in the device supply unit 14, the IC device 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC device 90 can be adjusted to a temperature suitable for inspection. That is, the device supply portion 14 is a cooling member (member) that can dispose the IC device 90 and can be cooled.
檢查部16為對IC器件90之電氣特性進行檢查、測試之單元,即,為當檢查IC器件90時保持該IC器件90之保持部。於檢查部16,設置有於保持有IC器件90之狀態下與該IC器件90之端子電性連接之複數個探針接腳。而且,使IC器件90之端子與探針接腳電性連接(接觸), 經由探針接腳而進行IC器件90之檢查。IC器件90之檢查係基於在與檢查部16連接之未圖示之測試器所具備之檢查控制部之記憶部中所記憶的程式而進行。再者,於檢查部16中,可與溫度調整部12同樣地,將IC器件90加熱或冷卻,而將該IC器件90調整為適於檢查之溫度。即,檢查部16為可配置IC器件90且可進行冷卻之冷卻構件(構件)。 The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, that is, holds the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 while the IC device 90 is held. Moreover, the terminal of the IC device 90 is electrically connected (contacted) to the probe pin, The inspection of the IC device 90 is performed via the probe pins. The inspection of the IC device 90 is performed based on a program stored in the memory unit of the inspection control unit provided in the tester (not shown) connected to the inspection unit 16. Further, in the inspection unit 16, the IC device 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC device 90 can be adjusted to a temperature suitable for inspection. That is, the inspection unit 16 is a cooling member (member) that can dispose the IC device 90 and can be cooled.
第2器件搬送頭17被支持為可於檢查區域A3內移動。藉此,第2器件搬送頭17可將自供給區域A2搬入之器件供給部14上之IC器件90搬送並載置於檢查部16上。又,於檢查IC器件90之情形時,第2器件搬送頭17將IC器件90朝檢查部16按壓,藉此,使IC器件90抵接於檢查部16。藉此,如上所述,使IC器件90之端子與檢查部16之探針接腳電性連接。再者,第2器件搬送頭17具有固持IC器件90之複數個固持部(未圖示),各固持部具備吸附嘴,藉由吸附而固持IC器件90。又,於第2器件搬送頭17中,可與溫度調整部12同樣地,將IC器件90加熱或冷卻,而將IC器件90調整為適於檢查之溫度。即,第2器件搬送頭17為可配置IC器件90且可進行冷卻之冷卻構件(構件)。 The second device transfer head 17 is supported to be movable within the inspection area A3. Thereby, the second device transfer head 17 can transport the IC device 90 on the device supply unit 14 carried in from the supply region A2 and carry it on the inspection unit 16. Further, when the IC device 90 is inspected, the second device transfer head 17 presses the IC device 90 toward the inspection portion 16, whereby the IC device 90 is brought into contact with the inspection portion 16. Thereby, the terminal of the IC device 90 is electrically connected to the probe pin of the inspection portion 16 as described above. Further, the second device transfer head 17 has a plurality of holding portions (not shown) for holding the IC device 90, and each of the holding portions includes a suction nozzle for holding the IC device 90 by suction. Further, in the second device transfer head 17, the IC device 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC device 90 can be adjusted to a temperature suitable for inspection. That is, the second device transfer head 17 is a cooling member (member) that can dispose the IC device 90 and can be cooled.
器件回收部18係將經檢查部16檢查結束之IC器件90搬送至回收區域A4之裝置。該器件回收部18被支持為可於檢查區域A3與回收區域A4之間沿X方向移動。又,於圖1所示之構成中,器件回收部18與器件供給部14同樣地,沿Y方向配置有2個,檢查部16上之IC器件90被搬送並載置於任一個器件回收部18。該搬送係藉由第2器件搬送頭17而進行。 The device recovery unit 18 is a device that transports the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device recovery portion 18 is supported to be movable in the X direction between the inspection region A3 and the recovery region A4. Further, in the configuration shown in FIG. 1, the device recovery unit 18 is disposed in the Y direction in the same manner as the device supply unit 14, and the IC device 90 on the inspection unit 16 is transported and placed in any device recovery unit. 18. This transfer is performed by the second device transfer head 17.
回收區域A4係回收檢查已結束之IC器件90之區域。於該回收區域A4,設置有回收用托盤19、第3器件搬送頭(搬送構件)20、及第6托盤搬送機構21。又,於回收區域A4,亦準備有空之托盤200。 The recovery area A4 is used to recover the area of the IC device 90 that has been checked. In the collection area A4, a collection tray 19, a third device transfer head (transport member) 20, and a sixth tray transfer mechanism 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared.
回收用托盤19固定於回收區域A4內,且於圖1所示之構成中,沿X方向配置有3個。又,空之托盤200亦沿X方向配置有3個。而且,朝 回收區域A4移動之器件回收部18上之IC器件90被搬送並載置於該等回收用托盤19及空之托盤200中之任一者。藉此,根據每個檢查結果將IC器件90回收、分類。 The recovery tray 19 is fixed in the collection area A4, and in the configuration shown in Fig. 1, three are arranged in the X direction. Further, the empty tray 200 is also arranged in three in the X direction. And, toward The IC device 90 on the device recovery unit 18 in which the recovery area A4 moves is transported and placed on any of the recovery trays 19 and the empty trays 200. Thereby, the IC device 90 is recovered and classified according to each inspection result.
第3器件搬送頭20被支持為可於回收區域A4內移動。藉此,第3器件搬送頭20可將IC器件90自器件回收部18搬送至回收用托盤19或空之托盤200。再者,第3器件搬送頭20具有固持IC器件90之複數個固持部(未圖示),各固持部具備吸附嘴,且藉由吸附而固持IC器件90。 The third device transfer head 20 is supported to be movable within the recovery area A4. Thereby, the third device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. Further, the third device transfer head 20 has a plurality of holding portions (not shown) for holding the IC device 90, and each of the holding portions includes a suction nozzle, and the IC device 90 is held by suction.
第6托盤搬送機構21係將自托盤去除區域A5搬入之空之托盤200沿X方向搬送之機構。而且,於該搬送後,空之托盤200配置於回收IC器件90之位置、即會成為上述3個空之托盤200中之任一者。 The sixth tray transport mechanism 21 is a mechanism that transports the empty tray 200 carried in from the tray removal area A5 in the X direction. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it becomes one of the above three empty trays 200.
托盤去除區域A5係將排列有檢查結束狀態之複數個IC器件90之托盤200回收、去除之區域。於托盤去除區域A5中,可堆疊多個托盤200。 The tray removal area A5 is an area in which the trays 200 of the plurality of IC devices 90 in the inspection end state are collected and removed. In the tray removal area A5, a plurality of trays 200 can be stacked.
又,以橫跨回收區域A4與托盤去除區域A5之方式設置有將托盤200逐片搬送之第4托盤搬送機構22A、第5托盤搬送機構22B。第4托盤搬送機構22A係將載置有檢查結束之IC器件90之托盤200自回收區域A4搬送至托盤去除區域A5之機構。第5托盤搬送機構22B係將用以回收IC器件90之空之托盤200自托盤去除區域A5搬送至回收區域A4之機構。 Moreover, the fourth tray conveyance mechanism 22A and the fifth tray conveyance mechanism 22B that convey the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism that transports the empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.
上述測試器之檢查控制部例如基於記憶於未圖示之記憶部之程式,而進行配置於檢查部16之IC器件90之電氣特性之檢查等。 The inspection control unit of the tester performs inspection of electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory unit (not shown).
又,控制部80例如控制第1托盤搬送機構11A、第2托盤搬送機構11B、溫度調整部12、第1器件搬送頭13、器件供給部14、第3托盤搬送機構15、檢查部16、第2器件搬送頭17、器件回收部18、第3器件搬送頭20、第6托盤搬送機構21、第4托盤搬送機構22A、及第5托盤搬送機構22B之各部之驅動。 Further, the control unit 80 controls, for example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the temperature adjustment unit 12, the first device transport head 13, the device supply unit 14, the third tray transport mechanism 15, the inspection unit 16, and the first The driving of each of the device transfer head 17, the device recovery unit 18, the third device transfer head 20, the sixth tray transfer mechanism 21, the fourth tray transfer mechanism 22A, and the fifth tray transfer mechanism 22B.
又,如圖2所示,檢查裝置1具有:溫度感測器(溫度檢測部)41,其檢測溫度;濕度感測器(濕度檢測部)42,其檢測濕度;流量感測器43,其檢測下述乾燥空氣之流量;加熱機構(加熱部)51,其進行加熱;冷卻機構(冷卻部)52,其進行冷卻;乾燥空氣供給機構(乾燥空氣供給部)53,其供給乾燥空氣;操作部6,其進行檢查裝置1之各操作;以及警報器71。再者,於圖2中,針對例如溫度感測器41、濕度感測器42、流量感測器43、加熱機構51等設置有複數個者,亦代表性地僅圖示其中一個。又,控制部80具有記憶各資訊之記憶部801、進行時間計測之計時器802、以及進行各判斷(判別)之判別部803,且控制加熱機構51、冷卻機構52、乾燥空氣供給機構53、顯示部62及警報器71等各部之驅動。 Further, as shown in FIG. 2, the inspection apparatus 1 includes a temperature sensor (temperature detecting unit) 41 that detects temperature, a humidity sensor (humidity detecting unit) 42, which detects humidity, and a flow sensor 43 that The following flow rate of dry air is detected; a heating mechanism (heating unit) 51 for heating; a cooling mechanism (cooling unit) 52 for cooling; a dry air supply unit (dry air supply unit) 53 for supplying dry air; Part 6, which performs each operation of the inspection apparatus 1; and an alarm 71. Further, in FIG. 2, for example, a plurality of the temperature sensor 41, the humidity sensor 42, the flow sensor 43, the heating mechanism 51, and the like are provided, and only one of them is representatively shown. Further, the control unit 80 includes a memory unit 801 that stores each information, a timer 802 that performs time measurement, and a determination unit 803 that performs each determination (determination), and controls the heating mechanism 51, the cooling mechanism 52, the dry air supply mechanism 53, The driving of each unit such as the display unit 62 and the alarm unit 71.
溫度感測器41及濕度感測器42分別配置於檢查裝置1之內部之特定之各部,於本實施形態中,配置於第1室R1及第2室R2內,藉由該溫度感測器41及濕度感測器42,可分別檢測第1室R1及第2室R2內之溫度及濕度。此情形時,溫度感測器41可配置於第1室R1及第2室R2內之任意位置,但較佳為配置於溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17。藉此,可直接測定溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17之溫度。 The temperature sensor 41 and the humidity sensor 42 are respectively disposed in specific portions inside the inspection device 1. In the present embodiment, the temperature sensor 41 and the humidity sensor 42 are disposed in the first chamber R1 and the second chamber R2, and the temperature sensor is provided. 41 and the humidity sensor 42 can detect the temperature and humidity in the first chamber R1 and the second chamber R2, respectively. In this case, the temperature sensor 41 may be disposed at any position in the first chamber R1 and the second chamber R2, but is preferably disposed in the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device. Head 17. Thereby, the temperature of the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17 can be directly measured.
再者,於本實施形態中,各濕度分別為相對濕度。 Furthermore, in the present embodiment, each humidity is a relative humidity.
流量感測器43配置於檢查裝置1之內部之特定之各部,於本實施形態中,配置於溫度調整部12、器件供給部14、檢查部16及器件回收部18各自之乾燥空氣之流路內,可利用流量感測器43分別檢測上述流路內之乾燥空氣之流量。 The flow sensor 43 is disposed in each of the specific portions inside the inspection device 1. In the present embodiment, the flow path of the dry air disposed in each of the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device recovery unit 18 is provided. The flow sensor 43 can be used to detect the flow rate of the dry air in the flow path, respectively.
又,操作部6具有進行各輸入之輸入部61、及顯示圖像之顯示部62。作為輸入部61,並無特別限定,例如可列舉鍵盤、滑鼠等。又,作為顯示部62,並無特別限定,例如可列舉液晶顯示面板、有機 EL(Electro Luminescence,電致發光)顯示面板等。作業者之操作部6之操作例如有藉由操作輸入部61,使游標移動至顯示於顯示部62之各操作按鈕(圖示)之位置,進行選擇(點選)而完成之情形,以下,亦將該操作稱為「按壓操作按鈕」。 Further, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard, a mouse, and the like. Further, the display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL (Electro Luminescence) display panel and the like. The operation of the operator's operation unit 6 is performed by, for example, operating the input unit 61 to move the cursor to the position of each operation button (illustration) displayed on the display unit 62, and performing selection (clicking) to complete the operation. This operation is also referred to as "pressing the operation button".
再者,亦可將顯示於顯示部62之各操作按鈕中之一部分或全部設置為按壓按鈕等機械式之操作按鈕。 Further, part or all of each of the operation buttons displayed on the display unit 62 may be provided as a mechanical operation button such as a push button.
又,作為操作部6,並不限定於上述構成,例如可列舉觸控面板等可進行輸入及圖像顯示之器件等。 In addition, the operation unit 6 is not limited to the above-described configuration, and examples thereof include a device that can perform input and image display such as a touch panel.
又,作為加熱機構51,並無特別限定,例如可列舉具有電熱線之加熱器等。又,加熱機構51亦可構成為進而具有風扇等送風源,藉由送風源而吹送溫風(熱風)。於本實施形態中,加熱機構51配置於溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17,且可將該等加熱。再者,若溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17被加熱,則與該加熱相應地,配置有溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17之室之溫度亦分別上升。 Further, the heating mechanism 51 is not particularly limited, and examples thereof include a heater having a heating wire. Further, the heating mechanism 51 may be configured to further include a blower such as a fan, and blow a warm air (hot air) by the air supply source. In the present embodiment, the heating mechanism 51 is disposed in the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17, and can be heated. When the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17 are heated, the temperature adjustment unit 12, the device supply unit 14, and the inspection unit 16 are disposed in accordance with the heating. The temperature of the chamber of the second device transfer head 17 also rises.
又,作為冷卻機構52,並無特別限定,例如可列舉使冷媒(例如低溫之氣體)流入至配置於冷卻對象物之附近之管體內進行冷卻之裝置、珀爾帖元件等。於本實施形態中,冷卻機構52係使用上述使冷媒流入至配置於冷卻對象物之附近之管體內進行冷卻之裝置,且使用使液氮氣化而成之氮氣作為冷媒。又,於本實施形態中,冷卻機構52可分別將溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17冷卻。再者,若溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17被冷卻,則與該冷卻相應地,配置有溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17之室之溫度亦分別降低。 In addition, the cooling mechanism 52 is not particularly limited, and examples thereof include a device that causes a refrigerant (for example, a low-temperature gas) to flow into a tube disposed in the vicinity of the object to be cooled, and a Peltier element. In the present embodiment, the cooling mechanism 52 is a device that cools the refrigerant into the pipe body disposed in the vicinity of the object to be cooled, and uses nitrogen gas obtained by nitrogenizing the liquid as a refrigerant. Further, in the present embodiment, the cooling mechanism 52 can cool the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17, respectively. When the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17 are cooled, the temperature adjustment unit 12, the device supply unit 14, and the inspection unit 16 are disposed in accordance with the cooling. The temperature of the chamber of the second device transfer head 17 is also lowered.
又,乾燥空氣供給機構53構成為可向檢查裝置1之內部之特定之各部供給(流入)濕度較低之空氣、氮氣等氣體(以下亦稱為乾燥空 氣)。於將IC器件90冷卻為特定溫度並進行檢查之情形時,與此相應地會將所需之各部冷卻,但藉由對所需之各部供給乾燥空氣,可防止結露、結冰(覆冰)。於本實施形態中,乾燥空氣供給機構53可對溫度調整部12、器件供給部14、檢查部16及器件回收部18供給乾燥空氣,即,可對第1室R1、第2室R2及第3室R3供給乾燥空氣。 Further, the dry air supply unit 53 is configured to supply (flow) air such as air or nitrogen having a low humidity to a specific portion of the inside of the inspection device 1 (hereinafter also referred to as dry air). gas). When the IC device 90 is cooled to a specific temperature and inspected, the required portions are cooled accordingly, but dew condensation and icing (ice coating) can be prevented by supplying dry air to the desired portions. . In the present embodiment, the dry air supply unit 53 can supply dry air to the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device recovery unit 18, that is, the first chamber R1, the second chamber R2, and the first chamber. Room 3 R3 supplies dry air.
再者,與溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17接觸之空氣之濕度較佳為低於與濕度感測器42接觸之空氣之濕度。藉此,於溫度感測器41未安裝於溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17之情形等時,當設定為溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17之溫度低於溫度感測器41之周圍之溫度時,產生結露或結冰之概率變高,但藉由使溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17之周圍之空氣之濕度變低,可使產生結露或結冰之概率變低。 Further, the humidity of the air in contact with the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17 is preferably lower than the humidity of the air in contact with the humidity sensor 42. Therefore, when the temperature sensor 41 is not attached to the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17, the temperature adjustment unit 12 and the device supply unit 14 are set. When the temperature of the inspection unit 16 and the second device transfer head 17 is lower than the temperature around the temperature sensor 41, the probability of dew condensation or icing becomes high, but the temperature adjustment unit 12, the device supply unit 14, and the inspection are performed. The humidity of the air around the portion 16 and the second device transfer head 17 becomes low, and the probability of occurrence of dew condensation or icing is lowered.
再者,關於乾燥空氣供給機構53中所使用之乾燥空氣,於本實施形態中,於利用冷卻機構52進行冷卻之情形時,為於冷卻機構52中使用後之氮氣與濕度較低之空氣之混合氣體,於停止上述冷卻之情形時,僅為上述濕度較低之空氣。 Further, in the case where the dry air used in the dry air supply means 53 is cooled by the cooling means 52, the dry air used in the cooling mechanism 52 is air which is used after the cooling means 52 and the air having a low humidity. The mixed gas is only the above-mentioned low humidity air when the above cooling is stopped.
於該檢查裝置1中,構成檢查裝置1之各構件(構成構件)之至少一個結露或結冰之至少一個條件被預先記憶於控制部80之記憶部801。而且,藉由判別部803而判別是否滿足上述條件中之任一條件,於滿足上述條件中之任一條件之情形時,藉由加熱機構51,將上述構成構件加熱。 In the inspection apparatus 1, at least one condition of condensation or icing of at least one of the members (constituting members) constituting the inspection apparatus 1 is previously stored in the memory unit 801 of the control unit 80. Further, the determination unit 803 determines whether or not any of the above conditions is satisfied, and when any of the above conditions is satisfied, the heating means 51 heats the constituent members.
再者,以下,亦將上述條件稱為「結露條件」。又,於本實施形態中,上述構成構件係設為溫度調整部12、器件供給部14、檢查部16及第2器件搬送頭17進行說明,但以下,亦將該等統稱為「冷卻構件」。 In addition, in the following, the above conditions are also referred to as "condensation conditions". In the present embodiment, the above-described constituent members are described as the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17, but these are collectively referred to as "cooling members" hereinafter. .
於本實施形態中,於記憶部801記憶有下述(1)~(3)之結露條件。 In the present embodiment, the following condensation conditions of (1) to (3) are stored in the memory unit 801.
(1)第1室R1及第2室R2中至少一者之室內之濕度為預先設定之特定閾值(第2閾值)α以上之情形。 (1) The humidity in the room of at least one of the first chamber R1 and the second chamber R2 is equal to or greater than a predetermined threshold (second threshold) α set in advance.
於滿足該結露條件之情形時,即,於第1室R1之濕度為閾值α以上之情形時,將配置於第1室R1內之冷卻構件加熱,又,於第2室R2之濕度為閾值α以上之情形時,將配置於第2室R2內之冷卻構件加熱。再者,以下,未標明此種區別,僅稱為「加熱」。 When the condensation condition is satisfied, that is, when the humidity of the first chamber R1 is equal to or greater than the threshold value α, the cooling member disposed in the first chamber R1 is heated, and the humidity in the second chamber R2 is a threshold value. In the case of α or more, the cooling member disposed in the second chamber R2 is heated. Further, in the following, such a difference is not indicated, and it is simply referred to as "heating".
(2)於冷卻構件已冷卻之狀態下切斷電源,其後接通電源之情形。 (2) A case where the power is turned off while the cooling member has been cooled, and then the power is turned on.
較佳為對該結露條件,進而附加條件,設為「於冷卻構件已冷卻之狀態下切斷電源,自上述電源被切斷時起在預先設定之特定時間t1以內將電源接通之情形」。其原因在於:即便於在冷卻構件已冷卻之狀態下切斷電源,其後使電源接通之情形時,若於電源切斷後經過長時間,則於此期間,冷卻構件之溫度會上升,而不產生結露或結冰之可能性較高。 It is preferable that the dew condensation condition and the additional condition are such that "the power is turned off in a state where the cooling member is cooled, and the power is turned on within a predetermined time t1 from the time when the power source is turned off". The reason for this is that even when the power supply is turned off while the cooling member has cooled, and then the power is turned on, if the power supply is turned off for a long time, the temperature of the cooling member rises during this period without There is a high probability of condensation or icing.
又,於滿足該結露條件之情形時,將各冷卻構件加熱。再者,以下,僅稱為「加熱」。 Further, when the condensation condition is satisfied, each of the cooling members is heated. In addition, hereinafter, it is only called "heating".
(3)乾燥空氣之供給停止或乾燥空氣之流量降低為特定值以下之情形。 (3) The supply of dry air is stopped or the flow rate of dry air is reduced to a specific value or less.
較佳為對於該結露條件,進而附加條件,設為「乾燥空氣之供給停止或乾燥空氣之流量降低為預先設定之特定值以下且在冷卻中之情形」。其原因在於:若不在冷卻中,則不產生結露或結冰之可能性較高。 It is preferable that the dew condensation condition and the additional condition are such that "the supply of dry air is stopped or the flow rate of the dry air is reduced to a predetermined value or less and is in a state of being cooled". The reason is that if it is not cooled, there is a high possibility that condensation or icing will not occur.
又,於滿足該結露條件之情形時,對乾燥空氣之供給停止或乾燥空氣之流量降低為特定值以下之冷卻構件、即配置有上述冷卻性構件之室內供給乾燥空氣。再者,以下,未標明此種區別,而僅稱為 「供給乾燥空氣」。 In addition, when the dew condensation condition is satisfied, the supply of the dry air is stopped or the flow rate of the dry air is reduced to a specific value or less, that is, the indoor air in which the cooling member is disposed is supplied with dry air. Furthermore, the following does not indicate such a difference, but only "Supply dry air."
其次,對檢查裝置1之控制動作進行說明。 Next, the control operation of the inspection device 1 will be described.
檢查裝置1具有控制其動作之複數個控制模式。於本實施形態中,作為上述控制模式,具有第1控制模式(停電恢復模式)、第2控制模式(過濕度偵測模式)、及第3控制模式(乾燥空氣異常模式)。 The inspection device 1 has a plurality of control modes that control its operation. In the present embodiment, the control mode includes a first control mode (power failure recovery mode), a second control mode (over-humidity detection mode), and a third control mode (dry air abnormal mode).
第1控制模式係自電源切斷之狀態變成接通電源之情形時之處理(初期處理)中之控制模式。又,第2控制模式係於初期處理之後監視濕度而進行之處理中之控制模式。又,第3控制模式係於初期處理之後監視乾燥空氣之供給而進行之處理中之控制模式。 The first control mode is a control mode in the process (initial processing) when the power-off state is changed to the power-on state. Further, the second control mode is a control mode in the process of monitoring the humidity after the initial processing. Further, the third control mode is a control mode in the process of monitoring the supply of dry air after the initial processing.
以下,基於圖6,對自電源切斷之狀態變成接通電源之情形之處理進行說明,基於圖7,對在初期處理之後監視濕度而進行之處理進行說明,基於圖8,對在初期處理之後監視乾燥空氣之供給而進行之處理進行說明。 In the following, the process of changing the state from the power-off state to the power-on state will be described with reference to Fig. 6. The process of monitoring the humidity after the initial processing will be described based on Fig. 7, and the initial processing will be described based on Fig. 8 . The process of monitoring the supply of dry air is then described.
首先,對自電源切斷之狀態將電源接通之情形時之初期處理中之檢查裝置1之控制動作進行說明。 First, the control operation of the inspection apparatus 1 in the initial processing in the case where the power is turned off from the state where the power is turned off will be described.
再者,自上一次電源被切斷時起,利用計時器802進行時間之計測,將利用該計時器802所計測出之時間(經過時間)設為「ta」。 Further, the time measurement is performed by the timer 802 from the time when the power is turned off, and the time (elapsed time) measured by the timer 802 is set to "ta".
如圖6所示,首先,接通電源(步驟S101),其後,利用濕度感測器42檢測第1室R1及第2室R2內之濕度(相對濕度)RH(步驟S102),分別判斷於第1室R1及第2室R2內,濕度RH是否為閾值α以上(步驟S103)。 As shown in FIG. 6, first, the power is turned on (step S101), and thereafter, the humidity (relative humidity) RH in the first chamber R1 and the second chamber R2 is detected by the humidity sensor 42 (step S102), and respectively judged. Whether the humidity RH is equal to or greater than the threshold value α in the first chamber R1 and the second chamber R2 (step S103).
於判斷濕度RH為閾值α以上之情形時,已產生有結露或結冰,或有可能產生結露或結冰,從而進行報告(B)(步驟S111)。 When it is judged that the humidity RH is equal to or higher than the threshold value α, condensation or icing has occurred, or condensation or icing may occur, and the report (B) is performed (step S111).
再者,閾值α並無特別限定,根據各種條件而適當設定,較佳為設定為90%以上且100%以下之範圍內,更佳為設定為95%以上且100%以下之範圍內。於本實施形態中,例如設定為100%。 In addition, the threshold value α is not particularly limited, and is appropriately set according to various conditions, and is preferably set in a range of 90% or more and 100% or less, and more preferably in a range of 95% or more and 100% or less. In the present embodiment, for example, it is set to 100%.
於步驟S111中,於顯示部62之畫面620上顯示圖3所示之圖像,並 且使警報器71作動,產生警告聲。藉此,作業者可掌握已產生異常、即產生有可能導致結露或結冰之異常,又,可根據顯示於顯示部62之圖像,而掌握該異常之詳細情況或應對方法等。再者,圖3所示之圖像為1例,以下,說明該1例。 In step S111, the image shown in FIG. 3 is displayed on the screen 620 of the display unit 62, and And the alarm 71 is activated to generate a warning sound. Thereby, the operator can grasp that an abnormality has occurred, that is, an abnormality that may cause condensation or ice formation, and the details of the abnormality, the countermeasure, and the like can be grasped based on the image displayed on the display unit 62. In addition, the image shown in FIG. 3 is one example, and this one is demonstrated below.
如圖3所示,上述圖像具有:第1圖像(主視窗)621,其顯示於畫面620之整體;以及第2圖像(子視窗)622,其被稱作對話框等,且較第1圖像621更小地顯示於第1圖像621上。 As shown in FIG. 3, the image has a first image (main window) 621 displayed on the entire screen 620, and a second image (sub-window) 622, which is called a dialog box and the like. The first image 621 is displayed on the first image 621 smaller.
於第1圖像621中,於畫面620之圖3中左上,顯示「停止中」。 In the first image 621, "stopping" is displayed on the upper left side of the screen 620 in FIG.
又,於第2圖像622中,於圖框623內,顯示有「指標產生濕度異常。」等檢查裝置1之當前之狀態(異常之內容)、「請再試,於選擇清除後開始。」等應對方法等各訊息。再者,上述指標為「第2室R2(檢查區域A3)」。 Further, in the second image 622, in the frame 623, the current state (the content of the abnormality) of the inspection device 1 such as "the indicator is abnormal in humidity" is displayed, "Please try again, and start after the selection is cleared." Wait for the response and other information. Furthermore, the above indicator is "the second room R2 (inspection area A3)".
再者,作為步驟S111及下述報告中之報告方法,並不限定於上述方法,除此以外,例如可列舉燈等發光部之點亮、熄滅等。 In addition, the method of reporting in the step S111 and the following report is not limited to the above-described method, and examples thereof include lighting and extinction of a light-emitting unit such as a lamp.
繼而,驅動乾燥空氣供給機構53,開始乾燥空氣之供給(步驟S112),驅動加熱機構51,開始冷卻構件之加熱(步驟S113)。藉此,於產生有結露或結冰之情形時,將該結露或結冰去除。又,由於濕度降低,故而可事先防止產生結露或結冰。 Then, the dry air supply means 53 is driven to start the supply of the dry air (step S112), the heating means 51 is driven, and the heating of the cooling means is started (step S113). Thereby, the condensation or icing is removed when condensation or icing occurs. Moreover, since the humidity is lowered, condensation or icing can be prevented in advance.
繼而,利用濕度感測器42檢測第1室R1及第2室R2內之濕度RH(步驟S114),分別判斷於第1室R1及第2室R2內,濕度RH是否為特定之閾值(第1閾值)β以下(步驟S115)。 Then, the humidity sensor 42 detects the humidity RH in the first chamber R1 and the second chamber R2 (step S114), and determines whether or not the humidity RH is a specific threshold in the first chamber R1 and the second chamber R2. 1 threshold value) β or less (step S115).
於判斷出濕度RH不為閾值β以下之情形時,返回至步驟S114,再次執行步驟S114以後之步驟,又,於判斷出濕度RH為閾值β以下之情形時,移行至步驟S116。 When it is determined that the humidity RH is not equal to or less than the threshold value β, the process returns to step S114, the step S114 and subsequent steps are executed again, and when it is determined that the humidity RH is equal to or lower than the threshold value β, the process proceeds to step S116.
再者,關於閾值β,只要為不產生結露或結冰之值,則並無特別限定,可根據各種條件而適當設定,但較佳為設定為50%以上且未達 100%之範圍內,更佳為設定為80%以上且未達100%之範圍內,進而較佳為設定為80%以上且90%以下之範圍內。又,閾值β較佳為設定為小於上述閾值α之值。 In addition, the threshold value β is not particularly limited as long as it does not cause condensation or icing, and can be appropriately set according to various conditions, but is preferably set to 50% or more and is not reached. In the range of 100%, it is more preferably set to 80% or more and less than 100%, and further preferably set to be in the range of 80% or more and 90% or less. Further, the threshold value β is preferably set to a value smaller than the threshold value α.
又,於步驟S103中,於判斷出濕度RH不為閾值α以上之情形時,判斷上一次之電源之切斷是否於冷卻中進行(步驟S104)。 Further, in the case where it is determined in step S103 that the humidity RH is not equal to or greater than the threshold value α, it is determined whether or not the cutting of the previous power source is being performed during cooling (step S104).
於判斷為上一次之電源之切斷於冷卻中進行之情形時,判斷利用計時器802所計測出之時間ta是否為特定時間t1以下(步驟S105),於判斷出時間ta為時間t1以下之情形時,已產生有結露或結冰,或有可能產生結露或結冰,從而進行報告(A)(步驟S106)。 When it is determined that the last power interruption is performed during cooling, it is determined whether or not the time ta measured by the timer 802 is equal to or less than the specific time t1 (step S105), and it is determined that the time ta is equal to or less than the time t1. In the case where condensation or icing has occurred, or condensation or icing may occur, report (A) is performed (step S106).
作為上一次電源被切斷之理由、尤其是儘管為冷卻中但上一次電源被切斷之理由,例如可列舉停電、作業者按壓緊急停止按鈕之情形等。 The reason why the power is cut off last time, in particular, the reason why the power is turned off the last time during cooling is, for example, a power failure, an operator pressing the emergency stop button, or the like.
再者,時間t1並無特別限定,根據各種條件而適當設定,但較佳為設定為5小時以下之範圍內,更佳為設定為4小時以下之範圍內,進而較佳為設定為3小時以下之範圍內。 Further, the time t1 is not particularly limited and is appropriately set depending on various conditions, but is preferably set to a range of 5 hours or less, more preferably set to a range of 4 hours or less, and further preferably set to 3 hours. Within the scope below.
於步驟S106中,於顯示部62之畫面620顯示圖4所示之圖像,並且使警報器71作動,產生警告聲。藉此,作業者可掌握產生有異常、即產生有可能與結露或結冰相關之異常,又,可根據顯示於顯示部62之圖像,而掌握該異常之詳細情況或應對方法等。再者,圖4所示之圖像為1例,以下,說明該1例。 In step S106, the image shown in Fig. 4 is displayed on the screen 620 of the display unit 62, and the alarm 71 is activated to generate a warning sound. Thereby, the operator can grasp that an abnormality has occurred, that is, an abnormality which may be caused by condensation or icing, and the details of the abnormality, the countermeasure, and the like can be grasped based on the image displayed on the display unit 62. In addition, the image shown in FIG. 4 is one example, and the following will be described below.
如圖4所示,於上述圖像中,於圖4中左上之圖框624內,顯示出「停止中」。又,於圖框624內,顯示出「低溫中電源斷。乾吹中。」等各訊息。 As shown in FIG. 4, in the above image, "stopping" is displayed in the upper frame 624 in FIG. Further, in the frame 624, various messages such as "the power supply is disconnected at a low temperature. The dry blow is being used."
繼而,驅動乾燥空氣供給機構53,開始乾燥空氣之供給(步驟S107),驅動加熱機構51,開始冷卻構件之加熱(步驟S108),利用計時器802開始時間(經過時間)tb之計測(步驟S109)。藉此,於產生有結 露或結冰之情形時,將該結露或結冰去除。又,由於濕度降低,故而可事先防止產生結露或結冰。 Then, the dry air supply means 53 is driven to start the supply of the dry air (step S107), the heating means 51 is driven, the heating of the cooling means is started (step S108), and the measurement of the time (elapsed time) tb is started by the timer 802 (step S109). ). In this way, there is a knot In the case of dew or icing, the condensation or icing is removed. Moreover, since the humidity is lowered, condensation or icing can be prevented in advance.
繼而,判斷利用計時器802所計測出之時間tb是否為特定時間t2以上(步驟S110),於判斷出時間tb為特定時間t2以上之情形時,移行至步驟S116。 Then, it is judged whether or not the time tb measured by the timer 802 is equal to or greater than the specific time t2 (step S110), and when it is determined that the time tb is equal to or greater than the specific time t2, the process proceeds to step S116.
再者,時間t2並無特別限定,根據各種條件而適當設定,但較佳為設定為5分鐘以上且1小時以下之範圍內,更佳為設定為10分鐘以上且40分鐘以下之範圍內。 In addition, the time t2 is not particularly limited, and is appropriately set according to various conditions. However, it is preferably set to a range of 5 minutes or more and 1 hour or less, and more preferably set to a range of 10 minutes or more and 40 minutes or less.
繼而,停止加熱機構51之驅動,而停止冷卻構件之加熱(步驟S116),停止乾燥空氣供給機構53之驅動,而停止乾燥空氣之供給(步驟S117),從而成為待機狀態(步驟S118)。 Then, the driving of the heating means 51 is stopped, and the heating of the cooling means is stopped (step S116), the driving of the dry air supply means 53 is stopped, and the supply of the dry air is stopped (step S117), and the standby state is obtained (step S118).
又,於步驟S105中,於判斷出時間ta不為時間t1以下之情形時,推斷出自上一次電源被切斷時起經過充足之時間,未產生結露或結冰,從而不進行特別之處理便成為待機狀態(步驟S118)。 Further, in the case where it is judged in the step S105 that the time ta is not equal to or less than the time t1, it is inferred that sufficient time has elapsed since the last time the power source was turned off, and no condensation or icing occurred, so that no special treatment is performed. It is in the standby state (step S118).
又,於步驟S104中,於判斷出上一次之電源之切斷未於冷卻中進行之情形時,推斷出未產生結露或結冰,從而不進行特別之處理便成為待機狀態(步驟S118)。關於以後之動作,省略其說明。 Further, in the case where it is determined in the step S104 that the previous power supply is not being turned off during cooling, it is estimated that condensation or ice is not generated, and the standby state is obtained without performing special processing (step S118). The description of the subsequent operations will be omitted.
其次,對於初期處理之後監視濕度而進行之檢查裝置1之控制動作進行說明。再者,本處理係於動作中與待機狀態下分別進行。 Next, the control operation of the inspection apparatus 1 performed by monitoring the humidity after the initial processing will be described. Furthermore, this processing is performed separately in the operation and in the standby state.
首先,利用濕度感測器42檢測第1室R1及第2室R2內之濕度(相對濕度)RH,如圖7所示,分別判斷於第1室R1及第2室R2內,濕度RH是否為閾值α以上(步驟S201)。上述濕度之檢測及判斷係定期地進行。再者,該閾值α與上述步驟S103之閾值α相同。 First, the humidity (relative humidity) RH in the first chamber R1 and the second chamber R2 is detected by the humidity sensor 42. As shown in FIG. 7, it is determined whether the humidity RH is in the first chamber R1 and the second chamber R2, respectively. It is equal to or greater than the threshold α (step S201). The detection and determination of the above humidity are performed periodically. Furthermore, the threshold α is the same as the threshold α of the above-described step S103.
於判斷出濕度RH不為閾值α以上之情形時,推斷出未產生結露或結冰,從而不進行特別之處理便移行至下一步驟。關於以後之動作,省略其說明。 When it is judged that the humidity RH is not above the threshold α, it is inferred that no condensation or ice is generated, and the process proceeds to the next step without special treatment. The description of the subsequent operations will be omitted.
又,於步驟S201中,於判斷出濕度RH為閾值α以上之情形時,已產生有結露或結冰、或有可能產生結露或結冰,從而進行報告(步驟S202)。 Further, in the case where it is determined in the step S201 that the humidity RH is equal to or greater than the threshold value α, condensation or icing has occurred, or condensation or icing may occur, and the report is made (step S202).
於步驟S202中,於顯示部62之畫面620,顯示圖3所示之圖像,並且使警報器71作動,產生警告聲。再者,該步驟S202與上述步驟S111相同。 In step S202, the image shown in FIG. 3 is displayed on the screen 620 of the display unit 62, and the alarm 71 is activated to generate a warning sound. Furthermore, this step S202 is the same as the above-described step S111.
繼而,判斷是否為利用冷卻機構52進行冷卻中(步驟S203),於判斷為不在冷卻中之情形時,驅動乾燥空氣供給機構53,開始乾燥空氣之供給(步驟S204),移行至步驟S206。又,於步驟S203中,於判斷為在冷卻中之情形時,停止冷卻機構52之驅動,停止冷卻(步驟S205),移行至步驟S206。再者,於冷卻中之情形時,利用乾燥空氣供給機構53正在進行乾燥空氣供給,故而該乾燥空氣之供給繼續進行。 Then, it is determined whether or not cooling is performed by the cooling mechanism 52 (step S203). When it is determined that the cooling air is not being cooled, the dry air supply means 53 is driven to start supply of dry air (step S204), and the flow proceeds to step S206. Moreover, in step S203, when it is determined that it is cooling, the driving of the cooling mechanism 52 is stopped, the cooling is stopped (step S205), and the process proceeds to step S206. Further, in the case of cooling, the dry air supply means 53 is performing the dry air supply, so the supply of the dry air continues.
繼而,驅動加熱機構51,開始冷卻構件之加熱(步驟S206)。藉此,於產生有結露或結冰之情形時,將該結露或結冰去除。又,由於濕度降低,故而可事先防止產生結露或結冰。 Then, the heating mechanism 51 is driven to start heating of the cooling member (step S206). Thereby, the condensation or icing is removed when condensation or icing occurs. Moreover, since the humidity is lowered, condensation or icing can be prevented in advance.
繼而,利用濕度感測器42檢測第1室R1及第2室R2內之濕度RH(步驟S207),分別判斷於第1室R1及第2室R2內,濕度RH是否為閾值β以下(步驟S208)。再者,該閾值β與上述步驟S115之閾值β相同。 Then, the humidity sensor 42 detects the humidity RH in the first chamber R1 and the second chamber R2 (step S207), and determines whether the humidity RH is equal to or less than the threshold value β in the first chamber R1 and the second chamber R2 (steps) S208). Furthermore, the threshold value β is the same as the threshold value β of the above-described step S115.
於判斷出濕度RH不為非閾值β以下之情形時,返回至步驟S207,再次執行步驟S207以後之步驟。 When it is judged that the humidity RH is not equal to or less than the non-threshold value β, the process returns to step S207, and the steps subsequent to step S207 are performed again.
又,於步驟S208中,於判斷濕度RH為閾值β以下之情形時,停止加熱機構51之驅動,而停止冷卻構件之加熱(步驟S209),停止乾燥空氣供給機構53之驅動,而停止乾燥空氣之供給(步驟S210),移行至下一步驟。關於以後之動作,省略其說明。 Further, in the case where it is determined in step S208 that the humidity RH is equal to or lower than the threshold value β, the driving of the heating mechanism 51 is stopped, and the heating of the cooling member is stopped (step S209), the driving of the dry air supply mechanism 53 is stopped, and the dry air is stopped. The supply is made (step S210), and the process proceeds to the next step. The description of the subsequent operations will be omitted.
其次,對於初期處理之後監視乾燥空氣之供給而進行之檢查裝置1之控制動作進行說明。 Next, the control operation of the inspection apparatus 1 performed by monitoring the supply of dry air after the initial processing will be described.
首先,如圖8所示,判斷利用乾燥空氣供給機構53之乾燥空氣之供給是否存在異常(步驟S301)。 First, as shown in FIG. 8, it is judged whether or not there is an abnormality in the supply of the dry air by the dry air supply means 53 (step S301).
於步驟S301中,於乾燥空氣之供給停止或乾燥空氣之流量降低為特定值a以下之情形時,判斷為異常,於乾燥空氣之流量不為特定值a以下之情形時,判斷為不異常(正常)。再者,利用流量感測器43進行乾燥空氣之流量之檢測,該乾燥空氣之流量之檢測及上述判斷係定期地進行。 In the case where the supply of the dry air is stopped or the flow rate of the dry air is reduced to a specific value a or less, it is determined to be abnormal, and when the flow rate of the dry air is not equal to or less than the specific value a, it is determined that the abnormality is not abnormal ( normal). Further, the flow rate sensor 43 detects the flow rate of the dry air, and the detection of the flow rate of the dry air and the above-described determination are performed periodically.
再者,特定值a並無特別限定,根據各種條件而適當設定,但較佳為設定為100mL/秒以下之範圍內,更佳為設定為10mL/秒以下之範圍內。 In addition, the specific value a is not particularly limited and is appropriately set depending on various conditions, but is preferably set to be in the range of 100 mL/sec or less, and more preferably set to be in the range of 10 mL/sec or less.
於判斷出乾燥空氣之供給存在異常之情形時,已產生有結露或結冰、或有可能產生結露或結冰,從而進行報告(步驟S302)。 When it is judged that there is an abnormality in the supply of the dry air, condensation or ice formation, or condensation or ice formation may occur, and the report is made (step S302).
於步驟S302中,於顯示部62之畫面620顯示圖5所示之圖像,並且使警報器71作動,而產生警告聲。藉此,作業者可掌握產生有異常、產生有可能與結露或結冰相關之異常,又,可根據顯示於顯示部62之圖像,而掌握該異常之詳細情況或應對方法等。再者,圖5所示之圖像為1例,以下,說明該1例。 In step S302, the image shown in FIG. 5 is displayed on the screen 620 of the display unit 62, and the alarm 71 is activated to generate a warning sound. Thereby, the operator can grasp the abnormality that occurs, and may cause an abnormality related to dew condensation or icing, and can grasp the details of the abnormality, the countermeasure, and the like based on the image displayed on the display unit 62. In addition, the image shown in FIG. 5 is one example, and this one is demonstrated below.
如圖5所示,上述圖像具有顯示於畫面620之整體之第1圖像621、及較第1圖像621小地顯示於第1圖像621上之第2圖像622。 As shown in FIG. 5, the image includes a first image 621 displayed on the entire screen 620 and a second image 622 displayed on the first image 621 in a smaller size than the first image 621.
於第1圖像621中,於畫面620之圖5中左上,顯示為「停止中」。 In the first image 621, on the upper left side of the screen 620 in FIG. 5, "Stop" is displayed.
又,於第2圖像622中,於圖框623內,顯示有「梭部沖洗流量異常。」等檢查裝置1之當前之狀態(異常之內容)、「請再試,於選擇清除後開始。」等應對方法等各訊息。又,異常之部位由圓形記號625表示。再者,上述梭部為「器件供給部14」。 Further, in the second image 622, the current state (the content of the abnormality) of the inspection device 1 such as "the shuttle flushing flow rate abnormality" is displayed in the frame 623, "Please try again, and start after the selection is cleared. And other information such as coping methods. Further, the abnormal portion is indicated by a circular mark 625. Further, the shuttle portion is the "device supply portion 14".
繼而,使冷卻機構52停止,從而停止冷卻(步驟S304),驅動加熱機構51,從而開始冷卻構件之加熱(步驟S305),移行至下一步驟。藉 此,於產生有結露或結冰之情形時,將該結露或結冰去除。又,由於溫度上升而使得濕度降低,故而可事先防止產生結露或結冰。 Then, the cooling mechanism 52 is stopped to stop the cooling (step S304), and the heating mechanism 51 is driven to start the heating of the cooling member (step S305), and the process proceeds to the next step. borrow Thus, the condensation or icing is removed in the event of condensation or icing. Moreover, since the humidity is lowered due to an increase in temperature, dew condensation or icing can be prevented in advance.
又,於步驟S303中,於判斷為並非冷卻中之情形時,推斷出未產生結露或結冰,從而不進行特別之處理便移行至下一步驟。 Further, in the case where it is determined in step S303 that it is not in the case of cooling, it is inferred that no condensation or icing has occurred, and the process proceeds to the next step without performing special processing.
又,於步驟S301中,於判斷為乾燥空氣之供給無異常之情形時,推斷出未產生結露或結冰,從而不進行特別之處理便移行至下一步驟。關於以後之動作,省略其說明。 Further, in the case where it is determined in the step S301 that there is no abnormality in the supply of the dry air, it is estimated that no condensation or icing has occurred, and the process proceeds to the next step without performing special processing. The description of the subsequent operations will be omitted.
如以上所作說明般,根據該檢查裝置1,於滿足複數個結露條件中之任一個結露條件之情形時,推斷已產生有結露或結冰,或將產生結露或結冰,從而驅動加熱機構51而將冷卻構件加熱。 As described above, according to the inspection apparatus 1, when the condensation condition of any one of the plurality of condensation conditions is satisfied, it is inferred that condensation or icing has occurred, or dew condensation or icing is generated, thereby driving the heating mechanism 51. The cooling member is heated.
藉此,於產生有結露或結冰之情形時,將該結露或結冰去除,又,可事先防止產生結露或結冰。 Thereby, the condensation or icing is removed when condensation or icing occurs, and dew condensation or icing can be prevented in advance.
又,作業者無需確認結露或結冰,或進行用於加熱之操作,而是檢查裝置1推斷已產生有結露或結冰、或將產生結露或結冰,而自動地驅動加熱機構51,將冷卻構件加熱,故而不花費工夫,又,可抑制因作業者之確認錯誤等而未去除結露或結冰之情況。 Further, the operator does not need to confirm condensation or icing, or performs an operation for heating, but the inspection device 1 infers that condensation or icing has occurred, or condensation or icing will occur, and the heating mechanism 51 is automatically driven. Since the cooling member is heated, it takes no effort, and it is possible to suppress the occurrence of condensation or icing due to an operator's confirmation error or the like.
再者,檢查裝置1亦可進而具有檢測結露或結冰之感測器。於產生有結露或結冰之情形時,可利用該感測器而檢測出產生有結露或結冰,藉此,可去除該結露或結冰。 Furthermore, the inspection device 1 can further have a sensor for detecting condensation or icing. The sensor can be used to detect condensation or icing when condensation or icing occurs, whereby the condensation or icing can be removed.
作為上述感測器,只要為可檢測結露或結冰者,則並無特別限定,例如可列舉洩漏感測器等。 The sensor is not particularly limited as long as it can detect condensation or ice, and examples thereof include a leakage sensor and the like.
<第2實施形態> <Second embodiment>
圖9係表示本發明之電子零件檢查裝置之第2實施形態之方塊圖。 Fig. 9 is a block diagram showing a second embodiment of the electronic component inspection device of the present invention.
以下,對第2實施形態進行說明,但以與上述第1實施形態之不同點為中心進行說明,關於相同之事項省略其說明。 In the following, the second embodiment will be described, but the differences from the above-described first embodiment will be mainly described, and the description of the same matters will be omitted.
如圖9所示,第2實施形態之檢查裝置1具有洩漏感測器44作為檢測用於冷卻機構52之冷媒之液氮之洩漏的感測器。 As shown in FIG. 9, the inspection apparatus 1 of the second embodiment has a leakage sensor 44 as a sensor for detecting leakage of liquid nitrogen for the refrigerant of the cooling mechanism 52.
而且,作為結露條件,除上述第1實施形態中所敍述之(1)~(3)之結露條件以外,亦追加「上述液氮洩漏之情形」之結露條件。 Further, as the dew condensation condition, in addition to the dew condensation conditions (1) to (3) described in the first embodiment, the dew condensation condition of "the case where the liquid nitrogen leaks" is added.
檢查裝置1係定期地利用洩漏感測器44檢測液氮之洩漏,於檢測出液氮之洩漏之情形時,驅動未圖示之加熱機構,將檢查裝置1之會利用洩漏之液氮而冷卻之部分加熱。藉此,事先防止利用洩漏之液氮將預想外之部分冷卻,於該部分產生結露或結冰之情況,又,於產生有結露或結冰之情形時,可將其去除。 The inspection device 1 periodically detects leakage of liquid nitrogen by the leak sensor 44, and when detecting leakage of liquid nitrogen, drives a heating mechanism (not shown) to cool the inspection device 1 by leaking liquid nitrogen. Part of the heating. Thereby, it is prevented in advance by using the leaked liquid nitrogen to cool the unexpected portion, and condensation or icing occurs in the portion, and when condensation or icing occurs, it can be removed.
根據如上所述之第2實施形態,亦可發揮與上述第1實施形態相同之效果。 According to the second embodiment described above, the same effects as those of the first embodiment described above can be exhibited.
<第3實施形態> <Third embodiment>
圖10係表示本發明之電子零件檢查裝置之第3實施形態之概略俯視圖。 Fig. 10 is a schematic plan view showing a third embodiment of the electronic component inspection device of the present invention.
以下,對第3實施形態進行說明,但以與上述第1實施形態之不同點為中心進行說明,關於相同之事項省略其說明。 In the following, the third embodiment will be described, but the differences from the above-described first embodiment will be mainly described, and the description of the same matters will be omitted.
如圖10所示,於第3實施形態之檢查裝置1中,於檢查裝置1之外部,設置有濕度感測器45,利用該濕度感測器45,檢測檢查裝置1之外部之濕度。 As shown in FIG. 10, in the inspection apparatus 1 of the third embodiment, a humidity sensor 45 is provided outside the inspection apparatus 1, and the humidity outside the inspection apparatus 1 is detected by the humidity sensor 45.
而且,作為結露條件,除上述第1實施形態中所述之(1)~(3)之結露條件以外,亦追加「檢查裝置1之外部之濕度為預先設定之特定閾值以上之情形」的結露條件。 In addition to the condensation conditions of (1) to (3) described in the above-described first embodiment, condensation is also added to the case where the humidity outside the inspection device 1 is equal to or greater than a predetermined threshold value set in advance. condition.
檢查裝置1係定期地利用濕度感測器45檢測檢查裝置1之外部之濕度,於該濕度為預先設定之特定之閾值以上之情形時,驅動未圖示之加熱機構,將檢查裝置1之外壁等加熱。藉此,事先防止於檢查裝置1之外壁等產生結露或結冰,又,於產生有結露或結冰之情形時, 可將其去除。 The inspection device 1 periodically detects the humidity outside the inspection device 1 by the humidity sensor 45. When the humidity is equal to or greater than a predetermined threshold value, the heating mechanism (not shown) is driven to the outside of the inspection device 1. Wait for heating. Thereby, condensation or ice formation on the outer wall of the inspection apparatus 1 or the like is prevented in advance, and when condensation or icing occurs, It can be removed.
根據如上所述之第3實施形態,亦可發揮與上述第1實施形態相同之效果。 According to the third embodiment described above, the same effects as those of the first embodiment described above can be exhibited.
<第4實施形態> <Fourth embodiment>
以下,對第4實施形態進行說明,但以與上述第1實施形態之不同點為中心進行說明,關於相同之事項省略其說明。 In the following, the fourth embodiment will be described, but the differences from the first embodiment will be mainly described, and the description of the same matters will be omitted.
第4實施形態之檢查裝置1係關於結露條件,將上述第1實施形態中所敍述之(1)之結露條件變更為下述(1A)之結露條件。 In the inspection apparatus 1 of the fourth embodiment, the dew condensation condition (1) described in the first embodiment is changed to the dew condensation condition of the following (1A).
(1A)利用溫度感測器41所檢測出之溫度成為露點溫度之2倍以下之情形。 (1A) The case where the temperature detected by the temperature sensor 41 becomes twice or less the dew point temperature.
於利用溫度感測器41所檢測出之溫度為露點溫度之2倍以下之情形時,有可能成為露點溫度而產生結露或結冰,從而驅動加熱機構51將冷卻構件加熱,藉此,於產生有結露或結冰之情形時,將該結露或結冰去除,又,可事先防止產生結露或結冰。 When the temperature detected by the temperature sensor 41 is twice or less the dew point temperature, there is a possibility that the dew point temperature is dew condensation or ice formation, and the heating mechanism 51 is driven to heat the cooling member, thereby generating In the case of condensation or icing, the condensation or icing is removed, and condensation or icing can be prevented in advance.
露點溫度可基於利用溫度感測器41所檢測出之溫度、及利用濕度感測器42所檢測出之濕度而求出。即,於控制部80之記憶部801,預先記憶有用於基於溫度及濕度而求出露點溫度之表格或運算式等校準曲線,控制部80係使用上述校準曲線而求出露點溫度。 The dew point temperature can be obtained based on the temperature detected by the temperature sensor 41 and the humidity detected by the humidity sensor 42. In other words, in the memory unit 801 of the control unit 80, a calibration curve such as a table or an arithmetic expression for obtaining the dew point temperature based on temperature and humidity is stored in advance, and the control unit 80 obtains the dew point temperature using the calibration curve.
再者,於本實施形態中,於利用溫度感測器41所檢測出之溫度成為露點溫度之2倍以下之情形時進行加熱,但較佳為於成為露點溫度之0.5倍以上且2倍以下之情形時進行加熱,更佳為於成為1.05倍以上且2倍以下之情形時進行加熱,進而較佳為於成為1.05倍以上且1.5倍以下之情形時進行加熱,特佳為於成為1.1倍以上且1.4倍以下之情形時進行加熱。 In the present embodiment, when the temperature detected by the temperature sensor 41 is twice or less the dew point temperature, the heating is performed, but it is preferably 0.5 times or more and twice or less the dew point temperature. In the case of heating, it is more preferably heated when it is 1.05 times or more and 2 times or less, and further preferably heated when it is 1.05 times or more and 1.5 times or less, and particularly preferably 1.1 times. Heating is performed at the above and 1.4 times or less.
根據如上所述之第4實施形態,亦可發揮與上述第1實施形態相同之效果。 According to the fourth embodiment described above, the same effects as those of the first embodiment described above can be exhibited.
以上,基於圖示之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置進行了說明,但本發明並不限定於此,各部之構成亦可替換為具有相同之功能之任意的構成。又,亦可附加其他任意之構成物。 Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each unit may be replaced with any configuration having the same function. Further, any other constituents may be added.
又,本發明亦可為將上述各實施形態中之任意2種以上之構成(特徵)組合而得者。 Furthermore, the present invention may be obtained by combining any two or more of the above-described configurations (features).
S101~S118‧‧‧步驟 S101~S118‧‧‧Steps
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JP2004273967A (en) * | 2003-03-12 | 2004-09-30 | Sumitomo Heavy Ind Ltd | Chamber temperature control system |
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JP4585979B2 (en) * | 2006-03-08 | 2010-11-24 | エスペック株式会社 | Environmental test equipment |
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2015
- 2015-01-30 KR KR1020150014813A patent/KR101680848B1/en active IP Right Grant
- 2015-03-27 CN CN201510140247.8A patent/CN105314358A/en active Pending
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US6313654B1 (en) * | 1998-06-24 | 2001-11-06 | Advantest Corporation | Device testing apparatus and test method |
US20060112699A1 (en) * | 2002-05-10 | 2006-06-01 | Glocal Co., Ltd | Refrigerating device, refrigerating method, and refrigerated object |
TW200707116A (en) * | 2005-08-12 | 2007-02-16 | Orc Mfg Co Ltd | Exposure device and exposure method |
CN101874185A (en) * | 2007-10-09 | 2010-10-27 | 松下电器产业株式会社 | Refrigerator |
US20110312841A1 (en) * | 2010-06-17 | 2011-12-22 | Geneasys Pty Ltd | Fabrication system for lab-on-a-chip (loc) devices with differing application specific functionality |
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KR101680848B1 (en) | 2016-11-29 |
TW201604553A (en) | 2016-02-01 |
KR20160010286A (en) | 2016-01-27 |
JP2016023994A (en) | 2016-02-08 |
CN105314358A (en) | 2016-02-10 |
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