TWI572869B - Electronic parts conveyor and electronic parts inspection device - Google Patents

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

In the prior art, for example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (Integrated Circuit) device is known, and the electronic component inspection device is incorporated to transfer the IC device to the inspection portion. The electronic component conveying device of the holding portion. When the IC device is inspected, the IC device is placed in the holding portion, and the plurality of probe pins provided in the holding portion are brought into contact with the respective terminals of the IC device.

Regarding the inspection of such an IC device, there is a case where the IC device is cooled to a specific temperature. In this case, the arrangement member in which the IC device is disposed is cooled to cool the IC device, and the humidity of the environment around the above-described arrangement member (humidity in the device) is lowered to prevent condensation or ice formation (ice coating).

Further, there is a case where condensation occurs inside the electronic component conveying device. In this case, the operator confirms the condensation and performs heating to remove the condensation by the operator's operation. Thereby, the above condensation can be removed.

Further, Patent Document 1 discloses a component testing device (electronic component conveying device) configured to have a chamber having a test for cooling a component to a low temperature and performing a test inside. When the temperature is abnormal in the chamber, the cooling is stopped, and the chamber is heated to return to normal temperature. In Patent Document 1, by heating the chamber to return to normal temperature, dew condensation in the chamber can be suppressed.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-9793

However, when condensation occurs inside the electronic component conveying device, the operator removes the heating of the condensation by the operation of the operator, and if the operator cannot find condensation or judges an error, condensation may occur. The state is still being transferred by the IC device. Therefore, there is a problem that water adheres to the IC device and causes a short circuit, so that it cannot be inspected, and the IC device is damaged. Further, if cooling is performed in a state where condensation is generated, ice formation occurs.

Further, in the component testing device described in Patent Document 1, when a temperature abnormality occurs in the chamber, the cooling is uniformly stopped, and the chamber is heated to return to the normal temperature, so that it is not necessary to return the chamber to the normal temperature. In the case of the case, that is, when condensation does not occur, the temperature is also restored to normal temperature. Therefore, there is a problem that it takes a long time before restarting the action.

Further, in the component testing device described in Patent Document 1, when a temperature abnormality occurs in the chamber, the chamber is returned to the normal temperature. Therefore, when condensation occurs in the chamber due to other reasons, the removal cannot be performed. Condensation.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can automatically prevent condensation or icing in advance and which can be removed when condensation or icing occurs.

The present invention has been made in order to solve at least a part of the above problems, and can be realized as the following aspects or application examples.

[Application Example 1]

The electronic component conveying device of the present invention is characterized by comprising: a structure constituting the device a heating unit that heats the member, a humidity detecting unit that detects humidity, and a temperature detecting unit that detects a temperature; and when the temperature detected by the temperature detecting unit is twice or less the dew point temperature , heating the above components.

Thereby, condensation or icing can be prevented from being generated in advance in the member constituting the electronic component conveying device, and can be removed when condensation or icing occurs.

[Application Example 2]

In the electronic component conveying apparatus of the present invention, it is preferable that the member is heated when the temperature detected by the temperature detecting unit is 0.5 times or more and twice or less the dew point temperature.

Thereby, condensation or icing can be prevented from being generated in advance in the member constituting the electronic component conveying device, and can be removed when condensation or icing occurs.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, it is preferable that the humidity of the air in contact with the member is lower than the humidity of the air in contact with the humidity detecting portion.

Therefore, when the temperature detecting portion is not attached to the member or the like, when the temperature of the member is lower than the temperature around the temperature detecting portion, the probability of occurrence of dew condensation or icing becomes high, but by the above The humidity of the air around the component becomes low, which reduces the probability of condensation or icing.

[Application Example 4]

In the electronic component conveying apparatus of the present invention, it is preferable that the temperature detecting unit is disposed in the member.

Thereby, the temperature of the member can be directly measured, and the temperature detecting portion can be disposed by the portion where the condensation is prevented, thereby preventing condensation or knot from being formed in the portion of the condensation. Ice, in addition, can be removed in the event of condensation or icing.

[Application 5]

In the electronic component conveying apparatus of the present invention, it is preferable that the member is disposed in a room controlled to a specific humidity of the electronic component conveying device.

Thereby, condensation or icing can be prevented in advance in the above-mentioned members which are not particularly intended to cause condensation or icing, and can be removed when condensation or icing occurs.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, it is preferable that the heating unit includes a heating wire.

Thereby, condensation or icing can be easily and quickly removed.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, it is preferable that the heating unit includes a blower.

Thereby, condensation or icing can be removed more easily and quickly.

[Application Example 8]

In the electronic component conveying apparatus of the present invention, it is preferable that the heating is stopped when the humidity in the room of the electronic component conveying device is equal to or lower than a specific first threshold value.

Thereby, dew condensation or icing can be prevented from occurring in the above-mentioned members in advance, and when condensation or icing occurs, it can be removed.

[Application Example 9]

In the electronic component conveying apparatus of the present invention, it is preferable that the heating is stopped when a certain period of time elapses.

Thereby, condensation or icing is prevented from occurring in the above-mentioned members in advance, and when condensation or icing occurs, it can be removed.

[Application Example 10]

The electronic component conveying apparatus of the present invention is characterized by comprising: a member constituting the device; and a heating portion that heats the member; and when the predetermined condition is satisfied, the member is heated.

Thereby, condensation or icing can be prevented from being generated in advance in the member constituting the electronic component conveying device, and can be removed when condensation or icing occurs.

[Application Example 11]

In the electronic component conveying apparatus of the present invention, it is preferable that the member has a cooling member that can dispose an electronic component and can be cooled.

Thereby, dew condensation or icing can be prevented from occurring in the above-described cooling member, and it can be removed when condensation or icing occurs.

[Application Example 12]

In the electronic component conveying apparatus of the present invention, preferably, the condition is such that the cooling member is turned off in a cooled state, and then the power source is turned on.

Thereby, dew condensation or icing can be prevented from occurring in the above-described cooling member, and it can be removed when condensation or icing occurs.

[Application Example 13]

In the electronic component conveying apparatus of the present invention, preferably, the cooling condition is that the cooling member is turned off in a cooled state, and the power source is turned on within a predetermined time from when the power source is turned off. situation.

Thereby, dew condensation or icing can be prevented from occurring in the above-described cooling member, and it can be removed when condensation or icing occurs.

[Application Example 14]

In the electronic component conveying apparatus of the present invention, it is preferable that the cooling of the cooling member uses liquid nitrogen, and the above condition is a case where the liquid nitrogen leaks.

Thereby, it is possible to prevent the unexpected portion from being cooled in advance, and to cause condensation or icing in the portion, and to remove it when condensation or icing occurs.

[Application Example 15]

In the electronic component conveying apparatus of the present invention, it is preferable that the humidity in at least one of the indoor components of the electronic component conveying device is equal to or greater than a specific second threshold.

Thereby, dew condensation or icing can be prevented from occurring in the above-mentioned members in advance, and when condensation or icing occurs, it can be removed.

[Application Example 16]

In the electronic component conveying apparatus of the present invention, it is preferable that the dried gas is supplied to at least one of the chambers of the electronic component conveying device, and the condition is that the supply of the gas is stopped or the flow rate of the gas is decreased to a specific value or less. .

Thereby, dew condensation or icing can be prevented from occurring in the above-mentioned members in advance, and when condensation or icing occurs, it can be removed.

[Application Example 17]

Preferably, the electronic component transporting apparatus of the present invention has a plurality of control modes for controlling the operation of the electronic component transporting device, and includes a display unit that displays a control mode currently set in the plurality of control modes. Corresponding image.

Thereby, the operator can grasp the information, the countermeasures, and the like related to condensation or icing, for example, and the operator can grasp it easily and quickly.

[Application Example 18]

The electronic component inspection apparatus of the present invention is characterized by comprising: a member constituting the device; a heating portion that heats the member; and a humidity detecting portion that detects the humidity; The temperature detecting unit detects the temperature; and the inspection unit checks the electronic component; and when the temperature detected by the temperature detecting unit is twice or less the dew point temperature, the member is heated.

Thereby, condensation or icing can be prevented from being generated in advance in the members constituting the electronic component inspection device, and can be removed when condensation or icing occurs.

1‧‧‧Inspection device (electronic parts inspection device)

6‧‧‧Operation Department

11A‧‧‧1st pallet transport mechanism

11B‧‧‧2nd tray transport mechanism

12‧‧‧Temperature adjustment unit (soaking plate)

13‧‧‧1st device transport head

14‧‧‧Device Supply Department (Supply Shuttle)

15‧‧‧3rd pallet transport mechanism

16‧‧‧Inspection Department

17‧‧‧2nd device transport head

18‧‧‧Device Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧3rd device transport head

21‧‧‧6th tray transport mechanism

22A‧‧‧4th tray transport mechanism

22B‧‧‧5th pallet transport mechanism

41‧‧‧Temperature Sensor

42, 45‧‧‧ Humidity Sensor

43‧‧‧Flow sensor

44‧‧‧Leak sensor

51‧‧‧ heating mechanism

52‧‧‧Cooling mechanism

53‧‧‧Dry air supply mechanism

61‧‧‧ Input Department

62‧‧‧Display Department

71‧‧‧Alarm

80‧‧‧Control Department

90‧‧‧IC devices

200‧‧‧Tray

620‧‧‧ screen

621‧‧‧1st image

622‧‧‧2nd image

623, 624‧‧‧ frame

625‧‧‧round mark

801‧‧‧Memory Department

802‧‧ ‧timer

803‧‧‧Discrimination Department

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

S101~S118‧‧‧Steps

S201~S210‧‧‧Steps

S301~S305‧‧‧Steps

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.

Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1.

Fig. 3 is a view showing a display screen of a display unit of the electronic component inspection device shown in Fig. 1;

Fig. 4 is a view showing a display screen of a display unit of the electronic component inspection device shown in Fig. 1;

Fig. 5 is a view showing a display screen of a display unit of the electronic component inspection device shown in Fig. 1;

Fig. 6 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.

Fig. 7 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.

Fig. 8 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.

Fig. 9 is a block diagram showing a second embodiment of the electronic component inspection device of the present invention.

Fig. 10 is a schematic plan view showing a third embodiment of the electronic component inspection device of the present invention.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on the embodiments shown in the drawings.

<First embodiment>

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1. 3 to 5 are views showing display screens of the display unit of the electronic component inspection device shown in Fig. 1, respectively. 6 to 8 are flowcharts showing the control operation of the electronic component inspection device shown in Fig. 1, respectively.

In the following, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is referred to as "X direction", the direction parallel to the Y axis is referred to as "Y direction", and the direction parallel to the Z axis is referred to as "Z direction". Further, the direction of the arrow of each of the X-axis, the Y-axis, and the Z-axis is referred to as a positive side, and the direction opposite to the arrow is referred to as a negative side. Moreover, the upstream side of the conveyance direction of the electronic component is also simply referred to as "upstream side", and the downstream side is simply referred to as "downstream side". Moreover, the "level" mentioned in the specification of the present invention is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as it does not hinder the conveyance of the electronic component.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is, for example, an IC device such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package, and an LCD (Liquid). A device for inspecting and testing (hereinafter referred to as "inspection") for electrical characteristics of electronic components such as a crystal display (Crystal Display), a CIS (CMOS (Complementary Metal Oxide Semiconductor) Image Sensor, and a complementary MOS image sensor). In the following, for convenience of explanation, a case where the IC device is used as the electronic component to be inspected is typically described, and this is referred to as "IC device 90".

As shown in FIG. 1, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a device collection area (hereinafter simply referred to as "recovery area") A4, and The tray removes the area A5. These regions are separated from each other by a wall portion, a baffle or the like (not shown). Further, the supply region A2 is formed by a wall portion or a baffle plate or the like. In the first chamber R1 which is formed separately, the inspection area A3 is the second chamber R2 which is divided by the wall portion, the baffle plate, or the like, and the recovery region A4 is the third chamber R3 which is formed by the wall portion, the baffle plate or the like. Further, the first chamber R1 (supply area A2), the second chamber R2 (inspection area A3), and the third chamber R3 (recovery area A4) are each configured to ensure airtightness or heat insulation. Thereby, the humidity in the first chamber R1, the second chamber R2, and the third chamber R3 can be maintained as much as possible. Further, the first chamber R1 and the second chamber R2 are controlled to have specific humidity and a specific temperature, respectively.

The IC device 90 is inspected sequentially from the tray supply area A1 to the tray removal area A5 via the above-described respective areas and in the middle of the inspection area A3. In this way, the inspection apparatus 1 includes an electronic component transport apparatus that transports the IC device 90 in each area and has a control unit 80; the inspection unit 16 performs inspection in the inspection area A3; and an inspection control unit (not shown). Further, in the inspection apparatus 1, the electronic component conveying apparatus includes a configuration other than the inspection unit 16 and the inspection control unit.

The tray supply area A1 is an area for supplying the tray 200, and the tray 200 is arranged with a plurality of IC devices 90 in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 supplies a plurality of IC devices 90 from the tray 200 of the tray supply area A1 to the area of the inspection area A3. In addition, the first tray transport mechanism 11A and the second tray transport mechanism 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

In the supply region A2, a temperature adjustment unit (soaking plate) 12, a first device transfer head (transport member) 13, and a third tray transfer mechanism 15 as arrangement portions of the IC device 90 are provided.

The temperature adjustment unit 12 heats or cools a plurality of IC devices 90 to adjust (control) the IC device 90 to a temperature suitable for inspection. That is, the temperature adjustment unit 12 is a cooling member (member) that can dispose the IC device 90 and can be cooled. In the configuration shown in FIG. 1, the temperature adjustment unit 12 is disposed and fixed in the Y direction. Moreover, the first tray transport mechanism The IC device 90 on the tray 200 that has been carried in (transferred) from the tray supply area A1 is transported and placed on any one of the temperature adjustment units 12.

The first device transfer head 13 is supported to be movable in the supply region A2. Thereby, the first device transfer head 13 can carry the IC device 90 between the tray 200 loaded from the tray supply region A1 and the temperature adjustment unit 12, and the IC between the temperature adjustment unit 12 and the device supply unit 14 described below. Transfer of device 90. Further, the first device transfer head 13 has a plurality of holding portions (not shown) for holding the IC device 90, and each of the holding portions includes a suction nozzle for holding the IC device 90 by suction.

The third tray transport mechanism 15 is a mechanism that transports the empty tray 200 in a state in which all of the IC devices 90 have been removed in the X direction. Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transport mechanism 11B.

The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14 as an electronic component transport unit for transporting the IC device 90, an inspection unit 16, a second device transfer head (contact portion) 17, and a device recovery unit (recycling) are provided. Shuttle) 18.

The device supply unit 14 transports the temperature-adjusted (temperature-controlled) IC device 90 to a device in the vicinity of the inspection unit 16. The device supply portion 14 is supported to be movable in the X direction between the supply region A2 and the inspection region A3. Further, in the configuration shown in FIG. 1, the device supply unit 14 is disposed in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported and placed on any of the device supply units 14. Further, in the device supply unit 14, the IC device 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC device 90 can be adjusted to a temperature suitable for inspection. That is, the device supply portion 14 is a cooling member (member) that can dispose the IC device 90 and can be cooled.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, that is, holds the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 while the IC device 90 is held. Moreover, the terminal of the IC device 90 is electrically connected (contacted) to the probe pin, The inspection of the IC device 90 is performed via the probe pins. The inspection of the IC device 90 is performed based on a program stored in the memory unit of the inspection control unit provided in the tester (not shown) connected to the inspection unit 16. Further, in the inspection unit 16, the IC device 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC device 90 can be adjusted to a temperature suitable for inspection. That is, the inspection unit 16 is a cooling member (member) that can dispose the IC device 90 and can be cooled.

The second device transfer head 17 is supported to be movable within the inspection area A3. Thereby, the second device transfer head 17 can transport the IC device 90 on the device supply unit 14 carried in from the supply region A2 and carry it on the inspection unit 16. Further, when the IC device 90 is inspected, the second device transfer head 17 presses the IC device 90 toward the inspection portion 16, whereby the IC device 90 is brought into contact with the inspection portion 16. Thereby, the terminal of the IC device 90 is electrically connected to the probe pin of the inspection portion 16 as described above. Further, the second device transfer head 17 has a plurality of holding portions (not shown) for holding the IC device 90, and each of the holding portions includes a suction nozzle for holding the IC device 90 by suction. Further, in the second device transfer head 17, the IC device 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC device 90 can be adjusted to a temperature suitable for inspection. That is, the second device transfer head 17 is a cooling member (member) that can dispose the IC device 90 and can be cooled.

The device recovery unit 18 is a device that transports the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device recovery portion 18 is supported to be movable in the X direction between the inspection region A3 and the recovery region A4. Further, in the configuration shown in FIG. 1, the device recovery unit 18 is disposed in the Y direction in the same manner as the device supply unit 14, and the IC device 90 on the inspection unit 16 is transported and placed in any device recovery unit. 18. This transfer is performed by the second device transfer head 17.

The recovery area A4 is used to recover the area of the IC device 90 that has been checked. In the collection area A4, a collection tray 19, a third device transfer head (transport member) 20, and a sixth tray transfer mechanism 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared.

The recovery tray 19 is fixed in the collection area A4, and in the configuration shown in Fig. 1, three are arranged in the X direction. Further, the empty tray 200 is also arranged in three in the X direction. And, toward The IC device 90 on the device recovery unit 18 in which the recovery area A4 moves is transported and placed on any of the recovery trays 19 and the empty trays 200. Thereby, the IC device 90 is recovered and classified according to each inspection result.

The third device transfer head 20 is supported to be movable within the recovery area A4. Thereby, the third device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. Further, the third device transfer head 20 has a plurality of holding portions (not shown) for holding the IC device 90, and each of the holding portions includes a suction nozzle, and the IC device 90 is held by suction.

The sixth tray transport mechanism 21 is a mechanism that transports the empty tray 200 carried in from the tray removal area A5 in the X direction. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it becomes one of the above three empty trays 200.

The tray removal area A5 is an area in which the trays 200 of the plurality of IC devices 90 in the inspection end state are collected and removed. In the tray removal area A5, a plurality of trays 200 can be stacked.

Moreover, the fourth tray conveyance mechanism 22A and the fifth tray conveyance mechanism 22B that convey the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism that transports the empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

The inspection control unit of the tester performs inspection of electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory unit (not shown).

Further, the control unit 80 controls, for example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the temperature adjustment unit 12, the first device transport head 13, the device supply unit 14, the third tray transport mechanism 15, the inspection unit 16, and the first The driving of each of the device transfer head 17, the device recovery unit 18, the third device transfer head 20, the sixth tray transfer mechanism 21, the fourth tray transfer mechanism 22A, and the fifth tray transfer mechanism 22B.

Further, as shown in FIG. 2, the inspection apparatus 1 includes a temperature sensor (temperature detecting unit) 41 that detects temperature, a humidity sensor (humidity detecting unit) 42, which detects humidity, and a flow sensor 43 that The following flow rate of dry air is detected; a heating mechanism (heating unit) 51 for heating; a cooling mechanism (cooling unit) 52 for cooling; a dry air supply unit (dry air supply unit) 53 for supplying dry air; Part 6, which performs each operation of the inspection apparatus 1; and an alarm 71. Further, in FIG. 2, for example, a plurality of the temperature sensor 41, the humidity sensor 42, the flow sensor 43, the heating mechanism 51, and the like are provided, and only one of them is representatively shown. Further, the control unit 80 includes a memory unit 801 that stores each information, a timer 802 that performs time measurement, and a determination unit 803 that performs each determination (determination), and controls the heating mechanism 51, the cooling mechanism 52, the dry air supply mechanism 53, The driving of each unit such as the display unit 62 and the alarm unit 71.

The temperature sensor 41 and the humidity sensor 42 are respectively disposed in specific portions inside the inspection device 1. In the present embodiment, the temperature sensor 41 and the humidity sensor 42 are disposed in the first chamber R1 and the second chamber R2, and the temperature sensor is provided. 41 and the humidity sensor 42 can detect the temperature and humidity in the first chamber R1 and the second chamber R2, respectively. In this case, the temperature sensor 41 may be disposed at any position in the first chamber R1 and the second chamber R2, but is preferably disposed in the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device. Head 17. Thereby, the temperature of the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17 can be directly measured.

Furthermore, in the present embodiment, each humidity is a relative humidity.

The flow sensor 43 is disposed in each of the specific portions inside the inspection device 1. In the present embodiment, the flow path of the dry air disposed in each of the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device recovery unit 18 is provided. The flow sensor 43 can be used to detect the flow rate of the dry air in the flow path, respectively.

Further, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard, a mouse, and the like. Further, the display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL (Electro Luminescence) display panel and the like. The operation of the operator's operation unit 6 is performed by, for example, operating the input unit 61 to move the cursor to the position of each operation button (illustration) displayed on the display unit 62, and performing selection (clicking) to complete the operation. This operation is also referred to as "pressing the operation button".

Further, part or all of each of the operation buttons displayed on the display unit 62 may be provided as a mechanical operation button such as a push button.

In addition, the operation unit 6 is not limited to the above-described configuration, and examples thereof include a device that can perform input and image display such as a touch panel.

Further, the heating mechanism 51 is not particularly limited, and examples thereof include a heater having a heating wire. Further, the heating mechanism 51 may be configured to further include a blower such as a fan, and blow a warm air (hot air) by the air supply source. In the present embodiment, the heating mechanism 51 is disposed in the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17, and can be heated. When the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17 are heated, the temperature adjustment unit 12, the device supply unit 14, and the inspection unit 16 are disposed in accordance with the heating. The temperature of the chamber of the second device transfer head 17 also rises.

In addition, the cooling mechanism 52 is not particularly limited, and examples thereof include a device that causes a refrigerant (for example, a low-temperature gas) to flow into a tube disposed in the vicinity of the object to be cooled, and a Peltier element. In the present embodiment, the cooling mechanism 52 is a device that cools the refrigerant into the pipe body disposed in the vicinity of the object to be cooled, and uses nitrogen gas obtained by nitrogenizing the liquid as a refrigerant. Further, in the present embodiment, the cooling mechanism 52 can cool the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17, respectively. When the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17 are cooled, the temperature adjustment unit 12, the device supply unit 14, and the inspection unit 16 are disposed in accordance with the cooling. The temperature of the chamber of the second device transfer head 17 is also lowered.

Further, the dry air supply unit 53 is configured to supply (flow) air such as air or nitrogen having a low humidity to a specific portion of the inside of the inspection device 1 (hereinafter also referred to as dry air). gas). When the IC device 90 is cooled to a specific temperature and inspected, the required portions are cooled accordingly, but dew condensation and icing (ice coating) can be prevented by supplying dry air to the desired portions. . In the present embodiment, the dry air supply unit 53 can supply dry air to the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device recovery unit 18, that is, the first chamber R1, the second chamber R2, and the first chamber. Room 3 R3 supplies dry air.

Further, the humidity of the air in contact with the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17 is preferably lower than the humidity of the air in contact with the humidity sensor 42. Therefore, when the temperature sensor 41 is not attached to the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17, the temperature adjustment unit 12 and the device supply unit 14 are set. When the temperature of the inspection unit 16 and the second device transfer head 17 is lower than the temperature around the temperature sensor 41, the probability of dew condensation or icing becomes high, but the temperature adjustment unit 12, the device supply unit 14, and the inspection are performed. The humidity of the air around the portion 16 and the second device transfer head 17 becomes low, and the probability of occurrence of dew condensation or icing is lowered.

Further, in the case where the dry air used in the dry air supply means 53 is cooled by the cooling means 52, the dry air used in the cooling mechanism 52 is air which is used after the cooling means 52 and the air having a low humidity. The mixed gas is only the above-mentioned low humidity air when the above cooling is stopped.

In the inspection apparatus 1, at least one condition of condensation or icing of at least one of the members (constituting members) constituting the inspection apparatus 1 is previously stored in the memory unit 801 of the control unit 80. Further, the determination unit 803 determines whether or not any of the above conditions is satisfied, and when any of the above conditions is satisfied, the heating means 51 heats the constituent members.

In addition, in the following, the above conditions are also referred to as "condensation conditions". In the present embodiment, the above-described constituent members are described as the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transfer head 17, but these are collectively referred to as "cooling members" hereinafter. .

In the present embodiment, the following condensation conditions of (1) to (3) are stored in the memory unit 801.

(1) The humidity in the room of at least one of the first chamber R1 and the second chamber R2 is equal to or greater than a predetermined threshold (second threshold) α set in advance.

When the condensation condition is satisfied, that is, when the humidity of the first chamber R1 is equal to or greater than the threshold value α, the cooling member disposed in the first chamber R1 is heated, and the humidity in the second chamber R2 is a threshold value. In the case of α or more, the cooling member disposed in the second chamber R2 is heated. Further, in the following, such a difference is not indicated, and it is simply referred to as "heating".

(2) A case where the power is turned off while the cooling member has been cooled, and then the power is turned on.

It is preferable that the dew condensation condition and the additional condition are such that "the power is turned off in a state where the cooling member is cooled, and the power is turned on within a predetermined time t1 from the time when the power source is turned off". The reason for this is that even when the power supply is turned off while the cooling member has cooled, and then the power is turned on, if the power supply is turned off for a long time, the temperature of the cooling member rises during this period without There is a high probability of condensation or icing.

Further, when the condensation condition is satisfied, each of the cooling members is heated. In addition, hereinafter, it is only called "heating".

(3) The supply of dry air is stopped or the flow rate of dry air is reduced to a specific value or less.

It is preferable that the dew condensation condition and the additional condition are such that "the supply of dry air is stopped or the flow rate of the dry air is reduced to a predetermined value or less and is in a state of being cooled". The reason is that if it is not cooled, there is a high possibility that condensation or icing will not occur.

In addition, when the dew condensation condition is satisfied, the supply of the dry air is stopped or the flow rate of the dry air is reduced to a specific value or less, that is, the indoor air in which the cooling member is disposed is supplied with dry air. Furthermore, the following does not indicate such a difference, but only "Supply dry air."

Next, the control operation of the inspection device 1 will be described.

The inspection device 1 has a plurality of control modes that control its operation. In the present embodiment, the control mode includes a first control mode (power failure recovery mode), a second control mode (over-humidity detection mode), and a third control mode (dry air abnormal mode).

The first control mode is a control mode in the process (initial processing) when the power-off state is changed to the power-on state. Further, the second control mode is a control mode in the process of monitoring the humidity after the initial processing. Further, the third control mode is a control mode in the process of monitoring the supply of dry air after the initial processing.

In the following, the process of changing the state from the power-off state to the power-on state will be described with reference to Fig. 6. The process of monitoring the humidity after the initial processing will be described based on Fig. 7, and the initial processing will be described based on Fig. 8 . The process of monitoring the supply of dry air is then described.

First, the control operation of the inspection apparatus 1 in the initial processing in the case where the power is turned off from the state where the power is turned off will be described.

Further, the time measurement is performed by the timer 802 from the time when the power is turned off, and the time (elapsed time) measured by the timer 802 is set to "ta".

As shown in FIG. 6, first, the power is turned on (step S101), and thereafter, the humidity (relative humidity) RH in the first chamber R1 and the second chamber R2 is detected by the humidity sensor 42 (step S102), and respectively judged. Whether the humidity RH is equal to or greater than the threshold value α in the first chamber R1 and the second chamber R2 (step S103).

When it is judged that the humidity RH is equal to or higher than the threshold value α, condensation or icing has occurred, or condensation or icing may occur, and the report (B) is performed (step S111).

In addition, the threshold value α is not particularly limited, and is appropriately set according to various conditions, and is preferably set in a range of 90% or more and 100% or less, and more preferably in a range of 95% or more and 100% or less. In the present embodiment, for example, it is set to 100%.

In step S111, the image shown in FIG. 3 is displayed on the screen 620 of the display unit 62, and And the alarm 71 is activated to generate a warning sound. Thereby, the operator can grasp that an abnormality has occurred, that is, an abnormality that may cause condensation or ice formation, and the details of the abnormality, the countermeasure, and the like can be grasped based on the image displayed on the display unit 62. In addition, the image shown in FIG. 3 is one example, and this one is demonstrated below.

As shown in FIG. 3, the image has a first image (main window) 621 displayed on the entire screen 620, and a second image (sub-window) 622, which is called a dialog box and the like. The first image 621 is displayed on the first image 621 smaller.

In the first image 621, "stopping" is displayed on the upper left side of the screen 620 in FIG.

Further, in the second image 622, in the frame 623, the current state (the content of the abnormality) of the inspection device 1 such as "the indicator is abnormal in humidity" is displayed, "Please try again, and start after the selection is cleared." Wait for the response and other information. Furthermore, the above indicator is "the second room R2 (inspection area A3)".

In addition, the method of reporting in the step S111 and the following report is not limited to the above-described method, and examples thereof include lighting and extinction of a light-emitting unit such as a lamp.

Then, the dry air supply means 53 is driven to start the supply of the dry air (step S112), the heating means 51 is driven, and the heating of the cooling means is started (step S113). Thereby, the condensation or icing is removed when condensation or icing occurs. Moreover, since the humidity is lowered, condensation or icing can be prevented in advance.

Then, the humidity sensor 42 detects the humidity RH in the first chamber R1 and the second chamber R2 (step S114), and determines whether or not the humidity RH is a specific threshold in the first chamber R1 and the second chamber R2. 1 threshold value) β or less (step S115).

When it is determined that the humidity RH is not equal to or less than the threshold value β, the process returns to step S114, the step S114 and subsequent steps are executed again, and when it is determined that the humidity RH is equal to or lower than the threshold value β, the process proceeds to step S116.

In addition, the threshold value β is not particularly limited as long as it does not cause condensation or icing, and can be appropriately set according to various conditions, but is preferably set to 50% or more and is not reached. In the range of 100%, it is more preferably set to 80% or more and less than 100%, and further preferably set to be in the range of 80% or more and 90% or less. Further, the threshold value β is preferably set to a value smaller than the threshold value α.

Further, in the case where it is determined in step S103 that the humidity RH is not equal to or greater than the threshold value α, it is determined whether or not the cutting of the previous power source is being performed during cooling (step S104).

When it is determined that the last power interruption is performed during cooling, it is determined whether or not the time ta measured by the timer 802 is equal to or less than the specific time t1 (step S105), and it is determined that the time ta is equal to or less than the time t1. In the case where condensation or icing has occurred, or condensation or icing may occur, report (A) is performed (step S106).

The reason why the power is cut off last time, in particular, the reason why the power is turned off the last time during cooling is, for example, a power failure, an operator pressing the emergency stop button, or the like.

Further, the time t1 is not particularly limited and is appropriately set depending on various conditions, but is preferably set to a range of 5 hours or less, more preferably set to a range of 4 hours or less, and further preferably set to 3 hours. Within the scope below.

In step S106, the image shown in Fig. 4 is displayed on the screen 620 of the display unit 62, and the alarm 71 is activated to generate a warning sound. Thereby, the operator can grasp that an abnormality has occurred, that is, an abnormality which may be caused by condensation or icing, and the details of the abnormality, the countermeasure, and the like can be grasped based on the image displayed on the display unit 62. In addition, the image shown in FIG. 4 is one example, and the following will be described below.

As shown in FIG. 4, in the above image, "stopping" is displayed in the upper frame 624 in FIG. Further, in the frame 624, various messages such as "the power supply is disconnected at a low temperature. The dry blow is being used."

Then, the dry air supply means 53 is driven to start the supply of the dry air (step S107), the heating means 51 is driven, the heating of the cooling means is started (step S108), and the measurement of the time (elapsed time) tb is started by the timer 802 (step S109). ). In this way, there is a knot In the case of dew or icing, the condensation or icing is removed. Moreover, since the humidity is lowered, condensation or icing can be prevented in advance.

Then, it is judged whether or not the time tb measured by the timer 802 is equal to or greater than the specific time t2 (step S110), and when it is determined that the time tb is equal to or greater than the specific time t2, the process proceeds to step S116.

In addition, the time t2 is not particularly limited, and is appropriately set according to various conditions. However, it is preferably set to a range of 5 minutes or more and 1 hour or less, and more preferably set to a range of 10 minutes or more and 40 minutes or less.

Then, the driving of the heating means 51 is stopped, and the heating of the cooling means is stopped (step S116), the driving of the dry air supply means 53 is stopped, and the supply of the dry air is stopped (step S117), and the standby state is obtained (step S118).

Further, in the case where it is judged in the step S105 that the time ta is not equal to or less than the time t1, it is inferred that sufficient time has elapsed since the last time the power source was turned off, and no condensation or icing occurred, so that no special treatment is performed. It is in the standby state (step S118).

Further, in the case where it is determined in the step S104 that the previous power supply is not being turned off during cooling, it is estimated that condensation or ice is not generated, and the standby state is obtained without performing special processing (step S118). The description of the subsequent operations will be omitted.

Next, the control operation of the inspection apparatus 1 performed by monitoring the humidity after the initial processing will be described. Furthermore, this processing is performed separately in the operation and in the standby state.

First, the humidity (relative humidity) RH in the first chamber R1 and the second chamber R2 is detected by the humidity sensor 42. As shown in FIG. 7, it is determined whether the humidity RH is in the first chamber R1 and the second chamber R2, respectively. It is equal to or greater than the threshold α (step S201). The detection and determination of the above humidity are performed periodically. Furthermore, the threshold α is the same as the threshold α of the above-described step S103.

When it is judged that the humidity RH is not above the threshold α, it is inferred that no condensation or ice is generated, and the process proceeds to the next step without special treatment. The description of the subsequent operations will be omitted.

Further, in the case where it is determined in the step S201 that the humidity RH is equal to or greater than the threshold value α, condensation or icing has occurred, or condensation or icing may occur, and the report is made (step S202).

In step S202, the image shown in FIG. 3 is displayed on the screen 620 of the display unit 62, and the alarm 71 is activated to generate a warning sound. Furthermore, this step S202 is the same as the above-described step S111.

Then, it is determined whether or not cooling is performed by the cooling mechanism 52 (step S203). When it is determined that the cooling air is not being cooled, the dry air supply means 53 is driven to start supply of dry air (step S204), and the flow proceeds to step S206. Moreover, in step S203, when it is determined that it is cooling, the driving of the cooling mechanism 52 is stopped, the cooling is stopped (step S205), and the process proceeds to step S206. Further, in the case of cooling, the dry air supply means 53 is performing the dry air supply, so the supply of the dry air continues.

Then, the heating mechanism 51 is driven to start heating of the cooling member (step S206). Thereby, the condensation or icing is removed when condensation or icing occurs. Moreover, since the humidity is lowered, condensation or icing can be prevented in advance.

Then, the humidity sensor 42 detects the humidity RH in the first chamber R1 and the second chamber R2 (step S207), and determines whether the humidity RH is equal to or less than the threshold value β in the first chamber R1 and the second chamber R2 (steps) S208). Furthermore, the threshold value β is the same as the threshold value β of the above-described step S115.

When it is judged that the humidity RH is not equal to or less than the non-threshold value β, the process returns to step S207, and the steps subsequent to step S207 are performed again.

Further, in the case where it is determined in step S208 that the humidity RH is equal to or lower than the threshold value β, the driving of the heating mechanism 51 is stopped, and the heating of the cooling member is stopped (step S209), the driving of the dry air supply mechanism 53 is stopped, and the dry air is stopped. The supply is made (step S210), and the process proceeds to the next step. The description of the subsequent operations will be omitted.

Next, the control operation of the inspection apparatus 1 performed by monitoring the supply of dry air after the initial processing will be described.

First, as shown in FIG. 8, it is judged whether or not there is an abnormality in the supply of the dry air by the dry air supply means 53 (step S301).

In the case where the supply of the dry air is stopped or the flow rate of the dry air is reduced to a specific value a or less, it is determined to be abnormal, and when the flow rate of the dry air is not equal to or less than the specific value a, it is determined that the abnormality is not abnormal ( normal). Further, the flow rate sensor 43 detects the flow rate of the dry air, and the detection of the flow rate of the dry air and the above-described determination are performed periodically.

In addition, the specific value a is not particularly limited and is appropriately set depending on various conditions, but is preferably set to be in the range of 100 mL/sec or less, and more preferably set to be in the range of 10 mL/sec or less.

When it is judged that there is an abnormality in the supply of the dry air, condensation or ice formation, or condensation or ice formation may occur, and the report is made (step S302).

In step S302, the image shown in FIG. 5 is displayed on the screen 620 of the display unit 62, and the alarm 71 is activated to generate a warning sound. Thereby, the operator can grasp the abnormality that occurs, and may cause an abnormality related to dew condensation or icing, and can grasp the details of the abnormality, the countermeasure, and the like based on the image displayed on the display unit 62. In addition, the image shown in FIG. 5 is one example, and this one is demonstrated below.

As shown in FIG. 5, the image includes a first image 621 displayed on the entire screen 620 and a second image 622 displayed on the first image 621 in a smaller size than the first image 621.

In the first image 621, on the upper left side of the screen 620 in FIG. 5, "Stop" is displayed.

Further, in the second image 622, the current state (the content of the abnormality) of the inspection device 1 such as "the shuttle flushing flow rate abnormality" is displayed in the frame 623, "Please try again, and start after the selection is cleared. And other information such as coping methods. Further, the abnormal portion is indicated by a circular mark 625. Further, the shuttle portion is the "device supply portion 14".

Then, the cooling mechanism 52 is stopped to stop the cooling (step S304), and the heating mechanism 51 is driven to start the heating of the cooling member (step S305), and the process proceeds to the next step. borrow Thus, the condensation or icing is removed in the event of condensation or icing. Moreover, since the humidity is lowered due to an increase in temperature, dew condensation or icing can be prevented in advance.

Further, in the case where it is determined in step S303 that it is not in the case of cooling, it is inferred that no condensation or icing has occurred, and the process proceeds to the next step without performing special processing.

Further, in the case where it is determined in the step S301 that there is no abnormality in the supply of the dry air, it is estimated that no condensation or icing has occurred, and the process proceeds to the next step without performing special processing. The description of the subsequent operations will be omitted.

As described above, according to the inspection apparatus 1, when the condensation condition of any one of the plurality of condensation conditions is satisfied, it is inferred that condensation or icing has occurred, or dew condensation or icing is generated, thereby driving the heating mechanism 51. The cooling member is heated.

Thereby, the condensation or icing is removed when condensation or icing occurs, and dew condensation or icing can be prevented in advance.

Further, the operator does not need to confirm condensation or icing, or performs an operation for heating, but the inspection device 1 infers that condensation or icing has occurred, or condensation or icing will occur, and the heating mechanism 51 is automatically driven. Since the cooling member is heated, it takes no effort, and it is possible to suppress the occurrence of condensation or icing due to an operator's confirmation error or the like.

Furthermore, the inspection device 1 can further have a sensor for detecting condensation or icing. The sensor can be used to detect condensation or icing when condensation or icing occurs, whereby the condensation or icing can be removed.

The sensor is not particularly limited as long as it can detect condensation or ice, and examples thereof include a leakage sensor and the like.

<Second embodiment>

Fig. 9 is a block diagram showing a second embodiment of the electronic component inspection device of the present invention.

In the following, the second embodiment will be described, but the differences from the above-described first embodiment will be mainly described, and the description of the same matters will be omitted.

As shown in FIG. 9, the inspection apparatus 1 of the second embodiment has a leakage sensor 44 as a sensor for detecting leakage of liquid nitrogen for the refrigerant of the cooling mechanism 52.

Further, as the dew condensation condition, in addition to the dew condensation conditions (1) to (3) described in the first embodiment, the dew condensation condition of "the case where the liquid nitrogen leaks" is added.

The inspection device 1 periodically detects leakage of liquid nitrogen by the leak sensor 44, and when detecting leakage of liquid nitrogen, drives a heating mechanism (not shown) to cool the inspection device 1 by leaking liquid nitrogen. Part of the heating. Thereby, it is prevented in advance by using the leaked liquid nitrogen to cool the unexpected portion, and condensation or icing occurs in the portion, and when condensation or icing occurs, it can be removed.

According to the second embodiment described above, the same effects as those of the first embodiment described above can be exhibited.

<Third embodiment>

Fig. 10 is a schematic plan view showing a third embodiment of the electronic component inspection device of the present invention.

In the following, the third embodiment will be described, but the differences from the above-described first embodiment will be mainly described, and the description of the same matters will be omitted.

As shown in FIG. 10, in the inspection apparatus 1 of the third embodiment, a humidity sensor 45 is provided outside the inspection apparatus 1, and the humidity outside the inspection apparatus 1 is detected by the humidity sensor 45.

In addition to the condensation conditions of (1) to (3) described in the above-described first embodiment, condensation is also added to the case where the humidity outside the inspection device 1 is equal to or greater than a predetermined threshold value set in advance. condition.

The inspection device 1 periodically detects the humidity outside the inspection device 1 by the humidity sensor 45. When the humidity is equal to or greater than a predetermined threshold value, the heating mechanism (not shown) is driven to the outside of the inspection device 1. Wait for heating. Thereby, condensation or ice formation on the outer wall of the inspection apparatus 1 or the like is prevented in advance, and when condensation or icing occurs, It can be removed.

According to the third embodiment described above, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>

In the following, the fourth embodiment will be described, but the differences from the first embodiment will be mainly described, and the description of the same matters will be omitted.

In the inspection apparatus 1 of the fourth embodiment, the dew condensation condition (1) described in the first embodiment is changed to the dew condensation condition of the following (1A).

(1A) The case where the temperature detected by the temperature sensor 41 becomes twice or less the dew point temperature.

When the temperature detected by the temperature sensor 41 is twice or less the dew point temperature, there is a possibility that the dew point temperature is dew condensation or ice formation, and the heating mechanism 51 is driven to heat the cooling member, thereby generating In the case of condensation or icing, the condensation or icing is removed, and condensation or icing can be prevented in advance.

The dew point temperature can be obtained based on the temperature detected by the temperature sensor 41 and the humidity detected by the humidity sensor 42. In other words, in the memory unit 801 of the control unit 80, a calibration curve such as a table or an arithmetic expression for obtaining the dew point temperature based on temperature and humidity is stored in advance, and the control unit 80 obtains the dew point temperature using the calibration curve.

In the present embodiment, when the temperature detected by the temperature sensor 41 is twice or less the dew point temperature, the heating is performed, but it is preferably 0.5 times or more and twice or less the dew point temperature. In the case of heating, it is more preferably heated when it is 1.05 times or more and 2 times or less, and further preferably heated when it is 1.05 times or more and 1.5 times or less, and particularly preferably 1.1 times. Heating is performed at the above and 1.4 times or less.

According to the fourth embodiment described above, the same effects as those of the first embodiment described above can be exhibited.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each unit may be replaced with any configuration having the same function. Further, any other constituents may be added.

Furthermore, the present invention may be obtained by combining any two or more of the above-described configurations (features).

S101~S118‧‧‧Steps

Claims (16)

An electronic component conveying apparatus comprising: a member constituting the device; a heating unit that heats the member; a humidity detecting unit that detects humidity; and a temperature detecting unit that detects a temperature; and the temperature detecting unit uses the temperature detecting unit When the detected temperature is 0.5 times or more and twice or less the dew point temperature, the member is heated. The electronic component transporting apparatus of claim 1, wherein the humidity of the air in contact with the member is lower than the humidity of the air in contact with the humidity detecting section. The electronic component conveying apparatus according to claim 1 or 2, wherein the temperature detecting unit is disposed in the member. The electronic component conveying apparatus according to claim 1 or 2, wherein the member is disposed in a room controlled to a specific humidity of the electronic component conveying device. The electronic component transport apparatus of claim 1 or 2, wherein the heating section comprises a heating wire. The electronic component transport device of claim 5, wherein the heating portion includes a supply air source. The electronic component conveying apparatus according to claim 1 or 2, wherein the heating is stopped when the humidity in the room of the electronic component conveying device is equal to or lower than a specific first threshold. The electronic component transporting apparatus of claim 1 or 2, wherein the heating is stopped when a certain time has elapsed. An electronic component conveying device characterized by comprising: a member constituting the device; and a heating portion that heats the member; The member is heated when it is twice the dew point temperature; the member has a cooling member that can dispose the electronic component and can be cooled. The electronic component transporting apparatus of claim 9, wherein the condition is that the cooling member is turned off in a cooled state, and then the power source is turned on. The electronic component conveying apparatus according to claim 9, wherein the condition is that the cooling member is turned off in a cooled state, and the power source is turned on within a predetermined time from when the power source is turned off. The electronic component conveying apparatus according to any one of claims 9 to 11, wherein the cooling of the cooling member uses liquid nitrogen, and the above condition is a case where the liquid nitrogen leaks. The electronic component conveying apparatus according to any one of claims 9 to 11, wherein the condition is such that the humidity in at least one of the indoor parts of the electronic component conveying device is equal to or greater than a specific second threshold. The electronic component conveying apparatus according to any one of claims 9 to 11, wherein a dry gas is supplied to at least one of the electronic component conveying apparatuses, and the condition is that the supply of the gas is stopped or the flow rate of the gas is lowered to a specific value. The following situation. The electronic component conveying apparatus according to any one of claims 9 to 11, further comprising: a plurality of control modes for controlling an operation of the electronic component conveying device, and a display unit for displaying a current setting among the plurality of control modes The image corresponding to the control mode. An electronic component inspection apparatus comprising: a member constituting a device; a heating portion that heats the member; a humidity detecting portion that detects humidity; and a temperature detecting portion that detects a temperature; and The inspection unit checks the electronic component, and heats the member when the temperature detected by the temperature detecting unit is 0.5 times or more and twice or less the dew point temperature.