TWI582441B - Electronic parts conveyor and electronic parts inspection device - Google Patents

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

For example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (integrated circuit) component has been known, and the electronic component inspection device is loaded with a device for transporting the IC component to the inspection unit. Electronic parts transfer device up to the department. In the inspection of the IC element, the IC element is placed in the holding portion, and the plurality of probes provided in the holding portion are brought into contact with the respective terminals of the IC element.

The inspection of such an IC component is carried out by cooling the IC component to a specific temperature. In this case, it is necessary to cool the IC element and to prevent condensation from occurring, so that the humidity of the gas atmosphere around the member in which the IC element is disposed is lowered.

Patent Document 1 discloses an IC handler configured to have a plurality of chambers internally set to a specific temperature and to be inspected while the IC wafer passes through each chamber.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 8-105938

However, in Patent Document 1, although temperature management can be performed in each chamber, there is no disclosure about humidity management, that is, how to prevent condensation generated when the IC element is cooled. Any tips. Therefore, it is not clear whether it is possible to prevent condensation from occurring in reality.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus capable of preventing dew condensation in a second chamber of a first chamber, a second chamber, and a third chamber in a state where the electronic component can be cooled.

The present invention has been developed in order to solve at least some of the above problems, and can be realized as the following aspects or application examples.

[Application 1]

The electronic component conveying apparatus of the present invention includes: a first chamber into which an electronic component is carried in, a second chamber into which the electronic component is carried in from the first chamber, and a third chamber in which the electronic component is carried in from the second chamber; The humidity in the second room is lower than the humidity in the first room.

Thereby, the humidity in the room can be adjusted (set) in each of the first chamber, the second chamber, and the third chamber in a state where the electronic component can be cooled. Further, if the humidity is adjusted while the humidity is being adjusted, it is possible to prevent condensation from occurring particularly in the second chamber.

[Applicable Example 2]

Preferably, in the electronic component conveying apparatus of the present invention, the humidity in the second room and the humidity in the first room are average temperatures in the respective rooms.

In this way, the humidity is as accurate as possible.

[Applicable Example 3]

Preferably, in the electronic component conveying apparatus of the present invention, the humidity in the second room and the humidity in the first room are the highest humidity among the plurality of humidity sensors sensed by the humidity sensors disposed in the respective rooms. .

Thereby, the humidity which is highly likely to cause dew condensation in the second room is obtained, thereby contributing to prevention of dew condensation.

[Applicable Example 4]

In the electronic component conveying apparatus of the present invention, it is preferable that the humidity of the position of the humidity sensor is disposed in each of the humidity in the second room and the humidity in the first room.

In this way, the humidity is as accurate as possible.

[Applicable Example 5]

Preferably, in the electronic component conveying device of the present invention, the humidity in the second room and the humidity in the first room are the humidity when the electronic component is placed in the second room.

Thereby, it is possible to obtain a humidity which may affect the electronic component particularly when condensation occurs in the second chamber.

[Applicable Example 6]

Preferably, in the electronic component conveying apparatus of the present invention, the difference between the humidity in the second chamber and the humidity in the first chamber is greater than 0% RH and less than 4.5% RH.

Thereby, dew condensation can be prevented especially in the second room.

[Applicable Example 7]

Preferably, in the electronic component conveying apparatus of the present invention, the humidity in the first room, the humidity in the second room, and the humidity in the third room are controlled by 0 to 60% RH.

Thereby, dew condensation can be prevented especially in the second room.

[Applicable Example 8]

Preferably, in the electronic component conveying apparatus of the present invention, the humidity in the first room, the humidity in the second room, and the humidity in the third room are controlled by flowing dry air or nitrogen into the respective rooms.

Thereby, the humidity control of each room can be easily and surely performed.

[Applicable Example 9]

Preferably, in the electronic component conveying apparatus of the present invention, the humidity in the second chamber is lower than the humidity in the third chamber.

Thereby, the humidity in the room can be adjusted (set) in each of the first chamber, the second chamber, and the third chamber in a state where the electronic component can be cooled. Further, if the cooling is performed in a state where the humidity is adjusted, it is possible to prevent condensation from occurring particularly in the second chamber.

[Application 10]

Preferably, in the electronic component conveying apparatus of the present invention, the humidity in the second room is lower than the humidity in the first room, and the humidity in the first room is lower than the humidity in the third room.

Therefore, if the cooling is performed in a state where the humidity is adjusted in such a size relationship, dew condensation can be prevented from occurring particularly in the second chamber.

[Applicable Example 11]

Preferably, in the electronic component conveying apparatus of the present invention, the difference between the humidity in the first room and the humidity in the third room is greater than 0% RH and less than 4.5% RH.

Thereby, dew condensation can be prevented especially in the second room.

[Applicable Example 12]

In the electronic component conveying apparatus of the present invention, the feeding unit that feeds the arrangement member in which the electronic component is disposed is provided, and an opening and closing portion that can be opened and closed is provided between the feeding portion and the first chamber.

Thereby, when the arrangement member is moved between the feeding portion and the first chamber, the opening and closing portion can be closed except for the time of the passage, whereby the humidity or temperature in the first chamber can be maintained as much as possible.

[Applicable Example 13]

Preferably, the electronic component conveying device of the present invention includes a removal portion that removes the arrangement member in which the electronic component is disposed, and an opening and closing portion that is openable and closable between the removal portion and the third chamber.

Therefore, when the arrangement member is moved between the removal portion and the third chamber, the opening and closing portion can be closed except for the passage, whereby the humidity or temperature of the third chamber can be maintained as much as possible. .

[Applicable Example 14]

Preferably, in the electronic component conveying apparatus of the present invention, the first chamber and the third chamber are separated by a partition wall.

Thereby, the airtightness of the first chamber and the airtightness of the third chamber can be ensured, and thus, for example, when the first chamber requires humidity management (humidity adjustment), the humidity management can be easily performed.

[Applicable Example 15]

Preferably, in the electronic component conveying apparatus of the present invention, an oxygen concentration sensor that detects an oxygen concentration is disposed in the first chamber, the second chamber, and the third chamber.

Thereby, the current oxygen concentration in each of the first chamber, the second chamber, and the third chamber can be detected.

[Applicable Example 16]

Preferably, in the electronic component conveying apparatus of the present invention, the first chamber, the second chamber, and the third chamber are controlled to have a predetermined humidity and oxygen concentration.

Thereby, the humidity is managed to prevent condensation from occurring in each of the first chamber, the second chamber, and the third chamber, and each chamber is filled with a sufficient oxygen concentration.

[Applicable Example 17]

Preferably, in the electronic component conveying apparatus of the present invention, a first opening that allows the first chamber to communicate with the second chamber is provided between the first chamber and the second chamber.

Therefore, for example, when the dry air for adjusting the humidity in the second chamber is supplied to the second chamber, the dry air passing through the second chamber can flow into the first chamber through the first opening, thereby being used for The humidity in the first room is adjusted.

[Applicable Example 18]

Preferably, in the electronic component conveying apparatus of the present invention, a second opening that allows the second chamber to communicate with the third chamber is provided between the second chamber and the third chamber.

In this case, for example, when the dry air for adjusting the humidity in the second chamber is supplied to the second chamber, the dry air passing through the second chamber can flow into the third chamber through the second opening, and the same can be used. The humidity adjustment in the third room. This configuration is effective when the third chamber requires humidity adjustment.

[Applicable Example 19]

In the electronic component conveying apparatus of the present invention, the fourth chamber in which the electronic component is transported in the second chamber is disposed in the upper portion of the second chamber.

Thereby, for example, when the second chamber requires humidity management (humidity adjustment), and the fourth chamber does not require humidity management as in the second chamber, the humidity management in the second chamber can be preferentially and easily performed.

[Application 20]

Preferably, in the electronic component conveying device of the present invention, the first conveying device is provided in the first chamber, and the second conveying device is provided in the third chamber.

Thereby, for example, compared with the configuration having one transport mechanism provided across the first chamber and the third chamber, the amount of transport, that is, the number of transports of electronic components per unit time can be improved.

[Application 21]

Preferably, in the electronic component conveying device of the present invention, the first door and the third door are lockable and unlockable in the first chamber and the third chamber, and the first door and the third door are independent of each other. The ground is locked and unlocked.

Thereby, for example, when the first door is closed and the third door is unlocked, the environment (gas atmosphere) of the first room that is locked can be maintained.

[Application 22]

Preferably, in the electronic component conveying device of the present invention, the first door and the third door are rotatably supported.

Thereby, the airtightness in the state in which the doors are closed can be improved.

[Applicable Example 23]

Preferably, in the electronic component conveying apparatus of the present invention, the refrigerant source that supplies the refrigerant and the cooling target that is cooled by the refrigerant are connected by the first pipe that is filled with the refrigerant, and the first pipe is provided by the second pipe. Covering, the first pipe and the second pipe are filled with air of a predetermined humidity.

Thereby, condensation can be prevented from occurring inside or outside the second pipe.

[Applicable Example 24]

Preferably, the electronic component inspection apparatus according to the present invention includes: a first chamber into which the electronic component is carried in, a second chamber into which the electronic component is carried in from the first chamber, and the electronic component from the second chamber. The third room that is carried in is provided with an inspection unit that is installed in the second room and inspects the electronic component, and the humidity in the second room is lower than the humidity in the first room.

Thereby, the humidity in the room can be adjusted (set) in each of the first chamber, the second chamber, and the third chamber in a state where the electronic component can be cooled. Further, if the cooling is performed in a state where the humidity is adjusted, it is possible to prevent condensation from occurring particularly in the second chamber.

1‧‧‧Inspection device (electronic parts inspection device)

4‧‧‧ tube

5A‧‧‧1st opening and closing department (opening and closing department)

5B‧‧‧2nd opening and closing part (opening and closing part)

11A, 11B‧‧‧Tray transport mechanism

12‧‧‧Temperature adjustment unit (soaking plate)

13‧‧‧Device component transfer head

14‧‧‧Device component supply department (supply shuttle)

15‧‧‧Tray transport mechanism (first transport device)

16‧‧‧Inspection Department

17‧‧‧Device component transfer head

18‧‧‧Device Component Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧Device component transfer head

21‧‧‧Tray transport mechanism

22A, 22B‧‧‧Tray transport mechanism

23‧‧‧Transportation agency

24‧‧‧Humidity sensor (hygrometer)

25‧‧‧temperature sensor (thermometer)

26‧‧‧Oxygen concentration sensor

27‧‧‧Adsorption components

28‧‧‧Support institutions

41‧‧‧1st piping

42‧‧‧2nd piping

43‧‧‧Insulation

44‧‧‧ Positioning members

51‧‧‧Baffle

52‧‧‧ cylinder

61‧‧‧1st partition wall

62‧‧‧2nd partition wall

63‧‧‧3rd partition wall

64‧‧‧4th partition wall

65‧‧‧5th partition wall

66‧‧‧6th dividing wall

67‧‧‧ partition wall

68‧‧‧Baffle (2nd baffle)

69‧‧‧Baffle (1st baffle)

70‧‧‧ front casing

71‧‧‧ side shell

72‧‧‧ side shell

73‧‧‧ rear casing

75‧‧‧4th door

80‧‧‧Control Department

90‧‧‧IC device components

200‧‧‧Tray (configuration component)

300‧‧‧Refrigerant source

400‧‧‧ cabinet

441‧‧‧Defects (through holes)

500‧‧‧Connecting Department

611‧‧‧ openings

621‧‧‧1st opening

631‧‧‧2nd opening

641‧‧‧ openings

671‧‧‧Slit

711‧‧‧1st door

721, 722‧‧‧ third door

731‧‧‧1st door

732‧‧‧2nd door

733‧‧‧3rd door

740, 741, 742, 743, 744, 745‧ ‧ cylinders

A1‧‧‧Tray supply area

A2‧‧‧Component supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Component recycling area (recycling area)

A5‧‧‧Tray removal area

C‧‧‧Refrigerant

DA‧‧‧dry air

OC1, OC2, OC3‧‧‧ oxygen concentration

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

Room 4, R4‧‧

RH1, RH2, RH3‧‧‧ Humidity

S101~S107, S201~S206, S301~S309‧‧‧ steps

SW1, SW2, SW3‧‧‧ switch

T‧‧‧thickness

α, β1, β2‧‧‧ threshold

d _1-1 , d _2-1 ‧‧‧outer diameter

d _1-2 , d _2-2 ‧‧‧Inner diameter

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.

Fig. 2 is a view (schematic rear view) as seen from the direction of the arrow A in Fig. 1.

3(a) and 3(b) are partial cross-sectional side views showing the vicinity of the opening and closing portion between the tray supply region and the component supply region in the electronic component inspection device shown in Fig. 1.

4(a) and 4(b) are diagrams showing the component recovery area in the electronic component inspection apparatus shown in FIG. A partial cross-sectional side view of the vicinity of the opening and closing portion between the tray removal regions.

Fig. 5 is a plan view showing a first conveying mechanism and a second conveying mechanism provided in the electronic component inspection device shown in Fig. 1;

Fig. 6 is a view showing a piping state between a refrigerant source and a cooling target in the electronic component inspection apparatus shown in Fig. 1;

Figure 7 is a cross-sectional view taken along line B-B of Figure 6.

Figure 8 is a cross-sectional view taken along line C-C of Figure 6.

Fig. 9 is a flow chart showing a control program of a control unit provided in the electronic component inspection device shown in Fig. 1.

Fig. 10 is a flow chart showing a control program of a control unit provided in the electronic component inspection device shown in Fig. 1;

Fig. 11 is a flow chart showing a control program of a control unit provided in the electronic component inspection device shown in Fig. 1.

Fig. 12 is a schematic rear view showing an electronic component inspection device (second embodiment) of the present invention.

Fig. 13 is a schematic rear view showing an electronic component inspection device (third embodiment) of the present invention.

Fig. 14 is a transverse cross-sectional view showing a state of piping between a refrigerant source and a cooling target in the electronic component inspection device (fourth embodiment) of the present invention.

Fig. 15 is a view showing a state of piping between a refrigerant source and a cooling target in the electronic component inspection device (fifth embodiment) of the present invention.

Fig. 16 is a view showing a state of piping between a refrigerant source and a cooling target in the electronic component inspection device (sixth embodiment) of the present invention.

Fig. 17 is a view showing an arrangement state of an oxygen concentration sensor in the electronic component inspection device (seventh embodiment) of the present invention.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on preferred embodiments shown in the drawings.

<First embodiment>

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a view (schematic rear view) as seen from the direction of the arrow A in Fig. 1. Fig. 3 is a partial cross-sectional side view showing the vicinity of an opening and closing portion between a tray supply region and a component supply region in the electronic component inspection device shown in Fig. 1. Fig. 4 is a partial cross-sectional side view showing the vicinity of an opening and closing portion between a component recovery region and a tray removal region in the electronic component inspection device shown in Fig. 1. Fig. 5 is a plan view showing a first conveying mechanism and a second conveying mechanism provided in the electronic component inspection device shown in Fig. 1; Fig. 6 is a view showing a piping state between a refrigerant source and a cooling target in the electronic component inspection apparatus shown in Fig. 1; Figure 7 is a cross-sectional view taken along line B-B of Figure 6. Figure 8 is a cross-sectional view taken along line C-C of Figure 6. 9 to 11 are flowcharts showing control programs of the control unit included in the electronic component inspection device shown in Fig. 1, respectively. In the following description, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". Moreover, the upstream side of the conveyance direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Further, the term "level" as used in the specification of the present invention is not limited to a complete level, and includes a state in which the electronic component is not inclined, and the state is inclined with respect to a certain level (for example, not about 5 degrees).

The inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 is used, for example, for inspection, testing (hereinafter referred to as "inspection") BGA (Ball Grid Array) package or LGA (Land grid array, Planar gate array) IC components such as package, LCD (Liquid Crystal Display), CIS (CMOS (complementary metal oxide semiconductor) Image Sensor, CMOS image sensor) A device for electrical characteristics of electronic components. In the following, for convenience of explanation, the case where the IC component is used as the above-described electronic component for inspection is representatively described, and the IC component is referred to as "IC component 90".

As shown in FIG. 1, the inspection apparatus 1 is divided into a tray supply area A1, a component supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a component collection area (hereinafter simply referred to as "recovery area") A4, and The tray removes the area A5. Further, the IC element 90 is sequentially inspected in the inspection area A3 in the middle via the above-described respective areas from the tray supply area A1 to the tray removal area A5. In this manner, the inspection apparatus 1 is an electronic component transport apparatus that transports the IC component 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 80.

Further, the inspection apparatus 1 has the side (the lower side in FIG. 1) on which the tray supply area A1 and the tray removal area A5 are disposed, and the inspection side A3 is disposed on the opposite side of the front side. The side (the upper side in Fig. 1) is used as the back side.

The tray supply area A1 is supplied with a feeding portion of a tray (arrangement member) 200 in which a plurality of IC elements 90 in an unchecked state are arranged. As shown in FIG. 3, in the tray supply area A1, a large number of trays 200 can be stacked.

The supply area A2 supplies a plurality of IC elements 90 disposed on the tray 200 from the tray supply area A1 to the area of the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the trays 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

In the supply area A2, a temperature adjustment unit (heating plate) 12, a component transfer head 13, and a tray conveyance mechanism (first conveyance device) 15 are provided.

The temperature adjustment unit 12 heats or cools a plurality of IC elements 90 to adjust the IC element 90 to a temperature suitable for inspection. In the configuration shown in Fig. 1, the temperature adjustment unit 12 is disposed and fixed in the Y direction. Further, the IC component 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported and placed at any temperature. Degree adjustment unit 12.

The component transfer head 13 is movably supported in the supply area A2. Thereby, the component transfer head 13 can be responsible for the transfer of the IC component 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the IC component 90 between the temperature adjustment unit 12 and the component supply unit 14 described below. Transfer.

The tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state in which all the IC elements 90 have been removed in the X direction in the supply region A2 (see FIG. 5). Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

The inspection area A3 is an area in which the IC component 90 is inspected. In the inspection area A3, a component supply unit (supply shuttle) 14, an inspection unit 16, a component transfer head 17, and a component collection unit (recycling shuttle) 18 are provided.

The component supply unit 14 is a device that transports the temperature-adjusted IC device 90 to the vicinity of the inspection unit 16. The component supply unit 14 is supported between the supply region A2 and the inspection region A3 so as to be movable in the X direction. Further, in the configuration shown in FIG. 1, two component supply portions 14 are disposed in the Y direction, and the IC device 90 on the temperature adjustment portion 12 is transported and placed on any of the component supply portions 14.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC component 90. The inspection unit 16 is provided with a plurality of probes electrically connected to the terminals of the IC element 90 while holding the IC element 90. Further, the terminal of the IC element 90 is electrically connected (contacted) to the probe, and the IC element 90 is inspected via the probe. The inspection of the IC component 90 is performed based on the program stored in the inspection control unit included in the testing machine connected to the inspection unit 16. Further, the inspection unit 16 can heat or cool the IC element 90 in the same manner as the temperature adjustment unit 12, and adjust the IC element 90 to a temperature suitable for inspection.

The component transfer head 17 is movably supported in the inspection area A3. Thereby, the component transfer head 17 can move the IC component 90 on the component supply portion 14 carried from the supply region A2. It is sent and placed on the inspection unit 16.

The component recovery unit 18 is a device that transports the IC component 90 in the inspection unit 16 to the collection area A4. The component recovery unit 18 is supported between the inspection region A3 and the recovery region A4 so as to be movable in the X direction. In the configuration shown in FIG. 1, the component collection unit 18 is disposed in the Y direction in the same manner as the component supply unit 14, and the IC component 90 on the inspection unit 16 is transported and placed in any component recovery. Part 18. This transfer is performed by the component transfer head 17.

The recovery area A4 will check the area where the plurality of IC elements 90 that have been completed are recovered. In the collection area A4, a collection tray 19, a component transfer head 20, and a tray conveyance mechanism (second conveyance means) 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared.

The recovery tray 19 is fixed in the collection area A4, and in the configuration shown in Fig. 1, three are arranged along the X direction. Further, the empty tray 200 is also arranged in three along the X direction. Then, the IC element 90 moved to the component collection unit 18 of the collection area A4 is transported and placed on any of the collection trays 19 and the empty trays 200. Thereby, the IC element 90 is recovered and classified according to each inspection result.

The component transfer head 20 is movably supported in the recovery area A4. Thereby, the component transfer head 20 can transport the IC component 90 from the component collection part 18 to the collection tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the X direction in the collection area A4 (see FIG. 5). Then, after the transfer, the empty tray 200 is placed at a position where the IC element 90 is collected, and any of the three empty trays 200 can be obtained. In this manner, the inspection apparatus 1 is provided with the tray conveyance mechanism 21 in the collection area A4, and the tray conveyance mechanism 15 is provided in the supply area A2. Thereby, for example, the conveyance amount (the number of conveyances of the IC elements 90 per unit time) can be improved as compared with the case where the empty tray 200 is conveyed in the X direction by one conveyance mechanism.

Further, the configuration of the tray transport mechanisms 15 and 21 is not particularly limited, and for example, As shown in FIG. 5, the adsorption mechanism 27 connected to the suction mechanism (not shown) and the support mechanism 28 such as a ball screw that supports the adsorption member 27 in the X direction are exemplified.

The tray removal area A5 is a removal unit that collects and removes the tray 200 in which a plurality of IC elements 90 in the inspection end state are arranged. As shown in FIG. 4, a large number of trays 200 can be stacked in the tray removal area A5.

Further, the tray transport mechanisms 22A and 22B that transport the trays 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC element 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports the empty tray 200 for collecting the IC component 90 from the tray removal area A5 to the collection area A4.

The control unit 80 has, for example, a drive control unit. The drive control unit controls, for example, the tray conveyance mechanisms 11A and 11B, the temperature adjustment unit 12, the component transfer head 13, the component supply unit 14, the tray conveyance mechanism 15, the inspection unit 16, the component transfer head 17, the component collection unit 18, and the component transfer head. 20. Driving of each portion of the tray transport mechanism 21 and the tray transport mechanisms 22A, 22B.

In addition, the inspection control unit of the tester performs inspection of electrical characteristics of the IC component 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).

The inspection apparatus 1 as described above is configured such that the element transfer head 13 and the component supply unit 14 and the element transfer head 17 can heat or cool the IC element 90 in addition to the temperature adjustment unit 12 or the inspection unit 16. Thereby, the temperature of the IC element 90 is maintained constant while being transported. Further, in the following, a case will be described in which the IC element 90 is cooled and inspected in a low temperature environment in the range of, for example, -60 ° C to -40 ° C.

As shown in FIG. 1, the inspection apparatus 1 is partitioned (separated) between the tray supply area A1 and the supply area A2 by the first partition 61, and the supply area A2 and the inspection area A3 are separated by the second partition 62. The inspection area A3 and the recovery area A4 are separated by the third partition wall 63, and the recovery area The field A4 and the tray removal area A5 are separated by a fourth partition wall 64. Further, the supply area A2 and the recovery area A4 are also separated by the fifth partition 65. These partition walls have a function of maintaining the airtightness of each region. Further, the inspection device 1 is covered by an outer casing, and the outer casing has, for example, a front outer casing 70, side outer casings 71 and 72, and a rear outer casing 73.

Further, the supply region A2 is the first chamber R1 defined by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side outer casing 71, and the rear outer casing 73. In the first chamber R1, a plurality of IC elements 90 in an unchecked state are carried in together with the tray 200.

The inspection area A3 is a second chamber R2 defined by the second partition 62, the third partition 63, and the rear casing 73. In the second chamber R2, a plurality of IC elements 90 are carried into the first chamber R1.

The recovery area A4 is a third chamber R3 defined by the third partition wall 63, the fourth partition wall 64, the fifth partition wall 65, the side outer casing 72, and the rear outer casing 73. In the third chamber R3, a plurality of IC elements 90 whose inspection has been completed are carried in from the second chamber R2.

As shown in FIG. 1, the first chamber R1 has a first door 711 provided in the side case 71 and a first door 731 provided in the rear case 73. The first door 711 on the side of the side casing 71 is lockable and unlockable by, for example, the operation of the cylinder 740. The first door 731 on the side of the rear casing 73 is lockable and unlockable by, for example, the operation of the cylinder 741. Maintenance of the first chamber R1 can be performed, for example, by opening the first doors 711 and 731.

The second chamber R2 has a second door 732 provided in the rear casing 73 and a fourth door 75 provided on the inner side of the second door 732. The second door 732 is lockable and unlockable by, for example, actuation of the cylinder 742. The fourth door 75 is unlocked and unlocked by, for example, the operation of the cylinder 743. Maintenance of the second chamber R2 can be performed, for example, by opening the second door 732 and the fourth door 75. Further, when both the second door 732 and the fourth door 75 are closed, airtightness or heat insulation in the second chamber R2 can be ensured.

The third chamber R3 has a third door 733 provided in the rear outer casing 73 and third doors 721 and 722 provided in the side outer casing 72. The third door 733 becomes lockable by actuation of, for example, the cylinder 744 lock. The third doors 721, 722 can be uniformly locked and unlocked by, for example, the operation of the cylinder 745. Maintenance in the third chamber R3 can be performed, for example, by opening the third doors 733, 721, and 722.

Further, as shown in FIG. 1, the first door 711, 731, the second door 732, the third door 721, 722, 733, and the fourth door 75 are respectively in the vertical direction, that is, the Z direction (in FIG. 1). The axis of the paper is parallel to the axis. The axis of rotation is rotatably supported. Thereby, the airtightness in the state in which the doors are closed can be improved. Further, the maximum rotation angle of each door is preferably, for example, 90 or more and 180 or less.

As described above, the inspection apparatus 1 inspects the IC component 90 in a low temperature environment. In this case, the temperature adjustment unit 12 or the inspection unit 16 is continuously cooled. However, if the humidity management (humidity adjustment) at this time is unreasonable, dew condensation occurs in each portion, which is a cause of malfunction of the electronic circuit or the like. After that. The inspection device 1 must perform humidity management provided in the first chamber R1 of the temperature adjustment unit 12 and humidity management provided in the second chamber R2 of the inspection unit 16.

For example, when the area from the tray supply area A1 to the tray removal area A5 is not partitioned to constitute one closed space, the humidity management of the entire space is extremely difficult. Here, the "humidity management" includes, for example, the time when the humidity is actually set to the target value and the humidity is set to the target value. However, the inspection apparatus 1 separates the area requiring humidity management into the first chamber R1 and the second chamber R2, and reduces the volume of the space as much as possible, thereby facilitating humidity management.

Further, as shown in FIGS. 2 and 6, the humidity of the first chamber R1 and the second chamber R2 is adjusted by supplying dry air DA to each room.

As described above, the component transfer head 17 is provided in the inspection area A3. As shown in FIG. 2, the IC element 90 is transported in the second chamber R2 via the element transfer head 17, but the transport mechanism 23 serving as the transport source is housed in the fourth chamber R4 disposed above the second chamber R2. . The fourth chamber R4 is divided into a box shape by the sixth partition wall 66. The second chamber R2 and the fourth chamber R4 are separated by a partition wall Separated by 67, the partition wall 67 is provided with a slit 671 for partially moving the transport mechanism 23. The second chamber R2 and the fourth chamber R4 communicate via the slit 671. In this manner, the inspection area A3 is divided into a second chamber R2 serving as a main chamber and a fourth chamber R4 serving as a secondary chamber. Further, in the inspection area A3, it is sufficient to perform humidity management in the second chamber R2 of the second chamber R2 and the fourth chamber R4. For example, although it is difficult to manage the humidity of the entire inspection area A3, the inspection area A3 requires a humidity manager, and thus it is preferable in terms of humidity management. Further, the second chamber R2 communicates with the fourth chamber R4 via the elongated slit 671. Thereby, the dry air DA supplied to the second chamber R2 is prevented from flowing out toward the fourth chamber R4, whereby the dry air DA can be prevented from being wasted in the fourth chamber R4.

Further, by accommodating the transport unit 23 having the movable portion more than the element transport head 17 in the fourth chamber R4, the maintenance of the transport mechanism 23 can be easily performed, and the heat conduction in the transport mechanism 23 can be prevented or suppressed. 2 rooms R2.

Further, the fourth chamber R4 is smaller than the chamber of the second chamber R2 (see FIG. 2). As a result, the entire inspection apparatus 1 has a smaller appearance, which contributes to downsizing.

In addition, the conveying mechanism 23 is not particularly limited, and for example, it may have a configuration including a ball screw, a motor, a linear guide, and the like.

As shown in FIG. 2, between the first chamber R1 and the second chamber R2, one first opening portion 621 that allows the chambers to communicate with each other is provided. Further, between the second chamber R2 and the third chamber R3, one second opening portion 631 that allows the chambers to communicate with each other is provided. The size of the first opening 621 and the second opening 631 is such that at least the IC element 90 can pass therethrough. Further, the first opening portion 621 is opened in the vertical direction so that the IC element 90 can be transferred from the element transfer head 13 toward the component supply portion 14. The second opening 631 is also opened in the vertical direction so that the IC component 90 can be transferred from the component collecting portion 18 toward the component carrying head 20.

Further, a baffle plate (second baffle plate) 68 is provided in the second opening portion 631. The second opening 631 can be opened and closed by the movement of the shutter 68. When the IC component 90 is transferred from the component recovery unit 18 toward the component transfer head 20, it is turned on, and the IC component 90 is turned on. Set to off when the handover is stopped. Further, the moving direction of the shutter 68 is the X direction in the configuration shown in FIG. 2, but is not limited thereto, and may be, for example, the Y direction. Moreover, the drive source for moving the shutter 68 is not particularly limited, and for example, a motor or the like can be used.

The inspection device 1 mainly supplies the dry air DA to the second chamber R2. Thereby, the dry air DA can be used for the humidity management in the second chamber R2, that is, the humidity adjustment in the second chamber R2. In the second chamber R2, since the component transfer head 17 moves, the gas in the second chamber R2 can be stirred. Thereby, the second chamber R2 as a whole has a uniform humidity.

When the second opening portion 631 is in the closed state, the dry air DA is temporarily supplied to the second chamber R2, and then preferentially fed to the first chamber R1 requiring humidity management via the first opening portion 621. Thereby, the humidity adjustment in the first chamber R1 is performed. In this manner, the inspection device 1 can directly use the dry air DA for humidity management in the second chamber R2 for the humidity management in the first chamber R1. Therefore, it is possible to omit a pipe that supplies the dry air DA to the first chamber R1 separately from the pipe that supplies the dry air DA to the second chamber R2. Also in the first chamber R1, the gas in the first chamber R1 can be stirred by the component transfer head 13 moving. Thereby, the first chamber R1 also has a uniform humidity as a whole.

Further, when the second opening portion 631 is in the open state, the dry air DA is also fed to the third chamber R3 via the second opening portion 631.

Further, the internal pressure of the first chamber R1 and the second chamber R2 can be higher than the atmospheric pressure due to the supply of the dry air DA. In this case, external air can be prevented from entering the first chamber R1 and the second chamber R2. Thereby, the structure in which the side outer casings 71 and 72 or the rear outer casing 73 is set to have a relatively high airtightness can be omitted, and the manufacturing cost can be reduced.

As shown in FIG. 3, between the tray supply area A1 and the first chamber R1, the communication opening 611 is provided in the first partition wall 61. As shown in FIG. 1, in the opening 611, there are an opening portion 611 through which the tray 200 conveyed by the tray conveying mechanism 11A passes, and an opening portion 611 through which the tray 200 conveyed by the tray conveying mechanism 11B passes. Here, the tray transfer mechanism 11A side will be representatively described.

The opening portion 611 is provided with a first opening and closing portion (opening and closing portion) 5A that switches the opening portion 611 to an open state and a closed state. The first opening and closing portion 5A includes a baffle 51 and a cylinder 52 as a support mechanism that is fixed to the first partition wall 61 and that supports the baffle 51 in the Z direction. As shown in FIG. 3(a), the state in which the shutter 51 covers the opening 611 maintains the humidity or temperature in the first chamber R1. As shown in FIG. 3(b), the tray 200 can be transported to the first chamber R1 in a state where the shutter 51 is moved upward and retracted from the opening 611. In this manner, the opening portion 611 is in a closed state except when the tray 200 is transported. Thereby, the humidity or temperature in the first chamber R1 can be maintained as much as possible, that is, the sudden change in humidity or temperature can be prevented.

Further, the support mechanism for the support baffle 51 is the cylinder 52 in the configuration shown in FIG. 3. However, the present invention is not limited thereto, and may be, for example, a motor or the like.

As shown in FIG. 4, between the third chamber R3 and the tray removal area A5, the communication opening 641 is provided in the fourth partition wall 64. As shown in FIG. 1, in the opening 641, there are an opening 641 through which the tray 200 conveyed by the tray transport mechanism 22A passes, and an opening 641 through which the tray 200 transported by the tray transport mechanism 22B passes. Here, the tray transfer mechanism 22A side will be representatively described.

The opening portion 641 is provided with a second opening and closing portion (opening and closing portion) 5B that switches the opening portion 641 to an open state and a closed state. The configuration of the second opening and closing portion 5B is the same as the configuration of the first opening and closing portion 5A. As shown in FIG. 4(a), the state in which the shutter 51 covers the opening 641 maintains the humidity or temperature in the third chamber R3. As shown in FIG. 4(b), the tray 200 can be transported to the tray removal area A5 in a state where the shutter 51 is moved upward and retracted from the opening 641. In this manner, the opening portion 641 is in a closed state except when the tray 200 is transported. Thereby, the humidity or temperature in the third chamber R3 can be maintained as much as possible.

As described above, in the first chamber R1 and the second chamber R2, the IC element 90 is cooled, but if it is cooled only, dew condensation may occur. Therefore, the inspection apparatus 1 is configured to prevent dew condensation in the second chamber R2, particularly in the first chamber R1, the second chamber R2, and the third chamber R3. Hereinafter, this configuration will be described.

As shown in Fig. 1, in the first chamber R1, the second chamber R2, and the third chamber R3, a humidity sensor (hygrometer) 24 for detecting humidity in the room and a temperature sensor for detecting temperature (thermometer) are disposed. ) 25. Further, the humidity in each room uses the humidity at the position where the humidity sensor 24 is disposed, and the temperature uses the temperature at which the temperature sensor 25 is disposed. In this way, you can get the correct humidity or temperature.

Further, as the order in which the humidity management is required in the first chamber R1, the second chamber R2, and the third chamber R3, the second chamber R2 is the highest, and then the first chamber R1 and the third chamber R3 are next.

Further, as the humidity RH2 in the second chamber R2 and the humidity RH1 in the first chamber R1, it is preferable to use the humidity when the IC element 90 is placed in the second chamber R2. Thereby, it is possible to obtain the humidity which may affect the IC element 90 when dew condensation occurs in the second chamber R2.

Further, it is preferable that the first chamber R1, the second chamber R2, and the third chamber R3 are controlled to have a predetermined humidity in the room. Specifically, the humidity RH2 in the second chamber R2 is lower than the humidity RH1 in the first chamber R1 and lower than the humidity RH3 in the third chamber R3. That is, the relationship of the humidity RH2 < humidity RH1 < humidity RH3 is satisfied. Further, the difference between the humidity RH2 and the humidity RH1 is preferably greater than 0% RH and less than 4.5% RH, and the difference between the humidity RH1 and the humidity RH3 is preferably greater than 0% RH and less than 4.5% RH. Further, the humidity RH1, the humidity RH2, and the humidity RH3 are preferably controlled by 0 to 60% RH. The humidity RH1, the humidity RH2, and the humidity RH3 are independently adjusted by adjusting the filling amount of the dry air DA filled in each chamber in such a manner as to satisfy such a relationship.

Judging whether or not cooling can be started in such a state. Here, the control program for cooling in the second chamber R2 will be representatively described based on the flowchart of FIG. This control program is stored in the control unit 80.

The supply of the dry air DA in the second chamber R2 is performed (step S101).

The current temperature (room temperature) in the second chamber R2 is detected by the temperature sensor 25 (step S102), and the current humidity RH2 in the second chamber R2 is detected by the humidity sensor 24 (step S103).

The amount of water vapor M contained in the gas in the current second chamber R2 is calculated based on the temperature detected in step S102 and the humidity RH2 detected in step S103 (step S104). This calculation formula is the amount of water vapor M = (saturated water vapor amount ML) × (humidity RH2 / 100) (Formula 1). In addition, the saturated steam amount ML is obtained based on, for example, a calibration curve (form) stored in the control unit 80 in advance.

Then, the relative humidity RHs at the time of cooling to a specific temperature is calculated (step S105). This calculation formula is a relative humidity RHs = (water vapor amount M / saturated steam amount ML at the above specific temperature (after temperature drop)) × 100 (formula 2).

For example, when the current temperature is 25 ° C and the humidity RH2 is 0.1%, the saturated water vapor amount ML becomes 23.0. Further, when the numerical values are substituted into the above (Formula 1), the amount of water vapor M = 23.0 × (0.1 / 100) = 0.023 [g / m ₃ ] is obtained. Further, for example, when it is cooled to -45 ° C, if the numerical value is substituted into the above (Formula 2), the relative humidity RHs = (0.023 / 0.0681) × 100 = 44.1 [%] is obtained.

Then, it is judged whether or not the relative humidity RHs exceeds the threshold value α (step S106). The "threshold value α" is a humidity (value) at which dew condensation occurs when it is cooled to the above specific temperature.

If it is determined in step S106 that the relative humidity RHs does not exceed the threshold value α, the cooling to the specific temperature is started (step S107). On the other hand, if it is determined in step S106 that the relative humidity RHs exceeds the threshold value α, the flow returns to step S101 to continue the supply of the dry air DA, and thereafter, the lower step of step S101 is sequentially performed.

As described above, the inspection apparatus 1 that performs the inspection in a low-temperature environment can supply the dry air DA to each of the first chamber R1, the second chamber R2, and the third chamber R3, thereby adjusting (setting) the humidity in the room. Thereby, condensation can be prevented from occurring in the second chamber R2 after cooling.

In addition, the number of the humidity sensor 24 and the temperature sensor 25 in the first chamber R1, the second chamber R2, and the third chamber R3 is one in the present embodiment, but the present invention is not limited thereto. Multiple. In this case, for example, as the humidity of the second chamber R2, it is possible to use a plurality of humidity The average of the detected values detected by the sensor 24 may also use the lowest detected value or the highest detected value.

Further, in the inspection apparatus 1, the humidity sensor 24 and the temperature sensor 25 in the third chamber R3 may be omitted.

The dry air DA for humidity adjustment in the first chamber R1, the second chamber R2, and the third chamber R3 also contains nitrogen which has been used as a refrigerant. Therefore, there is a possibility that the indoors become an oxygen-deficient state due to the supply amount of the dry air DA. Therefore, the inspection apparatus 1 is configured to ensure the safety of the operator in an oxygen-deficient state. Hereinafter, this configuration will be described. Here, the case where the inspection device 1 is performing the cooling operation and the doors of the first door 711 and the 731 to the fourth door 75 are locked in advance is taken as an example.

Further, when the specific gravity of the air is 1.00, the specific gravity of nitrogen is about 0.97, and the specific gravity of oxygen is about 1.11. When the room temperature at which the inspection device 1 is placed is the same as the temperature in the first chamber R1 to the third chamber R3, nitrogen tends to accumulate in the first chamber R1 to the third chamber R3. However, the nitrogen gas added to the dry air DA filled in the chambers is vaporized from the liquefied nitrogen and used as a refrigerant. Therefore, the nitrogen temperature after vaporization from the liquefied nitrogen is lower than room temperature, and the nitrogen tends to accumulate below.

As shown in FIG. 1, in the first chamber R1, the second chamber R2, and the third chamber R3, an oxygen concentration sensor 26 for detecting the oxygen concentration in the chamber is disposed, and the oxygen concentrations OC1, OC2 of the respective chambers are detected. OC3. Further, it is preferable that the first chamber R1, the second chamber R2, and the third chamber R3 are respectively controlled to have an oxygen concentration in which the indoor predetermined amount, that is, the oxygen deficiency state has been eliminated. Here, a control program for ensuring safety against an oxygen deficiency state in the first chamber R1 will be representatively described based on the flowchart of FIG. This control program is stored in the control unit 80.

The current oxygen concentration OC1 in the first chamber R1 is detected by the oxygen concentration sensor 26 (step S201), and it is determined whether or not the oxygen concentration OC1 is equal to or greater than the threshold value β1 (step S202).

When it is determined in step S202 that the oxygen concentration OC1 is equal to or greater than the threshold value β1, it is reported that any of the first doors 711 and 731 of the first chamber R1 can be unlocked (step S203). Thereby, for example Maintenance can be performed in the first room R1. Further, the numerical range of the threshold value β1 is not particularly limited, and is, for example, preferably 19% or more, and more preferably 18% or more.

If it is determined in step S202 that the oxygen concentration OC1 is not equal to or greater than the threshold value β1, it is determined whether or not the oxygen concentration OC1 is equal to or greater than the threshold value β2 (step S204). Further, the numerical range which is preferable as the threshold value β2 is not particularly limited, and is preferably, for example, 16% or more and less than 18%.

If it is determined in step S204 that the oxygen concentration OC1 is equal to or greater than the threshold value β2, it is reported that there is a possibility of an oxygen deficiency state, and it is necessary to pay attention to the result (step S205).

If it is determined in step S204 that the oxygen concentration OC1 is not equal to or greater than the threshold value β2, the cooling is stopped (step S206). At this time, the latching state of the first doors 711 and 731 is maintained. Further, it is preferable to perform the operation of increasing the oxygen concentration in the first chamber R1 together with the step S206.

As described above, in the inspection apparatus 1, even if one of the first chamber R1, the second chamber R2, and the third chamber R3 is in an oxygen-deficient state, the safety against the anoxic state is ensured.

In addition, the reporting method in steps S203 and S205 is not particularly limited, and for example, a method of image display, a method of sound, a method of emitting light, and the like can be used.

In the inspection apparatus 1, the door groups of the first doors 711 and 731 and the second door 732, the door groups of the third doors 721, 722, and 733, and the fourth door 75 can be independently locked and unlocked. As shown in FIG. 1, the inspection device 1 is provided with a switch SW1 for operating the first door group, a switch SW2 for operating the second door group, and a lock for operating the fourth door 75. Unlocked switch SW3.

As described above, the first chamber R1, the second chamber R2, and the third chamber R3 are in an oxygen-deficient state. For example, when the first chamber R1 is in an oxygen-deficient state, it is preferable to prohibit the unlocking of the first door 711 even if the switch SW1 is turned "ON". Therefore, the inspection apparatus 1 is configured to control the locking and unlocking of the door in accordance with the oxygen concentration in the room. Hereinafter, the control program will be described based on the flowchart of FIG. Furthermore, the control program is stored in the control unit 80. Here, the inspection apparatus 1 is an example in which all the doors of the first door 711 and the 731 to the fourth door 75 are previously locked.

When it is judged that the switch SW1 is turned on (step S301), it is judged whether or not the condition for unlocking the first gate group is satisfied (step S302). Furthermore, the condition in step S302 is based on the flowchart of FIG. 10, that is, the oxygen concentration is judged to be unlockable.

If it is determined in step S302 that the condition is satisfied, all the cylinders 740, 741, and 742 that perform the lock unlocking of the door belonging to the first gate group are operated (step S303). Thereby, the first doors 711 and 731 and the second door 732 can be opened to perform maintenance and the like. On the other hand, if it is determined in step S302 that the condition is not satisfied, the process proceeds to step S304.

Then, when it is judged that the switch SW2 is turned on (step S304), it is determined whether or not the condition for unlocking the second gate group is satisfied (step S305). Furthermore, the condition in step S305 is the same as the condition in step S302.

If it is determined in step S305 that the condition is satisfied, all of the cylinders 744 and 745 that perform the lock unlocking of the gate belonging to the second gate group are operated (step S306). Thereby, the third doors 721, 722, and 733 can be opened to perform maintenance and the like. On the other hand, if it is determined in step S305 that the condition is not satisfied, the process proceeds to step S307.

Then, when it is judged that the switch SW3 is turned on (step S307), it is judged whether or not the condition for unlocking the fourth door 75 is satisfied (step S308). Furthermore, the condition in step S308 is the same as the condition in step S302.

If it is determined in step S308 that the condition is satisfied, the cylinder 743 that performs the lockout of the fourth door 75 is actuated (step S309). Thereby, the fourth door 75 can be opened to perform maintenance and the like. On the other hand, if it is judged in step S309 that the condition is not satisfied, the flow returns to step S301, and thereafter, the step of the lower step of step S301 is sequentially performed.

As described above, the inspection apparatus 1 can control the unlocking of the door based on the oxygen concentration in the room of any of the first chamber R1, the second chamber R2, and the third chamber R3. Thereby, for example, even if the inside of the first chamber R1 is in an oxygen-deficient state, the safety against the anoxic state can be ensured. Further, when the first door group and the fourth door 75 are always blocked, and the second door group is unlocked and opened, the environment in the locked first chamber R1 and the second chamber R2 can be maintained. (gas atmosphere), That is, humidity and the like. Thereby, the conveyance of the IC element 90 in the first chamber R1 and the second chamber R2 is continued, whereby the decrease in the amount of conveyance can be prevented.

Furthermore, if it is determined that the switches SW1 to SW3 are turned on, they can be separated by a specific time (for example, 30 to 120 seconds), and the process proceeds to the next step.

Further, the size of the second door 732 and the fourth door 75 may be, for example, a height (longitudinal) of 120 mm or more and 200 mm or less, and a width (horizontal) of 300 mm or more and 400 mm or less. Thereby, it is possible to prevent the head of an ordinary adult from entering the second room R2 via the door of the open state, thereby improving the safety. Further, the oxygen concentration sensor 26 in the second chamber R2 may be omitted.

As shown in FIG. 6, the refrigerant source 300 that supplies the refrigerant C and the cooling target that is cooled by the refrigerant C are connected by two tubes 4. One of the two tubes 4 functions as a supply line for supplying the refrigerant C from the refrigerant source 300 to the cooling target, and the other tube 4 serves as a refrigerant for recovering the cooling C for cooling. The pipeline functions. In addition, the object to be cooled in the inspection apparatus 1 is not particularly limited, and examples thereof include a temperature adjustment unit 12 of the first chamber R1, an inspection unit 16 of the second chamber R2, and the like. Further, the refrigerant source 300 is provided on the outer side of the inspection apparatus 1 as, for example, a gas cylinder. Further, as the refrigerant C, for example, a vapor of a liquid can be used.

As shown in FIG. 7 and FIG. 8 , the tube 4 has a first pipe 41 filled with the refrigerant C and a casing structure in which the first pipe 41 is covered, that is, the second pipe 42 through which the first pipe 41 is inserted. By.

The first pipe 41 is a pipe body that is filled by the flow of the refrigerant C. The first pipe 41 is preferably an outer diameter d _1-1 is, for example, 4 mm or more and 8 mm or less, and the inner diameter d _1-2 is 2 mm or more and 6 mm or less. In addition, the constituent material of the first pipe 41 is not particularly limited, and for example, polytetrafluoroethylene or the like can be used.

Further, a heat insulating layer 43 is formed on the outer peripheral portion of the first pipe 41. Thereby, the first pipe 41 can be insulated from the outside. The thickness t of the heat insulating layer 43 is preferably, for example, 6 mm or more and 9 mm or less. Further, the constituent material of the heat insulating layer 43 is not particularly limited, and for example, a foamed rubber can be used. gum.

The second pipe 42 is a pipe body that is filled with a portion of the first pipe 41 that is filled with air having a predetermined humidity. As this air, it can be set as dry air DA. Furthermore, the second pipe 42 is preferably an outer diameter d _2-1 is, for example, 30 mm or more and 50 mm or less, and the inner diameter d _2-2 is 20 mm or more and 40 mm or less. The constituent material of the second pipe 42 is not particularly limited, and for example, a polyurethane or the like can be used.

In this manner, the tube 4 is configured such that the innermost portion is filled with the refrigerant C, and the outer side thereof is covered with the heat insulating layer 43, and the outer side is filled with the dry air DA. Thereby, it is possible to prevent the heat insulating layer 43 from coming into contact with the outside air, and it is possible to prevent dew condensation between the heat insulating layer 43 and the second pipe 42.

Further, it is preferable that the second pipe 42 has a large number of irregularities. That is, the second pipe 42 preferably has a bellows shape. Thereby, the tube 4 is easily bent as a whole, whereby the winding (pipe) of the tube 4 becomes easy.

As shown in FIG. 8, the tube 4 is provided with a positioning member 44 that positions the first pipe 41 and the second pipe 42 concentrically. The positioning members 44 are disposed at a plurality of intervals along the longitudinal direction of the tube 4. Thereby, the positioning of the first pipe 41 and the second pipe 42 is facilitated.

The positioning member 44 is annular and fitted between the first pipe 41 and the second pipe 42. Further, at least one of the positioning members 44 is formed with a defective portion (through hole) 441 through which the dry air DA passes.

<Second embodiment>

Fig. 12 is a schematic rear view showing an electronic component inspection device (second embodiment) of the present invention.

In the following, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.

In the present embodiment, in addition to the baffle provided in the first opening, the first solid is The form is the same.

As shown in FIG. 12, in the present embodiment, a baffle plate (first baffle plate) 69 is provided in the first opening portion 621 that allows the first chamber R1 and the second chamber R2 to communicate with each other. The first opening portion 621 can be opened and closed by the movement of the shutter 69. When the IC transfer unit 13 is transferred from the component transfer head 13 to the component supply unit 14, it is turned on, and is turned off when the transfer of the IC component 90 is stopped.

Further, in the open state, the dry air DA is preferentially fed from the second chamber R2 to the first chamber R1 via the first opening portion 621. Thereby, the humidity adjustment in the first chamber R1 is performed. In the closed state, the dry air DA is temporarily retained before being fed to the first chamber R1. Thereafter, by being in the on state, the dry air DA is rushed toward the first chamber R1 as compared with the case of the first embodiment. Thereby, the gas in the first chamber R1 is stirred, thereby contributing to the uniform humidity of the first chamber R1 as a whole.

Further, the moving direction of the shutter 69 is the X direction in the configuration shown in FIG. 12, but the present invention is not limited thereto, and may be, for example, the Y direction. The moving direction of the shutter 69 may be the same as or different from the moving direction of the shutter 68. Moreover, the drive source for moving the shutter 69 is not particularly limited, and for example, a motor or the like can be used.

<Third embodiment>

Fig. 13 is a schematic rear view showing an electronic component inspection device (third embodiment) of the present invention.

In the following, the third embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the sizes of the first opening and the second opening are different.

As shown in FIG. 13, in the present embodiment, the first opening 621 that connects the first chamber R1 and the second chamber R2 is provided in plurality, and the second chamber R2 and the third chamber R3 are connected to each other. Opening The part 631 is also provided with a plurality of parts. Each of the first openings 621 has an opening area larger than each of the second openings 631. Thereby, the dry air DA can be preferentially fed to the first chamber R1 than the third chamber R3.

<Fourth embodiment>

Fig. 14 is a transverse cross-sectional view showing a state of piping between a refrigerant source and a cooling target in the electronic component inspection device (fourth embodiment) of the present invention.

In the following, the fourth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the configuration of the tube is different.

As shown in FIG. 14, in the present embodiment, the tube 4 is composed of two first pipes 41 which are covered by the second pipe 42 in a bundle. In this way, one of the two first pipes 41 can be used for supplying the refrigerant C to the cooling target, and the other first pipe 41 can be used to recover the refrigerant C from the cooling target. Recycling use.

In addition, the number of the first pipes 41 is two in the present embodiment, but the number of the first pipes 41 is not limited thereto, and may be three or more.

<Fifth Embodiment>

Fig. 15 is a view showing a state of piping between a refrigerant source and a cooling target in the electronic component inspection device (fifth embodiment) of the present invention.

In the following, the fifth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the same matters will not be described.

This embodiment is the same as the above-described first embodiment except that the arrangement of the tubes is different.

As shown in Fig. 15, in the present embodiment, one of the tubes 4 in the longitudinal direction is surrounded by the casing 400, that is, stored. The box 400 is temporarily filled with dry air DA, borrowed Thus, the dry air DA can be dispensed, for example, to a portion that uses dry air DA, such as tube 4.

<Sixth embodiment>

Fig. 16 is a view showing a state of piping between a refrigerant source and a cooling target in the electronic component inspection device (sixth embodiment) of the present invention.

In the following, the sixth embodiment of the electronic component transporting apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the arrangement of the tubes is different.

As shown in Fig. 16, in the present embodiment, both end portions of the tube 4 are connected to the box-shaped connecting portion 500, respectively. The connecting portions 500 communicate with each other via the second pipes 42 of the tubes 4 . Thereby, for example, when the dry air DA is conveyed to the connection part 500 on the left side in FIG. 16, this dry air DA flows down in the 2nd piping 42, and it reaches the connection part 500 of the right side of FIG.

<Seventh embodiment>

Fig. 17 is a view showing an arrangement state of an oxygen concentration sensor in the electronic component inspection device (seventh embodiment) of the present invention.

In the following, the seventh embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the description of the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the arrangement position of the oxygen concentration sensor is different.

As shown in Fig. 17, in the present embodiment, the oxygen concentration sensor 26 is disposed inside the outer casing (e.g., the side casing 71) constituting the outermost package of the inspection apparatus 1 and is gated to perform the lock and unlock (for example, the first Door 711) is compared to the bottom.

As described above, the used nitrogen used as the refrigerant contained in the dry air DA tends to have a low temperature and is accumulated in the first chamber R1. Therefore, when the oxygen concentration sensor 26 is disposed below as described above, an oxygen concentration considered to be safe can be obtained in the first chamber R1.

Further, the operator of the inspection apparatus 1 opens the first door 711 to allow the hand or the like to enter the first chamber R1. Therefore, it is preferable to arrange the oxygen concentration sensor 26 near the entrance of the operator's hand. Further, the arrangement of the oxygen concentration sensor 26 described above is a preferred configuration, and thus it is preferable to be ergonomically considered in consideration of safety.

As described above, the electronic component conveying device and the electronic component inspection device of the present invention have been described based on the embodiments of the present invention. However, the present invention is not limited thereto, and various components constituting the electronic component conveying device and the electronic component inspection device can be utilized. Any component of the same function is replaced. Further, any constituent may be added.

Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be formed by combining any two or more of the above-described configurations (features).

1‧‧‧Inspection device (electronic parts inspection device)

11A, 11B‧‧‧Tray transport mechanism

12‧‧‧Temperature adjustment unit (soaking plate)

13‧‧‧Component transport head

14‧‧‧Component supply unit (supply shuttle)

15‧‧‧Tray transport mechanism (first transport device)

16‧‧‧Inspection Department

17‧‧‧Component head

18‧‧‧Component Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧Component head

21‧‧‧Tray transport mechanism

22A, 22B‧‧‧Tray transport mechanism

24‧‧‧Humidity sensor (hygrometer)

25‧‧‧temperature sensor (thermometer)

26‧‧‧Oxygen concentration sensor

61‧‧‧1st partition wall

62‧‧‧2nd partition wall

63‧‧‧3rd partition wall

64‧‧‧4th partition wall

65‧‧‧5th partition wall

70‧‧‧ front casing

71‧‧‧ side shell

72‧‧‧ side shell

73‧‧‧ rear casing

75‧‧‧4th door

80‧‧‧Control Department

90‧‧‧IC components

200‧‧‧Tray (configuration component)

611‧‧‧ openings

641‧‧‧ openings

711‧‧‧1st door

721, 722‧‧‧ third door

731‧‧‧1st door

732‧‧‧2nd door

733‧‧‧3rd door

740, 741, 742, 743, 744, 745‧ ‧ cylinders

A1‧‧‧Tray supply area

A2‧‧‧Component supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Component recycling area (recycling area)

OC1, OC2, OC3‧‧‧ oxygen concentration

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

RH1, RH2, RH3‧‧‧ Humidity

SW1, SW2, SW3‧‧‧ switch

Claims (24)

An electronic component transporting apparatus comprising: a first chamber into which an electronic component is carried in, a second chamber into which the electronic component is carried in from the first chamber, and a third chamber into which the electronic component is carried in from the second chamber; The feeding portion in which the electronic component arrangement member is disposed and the opening and closing portion that is openable and closable between the feeding portion and the first chamber are fed, and the humidity in the second chamber is lower than the humidity in the first chamber. An electronic component transporting apparatus comprising: a first chamber into which an electronic component is carried in, a second chamber into which the electronic component is carried in from the first chamber, and a third chamber into which the electronic component is carried in from the second chamber; The removal portion that removes the arrangement member of the electronic component is disposed, and the opening and closing portion that is openable and closable between the removal portion and the third chamber, and the humidity in the second chamber is lower than the humidity in the first chamber. The electronic component conveying apparatus according to claim 1 or 2, wherein the humidity in the second indoor chamber and the humidity in the first indoor chamber are average humidity in the room. The electronic component transport apparatus according to claim 1 or 2, wherein the humidity in the second room and the humidity in the first room are the highest humidity among a plurality of humidity sensors sensed by the humidity sensors disposed in the respective rooms. The electronic component transporting apparatus according to claim 1 or 2, wherein the humidity of the position of the humidity sensor is disposed in each of the humidity in the second indoor room and the humidity in the first indoor room. The electronic component conveying apparatus according to claim 1 or 2, wherein the humidity in the second room and the humidity in the first room are when the electronic component is disposed in the second room humidity. The electronic component conveying apparatus according to claim 1 or 2, wherein a difference between the humidity in the second chamber and the humidity in the first chamber is greater than 0% RH and less than 4.5% RH. The electronic component transport apparatus according to claim 1 or 2, wherein the humidity in the first room, the humidity in the second room, and the humidity in the third room are controlled by 0 to 60% RH. The electronic component transport apparatus according to claim 1 or 2, wherein the humidity in the first room, the humidity in the second room, and the humidity in the third room are controlled by flowing dry air or nitrogen into the respective rooms. The electronic component transport apparatus of claim 1 or 2, wherein the humidity in the second room is lower than the humidity in the third room. The electronic component transport apparatus of claim 10, wherein the humidity in the second room is lower than the humidity in the first room, and the humidity in the first room is lower than the humidity in the third room. The electronic component transport apparatus of claim 11, wherein a difference between the humidity in the first room and the humidity in the third room is greater than 0% RH and less than 4.5% RH. The electronic component transport apparatus of claim 1 or 2, wherein the first chamber and the third chamber are separated by a partition wall. The electronic component transport apparatus according to claim 1 or 2, wherein an oxygen concentration sensor that detects an oxygen concentration is disposed in the first chamber, the second chamber, and the third chamber. The electronic component transport apparatus according to claim 1 or 2, wherein the first chamber, the second chamber, and the third chamber are controlled to have a predetermined humidity and oxygen concentration. The electronic component transport apparatus according to claim 1 or 2, wherein a first opening that allows the first chamber to communicate with the second chamber is provided between the first chamber and the second chamber. The electronic component transport apparatus according to claim 1 or 2, wherein a second opening that allows the second chamber to communicate with the third chamber is provided between the second chamber and the third chamber. The electronic component transport apparatus according to claim 1 or 2, wherein a fourth chamber in which the transport mechanism of the electronic component is transported in the second chamber is disposed in an upper portion of the second chamber. The electronic component conveying apparatus according to claim 1 or 2, wherein the first conveying device is provided in the first chamber, and the second conveying device is provided in the third chamber. The electronic component transporting apparatus according to claim 1 or 2, wherein the first door and the third door are provided in the first chamber and the third chamber, and the first door and the third door are independently and independently Lock and unlock. The electronic component transport device of claim 20, wherein the first door and the third door are respectively rotatably supported. The electronic component conveying apparatus according to claim 1 or 2, wherein the refrigerant source that supplies the refrigerant and the cooling target that is cooled by the refrigerant are connected by a first pipe that is filled with the refrigerant, and the first pipe is connected by the second pipe Covering, the first pipe and the second pipe are filled with air of a predetermined humidity. An electronic component inspection device including: a first chamber into which an electronic component is carried in, a second chamber into which the electronic component is carried in from the first chamber, and a third chamber in which the electronic component is carried in from the second chamber; Feeding a feeding portion in which the electronic component arrangement member is disposed, and an opening and closing portion that is openable and closable between the feeding portion and the first chamber, and an inspection portion that is installed in the second chamber and inspects the electronic component, and the above The humidity in the second room is lower than the humidity in the first room. An electronic component inspection device including: a first chamber into which an electronic component is carried in, a second chamber into which the electronic component is carried in from the first chamber, and a third chamber in which the electronic component is carried in from the second chamber; a removal portion that removes the arrangement member of the electronic component, and an opening and closing portion that can be opened and closed between the removal portion and the third chamber, and an inspection portion that is installed in the second chamber and inspects the electronic component And the humidity in the second room is lower than the humidity in the first room.