TWI710513B - Electronic component inspection device and inspection method - Google Patents

Abstract

The object of the present invention is to provide an electronic component conveying device, an electronic component inspection device, a test piece for dew or frost inspection, and a dew or frost inspection method that can easily detect whether or not electronic components have condensation or frost in the device .

The electronic component inspection apparatus 1a includes a tray (mounting part) 200a on which an inspection test piece 90a including a discoloration member 92 that changes color when dew or frost is formed can be mounted. In addition, the electronic component inspection device 1a includes an imaging unit 103. In addition, the imaging unit 103 is arranged in the device collection area A4 where the electronic components whose inspection has been completed are collected. Moreover, the mounting part 200a is arrange|positioned in the horizontal direction or the vertical direction with respect to the electronic component mounting part 200 which mounts an electronic component.

Description

Electronic component inspection device and inspection method

The present invention relates to an electronic component conveying device, an electronic component inspection device, a test piece for dew or frost inspection, and a dew or frost inspection method.

Heretofore, there has been known an electronic component inspection device for testing the electrical characteristics of electronic components such as IC devices. In the electronic component inspection device, an electronic component conveying device for conveying the IC device to the holding part of the inspection unit is assembled. When the IC device is inspected, the IC device is placed in the holding part, and the plurality of probe pins provided in the holding part are brought into contact with each terminal of the IC device.

The inspection of this type of IC device may be performed by cooling the IC device to a specific temperature. In this case, in order to avoid condensation, the IC device must be cooled and the humidity of the environment of the components for the IC device must be reduced.

Patent Document 1 describes an IC sorting machine (IC Handler) which is configured to detect a short circuit when condensation occurs between electrodes of an IC device to detect the occurrence of condensation.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2005-300285

However, as in the device of Patent Document 1, the detection of dew condensation must be done through mechanical processing. Therefore, there are problems such as complexity of the device and high cost. In addition, in the case of frost-like ice, there is a possibility that there is no short circuit between the electrodes.

The object of the present invention is to provide an electronic component transport device, an electronic component inspection device, a test piece for dew or frost inspection, and an inspection of dew or frost that can easily detect whether condensation or frost occurs in the electronic parts in the device Method, or provide an electronic component conveying device, an electronic component inspection device, and an inspection method for dew or frost that can easily detect condensation or frost on electronic components in the device.

The present invention is accomplished to solve at least a part of the above-mentioned problems, and can be realized as the following forms or application examples.

[Application example 1] The electronic component conveying device of this application example is characterized by including a mounting portion that can convey electronic components and can be mounted with discoloration that changes color when liquid or solid water is attached The component of the component.

Thereby, it is easy to check whether the electronic component has condensation or frost in the electronic component conveying device.

[Application Example 2] In the electronic component conveying device of this application example, it is preferable that the color changing member changes color when dew or frost is formed.

In this way, it is easier to check whether the electronic components have condensation or frost in the electronic component conveying device.

[Application Example 3] In the electronic component conveying device of this application example, it is preferable to include an imaging unit capable of imaging the above-mentioned components.

Thereby, it is possible to more simply confirm the discoloration of the discoloration member.

[Application example 4] In the electronic component conveying device of this application example, preferably, the above-mentioned imaging unit It is located in the recycling area where the above-mentioned electronic parts that have undergone specific inspections are recycled.

As a result, it is possible to more reliably detect whether the electronic component has condensation or frost in the electronic component conveying device.

[Application Example 5] In the electronic component conveying device of this application example, it is preferable that the mounting portion is arranged in a vertical direction with respect to the electronic component mounting portion on which the electronic components are mounted.

In this way, it is easier to detect whether the electronic component has condensation or frost in the electronic component conveying device.

[Application Example 6] In the electronic component conveying device of this application example, it is preferable that the mounting portion is arranged in a direction orthogonal to the vertical direction with respect to the electronic component mounting portion on which the electronic component is mounted.

In this way, it is easier to detect whether the electronic component has condensation or frost in the electronic component conveying device.

[Application example 7] In the electronic component conveying device of this application example, it is preferable that the mounting portion is arranged in an electronic component mounting portion supply area or a device supply area, and the electronic component mounting portion supply area is a supply and mount The electronic component placement portion with the electronic components before the specific inspection is performed; the device supply area is to supply the electronic components placed on the electronic component placement portion from the electronic component placement portion supply area Inspection area for inspection.

In this way, it is easier to detect whether the electronic component has condensation or frost in the electronic component conveying device.

[Application Example 8] In the electronic component conveying device of this application example, it is preferable that when the above-mentioned member is arranged in the electronic component conveying device, the color changing member is configured to face vertically downward.

Thereby, it is possible to more reliably detect whether the electronic parts have knots in the electronic parts conveying device. Dew or frost.

[Application Example 9] The electronic component inspection device of this application example is characterized by including a mounting portion on which a member with a color-changing member that changes color when liquid water or solid water is attached; and an inspection portion for inspection Electronic parts.

Thereby, it is easy to check whether the electronic component has condensation or frost in the electronic component conveying device.

[Application Example 10] The test piece for dew or frost inspection of this application example is characterized by including a color changing member that changes color when liquid water or solid water is attached.

Thereby, it is easy to check whether the electronic parts have condensation or frost in the device.

[Application example 11] The feature of the inspection method for dew or frost in this application example is that it uses an inspection test piece that contains a discolored member that changes color when liquid or solid water is attached to detect dew or frost. .

Thereby, it is easy to check whether the electronic parts have condensation or frost in the device.

[Application Example 12] The electronic component conveying device of this application example is characterized by including an imaging unit that can photograph a member to which liquid water or solid water is attached.

Thereby, it is possible to easily detect whether the electronic component has condensation or frost in the electronic component conveying device.

[Application Example 13] In the electronic component conveying device of this application example, it is preferable that the imaging section captures the dew or frost of the member.

Thereby, it is easier to check the occurrence of dew or frost of the electronic parts in the electronic parts conveying device.

[Application Example 14] In the electronic component conveying device of this application example, it is preferable that the above-mentioned member is an electronic component or a test piece for inspection.

Thereby, it is easier to check the occurrence of dew or frost of the electronic parts in the electronic parts conveying device.

[Application example 15] In the electronic component conveying device of this application example, it is preferable to include a light irradiating part that irradiates light to the above-mentioned member.

In this way, light scattering can be used to more reliably detect the occurrence of dew or frost.

[Application example 16] In the electronic component conveying device of this application example, it is preferable that the light irradiation section irradiates light from a direction inclined with respect to the normal line of the imaging surface of the member.

Thereby, it is easier to detect the occurrence of dew or frost of the electronic parts in the electronic parts conveying device.

[Application Example 17] In the electronic component conveying device of this application example, it is preferable that the imaging surface of the aforementioned member is a mirror surface.

Thereby, it is easier to detect the occurrence of dew or frost of the electronic parts in the electronic parts conveying device.

[Application Example 18] The electronic component inspection device of this application example is characterized by including: a camera part that can photograph components that are condensed or frosted; and an inspection part that inspects electronic parts.

Thereby, it is possible to easily detect the occurrence of dew or frost on the electronic components in the electronic component conveying device.

[Application Example 19] The feature of the inspection method for dew or frost in this application example is that it photographs the dew or frost member to inspect the dew or frost.

Thereby, it is possible to easily detect the occurrence of dew or frost on the electronic parts in the device.

1a: Inspection device (electronic component inspection device)

1b: Inspection device (electronic component inspection device)

11A: Pallet transport mechanism

11B: Pallet transport mechanism

12: Temperature adjustment part (soaking plate)

13: Device transfer head

14: Device supply department (supply vehicle)

15: Pallet transport mechanism (first transport device)

16: Inspection Department

17: Device transfer head

18: Device recycling department (recycling vehicles)

19: Recycling pallets

20: Device transfer head

21: Pallet conveying mechanism (2nd conveying device)

22A: Pallet transport mechanism

22B: Pallet transport mechanism

24: Humidity sensor (hygrometer)

25: Temperature sensor (thermometer)

61: The first partition

62: The second partition wall

63: The third partition wall

64: The fourth partition wall

65: The fifth wall

66: inner partition

70: Front cover

71: side cover

72: side cover

73: back cover

75: The fourth door

80: Control Department

90: IC device

90a: Test piece for inspection (component)

90b: Test piece for inspection (component)

91: upper surface

91b: upper surface

92: color changing member

100: Camera Department

103: Camera Department

200: Tray (electronic component placement part)

200a: Tray (placement part)

711: The first door (the first door on the left)

712: The second door (the second door from the left)

721: The first door (the first door on the right)

722: 2nd door (2nd door on the right)

731: The first door (the first door on the back side)

732: The first door (the first door on the back side)

733: The third door (the third door on the back side)

740: cylinder

741: cylinder

742: cylinder

743: cylinder

744: cylinder

745: cylinder

A1: Pallet supply area

A2: Device supply area (supply area)

A3: Inspection area

A4: Device recycling area (recycling area)

A5: Pallet removal area

DA: Dry gas

R1: Room 1

R2: Room 2

R3: Room 3

X: axis

Y: axis

Z: axis

Fig. 1 is a schematic plan view showing the first embodiment of the electronic component inspection apparatus of the present invention.

Fig. 2 is a cross-sectional view of a test piece for inspection of condensation or frost and an imaging section of the first embodiment.

Fig. 3 is a schematic plan view showing a second embodiment of the electronic component inspection apparatus of the present invention.

Fig. 4 is a cross-sectional view of the imaging unit of the second embodiment.

Fig. 5 is a cross-sectional view of the imaging unit of the second embodiment.

Fig. 6 is a cross-sectional view of the imaging unit of the second embodiment.

Hereinafter, the electronic component conveying device, the electronic component inspection device, the test strip for dew or frost inspection, and the dew or frost inspection method of the present invention will be described in detail based on the preferred embodiments shown in the attached drawings.

Hereinafter, for convenience of description, for example, as shown in FIG. 1, three axes orthogonal to each other are referred to as the X axis, the Y axis, and the Z axis. In addition, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. In addition, the direction parallel to the X axis is also referred to as the "X direction", the direction parallel to the Y axis is also referred to as the "Y direction", and the direction parallel to the Z axis is also referred to as the "Z direction". In addition, the upstream side in the conveyance direction of the electronic components is also referred to as the "upstream side", and the downstream side is also referred to as the "downstream side". In addition, the so-called "horizontal" in the specification of this case is not limited to a complete level, as long as it does not hinder the conveyance of electronic components, it also includes a state slightly inclined (for example, less than 5°) relative to the horizontal.

Furthermore, the inspection device (electronic component inspection device) shown in the embodiment is used for inspection/testing (hereinafter referred to as "inspection") such as BGA (Ball grid array) package or LGA (Land grid array) Array: flat grid array) packaging and other IC devices, or LCD (Liquid Crystal Display: liquid crystal display), CIS (CMOS Image Sensor: CMOS image sensor) and other electronic components of the electrical characteristics of the device. In addition, the following, for the convenience of explanation, to use The IC device is described as a representative of the above-mentioned electronic parts to be inspected, and it is set as "IC device 90".

(First Embodiment)

Fig. 1 is a schematic plan view showing the first embodiment of the electronic component inspection apparatus of the present invention. Figure 2 is a cross-sectional view of a test piece for inspection of dew or frost and an imaging unit.

As shown in Fig. 1, the inspection device (electronic component inspection device) 1a of this embodiment is divided into a tray supply area (electronic component placement portion supply area) A1, a component supply area (hereinafter also referred to as "supply area") A2, Inspection area A3, device recycling area (hereinafter also referred to as "recycling area") A4, and tray removal area A5. In addition, the IC device 90 passes from the tray supply area A1 through the supply area A2, the inspection area A3, the recovery area A4, and the tray removal area A5 in order, and is inspected in the inspection area A3 in the middle. In this way, the inspection device 1a includes the following: an electronic component conveying device that supplies the tray supply area A1, supply area A2, inspection area A3, collection area A4, and tray removal area A5 (hereinafter also referred to as "area") The IC device 90 is transported; the inspection unit 16 which performs inspection in the inspection area A3; and the control unit 80.

In addition, the inspection device 1a is configured with one of the tray supply area A1 or the tray removal area A5 (the -Y direction side in FIG. 1) is the front side, and the opposite side is one of the inspection areas A3 (FIG. 1 The +Y direction side) is used as the back side.

The tray supply area A1 is a material supply part for supplying a tray (electronic component mounting part) 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In addition, in the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 is an area in which a plurality of IC devices 90 arranged on the upper surface of the tray 200 conveyed from the tray supply area A1 are respectively supplied to the inspection area A3. In addition, a tray conveyor is provided that transports the trays 200 one by one in a way that spans the tray supply area A1 and the supply area A2. Structure 11A, 11B.

In the supply area A2, a temperature adjustment section (heating plate) 12, a device transfer head 13, and a tray transfer mechanism (first transfer device) 15 are provided.

The temperature adjustment unit 12 is a device that heats or cools a plurality of IC devices 90 and adjusts the IC devices 90 to a temperature suitable for inspection. In the structure shown in FIG. 1, two temperature adjustment parts 12 are arranged and fixed along the Y direction. In addition, the IC device 90 on the tray 200 carried in (conveyed from) from the tray supply area A1 by the tray transport mechanism 11A is transported and placed on any one of the temperature adjusting parts 12.

The device transfer head 13 is supported movably in the supply area A2. Thereby, the device transfer head 13 can carry the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, and the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14 described later The transfer.

The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in the state where all IC devices 90 have been transported out in the X direction in the supply area A2. And, after this transport, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transfer head 17, and a device recovery unit (recovery shuttle) 18 are provided.

The device supply unit 14 is a device that transports the temperature-adjusted IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable in the X direction between the supply area A2 and the inspection area A3. Furthermore, in the configuration shown in FIG. 1, two component supply sections 14 are arranged in the Y direction, and the IC components 90 on the temperature adjustment section 12 are transported and placed on any one of the component supply sections 14.

The inspection unit 16 is a unit that inspects/tests the electrical characteristics of the IC device 90. The inspection part 16 is provided with a compound to maintain the state of the IC device 90 and electrically connect with the terminals of the IC device 90 Several probe pins. In addition, the terminals of the IC device 90 are electrically connected (contacted) with the probe pins, and the IC device 90 is inspected through the probe pins. The inspection of the IC device 90 is performed based on the program memorized in the inspection control section of the tester connected to the inspection section 16. In addition, the inspection unit 16 can heat or cool the IC device 90 and adjust the IC device 90 to a temperature suitable for inspection, similarly to the temperature adjustment unit 12.

The device transfer head 17 is supported movably in the inspection area A3. Thereby, the device transfer head 17 can transfer the IC device 90 on the device transfer and supply part 14 carried in from the supply area A2 to the inspection part 16 and place it on it.

The device recovery unit 18 is an apparatus that transports the IC device 90 whose inspection in the inspection unit 16 is completed to the recovery area A4. The device recovery part 18 is supported so as to be movable in the X direction between the inspection area A3 and the recovery area A4. In addition, in the configuration shown in FIG. 1, the device recovery section 18 is the same as the device supply section 14. Two devices are arranged in the Y direction, and the IC device 90 on the inspection section 16 is transported and placed on any one of the device recovery sections 18. . This transfer is performed by the device transfer head 17.

The recovery area A4 is an area where a plurality of IC devices 90 whose inspection has been completed are recovered. In this collection area A4, a collection tray 19, a device transfer head 20, and a tray transfer mechanism (second transfer device) 21 are provided. In addition, an empty tray 200 is also provided in the recycling area A4.

The recovery tray 19 is fixed in the recovery area A4, and in the configuration shown in FIG. 1, three are arranged along the X direction. In addition, three empty trays 200 are also arranged along the X direction. And, the IC device 90 moved to the device collection part 18 of the collection area A4 is transported and placed on any one of the collection tray 19 and the empty tray 200. In this way, the IC devices 90 are collected and classified based on the respective inspection results.

The device transfer head 20 is supported movably in the recovery area A4. Thereby, the device transfer head 20 can transfer the IC device 90 from the device recovery part 18 to the recovery tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 carried in from the tray removal area A5 in the X direction in the recovery area A4. Furthermore, after the transportation, the empty tray 200 is placed at the position where the IC device 90 is recovered, that is, it may become any one of the three empty trays 200 arranged in the recovery area A4.

In this way, in the inspection device 1a, the tray transport mechanism 21 is provided in the collection area A4, and the tray transport mechanism 15 is also provided in the supply area A2. With this, for example, even if the empty tray 200 is transported in the X direction by one transport device, the throughput (the number of transported IC devices 90 per unit time) can be increased.

The tray removal area A5 collects and removes the material removal part of the tray 200 in which a plurality of IC devices 90 in an inspected state are arranged. In addition, in the tray removal area A5, a plurality of trays 200 can be stacked.

Furthermore, tray conveying mechanisms 22A, 22B that convey the trays 200 one by one so as to span the collection area A4 and the tray removal area A5 are provided. The tray transport mechanism 22A is a mechanism that transports the tray 200 on which the IC device 90 that has been inspected is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports the empty tray 200 used for recycling the IC device 90 from the tray removal area A5 to the recycling area A4.

The control unit 80 has, for example, a drive control unit. The drive control unit, for example, controls the tray transport mechanism 11A, 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the device transfer head 17, the device recovery unit 18, and the device transfer head 20 , The drive of each part of the tray conveying mechanism 21, the tray conveying mechanism 22A, 22B.

In addition, the inspection control unit of the above-mentioned tester performs, for example, an inspection of the electrical characteristics of the IC device 90 arranged in the inspection unit 16 based on a program stored in a memory not shown.

In the inspection apparatus 1a as above, in addition to the temperature adjustment part 12 or the inspection part 16, the device The transfer head 13, the device supply unit 14, and the device transfer head 17 are similarly configured to be able to heat or cool the IC device 90. Thereby, the temperature of the IC device 90 is kept constant during the transportation process. In addition, the following description will describe the case where the IC device 90 is cooled and inspected in a low temperature environment in the range of -60°C to -40°C, for example.

As shown in Fig. 1, the inspection device 1a is divided (divided) between the tray supply area A1 and the supply area A2 by the first partition wall 61, and between the supply area A2 and the inspection area A3 by the second partition wall 62. The 3 partition wall 63 partitions the inspection area A3 and the recovery area A4, and the fourth partition wall 64 partitions the recovery area A4 and the tray removal area A5. In addition, the supply area A2 and the recovery area A4 are also partitioned by the fifth partition wall 65. The partition walls have the function of maintaining the airtightness of each area. Furthermore, the outermost of the inspection device 1a is covered by a cover body, and the cover body includes, for example, a front cover body 70, a side cover body 71, a side cover body 72, and a rear cover body 73.

In addition, the supply area A2 becomes a first chamber R1 partitioned by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side cover 71, and the rear cover 73. A plurality of IC devices 90 in an unchecked state are carried into the first chamber R1 by the entire tray 200.

The inspection area A3 is the second chamber R2 drawn by the second partition wall 62, the third partition wall 63, and the back cover 73. To the second room R2, a plurality of IC devices 90 are carried in from the first room R1.

The recovery area A4 is a third chamber R3 drawn by the third partition wall 63, the fourth partition wall 64, the fifth partition wall 65, the side cover 72, and the rear cover 73. To the third room R3, a plurality of IC devices 90 whose inspection has been completed are carried in from the second room R2.

As shown in FIG. 1, the side cover 71 is provided with a first door leaf (the first door leaf on the left) 711 and a second door leaf (the second door leaf on the left) 712. By opening the first door 711 or the second door 712, for example, the maintenance in the first room R1 or the clogging of the IC device 90 can be released (hereinafter, these are generally referred to as "work"). In addition, the first door 711 and the second door 712 are so-called that they open and close in opposite directions. "Double door". In addition, when the work in the first chamber R1 is performed, the movable parts of the device transfer head 13 and the like in the first chamber R1 are stopped. The first door leaf 711 and the second door leaf 712 can be locked/unlocked together by the action of the cylinder 740.

Similarly, in the side cover 72, a first door leaf (right side first door leaf) 721 and a second door leaf (right side second door leaf) 722 are provided. The operations in the third room R3 can be performed, for example, by opening the first door 721 or the second door 722. In addition, the first door 721 and the second door 722 also become so-called "double doors" that open and close in opposite directions. In addition, when the work in the third chamber R3 is performed, the movable parts of the device transfer head 20 and the like in the third chamber R3 are stopped. The first door 721 and the second door 722 can be locked/unlocked together by the actuation of the cylinder 745.

Furthermore, in the back cover 73, a first door (first door on the back side) 731, a second door (second door on the back side) 732, and a third door (third door on the back side) 733 are also provided. By opening the first door 731, for example, operations in the first room R1 can be performed. By opening the third door 733, for example, operations in the third room R3 can be performed.

Furthermore, an inner partition wall 66 is provided between the second door leaf (second door leaf on the back side) 732 and the second chamber R2, and a fourth door leaf 75 is provided on the inner partition wall 66. In addition, by opening the second door 732 and the fourth door 75, for example, operations in the second room R2 can be performed.

In addition, the first door 731, the second door 732, and the fourth door 75 are opened and closed in the same direction, and the third door 733 is opened and closed in the opposite direction to these doors. In addition, when working in the second room R2, the movable parts of the device transfer head 17 and the like in the second room R2 stop. The first door 731 can be locked/unlocked by the actuation of cylinder 741, the second door 732 can be locked/unlocked by the actuation of cylinder 742, and the third door 733 can be closed by the actuation of cylinder 744. For locking/unlocking, the fourth door 75 can be locked/unlocked by the action of the cylinder 743, and the airtightness or thermal insulation of the corresponding chambers can be ensured by closing the doors.

Thereby, the inspection apparatus 1a inspects the IC device 90 in a low-temperature environment.

As shown in Figure 1, in the first room R1, the second room R2, and the third room R3, a humidity sensor (hygrometer) 24 for detecting the humidity in the room and a temperature sensor ( Thermometer) 25. In addition, the humidity in each room uses the humidity (detected value) at the location where the humidity sensor 24 is disposed, and the temperature uses the temperature (detected value) at the location where the temperature sensor 25 is disposed. In this way, accurate humidity or temperature can be obtained as much as possible.

In the inspection device 1a that performs inspection in a low-temperature environment, dry air DA can be supplied to each of the first room R1, the second room R2, and the third room R3 to adjust (set) the humidity in each room. Thereby, it is possible to prevent condensation from occurring in the second chamber R2 after cooling.

In addition, although the number of the humidity sensor 24 and the temperature sensor 25 in the first room R1, the second room R2, and the third room R3 is one in this embodiment, it is not limited to this. For plural. In this case, for example, as the humidity of the second chamber R2, the average value of the detection values detected by a plurality of humidity sensors 24 may be used, or the lowest detection value or the highest detection value may be used.

Moreover, in the inspection device 1a, the humidity sensor 24 and the temperature sensor 25 in the third chamber R3 may be omitted.

In the above-mentioned inspection apparatus 1a, a tray (mounting part) 200a is supplied to the tray supply area A1 as shown in FIG. 1, and it is possible to mount an inspection test piece equipped with a discoloration member that changes color in the event of condensation or frost. (Member) 90a. In addition, the term "discoloration" in this specification includes not only color changes, but also the concept of uniformity or shade changes.

In the configuration shown in the figure, the tray (mounting portion) 200a is arranged in a horizontal direction with respect to the tray (electronic component mounting portion) 200. In addition, the tray 200 a is arranged in the vertical direction with respect to the tray 200.

As shown in FIG. 2, the test piece (member) 90a for inspection is composed of a test device 93 and a color changing member 92 arranged on the lower surface of the test device 93. In other words, the color changing member 92 is oriented vertically The way below is composed. In addition, as long as the orientation of the color changing member 92 is an orientation in which the imaging unit 103 described later can be installed, it is not limited to a vertical downward direction, and may be a vertical upward direction or a lateral direction.

As the color changing member 92, for example, a humidity indicator, a water immersion detection sealing film, etc. can be used.

An imaging unit 103 is provided in the recovery area A4.

The imaging unit 103 has a function of imaging the color changing member 92.

In this embodiment, the imaging unit 103 is configured to image the inspection test piece 90a held by the device transfer head 20 from the lower surface side as shown in FIG. 2 to confirm the discoloration of the discoloration member 92.

In such an inspection apparatus 1a, the tray 200a on which the test strip 90a for inspection is placed is conveyed to the supply area A2 by the tray conveying mechanism 11A.

The test piece 90a for inspection conveyed on the tray 200a of the supply area A2 is conveyed by the device conveying head 13 to the temperature adjustment part 12 like the IC device 90.

The test piece 90a for inspection conveyed to the temperature adjustment part 12 is conveyed by the device transfer head 13 and the device supply part 14 to the inspection area A3.

The test piece 90a for inspection conveyed to the inspection area A3 passes through the inspection area A3 in the same manner as the IC device 90, and is conveyed to the imaging section 103 by the device transfer head 20.

The color changing member 92 of the test piece 90a for inspection conveyed to the imaging part 103 is imaged.

If the discoloration of the discoloration member 92 is not confirmed, the inspection test piece 90a is conveyed along a path opposite to the path conveyed to the imaging unit 103 and placed on the empty tray 200a waiting in the supply area A2.

After that, the tray 200a containing the test strip 90a for inspection is returned from the supply area A2 to the tray supply area A1 by the tray transport mechanism 15 and the tray transport mechanism 11B. In addition, it may still be installed in the supply area A2 without returning to the tray supply area A1.

In addition, in the above-mentioned inspection apparatus 1a, before the inspection of the IC device 90, the above-mentioned dew or frost inspection is performed. In this inspection, if the discoloration of the discoloration member 92 is not confirmed, the IC device 90 is directly inspected. And, thereafter, for example, at about 3 hours intervals, check for condensation or frost. When confirming the condition of condensation or frost, the inspection device 1a displays an error and stops. The inside of the inspection device 1a is dried, and the inspection test piece 90a is used again to check for condensation or frost. After confirming that no condensation or frost occurs, the IC device 90 is inspected.

With the inspection device 1a described above, it is possible to easily inspect whether the IC device 90 has condensation or frost in the inspection device 1a.

In addition, in the above description, although the tray (placement portion) 200a is first located in the tray supply area A1 and then is transported to the supply area A2 as an example, the tray (placement portion) 200a may also be located in the supply area first. A2.

In addition, the imaging unit 103 and the inspection test strip 90a may be installed in the supply area A2 or the inspection area A3, and the discoloration of the discoloration member may be monitored at any time.

(Second Embodiment)

Fig. 3 is a schematic plan view showing a second embodiment of the electronic component inspection apparatus of the present invention. 4 to 6 are cross-sectional views of the imaging unit of the second embodiment.

Hereinafter, the second embodiment of the electronic component inspection apparatus of the present invention will be described with reference to these drawings, but the description will be centered on the differences from the above-mentioned embodiment, and the same items will be given the same symbols and omitted. The description.

As shown in Figure 3, the inspection device (electronic component inspection device) 1b is divided into a tray supply area A1, a component supply area (hereinafter also referred to as "supply area") A2, an inspection area A3, and a component recovery area (hereinafter also referred to as " Recycling area") A4, and tray removal area A5. Moreover, the IC device 90 passes through the supply area A2, the inspection area A3, and the recovery area from the tray supply area A1 in order. A4. Pallet removal area A5, and inspection in the halfway inspection area A3. In this way, the inspection device 1b includes the following: an electronic component conveying device that conveys the IC device 90 to the tray supply area A1, the supply area A2, the inspection area A3, the collection area A4, and the tray removal area A5; and the inspection unit 16, which Perform inspection in inspection area A3; and control section 80.

In the inspection apparatus 1b of the present embodiment, an imaging unit 100 for imaging the upper surface 91 of the IC device 90 is provided on the vertical upper side of the device recovery unit 18. The imaging unit 100 is included in an electronic component conveying device.

As shown in FIG. 4, the imaging unit 100 has a camera unit 101 and a light irradiation unit 102.

The camera section 101 is arranged vertically above the device recovery section 18, and is configured to photograph the upper surface 91 of the IC device 90 from above. If condensation or frost occurs on the upper surface 91 of the IC device 90, the color of the upper surface 91 of the IC device 90 photographed by the camera section 101 will change due to the reflection of light.

The light irradiating section 102 is arranged obliquely above the IC device 90 in such a way that it irradiates the upper surface 91 of the IC device 90 with light from a direction inclined with respect to the normal line X of the upper surface 91 of the IC device 90.

When the light is irradiated by the light irradiating part 102, when there is no condensation or frost, the light is reflected in a specific direction as shown in FIG. 4, but when there is condensation or frost, it occurs as shown in FIG. Scattering of light. As a result, the color change of the upper surface 91 of the IC device 90 photographed by the camera section 101 becomes obvious, and the occurrence of dew or frost can be detected more reliably. In addition, the change in the amount of light incident on the camera unit 101 can also be used to detect the occurrence of condensation or frost.

The upper surface 91 of the IC device 90 is preferably a mirror surface. By setting it as a mirror surface, the contrast of the color of the upper surface 91 becomes better, so that the occurrence of dew or frost can be detected more easily.

This type of inspection device 1b performs dew or frost inspection at appropriate intervals (for example, about 3 hours). When dew or frost is confirmed, the inspection device 1b displays an error and stops. its After that, the inside of the inspection device 1b is dried, and the inspection of condensation or frost is performed again. After confirming that no condensation or frost has occurred, the inspection of the IC device 90 is continued.

In the inspection apparatus 1b described above, the occurrence of dew or frost in the IC device 90 in the inspection apparatus 1b can be easily inspected.

In addition, in the above description, although the upper surface 91 of the IC device 90 is photographed to check the occurrence of dew or frost as an example, it is not limited to the IC device 90. For example, it may be as shown in FIG. 6 The test piece 90b for inspection used only for inspection is transported to the inspection device 1b to inspect the occurrence of dew or frost on the upper surface 91b.

In addition, in the above description, although the case where the imaging unit 100 is installed vertically above the device recovery unit 18 has been described, it is not limited to this. For example, the imaging unit 100 may be installed in the recovery area A4.

As mentioned above, although the electronic component conveying device and electronic component inspection device of the present invention have been described with the illustrated embodiment, the present invention is not limited to this, and each part constituting the electronic component conveying device and electronic component inspection device can be replaced with those capable of performing the same Arbitrary composition of functions. Moreover, arbitrary structures may be added.

Furthermore, the electronic component transport device and the electronic component inspection device of the present invention may also be a combination of any two or more configurations (features) in each embodiment.

1a: Inspection device (electronic component inspection device)

11A: Pallet transport mechanism

11B: Pallet transport mechanism

12: Temperature adjustment part (soaking plate)

13: Device transfer head

14: Device supply department (supply vehicle)

15: Pallet transport mechanism (first transport device)

16: Inspection Department

17: Device transfer head

18: Device recycling department (recycling vehicles)

19: Recycling pallets

20: Device transfer head

21: Pallet conveying mechanism (2nd conveying device)

22A: Pallet transport mechanism

22B: Pallet transport mechanism

24: Humidity sensor (hygrometer)

25: Temperature sensor (thermometer)

61: The first partition

62: The second partition wall

63: The third partition wall

64: The fourth partition wall

65: The fifth wall

66: inner partition

70: Front cover

71: side cover

72: side cover

73: back cover

75: The fourth door

80: Control Department

90: IC device

90a: Test piece for inspection (component)

103: Camera Department

200: Tray (electronic component placement part)

200a: Tray (placement part)

711: The first door (the first door on the left)

712: The second door (the second door from the left)

721: The first door (the first door on the right)

722: 2nd door (2nd door on the right)

731: The first door (the first door on the back side)

732: The first door (the first door on the back side)

733: The third door (the third door on the back side)

740: cylinder

741: cylinder

742: cylinder

743: cylinder

744: cylinder

745: cylinder

A1: Pallet supply area

A2: Device supply area

A3: Inspection area

A4: Device recycling area (recycling area)

A5: Pallet removal area

R1: Room 1

R2: Room 2

R3: Room 3

X: axis

Y: axis

Z: axis

Claims (4)

An electronic part inspection device, comprising: an inspection part which is electrically connected to the electronic part and inspects the electrical characteristics of the above-mentioned electronic part; an inspection area where the inspection part is arranged; and a light irradiation part which irradiates the electronic part with light And an imaging unit, which photographs the electronic components; a control unit, which controls the device; wherein the control unit supplies dry air to the inspection area and cools the electronic components, and inspects the electronic components by the inspection unit After the electronic component, when light is irradiated by the light irradiation unit, the electronic component is photographed by the imaging unit; based on the color of the electronic component photographed by the imaging unit, it is determined whether condensation occurs on the electronic component Or frost; and when it is judged that the above-mentioned condensation or frost has occurred, an error will be notified. The electronic component inspection apparatus of claim 1, further comprising a device recovery section on which the electronic components inspected by the inspection section are placed; and the light is irradiated to the electronic components placed in the device recovery section. The electronic component inspection device of claim 1 or 2, wherein the light irradiating section irradiates light from a direction inclined with respect to the normal line of the imaging surface of the electronic component. An inspection method of an electronic component inspection device, the electronic component inspection device comprising: an inspection part which is electrically connected to the electronic part and inspects the electrical characteristics of the electronic part; an inspection area where the inspection part is arranged; a light irradiation part, It irradiates the electronic component with light; and an imaging unit which photographs the electronic component; a control unit which controls the device; the inspection method is: the control unit supplies dry air to the inspection area and cools the electronic component In this case, after the electronic component is inspected by the inspection unit, when light is irradiated by the light irradiating unit, the electronic component is photographed by the imaging unit; based on the electronic component photographed by the imaging unit Color, judge whether condensation or frost occurs on the above electronic parts; and when it is judged that the above condensation or frost occurs, an error will be notified.

Images