TW201634370A - Electronic component conveying device, electronic component inspecting device, test piece for inspecting condensation or frosting, and method of inspecting condensation or frosting - Google Patents
Electronic component conveying device, electronic component inspecting device, test piece for inspecting condensation or frosting, and method of inspecting condensation or frosting Download PDFInfo
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- TW201634370A TW201634370A TW105107643A TW105107643A TW201634370A TW 201634370 A TW201634370 A TW 201634370A TW 105107643 A TW105107643 A TW 105107643A TW 105107643 A TW105107643 A TW 105107643A TW 201634370 A TW201634370 A TW 201634370A
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- 0 [O-][N+]=CC(CC1)C2C1C*=*C2 Chemical compound [O-][N+]=CC(CC1)C2C1C*=*C2 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
- G01N21/77—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
- G01N21/78—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator producing a change of colour
- G01N21/81—Indicating humidity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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Abstract
Description
本發明係關於電子零件搬送裝置、電子零件檢查裝置、結露或結霜之檢查用試驗片、及結露或結霜之檢查方法。 The present invention relates to an electronic component conveying apparatus, an electronic component inspection apparatus, a test piece for inspection of dew condensation or frosting, and a method of inspecting dew condensation or frosting.
先前以來,已知一種例如檢測IC器件等電子零件之電氣特性之電子零件檢查裝置,於該電子零件檢查裝置中,組裝有用於將IC器件搬送至檢查部之保持部之電子零件搬送裝置。於IC器件之檢查時,將IC器件配置於保持部,並使設置於保持部之複數個探針針腳與IC器件之各端子接觸。 An electronic component inspection apparatus for detecting electrical characteristics of an electronic component such as an IC device has been known, and an electronic component transportation apparatus for transporting an IC device to a holding portion of an inspection unit is incorporated in the electronic component inspection apparatus. At the time of inspection of the IC device, the IC device is placed in the holding portion, and a plurality of probe pins provided in the holding portion are brought into contact with the respective terminals of the IC device.
此種IC器件之檢查會有將IC器件冷卻至特定溫度而進行之情形。該情形下為避免產生結露,必須冷卻IC器件並使供配置IC器件之構件的環境濕度降低。 The inspection of such an IC device may be performed by cooling the IC device to a specific temperature. In order to avoid condensation, in this case, the IC device must be cooled and the ambient humidity of the components for configuring the IC device must be lowered.
於專利文獻1中,記載有一種IC分類機(IC Handler),其係以檢測IC器件之電極間產生結露時之短路而檢測結露產生之方式構成。 Patent Document 1 discloses an IC classifier (IC Handler) configured to detect a short circuit when a condensation occurs between electrodes of an IC device and detect condensation.
[專利文獻1]日本專利特開2005-300285號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-300285
然而,如專利文獻1之裝置中,因發生結露之檢測必須透過機械 性處理,故存在導致裝置複雜化、造價昂貴等問題。又,如為如結霜般之冰之情形時,會有電極間未發生短路之可能性。 However, in the apparatus of Patent Document 1, the detection of condensation occurs through the machine. Sexual processing, there are problems such as complicated devices and expensive construction. Moreover, in the case of frosty ice, there is a possibility that a short circuit does not occur between the electrodes.
本發明之目的在於提供可容易地檢測裝置內之電子零件中是否產生結露或結霜之電子零件搬送裝置、電子零件檢查裝置、結露或結霜之檢查用試驗片、及結露或結霜之檢查方法,或提供可容易地檢測裝置內之電子零件發生結露或結霜之電子零件搬送裝置、電子零件檢查裝置、及結露或結霜之檢查方法。 An object of the present invention is to provide an electronic component conveying apparatus, an electronic component inspection apparatus, a test piece for inspection of dew condensation or frosting, and a test for dew condensation or frosting, which can easily detect condensation or frost formation in electronic components in a device. The method provides an electronic component transport device, an electronic component inspection device, and an inspection method for dew condensation or frosting, which can easily detect condensation or frosting of electronic components in the device.
本發明係為解決上述問題之至少一部分而完成者,且可作為以下之形態或應用例而實現。 The present invention has been made to solve at least a part of the above problems, and can be realized as the following aspects or application examples.
[應用例1]本應用例之電子零件搬送裝置之特徵為包含載置部,該載置部可搬送電子零件,且可載置具有會於附著有液態水或固態水之情形時變色之變色構件的構件。 [Application Example 1] The electronic component transport apparatus according to the application example is characterized in that it includes a mounting portion that can carry electronic components and can be placed with a discoloration that is discolored when liquid water or solid water adheres thereto. The component of the component.
藉此,可容易地於電子零件搬送裝置中檢查電子零件是否產生結露或結霜。 Thereby, it is possible to easily check whether the electronic parts are dew condensation or frost formation in the electronic component conveying device.
[應用例2]於本應用例之電子零件搬送裝置中,較佳為,上述變色構件係於結露或結霜之情形時變色。 [Application Example 2] In the electronic component conveying apparatus of the application example, it is preferable that the color changing member is discolored in the case of dew condensation or frost formation.
藉此,可更容易地於電子零件搬送裝置中檢查電子零件是否產生結露或結霜。 Thereby, it is possible to more easily check whether the electronic parts are dew condensation or frost formation in the electronic component conveying device.
[應用例3]於本應用例之電子零件搬送裝置中,較佳包含可拍攝上述構件之攝像部。 [Application Example 3] In the electronic component conveying apparatus of the application example, it is preferable to include an image pickup unit that can image the above-described members.
藉此,可更簡便地進行變色構件之變色之確認。 Thereby, the confirmation of the discoloration of the color changing member can be performed more easily.
[應用例4]於本應用例之電子零件搬送裝置中,較佳為,上述攝像部係配置於回收已實施特定之檢查之上述電子零件的回收區域。 [Application Example 4] In the electronic component conveying apparatus of the application example, it is preferable that the imaging unit is disposed in a collection area for collecting the electronic component that has been subjected to the specific inspection.
藉此,可更確實地於電子零件搬送裝置中檢測電子零件是否產生結露或結霜。 Thereby, it is possible to more reliably detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.
[應用例5]於本應用例之電子零件搬送裝置中,較佳為,上述載置部係相對於載置電子零件之電子零件載置部而配置於鉛垂方向。 [Application Example 5] In the electronic component transport apparatus of the application example, it is preferable that the mounting portion is disposed in the vertical direction with respect to the electronic component mounting portion on which the electronic component is placed.
藉此,可更容易地於電子零件搬送裝置中檢測電子零件是否產生結露或結霜。 Thereby, it is possible to more easily detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.
[應用例6]於本應用例之電子零件搬送裝置中,較佳為,上述載置部係相對於載置上述電子零件之電子零件載置部而配置於與鉛垂方向正交之方向。 [Application Example 6] In the electronic component transport apparatus of the application example, it is preferable that the mounting portion is disposed in a direction orthogonal to the vertical direction with respect to the electronic component mounting portion on which the electronic component is placed.
藉此,可更容易地於電子零件搬送裝置中檢測電子零件是否產生結露或結霜。 Thereby, it is possible to more easily detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.
[應用例7]於本應用例之電子零件搬送裝置中,較佳為,上述載置部配置於電子零件載置部供給區域或器件供給區域,上述電子零件載置部供給區域係供給載置有實施上述特定之檢查之前之上述電子零件的上述電子零件載置部;上述器件供給區域係將來自上述電子零件載置部供給區域之上述電子零件載置部上載置之上述電子零件供給至進行檢查之檢查區域。 [Application Example 7] In the electronic component conveying apparatus of the application example, it is preferable that the mounting portion is disposed in an electronic component mounting portion supply region or a device supply region, and the electronic component mounting portion supply region is mounted on the mounting portion. The electronic component mounting portion of the electronic component before performing the above-described specific inspection, wherein the component supply region supplies the electronic component mounted on the electronic component mounting portion of the electronic component mounting portion supply region to the electronic component mounting portion Check the inspection area.
藉此,可更容易地於電子零件搬送裝置中檢測電子零件是否產生結露或結霜。 Thereby, it is possible to more easily detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.
[應用例8]於本應用例之電子零件搬送裝置中,較佳為,於上述構件配置於電子零件搬送裝置之情形時,上述變色構件係以朝向鉛垂下方之方式構成。 [Application Example 8] In the electronic component conveying apparatus of the application example, it is preferable that the color changing member is configured to be vertically downward when the member is disposed in the electronic component conveying device.
藉此,可更確實地於電子零件搬送裝置中檢測電子零件是否產生結露或結霜。 Thereby, it is possible to more reliably detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.
[應用例9]本應用例之電子零件檢查裝置之特徵為包含載置部,其載置具有會於附著有液態水或固態水之情形時變色之變色構件的構件;及檢查部,其檢查電子零件。 [Application Example 9] The electronic component inspection apparatus according to the application example of the present invention includes a mounting portion that mounts a member having a color changing member that is discolored when liquid water or solid water adheres, and an inspection portion that inspects Electronic parts.
藉此,可容易地於電子零件搬送裝置中檢查電子零件是否產生 結露或結霜。 Thereby, it is possible to easily check whether the electronic component is generated in the electronic component conveying device Condensation or frosting.
[應用例10]本應用例之結露或結霜之檢查用試驗片之特徵為包含變色構件,該變色構件係於附著有液態水或固態水之情形時變色。 [Application Example 10] The test piece for examination for dew condensation or frosting of this application example is characterized by comprising a color-changing member which is discolored when liquid water or solid water is adhered thereto.
藉此,可容易地於裝置內檢查電子零件是否產生結露或結霜。 Thereby, it is possible to easily check whether the electronic parts are dew condensation or frost formation in the apparatus.
[應用例11]本應用例之結露或結霜之檢查方法之特徵為其係使用包含會於附著有液態水或固態水之情形時變色之變色構件的檢查用試驗片而檢測結露或結霜。 [Application Example 11] The inspection method for dew condensation or frosting of this application example is characterized in that condensation or frost is detected by using an inspection test piece containing a color change member which is discolored when liquid water or solid water is adhered thereto. .
藉此,可容易地於裝置內檢查電子零件是否產生結露或結霜。 Thereby, it is possible to easily check whether the electronic parts are dew condensation or frost formation in the apparatus.
[應用例12]本應用例之電子零件搬送裝置之特徵為包含攝像部,其可拍攝附著有液態水或固態水之構件。 [Application Example 12] An electronic component transport apparatus according to this application example is characterized in that it includes an image pickup unit that can photograph a member to which liquid water or solid water adheres.
藉此,可容易地於電子零件搬送裝置中檢測電子零件是否產生結露或結霜。 Thereby, it is possible to easily detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.
[應用例13]於本應用例之電子零件搬送裝置中,較佳為,上述攝像部係拍攝結露或結霜之上述構件。 [Application Example 13] In the electronic component transport apparatus of the application example, it is preferable that the imaging unit captures the above-described members that are dew condensation or frost.
藉此,可更容易地檢查電子零件搬送裝置內之電子零件之結露或結霜之發生。 Thereby, it is possible to more easily check for the occurrence of condensation or frosting of the electronic components in the electronic component conveying device.
[應用例14]於本應用例之電子零件搬送裝置中,較佳為,上述構件係電子零件或檢查用試驗片。 [Application Example 14] In the electronic component conveying apparatus of the application example, the component is preferably an electronic component or a test piece for inspection.
藉此,可更容易地檢查電子零件搬送裝置內之電子零件之結露或結霜之發生。 Thereby, it is possible to more easily check for the occurrence of condensation or frosting of the electronic components in the electronic component conveying device.
[應用例15]於本應用例之電子零件搬送裝置中,較佳包含對上述構件照射光之光照射部。 [Application Example 15] In the electronic component conveying device of the application example, it is preferable that the light-emitting portion that irradiates the member with light is included.
藉此,可利用光之散射更確實地檢測結露或結霜之發生。 Thereby, the occurrence of condensation or frosting can be more reliably detected by scattering of light.
[應用例16]於本應用例之電子零件搬送裝置中,較佳為,上述光照射部係自相對於上述構件之攝像面之法線傾斜之方向照射光。 [Application Example 16] In the electronic component conveying apparatus of the application example, it is preferable that the light irradiation unit emits light from a direction inclined with respect to a normal line of the imaging surface of the member.
藉此,可更容易地檢測電子零件搬送裝置內之電子零件之結露 或結霜之發生。 Thereby, the condensation of the electronic parts in the electronic component conveying device can be detected more easily Or frosting occurs.
[應用例17]於本應用例之電子零件搬送裝置中,較佳為,上述構件之攝像面為鏡面。 [Application Example 17] In the electronic component conveying apparatus of the application example, it is preferable that the imaging surface of the member is a mirror surface.
藉此,可更容易地檢測電子零件搬送裝置內之電子零件之結露或結霜之發生。 Thereby, it is possible to more easily detect the occurrence of condensation or frosting of the electronic components in the electronic component conveying device.
[應用例18]本應用例之電子零件檢查裝置之特徵為包含:攝像部,其可拍攝結露或結霜之構件;及檢查部,其檢查電子零件。 [Application Example 18] The electronic component inspection apparatus of the application example is characterized by comprising: an imaging unit that can photograph a member that dews or frosts; and an inspection unit that inspects an electronic component.
藉此,可容易地檢測電子零件搬送裝置內之電子零件之結露或結霜之發生。 Thereby, it is possible to easily detect the occurrence of condensation or frosting of the electronic components in the electronic component conveying device.
[應用例19]本應用例之結露或結霜之檢查方法之特徵為,其係拍攝結露或結霜之構件而檢查結露或結霜。 [Application Example 19] The method for inspecting dew condensation or frosting of this application example is characterized in that it is a member which photographs dew condensation or frosting and checks for condensation or frosting.
藉此,可容易地檢測裝置內之電子零件之結露或結霜之發生。 Thereby, it is possible to easily detect the occurrence of condensation or frosting of the electronic components in the device.
1a‧‧‧檢查裝置(電子零件檢查裝置) 1a‧‧‧Inspection device (electronic parts inspection device)
1b‧‧‧檢查裝置(電子零件檢查裝置) 1b‧‧‧Inspection device (electronic parts inspection device)
11A‧‧‧托盤搬送機構 11A‧‧‧Tray transport mechanism
11B‧‧‧托盤搬送機構 11B‧‧‧Tray transport mechanism
12‧‧‧溫度調整部(均熱板) 12‧‧‧Temperature adjustment unit (soaking plate)
13‧‧‧器件搬送頭 13‧‧‧Device Transfer Head
14‧‧‧器件供給部(供給載具) 14‧‧‧Device Supply Department (supply vehicle)
15‧‧‧托盤搬送機構(第1搬送裝置) 15‧‧‧Tray transport mechanism (first transport device)
16‧‧‧檢查部 16‧‧‧Inspection Department
17‧‧‧器件搬送頭 17‧‧‧Device transfer head
18‧‧‧器件回收部(回收載具) 18‧‧‧Device Recycling Department (Recycling Vehicle)
19‧‧‧回收用托盤 19‧‧‧Recycling tray
20‧‧‧器件搬送頭 20‧‧‧Device Transfer Head
21‧‧‧托盤搬送機構(第2搬送裝置) 21‧‧‧Tray transport mechanism (second transport device)
22A‧‧‧托盤搬送機構 22A‧‧‧Tray transport mechanism
22B‧‧‧托盤搬送機構 22B‧‧‧Tray transport mechanism
24‧‧‧濕度感測器(濕度計) 24‧‧‧Humidity sensor (hygrometer)
25‧‧‧溫度感測器(溫度計) 25‧‧‧temperature sensor (thermometer)
61‧‧‧第1間隔壁 61‧‧‧1st partition wall
62‧‧‧第2間隔壁 62‧‧‧2nd partition wall
63‧‧‧第3間隔壁 63‧‧‧3rd partition wall
64‧‧‧第4間隔壁 64‧‧‧4th partition wall
65‧‧‧第5間隔壁 65‧‧‧5th partition wall
66‧‧‧內側間隔壁 66‧‧‧Intermediate partition
70‧‧‧前蓋體 70‧‧‧ front cover
71‧‧‧側蓋體 71‧‧‧ side cover
72‧‧‧側蓋體 72‧‧‧ side cover
73‧‧‧後蓋體 73‧‧‧Back cover
75‧‧‧第4門扉 75‧‧‧4th threshold
80‧‧‧控制部 80‧‧‧Control Department
90‧‧‧IC器件 90‧‧‧IC devices
90a‧‧‧檢查用試驗片(構件) 90a‧‧‧Test piece (component) for inspection
90b‧‧‧檢查用試驗片(構件) 90b‧‧‧Test piece (component) for inspection
91‧‧‧上表面 91‧‧‧Upper surface
91b‧‧‧上表面 91b‧‧‧ upper surface
92‧‧‧變色構件 92‧‧‧Discoloration members
100‧‧‧攝像部 100‧‧‧Photography Department
103‧‧‧攝像部 103‧‧‧Photography Department
200‧‧‧托盤(電子零件載置部) 200‧‧‧Tray (Electronic Parts Placement Department)
200a‧‧‧托盤(載置部) 200a‧‧‧Tray (placement)
711‧‧‧第1門扉(左側第1門扉) 711‧‧‧1st threshold (1st threshold on the left)
712‧‧‧第2門扉(左側第2門扉) 712‧‧‧2nd threshold (2nd threshold on the left)
721‧‧‧第1門扉(右側第1門扉) 721‧‧‧1st threshold (1st threshold on the right)
722‧‧‧第2門扉(右側第2門扉) 722‧‧‧2nd threshold (2nd threshold on the right)
731‧‧‧第1門扉(背面側第1門扉) 731‧‧‧1st threshold (1st threshold on the back side)
732‧‧‧第1門扉(背面側第1門扉) 732‧‧‧1st threshold (1st threshold on the back side)
733‧‧‧第3門扉(背面側第3門扉) 733‧‧‧3rd threshold (3rd threshold on the back side)
740‧‧‧缸體 740‧‧‧Cylinder
741‧‧‧缸體 741‧‧‧Cylinder
742‧‧‧缸體 742‧‧‧Cylinder
743‧‧‧缸體 743‧‧‧ cylinder
744‧‧‧缸體 744‧‧‧ cylinder
745‧‧‧缸體 745‧‧‧Cylinder
A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area
A2‧‧‧器件供給區域(供給區域) A2‧‧‧Device supply area (supply area)
A3‧‧‧檢查區域 A3‧‧‧ inspection area
A4‧‧‧器件回收區域(回收區域) A4‧‧‧Device recycling area (recycling area)
A5‧‧‧托盤移除區域 A5‧‧‧Tray removal area
DA‧‧‧乾燥氣體 DA‧‧‧dry gas
R1‧‧‧第1室 Room R1‧‧‧
R2‧‧‧第2室 Room R2‧‧‧
R3‧‧‧第3室 Room R3‧‧‧3
X‧‧‧軸 X‧‧‧ axis
Y‧‧‧軸 Y‧‧‧ axis
Z‧‧‧軸 Z‧‧‧ axis
圖1係表示本發明之電子零件檢查裝置之第1實施形態的示意俯視圖。 Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.
圖2係第1實施形態之結露或結霜之檢查用試驗片及攝像部之剖視圖。 Fig. 2 is a cross-sectional view showing a test piece for examination and an imaging unit for dew condensation or frosting according to the first embodiment.
圖3係表示本發明之電子零件檢查裝置之第2實施形態之示意俯視圖。 Fig. 3 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention.
圖4係第2實施形態之攝像部之剖視圖。 Fig. 4 is a cross-sectional view showing an imaging unit according to a second embodiment.
圖5係第2實施形態之攝像部之剖視圖。 Fig. 5 is a cross-sectional view showing an imaging unit according to a second embodiment.
圖6係第2實施形態之攝像部之剖視圖。 Fig. 6 is a cross-sectional view of the imaging unit of the second embodiment.
以下,基於附加圖式所示之較佳之實施形態而詳細地說明本發明之電子零件搬送裝置、電子零件檢查裝置、結露或結霜之檢查用試驗片、及結露或結霜之檢查方法。 Hereinafter, the electronic component conveying apparatus, the electronic component inspection apparatus, the test piece for dew condensation or frosting, and the inspection method of dew condensation or frosting of the present invention will be described in detail based on a preferred embodiment shown in the additional drawings.
以下,為便於說明,例如如圖1所示般,將相互正交之三個軸設為X軸、Y軸、及Z軸。且,包含X軸與Y軸之XY平面係水平,Z軸係鉛垂。又,將平行於X軸之方向亦稱作「X方向」,將平行於Y軸之方向亦稱作「Y方向」,將平行於Z軸之方向亦稱作「Z方向」。又,將電子零件之搬送方向之上游側亦稱作「上游側」,將下游側亦稱作「下游側」。又,本案說明書中所謂之「水平」並非限定於完全水平,只要不阻礙電子零件之搬送,亦包含相對於水平略微(例如未達5°左右)傾斜之狀態。 Hereinafter, for convenience of explanation, for example, as shown in FIG. 1, three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". Further, the upstream side of the transport direction of the electronic component is also referred to as "upstream side", and the downstream side is also referred to as "downstream side". Further, the "level" in the specification of the present invention is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as it does not hinder the conveyance of the electronic component.
再者,實施形態中所示之檢查裝置(電子零件檢查裝置)係用於檢查/試驗(以下稱作「檢查」)例如BGA(Ball grid array:球狀柵格陣列)封裝或LGA(Land grid array:平面柵格陣列)封裝等IC器件,或LCD(Liquid Crystal Display:液晶顯示器)、CIS(CMOS Image Sensor:CMOS影像感測器)等電子零件之電氣特性的裝置。另,以下,為便於說明,以使用IC器件作為要檢查之上述電子零件之情形為代表進行說明,並將其設為「IC器件90」。 Further, the inspection apparatus (electronic component inspection apparatus) shown in the embodiment is used for inspection/test (hereinafter referred to as "inspection") such as BGA (Ball grid array) package or LGA (Land grid). Array: A device for electrical characteristics of an electronic device such as an IC device such as an LCD (Liquid Crystal Display) or a CIS (CMOS Image Sensor: CMOS image sensor). In the following, for convenience of explanation, a case where an IC device is used as the above-described electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 90".
(第1實施形態) (First embodiment)
圖1係表示本發明之電子零件檢查裝置之第1實施形態的示意俯視圖。圖2係結露或結霜之檢查用試驗片及攝像部之剖視圖。 Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a cross-sectional view showing a test piece and an imaging unit for examination for dew condensation or frosting.
如圖1所示,本實施形態之檢查裝置(電子零件檢查裝置)1a劃分為托盤供給區域(電子零件載置部供給區域)A1、器件供給區域(以下亦稱作「供給區域」)A2、檢查區域A3、器件回收區域(以下亦稱作「回收區域」)A4、及托盤移除區域A5。又,IC器件90係自托盤供給區域A1依序經過供給區域A2、檢查區域A3、回收區域A4、托盤移除區域A5,而於中途之檢查區域A3受檢查。如此,檢查裝置1a係為包含如下者:電子零件搬送裝置,其對托盤供給區域A1、供給區域A2、檢查區域A3、回收區域A4及托盤移除區域A5(以下亦稱作「各 區域」)搬送IC器件90;檢查部16,其於檢查區域A3內進行檢查;及控制部80。 As shown in Fig. 1, the inspection apparatus (electronic component inspection apparatus) 1a of the present embodiment is divided into a tray supply area (electronic component mounting unit supply area) A1 and a device supply area (hereinafter also referred to as "supply area") A2. The inspection area A3, the device recovery area (hereinafter also referred to as "recovery area") A4, and the tray removal area A5. Further, the IC device 90 sequentially passes through the supply region A2, the inspection region A3, the recovery region A4, and the tray removal region A5 from the tray supply region A1, and is inspected in the inspection region A3 in the middle. In this way, the inspection apparatus 1a includes an electronic component transport apparatus that pairs the tray supply area A1, the supply area A2, the inspection area A3, the collection area A4, and the tray removal area A5 (hereinafter also referred to as "each The area ") transports the IC device 90; the inspection unit 16 performs inspection in the inspection area A3; and the control unit 80.
另,檢查裝置1a係其配置有托盤供給區域A1或托盤移除區域A5之一方(圖1中之-Y方向側)為正面側,其相反側亦即配置有檢查區域A3之一方(圖1中之+Y方向側)作為背面側使用。 Further, the inspection apparatus 1a is provided with one of the tray supply area A1 or the tray removal area A5 (the -Y direction side in FIG. 1) as the front side, and the opposite side, that is, one side of the inspection area A3 (FIG. 1) The middle +Y direction side is used as the back side.
托盤供給區域A1係供給排列有未檢查狀態之複數個IC器件90之托盤(電子零件載置部)200的供材部。另,於托盤供給區域A1中,可堆疊多個托盤200。 The tray supply area A1 supplies a supply unit of a tray (electronic part mounting unit) 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In addition, in the tray supply area A1, a plurality of trays 200 may be stacked.
供給區域A2係將配置於自托盤供給區域A1搬送而來之托盤200之上表面之複數個IC器件90分別供給至檢查區域A3的區域。另,設置有以跨及托盤供給區域A1與供給區域A2之方式逐個搬送托盤200之托盤搬送機構11A、11B。 In the supply area A2, a plurality of IC devices 90 disposed on the upper surface of the tray 200 transported from the tray supply area A1 are supplied to the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the trays 200 one by one across the tray supply area A1 and the supply area A2 are provided.
於供給區域A2中,設置有溫度調整部(均熱板)12、器件搬送頭13、及托盤搬送機構(第1搬送裝置)15。 In the supply area A2, a temperature adjustment unit (heating plate) 12, a device transfer head 13, and a tray transfer mechanism (first transfer device) 15 are provided.
溫度調整部12係加熱或冷卻複數個IC器件90,將IC器件90調整至適合檢查之溫度的裝置。圖1所示之構成中,溫度調整部12沿Y方向配置、固定有2個。且,藉由托盤搬送機構11A自托盤供給區域A1搬入(搬送而來)之托盤200上之IC器件90被搬送而載置於任一個溫度調整部12。 The temperature adjustment unit 12 heats or cools a plurality of IC devices 90 to adjust the IC device 90 to a temperature suitable for inspection. In the configuration shown in Fig. 1, the temperature adjustment unit 12 is disposed and fixed in the Y direction. The IC device 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported and placed on any one of the temperature adjustment units 12.
器件搬送頭13係可於供給區域A2內移動地被支持。藉此,器件搬送頭13可擔負自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與後述之器件供給部14之間之IC器件90之搬送。 The device transfer head 13 is movably supported within the supply area A2. Thereby, the device transfer head 13 can carry the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14 to be described later. Transfer.
托盤搬送機構15係將所有的IC器件90皆已搬出之狀態之空的托盤200於供給區域A2內朝X方向搬送之機構。且,於該搬送後,空的托盤200係藉由托盤搬送機構11B自供給區域A2返回至托盤供給區域 A1。 The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in a state in which all of the IC devices 90 have been carried out in the supply region A2 in the X direction. Further, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area by the tray transport mechanism 11B. A1.
檢查區域A3係檢查IC器件90之區域。於該檢查區域A3中,設置有器件供給部(供給梭)14、檢查部16、器件搬送頭17、及器件回收部(回收梭)18。 The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transfer head 17, and a device collection unit (recycling shuttle) 18 are provided.
器件供給部14係將經溫度調整後之IC器件90搬送至檢查部16附近之裝置。該器件供給部14係可沿X方向於供給區域A2與檢查區域A3之間移動地被支持。且,圖1所示之構成中,器件供給部14於Y方向配置有2個,溫度調整部12上之IC器件90被搬送、載置於任一個器件供給部14。 The device supply unit 14 transports the temperature-adjusted IC device 90 to a device in the vicinity of the inspection unit 16. The device supply portion 14 is supported to be movable in the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 1, the device supply unit 14 is disposed in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported and placed on any of the device supply units 14.
檢查部16係對IC器件90之電氣特性進行檢查/試驗之單元。於檢查部16中,設置有以保持IC器件90之狀態,與IC器件90之端子電性連接之複數個探針針腳。又,IC器件90之端子與探針針腳電性連接(接觸),經由探針針腳進行IC器件90之檢查。IC器件90之檢查係基於連接於檢查部16之測試器所具備之檢查控制部中記憶之程式進行。另,檢查部16係與溫度調整部12同樣地,可加熱或冷卻IC器件90,將IC器件90調整至適合檢查之溫度。 The inspection unit 16 is a unit that inspects/tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 in a state in which the IC device 90 is held. Further, the terminal of the IC device 90 is electrically connected (contacted) to the probe pin, and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in the inspection control unit provided in the tester connected to the inspection unit 16. Further, similarly to the temperature adjustment unit 12, the inspection unit 16 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.
器件搬送頭17係可於檢查區域A3內移動地被支持。藉此,器件搬送頭17可將自供給區域A2搬入之器件搬送供給部14上之IC器件90搬送於檢查部16上載置。 The device transfer head 17 is movably supported within the inspection area A3. Thereby, the device transfer head 17 can transport the IC device 90 on the device transport supply unit 14 carried in from the supply area A2 to the inspection unit 16 to be placed thereon.
器件回收部18係將在檢查部16之檢查結束之IC器件90搬送至回收區域A4的裝置。該器件回收部18係可於檢查區域A3與回收區域A4之間沿X方向移動地被支持。又,圖1所示之構成中,器件回收部18係與器件供給部14同樣地,於Y方向配置有2個,將檢查部16上之IC器件90搬送於任一個器件回收部18上載置。該搬送係藉由器件搬送頭17進行。 The device recovery unit 18 is a device that transports the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device recovery unit 18 is supported to be movable in the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 1, the device collection unit 18 is disposed in the Y direction in the same manner as the device supply unit 14, and the IC device 90 on the inspection unit 16 is transported to any one of the device collection units 18. . This transfer is performed by the device transfer head 17.
回收區域A4係回收已結束檢查之複數個IC器件90之區域。於該 回收區域A4中,設置有回收用托盤19、器件搬送頭20、及托盤搬送機構(第2搬送裝置)21。且,於回收區域A4中,亦備有空的托盤200。 The recovery area A4 is a region of a plurality of IC devices 90 that have been inspected for recycling. In this In the collection area A4, a collection tray 19, a device transfer head 20, and a tray conveyance mechanism (second conveyance device) 21 are provided. Further, in the collection area A4, an empty tray 200 is also provided.
回收用托盤19係固定於回收區域A4內,在圖1所示之構成中,其沿X方向配置有3個。又,亦沿X方向配置有3個空的托盤200。且,將移動至回收區域A4之器件回收部18上之IC器件90搬送於該等回收用托盤19及空的托盤200中之任一者上載置。藉此,將IC器件90根據各個檢查結果而加以回收及分類。 The recovery tray 19 is fixed in the collection area A4, and in the configuration shown in Fig. 1, three are arranged in the X direction. Further, three empty trays 200 are also arranged in the X direction. Then, the IC device 90 moved to the device collection unit 18 of the collection area A4 is transported to any of the collection trays 19 and the empty trays 200. Thereby, the IC device 90 is recovered and classified according to the respective inspection results.
器件搬送頭20係可於回收區域A4內移動地被支持。藉此,器件搬送頭20可將IC器件90自器件回收部18搬送至回收用托盤19或空的托盤200。 The device transfer head 20 is movably supported within the recovery area A4. Thereby, the device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.
托盤搬送機構21係將自托盤移除區域A5搬入之空的托盤200於回收區域A4內朝X方向搬送之機構。又,於該搬送後,空的托盤200置於回收IC器件90之位置,亦即其可能成為配置於回收區域A4內之3個空的托盤200中之任一者。 The tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 into the recovery area A4 in the X direction. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is recovered, that is, it may become any one of the three empty trays 200 disposed in the recovery area A4.
如此,於檢查裝置1a中,於回收區域A4設置有托盤搬送機構21,此外,並於供給區域A2設置有托盤搬送機構15。藉此,例如,即使由1個搬送裝置進行空的托盤200之朝X方向之搬送,仍可謀求處理量(每單位時間之IC器件90之搬送個數)之提高。 In the inspection apparatus 1a, the tray conveyance mechanism 21 is provided in the collection area A4, and the tray conveyance mechanism 15 is provided in the supply area A2. By this means, for example, even if the empty tray 200 is transported in the X direction by one transport device, the throughput (the number of transports of the IC device 90 per unit time) can be improved.
托盤移除區域A5係回收及移除排列有檢查完畢狀態之複數個IC器件90之托盤200的除材部。另,於托盤移除區域A5中,可堆疊多個托盤200。 The tray removing area A5 collects and removes the material removing portion of the tray 200 of the plurality of IC devices 90 in which the inspection is completed. In addition, in the tray removing area A5, a plurality of trays 200 may be stacked.
再者,設置有以跨及回收區域A4與托盤移除區域A5之方式逐個搬送托盤200之托盤搬送機構22A、22B。托盤搬送機構22A係將載置有檢查完畢之IC器件90之托盤200自回收區域A4搬送至托盤移除區域A5的機構。托盤搬送機構22B係將用於回收IC器件90之空的托盤200自托盤移除區域A5搬送至回收區域A4的機構。 Further, the tray transport mechanisms 22A and 22B that transport the trays 200 one by one across the recovery area A4 and the tray removal area A5 are provided. The tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports the tray 200 for recovering the empty space of the IC device 90 from the tray removal area A5 to the recovery area A4.
控制部80例如具有驅動控制部。驅動控制部例如控制托盤搬送機構11A、11B、溫度調整部12、器件搬送頭13、器件供給部14、托盤搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、22B之各部的驅動。 The control unit 80 has, for example, a drive control unit. The drive control unit controls, for example, the tray transport mechanisms 11A and 11B, the temperature adjustment unit 12, the device transport head 13, the device supply unit 14, the tray transport mechanism 15, the inspection unit 16, the device transport head 17, the device recovery unit 18, and the device transport head 20. Driving of each of the tray transport mechanism 21 and the tray transport mechanisms 22A and 22B.
另,上述測試器之檢查控制部係例如基於未圖示之記憶體內所記憶之程式,而進行配置於檢查部16之IC器件90之電氣特性之檢查等。 In addition, the inspection control unit of the tester performs inspection of electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).
如以上般之檢查裝置1a中,除溫度調整部12或檢查部16以外,器件搬送頭13、器件供給部14、器件搬送頭17亦同樣構成為可加熱或冷卻IC器件90。藉此,IC器件90其溫度於搬送過程中維持固定。又,以下說明對IC器件90進行冷卻、且於例如-60℃~-40℃之範圍內之低溫環境下進行檢查之情形進行說明。 In the inspection apparatus 1a as described above, the device transfer head 13, the device supply unit 14, and the device transfer head 17 are similarly configured to heat or cool the IC device 90 except for the temperature adjustment unit 12 or the inspection unit 16. Thereby, the temperature of the IC device 90 is maintained constant during the transfer. In the following description, a case where the IC device 90 is cooled and inspected in a low temperature environment within a range of, for example, -60 ° C to -40 ° C will be described.
如圖1所示,檢查裝置1a係由第1間隔壁61區劃(分隔)托盤供給區域A1與供給區域A2之間,由第2間隔壁62區劃供給區域A2與檢查區域A3之間,由第3間隔壁63區劃檢查區域A3與回收區域A4之間,由第4間隔壁64區劃回收區域A4與托盤移除區域A5之間。又,供給區域A2與回收區域A4之間亦由第5間隔壁65區劃。該等間隔壁具有保持各區域之氣密性的功能。進而,檢查裝置1a其最外裝由蓋體覆蓋,該蓋體例如有前蓋體70、側蓋體71、側蓋體72、及後蓋體73。 As shown in Fig. 1, the inspection device 1a is partitioned (separated) between the tray supply region A1 and the supply region A2 by the first partition wall 61, and is partitioned between the supply region A2 and the inspection region A3 by the second partition wall 62. 3 The partition wall 63 partitions between the inspection area A3 and the recovery area A4, and the fourth partition wall 64 partitions between the recovery area A4 and the tray removal area A5. Further, the supply region A2 and the recovery region A4 are also partitioned by the fifth partition wall 65. The partition walls have a function of maintaining airtightness of the respective regions. Further, the outermost cover of the inspection device 1a is covered by a lid body, for example, a front cover body 70, a side cover body 71, a side cover body 72, and a rear cover body 73.
且,供給區域A2成為由第1間隔壁61、第2間隔壁62、第5間隔壁65、側蓋體71及後蓋體73隔成之第1室R1。以整個托盤200將未檢查狀態之複數個IC器件90搬入第1室R1。 Further, the supply region A2 is the first chamber R1 partitioned by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side cover 71, and the rear lid body 73. A plurality of IC devices 90 in an unchecked state are carried into the first chamber R1 by the entire tray 200.
檢查區域A3係為由第2間隔壁62、第3間隔壁63及後蓋體73畫成之第2室R2。對第2室R2,自第1室R1搬入複數個IC器件90。 The inspection area A3 is the second chamber R2 drawn by the second partition 62, the third partition 63, and the rear cover 73. In the second chamber R2, a plurality of IC devices 90 are carried from the first chamber R1.
回收區域A4係為由第3間隔壁63、第4間隔壁64、第5間隔壁65、側蓋體72及後蓋體73畫成之第3室R3。對第3室R3,自第2室R2搬入已 結束檢查之複數個IC器件90。 The recovery area A4 is the third chamber R3 drawn by the third partition 63, the fourth partition 64, the fifth partition 65, the side cover 72, and the rear cover 73. For the third room R3, I have moved in from the second room R2. The plurality of IC devices 90 that have been inspected are terminated.
如圖1所示,於側蓋體71中,設置有第1門扉(左側第1門扉)711與第2門扉(左側第2門扉)712。可藉由打開第1門扉711或第2門扉712而例如進行第1室R1內之維護或解除IC器件90之壅塞等(以下,將該等通稱為「作業」)。另,第1門扉711與第2門扉712成為相互朝相反方向開閉之所謂「雙開門」。又,於進行第1室R1內之作業時,第1室R1內之器件搬送頭13等之可動部停止。第1門扉711及第2門扉712可藉由缸體740之作動而一起上鎖/開鎖。 As shown in FIG. 1, the side cover 71 is provided with a first threshold (left first door) 711 and a second threshold (left second door) 712. By opening the first threshold 711 or the second threshold 712, for example, maintenance in the first chamber R1 or smashing of the IC device 90 can be performed (hereinafter, these are generally referred to as "jobs"). Further, the first threshold 711 and the second threshold 712 are so-called "double-opening doors" that open and close in opposite directions. Moreover, when the work in the first chamber R1 is performed, the movable portion such as the device transfer head 13 in the first chamber R1 is stopped. The first threshold 711 and the second threshold 712 can be locked/unlocked together by the operation of the cylinder 740.
同樣地,於側蓋體72中,設置有第1門扉(右側第1門扉)721與第2門扉(右側第2門扉)722。可藉由打開第1門扉721或第2門扉722而例如進行第3室R3內之作業。另,第1門扉721與第2門扉722亦成為相互朝相反方向開閉之所謂「雙開門」。此外,於進行第3室R3內之作業時,第3室R3內之器件搬送頭20等之可動部停止。第1門扉721及第2門扉722可藉由缸體745之作動一起上鎖/開鎖。 Similarly, the side cover 72 is provided with a first threshold (the first threshold on the right side) 721 and a second threshold (the second threshold on the right side) 722. The operation in the third chamber R3 can be performed, for example, by opening the first threshold 721 or the second threshold 722. Further, the first threshold 721 and the second threshold 722 are also so-called "double-opening doors" that open and close in opposite directions. Further, when the operation in the third chamber R3 is performed, the movable portion of the device transfer head 20 or the like in the third chamber R3 is stopped. The first threshold 721 and the second threshold 722 can be locked/unlocked by the action of the cylinder 745.
再者,於後蓋體73中,亦設置有第1門扉(背面側第1門扉)731、第2門扉(背面側第2門扉)732、及第3門扉(背面側第3門扉)733。可藉由打開第1門扉731而例如進行第1室R1內之作業。可藉由打開第3門扉733而例如進行第3室R3內之作業。 Further, the rear cover 73 is also provided with a first threshold (first back door on the back side) 731, a second threshold (second threshold on the back side) 732, and a third threshold (third threshold on the back side) 733. The operation in the first chamber R1 can be performed, for example, by opening the first threshold 731. The operation in the third chamber R3 can be performed, for example, by opening the third threshold 733.
進而,於第2門扉(背面側第2門扉)732與第2室R2之間設置有內側間隔壁66,於內側間隔壁66設置有第4門扉75。且,可藉由打開第2門扉732及第4門扉75而例如進行第2室R2內之作業。 Further, an inner partition wall 66 is provided between the second threshold (the second door sill on the back side) 732 and the second chamber R2, and a fourth sill 75 is provided on the inner partition wall 66. Further, by operating the second threshold 732 and the fourth threshold 75, for example, the work in the second chamber R2 can be performed.
另,第1門扉731與第2門扉732及第4門扉75係朝相同方向開閉,第3門扉733朝與該等門扉相反之方向開閉。又,於第2室R2內之作業時,第2室R2內之器件搬送頭17等之可動部停止。第1門扉731可藉由缸體741之作動而上鎖/開鎖,第2門扉732可藉由缸體742之作動而上鎖/開鎖,第3門扉733可藉由缸體744之作動而上鎖/開鎖,第4門扉75 可藉由缸體743之作動而上鎖/開鎖, Further, the first threshold 731 and the second threshold 732 and the fourth threshold 75 are opened and closed in the same direction, and the third threshold 733 is opened and closed in a direction opposite to the threshold. Further, during the operation in the second chamber R2, the movable portion such as the device transfer head 17 in the second chamber R2 is stopped. The first threshold 731 can be locked/unlocked by the action of the cylinder 741, and the second threshold 732 can be locked/unlocked by the operation of the cylinder 742, and the third threshold 733 can be actuated by the cylinder 744. Lock/unlock, 4th threshold 75 Can be locked/unlocked by the action of the cylinder 743,
又,可藉由關閉各門扉而確保所對應之各室之氣密性或斷熱性。 Further, the airtightness or heat-breaking property of each of the corresponding chambers can be ensured by closing the respective thresholds.
藉此,檢查裝置1a係於低溫環境下對IC器件90進行檢查。 Thereby, the inspection apparatus 1a inspects the IC device 90 in a low temperature environment.
如圖1所示,於第1室R1、第2室R2及第3室R3中,分別配置有檢測室內的濕度之濕度感測器(濕度計)24,及檢測溫度之溫度感測器(溫度計)25。且,各室內之濕度係使用配置有濕度感測器24之位置的濕度(檢測值),溫度係使用配置有溫度感測器25之位置的溫度(檢測值)。藉此,可盡可能地獲得準確之濕度或溫度。 As shown in FIG. 1, in the first chamber R1, the second chamber R2, and the third chamber R3, a humidity sensor (hygrometer) 24 for detecting humidity in the room and a temperature sensor for detecting temperature are disposed. Thermometer) 25. Further, the humidity in each room uses the humidity (detected value) at the position where the humidity sensor 24 is disposed, and the temperature uses the temperature (detected value) at which the temperature sensor 25 is disposed. Thereby, accurate humidity or temperature can be obtained as much as possible.
於低溫環境下進行檢查之檢查裝置1a中,可對第1室R1、第2室R2及第3室R3之各者供給乾燥空氣DA,以調整(設定)各室內之濕度。藉此,可防止冷卻後尤其於第2室R2內產生結露。 In the inspection apparatus 1a that performs inspection in a low-temperature environment, dry air DA can be supplied to each of the first chamber R1, the second chamber R2, and the third chamber R3 to adjust (set) the humidity in each room. Thereby, condensation can be prevented from occurring in the second chamber R2 after cooling.
另,第1室R1、第2室R2及第3室R3中之濕度感測器24與溫度感測器25之設置數於本實施形態中雖為1個,但並非限定於此,亦可為複數個。於該情形下,例如作為第2室R2之濕度,可使用由複數個濕度感測器24檢測出之檢測值的平均值,亦可使用最低之檢測值或最高之檢測值。 In addition, although the number of the humidity sensor 24 and the temperature sensor 25 in the first chamber R1, the second chamber R2, and the third chamber R3 is one in the present embodiment, the present invention is not limited thereto. For multiples. In this case, for example, as the humidity of the second chamber R2, the average value of the detected values detected by the plurality of humidity sensors 24 may be used, and the lowest detected value or the highest detected value may be used.
又,檢查裝置1a中,亦可省略第3室R3內之濕度感測器24及溫度感測器25。 Further, in the inspection device 1a, the humidity sensor 24 and the temperature sensor 25 in the third chamber R3 may be omitted.
於上述檢查裝置1a中,對托盤供給區域A1,如圖1所示般供給托盤(載置部)200a,其可載置具備於結露或結霜之情形時變色之變色構件的檢查用試驗片(構件)90a。另,本說明書中所謂「變色」不僅包含顏色之變化,亦包含均勻性或濃淡之變化之概念。 In the inspection apparatus 1a, the tray supply area A1 is supplied with a tray (mounting part) 200a as shown in Fig. 1, and a test piece for inspection of a color-changing member which is discolored in the case of dew condensation or frost formation can be placed. (member) 90a. In addition, the term "discoloration" as used in this specification includes not only a change in color but also a concept of uniformity or change in shading.
圖示之構成中,托盤(載置部)200a相對於托盤(電子零件載置部)200沿水平方向配置。另,托盤200a係相對於托盤200沿鉛垂方向配置。 In the configuration shown in the drawing, the tray (mounting portion) 200a is disposed in the horizontal direction with respect to the tray (electronic component mounting portion) 200. Further, the tray 200a is disposed in the vertical direction with respect to the tray 200.
如圖2所示,檢查用試驗片(構件)90a係由試驗器件93及配設於試驗器件93之下表面之變色構件92構成。換言之,變色構件92係以朝向鉛垂下方之方式構成。另,只要變色構件92之朝向為可設置後述之攝像部103之朝向,則並不限定於鉛垂下方,亦可為鉛垂上方或側方。 As shown in FIG. 2, the test piece (member) 90a for inspection is composed of a test device 93 and a color change member 92 disposed on the lower surface of the test device 93. In other words, the color changing member 92 is configured to face vertically downward. Further, as long as the orientation of the color changing member 92 is such that the orientation of the imaging unit 103 to be described later can be set, it is not limited to the vertical lower side, and may be vertically upward or lateral.
作為變色構件92,例如可使用濕度指示器、水浸檢測封膜等。 As the color changing member 92, for example, a humidity indicator, a water immersion detecting sealing film, or the like can be used.
於回收區域A4,設置有攝像部103。 An imaging unit 103 is provided in the collection area A4.
攝像部103具有拍攝變色構件92之功能。 The imaging unit 103 has a function of capturing the color changing member 92.
於本實施形態中,攝像部103係如圖2所示般,以自下表面側拍攝由器件搬送頭20保持之狀態之檢查用試驗片90a而確認變色構件92之變色的方式構成。 In the present embodiment, the imaging unit 103 is configured to detect the discoloration of the color changing member 92 by photographing the test piece 90a for inspection held by the device transfer head 20 from the lower surface side as shown in FIG.
於此種檢查裝置1a中,載置檢查用試驗片90a之托盤200a係由托盤搬送機構11A搬送至供給區域A2。 In the inspection apparatus 1a, the tray 200a on which the test piece 90a for inspection is placed is conveyed to the supply area A2 by the tray conveyance mechanism 11A.
搬送至供給區域A2之托盤200a上之檢查用試驗片90a係與IC器件90同樣地,由器件搬送頭13搬送至溫度調整部12。 The test piece 90a for inspection conveyed on the tray 200a of the supply area A2 is transported to the temperature adjustment unit 12 by the device transfer head 13 in the same manner as the IC device 90.
搬送至溫度調整部12之檢查用試驗片90a係由器件搬送頭13與器件供給部14搬送至檢查區域A3。 The test piece 90a for inspection conveyed to the temperature adjustment unit 12 is transported to the inspection area A3 by the device transfer head 13 and the device supply unit 14.
搬送至檢查區域A3之檢查用試驗片90a係與IC器件90同樣地,通過檢查區域A3,並由器件搬送頭20搬送至攝像部103。 The test piece 90a for inspection that has been transported to the inspection area A3 passes through the inspection area A3 in the same manner as the IC device 90, and is transported to the imaging unit 103 by the device transfer head 20.
搬送至攝像部103之檢查用試驗片90a其變色構件92被拍攝。 The coloring member 92 that has been transported to the inspection test piece 90a of the imaging unit 103 is imaged.
若對變色構件92未確認出變色之情形時,將檢查用試驗片90a沿與被搬送至攝像部103之路徑相反之路徑搬送,並載置於供給區域A2中待機之空的托盤200a。 When the color change member 92 is not confirmed to be discolored, the test piece 90a for inspection is transported along a path opposite to the path to be transported to the image pickup unit 103, and placed on the tray 200a in the standby area of the supply area A2.
其後,收容有檢查用試驗片90a之托盤200a藉由托盤搬送機構15及托盤搬送機構11B自供給區域A2回送至托盤供給區域A1。另,亦可將其依然設置於供給區域A2,而不回送至托盤供給區域A1。 Thereafter, the tray 200a in which the test piece 90a for inspection is accommodated is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 15 and the tray conveyance mechanism 11B. Alternatively, it may be placed in the supply area A2 without being returned to the tray supply area A1.
另,上述檢查裝置1a中,於進行IC器件90之檢查之前,先進行上 述結露或結霜之檢查。於該檢查中,如未對變色構件92確認出變色之情形時,直接進行IC器件90之檢查。且,其後,例如以3小時左右之間隔,進行結露或結霜之檢查。於確認結露或結霜之情形時,檢查裝置1a顯示錯誤並停止。使檢查裝置1a內部乾燥,再度使用檢查用試驗片90a進行結露或結霜之檢查,確認無結露或結霜發生後,實施IC器件90之檢查。 In addition, in the above-mentioned inspection apparatus 1a, before performing the inspection of the IC device 90, the above is performed. A test of condensation or frosting. In this inspection, if the discoloration of the color changing member 92 is not confirmed, the inspection of the IC device 90 is directly performed. Then, the condensation or frosting inspection is performed, for example, at intervals of about 3 hours. When the condensation or frosting is confirmed, the inspection device 1a displays an error and stops. The inside of the inspection apparatus 1a was dried, and the test piece 90a for inspection was again used for inspection of dew condensation or frosting, and it was confirmed that no condensation or frost formation occurred, and the inspection of the IC device 90 was performed.
藉由以上所說明之檢查裝置1a,可容易地於檢查檢查裝置1a中檢查IC器件90是否產生結露或結霜。 With the inspection apparatus 1a described above, it is possible to easily check whether the IC device 90 is dew condensation or frost formation in the inspection inspection apparatus 1a.
另,於上述說明中,雖已以托盤(載置部)200a首先位於托盤供給區域A1、然後被搬送至供給區域A2為例進行說明,但托盤(載置部)200a亦可首先位於供給區域A2。 In the above description, the tray (mounting portion) 200a is first placed in the tray supply area A1 and then transported to the supply area A2. However, the tray (mounting portion) 200a may be first located in the supply area. A2.
又,亦可將攝像部103與檢查用試驗片90a設置於供給區域A2或檢查區域A3,並隨時監視變色構件有無變色。 Moreover, the imaging unit 103 and the test piece 90a for inspection can be installed in the supply area A2 or the inspection area A3, and the color change member can be monitored for discoloration at any time.
(第2實施形態) (Second embodiment)
圖3係表示本發明之電子零件檢查裝置之第2實施形態的示意俯視圖。圖4至圖6係第2實施形態之攝像部之剖視圖。 Fig. 3 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention. 4 to 6 are cross-sectional views of the imaging unit of the second embodiment.
以下,參照該等圖式對本發明之電子零件檢查裝置之第2實施形態進行說明,但以與上述實施形態之相異點為中心而進行說明,且對相同之項附加相同之符號而省略其之說明。 In the following, the second embodiment of the electronic component inspection apparatus according to the present invention will be described with reference to the drawings, but the description will be given focusing on the differences from the above-described embodiments, and the same reference numerals will be given to the same items, and the description thereof will be omitted. Description.
如圖3所示,檢查裝置(電子零件檢查裝置)1b劃分為托盤供給區域A1、器件供給區域(以下亦稱作「供給區域」)A2、檢查區域A3、器件回收區域(以下亦稱作「回收區域」)A4、及托盤移除區域A5。且,IC器件90自托盤供給區域A1依序經過供給區域A2、檢查區域A3、回收區域A4、托盤移除區域A5,並於中途之檢查區域A3進行檢查。如此,檢查裝置1b係為包含如下者:電子零件搬送裝置,其對托盤供給區域A1、供給區域A2、檢查區域A3、回收區域A4及托盤移除 區域A5搬送IC器件90;檢查部16,其於檢查區域A3內進行檢查;及控制部80。 As shown in FIG. 3, the inspection apparatus (electronic component inspection apparatus) 1b is divided into a tray supply area A1, a device supply area (hereinafter also referred to as "supply area") A2, an inspection area A3, and a device recovery area (hereinafter also referred to as " Recycling area") A4, and tray removal area A5. Further, the IC device 90 sequentially passes through the supply region A2, the inspection region A3, the recovery region A4, and the tray removal region A5 from the tray supply region A1, and inspects the inspection region A3 in the middle. As described above, the inspection apparatus 1b includes an electronic component transport apparatus that removes the tray supply area A1, the supply area A2, the inspection area A3, the recovery area A4, and the tray. The area A5 transports the IC device 90; the inspection unit 16 performs inspection in the inspection area A3; and the control unit 80.
於本實施形態之檢查裝置1b中,於器件回收部18之垂直上側,設置有拍攝IC器件90之上表面91之攝像部100。該攝像部100包含於電子零件搬送裝置內。 In the inspection apparatus 1b of the present embodiment, the imaging unit 100 that photographs the upper surface 91 of the IC device 90 is provided on the upper side of the device recovery unit 18. The imaging unit 100 is included in an electronic component transport device.
如圖4所示,攝像部100具有相機部101與光照射部102。 As shown in FIG. 4, the imaging unit 100 includes a camera unit 101 and a light irradiation unit 102.
相機部101係配置於器件回收部18之垂直上方,且係以自上方拍攝IC器件90之上表面91之方式構成。若於IC器件90之上表面91發生結露或結霜,會因光之反射,使得由相機部101拍攝之IC器件90之上表面91之顏色發生變化。 The camera unit 101 is disposed vertically above the device recovery unit 18, and is configured to capture the upper surface 91 of the IC device 90 from above. If condensation or frost forms on the upper surface 91 of the IC device 90, the color of the upper surface 91 of the IC device 90 captured by the camera portion 101 changes due to the reflection of light.
光照射部102係以自相對於IC器件90之上表面91之法線X傾斜之方向對IC器件90之上表面91照射光之方式,配置於IC器件90之斜上方。 The light-irradiating portion 102 is disposed obliquely above the IC device 90 so as to illuminate the upper surface 91 of the IC device 90 in a direction inclined with respect to the normal X of the upper surface 91 of the IC device 90.
於藉由光照射部102照射光時,於未結露或結霜之情形時,如圖4所示般光朝特定方向反射,然而於結露或結霜之情形時,如圖5所示般發生光之散射。其結果,由相機部101拍攝之IC器件90之上表面91之顏色變化變得明顯,從而可更確實地檢測結露或結霜之發生。另,亦可利用入射至相機部101之光量的變化來檢測結露或結霜之發生。 When the light is irradiated by the light irradiation portion 102, the light is reflected in a specific direction as shown in FIG. 4 when there is no condensation or frost formation, but occurs as shown in FIG. 5 in the case of condensation or frost formation. Light scattering. As a result, the color change of the upper surface 91 of the IC device 90 imaged by the camera unit 101 becomes conspicuous, so that the occurrence of condensation or frost formation can be more reliably detected. Alternatively, the change in the amount of light incident on the camera unit 101 can be used to detect the occurrence of condensation or frost formation.
IC器件90之上表面91較佳為鏡面。藉由設為鏡面,上表面91之顏色之對比度變良好,從而可更容易地檢測結露或結霜之發生。 The upper surface 91 of the IC device 90 is preferably mirrored. By setting it as a mirror surface, the contrast of the color of the upper surface 91 becomes good, and the occurrence of condensation or frosting can be detected more easily.
此種檢查裝置1b係相隔適當間隔(例如3小時左右)進行結露或結霜之檢查。於確認出結露或結霜之情形時,檢查裝置1b顯示錯誤並停止。其後,使檢查裝置1b內部乾燥,再度進行結露或結霜之檢查,確認無結露或結霜發生後,繼續進行IC器件90之檢查。 Such an inspection device 1b performs inspections for dew condensation or frosting at appropriate intervals (for example, about three hours). When the condensation or frosting is confirmed, the inspection device 1b displays an error and stops. Thereafter, the inside of the inspection apparatus 1b is dried, and dew condensation or frosting is again checked to confirm that no condensation or frost formation has occurred, and the inspection of the IC device 90 is continued.
於以上所說明之檢查裝置1b中,可容易地檢查檢查裝置1b內之IC器件90中之結露或結霜之發生。 In the inspection apparatus 1b described above, the occurrence of dew condensation or frost formation in the IC device 90 in the inspection apparatus 1b can be easily inspected.
另,上述說明中,雖已以拍攝IC器件90之上表面91而檢查結露或結霜之發生為例進行說明,但並非限定於IC器件90,例如,亦可為如圖6所示般將僅供檢查使用之檢查用試驗片90b搬送至檢查裝置1b內而檢查其上表面91b之結露或結霜之發生者。 Further, in the above description, the occurrence of dew condensation or frost formation has been described by taking the upper surface 91 of the IC device 90 as an example. However, the present invention is not limited to the IC device 90. For example, it may be as shown in FIG. The inspection test piece 90b for inspection only is conveyed to the inspection apparatus 1b, and the occurrence of condensation or frost on the upper surface 91b is inspected.
又,上述說明中,雖已對攝像部100設置於器件回收部18之垂直上方之情形進行說明,但並非限定於此,例如,攝像部100亦可設置於回收區域A4。 In the above description, the case where the imaging unit 100 is provided vertically above the device collection unit 18 has been described. However, the present invention is not limited thereto. For example, the imaging unit 100 may be provided in the collection area A4.
以上,雖已就圖示之實施形態說明本發明之電子零件搬送裝置及電子零件檢查裝置,但本發明並非限定於此,構成電子零件搬送裝置及電子零件檢查裝置之各部可置換為能夠發揮相同功能之任意構成。又,亦可附加任意之構成物。 In the above, the electronic component transport apparatus and the electronic component inspection apparatus of the present invention have been described with reference to the embodiments. However, the present invention is not limited thereto, and the components constituting the electronic component transport apparatus and the electronic component inspection apparatus can be replaced with the same. Arbitrary composition of functions. Further, any constituent may be added.
再者,本發明之電子零件搬送裝置及電子零件檢查裝置亦可為組合各實施形態中之任意2個以上之構成(特徵)者。 In addition, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be combined with any two or more of the configurations (characteristics) of the respective embodiments.
1a‧‧‧檢查裝置(電子零件檢查裝置) 1a‧‧‧Inspection device (electronic parts inspection device)
11A‧‧‧托盤搬送機構 11A‧‧‧Tray transport mechanism
11B‧‧‧托盤搬送機構 11B‧‧‧Tray transport mechanism
12‧‧‧溫度調整部(均熱板) 12‧‧‧Temperature adjustment unit (soaking plate)
13‧‧‧器件搬送頭 13‧‧‧Device Transfer Head
14‧‧‧器件供給部(供給載具) 14‧‧‧Device Supply Department (supply vehicle)
15‧‧‧托盤搬送機構(第1搬送裝置) 15‧‧‧Tray transport mechanism (first transport device)
16‧‧‧檢查部 16‧‧‧Inspection Department
17‧‧‧器件搬送頭 17‧‧‧Device transfer head
18‧‧‧器件回收部(回收載具) 18‧‧‧Device Recycling Department (Recycling Vehicle)
19‧‧‧回收用托盤 19‧‧‧Recycling tray
20‧‧‧器件搬送頭 20‧‧‧Device Transfer Head
21‧‧‧托盤搬送機構(第2搬送裝置) 21‧‧‧Tray transport mechanism (second transport device)
22A‧‧‧托盤搬送機構 22A‧‧‧Tray transport mechanism
22B‧‧‧托盤搬送機構 22B‧‧‧Tray transport mechanism
24‧‧‧濕度感測器(濕度計) 24‧‧‧Humidity sensor (hygrometer)
25‧‧‧溫度感測器(溫度計) 25‧‧‧temperature sensor (thermometer)
61‧‧‧第1間隔壁 61‧‧‧1st partition wall
62‧‧‧第2間隔壁 62‧‧‧2nd partition wall
63‧‧‧第3間隔壁 63‧‧‧3rd partition wall
64‧‧‧第4間隔壁 64‧‧‧4th partition wall
65‧‧‧第5間隔壁 65‧‧‧5th partition wall
66‧‧‧內側間隔壁 66‧‧‧Intermediate partition
70‧‧‧前蓋體 70‧‧‧ front cover
71‧‧‧側蓋體 71‧‧‧ side cover
72‧‧‧側蓋體 72‧‧‧ side cover
73‧‧‧後蓋體 73‧‧‧Back cover
75‧‧‧第4門扉 75‧‧‧4th threshold
80‧‧‧控制部 80‧‧‧Control Department
90‧‧‧IC器件 90‧‧‧IC devices
90a‧‧‧檢查用試驗片(構件) 90a‧‧‧Test piece (component) for inspection
103‧‧‧攝像部 103‧‧‧Photography Department
200‧‧‧托盤(電子零件載置部) 200‧‧‧Tray (Electronic Parts Placement Department)
200a‧‧‧托盤(載置部) 200a‧‧‧Tray (placement)
711‧‧‧第1門扉(左側第1門扉) 711‧‧‧1st threshold (1st threshold on the left)
712‧‧‧第2門扉(左側第2門扉) 712‧‧‧2nd threshold (2nd threshold on the left)
721‧‧‧第1門扉(右側第1門扉) 721‧‧‧1st threshold (1st threshold on the right)
722‧‧‧第2門扉(右側第2門扉) 722‧‧‧2nd threshold (2nd threshold on the right)
731‧‧‧第1門扉(背面側第1門扉) 731‧‧‧1st threshold (1st threshold on the back side)
732‧‧‧第1門扉(背面側第1門扉) 732‧‧‧1st threshold (1st threshold on the back side)
733‧‧‧第3門扉(背面側第3門扉) 733‧‧‧3rd threshold (3rd threshold on the back side)
740‧‧‧缸體 740‧‧‧Cylinder
741‧‧‧缸體 741‧‧‧Cylinder
742‧‧‧缸體 742‧‧‧Cylinder
743‧‧‧缸體 743‧‧‧ cylinder
744‧‧‧缸體 744‧‧‧ cylinder
745‧‧‧缸體 745‧‧‧Cylinder
A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area
A2‧‧‧器件供給區域 A2‧‧‧Device supply area
A3‧‧‧檢查區域 A3‧‧‧ inspection area
A4‧‧‧器件回收區域(回收區域) A4‧‧‧Device recycling area (recycling area)
A5‧‧‧托盤移除區域 A5‧‧‧Tray removal area
R1‧‧‧第1室 Room R1‧‧‧
R2‧‧‧第2室 Room R2‧‧‧
R3‧‧‧第3室 Room R3‧‧‧3
X‧‧‧軸 X‧‧‧ axis
Y‧‧‧軸 Y‧‧‧ axis
Z‧‧‧軸 Z‧‧‧ axis
Claims (11)
Applications Claiming Priority (2)
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JP2015051780A JP6536096B2 (en) | 2015-03-16 | 2015-03-16 | Electronic component transfer apparatus, electronic component inspection apparatus and inspection method of condensation or frost formation |
JP2015051773A JP2016170143A (en) | 2015-03-16 | 2015-03-16 | Electronic component conveyance device, electronic component inspection device, test piece for inspecting dew formation or frost formation and inspection method for dew formation or frost formation |
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TW201634370A true TW201634370A (en) | 2016-10-01 |
TWI597227B TWI597227B (en) | 2017-09-01 |
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TW106123000A TWI710513B (en) | 2015-03-16 | 2016-03-11 | Electronic component inspection device and inspection method |
TW105107643A TWI597227B (en) | 2015-03-16 | 2016-03-11 | Electronic parts conveying apparatus, electronic parts inspection apparatus, test piece for inspection of condensation or frosting, and inspection method of condensation or frosting |
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TW (2) | TWI710513B (en) |
WO (1) | WO2016147535A1 (en) |
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CN107966622A (en) * | 2016-10-19 | 2018-04-27 | 鸿劲科技股份有限公司 | Implement with condensation detecting unit |
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KR102514009B1 (en) * | 2018-03-09 | 2023-03-28 | (주)테크윙 | Handler for electronic component test |
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CN114441515B (en) * | 2021-12-15 | 2023-12-05 | 航天科工防御技术研究试验中心 | Device and method for detecting moisture of plastic package device |
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- 2016-02-04 CN CN201680016202.2A patent/CN108139442A/en active Pending
- 2016-02-04 WO PCT/JP2016/000584 patent/WO2016147535A1/en active Application Filing
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TWI607219B (en) * | 2016-10-07 | 2017-12-01 | ||
CN107966622A (en) * | 2016-10-19 | 2018-04-27 | 鸿劲科技股份有限公司 | Implement with condensation detecting unit |
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WO2016147535A1 (en) | 2016-09-22 |
TWI597227B (en) | 2017-09-01 |
TWI710513B (en) | 2020-11-21 |
TW201733891A (en) | 2017-10-01 |
CN108139442A (en) | 2018-06-08 |
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