TW201634370A - Electronic component conveying device, electronic component inspecting device, test piece for inspecting condensation or frosting, and method of inspecting condensation or frosting - Google Patents

Abstract

The objective of the present invention is to provide an electronic component conveying device, an electronic component inspecting device, a test piece for inspecting condensation or frosting, and a method of inspecting condensation or frosting, with which it is possible to inspect easily whether or not condensation or frosting is occurring on an electronic component in a device. An electronic component inspecting device 1a includes a tray (loading portion) 200a on which it is possible to load an inspection test piece 90a including a color-changing member 92 which changes color if condensation or frosting occurs. Further, the electronic component inspecting device 1a includes an image-capturing unit 103. Further, the image-capturing unit 103 is disposed in a device recovery region A4 in which electronic components that have been inspected are recovered. Further, the loading portion 200a is disposed either in the horizontal direction or the vertical direction relative to an electronic component loading portion 200 on which an electronic component is loaded.

Description

Electronic component conveying device, electronic component inspection device, test piece for dew condensation or frosting, and inspection method for condensation or frosting

The present invention relates to an electronic component conveying apparatus, an electronic component inspection apparatus, a test piece for inspection of dew condensation or frosting, and a method of inspecting dew condensation or frosting.

An electronic component inspection apparatus for detecting electrical characteristics of an electronic component such as an IC device has been known, and an electronic component transportation apparatus for transporting an IC device to a holding portion of an inspection unit is incorporated in the electronic component inspection apparatus. At the time of inspection of the IC device, the IC device is placed in the holding portion, and a plurality of probe pins provided in the holding portion are brought into contact with the respective terminals of the IC device.

The inspection of such an IC device may be performed by cooling the IC device to a specific temperature. In order to avoid condensation, in this case, the IC device must be cooled and the ambient humidity of the components for configuring the IC device must be lowered.

Patent Document 1 discloses an IC classifier (IC Handler) configured to detect a short circuit when a condensation occurs between electrodes of an IC device and detect condensation.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-300285

However, in the apparatus of Patent Document 1, the detection of condensation occurs through the machine. Sexual processing, there are problems such as complicated devices and expensive construction. Moreover, in the case of frosty ice, there is a possibility that a short circuit does not occur between the electrodes.

An object of the present invention is to provide an electronic component conveying apparatus, an electronic component inspection apparatus, a test piece for inspection of dew condensation or frosting, and a test for dew condensation or frosting, which can easily detect condensation or frost formation in electronic components in a device. The method provides an electronic component transport device, an electronic component inspection device, and an inspection method for dew condensation or frosting, which can easily detect condensation or frosting of electronic components in the device.

The present invention has been made to solve at least a part of the above problems, and can be realized as the following aspects or application examples.

[Application Example 1] The electronic component transport apparatus according to the application example is characterized in that it includes a mounting portion that can carry electronic components and can be placed with a discoloration that is discolored when liquid water or solid water adheres thereto. The component of the component.

Thereby, it is possible to easily check whether the electronic parts are dew condensation or frost formation in the electronic component conveying device.

[Application Example 2] In the electronic component conveying apparatus of the application example, it is preferable that the color changing member is discolored in the case of dew condensation or frost formation.

Thereby, it is possible to more easily check whether the electronic parts are dew condensation or frost formation in the electronic component conveying device.

[Application Example 3] In the electronic component conveying apparatus of the application example, it is preferable to include an image pickup unit that can image the above-described members.

Thereby, the confirmation of the discoloration of the color changing member can be performed more easily.

[Application Example 4] In the electronic component conveying apparatus of the application example, it is preferable that the imaging unit is disposed in a collection area for collecting the electronic component that has been subjected to the specific inspection.

Thereby, it is possible to more reliably detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.

[Application Example 5] In the electronic component transport apparatus of the application example, it is preferable that the mounting portion is disposed in the vertical direction with respect to the electronic component mounting portion on which the electronic component is placed.

Thereby, it is possible to more easily detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.

[Application Example 6] In the electronic component transport apparatus of the application example, it is preferable that the mounting portion is disposed in a direction orthogonal to the vertical direction with respect to the electronic component mounting portion on which the electronic component is placed.

Thereby, it is possible to more easily detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.

[Application Example 7] In the electronic component conveying apparatus of the application example, it is preferable that the mounting portion is disposed in an electronic component mounting portion supply region or a device supply region, and the electronic component mounting portion supply region is mounted on the mounting portion. The electronic component mounting portion of the electronic component before performing the above-described specific inspection, wherein the component supply region supplies the electronic component mounted on the electronic component mounting portion of the electronic component mounting portion supply region to the electronic component mounting portion Check the inspection area.

Thereby, it is possible to more easily detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.

[Application Example 8] In the electronic component conveying apparatus of the application example, it is preferable that the color changing member is configured to be vertically downward when the member is disposed in the electronic component conveying device.

Thereby, it is possible to more reliably detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.

[Application Example 9] The electronic component inspection apparatus according to the application example of the present invention includes a mounting portion that mounts a member having a color changing member that is discolored when liquid water or solid water adheres, and an inspection portion that inspects Electronic parts.

Thereby, it is possible to easily check whether the electronic component is generated in the electronic component conveying device Condensation or frosting.

[Application Example 10] The test piece for examination for dew condensation or frosting of this application example is characterized by comprising a color-changing member which is discolored when liquid water or solid water is adhered thereto.

Thereby, it is possible to easily check whether the electronic parts are dew condensation or frost formation in the apparatus.

[Application Example 11] The inspection method for dew condensation or frosting of this application example is characterized in that condensation or frost is detected by using an inspection test piece containing a color change member which is discolored when liquid water or solid water is adhered thereto. .

Thereby, it is possible to easily check whether the electronic parts are dew condensation or frost formation in the apparatus.

[Application Example 12] An electronic component transport apparatus according to this application example is characterized in that it includes an image pickup unit that can photograph a member to which liquid water or solid water adheres.

Thereby, it is possible to easily detect whether or not the electronic component is dew condensation or frost formation in the electronic component conveying device.

[Application Example 13] In the electronic component transport apparatus of the application example, it is preferable that the imaging unit captures the above-described members that are dew condensation or frost.

Thereby, it is possible to more easily check for the occurrence of condensation or frosting of the electronic components in the electronic component conveying device.

[Application Example 14] In the electronic component conveying apparatus of the application example, the component is preferably an electronic component or a test piece for inspection.

Thereby, it is possible to more easily check for the occurrence of condensation or frosting of the electronic components in the electronic component conveying device.

[Application Example 15] In the electronic component conveying device of the application example, it is preferable that the light-emitting portion that irradiates the member with light is included.

Thereby, the occurrence of condensation or frosting can be more reliably detected by scattering of light.

[Application Example 16] In the electronic component conveying apparatus of the application example, it is preferable that the light irradiation unit emits light from a direction inclined with respect to a normal line of the imaging surface of the member.

Thereby, the condensation of the electronic parts in the electronic component conveying device can be detected more easily Or frosting occurs.

[Application Example 17] In the electronic component conveying apparatus of the application example, it is preferable that the imaging surface of the member is a mirror surface.

Thereby, it is possible to more easily detect the occurrence of condensation or frosting of the electronic components in the electronic component conveying device.

[Application Example 18] The electronic component inspection apparatus of the application example is characterized by comprising: an imaging unit that can photograph a member that dews or frosts; and an inspection unit that inspects an electronic component.

Thereby, it is possible to easily detect the occurrence of condensation or frosting of the electronic components in the electronic component conveying device.

[Application Example 19] The method for inspecting dew condensation or frosting of this application example is characterized in that it is a member which photographs dew condensation or frosting and checks for condensation or frosting.

Thereby, it is possible to easily detect the occurrence of condensation or frosting of the electronic components in the device.

1a‧‧‧Inspection device (electronic parts inspection device)

1b‧‧‧Inspection device (electronic parts inspection device)

11A‧‧‧Tray transport mechanism

11B‧‧‧Tray transport mechanism

12‧‧‧Temperature adjustment unit (soaking plate)

13‧‧‧Device Transfer Head

14‧‧‧Device Supply Department (supply vehicle)

15‧‧‧Tray transport mechanism (first transport device)

16‧‧‧Inspection Department

17‧‧‧Device transfer head

18‧‧‧Device Recycling Department (Recycling Vehicle)

19‧‧‧Recycling tray

20‧‧‧Device Transfer Head

21‧‧‧Tray transport mechanism (second transport device)

22A‧‧‧Tray transport mechanism

22B‧‧‧Tray transport mechanism

24‧‧‧Humidity sensor (hygrometer)

25‧‧‧temperature sensor (thermometer)

61‧‧‧1st partition wall

62‧‧‧2nd partition wall

63‧‧‧3rd partition wall

64‧‧‧4th partition wall

65‧‧‧5th partition wall

66‧‧‧Intermediate partition

70‧‧‧ front cover

71‧‧‧ side cover

72‧‧‧ side cover

73‧‧‧Back cover

75‧‧‧4th threshold

80‧‧‧Control Department

90‧‧‧IC devices

90a‧‧‧Test piece (component) for inspection

90b‧‧‧Test piece (component) for inspection

91‧‧‧Upper surface

91b‧‧‧ upper surface

92‧‧‧Discoloration members

100‧‧‧Photography Department

103‧‧‧Photography Department

200‧‧‧Tray (Electronic Parts Placement Department)

200a‧‧‧Tray (placement)

711‧‧‧1st threshold (1st threshold on the left)

712‧‧‧2nd threshold (2nd threshold on the left)

721‧‧‧1st threshold (1st threshold on the right)

722‧‧‧2nd threshold (2nd threshold on the right)

731‧‧‧1st threshold (1st threshold on the back side)

732‧‧‧1st threshold (1st threshold on the back side)

733‧‧‧3rd threshold (3rd threshold on the back side)

740‧‧‧Cylinder

741‧‧‧Cylinder

742‧‧‧Cylinder

743‧‧‧ cylinder

744‧‧‧ cylinder

745‧‧‧Cylinder

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

DA‧‧‧dry gas

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

X‧‧‧ axis

Y‧‧‧ axis

Z‧‧‧ axis

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.

Fig. 2 is a cross-sectional view showing a test piece for examination and an imaging unit for dew condensation or frosting according to the first embodiment.

Fig. 3 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention.

Fig. 4 is a cross-sectional view showing an imaging unit according to a second embodiment.

Fig. 5 is a cross-sectional view showing an imaging unit according to a second embodiment.

Fig. 6 is a cross-sectional view of the imaging unit of the second embodiment.

Hereinafter, the electronic component conveying apparatus, the electronic component inspection apparatus, the test piece for dew condensation or frosting, and the inspection method of dew condensation or frosting of the present invention will be described in detail based on a preferred embodiment shown in the additional drawings.

Hereinafter, for convenience of explanation, for example, as shown in FIG. 1, three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". Further, the upstream side of the transport direction of the electronic component is also referred to as "upstream side", and the downstream side is also referred to as "downstream side". Further, the "level" in the specification of the present invention is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as it does not hinder the conveyance of the electronic component.

Further, the inspection apparatus (electronic component inspection apparatus) shown in the embodiment is used for inspection/test (hereinafter referred to as "inspection") such as BGA (Ball grid array) package or LGA (Land grid). Array: A device for electrical characteristics of an electronic device such as an IC device such as an LCD (Liquid Crystal Display) or a CIS (CMOS Image Sensor: CMOS image sensor). In the following, for convenience of explanation, a case where an IC device is used as the above-described electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 90".

(First embodiment)

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a cross-sectional view showing a test piece and an imaging unit for examination for dew condensation or frosting.

As shown in Fig. 1, the inspection apparatus (electronic component inspection apparatus) 1a of the present embodiment is divided into a tray supply area (electronic component mounting unit supply area) A1 and a device supply area (hereinafter also referred to as "supply area") A2. The inspection area A3, the device recovery area (hereinafter also referred to as "recovery area") A4, and the tray removal area A5. Further, the IC device 90 sequentially passes through the supply region A2, the inspection region A3, the recovery region A4, and the tray removal region A5 from the tray supply region A1, and is inspected in the inspection region A3 in the middle. In this way, the inspection apparatus 1a includes an electronic component transport apparatus that pairs the tray supply area A1, the supply area A2, the inspection area A3, the collection area A4, and the tray removal area A5 (hereinafter also referred to as "each The area ") transports the IC device 90; the inspection unit 16 performs inspection in the inspection area A3; and the control unit 80.

Further, the inspection apparatus 1a is provided with one of the tray supply area A1 or the tray removal area A5 (the -Y direction side in FIG. 1) as the front side, and the opposite side, that is, one side of the inspection area A3 (FIG. 1) The middle +Y direction side is used as the back side.

The tray supply area A1 supplies a supply unit of a tray (electronic part mounting unit) 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In addition, in the tray supply area A1, a plurality of trays 200 may be stacked.

In the supply area A2, a plurality of IC devices 90 disposed on the upper surface of the tray 200 transported from the tray supply area A1 are supplied to the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the trays 200 one by one across the tray supply area A1 and the supply area A2 are provided.

In the supply area A2, a temperature adjustment unit (heating plate) 12, a device transfer head 13, and a tray transfer mechanism (first transfer device) 15 are provided.

The temperature adjustment unit 12 heats or cools a plurality of IC devices 90 to adjust the IC device 90 to a temperature suitable for inspection. In the configuration shown in Fig. 1, the temperature adjustment unit 12 is disposed and fixed in the Y direction. The IC device 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported and placed on any one of the temperature adjustment units 12.

The device transfer head 13 is movably supported within the supply area A2. Thereby, the device transfer head 13 can carry the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14 to be described later. Transfer.

The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in a state in which all of the IC devices 90 have been carried out in the supply region A2 in the X direction. Further, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area by the tray transport mechanism 11B. A1.

The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transfer head 17, and a device collection unit (recycling shuttle) 18 are provided.

The device supply unit 14 transports the temperature-adjusted IC device 90 to a device in the vicinity of the inspection unit 16. The device supply portion 14 is supported to be movable in the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 1, the device supply unit 14 is disposed in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported and placed on any of the device supply units 14.

The inspection unit 16 is a unit that inspects/tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 in a state in which the IC device 90 is held. Further, the terminal of the IC device 90 is electrically connected (contacted) to the probe pin, and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in the inspection control unit provided in the tester connected to the inspection unit 16. Further, similarly to the temperature adjustment unit 12, the inspection unit 16 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.

The device transfer head 17 is movably supported within the inspection area A3. Thereby, the device transfer head 17 can transport the IC device 90 on the device transport supply unit 14 carried in from the supply area A2 to the inspection unit 16 to be placed thereon.

The device recovery unit 18 is a device that transports the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device recovery unit 18 is supported to be movable in the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 1, the device collection unit 18 is disposed in the Y direction in the same manner as the device supply unit 14, and the IC device 90 on the inspection unit 16 is transported to any one of the device collection units 18. . This transfer is performed by the device transfer head 17.

The recovery area A4 is a region of a plurality of IC devices 90 that have been inspected for recycling. In this In the collection area A4, a collection tray 19, a device transfer head 20, and a tray conveyance mechanism (second conveyance device) 21 are provided. Further, in the collection area A4, an empty tray 200 is also provided.

The recovery tray 19 is fixed in the collection area A4, and in the configuration shown in Fig. 1, three are arranged in the X direction. Further, three empty trays 200 are also arranged in the X direction. Then, the IC device 90 moved to the device collection unit 18 of the collection area A4 is transported to any of the collection trays 19 and the empty trays 200. Thereby, the IC device 90 is recovered and classified according to the respective inspection results.

The device transfer head 20 is movably supported within the recovery area A4. Thereby, the device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 into the recovery area A4 in the X direction. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is recovered, that is, it may become any one of the three empty trays 200 disposed in the recovery area A4.

In the inspection apparatus 1a, the tray conveyance mechanism 21 is provided in the collection area A4, and the tray conveyance mechanism 15 is provided in the supply area A2. By this means, for example, even if the empty tray 200 is transported in the X direction by one transport device, the throughput (the number of transports of the IC device 90 per unit time) can be improved.

The tray removing area A5 collects and removes the material removing portion of the tray 200 of the plurality of IC devices 90 in which the inspection is completed. In addition, in the tray removing area A5, a plurality of trays 200 may be stacked.

Further, the tray transport mechanisms 22A and 22B that transport the trays 200 one by one across the recovery area A4 and the tray removal area A5 are provided. The tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports the tray 200 for recovering the empty space of the IC device 90 from the tray removal area A5 to the recovery area A4.

The control unit 80 has, for example, a drive control unit. The drive control unit controls, for example, the tray transport mechanisms 11A and 11B, the temperature adjustment unit 12, the device transport head 13, the device supply unit 14, the tray transport mechanism 15, the inspection unit 16, the device transport head 17, the device recovery unit 18, and the device transport head 20. Driving of each of the tray transport mechanism 21 and the tray transport mechanisms 22A and 22B.

In addition, the inspection control unit of the tester performs inspection of electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).

In the inspection apparatus 1a as described above, the device transfer head 13, the device supply unit 14, and the device transfer head 17 are similarly configured to heat or cool the IC device 90 except for the temperature adjustment unit 12 or the inspection unit 16. Thereby, the temperature of the IC device 90 is maintained constant during the transfer. In the following description, a case where the IC device 90 is cooled and inspected in a low temperature environment within a range of, for example, -60 ° C to -40 ° C will be described.

As shown in Fig. 1, the inspection device 1a is partitioned (separated) between the tray supply region A1 and the supply region A2 by the first partition wall 61, and is partitioned between the supply region A2 and the inspection region A3 by the second partition wall 62. 3 The partition wall 63 partitions between the inspection area A3 and the recovery area A4, and the fourth partition wall 64 partitions between the recovery area A4 and the tray removal area A5. Further, the supply region A2 and the recovery region A4 are also partitioned by the fifth partition wall 65. The partition walls have a function of maintaining airtightness of the respective regions. Further, the outermost cover of the inspection device 1a is covered by a lid body, for example, a front cover body 70, a side cover body 71, a side cover body 72, and a rear cover body 73.

Further, the supply region A2 is the first chamber R1 partitioned by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side cover 71, and the rear lid body 73. A plurality of IC devices 90 in an unchecked state are carried into the first chamber R1 by the entire tray 200.

The inspection area A3 is the second chamber R2 drawn by the second partition 62, the third partition 63, and the rear cover 73. In the second chamber R2, a plurality of IC devices 90 are carried from the first chamber R1.

The recovery area A4 is the third chamber R3 drawn by the third partition 63, the fourth partition 64, the fifth partition 65, the side cover 72, and the rear cover 73. For the third room R3, I have moved in from the second room R2. The plurality of IC devices 90 that have been inspected are terminated.

As shown in FIG. 1, the side cover 71 is provided with a first threshold (left first door) 711 and a second threshold (left second door) 712. By opening the first threshold 711 or the second threshold 712, for example, maintenance in the first chamber R1 or smashing of the IC device 90 can be performed (hereinafter, these are generally referred to as "jobs"). Further, the first threshold 711 and the second threshold 712 are so-called "double-opening doors" that open and close in opposite directions. Moreover, when the work in the first chamber R1 is performed, the movable portion such as the device transfer head 13 in the first chamber R1 is stopped. The first threshold 711 and the second threshold 712 can be locked/unlocked together by the operation of the cylinder 740.

Similarly, the side cover 72 is provided with a first threshold (the first threshold on the right side) 721 and a second threshold (the second threshold on the right side) 722. The operation in the third chamber R3 can be performed, for example, by opening the first threshold 721 or the second threshold 722. Further, the first threshold 721 and the second threshold 722 are also so-called "double-opening doors" that open and close in opposite directions. Further, when the operation in the third chamber R3 is performed, the movable portion of the device transfer head 20 or the like in the third chamber R3 is stopped. The first threshold 721 and the second threshold 722 can be locked/unlocked by the action of the cylinder 745.

Further, the rear cover 73 is also provided with a first threshold (first back door on the back side) 731, a second threshold (second threshold on the back side) 732, and a third threshold (third threshold on the back side) 733. The operation in the first chamber R1 can be performed, for example, by opening the first threshold 731. The operation in the third chamber R3 can be performed, for example, by opening the third threshold 733.

Further, an inner partition wall 66 is provided between the second threshold (the second door sill on the back side) 732 and the second chamber R2, and a fourth sill 75 is provided on the inner partition wall 66. Further, by operating the second threshold 732 and the fourth threshold 75, for example, the work in the second chamber R2 can be performed.

Further, the first threshold 731 and the second threshold 732 and the fourth threshold 75 are opened and closed in the same direction, and the third threshold 733 is opened and closed in a direction opposite to the threshold. Further, during the operation in the second chamber R2, the movable portion such as the device transfer head 17 in the second chamber R2 is stopped. The first threshold 731 can be locked/unlocked by the action of the cylinder 741, and the second threshold 732 can be locked/unlocked by the operation of the cylinder 742, and the third threshold 733 can be actuated by the cylinder 744. Lock/unlock, 4th threshold 75 Can be locked/unlocked by the action of the cylinder 743,

Further, the airtightness or heat-breaking property of each of the corresponding chambers can be ensured by closing the respective thresholds.

Thereby, the inspection apparatus 1a inspects the IC device 90 in a low temperature environment.

As shown in FIG. 1, in the first chamber R1, the second chamber R2, and the third chamber R3, a humidity sensor (hygrometer) 24 for detecting humidity in the room and a temperature sensor for detecting temperature are disposed. Thermometer) 25. Further, the humidity in each room uses the humidity (detected value) at the position where the humidity sensor 24 is disposed, and the temperature uses the temperature (detected value) at which the temperature sensor 25 is disposed. Thereby, accurate humidity or temperature can be obtained as much as possible.

In the inspection apparatus 1a that performs inspection in a low-temperature environment, dry air DA can be supplied to each of the first chamber R1, the second chamber R2, and the third chamber R3 to adjust (set) the humidity in each room. Thereby, condensation can be prevented from occurring in the second chamber R2 after cooling.

In addition, although the number of the humidity sensor 24 and the temperature sensor 25 in the first chamber R1, the second chamber R2, and the third chamber R3 is one in the present embodiment, the present invention is not limited thereto. For multiples. In this case, for example, as the humidity of the second chamber R2, the average value of the detected values detected by the plurality of humidity sensors 24 may be used, and the lowest detected value or the highest detected value may be used.

Further, in the inspection device 1a, the humidity sensor 24 and the temperature sensor 25 in the third chamber R3 may be omitted.

In the inspection apparatus 1a, the tray supply area A1 is supplied with a tray (mounting part) 200a as shown in Fig. 1, and a test piece for inspection of a color-changing member which is discolored in the case of dew condensation or frost formation can be placed. (member) 90a. In addition, the term "discoloration" as used in this specification includes not only a change in color but also a concept of uniformity or change in shading.

In the configuration shown in the drawing, the tray (mounting portion) 200a is disposed in the horizontal direction with respect to the tray (electronic component mounting portion) 200. Further, the tray 200a is disposed in the vertical direction with respect to the tray 200.

As shown in FIG. 2, the test piece (member) 90a for inspection is composed of a test device 93 and a color change member 92 disposed on the lower surface of the test device 93. In other words, the color changing member 92 is configured to face vertically downward. Further, as long as the orientation of the color changing member 92 is such that the orientation of the imaging unit 103 to be described later can be set, it is not limited to the vertical lower side, and may be vertically upward or lateral.

As the color changing member 92, for example, a humidity indicator, a water immersion detecting sealing film, or the like can be used.

An imaging unit 103 is provided in the collection area A4.

The imaging unit 103 has a function of capturing the color changing member 92.

In the present embodiment, the imaging unit 103 is configured to detect the discoloration of the color changing member 92 by photographing the test piece 90a for inspection held by the device transfer head 20 from the lower surface side as shown in FIG.

In the inspection apparatus 1a, the tray 200a on which the test piece 90a for inspection is placed is conveyed to the supply area A2 by the tray conveyance mechanism 11A.

The test piece 90a for inspection conveyed on the tray 200a of the supply area A2 is transported to the temperature adjustment unit 12 by the device transfer head 13 in the same manner as the IC device 90.

The test piece 90a for inspection conveyed to the temperature adjustment unit 12 is transported to the inspection area A3 by the device transfer head 13 and the device supply unit 14.

The test piece 90a for inspection that has been transported to the inspection area A3 passes through the inspection area A3 in the same manner as the IC device 90, and is transported to the imaging unit 103 by the device transfer head 20.

The coloring member 92 that has been transported to the inspection test piece 90a of the imaging unit 103 is imaged.

When the color change member 92 is not confirmed to be discolored, the test piece 90a for inspection is transported along a path opposite to the path to be transported to the image pickup unit 103, and placed on the tray 200a in the standby area of the supply area A2.

Thereafter, the tray 200a in which the test piece 90a for inspection is accommodated is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 15 and the tray conveyance mechanism 11B. Alternatively, it may be placed in the supply area A2 without being returned to the tray supply area A1.

In addition, in the above-mentioned inspection apparatus 1a, before performing the inspection of the IC device 90, the above is performed. A test of condensation or frosting. In this inspection, if the discoloration of the color changing member 92 is not confirmed, the inspection of the IC device 90 is directly performed. Then, the condensation or frosting inspection is performed, for example, at intervals of about 3 hours. When the condensation or frosting is confirmed, the inspection device 1a displays an error and stops. The inside of the inspection apparatus 1a was dried, and the test piece 90a for inspection was again used for inspection of dew condensation or frosting, and it was confirmed that no condensation or frost formation occurred, and the inspection of the IC device 90 was performed.

With the inspection apparatus 1a described above, it is possible to easily check whether the IC device 90 is dew condensation or frost formation in the inspection inspection apparatus 1a.

In the above description, the tray (mounting portion) 200a is first placed in the tray supply area A1 and then transported to the supply area A2. However, the tray (mounting portion) 200a may be first located in the supply area. A2.

Moreover, the imaging unit 103 and the test piece 90a for inspection can be installed in the supply area A2 or the inspection area A3, and the color change member can be monitored for discoloration at any time.

(Second embodiment)

Fig. 3 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention. 4 to 6 are cross-sectional views of the imaging unit of the second embodiment.

In the following, the second embodiment of the electronic component inspection apparatus according to the present invention will be described with reference to the drawings, but the description will be given focusing on the differences from the above-described embodiments, and the same reference numerals will be given to the same items, and the description thereof will be omitted. Description.

As shown in FIG. 3, the inspection apparatus (electronic component inspection apparatus) 1b is divided into a tray supply area A1, a device supply area (hereinafter also referred to as "supply area") A2, an inspection area A3, and a device recovery area (hereinafter also referred to as " Recycling area") A4, and tray removal area A5. Further, the IC device 90 sequentially passes through the supply region A2, the inspection region A3, the recovery region A4, and the tray removal region A5 from the tray supply region A1, and inspects the inspection region A3 in the middle. As described above, the inspection apparatus 1b includes an electronic component transport apparatus that removes the tray supply area A1, the supply area A2, the inspection area A3, the recovery area A4, and the tray. The area A5 transports the IC device 90; the inspection unit 16 performs inspection in the inspection area A3; and the control unit 80.

In the inspection apparatus 1b of the present embodiment, the imaging unit 100 that photographs the upper surface 91 of the IC device 90 is provided on the upper side of the device recovery unit 18. The imaging unit 100 is included in an electronic component transport device.

As shown in FIG. 4, the imaging unit 100 includes a camera unit 101 and a light irradiation unit 102.

The camera unit 101 is disposed vertically above the device recovery unit 18, and is configured to capture the upper surface 91 of the IC device 90 from above. If condensation or frost forms on the upper surface 91 of the IC device 90, the color of the upper surface 91 of the IC device 90 captured by the camera portion 101 changes due to the reflection of light.

The light-irradiating portion 102 is disposed obliquely above the IC device 90 so as to illuminate the upper surface 91 of the IC device 90 in a direction inclined with respect to the normal X of the upper surface 91 of the IC device 90.

When the light is irradiated by the light irradiation portion 102, the light is reflected in a specific direction as shown in FIG. 4 when there is no condensation or frost formation, but occurs as shown in FIG. 5 in the case of condensation or frost formation. Light scattering. As a result, the color change of the upper surface 91 of the IC device 90 imaged by the camera unit 101 becomes conspicuous, so that the occurrence of condensation or frost formation can be more reliably detected. Alternatively, the change in the amount of light incident on the camera unit 101 can be used to detect the occurrence of condensation or frost formation.

The upper surface 91 of the IC device 90 is preferably mirrored. By setting it as a mirror surface, the contrast of the color of the upper surface 91 becomes good, and the occurrence of condensation or frosting can be detected more easily.

Such an inspection device 1b performs inspections for dew condensation or frosting at appropriate intervals (for example, about three hours). When the condensation or frosting is confirmed, the inspection device 1b displays an error and stops. Thereafter, the inside of the inspection apparatus 1b is dried, and dew condensation or frosting is again checked to confirm that no condensation or frost formation has occurred, and the inspection of the IC device 90 is continued.

In the inspection apparatus 1b described above, the occurrence of dew condensation or frost formation in the IC device 90 in the inspection apparatus 1b can be easily inspected.

Further, in the above description, the occurrence of dew condensation or frost formation has been described by taking the upper surface 91 of the IC device 90 as an example. However, the present invention is not limited to the IC device 90. For example, it may be as shown in FIG. The inspection test piece 90b for inspection only is conveyed to the inspection apparatus 1b, and the occurrence of condensation or frost on the upper surface 91b is inspected.

In the above description, the case where the imaging unit 100 is provided vertically above the device collection unit 18 has been described. However, the present invention is not limited thereto. For example, the imaging unit 100 may be provided in the collection area A4.

In the above, the electronic component transport apparatus and the electronic component inspection apparatus of the present invention have been described with reference to the embodiments. However, the present invention is not limited thereto, and the components constituting the electronic component transport apparatus and the electronic component inspection apparatus can be replaced with the same. Arbitrary composition of functions. Further, any constituent may be added.

In addition, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be combined with any two or more of the configurations (characteristics) of the respective embodiments.

1a‧‧‧Inspection device (electronic parts inspection device)

11A‧‧‧Tray transport mechanism

11B‧‧‧Tray transport mechanism

12‧‧‧Temperature adjustment unit (soaking plate)

13‧‧‧Device Transfer Head

14‧‧‧Device Supply Department (supply vehicle)

15‧‧‧Tray transport mechanism (first transport device)

16‧‧‧Inspection Department

17‧‧‧Device transfer head

18‧‧‧Device Recycling Department (Recycling Vehicle)

19‧‧‧Recycling tray

20‧‧‧Device Transfer Head

21‧‧‧Tray transport mechanism (second transport device)

22A‧‧‧Tray transport mechanism

22B‧‧‧Tray transport mechanism

24‧‧‧Humidity sensor (hygrometer)

25‧‧‧temperature sensor (thermometer)

61‧‧‧1st partition wall

62‧‧‧2nd partition wall

63‧‧‧3rd partition wall

64‧‧‧4th partition wall

65‧‧‧5th partition wall

66‧‧‧Intermediate partition

70‧‧‧ front cover

71‧‧‧ side cover

72‧‧‧ side cover

73‧‧‧Back cover

75‧‧‧4th threshold

80‧‧‧Control Department

90‧‧‧IC devices

90a‧‧‧Test piece (component) for inspection

103‧‧‧Photography Department

200‧‧‧Tray (Electronic Parts Placement Department)

200a‧‧‧Tray (placement)

711‧‧‧1st threshold (1st threshold on the left)

712‧‧‧2nd threshold (2nd threshold on the left)

721‧‧‧1st threshold (1st threshold on the right)

722‧‧‧2nd threshold (2nd threshold on the right)

731‧‧‧1st threshold (1st threshold on the back side)

732‧‧‧1st threshold (1st threshold on the back side)

733‧‧‧3rd threshold (3rd threshold on the back side)

740‧‧‧Cylinder

741‧‧‧Cylinder

742‧‧‧Cylinder

743‧‧‧ cylinder

744‧‧‧ cylinder

745‧‧‧Cylinder

A1‧‧‧Tray supply area

A2‧‧‧Device supply area

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

X‧‧‧ axis

Y‧‧‧ axis

Z‧‧‧ axis

Claims (11)

An electronic component transporting apparatus comprising: a mounting portion that can carry electronic components and can mount a member having a color changing member that discolors when liquid water or solid water adheres. The electronic component transporting device of claim 1, wherein the color changing member is discolored in the case of condensation or frosting. An electronic component transport apparatus according to claim 1 or 2, comprising an image pickup unit that can capture the above-described members. The electronic component transport apparatus of claim 3, wherein the imaging unit is disposed in a collection area for recovering the electronic component that has been subjected to the specific inspection. The electronic component conveying apparatus according to any one of claims 1 to 4, wherein the mounting portion is disposed in a vertical direction with respect to the electronic component mounting portion on which the electronic component is placed. The electronic component transport apparatus according to any one of claims 1 to 4, wherein the mounting portion is disposed in a direction orthogonal to a vertical direction with respect to an electronic component mounting portion on which the electronic component is placed. The electronic component transporting apparatus according to any one of claims 1 to 6, wherein the mounting portion is disposed in an electronic component mounting portion supply region or a device supply region, and the electronic component mounting portion supply region is mounted on the supply side. The electronic component mounting portion of the electronic component before the inspection; the device supply region supplies the electronic component placed on the electronic component mounting portion of the electronic component mounting portion supply region to an inspection for inspection region. The electronic component conveying apparatus according to any one of claims 1 to 6, wherein when the member is disposed in the electronic component conveying device, the color changing member is configured to be vertically downward. An electronic component inspection device characterized by comprising: The placing unit mounts a member having a color changing member that changes color when liquid water or solid water adheres, and an inspection unit that inspects the electronic component. A test piece for examination for dew condensation or frosting, comprising: a color changing member which is discolored when a liquid water or solid water is adhered thereto. A method for inspecting dew condensation or frosting, which is characterized in that dew condensation or frosting is detected using a test piece for inspection containing a discoloration member which is discolored when liquid water or solid water is adhered thereto.