JP4377276B2 - Semiconductor test equipment with condensation removal - Google Patents

Description

  According to the present invention, when the occurrence of dew condensation that occurs when a semiconductor device is subjected to a low temperature test is detected, the generated dew condensation is automatically removed.

  For example, a semiconductor device such as a semiconductor memory is tested after manufacture and before shipment. At this time, a low temperature wind is blown to the semiconductor device to perform a low temperature test at, for example, 0 ° C., or a high temperature wind is blown to perform, for example, a high temperature test at 75 ° C.

  By the way, when planning the automation of the test of the semiconductor device, there were the following problems.

  After setting the test sample in the socket part of the handler, which is an automatic test equipment, low-temperature air is sent to the socket part and the test sample is cooled to the set temperature, and then a predetermined test is performed. At the same time, condensation has occurred and electrical leakage has occurred, which has been a major obstacle to automation. Also, if there is condensation, there is no way to remove it automatically, so it was not possible to run the handler continuously at night.

For this reason, conventionally, a sealed space is formed on at least one side of the wiring board located on the back of the socket, dry air is sealed from the nozzle in the sealed space, and outside air contacts the test components maintained at a low temperature. To prevent condensation.
JP 2000-35458 A

  Encapsulating dry air in a sealed space in this way, not only complicating the device to prepare special dry air, but also not a countermeasure when condensation occurs for some reason, so dew condensation by simple means There is a need to provide countermeasures in the event of an outbreak.

In order to solve the above problems, in the present invention, a hand portion for moving a semiconductor device under test to be tested to a predetermined position, and a socket in which a case of the semiconductor device under test is pressed against the socket portion and a hole for blowing is formed. A holding plate, socket holding plate control means for controlling movement of the socket holding plate, a low-temperature blower for blowing low-temperature wind to the semiconductor device under test, and a high-temperature blower for blowing high-temperature wind to the semiconductor device under test The air blower control means for switching and controlling the low temperature air blower and the high temperature air blower, the test driver means for performing a test operation of the semiconductor device under test and detecting the occurrence of dew condensation in the socket, and the test result are predicted in advance. and a tester comparing means for determining the quality of the to the test results compared to the determination value, condensation detecting means for detecting the condensation of the socket portion immediately And, upon detection of the dew condensation of the socket part by the condensation detection means, the cancel blower control means a low-temperature blowing, the socket retainer plate control means to control the movement of the said socket retainer plate upward, the hand portion Take out the semiconductor device under test from the socket part and hold it, move the socket holding plate downward from the upper part of the socket part, perform high-temperature air blowing from the high-temperature air blowing part to control the drying, and then use the hand part A semiconductor test with condensation removal is characterized in that the semiconductor device under test held is transported to the socket part, blown again at a low temperature to perform a low temperature test, and a high temperature test is performed on the semiconductor device under test that has passed this Providing equipment.

  The following effects can be achieved by the present invention.

  (1) Every time condensation occurs, even if the user does not perform the condensation removal work, the high-temperature air is automatically blown on the semiconductor automatic test equipment side to remove the slight condensation. When a defect occurs, the user stops the test and removes dew condensation, for example, manually, and then blows at high temperature, then the test is restarted when the condensation is completely removed, compared to the user's Work can be lightened.

  (2) Since the automatic test can be performed even if the user is not attached to the automatic semiconductor test apparatus, automatic operation at midnight is possible, and the work efficiency can be greatly enhanced.

  (3) Conventionally, the presence of dew condensation could not be detected until the dew condensation increased. Therefore, semiconductor devices are often detected as defective devices on the basis of dew condensation even if they do not originally have defects, and are regarded as pseudo defective products. In some cases, the retest is performed, but it is no longer detected as a defective product based on condensation, and the efficiency of the test can be improved.

  (4) Since dew condensation can be detected at an early stage, it is possible to prevent the deterioration of pogo pins used in the socket.

  Insert the semiconductor device under test into the socket and perform low-temperature testing by blowing low-temperature air for the low-temperature test from the hole in the holding plate placed above it. At this time, condensation occurs on the lead wire of the semiconductor device under test. When it is detected by the dew condensation sensor, the holding plate is removed from the case of the semiconductor device, the semiconductor device under test at the low temperature test is removed from the socket portion, and the holding plate is put on the socket portion again. Then, high-temperature air for a high-temperature test is performed for a specified time, for example, from the hole of the holding plate. As a result, a slight amount of dew condensation is removed, so that the low temperature test of the semiconductor device can be continued again. Then, a semiconductor can be efficiently and automatically tested by performing a high temperature test on those that have passed the low temperature test.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an embodiment of the present invention, FIG. 2 is an explanatory diagram of a test state of the present invention, FIG. 3 is an explanatory diagram of a condensation sensor, and FIG. 4 is an operational explanatory diagram of the present invention.

  In the figure, 1 is a handler hand section, 2 is a handler control section, 3 is a tray section, 4 is a socket section, 5 is a socket pressing plate section, 6 is a socket pressing board control section, 7 is a low temperature blowing section, and 8 is a high temperature blowing section. , 9 is a ventilation control unit, 10 is a memory tester driver unit, 11 is a memory tester comparison unit, 12 is a memory tester control unit, 13 is a control unit, 20 is a semiconductor IC such as a memory, 21 is a lead, 22 is a pogo pin, 23 Is a pin head, 24 is a spring, 25 is a socket pressing plate, 26 is a hole, 27 and 28 are valves, 29 is a pipe, 30 is a vent hole, and 31 is a dew condensation detection electrode.

  The handler hand unit 1 sucks a semiconductor IC to be tested contained in the tray unit 3 with a vacuum suction pad (not shown), and transfers it to the socket unit 4 for setting or setting to the socket unit 4 The semiconductor IC being tested is adsorbed and held outside the socket portion 4.

  The handler control unit 2 is a control unit that controls the operation of the handler hand unit 1 as described above.

  The tray unit 3 is a holder that holds a plurality of semiconductor ICs such as semiconductor memories to be tested.

  The socket portion 4 is set when the semiconductor IC 20 is tested, and is configured as shown in FIG.

  The socket holding plate 5 is set so that the lead 21 of the semiconductor IC 20 is accurately connected to the pin head 23 of the pogo pin 22 of the socket 4 when the semiconductor IC 20 is set in the socket 4 when testing the semiconductor IC 20. It is located above and pushes it down against the spring 24, and includes a cylinder (not shown), and moves the socket pressing plate 25 up and down by moving it up and down.

  The socket presser plate control unit 6 performs control when the socket presser plate 5 is moved up and down.

  The low-temperature air blower 7 performs low-temperature air blowing to cool the semiconductor IC to this temperature when the semiconductor IC is subjected to a low-temperature test at 0 ° C., for example.

  The high-temperature air blowing unit 8 performs high-temperature air blowing for heating the semiconductor IC to this temperature when the semiconductor IC is subjected to a high temperature test at, for example, 75 ° C.

  The air blowing control unit 9 controls the opening and closing of the valves 27 and 28 shown in FIG. 2 in order to control the air temperature from the low temperature air blowing unit 7 and the high temperature air blowing unit 8 or to control air blowing from one of them. It is. Instead of providing the valves 27 and 28, the activation of the low temperature blower 7 and the high temperature blower 8 can be selectively controlled.

  The memory tester driver unit 10 includes a test circuit for testing a semiconductor IC such as a semiconductor memory, and is connected to the socket unit 4. When the semiconductor IC is set in the socket section 4, test data is sent out. The memory tester driver unit 10 is provided with condensation detection means for detecting the presence of condensation on the semiconductor IC.

  For example, as shown in FIG. 3A, the dew condensation detection means is configured by connecting a protection diode D to one lead 21. As shown in FIG. 3B, the protective diode D outputs, for example, a voltage of about 0.3 V to 0.4 V when the voltage V is applied to the lead 21 in a non-condensing state. Since the voltage of the lead 21 drops to 0 V, the presence of condensation can be detected by detecting this with the memory tester comparison unit 11. The detection of condensation is not limited to this, and a commercially available condensation sensor may be used.

  The memory tester comparison unit 11 compares the test result of the semiconductor IC disposed in the socket unit 4 with a predetermined value held in advance, and determines whether the test result has passed or failed. In addition, the output of the protection diode is monitored to detect the presence of condensation.

  During the test, the memory tester control unit 12 controls the activation of the memory tester driver unit 10 and the memory tester comparison unit 11 to send necessary data for the test, and determines pass or fail from the test result and controls the result. The unit 13 is notified, or the presence of condensation is notified to the control unit 13.

  The control unit 13 comprehensively controls the test operation as shown in FIG. 4 from the start to the end of the test for the automatic machine configured as shown in FIG. 1 for testing the semiconductor IC. It is.

  The socket portion 4 is used to set a semiconductor IC 20 to be tested, and has a hole portion 26 into which the pogo pin 22 is inserted. The pogo pin 22 includes a pin head 23 that comes into contact with the lead 21 of the semiconductor IC 20 when a test is performed, and a spring 24 that imparts a displacement force that deviates the pogo pin 22 in the direction of the arrow in the state of FIG. . In the test, the semiconductor IC 20 is arranged on the tray portion 4, and when set in the state shown in FIG. 2 by the socket pressing plate 25, the lead 21 is configured to be connected to the pin head 23 of the pogo pin 22. .

  The socket pressing plate 25 is formed with a cylinder (not shown), and when the cylinder is driven downward, the socket pressing plate 25 moves the semiconductor IC 20 downward against the spring 24 to move the pin head 23 of the pogo pin 22. Is set so as to be connected to the lead 21.

  Ventilation holes 30 are formed in the socket pressing plate 25, and low temperature blowing or high temperature blowing is performed from the low temperature blowing unit 7 or the high temperature blowing unit 8. Further, the condensation detection electrode 31 is provided in the socket portion 4, and it is possible to detect early that the lead 21 and the case portion of the semiconductor IC 20 are short-circuited due to the occurrence of condensation by a decrease in the output voltage due to the short-circuit.

  The operation of the apparatus of the present invention shown in FIG. 1 will be described with reference to the other figures based on the flowchart shown in FIG.

  S1. At the start of the test of the semiconductor IC 20, in the automatic machine configured as shown in FIG. 1, the control unit 13 controls the hand control unit 2, and the handler hand unit 1 takes out the semiconductor IC 20 from the tray unit 3, which is a semiconductor IC tray. Then, it is transported to the socket part 4 to be tested.

  S2. After transporting the semiconductor IC 20 to a predetermined position of the socket unit 4, the control unit 13 controls the socket pressing plate control unit 6 and presses it with the socket pressing plate 5 from directly above the socket unit 4. As a result, as shown in FIG. 2, the semiconductor IC 20 is set in the socket portion 4 so that the lead 21 of the semiconductor IC 20 correctly contacts the pin head 23 of the pogo pin 22.

  S3. Then, the control unit 13 controls the air blowing control unit 9 to operate the low temperature air blowing unit 7, opens the valve 27, closes the valve 28, and starts blowing air at, for example, 0 ° C.

  S4. Then, the control unit 13 controls the memory tester control unit 12, operates the memory tester driver unit 10 and the memory tester comparison unit 11, checks the contact state between the pin head 23 of the pogo pin and the lead 21, and performs this contact test. Check if there is a failure in. Also, check if condensation occurs due to low-temperature air blowing. The check result is detected by the memory tester control unit 12 and notified to the control unit 13.

  S5. If it is detected by this check that a contact failure has occurred or the presence of dew condensation, the control unit 13 controls the air blowing control unit 9 and closes the valve 27 on the low temperature air blowing unit 7 side to the socket unit 4. Stop the low temperature air flow.

  S6. The control unit 13 then controls the socket pressing plate control unit 6, and the socket pressing plate control unit 6 controls the socket pressing plate unit 5 to raise the socket pressing plate 25 directly above the socket unit 4.

  S7. Then, the control unit 13 controls the handler control unit 2 to take out the semiconductor IC 20 of the socket unit 4 with respect to the handler hand unit 1 and keep it in a state of being held by the hand, for example, by vacuum suction.

  S8. Next, the control unit 13 controls the socket pressing plate control unit 6 to move the socket pressing plate 25 downward from right above the socket unit 4 without the semiconductor 1C 20 to press the socket unit 4 without the semiconductor IC 20.

  S9. The control unit 13 controls the air blowing control unit 9 to open the valve 28, operates the high temperature air blowing unit 8, and starts high temperature air blowing to the socket unit 4. This high temperature blast continues for a certain period of time, for example, 3 minutes during which the detected condensation can be dried.

  S10. The control unit 13 controls the handler control unit 2 to transport the semiconductor IC 20 held by the handler hand unit 1 to the socket unit 4.

  S11. The control unit 13 controls the socket pressing plate control unit 6 and presses the semiconductor IC 20 with the socket pressing plate 25 by the socket pressing plate unit 5. Thereby, even when a failure occurs in the contact test, the connection state can be improved.

  S12. The control unit 13 controls the air blowing control unit 9 to close the valve 28, open the valve 27, operate the low temperature air blowing unit 7, and restart low temperature air blowing to the socket unit 4. Then, the process returns to step S4.

  S13. If no failure occurs and no condensation occurs in S4, the control unit 13 controls the memory tester control unit 12 to perform electrical tests such as a DC test, a function test, and an access test.

  S14. If the memory tester control unit 12 determines that the test result is good or not based on the comparison result of the memory tester comparison unit 11, this is notified to the control unit 13, and the control unit 13 notifies the handler control unit 2 and the socket pressing plate. An instruction to eject the semiconductor IC set in the socket unit 4 is sent to the control unit 6.

  S15. As a result, the socket pressing plate 25 moves upward, and the handler hand unit 1 sucks and holds the rejected semiconductor IC with the hand and transfers it to the discharge unit.

  S16. This time, a high temperature test is performed on the good low temperature test. Therefore, the control unit 13 opens the valve 28, closes the valve 27, and operates the high temperature blowing unit 8 with respect to the blowing control unit 9. As a result, high-temperature air is sent to the socket portion 4. In this state, an electrical test similar to S13 is performed.

  S17. The rejected semiconductor IC whose test result is not good is discharged in the same manner as in S15.

  S18. If the test result is good, the control unit 13 stops blowing air to the socket unit 4.

  S19. Then, the socket pressing plate 25 is moved directly above the socket portion 4.

  S20. The control unit 13 controls the handler control unit 2 so that the handler hand unit 1 of the automatic machine sucks the semiconductor IC of the socket unit 4 and takes it out of the socket unit 4 and transports it to the tray that stores the accepted product.

  In this way, one cycle test of the automatic machine is completed.

  As a result, the presence of condensation is detected in a very small amount, and it can be automatically removed by high-temperature air blowing, so the test operation can be performed even without an operator, so it is automatically tested even at night. It can be operated and the driving effect can be enhanced.

  In addition, the early detection of dew condensation is possible, so that deterioration of pogo pins used in the socket can be prevented.

  In the above description, an example of a memory as a semiconductor device has been described, but the present invention is not limited to this.

1 is an embodiment of the present invention. It is test state explanatory drawing of this invention. It is a dew condensation sensor explanatory drawing. It is operation | movement explanatory drawing of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Handler hand part 2 Handler control part 3 Tray part 4 Socket part 5 Socket presser plate part 6 Socket presser board control part 7 Low temperature air blower part 8 High temperature air blower part 9 Air blower control part 10 Memory tester driver part 11 Memory tester comparison part 12 Memory tester Control unit 13 Control unit

Claims (1)

A hand unit for moving a semiconductor device under test to be tested to a predetermined position;
A socket holding plate in which the case of the semiconductor device under test is pressed against the socket portion and a hole for blowing is formed;
Socket pressing plate control means for controlling movement of the socket pressing plate;
A low temperature blower for blowing low temperature air to the semiconductor device under test;
A high temperature blower for blowing high temperature air to the semiconductor device under test;
A blower control means for switching and controlling the low temperature blower and the high temperature blower,
Or operation test of the tested semiconductor device, a test driver means causes detecting dew condensation occurring in the socket portion,
A tester comparing means for comparing the test result with a judgment value expected in advance to determine whether the test result is good or bad ;
Condensation detection means for detecting the condensation of the socket part ,
Wherein upon detection of the dew condensation of the socket part by condensation detecting means, said blower control means stops the cold air blowing, the socket retainer plate control means to control the movement of the said socket retainer plate upward, the hand unit under test Take out the semiconductor device from the socket part and hold it, move the socket pressing plate downward from above the socket part, perform high-temperature air blowing from the high-temperature air blowing part to control the drying, and then hold it by the hand part A semiconductor test apparatus with condensation removal, wherein the semiconductor device to be tested is transported to a socket portion, blown again at a low temperature to perform a low temperature test, and a high temperature test is performed on the semiconductor device to be tested that has passed the test.

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