JP2016024511A - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveying apparatus whose operation can be stopped to perform prescribed work during operation thereof that accompanies cooling of electronic components, and then resumed in a shorter period of time, and to provide an electronic component inspection apparatus.SOLUTION: An electronic component conveying apparatus includes a cooling/heating member which allows electronic components to be placed and can either be cooled or heated at least, and a manipulation unit which allows for selecting a first operating mode in which cooling of the cooling/heating member is stopped, or a second operating mode in which cooling of the cooling/heating member is stopped and the cooling/heating member is heated. The cooling/heating member preferably has at least either of a conveying unit for conveying electronic components and a placement unit for placing electronic components.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device.

  Such an IC device inspection may be performed by cooling the IC device to a predetermined temperature. In that case, the IC device is cooled by cooling the arrangement member on which the IC device is arranged, and the humidity of the atmosphere around the arrangement member (humidity in the apparatus) is set so as not to cause condensation or icing (icing). ).

  Also, in the electronic component transport device, for example, when a jam occurs or when condensation or icing occurs on the arrangement member, the operation of the electronic component transport device is temporarily stopped to eliminate the jam. It is necessary to remove condensation and icing. When jam, condensation, icing, or the like occurs, the operator presses a predetermined operation button to temporarily stop the operation of the electronic component transport device and perform a predetermined operation.

  In the conventional electronic component transport apparatus, when the operation button is pressed, the operation is stopped and the processing described below is performed.

  First, the electronic component transport device stops cooling the placement member, starts heating the placement member, and waits until the temperature reaches room temperature. Thereby, when dew condensation or icing has occurred on the arrangement member, it is removed. The electronic component transport device waits until the internal oxygen concentration becomes a sufficient concentration, and then unlocks the door lock. The operator opens the door, and when condensation or icing has occurred, confirms that the condensation or icing has been removed. In addition, when a jam has occurred, the operator moves the IC device to an appropriate position.

  When the work is finished, the worker presses the operation start button. Thereby, the electronic component transport device stops heating the arrangement member, waits for a predetermined time, and starts cooling the arrangement member when the internal humidity sufficiently decreases. Then, the electronic component transport device waits until the temperature of the arrangement member becomes sufficiently low, and then starts (resumes) the operation.

Japanese Patent Laid-Open No. 11-11802

  However, in the conventional electronic component transport apparatus, when the predetermined operation button is pressed, the temperature of the arrangement member is uniformly returned to the room temperature regardless of whether jamming is eliminated or condensation or icing is removed. When removing condensation or icing, it is necessary to return the temperature of the arrangement member to room temperature. However, when removing jamming, it is not necessary to return the temperature of the arrangement member to room temperature. For this reason, in the conventional electronic component transport apparatus, when the jam is eliminated, it is necessary to take time until the temperature of the placement member is returned to room temperature, which is not necessary, and the temperature of the placement member is set to a predetermined temperature after the work is finished. It takes a long time to cool to temperature.

  Note that Patent Document 1 describes the contents related to resumption of automatic operation when the substrate processing apparatus automatically stops during automatic operation. However, Patent Document 1 cannot solve the conventional problems. .

  An object of the present invention is to provide an electronic component transport apparatus capable of shortening the time required to stop an operation and restart an operation from a state in which the electronic component is cooled while performing a predetermined work. An electronic component inspection apparatus is provided.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
The electronic component transport device of the present invention is capable of arranging electronic components, at least a cooling heating member capable of either cooling or heating,
A first operation mode for stopping cooling of the cooling / heating member, and an operation unit capable of selecting a second operation mode for stopping cooling of the cooling / heating member and heating the cooling / heating member. Features.

  In this way, when the operation of the electronic component transport device that is operating while cooling the cooling and heating member is temporarily stopped, for example, when removing jamming, removing condensation or icing, etc., removing jamming When heating such as is not required, the time from when the cooling and heating member is being operated to the time when the operation is stopped, the operation is performed, and the operation is resumed by selecting the first operation mode. Can be shortened.

[Application Example 2]
In the electronic component conveying apparatus of the present invention, it is preferable that the cooling heating member has at least one of a conveying unit that conveys the electronic component and an arrangement unit that arranges the electronic component.

  As a result, the first operation mode is selected when heating is not required, for example, when removing jams, removing condensation or icing, etc. in the transport unit and arrangement unit, or when removing jams, etc. Accordingly, it is possible to shorten the time from the state of operating while cooling the transport unit and the arrangement unit until the operation is stopped, the operation is performed, and the operation is restarted.

[Application Example 3]
In the electronic component transport apparatus of the present invention, it is preferable that the first operation mode is selected when the electronic component is not disposed at a predetermined position.

  As a result, when the electronic component is not arranged at the predetermined position, when the electronic component is arranged at the predetermined position, the operation is stopped from the state in which the cooling heating member is operating while being cooled. , It is possible to shorten the time until the work is performed and the operation is resumed.

[Application Example 4]
In the electronic component transport apparatus according to the present invention, it is preferable that the first operation mode is selected when a member disposed in the electronic component transport apparatus is adjusted.

  As a result, when adjusting the members arranged inside the electronic component conveying device, the time from when the cooling and heating member is operating while cooling is stopped, the operation is performed, and the operation is restarted. It can be shortened.

[Application Example 5]
In the electronic component conveying apparatus of the present invention, it is preferable that the second operation mode is selected when the cooling and heating member is condensed or frozen.

  Thus, condensation and icing can be removed by selecting the second operation mode.

[Application Example 6]
In the electronic component transport device of the present invention, in the second operation mode, when the cooling heating member is frozen, the energy for heating the cooling heating member is less than the cooling heating member when the cooling heating member is condensed. It is preferable that it is larger than the energy to heat.
Thereby, dew condensation and icing can be removed efficiently.

[Application Example 7]
In the electronic component transport device of the present invention, the operation unit selects a display for selecting the first operation mode and the second operation mode, and selects the first operation mode and the second operation mode. It is preferable to have a touch panel that can be used for input.

  Thereby, the first operation mode and the second operation mode can be easily selected.

[Application Example 8]
In the electronic component transport device of the present invention, the operation unit includes a display unit capable of displaying for selecting the first operation mode and the second operation mode,
It is preferable to include an input unit capable of inputting for selecting the first operation mode and the second operation mode.

  Thereby, the first operation mode and the second operation mode can be easily selected.

[Application Example 9]
In the electronic component transport device according to the aspect of the invention, it is preferable that the display position for selecting the first operation mode is above the display position for selecting the second operation mode.

  This makes it possible to easily and quickly select the first operation mode that is frequently used.

[Application Example 10]
The electronic component inspection apparatus of the present invention can arrange electronic components, and at least a cooling heating member capable of either cooling or heating,
An operation unit capable of selecting a first operation mode for stopping cooling of the cooling and heating member and a second operation mode for stopping cooling of the cooling and heating member and heating the cooling and heating member;
An inspection unit for inspecting the electronic component.

  In this way, when the operation of the electronic component inspection apparatus operating while cooling the cooling / heating member is temporarily stopped, for example, when removing jamming, removing condensation or icing, etc., removing jamming When heating such as is not required, the time from when the cooling and heating member is being operated to the time when the operation is stopped, the operation is performed, and the operation is resumed by selecting the first operation mode. Can be shortened.

[Application Example 11]
In the electronic component inspection apparatus of the present invention, the cooling heating member includes a transport unit that transports the electronic component,
An arrangement part for arranging the electronic component;
A holding unit for holding the electronic component when inspecting the electronic component;
It is preferable to have at least one of an abutting portion for bringing the electronic component into contact with the holding portion.

  As a result, in the transport unit, arrangement unit, holding unit, and contact unit, for example, when removing jams, removing condensation or icing, etc. By selecting the operation mode 1, the time until the operation is stopped, the operation is performed, and the operation is resumed from the state in which the conveyance unit, the arrangement unit, the holding unit, and the contact unit are cooled is operated. It can be shortened.

It is a schematic plan view which shows embodiment of the electronic component inspection apparatus of this invention. It is a block diagram of the electronic component inspection apparatus shown in FIG. It is a figure which shows the display screen of the display part of the electronic component inspection apparatus shown in FIG. It is a flowchart which shows the control operation of the electronic component inspection apparatus shown in FIG. It is a flowchart which shows the control operation of the electronic component inspection apparatus shown in FIG. It is a flowchart which shows the control operation of the electronic component inspection apparatus shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<Embodiment>
FIG. 1 is a schematic plan view showing an embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. FIG. 3 is a diagram showing a display screen of the display unit of the electronic component inspection apparatus shown in FIG. 4 to 6 are flowcharts showing the control operation of the electronic component inspection apparatus shown in FIG.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. The direction of the arrow of each axis of the X axis, the Y axis, and the Z axis is referred to as a plus side, and the direction opposite to the arrow is referred to as a minus side. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component transport apparatus that transports the IC device 90 in each region and has the control unit 80, the inspection unit 16 that performs inspection in the inspection region A3, and the inspection control unit (not shown). It has become. In the inspection apparatus 1, an electronic component transport apparatus is configured by a configuration excluding the inspection unit 16 and the inspection control unit.

  The tray supply area A1 is an area to which a tray 200 in which a plurality of IC devices 90 in an uninspected state are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjustment unit (soak plate) 12, a device transport head (transport member) 13, and a tray transport mechanism 15 which are placement units for placing the IC device 90 are provided.

  The temperature adjustment unit 12 is an apparatus that heats or cools the plurality of IC devices 90 to adjust (control) the IC devices 90 to a temperature suitable for inspection. That is, the temperature adjustment unit 12 is a cooling and heating member that can arrange the IC device 90 and can perform at least one of cooling and heating of the IC device 90. In the configuration shown in FIG. 1, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 that has been carried in (conveyed) from the tray supply region A1 by the tray transport mechanism 11A is transported to and placed on one of the temperature adjustment units 12.

  The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90. The device transport head 13 has a plurality of gripping portions (not shown) that grip the IC device 90. Each gripping portion includes a suction nozzle and grips the IC device 90 by suction.

  The tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state where all the IC devices 90 are removed in the X direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, which is an electronic component transfer unit that transfers the IC device 90, an inspection unit 16, a device transfer head (contact portion) 17, and a device recovery unit (recovery) Shuttle) 18 is provided.

  The device supply unit 14 is a device that conveys the temperature-adjusted (temperature-controlled) IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. The In the device supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. In other words, the device supply unit 14 is a cooling and heating member on which the IC device 90 can be disposed and at least one of cooling and heating of the IC device 90 is possible.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, that is, a holding unit that holds the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in a storage unit of an inspection control unit provided in a tester (not shown) connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection. In other words, the inspection unit 16 is a cooling and heating member that can arrange the IC device 90 and can perform at least one of cooling and heating of the IC device 90.

  The device transport head 17 is supported so as to be movable in the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16. When inspecting the IC device 90, the device transport head 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16. Thereby, as described above, the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected. The device transport head 17 has a plurality of gripping portions (not shown) that grip the IC device 90. Each gripping portion includes a suction nozzle and grips the IC device 90 by suction. In the device transport head 17, similarly to the temperature adjusting unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. That is, the device transport head 17 is a cooling / heating member that can arrange the IC device 90 and can cool and / or heat the IC device 90.

  The device collection unit 18 is an apparatus that conveys the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 1, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 includes any one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area where the IC device 90 that has been inspected is collected. In the collection area A4, a collection tray 19, a device transport head (transport member) 20, and a tray transport mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 1, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. The device transport head 20 has a plurality of gripping portions (not shown) that grip the IC device 90, and each gripping portion includes a suction nozzle and grips the IC device 90 by suction.

  The tray transport mechanism 21 is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The test control unit of the tester, for example, inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a storage unit (not shown).

  Further, the control unit 80 includes, for example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the temperature adjustment unit 12, the first device transport head 13, the device supply unit 14, and the third supply unit. Tray transport mechanism 15, inspection unit 16, second device transport head 17, device collection unit 18, third device transport head 20, sixth tray transport mechanism 21, and fourth tray transport mechanism The drive of each part of 22A and the 5th tray conveyance mechanism 22B is controlled.

  Further, the inspection device 1 is configured so that a gas such as low humidity air or nitrogen (hereinafter also referred to as dry air) can be flowed (supplied) to each predetermined part. When the IC device 90 is cooled to a predetermined temperature and inspected, each necessary part is cooled accordingly, but by supplying dry air to each necessary part, condensation and icing (freezing) can be prevented. . In the present embodiment, the dry air flows through the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device collection unit 18.

  Further, as described above, in this embodiment, the IC device 90 is in contact with the IC device 90 as a cooling heating member capable of at least one of cooling and heating, the temperature adjustment unit 12, the device supply unit 14, the inspection. In the following description, the case where the temperature adjustment unit 12 is a cooling and heating member will be described as a representative, and the device supply unit 14, the inspection unit 16, and the device transport head 17 will be described. Is a cooling and heating member, which is the same as in the case of the temperature adjustment unit 12, and therefore the description thereof is omitted.

  As shown in FIG. 2, the inspection apparatus 1 heats the temperature sensor 41 that detects the temperature, the humidity sensor 42 that detects the humidity, the oxygen concentration sensor 43 that detects the oxygen concentration, and the temperature adjustment unit 12. A heating mechanism 51, a cooling mechanism 52 that cools the temperature adjustment unit 12, a dry air supply mechanism 53 that supplies dry air to a predetermined portion inside the inspection apparatus 1, and an operation unit 6 that performs each operation of the inspection apparatus 1. And have. The temperature sensor 41, the humidity sensor 42, and the oxygen concentration sensor 43 are respectively disposed at predetermined positions inside the inspection apparatus 1. The temperature sensor 41, the humidity sensor 42, and the oxygen concentration sensor 43 respectively provide the inspection apparatus. The temperature, humidity and oxygen concentration inside 1 can be detected.

  The operation unit 6 includes an input unit 61 that performs each input and a display unit 62 that displays an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. In addition, some or all of the operation buttons displayed on the display unit 62 may be provided as mechanical operation buttons such as push buttons. The operation unit 6 is not limited to this, and examples include a device such as a touch panel that can input and display an image.

  Moreover, it does not specifically limit as the heating mechanism 51, For example, a heater etc. are mentioned. In addition, the cooling mechanism 52 is not particularly limited, and examples thereof include a device that cools by flowing a refrigerant (for example, a low-temperature gas) through a tube disposed in the vicinity of the object to be cooled, a Peltier element, and the like. In the present embodiment, the cooling mechanism 52 uses a device that cools the coolant by flowing it into a tube disposed in the vicinity of the object to be cooled, and uses nitrogen gas obtained by vaporizing liquid nitrogen as the coolant. To do.

  Further, in this embodiment, the dry air used in the dry air supply mechanism 53 is a mixed gas of nitrogen gas after use in the cooling mechanism 52 and air with low humidity when cooled by the cooling mechanism 52. When the cooling is stopped, only the low humidity air is used. For this reason, the oxygen concentration inside the inspection apparatus 1 is low when cooling by the cooling mechanism 52, and increases when the cooling is stopped.

  This inspection device 1 has a first operation mode (LN2 stop mode) and a second operation mode (defrosting mode) as an operation mode (maintenance mode). The two operation modes can be selectively set.

  In the first operation mode and the second operation mode, when the IC device 90 is cooled and the IC device 90 is inspected, that is, the temperature adjustment unit (cooling heating member) 12 of the inspection apparatus 1 is cooled, In the case where the inside of the inspection apparatus 1 is operated while dehumidifying, the operation mode is set when the operation of the inspection apparatus 1 is temporarily stopped and a predetermined work such as maintenance is performed. The first operation mode and the second operation mode can be selected by an operator (operator) by operating the input unit 61 of the operation unit 6.

  In the first operation mode, for example, when a jam occurs and an operation for eliminating the jam is performed, or when a predetermined member arranged in the inspection apparatus 1 is adjusted, the temperature of the temperature adjustment unit 12 is temporarily set. Selected when there is no need to return to room temperature.

  The jam is, for example, that the IC device 90 is not arranged at a predetermined position (appropriate position).

  Further, as the adjustment of the predetermined member, for example, the position, posture, light receiving sensitivity, etc. of the optical sensor that has a light emitting part and a light receiving part and detects whether or not the IC device 90 is arranged in the temperature adjusting part 12 Adjustment, adjustment of the gripping force (adsorption force) of the gripping portion of the device transport head 13, and the like.

  In the first operation mode, the cooling of the temperature adjustment unit 12 of the inspection apparatus 1 is temporarily stopped, but the process of returning the temperature of the temperature adjustment unit 12 to room temperature is not performed.

  Further, the second operation mode is selected, for example, when condensation or icing (icing) occurs in the inspection apparatus 1, for example, the temperature adjusting unit 12, and the condensation or icing is removed. In the second operation mode, the cooling of the temperature adjustment unit 12 of the inspection apparatus 1 is temporarily stopped, the temperature adjustment unit 12 of the inspection apparatus 1 is heated, and the temperature of the temperature adjustment unit 12 is temporarily set to room temperature. Perform processing to return. Thereby, the dew condensation and icing are removed.

Next, the control operation of the inspection apparatus 1 will be described.
In this embodiment, the operator's operation on the operation unit 6 is performed by, for example, operating the input unit 61, moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking) In the following, this operation is also referred to as “pressing the operation button”. In addition, as described above, the case where the temperature adjustment unit 12 is a cooling heating member will be described as a representative. When the device supply unit 14, the inspection unit 16, and the device transport head 17 are cooling heating members, respectively, Since it is the same as that of the adjustment part 12, the description is abbreviate | omitted.

  As shown in FIGS. 4 to 6, the inspection apparatus 1 operates while cooling the temperature adjusting unit 12 with the cooling mechanism 52 and supplying dry air with the dry air supply mechanism 53 under the control of the control unit 80. Yes. Note that the temperature t cooled by the cooling mechanism 52 is a temperature t1. Moreover, the door of the inspection apparatus 1 is locked. First, the control unit 80 determines whether or not to stop the operation during this operation (step S101).

  As described above, for example, when a jam occurs and an operation for eliminating the jam is performed, or when a predetermined member arranged in the inspection apparatus 1 is adjusted, dew condensation or When icing occurs and the condensation or icing is removed, the operation stop button is pressed to temporarily stop the operation of the inspection apparatus 1.

  In step S101, when the operation stop button is pressed, it is determined to stop the operation.

  In addition, as described above, the temperature adjustment unit 12 is provided with an optical sensor (not shown) that detects the IC device 90. This optical sensor detects whether or not the IC device 90 transported from the tray 200 to the temperature adjustment unit 12 by the device transport head 13 is disposed in the temperature adjustment unit 12. If the IC device 90 is not detected, it is determined that a jam has occurred, and it is determined in step S101 that the operation is stopped. Thus, even when the operator does not press the operation stop button, it may be determined to stop the operation.

  If it is determined in step S101 that the operation is to be stopped, the operations of the device transport heads 13, 17, 20, the device supply unit 14, the device collection unit 18, the tray transport mechanisms 11A, 11B, 15, 21, 22A, 22B, etc. Is stopped (step S102). However, the cooling of the temperature adjusting unit 12 by the cooling mechanism 52 and the supply of dry air by the dry air supply mechanism 53 are continued without stopping.

Next, the image shown in FIG. 3 is displayed on the display unit 62 (step S103).
The image shown in FIG. 3 has a display for selecting the first operation mode and the second operation mode. Specifically, first, “stopped” is displayed on the upper left in FIG. 3 of the screen 621 of the display unit 62. Further, in the rectangular frame 622 in the center of the screen 621, a first operation mode selection button 623 described as “LN2 stop mode” and a second operation mode selection button 624 described as “defrosting mode” are displayed. And a cancel button 625 in which “Cancel” is described.

  When input is performed by operating the input unit 61 and the first operation mode selection button 623 is pressed, the first operation mode is selected and the operation mode is set to the first operation mode.

  Also, when the input unit 61 is operated to input and the second operation mode selection button 624 is pressed, the second operation mode is selected and the operation mode is set to the second operation mode.

  Further, when input is performed by operating the input unit 61 and the cancel button 625 is pressed, cancel is selected, the operation mode is not set to either the first operation mode or the second operation mode, and the display unit The image 62 is changed to another image in which none of the first operation mode selection button 623, the second operation mode selection button 624, and the cancel button 625 is displayed.

  Here, the first operation mode selection button 623 and the second operation mode selection button 624 are arranged side by side in the vertical direction (vertical direction in FIG. 3). Further, the first operation mode selection button 623 is arranged above the second operation mode selection button 624 in the vertical direction. That is, the display position for selecting the first operation mode is vertically above the display position for selecting the second operation mode. The position of the operation button is easier to operate in the upper direction than in the lower direction in the vertical direction, and the first operation mode is used more frequently than the second operation mode. By disposing the second operation mode selection button 624 vertically above the first operation mode selection button 624, the first operation mode selection button 623 for selecting the first operation mode that is frequently used can be easily and quickly operated. .

  Further, the first operation mode selection button 623 may be displayed with emphasis over the second operation mode selection button 624. Thereby, the position of the first operation mode selection button 623 can be grasped easily and quickly. Examples of the highlighting include increasing the size (size) and increasing the luminance. That is, the size of the first operation mode selection button 623 is made larger than the size of the second operation mode selection button 624, and the luminance of the first operation mode selection button 623 is set to the second operation mode selection button 624. For example, it may be higher than the luminance.

  Next, it is determined whether or not the first operation mode has been selected (step S104). If it is determined that the first operation mode has been selected, the operation mode is set to the first operation mode, and the process proceeds to step S107. Transition.

  If it is determined in step S104 that the first operation mode is not selected, it is determined whether or not the second operation mode is selected (step S105), and it is determined that the second operation mode is selected. In this case, the operation mode is set to the second operation mode, and the process proceeds to step S120.

  If it is determined in step S105 that the second operation mode is not selected, it is determined whether or not cancel is selected (step S106). If it is determined that cancel is selected, the first operation mode is set. Without setting any of the operation mode and the second operation mode, the image on the display unit 62 is changed to a predetermined image, and the process proceeds to the next step. The description of the subsequent operation is omitted.

  If it is determined in step S106 that cancellation is not selected, the process returns to step S104, and step S104 and subsequent steps are executed again.

  When the operation mode is set to the first operation mode, first, the driving of the cooling mechanism 52 is stopped, and the cooling of the temperature adjusting unit 12 is stopped (step S107). Thereby, the dry air supplied by the dry air supply mechanism 53 is only air with low humidity, and the oxygen concentration inside the inspection apparatus 1 increases.

  Next, the oxygen concentration sensor 43 detects the oxygen concentration a inside the inspection apparatus 1 (step S108), determines whether the oxygen concentration a is equal to or higher than the threshold value α (step S109), and the oxygen concentration a is equal to the threshold value α. If it is determined that the above is not the case, the process returns to step S108, and step S108 and subsequent steps are executed again.

  If it is determined in step S109 that the oxygen concentration a is equal to or greater than the threshold value α, the door of the inspection apparatus 1 is unlocked (step S110). Thereby, the oxygen deficient state inside the inspection apparatus 1 is eliminated, and the inside work can be performed. An operator opens a door and performs a predetermined operation. Further, after the work is completed, the worker presses the operation start button.

  The threshold value α is not particularly limited and is appropriately set according to various conditions, but is preferably set within a range of 16% or more and 20% or less, and is preferably 17% or more and 19% or less. More preferably, it is set within the range. Next, it is determined whether or not the operation start button has been pressed (step S111). If it is determined that the operation start button has been pressed, the current temperature is detected by the temperature sensor 41 (step S112) and the humidity sensor 42 is used. The current humidity RH is detected (step S113).

Next, the relative humidity RHS is obtained (step S114).
The calculation method of the relative humidity RHS in step S114 is not particularly limited, and examples thereof include the following method.

  First, using the following (formula 1), based on the temperature detected in step S112 and the humidity RH detected in step S113, the amount of water vapor M contained in the current gas inside the inspection apparatus 1 is calculated. Calculate.

  Water vapor amount M = (saturated water vapor amount MN at current temperature) × (humidity RH / 100) (Equation 1)

  Note that the saturated water vapor amount MN and the saturated water vapor amount ML at a predetermined temperature t1, which will be described later, are obtained from a calibration curve such as a table or an arithmetic expression stored in advance in the storage unit of the control unit 80, for example.

  Next, the relative humidity RHS when cooled to the predetermined temperature t1 is calculated using the following (Formula 2).

  Relative humidity RHS = (water vapor amount M / saturated water vapor amount ML at a predetermined temperature t1) × 100 (Equation 2)

  Theoretically, when the temperature is cooled to the predetermined temperature t1, condensation or icing occurs if the relative humidity RHS is 100%, and no condensation or icing occurs if the relative humidity RHS is less than 100%.

  Next, it is determined whether or not the relative humidity RHS is less than or equal to the threshold value β (step S115). If it is determined that the relative humidity RHS is not less than or equal to the threshold value β, the process returns to step S112, and step S112 and subsequent steps are executed again. .

  If it is determined in step S115 that the relative humidity RHS is equal to or less than the threshold value β, the cooling mechanism 52 is driven to start cooling the temperature adjusting unit 12 (step S116). As a result, it is possible to prevent dew condensation or icing from occurring when cooling to a predetermined temperature t1.

  The threshold value β is not particularly limited as long as it does not cause condensation or icing when cooled to the temperature t1, and is appropriately set according to various conditions, but is 50% or more and less than 100%. It is preferably set within the range, more preferably set within the range of 80% or more and less than 100%, and further preferably set within the range of 80% or more and 90% or less.

  Next, the temperature t inside the inspection apparatus 1 is detected by the temperature sensor 41 (step S117), and it is determined whether or not the temperature t is equal to or lower than the temperature (threshold) t1 (step S118), and the temperature t is equal to or lower than the temperature t1. If it is determined that it is not, the process returns to step S117, and step S117 and subsequent steps are executed again. In the first operation mode, since the temperature adjusting unit 12 is not heated as in the second operation mode described later, the time for the temperature t to be equal to or lower than the temperature t1 is shorter than that in the second operation mode. Can be shortened.

  When it is determined in step S118 that the temperature t is equal to or lower than the temperature t1, the door is locked, the device transport heads 13, 17, 20, the device supply unit 14, the device collection unit 18, and the tray transport mechanisms 11A, 11B. , 15, 21, 22A, 22B, etc. are started (restarted) (step S119), and the process proceeds to the next step. The description of the subsequent operation is omitted.

  Next, the case where the operation mode is set to the second operation mode will be described, but the description of matters similar to those in the first operation mode will be omitted.

  When the operation mode is set to the second operation mode, first, the driving of the cooling mechanism 52 is stopped, and the cooling of the temperature adjusting unit 12 is stopped (step S120). Thereby, the dry air supplied by the dry air supply mechanism 53 is only air with low humidity, and the oxygen concentration inside the inspection apparatus 1 increases.

  Next, the heating mechanism 51 is driven to start heating the temperature adjustment unit 12 (step S121). As a result, the temperature inside the inspection apparatus 1 rises along with the temperature of the temperature adjustment unit 12. As a result, when condensation or icing has occurred in the temperature adjustment unit 12, the condensation or icing is removed.

  Here, it is preferable to change the energy for heating the temperature adjustment unit 12 between the case where the temperature adjustment unit 12 is condensed and the case where the temperature adjustment unit 12 is frozen. That is, it is preferable that the energy for heating the temperature adjustment unit 12 when the temperature adjustment unit 12 is frozen is larger than the energy for heating the temperature adjustment unit 12 when the temperature adjustment unit 12 is condensed. Thereby, dew condensation and icing can be removed efficiently.

  Next, the oxygen concentration a in the inspection apparatus 1 is detected by the oxygen concentration sensor 43 (step S122), and it is determined whether or not the oxygen concentration a is equal to or higher than the threshold value α (step S123). If it is determined that the above is not the case, the process returns to step S122, and step S122 and subsequent steps are executed again.

  If it is determined in step S123 that the oxygen concentration a is equal to or higher than the threshold value α, the temperature t inside the inspection apparatus 1 is detected by the temperature sensor 41 (step S124). Thereby, the oxygen deficient state inside the inspection apparatus 1 is eliminated, and the inside work can be performed.

  Next, it is determined whether or not the temperature t is equal to or higher than the temperature (threshold) t2 (step S125). If it is determined that the temperature t is not equal to or higher than the temperature t2, the process returns to step S124, and step S124 and subsequent steps are executed again. To do.

  If it is determined in step S125 that the temperature t is equal to or higher than the temperature t2, the door of the inspection apparatus 1 is unlocked (step S126). An operator opens a door and performs a predetermined operation. In addition, when the condensation or icing has occurred in the temperature adjustment unit 12, the operator confirms that the dew condensation or icing has been removed. The worker presses the operation start button after the work is completed.

  The temperature t2 is not particularly limited and is appropriately set according to various conditions, but is preferably set within a range of 25 ° C. or more and 35 ° C. or less, and is 27 ° C. or more and 33 ° C. More preferably, it is set within the lower range.

  Next, it is determined whether or not the operation start button has been pressed (step S127). If it is determined that the operation start button has been pressed, the driving of the heating mechanism 51 is stopped and the heating of the temperature adjustment unit 12 is stopped ( Step S128).

  Next, the current temperature is detected by the temperature sensor 41 (step S129), the current humidity RH is detected by the humidity sensor 42 (step S130), and the relative humidity RHS is obtained (step S131). In addition, the calculation method of the relative humidity RHS in step S131 is not specifically limited, For example, it is the same as that of said step S114.

  Next, it is determined whether or not the relative humidity RHS is equal to or less than the threshold value β (step S132). If it is determined that the relative humidity RHS is not equal to or less than the threshold value β, the process returns to step S129, and step S129 and subsequent steps are executed again. .

  If it is determined in step S132 that the relative humidity RHS is equal to or less than the threshold value β, the cooling mechanism 52 is driven to start cooling the temperature adjustment unit 12 (step S133). As a result, it is possible to prevent dew condensation or icing from occurring when cooling to a predetermined temperature t1.

  Next, the temperature t inside the inspection apparatus 1 is detected by the temperature sensor 41 (step S134), it is determined whether the temperature t is equal to or lower than the temperature (threshold) t1 (step S135), and the temperature t is equal to or lower than the temperature t1. If it is determined that it is not, the process returns to step S134, and step S134 and subsequent steps are executed again.

  When it is determined in step S135 that the temperature t is equal to or lower than the temperature t1, the door is locked, the device transport heads 13, 17, 20, the device supply unit 14, the device collection unit 18, and the tray transport mechanisms 11A and 11B. , 15, 21, 22A, 22B, etc. are started (restarted) (step S136), and the process proceeds to the next step. The description of the subsequent operation is omitted.

  As described above, according to the inspection apparatus 1, the operation of the inspection apparatus 1 that is operating while cooling the temperature adjusting unit 12 is temporarily stopped, for example, an operation for removing a jam, In the case of adjusting a predetermined member arranged inside, removing condensation or icing, etc., when heating is not required, such as when removing jam or adjusting a predetermined member, the first operation mode By selecting, it is possible to shorten the time from the state in which the temperature adjusting unit 12 is operating while being cooled to the time when the operation is stopped, the operation is performed, and the operation is restarted.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part has the same function. Any configuration can be substituted. Moreover, other arbitrary components may be added.

  Moreover, in the said embodiment, although the cooling heating member in an electronic component inspection apparatus is the temperature adjustment part 12, the device supply part 14, the test | inspection part 16, and the device conveyance head 17, in this invention, it is not restricted to this, For example, Any one, two, or three of the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device transport head 17 may be used.

1 ... Inspection equipment (electronic parts inspection equipment)
11A, 11B ...... Tray transport mechanism 12 ... Temperature adjuster (soak plate)
13 …… Device transport head 14 …… Device supply unit (supply shuttle)
15 …… Tray transport mechanism 16 …… Inspection unit 17 …… Device transport head 18 …… Device recovery unit (recovery shuttle)
19 ... Recovery tray 20 ... Device transfer head 21 ... Tray transfer mechanism 22A, 22B ... Tray transfer mechanism 41 ... Temperature sensor 42 ... Humidity sensor 43 ... Oxygen concentration sensor 51 ... Heating mechanism 52 ... Cooling mechanism 53 …… Dry air supply mechanism 6 …… Operation section 61 …… Input section 62 …… Display section 621 …… Screen 622 …… Frame 623 …… First operation mode selection button 624 …… Second operation mode Selection button 625 …… Cancel button 80 …… Control unit 90 …… IC device 200 …… Tray A1 …… Tray supply area A2 …… Device supply area (supply area)
A3: Inspection area A4: Device collection area (collection area)
A5 …… Tray removal area S101 to S136 …… Step

Claims (11)

A cooling and heating member capable of disposing electronic components and capable of at least cooling or heating; and
A first operation mode for stopping cooling of the cooling / heating member, and an operation unit capable of selecting a second operation mode for stopping cooling of the cooling / heating member and heating the cooling / heating member. An electronic component conveying device.   The electronic component conveying apparatus according to claim 1, wherein the cooling and heating member has at least one of a conveying unit that conveys the electronic component and an arrangement unit that arranges the electronic component.   3. The electronic component conveying apparatus according to claim 1, wherein the first operation mode is selected when the electronic component is not arranged at a predetermined position.   4. The electronic component transport apparatus according to claim 1, wherein the first operation mode is selected when a member disposed inside the electronic component transport apparatus is adjusted. 5.   5. The electronic component conveying apparatus according to claim 1, wherein the second operation mode is selected when the cooling and heating member is condensed or frozen.   The energy for heating the cooling heating member when the cooling heating member is frozen in the second operation mode is greater than the energy for heating the cooling heating member when the cooling heating member is condensed. 6. The electronic component conveying apparatus according to any one of items 5 to 5.   The operation unit is a touch panel capable of a display for selecting the first operation mode and the second operation mode and an input for selecting the first operation mode and the second operation mode. The electronic component conveying apparatus according to claim 1, comprising: The operation unit includes a display unit capable of displaying for selecting the first operation mode and the second operation mode;
The electronic component conveying apparatus according to claim 1, further comprising an input unit capable of inputting to select the first operation mode and the second operation mode.   The electronic component transport apparatus according to claim 7 or 8, wherein a display position for selecting the first operation mode is vertically above a display position for selecting the second operation mode. A cooling and heating member capable of disposing electronic components and capable of at least cooling or heating; and
An operation unit capable of selecting a first operation mode for stopping cooling of the cooling and heating member and a second operation mode for stopping cooling of the cooling and heating member and heating the cooling and heating member;
An electronic component inspection apparatus comprising: an inspection unit that inspects the electronic component. The cooling and heating member includes a transport unit that transports the electronic component;
An arrangement part for arranging the electronic component;
A holding unit for holding the electronic component when inspecting the electronic component;
The electronic component inspection apparatus according to claim 10, comprising at least one of a contact portion that causes the electronic component to contact the holding portion.

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