JP5161335B2 - Substrate transport apparatus and substrate processing apparatus provided with the same - Google Patents

Substrate transport apparatus and substrate processing apparatus provided with the same Download PDF

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JP5161335B2
JP5161335B2 JP2011084845A JP2011084845A JP5161335B2 JP 5161335 B2 JP5161335 B2 JP 5161335B2 JP 2011084845 A JP2011084845 A JP 2011084845A JP 2011084845 A JP2011084845 A JP 2011084845A JP 5161335 B2 JP5161335 B2 JP 5161335B2
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robot arm
substrate
substrates
stage
robot
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JP2012222087A (en
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勤 西尾
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中外炉工業株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Description

  The present invention makes it possible to make the temperature history of each substrate the same even when a plurality of substrates are transported by one robot arm at a time, thereby preventing temperature unevenness between the substrates. In addition, the present invention relates to a substrate transport apparatus that can uniformly finish a plurality of substrates and that can perform transport quickly, and a substrate processing apparatus including the substrate transport apparatus.

  In a processing facility that performs a drying process or a heat treatment while transporting various substrates, various proposals have been made in order to prevent unevenness in processing. For example, the “resist liquid coating treatment apparatus” of Patent Document 1 aims to provide a resist liquid coating treatment apparatus that can eliminate contact transfer unevenness and drying unevenness caused by contact between the back surface of the substrate and other members, A vacuum dryer for drying a substrate coated with a resist solution under reduced pressure, a baking device for heating the vacuum-dried substrate to solidify the resist solution, and a substrate between the vacuum dryer and the baking device. It is a resist solution application processing apparatus provided with the conveyance robot which conveys. The transfer robot has a transfer hand that supports the substrate placed on the lower side, a hand main body, a heat insulating portion that insulates between the substrate and the hand main body, and a thermal conductivity that is higher than that of the heat insulating portion. And a hand surface portion having protrusions that support the substrate and are made of a high material.

JP 2008-166623 A

  The substrate includes a large and thick substrate used for a plasma display panel, and a small and extremely thin substrate used for a touch panel of a mobile terminal (for example, a smartphone).

  In the case of mass production, a glass substrate for a plasma display panel employs a technique of processing a large size such as about 2 m × 2 m and then cutting it to a necessary small size. In contrast, glass substrates for touch panels are pursued to be lightweight so as to be portable, and the thickness is about 0.2 mm compared to about 2 mm for plasma display panels. For this reason, the strength is weak, and unlike a glass substrate for a plasma display panel, it is difficult to handle in a large size.

  Therefore, in order to efficiently mass-produce glass substrates for portable terminals, it is required to simultaneously convey and process a plurality of thin glass substrates. In consideration of automation of equipment in mass production, it is preferable to use a robot arm for the transfer work, as in the case of handling a glass substrate for a plasma display panel.

  When transporting a plurality of glass substrates at one time with a single robot arm, there is a problem that unevenness may occur in various processes performed on the glass substrate.

  Specifically, when a plurality of glass substrates that have been heat-treated on a heating stage in a high-temperature atmosphere are handled by a single robot arm, the robot arm is usually in a normal temperature state and is heated in a high-temperature atmosphere to receive the glass substrate. It is heated when it enters the stage. The distal end side of the robot arm that enters the heating stage in advance is warmed at an early timing and starts to rise in temperature, and then the proximal end side that enters later and enters is heated at a later timing and starts to rise in temperature.

  If the robot arm receives multiple glass substrates at the same time, even though the robot arm's distal end and proximal end have different temperatures, the distal end glass substrate will be placed on the proximal end of the robot arm. The glass substrate on the side will be transferred to the robot arm part where the temperature is low, and there will be a difference in temperature history between the glass substrate on the front end side and the base end side, resulting in an uneven finish. It was.

  In that case, if the glass substrate is delivered after waiting for the temperature of the entire robot arm to converge to a certain temperature, there is a problem that it takes time to carry.

  The present invention was devised in view of the above conventional problems, and even when a plurality of substrates are transported by one robot arm at a time, the temperature history of each substrate can be made the same. In addition, it is possible to prevent the occurrence of temperature unevenness between the substrates, to uniformly finish a plurality of substrates, and to carry the substrate quickly, and a substrate processing apparatus including the substrate conveying device. The purpose is to provide.

A substrate transfer apparatus according to the present invention is provided with a heating stage provided in a production line, and enters under the raised substrate on the heating stage , receives the substrate by being lowered, and then moves backward. the substrate and a robotic arm that can be moved horizontally to convey to the next stage and, the robot arm is, between its leading end side and the proximal side, enters prior to heating stage A substrate transfer apparatus having a habit of heating at a later timing than the distal end side and entering the base end side, and a plurality of the substrates are placed on the heating stage along the moving direction of the robot arm. Te and arranged in series, in the heating stage is increased to lift these substrates at the same height, and these substrates provided with lifting means for lowering to pass to the robot arm In order to transfer the plurality of substrates to the robot arm at the same temperature in the process of raising the temperature of the robot arm, the transfer of these substrates to the robot arm is performed first on the tip side of the robot arm and It is characterized by comprising timing adjusting means for performing later on the base end side.

In order to individually lift and transfer each of the plurality of substrates , a plurality of the lifting means are provided so that they can be raised and lowered individually, and the timing adjusting means is located on the tip side of the robot arm. Rather, it is a lifting / lowering means control device that slowly lowers the lifting / lowering means located on the base end side of the robot arm.

  The timing adjustment means gradually moves the robot arm from the proximal upper surface to the distal upper surface in order to separate the proximal upper surface of the robot arm from the substrate rather than the distal upper surface of the robot arm. It is an inclined surface provided to be inclined so as to be higher.

  The robot arm has a habit of flexing so that the inclined surface is approximately horizontal with the weight when all the substrates are mounted.

  A substrate processing apparatus according to the present invention includes the above-described substrate transfer device, and handles two substrates as a set, and handles the two substrates transferred by the first handling robot. A coating stage that performs coating processing in one set, a vacuum drying stage that performs vacuum drying processing on a set of two substrates conveyed from the coating stage by the first handling robot, and vacuum drying processing in the vacuum drying stage A second handling robot for handling and transporting the substrate after being processed in pairs, and heating for firing the pair of substrates transported from the vacuum drying stage by the second handling robot. Cooling is performed on a heating stage that performs processing and a set of two substrates that are transported from the heating stage by the second handling robot. Characterized in that it is composed of a cooling stage for performing sense.

  In the substrate transfer apparatus and the substrate processing apparatus including the substrate transfer apparatus according to the present invention, even when a plurality of substrates are transferred by one robot arm at a time, the temperature history of each substrate is made the same. In addition, it is possible to prevent the occurrence of temperature unevenness between the substrates, and it is possible to finish a plurality of substrates uniformly and to carry them quickly.

It is the schematic which shows the structure of the manufacturing line of the processing apparatus of the board | substrate which equips the board | substrate conveyance apparatus which concerns on this invention, and processes a thin glass substrate. It is explanatory drawing explaining the arrangement | sequence of the several board | substrate delivered to the robot arm with which the board | substrate conveyance apparatus which concerns on this invention is equipped. It is 1st Embodiment of the board | substrate conveyance apparatus which concerns on this invention, Comprising: It is explanatory drawing explaining the procedure in which a robot arm receives a several board | substrate. It is 2nd Embodiment of the conveyance apparatus of the board | substrate which concerns on this invention, Comprising: It is explanatory drawing explaining the procedure in which a robot arm receives a several board | substrate. It is the schematic which shows the structure of the other manufacturing line of the board | substrate processing apparatus which equips the board | substrate conveyance apparatus which concerns on this invention, and processes a thin glass substrate.

  DESCRIPTION OF EMBODIMENTS Preferred embodiments of a substrate transfer device and a substrate processing apparatus including the same according to the present invention will be described below in detail with reference to the accompanying drawings. FIGS. 1 to 3 show a substrate transfer apparatus and a substrate processing apparatus including the substrate transfer apparatus according to the first embodiment.

  FIG. 1 is a schematic view showing a configuration of a production line 2 of a substrate processing apparatus for processing a thin glass substrate 1 provided with a substrate transfer device according to the first embodiment, and FIG. 2 shows the first embodiment. Explanatory drawing explaining the arrangement | sequence of the two glass substrates 1a and 1b delivered to the robot arm 3 with which this glass substrate conveying apparatus is equipped, FIG. 3 is equipped with the glass substrate conveying apparatus concerning 1st Embodiment. It is explanatory drawing explaining the procedure in which the robot arm 3 receives the two glass substrates 1a and 1b.

  The substrate processing apparatus production line 2 in FIG. 1 is provided so as to face the carry-in conveyor 4 for carrying in the glass substrates 1 for the touch panel type portable terminal one by one, and carried in by the carry-in conveyor 4. A coupling stage 5 that includes a pair of glass substrates 1 (1a, 1b), a first handling robot 6 that is provided facing the coupling stage 5 and handles the glass substrates 1 as a set; A coating stage 7 provided on the left side of the first handling robot 6 and coating the glass substrate 1 in pairs, and a coating stage 7 provided on the right side of the first handling robot 6 and applied on the coating stage 7. A vacuum drying stage 8 that vacuum-drys a set of glass substrates 1, and a vacuum drying stage 8. The glass substrate 1 is mounted in the same manner as the first handling robot 6. A second handling robot 9 handled in a set and a pair of glass substrates 1 provided on the opposite side of the vacuum drying stage 8 across the second handling robot 9 and dried in the vacuum drying stage 8. The heating stage 10 for performing the heat treatment for firing and the second handling robot 9 are provided so as to perform the cooling process on the pair of glass substrates 1 and at the same time the pair of glass substrates. 1 includes a cooling / separation stage 11 for separating the handling of each sheet one by one, and a carry-out conveyor 12 that faces the cooling / separation stage 11 and carries the glass substrates 1 one by one.

  All stages 5, 7, 8, 10, 11 are basically provided with lifting means 13 for lifting and lifting the glass substrate 1 so that the glass substrate 1 can be handled by the handling robots 6, 9. (See FIG. 3B). The elevating means 13 moves up and down from the upper surfaces of the stages 5, 7, 8, 10, 11 and supports the glass substrate 1 (1 a, 1 b), and also elevates and descends into the stages 5, 7, 8, 10, 11. It is comprised from the drive part 13b which drives the pin 13a and the raising / lowering pin 13a up and down.

  The handling robots 6 and 9 are provided in a room temperature region, and basically enter the glass substrate 1 raised by the lifting / lowering means 13 and receive the glass substrate 1 from the lifting / lowering means 13 that descends, and then move backward. A robot arm 3 is provided that can move in the horizontal direction to transport the glass substrate 1 to the next stage (next process).

  The coupling stage 5 is provided with a belt conveyor (not shown) in an arrangement that does not hinder the operation of the elevating pins 13a. When two glass substrates 1 are loaded from the carry-in conveyor 4 one by one with the belt conveyor being empty, the coupling stage 5 enters a standby state for conveyance by the first handling robot 6.

  The cooling / separation stage 11 has a belt conveyor (not shown) in an arrangement that does not interfere with the operation of the elevating pins 13a in the same manner as the coupling stage 5 in order to separate the glass substrates 1 that are handled and processed in pairs. ) And the glass substrates 1 are carried out one by one to the carry-out conveyor 12 in a state where the two glass substrates 1 are placed on the belt conveyor. Wait for transportation.

  The handling robots 6 and 9 include a turntable 14, and the robot arm 3 is provided on the turntable 14. As the turntable 14 rotates, the orientation of the robot arm 3 is changed in all 360 ° directions. Further, as described above, the robot arm 3 is movable in the horizontal direction, and moves forward or backward toward each of the stages 5, 7, 8, 10, and 11 by a reciprocating motion in the front-rear direction. The glass substrate 1 is received from 5, 7, 8, 10 and transferred to the next stage 7, 8, 10, 11.

  The robot arm 3 includes a support portion 15 mounted on the turntable 14 and a plurality of forks 16, and a base end 16 b of the fork 16 whose tip 16 a protrudes like a cantilever is supported by the support portion 15. Is done. The robot arm 3, specifically the fork 16, is formed of a heat transfer material such as metal or carbon. The handling robots 6 and 9 perform the delivery operation of the glass substrate 1 according to the process timing of the production line 2 by an automatic control device (not shown).

  As shown in FIG. 2A, the two glass substrates 1a and 1b and the robot arm 3 that handles the glass substrates 1a and 1b in a lump are moved along the moving direction D of the robot arm 3 as shown in FIG. There are two methods: a method of arranging and handling them in series and a method of arranging and handling them in parallel in a direction perpendicular to the moving direction D of the robot arm 3 as shown in FIG.

  In the method of arranging in parallel, the weight balance of the glass substrates 1a and 1b received side by side is liable to be lost, causing vibrations and being unable to be transported appropriately. Therefore, in the first embodiment, the glass substrates 1a and 1b can be transferred to the robot arm 3 in a series arrangement that can stably handle the glass substrates 1a and 1b with respect to the parallel arrangement. In all stages 5, 7, 8, 10, and 11, the glass substrates 1a and 1b are set to be in a standby state for conveyance by the handling robots 6 and 9 in a serial arrangement. In the example of FIG. 2, a bending / extending arm 17 for horizontally moving the robot arm 3 provided on the support portion 15 is shown.

  The glass substrate transport apparatus according to the first embodiment is particularly preferably applied to transport of the glass substrates 1a and 1b from the heating stage 10 to the cooling / separation stage 11 as shown in FIG. The heating stage 10 is in a high temperature atmosphere when the glass substrates 1a and 1b are completely heated and the robot arm 3 of the second handling robot 9 unloads the glass substrates 1a and 1b. Instead of the turntable 14, the bending / extending arm 17 itself may be rotated 360 ° about the center 17 ′.

  The fork 16 of the robot arm 3 that enters the heating stage 10 and moves backward is formed of a heat transfer material, and enters the heating stage 10 in advance between the distal end 16a side and the proximal end 16b side of the fork 16. There is a habit of raising the temperature at a later timing on the proximal end 16b side entering after the distal end 16a side, or a situation in which the distal end 16a side is warmed first and the proximal end 16b side is later warmed.

  The heating stage 10 is provided with first and second lifting / lowering means 13. These two lifting / lowering means 13 individually drive the lifting / lowering pins 13a up / down, the lifting / lowering pins 13a ascend, individually lift the two glass substrates 1a and 1b to the same height, and descend to lower the glass. The substrates 1a and 1b are transferred to the robot arm 3.

  As described above, since the two glass substrates 1a and 1b are arranged side by side along the moving direction D of the robot arm 3, these two lifting means 13 are also adapted to the arrangement of the glass substrates 1a and 1b. Thus, the robot arms 3 are juxtaposed along the moving direction D. Of course, the other stages 5, 7, 8, and 11 may be provided with two lifting / lowering means 13 in the same manner as the heating stage 10.

  As the timing adjustment means, the two lifting means 13 of the heating stage 10 control the lowering timing of the lifting pins 13a and adjust the delivery timing of the glass substrates 1a and 1b to the robot arm 3. The lifting / lowering means control device 18 is connected.

  Specifically, the lifting / lowering means controller 18 lifts and lowers the second lifting / lowering means 13 positioned on the base end 16b side of the fork 16 with respect to the lifting / lowering pins 13a of the first lifting / lowering means 13 positioned on the distal end 16a side of the fork 16. The pin 13a is lowered slowly. In other words, the delivery timing of the glass substrates 1a and 1b to the robot arm 3 is advanced on the tip 16a side of the fork 16 (delivery is performed first) and delayed on the base end 16b side (delivery is performed later).

  When the robot arm 3 in the room temperature region moves to the heating stage 10 in a high temperature atmosphere and enters under the glass substrates 1a and 1b, the tip 16a side tends to warm up quickly and the base end 16b side tends to warm up slowly. In the process of increasing the temperature of the robot arm 3 due to the above, the delivery is accelerated on the distal end 16a side of the fork 16, and the proximal end 16b side is delivered at a later timing when the temperature on the proximal end 16b catches up with the temperature on the distal end 16a side. Thus, the two glass substrates 1a and 1b are transferred to the robot arm 3 at the same temperature.

  The delivery timing is set to a timing at which the temperature on the base end 16b side of the fork 16 becomes the same as the temperature on the tip end 16a side. The delivery timing is more specifically the heat transfer coefficient of the fork 16 and the two glass substrates 1a, Based on the distance of 1b, it can be easily obtained by conducting a test with an actual machine. Briefly, the delivery timing by the second lifting / lowering means 13 may be delayed by the time required for the robot arm 3 to reach the glass substrate 1a on the distal end 16a side from the glass substrate 1b on the proximal end 16b side.

  Next, the operation of the glass substrate transfer device according to the first embodiment will be described. The substrate processing apparatus for executing various processings on the glass substrate 1 is as described above (see FIG. 1).

  As shown in FIG. 3A, in the heating stage 10, a high temperature atmosphere remains after the heat treatment of the glass substrates 1a and 1b is completed. When the glass substrates 1a and 1b are transported from the heating stage 10 to the cooling / separation stage 11, the driving units 13b of the first and second elevating means 13 raise the elevating pins 13a as shown in FIG. The glass substrates 1a and 1b are lifted to the same height. The raising / lowering operation of the raising / lowering pin 13a may be the same timing, or may be different timing.

  Next, as shown in FIG. 3C, the robot arm 3 of the second handling robot 9 moves toward the heating stage 10 and enters under the glass substrates 1a and 1b from the front end 16a side. As shown in FIG. 3D, the movement is stopped under the glass substrates 1a and 1b from the distal end 16a side to the proximal end 16b side.

  At this time, the tip 16a side of the fork 16 that enters in advance starts to rise in temperature first, and the base end 16b side that goes in after and starts to rise in temperature later. Therefore, immediately after the fork 16 of the robot arm 3 enters under the glass substrates 1a and 1b, the temperature on the tip end 16a side is high and the temperature on the base end 16b side is low, and the temperature rises unevenly.

  In such a temperature rise process of the fork 16, the elevating means control device 18 is set with a timing at which the base end 16b side temperature catches up with the tip end 16a side temperature when the glass substrate 1a is delivered on the tip end 16a side, First, as shown in FIG. 3E, the lifting / lowering means control device 18 lowers the lifting pins 13a of the first lifting / lowering means 13 that lifts the glass substrate 1a located on the tip 16a side of the fork 16.

  Thereafter, at the timing when the base end 16b side becomes the same temperature as the tip end 16a side, as shown in FIG. 3 (f), the second elevating means 13 lifting the glass substrate 1b located on the base end 16b side of the fork 16 The raising / lowering pin 13a is lowered. As a result, the two glass substrates 1a and 1b are transferred to the fork 16 that has been heated to the same temperature on both the distal end 16a side and the proximal end 16b side.

  In the glass substrate transport apparatus and the substrate processing apparatus including the glass substrate transport apparatus according to the first embodiment described above, the temperature on the proximal end 16b side is set to the temperature on the distal end 16a side when the glass substrate 1a on the distal end 16a side is delivered. Even when the glass substrate 1b on the base end 16b side is delivered at the timing when the temperatures become equal and two glass substrates 1a and 1b are transported by one robot arm 3 at a time, each glass The temperature history of the substrates 1a and 1b can be made the same, temperature unevenness can be prevented between the glass substrates 1a and 1b, and the two glass substrates 1a and 1b can be finished uniformly. .

  In addition, when the fork 16 heated in the high temperature atmosphere of the heating stage 10 converges to the same constant temperature from the front end 16a to the base end 16b and then passes the glass substrates 1a and 1b, it takes time to carry. In the first embodiment, since the transfer can be performed in the process of increasing the temperature of the robot arm 3, the glass substrates 1a and 1b can be transported quickly, and high production efficiency can be ensured. .

  Furthermore, since the two glass substrates 1a and 1b are arranged side by side along the movement direction D of the robot arm 3, the robot arm 3 receives the glass substrates 1a and 1b more stably than in the case where they are arranged in parallel. Can be transported.

  FIG. 4 shows a second embodiment of the glass substrate transfer apparatus according to the present invention. In the second embodiment, instead of the first and second lifting / lowering means 13 operated individually, two lifting / lowering means 13 or two glass substrates 1a and 1b that are simultaneously operated are combined into a single lifting / lowering means 13. It is comprised so that it can handle.

  The timing adjusting means of the second embodiment is arranged so that the fork 16 has a base end in order to separate the top surface on the base end 16b side of the fork 16 from the glass substrates 1a and 1b rather than the top surface on the tip end 16a side of the fork 16 of the robot arm 3. An inclined surface 19 is provided which is inclined so as to gradually increase from the upper surface on the 16b side toward the upper surface on the tip 16a side.

  Thus, even if the raising / lowering pin 13a is simultaneously lowered by making the distance of the upper surface of the fork 16 with respect to the glass substrates 1a and 1b, that is, the receiving surface different from each other on the distal end 16a side and the proximal end 16b side, the glass substrates 1a and 1b are also lowered. The delivery timing can be made different. The inclination angle of the inclined surface 19 is such that the glass substrate 1b delivery on the base end 16b side is slower than the glass substrate 1a delivery on the distal end 16a side as described in the lifting means control device 18 of the first embodiment. Is set to be

  The fork 16 of the robot arm 3 has a cantilever shape as described above, and has a habitual material that bends so that the inclined surface 19 is approximately horizontal by the weight when the two glass substrates 1a and 1b are mounted. (See arrow X in FIG. 4).

  The operation of the glass substrate transfer apparatus and the substrate processing apparatus including the glass substrate transfer apparatus according to the second embodiment will be described. As shown in FIG. 4A, the glass substrates 1a and 1b are cooled from the heating stage 10 to the cooling / separation stage 11. When the sheet is conveyed, the driving unit 13b of the lifting / lowering means 13 raises the lifting / lowering pins 13a and lifts the glass substrates 1a and 1b to the same height. The robot arm 3 of the second handling robot 9 moves toward the heating stage 10, enters the glass substrate 1a, 1b from the tip 16a side, and extends from the tip 16a side to the base end 16b side to the glass substrate 1a. , 1b and stop moving.

  At this time, the tip 16a side of the fork 16 that enters in advance starts to rise in temperature first, and the base end 16b side that goes in after and starts to rise in temperature later. Therefore, immediately after the fork 16 enters under the glass substrates 1a and 1b, the temperature on the tip end 16a side is high and the temperature on the base end 16b side is low, so that the temperature rises unevenly. Further, the fork 16 of the robot arm 3 has an inclined surface 19 provided on the fork 16 so that the upper surface on the distal end 16a side is closer to the glass substrates 1a and 1b than the upper surface on the proximal end 16b side.

  Thereby, in the temperature rising process of the robot arm 3, the timing at which the base end 16b side temperature catches up with the tip end 16a side temperature when the glass substrate 1a is transferred on the tip end 16a side is set.

  Thereafter, the elevating pins 13a of the elevating means 13 lifting the two glass substrates 1a and 1b are lowered to simultaneously lower the two glass substrates 1a and 1b. 4B and 4C, the glass substrate 1a on the distal end 16a side is transferred to the robot arm 3 at an early timing, and the glass substrate 1b on the proximal end 16b side is transferred to the robot arm 3 at a later timing. Thus, the two glass substrates 1a and 1b are transferred to the robot arm 3 whose temperature is increased to the same temperature on both the distal end 16a side and the proximal end 16b side.

  Even in the second embodiment, it is a matter of course that the same operational effects as those of the first embodiment can be obtained. Particularly in the second embodiment, the two glass substrates 1a and 1b can be handled by the single lifting means 13, and the delivery timing can be adjusted simply by providing the inclined surface 19 on the fork 16. In addition to the simpler structure than the first embodiment, the present invention provides an excellent effect that timing control is also easy.

  In the second embodiment, since the lifting pins 13a supporting the two glass substrates 1a and 1b are lowered at the same time, when the robot arm 3 includes a lifting mechanism, the lifting pins 13a are not lowered. As a result, the robot arm 3 can be raised to complete the reception of the glass substrates 1a and 1b, and can be adapted to various controls.

  Further, since the fork 16 of the robot arm 3 has a habit of bending so that the inclined surface 19 becomes approximately horizontal by the weight when the two glass substrates 1a and 1b are mounted, the inclined surface 19 is provided. Even in this case, stable horizontal conveyance can be ensured.

  FIG. 5 shows another example of the production line of the substrate processing apparatus provided with the glass substrate transfer device according to the present embodiment.

  The manufacturing line 20 of the substrate processing apparatus in FIG. 5 is provided facing the loading turntable 21 for loading the glass substrates 1 for the touch panel type portable terminal one by one in different directions, and the loading turntable 21. The glass substrate 1 fed from the carry-in turntable 21 is carried in a pair, and a carry-in conveyor 22 is provided facing the carry-in conveyor 22. A first handling robot 24 for transporting to a staged coating stage 23; a coating stage 23 provided on the opposite side of the carry-in conveyor 22 across the first handling robot 24; The second handling roll is provided facing the coating stage 23 and transports the glass substrate 1 from the coating stage 23 to the next vacuum drying stage 25. A vacuum drying stage 25 that is provided on the opposite side of the coating stage 23 with the second handling robot 26 sandwiched between the vacuum drying stage 25 and a vacuum drying stage 25. And a third handling robot 28 for transporting the glass substrate 1 from the vacuum drying stage 25 to the next heating stage 27, and provided on the opposite side of the vacuum drying stage 25 across the third handling robot 28. A heating stage 27 that heat-treats the pair of glass substrates 1, a fourth handling robot 30 that is provided facing the heating stage 27 and transports the glass substrate 1 from the heating stage 27 to the next cooling stage 29; Cooling that is provided on the opposite side of the heating stage 27 across the handling robot 30 and that cools a set of two glass substrates 1 Stage 29 and facing the cooling stage 29, and the unloading conveyor 31 for unloading the glass substrates 1 in pairs, the unloading conveyor 31, and facing the unloading conveyor 31. It is comprised from the turntable 32 for carrying out changing and carrying out. Of course, as the first to fourth handling robots 24, 26, 28, 30 of the production line 20, the glass substrate transfer device according to the first or second embodiment can be suitably applied.

1, 1a, 1b Glass substrate 2, 20 Production line 3 Robot arm 4, 22 Carry-in conveyor 5, 7, 8, 11, 23, 25, 29 Stage 6, 9, 24, 26, 28, 30 Handling robot 10, 27 Heating stage 12, 31 Unloading conveyor 13 Lifting means 14, 21, 32 Turntable 15 Supporting part 16 Fork 16a Fork tip 16b Fork base end 17 Bending / extending arm 18 Lifting means control device 19 Inclined surface

Claims (5)

  1. The heating stage provided in the production line, and the substrate enters below the raised substrate on the heating stage , receives the substrate by being lowered, and then moves backward to transport the substrate to the next stage. and a robot arm movable in a horizontal direction, the robot arm is, between its leading end side and the proximal side, enters and trailing than the tip end entering prior to heating stage A substrate transfer device with a habit of heating the base end side at a late timing,
    On the heating stage, a plurality of the substrates are arranged in series along the moving direction of the robot arm,
    The heating stage is provided with elevating means that is raised to lift the substrates to the same height and lowered to pass the substrates to the robot arm,
    In order to transfer a plurality of the substrates to the robot arm at the same temperature in the process of increasing the temperature of the robot arm, the substrates are transferred to the robot arm first on the distal end side of the robot arm and the base end A substrate transfer apparatus comprising timing adjustment means for later processing on the side.
  2. A plurality of the lifting means are provided so that each of the plurality of substrates can be raised and lowered individually in order to individually lift and transfer the plurality of substrates .
    The said timing adjustment means is a raising / lowering means control apparatus which lowers | lowers the said raising / lowering means located in the base end side of the said robot arm late | slower than the said raising / lowering means located in the front end side of the said robot arm. Item 2. The substrate transfer apparatus according to Item 1.
  3.   The timing adjustment means gradually moves the robot arm from the proximal upper surface to the distal upper surface in order to separate the proximal upper surface of the robot arm from the substrate rather than the distal upper surface of the robot arm. The substrate transfer apparatus according to claim 1, wherein the substrate transfer apparatus is an inclined surface provided to be inclined so as to be higher.
  4.   4. The substrate transfer apparatus according to claim 3, wherein the robot arm has a habit of bending so that the inclined surface is approximately horizontal with a weight when all the substrates are mounted.
  5.   5. A first handling robot that includes the substrate transfer apparatus according to claim 1, handles the substrate in pairs, and transfers the substrate to be transferred by the first handling robot. A coating stage for coating a set of sheets, a vacuum drying stage for vacuum-drying a set of two substrates conveyed from the coating stage by the first handling robot, and vacuum drying at the vacuum drying stage A second handling robot that handles and transports the substrate after processing in pairs, and a pair of substrates transported from the vacuum drying stage by the second handling robot for firing. A cooling stage is applied to a heating stage for performing a heating process and a set of two substrates conveyed from the heating stage by the second handling robot. The substrate processing device, characterized in that it is composed of a cooling stage performing.
JP2011084845A 2011-04-06 2011-04-06 Substrate transport apparatus and substrate processing apparatus provided with the same Active JP5161335B2 (en)

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JP2011084845A JP5161335B2 (en) 2011-04-06 2011-04-06 Substrate transport apparatus and substrate processing apparatus provided with the same
TW101109055A TWI418502B (en) 2011-04-06 2012-03-16 Panel convey apparatus and panel processing system using the apparatus
KR1020120027613A KR101331626B1 (en) 2011-04-06 2012-03-19 Panel convey apparatus and panel processing system using the apparatus
CN2012100906055A CN102730416B (en) 2011-04-06 2012-03-30 Panel convey apparatus and panel processing system using apparatus

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JP2016024511A (en) * 2014-07-16 2016-02-08 セイコーエプソン株式会社 Electronic component conveying apparatus and electronic component inspection apparatus
CN104386489B (en) * 2014-09-10 2016-06-08 深圳市华星光电技术有限公司 Glass substrate transmission system and mechanical hand thereof
US9589825B2 (en) 2014-09-10 2017-03-07 Shenzhen China Star Optoelectronics Technology Co., Ltd Glass substrate transfer system and robot arm thereof
EP3238883A4 (en) * 2014-12-26 2018-10-10 Kawasaki Jukogyo Kabushiki Kaisha Robot
CN105799326B (en) * 2014-12-30 2018-11-20 深圳Tcl工业研究院有限公司 The ink ejecting method of ink-jet printer and ink-jet printer
KR101999838B1 (en) 2015-08-11 2019-07-15 삼성디스플레이 주식회사 Substrate processing system
CN108350572A (en) * 2015-09-22 2018-07-31 应用材料公司 The double base plate processing systems of large area
JP2018190939A (en) * 2017-05-11 2018-11-29 東京エレクトロン株式会社 Vacuum processing apparatus
TWI685059B (en) * 2018-12-11 2020-02-11 財團法人國家實驗研究院 Semiconductor reaction device and method
KR102108263B1 (en) * 2019-09-20 2020-05-11 삼성디스플레이 주식회사 Substrate processing system

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JP2002064132A (en) * 2000-08-22 2002-02-28 Tokyo Electron Ltd Delivery method of member to be treated, placement mechanism for the member and probing device
JP2003060004A (en) * 2001-08-20 2003-02-28 Yaskawa Electric Corp Robot hand
KR101198179B1 (en) * 2005-01-17 2012-11-16 삼성전자주식회사 Method for compensation static deflection of handling robot and apparatus thereof
JP4680657B2 (en) * 2005-04-08 2011-05-11 株式会社アルバック Substrate transfer system
JP2008166623A (en) * 2006-12-29 2008-07-17 Chugai Ro Co Ltd Resist solution application processing apparatus
JP4688004B2 (en) * 2008-04-22 2011-05-25 株式会社ダイフク Article conveying device
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TW201245023A (en) 2012-11-16
TWI418502B (en) 2013-12-11

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