TW201245023A - Panel convey apparatus and panel processing system using the apparatus - Google Patents

Panel convey apparatus and panel processing system using the apparatus Download PDF

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Publication number
TW201245023A
TW201245023A TW101109055A TW101109055A TW201245023A TW 201245023 A TW201245023 A TW 201245023A TW 101109055 A TW101109055 A TW 101109055A TW 101109055 A TW101109055 A TW 101109055A TW 201245023 A TW201245023 A TW 201245023A
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Taiwan
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substrate
end side
robot arm
substrates
base end
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TW101109055A
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Chinese (zh)
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TWI418502B (en
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Tsutomu Nisio
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Chugai Ro Kogyo Kaisha Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Robotics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

The invention provides a panel convey apparatus and a panel processing system using the apparatus which can finish up a plurality of panels uniformly by a prevention of uneven heat treatment and a procurement of same history in temperature among the panels and can accomplish a speedy conveyance. Two glass panels 1a, 1b are arranged in series along a moving direction of a robot arm 3 at a heat treatment stage 10, a lifting means is installed at the heat treatment stage for lifting the glass panels at the same height and descending them to deliver the glass panels to the robot arm, and a lifting means control device is provided for delivering the glass panels to a tip side 16a of the fork 16 in the robot arm in advance and the root side 16b afterward so that the robot arm can receive the glass panels at a time when the robot arm in total is in the same temperature during a rising process in temperature.

Description

201245023 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種基板之搬送裝置及具備其之基板之加 工裝置’即便於藉由一個機械臂一次搬送複數之基板之情形 時，亦可使各基板之溫度歷程相同，可防止基板彼此之間產 生溫度不均，可均勻地完成複數之基板，同時玎迅速地進行 搬送。 【先前技術】 一面搬送各種基板，一面進行乾燥處理或熱處理之處理設 備中，為防止處理中產生不均，而研究有各種提案。例如， 專利文獻1之「光阻液塗佈處理裝置」係以提供一種可去除 因基板背面與其他構件接觸而產生之接觸轉印不均、乾燥不 均之光阻缝佈處縣置作為課題，該級料佈處理裝置 包括：對表面塗佈有光阻液之基板進行減壓 壓乾燥 機、對上述經減壓乾燥之基板進行加熱而使上述光阻液固化 之供烤裝Γ及於減魏燥機與上述烘烤裝置之間搬送基板 的搬运機$人λ述搬喊器人中，以自下側載置之狀態支 反二送:械手係以層疊狀態配置有，手本 機械手本體之間隔熱-隔•及藉 由熱導率練上述隔熱部之材料構成且 _ 起的機械手表面部。 支持基板之六 [先前技術文獻] 101109055 4 201245023 [專利文獻] [專利文獻1]日本專利特開2008-166623號公報 【發明内容】 (發明所欲解決之問題） 基板中有用於電漿顯示面板之大型且較厚者，亦有用於攜 帶式終端（例如智慧型手機等）之觸控面板等之小型且極薄 者。 於大量生產之情形時，對於電漿顯示面板用之玻璃基板而 &，係採用對約2 mx2 m之大尺寸者施以加工處理後，切 取為必要之較小尺寸之方法。與此相對，觸控面板用之破續 基板為使攜帶性優異而追求輕便，其厚度相對於電漿顯示面 板用之約2 mm而為約0.2 mm之較薄者，因此強度較低， 與電漿顯示面板用之玻璃基板不同，難以以較大之尺寸操 作。 因此，為高效率地大量生產攜帶式終端用之玻璃基板，要 求同時地搬送複數之薄型之玻璃基板而進行處理。若考慮到 大量生產中之設備之自動化，則搬送作業較佳為與於操作電 漿顯示面板用之玻璃基板之情形時相同地利用機械臂。 於藉由一個機械臂一次搬送複數之玻璃基板之情形時，存 在對玻璃基板施加之各種處理有可能產生不均之問題。 具體而言，於藉由一個機械臂操作於高溫環境之加熱台經 加熱處理後之複數玻璃基板之情形時，機械臂通常為常溫狀 101109055 5 201245023 Ί且於為受取玻璃基板而進人高溫環境之加熱台之階段被 力”、、先進入加熱台之機械臂之前端側較早變熱而開始升 /孤其後’卩思後進入之機械臂之基端側較遲變熱而開始升溫。 若不在,¾、機械臂之前端側與基端側為不同之溫度，而使機 械#同時X取複數之玻璃基板，則成為使前端侧之玻璃基板 交付於’皿度之機械臂部分，而基端側之玻璃基板交付於 溫度較低之機械臂部分之情形，該等前端側與基端侧之玻璃 基板中之溫度歷程產生差值，從而存在加工不均勻之問題。 又’於此情形時’若特機械臂整體之溫度收敷於一定益 度後再交付朗基板，财在搬送頗費㈣之問題。 本發明係#於上《知之_研究㈣者，其目的在於捐 供-種基板之搬送裝置及具備其之基板之加工裝置，即便於 藉由-個频臂-讀送餘基板之情科，村使各基板 之溫度歷程相同，可防止基板彼此之間產生溫度不均，可均 勻地加工複數之基板，同時可迅速地進行搬送。 (解決問題之手段） 本發明之基板之搬送裝置，其具有機械臂，該機械臂係於 生產線所具備之加熱台，進入已上升之基板之下 板下降從而受取該基板，其後’後退而將該基:搬 操作台且可於水平方向移動，並且該機械臂具有在其前端側 與基端側之間，相較於先進人該加熱台之前端側，後進入之 基端側以較遲之時機升溫之習性；該基板之搬料置之特徵 101109055 6 201245023 ====_動方向—有 基_至相同之高度而^^；::將該等 機械臂，並且具備時機調整機構，其用以於上述機=上述 度上升過程中將複數之上述基板以相同之溫度交付至之溫 械臂，而使該等基板向該機 至錢 先進行且於基端側後進行。 4械臂之前端側 本發明之基板之搬送裝置之特徵在於：上述升 :複數個’以將該等基板各自昇起至相同之高度而使個:: 升且個別下降，從而交付至上述機械臂， _上 上述時機調整機構係升降機構控制裝置，以相較於、 述顧臂之前端側之上述升降機構，而使位於上:機= 基％側之上述升降機構較遲下降。 本發明之基板之搬狀置之舰纽：上料機調整機構 係相較於上述機械臂之前端側上面，使該機械臂之基端側上 面與上述基板隔離更遠，而於該機械臂設置有以自=側上 面朝前端側上面逐漸增高之方式傾斜之傾斜面。 本發明之基板之搬送裝置之贿在於：上述機 由搭载全部上述基板時之重量，而使上述傾斜—纽 水平之方式撓曲之習性。 1本發明之基板之加工裝置’其特徵在於具備上述之其板之 搬送裝置，且包括：第丨搬運機器人，其以2片作並 101109055 7 201245023 塗裝台，其對藉由該第1搬運機器人搬送之 上述基板^ 2片—組進行塗敷處理；真空乾燥台 上述第1搬運機器人自上述塗裝台搬 、于藉由 〜I Θ 一'組之卜；十[其 板進行真空乾燥處理；第2搬運機器盆、 ’土 、 Μ 2片一組操作 並於該真空乾燥台經真空乾燥處理後搬送 、' '、 见基板；加執 台，其對藉㈣第2搬運_人自上料空㈣台搬送之，，2 片一組之基板進行用於煅燒之加熱處 叹，令卻台，其對 藉由上述第2搬運機器人自上述加熱台搬送 片一組之上 述基板進行冷卻處理。 (發明效果） 之加工裝置，即 本發明之基板之搬送裝置及具備其之基板 便於藉由一個機械臂一次搬送複數之基板之情形時，亦可使 各基板之溫度歷程相同，可防止基板彼此之間產生w产不 均，可均勻地加工複數之基板，同時可迅速地進行搬送。 【實施方式】 以下參照隨附圖式，對本發明之基板之搬送裂置及具備其 之基板之加工裝置之較佳實施形態進行詳細說明。圖丨至圖 3表示第1實施形態之基板之搬送裝置及具備其之基板之加 工裝置。 圖1係表示具備第1實施形態之基板之搬送裝置，加工薄 型玻璃基板1之基板加工裝置之生產線2構成之概略圖，圖 2係說明交付至第1實施形態之玻璃基板之搬送裝置所具備 101109055 8 201245023 之機械臂3之2片玻璃基板la、lb之排列之說明圖，圖3 係說明第1實施形態之玻璃基板之搬送裝置所具備之機械 臂3受取2片玻璃基板la、lb之程序之說明圖。 圖1之基板之加工裝置之生產線2係由如下構件構成··搬 入輸送帶4,其將觸控面板式攜帶式終端用之破墙基板！逐 片搬入；輕合台5，其面對搬入輸送帶4、設置，將搬入輸送 帶4所搬入之玻璃基板1設為2片（la、lb)—組；第丨搬運 機器人6,其面對耦合台5設覃，以2片一組操作玻璃基板 1 ;塗裝台7，其設置於第1搬運機器人6之左側，對玻璃 基板1以2片一組進行塗敷處理；真空乾燥台8，其設置於 第1搬運機器人6之右侧，對於塗裝台7經塗敷處理之2 片一組之玻璃基板1埠行真空乾燥處理；第2搬運機器人 9’其面對真空乾燥台8設置，與第i搬運機器人6相同地 以2片一組操作玻璃基板丨；加熱台1〇，其挾持第2搬運機 器人9而設置於真空乾燥台8之相反側，對於真空乾燥台8 經乾燥處理之2片一組之玻璃基板1，施加用於煅燒之加熱 處理；冷卻.分離台11，其面對第2搬運機器人9設置，用 以對2片一組之玻璃基板1進行冷卻處理之同時，將2片一 組之破璃基板1之操作逐片分開；及，搬出輸送帶12，其 面對冷卻，分離台11設置，將玻璃基板1逐片搬出。 於全部操作台5、7、8、10、11中，主要設置有用以將玻 璃基板1昇起從而可以搬運機器人6、9操作玻璃基板1之 !〇Π〇9〇55 9 201245023 升降機構13(參照圖3(b))。升降機構13係由自操作台5、7 8、10、11之上面逐漸上升從而支持玻璃基板1〇a、丨…並 沒入操作台5、7、8、10、11之内部之升降銷13a，及上下 驅動升降銷13a之驅動部13b構成。 搬運機器人6、9設置於常溫域，主要具備藉由升降機構 13進入上升之玻璃基板1之下，並自下降之升降機構將 玻璃基板1受取，其後，後退而將玻璃基板1搬送至下一操 作台（下一步驟）且可於水平方向上移動之機械臂3。 耦合台5中、以不妨礙升降銷i3a之動作之配置，設置帶 式輸送機（未圖示）。耦合台5若以帶式輸送機上為空之狀 態，自搬入輸送帶4逐片搬入2片玻璃基板丨，則成為等待 第1搬運機器人6之搬送之狀態。 冷卻·分離台11中，為分開經以2片一组操作處理之玻 璃基板1，與耦合台5相同地，以不妨礙升降銷13a之動作 之配置，設置帶式輸送機（未圖示），以帶式輸送機上載有2 片玻璃基板1之狀態，將玻璃基板丨逐片搬出至搬出輸送帶 12，並以空之狀悲等待藉由第2搬運機器人9對玻璃基板i 之搬送。 搬運機器人6、9具備轉盤14，並於轉盤14上設置有機 械臂3。藉由轉盤14之旋轉，機械臂3之方向可以36〇。全 方位邊更。又’機械们如上所述，可於水平方向移動，藉 由前後方向之往返動作朝各操作台5、7、8、1〇、u進入或 \01109055 201245023 後退，從而自任一之操作台5 ^ ^ 7 8、w將玻璃基板1受取 而交付至下一刼作台7、8、1()、u。 機械臂3係由轉盤14上所;^β + 、斤乜载之支持部15與複數根又架 16構成，I ’、狀且前端16a a 办 J而1如向則突出之又架16之基端16b 係由支持部15所支持。機械们，具體而言叉架16係由金 屬或碳等傳熱材料形成。搬運機器人6、9係藉由自動控制 裝置（未圖示）’根據生產線2 又之步驟時機進行玻璃基板1之 交付動作。 關於2片、、且之麵基板la、lb與將其統—操作之機械 臂3’可認為有如圖2⑷所示，將2片玻璃基板卜μ 機械臂3 ^移_向D串列排列而配置操作之方法，與如 圖2(B)所示*機械臂3之移動方向d正交之方向並列排 列而配置操作之方法2種。 並列配置之方法中’橫向排列而使被受取之玻璃基板 la、lb易失去重量平衡，引起振動而無法正確地進行搬送。 因此，第1實施形態中，為可以相對於並列配置而可穩定地 操作玻璃基板la、lb之串列配置將玻璃基板la、lb交付至 機械臂3，而將於全部操作台5、7、8、10、11中之玻璃基 板la、lb，設定為以串列配置等待藉由搬運機器人6、9之 搬送之狀態。圖2之例中表示支持部15所設置之機械臂3 之水平移動用之屈伸臂17。 第1實施形態之玻璃基板之搬送裝置尤佳適用於如圖3 101109055 201245023 所示，自加熱台10至冷卻•分離台11之玻璃基板la、ib 之搬送。加熱台10在玻螭基板la、lb之加熱處理完成後， 以第2搬運機器人9之機械臂3將玻璃基板la、lb搬出之 P皆段中，為高溫環境。再者，亦可將屈伸臂17自身以中心 1T旋轉360°之構造代替轉盤14。 進入加熱台10並後退之機械臂3之又架16係由傳熱材料 而形成，且有於該叉架16之前端1如侧與基端1邰侧之間， 相較於先進入加熱台1〇之前端l6a側，後進入之基端 侧以較遲之時機升溫之習性，或前端16a側先變熱，基端 16b側隨後變熱之狀況。 加熱台10中設置有第1及第2升降機構13。該等2台升 降機構13個別地上下驅動升降銷13a，升降銷na上升從 而使2片玻璃基板la、lb各自個別地昇起至相同之高度， 並且下降從而將該等玻璃基板la、lb交付至機械臂3。 上所述，由於將2片玻璃基板la、lb沿機械臂3之移 動方向D排列配置，因此該等2台升降機構13 ,亦配合玻璃 基板la、lb之配置，而併設於沿機械臂3之移動方向β。 關於其他操作台5,7,8，u，當然亦可以與加熱台1〇相 同之樣態設置2台升降機構13。 加熱台10之2台升降機構13,係為控制該等之升降銷i3a 之下降時機’從而調I各玻璃幻反la、lb交付至機械臂3 之時機，連接有作為時機調整機構之升降機構控制裝置18。 101109055 12 201245023 具體而言，升降機構控制裝置18係相較於位於叉架16 之前端16a側之第丨升降機構13之升降銷13a，而使位於 叉架16之基端16b側之第2升降機構13之升降銷13a較遲 下降。換s之，係將玻璃基板la、lb交付至機械臂3之時 機，於叉架16之前端16a側較早進行（先進行交付）而於基 端16b側較遲進行(後進行交付）。 常溫域下之機械臂3由於移動至高溫環境之加熱台1〇從 而進入玻璃基板la、lb之下時，存在前端16a側較早變熱， 基端16b側較遲變熱之傾向，因此由高溫環境所導致之機械 臂3之溫度上升過程中，於叉架16之前端16&側較早進行 父付，於基端16b側，以基端16b側之溫度趕上前端16a 側之溫度之較遲之時機進行交付，從而將2片玻璃基板1&、 lb以相同之溫度交付至機械臂3。 交付時機設定為又架16之基端16b側之溫度變為與前端 16a側之溫度相同之時機，該交付時機詳細而言，可根據叉 架16之傳熱係數與2片玻璃基板la、lb之距離，藉由利用 實機實施試驗從而容易地求出。簡略而言，只要按照機械臂 3自基端16b側之玻璃基板lb到達前端16a侧之玻璃基板 la所需之時間，將第2升降機構13之交付時機推遲即可。 其次’對第1實施形態之玻璃基板之搬送裝置之作用進行 5兒明。對玻璃基板1實行各種加工處理之基板之加工装置係 如上所述（參照圖1)。 101109055 13 201245023 如圖3(a)所示之加熱台1〇中，玻璃基板u、沁之加熱處 理完成之後，有高溫環境氣體滯留。將玻璃基板la、沁自 加熱台10搬送至冷卻•分離台u之時，第丨及第2升降機 構13之各驅動部13b如圖3(b)所示，使升降銷Ua上升， 從而將玻璃基板la、lb昇起至相同之高度。升降銷i3a之 上升動作可為相同時機，亦可為不同時機。 其次，如圖3(c)所示，第2搬運機器人9之機械臂3朝加 熱台10移動’從而自前端〗6a側進入玻璃基板la、lb之下， 並如圖3(d)所示，自前端16a侧移動至基端16b側定位於 玻璃基板la、lb之下而停止移動。 此時，先進入之又架16之前端16a側先開始升溫，後進 入之基端16b側隨後以較遲之時機開始升溫。因此，於機械 臂3之叉架16剛進入玻璃基板la、比之下之時間點，前端 16a側之溫度較高而基端16b側之溫度較低，從而呈不均勻 之升溫狀態。 於又架16之此種溫度上升過程中，升降機構控制裝置18 中设定有基端16b側溫度趕上於前端16a側交付玻璃基板 la時之前端16a側溫度之時機，升降機構控制裝置18首先 如圖3⑷所示’使正昇起位於又架16之前端—側之玻璃 基板1a之第1升降機構13之升降銷13a下降。 其後，於基端16b側變為與前端他側溫度相同之時機， 如圖3_示，使正昇起位於叉架16之基端⑽側之玻璃 101109055 201245023 基板lb之第2升降機構13之升降銷13a下降。藉此’將2 片玻璃基板la、lb交付至前端16a側及基端1613側同時升 溫至相同之溫度之叉架16。 以上所說明之第1實施形態之玻璃基板之搬送裝置及具 備其之基板之加工裝置中，以基端16b侧之溫度變為與交付 前端16a侧之玻璃基板ia時之前端16a侧之溫度相等之時 機，交付基端16b側之玻璃基板lb，從而於一次以一個機 械臂3搬送2片玻璃基板la、lb之情形時，亦可使各玻璃 基板la、lb之溫度歷程相同，可防止玻璃基板la、lb彼此 之間產生溫度不均，可均勻地加工2片玻璃基板ia、ib。 又，若等在加熱台10之高溫環境下變熱之又架16，係自 前端1如至基端16b收斂至相同之一定溫度後再交付玻璃基 板la、lb，則搬送頗費時間，但第i實施形態中，由於; 於機械臂3之溫度上升輕巾進行交付，因此可迅速地進行 玻璃基板la、lb之搬送’從而可確保較高之生產效率仃 可 進而’由於將W麵基板la、W機械们之移動方 向D排列配置’因此與並列配置之情形相比，機械臂 穩定地受取玻璃基板la、lb而進行搬送。 圖4中示有本發明之玻璃基板之搬送震置之第2實 態。第2實施形態係由可同時地卫作之2台升_構= 可操作2片玻璃基板la、lb之單—之升降機構13，代2 別地工作之第1及第2升降機構13而構成。 101109055 15 201245023 第2實施形態之時機調整機構係由相較於機械臂〕之叉竿 16之前端16a側上面，使又架16之基端_側上面與玻璃 基板1a、lb隔離更遠，而於叉架16設置有以自基端咐 側上面朝前端16a側上面補增高之方式傾斜的傾斜面Η 而構成。 如此使前端16a側及基端16b側中，與玻璃基板ia、化 相對之又架16之上面，即’受取面之距離不同’藉此即便 使升_ 13a㈣下降，亦可使玻璃基板la、lb之交付時 機不同。相較於前端16a側之玻璃基板la之交付，於基端 ⑽側之破璃基板1b之交付仙上述第1實施形態之升降 機構控制裝置18巾所說明之較遲之時機進行 傾斜面19之傾斜角度。 °又疋 機械臂3之叉架16為如上所述之懸臂梁狀，且由藉由搭 载2片破螭基板la、lb時之重量而使傾斜面19以成為大致 水平之方式撓曲之習性之素材構成（參照圖4中箭頭X)。 右對第2實施形態之玻璃基板之搬送裝置及具備其之基 之力工裴置之作用進行說明，則如圖4(a)所示將玻璃基板 lb自加熱台1〇搬送至冷卻·分離台η之時，升降機 構13之驅動部13b使升降銷13a上升，將玻璃基板la、lb 昇起至相同之高度。第2搬運機器人9之機械臂3朝加熱台 1〇移動’從而自前端16a側進入玻璃基板la、lb之下，自 則^ 16a側移動至基端16b側，定位於玻璃基板la、lb之 101109055 201245023 下從而停止移動。 此時，先進入之又架16之前端16a側先開始升溫，後進 入之基端16b側隨後以較遲之時機開始升溫。因此，叉架 16剛進入玻璃基板la、lb之下之時間點，前端側之溫 度車又问而基端16b側之溫度較低，為不均勻之升溫狀態。 又，機械臂3之叉架16藉由設於其上之傾斜面19，使前端 16a側上面相較於基端16b側上面更接近玻璃基板ia、a。 藉此’於機械臂3之溫度上升過程中，設定基端16b側溫 度趕上於前端l6a側交付玻璃基板1&時之前端他側溫度 之時機。 其後，使正昇起2片玻璃基板ia、lb之升降機構13之升 降銷13a下降’從而使2片玻璃基板u、比同時下降。如 此’如圖4(b)、（c)所示，以較早之時機將前端…侧之玻璃 基板la交付至機械臂3，以較遲之時機將基端脱側之玻 璃基板lb交付至機械臂3，藉此，將2片玻璃基板1&、ib 父付至前端16a側及基端16b側同時升溫至相同之温度之機 械臂3。 上述第2實施形態當然亦具有與上述第1實施形態相同之 作用效果。尤其是於第2實施形態巾，可以單—之升降機構 13操作2片玻螭基板la、lb，並可以僅於叉架16設置傾斜 面19即可#雜讀之時機，故而發揮出與第丨實施形態相 比構造更簡單，並且時機控制亦更為容易之優異之作用效 101109055 17 201245023 果。 又，第2實施形態中為使正支持 升降銷13a同時下m …拉 降之樣態’因此在機械臂3具備升降機構 之情形時，可藉錢機姆3上升從衫核縣板^ 之受取，以代替升降銷…之下降，從而可應對多種控 制。 進而’由於機械臂3之又架16具有藉由搭载2片玻璃基 板la lb時之重I而使傾斜面19以成為大财平之方式挽 曲之習性’因此即使在設置有傾斜面19之情形時，亦可確 保穩定地水平搬送^ 圖5中示有具備本實施形態之玻璃基板之搬送裝置之基 板之加工裝置之生產線之另一例。 圖5之基板之加工裝置之生產線2〇係由如下構件構成： 搬入用轉盤21，其將觸控面板式攜帶式終端用之玻璃基板1 變更方向逐片搬入；搬入輸送帶22，其面對搬入用轉盤21 設置，將自該搬入用轉盤21搬入之玻璃基板丨以2片一组 搬入；第1搬運機器人24，其面對搬入輸送帶22設置，將 玻璃基板1以2片一組自搬入輸送帶22搬送至下一段之塗 裝台23;塗襞台23,其挾持第1搬運機器人24設置於搬入 輸送帶22之相反側，將玻璃基板1以2片一組進行塗敷處 理；第2搬運機器人26，其面對塗裝台23設置，將玻璃基 板1自塗裝台23搬送至下一段之真空乾燥台25;真空乾燥 101109055 18 201245023 台25 ’其挾持第2搬運機器人26設置於塗裝台23之相反 側，對2片一組之玻璃基板丨進行真空乾燥處理；第3搬運 機器人28，其面對真空乾燥台25設置，將玻璃基板1自真 空乾燥台25搬送至下一段之加熱台27 ;加熱台27，其挾持 第3搬運機器人28設置於真空乾燥台25之相反側，對2 片一組之玻璃基板1進行加熱處理；第4搬運機器人3〇， 其面對加熱台27設置’將玻璃基板1自加熱台27搬送至下 一段之冷卻台29 ;冷卻台29，其挾持第4搬運機器人30 设置於加熱台27之相反側’對2片一組之玻璃基板1進行 冷卻處理；搬出輸送帶31，其面對冷卻台29設置，將玻璃 基板1以2片一組搬出；搬出用轉盤32，其面對搬出輸送 帶31設置，將玻璃基板1逐片變更方向搬出。作為上述生 產線20之第1〜第4搬運機器人24，26，28，30，當然可 較佳地應用第1或第2實施形態之玻璃基板之搬送裝置。 【圖式簡單說明】 圖1係表示具備本發明之基板之搬送裝置，加工薄变之玻 璃基板之基板之加工裝置之生產線構成之概略圖。 圖2係對交付至本發明之基板之搬送裝置所具備之機械 臂之複數基板排列進行說明之說明圖。 圖3係對本發明之基板之搬送裝置之第1實施形態，即機 械臂受取複數基板之程序進行說明之說明圖。 圖4係對本發明之基板之搬送裝置之第2實施形態，即機 101109055 19 201245023 械臂受取複數基板之程序進行說明之說明圖。 圖5係表示具備本發明之基板之搬送裝置，加工薄型之玻 璃基板之基板之加工裝置之另一生產線之構成之概略圖。 【主要元件符號說明】 1、la、lb 玻璃基板 2、20 生產線 3 機械臂 4、22 搬入輸送帶 5 、 7 、 8 、 11 、 23 、 25 、 29 操作台 6 ' 9 ' 24 ' 26 ' 28 ' 30 搬運機器人 10、27 加熱台 12、31 搬出輸送帶 13 升降機構 14、21、32 轉盤 15 支持部 16 叉架 16a 叉架之前端 16b 叉架之基端 17 屈伸臂 18 升降機構控制裝置 19 傾斜面 101109055 20201245023 VI. OBJECT OF THE INVENTION: TECHNICAL FIELD The present invention relates to a substrate transfer apparatus and a processing apparatus for a substrate including the same, which can be performed even when a plurality of substrates are transported by one robot arm at a time. The temperature history of each of the substrates is the same, and temperature unevenness between the substrates can be prevented, and a plurality of substrates can be uniformly formed, and the substrates can be quickly transported. [Prior Art] In the processing equipment for performing drying treatment or heat treatment while transporting various substrates, various proposals have been made to prevent unevenness in processing. For example, the "photoresist coating processing apparatus" of Patent Document 1 provides a method for removing a photo-resistance cloth which is uneven in contact transfer and uneven drying due to contact between the back surface of the substrate and other members. The cloth processing apparatus of the present stage comprises: a pressure-reducing pressure dryer for a substrate coated with a photoresist liquid on the surface, and a baking device for heating the pressure-reduced liquid substrate by heating the pressure-reduced substrate; The transporter that transports the substrate between the WEI dryer and the above-mentioned baking device is placed in the state of being mounted from the lower side. The hand is placed in a stacked state, and the hand is placed. The mechanical watch face is composed of a material that is constructed by the material of the above-mentioned heat insulating portion by thermal conductivity between the main body of the robot. [Patent Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-166623 (Problem to be Solved by the Invention) The substrate is used for a plasma display panel. Large and thick, there are also small and extremely thin touch panels for portable terminals (such as smart phones). In the case of mass production, the glass substrate for a plasma display panel is processed by a process having a size of about 2 mx2 m and then cut to a necessary smaller size. On the other hand, the discontinuous substrate for a touch panel is light in weight and has a thickness of about 0.2 mm with respect to the plasma display panel, so that the thickness is low, and the strength is low. The glass substrate for the plasma display panel is different, and it is difficult to operate in a large size. Therefore, in order to efficiently mass-produce a glass substrate for a portable terminal, it is required to simultaneously transport a plurality of thin glass substrates for processing. In consideration of the automation of the equipment in mass production, it is preferable to use the robot arm in the same manner as in the case of operating the glass substrate for the plasma display panel. In the case where a plurality of glass substrates are transported at a time by one robot arm, there is a possibility that unevenness may occur in various processes applied to the glass substrate. Specifically, in the case of a plurality of glass substrates which are heated by a heating arm in a high temperature environment, the mechanical arm is usually at a normal temperature of 101109055 5 201245023 and is subjected to a high temperature environment for receiving the glass substrate. The stage of the heating stage is “forced”, and the front end side of the mechanical arm that first enters the heating stage heats up earlier and starts to rise/isolate. The base end side of the mechanical arm that enters after the thought is warmed up and starts to heat up. If it is not, the front end side and the base end side of the arm are different temperatures, and the glass substrate of the front side is delivered to the mechanical arm portion of the dish. When the glass substrate on the base end side is delivered to the lower arm portion, the temperature history in the front end side and the base end side of the glass substrate is different, so that there is a problem of uneven processing. In the case of the case, the temperature of the whole of the robot arm is applied to a certain degree of profit and then delivered to the substrate. The problem of the transfer is quite expensive (4). The present invention is based on the above-mentioned "Knowledge_Research (4), whose purpose is to donate - The substrate transfer device and the substrate processing device having the same, even if the temperature history of each substrate is the same by the frequency arm-reading substrate, the temperature of the substrates can be prevented from being generated. Each of the plurality of substrates can be processed uniformly and can be transported quickly. (Means for Solving the Problem) The substrate transfer device of the present invention has a mechanical arm that is attached to a heating table provided in the production line. The rising substrate lowers the plate to receive the substrate, and then 'reverses' the base: the transfer table and can move in the horizontal direction, and the mechanical arm has between the front end side and the base end side, as compared with The advanced person is the front side of the heating stage, and the base end side of the rear enters the habit of warming up at a later time; the characteristics of the substrate moving material 101109055 6 201245023 ====_ moving direction - having the base _ to the same height And ^^;:: the robot arms, and the timing adjustment mechanism for delivering the plurality of substrates to the thermostat arm at the same temperature during the above-mentioned machine-increasing process The substrate is transferred to the machine first and then to the base end side. 4 Arm front end The substrate transfer device of the present invention is characterized in that: the rise: a plurality of 'send each of the substrates to the same The height is increased by: and is lowered individually to be delivered to the above-mentioned robot arm, and the above-mentioned timing adjustment mechanism is a lifting mechanism control device, which is located above the lifting mechanism of the front end side of the arm The above-mentioned lifting mechanism of the machine-base side is lowered at a later time. The ship-loading mechanism of the substrate of the present invention: the loading mechanism of the loading machine is compared with the upper end side of the mechanical arm, and the base end of the mechanical arm is made. The side of the side is further separated from the substrate, and the arm is provided with an inclined surface that is inclined so as to gradually increase from the upper side toward the front end side. The bribe of the substrate transporting device of the present invention is: The weight of the above-mentioned substrate is the habit of flexing the above-described tilt-new level. A substrate processing apparatus according to the present invention is characterized by comprising the above-described board conveying apparatus, and comprising: a second transport robot, which is formed by two sheets and 101109055 7 201245023, and the first transport robot The substrate 2 is transferred and coated; the first drying robot of the vacuum drying station is moved from the coating station by a group of 〜1 ;; 10 [the plate is vacuum dried; The second transfer machine pot, 'soil, Μ 2 pieces of a set of operations and vacuum drying after the vacuum drying station is transferred, ' ', see the substrate; plus the table, the pair of (four) second handling _ people self-feeding In the empty (four) stage, the two sets of the substrate are subjected to a heating sigh for firing, and the substrate is cooled by the second transfer robot from the set of the transfer table. According to the processing apparatus of the present invention, in the case where the substrate transfer apparatus of the present invention and the substrate including the same are capable of transporting a plurality of substrates at a time by one robot arm, the temperature history of each substrate can be made the same, and the substrates can be prevented from each other. There is uneven production between the two, and a plurality of substrates can be processed uniformly, and the conveyance can be performed quickly. [Embodiment] Hereinafter, preferred embodiments of a substrate for transporting and splicing a substrate of the present invention and a substrate processing apparatus therewith will be described in detail with reference to the accompanying drawings. 3 to 3 show a substrate transfer apparatus and a processing apparatus including the substrate according to the first embodiment. 1 is a schematic view showing a configuration of a production line 2 of a substrate processing apparatus for processing a thin glass substrate 1 in a substrate transfer apparatus according to the first embodiment, and FIG. 2 is a view showing a transfer apparatus which is delivered to the glass substrate of the first embodiment. 101109055 8 201245023 An explanatory view of the arrangement of the two glass substrates la and lb of the robot arm 3, and FIG. 3 is a view showing that the robot arm 3 provided in the glass substrate transfer device of the first embodiment receives two glass substrates la and lb. Description of the program. The production line 2 of the substrate processing apparatus of Fig. 1 is composed of the following members: • The transport belt 4 is carried, and the wall-mounted substrate for the touch panel type portable terminal is used! The stacking unit 5 is placed in the stacking conveyor 4, and the glass substrate 1 loaded into the conveyor belt 4 is placed in two sheets (la, lb)-group; the second transport robot 6 is provided. The coupling table 5 is provided, and the glass substrate 1 is operated in two sets; the coating station 7 is disposed on the left side of the first transfer robot 6, and the glass substrate 1 is coated in two sets; the vacuum drying table is provided. 8. The first transfer robot 6 is disposed on the right side of the first transfer robot 6, and the glass substrate 1 of the two sets of the coating stage 7 is subjected to vacuum drying treatment; and the second transfer robot 9' faces the vacuum drying table. In the same manner as the i-th transfer robot 6, the glass substrate 操作 is operated in two groups; the heating stage 1 is held on the opposite side of the vacuum drying table 8 while holding the second transfer robot 9, and the vacuum drying table 8 is used. The glass substrate 1 of the two-piece drying process is subjected to heat treatment for calcination; and the separation stage 11 is disposed facing the second transfer robot 9 for cooling the two-piece glass substrate 1 At the same time, the operation of the two-piece glass substrate 1 is separated piece by piece; The conveyor belt 12 is disposed to face the cooling, and the separation table 11 is disposed to carry out the glass substrate 1 one by one. In all of the consoles 5, 7, 8, 10, and 11, the main arrangement is used to raise the glass substrate 1 so that the robots 6, 9 can be operated to operate the glass substrate 1! 〇Π〇9〇55 9 201245023 Lifting mechanism 13 ( Refer to Figure 3(b)). The elevating mechanism 13 is a lift pin 13a which is gradually raised from the upper surface of the operation table 5, 78, 10, 11 to support the glass substrate 1a, 丨, ... and is immersed inside the consoles 5, 7, 8, 10, 11. And a driving portion 13b that drives the lift pin 13a up and down. The transport robots 6 and 9 are installed in the normal temperature range, and mainly include the glass substrate 1 which is taken up by the elevating mechanism 13 and is lifted by the elevating mechanism 13 , and then the glass substrate 1 is transported to the lower side. A manipulator 3 (the next step) and can move the robot arm 3 in the horizontal direction. In the coupling table 5, a belt conveyor (not shown) is provided so as not to interfere with the operation of the lift pin i3a. When the belt conveyor is empty, the coupling table 5 is loaded into the two glass substrates one by one from the loading conveyor 4, and is in a state of waiting for the conveyance of the first conveyance robot 6. In the cooling/separating stage 11, in order to separate the glass substrate 1 which has been subjected to a two-piece operation, in the same manner as the coupling stage 5, a belt conveyor (not shown) is provided so as not to interfere with the operation of the lift pins 13a. In the state in which the two glass substrates 1 are carried by the belt conveyor, the glass substrate 搬 is carried out one by one to the carry-out conveyor 12, and the second transfer robot 9 is transported to the glass substrate i in an empty manner. The transport robots 6, 9 are provided with a turntable 14, and an organic arm 3 is provided on the turntable 14. By the rotation of the turntable 14, the direction of the robot arm 3 can be 36 〇. All sides are more. In addition, as described above, the machinery can be moved in the horizontal direction, and the reciprocating motion in the front-rear direction moves back to each console 5, 7, 8, 1 , u or \01109055 201245023, thereby moving from any console 5 ^ ^ 7 8, w The glass substrate 1 is taken and delivered to the next stage 7, 8, 1 (), u. The robot arm 3 is composed of a support portion 15 of the turntable 14 and a plurality of bases 16 and a plurality of roots. The shape of the front end 16a a and the front end 16a a The base end 16b is supported by the support unit 15. The machines, in particular the fork 16 are formed of a heat transfer material such as metal or carbon. The transport robots 6 and 9 perform the delivery operation of the glass substrate 1 in accordance with the step timing of the production line 2 by an automatic control device (not shown). Regarding the two substrates, the surface substrates la and lb and the robot arm 3' which is operated in the same manner, it can be considered that as shown in FIG. 2 (4), the two glass substrates are moved to the D array. The method of arranging the operation is two types of methods of arranging operations in parallel with the direction orthogonal to the moving direction d of the robot arm 3 as shown in Fig. 2(B). In the method of juxtaposed arrangement, the horizontally aligned glass substrates la and lb are easily lost in weight balance, causing vibration and failing to be transported correctly. Therefore, in the first embodiment, the glass substrates 1a and 1b can be stably transported to the robot arm 3 in a tandem arrangement in which the glass substrates 1a and 1b can be stably arranged in parallel, and all the stages 5 and 7, The glass substrates 1a and 1b in 8, 10, and 11 are set to be arranged in a line and wait for the conveyance by the conveyance robots 6, 9. In the example of Fig. 2, the flexure arm 17 for horizontal movement of the robot arm 3 provided in the support portion 15 is shown. The glass substrate transfer apparatus of the first embodiment is particularly preferably used for transporting the glass substrates la and ib from the heating stage 10 to the cooling/separating stage 11 as shown in FIG. 3, 101,109,055, 2012. After the heat treatment of the glass substrate l1, lb is completed, the heating stage 10 is carried out by the robot arm 3 of the second transfer robot 9 to carry out the glass substrates 1a and 1b, and is in a high temperature environment. Further, the turntable arm 17 may be replaced by a structure in which the bending arm 17 itself is rotated by 360° at the center 1T. The frame 16 of the robot arm 3 that enters the heating table 10 and is retracted is formed of a heat transfer material, and is disposed between the front end 1 of the fork frame 16 and the base end 1 side, as compared with the first entering the heating stage. 1〇 The front end l6a side, the rear end of the base end side is heated at a later timing, or the front end 16a side is heated first, and the base end 16b side is then heated. The first and second elevating mechanisms 13 are provided in the heating stage 10. The two lifting mechanisms 13 individually drive the lift pins 13a up and down, and the lift pins na rise so that the two glass substrates la and lb are individually raised to the same height and lowered to deliver the glass substrates la, lb. To the robot arm 3. As described above, since the two glass substrates 1a and 1b are arranged in the moving direction D of the robot arm 3, the two lifting mechanisms 13 are also disposed along the glass substrates 1a and 1b, and are disposed along the robot arm 3. The direction of movement β. Regarding the other consoles 5, 7, 8, u, it is of course possible to provide two lifting mechanisms 13 in the same manner as the heating table 1〇. The two lifting mechanisms 13 of the heating table 10 are used to control the timing of the falling of the lifting pins i3a, thereby adjusting the timing of the delivery of the glass glasses to the robot arm 3, and connecting the lifting mechanism as the timing adjustment mechanism. Control device 18. 101109055 12 201245023 Specifically, the elevating mechanism control device 18 is configured to be positioned on the base end 16b side of the fork 16 in comparison with the lift pin 13a of the third elevating mechanism 13 on the front end 16a side of the fork 16 The lift pin 13a of the mechanism 13 is lowered later. In other words, the timing at which the glass substrates 1a and 1b are delivered to the robot arm 3 is performed earlier on the front end 16a side of the fork frame 16 (delivered first) and later on the base end 16b side (post-delivery). When the robot arm 3 in the normal temperature range moves to the heating substrate 1 in the high temperature environment and enters the glass substrate 1a, 1b, there is a tendency that the front end 16a side heats up earlier and the base end 16b side becomes hotter late. During the temperature rise of the robot arm 3 caused by the high temperature environment, the front end 16& side of the fork frame 16 is fed earlier, and the temperature of the base end 16b side catches up with the temperature of the front end 16a side at the base end 16b side. At the later timing, the two glass substrates 1&, lb are delivered to the robot arm 3 at the same temperature. The delivery timing is set such that the temperature of the base end 16b side of the shelf 16 becomes the same as the temperature of the front end 16a side, and the delivery timing can be based on the heat transfer coefficient of the fork 16 and the two glass substrates la, lb. The distance is easily obtained by performing a test using a real machine. In short, it is only necessary to delay the delivery timing of the second elevating mechanism 13 in accordance with the time required for the robot arm 3 to reach the glass substrate la on the tip end 16a side from the glass substrate 1b on the proximal end 16b side. Next, the action of the glass substrate transfer apparatus of the first embodiment will be described. The substrate processing apparatus that performs various processing on the glass substrate 1 is as described above (see Fig. 1). 101109055 13 201245023 In the heating stage 1 shown in Fig. 3 (a), after the heating treatment of the glass substrate u and the crucible is completed, high-temperature ambient gas is retained. When the glass substrate 1a and the crucible are transported from the heating stage 10 to the cooling/separating stage u, the driving units 13b of the second and second elevating mechanisms 13 ascend the lifting pin Ua as shown in Fig. 3(b), thereby The glass substrates la, lb are raised to the same height. The lifting action of the lifting pin i3a can be the same timing or different timings. Next, as shown in Fig. 3(c), the robot arm 3 of the second transfer robot 9 moves toward the heating stage 10, and enters the glass substrates la and lb from the front end 6a side, as shown in Fig. 3(d). Moving from the front end 16a side to the base end 16b side is positioned below the glass substrates la, lb to stop moving. At this time, the front end 16a side of the first frame 16 is first heated up, and the base end 16b side of the rear entry is then heated at a later timing. Therefore, at the time when the fork 16 of the mechanical arm 3 enters the glass substrate la, the temperature on the side of the front end 16a is higher and the temperature on the side of the base end 16b is lower, so that the temperature rises unevenly. During the temperature rise of the shelf 16, the temperature of the base end 16b side of the elevation mechanism control device 18 is set to coincide with the timing of the temperature of the front end 16a when the front end 16a side delivers the glass substrate la, and the lifting mechanism control device 18 First, as shown in Fig. 3 (4), the lift pin 13a of the first elevating mechanism 13 of the glass substrate 1a which is raised to the front end side of the rack 16 is lowered. Thereafter, at the base end 16b side, the temperature is the same as the front end side temperature, as shown in FIG. 3, the glass is lifted on the base end (10) side of the fork 16 by the glass 101109055 201245023, the second lifting mechanism 13 of the substrate lb The lift pin 13a is lowered. Thereby, the two glass substrates 1a and 1b are delivered to the front end 16a side and the base end 1613 side while being warmed to the same temperature. In the glass substrate transfer apparatus and the substrate processing apparatus according to the first embodiment, the temperature on the base end 16b side is equal to the temperature on the front end 16a side of the glass substrate ia on the delivery end 16a side. At the timing of the delivery of the glass substrate 1b on the side of the base end 16b, when the two glass substrates 1a and 1b are transported by one robot arm 3 at a time, the temperature history of each of the glass substrates 1a and 1b can be made the same, and the glass can be prevented. Temperature unevenness occurs between the substrates 1a and 1b, and the two glass substrates ia and ib can be uniformly processed. Moreover, if the rack 16 is heated in the high temperature environment of the heating stage 10, the glass substrate la, lb is delivered from the front end 1 to the base end 16b until the same temperature is reached, and the transfer is time consuming, but In the first embodiment, since the temperature of the arm 3 is increased and the towel is delivered, the glass substrates 1a and 1b can be quickly transferred, so that high productivity can be ensured, and the W-side substrate can be further Since the movement directions of the la and the W machines are arranged in the arrangement D, the mechanical arm is stably conveyed by taking the glass substrates 1a and 1b as compared with the case of the parallel arrangement. Fig. 4 shows a second embodiment of the transporting of the glass substrate of the present invention. In the second embodiment, the two lifting mechanisms 13 that can simultaneously operate two sets of glass substrates la and lb can operate the first and second lifting mechanisms 13 that operate separately. Composition. 101109055 15 201245023 The timing adjustment mechanism of the second embodiment is such that the base end side of the shelf 16 is separated from the glass substrates 1a, 1b by the upper end 16a side of the fork 16 of the robot arm. The fork frame 16 is provided with an inclined surface 倾斜 which is inclined so as to be increased from the base end side to the front end 16a side. Thus, in the front end 16a side and the base end 16b side, the upper surface of the frame 16 opposite to the glass substrate ia, that is, the distance from the receiving surface is different, whereby the glass substrate la can be made even if the lift _ 13a (four) is lowered. The timing of delivery of lb is different. In contrast to the delivery of the glass substrate 1a on the side of the front end 16a, the delivery of the glass substrate 1b on the base end (10) side is performed at the later timing of the lifting mechanism control device 18 of the first embodiment. slope. The yoke 16 of the cymbal arm 3 is a cantilever beam shape as described above, and the slanting surface 19 is flexed in such a manner as to be substantially horizontal by the weight when the two sheets of the ruthenium substrates 1a and 1b are mounted. The material composition (see arrow X in Fig. 4). The operation of the glass substrate transfer device of the second embodiment and the working device including the base device will be described. As shown in Fig. 4 (a), the glass substrate lb is transferred from the heating stage 1 to the cooling and separation. At the time of the stage η, the driving portion 13b of the elevating mechanism 13 raises the lift pins 13a and raises the glass substrates 1a and 1b to the same height. The robot arm 3 of the second transfer robot 9 moves toward the heating stage 1', and enters the glass substrate 1a, 1b from the front end 16a side, moves from the side of the 16a side to the base end 16b side, and is positioned on the glass substrate 1a, 1b. 101109055 201245023 so that it stops moving. At this time, the front end 16a side of the first frame 16 is first heated up, and the base end 16b side of the rear entry is then heated at a later timing. Therefore, when the fork 16 has just entered the glass substrate la, lb, the temperature of the front end side is again asked, and the temperature of the base end 16b side is low, which is a non-uniform temperature rise state. Further, the fork frame 16 of the robot arm 3 has the upper surface of the front end 16a side closer to the glass substrates ia, a than the upper surface of the base end 16b side by the inclined surface 19 provided thereon. Thereby, during the temperature rise of the robot arm 3, the temperature of the base end 16b side is set to catch up with the timing at which the front end side of the glass substrate 1& Thereafter, the lift pins 13a of the elevating mechanism 13 that is raising the two glass substrates ia and lb are lowered, and the two glass substrates u and the ratio are simultaneously lowered. Thus, as shown in FIGS. 4(b) and 4(c), the glass substrate 1a on the front end side is delivered to the robot arm 3 at an earlier timing, and the glass substrate 1b from which the base end is detached is delivered to the later timing. By the robot arm 3, the two glass substrates 1&, ib are fed to the front end 16a side and the base end 16b side, and the temperature is raised to the robot arm 3 of the same temperature. The second embodiment described above naturally has the same operational effects as those of the first embodiment. In particular, in the second embodiment, the two-plate substrate l1, lb can be operated by the elevating mechanism 13 alone, and the inclined surface 19 can be provided only on the fork 16 to make the timing of the miscellaneous reading.丨The implementation is simpler than the structure, and the timing control is also easier and the effect is excellent. 101109055 17 201245023 Further, in the second embodiment, in the case where the lift pin 13a is being supported and the lower arm m is pulled down, the robot 3 can be lifted from the jersey board. In response to the drop in the lift pin, it can handle a variety of controls. Furthermore, the frame 16 of the robot arm 3 has a habit of making the inclined surface 19 to be a big profit by the weight I when the two glass substrates la lb are mounted. Therefore, even if the inclined surface 19 is provided In other cases, it is also possible to ensure a stable horizontal conveyance. Another example of the production line of the processing apparatus for the substrate including the glass substrate transfer apparatus of the present embodiment is shown in FIG. The production line 2 of the substrate processing apparatus of FIG. 5 is composed of the following members: a loading turntable 21 that carries the glass substrate 1 for the touch panel type portable terminal in a direction-changing direction; and carries the conveyor belt 22 to face The loading turntable 21 is provided, and the glass substrate 搬 carried in from the loading turntable 21 is carried in two sets; the first transfer robot 24 is disposed facing the loading conveyance belt 22, and the glass substrate 1 is set in two pieces. The loading conveyor 22 is transported to the coating station 23 of the next stage; the coating station 23 holds the first transfer robot 24 on the opposite side of the loading conveyor 22, and applies the glass substrate 1 in two sets; The second transfer robot 26 is disposed facing the coating station 23, and transports the glass substrate 1 from the coating station 23 to the vacuum drying table 25 of the next stage; vacuum drying 101109055 18 201245023 table 25' holds the second transfer robot 26 On the opposite side of the coating station 23, two sets of glass substrates are vacuum dried; the third transfer robot 28 is disposed facing the vacuum drying table 25, and the glass substrate 1 is transported from the vacuum drying station 25 to the lower side. Heating of a section 27; a heating table 27, which is disposed on the opposite side of the vacuum drying table 25, and heats the glass substrate 1 of the two sets; the fourth transfer robot 3 is disposed facing the heating stage 27. 'The glass substrate 1 is transported from the heating stage 27 to the cooling stage 29 of the next stage; the cooling stage 29 is held by the fourth transfer robot 30 on the opposite side of the heating stage 27' to cool the two sets of the glass substrate 1 The conveyance belt 31 is carried out, and is placed facing the cooling stage 29, and the glass substrate 1 is carried out in two sets; the carry-out turntable 32 is provided facing the carry-out conveyor 31, and the glass substrate 1 is carried out one by one. As the first to fourth transfer robots 24, 26, 28, and 30 of the above-described production line 20, of course, the glass substrate transfer apparatus of the first or second embodiment can be preferably applied. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a configuration of a production line of a substrate processing apparatus including a substrate transfer apparatus of the present invention and a glass substrate which is thinned. Fig. 2 is an explanatory view for explaining a plurality of substrate arrays of the mechanical arms provided in the transfer device of the substrate to be fed. Fig. 3 is an explanatory view showing a procedure of a plurality of substrates on which a mechanical arm receives a substrate according to a first embodiment of the substrate transfer apparatus of the present invention. Fig. 4 is an explanatory view for explaining a procedure of a plurality of substrates on which a robot arm receives a second embodiment of the substrate transfer apparatus according to the present invention, that is, a machine 101109055 19 201245023. Fig. 5 is a schematic view showing the configuration of another production line of a substrate processing apparatus for processing a thin glass substrate, which comprises the substrate transfer device of the present invention. [Description of main component symbols] 1. la, lb glass substrate 2, 20 production line 3 robot arm 4, 22 moving into the conveyor belt 5, 7, 8, 11, 23, 25, 29 console 6 ' 9 ' 24 ' 26 ' 28 ' 30 Handling robots 10, 27 Heating stations 12, 31 Carrying out the conveyor belt 13 Lifting mechanism 14, 21, 32 Turntable 15 Supporting part 16 Fork 16a Fork front end 16b Fork base end 17 Flexing arm 18 Lifting mechanism control device 19 Inclined surface 101109055 20

Claims (1)

ZU1Z4^UZ3 七、申请專利乾圍： 1. 一種基板之搬送裝置，其具有可' 臂，該機械臂係於生產線所具備之力於水平方向移動之機械 板之下，藉由該基板下降從而受台’進人已上升之基 該基板搬送至下一操作台，並且該=板’其後，後退而將 基端側之間，相較於先進入該加熱4成臂具有在其前端側與 端側以較遲之時機升溫之習性;之前端側’後進入之基 於： ’°Λ "'板之搬送裝置之特徵在 上述加熱台，係沿上述機械臂之 複數之上述基板， 助方向串列排列配置有 上述加熱台設置有升降機構， 高度而使其上升且下降從而交付至上述 提昇至相同之 並且具備時機調整機構，其用以於上过拖^ 過程中將魏之上祕板《相H㈣械f之溫度上升 #^,c, /现度父付至該機械臂，而 使料基板朝該機械臂之交付於該 行且於基端側為後進行。 < 之㈣側為先進 2.如申請專利侧第1項之基板之搬送裝置，盆中， =述升降機構設置有複數個，為了將該等基板各自昇起至 y之焉度而使個別上升且個別下降，從而交付至上述機械 、上述h機娜機構係升降機構控㈣置，以相較於位 述機械臂之前端側之上述升降機構，而使位於上述機械臂之 101109055 21 201245023 基知側之上述升降機構較遲下降。 3.如申請專利範圍第1項之基板之搬送裝置，其中， ▲上述時機調整機構係相較於上述機械臂之前端側上面，使 /為械|之基端側上面與上述基板隔離更遠，而於該機械臂 言免置古» 以自基端側上面朝前端側上面逐漸增高之方式傾斜 之傾钭面。 如申晴專利範圍第3項之基板之搬送裝置，其中， ^地機械臂具有藉由搭載全部上述基板時之重量，而使上 \钭面以成為大致水平之方式撓曲之習性。 1至種基板之加工裝置，其特徵在於具備申請專利範圍第 4項中任—項之基板之搬送裝置，且包括： 裝^，1搬運機器人’其以2片―組操作並搬送上述基板；塗 組^其對藉由該第1搬運機人搬送之上述基板以2片-人自上I、敷處理，真空乾燥台，其對藉由上述第1搬運機器 處理；^塗裝心送之2片—組之上述基板進行真空乾燥 乾燥a τ<運機器人，其以2片一組操作並搬送於該真空 第C處理後之上述基板;加熱台，其對藉由該 行用心二上處?空及繼搬r2片-組之基板進 搬運機时Α ό…處理，及，冷部台，其對藉由上述第2 冷部處理 Χ述加熱台搬送之2片—組之上述基板進行 1〇11〇9〇55 22ZU1Z4^UZ3 VII. Patent pending: 1. A substrate transfer device having an arm that is attached to a mechanical plate of a production line that is horizontally movable, and the substrate is lowered. The substrate is transported to the next stage by the base of the ascending person, and the = plate is thereafter retracted to bring the base end side between the base end side and the front end side The habit of warming up with the end side at a later time; the front end side is based on the following: '°Λ " 'The transport device of the board is characterized by the above-mentioned heating plate, which is a plurality of substrates along the above-mentioned robot arm, The directional arrangement is arranged such that the heating stage is provided with an elevating mechanism, and the height is raised and lowered to be delivered to the above-mentioned lift to the same and has a timing adjustment mechanism for use in the process of dragging and dropping The temperature rise of the phase "phase H (four) device f #^, c, / is now paid to the robot arm, and the substrate is delivered to the robot arm to the row and to the base end side. < The (4) side is advanced. 2. The substrate transfer device according to item 1 of the patent application side, in the basin, the plurality of lifting mechanisms are provided, and the individual is raised to the y degree for each of the substrates. Ascending and descending individually, and delivering to the above-mentioned machine, the above-mentioned h-machine mechanism is controlled by the lifting mechanism (4), and is located at 101109055 21 201245023 based on the above-mentioned lifting mechanism of the front end side of the robot arm. The above-mentioned lifting mechanism of the known side has been delayed. 3. The substrate transfer device according to claim 1, wherein the ▲ timing adjustment mechanism is such that the base end side of the mechanical arm is separated from the substrate by a distance from the front end side of the mechanical arm. And in the mechanical arm, the slanting face is inclined in such a manner as to gradually increase from the top side of the base end side toward the front end side. In the substrate transfer apparatus of the third aspect of the patent application, the ground mechanical arm has a habit of being bent so as to be substantially horizontal by the weight when all the substrates are mounted. A processing apparatus for a substrate according to any one of claims 4, further comprising: a loading robot that operates in two sheets and transports the substrate; The coating unit is configured to treat the substrate conveyed by the first carrier by two sheets of people, and to apply a vacuum drying station to the substrate, and to perform the processing by the first conveying device; The two substrates of the group are vacuum dried and dried, and the robot is operated in two sets and transferred to the substrate after the vacuum C treatment; ? 及 继 继 继 继 继 继 r 继 继 继 r r 继 r r r 继 r r r r r r r r r r r r r r r r r r r r r r r r r r r r r r r r r r 1〇11〇9〇55 22
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