JP2013009007A - Substrate transfer method in substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate transfer method in a substrate transfer apparatus which shortens the transfer time of substrates.SOLUTION: A main robot MR includes: multiple substrate holding hands 14a, 14b; multiple substrate holding hands 16a, 16b; and an upper movement driving mechanism 29 moving the multiple substrate holding hands 14a, 14b; and a lower movement driving mechanism 30 moving the multiple substrate holding hands 16a, 16b. The main robot MR uses the respective substrate holding hands 14a, 14b, 16a, 16b to carry substrates in to/out from substrate holding positions and thereby transferring the substrates between the multiple substrate holding positions.

Description

  The present invention relates to a substrate transfer method in a substrate processing apparatus. Examples of substrates to be transferred or processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. , Photomask substrates, ceramic substrates, and the like.

  In a manufacturing process of a semiconductor device or a liquid crystal display device, a substrate processing apparatus for processing a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device is used. As shown in FIG. 27, for example, a single-wafer type substrate processing apparatus that processes substrates one by one includes a processing block 201 and an indexer block 202 coupled to the processing block 201 (for example, a patent). Reference 1).

  In this Patent Document 1, the processing block 201 inverts the substrate W and the four processing units 203 arranged in a plane, the main transfer robot CR disposed in the center so as to be surrounded by the four processing units 203. And a reversing device RT. The main transport robot CR performs a substrate carry-in operation for carrying an unprocessed substrate W into the processing unit 203 and a substrate carry-out operation for carrying out the processed substrate W from the processing unit 203. The main transfer robot CR carries the substrate W into the reversing device RT, and carries the substrate W reversed by the reversing device RT from the reversing device RT. The main transfer robot CR has an upper hand H1 attached to the tip of the upper arm A1, and a lower hand H2 attached to the tip of the lower arm A2, and uses the pair of upper and lower hands H1 and H2. The substrate carrying-in operation is performed. The pair of hands H1 and H2 are independently driven forward and backward.

  On the other hand, the indexer block 202 accesses the cassette mounting table 206 on which the cassette 205 capable of accommodating a plurality of substrates W is placed, and the cassette 205 placed on the cassette mounting table 206 to carry in the loading of the substrates W. An indexer robot IR that carries out / transfers the substrate W to / from the main transfer robot CR and a moving mechanism that moves the indexer robot IR along the arrangement direction of the cassette 205 are provided. The indexer robot IR has an upper hand H3 attached to the tip of the upper arm A3, and a lower hand H4 attached to the tip of the lower arm A4. Using the pair of upper and lower hands H3 and H4, A substrate W loading / unloading operation with respect to the cassette 205 and a transfer operation with the main transfer robot CR are performed. The transfer of the substrate W between the indexer robot IR and the main transfer robot CR is performed in a state where the indexer robot IR is located at the substrate transfer position P1 closest to the main transfer robot CR in terms of distance.

  The unprocessed substrate W accommodated in the cassette 205 is held and carried out by the lower hand H4 of the indexer robot IR. Then, the unprocessed substrate W is delivered from the lower hand H4 of the indexer robot IR to the lower hand H2 of the main transport robot CR. The substrate W transferred to the main transport robot CR is reversed by the reversing device RT as necessary, and is carried into the processing unit 203 from the lower hand H2 of the main transport robot CR. At this time, if there is a processed substrate W in the processing unit 203, the processed substrate W is unloaded from the processing unit 203 by the upper hand H <b> 1 of the main transfer robot CR, and is then placed under the main transfer robot CR. The unprocessed substrate W held by the hand H2 is carried into the processing unit 203. The main transfer robot CR sequentially carries the substrates W delivered from the indexer robot IR into the plurality of processing units 203.

  On the other hand, the processed substrate W processed by the processing unit 203 is unloaded from the processing unit 203 by the upper hand H1 of the main transport robot CR. Then, when the unloaded substrate W is reversed, it is reversed again by the reversing device RT. Thereafter, the processed substrate W is transferred from the upper hand H1 of the main transfer robot CR to the upper hand H3 of the indexer robot IR, and the transferred substrate W is transferred into the cassette 205 by the indexer robot IR. Is done.

Japanese Patent Laying-Open No. 2006-12880 (FIG. 1)

  In order to improve the throughput of the substrate processing apparatus (the number of substrates processed per hour), for example, it is conceivable to shorten the processing time of the substrate W and the transport time of the substrate W in the processing unit 203. In the substrate processing apparatus according to Patent Document 1, since a plurality of processing units 203 are provided, the substrates W are sequentially loaded into these processing units 203 to process a plurality of substrates W in parallel. Thus, the processing time of the apparent substrate W can be shortened.

  On the other hand, the transfer time of the substrate W may become longer because the transfer of the substrate W is performed through a number of operations as described above. In particular, when the substrate W is reversed, the number of operations associated with the reversal increases, so that the transfer time of the substrate W tends to be longer. If the transfer time of the substrate W is longer than the processing time of the substrate W, the transfer time of the substrate W is limited in the entire apparatus, and the throughput of the substrate processing apparatus cannot be improved even if the processing time of the substrate W is shortened. Therefore, in order to improve the throughput of the substrate processing apparatus, it is necessary to shorten not only the processing time of the substrate W but also the transfer time of the substrate W.

  The present invention has been made under such a background, and an object of the present invention is to provide a substrate transport method in a substrate processing apparatus capable of shortening the substrate transport time.

  In order to achieve the above object, the invention according to claim 1 is to provide a plurality of substrate holders (RT1, RT1′RT2, RT2 ′, RT2 ′) for holding the first substrate and the second substrate at two substrate holding positions having different heights. PASS1, PASS2, RT3), a first processing unit (10) for holding one substrate at a predetermined substrate holding position and executing a predetermined substrate processing on the substrate, and one substrate at a predetermined substrate holding position A second processing unit (10) for holding the substrate and executing predetermined substrate processing on the substrate, and a first substrate holding hand and a second substrate holding hand (14a, 14b, 16a) for holding the substrates one by one at different heights , 16b) and a substrate transport apparatus (MR) including the substrate transport apparatus (MR).

  In this substrate transport method, after performing a simultaneous taking operation of taking two substrates at the same time, a one-sheet passing operation for transferring one substrate is performed twice.

  Specifically, in this substrate transport method, the first substrate holding hand and the second substrate holding hand are moved to a position facing the two substrate holding positions of the plurality of substrate holding units, and then the first substrate holding hand is moved to the second substrate holding hand. A simultaneous operation of simultaneously taking the first substrate and the second substrate from the two substrate holding positions is executed by the one substrate holding hand and the second substrate holding hand.

  Thereafter, the substrate transport method moves the first substrate holding hand to a position facing the substrate holding position of the first processing unit, then moves the hand above the substrate holding position, By moving the hand below the substrate holding position, a carry-in operation for carrying the first substrate held by the first substrate holding hand into the first processing unit is executed.

  Further, in this substrate transport method, the second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, and then the hand is moved above the substrate holding position. By moving the hand below the substrate holding position, a carrying-in operation for carrying the second substrate held by the second substrate holding hand into the second processing unit is executed.

  According to the second aspect of the present invention, there are provided a plurality of substrate holders (RT1, RT1′RT2, RT2 ′, PASS1, PASS2, RT3) for holding two substrates at two substrate holding positions having different heights; A first processing unit (10) that holds the first substrate at the substrate holding position and executes predetermined substrate processing on the substrate; and a second substrate that is held at the predetermined substrate holding position and executes predetermined substrate processing on the substrate And a substrate transfer apparatus (MR) including a first substrate holding hand and second substrate holding hands (14a, 14b, 16a, 16b) for holding the substrates one by one at different heights. Is a substrate transfer method executed in a substrate processing apparatus (1,100).

  In this substrate transfer method, a single sheet picking operation for taking one substrate is performed twice, and then a simultaneous transfer operation for simultaneously transferring the two substrates is performed.

  Specifically, in this substrate transport method, the first substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, and then the hand is moved below the substrate holding position. Further, the unloading operation of unloading the first substrate from the first processing unit is performed by moving the hand above the substrate holding position.

  Further, in this substrate transport method, the second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, and then the hand is moved below the substrate holding position. An unloading operation for unloading the second substrate from the second processing unit is performed by moving the hand above the substrate holding position.

  Thereafter, in the substrate transport method, the first substrate holding hand and the second substrate holding hand are moved to a position facing the two substrate holding positions of the plurality of holding units, and then the first substrate holding is performed. A simultaneous transfer operation of simultaneously transferring the first substrate and the second substrate to the two substrate holding positions is executed by the hand and the second substrate holding hand.

  According to a third aspect of the present invention, there are provided a plurality of substrate holders (RT1, RT1′RT2, RT2 ′, PASS1, PASS2, RT3) for holding two substrates at two substrate holding positions having different heights, A first processing unit (10) that holds a first substrate at a substrate holding position and executes predetermined substrate processing on the substrate; and a second substrate that is held at a predetermined substrate holding position and executes predetermined substrate processing on the substrate A substrate transfer method executed in a substrate processing apparatus (1, 100) including a second processing unit (10) and a substrate transfer apparatus (MR). The substrate transfer device includes a first substrate holding hand and a second substrate holding hand (14a, 14b) that hold substrates one by one at different heights, and a third substrate and a fourth substrate one by one at different heights. And a third substrate holding hand and a fourth substrate holding hand (16a, 16b) for holding.

  In this substrate transport method, after a replacement operation for replacing one substrate is performed twice, a simultaneous transfer operation for simultaneously transferring the two substrates is performed.

  Specifically, in this substrate transport method, the first substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, and then the hand is moved below the substrate holding position. Further, the unloading operation of unloading the first substrate from the first processing unit is performed by moving the hand above the substrate holding position.

  Further, in this substrate transport method, the third substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, and then the hand is moved above the substrate holding position. By moving the hand below the substrate holding position, a carrying-in operation for carrying the third substrate held by the third substrate holding hand into the first processing unit is executed.

  Further, in this substrate transport method, the second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, and then the hand is moved below the substrate holding position. An unloading operation for unloading the second substrate from the second processing unit is performed by moving the hand above the substrate holding position.

  Further, in this substrate transport method, the fourth substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, and then the hand is moved above the substrate holding position. By moving the hand below the substrate holding position, a loading operation for loading the fourth substrate held by the fourth substrate holding hand into the second processing unit is executed.

  Thereafter, in the substrate transport method, the first substrate holding hand and the second substrate holding hand are moved to positions facing the two substrate holding positions of the plural-sheet holding unit, and then the first substrate holding hand and A simultaneous transfer operation of simultaneously transferring the first substrate and the second substrate to the two substrate holding positions by the second substrate holding hand is executed.

  According to a fourth aspect of the present invention, there are provided a plurality of holding units (RT1, RT1′RT2, RT2 ′, PASS1, PASS2, RT3) for holding the first substrate and the second substrate at two substrate holding positions having different heights. A first processing unit (10) for holding a third substrate at a predetermined substrate holding position and executing a predetermined substrate processing on the substrate; and a fourth substrate at a predetermined substrate holding position and holding the predetermined substrate on the substrate This is a substrate transfer method executed in a substrate processing apparatus (1, 100) including a second processing unit (10) that performs processing and a substrate transfer apparatus (MR). The substrate transfer device includes a first substrate holding hand and second substrate holding hands (14a, 14b) that hold substrates one by one at different heights, and a third substrate holding that holds substrates one by one at different heights. And a fourth substrate holding hand (16a, 16b).

  In this substrate transport method, after performing a simultaneous taking operation of taking two substrates at the same time, an exchange operation for exchanging one substrate is performed twice.

  Specifically, in this substrate transfer method, the third substrate holding hand and the fourth substrate holding hand are moved to a position facing the two substrate holding positions of the plurality of holding units, and then the third substrate is transferred. A simultaneous operation of simultaneously taking the first substrate and the second substrate from the two substrate holding positions is executed by the holding hand and the fourth substrate holding hand.

  Thereafter, the substrate transfer method moves the first substrate holding hand to a position facing the substrate holding position of the first processing unit, and then moves the hand to a position below the substrate holding position. An unloading operation for unloading the third substrate from the first processing unit is performed by moving the hand above the substrate holding position.

  Further, in this substrate transport method, the third substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, and then the hand is moved above the substrate holding position. By moving the hand below the substrate holding position, a carrying-in operation for carrying the first substrate held by the third substrate holding hand into the first processing unit is executed.

  Further, in this substrate transport method, the second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, and then the hand is moved below the substrate holding position. An unloading operation for unloading the fourth substrate from the second processing unit is performed by moving the hand above the substrate holding position.

  Further, in this substrate transport method, the fourth substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, and then the hand is moved above the substrate holding position. By moving the hand below the substrate holding position, a carrying-in operation for carrying the second substrate held by the fourth substrate holding hand into the second processing unit is executed.

  According to a fifth aspect of the present invention, in the third or fourth aspect, the first substrate holding hand and the second substrate holding hand are positioned above the third substrate holding hand and the fourth substrate holding hand. It is a board | substrate conveyance method in the described board | substrate conveyance apparatus.

  According to a sixth aspect of the present invention, the vertical interval between the two substrate holding positions of the plurality of substrate holding units is the vertical interval between the first substrate holding hand and the second substrate holding hand, and the first 6. The substrate transfer method in the substrate transfer apparatus according to claim 1, wherein the substrate transfer method is equal to at least one of a vertical interval between the three substrate holding hands and the fourth substrate holding hand.

  The invention according to claim 7 is the substrate according to any one of claims 1 to 6, wherein the first substrate holding hand and the second substrate holding hand are arranged so as to overlap each other in plan view. It is the substrate conveyance method in a processing apparatus.

  According to an eighth aspect of the present invention, the carry-in operation, the carry-out operation, the simultaneous pick-up operation, or the simultaneous transfer operation is performed using a linear motion mechanism that linearly moves the substrate holding hand. It is a board | substrate conveyance method in the substrate processing apparatus as described in any one of 1-7.

  According to the ninth aspect of the present invention, there are provided a plurality of substrate holders (RT1, RT1′RT2, RT2 ′, PASS1, PASS2, RT3) for holding two substrates at two substrate holding positions having different heights; A first processing unit (10) that holds one first substrate at a substrate holding position and executes a predetermined substrate processing on the substrate, and holds a second substrate at a predetermined substrate holding position. A second processing unit (10) for performing predetermined substrate processing, a first substrate holding hand and second substrate holding hands (14a, 14b, 16a, 16b) for holding substrates one by one at different heights, The third substrate holding hand (14a, 14b, 16a, 16b), which is positioned at a different height from the first substrate holding hand and the second substrate holding hand and holds one third substrate, swivels and / or moves up and down. thing And a substrate transfer device (MR) that integrally moves the first to third substrate holding hands between the plurality of holding units, the first processing unit, and the second processing unit. , 100).

  The substrate transfer method includes an unloading operation for unloading a substrate from the first processing unit, an unloading operation for unloading the substrate from the second processing unit, an unloading operation for loading the substrate into the second processing unit, and a plurality of holding units. The simultaneous transfer operation of simultaneously transferring two substrates is performed.

  Specifically, the substrate transfer method moves the first substrate holding hand to a position facing the substrate holding position of the first processing unit by turning and / or raising and lowering the substrate transfer apparatus, and then continues. Moving the first substrate holding hand to a position below the substrate holding position, and further moving the hand above the substrate holding position, thereby carrying out an unloading operation for unloading the first substrate from the first processing unit. Execute.

  Further, in this substrate transfer method, the second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit by turning and / or raising and lowering the substrate transfer apparatus, and subsequently The unloading operation of unloading the second substrate from the second processing unit is performed by moving the two-substrate holding hand to below the substrate holding position and further moving the hand to above the substrate holding position.

  Further, in this substrate transfer method, the third substrate holding hand is moved to a position facing the second processing unit by turning and / or raising and lowering the substrate transfer device, and then the third substrate holding hand. Is moved to above the substrate holding position, and further, the hand is moved below the substrate holding position to execute a loading operation for loading the third substrate into the second processing unit.

  Further, in this substrate transfer method, the first substrate holding hand and the second substrate holding hand are opposed to the two substrate holding positions of the plurality of holding units by turning and / or raising and lowering the substrate transfer device. Subsequently, a simultaneous transfer operation for simultaneously transferring the first substrate and the second substrate to the two substrate holding positions is executed by the first substrate holding hand and the second substrate holding hand.

  The invention according to claim 10 is a plurality of holding units (RT1, RT1′RT2, RT2 ′, PASS1, PASS2, RT3) for holding two substrates at two substrate holding positions having different heights; A first processing unit (10) that holds one first substrate at a substrate holding position and executes a predetermined substrate processing on the substrate, and holds a second substrate at a predetermined substrate holding position. A second processing unit (10) for performing predetermined substrate processing, a first substrate holding hand and second substrate holding hands (14a, 14b, 16a, 16b) for holding substrates one by one at different heights, The third substrate holding hand (14a, 14b, 16a, 16b), which is positioned at a different height from the first substrate holding hand and the second substrate holding hand and holds one third substrate, swivels and / or moves up and down. This And a substrate transfer apparatus (MR) that integrally moves the first to third substrate holding hands between the plurality of holding units, the first processing unit, and the second processing unit (1). , 100).

  The substrate carrying method includes a carrying-out operation for carrying out a substrate from the first processing unit, a carrying-in operation for carrying the substrate into the first processing unit, a carrying-out operation for carrying out the substrate from the second processing unit, and a plurality of holding units. The simultaneous transfer operation of simultaneously transferring two substrates is performed.

  Specifically, the substrate transfer method moves the first substrate holding hand to a position facing the substrate holding position of the first processing unit by turning and / or raising and lowering the substrate transfer apparatus, and then continues. Moving the first substrate holding hand to a position below the substrate holding position, and further moving the hand above the substrate holding position, thereby carrying out an unloading operation for unloading the first substrate from the first processing unit. Execute.

  Further, in this substrate transfer method, the third substrate holding hand is moved to a position facing the first processing unit by turning and / or raising / lowering the previous substrate transfer device, and subsequently holding the third substrate. A carry-in operation for carrying the third substrate into the first processing unit is performed by moving the hand to above the substrate holding position and further moving the hand below the substrate holding position.

  Further, in this substrate transfer method, the second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit by turning and / or raising / lowering the previous substrate transfer apparatus, and subsequently An unloading operation for unloading the second substrate from the second processing unit is performed by moving the second substrate holding hand to below the substrate holding position and further moving the hand to above the substrate holding position. .

  Further, in this substrate transfer method, the first substrate holding hand and the second substrate holding hand are opposed to the two substrate holding positions of the plurality of holding units by turning and / or raising and lowering the previous substrate transfer device. Subsequently, a simultaneous transfer operation of simultaneously transferring the first substrate and the second substrate to the two substrate holding positions by the first substrate holding hand and the second substrate holding hand is executed.

  According to an eleventh aspect of the present invention, there are provided a plurality of holding units (RT1, RT1′RT2, RT2 ′, PASS1, PASS2, RT3) for holding the first substrate and the second substrate at two substrate holding positions having different heights. A first processing unit (10) for holding one third substrate at a predetermined substrate holding position and executing a predetermined substrate processing on the substrate; and holding the one substrate at a predetermined substrate holding position A second processing unit (10) for executing a predetermined substrate processing, a first substrate holding hand (14a, 14b, 16a, 16b) for holding one substrate, and a height different from that of the first substrate holding hand. The second substrate holding hand and the third substrate holding hand (14a, 14b, 16a, 16b), which hold the substrates one by one at different heights, and turn and / or move up and down, thereby This is executed in a substrate processing apparatus (1, 100) including a substrate transfer device (MR) that integrally moves a three-substrate holding hand between the plurality of holding units, the first processing unit, and the second processing unit. This is a substrate transfer method.

  The substrate carrying method includes a simultaneous taking operation for simultaneously taking two substrates from a plurality of holding units, an unloading operation for unloading a substrate from the first processing unit, an unloading operation for loading the substrate into the first processing unit, 2 Carrying in the operation of loading the substrate into the processing unit.

  Specifically, in this substrate transfer method, the second substrate holding hand and the third substrate holding hand are held by the plurality of substrate holding units by turning and / or raising / lowering the previous substrate transfer device. Next, the simultaneous taking operation of simultaneously taking the first substrate and the second substrate from the two substrate holding positions is executed by the second substrate holding hand and the third substrate holding hand.

  Further, in this substrate transport method, the substrate transport apparatus is swung and / or moved up and down to move the first substrate holding hand to a position facing the substrate holding position of the first processing unit. An unloading operation for unloading the third substrate from the first processing unit is performed by moving the one substrate holding hand to below the substrate holding position and further moving the hand above the substrate holding position.

  Furthermore, in this substrate transport method, the second substrate holding hand is moved to a position facing the first processing unit by turning and / or raising and lowering the substrate transport device, and subsequently the second substrate holding hand. Is moved to a position below the substrate holding position, and further, the hand is moved above the substrate holding position to execute a loading operation for loading the first substrate into the first processing unit.

  Further, in this substrate transfer method, the third substrate holding hand is moved to a position facing the substrate holding position of the second processing unit by turning and / or raising and lowering the substrate transfer apparatus, and subsequently A carry-in operation for carrying the second substrate into the second processing unit is performed by moving the three-substrate holding hand to above the substrate holding position and further moving the hand below the substrate holding position.

  According to a twelfth aspect of the present invention, there are provided a plurality of holding units (RT1, RT1′RT2, RT2 ′, PASS1, PASS2, RT3) for holding the first substrate and the second substrate at two substrate holding positions having different heights. A first processing unit (10) for holding a single substrate at a predetermined substrate holding position and executing a predetermined substrate processing on the substrate; and holding a single third substrate at the predetermined substrate holding position. A second processing unit (10) for executing a predetermined substrate processing, a first substrate holding hand (14a, 14b, 16a, 16b) for holding one substrate, and a height different from that of the first substrate holding hand. The second substrate holding hand and the third substrate holding hand (14a, 14b, 16a, 16b), which hold the substrates one by one at different heights, and turn and / or move up and down, thereby This is executed in a substrate processing apparatus (1, 100) including a substrate transfer device (MR) that integrally moves a three-substrate holding hand between the plurality of holding units, the first processing unit, and the second processing unit. This is a substrate transfer method.

  The substrate carrying method includes a simultaneous taking operation for simultaneously taking two substrates from a plurality of holding units, an unloading operation for unloading a substrate from the second processing unit, an unloading operation for loading the substrate into the first processing unit, 2 Carrying in the operation of loading the substrate into the processing unit.

  Specifically, in the substrate transport method, the second substrate holding hand and the third substrate holding hand are moved to the two substrate holding positions of the plurality of substrate holding portions by turning and / or raising and lowering the substrate transport device. Then, the simultaneous taking operation of simultaneously taking the first substrate and the second substrate from the two substrate holding positions is executed by the second substrate holding hand and the third substrate holding hand.

  Further, in this substrate transfer method, the first substrate holding hand is moved to a position facing the substrate holding position of the second processing unit by turning and / or raising and lowering the substrate transfer device, and subsequently An unloading operation for unloading the third substrate from the second processing unit is performed by moving the one substrate holding hand to below the substrate holding position and further moving the hand to above the substrate holding position.

  Furthermore, in this substrate transport method, the second substrate holding hand is moved to a position facing the first processing unit by turning and / or raising and lowering the substrate transport device, and subsequently the second substrate holding hand. Is moved to above the substrate holding position, and further, the hand is moved below the substrate holding position to execute a loading operation for loading the first substrate into the first processing unit.

  Further, in this substrate transfer method, the third substrate holding hand is moved to a position facing the substrate holding position of the second processing unit by turning and / or raising and lowering the substrate transfer apparatus, and subsequently A carry-in operation for carrying the second substrate into the second processing unit is performed by moving the three-substrate holding hand to above the substrate holding position and further moving the hand below the substrate holding position.

  According to a thirteenth aspect of the present invention, the carry-in operation, the carry-out operation, the simultaneous pick-up operation, or the simultaneous transfer operation is performed using a linear motion mechanism that linearly moves the substrate holding hand. It is a board | substrate conveyance method in the substrate processing apparatus as described in any one of 9-12.

  According to a fourteenth aspect of the present invention, the first processing unit and the second processing unit are disposed so as to be horizontally opposed to each other with the substrate transfer device interposed therebetween. It is a board | substrate conveyance method in the described substrate processing apparatus.

  The invention described in claim 15 is described in any one of claims 9 to 13, wherein the first processing unit and the second processing unit are arranged so as to surround the substrate transfer apparatus in a plan view. It is the substrate conveyance method in a substrate processing apparatus.

  In addition, the alphanumeric characters in parentheses represent corresponding components in the embodiments described later.

1 is an illustrative plan view showing a layout of a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic side view of the substrate processing apparatus viewed from the direction of arrow II in FIG. 1. It is an illustration side view which shows schematic structure of a back surface processing unit. It is a schematic side view of the main robot. It is the typical perspective view which looked at the 2nd upper hand and the 2nd lower hand of the main robot from the slanting upper part. It is an illustration side view of an inversion unit and a substrate mounting part. It is a block diagram for demonstrating the electrical structure of a substrate processing apparatus. It is a schematic diagram for demonstrating an example of operation | movement when carrying one board | substrate in a surface treatment unit with a main robot. It is a schematic diagram for demonstrating an example of operation | movement when exchanging one board | substrate between a main robot and a surface treatment unit. It is a schematic diagram for demonstrating an example of operation | movement when carrying in one board | substrate from the main robot to the inversion unit. It is a schematic diagram for demonstrating an example of operation | movement when carrying in two board | substrates simultaneously to a reversing unit by a main robot. It is a schematic diagram for demonstrating an example of operation | movement when exchanging two board | substrates between a main robot and a reversing unit. It is a schematic diagram for demonstrating an example of operation | movement when carrying one board | substrate in a board | substrate mounting part from a main robot. It is a schematic diagram for demonstrating an example of operation | movement when carrying in two board | substrates simultaneously at the board | substrate mounting part by a main robot. It is a table | surface which shows an example of the relationship between operation | movement of a main robot, and the design time required for the operation | movement. It is a table | surface for demonstrating an example of the conveyance operation of a board | substrate when processing the surface of a board | substrate once. It is a table | surface which shows the comparative example with respect to the conveyance operation | movement shown in FIG. It is a table | surface for demonstrating an example of the conveyance operation of a board | substrate when processing the back surface of a board | substrate once. It is a table | surface which shows the comparative example with respect to the conveyance operation | movement shown in FIG. It is a table | surface for demonstrating an example of the conveyance operation of the board | substrate W when processing the surface and back surface of a board | substrate once. It is a table | surface which shows the comparative example with respect to the conveyance operation | movement shown in FIG. It is an illustration top view of the substrate processing apparatus concerning a 2nd embodiment of this invention. It is an illustration front view of the inversion unit with which the substrate processing apparatus concerning a 2nd embodiment was equipped. It is an illustrative side view of the reversing unit provided in the substrate processing apparatus according to the second embodiment. It is a table | surface for demonstrating an example of the conveyance operation of a board | substrate when processing the back surface of a board | substrate once. It is a table | surface for demonstrating an example of the conveyance operation of a board | substrate when processing the front surface and back surface of a board | substrate once. It is an illustrative top view which shows the layout of the conventional substrate processing apparatus.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[First Embodiment]
[Configuration of Substrate Processing Apparatus 1]
FIG. 1 is a schematic plan view showing a layout of a substrate processing apparatus 1 according to a first embodiment of the present invention. FIG. 2 is a schematic side view of the substrate processing apparatus 1 viewed from the direction of arrow II in FIG.

The substrate processing apparatus 1 is a single-wafer type apparatus that processes substrates W such as semiconductor wafers one by one. The substrate processing apparatus 1 includes an indexer block 2 and a processing block 3 coupled to the indexer block 2.
The indexer block 2 includes a carrier holding unit 4 (substrate holding unit), an indexer robot IR (second substrate transfer device), and an indexer robot moving mechanism 5 (hereinafter referred to as “IR moving mechanism 5”). Yes.

  The carrier holding unit 4 can hold a carrier C that can accommodate a plurality of substrates W. The carrier C can hold, for example, a plurality of substrates W horizontally at a certain interval in the vertical direction, and holds the plurality of substrates W with the surface facing up. The carrier C is held by the carrier holding unit 4 in a state of being arranged along a predetermined arrangement direction U (hereinafter referred to as “carrier arrangement direction U”). The IR moving mechanism 5 can move the indexer robot IR horizontally along the carrier arrangement direction U.

  The indexer robot IR can perform a loading operation for loading the processed substrate W into the carrier C held by the carrier holding unit 4 and a loading operation for unloading the unprocessed substrate W from the carrier C. When the IR moving mechanism 5 moves the indexer robot IR horizontally along the carrier arrangement direction U, the indexer robot IR can be made to face each carrier C. The indexer robot IR performs a loading operation for loading the processed substrate W into the carrier C and / or a loading operation for unloading the unprocessed substrate W from the carrier C at a position facing the carrier C. Can do.

  The indexer robot IR includes a first upper hand 7 attached to the tip of the first upper arm 6 and a first lower hand 9 attached to the tip of the first lower arm 8. The first upper hand 7 and the first lower hand 9 are arranged with their heights shifted in the vertical direction so as not to interfere with each other (in FIG. 1, the first upper hand 7 and the first lower hand 9 overlap each other vertically). ing.). The indexer robot IR can hold the substrates W horizontally one by one with the hands 7 and 9.

  Each of the first upper arm 6 and the first lower arm 8 is an articulated bending-extension arm. The indexer robot IR can move the hands 7 and 9 corresponding to the arms 6 and 8 horizontally by extending and contracting the first upper arm 6 or the first lower arm 8 independently. Thereby, the first upper hand 7 and the first lower hand 9 can each access the carrier C.

  Although not shown, the indexer robot IR includes a turning mechanism and a lift drive mechanism. The turning mechanism can rotate the first upper hand 7 and the first lower hand 9 together with the corresponding arms 6 and 8 around a predetermined vertical axis. Moreover, the raising / lowering drive mechanism can raise / lower the 1st upper hand 7 and the 1st lower hand 9 with the corresponding arms 6 and 8 to a perpendicular direction.

  The indexer robot IR is moved along the carrier arrangement direction U by the IR moving mechanism 5, and the first upper hand 7 and the first lower hand 9 are rotated around a predetermined vertical axis by the turning mechanism, thereby The upper hand 7 and the first lower hand 9 can be made to face each carrier C. The indexer robot IR corresponds to the arms 6 and 8 by extending the first upper arm 6 or the first lower arm 8 with the first upper hand 7 and the first lower hand 9 facing the carrier C. The hands 7 and 9 can access the carrier C.

  On the other hand, the processing block 3 includes a plurality of processing units 10 (processing units, substrate holding positions) for processing the substrates W one by one, and a main robot MR (substrate transport apparatus). The main robot MR can perform a carry-in operation for carrying the substrate W into and out of the plurality of processing units 10 and a carry-out operation for carrying the substrate W out of the processing unit 10. Can be delivered. In the present embodiment, for example, eight processing units 10 are provided, and a first processing unit unit 11 and a second processing unit unit 12 in which four processing units 10 are stacked in the vertical direction are configured. ing.

  The first and second processing unit parts 11 and 12 are arranged side by side with a predetermined distance apart in the carrier arrangement direction U. Further, as shown in FIG. 1, the first and second processing unit units 11 and 12 and the carrier holding unit 4 are arranged at a predetermined distance in the horizontal direction orthogonal to the carrier arrangement direction U. The main robot MR is arranged between the first processing unit unit 11 and the second processing unit unit 12, and the indexer robot IR is connected between the first and second processing unit units 11, 12 and the carrier holding unit 4. Arranged between.

  In each processing unit 10 constituting the first processing unit unit 11, for example, a process such as cleaning is performed on the surface of the substrate W. Further, in each processing unit 10 constituting the second processing unit unit 12, for example, processing such as cleaning is performed on the back surface of the substrate W. Hereinafter, the processing unit 10 configuring the first processing unit unit 11 is also referred to as “surface processing unit 10”, and the processing unit 10 configuring the second processing unit unit 12 is also referred to as “back surface processing unit 10”. In FIG. 2, the four surface treatment units 10 are displayed as SS1, SS2, SS3, and SS4 in order from the top, and the four back surface treatment units 10 are displayed as SSR1, SSR2, SSR3, and SSR4 in order from the top.

  The main robot MR includes a second upper hand 14 attached to the tip of the second upper arm 13 (first arm) and a second lower hand attached to the tip of the second lower arm 15 (second arm). 16. As shown in FIG. 2, the second upper hand 14 and the second lower hand 16 are arranged with their heights shifted in the vertical direction so as not to interfere with each other. As will be described later, each of the second upper hand 14 and the second lower hand 16 includes a plurality of substrate holding hands. The main robot MR can horizontally hold a plurality of substrates W by the hands 14 and 16 (two in the first embodiment).

  Further, each of the second upper arm 13 and the second lower arm 15 is an articulated bending-extension arm. The main robot MR can horizontally move the hands 14 and 16 corresponding to the arms 13 and 15 by extending and contracting the second upper arm 13 and the second lower arm 15 independently. As a result, the second upper hand 14 and the second lower hand 16 can access the processing unit 10. A specific configuration of the main robot MR including the hands 14 and 16 will be described later.

  In addition, at the boundary between the indexer block 2 and the processing block 3, a reversing unit RT1 (substrate holding position) and a reversing unit RT2 (substrate holding position) for reversing the substrate W, an indexer robot IR, a main robot MR, A substrate platform PASS1 (relay position, substrate holding position) and a substrate platform PASS2 (relay position, substrate holding position) for transferring the substrate W between the two are disposed. As shown in FIG. 2, the substrate platforms PASS1, PASS2 are arranged side by side (the substrate platform PASS1 is arranged on the upper side), and the reversing units RT1, RT2 are arranged on the substrate platform. The parts PASS1 and PASS2 are arranged between the upper and lower sides. The reversing unit RT1 is provided above the substrate platform PASS1, and the reversing unit RT2 is provided below the substrate platform PASS2.

  Each of the reversing units RT1 and RT2 can horizontally hold a plurality of (in this first embodiment, two) substrates W. Further, the reversing units RT1 and RT2 can reverse the top and bottom of the held substrate W, respectively. The reversing units RT1, RT2 can be accessed from the main robot MR side. The main robot MR can carry the substrate W into the reversing units RT1 and RT2, and can carry out the substrate W reversed by the reversing units RT1 and RT2 from the reversing units RT1 and RT2.

  Further, each of the substrate platforms PASS1, PASS2 can hold a plurality of (for example, two) substrates W horizontally while supporting the substrate W from below. The indexer robot IR and the main robot MR can access the substrate platforms PASS1 and PASS2, respectively. When the substrate W is transferred between the indexer robot IR and the main robot MR, the substrate W is temporarily placed in the substrate platforms PASS1, PASS2. The upper substrate platform PASS1 is used when transporting the substrate W from the processing block 3 to the indexer block 2, and the lower substrate platform PASS2 transports the substrate W from the indexer block 2 to the processing block 3. Used when.

  Further, in the processing block 3, reversing units RT1 'and RT2' are vertically stacked on the opposite side of the main robot MR from the reversing units RT1 and RT2. (The reversing units RT1 'and RT2' are not shown in FIG. 2.) The reversing units RT1 'and RT2' can be accessed from the main robot MR side. The configuration of the reversing units RT1 'and RT2' is the same as that of the reversing units RT1 and RT2.

FIG. 3 is a schematic side view showing a schematic configuration of the surface treatment unit 10.
The surface processing unit 10 includes, for example, a spin chuck 18 that horizontally holds and rotates a single substrate W in a processing chamber 17 partitioned by partition walls, and an upper surface (surface) of the substrate W held by the spin chuck 18. ) Is provided with a processing liquid nozzle 19 for supplying a processing liquid and a brush mechanism 20 for cleaning the upper surface of the substrate W.

  The spin chuck 18 is, for example, a vacuum chuck, and is attached to the spin shaft 21 extending in the vertical direction and the upper end of the spin shaft 21 to suck the lower surface (back surface) of the substrate W in a horizontal posture. And a spin motor 23 having a rotation shaft coupled coaxially with the spin shaft 21. When the spin motor 23 is driven in a state where the lower surface of the substrate W is sucked and held by the suction base 22, the substrate W is rotated around the central axis of the spin shaft 21.

  Further, the processing liquid nozzle 19 is disposed above the spin chuck 18 with its discharge port directed downward. A processing liquid supply pipe 24 is connected to the processing liquid nozzle 19, and a processing liquid from a processing liquid supply source (not shown) is supplied through the processing liquid supply pipe 24. The processing liquid supply pipe 24 is provided with a processing liquid valve 24 a for switching between supply and stop of processing liquid to the processing liquid nozzle 19.

  Further, the brush mechanism 20 is disposed outside the rotation range of the substrate W, the brush 25 for cleaning the upper surface of the substrate W, the swing arm 26 extending horizontally above the position where the spin chuck 18 holds the substrate W, and the like. And an arm support shaft 27 that supports the base end of the swing arm 26 from below. Although not shown, the arm support shaft 27 is connected to a moving mechanism that moves the brush 25 and the swing arm 26 integrally. By moving the brush 25 and the swing arm 26 by the moving mechanism, the brush 25 can be brought into contact with the upper surface of the substrate W held by the spin chuck 18, and the brush 25 is brought into contact with the substrate W. In this state, the brush 25 can be moved along the upper surface of the substrate W.

  When cleaning the surface of the substrate W with the brush 25, the brush 25 is moved above the substrate W held by the spin chuck 18 with the surface facing up. Then, the processing liquid (for example, pure water (deionized water)) is supplied from the processing liquid nozzle 19 to the upper surface of the substrate W while rotating the substrate W by the spin chuck 18, and the brush 25 is pressed against the upper surface of the substrate W. Further, the brush 25 is moved along the upper surface of the substrate W while the brush 25 is pressed against the upper surface of the substrate W. Thereby, the upper surface of the substrate W can be scanned with the brush 25 and the entire surface of the substrate W can be scrubbed. In this way, the process for the surface of the substrate W is performed.

  Although not shown, the back surface processing unit 10 has substantially the same configuration as the surface processing unit 10. More specifically, in the back surface processing unit 10, for example, a mechanical chuck that rotates while cooperatively holding the peripheral end surface of the substrate W by a plurality of holding members is used as the spin chuck 18. The substrate W carried into the back surface processing unit 10 is sandwiched at its peripheral end surface with its back surface facing upward. Then, the liquid is rotated around a vertical axis passing through the back surface of the substrate W, and the processing liquid is discharged so as to arrive at a range including the rotation center of the back surface of the substrate W. Then, a brush is pressed against the back surface of the substrate W, and scrub cleaning is performed on the back surface of the substrate W.

FIG. 4 is a schematic side view of the main robot MR. FIG. 5 is a schematic perspective view of the second upper hand 14 and the second lower hand 16 of the main robot MR as viewed obliquely from above.
The main robot MR has a base part 28. One end of each of the second upper arm 13 and the second lower arm 15 is attached to the base portion 28. The second upper hand 14 and the second lower hand 16 are held on the base portion 28 via the second upper arm 13 and the second lower arm 15, respectively.

  Further, the base portion 28 includes an upward / backward drive mechanism 29 (first arm moving means) for bending and extending the second upper arm 13 to advance and retract the second upper hand 14 in the horizontal direction, and a second lower arm 15. A downward advance / retreat drive mechanism 30 (second arm moving means) for causing the second lower hand 16 to advance and retract in the horizontal direction, a turning mechanism 31 for rotating the base portion 28 around the vertical axis, An elevating drive mechanism 32 for elevating the base portion 28 in the vertical direction is incorporated.

  The second upper arm 13 and the second lower arm 15 are bent and extended independently of each other by the upward / reverse driving mechanism 29 and the downward / reverse driving mechanism 30, respectively. Accordingly, the second upper hand 14 and the second lower hand 16 are advanced and retracted independently of each other. The second upper hand 14 attached to the second upper arm 13 advances and retreats above the second lower hand 16 attached to the second lower arm 15. In the initial state in which the second upper arm 13 and the second lower arm 15 are retracted above the base portion 28, the second upper hand 14 and the second lower hand 16 are in the same position when viewed from the vertical direction. (See FIG. 1).

  The second upper hand 14 and the second lower hand 16 are rotated about a predetermined vertical axis by the turning mechanism 31. Further, the second upper hand 14 and the second lower hand 16 are moved up and down in the vertical direction by the lifting drive mechanism 32. By rotating the second upper hand 14 and the second lower hand 16 around a predetermined vertical axis and moving them up and down in the vertical direction, these hands 14 and 16 can be made to face each processing unit 10. Then, with the second upper hand 14 and the second lower hand 16 facing one of the processing units 10, the second upper arm 13 or the second lower arm 15 is extended to correspond to the arms 13 and 15. The hands 14 and 16 to be accessed can access the processing unit 10.

  As shown in FIG. 5, the second upper hand 14 includes a pair of substrate holding hands 14 a and 14 b that are arranged vertically apart from each other. Each of the substrate holding hands 14a and 14b is, for example, formed in a bifurcated fork shape. The pair of substrate holding hands 14a and 14b have the same shape and are arranged so as to overlap in plan view. Each of the substrate holding hands 14a and 14b can hold a single substrate W horizontally by supporting the peripheral portion of the lower surface of the substrate W from below. Therefore, the second upper hand 14 can hold the two substrates W horizontally with a pair of substrate holding hands 14a and 14b spaced apart vertically.

  The second lower hand 16 has the same shape as the second upper hand 14, and the pair of substrate holding hands 16 a and 16 b can hold the two substrates W horizontally with a space therebetween in the vertical direction. Since the second lower hand 16 has the same shape as the second upper hand 14, the vertical distance between the two substrates W held by the second lower hand 16 is held by the second upper hand 14. It becomes equal to the interval between the two substrates W in the vertical direction.

  FIG. 6 is a schematic side view of the reversing units RT1 and RT2 and the substrate platforms PASS1 and PASS2. Hereinafter, configurations of the reversing unit RT1 and the substrate platform PASS1 will be described. Since the reversing unit RT2 has the same configuration as that of the reversing unit RT1, its description is omitted. Similarly, since the substrate platform PASS2 has the same configuration as the substrate platform PASS1, the description thereof is omitted. In FIG. 6, the configuration of the reversing unit RT2 corresponding to the reversing unit RT1 is given the same reference numeral as that of the reversing unit RT1, and the configuration of the substrate platform PASS2 corresponding to the substrate platform PASS1 is The same reference numerals as those of the placement unit PASS1 are given. Further, since the reversing units RT1 'and RT2' have the same configuration as that of the reversing unit RT1, description thereof will be omitted.

  The reversing unit RT1 has a fixed plate 33 arranged horizontally and a pair of movable plates 34 arranged horizontally with the fixed plate 33 sandwiched vertically. The fixed plate 33 and the pair of movable plates 34 are each rectangular and are arranged so as to overlap in plan view. The fixed plate 33 is fixed to the support plate 35 in a horizontal state, and each movable plate 34 is attached to the support plate 35 in a horizontal state via a guide 36 extending in the vertical direction. Each movable plate 34 is movable in the vertical direction with respect to the support plate 35. Each movable plate 34 is moved in the vertical direction by an actuator (not shown) such as an air cylinder. A rotation actuator 37 is attached to the support plate 35. The fixed plate 33 and the pair of movable plates 34 are integrally rotated around a horizontal rotation axis together with the support plate 35 by a rotation actuator 37. The rotary actuator 37 can reverse the top and bottom of the fixed plate 33 and the pair of movable plates 34 by rotating the support plate 35 about a horizontal rotation axis by 180 degrees.

  Further, in the fixed plate 33 and the pair of movable plates 34, a plurality of support pins 38 are attached to surfaces facing each other (for example, the lower surface of the upper movable plate 34 and the upper surface of the fixed plate 33). The plurality of support pins 38 are arranged on each surface at appropriate intervals on a circumference corresponding to the outer peripheral shape of the substrate W. The height (length from the base end to the tip end) of each support pin 38 is constant, and is larger than the thickness (length in the vertical direction) of the substrate holding hands 14a, 14b, 16a, 16b. Yes.

  The fixing plate 33 can horizontally support a single substrate W above the plurality of support pins 38. Further, when the pair of movable plates 34 are respectively positioned on the lower side, a single substrate W can be horizontally supported above the plurality of support pins 38. The vertical distance between the substrate support position by the fixed plate 33 and the substrate support position by the movable plate 34 is equal to the vertical distance between the two substrates W held by the hands 14 and 16 of the main robot MR. Is set to

  With the substrate W placed on the fixed plate 33, the upper movable plate 34 is lowered to hold the substrate W horizontally between the fixed plate 33 and the upper movable plate 34. . Further, by raising the lower movable plate 34 in a state where the substrate W is placed on the lower movable plate 34, the substrate W is fixed between the fixed plate 33 and the lower movable plate 34. Can be held horizontally. Then, with the substrate W held in the reversing unit RT1, the support plate 35 is rotated around the horizontal rotation axis by the rotary actuator 37, whereby the held substrate W can be turned upside down.

  On the other hand, the substrate platform PASS1 has a multi-story structure (for example, a two-story structure) stacked in the vertical direction. A plurality of support pins 39 for supporting the lower surface of the substrate W are provided on each floor of the substrate platform PASS1. The plurality of support pins 39 on each floor are mounted on the mounting plate 40 so that the upper ends thereof have the same height. The height of each support pin 39 is set larger than the thickness (length in the vertical direction) of the substrate holding hands 14a, 14b, 16a, 16b.

  The substrate platform PASS1 can hold the substrates W horizontally one by one on the mounting plate 40 on each floor by supporting the substrate W by the plurality of support pins 39. The distance between the two substrates W held by the substrate platform PASS1 in the vertical direction is equal to the distance between the two substrates W held by the hands 14 and 16 of the main robot MR in the vertical direction. Is set to

FIG. 7 is a block diagram for explaining the electrical configuration of the substrate processing apparatus 1.
The substrate processing apparatus 1 includes a main control unit 41 (control device). The main control unit 41 includes a computer including a CPU (Central Processing Unit). The main control unit 41 is provided in the indexer block 2 (see FIG. 1). The main controller 41 is connected to the indexer robot IR, the main robot MR, the IR moving mechanism 5, the reversing units RT1, RT2, RT1 ′, RT2 ′, and the processing units 10 as control targets. The operations of the indexer robot IR, main robot MR, IR moving mechanism 5, reversing units RT1, RT2, RT1 ′, RT2 ′ and each processing unit 10 are controlled by the main control unit 41.

Below, control of the main robot MR by the main control part 41 is demonstrated. Specifically, between the processing unit 10 and the main robot MR, between the reversing units RT1, RT2, RT1 ′, RT2 ′ and the main robot MR, and between the substrate platforms PASS1, PASS2 and the main robot MR. Next, the transfer of the substrate W in the substrate processing apparatus 1 will be described, and then the transfer of the substrate W in the substrate processing apparatus 1 by the main robot MR will be described.
[Transfer of substrate W between processing unit 10 and main robot MR]
[Single-sheet delivery and single-sheet removal]
FIG. 8 is a schematic diagram for explaining an example of an operation when a single substrate W is carried into the surface treatment unit 10 by the main robot MR.

  As described above, the main robot MR can perform a loading operation for loading the substrate W into the plurality of processing units 10 and a loading operation for unloading the substrate W from the processing unit 10. When a single substrate W is carried into any of the surface treatment units 10, for example, the main control unit with the single substrate W held by the substrate holding hand 14 a on the upper side of the second upper hand 14. 41 controls the turning mechanism 31 and the lift drive mechanism 32 to make the second upper hand 14 face the surface treatment unit 10. More specifically, as shown in FIG. 8A, the substrate W held by the second upper hand 14 is positioned above the holding position of the substrate W by the spin chuck 18 in the second state. The upper hand 14 is made to face one of the processing units 10.

Then, the main control unit 41 controls the upward / backward drive mechanism 29 to extend the second upper arm 13. As a result, the second upper hand 14 moves horizontally and enters the surface treatment unit 10, and as shown in FIG. 8B, the substrate W held by the substrate holding hand 14 a on the upper side of the second upper hand 14. Is disposed above the spin chuck 18.
Thereafter, the main control unit 41 controls the lifting drive mechanism 32 to lower the second upper hand 14. Thus, as shown in FIG. 8C, the substrate W held by the upper substrate holding hand 14a of the second upper hand 14 is placed on the spin chuck 18, and the substrate W is held by the upper substrate holding hand 14a. It is passed from the hand 14a to the spin chuck 18. Then, the main control unit 41 controls the upward / backward drive mechanism 29 to contract the second upper arm 13. As a result, the second upper hand 14 retreats from the surface treatment unit 10 (one-sheet passing operation).

  When the second upper hand 14 is lowered, as shown in FIG. 8C, the second upper hand 14 overlaps the spin chuck 18 in a side view (viewed from the horizontal direction). However, since the substrate holding hands 14a and 14b have a forked shape, the spin chuck 18 does not enter the substrate holding hands 14a and 14b and interfere with the second upper hand 14 at this time. .

In the above-described series of operations, the case where a single substrate W is carried into any of the surface treatment units 10 using the upper substrate holding hand 14a of the second upper hand 14 has been described. When using (the substrate holding hands 14b on the lower side of the second upper hand 14 and the upper and lower substrate holding hands 16a, 16b of the second lower hand 16), the heights of the second upper hand 14 and the second lower hand 16 are set. By changing and performing the same operation as the above-described series of operations, one substrate W can be carried into any of the surface treatment units 10. Although specific explanation is omitted, when a single substrate W is unloaded from any of the surface treatment units 10, any of the substrates of the main robot MR is performed by performing the above-described series of operations in reverse. One substrate W can be unloaded from any of the processing units 10 using the holding hands 14a, 14b, 16a, 16b (single-sheet taking operation).
[Replacement operation for a single substrate W]
Next, an example of an operation when a single substrate W is exchanged between the main robot MR and the surface treatment unit 10 will be described.

FIG. 9 is a schematic diagram for explaining an example of an operation when one substrate W is exchanged between the main robot MR and the surface treatment unit 10.
When exchanging one substrate W between the main robot MR and the surface treatment unit 10, for example, the substrate W is held by the surface treatment unit 10 and the second lower hand 16 one by one. One substrate W is unloaded from the surface treatment unit 10 by the hand 14 (single-sheet removal operation), and then one substrate W is loaded into the surface treatment unit 10 by the second lower hand 16 (one-sheet delivery operation). . That is, the upper and lower hands 14 and 16 of the main robot MR cause one of the surface treatment units 10 to continuously perform a single sheet picking operation and a single sheet transferring operation.

  Specifically, the main control unit 41 controls the turning mechanism 31 and the elevation drive mechanism 32 so that the second upper hand 14 and the second lower hand 16 are opposed to any one of the surface treatment units 10. At this time, as shown in FIG. 9A, the second upper hand 14 is held by the spin chuck 18 by the substrate holding hand (the upper substrate holding hand 14a in this example of operation) that carries the substrate W out. The height is lowered or lowered to a height below the lower surface of the substrate W.

Next, the main control unit 41 controls the upward / backward drive mechanism 29 to extend the second upper arm 13. As a result, as shown in FIG. 9B, the second upper hand 14 enters the surface treatment unit 10, and the substrate holding hand 14 a above the second upper hand 14 is held by the spin chuck 18. It is arranged below.
Thereafter, the main control unit 41 controls the lifting drive mechanism 32 to raise the second upper hand 14. As a result, as shown in FIG. 9C, the substrate W is picked up from the spin chuck 18 by the upper substrate holding hand 14a of the second upper hand 14, and the substrate W is held by the upper substrate holding hand 14a. . After one substrate W is held by the second upper hand 14, the main control unit 41 controls the upward / backward drive mechanism 29 to contract the second upper arm 13. As a result, as shown in FIG. 9D, the second upper hand 14 is retracted from the surface treatment unit 10 together with the single substrate W. In this way, one substrate W is unloaded from the surface treatment unit 10 (single-sheet taking operation).

  After the single sheet picking operation is performed, a single sheet passing operation is performed on the same surface treatment unit 10. That is, as shown in FIG. 9D, when the main control unit 41 scoops the substrate W from the spin chuck 18 in the above-described single picking operation, the substrate W held by the second lower hand 16 spins. The second lower hand 16 is raised to a height above the chuck 18. Furthermore, the main control unit 41 extends the second lower arm 15 in parallel with retracting the second upper hand 14 from the surface treatment unit 10 by controlling the upward / backward drive mechanism 29 and the downward / backward drive mechanism 30. Let Therefore, as shown in FIG. 9D, the second lower hand 16 enters the processing unit 10 in parallel with the second upper hand 14 retracting from the surface processing unit 10. Accordingly, as shown in FIG. 9E, the substrate W held by the substrate holding hand 16a on the upper side of the second lower hand 16 is arranged above the spin chunk.

Next, the main control unit 41 controls the elevation drive mechanism 32 to lower the second lower hand 16 as shown in FIG. As a result, the substrate W is placed on the spin chuck 18, and the substrate W is transferred from the second lower hand 16 to the spin chuck 18. Then, the main control unit 41 controls the downward advance / retreat drive mechanism 30 to contract the second lower arm 15. As a result, the second lower hand 16 moves away from the surface treatment unit 10 (one-sheet passing operation). In this way, the single wafer picking operation and the single wafer transfer operation are performed continuously, and the replacement operation of the single substrate W is performed between the main robot MR and the surface treatment unit 10.
[Transfer of Substrate W between Reversing Units RT1, RT2, RT1 ′, RT2 ′ and Main Robot MR]
[Single-sheet delivery and single-sheet removal]
FIG. 10 is a schematic diagram for explaining an example of an operation when a single substrate W is carried into the reversing unit RT1 from the main robot MR.

When a single substrate W is transferred from the main robot MR to the reversing unit RT1, for example, one substrate W is held with respect to the reversing unit RT1 while the substrate W is held by the substrate holding hand 14a on the upper side of the second upper hand 14. Let the passing action take place.
Specifically, the main control unit 41 controls the turning mechanism 31 and the lift drive mechanism 32 to make the second upper hand 14 face the reversing unit RT1. At this time, as shown in FIG. 10A, the second upper hand 14 has the substrate W held by the upper substrate holding hand 14a positioned more than the substrate support position by the lower movable plate 34 of the reversing unit RT1. It is raised or lowered to an upper height.

Next, the main control unit 41 controls the upward / backward drive mechanism 29 to extend the second upper hand 14. As a result, the second upper hand 14 enters the reversing unit RT1, and the substrate W held by the substrate holding hand 14a on the upper side of the second upper hand 14 is turned into the reversing unit RT1 as shown in FIG. 10B. It is arranged above the substrate support position by the lower movable plate 34.
Thereafter, the main control unit 41 controls the lifting drive mechanism 32 to lower the second upper hand 14. As a result, as shown in FIG. 10C, the substrate W is placed on the lower movable plate 34, and the substrate W is transferred from the second upper hand 14 to the reversing unit RT1. Then, the main control unit 41 controls the upward / backward drive mechanism 29 to contract the second upper arm 13. As a result, the second upper hand 14 retreats from the reversing unit RT1 (one-sheet passing operation).

  When the substrate W is transferred from the second upper hand 14 to the reversing unit RT1, the substrate holding hand 14a on the upper side of the second upper hand 14 is viewed from the side (as viewed from the horizontal direction) as shown in FIG. ) Overlaps with a plurality of support pins 38 attached to the lower movable plate 34. However, the substrate holding hand 14 a on the upper side of the second upper hand 14 enters between the support pins 38 in a plan view and does not interfere with the support pins 38. Further, since the height of each support pin 38 is larger than the thickness of each substrate holding hand 14a, 14b, 16a, 16b, the substrate holding hand 14a on the upper side of the second upper hand 14 is attached to the upper mounting plate 40. There is no interference.

In the series of operations described above, the case where one substrate W is carried into the reversing unit RT1 using the substrate holding hand 14a on the upper side of the second upper hand 14 has been described. However, the other substrate holding hands 14b, 16a, 16b are When used, by changing the height of the second upper hand 14 and the second lower hand 16 and performing the same operation as the above-described series of operations, it is possible to carry one substrate W into the reversing unit RT1. it can. Further, a single substrate W can be loaded by causing the reversing units RT2, RT1 ′, RT2 ′ to perform the same operation as the series of operations described above. Furthermore, although a specific description is omitted, when carrying out a single substrate W from the reversing units RT1, RT2, RT1 ′, RT2 ′, the above-described series of operations are reversed to perform the main robot MR. One of the substrates W can be carried out from the reversing units RT1, RT2, RT1 ′, RT2 ′ using any one of the substrate holding hands 14a, 14b, 16a, 16b (single-sheet taking operation).
[Simultaneous delivery operation and simultaneous operation]
Next, an example of an operation when two substrates W are simultaneously carried into the reversing unit RT1 by the main robot MR will be described.

FIG. 11 is a schematic diagram for explaining an example of the operation when the main robot MR carries two substrates W into the reversing unit RT1 at the same time.
When two substrates W are simultaneously carried into the reversing unit RT1 by the main robot MR, for example, two substrates W are held in the upper and lower substrate holding hands 14a and 14b of the second upper hand 14 one by one. Are simultaneously loaded into the reversing unit RT1 (simultaneous transfer operation).

  Specifically, the main control unit 41 controls the turning mechanism 31 and the lift drive mechanism 32 to make the second upper hand 14 face the reversing unit RT1. At this time, as shown in FIG. 11A, the second upper hand 14 has two substrates W held by the upper and lower substrate holding hands 14a and 14b, respectively, It is raised or lowered to a height above the substrate support position by the lower movable plate 34.

  As described above, the vertical interval between the substrate support position by the fixed plate 33 and the substrate support position by the movable plate 34 is in the vertical direction of the two substrates W held by the hands 14 and 16 of the main robot MR. For example, if the upper substrate W is placed on the substrate support position by the fixing plate 33, the two substrates W are respectively fixed to the substrate by the fixing plate 33. It can be arranged on the support position and the substrate support position by the lower movable plate 34.

  Next, the main control unit 41 controls the upward / backward drive mechanism 29 to extend the second upper hand 14. As a result, the second upper hand 14 enters the reversing unit RT1, and as shown in FIG. 11B, the two substrates held by the upper and lower substrate holding hands 14a and 14b of the second upper hand 14, respectively. W is disposed above the substrate support position by the fixed plate 33 and the substrate support position by the lower movable plate 34, respectively.

  Thereafter, the main control unit 41 controls the lifting drive mechanism 32 to lower the second upper hand 14. Thus, as shown in FIG. 11C, the substrate W is simultaneously placed on the fixed plate 33 and the lower movable plate 34, and the two substrates W are simultaneously placed on the reversing unit RT1 from the second upper hand 14. Passed. Then, the main control unit 41 controls the upward / backward drive mechanism 29 to contract the second upper arm 13. As a result, the second upper hand 14 retreats from the reversing unit RT1 (simultaneous transfer operation).

In the series of operations described above, the case where two substrates W are simultaneously loaded into the reversing unit RT1 using the second upper hand 14 has been described. However, when the second lower hand 16 is used, the height of the second lower hand 16 is increased. By changing the height and performing the same operation as the above-described series of operations, it is possible to simultaneously carry two substrates W into the reversing unit RT1 using the second lower hand 16. Further, two substrates W can be loaded simultaneously by causing the reversing units RT2, RT1 ′, RT2 ′ to perform the same operation as the series of operations described above. Furthermore, although a specific description is omitted, when the two substrates W are simultaneously carried out from the reversing units RT1, RT2, RT1 ′, RT2 ′, the main robot MR is performed by reversing the above-described series of operations. The two substrates W can be carried out simultaneously from the reversing units RT1, RT2, RT1 ′, RT2 ′ using any one of the hands 14, 16 (simultaneous taking operation).
[Replacement operation for two substrates W]
Next, an example of an operation when exchanging two substrates W between the main robot MR and the reversing units RT1 and RT2 will be described.

FIG. 12 is a schematic diagram for explaining an example of an operation when two substrates W are exchanged between the main robot MR and the reversing units RT1 and RT2.
When exchanging two substrates W between the main robot MR and the reversing units RT1 and RT2, for example, the second upper hand 14 or the second lower hand 16 of the main robot MR and the reversing unit RT1 or reversing unit RT2 are used. In the state where the substrates W are held two by two, the two substrates W are simultaneously unloaded from the reversing unit holding the substrates W (simultaneous taking operation), and then the reversing unit where the substrates W are not held. At the same time, two substrates W are carried in (simultaneous delivery operation). That is, the upper and lower hands 14 and 16 of the main robot MR cause the reversing units RT1 and RT2 to continuously perform the simultaneous taking operation and the simultaneous passing operation, respectively.

  Specifically, in order to cause the reversing unit RT1 to simultaneously perform the reversing unit RT1 using the second lower hand 16, the main control unit 41 controls the turning mechanism 31 and the lifting drive mechanism 32, and the second lower hand 16 The hand 16 is opposed to the reversing unit RT1. At this time, as shown in FIG. 12A, the second lower hand 16 is such that the upper and lower substrate holding hands 16a and 16b are respectively a substrate support position by the fixed plate 33 and a substrate support position by the lower movable plate 34. The height is raised or lowered to a lower level.

Next, the main control unit 41 controls the downward advance / retreat drive mechanism 30 to extend the second lower hand 16. As a result, the second lower hand 16 enters the inside of the reversing unit RT1, and the upper and lower substrate holding hands 16a and 16b of the second lower hand 16 are respectively placed on the fixed plate 33 and the second lower hand 16 as shown in FIG. It is disposed below the substrate W held on the lower movable plate 34.
Thereafter, the main control unit 41 controls the lifting drive mechanism 32 to raise the second lower hand 16. Thereby, as shown in FIG. 12C, the two substrates W held by the reversing unit RT1 are simultaneously scooped by the upper and lower substrate holding hands 16a and 16b of the second lower hand 16, respectively. It is simultaneously held by the upper and lower substrate holding hands 16a and 16b. Then, the main control unit 41 controls the downward advance / retreat drive mechanism 30 to contract the second lower arm 15. As a result, the second lower hand 16 moves away from the reversing unit RT1 together with the two substrates W (simultaneous taking operation).

  After the simultaneous taking operation is performed, the simultaneous passing operation is performed to the reversing unit RT2 using the second upper hand 14. That is, the main control unit 41 controls the lifting drive mechanism 32 to lower the second upper hand 14 and the second lower hand 16 so that the second upper hand 14 faces the reversing unit RT2. At this time, as shown in FIG. 12 (d), the second upper hand 14 moves the substrate W held by the upper and lower substrate holding hands 14a, 14b to the substrate support position by the fixing plate 33 of the reversing unit RT2, respectively. It is raised or lowered to a height above the substrate support position by the lower movable plate 34.

  Next, the main control unit 41 extends the second upper arm 13 by controlling the upward / backward drive mechanism 29. As a result, the second upper hand 14 enters the reversing unit RT2, and the substrates W held by the upper and lower substrate holding hands 14a and 14b of the second upper hand 14 are respectively shown in FIG. 12 (e). The substrate support position by the fixed plate 33 and the substrate support position by the lower movable plate 34 are disposed above.

  Thereafter, the main control unit 41 controls the lifting drive mechanism 32 to lower the second upper hand 14. As a result, as shown in FIG. 12 (f), the substrate W is simultaneously placed on the fixed plate 33 and the lower movable plate 34, and the two substrates W are simultaneously placed on the reversing unit RT2 from the second upper hand 14. Passed. Then, the main control unit 41 controls the upward / backward drive mechanism 29 to contract the second upper arm 13. As a result, the second upper hand 14 retreats from the reversing unit RT2 (simultaneous transfer operation). In this way, the simultaneous taking operation and the simultaneous passing operation are continuously performed, and the replacement operation of the two substrates W is performed between the main robot MR and the reversing units RT1 and RT2.

The reversing units RT1 ′ and RT2 ′ are also operated in the same manner as the series of operations described above, so that the two substrates W are transferred between the main robot MR and the reversing units RT1 ′ and RT2 ′. Can be exchanged. Similarly, two substrates W can be exchanged between the main robot MR and any two of the reversing units RT1, RT2, RT1 ′, RT2 ′. [Transfer of substrate W between substrate platform PASS1, PASS2 and main robot MR]
[Single-sheet delivery and single-sheet removal]
FIG. 13 is a schematic diagram for explaining an example of an operation when a single substrate W is carried into the substrate platform PASS1 from the main robot MR.

When a single substrate W is transferred from the main robot MR to the substrate platform PASS1, the substrate platform PASS1 is loaded with the substrate W held by the substrate holding hand 14a on the upper side of the second upper hand 14, for example. On the other hand, one sheet is moved.
Specifically, the main control unit 41 controls the turning mechanism 31 and the elevation drive mechanism 32 to make the second upper hand 14 face the substrate platform PASS1. At this time, as shown in FIG. 13A, the second upper hand 14 is configured such that the substrate W held by the upper substrate holding hand 14a is above the lower substrate support position in the substrate platform PASS1. Has been raised or lowered to a height.

Next, the main control unit 41 controls the upward / backward drive mechanism 29 to extend the second upper hand 14. As a result, the second upper hand 14 enters the substrate platform PASS1, and as shown in FIG. 13B, the substrate W held by the substrate holding hand 14a on the upper side of the second upper hand 14 becomes the substrate. It is disposed above the lower substrate support position in the mounting portion PASS1.
Thereafter, the main control unit 41 controls the lifting drive mechanism 32 to lower the second upper hand 14 to a height at which the upper substrate holding hand 14a of the second upper hand 14 does not collide with the lower mounting plate 40. . Accordingly, as shown in FIG. 13C, the substrate W is placed on the lower mounting plate 40, and the substrate W is transferred from the second upper hand 14 to the substrate platform PASS1. Then, the main control unit 41 controls the upward / backward drive mechanism 29 to contract the second upper arm 13. As a result, the second upper hand 14 retreats from the substrate platform PASS1 (one-sheet passing operation).

  When the substrate W is transferred from the second upper hand 14 to the substrate platform PASS1, the substrate holding hand 14a on the upper side of the second upper hand 14 is shown in a side view (from the horizontal direction as shown in FIG. 13C). See) and overlap with a plurality of support pins 39 attached to the lower mounting plate 40. However, the substrate holding hand 14 a on the upper side of the second upper hand 14 enters between the support pins 39 in a plan view and does not interfere with the support pins 39. Further, since the height of each support pin 39 is larger than the thickness of each substrate holding hand 14a, 14b, 16a, 16b, the substrate holding hand 14a on the upper side of the second upper hand 14 is attached to the upper mounting plate 40. There is no interference.

In the series of operations described above, the case where one substrate W is carried into the substrate platform PASS1 using the substrate holding hand 14a on the upper side of the second upper hand 14 has been described. However, the other substrate holding hands 14b, 16a, When using 16b, by changing the height of the second upper hand 14 and the second lower hand 16 and performing the same operation as the above-described series of operations, one substrate W is placed on the substrate platform PASS1. Can be brought in. Further, a single substrate W can be loaded by causing the substrate platform PASS2 to perform the same operation as the above-described series of operations. Furthermore, although a specific description is omitted, when carrying out one substrate W from the substrate platform PASS1, PASS2, any substrate of the main robot MR is performed by performing the above-described series of operations in reverse. One substrate W can be carried out from the substrate platforms PASS1, PASS2 using the holding hands 14a, 14b, 16a, 16b (single-sheet taking operation).
[Simultaneous delivery operation and simultaneous operation]
Next, an example of the operation when the main robot MR carries two substrates W onto the substrate platform PASS1 at the same time will be described.

FIG. 14 is a schematic diagram for explaining an example of the operation when the main robot MR simultaneously carries two substrates W onto the substrate platform PASS1.
When two substrates W are simultaneously loaded into the substrate platform PASS1 by the main robot MR, for example, with the substrates W held one by one in the upper and lower substrate holding hands 14a, 14b of the second upper hand 14, Two substrates W are simultaneously carried into the substrate platform PASS1 (simultaneous delivery operation).

  Specifically, the main control unit 41 controls the turning mechanism 31 and the elevation drive mechanism 32 to make the second upper hand 14 face the substrate platform PASS1. At this time, as shown in FIG. 14A, the second upper hand 14 is configured so that the two substrates W held by the upper and lower substrate holding hands 14a and 14b are moved upward and downward in the substrate platform PASS1, respectively. It is raised or lowered to a height above the substrate support position.

  As described above, the vertical distance between the upper and lower substrate support positions in the substrate platform PASS1 is equal to the vertical distance between the two substrates W held by the hands 14 and 16 of the main robot MR. For example, if the upper substrate W is positioned on the upper substrate support position, the two substrates W can be respectively disposed on the upper and lower substrate support positions. .

  Next, the main control unit 41 controls the upward / backward drive mechanism 29 to extend the second upper hand 14. As a result, the second upper hand 14 enters the inside of the substrate platform PASS1, and as shown in FIG. 14B, the two pieces held by the upper and lower substrate holding hands 14a and 14b of the second upper hand 14, respectively. The substrates W are respectively disposed above the upper and lower substrate support positions in the substrate platform PASS1.

  After that, the main control unit 41 controls the lifting drive mechanism 32 so that the upper and lower substrate holding hands 14a and 14b of the second upper hand 14 are moved to a height at which they do not interfere with the upper and lower mounting plates 40, respectively. Lower. As a result, as shown in FIG. 14C, the substrates W are simultaneously placed on the upper and lower mounting plates 40, and the two substrates W are simultaneously transferred from the second upper hand 14 to the substrate platform PASS1. Then, the main control unit 41 controls the upward / backward drive mechanism 29 to contract the second upper arm 13. As a result, the second upper hand 14 retreats from the substrate platform PASS1 (simultaneous transfer operation).

In the above-described series of operations, the case where two substrates W are simultaneously loaded into the substrate platform PASS1 using the second upper hand 14 has been described. However, when the second lower hand 16 is used, the second upper hand 14 is used. By changing the height of the second lower hand 16 and performing the same operation as the above-described series of operations, two substrates W are simultaneously loaded into the substrate platform PASS2 using the second lower hand 16. be able to. In addition, two substrates W can be loaded simultaneously by causing the substrate platform PASS2 to perform the same operation as the series of operations described above. Furthermore, although a detailed description is omitted, when two substrates W are simultaneously carried out from the substrate platforms PASS1, PASS2, any one of the main robots MR is performed by performing the above-described series of operations in reverse. Two substrates W can be carried out simultaneously from the substrate platforms PASS1, PASS2 using the hands 14, 16 (simultaneous taking operation).
[Design time required for operation of the main robot MR]
FIG. 15 is a table showing an example of the relationship between the operation of the main robot MR and the design time required for the operation.

  In FIG. 15, “preparation movement” means that the second upper hand 14 and the second lower hand 16 are in the state where they are not facing any unit (processing unit 10, reversing units RT 1, RT 2, etc.). The upper hand 14 and the second lower hand 16 are turned and / or moved up and down, and the second upper hand 14 and the second lower hand 16 are opposed to any unit, and the design time required for the operation is as follows. 0.5 sec.

  “Movement” means that the second upper hand 14 and the second lower hand 16 are turned and / or moved up and down in a state where the second upper hand 14 or the second lower hand 16 faces any unit. Thus, the second upper hand 14 and the second lower hand 16 are opposed to a unit different from the unit, and the design time required for the operation is 0.65 sec.

Further, “single picking / simultaneous picking” is the above-mentioned single picking operation and simultaneous picking operation, respectively, and the design time required for the operation is 1.5 sec. Similarly, “single-sheet delivery / simultaneous delivery” is the above-described single-sheet delivery operation and simultaneous delivery operation, respectively, and the design time required for the operation is 1.5 sec.
The “exchange” is the above-described exchange operation, and the design time required for the operation is 2.6 sec. Even though the replacement operation is a single-sheet pick-up operation and a single-sheet transfer operation, the design time required for “exchange” (2.6 sec) is required for “single-sheet pick-up”. It is shorter than the time (1.5 sec + 1.5 sec = 3.0 sec) that is the sum of the design time and the design time required for “passing one sheet”, while the other arm is contracted. This is because there is a period in which the single picking operation and the single picking operation are performed in parallel by extending the arm.

In the following, when a plurality of substrates W are successively processed one by one, the operation of the main robot MR shown in FIG. 15 is combined to carry the substrate W in the substrate processing apparatus 1. A specific example will be described.
[Transfer of substrate W in substrate processing apparatus 1 by main robot MR]
[When processing the surface of the substrate W once]
FIG. 16 is a table for explaining an example of the transfer operation of the substrate W when the surface of the substrate W is processed once. FIG. 17 is a table showing a comparative example for the conveying operation shown in FIG. FIG. 17 shows a conventional main robot in which only one substrate holding hand is provided for each arm instead of the main robot MR when the surface of the substrate W is processed once in the substrate processing apparatus 1. An example of the carrying operation when carrying W is shown.

The upper part of FIG. 16 shows the operation of the main robot MR in each STEP and the design time required for the operation. The lower part of FIG. 16 shows the substrate holding hands 14a, 14b, 16a, 16b in each STEP. Shows the operation. The same applies to FIG.
Further, “upper arm / upper hand”, “upper arm / lower hand”, “lower arm / upper hand”, and “lower arm / lower hand” in the lower part of FIG. Substrate holding hand 14a, lower substrate holding hand 14b below the second upper arm 13, substrate holding hand 16a above the second lower arm 15, and substrate holding hand 16b below the second lower arm 15. Yes. Such a definition is also applied to other figures shown below.
[Transfer of substrate W by main robot MR]
First, an example of the transport operation when the main robot MR is used will be described with reference to FIG. 1, FIG. 2, and FIG.

  In order to transport the substrate W using the main robot MR when processing the surface of the substrate W once, for example, a state in which two unprocessed substrates W are placed on the lower substrate platform PASS2 Then, the second upper hand 14 and the second lower hand 16 that do not hold the substrate W are turned and / or moved up and down, and the second upper hand 14 of the main robot MR and the second substrate hand PASS2 are moved to the lower substrate platform PASS2. The second lower hand 16 is opposed (preparation movement). At this time, the surface of each of the two substrates W placed on the lower substrate platform PASS2 is directed upward.

Next, using the second lower hand 16 of the main robot MR, the two substrates W are simultaneously carried out from the lower substrate platform PASS2 (STEP1, simultaneous taking). As a result, as shown in the lower part of FIG. 16, the unprocessed substrates W are held one by one by the upper and lower substrate holding hands 16 a and 16 b of the second lower hand 16.
Then, in a state where the second lower hand 16 holds the two substrates W, the second upper hand 14 and the second lower hand 16 are swung and / or lifted up and down, and one of the processing units 10 (for example, one The second upper hand 14 and the second lower hand 16 are made to face (move) the processing unit 10) arranged at the top.

  When the substrate processing apparatus 1 is continuously processing a plurality of substrates W, the substrate W that has been processed on the surface is disposed in the processing unit 10. The substrate W is unloaded from the processing unit 10 using the upper substrate holding hand 14 a, and then the unprocessed substrate W held by the lower substrate holding hand 16 b of the second lower hand 16 is transferred to the processing unit 10. Carry in (STEP2, exchange). After one substrate W is exchanged between the processing unit 10 and the main robot MR, the upper substrate holding hand 14a of the second upper hand 14 and the upper substrate holding hand 16a of the second lower hand 16 are The substrates W whose surfaces are directed upward are held one by one.

  Next, with the second upper hand 14 and the second lower hand 16 holding the substrates W one by one, the second upper hand 14 and the second lower hand 16 are turned and / or moved up and down, and the above-mentioned The second upper hand 14 and the second lower hand 16 are opposed (moved) to a processing unit 10 different from the processing unit 10 (for example, the processing unit 10 arranged second from the top).

  And the board | substrate W by which the process to the surface was performed from the processing unit 10 arrange | positioned 2nd from the top using the board | substrate holding hand 14b of the lower side of the 2nd upper hand 14 is carried out, Then, 2nd lower hand The unprocessed substrate W held by the upper substrate holding hand 16a of 16 is carried into the processing unit 10 (STEP 3, replacement). After one substrate W is exchanged between the processing unit 10 and the main robot MR, processed substrates whose surfaces are directed upward to the upper and lower substrate holding hands 14a, 14b of the second upper hand 14 W is held one by one.

Thereafter, the second upper hand 14 is made to face (move) the upper substrate platform PASS1, and the two substrates W are simultaneously placed on the upper substrate platform PASS1 (STEP 4, simultaneous transfer). Then, the two substrates W placed on the upper substrate platform PASS1 are received by the indexer robot IR and carried into the carrier C. In this way, the process for the surface of the substrate W is performed once.
[(Comparative example) Transfer of substrate W by conventional main robot]
Next, with reference to FIG. 1, FIG. 2, and FIG. 17, an example of a transport operation when a conventional main robot is used will be described.

  In order to transport the substrate W using the conventional main robot when the surface of the substrate W is processed once, for example, one unprocessed substrate W is placed on the lower substrate platform PASS2. In this state, the upper hand and the lower hand that do not hold the substrate W are turned and / or moved up and down, and the lower hand of the main robot faces the lower substrate platform PASS2 (movement). At this time, the surface of the substrate W placed on the lower substrate platform PASS2 is directed upward.

  Next, using the lower hand of the main robot, one substrate W is unloaded from the lower substrate platform PASS2 (STEP1, one piece is taken). Then, with the lower hand holding one substrate W, the upper hand and the lower hand are swung and / or moved up and down, and one of the processing units 10 (for example, the processing unit 10 disposed at the top) ) With the upper hand and the lower hand facing each other (moving).

  When the substrate processing apparatus 1 is processing a plurality of substrates W continuously, the substrate W that has been processed on the surface is disposed in the processing unit 10. The substrate W is unloaded from the processing unit 10, and then the unprocessed substrate W held by the lower hand is loaded into the processing unit 10 (STEP 2, replacement). After one substrate W is exchanged between the processing unit 10 and the main robot, one processed substrate W whose surface is directed upward is held in the upper hand.

  After exchanging one substrate W between the processing unit 10 and the main robot, the upper hand holding one processed substrate W is made to face (move) the upper substrate platform PASS1. The single substrate W is placed on the upper substrate platform PASS1 (STEP3, one piece is passed). Then, the processed substrate W placed on the upper substrate platform PASS1 is received by the indexer robot IR and carried into the carrier C. In this way, the process for the surface of the substrate W is performed once.

As shown in the left part of the table of FIG. 17, when the surface of the substrate W is processed once, the conventional main robot receives one unprocessed substrate W from the lower substrate platform PASS2. The total time until the processed substrate W is transferred to the upper substrate platform PASS1 (including preparation time for receiving) is 7.40 sec.
On the other hand, as shown in the upper left part of FIG. 16, when the surface of the substrate W is processed once, the main robot MR receives two unprocessed substrates W from the lower substrate platform PASS2 ( The total time until the processed two substrates W are transferred to the upper substrate platform PASS1 is 10.65 sec. Since the main robot MR handles two substrates W, when the transfer time of the substrate W is calculated per substrate W, it is 5.33 sec (10.65 sec / 2). Therefore, when the surface of the substrate W is processed once, the transfer time of the substrate W can be shortened by transferring the substrate W using the main robot MR as compared with the case of using the conventional main robot. it can.
[When processing the back surface of the substrate W once]
FIG. 18 is a table for explaining an example of the transfer operation of the substrate W when the back surface of the substrate W is processed once. FIG. 19 is a table showing a comparative example for the conveying operation shown in FIG. FIG. 19 shows an example of a transfer operation when the substrate W is transferred using the above-described conventional main robot when the back surface of the substrate W is processed once in the substrate processing apparatus 1.
[Transfer of substrate W by main robot MR]
First, with reference to FIG. 1, FIG. 2, and FIG. 18, an example of the transport operation when the main robot MR is used will be described.

  In order to transport the substrate W using the main robot MR when the back surface of the substrate W is processed once, for example, a state in which two unprocessed substrates W are placed on the lower substrate platform PASS2. Then, the second upper hand 14 and the second lower hand 16 in a state where the substrate W is not held are turned and / or moved up and down, and the second upper hand 14 and the second lower hand are moved to the lower substrate platform PASS2. 16 is opposed (preparation movement). At this time, the surface of each of the two substrates W placed on the lower substrate platform PASS2 is directed upward.

  Next, the two substrates W are simultaneously carried out from the lower substrate platform PASS2 using the second lower hand 16 (STEP1, simultaneous taking). As a result, as shown in the lower part of FIG. 18, the unprocessed substrates W are held one by one by the upper and lower substrate holding hands 16 a and 16 b of the second lower hand 16. Then, the second upper hand 14 and the second lower hand 16 are lowered while holding the two substrates W in the second lower hand 16, and the second lower hand 16 is opposed to the lower reversing unit RT2. (Move). Thereafter, two unprocessed substrates W are simultaneously carried into the reversing unit RT2 by the second lower hand 16 (STEP2, simultaneous delivery).

  Next, the second upper hand 14 and the second lower hand 16 are raised, and the second upper hand 14 is opposed (moved) to the upper reversing unit RT1. At this time, two unprocessed substrates W are held in the reversing unit RT1, and each of the two substrates W is inverted in advance and the back surface is directed upward. These substrates W are simultaneously carried out from the reversing unit RT1 by the second upper hand 14 (STEP3, simultaneous taking), and held by the upper and lower substrate holding hands 14a and 14b of the second upper hand 14, respectively.

After the two substrates W are simultaneously unloaded from the reversing unit RT1, the second upper hand 14 and the second lower hand 16 are swung and / or moved up and down, and one of the processing units 10 (for example, on the top) The second upper hand 14 and the second lower hand 16 are opposed (moved) to the disposed processing unit 10).
When the substrate processing apparatus 1 continuously processes a plurality of substrates W, the substrate W that has been processed on the back surface is disposed in the processing unit 10. The substrate W is unloaded from the processing unit 10 using the upper substrate holding hand 16a, and then the unprocessed substrate W held by the lower substrate holding hand 14b of the second upper hand 14 is transferred to the processing unit 10. Carry in (STEP4, exchange). After one substrate W is exchanged between the processing unit 10 and the main robot MR, the upper substrate holding hand 14a of the second upper hand 14 and the upper substrate holding hand 16a of the second lower hand 16 are The substrates W whose back surfaces are directed upward are held one by one.

  Next, with the second upper hand 14 and the second lower hand 16 holding the substrates W one by one, the second upper hand 14 and the second lower hand 16 are turned and / or moved up and down, and the above-mentioned The second upper hand 14 and the second lower hand 16 are opposed (moved) to a processing unit 10 different from the processing unit 10 (for example, the processing unit 10 arranged second from the top).

  And the board | substrate W by which the process to the back surface was performed from the processing unit 10 arrange | positioned 2nd from the top using the board | substrate holding hand 16b of the lower side of the 2nd lower hand 16 is carried out, Then, 2nd upper hand The unprocessed substrate W held by the upper substrate holding hand 14a is carried into the processing unit 10 (STEP 5, exchange). After a single substrate W is exchanged between the processing unit 10 and the main robot MR, processed substrates whose back surfaces are directed upward to the upper and lower substrate holding hands 16a and 16b of the second lower hand 16 are described. W is held one by one.

  After the processed substrates W are held one by one on the upper and lower substrate holding hands 16a and 16b of the second lower hand 16, the second lower hand 16 is made to face (move) the upper reversing unit RT1 ′. Two substrates W held by the second lower hand 16 are simultaneously carried into the upper reversing unit RT1 ′ (STEP 6, simultaneous delivery). Then, the second upper hand 14 and the second lower hand 16 are lowered, and the second upper hand 14 is opposed to the lower reversing unit RT2 '(moving). At this time, two processed substrates W are held in the reversing unit RT2 ', and the two substrates W are inverted in advance and faced upward. Then, the two substrates W are simultaneously carried out from the lower reversing unit RT2 'by the upper and lower substrate holding hands 14a, 14b of the second upper hand 14 (STEP 7, simultaneous picking). As a result, the two processed substrates W whose surfaces are directed upward are held by the upper and lower substrate holding hands 14 a and 14 b of the second upper hand 14, respectively.

After the processed two substrates W are held by the second upper hand 14, the second upper hand 14 is opposed to (moved to) the upper substrate platform PASS1, and the two substrates W are moved upward. Are simultaneously carried into the substrate platform PASS1 (STEP8, simultaneous delivery). Thereafter, the two substrates W placed on the upper substrate platform PASS1 are received by the indexer robot IR and carried into the carrier C. In this way, the process for the back surface of the substrate W is performed once.
[(Comparative example) Transfer of substrate W by conventional main robot]
Next, with reference to FIG. 1, FIG. 2, and FIG. 19, an example of a transport operation when a conventional main robot is used will be described.

  In order to transport the substrate W using the conventional main robot when the back surface of the substrate W is processed once, for example, one unprocessed substrate W is placed on the lower substrate platform PASS2. In this state, the upper hand and the lower hand in a state where the substrate W is not held are turned and / or moved up and down to face the lower substrate platform PASS2 (preparation movement). At this time, the surface of the substrate W placed on the lower substrate platform PASS2 is directed upward.

Next, one substrate W is unloaded from the lower substrate platform PASS2 using the lower hand (STEP1, one piece is taken). Then, with the substrate W held by the lower hand, the upper hand and the lower hand are lowered, and the lower hand is opposed to the lower reversing unit RT2 (moving).
After the lower hand is opposed to the lower reversing unit RT2, the unprocessed substrate W held by the lower hand is carried into the lower reversing unit RT2. Then, after the substrate W is turned upside down by the lower reversing unit RT2, the unprocessed substrate W is unloaded from the lower reversing unit RT2 by the upper hand (STEP2, replacement). These series of operations are performed continuously, and the design time required for the series of operations can be regarded as the same as the exchange operation.

After the substrate W with the back side facing up is held by the upper hand, the upper hand and the lower hand are swung and / or moved up and down, and one of the processing units 10 (for example, the processing disposed at the top) The upper hand and the lower hand are made to face (move) the unit 10).
Then, the processed substrate W is unloaded from the processing unit 10 using the lower hand, and then the unprocessed substrate W held by the upper hand is loaded into the processing unit 10 (STEP 3, replacement). After one substrate W is exchanged between the processing unit 10 and the main robot MR, one processed substrate W whose back surface is directed upward is held in the lower hand.

  After one processed substrate W is held by the lower hand, the lower hand is made to face (move) the upper reversing unit RT1, and one substrate W held by the lower hand is moved to the upper reversing unit RT1. It is carried in. Then, after the substrate W is turned upside down by the upper reversing unit RT1, the substrate W whose surface is directed upward is carried out by the upper hand (STEP 4, exchange). These series of operations are performed continuously, and the design time required for the series of operations can be regarded as the same as the exchange operation.

  After the processed single substrate W is held by the upper hand, the upper hand is made to oppose (move) the upper substrate platform PASS1, and the substrate W is carried into the upper substrate platform PASS1. (STEP5, pass one). Thereafter, the substrate W placed on the upper substrate platform PASS1 is received by the indexer robot IR and carried into the carrier C. In this way, the process for the back surface of the substrate W is performed once.

As shown in the left part of the table of FIG. 19, when the back surface of the substrate W is processed once, the conventional main robot receives one unprocessed substrate W from the lower substrate platform PASS2. The total time until the processed substrate W is transferred to the upper substrate platform PASS1 (including preparation time for receiving) is 13.90 sec.
On the other hand, as shown in the upper left part of FIG. 18, when the back surface of the substrate W is processed once, the main robot MR receives two unprocessed substrates W from the lower substrate platform PASS2 ( The total time taken to transfer the processed two substrates W to the upper substrate platform PASS1 is 19.25 sec. When this is calculated for each substrate W, it is 9.63 sec (19.25 sec / 2). Therefore, when the back surface of the substrate W is processed once, the transfer time of the substrate W can be shortened by transferring the substrate W using the main robot MR as compared with the case of using the conventional main robot. it can.
[When processing the front and back surfaces of the substrate W once each]
FIG. 20 is a table for explaining an example of the transfer operation of the substrate W when the front surface and the back surface of the substrate W are processed once each. FIG. 21 is a table showing a comparative example for the carrying operation shown in FIG. FIG. 21 shows an example of the transfer operation when the substrate W is transferred using the above-described conventional main robot when the substrate processing apparatus 1 processes the front surface and the back surface of the substrate W once each.
[Transfer of substrate W by main robot MR]
First, an example of the transport operation when the main robot MR is used will be described with reference to FIG. 1, FIG. 2, and FIG.

  In order to transfer the substrate W using the main robot MR when processing the front surface and the back surface of the substrate W once each, for example, two unprocessed substrates W are placed on the lower substrate platform PASS2. In this state, the second upper hand 14 and the second lower hand 16 that are not holding the substrate W are turned and / or moved up and down, and the second upper hand 14 and the second lower hand 16 are moved to the lower substrate platform PASS2. 2 Lower hand 16 is made to face (preparation movement). At this time, the surface of each of the two substrates W placed on the lower substrate platform PASS2 is directed upward.

  Next, the two substrates W are simultaneously carried out from the lower substrate platform PASS2 using the second lower hand 16 (STEP1, simultaneous taking). As a result, as shown in the lower part of FIG. 20, the unprocessed substrates W whose surfaces are directed upward are held one by one by the upper and lower substrate holding hands 16 a and 16 b of the second lower hand 16. Then, the second upper hand 14 and the second lower hand 16 are lowered while holding the two substrates W in the second lower hand 16, and the second lower hand 16 is opposed to the lower reversing unit RT2. (Move). Thereafter, two unprocessed substrates W are simultaneously carried into the reversing unit RT2 (STEP2, simultaneous delivery).

  Next, the second upper hand 14 and the second lower hand 16 are raised, and the second upper hand 14 is opposed (moved) to the upper reversing unit RT1. At this time, two unprocessed substrates W are held in the reversing unit RT1, and the two substrates W are inverted in advance. The two substrates W held by the reversing unit RT1 are simultaneously carried out of the reversing unit RT1 by the second upper hand 14 (STEP3, simultaneous taking), and the upper and lower substrate holding hands 14a and 14b of the second upper hand 14, respectively. Retained.

After the two substrates W are simultaneously unloaded from the reversing unit RT1, the second upper hand 14 and the second lower hand 16 are swung and / or moved up and down, and one of the processing units 10 (for example, on the top) The second upper hand 14 and the second lower hand 16 are opposed (moved) to the disposed processing unit 10).
When the substrate processing apparatus 1 continuously processes a plurality of substrates W, the substrate W that has been processed on the back surface is disposed in the processing unit 10. The substrate W is unloaded from the processing unit 10 using the upper substrate holding hand 16a, and then the unprocessed substrate W held by the lower substrate holding hand 14b of the second upper hand 14 is transferred to the processing unit 10. Carry in (STEP4, exchange). After one substrate W is exchanged between the processing unit 10 and the main robot MR, the upper substrate holding hand 14a of the second upper hand 14 and the upper substrate holding hand 16a of the second lower hand 16 are The substrates W whose back surfaces are directed upward are held one by one.

  Next, with the second upper hand 14 and the second lower hand 16 holding the substrates W one by one, the second upper hand 14 and the second lower hand 16 are turned and / or moved up and down, and the above-mentioned The second upper hand 14 and the second lower hand 16 are opposed (moved) to a processing unit 10 different from the processing unit 10 (for example, the processing unit 10 arranged second from the top).

  And the board | substrate W by which the process to the back surface was performed from the processing unit 10 arrange | positioned 2nd from the top using the board | substrate holding hand 16b of the lower side of the 2nd lower hand 16 is carried out, Then, 2nd upper hand The unprocessed substrate W held by the upper substrate holding hand 14a is carried into the processing unit 10 (STEP 5, exchange). After one substrate W is exchanged between the processing unit 10 and the main robot MR, one substrate W with the back surface facing up is placed on the upper and lower substrate holding hands 16a and 16b of the second lower hand 16. Each sheet is held.

  After the substrates W are held one by one on the upper and lower substrate holding hands 16a and 16b of the second lower hand 16, the second lower hand 16 is opposed (moved) to the upper reversing unit RT1 ′, and the second lower hand 16 Two substrates W held by the hand 16 are simultaneously carried into the upper reversing unit RT1 ′ (STEP 6, simultaneous delivery). Then, the second upper hand 14 and the second lower hand 16 are lowered, and the second upper hand 14 is opposed to the lower reversing unit RT2 '(moving). At this time, the reversing unit RT2 ′ holds two substrates W that have been processed on the back surface, and the two substrates W are each inverted in advance and faced up. Yes. Then, by the upper and lower substrate holding hands 14a and 14b of the second upper hand 14, the two substrates W whose top and bottom are inverted are simultaneously carried out from the lower reversing unit RT2 '(STEP 7, simultaneous taking). As a result, the two substrates W that have been processed on the back surface are respectively held by the second upper hand 14 with their front surfaces facing up.

After the two substrates W that have been processed on the back surface are held by the upper and lower substrate holding hands 14a and 14b of the second upper hand 14, respectively, the second upper hand 14 and the second lower hand 16 are swung and The second upper hand 14 and the second lower hand 16 are opposed (moved) to / from one of the processing units 10 (for example, the processing unit 10 disposed at the top) by moving up and down.
When the substrate processing apparatus 1 is continuously processing a plurality of substrates W, the processed substrate W that has been processed once on the front surface and the back surface is disposed in the processing unit 10. First, the processed substrate W is unloaded from the processing unit 10 using the substrate holding hand 16a on the upper side of the second lower hand 16, and then held on the substrate holding hand 14b on the lower side of the second upper hand 14. The substrate W is carried into the processing unit 10 (STEP 8, exchange). After one substrate W is exchanged between the processing unit 10 and the main robot MR, the upper substrate holding hand 14a of the second upper hand 14 and the upper substrate holding hand 16a of the second lower hand 16 are The substrates W whose surfaces are directed upward are held one by one.

  Next, with the second upper hand 14 and the second lower hand 16 holding the substrates W one by one, the second upper hand 14 and the second lower hand 16 are turned and / or moved up and down, and the above-mentioned The second upper hand 14 and the second lower hand 16 are opposed (moved) to a processing unit 10 different from the processing unit 10 (for example, the processing unit 10 arranged second from the top).

  Then, using the substrate holding hand 16b on the lower side of the second lower hand 16, the processed substrate W that has been processed on the front surface and the back surface once each is processed secondly from the top. Then, the substrate W held by the substrate holding hand 14a on the upper side of the second upper hand 14 is carried into the processing unit 10 (STEP 9, replacement). After one substrate W is exchanged between the processing unit 10 and the main robot MR, processed substrates whose surfaces are directed upward to the upper and lower substrate holding hands 16a and 16b of the second lower hand 16 are processed. W is held one by one.

After the processed substrates W are held one by one on the upper and lower substrate holding hands 16a and 16b of the second lower hand 16, the second lower hand 16 is made to face the upper substrate platform PASS1 (moving). The two substrates W are simultaneously placed on the upper substrate platform PASS1 (STEP 10, simultaneous delivery). Then, the two substrates W placed on the upper substrate platform PASS1 are received by the indexer robot IR and carried into the carrier C. In this way, the processing on the front surface and the back surface of the substrate W is performed once.
[(Comparative example) Transfer of substrate W by conventional main robot]
Next, with reference to FIG. 1, FIG. 2, and FIG. 21, an example of the transfer operation when the conventional main robot is used will be described.

  In order to transport the substrate W using the conventional main robot when processing the front surface and the back surface of the substrate W one by one, for example, one unprocessed substrate W is mounted on the lower substrate platform PASS2. The upper hand and the lower hand that do not hold the substrate W are turned and / or moved up and down while the substrate W is placed, and the upper hand and the lower hand are opposed to the lower substrate platform PASS2 (preparation movement). . At this time, the surface of the substrate W placed on the lower substrate platform PASS2 is directed upward.

Next, one substrate W is unloaded from the lower substrate platform PASS2 using the lower hand (STEP1, one piece is taken). Then, with the substrate W held by the lower hand, the upper hand and the lower hand are lowered, and the lower hand is opposed to the lower reversing unit RT2 (moving).
After the lower hand is opposed to the lower reversing unit RT2, the unprocessed substrate W held by the lower hand is carried into the lower reversing unit RT2. Then, after the substrate W is turned upside down by the lower reversing unit RT2, the unprocessed substrate W is unloaded from the lower reversing unit RT2 by the upper hand (STEP2, replacement). These series of operations are performed continuously, and the design time required for the series of operations can be regarded as the same as the exchange operation.

After the substrate W with the back side facing up is held by the upper hand, the upper hand and the lower hand are swung and / or moved up and down, and one of the processing units 10 (for example, the processing disposed at the top) The upper hand and the lower hand are made to face (move) the unit 10).
And the board | substrate W by which the process to the back surface was performed from the said processing unit 10 using the lower hand is carried out, and the unprocessed board | substrate W hold | maintained at the upper hand is carried in into the said processing unit 10 after that (STEP3, Exchange). After one substrate W is exchanged between the processing unit 10 and the main robot MR, the lower hand is processed on the back surface, and one substrate W with the back surface facing upward is held. It becomes a state.

  After one substrate W is held by the lower hand, the upper hand and the lower hand are opposed (moved) to the upper reversing unit RT1, and one substrate W held by the lower hand is the upper reversing unit RT1. It is carried in. Then, after the substrate W is turned upside down by the upper reversing unit RT1, the substrate W whose surface is directed upward is carried out by the upper hand (STEP 4, exchange). These series of operations are performed continuously, and the design time required for the series of operations can be regarded as the same as the exchange operation.

After the processed substrate W is held in the upper hand, the upper hand and the lower hand are swung and / or moved up and down, and one of the processing units 10 (for example, the processing unit disposed at the top) 10) The upper hand and the lower hand are made to face each other (movement).
When the substrate processing apparatus 1 is continuously processing a plurality of substrates W, the processed substrate W that has been processed once on the front surface and the back surface is disposed in the processing unit 10. First, the processed substrate W is unloaded from the processing unit 10 using the lower hand, and then the substrate W held by the upper hand is loaded into the processing unit 10 (STEP 5, exchange). After one substrate W is exchanged between the processing unit 10 and the main robot MR, the lower hand is processed once for the front surface and the back surface, and the processed substrate with the front surface facing up is processed. One sheet of W is held.

  After the processed substrate W is held by the lower hand, the lower hand is made to face (move) the upper substrate platform PASS1, and the processed substrate W held by the lower hand is placed on the upper substrate platform. Is placed on the part PASS1 (STEP6, one sheet is passed). Then, one substrate W placed on the upper substrate platform PASS1 is received by the indexer robot IR and carried into the carrier C. In this way, the processing on the front surface and the back surface of the substrate W is performed once.

As shown in the left part of the table of FIG. 21, when the front and back surfaces of the substrate W are processed once each, the conventional main robot removes an unprocessed substrate W from the lower substrate platform PASS2. The total time from receipt of one (including preparation time for receiving) one processed substrate W to the upper substrate platform PASS1 is 17.15 sec.
On the other hand, as shown in the upper left part of FIG. 20, when the front and back surfaces of the substrate W are processed once, the main robot MR removes two unprocessed substrates W from the lower substrate platform PASS2. The total time from receiving (including preparation time for receiving) the processed two substrates W to the upper substrate platform PASS1 is 25.75 sec. When this is calculated for each substrate W, it is 12.88 sec (25.75 sec / 2). Therefore, when the front and back surfaces of the substrate W are processed once, the time for transporting the substrate W is shortened by transporting the substrate W using the main robot MR as compared with the case of using the conventional main robot. can do.
[Summary of First Embodiment]
As described above, in the present embodiment, the second upper arm 13 and the second lower arm 15 of the main robot MR are provided with the plurality of substrate holding hands 14a and 14b and the substrate holding hands 16a and 16b, respectively. Compared to a conventional main robot in which each arm has only one substrate holding hand, more substrates W can be transferred at the same time, and the substrates W can be transferred efficiently. Thereby, the conveyance time of the board | substrate W can be shortened. Simultaneously, a plurality of substrates W are simultaneously taken from the substrate platform PASS1 and the substrate platform PASS2 by using the substrate holding hands 14a, 14b, 16a, 16b provided on the arms 13 and 15 of the main robot MR. The number of operations of the main robot MR accompanying the transfer of the substrate W can be reduced by performing a picking operation and a simultaneous transfer operation of simultaneously transferring a plurality of substrates W to the substrate platform PASS1 and the substrate platform PASS2. . Thereby, the conveyance time of a board | substrate can further be shortened.

On the other hand, in the present embodiment, since a plurality of processing units 10 are provided, the processing of the substrates W is sequentially performed by sequentially loading the substrates W into the processing units 10 and processing the plurality of substrates W in parallel. The processing time of the apparent substrate W can be shortened by completing the process. That is, in the present embodiment, the processing time and transport time of the substrate W can be shortened, and the throughput of the substrate processing apparatus 1 can be improved.
[Second Embodiment]
FIG. 22 is a schematic plan view of a substrate processing apparatus 100 according to the second embodiment of the present invention. FIGS. 23 and 24 are a schematic front view and a side view of the reversing unit RT3 provided in the substrate processing apparatus 100, respectively. 22 to 24, the same components as those shown in FIGS. 1 to 21 are given the same reference numerals as those in FIGS. 1 to 21 and the description thereof is omitted.
[Configuration of Substrate Processing Apparatus 100]
The main difference between the second embodiment and the first embodiment described above is that the indexer robot IR and the main robot MR can load and unload the substrate W at the boundary between the indexer block 2 and the processing block 3, respectively. The reversing unit RT3 (reversing device, relay position, substrate holding position) is arranged. The reversing unit RT3 can horizontally hold a plurality of (four in the second embodiment) substrates W, and can flip the held substrates W upside down. When the substrate W is transferred between the indexer robot IR and the main robot MR, the substrate W is temporarily placed in the reversing unit RT3.

  As shown in FIGS. 23 and 24, the reversing unit RT3 includes a fixed plate 42 that is horizontally disposed and a plurality of (four in the second embodiment) movable plates 43. The four movable plates 43 are arranged horizontally, and two pieces are arranged above and below the fixed plate 42 respectively. The fixed plate 42 and the four movable plates 43 are each rectangular and are arranged so as to overlap in plan view.

  The fixed plate 42 is fixed to the support plate 44 in a horizontal state, and each movable plate 43 is attached to the support plate 44 in a horizontal state via a guide 45 extending in the vertical direction. Each movable plate 43 is movable in the vertical direction with respect to the support plate 44. Each movable plate 43 is moved in the vertical direction by an actuator (not shown) such as an air cylinder. A rotation actuator 46 is attached to the support plate 44, and the fixed plate 42 and the four movable plates 43 are integrally rotated around the horizontal rotation axis together with the support plate 44 by the rotation actuator 46. The rotary actuator 46 can invert the fixed plate 42 and the four movable plates 43 by rotating the support plate 44 about a horizontal rotation axis by 180 degrees.

  Further, in the fixed plate 42 and the four movable plates 43, a plurality of opposing surfaces (for example, the lower surface of the uppermost movable plate 43 and the upper surface of the second movable plate 43 from the top) are respectively provided in plural. A support pin 47 is attached. The plurality of support pins 47 are arranged on each surface at appropriate intervals on a circumference corresponding to the outer peripheral shape of the substrate W. The height (length from the base end to the tip end) of each support pin 47 is constant, and is larger than the thickness (length in the vertical direction) of the substrate holding hands 14a, 14b, 16a, 16b. Yes. The fixing plate 42 can horizontally support a single substrate W via a plurality of support pins 47. Further, the four movable plates 43 can horizontally support a single substrate W above the plurality of support pins 47, except when located on the uppermost side.

  In the open state of the reversing unit RT3 (the state in which the substrate W can be loaded and unloaded), the substrate support position by the movable plate 43 located at the bottom of the four movable plates 43 and the second position from the bottom. The vertical distance between the movable plate 43 and the substrate support position is set to be equal to the vertical distance between the two substrates W held by the hands 14 and 16 of the main robot MR. Further, in the open state of the reversing unit RT3, the distance between the substrate support position by the fixed plate 42 and the substrate support position by the movable plate 43 positioned second from the top and the vertical direction is determined by the hands 14 and 16 of the main robot MR. It is set to be equal to the interval in the vertical direction between the two substrates W to be held. In the open state of the reversing unit RT3, the positional relationship of the four substrate support positions in the reversing unit RT3 is equal to the positional relationship of the four substrate holding positions by the main robot MR.

  While the substrate W is placed on the fixed plate 42, the movable plate 43 on the upper side is lowered to hold the substrate W horizontally between the fixed plate 42 and the movable plate 43. Further, by moving the movable plate 43 in a state where the substrate W is placed on the movable plate 43 (second movable plate 43 from the bottom) located below the fixed plate 42, the movable plate 43 is movable with the fixed plate 42. The substrate W can be held horizontally with the plate 43. Further, in a state where the substrate W is placed on the movable plate 43 located at the bottom, the movable plate 43 and / or the movable plate 43 located above the movable plate 43 (second movable plate 43 from the bottom) is moved up and down. Thus, by narrowing the distance between the two movable plates 43, the substrate W can be held horizontally between the two movable plates 43. Similarly, in a state where the substrate W is placed on the movable plate 43 located second from the top, the movable plate 43 and / or the movable plate 43 (the uppermost movable plate 43) located above the movable plate 43 is mounted. The substrate W can be held horizontally between the two movable plates 43 by raising and lowering and narrowing the distance between the two movable plates 43. Then, in a state where the substrate W is held in the reversing unit RT3, the support plate 44 is rotated around the horizontal rotation axis by the rotary actuator 46, whereby the held substrate W can be turned upside down.

Each of the indexer robot IR and the main robot MR can carry the substrate W into the reversing unit RT3 and place the substrate W at each substrate support position, and receives the substrate W placed at each substrate support position. The substrate W can be carried out from the reversing unit RT3. Hereinafter, transfer of the substrate W between the reversing unit RT3 and the main robot MR will be described, and then transfer of the substrate W in the substrate processing apparatus 100 by the main robot MR will be described.
[Transfer of substrate W between reversing unit RT3 and main robot MR]
[Simultaneous delivery operation and simultaneous operation]
When two substrates W are simultaneously loaded into the reversing unit RT3 by the main robot MR, for example, two substrates W are held in the upper and lower substrate holding hands 14a and 14b of the second upper hand 14 one by one. Are simultaneously loaded into the reversing unit RT3 (simultaneous transfer operation).

  Specifically, the main control unit 41 controls the turning mechanism 31 and the lifting drive mechanism 32 to make the second upper hand 14 and the second lower hand 16 face the reversing unit RT3. At this time, the second upper hand 14 is configured so that the two substrates W held by the upper and lower substrate holding hands 14a and 14b are respectively positioned at the substrate support position by the lowermost movable plate 43 of the reversing unit RT3 and from below. It is raised or lowered to a height above the substrate support position by the second movable plate 43.

  As described above, in the open state of the reversing unit RT3, the positional relationship of the four substrate support positions in the reversing unit RT3 is equal to the positional relationship of the four substrate holding positions by the main robot MR. If the second substrate W is placed on the substrate support position by the lowermost movable plate 43, the two substrates W are respectively placed at the substrate support position by the lowermost movable plate 43 and the second from the bottom. The movable plate 43 can be disposed on the substrate support position.

  Next, the main control unit 41 controls the upward / backward drive mechanism 29 to extend the second upper hand 14. As a result, the second upper hand 14 enters the reversing unit RT3, and the two substrates W held by the upper and lower substrate holding hands 14a and 14b of the second upper hand 14 are respectively the second from the bottom. It is arranged above the substrate support position by the movable plate 43 and the substrate support position by the lowermost movable plate 43.

  Thereafter, the main control unit 41 controls the lifting drive mechanism 32 to lower the second upper hand 14. As a result, the substrate W is simultaneously placed on the lowermost movable plate 43 and the second lowest movable plate 43, and the two substrates W are simultaneously transferred from the second upper hand 14 to the reversing unit RT3. Then, the main control unit 41 controls the upward / backward drive mechanism 29 to contract the second upper arm 13. As a result, the second upper hand 14 retreats from the reversing unit RT3 (simultaneous delivery operation).

In the above-described series of operations, the case where two substrates W are simultaneously loaded into the reversing unit RT3 using the second upper hand 14 has been described. However, when the second lower hand 16 is used, the height of the second lower hand 16 is increased. By changing the height and performing the same operation as the above-described series of operations, two substrates W can be simultaneously loaded into the reversing unit RT3 using the second lower hand 16.
In the series of operations described above, the case where the substrate W is simultaneously placed on the lowermost movable plate 43 and the second lowest movable plate 43 has been described. However, the second upper hand 14 and the second lower hand By changing the height of 16 and performing the same operation as the above-described series of operations, the substrate W can be simultaneously placed on the fixed plate 42 and the second movable plate 43 from the top.

Furthermore, although a specific description is omitted, when two substrates W are simultaneously unloaded from the reversing unit RT3, the above series of operations are reversed to use any hand of the main robot MR. Two substrates W can be carried out simultaneously from the reversing unit RT3 (simultaneous taking operation).
[Replacement operation for two substrates W]
Next, an example of an operation when exchanging two substrates W between the main robot MR and the reversing unit RT3 will be described.

  When exchanging two substrates W between the main robot MR and the reversing unit RT3, for example, from the reversing unit RT3, with the main robot MR and the reversing unit RT3 holding the two substrates W. Two substrates W are simultaneously unloaded (simultaneous picking operation), and then two substrates W are simultaneously loaded into the reversing unit RT3 (simultaneous delivery operation). That is, the upper and lower hands 14 and 16 of the main robot MR cause the reversing unit RT3 to perform the simultaneous taking operation and the simultaneous passing operation continuously.

  Specifically, in order to cause the reversing unit RT3 to simultaneously perform the reversing unit RT3 using the second lower hand 16, the main control unit 41 controls the turning mechanism 31 and the lifting drive mechanism 32 to perform the second upper hand. The hand 14 and the second lower hand 16 are opposed to the reversing unit RT3. At this time, the second lower hand 16 is such that the upper and lower substrate holding hands 16a and 16b are lower than the substrate support position by the second movable plate 43 from the bottom and the substrate support position by the lowermost movable plate 43, respectively. Is raised or lowered to a predetermined position.

  As described above, since the positional relationship between the four substrate support positions in the reversing unit RT3 is equal to the positional relationship between the four substrate holding positions by the main robot MR, the second lower hand 16 is raised to the predetermined position. Or, when lowered, the four substrate holding hands 14a, 14b, 16a, 16b of the main robot MR are arranged below the corresponding substrate support positions in the reversing unit RT3.

Next, the main control unit 41 controls the downward advance / retreat drive mechanism 30 to extend the second lower hand 16. As a result, the second lower hand 16 enters the reversing unit RT3, and the upper and lower substrate holding hands 16a and 16b of the second lower hand 16 are respectively movable on the second movable plate 43 and the lowermost one from the bottom. It is disposed below the substrate W held on the plate 43.
Thereafter, the main control unit 41 controls the lifting drive mechanism 32 to raise the second lower hand 16. As a result, the two substrates W held by the reversing unit RT3 are simultaneously picked up by the upper and lower substrate holding hands 16a and 16b of the second lower hand 16, and simultaneously received by the upper and lower substrate holding hands 16a and 16b. Retained. Then, the main control unit 41 controls the downward advance / retreat drive mechanism 30 to contract the second lower arm 15. As a result, the second lower hand 16 moves away from the reversing unit RT3 together with the two substrates W (simultaneous taking operation).

  After the simultaneous taking operation is performed, the simultaneous passing operation is performed to the reversing unit RT3 using the second upper hand 14. That is, when the second lower hand 16 is lifted in the above-described simultaneous operation, the second upper hand 14 in which the substrates W are held one by one by the upper and lower substrate holding hands 14a and 14b is held by the two held hands. Each of the substrates W is raised to a height that is higher than the substrate support position by the second movable plate 43 from the top and the substrate support position by the fixed plate 42. The main control unit 41 raises the second upper hand 14 and the second lower hand 16, and then controls the upward / backward drive mechanism 29 and the downward / backward drive mechanism 30 to retract the second lower hand 16 from the reversing unit RT3. In parallel with this, the second upper arm 13 is extended. Accordingly, in parallel with the second lower hand 16 retracting from the reversing unit RT3, the second upper hand 14 enters the reversing unit RT3 and is held by the second upper hand 14. Each of the substrates W is disposed above the substrate support position by the second movable plate 43 from the top and the substrate support position by the fixed plate 42.

  Thereafter, the main control unit 41 controls the lifting drive mechanism 32 to lower the second upper hand 14. Thereby, the substrate W is simultaneously placed on the second movable plate 43 and the fixed plate 42 from the top, and the two substrates W are simultaneously transferred from the second upper hand 14 to the reversing unit RT3. Then, the main control unit 41 controls the upward / backward drive mechanism 29 to contract the second upper arm 13. As a result, the second upper hand 14 retreats from the reversing unit RT3 (simultaneous delivery operation). In this way, the simultaneous taking operation and the simultaneous passing operation are continuously performed, and the replacement operation of the two substrates W is performed between the main robot MR and the reversing unit RT3.

As described above, there is a period in which the simultaneous taking operation and the simultaneous passing operation are performed in parallel by extending the other arm while contracting one arm. Therefore, the main robot MR and the reversing unit RT3 The design time required for the operation of exchanging the two substrates W in between is 2.6 sec (see FIG. 15).
[Transfer of the substrate W in the substrate processing apparatus 100 by the main robot MR]
Hereinafter, a specific example of the transfer operation when the substrate W is transferred by the main robot MR in the substrate processing apparatus 100 when processing a plurality of substrates W one by one will be described.
[When processing the back surface of the substrate W once]
FIG. 25 is a table for explaining an example of the transfer operation of the substrate W when the back surface of the substrate W is processed once.

  In order to transport the substrate W using the main robot MR when the back surface of the substrate W is processed once, for example, on the lowermost movable plate 43 and the second movable plate 43 from the bottom of the reversing unit RT3. While the substrates W are placed one by one, the second upper hand 14 and the second lower hand 16 in a state where the substrates W are not held are turned and / or moved up and down, and the second upper hand is moved to the reversing unit RT3. 14 and the second lower hand 16 are made to face each other (preparation movement). At this time, the two substrates W placed on the reversing unit RT3 are inverted upside down in advance, and both of them have their back surfaces facing upward.

  Next, two substrates W are simultaneously carried out from the reversing unit RT3 using the second lower hand 16 (STEP1, simultaneous taking). Accordingly, the unprocessed substrates W are held one by one on the upper and lower substrate holding hands 16a and 16b of the second lower hand 16. Then, the second upper hand 14 and the second lower hand 16 are turned and / or moved up and down, and the second upper hand 14 and the second lower hand 16 are moved to any one of the processing units 10 (for example, the processing unit 10 disposed at the top). 2 The lower hand 16 is opposed (moved).

  When the substrate processing apparatus 100 is continuously processing a plurality of substrates W, the substrate W that has been processed on the back surface is disposed in the processing unit 10. The substrate W is unloaded from the processing unit 10 using the upper substrate holding hand 14 a, and then the unprocessed substrate W held by the lower substrate holding hand 16 b of the second lower hand 16 is transferred to the processing unit 10. Carry in (STEP2, exchange). After one substrate W is exchanged between the processing unit 10 and the main robot MR, the upper substrate holding hand 14a of the second upper hand 14 and the upper substrate holding hand 16a of the second lower hand 16 are The substrates W whose back surfaces are directed upward are held one by one.

  Next, with the second upper hand 14 and the second lower hand 16 holding the substrates W one by one, the second upper hand 14 and the second lower hand 16 are turned and / or moved up and down, and the above-mentioned The second upper hand 14 and the second lower hand 16 are opposed (moved) to a processing unit 10 different from the processing unit 10 (for example, the processing unit 10 arranged second from the top).

  And the board | substrate W by which the process to the back surface was performed from the processing unit 10 arrange | positioned 2nd from the top using the board | substrate holding hand 14b of the lower side of the 2nd upper hand 14 is carried out, Then, 2nd lower hand The unprocessed substrate W held by the upper substrate holding hand 16a of 16 is carried into the processing unit 10 (STEP 3, replacement). After a single substrate W is exchanged between the processing unit 10 and the main robot MR, processed substrates whose back surfaces are directed upward to the upper and lower substrate holding hands 14a and 14b of the second upper hand 14 are processed. W is held one by one.

  Thereafter, the second upper hand 14 and the second lower hand 16 are made to face (move) the reversing unit RT3, and the two substrates W held by the second upper hand 14 are simultaneously carried into the reversing unit RT3 (STEP4 , Simultaneous delivery). The processed two substrates W carried into the reversing unit RT3 are received by the indexer robot IR and carried into the carrier C after the surface is turned up by the reversing unit RT3. In this way, the process for the back surface of the substrate W is performed once.

In this substrate processing apparatus 100, when the back surface of the substrate W is processed once, the main robot MR receives two unprocessed substrates W from the reversing unit RT3 (including preparation time for receiving), and processes them. The total time until the two substrates W are transferred to the reversing unit RT3 is 10.65 sec. When this is calculated per substrate W, it is 5.33 sec (10.65 sec / 2). Therefore, the transfer time of the substrate W can be shortened compared with the case where the back surface of the substrate W is processed once in the substrate processing apparatus 1 described above (9.63 sec in the substrate processing apparatus 1 described above, see FIG. 18). Thereby, the throughput of the substrate processing apparatus 100 when processing the back surface of the substrate W once can be further improved.
[When processing the front and back surfaces of the substrate W once each]
FIG. 26 is a table for explaining an example of the transfer operation of the substrate W when the front surface and the back surface of the substrate W are processed once each.

  In order to transport the substrate W using the main robot MR when processing the front surface and the back surface of the substrate W one by one, for example, on the lowermost movable plate 43 and the second movable plate from the bottom of the reversing unit RT3. In a state in which the unprocessed substrates W are placed one by one on 43, the second upper hand 14 and the second lower hand 16 in a state where the substrates W are not held are turned and / or moved up and down, so that the reversing unit The second upper hand 14 and the second lower hand 16 are made to face RT3 (preparation movement). At this time, the two unprocessed substrates W placed on the reversing unit RT3 are inverted in advance, and the back surfaces thereof are directed upward.

  Next, two substrates W are simultaneously carried out from the reversing unit RT3 using the second lower hand 16 (STEP1, simultaneous taking). Accordingly, the unprocessed substrates W are held one by one on the upper and lower substrate holding hands 16a and 16b of the second lower hand 16. Then, the second upper hand 14 and the second lower hand 16 are turned and / or moved up and down, and the second upper hand 14 and the second lower hand 16 are moved to any one of the processing units 10 (for example, the processing unit 10 disposed at the top). 2 The lower hand 16 is opposed (moved).

  When the substrate processing apparatus 100 is continuously processing a plurality of substrates W, the substrate W that has been processed on the back surface is disposed in the processing unit 10. The substrate W is unloaded from the processing unit 10 using the upper substrate holding hand 14 a, and then the unprocessed substrate W held by the lower substrate holding hand 16 b of the second lower hand 16 is transferred to the processing unit 10. Carry in (STEP2, exchange). After one substrate W is exchanged between the processing unit 10 and the main robot MR, the upper substrate holding hand 14a of the second upper hand 14 and the upper substrate holding hand 16a of the second lower hand 16 are The substrates W whose back surfaces are directed upward are held one by one.

  Next, with the second upper hand 14 and the second lower hand 16 holding the substrates W one by one, the second upper hand 14 and the second lower hand 16 are turned and / or moved up and down, and the above-mentioned The second upper hand 14 and the second lower hand 16 are opposed (moved) to a processing unit 10 different from the processing unit 10 (for example, the processing unit 10 arranged second from the top).

  And the board | substrate W by which the process to the back surface was performed from the processing unit 10 arrange | positioned 2nd from the top using the board | substrate holding hand 14b of the lower side of the 2nd upper hand 14 is carried out, Then, 2nd lower hand The unprocessed substrate W held by the upper substrate holding hand 16a of 16 is carried into the processing unit 10 (STEP 3, replacement). After a single substrate W is exchanged between the processing unit 10 and the main robot MR, processed substrates whose back surfaces are directed upward to the upper and lower substrate holding hands 14a and 14b of the second upper hand 14 are processed. W is held one by one.

Thereafter, the second upper hand 14 and the second lower hand 16 are made to face the reversing unit RT3 (movement). At this time, on the lowermost movable plate 43 and the second movable plate 43 from the bottom of the reversing unit RT3, the processing for the back surface is performed once, and the substrates W whose front surfaces are directed upward are one by one. It is placed.
The two substrates W held by the second upper hand 14 are transferred to the reversing unit after the two substrates W in the reversing unit RT3 are simultaneously carried out by the upper and lower substrate holding hands 16a and 16b of the second lower hand 16. It is simultaneously carried into RT3 (STEP4, exchange). That is, the simultaneous transfer operation and the simultaneous taking operation are continuously performed on the reversing unit RT3, the back surface is processed once by the second lower hand 16, and two substrates W with the front surface facing upward are provided. Retained.

  Next, the second upper hand 14 and the second lower hand 16 are turned and / or moved up and down, and the second upper hand 14 and the second upper hand 14 and the processing unit 10 (for example, the processing unit 10 disposed at the top) are moved to one of the processing units 10. The second lower hand 16 is opposed (moved). Then, the processed substrate W that has been processed once on the front surface and the back surface is carried out from the processing unit 10 by using the substrate holding hand 14a on the upper side of the second upper hand 14, and then the second lower hand 16 The substrate W held by the lower substrate holding hand 16b is carried into the processing unit 10 (STEP 5, exchange). After the single substrate W is exchanged between the processing unit 10 and the main robot MR, the processed substrate W whose surface is directed upward is placed on the upper substrate holding hand 14a of the second upper hand 14. The substrate holding hand 16a on the upper side of the second lower hand 16 is processed once for the back surface, and the substrate W with the front surface facing up is held.

  Next, with the second upper hand 14 and the second lower hand 16 holding the substrates W one by one, the second upper hand 14 and the second lower hand 16 are turned and / or moved up and down, and the above-mentioned The second upper hand 14 and the second lower hand 16 are opposed (moved) to a processing unit 10 different from the processing unit 10 (for example, the processing unit 10 arranged second from the top).

  Then, using the substrate holding hand 14b on the lower side of the second upper hand 14, the processed substrate W that has been subjected to the processing on the front surface and the back surface once from the processing unit 10 disposed second from the top is carried out. Thereafter, the substrate W held by the substrate holding hand 16a on the upper side of the second lower hand 16 is carried into the processing unit 10 (STEP 6, exchange). After one substrate W is exchanged between the processing unit 10 and the main robot MR, the upper and lower substrate holding hands 14a and 14b of the second upper hand 14 are processed once on the front surface and the back surface. In other words, the processed substrates W whose surfaces are directed upward are held one by one.

  Thereafter, the second upper hand 14 and the second lower hand 16 are made to face (move) the reversing unit RT3, and the two substrates W held by the second upper hand 14 are simultaneously carried into the reversing unit RT3 (STEP7 , Simultaneous delivery). The two processed substrates W carried into the reversing unit RT3 are received by the indexer robot IR and carried into the carrier C. In this way, the processing on the front surface and the back surface of the substrate W is performed once.

In the substrate processing apparatus 100, when the front surface and the back surface of the substrate W are processed once each, the main robot MR receives two unprocessed substrates W from the reversing unit RT3 (including preparation time for receiving them). ) The total time taken to deliver the two processed substrates W to the reversing unit RT3 is 20.40 sec. When this is calculated per substrate W, it is 10.20 sec (20.40 sec / 2). Therefore, the transfer time of the substrate W can be shortened compared with the case where the front and back surfaces of the substrate W are processed once each in the substrate processing apparatus 1 described above (12.88 sec in the substrate processing apparatus 1 described above). reference). Thereby, when the front surface and the back surface of the substrate W are processed once, the throughput of the substrate processing apparatus 100 can be further improved.
[Modification]
The present invention is not limited to the contents of the above embodiments, and various modifications can be made within the scope of the claims. For example, in the first and second embodiments described above, the case where the substrate W is transferred between the indexer robot IR and the main robot MR via the substrate platform PASS1 or the like has been described. Instead, the substrate may be directly transferred between the indexer robot IR and the main robot MR. In this case, it is preferable that the hands 7, 9, 14, and 16 of the indexer robot IR and the main robot MR are configured to mesh with each other so as not to overlap in plan view.

  Further, in the first and second embodiments described above, a case where two substrate holding hands are provided on the second upper arm 13 and the second lower arm 15 of the main robot MR so as to overlap each other vertically. Although it demonstrated, not only this but three or more board | substrate holding hands may be provided in each arm 13 and 15, and the several board | substrate holding hand provided in each arm 13 and 15 is shifted in the horizontal direction. May be arranged.

In the first and second embodiments described above, the case where the second upper arm 13 and the second lower arm 15 of the main robot MR are articulated arms has been described. The second lower arm 15 may be a linear motion mechanism that linearly moves the corresponding hand.
In the first and second embodiments described above, the case has been described in which the plurality of processing units 10 are arranged so as to face each other horizontally with the main robot MR interposed therebetween. May be arranged so as to surround the main robot MR in plan view.

  In the first and second embodiments described above, when a plurality of substrates W are successively processed one by one, the same processing is performed on all the substrates W to be processed (for example, Although the case where the processing on the surface is performed once for all the substrates W) has been described, the present invention is not limited to this. For example, different processing may be performed on some of the substrates W to be processed. Specifically, some of the substrates W to be processed may be processed once for the front surface, and the remaining substrates W may be processed once for the back surface.

  When the processing for the front surface and the processing for the back surface are mixed, the transport time is different between the substrate W for processing the front surface and the substrate W for processing the back surface, so two processed substrates (processing to the front surface was performed) In order to simultaneously carry the substrate W and the substrate W) processed on the back surface from the main robot MR to the substrate platform PASS1 or the reversing unit RT3, for example, each step of the transfer operation of the substrate W by the main robot MR. In this case, the difference in transport time can be adjusted by appropriately selecting which substrate holding hand 14a, 14b, 16a, 16b is used to hold the substrate W for processing the front surface and the substrate W for processing the back surface. preferable. As a result, the substrate W that has been processed on the front surface and the substrate W that has been processed on the back surface can be simultaneously loaded into the substrate platform PASS1 or the reversing unit RT3. By reducing the number of MR operations, the transfer time of the substrate W can be shortened.

  In addition, various design changes can be made within the scope of matters described in the claims.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 4 Carrier holding part 10 Processing unit 13 2nd upper arm 14a (upper) substrate holding hand 14b (lower) substrate holding hand 15 2nd lower arm (2nd arm)
16a (Upper) substrate holding hand 16b (Lower) substrate holding hand 29 Up / Down drive mechanism 30 Downward / backward drive mechanism 41 Main control unit 100 Substrate processing device IR Indexer robot MR Main robot PASS1 Substrate platform PASS2 Substrate platform Part RT1, RT1 ′ reversing unit RT2, RT2 ′ reversing unit RT3 reversing unit W substrate

Claims (15)

A plurality of holding units for holding the first substrate and the second substrate at two substrate holding positions having different heights;
A first processing unit for holding one substrate at a predetermined substrate holding position and executing a predetermined substrate processing on the substrate;
A second processing unit that holds a single substrate at a predetermined substrate holding position and executes predetermined substrate processing on the substrate;
A substrate transfer method executed in a substrate processing apparatus comprising: a substrate transfer apparatus including a first substrate holding hand and a second substrate holding hand that hold substrates one by one at different heights,
The first substrate holding hand and the second substrate holding hand are moved to a position facing the two substrate holding positions of the plurality of substrate holding units, and then the first substrate holding hand and the second substrate holding hand are used. Performing a simultaneous operation of simultaneously taking the first substrate and the second substrate from the two substrate holding positions;
after that,
The first substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, then the hand is moved above the substrate holding position, and the hand is further moved below the substrate holding position. To carry in the carry-in operation of carrying the first substrate held by the first substrate holding hand into the first processing unit,
further,
The second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, then the hand is moved above the substrate holding position, and the hand is further moved below the substrate holding position. A substrate transport method in a substrate processing apparatus for executing a loading operation for loading the second substrate held by the second substrate holding hand into the second processing unit. A plurality of substrate holders for holding two substrates at two substrate holding positions having different heights;
A first processing unit for holding a first substrate at a predetermined substrate holding position and executing a predetermined substrate processing on the substrate;
A second processing unit that holds the second substrate at a predetermined substrate holding position and performs predetermined substrate processing on the substrate;
A substrate transfer method executed in a substrate processing apparatus comprising: a substrate transfer apparatus including a first substrate holding hand and a second substrate holding hand that hold substrates one by one at different heights,
The first substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, then the hand is moved below the substrate holding position, and the hand is further moved above the substrate holding position. To carry out an unloading operation for unloading the first substrate from the first processing unit,
further,
The second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, then the hand is moved below the substrate holding position, and the hand is further moved above the substrate holding position. To carry out the unloading operation to unload the second substrate from the second processing unit,
after that,
The first substrate holding hand and the second substrate holding hand are moved to a position facing the two substrate holding positions of the plurality of substrate holding units, and then the first substrate holding hand and the second substrate holding hand are used. A substrate transfer method in a substrate processing apparatus, wherein a simultaneous transfer operation for simultaneously transferring the first substrate and the second substrate to the two substrate holding positions is executed. A plurality of substrate holders for holding two substrates at two substrate holding positions having different heights;
A first processing unit for holding a first substrate at a predetermined substrate holding position and executing a predetermined substrate processing on the substrate;
A second processing unit that holds the second substrate at a predetermined substrate holding position and performs predetermined substrate processing on the substrate;
The first substrate holding hand and the second substrate holding hand for holding the substrates one by one at different heights, and the third substrate holding hand and the fourth substrate for holding the third substrate and the fourth substrate one by one at different heights. A substrate carrying method including a holding hand, and a substrate carrying method executed in a substrate processing apparatus comprising:
The first substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, then the hand is moved below the substrate holding position, and the hand is further moved above the substrate holding position. To carry out an unloading operation for unloading the first substrate from the first processing unit,
further,
The third substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, then the hand is moved above the substrate holding position, and the hand is further moved below the substrate holding position. To carry in the carry-in operation of carrying the third substrate held by the third substrate holding hand into the first processing unit,
further,
The second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, then the hand is moved below the substrate holding position, and the hand is further moved above the substrate holding position. To carry out the unloading operation to unload the second substrate from the second processing unit,
further,
The fourth substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, then the hand is moved above the substrate holding position, and the hand is further moved below the substrate holding position. To carry in the loading operation of loading the fourth substrate held by the fourth substrate holding hand into the second processing unit,
after that,
The first substrate holding hand and the second substrate holding hand are moved to a position facing the two substrate holding positions of the plurality of substrate holding units, and then the first substrate holding hand and the second substrate holding hand are used to move the first substrate holding hand and the second substrate holding hand. A substrate transfer method in a substrate processing apparatus, wherein a simultaneous transfer operation for simultaneously transferring one substrate and the second substrate to the two substrate holding positions is executed. A plurality of holding units for holding the first substrate and the second substrate at two substrate holding positions having different heights;
A first processing unit that holds a third substrate at a predetermined substrate holding position and executes predetermined substrate processing on the substrate;
A second processing unit that holds the fourth substrate at a predetermined substrate holding position and executes predetermined substrate processing on the substrate;
A substrate including a first substrate holding hand and a second substrate holding hand that hold substrates one by one at different heights, and a third substrate holding hand and a fourth substrate holding hand that hold substrates one by one at different heights A substrate transport method executed in a substrate processing apparatus comprising a transport device,
The third substrate holding hand and the fourth substrate holding hand are moved to a position facing the two substrate holding positions of the plurality of substrate holding units, and then the third substrate holding hand and the fourth substrate holding hand are used to move the first substrate holding hand and the fourth substrate holding hand. Performing a simultaneous operation of simultaneously taking one substrate and the second substrate from the two substrate holding positions;
after that,
The first substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, then the hand is moved below the substrate holding position, and the hand is further moved above the substrate holding position. To carry out an unloading operation for unloading the third substrate from the first processing unit,
further,
The third substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, then the hand is moved above the substrate holding position, and the hand is further moved below the substrate holding position. To carry in the carry-in operation to carry the first substrate held by the third substrate holding hand into the first processing unit,
further,
The second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, then the hand is moved below the substrate holding position, and the hand is further moved above the substrate holding position. To carry out an unloading operation for unloading the fourth substrate from the second processing unit,
further,
The fourth substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, then the hand is moved above the substrate holding position, and the hand is further moved below the substrate holding position. A substrate transport method in a substrate processing apparatus for executing a loading operation for loading the second substrate held by the fourth substrate holding hand into the second processing unit by moving the second substrate to the second processing unit.   5. The substrate transfer method in the substrate transfer apparatus according to claim 3, wherein the first substrate holding hand and the second substrate holding hand are positioned above the third substrate holding hand and the fourth substrate holding hand. 6. .   The vertical interval between the two substrate holding positions of the plurality of substrate holding portions is the vertical interval between the first substrate holding hand and the second substrate holding hand, and the third substrate holding hand and the fourth substrate holding. The substrate transfer method in the substrate transfer apparatus according to claim 1, wherein the substrate transfer method is equal to at least one of the vertical intervals of the hand.   The substrate transfer method in a substrate processing apparatus according to claim 1, wherein the first substrate holding hand and the second substrate holding hand are arranged so as to overlap each other in a plan view.   The carry-in operation, the carry-out operation, the simultaneous taking operation, or the simultaneous delivery operation is performed using a linear motion mechanism that linearly moves the substrate holding hand. A substrate transport method in the substrate processing apparatus according to claim. A plurality of substrate holders for holding two substrates at two substrate holding positions having different heights;
A first processing unit that holds one first substrate at a predetermined substrate holding position and executes predetermined substrate processing on the substrate;
A second processing unit that holds one second substrate at a predetermined substrate holding position and executes predetermined substrate processing on the substrate;
A first substrate holding hand and a second substrate holding hand for holding substrates one by one at different heights;
A third substrate holding hand which is positioned at a different height from the first substrate holding hand and the second substrate holding hand and holds one third substrate;
A substrate transporting device that integrally moves the first to third substrate holding hands between the plurality of holding units, the first processing unit, and the second processing unit by turning and / or moving up and down. A substrate transfer method executed in a processing apparatus,
By turning and / or raising / lowering the substrate transfer device, the first substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, and then the first substrate holding hand is held. A carry-out operation for carrying out the first substrate from the first processing unit by moving the hand to a position below the position and further moving the hand above the substrate holding position;
By turning and / or raising / lowering the substrate transfer device, the second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, and then the second substrate holding hand is held. By moving the hand to a position below the position and further moving the hand to a position above the substrate holding position to carry out the unloading operation to unload the second substrate from the second processing unit;
By turning and / or raising / lowering the substrate transfer device, the third substrate holding hand is moved to a position facing the second processing unit, and then the third substrate holding hand is moved to above the substrate holding position. Moving, and further moving the hand below the substrate holding position to execute a loading operation for loading the third substrate into the second processing unit;
By turning and / or raising and lowering the substrate transfer device, the first substrate holding hand and the second substrate holding hand are opposed to the two substrate holding positions of the plurality of substrate holding units, and subsequently the first substrate holding A substrate transfer method in a substrate processing apparatus, wherein a simultaneous transfer operation of simultaneously transferring the first substrate and the second substrate to the two substrate holding positions by a hand and a second substrate holding hand is performed. A plurality of substrate holders for holding two substrates at two substrate holding positions having different heights;
A first processing unit that holds one first substrate at a predetermined substrate holding position and executes predetermined substrate processing on the substrate;
A second processing unit that holds one second substrate at a predetermined substrate holding position and executes predetermined substrate processing on the substrate;
A first substrate holding hand and a second substrate holding hand for holding substrates one by one at different heights;
A third substrate holding hand which is positioned at a different height from the first substrate holding hand and the second substrate holding hand and holds one third substrate;
A substrate transporting device that integrally moves the first to third substrate holding hands between the plurality of holding units, the first processing unit, and the second processing unit by turning and / or moving up and down. A substrate transfer method executed in a processing apparatus,
By turning and / or raising / lowering the substrate transfer device, the first substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, and then the first substrate holding hand is held. A carry-out operation for carrying out the first substrate from the first processing unit by moving the hand to a position below the position and further moving the hand above the substrate holding position;
By turning and / or raising / lowering the substrate transfer device, the third substrate holding hand is moved to a position facing the first processing unit, and then the third substrate holding hand is moved to above the substrate holding position. Move, and further move the hand below the substrate holding position to execute a loading operation for loading the third substrate into the first processing unit;
By turning and / or raising / lowering the substrate transfer device, the second substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, and then the second substrate holding hand is held. By moving the hand to a position below the position and further moving the hand to a position above the substrate holding position to carry out the unloading operation to unload the second substrate from the second processing unit;
By turning and / or raising and lowering the substrate transfer device, the first substrate holding hand and the second substrate holding hand are opposed to the two substrate holding positions of the plurality of substrate holding units, and subsequently the first substrate holding A substrate transfer method in a substrate processing apparatus, wherein a simultaneous transfer operation of simultaneously transferring the first substrate and the second substrate to the two substrate holding positions by a hand and a second substrate holding hand is performed. A plurality of holding units for holding the first substrate and the second substrate at two substrate holding positions having different heights;
A first processing unit that holds one third substrate at a predetermined substrate holding position and executes predetermined substrate processing on the substrate;
A second processing unit that holds a single substrate at a predetermined substrate holding position and executes predetermined substrate processing on the substrate;
A first substrate holding hand for holding one substrate;
A second substrate holding hand and a third substrate holding hand which are positioned at different heights from the first substrate holding hand and hold the substrates one by one at different heights;
A substrate transporting device that integrally moves the first to third substrate holding hands between the plurality of holding units, the first processing unit, and the second processing unit by turning and / or moving up and down. A substrate transfer method executed in a processing apparatus,
By turning and / or raising and lowering the substrate transfer device, the second substrate holding hand and the third substrate holding hand are opposed to the two substrate holding positions of the plurality of substrate holding units, and then the second substrate holding A simultaneous operation of taking the first substrate and the second substrate from the two substrate holding positions simultaneously by the hand and the third substrate holding hand;
By turning and / or raising / lowering the substrate transfer device, the first substrate holding hand is moved to a position facing the substrate holding position of the first processing unit, and then the first substrate holding hand is held. By moving the hand to a position below the position and further moving the hand to a position above the substrate holding position to carry out the unloading operation for unloading the third substrate from the first processing unit;
By turning and / or raising / lowering the substrate transfer device, the second substrate holding hand is moved to a position facing the first processing unit, and then the second substrate holding hand is moved to a position below the substrate holding position. Moving, further moving the hand above the substrate holding position to execute a loading operation for loading the first substrate into the first processing unit;
The third substrate holding hand is moved to a position facing the substrate holding position of the second processing unit by turning and / or raising / lowering the substrate transfer device, and then the third substrate holding hand is held by the substrate holding device. A substrate transfer method in a substrate processing apparatus, wherein a carry-in operation for carrying the second substrate into the second processing unit is performed by moving the hand to a position above the position and further moving the hand below the substrate holding position. A plurality of holding units for holding the first substrate and the second substrate at two substrate holding positions having different heights;
A first processing unit for holding one substrate at a predetermined substrate holding position and executing a predetermined substrate processing on the substrate;
A second processing unit that holds one third substrate at a predetermined substrate holding position and executes predetermined substrate processing on the substrate;
A first substrate holding hand for holding one substrate;
A second substrate holding hand and a third substrate holding hand which are positioned at different heights from the first substrate holding hand and hold the substrates one by one at different heights;
A substrate transporting device that integrally moves the first to third substrate holding hands between the plurality of holding units, the first processing unit, and the second processing unit by turning and / or moving up and down. A substrate transfer method executed in a processing apparatus,
By turning and / or raising and lowering the substrate transfer device, the second substrate holding hand and the third substrate holding hand are opposed to the two substrate holding positions of the plurality of substrate holding units, and then the second substrate holding A simultaneous operation of taking the first substrate and the second substrate from the two substrate holding positions simultaneously by the hand and the third substrate holding hand;
By turning and / or raising / lowering the substrate transfer device, the first substrate holding hand is moved to a position facing the substrate holding position of the second processing unit, and then the first substrate holding hand is held. By moving the hand to a position below the position and further moving the hand to a position above the substrate holding position to carry out the unloading operation for unloading the third substrate from the second processing unit;
By turning and / or raising / lowering the substrate transfer device, the second substrate holding hand is moved to a position facing the first processing unit, and then the second substrate holding hand is moved to above the substrate holding position. Moving, and further moving the hand below the substrate holding position to execute a loading operation for loading the first substrate into the first processing unit;
The third substrate holding hand is moved to a position facing the substrate holding position of the second processing unit by turning and / or raising / lowering the substrate transfer device, and then the third substrate holding hand is held by the substrate holding device. A substrate transfer method in a substrate processing apparatus, wherein a carry-in operation for carrying the second substrate into the second processing unit is performed by moving the hand to a position above the position and further moving the hand below the substrate holding position.   The said carrying-in operation | movement, the said carrying-out operation | movement, the said simultaneous taking operation | movement, or the said simultaneous delivery operation | movement are performed using the linear motion mechanism which moves the said board | substrate holding hand linearly. Substrate transport method in the substrate processing apparatus.   The substrate transfer method in the substrate processing apparatus according to claim 9, wherein the first processing unit and the second processing unit are disposed so as to be horizontally opposed to each other with the substrate transfer apparatus interposed therebetween. .   The substrate transport method in the substrate processing apparatus according to claim 9, wherein the first processing unit and the second processing unit are disposed so as to surround the substrate transport apparatus in a plan view.

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