JP4869097B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus for processing a substrate.

  2. Description of the Related Art Conventionally, a substrate processing apparatus is used to perform various processes on a substrate such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, and a glass substrate for an optical disk.

  For example, the substrate processing apparatus includes a surface processing unit that processes the surface of the substrate, a back surface processing unit that processes the back surface of the substrate, and a reversing unit that reverses the front surface and the back surface of the substrate. In such a substrate processing apparatus, a center robot (conveyance unit) that conveys a substrate is disposed at substantially the center of a rectangular process unit.

  A front surface processing unit and a back surface processing unit are arranged so as to surround the center robot in the process section. Further, a reversing unit is arranged at a position where access by the central robot is possible in the process unit.

  An indexer unit including a plurality of storage containers for storing substrates is provided on one end side of the process unit. The indexer unit is provided with a substrate transfer robot that takes out the substrate before processing from the storage container or stores the processed substrate in the storage container.

  In the configuration as described above, the substrate transfer robot takes out the substrate before processing from one of the storage containers and passes it to the center robot, and receives the processed substrate from the center robot and stores it in the storage container.

  When the center robot receives the unprocessed substrate from the substrate transfer robot, the center robot carries the received substrate into the surface cleaning unit. When the process is completed in the surface cleaning unit, the center robot takes out the substrate from the surface cleaning unit and then passes it to the reversing unit. The reversing unit reverses the substrate received from the center robot so that the surface faces downward. The center robot receives the substrate reversed by the reversing unit and carries the substrate into the back surface cleaning unit.

  When the processing is completed in the back surface cleaning unit, the center robot takes out the substrate from the back surface cleaning unit and passes it again to the reversing unit. The reversing unit reverses the substrate that has been processed in the back surface cleaning unit so that the front surface faces upward.

  The center robot receives the substrate reversed by the reversing unit and passes it to the substrate transport robot. The substrate transfer robot stores the processed substrate received from the center robot in the storage container.

Thus, the substrate is transferred between the front surface processing unit, the back surface processing unit, and the reversing unit by one central robot.
JP 2004-146708 A

  However, in the substrate processing apparatus having a plurality of processing units as described above, the number of substrate transport steps increases, and the operation of the center robot becomes complicated. For this reason, it becomes difficult to efficiently transport a plurality of substrates, and the throughput of substrate processing decreases.

  An object of the present invention is to provide a substrate processing apparatus capable of improving throughput.

A substrate processing apparatus according to a first aspect of the present invention is a substrate processing apparatus that performs processing on a substrate having a front surface and a back surface, the first and second processing regions that are disposed adjacent to each other and perform processing on the substrate, A carry-in / carry-out area for carrying in and out a substrate to / from the first process area, a first transfer area provided between the carry-in / carry-out area and the first process area, a first process area, and a second A second transfer area provided between the first processing area and the processing area. The first processing area is between the first processing section, the first transfer area, the first processing section, and the second transfer area. And a second transport region that transports the substrate between the second processing unit, the second transfer region, and the second processing unit. And the loading / unloading area includes a container on which a storage container for storing the substrate is placed. And mounting portion, and a third conveyance means for conveying the substrate between the container placement placed on the container in part and the first transfer region, the first transfer region, the substrate is placed And a first reversing device for reversing the front surface and the back surface of the substrate, and the second transfer area includes a second substrate placing portion on which the substrate is placed, And a second reversing device for reversing the front surface and the back surface of the substrate, wherein one of the first and second processing units includes a back surface cleaning processing unit for cleaning the back surface of the substrate, and the first and second The other of the processing units includes a surface cleaning processing unit that cleans the surface of the substrate, and the first transfer means includes a first substrate mounting unit, a second substrate mounting unit, a first reversing device, and a second The substrate is transported between the reversing device and the first processing unit, and the second transporting means includes a second substrate placing unit, a second reversing device, and a second processing unit. Conveying the substrate between parts, the third conveying means, placed on the container in the container mounting part, which carry the substrate between the first substrate platform and the first reversing device is there.

In this substrate processing apparatus, the substrate is carried into and out of the first processing region from the loading and unloading region, and the substrate is processed in the first processing region and the second processing region. In the first processing region, the first transport unit causes the first substrate placing unit, the second substrate placing unit, the first reversing device, the second reversing device, and the first processing unit. The substrate is transferred. In the second processing region, the second transport means transports the substrate between the second substrate platform, the second reversing device, and the second processing unit. In the carry-in / carry-out region, the substrate is transported between the storage container mounted on the container mounting unit, the first substrate mounting unit, and the first reversing device by the third transport unit.

The substrate is inverted so that the back surface is directed upward by the first or second reversing device, and the back surface of the substrate is cleaned by the back surface cleaning processing unit in one of the first and second processing units. The substrate cleaned by the back surface cleaning processing unit is inverted again by the first or second inverting device so that the surface is directed upward. In the other of the first and second processing units, the surface of the substrate is cleaned by the surface cleaning processing unit.

With such a configuration, in the first processing region and the second processing region, the substrate transport by the first transport unit and the substrate transport by the second transport unit can be performed in parallel. Thereby, a some board | substrate can be conveyed efficiently. Accordingly, it is possible to shorten the substrate transport time in the first processing region and the second processing region. As a result, the throughput in the substrate processing apparatus can be improved.
In the first transfer area, the substrate can be transferred between the first transfer means and the third transfer means while the substrate is reversed by the first reversing device. In the second transfer area, the substrate can be transferred between the first transfer means and the second transfer means while the substrate is inverted by the second reversing device. Accordingly, the substrate transport time can be further shortened, and the throughput in the substrate processing apparatus can be further improved.

Back surface cleaning processing unit includes a plurality of back surface cleaning units arranged in a plurality of stages, a surface cleaning processing unit may include a plurality of surface cleaning units arranged in a plurality of stages.

  In this case, by arranging a plurality of back surface cleaning units and a plurality of front surface cleaning units in a plurality of stages, the footprint can be reduced, and the back surface cleaning of the plurality of substrates and the cleaning of the front surfaces of the plurality of substrates can be efficiently performed. Can do. Therefore, the throughput in the substrate processing apparatus can be further improved.

The first reversing device reverses the substrate around a rotation axis that intersects a line connecting the position of the first transport unit and the position of the third transport unit when the substrate is transferred. The substrate may be reversed around a rotation axis that intersects a line connecting the position of the first transport unit and the position of the second transport unit when the substrate is delivered.

In this case, the first reversing device can pass the substrate between the first and third transfer means without changing the direction, and the second reversing device can change the first and second without changing the direction. The substrate can be transferred between the transfer means. Therefore, the structure of the first and second reversing devices is simplified and the cost can be reduced. Further, since the first and second reversing devices do not need to change direction, the throughput in the substrate processing apparatus is improved.
Each of the first and second reversing devices includes a first holding mechanism that holds the substrate in a state perpendicular to the first axis, and a second holding mechanism that holds the substrate in a state perpendicular to the first axis. A support member that supports the first and second holding mechanisms so as to overlap in the direction of the first axis, and a second member that is substantially perpendicular to the first axis together with the first and second holding mechanisms. And a rotating device that rotates integrally around the shaft.
In this case, the substrate is held in a state perpendicular to the first axis by at least one of the first and second holding mechanisms. In this state, the first and second holding mechanisms are integrally rotated around the second axis substantially perpendicular to the first axis by the rotating device. Thereby, the substrate held by the first holding mechanism or the second holding mechanism is inverted.
Here, each of the first to third transport units has two transport holding units, and the two transport holding units are used to carry the substrate in and out of the first and second reversing devices. In this case, two transport holding units are arranged so as to overlap each other in a direction parallel to the first axis, whereby two substrates are simultaneously carried into the first and second holding mechanisms by the two transport holding units. In addition, two substrates can be simultaneously carried out from the first and second holding mechanisms by the two conveyance holding units. Accordingly, it is possible to quickly carry the substrate in and out of the first and second reversing devices, and to efficiently reverse the plurality of substrates.

A substrate processing apparatus according to a second invention is a substrate processing apparatus for processing a substrate having a front surface and a back surface, and is disposed adjacent to each other, and first and second processing regions for processing a substrate, A carry-in / carry-out area for carrying in and out a substrate to / from the first process area, a first transfer area provided between the carry-in / carry-out area and the first process area, a first process area, and a second A second transfer area provided between the first processing area and the processing area. The first processing area is between the first processing section, the first transfer area, the first processing section, and the second transfer area. And a second transport region that transports the substrate between the second processing unit, the second transfer region, and the second processing unit. And the loading / unloading area includes a container on which a storage container for storing the substrate is placed. And mounting portion, and a third conveyance means for conveying the substrate between the container placement placed on the container in part and the first transfer region, the first transfer region, the substrate is placed And the second transfer region includes a reversing device that reverses the front surface and the back surface of the substrate, and one of the first and second processing units cleans the back surface of the substrate. And the other of the first and second processing units includes a surface cleaning processing unit that cleans the surface of the substrate, and the first transport means includes the first substrate mounting unit and the reversing device. and transporting the substrate between the first processing unit, the second conveying means conveys the substrate between the reversing device and the second processing unit, the third conveying means, mounting the container platform is intended to convey the substrate between the location has been container and the first substrate platform.

In this substrate processing apparatus, the substrate is carried into and out of the first processing region from the loading and unloading region, and the substrate is processed in the first processing region and the second processing region. In the first processing region, the substrate is transported between the first substrate platform, the reversing device, and the first processing unit by the first transport unit. In the second processing region, the substrate is transported between the reversing device and the second processing unit by the second transport means. In the carry-in / out region, the third transport means transports the substrate between the storage container placed on the container placement unit and the first substrate placement unit.

  With such a configuration, in the first processing region and the second processing region, the substrate transport by the first transport unit and the substrate transport by the second transport unit can be performed in parallel. Thereby, a some board | substrate can be conveyed efficiently. Accordingly, it is possible to shorten the substrate transport time in the first processing region and the second processing region. As a result, the throughput in the substrate processing apparatus can be improved.

  In the second transfer area, the substrate can be transferred between the first transfer means and the second transfer means while the substrate is inverted by the reversing device. Accordingly, the substrate transport time can be further shortened, and the throughput in the substrate processing apparatus can be further improved.

Inversion apparatus may be inverted substrate about an axis of rotation which intersects the line connecting the position of the second conveying means of the first transfer means at the time of transferring the substrate.

  In this case, the reversing device can pass the substrate between the first and second transport means without changing the direction. Therefore, the structure of the reversing device is simplified and the cost can be reduced. Further, since it is not necessary for the reversing device to change direction, the throughput in the substrate processing apparatus is improved.

The first delivery area includes a first substrate platform on which the substrate is placed, and the second delivery area includes a second substrate platform on which the substrate is placed, and the second delivery area. The region opposite to the region includes a reversing device, the first processing unit includes a front surface cleaning processing unit, the second processing unit includes a back surface cleaning processing unit, and the first transport unit includes the first transport unit. The substrate is transferred between the substrate mounting unit, the second substrate mounting unit, and the front surface cleaning processing unit, and the second transporting unit is between the second substrate mounting unit, the reversing device, and the back surface cleaning processing unit. The substrate may be transported, and the third transport means may transport the substrate between the storage container placed on the container placing portion and the first substrate placing portion.

  In this case, in the first processing region, the first transport unit transports the substrate between the first substrate platform, the second substrate platform, and the surface cleaning processor. In the second processing region, the substrate is transported between the second substrate mounting unit, the reversing device, and the back surface cleaning processing unit by the second transport unit. In the carry-in / out region, the third transport means transports the substrate between the storage container placed on the container placement unit and the first substrate placement unit.

  With such a configuration, in the first processing region and the second processing region, the substrate transport by the first transport unit and the substrate transport by the second transport unit can be performed in parallel. Thereby, a some board | substrate can be conveyed efficiently. Accordingly, it is possible to shorten the substrate transport time in the first processing region and the second processing region. As a result, the throughput in the substrate processing apparatus can be improved.

Inversion apparatus may include a first and second reversing devices disposed vertically. In this case, the substrate before the cleaning by the back surface cleaning processing unit is inverted by the first reversing device, and the substrate after the cleaning by the back surface cleaning processing unit is inverted by the second reversing device. be the back surface of the substrate is contaminated, it is possible to prevent the contamination is transferred to the board after the back surface cleaning process through an inverting device. Thereby, the back surface of the substrate after cleaning by the back surface cleaning processing unit can be maintained in a clean state.

The first reversing device may be used for reversing the substrate before cleaning by the back surface cleaning processing unit, and the second reversing device may be used for reversing the substrate after cleaning by the back surface cleaning processing unit. .

  In this case, even if the back surface of the substrate before cleaning by the back surface cleaning processing unit is contaminated, the contaminants are prevented from transferring to the substrate W after the back surface cleaning processing through the reversing device. Thereby, the back surface of the substrate after cleaning by the back surface cleaning processing unit can be maintained in a clean state.

Inversion apparatus, a first holding mechanism for holding the substrate in a state vertical to the first axis, a second holding mechanism for holding the substrate in a state vertical to the first axis, first and second A supporting member that supports the holding mechanism so as to overlap in the direction of the first axis, and the supporting member together with the first and second holding mechanisms, integrally around a second axis that is substantially perpendicular to the first axis. And a rotating device that rotates.

  In this case, the substrate is held in a state perpendicular to the first axis by at least one of the first and second holding mechanisms. In this state, the first and second holding mechanisms are integrally rotated around the second axis substantially perpendicular to the first axis by the rotating device. Thereby, the substrate held by the first holding mechanism or the second holding mechanism is inverted.

  Here, when each of the first to third transport units has two transport holding units and the two transport holding units are used to carry the substrate in and out of the reversing device, two transports are performed. By disposing the holding portion so as to overlap in the direction parallel to the first axis, it becomes possible to simultaneously carry two substrates into the first and second holding mechanisms by the two transport holding portions, Two substrates can be carried out simultaneously from the first and second holding mechanisms by the two conveyance holding units. Accordingly, it is possible to quickly carry the substrate in and out of the reversing device, and to efficiently reverse a plurality of substrates.

The first and second holding mechanisms include a common inversion holding member having one surface and another surface perpendicular to the first axis, and the first holding mechanism is provided on one surface of the common inversion holding member. A plurality of first support portions that support the outer peripheral portion of the first reverse holding member, a first reverse holding member that is provided to face one surface of the common reverse holding member, and a first reverse that faces the common reverse holding member. A plurality of second support portions provided on the surface of the holding member and supporting the outer peripheral portion of the substrate, and a state in which the first reverse holding member and the common reverse holding member are separated from each other in the direction of the first axis; A first drive mechanism that moves at least one of the first reverse holding member and the common reverse holding member so that the first reverse holding member and the common reverse holding member are selectively shifted to a state where they are close to each other. And the second holding mechanism has a common inversion holding portion Of provided on the other surface, a plurality of third support portions for supporting the outer peripheral portion of the substrate, and a second reverse holding member provided so as to face the other surface of the common reverse holding member, the common reverse A plurality of fourth support portions that are provided on the surface of the second reverse holding member facing the holding member and support the outer peripheral portion of the substrate, and the second reverse holding member and the common reverse holding member are the first. At least one of the second inversion holding member and the common inversion holding member so as to selectively shift to a state in which the second inversion holding member and the common inversion holding member are close to each other in the axial direction. And a second drive mechanism that moves one of them.

  In this case, in a state where the first reverse holding member and the common reverse holding member are separated from each other, the plurality of first support portions provided on one surface of the common reverse holding member and the common reverse holding member are opposed to each other. A board | substrate is carried in between the several 2nd support parts provided in the surface of the 1st inversion holding member. In this state, at least one of the first reverse holding member and the common reverse holding member is moved by the first drive mechanism so that the first reverse holding member and the common reverse holding member are close to each other. Accordingly, the outer peripheral portion of the substrate is held by the plurality of first and second support portions.

  In this state, the first reverse holding member, the second reverse holding member, and the common reverse holding member are integrally rotated around the second axis by the rotating device. Thereby, the substrate held by the first reverse holding member and the common reverse holding member is reversed.

  In addition, in a state where the second reverse holding member and the common reverse holding member are separated from each other, the plurality of third support portions provided on the other surface of the common reverse holding member and the common reverse holding member are opposed to each other. The substrate is carried in between the plurality of fourth support portions provided on the surface of the second reverse holding member. In this state, at least one of the second inversion holding member and the common inversion holding member is moved by the second driving mechanism so that the second inversion holding member and the common inversion holding member come closer to each other. Accordingly, the outer peripheral portion of the substrate is held by the plurality of third and fourth support portions.

  In this state, the first reverse holding member, the second reverse holding member, and the common reverse holding member are integrally rotated around the second axis by the rotating device. Thereby, the substrate held by the second reverse holding member and the common reverse holding member is reversed.

  According to the present invention, in the first processing region and the second processing region, the substrate transport by the first transport unit and the substrate transport by the second transport unit can be performed in parallel. Thereby, a some board | substrate can be conveyed efficiently. Accordingly, it is possible to shorten the substrate transport time in the first processing region and the second processing region. As a result, the throughput in the substrate processing apparatus can be improved.

  Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  In the following description, a substrate refers to a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), a glass substrate for a photomask, a substrate for an optical disk, and the like.

  In the following description, the surface of the substrate on which various patterns such as circuit patterns are formed is referred to as the front surface, and the opposite surface is referred to as the back surface. Further, the surface of the substrate directed downward is referred to as a lower surface, and the surface of the substrate directed upward is referred to as an upper surface.

(1) First Embodiment (1-1) Configuration of Substrate Processing Apparatus FIGS. 1 to 3 are schematic diagrams showing a configuration of a substrate processing apparatus according to a first embodiment. 1 is a plan view of the substrate processing apparatus, and FIG. 2 is a side view of the substrate processing apparatus of FIG. FIG. 3 is a cross-sectional view taken along line A1-A1 of FIG.

  As shown in FIG. 1, the substrate processing apparatus 100 includes an indexer block 10, a first processing block 11, and a second processing block 12 provided in parallel with each other.

  The indexer block 10 is provided with a plurality of carrier mounting tables 40, an indexer robot IR, and a control unit 4. On each carrier mounting table 40, a carrier C that stores a plurality of substrates W in multiple stages is mounted.

  The indexer robot IR is configured to be movable in the direction of an arrow U, rotatable about a vertical axis, and movable up and down. In the indexer robot IR, hands IRH1 and IRH2 for delivering the substrate W are provided above and below. The hands IRH1 and IRH2 hold the peripheral edge and the outer peripheral edge of the lower surface of the substrate W. The control unit 4 includes a computer including a CPU (Central Processing Unit) and controls each component in the substrate processing apparatus 100.

  As shown in FIGS. 1 and 2, the first processing block 11 is provided with a plurality (eight in FIG. 2) of back surface cleaning units SSR and a first main robot MR1.

  The plurality of back surface cleaning units SSR are stacked one above the other on the one side surface side and the other side surface side of the first processing block 11. The first main robot MR1 is provided in a substantially central portion of the processing block 11, and is configured to be rotatable about a vertical axis and to be vertically movable.

  The first main robot MR1 is provided with hands MRH1 and MRH2 for delivering the substrate W up and down. The hands MRH1 and MRH2 hold the peripheral edge and the outer peripheral edge of the lower surface of the substrate W.

  The second processing block 12 is provided with a plurality of (eight in FIG. 2) surface cleaning units SS and a second main robot MR2. The plurality of surface cleaning units SS are stacked one above the other on the one side and the other side of the second processing block 12. The second main robot MR2 is provided at a substantially central portion of the second processing block 12, and is configured to be rotatable about a vertical axis and to be vertically movable.

  As shown in FIG. 3, between the indexer block 10 and the first processing block 11, a reversing unit RT1 for reversing the substrate W and a substrate between the indexer robot IR and the first main robot MR1. Substrate platforms PASS1 for delivering W are provided above and below. Between the first processing block 11 and the second processing block 12, an inversion unit RT2 for inverting the substrate W and the substrate W between the first main robot MR1 and the second main robot MR2. A substrate platform PASS2 is provided at the top and bottom for transferring the above. Details of the reversing units RT1 and RT2 will be described later.

  The substrate platforms PASS1, PASS2 are provided with optical sensors (not shown) that detect the presence or absence of the substrate W. Thereby, it is possible to determine whether or not the substrate W is placed on the substrate platforms PASS1 and PASS2. The substrate platforms PASS1, PASS2 are provided with a plurality of support pins 51 that support the lower surface of the substrate W. When the substrate W is transferred between the indexer robot IR and the first main robot MR1 and between the first main robot MR1 and the second main robot MR2, the substrate W is temporarily mounted on the substrate. It is placed on the support pins 51 of the placement parts PASS1, PASS2.

(1-2) Outline of Operation of Substrate Processing Apparatus Next, an outline of operation of the substrate processing apparatus 100 will be described with reference to FIGS. The operation of each component of the substrate processing apparatus 100 described below is controlled by the control unit 4 in FIG.

  First, in the indexer block 10, the indexer robot IR takes out the unprocessed substrate W from one of the carriers C mounted on the carrier mounting table 40. The indexer robot IR rotates around the vertical axis while moving in the direction of the arrow U, and passes the substrate W to the reversing unit RT1. At this point, the surface of the substrate W is directed upward.

  In the reversing unit RT1, the substrate W is reversed so that the back surface faces upward. The inverted substrate W is unloaded from the reversing unit RT1 by the first main robot MR1 of the first processing block 11, and then loaded into the back surface cleaning unit SSR. In the back surface cleaning unit SSR, the back surface of the substrate W is cleaned. Hereinafter, the cleaning process for the back surface of the substrate W is referred to as a back surface cleaning process. The details of the back surface cleaning process by the back surface cleaning unit SSR will be described later.

  The substrate W after the back surface cleaning process is unloaded from the back surface cleaning unit SSR by the first main robot MR1, and then loaded into the reversing unit RT2. In the reversing unit RT2, the substrate W whose back surface is directed upward is reversed so that the front surface faces upward. The inverted substrate W is unloaded from the reversing unit RT2 by the second main robot MR2 of the second processing block 12, and is loaded into the surface cleaning unit SS.

  In the surface cleaning unit SS, the surface of the substrate W is cleaned. Hereinafter, the cleaning process for the surface of the substrate W is referred to as a surface cleaning process. The details of the surface cleaning process by the surface cleaning unit SS will be described later.

  The substrate W after the surface cleaning process is carried out of the surface cleaning unit SS by the second main robot MR2, and subsequently placed on the substrate platform PASS2. The substrate W placed on the substrate platform PASS2 is received by the main robot MR1 of the first processing block, and subsequently placed on the substrate platform PASS1. The substrate W placed on the substrate platform PASS1 is received by the indexer robot IR of the indexer block 10 and stored in the carrier C.

(1-3) Details of the main robot (1-3-1) Configurations of the first main robot and the second main robot Next, detailed configurations of the first and second main robots MR1 and MR2 will be described. Here, a detailed configuration of the first main robot MR1 will be described. The configuration of the second main robot MR2 is the same as the configuration of the first main robot MR1 described below. FIG. 4A is a side view of the first main robot MR1, and FIG. 4B is a plan view of the first main robot MR1.

  As shown in FIG. 4A and FIG. 4B, the first main robot MR1 includes a base portion 21, and an up-and-down rotation portion 22 is provided so as to be movable up and down with respect to the base portion 21. ing. A hand MRH1 is connected to the up-and-down rotating unit 22 via an articulated arm AM1, and a hand MRH2 is connected via an articulated arm AM2.

  The up-and-down rotation unit 22 is moved up and down by an up-and-down drive mechanism 25 provided in the base unit 21 and is rotated around a vertical axis by a rotation drive mechanism 26 provided in the base unit 21. The

  The articulated arms AM1 and AM2 are independently driven by a driving mechanism (not shown), and advance and retreat in the horizontal direction while maintaining the hands MRH1 and MRH2 in a fixed posture.

  Each of the hands MRH1 and MRH2 is provided at a certain height with respect to the up-and-down rotation unit 22, and the hand MRH1 is located above the MRH2. The height difference M1 (FIG. 4A) between the hand MRH1 and the hand MRH2 is kept constant.

  The hands MRH1 and MRH2 have the same shape, and are each formed in a substantially U shape. The hand MRH1 has two claw portions H11 extending substantially in parallel, and the hand MRH2 has two claw portions H12 extending substantially in parallel.

  A plurality of support pins 23 are attached to the hands MRH1 and MRH2. In the present embodiment, four support pins 23 are attached almost evenly along the outer periphery of the substrate W placed on the upper surfaces of the hands MRH1 and MRH2. The four support pins 23 hold the peripheral edge and the outer peripheral edge of the lower surface of the substrate W.

(1-3-2) Operation Example of First Main Robot Next, a specific operation example of the first main robot MR1 will be described with reference to FIG.

  First, the first main robot MR1 unloads the unprocessed substrate W whose back surface is directed upward from the reversing unit RT1 by the hand MRH2. Next, the first main robot MR1 unloads the substrate W after the back surface cleaning process from any of the back surface cleaning units SSR by the hand MRH1, and holds the unprocessed substrate W held by the hand MRH2 in the back surface cleaning unit SSR. Carry in. Next, the first main robot MR1 carries out the substrate W whose surface is directed upward from the substrate platform PASS2 by the hand MRH2. This substrate W is a substrate W that has been subjected to back surface cleaning processing and front surface cleaning processing.

  Subsequently, the first main robot MR1 carries the substrate W after the back surface cleaning process held by the hand MRH1 into the reversing unit RT2. Subsequently, the first main robot MR1 places the substrate W after the back surface cleaning process and the front surface cleaning process held on the hand MRH2 on the substrate platform PASS1.

  The first main robot MR1 performs such a series of operations continuously. In the above operation example, the operation by the hand MRH1 and the operation by the hand MRH2 may be opposite to each other.

  The number of transfer steps of the first main robot MR1 relating to one substrate W is as follows: transfer from the reversing unit RT1 to the back surface cleaning unit SSR, transfer from the back surface cleaning unit SSR to the reversing unit RT2, and from the substrate platform PASS2 to the substrate. There are three steps of conveyance to the placement unit PASS1.

(1-3-3) Operation Example of Second Main Robot Next, a specific operation example of the second main robot MR2 will be described with reference to FIG.

  First, the second main robot MR2 unloads the substrate W after the back surface cleaning process whose front surface is directed upward from the reversing unit RT2 by the hand MRH4. Next, the second main robot MR2 unloads the substrate W after the surface cleaning process from any of the surface cleaning units SS with the hand MRH3, and loads the substrate W held by the hand MRH4 into the surface cleaning unit SS. Next, the second main robot MR2 places the substrate W after the surface cleaning process held by the hand MRH3 on the substrate platform PASS2.

  The second main robot MR2 performs such a series of operations continuously. In the above operation example, the operation by the hand MRH3 and the operation by the hand MRH4 may be opposite to each other.

  The number of transport steps of the second main robot MR2 relating to one substrate W is two steps of transport from the reversing unit RT2 to the surface cleaning unit SS and transport from the surface cleaning unit SS to the substrate platform PASS2.

  The operation of the second main robot MR2 is performed in parallel with the operation of the first main robot MR1 as described above. In the present embodiment, the number of transfer processes of the substrate W by the second main robot MR2 is smaller than the number of transfer processes of the substrate W by the first main robot MR1. Therefore, the overall throughput of the substrate processing apparatus 100 depends on the transfer speed of the substrate W by the first main robot MR1.

(1-4) Configuration and Operation of Reversing Unit Subsequently, the configuration of the reversing units RT1 and RT2 will be described. The reversing units RT1 and RT2 have the same configuration.

  FIG. 5 is a schematic configuration diagram of the reversing units RT1 and RT2 in FIG. FIG. 5A is a side view of the reversing units RT1 and RT2, and FIG. 5B is a top view of the reversing units RT1 and RT2. FIG. 6 is a perspective view showing the appearance of the main part of the reversing units RT1 and RT2, and FIG. 7 is a perspective view showing the appearance of a part of the reversing units RT1 and RT2.

  As shown in FIG. 5, the reversing units RT1 and RT2 include a first support member 41, a second support member 42, a plurality of substrate support pins 43a and 43b, a first movable member 44, and a second movable member 45. A fixed plate 46, a link mechanism 47, and a rotation mechanism 48.

  As shown in FIG. 6, the first support member 41 is composed of six rod-shaped members extending radially. Substrate support pins 43a are provided at the respective tips of the six rod-shaped members. Similarly, as shown in FIG. 7, the second support member 42 is also composed of six rod-shaped members extending radially. Substrate support pins 43b are provided at the respective tips of the six rod-shaped members.

  In the present embodiment, the first and second support members 41 and 42 are composed of six rod-shaped members. However, the present invention is not limited to this, and the first and second support members 41 and 42 are other optional members. The number of the rod-shaped members or any other shape member, for example, a disk or a polygon having an outer periphery along the plurality of substrate support pins 43a and 43b may be used.

  The first movable member 44 in FIG. 6 has a U-shape, one end and the other end extending in the vertical direction, and the middle portion extending in the direction of the arrow U. The first support member 41 is fixed to one end of the first movable member 44. The other end of the first movable member 44 is connected to the link mechanism 47. Similarly, the second movable member 45 in FIG. 7 has a U shape. The second support member 42 is fixed to one end of the second movable member 45. The other end of the second movable member 45 is connected to the link mechanism 47. The link mechanism 47 is attached to the rotation shaft of the rotation mechanism 48. The link mechanism 47 and the rotation mechanism 48 are attached to the fixed plate 46.

  The link mechanism 47 of FIG. 6 incorporates an air cylinder or the like, and selectively shifts between a state in which the first movable member 44 and the second movable member 45 are relatively separated from each other and a state in which the first movable member 44 is brought close to the link mechanism 47. Can be made. The rotation mechanism 48 incorporates a motor or the like, and rotates the first movable member 44 and the second movable member 45 through the link mechanism 47, for example, 180 degrees around a horizontal axis. Can do.

  Here, the operation of the reversing units RT1 and RT2 will be described with reference to the drawings. First, the substrate W is carried into the reversing units RT1 and RT2 by the indexer robot IR or the first main robot MR1 (FIG. 1). The substrate W is placed on the plurality of substrate support pins 43b of the second support member 42 by the indexer robot IR or the first main robot MR1 with the first movable member 44 and the second movable member 45 separated in the vertical direction. To be transferred.

  Next, as shown in FIG. 5A, the first movable member 44 and the second movable member 45 are shifted to a state in which they are close to each other in the vertical direction by the function of the link mechanism 47. Thereby, both surfaces of the substrate W are supported by the plurality of substrate support pins 43a and 43b, respectively.

  Subsequently, the first movable member 44 and the second movable member 45 rotate 180 degrees around an axis parallel to the direction of the arrow U by the action of the rotation mechanism 48. Thus, the substrate W is held by the plurality of substrate support pins 43 a and 43 b provided on the first support member 41 and the second support member 42 together with the first movable member 44 and the second movable member 45. While rotating 180 degrees. Thereby, the substrate W is inverted.

  Next, the first movable member 44 and the second movable member 45 are shifted to a state of being separated in the vertical direction by the action of the link mechanism 47. In this state, the substrate W is unloaded from the reversing units RT1, RT2 by the first or second main robot MR1, MR2.

(1-5) Details of Front Surface Cleaning Unit and Back Surface Cleaning Unit Next, each configuration of the front surface cleaning unit SS and the back surface cleaning unit SSR in FIG. 1 will be described.

  FIG. 8 is a schematic diagram showing the configuration of the front surface cleaning unit SS, and FIG. 9 is a schematic diagram showing the configuration of the back surface cleaning unit SSR.

  In the front surface cleaning unit SS of FIG. 8 and the back surface cleaning unit SSR of FIG. 9, a cleaning process (hereinafter referred to as a scrub cleaning process) of the substrate W using a brush is performed.

  As shown in FIG. 8, the surface cleaning unit SS includes a spin chuck 61 for holding the substrate W horizontally and rotating the substrate W around a vertical axis passing through the center of the substrate W. The spin chuck 61 is fixed to the upper end of a rotation shaft 63 that is rotated by a chuck rotation drive mechanism 62.

  As described above, the substrate W whose surface is directed upward is carried into the surface cleaning unit SS. When performing the scrub cleaning process and the rinsing process, the back surface of the substrate W is sucked and held by the spin chuck 61.

  A motor 64 is provided outside the spin chuck 61. A rotation shaft 65 is connected to the motor 64. An arm 66 is connected to the rotation shaft 65 so as to extend in the horizontal direction, and a substantially cylindrical brush cleaning tool 70 is provided at the tip of the arm 66.

  Further, a liquid discharge nozzle 71 for supplying a cleaning liquid or a rinsing liquid (pure water) toward the surface of the substrate W held by the spin chuck 61 is provided above the spin chuck 61. A supply pipe 72 is connected to the liquid discharge nozzle 71, and the cleaning liquid and the rinse liquid are selectively supplied to the liquid discharge nozzle 71 through the supply pipe 72.

  During the scrub cleaning process, the motor 64 rotates the rotating shaft 65. As a result, the arm 66 rotates in the horizontal plane, and the brush cleaning tool 70 moves between the outer position of the substrate W and the upper position of the center of the substrate W around the rotation shaft 65. The motor 64 is provided with a lifting mechanism (not shown). The raising / lowering mechanism raises and lowers the rotating shaft 65, thereby lowering and raising the brush cleaning tool 70 at the outer position of the substrate W and the upper position of the center of the substrate W.

  At the start of the scrub cleaning process, the substrate W whose surface is directed upward is rotated by the spin chuck 61. Further, the cleaning liquid or the rinse liquid is supplied to the liquid discharge nozzle 71 through the supply pipe 72. Thereby, the cleaning liquid or the rinsing liquid is supplied to the surface of the rotating substrate W. In this state, the brush cleaning tool 70 is swung and moved up and down by the rotating shaft 65 and the arm 66. Thereby, a scrub cleaning process is performed on the surface of the substrate W. In addition, since the adsorption type spin chuck 61 is used in the surface cleaning unit SS, the peripheral edge and the outer peripheral edge of the substrate W can be cleaned simultaneously.

  Next, differences between the back surface cleaning unit SSR and the front surface cleaning unit SS of FIG. 8 will be described with reference to FIG.

  As shown in FIG. 9, the back surface cleaning unit SSR includes a mechanical spin chuck 81 that holds the outer peripheral edge of the substrate W instead of the suction spin chuck 61 that holds the lower surface of the substrate W by vacuum suction. . When performing the scrub cleaning process and the rinsing process, the substrate W is rotated while maintaining a horizontal posture in a state in which the peripheral edge portion and the outer peripheral edge portion of the lower surface thereof are held by the rotary holding pins 82 on the spin chuck 61.

  The back surface cleaning unit SSR carries the substrate W with the back surface directed upward. Therefore, the substrate W is held by the spin chuck 81 with the back surface thereof directed upward. Then, the same scrub cleaning process is performed on the back surface of the substrate W.

  A mechanical spin chuck 81 used for the back surface cleaning unit SSR may be used for the surface cleaning unit SS.

(1-6) Effects in the First Embodiment In the present embodiment, the first main robot MR1 is provided in the first processing block 11, and the second main robot MR2 is provided in the second processing block 12. Provided. In this case, the transfer of the substrate W in the first processing block 11 and the transfer of the substrate W in the second processing block 12 can be performed in parallel. Thereby, since the conveyance time of the board | substrate W can be shortened, the improvement in the throughput in the substrate processing apparatus 100 can be aimed at.

  A reversing unit RT1 is provided at a position between the indexer robot IR and the first main robot MR1, and a reversing unit RT2 is provided at a position between the first main robot MR1 and the second main robot MR2. It is done. In this case, the substrate W can be transferred from the indexer robot IR to the first main robot MR1 while inverting the substrate W. Similarly, the substrate W can be transferred from the first main robot MR1 to the second main robot MR2 while inverting the substrate W. Thereby, the transfer process of the first and second main robots MR1 and MR2 is compared with the case where each of the first and second main robots MR1 and MR2 carries the substrate W into and out of the reversing units RT1 and RT2. Can be reduced. Therefore, the throughput in the substrate processing apparatus 100 can be further improved.

  In the substrate processing apparatus 100 according to the present embodiment, a plurality of back surface cleaning units SSR are arranged in multiple stages on one side surface side and the other side surface side of the first processing block 11. A plurality of surface cleaning units SS are arranged in multiple stages on one side and the other side. Thereby, compared with the case where a plurality of cleaning units are arranged in a plane, the substrate processing apparatus 100 can be significantly reduced in size and space.

  In the present embodiment, the substrate W before the back surface cleaning process and the substrate W after the back surface cleaning process are inverted by different reversing units RT1 and RT2. In this case, even if the back surface of the substrate W before the back surface cleaning process is contaminated, the contaminant does not transfer to the substrate W after the back surface cleaning process. Thereby, the back surface of the substrate W after the back surface cleaning process can be maintained in a clean state.

  In the present embodiment, the configuration of the substrate processing apparatus 100 (so-called platform configuration) is reduced by providing a plurality of front surface cleaning units SS and a plurality of back surface cleaning units SSR stacked in the height direction in multiple stages. In addition, the required number of front surface cleaning units SS and the required number of rear surface cleaning units SSR can be easily provided by disposing the front surface cleaning unit SS and the back surface cleaning unit SSR in the height direction.

(2) Second Embodiment Hereinafter, a difference between the substrate processing apparatus according to the second embodiment of the present invention and the first embodiment will be described.

  FIG. 10 is a schematic cross-sectional view of the substrate processing apparatus according to the second embodiment. As shown in FIG. 10, the substrate processing apparatus 100a according to the second embodiment includes inversion units RT1a and RT2a shown below instead of the inversion units RT1 and RT2. Two substrate platforms PASS1, PASS2 are provided.

(2-1) Reversing Unit FIG. 11A is a side view of the reversing units RT1a and RT2a, and FIG. 11B is a perspective view of the reversing units RT1a and RT2a. The reversing units RT1a and RT2a have the same configuration.

  As shown in FIG. 11 (a), the reversing units RT1a and RT2a include a support plate 31, a fixed plate 32, a pair of linear guides 33a and 33b, a pair of support members 35a and 35b, and a pair of cylinders 37a and 37b. , A first movable plate 36a, a second movable plate 36b, and a rotary actuator 38.

  The support plate 31 is provided so as to extend in the vertical direction, and a fixed plate 32 is attached so as to extend in the horizontal direction from the center portion of one surface of the support plate 31. A linear guide 33 a extending in a direction perpendicular to the fixed plate 32 is provided in the region of the support plate 31 on the one surface side of the fixed plate 32. A linear guide 33 b extending in a direction perpendicular to the fixed plate 32 is provided in the region of the support plate 31 on the other surface side of the fixed plate 32. The linear guides 33 a and 33 b are provided symmetrically with respect to the fixed plate 32.

  A support member 35 a is provided on one surface side of the fixed plate 32 so as to extend in a direction parallel to the fixed plate 32. The support member 35a is slidably attached to the linear guide 33a via the connecting member 34a. A cylinder 37a is connected to the support member 35a, and the support member 35a is moved up and down along the linear guide 33a by the cylinder 37a. In this case, the support member 35a moves in a direction perpendicular to the fixed plate 32 while maintaining a constant posture. A first movable plate 36a is attached to the support member 35a so as to face one surface of the fixed plate 32.

  A support member 35 b is provided on the other surface side of the fixed plate 32 so as to extend in a direction parallel to the fixed plate 32. The support member 35b is slidably attached to the linear guide 33b via the connecting member 34b. A cylinder 37b is connected to the support member 35b, and the support member 35b is moved up and down along the linear guide 33b by the cylinder 37b. In this case, the support member 35b moves in a direction perpendicular to the fixed plate 32 while maintaining a constant posture. A second movable plate 36b is attached to the support member 35b so as to face the other surface of the fixed plate 32.

  In the present embodiment, the distance M2 between the first movable plate 36a and the fixed plate 32 and the second movable plate in a state where the first movable plate 36a and the second movable plate 36b are farthest from the fixed plate 32. The distance M3 between 36b and the fixed plate 32 is the difference in height between the hand MRH1 and the hand MRH2 of the first main robot MR1 shown in FIG. 4 (the hand MRH3 and the hand MRH4 of the second main robot MR2). The height difference is set to be substantially equal to M1.

  The rotary actuator 38 rotates the support plate 31 around a horizontal axis HA parallel to the direction of the arrow U (FIG. 1). As a result, the first movable plate 36a, the second movable plate 36b, and the fixed plate 32 connected to the support plate 31 rotate around the horizontal axis HA (in the θ direction).

  As shown in FIG. 11B, the first movable plate 36a, the fixed plate 32, and the second movable plate 36b are each formed in a flat plate shape.

  As shown in FIG. 11A, a plurality of support pins 39a are provided on one surface of the fixed plate 32 facing the first movable plate 36a, and a plurality of support pins 39b are provided on the other surface. . A plurality of support pins 39c are provided on one surface of the first movable plate 36a facing the fixed plate 32, and a plurality of support pins 39d are provided on one surface of the second movable plate 36b facing the fixed plate 32. Yes.

  In the present embodiment, six support pins 39a, 39b, 39c, and 39d are provided. These support pins 39a, 39b, 39c, and 39d are arranged along the outer periphery of the substrate W carried into the reversing units RT1a and RT2a. The support pins 39a, 39b, 39c, 39d have the same length. Therefore, the distance between the tip of the support pin 39a and the tip of the support pin 39d and the tip of the support pin 39b and the support pin 39c when the first movable plate 36a and the second movable plate 36b are farthest from the fixed plate 32. 4 is the difference in height between the hand MRH1 and the hand MRH2 of the first main robot MR1 shown in FIG. 4 (the height of the hand MRH3 and the hand MRH4 of the second main robot MR2). Difference) is almost equal to M1.

  The distance M2 between the first movable plate 36a and the fixed plate 32 and the distance M3 between the second movable plate 36b and the fixed plate 32 may be appropriately changed. However, the distance between the tip of the support pin 39c and the tip of the support pin 39d in the state where the first movable plate 36a and the second movable plate 36b are farthest from the fixed plate 32 is the height of the hand MRH1 and the hand MRH2. It is set to be larger than the difference in height (the difference in height between the hand MRH3 and the hand MRH4) M1.

(2-2) Outline of Operation of Substrate Processing Apparatus Next, an outline of the operation of the substrate processing apparatus 100a will be described with reference to FIG.

  First, in the indexer block 10, the indexer robot IR takes out two unprocessed substrates W from one of the carriers C mounted on the carrier mounting table 40 by the hands IRH1 and IRH2. Subsequently, the indexer robot IR sequentially passes the two substrates W held by the hands IRH1 and IRH2 to the reversing unit RT1a.

  In the reversing unit RT1a, the two unprocessed substrates W whose front surfaces are directed upward are reversed so that the back surfaces thereof face upward. The operation of the reversing unit RT1a will be described later.

  Next, the first main robot MR1 of the first processing block 11 simultaneously carries out the two substrates W whose back surfaces are directed upward from the reversing unit RT1a by the hands MRH1 and MRH2. Subsequently, the first main robot MR1 sequentially carries two substrates W held by the hands MRH1 and MRH2 into two of the back surface cleaning unit SSR (FIG. 1). Next, the first main robot MR1 sequentially carries out the two substrates W after the back surface cleaning processing from the two back surface cleaning units SSR by the hands MRH1 and MRH2.

  Next, the first main robot MR1 simultaneously carries the two substrates W after the back surface cleaning process held by the hands MRH1 and MRH2 into the reversing unit RT2a. In the reversing unit RT2a, the two substrates W whose back surfaces are directed upward are reversed so that the front surfaces face upward. The operation of the reversing unit RT2a will be described later.

  Next, the second main robot MR2 of the second processing block 12 simultaneously carries out the two substrates W whose surfaces are directed upward from the reversing unit RT2a by the hands MRH3 and MRH4. Subsequently, the second main robot MR2 sequentially carries two substrates W held by the hands MRH3 and MRH4 into the two surface cleaning units SS (FIG. 1). Next, the second main robot MR2 sequentially carries out the two substrates W after the surface cleaning process from the two surface cleaning units SS by the hands MRH3 and MRH4.

  Next, the two substrates W held by the second main robot MR2 on the hands MRH3 and MRH4 are sequentially placed on the two substrate platforms PASS2. Subsequently, the first main robot MR1 of the first processing block 11 sequentially receives the two substrates W placed on the two substrate platforms PASS2 by the hands MRH1 and MRH2. Subsequently, the first main robot MR1 places the two substrates W on the two substrate platforms PASS1 in order. Subsequently, the indexer robot IR of the indexer block 10 receives the two substrates W placed on the two substrate platforms PASS1, and stores them in the carrier C. Thus, a series of operations of the substrate processing apparatus 100a according to the second embodiment is completed.

  The difference in height between the hand IRH1 and the hand IRH2 of the indexer robot IR is set to be substantially equal to the height difference M1 between the hand MRH1 and the hand MRH2 (height difference between the hand MRH3 and the hand MRH4). The indexer robot IR can carry two substrates W into the reversing unit RT1a at the same time.

  Further, the distance between the two substrate platforms PASS1 and the distance between the two substrate platforms PASS2 is set to the height difference between the hand MRH1 and the hand MRH2 shown in FIG. 4 (the height of the hand MRH3 and the hand MRH4). Difference) By setting substantially equal to M1, the first main robot MR1 can simultaneously receive two substrates W from the two substrate platforms PASS2. Further, the first main robot MR1 can place two substrates W on the two substrate platforms PASS1 at the same time. Further, the second main robot MR2 can place two substrates W on the two substrate platforms PASS2 at the same time. The height difference between the hand IRH1 and the hand IRH2 of the indexer robot IR is set to be substantially equal to the height difference M1 between the hand MRH1 and the hand MRH2 (height difference between the hand MRH3 and the hand MRH4). In this case, the indexer robot IR can carry out two substrates W simultaneously from the two substrate platforms PASS1.

(2-3) Operation of Reversing Unit Next, operations of the reversing units RT1a and RT2a will be described. 12 and 13 are diagrams for explaining the operation of the reversing units RT1a and RT2a. In addition, since the operation | movement of each process of reversing unit RT1a and RT2a is the same, FIG. 12 and FIG. 13 demonstrates operation | movement of reversing unit RT2a as an example.

  As shown in FIG. 12A, the hand MRH1 of the first main robot MR1 holding the substrate W between the first movable plate 36a and the fixed plate 32 and between the second movable plate 36b and the fixed plate 32. MRH2 advances simultaneously. The advancing / retreating direction of the hands MRH1, MRH2 of the first main robot MR1 is orthogonal to the direction of the arrow U (FIG. 1). Further, the support pins 39a, 39b, 39c, 39d of the reversing units RT1a, RT2a are not in contact with the hands IRH1, IRH2 (FIG. 10), the hands MRH1, MRH2, and the hands MRH3, 4 when the substrate W is carried in and out. Provided in position.

  Subsequently, as shown in FIG. 12B, the hands MRH1 and MRH2 are simultaneously lowered and retracted. As a result, the substrate W is placed on the support pins 39a and 39d. In this case, in the reversing unit RT2a, the substrate W whose back surface is directed upward is placed on the support pins 39a and 39d.

  Subsequently, as shown in FIG. 12C, the support member 35a is lowered by the cylinder 37a (FIG. 11A), and the support member 35b is raised by the cylinder 37b (FIG. 11A). Accordingly, one substrate W is held by the support pins 39c of the first movable plate 36a and the support pins 39a of the fixed plate 32, and the other substrate W is supported by the support pins 39d of the second movable plate 36b and the fixed plate 32. It is held by the pin 39b.

  In this state, as shown in FIG. 12D, the first movable plate 36a, the fixed plate 32, and the second movable plate 36b are integrally rotated 180 degrees in the θ direction (around the horizontal axis HA) by the rotary actuator 38. Is done. Thereby, the substrate W held by the support pins 39a and 39c and the substrate W held by the support pins 39b and 39d are reversed. In this case, the surface of the substrate W is directed upward in the reversing unit RT2a.

  Subsequently, as shown in FIG. 13E, the support member 35a is lowered by the cylinder 37a, and the support member 35b is raised by the cylinder 37b. Accordingly, the first movable plate 36a is lowered and the second movable plate 36b is raised. Therefore, one substrate W is supported by the support pins 39c of the first movable plate 36a, and the other substrate W is supported by the support pins 39b of the fixed plate 32.

  In this state, as shown in FIG. 13 (f), the hands MRH3 and MRH4 of the second main robot MR2 (FIG. 10) are below the substrate W supported by the support pins 39b and the substrate supported by the support pins 39c. Ascends below W and rises. Thereby, the substrate W supported by the support pins 39b is received by the hand MRH3, and the substrate W supported by the support pins 39c is received by the hand MRH4. The advancing / retreating direction of the hands MRH3, MRH4 of the second main robot MR2 is orthogonal to the direction of the arrow U (FIG. 1).

  Thereafter, as shown in FIG. 13G, the hands MRH3 and MRH4 are simultaneously retracted, whereby the two substrates W are unloaded from the reversing unit RT2a.

(2-4) Effects in the Second Embodiment In the present embodiment, the first and second main robots MR2 simultaneously carry in and out the two substrates W with respect to the reversing units RT1a and RT2a. Further, the reversing units RT1a and RT2a simultaneously reverse the two substrates W. Thereby, the some board | substrate W can be reversed efficiently. As a result, the throughput in the substrate processing apparatus 100a can be improved.

  Further, the indexer robot IR, the first main robot MR1 and the second main robot MR2 transfer the two substrates W in parallel, so that the throughput in the substrate processing apparatus 100a can be further improved.

(3) Third Embodiment Hereinafter, a substrate processing apparatus according to a third embodiment of the present invention will be described while referring to differences from the first embodiment.

(3-1) Configuration of Substrate Processing Apparatus FIGS. 14 and 15 are schematic views showing the configuration of the substrate processing apparatus according to the third embodiment. 14 is a plan view of the substrate processing apparatus, and FIG. 15 is a cross-sectional view taken along line A2-A2 of FIG.

  As shown in FIG. 14, in the substrate processing apparatus 100 b according to the third embodiment, a plurality of (for example, eight) surface cleaning units SS are provided in the first processing block 11, and the second processing block 12. A plurality of (for example, eight) back surface cleaning units SSR are provided. Further, as shown in FIG. 15, substrate platforms PASS <b> 1 and PASS <b> 2 are provided vertically between the indexer block 10 and the first processing block 11, and the first processing block 11, the second processing block 12, Inverting units RT1 and RT2 are provided above and below.

(3-2) Outline of Operation of Substrate Processing Apparatus Next, an outline of the operation of the substrate processing apparatus 100b will be described with reference to FIGS.

  First, in the indexer block 10, the indexer robot IR takes out the unprocessed substrate W from one of the carriers C placed on the carrier placing table 40. The indexer robot IR rotates around the vertical axis while moving in the direction of arrow U, and places the substrate W on the substrate platform PASS1.

  The substrate W placed on the substrate platform PASS1 is received by the first main robot MR1 of the first processing block 11, and subsequently carried into the surface cleaning unit SS. Then, the substrate W after the surface cleaning process is unloaded from the surface cleaning unit SS by the first main robot MR1, and subsequently loaded into the reversing unit RT1.

  In the reversing unit RT1, the substrate W whose front surface is directed upward is reversed so that the back surface faces upward. The inverted substrate W is unloaded from the reversing unit RT1 by the second main robot MR2 of the second processing block 12, and subsequently loaded into the back surface cleaning unit SSR. Then, the substrate W after the back surface cleaning process is unloaded from the back surface cleaning unit SSR by the second main robot MR2, and subsequently loaded into the reversing unit RT2.

  In the reversing unit RT2, the substrate W whose back surface is directed upward is reversed so that the front surface faces upward. The inverted substrate W is unloaded from the reversing unit RT2 by the first main robot MR1 of the first processing block 11, and placed on the substrate platform PASS2. The substrate W placed on the substrate platform PASS2 is received by the indexer robot IR of the indexer block 10 and stored in the carrier C.

  In the substrate processing apparatus 100b, the number of transfer steps of the first main robot MR1 relating to one substrate W is as follows: transfer from the substrate platform PASS1 to the surface cleaning unit SS, transfer from the surface cleaning unit SS to the reversing unit RT1, And three steps of conveyance from the reversing unit RT2 to the substrate platform PASS2.

  Further, the number of transport steps of the second main robot MR2 regarding one substrate W is two steps of transport from the reversing unit RT1 to the back surface cleaning unit SSR and transport from the back surface cleaning unit SSR to the reversing unit RT2.

  Similar to the first embodiment, the number of steps of transporting the substrate W by the second main robot MR2 is smaller than the number of steps of transporting the substrate W by the first main robot MR1. Therefore, the overall throughput of the substrate processing apparatus 100b depends on the transfer speed of the substrate W by the first main robot MR1.

(3-3) Effects in the Third Embodiment Also in the present embodiment, similarly to the first embodiment, the transport of the substrate W in the first processing block 11 and the second processing block 12 are performed. The conveyance of the substrate W can be performed in parallel. Thereby, since the conveyance time of the board | substrate W can be shortened, the throughput in the substrate processing apparatus 100b can be improved.

  Further, the reversing units RT1 and RT2 are provided at a position between the first main robot MR1 and the second main robot MR2, so that the first main robot MR1 and the second main robot are reversed while the substrate W is reversed. The substrate W can be delivered to and from the MR2. Thereby, the number of transfer processes of the first and second main robots MR1 and MR2 is compared with the case where each of the first and second main robots MR1 and MR2 carries the substrate W into and out of the reversing units RT1 and RT2. Can be reduced. Therefore, the throughput in the substrate processing apparatus 100 can be further improved.

(3-4) Modification of Third Embodiment In the substrate processing apparatus 100b according to the third embodiment, the reversing unit RT1a shown in the second embodiment is used instead of the reversing units RT1 and RT2. RT2a may be used. In this case, since the plurality of substrates W can be efficiently reversed, the throughput in the substrate processing apparatus 100b can be improved.

  Also, two substrate platforms PASS1 and PASS2 are provided, and two substrates W are transferred in parallel as in the second embodiment, thereby further improving the throughput in the substrate processing apparatus 100b. be able to.

(4) Reference Example Hereinafter, a substrate processing apparatus according to a reference example of the present invention will be described while referring to differences from the first embodiment.

(4-1) Configuration of Substrate Processing Apparatus FIGS. 16 and 17 are schematic views showing the configuration of a substrate processing apparatus according to a reference example . 16 is a plan view of the substrate processing apparatus, and FIG. 17 is a cross-sectional view taken along line A3-A3 of FIG.

As shown in FIGS. 16 and 7, in the substrate processing apparatus 100c according to the reference example , the substrate platforms PASS1 and PASS2 are provided above and below between the indexer block 10 and the first processing block 11, and the first Between the processing block 11 and the second processing block 12, substrate platforms PASS3 and PASS4 having the same configuration as the substrate platforms PASS1 and PASS2 are provided above and below. Further, reversing units RT1 and RT2 are provided vertically on one side surface of the second processing block 12 opposite to the first processing block 11.

(4-2) Outline of Operation of Substrate Processing Apparatus An outline of operation of the substrate processing apparatus 100c will be described with reference to FIGS. First, in the indexer block 10, the indexer robot IR takes out the unprocessed substrate W from one of the carriers C placed on the carrier placing table 40. The indexer robot IR rotates around the vertical axis while moving in the direction of arrow U, and places the substrate W on the substrate platform PASS1.

  The substrate W placed on the substrate platform PASS1 is received by the first main robot MR1 of the first processing block 11, and subsequently placed on the substrate platform PASS3. The substrate W placed on the substrate platform PASS3 is received by the second main robot MR2 of the second processing block 12, and subsequently carried into the reversing unit RT1.

  In the reversing unit RT1, the substrate W whose front surface is directed upward is reversed so that the back surface faces upward. The substrate W after the reversal is unloaded from the reversing unit RT1 by the second main robot MR2, and then is loaded into the back surface cleaning unit SSR. Then, the substrate W after the back surface cleaning process is unloaded from the back surface cleaning unit SSR by the second main robot MR2, and subsequently loaded into the reversing unit RT2.

  In the reversing unit RT2, the substrate W whose back surface is directed upward is reversed so that the front surface faces upward. The inverted substrate W is unloaded from the reversing unit RT2 by the second main robot MR2 and placed on the substrate platform PASS4. The substrate W placed on the substrate platform PASS4 is received by the first main robot MR1 of the first processing block 11, and subsequently carried into the surface cleaning unit SS.

  Then, the substrate after the surface cleaning process is carried out of the surface cleaning unit SS by the first main robot MR1, and subsequently placed on the substrate platform PASS2. The substrate W placed on the substrate platform PASS2 is received by the indexer robot IR of the indexer block 10 and stored in the carrier C.

(4-3) Effects in Reference Example
Also in the reference example , similarly to the first embodiment, the transfer of the substrate W in the first processing block 11 and the transfer of the substrate W in the second processing block 12 can be performed in parallel. Thereby, since the conveyance time of the board | substrate W can be shortened, the throughput in the substrate processing apparatus 100c can be improved.

(4-4) Modification of reference example
In the substrate processing apparatus 100c according to the reference example , the reversing units RT1a and RT2a shown in the second embodiment may be used instead of the reversing units RT1 and RT2. In this case, since the plurality of substrates W can be efficiently reversed, the throughput in the substrate processing apparatus 100c can be improved.

  Further, by providing two substrate platforms PASS1, PASS2, PASS3, and PASS4, respectively, and carrying two substrates W in parallel as in the second embodiment, throughput in the substrate processing apparatus 100c is achieved. Can be further improved.

(5) Other Embodiments In the first embodiment, the substrate W after the surface cleaning process is transferred from the second processing block 12 to the indexer block 10 via the substrate platforms PASS1, PASS2. However, the present invention is not limited to this, and it may be conveyed from the second processing block 12 to the indexer block 10 via the reversing units RT1 and RT2.

In the third embodiment and the reference example , the reversing unit RT1 inverts the substrate W before the back surface cleaning process and the reversing unit RT2 inverts the substrate W after the back surface cleaning process. However, the present invention is not limited to this. Instead, the substrate W before the back surface cleaning process and the substrate W after the back surface cleaning process may be inverted by a common inversion unit.

In the first to third embodiments and the reference examples , as the indexer robot IR and the main robots MR1 and MR2, an articulated transfer robot that moves the joint linearly by moving the joint is used. However, the present invention is not limited to this, and a linear motion type transfer robot that moves the hand linearly with respect to the substrate W to perform the advance / retreat operation may be used.

In the first to third embodiments and reference examples , the order of the front surface cleaning process and the rear surface cleaning process may be reversed.

  Further, the operation order of the indexer robot IR and the main robots MR1 and MR2 may be changed as appropriate according to the processing speed of the reversing units RT1 and RT2, the front surface cleaning unit SS, and the back surface cleaning unit SSR.

  Further, the numbers of the reversing units RT1, RT2, RT1a, RT2a, the front surface cleaning unit SS, the back surface cleaning unit SSR, and the end surface cleaning unit SSB may be appropriately changed according to the processing speed.

(6) Correspondence between each constituent element of claim and each element of the embodiment Hereinafter, an example of correspondence between each constituent element of the claim and each element of the embodiment will be described. It is not limited to.

  In the above embodiment, the first processing block 11 is an example of the first processing area, the second processing block 12 is an example of the second processing area, and the indexer block 10 is an example of the carry-in / out area. Yes, the area between the indexer block 10 and the first processing block 11 is an example of the first delivery area, and the area between the first processing block 11 and the second processing block 12 is the second It is an example of a delivery area.

  In addition, the front surface cleaning unit SS or the back surface cleaning unit SSR is an example of the first processing unit, the first main robot MR1 is an example of the first transport unit, and the front surface cleaning unit SS or the back surface cleaning unit SSR is the first processing unit. 2 is an example of the processing unit, the second main robot MR2 is an example of the second transport means, the carrier C is an example of the storage container, the carrier mounting table 40 is an example of the container mounting unit, The indexer robot IR is an example of the third transfer means.

  The back surface cleaning unit SSR is an example of a back surface cleaning processing unit, the front surface cleaning unit SS is an example of a front surface cleaning processing unit, and the reversing units RT1, RT2, RT1a, RT1b are (first or second) reversing devices. The substrate platforms PASS1, PASS2 and PASS3 are examples of the (first or second) substrate platform.

  The fixed plate 32, the first movable plate 36a, the support pins 39a and 39c, and the cylinder 37a are examples of the first holding mechanism. The fixed plate 32, the second movable plate 36b, the support pins 39b and 39d, and the cylinder 37b is an example of a second holding mechanism, the support plate 31 is an example of a support member, the rotary actuator 38 is an example of a rotating device, the fixed plate 32 is an example of a common reverse holding member, and a support pin 39a is an example of the first support part, the first movable plate 36a is an example of the first reverse holding member, the support pin 39c is an example of the second support part, and the cylinder 37a is the first drive. It is an example of a mechanism, the support pin 39b is an example of a third support part, the second movable plate 36b is an example of a second reverse holding member, and the support pin 39d is an example of a fourth support part , Cylinder 37b is an example of the second drive mechanism That.

  In addition, as each component of a claim, it is also possible to use the other various elements which have the structure or function described in the claim.

  The present invention can be used for processing various substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for PDP, glass substrates for photomasks, and substrates for optical disks.

It is a figure which shows the structure of the substrate processing apparatus which concerns on 1st Embodiment. It is a figure which shows the structure of the substrate processing apparatus which concerns on 1st Embodiment. It is a figure which shows the structure of the substrate processing apparatus which concerns on 1st Embodiment. It is a figure which shows the structure of a 1st main robot. It is a figure which shows an inversion unit structure. It is a figure which shows an inversion unit structure. It is a figure which shows an inversion unit structure. It is a schematic diagram which shows the structure of a surface cleaning unit. It is a schematic diagram which shows the structure of a back surface cleaning unit. It is a figure which shows the structure of the substrate processing apparatus which concerns on 2nd Embodiment. It is a figure which shows the structure of the inversion unit in 2nd Embodiment. It is a figure which shows operation | movement of the inversion unit in 2nd Embodiment. It is a figure which shows operation | movement of the inversion unit in 2nd Embodiment. It is a figure which shows the structure of the substrate processing apparatus which concerns on 3rd Embodiment. It is a figure which shows the structure of the substrate processing apparatus which concerns on 3rd Embodiment. It is a figure which shows the structure of the substrate processing apparatus which concerns on a reference example . It is a figure which shows the structure of the substrate processing apparatus which concerns on a reference example .

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Indexer block 11 1st process block 12 2nd process block 40 Carrier mounting base 100,100a, 100b, 100c Substrate processing apparatus C carrier PASS1, PASS2, PASS3 Substrate mounting part RT1, RT2, RT1a, RT1b Inversion unit SS Front surface cleaning unit SSR Back surface cleaning unit MR1 First main robot MR2 Second main robot W Substrate

Claims (10)

A substrate processing apparatus for processing a substrate having a front surface and a back surface,
First and second processing regions disposed adjacent to each other and processing a substrate;
A loading / unloading area for loading and unloading a substrate with respect to the first processing area;
A first delivery area provided between the carry-in / out area and the first processing area;
A second transfer area provided between the first processing area and the second processing area;
The first processing area is:
A first processing unit;
And a first transfer means for transferring a substrate between the first transfer area, the first processing unit, and the second transfer area,
The second processing area is
A second processing unit;
A second transfer means for transferring a substrate between the second transfer area and the second processing unit;
The carry-in / out area is
A container mounting portion on which a storage container for storing a substrate is mounted;
Including a third transport means for transporting the substrate between the storage container placed on the container placement section and the first delivery area;
The first delivery region includes a first substrate placement unit on which a substrate is placed, and a first reversing device that reverses the front surface and the back surface of the substrate,
The second delivery area includes a second substrate placement portion on which the substrate is placed, and a second reversing device for reversing the front surface and the back surface of the substrate,
One of the first and second processing units includes a back surface cleaning processing unit that cleans the back surface of the substrate,
The other of the first and second processing units includes a surface cleaning processing unit that cleans the surface of the substrate,
The first transfer means includes a substrate between the first substrate platform, the second substrate platform, the first reversing device, the second reversing device, and the first processing unit. Transport the
The second transport means transports the substrate between the second substrate platform, the second reversing device, and the second processing unit,
The third transport means transports a substrate between the storage container placed on the container placing portion, the first substrate placing portion, and the first reversing device. apparatus. The first reversing device reverses the substrate around a rotation axis intersecting a line connecting the position of the first transport unit and the position of the third transport unit at the time of transferring the substrate,
The second reversing device reverses the substrate around a rotation axis intersecting a line connecting the position of the first transport unit and the position of the second transport unit at the time of transferring the substrate. The substrate processing apparatus according to claim 1 . Each of the first and second reversing devices includes:
  A first holding mechanism for holding the substrate in a state perpendicular to the first axis;
  A second holding mechanism for holding the substrate in a state perpendicular to the first axis;
  A support member that supports the first and second holding mechanisms so as to overlap in the direction of the first axis;
  3. A rotating device that integrally rotates the support member together with the first and second holding mechanisms around a second axis that is substantially perpendicular to the first axis. The substrate processing apparatus as described. A substrate processing apparatus for processing a substrate having a front surface and a back surface,
First and second processing regions disposed adjacent to each other and processing a substrate;
A loading / unloading area for loading and unloading a substrate with respect to the first processing area;
A first delivery area provided between the carry-in / out area and the first processing area;
A second transfer area provided between the first processing area and the second processing area;
The first processing area is:
A first processing unit;
And a first transfer means for transferring a substrate between the first transfer area, the first processing unit, and the second transfer area,
The second processing area is
A second processing unit;
A second transfer means for transferring a substrate between the second transfer area and the second processing unit;
The carry-in / out area is
A container mounting portion on which a storage container for storing a substrate is mounted;
Including a third transport means for transporting the substrate between the storage container placed on the container placement section and the first delivery area;
The first delivery area includes a first substrate placement unit on which a substrate is placed,
The second delivery region includes a reversing device that reverses the front surface and the back surface of the substrate ,
One of the first and second processing units includes a back surface cleaning processing unit that cleans the back surface of the substrate,
The other of the first and second processing units includes a surface cleaning processing unit that cleans the surface of the substrate,
The first transport means transports a substrate between the first substrate platform, the reversing device, and the first processing unit,
The second transport means transports a substrate between the reversing device and the second processing unit,
The third conveying means, board processor you characterized by transporting the substrate between the container and the placed on the container platform first substrate platform. The reversing device according to claim 4, characterized in that reversing the substrate about an axis of rotation which intersects the line connecting the position of the second conveying means of said first conveying means at the time of transferring the substrate The substrate processing apparatus as described. 6. The substrate processing apparatus according to claim 4 , wherein the inverting device includes first and second inverting devices arranged above and below. The first reversing device is used for reversing the substrate before cleaning by the back surface cleaning processing unit, and the second reversing device is used for reversing the substrate after cleaning by the back surface cleaning processing unit. The substrate processing apparatus according to claim 6 , wherein the substrate processing apparatus is formed. The reversing device is
A first holding mechanism for holding the substrate in a state perpendicular to the first axis;
A second holding mechanism for holding the substrate in a state perpendicular to the first axis;
A support member that supports the first and second holding mechanisms so as to overlap in the direction of the first axis;
Claim 4-7, characterized in that it comprises a rotary device for rotating integrally around the support member to said first and said with second holding mechanism first axis substantially perpendicular to the second axis The substrate processing apparatus according to any one of the above. The first and second holding mechanisms include a common inversion holding member having one surface and another surface perpendicular to the first axis,
The first holding mechanism includes:
A plurality of first support portions provided on the one surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;
A first reverse holding member provided to face the one surface of the common reverse holding member;
A plurality of second support portions provided on a surface of the first reverse holding member facing the common reverse holding member and supporting an outer peripheral portion of the substrate;
A state in which the first inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis, and a state in which the first inversion holding member and the common inversion holding member are close to each other; A first drive mechanism that moves at least one of the first inversion holding member and the common inversion holding member so as to selectively shift to
The second holding mechanism includes:
A plurality of third support portions provided on the other surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;
A second reverse holding member provided so as to face the other surface of the common reverse holding member,
A plurality of fourth support portions provided on a surface of the second reverse holding member facing the common reverse holding member, and supporting an outer peripheral portion of the substrate;
A state in which the second inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis, and a state in which the second inversion holding member and the common inversion holding member are close to each other; The substrate processing according to claim 3 , further comprising: a second drive mechanism that moves at least one of the second reverse holding member and the common reverse holding member so as to selectively shift to apparatus. The backside cleaning processing unit includes a plurality of backside cleaning units arranged in a plurality of stages, and the frontside cleaning processing unit includes a plurality of front surface cleaning units arranged in a plurality of stages. The substrate processing apparatus according to any one of 9.

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