JP5385965B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus for processing a substrate.

  2. Description of the Related Art Conventionally, a substrate processing apparatus is used to perform various processes on a substrate such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, and a glass substrate for an optical disk.

  For example, Patent Document 1 describes a substrate processing apparatus including a reversing unit that reverses the front surface and the back surface of a substrate. In such a substrate processing apparatus, a center robot (conveyance unit) that conveys a substrate is disposed at substantially the center of a rectangular process unit.

  A plurality of (for example, four) back surface cleaning units for performing a cleaning process are arranged on the back surface of the substrate so as to surround the center robot in the process unit. Further, a reversing unit is arranged at a position where access by the central robot is possible in the process unit.

  An indexer unit including a plurality of storage containers for storing substrates is provided on one end side of the process unit. The indexer unit is provided with a substrate transfer robot that takes out the substrate before processing from the storage container or stores the processed substrate in the storage container.

  In the configuration as described above, the substrate transfer robot takes out the substrate before processing from one of the storage containers and passes it to the center robot, and receives the processed substrate from the center robot and stores it in the storage container.

  When the center robot receives the unprocessed substrate from the substrate transfer robot, the center robot passes the received substrate to the reversing unit. The reversing unit reverses the substrate received from the center robot so that the surface faces downward. The center robot receives the substrate reversed by the reversing unit, and carries the substrate into one of the back surface cleaning units.

  Subsequently, when the processing is completed in any of the above-described back surface cleaning units, the center robot carries the substrate out of the back surface cleaning unit and passes it again to the reversing unit. The reversing unit reverses the substrate that has been processed in the back surface cleaning unit so that the front surface faces upward.

  The center robot receives the substrate reversed by the reversing unit and passes it to the substrate transport robot. The substrate transfer robot stores the processed substrate received from the center robot in the storage container.

JP 2004-146708 A

  However, in the conventional substrate processing apparatus described above, the number of substrate transport steps is increased, which complicates the operation of the center robot. In this case, it becomes difficult to efficiently transport a plurality of substrates, and the throughput in substrate processing is significantly reduced.

  An object of the present invention is to provide a substrate processing apparatus capable of improving throughput.

(1) A substrate processing apparatus according to the present invention is a substrate processing apparatus that performs processing on a substrate having a front surface and a back surface, and a processing region for processing the substrate, and loading and unloading the substrate with respect to the processing region. A carry-out area, and a delivery area provided between the carry-in / out area and the processing area, wherein the processing area has a plurality of back surface cleaning processing units for cleaning the back surface of the substrate and a plurality of surface cleanings for cleaning the surface of the substrate Including a processing section, a plurality of back surface cleaning processing sections, a plurality of front surface cleaning processing sections, and a first transport means for transporting the substrate between the transfer areas, and the loading / unloading area is loaded with a storage container for storing the substrates And a second transport means for transporting the substrate between the storage container placed on the container placement portion and the delivery area, and the delivery area includes a front surface and a back surface of the substrate. Includes reversing device to reverse, reversing device Simultaneously inverts a plurality of substrates, the second conveying means is simultaneously transporting a plurality of substrates between the container and the reversing device.

  (2) The delivery area includes a plurality of substrate placement units for placing the substrates, and the second transfer device places a plurality of substrates before cleaning by the back surface cleaning processing unit and the front surface cleaning processing unit. The first transport device may simultaneously take out the plurality of substrates placed on the plurality of substrate placement units before cleaning from the plurality of substrate placement units.

  (3) The second transport unit may simultaneously place the plurality of substrates before cleaning by the back surface cleaning processing unit and the front surface cleaning processing unit on the plurality of substrate mounting units.

  (4) The first transport device may simultaneously carry a plurality of substrates cleaned by the back surface cleaning processing unit and the front surface cleaning processing unit into the reversing device.

  (5) In the reversing device, the first and second holding mechanisms that respectively hold the substrate in a state perpendicular to the first axis, and the first and second holding mechanisms are overlapped in the direction of the first axis. A supporting member for supporting, and a rotating device for integrally rotating the supporting member together with the first and second holding mechanisms around a second axis substantially perpendicular to the first axis may be included.

  (6) The first transport unit includes first and second holding units that respectively hold the substrate, and the substrate holding position by the first holding unit and the substrate holding position by the second holding unit The distance between them may be equal to the distance between the substrate holding position by the first holding mechanism of the reversing device and the substrate holding position by the second holding mechanism.

  (7) The second transport unit includes third and fourth holding units that respectively hold the substrate, and the substrate holding position by the third holding unit and the substrate holding position by the fourth holding unit The distance between them may be equal to the distance between the substrate holding position by the first holding mechanism of the reversing device and the substrate holding position by the second holding mechanism.

  (8) A substrate processing apparatus according to a reference example is a substrate processing apparatus that performs processing on a substrate having a front surface and a back surface, and is disposed adjacent to each other and includes first and second processing regions that perform processing on the substrate. A loading / unloading area for loading and unloading the substrate with respect to the first processing area, a first transfer area provided between the loading / unloading area and the first processing area, a first processing area, and a second A second transfer area provided between the first process area, the first process area, the first transfer area, the first process section, and the second transfer area. And a second processing region that transports the substrate between the second processing unit, the second transfer region, and the second processing unit. And a loading / unloading area on which a storage container for storing the substrate is placed. And a third transfer means for transferring the substrate between the storage container placed on the container placement part and the first delivery area, and any of the first and second processing parts. The one includes an edge cleaning processing unit that cleans the outer peripheral edge of the substrate while holding the back surface of the substrate, and at least one of the first and second transfer regions is a substrate cleaned by the edge cleaning processing unit. In this case, one of the first and second processing units includes a back surface cleaning processing unit that cleans the back surface of the substrate inverted by the reversing device.

  In this substrate processing apparatus, the substrate is carried into and out of the first processing region from the loading and unloading region, and the substrate is processed in the first processing region and the second processing region. In the first processing region, the substrate is transported between the first delivery region, the first processing unit, and the second delivery region by the first transport means. In the second processing region, the substrate is transported between the second delivery region and the second processing unit by the second transport means. Further, in the carry-in / out area, the substrate is transported between the storage container placed on the container placing portion and the first delivery area by the third transport means.

  In either one of the first and second processing units, the outer peripheral edge of the substrate is cleaned by the edge cleaning processing unit while the back surface of the substrate is held. The front surface and the back surface of the substrate cleaned by the edge cleaning processing unit are reversed by the reversing device in at least one of the first and second transfer regions. In either one of the first processing unit and the second processing unit, the back surface of the substrate inverted by the reversing device is cleaned by the back surface cleaning processing unit.

  With such a configuration, in the first processing region and the second processing region, the substrate transport by the first transport unit and the substrate transport by the second transport unit can be performed in parallel. Thereby, a some board | substrate can be conveyed efficiently. Accordingly, it is possible to shorten the substrate transport time in the first processing region and the second processing region. As a result, the throughput in the substrate processing apparatus can be improved.

  In addition, after the outer peripheral edge of the substrate is cleaned by the edge cleaning processing unit, the back surface of the substrate is cleaned by the back surface cleaning processing unit, whereby the substrate back surface is held in the edge cleaning processing unit. Even if the back surface of the substrate is contaminated, the contamination of the back surface of the substrate is removed by the back surface cleaning processing unit. Thereby, the substrate can be sufficiently cleaned.

  Further, the substrate is reversed by the reversing device at least one of the first and second transfer areas, so that the first conveying unit and the third conveying unit are connected to each other. The front and back surfaces of the substrate can be reversed while transferring the substrate at least at one of the conveyance means. Accordingly, the substrate transport time can be further shortened, and the throughput in the substrate processing apparatus can be further improved.

  (9) The edge cleaning processing unit may include a plurality of edge cleaning units arranged in a plurality of stages, and the back surface cleaning processing unit may include a plurality of back surface cleaning units arranged in a plurality of stages.

  In this case, by arranging multiple edge cleaning units and multiple back surface cleaning units in multiple stages, the footprint can be reduced, and the cleaning of the outer peripheral edges of multiple substrates and the cleaning of the back surfaces of multiple substrates is efficient. Can be done well. Therefore, the throughput in the substrate processing apparatus can be further improved.

  (10) Either one of the first and second processing units may include a surface cleaning processing unit that cleans the surface of the substrate.

  In this case, in either one of the first processing unit and the second processing unit, the surface of the substrate is cleaned by the surface cleaning processing unit.

  (11) The surface cleaning processing unit may include a plurality of surface cleaning units arranged in a plurality of stages.

  In this case, by arranging the plurality of surface cleaning units in a plurality of stages, the footprint can be reduced and the surfaces of the plurality of substrates can be efficiently cleaned. Therefore, the throughput in the substrate processing apparatus can be further improved.

  (12) The reversing device includes first and second reversing devices, and the first transfer area includes a first substrate placement unit on which the substrate is placed and a first reversing device, The second transfer area includes a second substrate placement unit on which the substrate is placed and a second reversing device, the first processing unit includes a back surface cleaning processing unit, and the second processing unit includes: , An edge cleaning processing unit and a front surface cleaning processing unit, and the first transport means includes a first substrate mounting unit, a second substrate mounting unit, a first inversion device, a second inversion device, and a back surface. The substrate is transported between the cleaning processing units, and the second transporting unit transports the substrate between the second substrate mounting unit, the second reversing device, the edge cleaning processing unit, and the surface cleaning processing unit, The third transport means may transport the substrate between the storage container, the first substrate platform, and the first reversing device.

  In this case, an unprocessed substrate is taken out of the storage container by the third transport means and placed on the first substrate platform. The substrate placed on the first substrate platform is placed on the second substrate platform by the first transport means. The substrate placed on the second substrate placement unit is carried into one of the edge cleaning processing unit and the surface cleaning processing unit by the second transport unit.

  The substrate cleaned by one of the edge cleaning processor and the surface cleaning processor is carried into the other of the edge cleaning processor and the surface cleaning processor by the second transport means. The substrate after the cleaning by the surface cleaning processing unit and the edge cleaning processing unit is carried into the second reversing device by the second transport means. The substrate that has been reversed so that the back surface faces upward by the second reversing device is carried into the back surface cleaning processing section by the first transport means. The substrate cleaned by the back surface cleaning processing unit is carried into the first reversing device by the first transport means. The substrate inverted so that the surface is directed upward by the first reversing device is returned to the storage container by the third conveying means.

  With such a configuration, the substrate transport by the first transport unit and the substrate transport by the second transport unit can be performed in parallel. Thereby, a some board | substrate can be conveyed efficiently. Accordingly, it is possible to shorten the substrate transport time in the substrate processing apparatus. As a result, the throughput in the substrate processing apparatus can be improved.

  Even if the back surface of the substrate is cleaned by the back surface cleaning processing unit after the peripheral edge portion of the substrate is cleaned by the edge cleaning processing unit, the back surface of the substrate is contaminated in the end cleaning processing unit. Contamination on the back surface of the substrate is removed in the back surface cleaning processing section. Thereby, the substrate can be sufficiently cleaned.

  In the second transfer area, the substrate can be transferred from the second transfer means to the first transfer means while the substrate is inverted by the second reversing device. Further, in the first transfer area, the substrate can be transferred from the first transfer means to the third transfer means while the substrate is inverted by the first inversion device. Accordingly, the substrate transport time can be further shortened, and the throughput in the substrate processing apparatus can be further improved.

  (13) The first reversing device reverses the substrate around a rotation axis that intersects a line connecting the position of the first transport unit and the position of the third transport unit at the time of transferring the substrate. The reversing device may reverse the substrate around a rotation axis that intersects a line connecting the position of the first transport unit and the position of the second transport unit when the substrate is transferred.

  In this case, the first reversing device can pass the substrate between the first and third transfer means without changing the direction, and the second reversing device can change the first and second without changing the direction. The substrate can be transferred between the transfer means. Therefore, the structure of the first and second reversing devices is simplified and the cost can be reduced. Further, since the first and second reversing devices do not need to change direction, the throughput in the substrate processing apparatus is improved.

  (14) The first delivery area includes a first substrate placement section on which a substrate is placed, and the second delivery area is a second substrate placement section on which the substrate is placed, and a reversing device. The first processing unit includes a front surface cleaning processing unit, the second processing unit includes an end surface cleaning processing unit and a back surface cleaning processing unit, and the first transport means is configured to mount the first substrate. The substrate is transported between the placement unit, the second substrate mounting unit, the reversing device, and the surface cleaning processing unit, and the second transporting means includes a second substrate placing unit, a reversing device, an edge cleaning processing unit, and The substrate may be transported between the back surface cleaning processing units, and the third transport unit may transport the substrate between the storage container and the first substrate mounting unit.

  In this case, an unprocessed substrate is taken out of the storage container by the third transport means and placed on the first substrate platform. The substrate placed on the first substrate platform is placed on the second substrate platform by the first transport means. The substrate placed on the second substrate placement unit is carried into the edge cleaning processing unit by the second transport means.

  The substrate after the cleaning by the edge cleaning processing unit is carried into the reversing device by the second transport unit. The substrate reversed so that the back surface faces upward by the reversing device is carried into the back surface cleaning processing section by the second transport means. The substrate after cleaning by the back surface cleaning processing unit is carried into the reversing device by the second transport means. The substrate inverted so that the surface faces upward by the reversing device is carried into the surface cleaning processing section by the first transport means. The substrate cleaned by the front surface cleaning processing unit is placed on the first substrate mounting unit by the first transport unit. The substrate placed on the first substrate platform is returned to the storage container by the third transport means.

  With such a configuration, the substrate transport by the first transport unit and the substrate transport by the second transport unit can be performed in parallel. Thereby, a some board | substrate can be conveyed efficiently. Accordingly, it is possible to shorten the substrate transport time in the substrate processing apparatus. As a result, the throughput in the substrate processing apparatus can be improved.

  Even if the back surface of the substrate is cleaned by the back surface cleaning processing unit after the peripheral edge portion of the substrate is cleaned by the edge cleaning processing unit, the back surface of the substrate is contaminated in the end cleaning processing unit. Contamination on the back surface of the substrate is removed in the back surface cleaning processing section. Thereby, the substrate can be sufficiently cleaned.

  Further, in the second transfer area, the substrate can be transferred from the second transfer means to the first transfer means substrate while the substrate is inverted by the reversing device. Accordingly, the substrate transport time can be further shortened, and the throughput in the substrate processing apparatus can be further improved.

  In the above configuration, the outer peripheral edge and back surface of the substrate can be cleaned by the edge cleaning processing unit and the back surface cleaning processing unit after cleaning the surface of the substrate by the surface cleaning processing unit.

  (15) The reversing device may reverse the substrate around a rotation axis that intersects a line connecting the position of the first transport unit and the position of the second transport unit when the substrate is transferred.

  In this case, the reversing device can pass the substrate between the first and second transport means without changing the direction. Therefore, the structure of the reversing device is simplified and the cost can be reduced. Further, since it is not necessary for the reversing device to change direction, the throughput in the substrate processing apparatus is improved.

  (16) The reversing device includes a first holding mechanism that holds the substrate in a state perpendicular to the first axis, a second holding mechanism that holds the substrate in a state perpendicular to the first axis, A support member that supports the second holding mechanism so as to overlap in the direction of the first axis, and the support member together with the first and second holding mechanisms around the second axis that is substantially perpendicular to the first axis And a rotating device that rotates automatically.

  In this case, the substrate is held in a state perpendicular to the first axis by at least one of the first and second holding mechanisms. In this state, the first and second holding mechanisms are integrally rotated around the second axis substantially perpendicular to the first axis by the rotating device. Thereby, the substrate held by the first holding mechanism or the second holding mechanism is inverted.

  Here, when each of the first to third transport units has two transport holding units and the two transport holding units are used to carry the substrate in and out of the reversing device, two transports are performed. By disposing the holding portion so as to overlap in the direction parallel to the first axis, it becomes possible to simultaneously carry two substrates into the first and second holding mechanisms by the two transport holding portions, Two substrates can be carried out simultaneously from the first and second holding mechanisms by the two conveyance holding units. Accordingly, it is possible to quickly carry the substrate in and out of the reversing device, and to efficiently reverse a plurality of substrates.

  (17) The first and second holding mechanisms include a common inversion holding member having one surface and the other surface perpendicular to the first axis, and the first holding mechanism is provided on one surface of the common inversion holding member. A plurality of first support portions that support the outer peripheral portion of the substrate, a first reverse holding member that is provided to face one surface of the common reverse holding member, and a first face that faces the common reverse holding member. A plurality of second support portions that are provided on the surface of the one reverse holding member and support the outer peripheral portion of the substrate, and the first reverse holding member and the common reverse holding member are separated from each other in the direction of the first axis. The first reversing holding member and the common reversing holding member are moved so as to selectively shift to the state in which the first reversing holding member and the common reversing holding member are close to each other. And the second holding mechanism includes a common reaction mechanism. Common to a plurality of third support portions provided on the other surface of the holding member and supporting the outer peripheral portion of the substrate, and a second reverse holding member provided to face the other surface of the common reverse holding member A plurality of fourth support portions that are provided on the surface of the second reverse holding member facing the reverse holding member and support the outer peripheral portion of the substrate; The second reverse holding member and the common reverse holding member so as to selectively shift to a state where they are separated from each other in the direction of one axis and a state where the second reverse holding member and the common reverse holding member are close to each other A second drive mechanism that moves at least one of the first drive mechanism and the second drive mechanism.

  In this case, in a state where the first reverse holding member and the common reverse holding member are separated from each other, the plurality of first support portions provided on one surface of the common reverse holding member and the common reverse holding member are opposed to each other. A board | substrate is carried in between the several 2nd support parts provided in the surface of the 1st inversion holding member. In this state, at least one of the first reverse holding member and the common reverse holding member is moved by the first drive mechanism so that the first reverse holding member and the common reverse holding member are close to each other. Accordingly, the outer peripheral portion of the substrate is held by the plurality of first and second support portions.

  In this state, the first reverse holding member, the second reverse holding member, and the common reverse holding member are integrally rotated around the second axis by the rotating device. Thereby, the substrate held by the first reverse holding member and the common reverse holding member is reversed.

  In addition, in a state where the second reverse holding member and the common reverse holding member are separated from each other, the plurality of third support portions provided on the other surface of the common reverse holding member and the common reverse holding member are opposed to each other. The substrate is carried in between the plurality of fourth support portions provided on the surface of the second reverse holding member. In this state, at least one of the second inversion holding member and the common inversion holding member is moved by the second driving mechanism so that the second inversion holding member and the common inversion holding member come closer to each other. Accordingly, the outer peripheral portion of the substrate is held by the plurality of third and fourth support portions.

  In this state, the first reverse holding member, the second reverse holding member, and the common reverse holding member are integrally rotated around the second axis by the rotating device. Thereby, the substrate held by the second reverse holding member and the common reverse holding member is reversed.

  According to the present invention, the throughput in the substrate processing apparatus can be improved.

It is a figure which shows the structure of the substrate processing apparatus which concerns on a 1st reference form. It is a figure which shows the structure of the substrate processing apparatus which concerns on a 1st reference form. It is a figure which shows the structure of the substrate processing apparatus which concerns on a 1st reference form. It is a figure which shows the structure of a 1st main robot. It is a figure which shows the structure of an inversion unit. It is a figure which shows the structure of an inversion unit. It is a figure which shows the structure of an inversion unit. It is a figure which shows the structure of the end surface washing | cleaning unit SSB. It is a figure which shows the structure of the end surface cleaning apparatus of end surface cleaning unit SSB. It is a figure which shows the structure of surface cleaning unit SS. It is a figure which shows the structure of the back surface cleaning unit SSR. It is a figure which shows the structure of the substrate processing apparatus which concerns on embodiment. It is a figure which shows the structure of the inversion unit in embodiment. It is a figure which shows operation | movement of the inversion unit in embodiment. It is a figure which shows operation | movement of the inversion unit in embodiment. It is a figure which shows the structure of the substrate processing apparatus which concerns on a 2nd reference form. It is a figure which shows the structure of the substrate processing apparatus which concerns on a 2nd reference form.

  Hereinafter, substrate processing apparatuses according to embodiments and reference embodiments of the present invention will be described with reference to the drawings.

  In the following description, a substrate refers to a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), a glass substrate for a photomask, a substrate for an optical disk, and the like.

  In the following description, the surface of the substrate on which various patterns such as circuit patterns are formed is referred to as the front surface, and the opposite surface is referred to as the back surface. Further, the surface of the substrate directed downward is referred to as a lower surface, and the surface of the substrate directed upward is referred to as an upper surface.

(1) First Reference Mode (1-1) Configuration of Substrate Processing Apparatus FIGS. 1 to 3 are schematic views showing the configuration of a substrate processing apparatus according to a first reference mode. 1 is a plan view of the substrate processing apparatus, and FIG. 2 is a side view of the substrate processing apparatus of FIG. FIG. 3 is a cross-sectional view taken along line A1-A1 of FIG.

  As shown in FIG. 1, the substrate processing apparatus 100 includes an indexer block 10, a first processing block 11, and a second processing block 12 provided in parallel with each other. The indexer block 10 is provided with a plurality of carrier mounting tables 40, an indexer robot IR, and a control unit 4. On each carrier mounting table 40, a carrier C that stores a plurality of substrates W in multiple stages is mounted.

  The indexer robot IR is configured to be movable in the direction of an arrow U, rotatable about a vertical axis, and movable up and down. In the indexer robot IR, hands IRH1 and IRH2 for delivering the substrate W are provided above and below. The hands IRH1 and IRH2 hold the peripheral edge and the outer peripheral edge of the lower surface of the substrate W. The control unit 4 includes a computer including a CPU (Central Processing Unit) and controls each component in the substrate processing apparatus 100.

  As shown in FIGS. 1 and 2, the first processing block 11 is provided with a plurality of back surface cleaning units SSR (four in FIG. 2) and a first main robot MR1. The plurality of back surface cleaning units SSR are stacked one above the other on one side surface of the first processing block 11 (see FIG. 2). The first main robot MR1 is provided in a substantially central portion of the processing block 11, and is configured to be rotatable about a vertical axis and to be vertically movable.

  The first main robot MR1 is provided with hands MRH1 and MRH2 for delivering the substrate W up and down. The hands MRH1 and MRH2 hold the peripheral edge and the outer peripheral edge of the lower surface of the substrate W.

  The second processing block 12 is provided with a plurality of surface cleaning units SS (four in FIG. 2), a plurality of end surface cleaning units SSB (four in FIG. 2), and a second main robot MR2. The plurality of surface cleaning units SS are vertically stacked on one side surface of the second processing block 12, and the plurality of end surface cleaning units SSB are vertically stacked on the other side surface of the second processing block 12. (See FIG. 2). The second main robot MR2 is provided at a substantially central portion of the second processing block 12, and is configured to be rotatable about a vertical axis and to be vertically movable.

  As shown in FIG. 3, between the indexer block 10 and the first processing block 11, a reversing unit RT1 for reversing the substrate W and a substrate between the indexer robot IR and the first main robot MR1. Substrate platforms PASS1 for delivering W are provided above and below. Between the first processing block 11 and the second processing block 12, a reversing unit RT2 for reversing the substrate W and a substrate between the first main robot MR1 and the second main robot MR2 are provided. A substrate platform PASS2 for delivery is provided above and below. Details of the reversing units RT1 and RT2 will be described later.

  The substrate platforms PASS1, PASS2 are provided with optical sensors (not shown) that detect the presence or absence of the substrate W. Thereby, it is possible to determine whether or not the substrate W is placed on the substrate platforms PASS1 and PASS2. The substrate platforms PASS1, PASS2 are provided with a plurality of support pins 51 that support the lower surface of the substrate W. When the substrate W is transferred between the indexer robot IR and the first main robot MR1 and between the first main robot MR1 and the second main robot MR2, the substrate W is temporarily mounted on the substrate. It is placed on the support pins 51 of the placement parts PASS1, PASS2.

(1-2) Outline of Operation of Substrate Processing Apparatus Next, an outline of operation of the substrate processing apparatus 100 will be described with reference to FIGS. The operation of each component of the substrate processing apparatus 100 described below is controlled by the control unit 4 in FIG.

  First, in the indexer block 10, the indexer robot IR takes out the unprocessed substrate W from one of the carriers C placed on the carrier placing table 40. The indexer robot IR rotates around the vertical axis while moving in the direction of arrow U, and places the substrate W on the substrate platform PASS1. The substrate W placed on the substrate platform PASS1 is received by the first main robot MR1 of the first processing block 11, and subsequently placed on the substrate platform PASS2. The substrate W placed on the substrate platform PASS2 is received by the second main robot MR2 of the second processing block 12, and subsequently carried into the end surface cleaning unit SSB.

  In the end surface cleaning unit SSB, the end surface of the substrate W is subjected to a cleaning process. Hereinafter, the cleaning process for the end face of the substrate W is referred to as an end face cleaning process. The details of the end face cleaning process by the end face cleaning unit SSB will be described later.

  The substrate W after the end surface cleaning process is unloaded from the end surface cleaning unit SSB by the second main robot MR2, and subsequently loaded into the surface cleaning unit SS. In the surface cleaning unit SS, the surface of the substrate W is cleaned. Hereinafter, the cleaning process for the surface of the substrate W is referred to as a surface cleaning process. Details of the surface cleaning process by the surface cleaning unit SS will be described later.

  The substrate W after the surface cleaning process is unloaded from the surface cleaning unit SS by the second main robot MR2, and then loaded into the reversing unit RT2. In the reversing unit RT2, the substrate W whose front surface is directed upward is reversed so that the back surface faces upward. The inverted substrate W is unloaded from the reversing unit RT2 by the first main robot MR1 of the first processing block 11, and then loaded into the back surface cleaning unit SSR.

  In the back surface cleaning unit SSR, the back surface of the substrate W is cleaned. Hereinafter, the cleaning process for the back surface of the substrate W is referred to as a back surface cleaning process. The details of the back surface cleaning process by the back surface cleaning unit SSR will be described later. The substrate W after the back surface cleaning process is unloaded from the back surface cleaning unit SSR by the first main robot MR1, and then loaded into the reversing unit RT1. In the reversing unit RT1, the substrate W whose back surface is directed upward is reversed so that the front surface faces upward.

  The inverted substrate W is unloaded from the reversing unit RT1 by the indexer robot IR of the indexer block 10 and stored in the carrier C on the carrier mounting table 40.

(1-3) Details of the main robot (1-3-1) Configurations of the first main robot and the second main robot Next, detailed configurations of the first and second main robots MR1 and MR2 will be described. Here, a detailed configuration of the first main robot MR1 will be described. The configuration of the second main robot MR2 is the same as the configuration of the first main robot MR1 described below. FIG. 4A is a side view of the first main robot MR1, and FIG. 4B is a plan view of the first main robot MR1.

  As shown in FIG. 4A and FIG. 4B, the first main robot MR1 includes a base portion 21, and an up-and-down rotation portion 22 is provided so as to be movable up and down with respect to the base portion 21. ing. A hand MRH1 is connected to the up-and-down rotating unit 22 via an articulated arm AM1, and a hand MRH2 is connected via an articulated arm AM2.

  The up-and-down rotation unit 22 is moved up and down by an up-and-down drive mechanism 25 provided in the base unit 21 and is rotated around a vertical axis by a rotation drive mechanism 26 provided in the base unit 21. The

  The articulated arms AM1 and AM2 are independently driven by a driving mechanism (not shown), and advance and retreat in the horizontal direction while maintaining the hands MRH1 and MRH2 in a fixed posture.

  The hands MRH1 and MRH2 are provided at a certain height with respect to the up-and-down rotation unit 22, and the hand MRH1 is located above the hand MRH2. The height difference M1 (FIG. 4A) between the hand MRH1 and the hand MRH2 is kept constant.

  The hands MRH1 and MRH2 have the same shape, and are each formed in a substantially U shape. The hand MRH1 has two claw portions H11 extending substantially in parallel, and the hand MRH2 has two claw portions H12 extending substantially in parallel.

  A plurality of support pins 23 are attached to the hands MRH1 and MRH2. In the present embodiment, four support pins 23 are attached almost evenly along the outer periphery of the substrate W placed on the upper surfaces of the hands MRH1 and MRH2. The four support pins 23 hold the peripheral edge and the outer peripheral edge of the lower surface of the substrate W.

(1-3-2) Operation Example of First Main Robot Next, a specific operation example of the first main robot MR1 will be described with reference to FIG.

  The first main robot MR1 first receives an unprocessed substrate W from the substrate platform PASS1 by the hand MRH2. Next, the first main robot MR1 carries out the substrate W whose back surface is received upward from the reversing unit RT2 by the hand MRH1. This substrate W is the substrate W after the end face cleaning process and the surface cleaning process. Subsequently, the unprocessed substrate W held by the hand MRH2 is placed on the substrate platform PASS2.

  Next, the first main robot MR1 unloads the substrate W after the back surface cleaning process from any of the back surface cleaning units SSR with the hand MRH2, and loads the substrate W held by the hand MRH1 into the back surface cleaning unit SSR. . Subsequently, the first main robot MR1 carries the substrate W after the back surface cleaning process held by the hand MRH2 into the reversing unit RT1.

  The first main robot MR1 performs such a series of operations continuously. In the above operation example, the operation by the hand MRH1 and the operation by the hand MRH2 may be opposite to each other.

  The number of transfer steps of the first main robot MR1 relating to one substrate W is as follows: transfer from the substrate platform PASS1 to the substrate platform PASS2, transfer from the reversing unit RT2 to the back surface cleaning unit SSR, and back surface cleaning unit SSR. Is a three-step process from the first to the reversing unit RT1.

(1-3-3) Operation of Second Main Robot Next, a specific operation example of the second main robot MR2 will be described with reference to FIG.

  First, the second main robot MR2 receives the unprocessed substrate W from the substrate platform PASS2 by the hand MRH4. Next, the second main robot MR2 unloads the substrate W after the end surface cleaning process from any of the end surface cleaning units SSB with the hand MRH3, and loads the substrate W held by the hand MRH4 into the end surface cleaning unit SSB. Next, the second main robot MR2 unloads the substrate W after the surface cleaning process from one of the surface cleaning units SS by the hand MRH4, and loads the substrate W held by the hand MRH3 into the surface cleaning unit SS. Next, the second main robot MR2 carries the substrate W held by the hand MRH4 into the reversing unit RT2.

  The second main robot MR2 performs such a series of operations continuously. In the above operation example, the operation by the hand MRH3 and the operation by the hand MRH4 may be opposite to each other.

  The number of transport steps of the second main robot MR2 related to one substrate W is as follows: transport from the substrate platform PASS2 to the end surface cleaning unit SSB, transport from the end surface cleaning unit SSB to the surface cleaning unit SS, and surface cleaning unit SS. Is a three-step process of conveying to the reversing unit RT2. The operation of the second main robot MR2 is performed in parallel with the operation of the first main robot MR1 as described above.

(1-4) Configuration and Operation of Reversing Unit Subsequently, the configuration of the reversing units RT1 and RT2 will be described. The reversing units RT1 and RT2 have the same configuration.

  FIG. 5 is a schematic configuration diagram of the reversing units RT1 and RT2 in FIG. FIG. 5A is a side view of the reversing units RT1 and RT2, and FIG. 5B is a top view of the reversing units RT1 and RT2. FIG. 6 is a perspective view showing the external appearance of the main part of the reversing units RT1 and RT2, and FIG. 7 is a perspective view showing the external appearance of a part of the reversing units RT1 and RT2.

  As shown in FIG. 5, the reversing units RT1 and RT2 include a first support member 41, a second support member 42, a plurality of substrate support pins 43a and 43b, a first movable member 44, and a second movable member 45. A fixed plate 46, a link mechanism 47, and a rotation mechanism 48.

  As shown in FIG. 6, the first support member 41 is composed of six rod-shaped members extending radially. Substrate support pins 43a are provided at the respective tips of the six rod-shaped members. Similarly, as shown in FIG. 7, the second support member 42 is also composed of six rod-shaped members extending radially. Substrate support pins 43b are provided at the respective tips of the six rod-shaped members.

  In the present embodiment, the first and second support members 41 and 42 are composed of six rod-shaped members. However, the present invention is not limited to this, and the first and second support members 41 and 42 may be any other arbitrary members. It may be configured by a number of rod-shaped members or other arbitrary shape members, for example, a disk or a polygon having an outer periphery along the plurality of substrate support pins 43a and 43b.

  The first movable member 44 in FIG. 6 has a U-shape, one end and the other end extending in the vertical direction, and the middle portion extending in the direction of the arrow U. The first support member 41 is fixed to one end of the first movable member 44. The other end of the first movable member 44 is connected to the link mechanism 47. Similarly, the second movable member 45 in FIG. 7 has a U shape. The second support member 42 is fixed to one end of the second movable member 45. The other end of the second movable member 45 is connected to the link mechanism 47. The link mechanism 47 is attached to the rotation shaft of the rotation mechanism 48. The link mechanism 47 and the rotation mechanism 48 are attached to the fixed plate 46.

  The link mechanism 47 of FIG. 6 incorporates an air cylinder or the like, and selectively shifts between a state in which the first movable member 44 and the second movable member 45 are relatively separated from each other and a state in which the first movable member 44 is brought close to the link mechanism 47. Can be made. The rotation mechanism 48 incorporates a motor or the like, and rotates the first movable member 44 and the second movable member 45 through the link mechanism 47, for example, 180 degrees around a horizontal axis. Can do.

  Here, the operation of the reversing units RT1 and RT2 will be described with reference to the drawings. First, the substrate W is carried into the reversing units RT1, RT2 by the first or second main robot MR1, MR2 (FIG. 1). A plurality of substrate support pins 43b of the second support member 42 are provided on the substrate W by the first or second main robots MR1 and MR2 in a state where the first movable member 44 and the second movable member 45 are separated in the vertical direction. Reprinted on top.

  Next, as shown in FIG. 5A, the first movable member 44 and the second movable member 45 are shifted to a state in which they are close to each other in the vertical direction by the function of the link mechanism 47. Thereby, both surfaces of the substrate W are supported by the plurality of substrate support pins 43a and 43b, respectively.

  Subsequently, the first movable member 44 and the second movable member 45 rotate 180 degrees around an axis parallel to the direction of the arrow U by the action of the rotation mechanism 48. Thus, the substrate W is held by the plurality of substrate support pins 43 a and 43 b provided on the first support member 41 and the second support member 42 together with the first movable member 44 and the second movable member 45. While rotating 180 degrees. Thereby, the substrate W is inverted.

  Next, the first movable member 44 and the second movable member 45 are shifted to a state of being separated in the vertical direction by the action of the link mechanism 47. In this state, the substrate W is unloaded from the reversing units RT1, RT2 by the indexer robot IR or the first main robot MR1.

(1-5) Details of End Surface Cleaning Unit FIG. 8 is a diagram for explaining the configuration of the end surface cleaning unit SSB. As shown in FIG. 8, the end surface cleaning unit SSB includes a spin chuck 201 for holding the substrate W horizontally and rotating the substrate W about a vertical rotation axis passing through the center of the substrate W.

  The spin chuck 201 is fixed to the upper end of the rotation shaft 203 rotated by the chuck rotation drive mechanism 204. Further, the spin chuck 201 is formed with an intake path (not shown), and the substrate W is placed on the spin chuck 201 and the inside of the intake path is evacuated so that the back surface of the substrate W is placed on the spin chuck 201. The substrate W can be held in a horizontal posture.

  An end surface cleaning device moving mechanism 230 is provided on the side of the spin chuck 201 and on the upper portion in the end surface cleaning unit SSB. A bar-shaped support member 220 extending downward is attached to the end surface cleaning device moving mechanism 230. The support member 220 is moved in the horizontal direction (see arrow M in FIG. 8) by the end face cleaning device moving mechanism 230.

  An end surface cleaning device 210 having a substantially cylindrical shape is attached to the lower end portion of the support member 220 so as to extend in the horizontal direction. Thereby, the end surface cleaning device 210 is moved together with the support member 220 by the end surface cleaning device moving mechanism 230.

  The end surface cleaning device 210 is located at substantially the same height as the substrate W sucked and held by the spin chuck 201. Thereby, one end of the end surface cleaning apparatus 210 faces the end surface R of the substrate W. In the following description, one end of the end surface cleaning apparatus 210 that faces the end surface R of the substrate W is defined as the front surface.

  At the start of the edge cleaning process for the substrate W, the edge cleaning device 210 is moved to the position of the edge surface of the substrate W by the edge cleaning device moving mechanism 230. At the end of the end face cleaning process for the substrate W, the end face cleaning apparatus 210 moves away from the end face R of the substrate W by the end face cleaning apparatus moving mechanism 230.

  A cleaning liquid supply pipe 241 and an exhaust pipe 244 are connected to the end face cleaning device 210. The cleaning liquid is supplied to the internal space (a cleaning chamber 211 described later) of the end surface cleaning device 210 through the cleaning liquid supply pipe 241. Further, the exhaust pipe 244 is connected to the exhaust unit 245. The exhaust unit 245 sucks the atmosphere in the internal space of the end face cleaning device 210 and exhausts it through the exhaust pipe 244.

  Details of the end face cleaning apparatus 210 will be described. FIG. 9 is a view for explaining the structure of the end surface cleaning apparatus 210 of the end surface cleaning unit SSB of FIG. FIG. 9A shows a longitudinal sectional view of the end face cleaning apparatus 210, and FIG. 9B shows a front view of the end face cleaning apparatus 210.

  As shown in FIG. 9A, a cleaning chamber 211 is formed inside a substantially cylindrical housing 210 a of the end surface cleaning device 210. Further, as shown in FIGS. 9A and 9B, an opening 212 that allows the cleaning chamber 211 to communicate with the outside is formed on the front side of the housing 210a. The opening 212 has an arcuate upper surface and lower surface so that the vertical width gradually increases from the center to both sides. At the time of the end face cleaning process of the substrate W, the end face R of the substrate W attracted and held by the spin chuck 201 is inserted into the opening 212.

  In the cleaning chamber 211, a brush 213 having a substantially cylindrical shape is arranged to extend in the vertical direction. On the outer peripheral surface of the brush 213, a V-shaped groove 213a is formed in the circumferential direction. The brush 213 is attached to a rotating shaft 214 extending in the vertical direction. The upper end and the lower end of the rotating shaft 214 are rotatably attached to rotating bearings formed at the upper and lower portions of the cleaning chamber 211. Thereby, the brush 213 is rotatably supported by the cleaning chamber 211 and the rotating shaft 214.

  During the end face cleaning process of the substrate W, the groove 213a formed in the brush 213 comes into contact with the end face R of the rotating substrate W. Thereby, the end surface R of the substrate W is cleaned by the brush 213.

  The cleaning liquid supply pipe 241 and the exhaust pipe 244 described above are connected to the upper portion of the end face cleaning device 210. The cleaning liquid supply pipe 241 is connected to cleaning liquid supply paths 241a and 241b formed in the housing 210a. As shown in FIG. 9A, the cleaning liquid supply path 241a extends from the outside of the housing 210a to the upper inner surface of the cleaning chamber 211. The cleaning liquid supply path 241 b extends from the outside of the housing 210 a to the lower inner surface of the cleaning chamber 211. FIG. 9A shows only a part of the cleaning liquid supply pipe 241b.

  As a result, during the edge cleaning process of the substrate W, the cleaning liquid supplied to the edge cleaning apparatus 210 is sprayed from the vertical direction toward the edge R of the substrate W in contact with the brush 213 in the cleaning chamber 211. Thereby, the end surface R of the substrate W is efficiently cleaned.

  The exhaust pipe 244 is inserted into the cleaning chamber 211 through a hole provided in the upper part of the housing 210a. Accordingly, as described above, the atmosphere in the cleaning chamber 211 is sucked by the exhaust unit 245 of FIG. 8 and exhausted through the exhaust pipe 244. Thus, in the cleaning chamber 211, the internal atmosphere is exhausted by the exhaust unit 245, so that the volatilized cleaning liquid and the mist of the cleaning liquid are efficiently exhausted.

(1-6) Details of Front Surface Cleaning Unit and Back Surface Cleaning Unit Next, each configuration of the front surface cleaning unit SS and the back surface cleaning unit SSR in FIG. 1 will be described.

  FIG. 10 is a schematic diagram showing the configuration of the front surface cleaning unit SS, and FIG. 11 is a schematic diagram showing the configuration of the back surface cleaning unit SSR. In the front surface cleaning unit SS shown in FIG. 10 and the back surface cleaning unit SSR shown in FIG. 11, a cleaning process (hereinafter referred to as a scrub cleaning process) of the substrate W using a brush is performed.

  As shown in FIG. 10, the front surface cleaning unit SS includes a spin chuck 61 for holding the substrate W horizontally and rotating the substrate W about a vertical axis passing through the center of the substrate W. The spin chuck 61 is fixed to the upper end of a rotation shaft 63 that is rotated by a chuck rotation drive mechanism 62. The spin chuck 61 holds the substrate W by vacuum-sucking the lower surface of the substrate W, similarly to the spin chuck 201 of the end surface cleaning unit SSB. Instead of the adsorption-type spin chuck 61, a mechanical spin chuck (see FIG. 11 described later) that holds the outer peripheral end of the substrate W may be used for the surface cleaning unit SS.

  As described above, the substrate W whose surface is directed upward is carried into the surface cleaning unit SS. When performing the scrub cleaning process and the rinsing process, the back surface of the substrate W is sucked and held by the spin chuck 61.

  A motor 64 is provided outside the spin chuck 61. A rotation shaft 65 is connected to the motor 64. An arm 66 is connected to the rotation shaft 65 so as to extend in the horizontal direction, and a substantially cylindrical brush cleaning tool 70 is provided at the tip of the arm 66.

  Further, a liquid discharge nozzle 71 for supplying a cleaning liquid or a rinsing liquid (pure water) toward the surface of the substrate W held by the spin chuck 61 is provided above the spin chuck 61. A supply pipe 72 is connected to the liquid discharge nozzle 71, and the cleaning liquid and the rinse liquid are selectively supplied to the liquid discharge nozzle 71 through the supply pipe 72.

  During the scrub cleaning process, the motor 64 rotates the rotating shaft 65. As a result, the arm 66 rotates in the horizontal plane, and the brush cleaning tool 70 moves between the outer position of the substrate W and the upper position of the center of the substrate W around the rotation shaft 65. The motor 64 is provided with a lifting mechanism (not shown). The raising / lowering mechanism raises and lowers the rotating shaft 65, thereby lowering and raising the brush cleaning tool 70 at the outer position of the substrate W and the upper position of the center of the substrate W.

  At the start of the scrub cleaning process, the substrate W whose surface is directed upward is rotated by the spin chuck 61. Further, the cleaning liquid or the rinse liquid is supplied to the liquid discharge nozzle 71 through the supply pipe 72. Thereby, the cleaning liquid or the rinsing liquid is supplied to the surface of the rotating substrate W. In this state, the brush cleaning tool 70 is swung and moved up and down by the rotating shaft 65 and the arm 66. Thereby, a scrub cleaning process is performed on the surface of the substrate W. In addition, since the adsorption type spin chuck 61 is used in the surface cleaning unit SS, the peripheral edge and the outer peripheral edge of the substrate W can be cleaned simultaneously.

  Next, the difference between the back surface cleaning unit SSR and the front surface cleaning unit SS of FIG. 10 will be described with reference to FIG. As shown in FIG. 9, the back surface cleaning unit SSR includes a mechanical spin chuck 81 that holds the outer peripheral edge of the substrate W instead of the suction spin chuck 61 that holds the lower surface of the substrate W by vacuum suction. . When performing the scrub cleaning process and the rinsing process, the substrate W is rotated while maintaining a horizontal posture in a state in which the peripheral edge portion and the outer peripheral edge portion of the lower surface thereof are held by the rotary holding pins 82 on the spin chuck 61.

  The back surface cleaning unit SSR carries the substrate W with the back surface directed upward. Therefore, the substrate W is held by the spin chuck 81 with the back surface thereof directed upward. Then, the same scrub cleaning process is performed on the back surface of the substrate W.

  In the end face cleaning unit SSB and the front surface cleaning unit SSB, the back surface of the substrate W is sucked by the suction spin chucks 201 and 61. In this case, a suction mark may be formed on the back surface of the substrate W. In the back surface cleaning unit SSR, by cleaning the back surface of the substrate W, the suction marks formed during the end surface cleaning process and the front surface cleaning process can be removed.

(1-7) Effects in the First Reference Mode In this reference mode, the first main robot MR1 is provided in the first processing block 11, and the second main robot MR2 is provided in the second processing block 12. . In this case, the transport of the substrate W in the first processing block 11 and the transport of the substrate W in the second processing block 12 can be performed in parallel. Thereby, since the conveyance time of the board | substrate W can be shortened, the throughput in the substrate processing apparatus 100 can be improved.

  Further, in the substrate processing apparatus 100 according to the present embodiment, after the end face cleaning process and the front surface cleaning process are performed on the substrate W, the back surface cleaning process is performed on the substrate W by the back surface cleaning unit SSR. In this case, in the end surface cleaning unit SSB or the front surface cleaning unit SS, even if suction marks are formed on the back surface of the substrate W by the suction-type spin chucks 201 and 61, the suction marks on the back surface of the substrate W are removed by the subsequent back surface cleaning process. Can be removed. Thereby, the substrate W can be sufficiently cleaned.

  In this reference embodiment, the reversing unit RT1 is provided at a position between the indexer robot IR and the first main robot MR1, and the reversing unit RT2 is provided between the first main robot MR1 and the second main robot MR2. It is provided in the position between. In this case, the substrate W can be transferred from the second main robot MR2 to the first main robot MR1 while inverting the substrate W. Similarly, the substrate W can be transferred from the first main robot MR1 to the indexer robot IR while inverting the substrate W. Thereby, the transfer process of the first and second main robots MR1 and MR2 can be reduced, and the throughput in the substrate processing apparatus 100 can be further improved.

  In the present embodiment, the number of steps of transporting the substrate W by the first main robot MR1 is equal to the number of steps of transporting the substrate W by the second main robot MR2. In this case, one of the first and second main robots MR1 and MR2 hardly waits in accordance with the operation of the other. Thereby, the substrate W can be efficiently transferred, and the throughput in the substrate processing apparatus 100 can be further improved.

  Further, in the substrate processing apparatus 100 according to the present embodiment, a plurality of back surface cleaning units SSR are arranged in multiple stages on one side surface of the first processing block 11, and one side surface side and the other side of the second processing block 12 are arranged. A plurality of front surface cleaning units SS and end surface cleaning units SSB are arranged in multiple stages on the side surface side of each. Thereby, compared with the case where a plurality of cleaning units are arranged in a plane, the substrate processing apparatus 100 can be significantly reduced in size and space.

  In the present embodiment, the substrate W before the back surface cleaning process and the substrate W after the back surface cleaning process are inverted by different reversing units RT1 and RT2. In this case, even if the back surface of the substrate W before the back surface cleaning process is contaminated, the contaminant does not transfer to the substrate W after the back surface cleaning process. Thereby, the back surface of the substrate W after the back surface cleaning process can be maintained in a clean state.

  In the present embodiment, the configuration (so-called platform configuration) of the substrate processing apparatus 100 can be reduced in size by providing a plurality of front surface cleaning units SS and a plurality of back surface cleaning units SSR stacked in the height direction in multiple stages. In addition, by disposing the front surface cleaning unit SS, the back surface cleaning unit SSR, and the end surface cleaning unit SSB in the height direction, the required number of front surface cleaning units SS, the required number of back surface cleaning units SSR, and the required number of end surface cleaning units. SSB can be easily provided.

(2) Embodiments Hereinafter, the substrate processing apparatus according to the embodiments of the present invention will be described while referring to differences from the first reference embodiment.

  FIG. 12 is a schematic cross-sectional view of the substrate processing apparatus according to the embodiment. As shown in FIG. 12, the substrate processing apparatus 100a according to the embodiment includes reversing units RT1a and RT2a shown below instead of the reversing units RT1 and RT2. Two substrate platforms PASS1, PASS2 are provided.

(2-1) Reversing Unit FIG. 13A is a side view of the reversing units RT1a and RT2a, and FIG. 13B is a perspective view of the reversing units RT1a and RT2a. The reversing units RT1a and RT2a have the same configuration.

  As shown in FIG. 13A, the reversing units RT1a and RT2a include a support plate 31, a fixed plate 32, a pair of linear guides 33a and 33b, a pair of support members 35a and 35b, and a pair of cylinders 37a and 37b. , A first movable plate 36a, a second movable plate 36b, and a rotary actuator 38.

  The support plate 31 is provided so as to extend in the vertical direction, and a fixed plate 32 is attached so as to extend in the horizontal direction from the center portion of one surface of the support plate 31. A linear guide 33 a extending in a direction perpendicular to the fixed plate 32 is provided in the region of the support plate 31 on the one surface side of the fixed plate 32. A linear guide 33 b extending in a direction perpendicular to the fixed plate 32 is provided in the region of the support plate 31 on the other surface side of the fixed plate 32. The linear guides 33 a and 33 b are provided symmetrically with respect to the fixed plate 32.

  A support member 35 a is provided on one surface side of the fixed plate 32 so as to extend in a direction parallel to the fixed plate 32. The support member 35a is slidably attached to the linear guide 33a via the connecting member 34a. A cylinder 37a is connected to the support member 35a, and the support member 35a is moved up and down along the linear guide 33a by the cylinder 37a. In this case, the support member 35a moves in a direction perpendicular to the fixed plate 32 while maintaining a constant posture. A first movable plate 36a is attached to the support member 35a so as to face one surface of the fixed plate 32.

  A support member 35 b is provided on the other surface side of the fixed plate 32 so as to extend in a direction parallel to the fixed plate 32. The support member 35b is slidably attached to the linear guide 33b via the connecting member 34b. A cylinder 37b is connected to the support member 35b, and the support member 35b is moved up and down along the linear guide 33b by the cylinder 37b. In this case, the support member 35b moves in a direction perpendicular to the fixed plate 32 while maintaining a constant posture. A second movable plate 36b is attached to the support member 35b so as to face the other surface of the fixed plate 32.

  In the present embodiment, the distance M2 between the first movable plate 36a and the fixed plate 32 and the second movable plate in a state where the first movable plate 36a and the second movable plate 36b are farthest from the fixed plate 32. The distance M3 between 36b and the fixed plate 32 is the difference in height between the hand MRH1 and the hand MRH2 of the first main robot MR1 shown in FIG. 4 (the hand MRH3 and the hand MRH4 of the second main robot MR2). The height difference is set to be substantially equal to M1.

  The rotary actuator 38 rotates the support plate 31 around a horizontal axis HA parallel to the direction of the arrow U (FIG. 1). As a result, the first movable plate 36a, the second movable plate 36b, and the fixed plate 32 connected to the support plate 31 rotate around the horizontal axis HA (in the θ direction).

  As shown in FIG. 13B, the first movable plate 36a, the fixed plate 32, and the second movable plate 36b are each formed in a flat plate shape.

  As shown in FIG. 13A, a plurality of support pins 39a are provided on one surface of the fixed plate 32 facing the first movable plate 36a, and a plurality of support pins 39b are provided on the other surface. . A plurality of support pins 39c are provided on one surface of the first movable plate 36a facing the fixed plate 32, and a plurality of support pins 39d are provided on one surface of the second movable plate 36b facing the fixed plate 32. Yes.

  In the present embodiment, six support pins 39a, 39b, 39c, and 39d are provided. These support pins 39a, 39b, 39c, and 39d are arranged along the outer periphery of the substrate W carried into the reversing units RT1 and RT2. The support pins 39a, 39b, 39c, 39d have the same length. Therefore, the distance between the tip of the support pin 39a and the tip of the support pin 39d and the tip of the support pin 39b and the support pin 39c when the first movable plate 36a and the second movable plate 36b are farthest from the fixed plate 32. 4 is the difference in height between the hand MRH1 and the hand MRH2 of the first main robot MR1 shown in FIG. 4 (the height of the hand MRH3 and the hand MRH4 of the second main robot MR2). Difference) is almost equal to M1.

  The distance M2 between the first movable plate 36a and the fixed plate 32 and the distance M3 between the second movable plate 36b and the fixed plate 32 may be appropriately changed. However, the distance between the tip of the support pin 39c and the tip of the support pin 39d in the state where the first movable plate 36a and the second movable plate 36b are farthest from the fixed plate 32 is the height of the hand MRH1 and the hand MRH2. It is set to be larger than the difference in height (the difference in height between the hand MRH3 and the hand MRH4) M1.

(2-2) Outline of Operation of Substrate Processing Apparatus Next, an outline of the operation of the substrate processing apparatus 100a will be described with reference to FIG. 1 and FIG.

  First, in the indexer block 10, the indexer robot IR takes out two unprocessed substrates W from one of the carriers C mounted on the carrier mounting table 40 by the hands IRH1 and IRH2. Subsequently, the indexer robot IR passes the two substrates W held by the hands IRH1 and IRH2 to the two substrate platforms PASS1 in order.

  Next, the first main robot MR1 of the first processing block 11 sequentially receives two substrates from the two substrate platforms PASS1 by the hands MRH1 and MRH2, and the two substrates W are loaded on the two substrates. It mounts in order on mounting part PASS2. Subsequently, the second main robot MR2 of the second processing block 12 sequentially receives the two substrates W from the two substrate platforms PASS2 by the hands MRH3 and MRH4, and receives the two substrates W on the two end surfaces. It carries in order to washing | cleaning unit SSB.

  Next, the second main robot MR2 sequentially carries out the two substrates W after the end surface cleaning processing from the two end surface cleaning units SSB by the hands MRH3 and MRH4, and removes the two substrates W into the two surface cleaning units. Carry in SS. Next, the second main robot MR2 sequentially carries out the two substrates W after the surface cleaning process from the two surface cleaning units SS by the hands MRH3 and MRH4, and simultaneously transfers the two substrates W to the reversing unit RT2a. Carry in.

  In the reversing unit RT2a, the two unprocessed substrates W whose front surfaces are directed upward are reversed so that the back surfaces thereof face upward. The operation of the reversing unit RT2a will be described later.

  Next, the first main robot MR1 of the first processing block 11 simultaneously carries out the two substrates W whose back surfaces are directed upward from the reversing unit RT2a by the hands MRH1 and MRH2, and the two substrates W1. Are sequentially carried into the two back surface cleaning units SSR. Next, the first main robot MR1 sequentially carries out the two substrates W after the back surface cleaning processing from the two back surface cleaning units SSR, and simultaneously loads the two substrates W into the reversing unit RT1a.

  In the reversing unit RT1a, the two substrates W whose back surfaces are directed upward are reversed so that the front surfaces face upward. The operation of the reversing unit RT1a will be described later. Next, the indexer robot IR of the indexer block 10 sequentially unloads the two substrates W after reversal from the reversing unit RT1a by the hands IRH1 and IRH2, and the two substrates W are put into the carrier C on the carrier mounting table 40. Store. Thereby, a series of operations of the substrate processing apparatus 100a according to the embodiment is completed.

  The difference in height between the hand IRH1 and the hand IRH2 of the indexer robot IR is set to be substantially equal to the height difference M1 between the hand MRH1 and the hand MRH2 (height difference between the hand MRH3 and the hand MRH4). The indexer robot IR can carry out two substrates W from the reversing unit RT1a at the same time.

  Further, the distance between the two substrate platforms PASS1 and the distance between the two substrate platforms PASS2 is set to the height difference between the hand MRH1 and the hand MRH2 shown in FIG. 4 (the height of the hand MRH3 and the hand MRH4). Difference) By setting substantially equal to M1, the first main robot MR1 can simultaneously receive two substrates W from the two substrate platforms PASS1. In addition, the first main robot MR1 can place two substrates W on the two substrate platforms PASS2 at the same time. Furthermore, the second main robot MR2 can simultaneously receive two substrates W from the two substrate platforms PASS2. The height difference between the hand IRH1 and the hand IRH2 of the indexer robot IR is set to be substantially equal to the height difference M1 between the hand MRH1 and the hand MRH2 (height difference between the hand MRH3 and the hand MRH4). In this case, the indexer robot IR can place two substrates W on the two substrate platforms PASS1 at the same time.

(2-3) Operation of Reversing Unit Next, operations of the reversing units RT1a and RT2a will be described. 14 and 15 are diagrams for explaining the operation of the reversing units RT1a and RT2a. Since the operations of the reversing units RT1 and RT2 are the same, the operations of the reversing unit RT2a will be described as an example in FIGS.

  As shown in FIG. 14A, the hand of the second main robot MR2 holding the substrate W between the first movable plate 36a and the fixed plate 32 and between the second movable plate 36b and the fixed plate 32. MRH3 and MRH4 advance simultaneously. The advancing / retreating direction of the hands MRH3, MRH4 of the second main robot MR2 is orthogonal to the direction of the arrow U (FIG. 13). Further, the support pins 39a, 39b, 39c, and 39d of the reversing units RT1a and RT2a are provided at positions where the hands IRH1, IRH2, the hands MRH1, MRH2, and the hands MRH3, 4 are not in contact with each other when the substrate W is carried in and out. .

  Subsequently, as shown in FIG. 14B, the hands MRH3 and MRH4 are simultaneously lowered and retracted. As a result, the substrate W is placed on the support pins 39a and 39d. In this case, in the reversing unit RT2a, the substrate W whose surface is directed upward is placed on the support pins 39a and 39d.

  Subsequently, as shown in FIG. 14C, the support member 35a is lowered by the cylinder 37a (FIG. 13A), and the support member 35b is raised by the cylinder 37b (FIG. 13A). Accordingly, one substrate W is held by the support pins 39c of the first movable plate 36a and the support pins 39a of the fixed plate 32, and the other substrate W is supported by the support pins 39d of the second movable plate 36b and the fixed plate 32. It is held by the pin 39b.

  In this state, as shown in FIG. 14D, the first movable plate 36a, the fixed plate 32, and the second movable plate 36b are rotated 180 degrees integrally in the θ direction (around the horizontal axis HA) by the rotary actuator 38. Is done. Thereby, the substrate W held by the support pins 39a and 39c and the substrate W held by the support pins 39b and 39d are reversed. In this case, the reverse surface of the substrate W is directed upward in the reversing unit RT2a.

  Subsequently, as shown in FIG. 15E, the support member 35a is lowered by the cylinder 37a, and the support member 35b is raised by the cylinder 37b. Accordingly, the first movable plate 36a is lowered and the second movable plate 36b is raised. Therefore, one substrate W is supported by the support pins 39c of the first movable plate 36a, and the other substrate W is supported by the support pins 39b of the fixed plate 32.

  In this state, as shown in FIG. 15 (f), the hands MRH1 and MRH2 of the first main robot MR1 (FIG. 10) are below the substrate W supported by the support pins 39b and the substrate supported by the support pins 39c. Ascends below W and rises. Thereby, the substrate W supported by the support pins 39b is received by the hand MRH1, and the substrate W supported by the support pins 39c is received by the hand MRH2. The advancing / retreating direction of the hands MRH1, MRH2 of the first main robot MR1 is orthogonal to the direction of the arrow U (FIG. 1).

  Thereafter, as shown in FIG. 15G, the hands MRH1 and MRH2 are simultaneously retracted, whereby the two substrates W are unloaded from the reversing unit RT2a.

(2-4) Effects in the embodiment In the present embodiment, the first and second main robots MR1 and MR2 simultaneously carry in and out the two substrates W with respect to the reversing units RT1a and RT2a. Further, the reversing units RT1a and RT2a simultaneously reverse the two substrates W. Thereby, the some board | substrate W can be reversed efficiently. As a result, the throughput in the substrate processing apparatus 100a can be improved.

  Further, the indexer robot IR, the first main robot MR1 and the second main robot MR2 transfer the two substrates W in parallel, so that the throughput in the substrate processing apparatus 100a can be further improved.

  Similarly to the first reference embodiment, after the end surface cleaning process and the front surface cleaning process of the substrate W, the back surface cleaning process of the substrate W is performed, so that the suction traces by the suction spin chucks 201 and 61 are changed. Even if it is formed on the back surface, the adsorption marks can be removed by the back surface cleaning process. Thereby, the substrate W can be sufficiently cleaned.

(3) Second Reference Embodiment Hereinafter, the difference from the first reference embodiment will be described with respect to the substrate processing apparatus according to the second reference embodiment of the present invention.

(3-1) Configuration of Substrate Processing Apparatus FIGS. 16 and 17 are schematic views showing the configuration of the substrate processing apparatus according to the second embodiment. 16 is a plan view of the substrate processing apparatus, and FIG. 17 is a cross-sectional view taken along line A2-A2 of FIG.

  As shown in FIG. 16, in the substrate processing apparatus 100 b according to the second reference embodiment, a plurality of (for example, four) surface cleaning units SS are provided on one side of the first processing block 11. In addition, a plurality of (for example, four) back surface cleaning units SSR are provided on one side surface of the second processing block 12, and a plurality of (for example, four) end surface cleaning are provided on the other side surface of the second processing block 12. A unit SSB is provided. As shown in FIG. 17, substrate platforms PASS <b> 1 and PASS <b> 2 are provided vertically between the indexer block 10 and the first processing block 11, and the first processing block 11, the second processing block 12, Inverting units RT1 and RT2 and a substrate platform PASS3 are provided above and below.

  Further, in the surface cleaning unit SS of the substrate processing apparatus 100b, a mechanical spin chuck (see FIG. 11) that holds the outer peripheral end of the substrate W is used.

(3-2) Outline of Operation of Substrate Processing Apparatus Next, an outline of operation of the substrate processing apparatus 100b will be described with reference to FIGS.

  First, in the indexer block 10, the indexer robot IR takes out the unprocessed substrate W from one of the carriers C placed on the carrier placing table 40. The indexer robot IR rotates around the vertical axis while moving in the direction of arrow U, and places the substrate W on the substrate platform PASS1.

  The substrate W placed on the substrate platform PASS1 is received by the first main robot MR1 of the first processing block 11, and subsequently placed on the substrate platform PASS2. The substrate W placed on the substrate platform PASS2 is received by the second main robot MR2 of the second processing block 12, and subsequently carried into the end surface cleaning unit SB. Then, the substrate W after the end surface cleaning process is carried out from the end surface cleaning unit SSB by the second main robot MR2, and subsequently carried into the reversing unit RT1.

  In the reversing unit RT1, the substrate W whose front surface is directed upward is reversed so that the back surface faces upward. The substrate W after the reversal is unloaded from the reversing unit RT1 by the second main robot MR2, and then is loaded into the back surface cleaning unit SSR. Then, the substrate W after the back surface cleaning process is unloaded from the back surface cleaning unit SSR by the second main robot MR2, and subsequently loaded into the reversing unit RT2.

  In the reversing unit RT2, the substrate W whose back surface is directed upward is reversed so that the front surface faces upward. The inverted substrate W is unloaded from the reversing unit RT2 by the first main robot MR1 of the first processing block 11, and then loaded into the surface cleaning unit SS. The substrate W after the surface cleaning process is unloaded from the surface cleaning unit SS by the first main robot MR1, and subsequently placed on the substrate platform PASS2. The substrate W placed on the substrate platform PASS2 is received by the indexer robot IR of the indexer block 10 and stored in the carrier C.

  In the substrate processing apparatus 100b, the number of transfer processes of the first main robot MR1 relating to one substrate W is the transfer from the substrate platform PASS1 to the substrate platform PASS3 and the transfer from the reversing unit RT2 to the surface cleaning unit SS. And 3 steps of conveyance from the surface cleaning unit SS to the substrate platform PASS2.

  Further, the number of transport steps of the second main robot MR2 related to one substrate W is as follows: transport from the substrate platform PASS3 to the end surface cleaning unit SSB, transport from the end surface cleaning unit SSB to the reversing unit RT1, and from the reversing unit RT1. There are four steps: transport to the back surface cleaning unit SSR and transport from the back surface cleaning unit SSR to the reversing unit RT2.

  In this case, the number of transfer processes of the substrate W by the second main robot MR2 is larger than the number of transfer processes of the substrate W by the first main robot MR1. Therefore, the overall throughput of the substrate processing apparatus 100b depends on the transfer speed of the substrate W by the second main robot MR2.

(3-3) Effects in the Second Reference Mode In the present reference mode, similarly to the first reference mode, the transfer of the substrate W in the first processing block 11 and the transfer of the substrate W in the second processing block 12 are performed. By carrying out in parallel, the transfer time of the substrate W can be shortened. Thereby, the throughput in the substrate processing apparatus 100b can be improved.

  Moreover, in this reference form, by performing the back surface cleaning process of the substrate W after the end surface cleaning process of the substrate W, even if a suction mark is formed on the back surface of the substrate W during the end surface cleaning process, it is removed by the subsequent back surface cleaning process. . Further, since a mechanical spin chuck is used for the front surface cleaning unit SS, even if the front surface cleaning process is performed after the back surface cleaning process, the suction marks are not formed again on the back surface of the substrate W.

(3-4) Modification of Second Reference Embodiment In the substrate processing apparatus 100b according to the second reference embodiment, the reversing units RT1a and RT2a shown in the above embodiment are used instead of the reversing units RT1 and RT2. Also good. In this case, since the plurality of substrates W can be efficiently reversed, the throughput of the substrate processing apparatus 100b can be improved.

  Further, two substrate platforms PASS1, PASS2, and PASS3 are provided, and two substrates W are transferred in parallel as in the above embodiment, thereby further improving the throughput in the substrate processing apparatus 100b. Can do.

(5) Other Examples In the first reference embodiment, the unprocessed substrate W is transferred from the indexer block 10 to the second processing block 12 via the substrate platforms PASS1 and PASS2, but this is not limitative. Instead, it may be conveyed from the indexer block 10 to the second processing block 12 via the reversing units RT1 and RT2.

  In the second reference embodiment, the surface cleaning process of the substrate W is performed after the end surface cleaning process and the back surface cleaning process of the substrate W. However, the present invention is not limited to this, and the substrate W is processed after the surface cleaning process of the substrate W. The end surface cleaning process and the back surface cleaning process of the substrate W may be performed.

  In the second reference embodiment, the substrate W before the back surface cleaning process is reversed by the reversing unit RT1, and the substrate W after the back surface cleaning process is reversed by the reversing unit RT2. However, the present invention is not limited to this. The substrate W before the back surface cleaning process and the substrate W after the back surface cleaning process may be inverted by a common inversion unit.

  In the embodiment and the reference embodiment, as the indexer robot IR and the main robots MR1 and MR2, an articulated transfer robot that moves the joint linearly by moving the joint is used. However, the present invention is not limited to this. Instead of this, a direct-acting transfer robot that slides the hand linearly with respect to the substrate W to perform advance / retreat operation may be used.

  Further, the arrangement of the front surface cleaning unit SS, the back surface cleaning unit SSR, and the end surface cleaning unit SSB may be appropriately changed according to the processing speed and the like. For example, the end surface cleaning unit SSB may be provided first in the processing block 11, or the front surface cleaning unit SS and the back surface cleaning unit SS may be provided in a common processing block.

  Further, the operation order of the indexer robot IR and the main robots MR1 and MR2 may be changed as appropriate according to the processing speed of the reversing units RT1 and RT2, the front surface cleaning unit SS, and the back surface cleaning unit SSR.

  Further, the numbers of the reversing units RT1, RT2, RT1a, RT2a, the front surface cleaning unit SS, and the back surface cleaning unit SSR may be appropriately changed according to the processing speed.

(6) Correspondence between each constituent element of claim and each element of the embodiment Hereinafter, an example of correspondence between each constituent element of the claim and each element of the embodiment will be described. It is not limited to.

  In the above embodiment, the first processing block 11 and the second processing block 12 are examples of processing areas, the indexer block 10 is an example of a carry-in / out area, and the indexer block 10 and the first processing block 11 The area between is an example of the delivery area.

  Further, the front surface cleaning unit SS is an example of a front surface cleaning processing unit, the back surface cleaning unit SSR is an example of a back surface cleaning processing unit, the first main robot MR1 is an example of a first transport means, and the indexer robot IR. Is an example of the second conveying means, the carrier C is an example of a storage container, and the carrier mounting table 40 is an example of a container mounting part.

  The reversing units RT1a and RT1b are examples of reversing devices, and the substrate platform PASS1 is an example of a substrate platform.

  The fixed plate 32, the first movable plate 36a, the support pins 39a and 39c, and the cylinder 37a are examples of the first holding mechanism. The fixed plate 32, the second movable plate 36b, the support pins 39b and 39d, and the cylinder Reference numeral 37b is an example of a second holding mechanism, the support plate 31 is an example of a support member, and the rotary actuator 38 is an example of a rotating device. The hand MRH1 is an example of a first holding unit, the hand MRH2 is an example of a second holding unit, the hand IRH1 is an example of a third holding unit, and the hand IRH2 is an example of a fourth holding unit. It is an example.

  In addition, as each component of a claim, it is also possible to use the other various elements which have the structure or function described in the claim.

  The present invention can be used for processing various substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for PDP, glass substrates for photomasks, and substrates for optical disks.

DESCRIPTION OF SYMBOLS 10 Indexer block 11 1st process block 12 2nd process block 40 Carrier mounting base 100,100a, 100b, 100c Substrate processing apparatus C carrier PASS1, PASS2, PASS3 Substrate mounting part RT1, RT2, RT1a, RT1b Inversion unit SS Front surface cleaning unit SSB End surface cleaning unit SSR Back surface cleaning unit MR1 First main robot MR2 Second main robot W Substrate

Claims (7)

A substrate processing apparatus for processing a substrate having a front surface and a back surface,
A processing area for processing the substrate;
A loading / unloading area for loading and unloading the substrate with respect to the processing area;
A delivery area provided between the carry-in / out area and the processing area;
The processing area is
A plurality of back surface cleaning processing units for cleaning the back surface of the substrate;
A plurality of surface cleaning processing units for cleaning the surface of the substrate;
Including a plurality of back surface cleaning processing units, a plurality of front surface cleaning processing units, and a first transport means for transporting a substrate between the transfer areas,
The carry-in / out area is
A container mounting portion on which a storage container for storing a substrate is mounted;
A second transfer means for transferring a substrate between the storage container placed on the container placement unit and the transfer area;
The delivery region includes a reversing device that reverses the front surface and the back surface of the substrate,
The reversing device reverses a plurality of substrates simultaneously,
The substrate processing apparatus, wherein the second transfer means transfers a plurality of substrates simultaneously between the storage container and the reversing device. The delivery area includes a plurality of substrate placement portions for placing a substrate,
The second transfer device places a plurality of substrates before cleaning by the back surface cleaning processing unit and the front surface cleaning processing unit on the plurality of substrate mounting units,
2. The substrate processing apparatus according to claim 1, wherein the first transfer device simultaneously takes out a plurality of uncleaned substrates placed on the plurality of substrate placement units from the plurality of substrate placement units. . 3. The substrate according to claim 2, wherein the second transport unit simultaneously places the plurality of substrates before cleaning by the back surface cleaning processing unit and the front surface cleaning processing unit on the plurality of substrate mounting units. Processing equipment. The said 1st conveying apparatus carries in simultaneously the several board | substrate after the washing | cleaning by the said back surface cleaning process part and the said surface cleaning process part to the said inversion apparatus, The Claim 1 characterized by the above-mentioned. Substrate processing equipment. The reversing device is
First and second holding mechanisms for holding the substrate in a state perpendicular to the first axis, respectively;
A support member that supports the first and second holding mechanisms so as to overlap in the direction of the first axis;
5. A rotating device that integrally rotates the support member together with the first and second holding mechanisms around a second axis that is substantially perpendicular to the first axis. The substrate processing apparatus according to any one of the above. The first transport means has first and second holding portions for holding the substrates,
The distance between the substrate holding position by the first holding unit and the substrate holding position by the second holding unit is the same as the substrate holding position and the second holding by the first holding mechanism of the reversing device. 6. The substrate processing apparatus according to claim 5, wherein the distance is equal to a distance between the holding position of the substrate by the mechanism. The second transport means has third and fourth holding portions for holding the substrates, respectively.
The distance between the substrate holding position by the third holding unit and the substrate holding position by the fourth holding unit is the same as the substrate holding position and the second holding by the first holding mechanism of the reversing device. 7. The substrate processing apparatus according to claim 5, wherein the distance is equal to a distance between the holding position of the substrate by the mechanism.

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