JP2002110609A - Cleaning apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning apparatus having a small footprint which copes with the upsizing of substrates. SOLUTION: The cleaning device 1 for giving prescribed cleaning operations to substrates, such as semiconductor wafers W, is provided with a cleaning section 3 which has several treating units for giving prescribed treatments to the wafers W and a carrying section 2 which carries the wafers W in and out from the cleaning section 3. The cleaning section 3 is provided with four scrub cleaning units which are placed in two stages, a wafer inverting unit 14b for causing the side of the wafers W to be inverted, a wafer delivery unit 14a on which the wafers W are temporarily placed for passing or receiving the wafers W to or from the carrying section 2 and a main wafer transfer mechanism 15, which has access to all the units and passes or receives the wafers W to and from each of the units.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a cleaning apparatus for performing a predetermined cleaning process on a substrate such as a CD substrate.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, for example, it is necessary to maintain a high degree of cleanliness on both the front and back surfaces of a semiconductor wafer (wafer), particularly on the surface of a wafer on which semiconductor devices are formed. Before and after the manufacturing process, the surface of the wafer is cleaned. In particular, in the photolithography process, cleaning the surface of the wafer is indispensable. Conventionally, while supplying a cleaning liquid to the surface of the rotating wafer, the rotating brush abuts against the surface of the wafer and the center of the wafer and the peripheral edge thereof. Scrub cleaning is performed to remove contaminants such as particles attached to the surface of the wafer by reciprocating the wafer with a unit.

In such a cleaning apparatus for performing scrub cleaning, conventionally, a plurality of scrub cleaning units for performing scrub cleaning have been arranged in a plane.

[0004]

However, in recent years, the diameter of wafers has been increasing, and in order to cope with this, other units provided in the cleaning apparatus, such as a scrub cleaning unit, for example, When each unit such as a heating unit for drying the wafer, a reversing unit for reversing the wafer to scrub clean both surfaces of the wafer, and a wafer transfer mechanism are enlarged to match the size of the wafer, cleaning is performed. The footprint of the processing equipment becomes very large.

[0005] In this case, it becomes difficult to dispose the cleaning apparatus in the existing clean room, and it is necessary to extend or newly install the clean room, and it is expected that the facility load will increase. Therefore, although it is inevitable to increase the footprint of the cleaning apparatus, it is desired to minimize the increase.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a cleaning apparatus having a small footprint corresponding to an increase in the size of a substrate.

[0007]

That is, according to the present invention, there is provided a cleaning apparatus for performing a predetermined cleaning process on a substrate, comprising a plurality of scrub cleaning units stacked and arranged in multiple stages; And a substrate transport mechanism capable of accessing all of the scrub cleaning units.

Further, according to the present invention, there is provided a cleaning processing apparatus for performing a predetermined cleaning processing on a substrate, comprising: a cleaning processing section having a plurality of scrub cleaning units stacked and arranged in multiple stages; A cleaning processing apparatus comprising: a substrate loading / unloading unit for loading / unloading a substrate into / from a unit; and a substrate transfer mechanism capable of accessing all of the plurality of scrub cleaning units.

Further, according to the present invention, there is provided a cleaning processing apparatus for performing a predetermined cleaning processing on a substrate, the cleaning processing unit having a plurality of processing units for performing a predetermined processing on the substrate;
A substrate loading / unloading unit for loading / unloading a substrate to / from the cleaning processing unit, wherein the cleaning processing unit is a plurality of scrub cleaning units disposed at least in upper and lower two stages, and the substrate is turned upside down. A substrate reversing unit to be carried out, a substrate delivery unit for temporarily placing the substrate in order to transfer a substrate between the substrate loading / unloading section, and all of the units, and And a substrate transport mechanism for transferring the substrate between the two.

In such a cleaning apparatus, the scrub cleaning unit, which was conventionally arranged in a plane, is arranged in a multi-tiered arrangement. Even if the size is increased, the increase in the footprint can be minimized.
In addition, by arranging scrub cleaning units in multiple stages,
The throughput can be reduced by increasing the number of scrub cleaning units provided in one cleaning apparatus.

[0011]

Embodiments of the present invention will be specifically described below with reference to the accompanying drawings. In the present embodiment, a description will be given of a cleaning apparatus configured to consistently carry in, clean, dry, and carry out a semiconductor wafer (wafer) in a batch manner.

FIG. 1 is a plan view showing a schematic structure of a cleaning apparatus 1, and FIG. 2 is a side view thereof. As shown in FIGS. 1 and 2, the cleaning apparatus 1
And a loading / unloading unit 2 for loading / unloading a wafer W from / to the cleaning processing unit 3.

In the cleaning apparatus 1, the loading / unloading section 2
Is an in / out port 4 provided with a mounting table 11 for mounting a carrier C in which a plurality of, for example, 26 wafers W are horizontally stored at predetermined intervals, and a carrier C
And a wafer transfer section 5 provided with a wafer transfer mechanism 13 for transferring a wafer between the cleaning section 3 and the cleaning section 3. The loading / unloading unit 2 is provided with an interface for unloading the wafer W transferred from the previous process to the cleaning unit 3 and unloading the wafer W after the cleaning process in the cleaning unit 3 to the next process. It is also preferable to do so.

On the mounting table 11 provided in the in / out port 4, for example, three carriers can be arranged at a predetermined position in a row in the Y direction on the horizontal plane. A window 92 is formed at a position corresponding to the place where the carrier C is placed on a boundary wall 91 between the in / out port 4 and the wafer transfer unit 5. Is provided with a window opening / closing mechanism 12 for opening and closing the window 92 with a shutter or the like.

The structure of the carrier C to be used is not limited, but the carrier C may be, for example, one provided with a lid for opening / closing the loading / unloading port at the loading / unloading port of the wafer W. In this case, the carrier C is attached to the window opening / closing mechanism 12.
When the carrier C is placed on the mounting table 11 with the carrier C facing the window 92 with the function of opening and closing the lid, the window opening and closing mechanism 12 causes the window 92 and the carrier C The lid can be opened and closed. When the window 92 and the cover of the carrier C are opened by the window opening / closing mechanism 12 in this manner, the wafer transport mechanism 13 provided in the wafer transport unit 5 can access the carrier C, and transport the wafer W. Will be able to do it.

The window 92 is provided with only a shutter for opening and closing the window 92, and the lid provided at the loading / unloading port of the carrier C is, for example, manually mounted on the mounting table 11 when the carrier C is mounted on the mounting table 11. A method of opening the loading / unloading port by operating may be used. When the cover is not provided on the carrier C, it is not necessary to provide an opening / closing mechanism for the cover. As described above, the structure of the window portion 92 can be appropriately designed appropriately in accordance with the structure of the carrier C.

The window opening / closing mechanism 12 further includes a carrier C
Of the wafer W in the inside, for example, whether or not a predetermined number of wafers W are accommodated,
To see if it has been contained
Alternatively, it is also preferable to provide a sensor for detecting whether or not the wafer W is accommodated obliquely in the height direction. By starting the cleaning process after inspecting the accommodation state of the wafer W by such a sensor, for example, a batch process in which a predetermined number of the same condition processes are required can be reliably performed.

The wafer transfer section 5 is provided with a wafer transfer mechanism 13 for transferring a wafer W between the carrier C and the cleaning section 3. The wafer transfer mechanism 13 is movable in the Y direction and can access all carriers C mounted on the mounting table 11. Further, the wafer holding arm 13a of the wafer transfer mechanism 13 is slidable in the X direction on the horizontal plane, and within the XY plane (θ direction).
To transfer the wafer W to / from the carrier C through the window 92, and to a wafer delivery unit (TR) provided in the cleaning unit 3 to be described later.
S) 14a is accessible. Thus, the wafer transfer mechanism 13 moves from the in-out port 4 side to the cleaning processing unit 3 side, and conversely, from the cleaning processing unit 3 side to the in-out port 4
The wafer W can be transferred to the side. Further, the wafer transfer mechanism 13 can move up and down in the vertical Z direction, and can transfer the wafer W at an arbitrary height position in the carrier C.

Next, the cleaning section 3 will be described. The cleaning processing unit 3 includes a wafer transfer unit (RVS) 14b for reversing the front and back of the wafer W and a wafer transfer unit (temporarily placing the wafer W thereon) for transferring the substrate between the wafer transfer unit 5 and the wafer transfer unit (RVS). A transfer / reversal unit 14 comprising a TRS (transformer) (TRS) 14a and a heating / cooling unit (HP / COL) 16 for drying the wafer W after the cleaning process are provided. S
CR) 21a to 21d, a wafer reversing unit (RVS) 14b, and a wafer transfer unit (TRS) 14
a, scrub cleaning units (SCR) 21a to 21d,
A main wafer transfer mechanism (PRA) 1 which is provided so as to be accessible to all of the heating / cooling units (HP / COL) 16 and transfers a wafer W to or from each of these units or units.
5 are provided.

The cleaning unit 3 includes a cleaning apparatus 1.
Electrical unit (EB) 1 for overall operation and control
8 and a machine control unit (MB) 19, a chemical solution storage unit (CTB) 17 for storing a predetermined cleaning solution to be sent to scrub cleaning units (SCR) 21a to 21d.
Are arranged. Further, a filter fan unit (FFU) 22 for down-flowing clean air is disposed on each unit for handling the wafer W and the main wafer transfer mechanism (PRA) 15 on the ceiling of the cleaning processing unit 3. I have. The chemical storage unit (CTB) 17
Can be provided below the scrub cleaning units (SCR) 21a to 21d.

FIG. 3 shows a wafer reversing unit (RVS) 14b and a wafer delivery unit (T
RS) 14a to the main wafer transfer mechanism (PRA) 15 and the heating / cooling unit (HP / CO) adjacent in the X direction.
L) is a sectional view shown together with 16; Delivery / Reversal unit 1
4, the wafer transfer unit (TRS) 1
4a are stacked in two stages, and a wafer delivery unit (TR
S) A wafer reversing unit (RVS) 14b is further stacked and arranged on two levels on the 14a.

On the side of the wafer transfer unit (TRS) 14a on the side of the main wafer transfer mechanism (PRA) 15, a main wafer transfer arm 5 of the main wafer transfer mechanism (PRA) 15 is provided.
An opening 95a is provided so that 5-57 can be inserted. A wall 93 is provided between the cleaning unit 3 and the wafer transfer unit 5, and a window is provided in a portion of the wall 93 corresponding to a boundary between the wafer transfer unit (TRS) 14 a and the wafer transfer unit 5. A portion 94a is formed, and the wafer W can be transferred between the wafer transfer mechanism 13 and the wafer transfer unit (TRS) 14a through the window portion 94a.

FIG. 4 is the same sectional view as FIG. 3, and is an explanatory view showing the flow of the down flow from the filter fan unit (FFU) 22. In FIG. 4, the arrangement of the main wafer transfer mechanism (PRA) 15 is shown. Portions are shown blank to show the flow of the downflow. As shown in FIG.
Part of the down flow from the filter fan unit (FFU) 22 is guided into the wafer transfer unit (TRS) 14a from the opening 95a and flows out from the window 94a toward the wafer transfer unit 5. .

With such a structure, intrusion of particles and the like from the wafer transfer section 5 to the cleaning section 3 is prevented, and the cleanliness of the cleaning section 3 is maintained. Further, the down flow guided to the wafer transfer unit 5 prevents particles or the like from entering the wafer transfer unit 5 from the in / out port 4 and has an effect of maintaining the cleanliness of the wafer transfer unit 5. Thus, the cleaning apparatus 1 has a structure in which particles and the like are prevented from adhering to the wafer W as a whole.

The window 94a and the opening 95a may be formed to be openable and closable by a shutter or the like. In this case, the wafer transfer unit (TRS) 14a is operated while the filter fan unit (FFU) 22 is in operation. It is preferable to keep it open regardless of whether it is used or not, and a filter fan unit (FFU) 2
2, regardless of the operating state of the second window 94a and the opening 95
a may be always open.

At a predetermined position on the bottom surface of the wafer transfer unit (TRS) 14a, a pin 25 protruding upward is provided. For example, the wafer holding arm 13a of the wafer transfer mechanism 13 holding the wafer W is 25, and then the wafer W is
By lowering and pulling back the wafer holding arm 13a so as to be placed on the pins 25 apart from the wafer 3a, the wafer W
Is placed on the pin 25. When the method of placing the wafer W by the pins 25 is used, one wafer W is basically held in one unit. For example, the wafer W is stored in the carrier C. When the wafer W is held by guides arranged in multiple stages,
A plurality of wafers W can be placed on the unit.

The wafer transfer units (TRS) 14a arranged in two upper and lower stages can be used in various ways. For example, the lower wafer transfer unit (T
RS) 14a is mounted with only the wafer W that has not been subjected to the cleaning process and is transferred from the wafer transfer unit 5 to the cleaning processing unit 3, and the upper wafer transfer unit (TRS) 14a is connected to the wafer transfer unit 3 from the cleaning processing unit 3. 5 can be used so that only the cleaned wafer W to be transported to the wafer 5 is placed.
In this case, contamination of the wafer W such that particles or the like adhering to the pins 25 from the unprocessed wafer W adhere to the wafer W after the cleaning process is reduced, and the wafer W is kept clean. .

In some cases, unprocessed wafers W to be transported to the cleaning section 3 are placed in both stages at one time in accordance with the progress of the cleaning process. Wafer W that has been cleaned and transferred to
Can also be used. In this case, throughput is improved and productivity is improved.

Next, the wafer reversing unit (RVS) 14b provided in the transfer / reversal unit 14 will be described. As shown in FIG. 3, the wafer reversing unit (RVS) 14b
An opening 95b is provided at a lower portion of the side surface on the side of the main wafer transfer mechanism (PRA) 15 so that the main wafer transfer arms 55 to 57 of the main wafer transfer mechanism (PRA) 15 can be inserted. Is formed with a window 95c for taking in a part of the down flow from the filter fan unit (FFU) 22. Here, the side surface of the wafer reversing unit (RVS) 14b on the side of the main wafer transfer mechanism (PRA) 15 may be entirely open. A wall 93 is provided between the cleaning unit 3 and the wafer transfer unit 5, and a window at a portion of the wall 93 corresponding to a boundary between the wafer reversing unit (RVS) 14 b and the wafer transfer unit 5. A portion 94b is formed.

Therefore, as shown in FIG. 4, as in the case of the wafer transfer unit (TRS) 14a, a part of the downflow from the filter fan unit (FFU) 22 is partially reversed from the openings 95b and 95c. It is guided into the unit (RVS) 14b and flows out of the window 94b toward the wafer transfer unit 5. The cleaning process is performed to prevent particles and the like from entering the cleaning unit 3 from the wafer transfer unit 5. The cleanliness of the section 3 is maintained, and thus the cleanliness of the wafer transfer section 5 is also maintained.

The schematic structure of the wafer reversing unit (RVS) 14b is shown in a plan view of FIG. 5 and a side view of FIG. The wafer reversing unit (RVS) 14b includes a wafer relay unit 26 for transferring a wafer W to and from a main wafer transfer mechanism (PRA) 15, which will be described later in detail, an elevating mechanism 27 for moving the wafer relay unit 26 up and down, It has a wafer reversing mechanism 28 that grips and receives the wafer W held by the wafer relay unit 26, turns the gripped wafer W by rotation, and transfers the wafer W to the wafer relay unit 26 again.

As shown in FIGS. 5 and 6, the wafer relay unit 26 has a substantially H-shaped support table 31 and two support arms 32a and 32b for horizontally holding the support table 31. Legs 31b are provided at four ends of the base 31, and furthermore,
Holding member 31 formed on leg 31b with a substantially L-shaped cross section
a is provided. The holding member 31a is located on the outside so that the peripheral edge of the wafer W contacts the bottom thereof and the vertical wall serves as a guide when holding the wafer, and can hold the wafer W. I have.

The base ends of the support arms 32a and 32b are fixed to a block 33 attached to the lifting mechanism 27, and the block 33 is an air cylinder 3 that expands and contracts in the Z direction.
4 and is guided by a guide 35 extending in the Z direction to move up and down in accordance with the elevating operation of the air cylinder 34. In addition, the lifting mechanism 27 is not limited to the structure using such an air cylinder 34,
By transmitting rotation using a rotation drive mechanism such as a motor to the block 33 using a pulley, a belt, and the like,
A mechanism for performing a lifting operation may be used.

The wafer reversing mechanism 28 includes a pair of wafer gripping arms 36a and 36
The holding member 36c having a V-groove whose bottom is along the side surface of the wafer W is provided at the tip of the holding member 36c. When the wafer gripping arms 36a and 36b are closed, the peripheral portion of the wafer W is sandwiched by the V-grooves, and the wafer W is gripped by the wafer gripping arms 36a and 36b in the diameter direction. In FIG. 6, a dotted line shows a state in which the wafer gripping arms 36a and 36b that grip the wafer W in the horizontal direction are rotated by about 90 ° and held vertically.

FIGS. 7A to 7C are explanatory views showing the X-direction opening / closing mechanism 29 of the wafer gripping arms 36a and 36b in different directions as viewed from the arrow. 7 (a) and 7 (c) are views as viewed in the direction of the arrow Z. FIG. 7 (a) shows the wafer reversing unit (RVS) 14b from above to below, and FIG. 7 (b) shows the view from below to above. It is an arrow view toward.

The base ends of the wafer gripping arms 36a and 36b are fixed to the ZX end faces of the guide blocks 37a and 37b, and the guide blocks 37a and 37b are provided with a guide 38 extending in the X direction. It is fitted and is slidable in the X direction. Guide block 37a
Is a pulley 49a arranged in parallel with the X direction.
49b, is fixed to the upper side in the Y direction (FIG. 7 (c)) of one wire 39 provided between the guide blocks 37.
“b” is connected to the lower side of the wire 39 in the Y direction (FIG. 7C). Further, the guide block 37a
It is fixed to the tip of an air cylinder 41 that can expand and contract in the X direction. The spring 42 connecting the wire 39
Has a function of keeping the tension of the wire 39 constant.

In the structure shown in FIGS. 7A to 7C, when the air cylinder 41 is extended rightward in the X direction, the guide block 37a moves rightward in the same X direction. At this time, the guide block 37a rotates the wire 39 so that the portion of the wire 39 located on the upper side in the Y direction moves rightward in the X direction.
The portion which was on the lower side in the direction moves to the left in the X direction, and the guide block 37b attached to the portion which was on the lower side in the Y direction of the wire 39 in accordance with such movement of the wire 39.
Moves left in the X direction. Thus, the air cylinder 41
As a result, the distance between the guide blocks 37a and 37b increases, and the wafer gripping arms 36a and 36b operate to open their legs. Conversely, when the length of the air cylinder 41 is reduced, the wafer gripping arms 36a and 36b operate to close their legs.

The wafer gripping arms 36a and 36b and the X-direction opening / closing mechanism 29 can be turned 180 ° around a rotation axis 44 parallel to the Y-direction by a rotation driving mechanism 30. Thereby, the upper and lower surfaces of the wafer W are inverted.
As shown in FIG. 5 and FIG.
The protruding portion 43a protruding from the X-direction end of the wafer holding arms 36a and 36b is provided with the wafer gripping arms 36a and 36b so that the wafer W is held horizontally when the X-direction opening / closing mechanism 29 is inverted.
The position of the direction opening / closing mechanism 29 is controlled. For example, as shown in FIG. 5, the horizontal position is determined by abutting on a separately provided projection holding portion 43b.

As the structure of the rotary drive mechanism 30, for example, one end in the Y direction parallel to the Y direction is
9, a rotary shaft 44 and a pulley 44a fixed to the rotary shaft 44, and a rotary motor 45 and a pulley 45a fixed to the rotary shaft of the rotary motor 45, and the rotation of the rotary motor 45 is controlled by the pulley 45a and the pulley 44a. A structure for transmitting the rotation to the rotation shaft 44 through the belt 46 stretched between the rotation shaft 44 and the rotation shaft 44 can be used. The rotation drive mechanism 3
In order to prevent particles generated at 0 from adhering to the wafer W, the rotation driving mechanism 30 is
The wafer W is isolated from the space where the reversal processing is performed.

In the wafer reversing unit (RVS) 14b, for example, the rear surface (wafer W)
Of the wafer W after the cleaning of the wafer W is completed, the back surface of the wafer W has an upper surface (refers to the upper surface when the wafer W is held horizontally). The main wafer transfer mechanism (P
RA) 15 is inserted into the wafer reversing unit (RVS) 14b, and is once transferred so as to be held by the holding member 31a on the support table 31 located below. Then, the support table 31 on which the wafer W is mounted is held horizontally by the elevating mechanism 27 in an open state by the lifting mechanism 27.
a to the position of the wafer gripping arm 36
By closing the legs a and 36b, the wafer W is gripped by the wafer gripping arms 36a and 36b.

Next, during the reversing operation of the wafer W, the support table 31 is retracted downward so that the wafer gripping arms 36a and 36b do not collide with the support table 31 and the holding member 31a, and the rotation drive mechanism 30 is driven to drive the wafer W. Invert W by 180 °. Thereafter, the support table 31 is raised again in a state where the wafer W is turned 180 °, and the wafer holding arms 36a and 36b
The wafer W is transferred to the support table 31 by opening the legs. Subsequently, the support table 31 on which the wafer W is mounted is lowered, and the wafer W is transferred to the main wafer transfer mechanism (PRA) 15 so that the wafer W is turned upside down. Is formed on the upper surface of the wafer W, for example,
It is transported to the scrub cleaning units 21a to 21d, and is subjected to a surface cleaning process.

When two wafer reversing units (RVS) 14b are provided as in the case of the cleaning apparatus 1, each of the wafer reversing units (RVS) 14b can be used for different purposes. For example, the lower wafer reversing unit (RVS) 14b is used for reversing the wafer W transported with the upper surface on the upper surface by the wafer transport arms 55 to 57 described later so that the lower surface on the upper surface. Upper stage wafer reversing unit (RVS)
14b can be used to invert the wafer W transported by the wafer transport arms 55 to 57 with the back surface facing upward so that the front surface is facing upward.

Since four scrub cleaning units (SCR) 21a to 21d are provided in the cleaning apparatus 1, the upper wafer reversing unit (RVS) 14b is replaced with the upper scrub cleaning unit (SCR) 21c.・ 21d
Used for the reversal process of the wafer W that has finished the process in
The lower wafer reversing unit (RVS) 14b may be used for the reversal processing of the wafer W that has been processed by the lower scrub cleaning units (SCR) 21a and 21b.

Further, in accordance with the progress of the cleaning process at all at random, that is, a completely unprocessed wafer W, a wafer W for which only the back surface has been cleaned, a wafer W for which only the front surface has been cleaned, and a cleaning process for both the front and back surfaces. Can be used to sequentially transfer the wafer W to the vacant wafer reversing unit (RVS) 14b so that the next processing can be performed, and perform the reversing process. The main wafer transfer arms 55 to 57 provided on the 15) are set in the controller of the machine control unit (MB) 19 determined in advance as described above, and transfer the wafer W to a predetermined wafer reversing unit ( RVS) 14b, or is controlled to carry out the wafer W from a predetermined wafer reversing unit (RVS) 14b. .

The above-described wafer reversing unit (RV
S) The state of the wafer W, for example, whether the wafer W is placed on the support table 31 at an accurate position,
Further, it is preferable to provide a sensor 48 such as an optical sensor for detecting whether the wafer W is securely gripped by the wafer gripping arms 36a and 36b, and to monitor whether the movement of the wafer W is surely performed. This prevents the wafer W from being dropped or damaged during the reversing operation of the wafer W.

Next, the structure of the main wafer transfer mechanism (PRA) 15 will be described. Main wafer transfer mechanism (PRA) 1
5 is a cylindrical support 51 extending in the Z direction and having vertical walls 51a and 51b and side openings 51c therebetween.
And a wafer carrier 52 provided inside the cylindrical carrier 51 so as to be able to move up and down in the Z direction along the cylindrical support 51. The cylindrical support 51 is rotatable by the rotational driving force of a motor 53, and accordingly, the wafer carrier 52 is also integrally rotated.

The wafer transfer body 52 includes a transfer base 54 and three main wafer transfer arms 55, 56 and 57 movable back and forth along the transfer base 54. 57 are the side openings 5 of the cylindrical support 51.
1c. The main wafer transfer arms 55 to 57 can be independently advanced and retracted by a motor and a belt mechanism built in the transfer base 54. The wafer carrier 52 is
The belt 59 is moved up and down by driving a belt 59 by a motor 58. Reference numeral 60 denotes a driving pulley, and 61 denotes a driven pulley.

As shown in FIG. 3, the main wafer transfer mechanism (P
A heating / cooling unit (HP / COL) 16 is provided on the opposite side of the delivery / reversal unit 14 with the RA) 15 interposed therebetween. The heating / cooling unit (HP / COL) 16 is provided with one cooling unit (COL) 16b for performing forced cooling, and three hot plate units (HP) 16a for performing forced heating / natural cooling thereon. They are arranged in a stack.
An opening / closing window 96 is formed on the main wafer transfer mechanism (PRA) 15 side of each of these units so that the main wafer transfer arms 55 to 57 can be inserted and withdrawn.

The cooling unit (COL) 16b supplies a cooling gas such as nitrogen gas from below to a mounting table 62 provided with a plurality of pins 62a for holding the wafer W protruding in proximity to the upper surface. Spray and place table 6
2 can be used to cool the wafer W uniformly by cooling it. On the other hand, the heating unit (HP) 16a has a built-in heater 63a, and can hold the wafer W close to the upper surface of the hot plate 63 held at a predetermined temperature, thereby uniformly heating the wafer W. Is preferably used. Heating / cooling unit (H
The P / COL (P / COL) 16 is mainly used for drying the wafer W in a state where the front or back surface after scrub cleaning is not completely dried.

Subsequently, a scrub cleaning unit (SCR) 2
1a to 21d will be described. As shown in FIGS. 1 and 2, in the cleaning apparatus 1, four scrub cleaning units (SCRs) 21a to 21d are arranged in two vertically stacked stages, two in each stage. ing.

Scrub cleaning unit (SCR) 21a-
Reference numeral 21d denotes a scrub cleaning unit (S) disposed on the wafer transfer unit 5 side so that the main wafer transfer arms 55 to 57 of the main wafer transfer mechanism (PRA) 15 can be inserted and withdrawn.
CR) 21b and the scrub cleaning unit (SCR) 21a arranged next to the same stage, these boundary walls 97a
(One side surface of the sink 68 described later) is symmetrical, and the scrub cleaning unit (SCR) 21c adjacent to the same stage as the scrub cleaning unit (SCR) 21c is also symmetrical about the boundary wall 97b. .

In other words, as shown in detail in FIGS. 8 and 9, the scrub cleaning units (SCR) 21a to 21d communicate with the wafer W between the main wafer transfer arms 55 to 57.
And the spin chuck 71 that holds the wafer W substantially horizontally is provided in all the scrub cleaning units (S
CR) 21a to 21d and a main wafer transfer mechanism (PR)
A) The spin chuck 7 is provided at a position close to 15.
Brushes 76a and 76a on the upper surface of the wafer W held on
b, a brush holding arm 77a driven to abut
The retract position of 77b is the main wafer transfer mechanism (PRA) 1
5 is provided at a position distant from 5. Thus, the scrub cleaning units (SCR) 21a and 21b have a symmetrical structure with respect to the boundary wall surface 97a, and the scrub cleaning units (SCR) 21c and 21d have a symmetrical structure with respect to the boundary wall surface 97b. (Figure 1
reference).

The scrub cleaning unit (SCR) 2
As a method of using 1a to 21d, a method is used in which a cleaning process is started by sequentially transporting wafers W to randomly vacant units without considering the front and back surfaces of the wafer W and starting a cleaning process. Here, the scrub cleaning units (SCR) 21c and 21d provided in the upper stage
Is the filter fan unit (FF
U) can take in clean air directly from 22;
While it is possible to maintain a high degree of internal cleanliness, the scrub cleaning unit (SCR) provided at the lower stage
Regarding 21a and 21b, since it is necessary to draw clean air into the inside from the filter fan unit (FFU) 22 by providing piping using the wall surface of the cleaning apparatus 1, the scrub provided in the lower stage is usually used. The cleanliness of the cleaning units (SCR) 21a and 21b is determined by the scrub cleaning units (SCR) 21c and 21d provided in the upper stage.
It is not expected to be as high.

Therefore, in the cleaning apparatus 1, the scrub cleaning unit (SC) provided on the upper stage performs cleaning of the surface of the wafer W, which is preferably processed in an environment with higher cleanliness.
R) It is preferable to use differently for different purposes such that the cleaning is performed in 21c and 21d, and the back surface of the wafer W is cleaned using the scrub cleaning units (SCR) 21a and 21b provided in the lower stage. The lower scrub cleaning unit (S
A filter unit is provided above the CR) 21a and 21b, and air supplied from a filter fan unit (FFU) 22 through a pipe is filtered by the filter unit and the scrub cleaning unit (SCR) 21 is provided.
If it is configured to be supplied into the a.21b, the cleanliness in the scrub cleaning units (SCR) 21a and 21b is preferably kept high.

In this case, in the scrub cleaning units (SCR) 21a and 21b for back surface cleaning, when the wafer W is horizontally held on the spin chuck 71, the front surface is lower (when the wafer W is horizontally held). The lower surface of the wafer W is mechanically controlled so that no trace is left on the surface of the wafer W when it is held by the spin chuck 71. It is preferable to use one having a mechanism for holding the peripheral portion of W.

On the other hand, in the scrub cleaning units (SCR) 21c and 21d for cleaning the front surface, when the wafer W is held substantially horizontally on the spin chuck 71, the back surface is the lower surface. As the component 71, a component having a mechanism for holding the wafer W by vacuum suction can be used.

As described above, when the scrub cleaning units (SCR) 21a to 21d are separately used for cleaning the back surface of the wafer W and for cleaning the front surface of the wafer W, the structure of the spin chuck 71 is different. Since the parts configuration and the like are the same, the structure of the scrub cleaning unit (SCR) 21a for back surface cleaning will be described below as an example.

FIG. 8 shows a scrub cleaning unit (SCR) 2
FIG. 9 is a plan view showing a schematic structure of 1c, and FIG. 9 is a sectional view thereof. Each member of the scrub cleaning unit (SCR) 21a is provided in the sink 68, and an opening / closing window 69 is provided at a boundary portion of the sink 68 with the main wafer transfer mechanism (PRA) 15, and an opening / closing window 69 is provided. The main wafer transfer arms 55 to 57 advance and retreat through 69. For this reason, the spin chuck 71 that holds the wafer W uses the main wafer transfer mechanism (PR).
A) It is arranged at a position close to 15.

The spin chuck 71 mainly includes a chuck plate 71a, a support column 71b for supporting the chuck plate 71a, and a rotation driving mechanism 71 for rotating the support column 71b.
c. On the surface of the chuck plate 71a, for example, a plurality of support pins (not shown) are provided at appropriate positions, and the wafer W is placed in contact with the apex of the support pins.

Further, the peripheral edge of the chuck plate 71a
A detachment mechanism 71d for the wafer W is provided at the location. Here, on the left side of FIG.
9 is shown, and the right side of FIG. 9 shows a state where the detachment mechanism 71d does not hold the wafer W. Contact jigs 72b are arranged at three places on one connection table 72a which can be moved up and down by the elevating mechanism 72 in accordance with the arrangement position of the detachable mechanism 71d. When the elevating mechanism 72 is raised, it is arranged at three places. The provided contact jig 72b simultaneously presses the inner peripheral end of the detachment mechanism 71d against the back surface of the chuck plate 71a, and thereby the detachment mechanism 71d
Is tilted outward and downward so that the holding state of the wafer W is released. Conversely, when the elevating mechanism 72 is lowered and the contact jig 72b is separated from the detaching mechanism 71d,
The outer peripheral end of the detachment mechanism 71d is inclined inward and upward, and the wafer W is naturally held by the detachment mechanism 71d.

The cup 73 disposed so as to surround the periphery of the chuck plate 71a can be moved up and down by an elevating mechanism 74. FIG. 9 shows the lower position and the upper position at the same time. The cup 73 is held at the lower position when the wafer W is loaded and unloaded, and is held at the upper position during the cleaning process and scatters from the outer periphery of the wafer W to the outside. The cleaning liquid is guided downward inside the cup 73. The cup 73 is formed with two tapered portions 73a at upper and lower portions, so that the cleaning liquid is hardly scattered to the outside. Further, a drain 75 is formed at the inner peripheral bottom of the cup 73 so that the inside of the cup 73 is exhausted and the cleaning liquid is exhausted.

The scrub cleaning unit (SCR) 21a is provided with two brushes 76a and 76b for performing scrub cleaning by contacting the upper surface of the wafer W. Brush 76
a and 76b are brush holding arms 77a and 77b, respectively.
Of the brush holding arm 77a.
A rotary drive mechanism (not shown) provided at the end of the rotary shaft 7b is configured to be rotatable around rotary shafts 78a and 78b parallel to the Z direction. FIG. 8 shows a state in which the two brush holding arms 77a and 77b are in the retracted position outside the cup 73, and the brushes 76a and 76b are located on the brush bus 67 in the retracted position. The cleaning liquid dripping from the brushes 76a and 76b is collected.

A cleaning liquid supply nozzle (not shown) for supplying a predetermined cleaning liquid to the brushes 76a and 76b is provided at the tips of the brush holding arms 77a and 77b.
During scrub cleaning using the brushes 76a and 76b, a predetermined amount of cleaning liquid is supplied to the brushes 76a and 76b.

The base end of the brush holding arm 77a is connected to a drive mechanism 79a, and the guide 81 is driven by the drive mechanism 79a.
It is slidable parallel to the X direction along a,
The base end of the brush holding arm 77b is connected to the drive mechanism 79b, and the drive mechanism 79b moves the guide X along the guide 81b.
It is slidable parallel to the direction. in this way,
In the scrub cleaning unit (SCR) 21a, the two brush holding arms 77a and 77b can be driven independently. In addition, these drive mechanisms 79a.
79b also has a lifting mechanism for raising and lowering the brush holding arms 77a and 77b in the Z direction, and the height of the brushes 76a and 76b can be adjusted by the lifting mechanism. It is also possible to provide a mechanism for raising and lowering the brushes 76a and 76b in the Z direction at the end portions of the brush holding arms 77a and 77b on which the brushes 76a and 76b are provided.

Thus, the scrub cleaning unit (SCR)
In 21a, for example, while the spin chuck 71 is rotated, the cleaning liquid is supplied to a predetermined position on the surface of the wafer W from the rinsing nozzles 86a and 86b disposed near the outside of the cup 73 to uniformly spread the cleaning liquid on the wafer W. The cleaning process can be performed by simultaneously driving the two brush holding arms 77a and 77b and scanning the brushes 76a and 76b in different directions on the wafer W while scanning the wafer W while forming a liquid film. In this case, it is possible to reduce the cleaning processing time for one wafer W.

Further, for example, the materials of the portions of the brushes 76a and 76b that come into contact with the wafer W may be different, and one of the brushes 76a and 76b may be used for rough cleaning, and the other may be used for finishing to perform more precise cleaning. Further, it is also possible to use one brush as a spare brush for dealing with a case where the other brush becomes unusable due to a failure or abrasion of the brush.

As shown in FIG. 8, the sink 68 is divided by a wall 98 into a cleaning processing chamber 8 in which a cup 73 is disposed.
2a and drive mechanism 7 for brush holding arms 77a and 77b
The brush holding arms 77a and 77b are separated from a drive mechanism installation chamber 82b in which the brush holding arms 9a and 79b are disposed. It is arranged to be located. This window is provided with the Z of the brush holding arms 77a and 77b.
It has a predetermined width in the Z direction and extends in the X direction so as not to hinder vertical movement in the direction and scanning in the X direction.

As described above, the interior of the sink 68 is
a and the drive mechanism installation chamber 82b, the diffusion of particles and the like expected to be generated in the drive mechanisms 79a and 79b in the scrub cleaning unit (SCR) 21a is prevented, and the wafer W Adherence can be avoided. Further, when there is a cleaning liquid scattered outside the cup 73, such a cleaning liquid is supplied to the driving mechanism 79a.
The problem of causing the drive mechanisms 79a and 79b to malfunction due to adhesion to the drive mechanism 79b is avoided.

The scrub cleaning unit (SCR) 21a includes a cleaning liquid discharge nozzle 83 for performing cleaning processing using high-speed jet cleaning water or cleaning water to which ultrasonic waves have been applied, in addition to scrub cleaning using the brushes 76a and 76b. It is arranged. The cleaning liquid discharge nozzle 83 is
It is attached to the tip of a nozzle holding arm 84 that can be scanned in the X direction by the driving mechanism 79c along the direction 1a and can be moved up and down in the Z direction. The height / direction adjusting mechanism 85 of the cleaning liquid discharge nozzle 83 can change the height in the Z direction and the discharge angle of the rinse liquid. Thus, the scrub cleaning unit (SC
Since different cleaning means are provided in the R) 21a, a cleaning process using only one of them may be performed according to the type of the wafer W, and both cleaning means are used before and after. A cleaning process can be performed.

The drive mechanism 79c is provided in the drive mechanism installation room 8
The nozzle holding arm 84 is disposed in the cleaning processing chamber 82 through the not-shown window provided on the wall 98 similarly to the brush holding arms 77a and 77b.
a. In this way, particles generated by the drive mechanism 79c are prevented from scattering into the cleaning processing chamber 82a, while the cleaning liquid from the cup 73 scatters into the drive mechanism installation chamber 82b and adheres to the drive mechanism 79c, and the cleaning mechanism 79c The problem of causing a malfunction is avoided.

Next, the cleaning process of the wafer W in the above-described cleaning apparatus 1 is performed according to a processing recipe in which the front surface of the wafer W is cleaned and then the back surface is cleaned in the order of the cleaning process. Will be described. Here, as a premise, of the two wafer transfer units (TRS) 14a provided, the lower stage is used for transporting the wafer W from the wafer transport unit 5 to the cleaning processing unit 3, and the upper stage is transmitted from the cleaning processing unit 3. It is used for transfer to the wafer transfer section 5.

Further, of the two wafer reversing units (RVS) 14b provided, the lower stage is used for reversing the wafer W from the state where the front surface of the wafer W is the upper surface to the state where the rear surface is the upper surface. Is used to invert the wafer W from the state where the back surface of the wafer W is the upper surface to the state where the front surface is the upper surface.

Further, among the four scrub cleaning units (SCR) 21a to 21d, the lower scrub cleaning units (SCR) 21a and 21b are used for cleaning the back surface of the wafer W, and The scrub cleaning units (SCR) 21c and 21d provided
Shall be used for surface cleaning. The main wafer transfer arms 55 to 57 of the main wafer transfer mechanism (PRA) 15
The wafer W is controlled to operate in accordance with a processing recipe set and stored in advance in the controller of the machine control unit (MB) 19, and the wafer W is transferred between the units to which the processing contents are allocated as described above.

First, the carrier C containing a predetermined number of wafers W is mounted at a predetermined position on the mounting table 11 such that the loading / unloading port of the wafer W is on the wafer transfer section 5 side.
When the window 92 is opened by the window opening / closing mechanism 12 and a lid is attached to the loading / unloading port, the lid is moved to allow the inside of the carrier C to communicate with the wafer transport unit 5 and further the sensor is Then, the accommodation state of the wafer W in the carrier C is confirmed. If there is an abnormality in the accommodation state of the wafer W, the processing is interrupted, and for example, the processing shifts to the processing operation of another carrier C.

When there is no abnormality in the accommodation state of the wafer W, the wafer transfer mechanism 13 is moved to a predetermined height position in the carrier C.
Is inserted, and one wafer W
Take out. The wafer W thus held by the wafer holding arm 13a is transferred to the lower wafer transfer unit (TRS) 1
Wafer transfer unit (TRS) 14a
It is placed at a predetermined position inside. At this time, the surface of the wafer W is in an upper surface. Then, the wafer transfer mechanism 1
3 continues the work such as taking out another wafer W.

One of the main wafer transfer arms 55 to 57 of the main wafer transfer mechanism (PRA) 15, for example, the main wafer transfer arm 55 is transferred to the lower wafer transfer unit (TRS) 14a on which the wafer W is mounted. The wafer W is inserted and taken out. Since the wafer W is held by the main wafer transfer arm 55 with the front surface facing upward, the wafer W is transferred to the upper scrub processing unit (SC) according to the processing recipe.
R) Convey to one of 21c and 21d.

For example, a scrub cleaning unit (SCR)
21c, the opening / closing window 69 is opened with the cup 73 held at the lower position, and the main wafer transfer arm 5 is opened.
5 is inserted to the position of the spin chuck 71, and the wafer W is mounted on the spin chuck 71 and fixed. Thereafter, the main wafer transfer arm 55 is moved to the scrub cleaning unit (SC).
R) Exit from inside 21c and close opening / closing window 69.

The scrub cleaning unit (SCR) 2
In 1c, a spin chuck having a mechanism for holding the wafer W by vacuum suction is preferably used as the spin chuck 71. At this time, a suction mark due to the vacuum suction is left on the lower surface of the wafer W in contact with the spin chuck 71. However, such an adsorbing mark is later found in a scrub cleaning unit (SCR).
It is removed by back surface cleaning using 21a and 21b.

In the scrub cleaning unit (SCR) 21c, if scrub cleaning is performed using both the brushes 76a and 76b, first, the brush holding arms 77a and 77b are used.
7b are slid so that the brushes 76a and 76b are positioned on the wafer W, and the cup 73 is raised and held at a predetermined position. Then spin chuck 7
1 to make the wafer W rotate in-plane,
After the cleaning liquid is supplied to the wafer W from the rinsing nozzles 86a and 86b to form a liquid film on the wafer W, the cleaning liquid is supplied to the wafer W from the rinsing nozzles 86a and 86b while rotating the brushes 76a and 76b. W
To the brush holding arms 77a and 77a at a predetermined speed.
Scan b. Thus, scrub cleaning is performed.

In such scrub cleaning, since the linear velocity of rotation is low at the center of the wafer W and high at the peripheral edge, the brush holding arms 77a and 77b are scanned in the X direction. In this case, for example, the scan speed is increased at the center of the wafer W, while
A uniform cleaning process over the entire surface of the wafer W by reducing the scanning speed at the peripheral portion of the wafer W, for example, so that the time during which the brushes 76a and 76b contact an arbitrary unit area of the wafer W is equalized over the entire wafer W. It can be performed.

After the scrub cleaning using the brushes 76a and 76b is completed, the brushes 76a and 76b
The cleaning liquid discharge nozzle 83 is moved toward the upper surface of the rotating wafer W by moving the nozzle holding arm 84 into the cup instead of being retracted from the cup 73 so as to be positioned above the nozzle 73.
The cleaning process of scanning the nozzle holding arm 84 in the X direction is performed while discharging high-speed jet cleaning water or cleaning water to which ultrasonic waves are applied. However, the brush 7
It is not necessary to perform both scrub cleaning using 6a and 76b and cleaning using the cleaning liquid discharge nozzle 83.

After the cleaning process is completed, the nozzle holding arm 84 is retracted out of the cup 73, and the wafer W is rotated at a predetermined number of revolutions, thereby spin-drying off the cleaning liquid attached to the wafer W. . It is preferable that a predetermined rinsing liquid is supplied to the surface of the rotating wafer W from the rinsing nozzles 86a and 86b to perform a rinsing process on the wafer W before the spin drying.

After the spin drying, the cup 73 is lowered,
Further, the vacuum suction mechanism of the spin chuck 71 is released.
Then, the opening / closing window 69 is opened, for example, the main wafer transfer arm 55 is inserted, and the wafer W is transferred to the main wafer transfer arm 55. The wafer W carried out of the scrub cleaning unit (SCR) 21c for surface cleaning in this manner is, for example,
One of the three hot plate units (H
P) The wafer is transferred to the inside of the cooling unit (COL) 16a and dried by the main wafer transfer arm 55 if necessary.
b and cooled, and the main wafer transfer arm 55
Is returned to.

Next, in order to clean the back surface of the wafer W, it is necessary to invert the wafer W so that the back surface is on the upper surface.
Is transferred to the lower wafer reversing unit (RVS) 14b, and the wafer W is transferred to the support table 31. The support table 31 on which the wafer W is placed is moved up to a position where the wafer holding arms 36a and 36b are on standby by driving the elevating mechanism 27 and the wafer holding arms 36a and 36b are opened.
6b is closed. When the wafer W is in the wafer holding arm 36a
The sensor 48 confirms that the wafer W has been gripped by the sensor 48, and then lowers the support table 31 to a position where the reversing operation of the wafer W is not hindered.
Is rotated 180 ° by the rotation drive mechanism 30. With the back surface of the wafer W facing up, the support 31
Is raised to a position where the wafer W can be delivered and the wafer gripping arms 36a and 36b are opened, the wafer W is mounted on the support table 31 again.

The support table 31 is lowered, and for example, the main wafer transfer arm 55 is inserted into the wafer reversing unit (RVS) 14b, and the wafer W is transferred to the main wafer transfer arm 55. The main wafer transfer arm 55 cleans the wafer W, the back surface of which is the top surface, with the scrub cleaning unit (SCR) 21a.
・ Transport to either one of 21b. In the scrub cleaning units (SCR) 21a and 21b, the spin chuck 7
The cleaning process is performed using the same method as that using the above-described scrub cleaning unit (SCR) 21c for surface cleaning, except that the wafer W is held / released by using the above-described detaching mechanism 71d as 1. Will be

Since the cleaning process on both the front and back surfaces has been completed in this way, and the dried wafer W is in a state in which the back surface is on the upper surface, the wafer W is returned to the carrier C so that the front surface of the wafer W is on the upper surface. Needs to be inverted. Therefore, next, the wafer W is transferred to the main wafer transfer arm 55, for example.
Is transferred to the upper wafer reversing unit (RVS) 14b using the Upper stage wafer reversing unit (RVS) 14
b, the lower wafer reversing unit (R
VS) The wafer W is turned upside down by the same operation as the inversion operation in 14b. In this way, the wafer W is returned to, for example, the main wafer transfer arm 55 with the surface of the wafer W facing up.

The main wafer transfer arm 5
The wafer W held by the wafer transfer unit 5 is transported to the upper wafer transfer unit (TRS) 14a, and further from the wafer transfer unit (TRS) 14a to the wafer holding arm 13a.
Transported into the wafer transport unit 5 by the carrier C
It is housed in a predetermined position inside. Such a single wafer W
Processing of all wafers W accommodated in the carrier C
Is completed, the carrier C containing the wafer W is sent to the next step.

In the above-described processing steps, the same main wafer transfer arm 55 has always been used in the transfer step of one wafer W in the cleaning processing unit 3. , Main wafer transfer arm 55
It is possible to select an unused one of the 57 and use it.

Although the cleaning apparatus of the present invention has been described above, the present invention is not limited to the above embodiment. For example, the number of carriers C that can be disposed on the mounting table 11 may be four or more, or conversely, two or less. Although only one wafer transfer mechanism 13 is provided, two or more wafer transfer mechanisms 13 may be used. Further, the substrate is not limited to a semiconductor wafer, but may be used for a glass substrate, a CD substrate, or the like.

[0090]

As described above, according to the cleaning apparatus of the present invention, the scrub cleaning unit is provided in multiple stages,
Even when the substrate to be processed becomes large, the increase in the footprint can be suppressed to a minimum. This facilitates installation in existing clean rooms,
Even when the clean room needs to be renovated or expanded, the installation cost of the cleaning apparatus is reduced because the space for disposing the cleaning apparatus is small. Further, by using the scrub cleaning unit separately for the front surface cleaning and the back surface cleaning, the quality of the substrate can be further improved. Furthermore, in addition to a plurality of scrub cleaning units, a plurality of units of the same type, such as a delivery unit, a reversing unit, and a heating / cooling unit, which perform other processing, can easily reduce the throughput. It is. Furthermore, the present invention has various effects, for example, by properly using these plural units in accordance with the processing steps, it is possible to reduce the adhesion of particles to the substrate and to keep the quality of the substrate high.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a cleaning apparatus according to the present invention.

FIG. 2 is a side view of the cleaning apparatus shown in FIG. 1;

FIG. 3 shows a delivery / reversal unit, a main wafer transfer mechanism, and a heating /
Sectional drawing which shows the arrangement form of a cooling unit.

FIG. 4 shows a filter fan unit (FF) shown in FIG.
Explanatory drawing which showed the flow of the down flow from U).

FIG. 5 is a plan view showing a schematic structure of a wafer reversing unit (RVS).

FIG. 6 is a side view showing a schematic structure of a wafer reversing unit (RVS).

FIG. 7 is an explanatory diagram showing an X-direction opening / closing mechanism of a wafer gripping arm.

FIG. 8 is a plan view showing a schematic structure of a scrub cleaning unit (SCR).

FIG. 9 is a sectional view showing a schematic structure of a scrub cleaning unit (SCR).

DESCRIPTION OF SYMBOLS 1; cleaning processing apparatus 2; loading / unloading section 3: cleaning processing section 4: in / out port 5; wafer transport section 13; wafer transport mechanism 14; delivery / reversal section 14a; wafer delivery unit 14b; Reversing unit 15; Main wafer transfer mechanism (PRA) 16; Heating / cooling units 21a to 21d; Scrub cleaning unit 22; Filter fan unit 26; Wafer relay unit 27; Lifting mechanism 28; Wafer reversing mechanism 55 to 57; Main wafer transfer Arms 67a, 67b; brush 71; spin chuck 73; cup W; semiconductor wafer (substrate) C; carrier (substrate container)

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B08B 3/12 B08B 3/12 C 7/04 7/04 A H01L 21/68 H01L 21/68 A F term (Reference) 3B116 AA03 AB23 AB27 AB34 AB47 BA02 BA13 BA33 BB22 BB44 CC01 CC03 3B201 AA03 AB24 AB27 AB34 AB47 BA02 BA13 BA33 BB22 BB44 BB92 CB25 CC01 CC13 5F031 CA02 CA05 FA01 FA02 FA11 FA12 FA15 FA21 HA13 HA23 MA02 MA06

Claims (13)

[Claims] 1. A cleaning apparatus for performing a predetermined cleaning process on a substrate, comprising: a plurality of scrub cleaning units stacked and arranged in a plurality of stages; and a substrate transporter capable of accessing all of the plurality of scrub cleaning units. A cleaning treatment device comprising: a mechanism. 2. A cleaning processing apparatus for performing a predetermined cleaning processing on a substrate, comprising: a cleaning processing unit having a plurality of scrub cleaning units stacked and arranged in multiple stages; A cleaning apparatus, comprising: a substrate loading / unloading section for loading / unloading; and a substrate transport mechanism capable of accessing all of the plurality of scrub cleaning units. 3. A cleaning apparatus for performing a predetermined cleaning process on a substrate, comprising: a cleaning processing unit having a plurality of processing units for performing a predetermined processing on the substrate; A substrate loading / unloading unit, wherein the cleaning processing unit comprises: a plurality of scrub cleaning units disposed at least in upper and lower two stages; a substrate reversing unit for reversing the front and back of the substrate; and the substrate loading / unloading unit. A substrate transfer unit for temporarily placing the substrate to transfer the substrate to and from a substrate transfer unit that can access all of the units and transfer the substrate to and from each unit A cleaning treatment device comprising: a mechanism. 4. The cleaning apparatus according to claim 3, wherein two or more of the substrate delivery units are stacked and disposed. 5. The cleaning apparatus according to claim 3, wherein two or more of the substrate reversing units are stacked and disposed. 6. The apparatus according to claim 3, wherein two or more substrate reversing units are stacked and disposed on two or more substrate transfer units stacked and disposed. The cleaning treatment apparatus according to any one of claims 5 to 13. 7. The substrate reversing unit includes: a substrate relay unit that transfers a substrate to and from the substrate transfer mechanism; an elevating mechanism that moves the substrate relay unit up and down; and a substrate held by the substrate relay unit. Hold and receive,
The cleaning apparatus according to any one of claims 3 to 6, further comprising: a substrate reversing mechanism that reverses the substrate held by rotation and transfers the substrate to the substrate relay unit. 8. A filter fan unit for down-flowing clean air is provided above the cleaning unit,
The substrate delivery unit and the substrate reversing unit are disposed in contact with the substrate carrying-in / out portion, and a part of the downflow of the clean air is transferred from the space for disposing the substrate transfer mechanism to the substrate delivery unit. The cleaning apparatus according to any one of claims 3 to 7, wherein the cleaning apparatus has a structure of flowing out to the substrate loading / unloading section through a unit. 9. The cleaning apparatus according to claim 3, wherein two scrub cleaning units are arranged in an upper stage and a lower stage, respectively. 10. The scrub cleaning unit disposed in the upper stage is used for cleaning the front surface of the substrate, and the scrub cleaning unit disposed in the lower stage is used for cleaning the back surface of the substrate. The cleaning treatment device according to any one of items 3 to 9. 11. The scrub cleaning unit for cleaning the front surface of the substrate uses a vacuum suction mechanism for a chuck for holding the substrate, and the scrub cleaning unit for cleaning the back surface of the substrate holds the substrate. The cleaning apparatus according to claim 10, wherein a mechanical holding mechanism is used for the chuck. 12. A filter fan unit for down-flowing clean air is provided at an upper portion of the cleaning section, and a part of the clean air is directly provided from the filter fan unit to the lower stage through a pipe. The cleaning apparatus according to any one of claims 8 to 11, wherein air is blown to the provided scrub processing unit via a filter unit provided above the lower scrubber cleaning unit. . 13. The cleaning apparatus according to claim 1, wherein a heating / cooling unit is provided in the cleaning section.