CN105301473A - Electronic component carrying device and electronic component testing device - Google Patents
Electronic component carrying device and electronic component testing device Download PDFInfo
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- CN105301473A CN105301473A CN201510142209.6A CN201510142209A CN105301473A CN 105301473 A CN105301473 A CN 105301473A CN 201510142209 A CN201510142209 A CN 201510142209A CN 105301473 A CN105301473 A CN 105301473A
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- pattern
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- cooling
- heater block
- temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
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- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Control Of Temperature (AREA)
Abstract
The present invention provides an electronic component carrying device and an electronic component testing device. The electronic component carrying device comprises a cooling and heating component and an operation part, wherein the cooling and heating component can configure electronic components and can cool or heat at least one of the electronic components; the operation part can stop the first motion mode for cooling for the cooling and heating component and can stop selection between cooling of the cooling and heating component and the second motion mode for heating the cooling and heating component; the cooling and heating component is provided with a carrying part and at least one side for configuring the configuration part of the electronic components; and the carrying part can carrying the electronic components.
Description
Technical field
The present invention relates to electronic component conveying device and electronic component inspection device.
Background technology
In the past, being such as known to the electronic component inspection device that the electrical specification of the electronic units such as IC device is checked, being provided with the electronic component conveying device of the maintaining part for IC device being carried to inspection portion in this electronic component inspection device.When carrying out the inspection of IC device, by IC cell configuration in maintaining part, and make to be arranged at multiple probe of maintaining part and each termination contact of IC device.
Exist and IC device is cooled to set point of temperature to carry out the situation of the inspection of such IC device.In this case, cool IC device by cooling the arrangement components of configuration IC device, and not produce condensation, the mode of icing (freezing) makes the humidity (humidity in device) of the surrounding atmosphere of above-mentioned arrangement components reduce.
In addition, in electronic component conveying device, in action, such as producing the situation of jam, arrangement components produces condensation, the situation of freezing is inferior, need temporarily to stop the action of electronic component conveying device to eliminate jam or removing condensation, freeze.When producing jam, condensation, when to freeze etc., operator presses the action button of regulation, temporarily stops the action of electronic component conveying device, the operation that professional etiquette of going forward side by side is fixed.
In existing electronic component conveying device, if press aforesaid operations button, then stop action, and carry out following process.
First, electronic component conveying device stops the cooling of arrangement components, and starts the heating of arrangement components, and standby till becoming normal temperature.Thus, when arrangement components produce condensation, freeze, be removed.Then, electronic component conveying device, after the standby until oxygen concentration of inside becomes enough concentration, opens door lock.Operator opens door, and when produce condensation, freeze, confirm above-mentioned condensation, freeze be removed.In addition, operator, when producing jam, makes IC device move to suitable position.
For operator, if the end of job, then press action start button.Thus, for electronic component conveying device, as long as stop the heating of arrangement components and standby stipulated time and the humidity of inside fully reduce, just start the cooling of arrangement components.And electronic component conveying device, after the standby until temperature of arrangement components fully reduces, starts (restarting) action.
Patent documentation 1: Japanese Unexamined Patent Publication 11-111802 publication
But, in existing electronic component conveying device, if press the action button of afore mentioned rules, and though then when eliminate the situation of jam or remove condensation, icing, make the temperature of arrangement components be back to normal temperature without exception.When removing condensation, freezing, need the temperature making arrangement components to be back to normal temperature, but when eliminating jam, do not need to make the temperature of arrangement components be back to normal temperature.Therefore, in existing electronic component conveying device, when eliminating jam, need cost originally unwanted make the temperature of arrangement components be back to normal temperature till time, in addition, after the end of job, need the longer time that the temperature of arrangement components is cooled to set point of temperature.
In addition, in patent documentation 1, describe to the automatic running of substrate board treatment in automatically operating in self-braking situation restart relevant content, but above-mentioned existing problem cannot be solved in this patent documentation 1.
Summary of the invention
The object of the present invention is to provide when carrying out the operation specified, can shorten from cooling electronic components while the state performed an action to stopping action, restart the electronic component conveying device of time and electronic component inspection device.
The present invention is that it can realize as following mode or application examples in order to solve proposing at least partially of above-mentioned problem.
Application examples 1
The feature of electronic component conveying device of the present invention is to possess: cooling heater block, and it can configure electronic unit, and at least can cool or add any one of hankering; And operating portion, it can stop the first pattern of the cooling of above-mentioned cooling heater block and stop the cooling of above-mentioned cooling heater block and select between the second pattern heating above-mentioned cooling heater block.
Thus, temporarily limit is being stopped to carry out cooling the action of the electronic component conveying device that limit performs an action to cooling heater block, such as carry out in the situation of the operation of elimination jam, condensation or icing removing etc., if the situation etc. eliminating jam does not need situation about heating, then by selection first pattern, thus can shorten from limit to cooling heater block carry out cooling state that limit performs an action to stopping action, carry out operation and time restarting.
Application examples 2
In electronic component conveying device of the present invention, preferably, above-mentioned cooling heater block has the trucking department carrying above-mentioned electronic unit and at least one party configured in the configuration section of above-mentioned electronic unit.
Thus, in trucking department, configuration section, such as when carry out eliminating the operation of jam, condensation or icing removing etc., if the situation etc. eliminating jam does not need situation about heating, then by selection first pattern, thus can shorten the state that performs an action from limit cooling trucking department, configuration section limit to stopping action, carry out operation and time restarting.
Application examples 3
In electronic component conveying device of the present invention, preferably, above-mentioned first pattern is selected when above-mentioned electronic unit is not configured at the position of regulation.
Thus, when electronic unit is not configured at the position of regulation, when carrying out this electronic unit to be configured at the operation of the position of regulation, can shorten from limit to cooling heater block carry out cooling the state that performs an action of limit to stopping action, carry out operation and time restarting.
Application examples 4
In electronic component conveying device of the present invention, preferably, above-mentioned first pattern is selected when adjusting the parts of the inside being configured at above-mentioned electronic component conveying device.
Thus, when adjusting the parts of the inside being configured at electronic component conveying device, can shorten from limit to cooling heater block carry out cooling the state that performs an action of limit to stopping action, carry out operation and time restarting.
Application examples 5
In electronic component conveying device of the present invention, preferably, above-mentioned second pattern is selected when above-mentioned cooling heater block condenses or freeze.
Thus, by selecting the second pattern, condensation can be removed, freeze.
Application examples 6
In electronic component conveying device of the present invention, preferably, in above-mentioned second pattern, heat the energy of above-mentioned cooling heater block when above-mentioned cooling heater block freezes, larger than the energy heating above-mentioned cooling heater block when above-mentioned cooling heater block condenses.
Thereby, it is possible to removing condensation is efficiently with icing.
Application examples 7
In electronic component conveying device of the present invention, preferably, aforesaid operations portion is had touch panel and can be carried out by this touch panel for selecting the display of above-mentioned first pattern and above-mentioned second pattern and for selecting the input of above-mentioned first pattern and above-mentioned second pattern.
Thereby, it is possible to easily select the first pattern and the second pattern.
Application examples 8
In electronic component conveying device of the present invention, preferably, aforesaid operations portion has: display part, and it can carry out the display for selecting above-mentioned first pattern and above-mentioned second pattern; And input part, it can carry out the input for selecting above-mentioned first pattern and above-mentioned second pattern.
Thereby, it is possible to easily select the first pattern and the second pattern.
Application examples 9
In electronic component conveying device of the present invention, preferably, for selecting the display position of above-mentioned first pattern ratio for selecting the display position of above-mentioned second pattern more by above vertical.
Thereby, it is possible to easily and the first pattern that promptly choice for use frequency is high.
Application examples 10
The feature of electronic component inspection device of the present invention is to possess: cooling heater block, and it can configure electronic unit, and at least can cool or add any one of hankering; Operating portion, it can stop the first pattern of the cooling of above-mentioned cooling heater block and stop the cooling of above-mentioned cooling heater block and select between the second pattern heating above-mentioned cooling heater block; And inspection portion, it checks above-mentioned electronic unit.
Thus, temporarily limit is being stopped to carry out cooling the action of the electronic component inspection device that limit performs an action to cooling heater block, such as carry out in the situation of the operation of elimination jam, condensation or icing removing etc., when the situation etc. for eliminating jam does not need situation about heating, select the first pattern, thus can shorten from limit to cooling heater block carry out cooling the state that performs an action of limit to stopping action, carry out operation and time restarting.
Application examples 11
In electronic component inspection device of the present invention, preferably, above-mentioned cooling heater block have the trucking department carrying above-mentioned electronic unit, the configuration section configuring above-mentioned electronic unit, keep when checking above-mentioned electronic unit the maintaining part of above-mentioned electronic unit and above-mentioned electronic unit is abutted with above-mentioned maintaining part abutting part at least one.
Thus, in trucking department, configuration section, maintaining part, abutting part, such as when carry out eliminating the operation of jam, condensation or icing removing etc., when the situation etc. for eliminating jam does not need situation about heating, select the first pattern, thus can shorten the state that performs an action from limit cooling trucking department, configuration section, maintaining part, abutting part limit to stopping action, carry out operation and time restarting.
Accompanying drawing explanation
Fig. 1 is the approximate vertical view of the embodiment representing electronic component inspection device of the present invention.
Fig. 2 is the block diagram of the electronic component inspection device shown in Fig. 1.
Fig. 3 is the figure of the display frame of the display part representing the electronic component inspection device shown in Fig. 1.
Fig. 4 is the process flow diagram of the control action representing the electronic component inspection device shown in Fig. 1.
Fig. 5 is the process flow diagram of the control action representing the electronic component inspection device shown in Fig. 1.
Fig. 6 is the process flow diagram of the control action representing the electronic component inspection device shown in Fig. 1.
Embodiment
Below, shown with reference to the accompanying drawings embodiment is described in detail electronic component conveying device of the present invention and electronic component inspection device.
Embodiment
Fig. 1 is the approximate vertical view of the embodiment representing electronic component inspection device of the present invention.Fig. 2 is the block diagram of the electronic component inspection device shown in Fig. 1.Fig. 3 is the figure of the display frame of the display part representing the electronic component inspection device shown in Fig. 1.Fig. 4 ~ Fig. 6 is the process flow diagram of the control action representing the electronic component inspection device shown in Fig. 1 respectively.
In addition, below, for convenience of explanation, as shown in Figure 1,3 mutually orthogonal axles are set to X-axis, Y-axis and Z axis.In addition, the XY planar shaped comprising X-axis and Y-axis becomes level, and Z axis is formed as vertical.In addition, also the direction parallel with X-axis is called " X-direction ", also the direction parallel with Y-axis is called " Y-direction ", also the direction parallel with Z axis is called " Z-direction ".In addition, the direction of the arrow of each axle of X-axis, Y-axis and Z axis is called positive side, the direction contrary with arrow is called minus side.In addition, also by the upstream side in the carrying direction of electronic unit referred to as " upstream side ", also by downstream referred to as " downstream ".In addition, said in present specification " level " is not limited to level completely, only otherwise hinder the carrying of electronic unit, just also comprises relative to level (such as less than the degree of 5 °) state of tilting a little.
Testing fixture (electronic component inspection device) 1 shown in Fig. 1 is such as the device for carrying out check test (hereinafter referred to as " inspection ") to the electrical specification of the electronic units such as IC device, LCD (LiquidCrystalDisplay: liquid crystal display), CIS (CMOSImageSensor:CMOS imageing sensor) such as BGA (Ballgridarray: ball grid array) encapsulation or LGA (Landgridarray: grid array) encapsulation.In addition, below, for convenience of explanation, typically the situation using IC device as the above-mentioned electronic unit checked is described, and it is called " IC device 90 ".
As shown in Figure 1, testing fixture 1 is divided into pallet supply area A1, device supply area (hereinafter referred to as " supply area ") A2, inspection area A3, device recovery zone (hereinafter referred to as " recovery zone ") A4 and pallet removing region A5.And IC device 90 removes region A5 successively through above-mentioned each region from pallet supply area A1 to pallet, and check at the inspection area A3 of midway.Like this, testing fixture 1 possesses: in each region, carry IC device 90 and have the electronic component conveying device of control part 80; The inspection portion 16 checked is carried out in the A3 of inspection area; And not shown inspection control part.In addition, in testing fixture 1, by the Structure composing electronic component conveying device except inspection portion 16 and inspection control part.
Pallet supply area A1 is the region that supply is arranged with the pallet 200 of multiple IC devices 90 of the state of inspection.In the A1 of pallet supply area, can stacked multiple pallet 200.
Supply area A2 is the region multiple IC devices 90 on the pallet 200 from pallet supply area A1 being supplied to respectively inspection area A3.In addition, in the mode across pallet supply area A1 and supply area A2, tray conveying mechanism 11A, 11B of transportation tray 200 singly is provided with.
At supply area A2, be provided with the temperature adjustment part (immersion plate) 12 of the configuration section as configuration IC device 90, device carrying head (handling article) 13 and tray conveying mechanism 15.
Temperature adjustment part 12 is that multiple IC device 90 is heated or cooled, thus this IC device 90 is adjusted (control) to the device being suitable for the temperature checked.That is, temperature adjustment part 12 is the cooling heater blocks that can configure IC device 90 and can carry out the cooling of this IC device 90 and at least one party of heating.In the construction shown in fig. 1, configure along Y-direction, be fixed with two temperature adjustment parts 12.And the IC device 90 moved into the pallet 200 of (carrying out) from pallet supply area A1 by tray conveying mechanism 11A is handled upside down and is placed in one of them temperature adjustment part 12.
Device carrying 13 is supported to and can moves in the A2 of supply area.Thus, device carrying 13 can be responsible for the carrying of the carrying of IC device 90 between the pallet 200 moved into from pallet supply area A1 and temperature adjustment part 12 and the IC device 90 between temperature adjustment part 12 and aftermentioned device supply unit 14.In addition, device carrying 13 has the multiple handle parts (not shown) holding IC device 90, and each handle part possesses adsorption nozzle, and is held by absorption IC device 90.
Tray conveying mechanism 15 is the mechanisms of being carried in X direction by the pallet 200 of the sky under the state eliminating all IC devices 90.And after this carrying, empty pallet 200 is back to pallet supply area A1 by tray conveying mechanism 11B from supply area A2.
Inspection area A3 is the region checking IC device 90.In the A3 of this inspection area, be provided with the device supply unit (supply shuttle) 14 of the electronic unit trucking department as carrying IC device 90, inspection portion 16, device carrying head (abutting part) 17 and device recoverer (recovery shuttle) 18.
Device supply unit 14 is devices that the IC device 90 after temperature is adjusted (temperature control) is carried near inspection portion 16.This device supply unit 14 is supported to and can moves in X direction between supply area A2 and inspection area A3.In addition, in the construction shown in fig. 1, be configured with two device supply units 14 along Y-direction, the IC device 90 on temperature adjustment part 12 is handled upside down and is placed in one of them device supply unit 14.In addition, in device supply unit 14, identically with temperature adjustment part 12, IC device 90 can be heated or cool, thus this IC device 90 is adjusted to the temperature being suitable for checking.That is, device supply unit 14 to configure IC device 90, and can carry out the cooling heater block to the cooling of this IC device 90 and at least one party of heating.
Inspection portion 16 is the unit electrical specification of IC device 90 being carried out to check test, is namely the maintaining part keeping this IC device 90 when checking IC device 90.In inspection portion 16, be provided with the multiple probes be electrically connected with the terminal of this IC device 90 under the state keeping IC device 90.And the terminal of IC device 90 is electrically connected with probe (contact), and carries out the inspection of IC device 90 via probe.The inspection of IC device 90 is carried out according to the program of the storage part being stored in the inspection control part that the not shown tester that is connected with inspection portion 16 possesses.In addition, in inspection portion 16, identically with temperature adjustment part 12, IC device 90 can be heated or cool, thus this IC device 90 is adjusted to the temperature being suitable for checking.That is, inspection portion 16 to configure IC device 90, and can carry out the cooling heater block to the cooling of this IC device 90 and at least one party of heating.
Device carrying 17 is supported to and can moves in the A3 of inspection area.Thus, the IC device 90 on the device supply unit 14 moved into from supply area A2 can be carried and be placed on inspection portion 16 by device carrying 17.In addition, when checking IC device 90, IC device 90 presses to inspection portion 16 by device carrying 17, thus, IC device 90 is abutted with inspection portion 16.Thus, as mentioned above, the probe of the terminal of IC device 90 with inspection portion 16 is electrically connected.In addition, device carrying 17 has the multiple handle parts (not shown) holding IC device 90, and each handle part possesses adsorption nozzle, and is held by absorption IC device 90.In addition, in device carrying 17, identically with temperature adjustment part 12, IC device 90 can be heated or cool, thus IC device 90 is adjusted to the temperature being suitable for inspection.That is, device carrying 17 to configure IC device 90, and can carry out the cooling heater block to the cooling of this IC device 90 and at least one party of heating.
Device recoverer 18 is devices that the IC device 90 inspection in inspection portion 16 terminated is carried to recovery zone A4.This device recoverer 18 is supported to and can moves in X direction between inspection area A3 and recovery zone A4.In addition, in the construction shown in fig. 1, device recoverer 18 is configured with two identically with device supply unit 14 in the Y direction, and the IC device 90 on inspection portion 16 is handled upside down and is placed in one of them device recoverer 18.Carry 17 by device and carry out this carrying.
Recovery zone A4 reclaims the region checking the IC device 90 terminated.In the A4 of this recovery zone, be provided with recovery pallet 19, device carrying head (handling article) 20 and tray conveying mechanism 21.In addition, the pallet 200 of having time also is prepared at recovery zone A4.
Recovery pallet 19 is fixed in the A4 of recovery zone, in the construction shown in fig. 1, is configured with three recovery pallets 19 in X direction.In addition, empty pallet 200 is also configured with three in X direction.And the IC device 90 moved on the device recoverer 18 of recovery zone A4 is handled upside down and is placed in the pallet 200 of above-mentioned recovery pallet 19 and sky.Thus, reclaim IC device 90 for each check result and classify.
Device carrying 20 is supported to and can moves in the A4 of recovery zone.Thus, device carrying 20 can by IC device 90 from device recoverer 18 to recovery pallet 19, empty pallet 200 carries.In addition, device carrying 20 has the multiple handle parts (not shown) holding IC device 90, and each handle part possesses adsorption nozzle, and is held by absorption IC device 90.
Tray conveying mechanism 21 is the mechanisms of being carried in X direction by the pallet 200 of the sky moved into from pallet removing region A5.And, after this carrying, the pallet 200 of sky can be configured at the position of reclaiming IC device 90, that is, become in above-mentioned three empty pallets 200.
Pallet removing region A5 reclaims and removes the region of pallet 200 of the multiple IC devices 90 be arranged with under the complete state of inspection.In pallet removing region A5, can stacked multiple pallet 200.
In addition, to remove the mode of region A5 across recovery zone A4 and pallet, tray conveying mechanism 22A, 22B of transportation tray 200 is singly provided with.By being placed with, tray conveying mechanism 22A checks that the pallet 200 of complete IC device 90 remove the mechanism of region A5 carrying from recovery zone A4 to pallet.Tray conveying mechanism 22B is the mechanism of being carried from pallet removing region A5 to recovery zone A4 by the pallet 200 being used for the sky reclaiming IC device 90.
The inspection control part of above-mentioned tester, such as according to the program being stored in not shown storage part, is configured the inspection etc. of the electrical specification of the IC device 90 in inspection portion 16.
In addition, control part 80 such as controls the driving in each portion of the first tray conveying mechanism 11A, the second tray conveying mechanism 11B, temperature adjustment part 12, first device carrying 13, device supply unit 14, the 3rd tray conveying mechanism 15, inspection portion 16, second device carrying 17, device recoverer 18, the 3rd device carrying the 20, the 6th tray conveying mechanism 21, the 4th tray conveying mechanism 22A and the 5th tray conveying mechanism 22B.
In addition, testing fixture 1 is configured to, and the gas (hereinafter also referred to as dry gas) such as air, nitrogen that humidity is low can be made to flow (can supply) in each portion of regulation.When IC device 90 is cooled to set point of temperature to check, the required each portion of cooling correspondingly, but by making dry gas in required each portion flowing, condensation can be prevented, freeze (freezing).In addition, in the present embodiment, make dry gas in temperature adjustment part 12, device supply unit 14, inspection portion 16 and device recoverer 18 flow.
In addition, as mentioned above, in the present embodiment, contact as IC device 90, and the cooling heater block that can carry out the cooling of this IC device 90 and at least one party of heating, be provided with temperature adjustment part 12, device supply unit 14, inspection portion 16 and device carrying 17, but in the following description, be described for representative with the situation that temperature adjustment part 12 is cooling heater blocks, at device supply unit 14, when inspection portion 16 and device carrying 17 are cooling heater blocks, identical with the situation of temperature adjustment part 12 separately, therefore the description thereof will be omitted.
In addition, as shown in Figure 2, testing fixture 1 has: the temperature sensor 41 of detected temperatures; Detect the humidity sensor 42 of humidity; Detect the oxygen concentration sensor 43 of oxygen concentration; The heating arrangements 51 of heating-up temperature adjustment part 12; The cooling body 52 of chilling temperature adjustment part 12; To the dry gas feed mechanism 53 of the position supply dry gas of the regulation of the inside of testing fixture 1; And carry out the operating portion 6 of each operation of testing fixture 1.Temperature sensor 41, humidity sensor 42 and oxygen concentration sensor 43 lay respectively at the position of the regulation of the inside of testing fixture 1, utilize said temperature sensor 41, humidity sensor 42 and oxygen concentration sensor 43, the temperature of the inside of testing fixture 1, humidity and oxygen concentration can be detected respectively.
In addition, operating portion 6 has the display part 62 of the input part 61 and display image carrying out each input.As input part 61, there is no particular limitation, such as, can enumerate keyboard, mouse etc.In addition, as display part 62, there is no particular limitation, such as, can enumerate display panels, organic EL display panel etc.In addition, part or all in each action button shown by display part 62 can be provided as the mechanical operation buttons such as press button.In addition, as operating portion 6, be not limited thereto, such as, can enumerate touch panel etc. and can carry out inputting and the device etc. of display of image.
In addition, as heating arrangements 51, there is no particular limitation, such as, can enumerate well heater etc.In addition, as cooling body 52, there is no particular limitation, such as, can enumerate and make cold-producing medium (such as, the gas of low temperature) carry out the device, Peltier element etc. that cool being configured at flowing in the body near cooling object.In addition, in the present embodiment, the device that cooling body 52 makes cold-producing medium be configured in the body near above-mentioned cooling object flowing and carry out cooling, and make the nitrogen gas of liquid nitrogen gasification as cold-producing medium.
In addition, for the dry gas that dry gas feed mechanism 53 uses, in the present embodiment, when being cooled by cooling body 52, it is the mixed gas of nitrogen gas after using in cooling body 52 and the low air of humidity, when stopping above-mentioned cooling, it is only the air that above-mentioned humidity is low.Therefore, the oxygen concentration of the inside of testing fixture 1 is lower when being cooled by cooling body 52, and if stop above-mentioned cooling, oxygen concentration increases.
This testing fixture 1 is configured to, as pattern (service mode), there is the first pattern (LN2 stop mode) and the second pattern (defrosting mode), and optionally can set above-mentioned first pattern and the second pattern.
First pattern and the second pattern be respectively when cooling IC device 90 to carry out the inspection of IC device 90, cool the temperature adjustment part (cooling heater block) 12 of testing fixture 1 and limit to the inside of testing fixture 1 carry out dehumidifying limit perform an action time, the action of testing fixture 1 is temporarily stopped, and the pattern set by when such as carrying out safeguarding the operation waiting regulation.For this first pattern and the second pattern, the input part 61 that operator (operator) can operate operating portion 6 is selected.
Such as, when produce jam thus carry out the operation eliminating this jam situation, be configured the adjustment of the parts of the regulation of the inside in testing fixture 1 situation etc., do not need to select the first pattern when making the temperature of temperature adjustment part 12 temporarily be back to normal temperature.
Above-mentioned jam such as refers to that IC device 90 is not configured at the position (suitable position) etc. of regulation.
In addition, as the adjustment of the parts of afore mentioned rules, such as, can enumerate and there is illuminating part and light receiver and to the adjustment etc. of hold (absorption affinity) of handle part whether being configured with the adjustment of position, posture, optical receiver sensitivity etc. of the optical sensor that IC device 90 detects, device carrying 13 in temperature adjustment part 12.
In this first pattern, although temporarily stop the cooling of the temperature adjustment part 12 of testing fixture 1, do not carry out making the temperature of temperature adjustment part 12 be back to the process of normal temperature.
In addition, such as, produce condensation in the inside of testing fixture 1, such as in temperature adjustment part 12, freeze (freezing) thus remove selection second pattern in this condensation, icing situation etc.In this second pattern, temporarily stop the cooling of the temperature adjustment part 12 of testing fixture 1, and the temperature adjustment part 12 of heating test device 1 and carry out making the temperature of this temperature adjustment part 12 temporarily be back to the process of normal temperature.Thus, remove above-mentioned condensation, freeze.
Next, the control action of testing fixture 1 is described.
In addition, in the present embodiment, such as operation inputting part 61, and cursor is moved to the position of each action button (icon) shown by display part 62 select (click) thus carry out the operation of operator to operating portion 6, but below, also this operation is called " pressing the operation button ".In addition, as mentioned above, be described for representative with the situation that temperature adjustment part 12 is cooling heater blocks, when device supply unit 14, inspection portion 16 and device carrying 17 is cooling heater blocks, identical with the situation of temperature adjustment part 12 separately, therefore the description thereof will be omitted.
As shown in Fig. 4 ~ Fig. 6, testing fixture 1 is by the control of control part 80, and lateral dominance cooling body 52 comes chilling temperature adjustment part 12, utilizes dry gas feed mechanism 53 to supply dry gas, while perform an action.In addition, the temperature t cooled by cooling body 52 is set to temperature t1.In addition, by the door locked of testing fixture 1.First, control part 80 judges whether in above-mentioned action, stop action (step S101).
For operator, as mentioned above, such as in generation jam thus carry out the situation of the operation eliminating this jam, the situation being configured the adjustment of the parts of the regulation of the inside in testing fixture 1, temperature adjustment part 12 produce condensation, freeze thus remove this condensation, icing situation is inferior, operator presses action stop button and temporarily stops the action of testing fixture 1.
In step S101, when above-mentioned action stop button is pressed, be judged as stopping action.
In addition, as mentioned above, the not shown optical sensor detecting IC device 90 is provided with in temperature adjustment part 12.Utilize this optical sensor to detect and carry the 13 IC devices 90 being carried to temperature adjustment part 12 from pallet 200 by device and whether be configured at temperature adjustment part 12.And, when above-mentioned IC device 90 not detected, being characterized as and creating jam, thus in step S101, be judged as stopping action.Like this, even if when operator does not press action stop button, also there is the situation being judged as stopping action.
In step S101, when being judged as stopping action, stop device carrying 13,17,20, device supply unit 14, device recoverer 18, tray conveying mechanism 11A, 11B, 15,21, the action (step S102) of 22A, 22B etc.Wherein, do not stop and the cooling proceeding the temperature adjustment part 12 performed by cooling body 52, the supply of dry gas that performed by dry gas feed mechanism 53.
Next, the image (step S103) shown in Fig. 3 is shown at display part 62.
Image shown in this Fig. 3 has the display for selecting the first pattern and the second pattern.Specifically, first, the upper left side in Fig. 3 of the picture 621 of display part 62 shows " in stopping ".In addition, in the rectangular frame 622 of the central portion of picture 621, show be recited as " LN2 stop mode " the first pattern select button 623, be recited as the second pattern select button 624 of " defrosting mode " and be recited as the cancel button 625 of " cancellation ".
If operation inputting part 61 is carried out inputting and pressed the first pattern select button 623, then select the first pattern, and pattern is set as the first pattern.
In addition, if operation inputting part 61 is carried out inputting and pressed the second pattern select button 624, then select the second pattern, and pattern is set as the second pattern.
In addition, if operation inputting part 61 carries out inputting and presses cancel button 625, then select to cancel, thus pattern is not set as any one in the first pattern and the second pattern, and make the image changing of display part 62 be do not show other images of any one in the first pattern select button 623, second pattern select button 624 and cancel button 625.
Here, the first pattern select button 623 and the second pattern select button 624 configure side by side in vertical (above-below direction in Fig. 3).In addition, the first pattern select button 623 is configured at than the second pattern select button 624 more by the position above vertical.That is, for selecting the display position of the first pattern ratio for selecting the display position of the second pattern more by above vertical.For the position of action button, top more easily operates compared with below vertical, in addition, first pattern is higher than the second pattern usage frequency, therefore by being configured at by the first pattern select button 623 than the second pattern select button 624 more by the position above vertical, the first pattern select button 623 of the first high pattern of the above-mentioned usage frequency of selection can easily and promptly be operated.
In addition, also the first pattern select button 623 can be shown more emphatically than the second pattern select button 624.Thereby, it is possible to easily and promptly grasp the position of the first pattern select button 623.As being highlighted, such as, can enumerating the situation of increased in size (size), improve the situation etc. of brightness.That is, the situation etc. the situation making the size of the first pattern select button 623 larger than the size of the second pattern select button 624 can enumerated and make the brightness of the brightness ratio second pattern select button 624 of the first pattern select button 623 high.
Next, judge whether to have selected the first pattern (step S104), when being judged as have selected the first pattern, pattern being set as the first pattern, and moving to step S107.
In addition, in step S104, when being judged as non-selected first pattern, judge whether to have selected the second pattern (step S105), when being judged as have selected the second pattern, pattern is set as the second pattern, and moves to step S120.
In addition, in step S105, when being judged as non-selected second pattern, judge whether to have selected cancellation (step S106), when being judged as have selected cancellation, pattern is not set as any one in the first pattern and the second pattern, and is the image of regulation by the image changing of display part 62, and move to following step.In addition, the explanation of following action is omitted.
In addition, in step s 106, when being judged as non-selected cancellation, get back to step S104, and again perform the process of below step S104.
When pattern is set to the first pattern, first stops the driving of cooling body 52, and stop the cooling (step S107) of temperature adjustment part 12.Thus, the dry gas supplied by dry gas feed mechanism 53 only becomes the low air of humidity, and the oxygen concentration of the inside of testing fixture 1 increases.
Next, utilize oxygen concentration sensor 43 to detect the oxygen concentration a (step S108) of the inside of testing fixture 1, and judge oxygen concentration a whether more than threshold alpha (step S109), when being judged as that oxygen concentration a is not more than threshold alpha, get back to step S108, and again perform the process of below step S108.
In addition, in step S109, when being judged as that oxygen concentration a is more than threshold alpha, unlock the door (step S110) of testing fixture 1.Thus, eliminate the anaerobic condition of the inside of testing fixture 1, thus the operation of its inside can be carried out.Operator opens door and to go forward side by side the fixed operation of professional etiquette.In addition, operator presses action start button after the end of job.
In addition, there is no particular limitation for threshold alpha, suitably can set according to each condition, but be preferably set in the scope of more than 16%, less than 20%, is more preferably set in the scope of more than 17%, less than 19%.Next, judge whether to press action start button (step S111), when being judged as pressing action start button, utilize temperature sensor 41 to detect current temperature (step S112), and utilize humidity sensor 42 to detect current humidity RH (step S113).
Next, relative humidity RHS (step S114) is obtained.
There is no particular limitation for the computing method of the relative humidity RHS in step S114, such as, can enumerate following method.
First, to use following (formula 1), and according to the humidity RH detected in the temperature detected in step S112 and step S113, the steam vapour amount M that the current gas of the inside of arithmetic check device 1 comprises.
Steam vapour amount M=(the saturated steam amount MN of current temperature) × (humidity RH/100) ... (formula 1)
In addition, the saturated steam amount ML under saturated steam amount MN and set point of temperature t1 described later such as obtains according to the calibration curve of form, operational formula etc. of the storage part being pre-stored within control part 80 respectively.
Next, the relative humidity RHS that following (formula 2) comes when computing is cooled to set point of temperature t1 is used.
Relative humidity RHS=(the saturated steam amount ML under steam vapour amount M/ set point of temperature t1) × 100 ... (formula 2)
In addition, in theory, when being cooled to afore mentioned rules temperature t1, if relative humidity RHS is 100%, then produces condensation, freeze, if relative humidity RHS is less than 100%, does not then produce condensation, freeze.
Next, judging relative humidity RHS whether below threshold value beta (step S115), when being judged as that relative humidity RHS is not below threshold value beta, getting back to step S112, and again perform the process of below step S112.
In addition, in step sl 15, when being judged as that relative humidity RHS is below threshold value beta, driving cooling body 52 and starting the cooling (step S116) of temperature adjustment part 12.Thereby, it is possible to prevent from producing condensation when being cooled to set point of temperature t1, freezing.
In addition, as long as threshold value beta does not produce condensation when being cooled to temperature t1, just there is no particular limitation for icing value, suitably can set according to each condition, but be preferably set to more than 50%, less than in the scope of 100%, more preferably be set in more than 80%, less than in the scope of 100%, be preferably set to further in the scope of more than 80%, less than 90%.
Next, utilize temperature sensor 41 to detect the temperature t (step S117) of the inside of testing fixture 1, and judge that whether temperature t is at temperature (threshold value) below t1 (step S118), when being judged as temperature t not at below temperature t1, get back to step S117, and again perform the process of below step S117.In addition, in this first pattern, the heating of the such temperature adjustment part 12 of aftermentioned second pattern is not carried out, therefore, it is possible to make temperature t shorter than the second pattern in the time of below temperature t1.
In addition, in step S118, when being judged as temperature t at below temperature t1, lock door, and start (restarting) device carrying 13,17,20, device supply unit 14, device recoverer 18, tray conveying mechanism 11A, 11B, 15,21, the action (step S119) of 22A, 22B etc., and move to following step.In addition, the explanation of following action is omitted.
Next, situation pattern being set to the second pattern is described, but omits the explanation of the item identical with above-mentioned first pattern.
When pattern is set to the second pattern, first stops the driving of cooling body 52, and stop the cooling (step S120) of temperature adjustment part 12.Thus, the dry gas supplied by dry gas feed mechanism 53 only becomes the low air of humidity, and the oxygen concentration of the inside of testing fixture 1 increases.
Next, drive heating arrangements 51, and start the heating (step S121) of temperature adjustment part 12.Thus, the temperature of the inside of testing fixture 1 also rises together with the temperature of temperature adjustment part 12.Thus, when temperature adjustment part 12 produce condensation, freeze, remove this condensation, freeze.
Here, the situation of preferably freezing according to situation and temperature adjustment part 12 generation of temperature adjustment part 12 generation condensation changes the energy of heating-up temperature adjustment part 12.That is, when preferably when temperature adjustment part 12 produces icing, energy Ratios temperature adjustment part 12 generation of heating-up temperature adjustment part 12 condenses, the energy of heating-up temperature adjustment part 12 is large.Thereby, it is possible to removing condensation is efficiently with icing.
Next, utilize oxygen concentration sensor 43 to detect the oxygen concentration a (step S122) of the inside of testing fixture 1, and judge oxygen concentration a whether more than threshold alpha (step S123), when being judged as that oxygen concentration a is not more than threshold alpha, get back to step S122, and again perform the process of below step S122.
In addition, in step S123, when being judged as that oxygen concentration a is more than threshold alpha, utilize temperature sensor 41 to detect the temperature t (step S124) of the inside of testing fixture 1.Thus, eliminate the anaerobic condition of the inside of testing fixture 1, thus the operation of its inside can be carried out.
Next, judge that whether temperature t is at temperature (threshold value) more than t2 (step S125), when being judged as temperature t not at more than temperature t2, gets back to step S124, and again perform the process of below step S124.
In addition, in step s 125, when being judged as temperature t at more than temperature t2, the door (step S126) of testing fixture 1 is unlocked.Operator opens door and the operation put rules into practice.In addition, operator when temperature adjustment part 12 produce condensation, freeze, confirm this condensation, freeze be removed.Operator, after the end of job, presses action start button.
In addition, there is no particular limitation for temperature t2, suitably can set according to each condition, but be preferably set in the scope of more than 25 DEG C, less than 35 DEG C, is more preferably set in the scope of more than 27 DEG C, less than 33 DEG C.
Next, judge whether to press action start button (step S127), when being judged as pressing action start button, stopping the driving of heating arrangements 51, and stopping the heating (step S128) of temperature adjustment part 12.
Next, utilize temperature sensor 41 to detect current temperature (step S129), and utilize humidity sensor 42 to detect current humidity RH (step S130), thus obtain relative humidity RHS (step S131).In addition, there is no particular limitation for the computing method of the relative humidity RHS in step S131, such as identical with above-mentioned steps S114.
Next, judging relative humidity RHS whether below threshold value beta (step S132), when being judged as that relative humidity RHS is not below threshold value beta, getting back to step S129, and again perform the process of below step S129.
In addition, in step S132, when being judged as that relative humidity RHS is below threshold value beta, driving cooling body 52, and starting the cooling (step S133) of temperature adjustment part 12.Thereby, it is possible to prevent from producing condensation when being cooled to set point of temperature t1, freezing.
Next, utilize temperature sensor 41 to detect the temperature t (step S134) of the inside of testing fixture 1, and judge that whether temperature t is at temperature (threshold value) below t1 (step S135), when being judged as temperature t not at below temperature t1, get back to step S134, and again perform the process of below step S134.
In addition, in step S135, when being judged as temperature t at below temperature t1, lock door, and start (restarting) device carrying 13,17,20, device supply unit 14, device recoverer 18, tray conveying mechanism 11A, 11B, 15,21, the action (step S136) of 22A, 22B etc., and move to following step.In addition, the explanation of following action is omitted.
As described above, according to this testing fixture 1, in the action of the testing fixture 1 temporarily stopping limit, chilling temperature adjustment part 12, limit to perform an action, and such as carry out the operation eliminating jam, be configured at the adjustment of the parts of the regulation of the inside of testing fixture 1, in the situations such as condensation or icing removing, when the operation for carrying out elimination jam, when the situation etc. of adjustment of the parts of regulation does not need situation about heating, select the first pattern, thus the state that performs an action from limit, chilling temperature adjustment part 12, limit can be shortened to stopping action, carry out operation, and the time till restarting.
Above, be illustrated, but the present invention is not limited thereto according to illustrated embodiment to electronic component conveying device of the present invention and electronic component inspection device, the structure in each portion can be replaced into the arbitrary structure with identical function.In addition, other arbitrary works can also be added.
In addition, in the above-described embodiment, cooling heater block in electronic component inspection device is temperature adjustment part 12, device supply unit 14, inspection portion 16 and device carrying 17, such as, but being not limited thereto in the present invention, also can be or two or three in temperature adjustment part 12, device supply unit 14, inspection portion 16 and device carrying 17.
The explanation of Reference numeral
1... testing fixture (electronic component inspection device); 11A, 11B... tray conveying mechanism; 12... temperature adjustment part (soaking plate (soakplate)); 13... device carrying head; 14... device supply unit (supply shuttle); 15... tray conveying mechanism; 16... inspection portion; 17... device carrying head; 18... device recoverer (recovery shuttle); 19... recovery pallet; 20... device carrying head; 21... tray conveying mechanism; 22A, 22B... tray conveying mechanism; 41... temperature sensor; 42... humidity sensor; 43... oxygen concentration sensor; 51... heating arrangements; 52... cooling body; 53... dry gas feed mechanism; 6... operating portion; 61... input part; 62... display part; 621... picture; 622... frame; 623... the first pattern select button; 624... the second pattern select button; 625... cancel button; 80... control part; 90...IC device; 200... pallet; A1... pallet supply area; A2... device supply area (supply area); A3... inspection area; A4... device recovery zone (recovery zone); A5... pallet removing region; S101 ~ S136... step.
Claims (11)
1. an electronic component conveying device, is characterized in that, possesses:
Cooling heater block, it can configure electronic unit, and at least can cool or add any one of hankering; And
Operating portion, it can stop the first pattern of the cooling of described cooling heater block and stop the cooling of described cooling heater block and select between the second pattern heating described cooling heater block.
2. electronic component conveying device according to claim 1, is characterized in that,
Described cooling heater block has the trucking department carrying described electronic unit and at least one party configured in the configuration section of described electronic unit.
3. electronic component conveying device according to claim 1 and 2, is characterized in that,
Described first pattern is selected when described electronic unit is not configured at the position of regulation.
4. the electronic component conveying device according to any one of claims 1 to 3, is characterized in that,
Described first pattern is selected when adjusting the parts of the inside being configured at described electronic component conveying device.
5. the electronic component conveying device according to any one of Claims 1 to 4, is characterized in that,
Described second pattern is selected when described cooling heater block condenses or freeze.
6. the electronic component conveying device according to any one of Claims 1 to 5, is characterized in that,
In described second pattern, heat the energy of described cooling heater block when described cooling heater block freezes, larger than the energy heating described cooling heater block when described cooling heater block condenses.
7. the electronic component conveying device according to any one of claim 1 ~ 6, is characterized in that,
Described operating portion has touch panel, can be carried out for selecting the display of described first pattern and described second pattern and for selecting the input of described first pattern and described second pattern by this touch panel.
8. the electronic component conveying device according to any one of claim 1 ~ 6, is characterized in that,
Described operating portion has:
Display part, it can carry out the display for selecting described first pattern and described second pattern; And
Input part, it can carry out the input for selecting described first pattern and described second pattern.
9. the electronic component conveying device according to claim 7 or 8, is characterized in that,
For selecting the display position of described first pattern ratio for selecting the display position of described second pattern more by above vertical.
10. an electronic component inspection device, is characterized in that, possesses:
Cooling heater block, it can configure electronic unit, and at least can cool or add any one of hankering;
Operating portion, it can stop the first pattern of the cooling of described cooling heater block and stop the cooling of described cooling heater block and select between the second pattern heating described cooling heater block; And
Inspection portion, it checks described electronic unit.
11. electronic component inspection device according to claim 10, is characterized in that,
Described cooling heater block have the trucking department carrying described electronic unit, the configuration section configuring described electronic unit, keep when checking described electronic unit the maintaining part of described electronic unit and described electronic unit is abutted with described maintaining part abutting part at least one.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014146289A JP2016024511A (en) | 2014-07-16 | 2014-07-16 | Electronic component conveying apparatus and electronic component inspection apparatus |
| JP2014-146289 | 2014-07-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105301473A true CN105301473A (en) | 2016-02-03 |
| CN105301473B CN105301473B (en) | 2018-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510142209.6A Expired - Fee Related CN105301473B (en) | 2014-07-16 | 2015-03-27 | Electronic component conveying device and electronic component inspection device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016024511A (en) |
| KR (1) | KR101680844B1 (en) |
| CN (1) | CN105301473B (en) |
| TW (2) | TWI603091B (en) |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2915969B2 (en) | 1990-07-06 | 1999-07-05 | 株式会社アドバンテスト | Constant temperature bath for IC testing |
| US5909657A (en) * | 1996-06-04 | 1999-06-01 | Advantest Corporation | Semiconductor device testing apparatus |
| JPH11111802A (en) | 1997-10-03 | 1999-04-23 | Kokusai Electric Co Ltd | Device and method for stopping and restarting automatic operation |
| JP4037962B2 (en) * | 1998-06-24 | 2008-01-23 | 株式会社アドバンテスト | Parts testing equipment |
| JP4789125B2 (en) * | 2000-12-07 | 2011-10-12 | 株式会社アドバンテスト | Electronic component test socket and electronic component test apparatus using the same |
| US6678517B2 (en) * | 2001-06-21 | 2004-01-13 | Spatial Wireless, Inc. | Method and system for providing continuous voice and packet data services to a mobile station |
| JP4119104B2 (en) * | 2001-07-12 | 2008-07-16 | 株式会社アドバンテスト | Pusher with heater, electronic component handling apparatus, and electronic component temperature control method |
| JP2004273967A (en) | 2003-03-12 | 2004-09-30 | Sumitomo Heavy Ind Ltd | Chamber temperature control system |
| JP4377276B2 (en) * | 2004-04-09 | 2009-12-02 | 富士通株式会社 | Semiconductor test equipment with condensation removal |
| US8359906B2 (en) * | 2008-07-22 | 2013-01-29 | Espec Corp. | Environment testing apparatus capable of controlling condensation amount, and control method therefor |
| US20120060758A1 (en) * | 2011-03-24 | 2012-03-15 | Primestar Solar, Inc. | Dynamic system for variable heating or cooling of linearly conveyed substrates |
| JP5161335B2 (en) * | 2011-04-06 | 2013-03-13 | 中外炉工業株式会社 | Substrate transport apparatus and substrate processing apparatus provided with the same |
| CN202305712U (en) * | 2011-11-09 | 2012-07-04 | 高见泽电脑科技股份有限公司 | Temperature testing device |
| JP5936853B2 (en) * | 2011-12-05 | 2016-06-22 | 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ | Substrate processing apparatus and substrate processing method |
| JP5874427B2 (en) * | 2012-02-14 | 2016-03-02 | セイコーエプソン株式会社 | Parts inspection device and handler |
| JP6001961B2 (en) * | 2012-08-29 | 2016-10-05 | 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ | Substrate processing apparatus and substrate processing method |
| JP2014224785A (en) * | 2013-05-17 | 2014-12-04 | セイコーエプソン株式会社 | Handler and test device |
| JP2014228297A (en) * | 2013-05-20 | 2014-12-08 | セイコーエプソン株式会社 | Handler and inspection device |
| JP6331271B2 (en) * | 2013-06-10 | 2018-05-30 | セイコーエプソン株式会社 | Electronic component pressing unit, electronic component transport device, and electronic component inspection device |
-
2014
- 2014-07-16 JP JP2014146289A patent/JP2016024511A/en active Pending
-
2015
- 2015-01-30 KR KR1020150014811A patent/KR101680844B1/en active IP Right Grant
- 2015-03-27 CN CN201510142209.6A patent/CN105301473B/en not_active Expired - Fee Related
- 2015-07-13 TW TW106104965A patent/TWI603091B/en not_active IP Right Cessation
- 2015-07-13 TW TW104122622A patent/TWI577995B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201604552A (en) | 2016-02-01 |
| TWI577995B (en) | 2017-04-11 |
| KR20160009483A (en) | 2016-01-26 |
| CN105301473B (en) | 2018-04-27 |
| TW201732300A (en) | 2017-09-16 |
| KR101680844B1 (en) | 2016-11-29 |
| JP2016024511A (en) | 2016-02-08 |
| TWI603091B (en) | 2017-10-21 |
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