KR100950333B1 - Supporting apparatus for testing electronic device and sorting method of tested electronic device - Google Patents

Abstract

The present invention relates to an electronic component inspection support apparatus and a method for classifying an electronic component that has been tested.

According to the present invention, a technique for detecting a temperature of an electronic component under test and classifying the electronic component into a retest quantity when the detected temperature is out of a required temperature range is disclosed.

Test handler, tester, semiconductor, temperature

Description

SUPPORTING APPARATUS FOR TESTING ELECTRONIC DEVICE AND SORTING METHOD OF TESTED ELECTRONIC DEVICE}

The present invention relates to an electronic component inspection support apparatus and a method for classifying an electronic component that has been tested.

In general, a test system for testing an electronic component such as a semiconductor device is composed of a tester and an electronic component inspection support device (hereinafter, referred to as an 'inspection support device') for electrically connecting the electronic component to the tester.

The tester has a test socket electrically connected to the electronic component, and performs a test of the electronic component electrically connected to the test socket.

The inspection support apparatus is an automated device for supporting the test of the electronic component by the tester, and allows a plurality of electronic components to be connected to the tester at the same time so that the test of the plurality of electronic components can be performed at the same time. Such inspection support apparatus is already known through the Republic of Korea Patent Registration No. 10-0709114 (name of the invention: test handler).

FIG. 1 is a conceptual plan view illustrating a state in which the test support apparatus 110 and the tester 210 are coupled, and the test support apparatus 110 and the tester 210 will be described in more detail with reference to the drawing.

The inspection support apparatus 110, as referred to in the plan view of Figure 1, the loading device 111, the test chamber 112, the unloading device 113, the control device 114 and the temperature control device (not shown) And the like.

The loading device 111 loads an electronic component into a carrier board (CB, mainly referred to as a 'test tray') at the loading position LP.

The test chamber 112 accommodates the carrier board CB that has been transferred after the loading is completed by the loading device 111, and the temperature according to the test conditions required for the electronic components loaded on the received carrier board CB is required. The internal environment can be created to have.

The unloading apparatus 113 unloads the electronic component loaded on the carrier board CB, which has been transferred from the test chamber 112 to the unloading position UP.

The controller 114 controls the unloading apparatus 113 to classify and unload the tested electronic component by test grade.

The thermostat creates a temperature environment inside the test chamber under the control of the controller. At this time, low temperature gas (at low temperature test) or high temperature air (at high temperature test) may be used to control the temperature inside the test chamber.

The tester 210 has a plurality of test sockets 211 electrically connected to a plurality of electronic components supplied from the inspection support apparatus 110, respectively.

For reference, reference numeral C of FIG. 1 is a circulation path of the carrier board CB.

On the other hand, since electronic components can be used in various temperature environments, the produced electronic components must be tested at low temperature, room temperature, and high temperature. Therefore, as described above, the temperature composition of the test chamber 112 is required.

The development of the manufacturing process of the electronic component has enabled the high speed and high integration of the electronic component. Accordingly, the self-heating of the electronic component is greatly generated during the test, and thus the electronic component is tested in a state outside the required temperature range. There is a probability that the reliability of the test will be degraded.

Therefore, the Republic of Korea Patent Publication No. 10-2000-0035699 (Invention name: electronic component test device, hereinafter referred to as 'prior art 1'), Publication No. 2000-0052440 (Invention name: Electronic part test device, Hereinafter, a technique has been proposed according to 'Prior Art 2') and Publication No. 10-2000-0071368 (Invention name: Electronic Component Testing Device and Electronic Component Testing Method, hereinafter 'Prior Art 3').

According to the prior art 1, a technique is disclosed in which a temperature sensor detects a temperature of an IC chip and then removes self-heating through a cooling device. According to the prior art 2, a temperature sensor detects an ambient temperature around the IC chip and a temperature is detected. The technique of blowing control air directly to the periphery of the IC chip is disclosed. According to the prior art 3, the temperature control air is directly detected after detecting the temperature of the IC under test by using a temperature sensitive device made inside the IC under test. A technique for blowing around the IC under test is disclosed.

On the other hand, an electronic component such as a semiconductor device is simultaneously tested while a plurality of carrier boards (256, 512, etc.) are loaded at the same time, and at this time, not all points in the test chamber are at the same temperature. As a result, temperature variations exist for a plurality of electronic components.

 However, according to the above-described prior arts 1 to 3, when the cooling device is operated to adjust the temperature of some electronic components out of the temperature range required by various situations to the required temperature, the other electronics are adjusted within the currently required temperature range. There is a high probability that the components will be affected, causing the temperature of other electronic components to deviate from the required temperature range. And this can cause a drop in the reliability of another test.

Of course, the temperature can be controlled for each electronic component, but to do so requires means to control the temperature for the number of electronic components being tested at the same time, which increases the cost of the device and complicates the design. However, according to the technology of supplying temperature-controlled air around a specific electronic component, there is no choice but to affect adjacent electronic components, which makes it difficult to commercialize.

An object of the present invention is to provide a technique for classifying an electronic component tested out of a required temperature range into a quantity of REEST.

Electronic component inspection support apparatus according to the present invention for achieving the above object, a loading device for loading an electronic component into a carrier board; A test chamber in which a temperature environment required for testing an electronic component loaded on a carrier board by the loading device in a temperature environment according to a required test condition can be established; An unloading apparatus for classifying the electronic components, which have been tested on the test chamber, by unclassified test classes, and unloading them from a carrier board; And receiving the temperature information of the electronic component to be tested on the test chamber, and if the temperature of the electronic component is tested in a state within the required temperature range, classify the test class according to the test grade and unload the temperature. A control device for controlling the unloading device to be unloaded by classifying a retest when the test is performed out of range; Characterized in that it comprises a.

When a plurality of electronic components are loaded into a carrier board, the control device obtains temperature information of each of the plurality of electronic components, and classifies and unloads each of the plurality of electronic components by test grade or unloads them by retest quantity. Another feature is the control of the unloading device.

In addition, the classification method of the electronic component is tested according to the present invention for achieving the above object, A) step of detecting the temperature of the electronic component to be tested on the test chamber; Determining whether the temperature of the electronic component detected in step A) is being tested in a state within a required temperature range; And if it is determined in step B) that the temperature of the electronic component has been tested in a state within the required temperature range, the classification is made by test grade, and if it is determined in step B) that the temperature of the electronic component is tested outside the required temperature range, C) step of classifying the electronic components into the REEST (retest) quantity; Characterized in that it comprises a.

When a plurality of electronic components are tested at the same time in the classification method, step A) detects a temperature of each of the plurality of electronic components, and step B) determines whether a temperature of each of the plurality of electronic components is within a required temperature range. Determining, step C) is another feature that is performed for each of a plurality of electronic components.

Step A includes: A1) detecting a temperature of a test socket on a tester side electrically connected to the electronic component; And A2) calculating a temperature of an electronic component electrically connected to the test socket from the temperature of the test socket sensed in step A1). It includes a more specific feature to include.

In addition, the classification method of the electronic component is a test according to the present invention for achieving the above object, A) detecting the temperature of the test socket on the tester side electrically connected to the electronic component to be tested on the test chamber; Determining whether the test of the electronic component is performed in a state in which the temperature of the test socket sensed in step A) is within a required temperature range; And if it is determined that the electronic component electrically connected to the test socket has been tested within the temperature range in which the temperature of the test socket is required in step B), classify the electronic component by test grade and then, in step B), the temperature of the test socket. Step C) of classifying the electronic component into a retest (RETEST) quantity when it is determined that the electronic component electrically connected to the test socket has been tested out of the required temperature range; Characterized in that it comprises a.

According to the present invention, the electronic components tested in the required temperature range are classified by test grade, and the electronic components tested out of the proper temperature range are classified as retest quantities so that a separate configuration other than the temperature sensor may be added. Since there is no need to increase the cost of the device or difficulty in designing, there is no difficulty in commercialization, and there is an effect that the reliability of the test can be significantly improved compared to the prior arts 1 to 3.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the present invention will be described in more detail, for the sake of brevity of description the description overlapping with the background.

2 is a plan view of the inspection support apparatus 120 according to an embodiment of the present invention.

As shown in FIG. 2, the inspection support apparatus 120 according to the present embodiment includes a loading apparatus 121, a test chamber 122, an unloading apparatus 123, a control apparatus 124, a temperature control apparatus, and the like. It is configured to include.

The loading device 121 serves to load a plurality of electronic components into the carrier board CB at the loading position LP.

The test chamber 122 accommodates the carrier board CB transferred after the loading is completed by the loading apparatus 121, and the temperature according to the test conditions required for the electronic components loaded on the accommodated carrier board CB is required. The internal environment can be created to have.

The unloading device 123 unloads the electronic component loaded on the carrier board CB transferred from the test chamber 122 to the unloading position UP.

The controller 124 controls the unloading device 123 to classify the tested electronic components by test grade and to unload them. In addition, the controller 124 controls the unloading device 123 to classify the electronic component as a retest quantity when the tested electronic component is tested in a state outside the required temperature range.

The tester 220 may include a plurality of test sockets 221 electrically connected to a plurality of electronic components supplied from the test support apparatus 120, and a plurality of temperature sensors for sensing temperatures of the respective test sockets 221. Has 222.

Of course, in the present embodiment, the tester 220 is provided with a temperature sensor 222, but the present invention is not limited thereto, and the test support apparatus may be provided with a temperature sensor. However, the test socket is fixed, so it is easy to install a temperature sensor to detect its temperature.However, when the inspection support device is equipped with a temperature sensor for indirectly detecting the temperature of the electronic component, The design needs to be elaborate.

Subsequently, a description will be given of a method for classifying electronic components in which a test made in a test system to which the inspection support apparatus 120 is applied is performed.

<First example>

1. Temperature detection of test socket <S301>

Each temperature sensor 222 senses the temperature of each test socket 221 corresponding to each temperature sensor 222.

2. Calculate the temperature of electronic components <S302>

The temperature of the electronic component electrically connected to the test socket 221 is calculated from the sensed temperature of the test socket 221. To this end, it is necessary to database the correlation between the temperature of the test socket 221 and the temperature of the electronic component connected to the test socket 221 at various temperature conditions in advance.

In addition, the process may be implemented to be performed in the tester 220 or may be implemented to be performed in the test support apparatus 120.

In this embodiment, the temperature of the electronic component is indirectly detected by sensing the temperature of the test socket 221. However, as described above, the temperature of the electronic component may be directly considered.

3. Judgment <S303>

Determine if the temperature of the electronic component is being tested within the required temperature range. Similarly, this process may be implemented at the tester 220 and the determination result may be implemented to be notified to the control device 124 or may be implemented at the control device 124.

4. Classification <S304>

If it is determined in step S303 that the electronic component has been tested in the state where the temperature of the electronic component is within the required temperature range, the control device 124 controls the unloading device 123 to classify the electronic component by the test class by a general classification method. If it is determined that the electronic component has been tested in a state in which the temperature of the electronic component is out of the required temperature range in step S303, the control apparatus 124 controls the unloading apparatus 123 to the retest rod. It classifies <S304b> and unloads.

Here, the technology related to the retest may be referred to in Patent Registration No. 10-0792488 (name of the invention: test support method of test handler and test handler).

On the other hand, since a plurality of electronic components such as semiconductor devices are simultaneously tested at the same time, in such a case, in steps S301 to S303, the temperature of each of the plurality of electronic components is sensed and calculated, and each of the plurality of electronic components is required according to the result. It is determined whether it is being tested in a state within the temperature range, and steps S304a and S304b are performed for each of the plurality of electronic components.

In other words, when some electronic components are tested within the proper temperature range and some electronic components are tested outside the proper temperature range, some of the electronic components are classified by general test class. Some other electronic components are classified as retest quantities.

<Second example>

1. Temperature detection of test socket <S401>

Each temperature sensor 222 senses the temperature of each test socket 221 corresponding to each temperature sensor 222.

2. Judgment <S402>

It is determined whether the test of the electronic component is performed in the state where the temperature of the test socket 221 is within the required temperature range. Similarly, this process may be implemented at the tester 220 and the determination result may be implemented to be notified to the control device 124 or may be implemented at the control device 124.

3. Classification <S403>

If it is determined in step S402 that the electronic component has been tested in the state where the temperature of the test socket 221 is within the required temperature range, the control device 124 controls the unloading device 123 to test the electronic component by a general classification method. If it is determined that the electronic component has been tested in a state in which the temperature of the test socket 221 is out of the required temperature range in step S402, the controller 124 removes the unloading device 123. The control is classified as a retest lot and unloaded.

This second example is preferable when it is not necessary to calculate the temperature of the electronic component from the temperature of the test socket 221 because the thermal correlation between the test socket and the electronic component can be obtained in advance through a test database. Can be applied.

In addition, since the temperature of the test socket 221 may affect the electrical circuit of the tester 220 at the rear end of the test socket 221 and affect its operation, the test socket 221 as well as the temperature during the test of the electronic component. The temperature itself may also be important, and in this case, it may be desirable to classify the electronic component that has been tested by the classification method as in the second example.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings. However, since the above-described embodiments have only been described with reference to the preferred examples of the present invention, the present invention is limited to the above embodiments. It should not be understood to be limited, and the scope of the present invention should be understood as the following claims and equivalent concepts.

1 is a conceptual plan view of a main part of a general electronic component test system.

2 is a conceptual plan view of an electronic component inspection support apparatus according to an exemplary embodiment of the present invention.

3 is a flowchart illustrating a classification method of an electronic component that has been tested according to a first example of the present invention.

4 is a flowchart illustrating a method for classifying electronic components subjected to testing according to a second example of the zone invention.

* Description of the code for the main parts of the drawings *

120: inspection support device

121: loading device

122: test chamber

123: unloading device

124: controller

Claims (5)

A loading device for loading a plurality of electronic components into a carrier board; A test chamber in which a temperature environment required for testing a plurality of electronic components loaded on a carrier board by the loading device in a temperature environment according to a required test condition can be created; An unloading apparatus for unloading a plurality of electronic components tested in the test chamber according to test grades and unloading them from a carrier board; And Receive temperature information of each of the electronic components tested in the test chamber, and when the temperature of each electronic component is tested in a state within the required temperature range, classify them by test grade and unload them. A control device for controlling the unloading device to classify the unloading into a retest (RETEST) quantity when the temperature of the test is out of a required temperature range; Characterized in that it comprises Electronic component inspection support device. A) detecting the temperature of the electronic component to be tested in the test chamber; Determining whether the temperature of the electronic component detected in step A) is being tested in a state within a required temperature range; And If it is determined in step B) that the temperature of the electronic component is tested in a state within the required temperature range, it is classified by test grade and if it is determined in step B) that the temperature of the electronic component is tested outside the required temperature range, the electronic C) classifying the parts in the quantity of retest (retest); Characterized in that it comprises Classification of electronic components tested. The method of claim 2, If multiple electronic components are tested at the same time, Step A) detects a temperature of each of the plurality of electronic components, Step B) determines whether the temperature of each of the plurality of electronic components is within the required temperature range, Step C) is performed for each of the plurality of electronic components Classification of electronic components tested. The method of claim 3, Step A includes: A1) detecting a temperature of a test socket on a tester side electrically connected to the electronic component; And A2) calculating the temperature of the electronic component electrically connected to the test socket from the temperature of the test socket detected in the step A1); Characterized in that it comprises Classification of electronic components tested. A) detecting the temperature of the test socket on the tester side electrically connected to the electronic component to be tested in the test chamber; B) determining whether the electronic component is being tested while the temperature of the test socket detected in step A) is within a required temperature range; And If it is determined in step B) that the electronic component electrically connected to the test socket has been tested within the temperature range in which the temperature of the test socket is required, the electronic component is classified according to a test grade and the temperature of the test socket is determined in step B). If it is determined that the electronic component electrically connected to the test socket has been tested outside the required temperature range, classifying the electronic component into a quantity of retest (RETEST); Characterized in that it comprises Classification of electronic components tested.

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