CN106908711A - A kind of high/low temperature test device for being applied to IC tests - Google Patents
A kind of high/low temperature test device for being applied to IC tests Download PDFInfo
- Publication number
- CN106908711A CN106908711A CN201710066043.3A CN201710066043A CN106908711A CN 106908711 A CN106908711 A CN 106908711A CN 201710066043 A CN201710066043 A CN 201710066043A CN 106908711 A CN106908711 A CN 106908711A
- Authority
- CN
- China
- Prior art keywords
- low temperature
- module
- monitoring module
- switch
- processor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
Abstract
The present invention relates to a kind of high/low temperature test device for being applied to IC tests, main solving can not carry out abnormal investigation and amendment when high-low temperature chamber is not turned on to single abnormal integrated circuit present in prior art, the power supply that can not will can not thoroughly correct or test the integrated circuit for completing disconnects, into the technical problem of silent status.The present invention is by including host computer, the hardware circuit being connected with host computer, the multiple IC being connected with the hardware circuit；The hardware circuit includes processor, the power module with the processor and downlink connection, current monitoring module, the test device of voltage monitoring module and switch module, preferably resolves the problem, can be used in the industrial production of IC.
Description
Technical field
The present invention relates to integrated circuit testing field, a kind of high/low temperature test device for being applied to IC tests is related specifically to
Method of work.
Background technology
Integrated circuit, abbreviation IC, before market is entered, it is necessary to carry out the electric performance test under different temperatures, to simulate
Integrated circuit temperature stress under various operating conditions, high temperature is typically in 120 DEG C, -40 DEG C of low temperature.High/low temperature test problem is
Old problem in integrated circuit detection work.
Existing high/low temperature method of testing is that signal transacting is carried out outside high-low temperature chamber after saying single integrated circuit line
With test.Existing high/low temperature test device and method can not be when high-low temperature chamber be not turned on to single abnormal integrated circuit
Abnormal investigation and amendment are carried out, the power supply that can not will can not thoroughly correct or test the integrated circuit for completing disconnects, and enters
Enter silent status.Therefore provide one kind just individually can carry out abnormal row high/low temperature test box is not turned on to some IC
Look into just necessary with the device of amendment.
The content of the invention
The present invention is must with when correcting to individually carrying out abnormal investigation to a certain abnormal IC present in solution prior art
The technical problem that high-low temperature chamber interrupts high/low temperature testing process must be opened.A kind of new high/low temperature for being applied to IC tests is provided to survey
Trial assembly is put, change high/low temperature test device have can be not turned on high/low temperature test box single IC can just be carried out abnormal investigation with
The characteristics of correcting, and IC can be controlled to enter thorough off-position.
In order to solve the above technical problems, the technical solution adopted by the present invention is as follows：
The high/low temperature test device includes host computer, and the hardware circuit being connected with host computer connects with the hardware circuit
The multiple IC for connecing；The hardware circuit includes processor, with the processor and the power module of downlink connection, current monitoring mould
Block, voltage monitoring module and switch module；
The host computer is used for control process device；
The processor is used to control the power module, current monitoring module, voltage monitoring module and switch module；
The power module is also connected with the voltage monitoring module and current detection module；
The current detection module is used to detect the operating current of IC；
The voltage monitoring module is used to detect the operating voltage of IC；
The temperature sensor is used to detect the operating temperature of IC；
The on-off circuit is used to control IC.
It is optimization, further, the power module, current monitoring module, voltage monitoring mould in above-mentioned technical proposal
Quantity of the quantity of block, temperature sensor and on-off circuit respectively with IC is identical.
Further, the on-off circuit includes the data channel switch being connected in parallel between processor and the IC,
Clock switch and reset switch.
The present invention also provide it is a kind of be applied to IC test high/low temperature test device method of work, methods described include with
Lower step：
(1) multiple IC are put into high-low temperature chamber, connecting test device and IC；
(2) host computer, the automatic test instruction of output are started；
(3) switch in the test device is initialized, switch is off-state；
(4) high/low temperature temperature, power-on module after temperature stabilization are detected；
(5) host computer downloads to multiple IC respectively, and processor receives the test information of each IC printings, while described
Voltage monitoring module works, and detects the output voltage of IC, normally then skips to step (8), preceding return to step (3) abnormal twice, the
Three times abnormal into step (6)；
(6) abnormal reparation is carried out, cycle detection type information normally then skips to step (5), the broken road is skipped to extremely
Power supply and all switches enter step (7)；
(7) select manually operated, it is manually operated to carry out list including sending command adapted thereto to the processor by host computer
Item debugging and test, processor stop processing the test information that remaining IC is printed；
(8) high/low temperature test terminates, and test data analysis are carried out with statistics by host computer.
It is optimization in above-mentioned technical proposal, further, in the step (6) repairing extremely includes the output current of IC
Amendment.
Further, the output current amendment includes the excessive amendment of electric current and the too small amendment of electric current.
Further, the excessive amendment of the electric current closes power module and switching molding at least twice, including by processor
Block, is then turned on power module.
Further, the electric current is too small corrects at least twice, including switch resets and corrects, the switch reset amendment bag
Include and reset switch is opened by processor.
Further, the too small amendment electrification reset amendment of the electric current, clock switch is opened after each electrification reset amendment,
The electrification reset amendment is included the shut-off of the power module carried out successively by processor and opens operation.
The present invention is analyzed by the type information to each IC, determines the working condition of IC, and to the work of each IC
Make voltage and operating current is detected, so as to investigate problem, be modified by corresponding reset measure after confirmation problem, from
And ensure that being not turned on high-low temperature chamber can carry out abnormal investigation and amendment to single IC.
Beneficial effects of the present invention,
Effect one, can cut off all pin connections of IC, IC is mourned in silence；
Effect two, can be not turned on high-low temperature chamber and IC is investigated and corrected；
Effect three, reduces the cost of IC high/low temperatures experiment；
Effect four, reduces the IC damages that IC power-off does not cause thoroughly.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
The block diagram of Fig. 1 high/low temperature test devices of the present invention.
The flow chart of work methods of Fig. 2 high/low temperature test devices of the present invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
Fig. 1 clearly illustrates the block diagram of high/low temperature test device of the present invention, and as can be seen from Figure 1 high/low temperature is surveyed
Included part and annexation is put in trial assembly.
The method of work of Fig. 2 high/low temperature test devices of the present invention, Fig. 2 detailed work for describing high/low temperature test device
The step of method.
Embodiment 1
The present embodiment provides a kind of high/low temperature test device for being applied to IC tests, and the high/low temperature test device includes upper
Position machine, host computer is PC computers, the hardware circuit being connected with host computer, the multiple IC being connected with the hardware circuit；It is described hard
Part circuit includes processor, and processor is arm processor, with the processor and the power module of downlink connection, current monitoring mould
Block, voltage monitoring module and switch module；The host computer is connected and communicates with arm processor；The processor is used to control
The power module, current monitoring module, voltage monitoring module and switch module；The power module also with the voltage monitoring
Module and current detection module are connected；The voltage monitoring module is used to detect the operating voltage of IC；The current detection module
Operating current for detecting IC；The temperature sensor is used to detect the operating temperature of IC；The on-off circuit is used to control
IC。
The quantity difference of the power module, current monitoring module, voltage monitoring module, temperature sensor and on-off circuit
Quantity with IC is identical.The on-off circuit includes the data channel switch being connected in parallel between processor and the IC, when
Clock is switched and reset switch.
The present embodiment also provides a kind of method of work of the high/low temperature test device for being applied to IC tests, and methods described includes
Following steps：
(1) multiple IC are put into high-low temperature chamber, connecting test device and IC；
(2) host computer, the automatic test instruction of output are started；
(3) switch in the test device is initialized, switch is off-state；
(4) high/low temperature temperature, power-on module after temperature stabilization are detected；
(5) host computer downloads to multiple IC respectively, and processor receives the test information of each IC printings, while described
Voltage monitoring module works, and detects the output Pin voltages of IC, normally then skips to step (8), first 2 times abnormal return to step (3),
3rd time abnormal into step (6)；
(6) abnormal reparation is carried out, the operating current size of exception IC is detected by current monitoring module first, it is bigger than normal, enter
The excessive amendment of row electric current, including closing switch module and power module, then reopen power module, electric current is excessive correct into
Row 2 times, cycle detection type information is carried out after the excessive amendment of every primary current, is checked whether and is corrected successfully；
Electric current is less than normal, carries out the too small amendment of electric current, including open reset switch to carry out switch reset amendment, is followed after amendment
Ring detection type information is checked whether to be corrected successfully, switch reset amendment 2 times, and switch carries out cycle detection after resetting and correcting every time
Type information, checks whether and corrects successfully；Failed then by power module shut-off carries out 2 electrification resets with operation is opened
Amendment, opens clock switch and starts printing letter after receiving clock signal to IC clock signals, IC after each electrification reset amendment
Breath, the information to printing detects, checks whether and correct successfully.
Above-mentioned amendment is failed, then processor disconnects the power supply of abnormal IC and switch module, into step (7)；
(7) selection is operated manually, manually operated to enter including sending command adapted thereto to the processor by host computer
Row test；Manual test can again write test code to IC, can carry out single-step debug.Now, other normal IC continue not
The printmessage for stopping is left intact to processor, processor to these message.
(8) high/low temperature test terminates, and test data analysis are carried out by host computer.
Embodiment 2
The present embodiment further illustrates the optimization of amendment switch reset times of revision, step (6) on the basis of embodiment 1
It is as follows：
Abnormal reparation is carried out, the operating current size of exception IC is detected by current monitoring module first, it is bigger than normal, carry out
The excessive amendment of electric current, including closing switch module and power module, then reopen power module, and the excessive amendment of electric current is carried out
3 times, cycle detection type information is carried out after the excessive amendment of every primary current, check whether and correct successfully；
Electric current is less than normal, carries out the too small amendment of electric current, including open reset switch to carry out switch reset amendment, is followed after amendment
Ring detection type information is checked whether to be corrected successfully, switch reset amendment 3 times, and switch carries out cycle detection after resetting and correcting every time
Type information, checks whether and corrects successfully；Failed then by power module shut-off carries out 3 electrification resets with operation is opened
Amendment, opens clock switch and starts printing letter after receiving clock signal to IC clock signals, IC after each electrification reset amendment
Breath, the information to printing detects, checks whether and correct successfully.
Embodiment 3
The present embodiment further illustrates the optimization of amendment switch reset times of revision, step (6) on the basis of embodiment 1
It is as follows：
Abnormal reparation is carried out, the operating current size of exception IC is detected by current monitoring module first, it is bigger than normal, carry out
The excessive amendment of electric current, including closing switch module and power module, then reopen power module, and the excessive amendment of electric current is carried out
5 times, cycle detection type information is carried out after the excessive amendment of every primary current, check whether and correct successfully；
Electric current is less than normal, carries out the too small amendment of electric current, including open reset switch to carry out switch reset amendment, is followed after amendment
Ring detection type information is checked whether to be corrected successfully, switch reset amendment 5 times, and switch carries out cycle detection after resetting and correcting every time
Type information, checks whether and corrects successfully；Failed then by power module shut-off carries out 5 electrification resets with operation is opened
Amendment, opens clock switch and starts printing letter after receiving clock signal to IC clock signals, IC after each electrification reset amendment
Breath, the information to printing detects, checks whether and correct successfully.
Although being described to illustrative specific embodiment of the invention above, in order to the technology of the art
Personnel are it will be appreciated that the present invention, but the present invention is not limited only to the scope of specific embodiment, to the common skill of the art
For art personnel, as long as long as various change is in appended claim restriction and the spirit and scope of the invention for determining, one
The innovation and creation using present inventive concept are cut in the row of protection.
Claims (3)
- It is 1. a kind of to be applied to the high/low temperature test device that IC is tested, it is characterised in that：The high/low temperature test device includes upper Machine, the hardware circuit being connected with host computer, the multiple IC being connected with the hardware circuit；The hardware circuit includes processor, The power module being connected in parallel with the processor, current monitoring module, voltage monitoring module and switch module；The host computer is connected and communicates with processor；The processor is used to control power module, current monitoring module, voltage monitoring module and switch module；The power module is also connected with the voltage monitoring module and current detection module；The voltage monitoring module is used to detect the operating voltage of IC；The current detection module is used to detect the operating current of IC；The temperature sensor is used to detect the operating temperature of IC；The on-off circuit is used to control IC.
- It is 2. a kind of according to claim 1 to be applied to the high/low temperature test device that IC is tested, it is characterised in that：The power supply mould Quantity of the quantity of block, current monitoring module, voltage monitoring module, temperature sensor and on-off circuit respectively with IC is identical.
- 3. it is according to claim 1 or claim 2 it is a kind of be applied to IC test high/low temperature test device, it is characterised in that：It is described to open Powered-down road includes being connected in parallel in the data channel switch of processor, clock switch and reset switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710066043.3A CN106908711A (en) | 2017-02-06 | 2017-02-06 | A kind of high/low temperature test device for being applied to IC tests |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710066043.3A CN106908711A (en) | 2017-02-06 | 2017-02-06 | A kind of high/low temperature test device for being applied to IC tests |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106908711A true CN106908711A (en) | 2017-06-30 |
Family
ID=59207561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710066043.3A Pending CN106908711A (en) | 2017-02-06 | 2017-02-06 | A kind of high/low temperature test device for being applied to IC tests |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106908711A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108152704A (en) * | 2017-12-08 | 2018-06-12 | 宁波芯路通讯科技有限公司 | A kind of integrated circuit high/low temperature test device |
| CN108983680A (en) * | 2018-08-23 | 2018-12-11 | 河南东贵电子科技有限公司 | A kind of automation on-off controller |
| CN109406833A (en) * | 2017-08-18 | 2019-03-01 | 泰克元有限公司 | Processor for testing electronic element |
| CN109596973A (en) * | 2018-12-29 | 2019-04-09 | 北京智芯微电子科技有限公司 | The test method of chip parameter under different temperatures |
| CN110297171A (en) * | 2019-06-14 | 2019-10-01 | 合肥格易集成电路有限公司 | A kind of the power consumption test system and equipment of chip |
| CN110932224A (en) * | 2019-12-16 | 2020-03-27 | 安徽博洽多闻智能电网科技有限公司 | Integrated microcomputer comprehensive protection measurement and control device with high interference resistance |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6329831B1 (en) * | 1997-08-08 | 2001-12-11 | Advanced Micro Devices, Inc. | Method and apparatus for reliability testing of integrated circuit structures and devices |
| CN101145988A (en) * | 2007-07-19 | 2008-03-19 | 中兴通讯股份有限公司 | A detection and recovery method for communication link failure |
| CN201532442U (en) * | 2009-11-23 | 2010-07-21 | 浪潮齐鲁软件产业有限公司 | Device for carrying out batch environment testing of restoring chips |
| CN102043119A (en) * | 2009-10-26 | 2011-05-04 | 中芯国际集成电路制造(上海)有限公司 | Burn-in testing method |
| CN102955083A (en) * | 2011-08-31 | 2013-03-06 | 北京中电华大电子设计有限责任公司 | Interference resistance test method and device for power-on resetting circuit of central processing unit (CPU) chip |
| US20140139246A1 (en) * | 2012-11-19 | 2014-05-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer Temperature Sensing Methods and Related Semiconductor Wafer |
| CN103913646A (en) * | 2012-12-28 | 2014-07-09 | 北京中电华大电子设计有限责任公司 | High/ low temperature test device for non-contact communication chip |
| CN106054058A (en) * | 2016-04-28 | 2016-10-26 | 芯海科技（深圳）股份有限公司 | System and method capable of performing testing and temperature control on multiple Sigma-Delta ADC chips |
| CN106371001A (en) * | 2016-09-27 | 2017-02-01 | 上海华岭集成电路技术股份有限公司 | Device and method for controlling test temperature of chip to be tested |
-
2017
- 2017-02-06 CN CN201710066043.3A patent/CN106908711A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6329831B1 (en) * | 1997-08-08 | 2001-12-11 | Advanced Micro Devices, Inc. | Method and apparatus for reliability testing of integrated circuit structures and devices |
| CN101145988A (en) * | 2007-07-19 | 2008-03-19 | 中兴通讯股份有限公司 | A detection and recovery method for communication link failure |
| CN102043119A (en) * | 2009-10-26 | 2011-05-04 | 中芯国际集成电路制造(上海)有限公司 | Burn-in testing method |
| CN201532442U (en) * | 2009-11-23 | 2010-07-21 | 浪潮齐鲁软件产业有限公司 | Device for carrying out batch environment testing of restoring chips |
| CN102955083A (en) * | 2011-08-31 | 2013-03-06 | 北京中电华大电子设计有限责任公司 | Interference resistance test method and device for power-on resetting circuit of central processing unit (CPU) chip |
| US20140139246A1 (en) * | 2012-11-19 | 2014-05-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer Temperature Sensing Methods and Related Semiconductor Wafer |
| CN103913646A (en) * | 2012-12-28 | 2014-07-09 | 北京中电华大电子设计有限责任公司 | High/ low temperature test device for non-contact communication chip |
| CN106054058A (en) * | 2016-04-28 | 2016-10-26 | 芯海科技（深圳）股份有限公司 | System and method capable of performing testing and temperature control on multiple Sigma-Delta ADC chips |
| CN106371001A (en) * | 2016-09-27 | 2017-02-01 | 上海华岭集成电路技术股份有限公司 | Device and method for controlling test temperature of chip to be tested |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109406833A (en) * | 2017-08-18 | 2019-03-01 | 泰克元有限公司 | Processor for testing electronic element |
| CN109406833B (en) * | 2017-08-18 | 2021-04-09 | 泰克元有限公司 | Processor for testing electronic components |
| CN108152704A (en) * | 2017-12-08 | 2018-06-12 | 宁波芯路通讯科技有限公司 | A kind of integrated circuit high/low temperature test device |
| CN108983680A (en) * | 2018-08-23 | 2018-12-11 | 河南东贵电子科技有限公司 | A kind of automation on-off controller |
| CN109596973A (en) * | 2018-12-29 | 2019-04-09 | 北京智芯微电子科技有限公司 | The test method of chip parameter under different temperatures |
| CN110297171A (en) * | 2019-06-14 | 2019-10-01 | 合肥格易集成电路有限公司 | A kind of the power consumption test system and equipment of chip |
| CN110297171B (en) * | 2019-06-14 | 2021-10-01 | 苏州福瑞思信息科技有限公司 | Power consumption test system and equipment of chip |
| CN110932224A (en) * | 2019-12-16 | 2020-03-27 | 安徽博洽多闻智能电网科技有限公司 | Integrated microcomputer comprehensive protection measurement and control device with high interference resistance |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106908711A (en) | A kind of high/low temperature test device for being applied to IC tests | |
| CN103149526B (en) | PCBA board test macro and method | |
| US10170070B2 (en) | Display apparatus with testing functions and driving circuit and driving method thereof | |
| US20080301497A1 (en) | Testing Apparatus, System, and Method for Testing at Least One Device with a Connection Interface | |
| US8423829B2 (en) | Failure analysis apparatus, method | |
| CN101561467A (en) | System and method for real-time impedance measuring | |
| TW202109298A (en) | Flash memory controller and method capable of efficiently reporting debug information to host device | |
| US5535330A (en) | System and method for error location in printed wire assemblies by external power on self test (post) commands | |
| CN106908712A (en) | A kind of high/low temperature method of testing for being applied to IC tests | |
| CN112025766A (en) | Robot system health checking and self-checking method and device and electronic equipment | |
| US5537331A (en) | Method of testing devices to be measured and testing system therefor | |
| KR100809598B1 (en) | Semiconductor test system being capable of virtual test and semiconductor test method thereof | |
| US5940413A (en) | Method for detecting operational errors in a tester for semiconductor devices | |
| JP5067266B2 (en) | Integrated circuit board with JTAG function | |
| US20070152732A1 (en) | Method and apparatus to detect electrical overstress of a device | |
| US9236144B2 (en) | For-test apparatuses and techniques | |
| KR100929867B1 (en) | Monitor burn-in system | |
| US7076376B1 (en) | System and method for calibrating weak write test mode (WWTM) | |
| JP2004163194A (en) | Ic tester and testing module | |
| KR100750396B1 (en) | All automatic return systems of semiconductor tester and the return method | |
| CN216749321U (en) | Dead pixel self-detection device and chip | |
| CN117031241A (en) | Detection method of power supply control circuit board | |
| CN116978439A (en) | Test method, system, device and computer readable storage medium | |
| KR100231411B1 (en) | Apparatus and method of gasket existing test in battery manufacturing process | |
| WO2008051107A1 (en) | Testing of a test element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170630 |
|
| RJ01 | Rejection of invention patent application after publication |