WO2016147535A1

WO2016147535A1 - Electronic component conveying device, electronic component inspecting device, test piece for inspecting condensation or frosting, and method of inspecting condensation or frosting

Info

Publication number: WO2016147535A1
Application number: PCT/JP2016/000584
Authority: WO
Inventors: 武彦荻原
Original assignee: セイコーエプソン株式会社
Priority date: 2015-03-16
Filing date: 2016-02-04
Publication date: 2016-09-22
Also published as: TWI597227B; TW201733891A; CN108139442A; TWI710513B; TW201634370A

Abstract

The objective of the present invention is to provide an electronic component conveying device, an electronic component inspecting device, a test piece for inspecting condensation or frosting, and a method of inspecting condensation or frosting, with which it is possible to inspect easily whether or not condensation or frosting is occurring on an electronic component in a device. An electronic component inspecting device 1a includes a tray (loading portion) 200a on which it is possible to load an inspection test piece 90a including a color-changing member 92 which changes color if condensation or frosting occurs. Further, the electronic component inspecting device 1a includes an image-capturing unit 103. Further, the image-capturing unit 103 is disposed in a device recovery region A4 in which electronic components that have been inspected are recovered. Further, the loading portion 200a is disposed either in the horizontal direction or the vertical direction relative to an electronic component loading portion 200 on which an electronic component is loaded.

Description

Electronic component conveyance device, electronic component inspection device, test piece for dew condensation or frost formation, and method for dew condensation or frost formation

The present invention relates to an electronic component conveyance device, an electronic component inspection device, a test piece for dew condensation or frost formation, and a dew condensation or frost inspection method.

2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device.

Such an IC device inspection may be performed by cooling the IC device to a predetermined temperature. In that case, it is necessary to cool the IC device and to reduce the humidity of the atmosphere of the member in which the IC device is arranged so that condensation does not occur.

Patent Document 1 describes an IC handler configured to detect the occurrence of condensation by detecting a short circuit when condensation occurs between electrodes of an IC device.

Japanese Patent Laid-Open No. 2005-300285

However, the apparatus as disclosed in Patent Document 1 requires a mechanical response to the detection of the occurrence of dew condensation, which causes a problem that the apparatus becomes complicated and expensive. In the case of ice such as frost formation, there is a possibility that a short circuit does not occur between the electrodes.

An object of the present invention is to provide an electronic component transport apparatus, an electronic component inspection apparatus, a test piece for dew condensation or frost inspection, which can easily inspect whether or not condensation or frost is generated on an electronic component in the apparatus, and , An inspection method for dew condensation or frost, or an electronic component transport device, an electronic component inspection device, and an inspection method for dew condensation or frost that can easily detect the occurrence of dew condensation or frost formation on electronic components in the device It is to provide.

The present invention has been made to solve at least a part of the problems described above, and can be realized as the following forms or application examples.

Application Example 1 The electronic component transport apparatus according to the present application example can transport electronic components and can mount a member including a discoloration member that changes color when liquid water or solid water adheres. It has the mounting part.

Thereby, it is possible to easily inspect whether or not condensation or frost is formed on the electronic component in the electronic component conveying apparatus.

[Application Example 2] In the electronic component transport apparatus according to this application example, it is preferable that the color changing member changes color when condensation or frost formation occurs.

This makes it possible to more easily inspect whether or not dew condensation or frost is generated on the electronic component in the electronic component conveying apparatus.

[Application Example 3] It is preferable that the electronic component transport apparatus according to this application example includes an imaging unit capable of imaging the member.

Thereby, the color change of the color change member can be confirmed more easily.

[Application Example 4] In the electronic component transport apparatus according to this application example, it is preferable that the imaging unit is disposed in a collection area in which the electronic component subjected to a predetermined inspection is collected.

This makes it possible to more reliably detect the occurrence of dew condensation or frost formation on the electronic component in the electronic component conveying apparatus.

[Application Example 5] In the electronic component transport apparatus according to this application example, it is preferable that the placement unit is arranged in a vertical direction with respect to the electronic component placement unit on which the electronic component is placed.

Thereby, it is possible to more easily detect the occurrence of dew condensation or frost formation on the electronic component in the electronic component conveying apparatus.

Application Example 6 In the electronic component transport apparatus according to this application example, it is preferable that the placement unit is arranged in a direction perpendicular to the vertical direction with respect to the electronic component placement unit on which the electronic component is placed.

Application Example 7 In the electronic component transport apparatus according to this application example, the placement unit is an electronic component to which the electronic component placement unit on which the electronic component before the predetermined inspection is placed is supplied. It is arranged in a device supply area which is supplied to a placement section supply area or an inspection area where the electronic components placed on the electronic component placement section from the electronic component placement section supply area are inspected. Is preferred.

Application Example 8 In the electronic component transport apparatus according to this application example, it is preferable that the discoloring member is configured to face vertically downward when the member is arranged in the electronic component transport apparatus.

[Application Example 9] An electronic component inspection apparatus according to this application example inspects a mounting unit on which a member including a discoloring member that changes color when liquid water or solid water adheres can be mounted, and an electronic component And an inspection unit that performs the inspection.

Thereby, it is possible to easily inspect whether or not condensation or frost is formed on the electronic component in the electronic component inspection apparatus.

[Application Example 10] The test piece for dew condensation or frost formation in this application example includes a discoloration member that changes color when liquid water adheres or solid water adheres.

This makes it possible to easily inspect whether or not condensation or frost formation occurs on the electronic components in the apparatus.

[Application Example 11] In the method for inspecting condensation or frost formation in this application example, condensation or frost formation is performed using a test piece including a discoloration member that changes color when liquid water adheres or solid water adheres. It is characterized by detecting.

Application Example 12 The electronic component transport apparatus according to this application example includes an imaging unit capable of imaging a member to which liquid water adheres or solid water adheres.

Thereby, it is possible to easily detect the occurrence of dew condensation or frost formation on the electronic components in the electronic component conveying apparatus.

[Application Example 13] In the electronic component transport apparatus according to this application example, it is preferable that the imaging unit captures the condensed or frosted member.

Thereby, it is possible to more easily inspect the occurrence of dew condensation or frost formation on the electronic components in the electronic component conveying apparatus.

[Application Example 14] In the electronic component transport apparatus according to this application example, the member is preferably an electronic component or a test specimen for inspection.

Application Example 15 In the electronic component transport apparatus according to this application example, it is preferable to include a light irradiation unit that irradiates the member with light.

This makes it possible to more reliably detect the occurrence of condensation or frost formation by light scattering.

Application Example 16 In the electronic component transport apparatus according to this application example, it is preferable that the light irradiation unit irradiates light from a direction inclined with respect to the normal line of the imaging surface of the member.

Thereby, it is possible to more easily detect the occurrence of dew condensation or frost formation on the electronic components in the electronic component conveying apparatus.

[Application Example 17] In the electronic component transport apparatus according to this application example, it is preferable that the imaging surface of the member is a mirror surface.

Application Example 18 An electronic component inspection apparatus according to this application example includes an imaging unit that can image a condensed or frosted member and an inspection unit that inspects the electronic component.

This makes it possible to easily detect the occurrence of condensation or frost formation on the electronic components in the electronic component inspection apparatus.

[Application Example 19] The method for inspecting dew condensation or frost formation in this application example is characterized in that dew condensation or frost formation is imaged and dew condensation or frost formation is detected.

This makes it possible to easily detect the occurrence of condensation or frost formation on the electronic components in the apparatus.

FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a cross-sectional view of a test piece for dew condensation or frost formation and an imaging unit in the first embodiment. FIG. 3 is a schematic plan view showing a second embodiment of the electronic component inspection apparatus of the present invention. FIG. 4 is a cross-sectional view of the imaging unit in the second embodiment. FIG. 5 is a cross-sectional view of the imaging unit in the second embodiment. FIG. 6 is a cross-sectional view of the imaging unit in the second embodiment.

Hereinafter, an electronic component conveying device, an electronic component inspection device, a test piece for dew condensation or frost formation, and a dew condensation or frost inspection method according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

In the following, for convenience of explanation, for example, as shown in FIG. 1, three axes orthogonal to each other are defined as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

The inspection device (electronic component inspection device) shown in the embodiment includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, LCD (Liquid Crystal 、 Display), CIS (CMOS Image Sensor). ) And the like for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

(First embodiment)
FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a cross-sectional view of a test piece for dew condensation or frost formation and an imaging unit.
As shown in FIG. 1, an inspection apparatus (electronic component inspection apparatus) 1a according to this embodiment includes a tray supply area (electronic component placement section supply area) A1 and a device supply area (hereinafter also simply referred to as “supply area”). It is divided into A2, an inspection area A3, a device collection area (hereinafter also simply referred to as “collection area”) A4, and a tray removal area A5. Then, the IC device 90 is inspected in the inspection area A3 in the middle through the tray supply area A1, the supply area A2, the inspection area A3, the collection area A4, and the tray removal area A5 in this order. As described above, the inspection apparatus 1a transports the electronic component that transports the IC device 90 in the tray supply area A1, the supply area A2, the inspection area A3, the collection area A4, and the tray removal area A5 (hereinafter also simply referred to as “each area”). The apparatus includes an inspection unit 16 that performs inspection in the inspection region A3, and a control unit 80.

In the inspection apparatus 1a, the side where the tray supply area A1 and the tray removal area A5 are disposed (the −Y direction side in FIG. 1) is the front side, and the opposite side, that is, the direction where the inspection area A3 is disposed. (+ Y direction side in FIG. 1) is used as the back side.

The tray supply area A1 is a material supply unit to which a tray (electronic component placement unit) 200 in which a plurality of uninspected IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

The supply area A2 is an area where a plurality of IC devices 90 arranged on the upper surface of the tray 200 conveyed from the tray supply area A1 are supplied to the inspection area A3. Note that

tray transport mechanisms

11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

In the supply area A2, a temperature adjusting unit (soak plate) 12, a device transport head 13, and a tray transport mechanism (first transport device) 15 are provided.

The temperature adjustment unit 12 is a device that adjusts the IC device 90 to a temperature suitable for inspection by heating or cooling the plurality of IC devices 90. In the configuration shown in FIG. 1, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply region A1 by the tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

The tray transport mechanism 15 is a mechanism for transporting an empty tray 200 in a state where all the IC devices 90 are unloaded in the supply area A2 in the X direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transport head 17, and a device recovery unit (recovery shuttle) 18 are provided.

The device supply unit 14 is a device that transports the temperature-adjusted IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. The

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

The device transport head 17 is supported so as to be movable in the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16.

The device collection unit 18 is an apparatus that conveys the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 1, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 includes any one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

The collection area A4 is an area where a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism (second conveyance device) 21 are provided. An empty tray 200 is also prepared in the collection area A4.

The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 1, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, one of the three empty trays 200 arranged in the collection area A4. obtain.
Thus, in the inspection apparatus 1a, the tray transport mechanism 21 is provided in the collection area A4, and the tray transport mechanism 15 is provided in the supply area A2. Thereby, for example, the throughput (the number of IC devices 90 to be transported per unit time) can be improved as compared to transporting an empty tray 200 in the X direction with a single transport mechanism.

The tray removal area A5 is a material removal unit where the tray 200 on which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

Also,

tray transport mechanisms

22A and 22B for transporting the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

The control unit 80 has, for example, a drive control unit. The drive control unit includes, for example,

tray transport mechanisms

11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and

tray conveyance mechanism

22A, 22B is controlled.

Note that the test control unit of the tester described above performs, for example, an inspection of the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a memory (not shown).

In the inspection apparatus 1a as described above, in addition to the temperature adjustment unit 12 and the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 are also configured to be able to heat or cool the IC device 90. Thereby, the temperature of the IC device 90 is kept constant while being transported. In the following, the case where the IC device 90 is cooled and inspected in a low temperature environment within a range of, for example, −60 ° C. to −40 ° C. is described.

As shown in FIG. 1, in the inspection apparatus 1a, the tray supply area A1 and the supply area A2 are separated (partitioned) by the first partition wall 61, and the supply area A2 and the inspection area A3 are separated. It is divided by the second partition wall 62, the inspection area A3 and the collection area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. ing. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each region. Further, the outermost exterior of the inspection apparatus 1a is covered with a cover, and examples of the cover include a front cover 70, a side cover 71, a side cover 72, and a rear cover 73.

The supply area A2 is a first chamber R1 defined by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side cover 71, and the rear cover 73. A plurality of IC devices 90 in an uninspected state are carried into the first chamber R1 together with the tray 200.

The inspection area A3 is a second chamber R2 defined by the second partition wall 62, the third partition wall 63, and the rear cover 73. A plurality of IC devices 90 are carried into the second chamber R2 from the first chamber R1.

The collection area A4 is a third chamber R3 defined by the third partition wall 63, the fourth partition wall 64, the fifth partition wall 65, the side cover 72, and the rear cover 73. A plurality of IC devices 90 that have been inspected are carried into the third chamber R3 from the second chamber R2.

As shown in FIG. 1, the side cover 71 is provided with a first door (left first door) 711 and a second door (left second door) 712. By opening the first door 711 and the second door 712, for example, maintenance in the first chamber R1, release of jam in the IC device 90, and the like (hereinafter collectively referred to as “work”) can be performed. . The first door 711 and the second door 712 are so-called “folding doors” that open and close in opposite directions. Further, during the work in the first chamber R1, the movable part such as the device transport head 13 in the first chamber R1 stops. The first door 711 and the second door 712 can be locked and unlocked collectively by the operation of the cylinder 740.

Similarly, the side cover 72 is provided with a first door (right first door) 721 and a second door (right second door) 722. By opening the first door 721 and the second door 722, for example, work in the third chamber R3 can be performed. The first door 721 and the second door 722 are also so-called “folding doors” that open and close in opposite directions. In addition, during work in the third chamber R3, the movable part such as the device transport head 20 in the third chamber R3 stops. The first door 721 and the second door 722 can be locked and unlocked collectively by the operation of the cylinder 745.

The rear cover 73 is also provided with a first door (back side first door) 731, a second door (back side second door) 732, and a third door (back side third door) 733. Yes. By opening the first door 731, for example, work in the first chamber R <b> 1 can be performed. By opening the third door 733, for example, work in the third chamber R3 can be performed.

Furthermore, an inner partition 66 is provided between the second door (back side second door) 732 and the second chamber R2, and a fourth door 75 is provided in the inner partition 66. Then, by opening the second door 732 and the fourth door 75, for example, work in the second chamber R2 can be performed.

In addition, the 1st door 731, the 2nd door 732, and the 4th door 75 open and close in the same direction, and the 3rd door 733 opens and closes in the opposite direction to these doors. Further, during the work in the second chamber R2, the movable parts such as the device transport head 17 in the second chamber R2 are stopped. The first door 731 can be locked and unlocked by the operation of the cylinder 741, the second door 732 can be locked and unlocked by the operation of the cylinder 742, and the third door 733 can be operated by the cylinder 744. Thus, the fourth door 75 can be locked and unlocked by the operation of the cylinder 743.

And by closing each door, it is possible to ensure airtightness and heat insulation in each corresponding room.

Thereby, in the inspection apparatus 1a, the IC device 90 is inspected in a low temperature environment.

As shown in FIG. 1, each of the first chamber R1, the second chamber R2, and the third chamber R3 includes a humidity sensor (hygrometer) 24 that detects indoor humidity and a temperature sensor (temperature) that detects temperature. 25) are arranged. The humidity (detection value) at the position where the humidity sensor 24 is arranged is used as the humidity in each room, and the temperature (detection value) at the position where the temperature sensor 25 is arranged is used as the temperature. Thereby, it is possible to obtain as accurate humidity and temperature as possible.

In the inspection apparatus 1a that performs inspection in a low temperature environment, the dry air DA can be supplied to each of the first chamber R1, the second chamber R2, and the third chamber R3 to adjust (set) the humidity in each chamber. . Thereby, it can prevent that dew condensation arises in the 2nd chamber R2 especially after cooling.

The number of the humidity sensors 24 and the temperature sensors 25 in the first chamber R1, the second chamber R2, and the third chamber R3 is one in the present embodiment, but the number is not limited to this. There may be. In this case, for example, an average value of detection values detected by the plurality of humidity sensors 24 may be used as the humidity of the second chamber R2, or the lowest detection value or the highest detection value may be used.

In the inspection apparatus 1a, the humidity sensor 24 and the temperature sensor 25 in the third chamber R3 can be omitted.

In the inspection apparatus 1a described above, in the tray supply region A1, as shown in FIG. 1, a tray (on which a test specimen (member) 90a having a discoloration member that changes color when condensation or frost formation can be placed ( Placement unit 200a is supplied. In the present specification, “discoloration” refers to a concept including not only a change in color but also a change in unevenness and shading.

In the illustrated configuration, the tray (mounting unit) 200a is disposed in the horizontal direction with respect to the tray (electronic component mounting unit) 200. Note that the tray 200a may be arranged in the vertical direction with respect to the tray 200.

As shown in FIG. 2, the test piece (member) 90 a for inspection is composed of a test device 93 and a discoloration member 92 disposed on the lower surface of the test device 93. In other words, the color changing member 92 is configured to face vertically downward. Note that the direction of the color changing member 92 is not limited to the vertically downward direction as long as the imaging unit 103 to be described later can be installed, and may be vertically upward or laterally.

As the discoloring member 92, for example, a humidity indicator, a submergence detection seal, or the like can be used.

An imaging unit 103 is provided in the collection area A4.
The imaging unit 103 has a function of imaging the color changing member 92.

In the present embodiment, as shown in FIG. 2, the imaging unit 103 is configured to check the discoloration of the discoloring member 92 by capturing an image of the test specimen 90 a held by the device transport head 20 from the lower surface side. ing.

In such an inspection apparatus 1a, the tray 200a on which the test specimen 90a is placed is transported to the supply area A2 by the tray transport mechanism 11A.

The test specimen 90a on the tray 200a conveyed to the supply area A2 is conveyed to the temperature adjustment unit 12 by the device conveyance head 13 in the same manner as the IC device 90.

The test piece 90a for inspection conveyed to the temperature adjustment unit 12 is conveyed to the inspection area A3 by the device conveyance head 13 and the device supply unit 14.

The test piece 90a for inspection transported to the inspection area A3 passes through the inspection area A3 and is transported to the imaging unit 103 by the device transport head 20 similarly to the IC device 90.
As for the test piece 90a for an inspection conveyed by the imaging part 103, the discoloration member 92 is imaged.

When no change in color is confirmed in the color changing member 92, the test piece 90a for inspection is transported in the reverse direction along the path transported to the imaging unit 103 and placed on the empty tray 200a waiting in the supply area A2. The

Thereafter, the tray 200a containing the test specimen 90a for inspection is returned from the supply region A2 to the tray supply region A1 by the tray transport mechanism 15 and the tray transport mechanism 11B. In addition, you may leave with installing in supply area | region A2, without returning to tray supply area | region A1.

In the inspection apparatus 1a, the above-described dew condensation or frost formation is inspected prior to the inspection of the IC device 90. If no color change is confirmed in the color changing member 92 in the inspection, the IC device 90 is inspected as it is. Then, after that, for example, an inspection for condensation or frost formation is performed at intervals of about 3 hours. When dew condensation or frost formation is confirmed, the inspection apparatus 1a displays an error and stops. The inside of the inspection apparatus 1a is dried, and again, an inspection test piece 90a is used to inspect condensation or frost formation. After confirming that there is no condensation or frost formation, the IC device 90 is inspected. .

In the inspection apparatus 1a described above, it is possible to easily inspect whether or not condensation or frost forms on the IC device 90 in the inspection apparatus 1a.

In the above description, the tray (mounting unit) 200a is first in the tray supply area A1 and is transported to the supply area A2. However, the tray (mounting unit) 200a is supplied from the beginning in the supply area A2. May be.

Further, the imaging unit 103 and the test specimen 90a for inspection may be installed in the supply area A2 or the inspection area A3, and the presence or absence of discoloration of the discoloration member may be constantly monitored.

(Second Embodiment)
FIG. 3 is a schematic plan view showing a second embodiment of the electronic component inspection apparatus of the present invention. 4 to 6 are sectional views of the imaging unit in the second embodiment.

Hereinafter, a second embodiment of the electronic component inspection apparatus according to the present invention will be described with reference to these drawings. The second embodiment will be described mainly with respect to differences from the above-described embodiment, and the same matters are denoted by the same reference numerals. Description is omitted.

As shown in FIG. 3, the inspection apparatus (electronic component inspection apparatus) 1b includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter referred to as “supply area”). It is divided into A4 and a tray removal area A5. Then, the IC device 90 is inspected in the inspection area A3 in the middle through the tray supply area A1, the supply area A2, the inspection area A3, the collection area A4, and the tray removal area A5 in this order. As described above, the inspection apparatus 1b performs the inspection in the inspection area A3 and the electronic component conveyance apparatus that conveys the IC device 90 in the tray supply area A1, the supply area A2, the inspection area A3, the collection area A4, and the tray removal area A5. An inspection unit 16 to perform and a control unit 80 are provided.

In the inspection apparatus 1b of the present embodiment, an imaging unit 100 that images the upper surface 91 of the IC device 90 is installed on the vertical upper side of the device collection unit 18. The imaging unit 100 is included in an electronic component transport device.

The imaging unit 100 includes a camera unit 101 and a light irradiation unit 102 as shown in FIG.

The camera unit 101 is arranged vertically above the device collection unit 18 and is configured to image the upper surface 91 of the IC device 90 from above. When condensation or frosting occurs on the upper surface 91 of the IC device 90, the color of the upper surface 91 of the IC device 90 imaged by the camera unit 101 changes due to light reflection.

The light irradiation unit 102 is disposed obliquely above the IC device 90 so that light is irradiated onto the upper surface 91 of the IC device 90 from a direction inclined with respect to the normal line X of the upper surface 91 of the IC device 90. Yes.

When light is irradiated by the light irradiation unit 102, when there is no condensation or frost formation, the light is reflected in a predetermined direction as shown in FIG. 4, but when condensation or frost formation occurs, As shown in FIG. 5, light scattering occurs. As a result, the color change of the upper surface 91 of the IC device 90 imaged by the camera unit 101 becomes remarkable, and the occurrence of condensation or frost formation can be detected more reliably. The occurrence of dew condensation or frost formation can also be detected by a change in the amount of light incident on the camera unit 101.

The upper surface 91 of the IC device 90 is preferably a mirror surface. By using a mirror surface, the color contrast of the upper surface 91 becomes good, and the occurrence of condensation or frost formation can be detected more easily.

In such an inspection apparatus 1b, dew condensation or frost formation is inspected at an appropriate interval (for example, about 3 hours). When dew condensation or frost formation is confirmed, the inspection apparatus 1b displays an error and stops. Thereafter, the inside of the inspection apparatus 1b is dried, and the dew condensation or frost is inspected again. After confirming that no dew condensation or frost formation occurs, the inspection of the IC device 90 is continued.

In the inspection apparatus 1b described above, it is possible to easily detect the occurrence of dew condensation or frost formation in the IC device 90 in the inspection apparatus 1b.

In the above description, the upper surface 91 of the IC device 90 is imaged to detect the occurrence of condensation or frost formation. However, the present invention is not limited to the IC device 90. For example, as shown in FIG. An inspection test piece 90b used only for inspection may be conveyed into the inspection apparatus 1b to detect the occurrence of condensation or frost formation on the upper surface 91b.

In the above description, the case where the imaging unit 100 is provided vertically above the device collection unit 18 has been described. However, the present invention is not limited to this. For example, the imaging unit 100 is provided in the collection area A4. Also good.

As mentioned above, although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described with respect to the illustrated embodiment, the present invention is not limited thereto, and the electronic component conveying apparatus and the electronic component inspection apparatus are configured. Each part to be replaced can be replaced with one having any configuration capable of performing the same function. Moreover, arbitrary components may be added.

Moreover, the electronic component transport device and the electronic component inspection device of the present invention may be a combination of any two or more configurations (features) of the embodiments.

DESCRIPTION OF

SYMBOLS

1a, 1b ... Inspection apparatus (electronic component inspection apparatus) 11A, 11B ... Tray conveyance mechanism 12 ... Temperature adjustment part (soak plate) 13 ... Device conveyance head 14 ... Device supply part (supply shuttle) 15 ... Tray conveyance mechanism (1st (Transport device) 16 ... inspection unit 17 ... device transport head 18 ... device recovery unit (collection shuttle) 19 ... collection tray 20 ... device transport head 21 ... tray transport mechanism (second transport device) 22A, 22B ... tray transport mechanism 24 ... humidity sensor (hygrometer) 25 ... temperature sensor (thermometer) 61 ... first partition 62 ... second partition 63 ... third partition 64 ... fourth partition 65 ... fifth partition 66 ... inner partition 80 ... control unit 90 ...

IC devices

90a, 90b ... test specimens (members) 91, 91b ... top surface 92 ...

discoloration Materials

100, 103 ... Imaging unit 200 ... Tray (electronic component placement unit) 200a ... Tray (placement unit) A1 ... Tray supply area A2 ... Device supply area (supply area) A3 ... Inspection area A4 ... Device collection area (collection) Area) A5 ... Tray removal area R1 ... First chamber R2 ... Second chamber R3 ... Third chamber.

Claims

An electronic component conveying apparatus characterized by having a placing portion that can carry an electronic component and on which a member including a color changing member that changes color when liquid water or solid water adheres can be placed.
The electronic component conveying apparatus according to claim 1, wherein the color changing member changes color when condensation or frost forms.
3. The electronic component conveying apparatus according to claim 1, further comprising an imaging unit capable of imaging the member.
4. The electronic component transport apparatus according to claim 3, wherein the imaging unit is disposed in a collection area where the electronic component subjected to a predetermined inspection is collected.
5. The electronic component transport device according to claim 1, wherein the placement unit is arranged in a vertical direction with respect to the electronic component placement unit on which the electronic component is placed.
5. The electronic component transport device according to claim 1, wherein the placement unit is disposed in a direction perpendicular to a vertical direction with respect to the electronic component placement unit on which the electronic component is placed.
The mounting unit is an electronic component mounting unit supply region to which the electronic component mounting unit on which the electronic component before the predetermined inspection is mounted is supplied, or the electronic component mounting unit supply The electronic component conveyance according to any one of claims 1 to 6, wherein the electronic component is placed in a device supply region that is supplied to an inspection region in which the electronic component placed on the electronic component placement portion from the region is inspected. apparatus.
The electronic component conveying apparatus according to any one of claims 1 to 6, wherein when the member is disposed in an electronic component conveying apparatus, the discoloring member is configured to face vertically downward.
A mounting portion on which a member including a discoloring member that changes color when liquid water adheres or solid water adheres; and
An electronic component inspection apparatus comprising: an inspection unit for inspecting an electronic component.
Specimens for dew condensation or frost formation comprising a discoloration member that changes color when liquid water adheres or solid water adheres.
A method for inspecting dew condensation or frost formation, comprising detecting dew condensation or frost formation using a test specimen including a discoloration member that changes color when liquid water or solid water adheres.