JP2017015479A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device capable of appropriately determining presence or absence of a flaw on a surface of an electronic component.SOLUTION: The electronic component conveyance device has a surface state acquiring part that can acquire information of a surface state of an electronic component. Upon acquiring the information of a surface state of the electronic component, at least one vibration in a vibration generating part generating vibrations is controlled to be smaller than a vibration prior to acquiring the information of the surface state. Upon acquiring information of a surface state of the electronic component, the electronic component is mounted on a conveying part that can mount and convey the electronic component.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device.

  The electronic component conveying apparatus heats or cools the IC device in advance to adjust the IC device to a temperature suitable for inspection, and conveys the IC device whose temperature is adjusted by the soak plate to the vicinity of the inspection unit. A supply shuttle, a first device transport head for transporting the IC device between the tray on which the IC device is disposed and the soak plate, and transporting the IC device between the soak plate and the supply shuttle, and the IC after the inspection A recovery shuttle that transports the device, a second device transport head that transports the IC device between the supply shuttle and the inspection unit, and an IC device between the inspection unit and the recovery shuttle, and the recovery shuttle There is a third device transport head that transports the IC device to and from the tray where the IC device is placed. To have.

  Further, in Patent Document 1, in addition to the inspection of the electrical characteristics of the IC device, the appearance inspection of the IC device, that is, whether the surface of the IC device has cracks, dents, scratches or the like is determined. An auto handler for a device tester that can be inspected is disclosed. This device / tester auto handler is provided with a dedicated visual inspection area for visual inspection of the IC device. In the visual inspection, the IC device is moved and arranged in the visual inspection area. In the appearance inspection of an IC device, the surface of the IC device is imaged by a CCD camera, and the presence or absence of a scratch on the surface of the IC device is determined based on the image data.

JP-A-8-105937

  However, in the device / tester auto-handler described in Patent Document 1, when the surface of the IC device is imaged by a CCD camera in the appearance inspection of the IC device, blurring occurs, that is, the image is unclear ( There is a problem that the determination of the presence or absence of scratches cannot be performed properly.

  An object of the present invention is to provide an electronic component transport apparatus and an electronic component inspection apparatus that can appropriately determine whether or not there is a scratch on the surface of an electronic component.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

The electronic component transport device of the present invention has a surface state acquisition unit capable of acquiring information on the surface state of the electronic component,
When acquiring information on the surface state of the electronic component, at least one vibration of a vibration generating unit that generates vibration is made smaller than vibration before acquiring information on the surface state.

  Thereby, when the surface state acquisition unit is, for example, an imaging device, blurring is prevented or reduced, that is, the image becomes clear (clear), and it is possible to appropriately determine whether there is a scratch on the surface of the electronic component.

  In the electronic component transport apparatus of the present invention, when acquiring information on the surface state of the electronic component, it is preferable that the electronic component is placed on a transporting portion on which the electronic component can be placed and transported.

  As a result, it is possible to easily and quickly perform an appearance inspection of an electronic component as compared with a case where a dedicated appearance inspection area for performing an appearance inspection of the electronic component is provided, , The number of times of release can be reduced, and damage to the electronic component can be suppressed.

  In the electronic component transport device of the present invention, the vibration generating unit is, for example, a drive mechanism of the electronic component transport device.

  Thereby, when acquiring the surface state information of the electronic component, for example, the speed of the drive mechanism is made slower than before the surface state information is acquired, or the drive mechanism is stopped from the drive mechanism. The generated vibration can be made smaller than the vibration before the surface state information is acquired.

In the electronic component transport device of the present invention, the drive mechanism includes, for example, a motor.
As a result, when acquiring the surface condition information of the electronic component, for example, the motor speed is made slower than before the surface condition information is acquired, or vibration generated from the motor is stopped by stopping the motor. The vibration before the acquisition of the surface state information can be made smaller.

  In the electronic component transport device of the present invention, the drive mechanism includes, for example, a slide rail and a slider.

  As a result, when acquiring surface state information of an electronic component, for example, the slider speed is made slower than before acquiring the surface state information, or the slider is stopped from the slide rail and the slider. The generated vibration can be made smaller than the vibration before the surface state information is acquired.

  In the electronic component transport device of the present invention, when acquiring information on the surface state of the electronic component, it is preferable that the speed of the drive mechanism is made slower than before acquiring the information on the surface state.

  Thereby, the vibration which arises from a drive mechanism can be made smaller than the vibration before acquiring the surface state information.

  In the electronic component transport device of the present invention, it is preferable that the drive mechanism is stopped when acquiring information on the surface state of the electronic component.

  Thereby, the vibration which arises from a drive mechanism can be made smaller than the vibration before acquiring the surface state information.

In the electronic component transport device of the present invention, the drive mechanism has a servo motor,
When acquiring information on the surface state of the electronic component, it is preferable to stop the excitation of the servo motor.
Thereby, the vibration which arises from a drive mechanism can be eliminated.

  In the electronic component transport apparatus according to the aspect of the invention, it is preferable that the driving mechanism is a grip portion that can grip and transport the electronic component.

  Thereby, when acquiring information on the surface state of the electronic component, for example, by lowering the speed of the gripper than before acquiring the surface state information, or by stopping the gripper, The generated vibration can be made smaller than the vibration before the surface state information is acquired.

  In the electronic component transport apparatus according to the aspect of the invention, it is preferable that the driving mechanism is a transport unit that can place and transport the electronic component.

  Thereby, when acquiring the information on the surface state of the electronic component, for example, by lowering the speed of the conveying unit than before acquiring the information on the surface state, or by stopping the conveying unit, The generated vibration can be made smaller than the vibration before the surface state information is acquired.

In the electronic component transport device of the present invention, it is preferable that the surface state acquisition unit acquires information on the surface state of the electronic component to perform an appearance inspection of the electronic component.
Thereby, the appearance inspection of the electronic component can be easily performed.

In the electronic component conveying apparatus of the present invention, it is preferable that the appearance inspection determines whether or not there is a scratch on the surface of the electronic component based on the information on the surface state.
As a result, it is possible to select a good product and a defective product regarding the appearance of the electronic component.

  In the electronic component conveying apparatus of the present invention, it is preferable that the surface state acquisition unit acquires information on the surface state of the electronic component after the electronic component is electrically inspected.

  As a result, it is possible to detect scratches on the surface of the electronic component before the electrical inspection of the electronic component is completed, and to appropriately inspect the appearance of the electronic component.

  In the electronic component transport apparatus of the present invention, it is preferable that the surface state information of the electronic component is acquired by the surface state acquisition unit for the electronic component that has passed the electrical inspection of the electronic component.

  Thereby, it is possible to prevent wasteful acquisition of information on the surface state of the electronic component, and it is possible to quickly inspect the appearance of the electronic component.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the surface state acquisition unit includes an imaging device capable of imaging the electronic component.

  Thereby, image data of the surface of the electronic component is obtained as information on the surface state of the electronic component, and it is possible to determine whether or not there is a scratch on the surface of the electronic component based on the image data.

In the electronic component transport device of the present invention, the surface state acquisition unit has a strobe.
It is preferable that when the electronic component is imaged by the imaging device, the strobe is driven to irradiate the electronic component with light.

  Thereby, it can suppress that an image becomes dark by insufficient light quantity, and the presence or absence of the damage | wound of the surface of an electronic component can be determined appropriately.

The electronic component inspection apparatus of the present invention includes a surface state acquisition unit capable of acquiring information on the surface state of the electronic component,
An inspection unit for inspecting the electronic component,
When acquiring information on the surface state of the electronic component, at least one vibration of a vibration generating unit that generates vibration is made smaller than vibration before acquiring information on the surface state.

  Thereby, when the surface state acquisition unit is, for example, an imaging device, blurring is prevented or reduced, that is, the image becomes clear, and it is possible to appropriately determine the presence or absence of scratches on the surface of the electronic component.

It is a schematic plan view which shows embodiment of the electronic component inspection apparatus of this invention. It is a block diagram of the electronic component inspection apparatus shown in FIG. It is a top view which shows the surface state acquisition part of the electronic component inspection apparatus shown in FIG. 1, and its vicinity. FIG. 2 is a side view (including a partial cross-sectional view) showing a surface state acquisition unit and its vicinity of the electronic component inspection apparatus shown in FIG. 1.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic plan view showing an embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. FIG. 3 is a plan view showing a surface state acquisition unit and its vicinity of the electronic component inspection apparatus shown in FIG. 4 is a side view (including a partial cross-sectional view) showing a surface state acquisition unit and its vicinity of the electronic component inspection apparatus shown in FIG.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. The direction of the arrow of each axis of the X axis, the Y axis, and the Z axis is referred to as a plus side, and the direction opposite to the arrow is referred to as a minus side. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  In the following, for convenience of explanation, the upper side in FIG. 4 is referred to as “upper” or “upper”, the lower side as “lower” or “lower”, the right side as “right”, and the left side as “left”. FIG. 2 typically shows one surface state acquisition unit.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Each of these regions is partitioned from each other by a wall portion, a shutter, or the like (not shown). The supply area A2 is a first chamber R1 defined by walls and shutters, and the inspection area A3 is a second chamber R2 defined by walls and shutters. In addition, the collection area A4 is a third chamber R3 defined by walls and shutters. The first chamber R1 (supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (collection region A4) are each configured to ensure airtightness and heat insulation. ing. Thereby, each of the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible. The interiors of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively.

  The IC device 90 is inspected in the intermediate inspection area A3 through the respective areas in order from the tray supply area A1 to the tray removal area A5. As described above, the inspection apparatus 1 includes the electronic component transport apparatus that transports the IC device 90 in each region and has the control unit 80, the inspection unit 16 that performs inspection in the inspection region A3, and the inspection control unit (not shown). It has become. In the inspection apparatus 1, an electronic component transport apparatus is configured by a configuration excluding the inspection unit 16 and the inspection control unit.

  The tray supply area A1 is an area to which a tray 200 in which a plurality of IC devices 90 in an uninspected state are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3. A first tray transport mechanism 11A and a second tray transport mechanism 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjustment unit (soak plate) 12, which is an arrangement unit in which the IC device 90 is arranged, a first device conveyance head 13, and a third tray conveyance mechanism 15 are provided.

  The temperature adjustment unit 12 is an apparatus that heats or cools the plurality of IC devices 90 to adjust (control) the IC devices 90 to a temperature suitable for inspection. That is, the temperature adjustment unit 12 is a temperature control member (member) that can arrange the IC device 90 and can perform both heating and cooling of the IC device 90. In the present embodiment, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the first tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The first device transport head 13 is supported so as to be movable in the X direction, the Y direction, and the Z direction within the supply region A2. Thereby, the first device transport head 13 transports the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, the temperature adjustment unit 12, and a device supply unit 14 to be described later. And the IC device 90 can be transported between them. Note that the first device transport head 13 has a plurality of hand units 131 as gripping units (electronic component gripping units) that grip the IC device 90, and each hand unit 131 is a second device described later. As with the transport head 17, the suction nozzle is provided and the IC device 90 is gripped by suction. Further, in each hand unit 131 of the first device transport head 13, as with the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. It may be configured as follows.

  The third tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state where all the IC devices 90 are removed in the X direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a device supply section (supply shuttle) 14 that is a transport section (placement section) capable of arranging (mounting) and transporting the IC device 90, an inspection section 16, and a second device transport A head 17 and a device collection unit (collection shuttle) 18 that is a conveyance unit (mounting unit) that can arrange (place) and transport the IC device 90 are provided.

  The device supply unit 14 is a device that conveys the temperature-adjusted (temperature-controlled) IC device 90 to the vicinity of the inspection unit 16.

  The device supply unit 14 includes a placement plate 142 on which the IC device 90 is placed (placed), and a device supply unit main body 141 movable in the X direction. On the upper surface of the arrangement plate 142, a plurality of pockets 145, which are recesses for accommodating (holding) the IC device 90, are provided. The arrangement plate 142 is detachably installed on the device supply unit main body 141. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the present embodiment, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is connected to one of the device supply units 14 by the first device transport head 13. Transported and placed. In the device supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The inspection unit 16 is a unit that inspects / tests (electrically inspects) the electrical characteristics of the IC device 90, that is, a member that holds the IC device 90 when the IC device 90 is inspected.

  The inspection unit 16 includes a holding member 162 that holds the IC device 90 and an inspection unit main body 161 that supports the holding member 162. The holding member 162 is detachably installed on the inspection unit main body 161.

  On the upper surface of the holding member 162 of the inspection unit 16, a plurality of holding units 163 that are concave portions that house (hold) the IC device 90 are provided. The IC device 90 is accommodated in the holding unit 163, thereby being arranged (placed) on the inspection unit 16.

  In addition, probe pins that are electrically connected to the terminals of the IC device 90 in a state where the IC device 90 is held by the holding unit 163 are provided at positions corresponding to the holding units 163 of the inspection unit 16. Yes. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in a storage unit of an inspection control unit provided in a tester (not shown) connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  The second device transport head 17 is supported so as to be movable in the Y direction and the Z direction within the inspection region A3. In the present embodiment, one second device transport head 17 is arranged in the Y direction, and the second device transport head 17 is an IC device on the device supply unit 14 carried in from the supply area A2. 90 can be transported and placed on the inspection unit 16, and the IC device 90 on the inspection unit 16 can be transported and placed on the device collection unit 18. When inspecting the IC device 90, the second device transport head 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16. Thereby, as described above, the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected. Note that the number of second device transport heads 17 is not limited to one, and may be two, for example.

  The second device transport head 17 includes a plurality of hand units 171 as a gripping part (electronic component gripping part) that grips the IC device 90. Since the configuration of each hand unit 171 is the same, one hand unit 171 will be typically described below. The hand unit 171 includes a gripping member 173 that holds the IC device 90 and a hand unit main body 172 that supports the gripping member 173. The grip member 173 is detachably installed on the hand unit main body 172. The hand unit 171 includes a suction nozzle and grips the IC device 90 by suction. Further, in each hand unit 171 of the second device transport head 17, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The device collection unit 18 is an apparatus that conveys the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4.

  The device collection unit 18 includes an arrangement plate 182 on which the IC device 90 is arranged, and a device collection unit main body 181 that can move in the X direction. On the upper surface of the arrangement plate 182, a plurality of pockets 185, which are recesses for accommodating (holding) the IC device 90, are provided. The arrangement plate 182 is detachably installed on the device collection unit main body 181. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the present embodiment, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is moved by the second device transport head 17. It is transported to and placed on the device collection unit 18.

  In the present embodiment, the device collection unit 18 and the device supply unit 14 are configured to move independently of each other. However, the present invention is not limited to this. For example, the device collection unit 18 and the device supply unit 14 include The device collection unit 18 and the device supply unit 14 may be configured to move integrally with each other.

  The collection area A4 is an area where the IC device 90 that has been inspected is collected. In the collection area A4, a collection tray 19, a third device transport head 20, and a sixth tray transport mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection trays 19 are fixed in the collection area A4, and in the present embodiment, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The third device transport head 20 is supported so as to be movable in the X direction, the Y direction, and the Z direction within the collection region A4. Accordingly, the third device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. Note that the third device transport head 20 has a plurality of hand units 201 as gripping units (electronic component gripping units) that grip the IC device 90, and each hand unit 201 is configured to transport the second device. Similar to the head 17, the suction nozzle is provided and the IC device 90 is gripped by suction.

  The sixth tray transport mechanism 21 is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, a fourth tray transport mechanism 22A and a fifth tray transport mechanism 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism for transporting an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The test control unit of the tester performs (electrical) test of the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a storage unit (not shown), for example.

  Further, as shown in FIG. 2, the inspection apparatus 1 includes a control unit 80, an operation unit 6 that is electrically connected to the control unit 80 and performs each operation of the inspection apparatus 1, and information on the surface state of the IC device 90. And a surface state acquisition unit 3 that can acquire the IC device 90, and is configured to be able to perform an appearance inspection (surface inspection) of the IC device 90.

  In the appearance inspection of the IC device 90, the surface state acquisition unit 3 acquires the surface state information of the IC device 90, and based on the surface state information, for example, the determination unit 802 of the control unit 80 described later uses the IC device 90. It is determined whether or not there is a crack such as a crack, a dent or a chip, the size of the scratch is measured, and the position is specified. The appearance inspection may be performed on all of the upper surface, the lower surface (back surface), and the side surfaces in FIG. 4 of the IC device 90, that is, the entire surface. It may be performed only on the upper surface.

  The appearance inspection may be performed at any stage (process), but is preferably performed after the inspection of the electrical characteristics of the IC device 90 is performed. In the present embodiment, the IC device 90 is connected to the device collection unit 18. In this state, the IC device 90 is imaged by an imaging device 31 described later, which is the first step of the appearance inspection.

  As a result, it is possible to detect scratches generated on the surface of the IC device 90 before the inspection of the electrical characteristics of the IC device 90 is completed, and the appearance inspection of the IC device 90 can be appropriately performed.

  The control unit 80 includes a storage unit 801 that stores information, a determination unit 802 that performs each determination (determination), and the like. For example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, and temperature adjustment Unit 12, first device transport head 13, device supply unit 14, third tray transport mechanism 15, second device transport head 17, device collection unit 18, and third device transport head 20. And the drive of each part such as the sixth tray transport mechanism 21, the fourth tray transport mechanism 22A, the fifth tray transport mechanism 22B, the display unit 62, and the surface state acquisition unit 3.

  Further, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays each information (data) such as an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. For example, the operator (operator) operates the operation unit 6 by operating the input unit 61, moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking). Is made by

  The input unit 61 is not limited to the one having the above configuration, and examples thereof include mechanical operation buttons such as push buttons. In addition, the operation unit 6 is not limited to the above-described configuration, and examples thereof include a device such as a touch panel that can input and display information.

  As shown in FIG. 4, the surface state acquisition unit 3 includes an imaging device 31 that images the IC device 90, and a strobe 32 that irradiates the IC device 90 with light when the IC device 90 is imaged by the imaging device 31. Have. Note that the imaging device 31 itself may have a strobe 32, or the strobe 32 may be omitted.

  Although it does not specifically limit as the imaging device 31, For example, the camera (CCD camera) using a CCD (Charge Coupled Device) image sensor as an imaging device, the camera using a CMOS (Complementary Metal Oxide Semiconductor) image sensor as an imaging device, Examples thereof include an electronic camera (digital camera) such as a camera using a MOS image sensor as an image sensor.

  Further, the imaging device 31 may not have an autofocus mechanism, but preferably has an autofocus mechanism. Thereby, for example, even when the height (the height in the Z direction) of the IC device 90 is different, a clear image can be obtained.

  The surface state acquisition unit 3 is not limited to the imaging device 31 as long as it can acquire information on the surface state of the IC device 90. For example, the surface of the IC device 90 is irradiated with laser light and the laser is obtained. A device that scans light and receives laser light reflected on the surface is exemplified.

  The strobe 32 is a light source device that is driven when the imaging device 31 captures an image of the IC device 90 and irradiates the IC device 90 with light. The strobe 32 can prevent the image from becoming dark due to insufficient light quantity.

  In the present embodiment, the strobe 32 has an annular shape and is disposed around the imaging device 31. As a result, the IC device 90 can be irradiated with light uniformly. Needless to say, the shape and arrangement of the strobe 32 are not limited to those described above.

  As shown in FIGS. 3 and 4, the inspection apparatus 1 has a structure 5 to which a member and the like that movably supports the second device transport head 17 is attached, and the surface state acquisition unit 3 has its structure. It is installed on the body 5.

  As shown in FIG. 3, in this embodiment, the surface state acquisition unit 3 has one surface state in one row of pockets 185 of one device recovery unit 18, that is, four pockets 185 arranged in the X direction. The acquisition unit 3 is provided to correspond. Then, when the device collection unit 18 moves in the X direction, the imaging device 31 images the surface of the IC device 90 while moving the device collection unit 18 or with the device collection unit 18 stopped.

  In the present embodiment, the imaging device 31 is arranged so as to be positioned above the device collection unit 18 when the device collection unit 18 moves to a position corresponding to the imaging device 31. The IC device 90 is configured to image the upper surface in FIG. Since the IC device 90 has the circuits concentrated on the upper part, it is preferable to perform an appearance inspection on the upper surface of the IC device 90 in FIG. For example, the imaging device 31 may be configured to be able to image the lower surface (back surface), side surface, and the like of the IC device 90 in FIG. When imaging the back surface of the IC device 90, for example, the lower portion of the pocket 185 of the device collection unit 18 is formed of a light-transmitting member (transparent member), and a hole is formed in the lower portion of the pocket 185. To do.

  Further, the surface of the portion near the IC device 90 of the device collection unit 18, such as the inner surface of the pocket 185 of the device collection unit 18, is emitted from the strobe 32 and is reflected by the device collection unit 18 toward the imaging device 31. It is preferable to configure so that the amount of light is reduced. Thereby, when imaging the IC device 90 with the imaging device 31, it can suppress that unnecessary light injects into the image pick-up element of the imaging device 31, and can obtain a clearer image.

  As a method (configuration) for reducing the amount of light reflected toward the imaging device 31, for example, at least the surface of a portion in the vicinity of the IC device 90 such as the inner surface of the pocket 185 of the device recovery unit 18 Are formed of a material having a low light reflectance, formed of a material having a high light absorption rate, and roughened so as to increase light scattering, for example.

  In the appearance inspection of the IC device 90, when the device collection unit 18 moves in the X direction, the strobe 32 is driven to irradiate light on the surface of the IC device 90, and the surface of the IC device 90 is captured by the imaging device 31. And image data of the surface of the IC device 90 is acquired. The imaging of the IC device 90 is sequentially performed on the four IC devices 90 arranged in the X direction.

  By imaging the IC device 90 in a state where the IC device 90 is placed on the device collection unit 18, compared to a case where a dedicated appearance inspection area for performing an appearance inspection of the IC device 90 is provided, The appearance inspection of the IC device 90 can be performed easily and quickly. In addition, the number of times the IC device 90 is gripped or released can be reduced, and damage to the IC device 90 can be suppressed.

  Next, based on the obtained image data, the determination unit 802 of the control unit 80 determines whether there is a scratch on the surface of the IC device 90. Moreover, the magnitude | size of a damage | wound or a position is specified as needed. In addition, in this visual inspection, by analyzing image data using, for example, differential interference method, Fourier transform method, etc., it is possible to emphasize fine scratches and scratches that are difficult to see and improve the detection sensitivity of scratches It is.

  Thereby, the non-defective product and the defective product can be selected with respect to the appearance (surface state) of the IC device 90. Even if the IC device 90 has passed the electrical property inspection, the IC device 90 that has failed the appearance inspection is treated as a defective product.

  Further, the appearance inspection of the IC devices 90 may be performed on all the IC devices 90, but it is preferable to perform the appearance inspection only on the IC devices 90 that have passed the inspection of the electrical characteristics. Thereby, useless imaging of the IC device 90 can be prevented, and the appearance inspection of the IC device 90 can be quickly performed.

  In the present embodiment, the imaging of the IC device 90 is performed in a state where the IC device 90 is placed on the device collection unit 18. However, the present invention is not limited to this. It may be performed in a state where it is placed on the empty tray 200, or a tray for visual inspection (not shown) is prepared separately, and the IC device 90 is mounted on the tray for visual inspection. Also good.

  Moreover, in this embodiment, although the surface state acquisition part 3 is being fixed to the structure 5, it is not restricted to this, For example, you may be installed in the structure 5 etc. so that a movement in a Y direction is possible. In the case of such a configuration, for example, the following configuration 1 and configuration 2 can be realized.

(Configuration 1)
By changing the number of surface state acquisition units 3 for one device recovery unit 18 from two to one and moving the surface state acquisition unit 3 in the Y direction, one imaging device 31 is arranged in two rows. The IC device 90 is imaged. Specifically, after imaging the first row of IC devices 90 with the imaging device 31, the surface state acquisition unit 3 is moved in the Y direction, that is, the second row of IC devices 90 is moved to a position where imaging is possible, The imaging device 31 images the second row of IC devices 90. In the case of this configuration 1, the number of surface state acquisition units 3 can be reduced, and the configuration of the inspection apparatus 1 can be simplified.

(Configuration 2)
The imaged region of the IC device 90, that is, the region on the surface of the IC device 90 that is imaged by the imaging device 31, is divided into a plurality (a plurality of portions) for imaging. Thereby, a high-definition image can be obtained and even a fine scratch can be detected.

  In addition, in this imaging, when the imaging area is divided into a plurality of areas in the Y direction, imaging is performed by moving the surface state acquisition unit 3 in the Y direction, and the imaging area is divided into a plurality in the X direction. When dividing and imaging, the IC device 90 (device collection unit 18) is moved in the X direction to perform imaging. In the case where the imaged region is divided into a plurality of parts in the X direction and the IC device 90 is moved to the plus side in the X direction, the images may be taken sequentially, and the IC device 90 is moved in the X direction. The imaging may be performed by reciprocating between the plus side and the X direction minus side.

  In addition, when imaging an imaged region by dividing it into a plurality of regions, the number of divisions is not particularly limited and is appropriately set according to various conditions such as the performance of the imaging device 31, but is an even number. Is preferably 2 or more and 64 or less, more preferably 2 or more and 16 or less. Specifically, two divisions or four divisions are preferable, four divisions are more preferable, two divisions in the X direction, and two divisions in the Y direction (four divisions in total) are more preferable. Thereby, a necessary and sufficiently high-definition image can be obtained, and the entire imaging area can be quickly imaged.

  In addition, when capturing an image by dividing a region to be imaged, two adjacent images of each image (imaging region of the imaging device 31) may have a common portion, or two adjacent images The boundaries may be matched.

  The division of the imaging region is not limited to the configuration in which the surface state acquisition unit 3 is moved in the Y direction. For example, a plurality of (for example, two) fixed to the IC devices 90 for one column. The surface state acquisition unit 3 may be provided.

  Further, the surface state acquisition unit 3 may be configured to acquire a 3D (three-dimensional) image of the IC device 90. In this case, for example, an imaging device (not shown) capable of obtaining a 3D image may be used as the surface state acquisition unit 3, and two or more, preferably three or more (for example, three) are illustrated. It is also possible to arrange the imaging devices not to be arranged at positions different from each other and create 3D image data based on image data obtained from the respective imaging devices. Moreover, you may use the laser measuring device (laser length measuring device) which can measure 3D image by a triangulation method using a laser beam. In this case, in the appearance inspection of the IC device 90, the depth of the scratch and the like can be measured based on the 3D image data and the data obtained by the 3D image measurement.

  The inspection apparatus 1 is a vibration generation unit that generates vibration when the surface state acquisition unit 3 acquires information on the surface state of the IC device 90, that is, when the imaging device 31 images the IC device 90. First tray transport mechanism 11A, second tray transport mechanism 11B, third tray transport mechanism 15, fourth tray transport mechanism 22A, fifth tray transport mechanism 22B, sixth tray transport mechanism 21, first Vibration of at least one of the drive mechanisms of the inspection apparatus 1 (electronic component carrying apparatus) such as the device carrying head 13, the second device carrying head 17, the third device carrying head 20, the device supply unit 14, and the device collection unit 18 Is made smaller than the vibration before acquiring the surface state information (before imaging). Note that “reducing vibration” includes eliminating vibration. Hereinafter, making the vibration smaller than the vibration before acquiring the surface state information (before imaging) (operation) is also simply referred to as “vibration reducing operation”.

  Examples of the driving mechanism include a motor having at least one of a motor such as a servo motor, a slide rail, and a slider.

  By performing this vibration reduction operation, blurring is prevented or reduced in an image obtained by imaging by the imaging device 31, that is, the image becomes clear (clear), and the presence / absence of scratches on the surface of the IC device 90 is determined. Can be performed appropriately.

  Here, as a method for reducing the vibration of the drive mechanism to be smaller than the vibration before imaging, that is, as the vibration reduction operation of the drive mechanism, for example, the speed of the drive mechanism is made slower than before imaging, and the drive mechanism is stopped. When the drive mechanism has a servo motor as a drive source, the excitation of the servo motor is stopped (power supply to the servo motor is stopped). Of these, the most effective method for reducing or eliminating vibration is to stop the excitation of the servo motor, and the next most effective method is to stop the drive mechanism. A highly effective method is to make the speed of the drive mechanism slower than before imaging. These are appropriately set according to various conditions.

  In the present embodiment, drive sources such as the first device transport head 13, the second device transport head 17, the third device transport head 20, the device supply unit 14, and the device collection unit 18 are servo motors, respectively. However, other drive sources are also applicable.

  Further, when the IC device 90 is imaged by the imaging device 31, the vibration reducing operation may be performed in all the driving devices, and the vibration reducing operation may be performed in some of the driving devices. A high effect can be obtained by performing a vibration reducing operation in the driving device. Further, in a case where a vibration reducing operation is performed in some driving apparatuses, a high effect can be obtained by performing the vibration reducing operation in the device collection unit 18 on which the IC device 90 is placed.

  As described above, according to the inspection apparatus 1, a clear image is obtained in the appearance inspection of the IC device 90, whereby it is possible to appropriately determine the presence or absence of scratches on the surface of the IC device 90. .

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part has the same function. Any configuration can be substituted. Moreover, other arbitrary components may be added.

  DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus (electronic component inspection apparatus) 11A ... 1st tray conveyance mechanism 11B ... 2nd tray conveyance mechanism 12 ... Temperature adjustment part (soak plate) 13 ... 1st device conveyance head 131 ... Hand unit 14 ... Device Supply unit (supply shuttle) 141 ... Device supply unit main body 142 ... Arrangement plate 145 ... Pocket 15 ... Third tray transport mechanism 16 ... Inspection unit 161 ... Inspection unit main body 162 ... Holding member 163 ... Holding unit 17 ... Second device Conveying head 171 ... Hand unit 172 ... Hand unit main body 173 ... Holding member 18 ... Device recovery part (recovery shuttle) 181 ... Device recovery part main body 182 ... Placement plate 185 ... Pocket 19 ... Recovery tray 20 ... Third device transport head 201: Hand unit 21 ... Sixth tray transporter Structure 22A ... 4th tray conveyance mechanism 22B ... 5th tray conveyance mechanism 3 ... Surface state acquisition part 31 ... Imaging device 32 ... Strobe 5 ... Structure 6 ... Operation part 61 ... Input part 62 ... Display part 80 ... Control part 801 ... Storage unit 802 ... Determination unit 90 ... IC device 200 ... Tray A1 ... Tray supply area A2 ... Device supply area (supply area) A3 ... Inspection area A4 ... Device recovery area (collection area) A5 ... Tray removal area R1 ... No. 1st room R2 ... 2nd room R3 ... 3rd room

Claims (17)

It has a surface state acquisition unit that can acquire information on the surface state of electronic components,
When acquiring information on the surface state of the electronic component, at least one vibration of a vibration generating unit that generates vibration is made smaller than vibration before acquiring the surface state information. Conveying device.   2. The electronic component transport apparatus according to claim 1, wherein when acquiring information on a surface state of the electronic component, the electronic component is placed on a transport unit on which the electronic component can be placed and transported.   The electronic component transport apparatus according to claim 1, wherein the vibration generating unit is a drive mechanism of the electronic component transport apparatus.   The electronic component conveying apparatus according to claim 3, wherein the driving mechanism includes a motor.   The electronic component conveying apparatus according to claim 3, wherein the driving mechanism includes a slide rail and a slider.   The electronic component conveyance according to any one of claims 3 to 5, wherein when acquiring information on the surface state of the electronic component, the speed of the driving mechanism is made slower than before acquiring the information on the surface state. apparatus.   The electronic component carrying device according to any one of claims 3 to 5, wherein when the information on the surface state of the electronic component is acquired, the driving mechanism is stopped. The drive mechanism has a servo motor,
The electronic component transport apparatus according to any one of claims 3 to 5, wherein when acquiring information on a surface state of the electronic component, excitation of the servo motor is stopped.   The electronic component transport apparatus according to claim 3, wherein the driving mechanism is a grip portion that can grip and transport the electronic component.   The electronic component transport apparatus according to any one of claims 3 to 8, wherein the drive mechanism is a transport unit on which the electronic component can be placed and transported.   The electronic component transport apparatus according to claim 1, wherein the surface state acquisition unit acquires surface state information of the electronic component and performs an appearance inspection of the electronic component.   The electronic component transport apparatus according to claim 11, wherein in the appearance inspection, the presence or absence of a scratch on the surface of the electronic component is determined based on the information on the surface state.   The electronic component transport apparatus according to claim 11, wherein after the electrical inspection of the electronic component is performed, information on a surface state of the electronic component is acquired by the surface state acquisition unit.   The electronic component transport apparatus according to claim 13, wherein information on a surface state of the electronic component is acquired by the surface state acquisition unit for the electronic component that has passed the electrical inspection of the electronic component.   The electronic component conveyance device according to claim 1, wherein the surface state acquisition unit includes an imaging device capable of imaging the electronic component. The surface state acquisition unit has a strobe,
The electronic component carrying device according to claim 15, wherein when the electronic component is imaged by the imaging device, the strobe is driven to irradiate the electronic component with light. A surface state acquisition unit capable of acquiring information on the surface state of the electronic component;
An inspection unit for inspecting the electronic component,
When acquiring information on the surface state of the electronic component, at least one vibration of a vibration generating unit that generates vibration is made smaller than vibration before acquiring the surface state information. Inspection device.

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