TWI635284B - Electronic component transfer device and electronic component inspection device - Google Patents

Abstract

The electronic component transfer device of the present invention includes a first space, a second space, which is different from the first space, and a disposition member, which is disposed in the second space and includes a plurality of electronic components; and a baffle, which The electronic component is operable in at least one direction in which the electronic component is arranged, and is in contact with the first space and the second space; and a plurality of first openings are provided in the baffle. It is preferable that the humidity of the first space is different from that of the second space. The humidity of the second space is preferably lower than the humidity of the first space.

Description

Electronic component transfer device and electronic component inspection device

The invention relates to an electronic component conveying device and an electronic component inspection device.

For example, an electronic component inspection device for inspecting the electrical characteristics of electronic components such as IC (integrated circuit) components has been known, and an electronic component inspection device is incorporated in the electronic component inspection device to transport IC components to an inspection unit Electronic parts transfer device up to the holding part. In the inspection of the IC element, the IC element is arranged on the holding portion, and a plurality of probes provided on the holding portion are brought into contact with each terminal of the IC element.

The inspection of such an IC device may be performed by cooling the IC device to a specific temperature. In this case, the IC element is cooled, and in order to avoid dew condensation, the humidity of the gas atmosphere around the component where the IC element is arranged is reduced.

Patent Document 1 describes an IC chip component testing device in which an IC tray having a plurality of IC storage sections for storing a plurality of IC chips is movably stored in a chamber whose temperature is controlled to be low, and an opening and closing chamber is provided. Plate-like baffle at the entrance to the room. When the IC chip is transported from the outside and stored in the IC receiving section of the IC tray in the chamber, the IC tray is moved to the entrance position, and the shutter is opened. When the entire IC tray is exposed to the outside, it will be adsorbed by the suction nozzle. The IC chip is accommodated in the IC housing section of the IC tray by releasing the suction. The IC chip component testing device described in Patent Document 1 can keep the inside of the chamber at a specific temperature and a specific humidity by closing the entrance of the chamber with a baffle.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2000-74996

However, the baffle described in Patent Document 1 includes a plate-shaped member that opens and closes the entire entrance of the chamber, and the baffle is not a baffle that can open and close each IC storage portion of the IC tray. Therefore, in a state where the shutter has been opened, the opening portion becomes larger than necessary, whereby all the IC chips contained in the IC tray are exposed to an unmanaged gas atmosphere such as humidity. Accordingly, when the temperature of the IC chip is low, there is a possibility that dew condensation may occur on the surface of the IC chip.

An object of the present invention is to provide an electronic component transfer device and an electronic component inspection device which can suppress the exposure of electronic components to an unmanaged gas atmosphere such as humidity.

The present invention has been developed to solve at least a part of the problems described above, and can be implemented as the following forms or application examples.

[Application example 1]

The electronic component transfer device of the present invention is characterized by including: a first space; a second space that is different from the first space; and a configuration member that is arranged in the second space and is configured with a plurality of electronic components; And a baffle, which is operable in at least one direction in which the electronic component is arranged, and is in contact with the first space and the second space; and the baffle is provided with a plurality of first openings.

This can prevent the electronic components from being exposed to an unmanaged gas atmosphere such as humidity.

That is, by closing the baffle, the communication between the first space and the second space can be blocked at the part of the baffle, thereby making it possible to easily manage the humidity of the second space, for example.

In addition, when the shutter is opened, the first opening portion can be opened at a specific portion of the portion where the plurality of electronic components are arranged, and only the specific portion can be opened. Thereby, for example, when humidity and the like are not managed in the first space, it is possible to suppress exposure of electronic components to an unmanaged gas atmosphere such as the humidity.

[Application example 2]

Preferably, one surface of the baffle is connected to the first space, and the other surface of the baffle is connected to the second space.

Thereby, a baffle having a higher blocking function can be provided.

[Application Example 3]

Preferably, the direction in which the baffle operates is a longitudinal direction of the arrangement member.

This allows the shutter to be opened and closed efficiently.

[Application Example 4]

Preferably, in the electronic component transfer device of the present invention, the humidity of the first space is different from that of the second space.

Accordingly, by reducing the humidity in the second space, when the temperature of the electronic component or the second space is low, the occurrence of dew condensation in the electronic component or the second space can be suppressed.

[Application Example 5]

Preferably, in the electronic component transfer device of the present invention, the humidity in the second space is lower than the humidity in the first space.

Accordingly, when the temperature of the electronic component or the second space is low, it is possible to suppress the occurrence of condensation on the electronic component or the second space.

[Application Example 6]

Preferably, the electronic component transfer device of the present invention includes an opening member disposed between the baffle and the arrangement member and having a plurality of second openings.

Thereby, the distance between the baffle and the opening member can be reduced, and the baffle can be improved. Blocking function. In addition, when a gas such as low-humidity air (hereinafter, also referred to as dry air) flows into the second space, especially the third space between the opening member and the arrangement member in the second space, the dry air is in the The flow in the third space prevents condensation of the electronic parts when the temperature of the electronic parts is low.

[Application Example 7]

Preferably, in the electronic component conveying device of the present invention, the interval between the opening member and the arrangement member is larger than the interval between the opening member and the baffle.

Thereby, when the dry air is caused to flow into the third space, the dry air can smoothly flow in the third space, so that when the temperature of the electronic part is low, the dew condensation of the electronic part can be prevented.

[Application Example 8]

Preferably, the electronic component conveying device of the present invention includes a sliding member that movably supports the baffle.

Thereby, the shutter can be smoothly operated and opened and closed.

[Application Example 9]

Preferably, in the electronic component conveying device of the present invention, the movement of the baffle is translation.

With this, the structure of the driving mechanism of the baffle can be simplified.

[Application Example 10]

Preferably, in the electronic component conveying device of the present invention, the baffle plate may be replaced with a baffle plate having a different size of the first opening portion and a position of the first opening portion.

This can correspond to electronic components of various sizes.

[Application Example 11]

Preferably, in the electronic component transfer device of the present invention, the size of the first opening is set based on the size of the electronic component.

This can correspond to electronic components of various sizes.

[Application Example 12]

Preferably, in the electronic component transfer device of the present invention, the distance between the plurality of first openings is twice the distance between the plurality of electronic component placement portions provided on the arrangement member and the electronic component.

Therefore, when the electronic component disposition portion is arranged in a matrix, only one of the electronic component disposition portion of the odd-numbered rows and the electronic component disposition portion of the even-numbered lines can be formed as the shutter is opened, and the other is the shutter closed. Of the state. Thereby, only the required ones among the electronic component arrangement sections of the odd-numbered rows and the electronic component arrangement sections of the even-numbered rows can open the shutter.

[Application Example 13]

Preferably, in the electronic component conveying device of the present invention, the baffle can reciprocate, and a single distance of the reciprocating action of the baffle is 1/2 of the distance between the first openings.

Therefore, when the electronic component arrangement portions are arranged in a matrix, only one of the electronic component arrangement portions of the odd-numbered rows and the electronic component arrangement portions of the even-numbered rows can be formed as a shutter, and the other is a shutter. Closed. Thereby, only the required ones among the electronic component arrangement sections of the odd-numbered rows and the electronic component arrangement sections of the even-numbered rows can open the shutter.

[Application Example 14]

Preferably, the electronic component conveying device of the present invention includes a conveying member capable of conveying the electronic component, and the shutter is opened when the conveying member moves toward the arrangement member.

Thus, for example, in a case where humidity and the like are not managed in the first space, as compared with a case where the shutter is opened before the transfer member starts moving toward the arrangement member, it is possible to suppress exposure of the electronic component to an unmanaged gas atmosphere such as humidity.

In addition, the processing time can be shortened as compared with a case where the shutter is opened after the conveying member reaches the arranging member.

[Application Example 15]

Preferably, in the electronic component conveying device of the present invention, based on a position where the conveying member starts to move toward the disposing member, a time for starting the operation of opening the shutter is set.

With this, it is possible to easily and accurately set the time to start the operation of opening the shutter.

[Application Example 16]

Preferably, in the electronic component conveying device of the present invention, the time for starting the operation of opening the shutter is that the moving distance of the conveying member since the conveying member starts moving toward the arrangement member is smaller than the moving of the conveying member. At a specific value of the total moving distance up to the arrangement member.

With this, it is possible to easily and accurately set the time to start the operation of opening the shutter.

[Application Example 17]

Preferably, in the electronic component transfer device of the present invention, the specific value is set within a range of 60% to 95% of the total moving distance.

With this, it is possible to accurately set the time when the action of opening the shutter is started.

[Application Example 18]

The electronic component inspection device of the present invention is characterized by comprising: a first space; a second space, which is different from the first space; and a disposition member, which is disposed in the second space and is provided with a plurality of electronic parts; A baffle, which is operable in at least one direction in which the electronic parts are arranged, and is in contact with the first space and the second space; and an inspection section, which inspects the electronic parts; and the baffle, which is provided with A plurality of openings.

This can prevent the electronic parts from being exposed to an unmanaged gas atmosphere such as humidity, that is, by closing the baffle, the communication between the first space and the second space can be blocked in a part of the baffle. Therefore, for example, the humidity in the second space can be easily managed.

In addition, when the shutter is opened, the first opening portion can be opened at a specific portion of the portion where the plurality of electronic components are arranged, and only the specific portion can be opened. Thereby, for example, when humidity and the like are not managed in the first space, it is possible to suppress exposure of electronic components to an unmanaged gas atmosphere such as the humidity.

1‧‧‧Inspection device (electronic parts inspection device)

3‧‧‧ base

11A‧‧‧The first pallet transfer mechanism

11B‧‧‧Second pallet transfer mechanism

12‧‧‧Temperature adjustment section (soaking plate)

13‧‧‧The first component transfer head

14‧‧‧ Component Supply Department (Supply Shuttle)

15‧‧‧3rd pallet transfer mechanism

16‧‧‧ Inspection Department

17‧‧‧ 2nd component transfer head

18‧‧‧ Component Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧3rd component transfer head

21‧‧‧The 6th pallet transfer mechanism

22A‧‧‧4th pallet transfer mechanism

22B‧‧‧5th pallet transfer mechanism

41‧‧‧Temperature Control Board

42‧‧‧ Replace the fixture board

43‧‧‧ bracket

44‧‧‧shell

45‧‧‧ bezel

51‧‧‧The first space

52‧‧‧ 2nd space

53‧‧‧ 3rd space

61‧‧‧board

62‧‧‧ bezel

63‧‧‧ sliding member

64‧‧‧ Bolt

80‧‧‧Control Department

90‧‧‧IC components

181‧‧‧Dent

200‧‧‧tray

421‧‧‧Dent

441‧‧‧Second wall section

442‧‧‧ 2nd opening

451‧‧‧The first wall

452‧‧‧The first opening

611‧‧‧ 2nd opening

621‧‧‧The first opening

622‧‧‧ long hole

631, 632‧‧‧large diameter department

633‧‧‧ Trail

A1‧‧‧Tray supply area

A2‧‧‧component supply area (supply area)

A3‧‧‧ Inspection area

A4‧‧‧component recycling area (recycling area)

A5‧‧‧Tray removal area

d1 ~ d4‧‧‧interval

S101 ~ S104‧‧‧step

P1, P2, P3 ‧‧‧ pitch

FIG. 1 is a schematic plan view showing a first embodiment of the electronic component inspection apparatus of the present invention.

FIG. 2 is a cross-sectional view showing a temperature adjustment section of the electronic component inspection apparatus shown in FIG. 1. FIG.

FIG. 3 is a cross-sectional view showing a temperature adjustment section of the electronic component inspection device shown in FIG. 1. FIG.

FIG. 4 is a cross-sectional view showing a temperature adjustment section of the electronic component inspection apparatus shown in FIG. 1. FIG.

FIG. 5 is a plan view showing a replacement jig board of a temperature adjustment section of the electronic component inspection device shown in FIG. 1.

FIG. 6 is a plan view showing a casing of a temperature adjustment section of the electronic component inspection device shown in FIG. 1. FIG.

FIG. 7 is a plan view showing a baffle plate of a temperature adjustment section of the electronic component inspection device shown in FIG. 1. FIG.

FIG. 8 is a plan view for explaining the operation of the temperature adjustment section of the electronic component inspection device shown in FIG. 1.

FIG. 9 is a plan view for explaining the operation of a temperature adjustment section of the electronic component inspection device shown in FIG. 1. FIG.

FIG. 10 is a plan view showing a plate and a baffle plate above the component recovery section arranged in the component recovery area of the electronic component inspection device shown in FIG. 1.

11 is a cross-sectional view showing a component recovery section, a plate, and a baffle plate arranged in a component recovery area of the electronic component inspection apparatus shown in FIG. 1.

Fig. 12 is a plan view showing a casing of a temperature adjustment unit of a second embodiment of the electronic component inspection device of the present invention.

FIG. 13 is a plan view showing a baffle plate of a temperature adjustment unit in a second embodiment of the electronic component inspection device of the present invention.

Fig. 14 is a diagram for explaining the operation of the fourth embodiment of the electronic component inspection device of the present invention.

Fig. 15 is a flowchart showing a control operation of the fourth embodiment of the electronic component inspection device of the present invention.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the embodiments shown in the accompanying drawings.

<First Embodiment>

FIG. 1 is a schematic plan view showing a first embodiment of the electronic component inspection apparatus of the present invention. FIG. 2 to FIG. 4 are cross-sectional views each showing a temperature adjustment section of the electronic component inspection device shown in FIG. 1. FIG. 5 is a plan view showing a replacement jig board of a temperature adjustment section of the electronic component inspection device shown in FIG. 1. FIG. 6 is a plan view showing a casing of a temperature adjustment section of the electronic component inspection device shown in FIG. 1. FIG. FIG. 7 is a plan view showing a baffle plate of a temperature adjustment section of the electronic component inspection device shown in FIG. 1. FIG. 8 and 9 are plan views for explaining the operation of the temperature adjustment section of the electronic component inspection device shown in FIG. 1, respectively. FIG. 10 is a plan view showing a plate and a baffle plate above the component recovery section arranged in the component recovery area of the electronic component inspection device shown in FIG. 1. 11 is a cross-sectional view showing a component recovery section, a plate, and a baffle plate arranged in a component recovery area of the electronic component inspection apparatus shown in FIG. 1.

In the following, for convenience of explanation, as shown in FIG. 1, three axes that are orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. The XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. A direction parallel to the X axis is also referred to as "X direction", a direction parallel to the Y axis is also referred to as "Y direction", and a direction parallel to the Z axis is also referred to as "Z direction". The directions of the arrows of the X-axis, Y-axis, and Z-axis are referred to as positive sides, and the directions opposite to the arrows are referred to as negative sides. In addition, the upstream side in the conveyance direction of the electronic components is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". In addition, the so-called "horizontal" in the description of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state inclined slightly (for example, less than about 5 °) with respect to the level. The illustration of the housing 44 is omitted in FIGS. 8 and 9.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is, for example, used for inspection and testing (hereinafter referred to as “inspection”) BGA (Ball grid array) package or LGA (Land grid array, Electrical characteristics of IC components such as planar grid array (package), LCD (Liquid Crystal Display), CIS (complementary metal oxide semiconductor), Image Sensor, and CMOS image sensors Of the device. In the following, for convenience of explanation, a case where an IC element is used as the above-mentioned electronic component for inspection is representatively described, and this IC element is referred to as "IC element 90".

As shown in FIG. 1, the inspection device 1 is divided into a tray supply area A1, a component supply area (hereinafter referred to as "supply area") A2, an inspection area A3, a component recovery area (hereinafter referred to as "recycling area") A4, and a tray. Remove area A5. Further, the IC element 90 is sequentially inspected in the inspection area A3 halfway through the above-mentioned areas from the tray supply area A1 to the tray removal area A5. In this manner, the inspection apparatus 1 includes an electronic component transporting apparatus that transports IC components 90 in each area and has a control unit 80, an inspection unit 16 that performs inspection in the inspection area A3, and a detection control unit (not shown). In addition, the inspection apparatus 1 is constituted by a structure other than the inspection unit 16 and the inspection control unit. Parts transfer device.

The tray supply area A1 is an area where a tray 200 in which a plurality of IC components 90 are arranged in an unchecked state is supplied. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 is an area where a plurality of IC components 90 on the tray 200 from the tray supply area A1 are supplied to the inspection area A3, respectively. In addition, a first tray conveyance mechanism 11A and a second tray conveyance mechanism 11B that convey the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

In the supply area A2, a temperature adjustment section (a soaking plate) 12, a first component transfer head (a transfer member) 13, and a third tray transfer mechanism 15 are provided.

The temperature adjustment unit 12 is a device that heats or cools the plurality of IC elements 90 and adjusts (controls) the IC elements 90 to a temperature suitable for inspection. The configuration shown in FIG. 1 is one in which two temperature adjustment sections 12 are arranged and fixed in the Y direction. Then, the IC components 90 on the tray 200 carried in (carried in) from the tray supply area A1 by the first tray transfer mechanism 11A are transferred and placed on any one of the temperature adjustment sections 12.

The first component transfer head 13 is supported so as to be movable in the supply area A2. Thereby, the first component transfer head 13 can be responsible for transferring the IC components 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC between the temperature adjustment section 12 and the component supply section 14 described below. Transport of component 90. In addition, the first component transfer head 13 includes a plurality of holding portions (not shown) that hold the IC element 90, and each holding portion includes a suction nozzle to hold the IC element 90 by suction. The first component transfer head 13 is configured such that the plurality of holding portions can be selectively moved (approached) to the recesses 421 (the second openings 442 in the odd-numbered rows) of the odd-numbered rows in the temperature adjustment unit 12 described below. And one of the recesses 421 (the second openings 442 in the even rows) of the plural even rows. In addition, the first element transfer head 13 can heat or cool the IC element 90 in the same manner as the temperature adjustment unit 12 and adjust the IC element 90 to a temperature suitable for inspection.

The third tray transporting mechanism 15 transports all IC components 90 in the X direction. The mechanism of the removed empty tray 200. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transfer mechanism 11B.

The inspection area A3 is an area where the IC element 90 is inspected. In this inspection area A3, a component supply section (supply shuttle) 14 as a disposition member, an inspection section 16, a component recovery section (recovery shuttle) 18 as a disposition member, and a second component transfer head 17 are provided.

The component supply section 14 is a device that transports the temperature-adjusted (temperature-controlled) IC components 90 to the vicinity of the inspection section 16. The component supply unit 14 is supported between the supply area A2 and the inspection area A3 so as to be movable in the X direction. In the configuration shown in FIG. 1, two component supply sections 14 are arranged in the Y direction, and the IC components 90 on the temperature adjustment section 12 are transported and placed on either of the component supply sections 14. In addition, the component supply unit 14 can heat or cool the IC element 90 in the same manner as the temperature adjustment unit 12 and adjust the IC element 90 to a temperature suitable for inspection.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC element 90. The inspection unit 16 is provided with a plurality of probes that are electrically connected to the terminals of the IC element 90 while the IC element 90 is held. Furthermore, the terminals of the IC element 90 are electrically connected (contacted) with the probe, and the inspection of the IC element 90 is performed through the probe. The inspection of the IC device 90 is performed based on a program stored in a memory section of an inspection control section included in a tester connected to the inspection section 16. In addition, the inspection unit 16 can heat or cool the IC element 90 in the same manner as the temperature adjustment unit 12, and adjust the IC element 90 to a temperature suitable for inspection.

The second component transfer head 17 is supported to be movable within the inspection area A3. Thereby, the second component transfer head 17 can transfer and place the IC components 90 on the component supply section 14 carried in from the supply area A2 to the inspection section 16. The second component transfer head 17 includes a plurality of holding portions (not shown) that hold the IC element 90, and each holding portion includes a suction nozzle to hold the IC element 90 by suction. In addition, the second element transfer head 17 can heat or cool the IC element 90 in the same manner as the temperature adjustment unit 12, and adjust the IC element 90 to a suitable temperature. Check the temperature.

The component recovery section 18 is a device that transports the IC components 90 whose inspection has been completed in the inspection section 16 to the recovery area A4. The component recovery unit 18 is supported between the inspection area A3 and the recovery area A4 so as to be movable in the X direction. In the configuration shown in FIG. 1, two component recovery sections 18 are arranged in the Y direction in the same manner as the component supply section 14, and IC components 90 on the inspection section 16 are transported and placed in any one of the component recovery sections. Department 18. This transfer is performed by the second component transfer head 17.

The recovery area A4 is an area where the IC component 90 whose inspection has been completed is recovered. In this collection area A4, a collection tray 19, a third component transfer head (transfer member) 20, and a sixth tray transfer mechanism 21 are provided. An empty tray 200 is also prepared in the recovery area A4.

The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 1, three collection trays are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. The IC components 90 moved to the component collection section 18 of the collection area A4 are transported and placed on any of the collection trays 19 and empty trays 200. Thereby, the IC element 90 is collected and classified according to each inspection result.

The third component transfer head 20 is supported so as to be movable in the recovery area A4. Thereby, the 3rd component transfer head 20 can transfer the IC component 90 from the component collection part 18 to the collection | recovery tray 19 or the empty tray 200. In addition, the third component transfer head 20 includes a plurality of holding portions (not shown) that hold the IC element 90, and each holding portion includes a suction nozzle to hold the IC element 90 by suction.

The sixth tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction. After the conveyance, the empty tray 200 is disposed at a position where the IC components 90 are collected, so that any one of the three empty trays 200 described above can be obtained.

The tray removal area A5 is an area for collecting and removing the trays 200 in which the plurality of IC components 90 in the inspection completion state are arranged. Can be stacked in a large amount in the tray removal area A5 Of tray 200.

In addition, a fourth tray conveyance mechanism 22A and a fifth tray conveyance mechanism 22B that convey the tray 200 one by one are provided so as to span the recovery area A4 and the tray removal area A5. The fourth tray transfer mechanism 22A is a mechanism that transfers the tray 200 on which the IC components 90 having been inspected are placed from the recovery area A4 to the tray removal area A5. The fifth tray transfer mechanism 22B is a mechanism that transfers the empty tray 200 for collecting the IC components 90 from the tray removal area A5 to the collection area A4.

The inspection control unit of the tester performs inspection of the electrical characteristics of the IC element 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory not shown.

The control unit 80 controls, for example, the first tray transfer mechanism 11A, the second tray transfer mechanism 11B, the temperature adjustment unit 12, the first component transfer head 13, the component supply unit 14, the third tray transfer mechanism 15, the inspection unit 16, The second component transfer head 17, the component recovery unit 18, the third component transfer head 20, the sixth tray transfer mechanism 21, the fourth tray transfer mechanism 22A, and the fifth tray transfer mechanism 22B are driven.

The inspection device 1 is configured to allow gases such as low-humidity air (hereinafter, also referred to as dry air) to flow into specific portions. When the IC element 90 is cooled to a specific temperature for inspection, the required parts are cooled accordingly, but dew condensation can be prevented by allowing dry air to flow into the required parts. Furthermore, in this embodiment, the dry air flows into the temperature adjustment section 12, the component supply section 14, the inspection section 16, and the component recovery section 18.

Hereinafter, the configuration of the temperature adjustment unit 12 and the component recovery unit 18 will be described, but descriptions of common parts will be omitted. The component supply unit 14 is the same as the component recovery unit 18, and its description is omitted.

As shown in FIG. 2, the temperature adjustment section 12 is disposed on the base 3 of the inspection device 1. The temperature adjustment unit 12 includes a temperature control board 41, a replacement jig board (arrangement member) 42 in which a plurality of IC elements 90 are arranged, a plurality of (four in the structure shown in the figure) a bracket 43, and a housing. (Opening member) 44 and a shutter 45. The shape of the temperature adjustment section 12, that is, the shapes of the temperature control plate 41, the replacement fixture plate 42, the housing 44, and the baffle 45 are not particularly limited, but in this embodiment, viewed from the Z direction (temperature adjustment section 12 (Viewed from above), the shape is rectangular. The direction of the long side of the rectangle is the Y direction, and the direction of the short side is the X direction.

The temperature control plate 41 has a plate shape, and is fixed to the base 3 through each of the brackets 43. In this case, one end of each bracket 43 is fixed to the four corners of the temperature control plate 41, and the other end is fixed to the base 3. The temperature control plate 41 can be heated by a heating mechanism (not shown), and can be cooled by a cooling mechanism (not shown). Thereby, the IC element 90 arranged in the temperature adjustment part 12 can be heated or cooled.

The replacement jig plate 42 is detachably attached to the temperature control plate 41. The replacement fixture plate 42 can be replaced, and can be replaced with other people of the same or different type according to need. Specifically, the replacement jig plate 42 is replaced with a corresponding one based on, for example, the shape, size (size) of the IC component 90 to be inspected, or the arrangement (position) of each holding portion of the first component transfer head 13. Replace the fixture board.

As shown in FIGS. 2 and 5, on the upper surface of the replacement fixture plate 42, that is, on the side opposite to the temperature control plate 41, a plurality of recesses (electronic parts) that house (arrange) the IC device 90 are formed. Placement section) 421. Each IC device 90 is housed in each of the recesses 421, and is thereby disposed on the replacement jig plate 42.

The shape, size (size), and arrangement (position) of each pocket 421 are based on the shape, size (size) of the IC component 90 to be inspected, or the arrangement (position) of each holding portion of the first component transfer head 13. set up.

Moreover, in this embodiment, the outer shape of the IC element 90 is square (quadrilateral) when viewed from the Z direction. Therefore, the outer shape of the cavity 421 is a square (quadrilateral) corresponding to the outer shape of the IC element 90. The recesses 421 are arranged in a matrix.

The case 44 is fixed to the bracket 43. The shell 44 is a hollow cuboid Shape, and the temperature control board 41 and the fixture replacement plate 42 are housed in the inside. The inside of the casing 44 is configured to be capable of supplying dry air. By supplying dry air to the inside of the case 44, a space having a low-humidity gas atmosphere can be formed inside the case 44 (third space 53 described below).

As shown in FIGS. 2 and 6, a plurality of second wall portions 441 are formed on the upper wall portion of the housing 44 in FIG. 2, that is, the second wall portion 441 facing the recess 421 of the fixture plate 42. Opening 442.

When viewed from the Z direction, the outer shape of the second opening 442 is rectangular (rectangular). Furthermore, the direction of the long side of the rectangle is the X direction, that is, the direction orthogonal to the reciprocating direction of the baffle 45, and the direction of the short side is the Y direction, that is, the reciprocating direction of the baffle 45. The second openings 442 are arranged side by side in the Y direction. In this way, the second opening portion 442 has a long shape in the X direction. Therefore, it is possible to cope with the case where the length in the X direction of the recess 421 of the fixture plate 42 is changed or the distance between the X directions is changed.

The distance P3 in the Y direction between the second openings 442 is set to be equal to the distance P2 between the recesses 421.

When focusing on one second opening 442, the second opening 442 is disposed on each of the recesses 421 arranged in the X direction, and viewed from the Z direction, the second opening 442 includes Recesses 421 arranged in the X direction.

A gap is formed between the second wall portion 441 and the replacement jig plate 42. Accordingly, when the dry air is supplied to the inside of the case 44, the dry air will flow between the second wall portion 441 and the replacement fixture plate 42, thereby reducing the humidity around the IC element 90.

The interval d1 between the second wall portion 441 and the replacement jig plate 42 is not particularly limited and can be appropriately set according to various conditions, but it is preferably 4 mm or more and 20 mm or less, and more preferably 5 mm or more and 16 mm or less.

If the interval d1 is smaller than the lower limit value described above, when dry air is supplied to the inside of the housing 44 due to other conditions, it becomes difficult for the dry air to flow into the second wall portion 441 and Replace between the fixture plates 42. Further, even if the interval d1 is larger than the above-mentioned upper limit value, the effect that the dry air can easily flow into the space between the second wall portion 441 and the fixture replacement plate 42 cannot be expected to increase, and the thickness of the temperature adjustment portion 12 becomes thicker.

The interval d1 is preferably larger than the interval d2 between the first wall portion 451 and the second wall portion 441 of the baffle 45 described below. This allows the dry air to smoothly flow between the second wall portion 441 and the fixture replacement plate 42 when the dry air is supplied to the inside of the case 44, thereby reducing the humidity around the IC element 90.

The ratio d1 / d2 of the interval d1 and the interval d2 is not particularly limited and may be appropriately set according to various conditions, but is preferably 1.6 or more and 16 or less, and more preferably 2 or more and 4 or less.

If d1 / d2 is smaller than the lower limit value described above, when dry air is supplied to the inside of the case 44 due to other conditions, it becomes difficult for the dry air to flow between the second wall portion 441 and the fixture replacement plate 42. Moreover, even if d1 / d2 is larger than the above-mentioned upper limit value, the effect that the dry air can easily flow into the space between the second wall portion 441 and the fixture replacement plate 42 cannot be expected to increase, and the thickness of the temperature adjustment portion 12 becomes thicker.

The baffle 45 is provided to be movable (displaceable) with respect to the base 3 in at least one direction in which the IC element 90 is arranged. In this embodiment, the baffle 45 is translated (moved) in the Y direction, and performs a reciprocating motion (reciprocating motion). That is, the direction in which the baffle 45 operates is the longitudinal direction of the temperature adjustment unit 12.

It should be noted that when the long side is a shape (outer shape) of the temperature adjustment section 12 when viewed from the Z direction (in the plan view of the temperature adjustment section 12), the long side (the side extending in the Y direction) of the rectangle is rectangular. ).

Here, the direction in which the above-mentioned IC elements 90 are arranged includes the concept of including the directions in the plane in which the IC elements 90 are arranged, that is, the directions in the XY plane, and not only the directions in which the IC elements 90 are arranged. It also includes directions crossing the above directions. Therefore, the operation (shift) in at least one direction in which the IC element 90 is arranged means that Operation is performed in any direction within a plane including the direction in which the IC elements 90 are arranged.

Examples of the action (shift) include translation (movement), rotation (rotation), and the like, and combinations thereof are also included.

The translation includes, for example, straight travel or traveling on a curve, and also includes movement in progress, or temporarily interrupting the movement and changing the direction of travel. Specific examples include a case of going straight and changing the traveling direction by 90 ° halfway, a case of reciprocating motion (reciprocating motion), and the like.

The baffle 45 has a hollow rectangular parallelepiped shape, and the housing 44, the temperature control plate 41, and the replacement fixture plate 42 are housed inside the baffle 45. The space outside the baffle 45 is a first space 51, and the space inside the baffle 45 is a second space 52 that is different from the first space 51 described above. The space inside the casing 44 in the second space 52 is the third space 53. Therefore, the following first wall portion 451 of the baffle 45 is disposed between the first space 51 and the second space 52, and the two are in contact with each other. The casing 44, the temperature control plate 41, and the replacement jig plate 42 are arranged in the second space 52. Moreover, the humidity of the first space 51 and the second space 52 are different, and the humidity of the second space 52 is lower than the humidity of the first space 51. That is, the humidity in the first space 51 is not managed, and the humidity in the second space 52 is managed such that the humidity is equal to or lower than a specific humidity. Therefore, when the IC element 90 is cooled, the baffle 45 can be closed to prevent condensation from occurring in the IC element 90.

As shown in FIGS. 2 and 7, a plurality of first wall portions 451 are formed on the upper wall portion of the baffle 45 in FIG. 2, that is, the first wall portion 451 facing the second wall portion 441 of the housing 44. Opening 452.

When viewed from the Z direction, the outer shape of the first opening 452 is rectangular (rectangular). Furthermore, the direction of the long side of the rectangle is the X direction, that is, the direction orthogonal to the reciprocating direction of the baffle 45, and the direction of the short side is the Y direction, that is, the reciprocating direction of the baffle 45. The first openings 452 are arranged side by side in the Y direction. In this way, the first opening portion 452 has a long shape in the X direction. Therefore, it is also possible to respond to the replacement of the recess 421 of the fixture plate 42. When the length in the X direction or the distance between the X directions is changed.

The distance P1 in the Y direction between the first openings 452 is set to be twice the distance P2 between the recesses 421.

In addition, when focusing on one first opening 452, the first opening 452 is included in the recesses 421 arranged in the X direction, and the first opening 452 includes Each of the recesses 421 and the second openings 442 are arranged in the X direction.

A gap is formed between the first wall portion 451 and the second wall portion 441. The interval d2 between the first wall portion 451 and the second wall portion 441 is not particularly limited and can be appropriately set according to various conditions, but it is preferably 10 mm or less, more preferably 0.5 mm or more and 5 mm or less.

If the interval d2 is larger than the above-mentioned upper limit value, there is a possibility that the blocking effect of the baffle 45 becomes low due to other conditions.

The driving source of the baffle 45 is not particularly limited, and examples thereof include various motors such as various cylinders and stepping motors.

Next, the operation of the shutter 45 will be described.

First, in a state in which the baffle 45 is closed (closed state) shown in FIG. 4, the first opening 452 of the baffle 45 is disposed in two recesses 421 adjacent to each other in the Y direction of the fixture plate 42. And between the two second openings 442 adjacent to each other in the Y direction of the case 44.

When the baffle 45 is closed, when the IC element 90 is housed in the recess 421, the IC element 90 can be prevented from being exposed to the gas atmosphere of the unmanaged first space 51 such as humidity. In addition, the dry air supplied to the inside of the case 44 can be suppressed from being released from the second opening portion 442, and the humidity of the second space 52 can be easily managed.

Furthermore, in the present embodiment, when the shutter 45 is closed, the first opening portion 452 overlaps with a portion of the recess 421 and a portion of the second opening 442 when viewed from the Z direction, but it is not limited to this, and may be The first opening portion 452 is configured not to overlap the recess 421 and the second opening portion 442.

When the baffle 45 is opened from the state in which the baffle 45 has been closed, the baffle 45 is opened to the first open state (the state shown in FIGS. 2 and 8), as shown in FIGS. 2 and 8. 45 moves toward the right side (positive side in the Y direction) in FIG. 2 in the Y direction by 1 / 4‧P1. Thereby, the first opening portion 452 of the baffle 45 is disposed on the second opening portion 442 of the odd-numbered rows of the recesses 421 in the odd-numbered rows of the fixture plate 42 and the housing 44. Thereby, the IC elements 90 housed in the recesses 421 in the odd rows can be taken out, or the IC elements 90 can be housed in the recesses 421 in the odd rows. The arrangement in the X direction is referred to as the above-mentioned row, and the above-mentioned odd-numbered row and the following even-numbered row of the row are obtained by counting from the right side (upper side in FIG. 8) in FIG. 2.

On the other hand, when viewed from the Z direction, the first openings 452 do not overlap with the pockets 421 of the even-numbered rows and the second openings 442 of the even-numbered rows. Thereby, in the second opening portion 442 of the even-numbered row, the flow of the gas is suppressed between the first space 51 and the second space 52 by the baffle 45. Thereby, release of the dry air supplied to the inside of the case 44 from the second opening portion 442 of the even-numbered row can be suppressed. In the case where the IC elements 90 are housed in the recesses 421 of the even-numbered rows, the IC elements 90 housed in the recesses 421 of the even-numbered rows can be suppressed from being exposed to the gas atmosphere of the unmanaged first space 51 such as humidity in.

Then, when the shutter 45 is brought into the second opened state (the state shown in FIGS. 3 and 9), as shown in FIGS. 3 and 9, the shutter 45 is directed to the left side in FIG. 3 (Y Negative side) Move 1 / 2‧P1. Thereby, the first opening portion 452 of the baffle 45 is disposed on the second opening portion 442 of the even-numbered rows of the recesses 421 in the even-numbered rows of the fixture plate 42 and the housing 44. Thereby, the IC elements 90 accommodated in the recesses 421 of the even rows can be taken out, or the IC elements 90 can be accommodated in the recesses 421 of the even rows.

On the other hand, when viewed from the Z direction, the first openings 452 do not coincide with the recesses 421 in the odd rows and the second openings 442 in the odd rows. Accordingly, in the second openings 442 in the odd-numbered rows, the flow of the gas between the first space 51 and the second space 52 can be suppressed by the baffle 45. Thereby, it is possible to suppress the dry air supplied to the inside of the case 44 from being odd. The second opening portion 442 is released. In the case where the IC elements 90 are housed in the recesses 421 of the odd rows, it is possible to suppress the IC elements 90 housed in the recesses 421 of the odd rows from being exposed to the gas atmosphere of the unmanaged first space 51 such as humidity. in.

Then, when the shutter 45 is brought into the first open state, as shown in FIGS. 2 and 8, the shutter 45 is moved toward the right side (the positive side in the Y direction) in FIG. 2 in the Y direction by 1 / 2‧P1 Then, when the shutter 45 is set to the second opened state, as shown in FIGS. 3 and 9, the shutter 45 is moved toward the left side (the negative side in the Y direction) in FIG. 3 in the Y direction by 1 / 2‧ P1. In the following, the situation is the same.

In this way, the shutter 45 is reciprocated in the Y direction during the opening and closing action or the action of switching between the first opened state and the second opened state, but the shutter 45 switches between the first opened state and the second opened state. The one-way distance of the reciprocating movement during the movement is 1/2 of the distance P1 between the first openings 452. Therefore, switching between the first open state and the second open state, switching between the closed state and the first open state, and switching between the closed state and the second open state can be performed quickly, respectively.

Next, the component recovery unit 18 and the baffle plate and the like with respect to the component recovery unit 18 will be described. The differences from the temperature adjustment unit 12 described above will be mainly described, and the description of the same matters will be omitted.

As shown in FIG. 10 and FIG. 11, the component recovery unit 18 has a plate shape and is disposed on the base 3 of the inspection device 1 so as to be movable in the X direction. The shape of the component recovery section 18 is not particularly limited, but in this embodiment, when viewed from the Z direction (in a plan view of the component recovery section 18), the external shape is rectangular. The direction of the long side of the rectangle is the X direction, and the direction of the short side is the Y direction.

Further, on the upper surface of the component recovery portion 18, that is, the surface opposite to the base 3, there are formed a plurality of recesses (electronic component placement portions) 181 that accommodate (arrange) the IC components 90. Each IC device 90 is housed in each of the recesses 181, and is thereby placed in the device recovery unit 18.

The shape, size (size) and arrangement (position) of each pocket 181 are based on the inspection The shape, size (size) of the IC element 90, and the arrangement (position) of each holding portion of the third element transfer head 20 are set.

In addition, the outer shape of the cavity 181 has a shape corresponding to the outer shape of the IC element 90, and in this embodiment, it has a square shape (quadrilateral shape). The recesses 181 are arranged in a matrix.

Further, on the base 3 in the component recovery area A4, a plate 61 having a plate shape and having a plurality of second openings 611 and a baffle 62 having a plate shape and having a plurality of first openings 621 are disposed.

The board 61 is disposed above the component recovery section 18 when the component recovery section 18 is disposed in the component recovery area A4.

A gap is formed between the plate 61 and the component recovery unit 18. The interval d3 between the plate 61 and the component recovery unit 18 is not particularly limited and can be appropriately set according to various conditions, but a preferable value is the same as the interval d1 of the first embodiment.

Each of the second openings 611 is disposed in the same manner as each of the recesses 181. That is, when the component recovery part 18 is disposed in the component recovery area A4, each of the second openings 611 is disposed on each of the recesses 181. Therefore, the distance in the X direction and the distance in the Y direction of the second opening portion 611 are set to be equal to the distance in the X direction and the distance in the Y direction of the cavity 181, respectively.

In addition, when viewed from the Z direction, the external system of the second opening portion 611 has a shape corresponding to the recess 181, and in this embodiment, it has a square shape (quadrilateral shape). Further, in a state where the second opening portion 611 is disposed on the recess 181, the second opening portion 611 includes the recess 181 as viewed from the Z direction.

The baffle 62 is disposed above the plate 61. The baffle 62 is provided to be movable (displaceable) with respect to the board 61 in at least one direction in which the IC element 90 is arranged. In this embodiment, the baffle 62 is translated (moved) in the Y direction, and reciprocated (reciprocated). An example of a mechanism that can support the baffle 62 in a translatable manner is as follows.

First, the four sliding members 63 are fastened to the four corners of the plate 61 by bolts 64. The sliding member 63 may be fixed or may be rotated.

The sliding member 63 is configured by a pair of large diameter portions 631 and 632 and a small diameter portion 633 arranged between the large diameter portion 631 and the large diameter portion 632. The constituent material of the sliding member 63 is not particularly limited, but it is preferably a material having less friction with respect to the baffle 62, and examples thereof include various resin materials such as a fluorine-containing resin. In addition, the sliding member 63 may have a layer formed on a surface of the sliding member 63 with a material having less friction with respect to the baffle 62.

On the other hand, in the four corners of the baffle 62, long holes 622 that are longer in the Y direction are formed. Further, each slide member 63 is inserted into each of the long holes 622. That is, a baffle 62 is disposed between the large-diameter portion 631 and the large-diameter portion 632 of each sliding member 63. Thereby, the baffle 62 is supported by the sliding members 63 in a translatable manner.

A gap is formed between the baffle 62 and the plate 61. The interval d4 between the baffle 62 and the plate 61 is not particularly limited and can be appropriately set according to various conditions, but a preferable value is the same as the interval d2 of the first embodiment. The relationship between the interval d3 and the interval d4 is the same as that of the first embodiment. In this case, the interval d1 and the interval d3 of the first embodiment can be replaced, and the interval d2 and the interval d4 of the first embodiment can be replaced. Replacement.

Each of the first openings 621 is disposed in the same manner as each of the recesses 181. That is, the distance in the X direction and the distance in the Y direction of the first openings 621 are set to be equal to the distance in the X direction and the distance in the Y direction of the pockets 181, respectively.

In addition, when viewed from the Z direction, the shape of the outer portion of the first opening portion 621 is a shape corresponding to the cavity 181 and the second opening portion 611, and in this embodiment, it is square (quadrilateral). In addition, in a state where the first opening portion 621 is disposed on the recess 181, the first opening portion 621 includes the recess 181 and the second opening portion 611 as viewed from the Z direction.

In addition, the space on the upper side in FIG. 11 of the baffle 62 is the first space 51, the space on the lower side in FIG. 11 of the baffle 62 is the second space 52, and the baffle 62 is connected to the first space 51 and the first space 51. 2 spaces 52 are connected. The board 61 and the component recovery unit 18 are arranged in the second space 52.

Next, the operation of the baffle 62 will be described.

First, when the baffle 62 is opened from the state where the baffle 62 shown in FIGS. 10 and 11 is closed, the baffle 62 is directed toward the lower side (the positive side in the Y direction) in FIG. 10 in the Y direction. Move 1 / 2‧P1. Thereby, the 1st opening part 621 of the baffle 62 is arrange | positioned in the recess 181 of the component collection part 18, and the 2nd opening part 611 of the board 61. Thereby, the IC device 90 accommodated in the cavity 181 can be taken out, or the IC device 90 can be accommodated in the cavity 181.

When the shutter 62 is closed, the shutter 62 is moved toward the upper side (the negative side in the Y direction) in FIG. 10 in the Y direction by 1/2 · P1. Thereby, as shown in FIG. 10 and FIG. 11, the first opening portion 621 of the baffle 62 is retracted from the recess 181 of the component recovery portion 18 and the second opening portion 611 of the plate 61, and is thus viewed from the Z direction. The opening portion 621 does not overlap with the pocket 181 and the second opening portion 611. Accordingly, the baffle 62 suppresses the flow of gas between the first space 51 and the second space 52.

As such, the flapper 62 reciprocates in the Y direction during the opening and closing operation, but the one-way distance of the flapper 62's reciprocating motion is 1/2 of the distance between the first openings 621 and P1. Therefore, the shutter 62 can be quickly opened and closed.

The component supply area A2, the inspection area A3, and the component recovery area A4 are communicated through a tunnel (not shown), and the component supply section 14 and the component recovery section 18 move in the tunnel, and dry air flows into the section. Inside the tunnel. Therefore, the shutter 62 can be closed to prevent the dry air from being released from the second opening portion 611 of the plate 61.

In addition, in this embodiment, the baffle 45 of the temperature adjustment section 12 is configured so that the second openings 442 (cavities 421) in the odd rows and the second openings 442 (cavities 421) in the even rows Only one of them is closed, and only the other is opened. However, the present invention is not limited to this. For example, all the second openings 442 can be opened and closed simultaneously. That is, the baffle 45 may The structure is the same as that of the baffle 62, for example.

Moreover, in this embodiment, the distance P1 in the Y direction between the first openings 452 of the baffle 45 is set to be twice the distance P2 between the recesses 421 of the fixture plate 42, but it is not limited to this. For example, it may be The pitch P1 is set to n times the pitch P2 (n is a natural number).

Moreover, in this embodiment, the shutter 62 of the component recovery part 18 is provided separately from the component recovery part 18, but it is not limited to this, the component recovery part 18 may have a shutter.

In addition, the component supply unit 14 may be provided with or without a baffle. When a baffle is provided, it can be comprised similarly to the case of the said component recovery part 18.

<Second Embodiment>

Fig. 12 is a plan view showing a casing of a temperature adjustment unit of a second embodiment of the electronic component inspection device of the present invention. FIG. 13 is a plan view showing a baffle plate of a temperature adjustment unit in a second embodiment of the electronic component inspection device of the present invention.

Hereinafter, the second embodiment will be described, but the differences from the first embodiment will be mainly described, and descriptions of the same matters will be omitted.

The inspection device 1 of the second embodiment is the same as the first embodiment except that the shape of the second opening 442 of the casing 44 of the temperature adjustment section 12 and the first opening 452 of the baffle 45 are different from those of the first embodiment. The form is the same.

As shown in FIG. 12, the second openings 442 of the housing 44 are arranged in the same manner as the recesses 421 of the fixture plate 42. That is, each of the second openings 442 is disposed on each of the recesses 421. Therefore, the distance in the X direction and the distance in the Y direction P3 of the second openings 442 are set to be equal to the distance in the X direction and the distance P2 in the Y direction, respectively.

In addition, when viewed from the Z direction, the outer shape of the second opening 442 has a shape corresponding to the recess 421, and in this embodiment, it has a square (quadrilateral) shape. When viewed from the Z direction, the second opening 442 includes a recess 421.

As shown in FIG. 13, when viewed from the Z direction, the outer shape of the first opening portion 452 of the baffle 45 has a shape corresponding to the recess 421 and the second opening portion 442 of the fixture plate 42. The shape is a square (quadrilateral) in this embodiment. In addition, in a state where the first opening portion 452 is disposed on the recess 421, the first opening portion 452 includes the recess 421 and the second opening portion 442 as viewed from the Z direction.

In this way, the first opening portion 452 has a shape corresponding to the cavity 421 and the second opening portion 442. Therefore, compared with the first embodiment, when the IC device 90 is housed in the cavity 421, When the plate 45 is closed, the IC element 90 can be prevented from being exposed to the gas atmosphere of the first space 51, and the dry air supplied to the inside of the case 44 can be prevented from being released from the second opening 442, and can be easily managed. Humidity of the second space 52.

In addition, the distance in the X direction of the first openings 452 is set to be equal to the distance in the X direction of the recesses 421, and the distance in the Y direction of the first openings 452 is set to 2 between the Y directions of the recesses 421. Times.

The second embodiment described above can also achieve the same effect as the first embodiment.

The combination of the baffle 45 and the case 44 is not limited to the second embodiment and the first embodiment described above. For example, the baffle 45 of the first embodiment may be combined with the case of the second embodiment. The baffle 45 of the second embodiment may be combined with the case of the first embodiment.

<Third Embodiment>

Hereinafter, the third embodiment will be described, but the differences from the first embodiment will be mainly described, and descriptions of the same matters will be omitted.

In the inspection device 1 according to the third embodiment, the baffle 45 of the temperature adjustment unit 12 can be replaced, and if necessary, it can be replaced with other same or different types.

Specifically, the baffle 45 can be replaced with at least one different baffle having the shape, size (size), and position (position) of the first opening 452, and in particular, it can be replaced with the size and position of the first opening 452. At least one of them is different. The size of the first opening 452 of the baffle 45 is set based on the size of the IC element 90. Moreover, the bezel 45 is based For example, the shape, size (size) of the IC component 90 to be inspected, or the arrangement (position) of each holding portion of the first component transfer head 13 is replaced with a corresponding baffle.

The baffle 45 may be replaced as a whole or a part of it. When a part of the baffle 45 can be replaced, for example, the first wall portion 451 in the baffle 45 can be replaced.

In the case where the first wall portion 451 in the baffle 45 is replaceable, the method of fixing the first wall portion 451 is not particularly limited, but examples thereof include screwing and magnetization.

The third embodiment described above can also achieve the same effect as the first embodiment.

Moreover, since the baffle 45 is replaceable, it can correspond to IC elements 90 of various sizes.

In addition, the first wall portion 451 of the baffle 45 can be replaced. Compared with the case where the whole can be replaced, the replacement operation is easier, and the cost required for the preparation of replacement components can be reduced. .

The third embodiment is also applicable to the second embodiment described above.

Furthermore, the present embodiment has been described by taking the case where the baffle 45 of the temperature adjustment unit 12 is replaceable as an example, but it is not limited to this, the case 44 may be replaced, and the baffle 45 and the case 44 may be replaced. Can also be replaced.

In addition, one or both of the baffle 62 and the plate 61 of the component recovery unit 18 may be replaced.

When a baffle and a plate for the component supply unit 14 are provided, either or both of the baffle and the plate may be replaced.

<Fourth Embodiment>

FIG. 14 is a diagram for explaining the operation of the fourth embodiment of the electronic component inspection device of the present invention. Fig. 15 shows a fourth embodiment of the electronic component inspection apparatus of the present invention Flow chart of control actions.

Hereinafter, the fourth embodiment will be described, but the differences from the first embodiment will be mainly described, and descriptions of the same matters will be omitted.

The inspection apparatus 1 according to the fourth embodiment is configured to open the shutter when the conveying member moves toward the arranging member. This control can also be applied to any one of the shutter 45 of the temperature adjustment section 12, the shutter 62 for the component recovery section 18, and the shutter for the component supply section 14. Hereinafter, a case where the above-mentioned control is applied to the shutter 45 of the temperature adjustment unit 12 will be representatively described. In this case, there may be a case where the first component transfer head 13 transfers the IC component 90 arranged on the tray 200 to the temperature adjustment section 12, and the first component transfer head 13 transfers the IC component 90 arranged on the temperature adjustment section 12. A case where the IC component 90 is transported to the component supply unit 14 will be described below as a representative case.

As shown in FIG. 14, when the inspection device 1 of the fourth embodiment is in the case where the first component transfer head 13 transfers the IC components 90 arranged on the tray 200 to the temperature adjustment unit 12, the control unit 80 controls the first When the one-component conveying head 13 is moved toward the replacement jig plate 42 of the temperature adjustment section 12, the shutter 45 is opened. In addition, based on the position at which the first component transfer head 13 moves toward the replacement jig plate 42 of the temperature adjustment unit 12 (for example, the total moving distance of the first component transfer head 13), a setting is made to start the operation of opening the shutter 45. time.

Here, for example, if the shutter 45 is opened before the first component transfer head 13 starts to move from the position of the tray 200, the time during which the shutter 45 is opened becomes longer, and during this period, the dry air from the temperature adjustment section 12 It is also revealed that, if the shutter 45 is opened after the first component transfer head 13 reaches the temperature adjustment section 12, the time required for the IC component 90 to be transferred becomes longer. However, in the present embodiment, the shutter 45 can be opened when the first component transfer head 13 is moved toward the replacement fixture plate 42 of the temperature adjustment section 12, and the release of dry air from the temperature adjustment section 12 can be suppressed. Shorten the transportation of IC components 90 Time.

The position of the tray 200 is the position where the first component transfer head 13 starts to move (moving start position), and the position of the replacement jig plate 42 of the temperature adjustment unit 12 is the position where the first component transfer head 13 ends moving (movement End position).

In addition, each position such as the movement start position and the movement end position may be, for example, a position in the XY plane, or may further include a position in the Z direction. However, the following will be representative of the positions in the XY plane. To explain.

Similarly, the moving distance and the total moving distance of the first component transfer head 13 described below may be, for example, the moving distance and the total moving distance in the XY plane, and may further include the moving distance and the total moving distance in the Z direction, but Hereinafter, a case where the moving distance and the total moving distance in the XY plane are representatively described.

First, the time for starting the operation of opening the shutter 45 is not particularly limited as long as the movement of the first component transfer head 13 is in progress, but in this embodiment, as shown in FIG. 14, this time is set to the first time. When the moving distance from the moving start position of the 1-component conveying head 13 becomes smaller than the specific value A of the total moving distance from the moving start position to the moving end position of the first component conveying head 13.

The specific value A may be a fixed value in advance, or may be determined based on specific conditions. The specific value A may be specified as a relative value with respect to the total moving distance, for example.

When the specific value A is fixed in advance, it has the advantage of simple control. In addition, for example, when the total moving distance from the movement start position to the movement end position of the first component transfer head 13 is fixed and the speed at which the shutter 45 is opened is fixed, the error is also small, so it is effective.

The specific value A is preferably set in a range of 60% to 95% of the total moving distance, and more preferably set in a range of 80% to 95%.

If the specific value A is less than the above lower limit value, it is different from the first element due to other conditions. The shutter 45 is opened before the transport head 13 is sufficiently close to the movement end position, so that the time during which the shutter 45 is opened becomes longer.

If the specific value A is larger than the above-mentioned upper limit value, the first component transfer head 13 reaches the movement end position before the shutter 45 is completely opened due to other conditions, so that the time required for the transfer of the IC component 90 changes. long.

When the specific value A is determined based on specific conditions, the specific conditions include, for example, the movement speed, the movement start position, the movement end position, and the total movement distance of the first element transfer head 13. At this time, for example, when the movement of the opening of the shutter 45 is started when the moving distance of the first component conveying head 13 becomes a specific value A, the first component conveying head 13 is opened when the shutter 45 is opened. In the method of moving to the movement end position or a position slightly before the movement end position, a calibration curve for determining a specific value A or a calculation formula is obtained in advance, and is stored in advance in a memory section (not shown) of the control section 80 in. When the control unit 80 moves the first component transfer head 13 and opens the shutter 45, the control unit 80 reads the calibration curve from the memory unit, and obtains a specific value A based on the calibration curve and the specific conditions described above. With this, for example, even when the movement speed, the movement start position, the movement end position, and the total movement distance of the first component transfer head 13 are different, the exact value A can be obtained as the specific value A.

Next, an example is given, and the control operation of the control unit 80 when the shutter 45 is opened will be described based on FIG. 15.

As shown in FIG. 15, first, the jig plate 42 is moved from the tray 200 toward the temperature adjustment unit 12 to start the movement of the first component transfer head 13 (step S101).

Then, the moving distance of the first component transfer head 13 is detected (step S102). The control unit 80 has grasped the position of the first component transfer head 13, and therefore, the above-mentioned moving distance can be obtained without performing a special detection here.

Then, it is determined whether the moving distance of the first component conveying head 13 has reached 90% of the total moving distance (step S103), and it is determined that the moving distance has not reached 90% of the total moving distance. When it is working, return to step S102 and execute the steps after step S102 again.

When it is determined in step S103 that the moving distance has reached 90% of the total moving distance, the operation of opening the shutter 45 is started (step S104). Hereinafter, the baffle 45 is completely opened, so that the IC component 90 is accommodated in the recess 421 of the replacement fixture plate 42.

The fourth embodiment described above can also achieve the same effect as the first embodiment.

The fourth embodiment is also applicable to the above-mentioned second and third embodiments.

The electronic component transfer device and the electronic component inspection device of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part can be replaced with any configuration having the same function. Moreover, you may add another arbitrary structure.

The present invention may be a combination of any two or more configurations (features) in each of the above embodiments.

In the above-mentioned embodiment, a plurality of openings are formed in the baffle. However, the present invention is not limited to this. For example, the openings may be omitted.

Claims (18)

An electronic parts conveying device, comprising: a conveying member for conveying electronic parts; a disposing member having a plurality of electronic part disposing parts capable of disposing the electronic parts; and a baffle plate having an opening part and provided on the opposite side. Above the vertical position of the arranging member, it can move relative to the arranging member to the first position that is the first open state, that is, the first position, and the position that is different from the first position and that is the second open state, that is, the first 2 position; and when the baffle moves to the first position, the opening portion moves to a vertical position above one of the electronic component placement portions; when the baffle moves to the second position, the above The opening portion moves vertically above the other electronic component placement portion. According to the electronic component transfer device of claim 1, wherein the shutter is provided with a plurality of the openings. For example, the electronic component conveying device according to claim 1 or 2, wherein the arrangement member is provided with a plurality of concave portions, and the electronic component arrangement portion is the concave portion. For example, the electronic component transfer device of claim 1 or 2, wherein the humidity of the first space above the plumb of the baffle is different from the humidity of the second space below the plumb of the baffle. For example, the electronic component transfer device of claim 1 or 2, wherein the humidity in the second space is lower than the humidity in the first space. The electronic component transfer device according to claim 1 or 2, further comprising an opening member disposed between the baffle plate and the arrangement member and having a plurality of second opening portions. The electronic component conveying device according to claim 6, wherein an interval between the opening member and the arrangement member is larger than an interval between the opening member and the baffle. The electronic component conveying device according to claim 1 or 2, further comprising a sliding member that operatively supports the baffle. For example, if the electronic component transfer device of item 1 or 2 is requested, the action of the above baffle is translation. For example, in the electronic component transfer device of claim 1 or 2, the baffle plate may be replaced with a baffle plate having a size different from that of the first opening portion and a position of the first opening portion. For example, the electronic component transfer device according to claim 10, wherein the size of the first opening is set based on the size of the electronic component. For example, the electronic component transfer device of claim 1 or 2, wherein the distance between the plurality of first openings is twice the distance between the plurality of electronic component placement portions provided on the arrangement member and the electronic component. For example, the electronic component conveying device of claim 1 or 2, wherein the baffle can reciprocate, and the one-way distance of the reciprocating movement of the baffle is 1/2 of the distance between the first openings. For example, the electronic component conveying device of claim 1 or 2 includes a conveying member capable of conveying the electronic component, and the shutter is opened when the conveying member moves toward the arrangement member. For example, the electronic component conveying device according to claim 14, wherein the time for starting the operation of opening the shutter is set based on the position where the conveying member starts moving toward the disposing member. For example, in the electronic component transporting device of claim 14, the time for starting the operation of opening the shutter is that the moving distance of the transporting member from the time when the transporting member starts to move toward the arrangement member becomes smaller than the movement of the transporting member to the arrangement At a certain value of the total travel distance up to the component. For example, the electronic component transfer device of claim 16, wherein the specific value is within a range of 60% to 95% of the total moving distance. An electronic component inspection device is characterized by comprising: a conveying member that conveys electronic parts; a arranging member that has a plurality of electronic part arranging sections that can arrange the electronic parts; and a baffle that has an opening and is provided opposite to The vertical position of the arranging member can be moved relative to the arranging member to the first position, which is the first open state, and the second position, which is a position different from the first position, and the second open state. And an inspection section for inspecting the above-mentioned electronic component; and when the shutter is moved to the first position, the opening is moved to a vertical position above one of the electronic component placement sections; and the shutter is moved to the shutter In the case of the second position, the opening portion is moved vertically above the other electronic component placement portion.