TWI586970B - Electronic parts conveyor and electronic parts inspection device - Google Patents

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

For example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (integrated circuit) component has been known, and the electronic component inspection device is loaded with an IC component for transporting the IC component to the inspection unit. The electronic component transport device up to the holding unit. In the inspection of the IC element, the IC element is placed in the holding portion, and the plurality of probes provided in the holding portion are brought into contact with the respective terminals of the IC element.

The inspection of such an IC component is carried out by cooling the IC component to a specific temperature. Patent Document 1 describes an IC handler including a soaking chamber and a test chamber which are set to have a specific temperature inside, and an IC wafer is inspected in a test chamber. Further, in order to cool the IC device, a refrigerating device that supplies cold air to the soaking chamber and the test chamber is used. The freezer is placed on the floor in a manner separate from the IC handler and adjacent to the IC handler.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-46904

However, in the case of, for example, the case where the IC handler is moved and transported, the refrigerating apparatus must also be transported together, and the transporting operation becomes complicated. Also, the transfer operation system The pipe connecting the IC handler and the freezing device is temporarily released, and then the pipe is temporarily released. Further, at the transfer destination, it is necessary to re-connect the IC handler to the freezer by using the piping again, which complicates the installation work.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which are easy to carry out after a conveyance operation or a conveyance.

The present invention has been developed in order to solve at least some of the above problems, and can be realized as the following aspects or application examples.

[Application 1]

The electronic component transport apparatus of the present invention includes an electronic component placement unit in which electronic components are disposed, and a refrigerant supply device that is disposed vertically above the electronic component placement unit and supplies the refrigerant to the electronic component placement unit.

With this configuration, the refrigerant supply device is placed in advance. Therefore, the refrigerant supply device can be transported together, and the transport operation can be facilitated. In addition, the transportation can be performed without releasing the piping between the refrigerant supply device and the electronic component placement unit. Therefore, the installation work after the transportation becomes easy.

[Applicable Example 2]

Preferably, the electronic component conveying apparatus of the present invention includes: an inspection unit arranging unit that can arrange an inspection unit for inspecting the electronic component; and a tester arrangement space in which a test machine connected to the inspection unit is disposed, and The position of the center of gravity of the refrigerant supply device viewed from above in the vertical direction is located in a region other than the region from the vertical upper side of the test machine arrangement space.

As a result, the center of gravity of the electronic component transport device before being loaded with the refrigerant supply device is moved to the center of gravity of the refrigerant supply device, and is placed in a region other than the region in which the tester is disposed in the same manner as the center of gravity. With such a configuration, the inspection device is stabilized Ground setting.

[Applicable Example 3]

Preferably, in the electronic component conveying apparatus of the present invention, the refrigerant supply device is disposed vertically above the path for transporting the electronic component.

Thereby, there is a tendency that the air directly under the refrigerant supply device is cooled and accumulated. Also, due to the air, the surrounding of the mounted electronic components is also cooled, so that the cooling efficiency is improved.

[Applicable Example 4]

In the electronic component conveying apparatus of the present invention, the refrigerant supply device and the electronic component placement unit are connected by a first pipe through which the refrigerant flows, and the first pipe is covered by the second pipe, and the first pipe is At least a portion of the piping and the second piping are filled with a gas of a predetermined humidity.

Thereby, condensation can be prevented from occurring inside or outside the second pipe.

[Applicable Example 5]

Preferably, in the electronic component conveying apparatus of the present invention, the liquid leakage receiving portion that receives the leakage of the refrigerant from the refrigerant supply device is provided below the refrigerant supply device, and the liquid leakage is performed from the above The liquid leakage receiving portion flows to the pipe vertically below.

Thereby, it is possible to prevent the liquid from scattering to the area where the electronic component arrangement portion is disposed.

[Applicable Example 6]

Preferably, in the electronic component conveying apparatus of the present invention, casters are provided vertically below the electronic component arrangement portion.

Thereby, the transfer operation becomes easy.

[Applicable Example 7]

An electronic component inspection device according to the present invention includes: an electronic component arrangement portion in which an electronic component is disposed, and is disposed vertically above the electronic component placement portion; and supplies the refrigerant to the above A refrigerant supply device for the electronic component placement unit and an inspection unit for inspecting the electronic component.

With this configuration, the refrigerant supply device is placed in advance. Therefore, the refrigerant supply device can be transported together, and the transport operation can be facilitated. In addition, the transportation can be performed without releasing the piping between the refrigerant supply device and the electronic component placement unit. Therefore, the installation work after the transportation becomes easy.

1‧‧‧Inspection device (electronic parts inspection device)

4‧‧‧ tube

11A, 11B‧‧‧Tray transport mechanism

12‧‧‧Temperature adjustment unit (soaking plate)

13‧‧‧Component transport head

14‧‧‧Component supply unit (supply shuttle)

15‧‧‧Tray transport mechanism

16‧‧‧Inspection Department

17‧‧‧Component head

18‧‧‧Component Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧Component head

21‧‧‧Tray transport mechanism

22A, 22B‧‧‧Tray transport mechanism

29‧‧‧ Inspection Department Configuration Department

30‧‧‧Electronic Parts Configuration Department

31‧‧‧ beams

41‧‧‧1st piping

42‧‧‧2nd piping

43‧‧‧Insulation

44‧‧‧ Positioning members

51‧‧‧1st liquid leakage receiving unit

52‧‧‧Pipe

53‧‧‧Second liquid leakage receiving unit

61‧‧‧ casters

62‧‧‧Adjustment feet

70‧‧‧ front casing

71‧‧‧ side shell

72‧‧‧ side shell

73‧‧‧ rear casing

74‧‧‧ top shell

80‧‧‧Control Department

90‧‧‧IC components

200‧‧‧Tray

300‧‧‧Cooling unit

301‧‧‧ storage tank

302‧‧‧flow path

303‧‧‧Supply path

304‧‧‧ valve

305‧‧‧vaporization room

307‧‧‧ heat exchanger

308‧‧‧Insulation

309‧‧‧Drainage path

310‧‧‧ check valve

311‧‧‧ heat exchanger

312‧‧‧Cryogenic fluid chamber

313‧‧‧ Dry air supply source

314‧‧‧High temperature fluid chamber

315‧‧‧Air heater

316‧‧‧ check valve

400‧‧‧ cabinet

441‧‧‧Defects (through holes)

500‧‧‧Connecting Department

521‧‧‧ mouth

600‧‧‧Tester

A1‧‧‧Tray supply area

A2‧‧‧Component supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Component recycling area (recycling area)

A5‧‧‧Tray removal area

A6‧‧‧Tester configuration space

C‧‧‧Refrigerant

CG ₁ , CG ₃₀₀ ‧ ‧ center of gravity

DA‧‧‧dry air

T‧‧‧thickness

d _1-1 , d _2-1 ‧‧‧outer diameter

d _1-2 , d _2-2 ‧‧‧Inner diameter

Fig. 1 is a schematic perspective view of the electronic component conveying device (first embodiment) of the present invention as seen from the front side.

Fig. 2 is a schematic perspective view of the electronic component conveying device (first embodiment) of the present invention as seen from the back side.

Fig. 3 is a schematic plan view showing an electronic component inspection device (first embodiment) of the present invention.

Fig. 4 is a schematic plan view showing an electronic component inspection device (first embodiment) of the present invention.

Fig. 5 is a schematic plan view showing an electronic component inspection device (first embodiment) of the present invention.

Fig. 6 is a schematic front view showing an electronic component inspection device (first embodiment) of the present invention.

FIG. 7 is a schematic configuration diagram showing the internal structure of a refrigerant supply device provided in the electronic component conveying device of the present invention.

FIG. 8 is a view showing a piping state between the refrigerant supply device and the cooling target in the electronic component inspection device (first embodiment) of the present invention.

Figure 9 is a cross-sectional view taken along line A-A of Figure 8.

Figure 10 is a cross-sectional view taken along line B-B of Figure 8.

Fig. 11 is a view showing the outline of the electronic component inspection device (second embodiment) of the present invention; view.

FIG. 12 is a transverse cross-sectional view showing a state of piping between a refrigerant supply device and a cooling target in the electronic component inspection device (third embodiment) of the present invention.

FIG. 13 is a view showing a piping state between the refrigerant supply device and the cooling target in the electronic component inspection device (fourth embodiment) of the present invention.

Fig. 14 is a view showing a state of piping between a refrigerant supply device and a cooling target in the electronic component inspection device (fifth embodiment) of the present invention.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on preferred embodiments shown in the drawings.

<First embodiment>

Fig. 1 is a schematic perspective view of the electronic component conveying device (first embodiment) of the present invention as seen from the front side. Fig. 2 is a schematic perspective view of the electronic component conveying device (first embodiment) of the present invention as seen from the back side. 3 to 5 are schematic plan views showing an electronic component inspection device (first embodiment) of the present invention. Fig. 6 is a schematic front view showing an electronic component inspection device (first embodiment) of the present invention. FIG. 7 is a schematic configuration diagram showing the internal structure of a refrigerant supply device provided in the electronic component conveying device of the present invention. FIG. 8 is a view showing a piping state between the refrigerant supply device and the cooling target in the electronic component inspection device (first embodiment) of the present invention. Figure 9 is a cross-sectional view taken along line A-A of Figure 8. Figure 10 is a cross-sectional view taken along line B-B of Figure 8. In the following description, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical (gravity direction). Further, the direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". Moreover, the upstream side of the conveyance direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Moreover, the so-called "level" in the present specification is not limited to the full level, as long as it does not hinder the transfer of electronic parts. It also includes a state of tilting relative to a certain number of levels (for example, less than about 5°).

The inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 and FIG. 2 is used, for example, for inspection, testing (hereinafter referred to as "inspection") BGA (Ball Grid Array) package or LGA (Land (Land) Grid array, planar gate array, etc. IC components such as IC components, LCD (Liquid Crystal Display), CIS (CMOS (complementary metal oxide semiconductor) Image Sensor, CMOS image sensor) The device for electrical characteristics. In the following, for convenience of explanation, the case where the IC component is used as the above-described electronic component for inspection is representatively described, and the IC component is referred to as "IC component 90".

Further, the inspection device 1 is covered by an outer casing, and has, for example, a front outer casing 70, side outer casings 71 and 72, a rear outer casing 73, and a top outer casing 74.

As shown in FIG. 3 and FIG. 4, the inspection apparatus 1 is divided into a tray supply area A1, a component supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, and a component collection area (hereinafter referred to as "recovery area"). A4, and the tray removal area A5. Further, the IC element 90 is sequentially inspected in the inspection area A3 in the middle through the above-described respective areas from the tray supply area A1 to the tray removal area A5. In this manner, the inspection apparatus 1 is an electronic component transport apparatus that transports the IC component 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 80.

In addition, the inspection apparatus 1 sets the side on which the tray supply area A1 and the tray removal area A5 are disposed to the front side (see FIG. 1), and the side opposite to the front side, that is, the side on which the inspection area A3 is disposed. It is used on the back side (see Fig. 2).

The tray supply area A1 is supplied with an area of the tray 200 in which a plurality of IC elements 90 in an unchecked state are arranged. In the tray supply area A1, a large number of trays 200 can be stacked.

The supply area A2 supplies a plurality of IC elements 90 disposed on the tray 200 from the tray supply area A1 to the area of the inspection area A3. Furthermore, to supply across the tray In the form of the area A1 and the supply area A2, the tray transport mechanisms 11A and 11B that transport the trays 200 one by one are provided.

In the supply area A2, a temperature adjustment unit (heating plate) 12, a component transfer head 13, and a tray conveyance mechanism (first conveyance device) 15 are provided.

The temperature adjustment unit 12 heats or cools a plurality of IC elements 90 to adjust the IC element 90 to a temperature suitable for inspection. In the configuration shown in FIGS. 3 and 4, the temperature adjustment unit 12 is disposed and fixed in the Y direction. Then, the IC component 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported and placed on any of the temperature adjustment units 12.

The component transfer head 13 is movably supported in the supply area A2. Thereby, the component transfer head 13 can be responsible for the transfer of the IC component 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the IC component 90 between the temperature adjustment unit 12 and the component supply unit 14 described below. Transfer.

The tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state in which all the IC elements 90 have been removed in the X direction. Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

The inspection area A3 is an area in which the IC component 90 is inspected. In the inspection area A3, a component supply unit (supply shuttle) 14, an inspection unit 16, a component transfer head 17, and a component collection unit (recycling shuttle) 18 are provided.

The component supply unit 14 is a device that transports the temperature-adjusted IC device 90 to the vicinity of the inspection unit 16. The component supply unit 14 is supported between the supply region A2 and the inspection region A3 so as to be movable in the X direction. Further, in the configuration shown in FIGS. 3 and 4, two component supply portions 14 are disposed in the Y direction, and the IC device 90 on the temperature adjustment portion 12 is transported and placed on any of the component supply portions 14.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC component 90. Further, the inspection unit 16 is disposed in the slot of the inspection unit arrangement unit 29, and is disposed relative to the inspection unit arrangement unit 29 It can be freely loaded and unloaded (refer to Figure 4). Thereby, the inspection unit 16 can be replaced according to the type of the IC component 90 or the like. The inspection unit 16 is provided with a plurality of probes electrically connected to the terminals of the IC element 90 while the IC element 90 is held. Each probe system is electrically connected to an inspection control unit provided in the testing machine 600 connected to the inspection unit 16 . Further, the terminal of the IC element 90 is electrically connected (contacted) to the probe, and the IC element 90 is inspected via the probe. The inspection of the IC component 90 is performed based on the program stored in the above-described inspection control section. Further, the inspection unit 16 can heat or cool the IC element 90 in the same manner as the temperature adjustment unit 12, and adjust the IC element 90 to a temperature suitable for inspection.

The component transfer head 17 is movably supported in the inspection area A3. Thereby, the element transfer head 17 can transport and mount the IC element 90 on the component supply unit 14 carried in from the supply area A2 to the inspection unit 16.

The component recovery unit 18 is a device that transports the IC component 90 in the inspection unit 16 to the collection area A4. The component recovery unit 18 is supported between the inspection region A3 and the recovery region A4 so as to be movable in the X direction. In the configuration shown in FIG. 3 and FIG. 4, the component collection unit 18 is disposed in the Y direction in the same manner as the component supply unit 14, and the IC component 90 on the inspection unit 16 is transported and placed. A component recovery unit 18. This transfer is performed by the component transfer head 17.

The recycling area A4 will check the area where the completed IC component 90 is recovered. In the collection area A4, a collection tray 19, a component transfer head 20, and a tray conveyance mechanism 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared.

The recovery tray 19 is fixed in the collection area A4, and in the configuration shown in FIGS. 3 and 4, three are arranged along the X direction. Further, the empty tray 200 is also arranged in three along the X direction. Then, the IC element 90 moved to the component collection unit 18 of the collection area A4 is transported and placed on any of the collection trays 19 and the empty trays 200. Thereby, the IC element 90 is recovered and classified according to each inspection result.

The component transfer head 20 is movably supported in the recovery area A4. With this, Yuan The transfer head 20 can transport the IC component 90 from the component recovery unit 18 to the recovery tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction. Further, after the transfer, the empty tray 200 is placed at a position where the IC element 90 is collected, and any of the three empty trays 200 can be obtained.

The tray removal area A5 is an area in which the trays 200 of the plurality of IC elements 90 in the inspection end state are collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

Further, the tray transport mechanisms 22A and 22B that transport the trays 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC element 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports the empty tray 200 for collecting the IC component 90 from the tray removal area A5 to the collection area A4.

The control unit 80 has, for example, a drive control unit. The drive control unit controls, for example, the tray conveyance mechanisms 11A and 11B, the temperature adjustment unit 12, the component transfer head 13, the component supply unit 14, the tray conveyance mechanism 15, the inspection unit 16, the component transfer head 17, the component collection unit 18, and the component transfer head. 20. Driving of each portion of the tray transport mechanism 21 and the tray transport mechanisms 22A, 22B.

In addition, the inspection control unit of the test machine 600 performs inspection of electrical characteristics of the IC component 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).

The inspection apparatus 1 described above is configured such that the element transfer head 13 and the component supply unit 14 in addition to the temperature adjustment unit 12 or the inspection unit 16, and the element transfer head 17 can heat or cool the IC element 90. Thereby, the temperature of the IC element 90 is maintained constant while being transported. Further, hereinafter, the case where the IC element 90 is cooled and inspected in a low temperature environment in the range of, for example, -60 ° C to -40 ° C will be described. Moreover, the temperature adjustment unit 12 or the inspection unit 16 can be The part in which the temperature adjustment is performed is a part in which the IC element 90 is placed, and the case where these are collectively referred to as the "electronic component arrangement part 30" exists.

As shown in FIG. 2, FIG. 4, and FIG. 5, the test machine arrangement space A6 in which the test machine 600 is inserted and disposed is formed on the back side of the inspection apparatus 1. The test machine configuration space A6 is located below the supply area A2 and the inspection area A3. Further, the testing machine 600 has a test head (not shown) connected to the inspection unit 16 of the inspection area A3 in a state of being placed in the testing machine arrangement space A6. Further, in this connected state, inspection of the IC component 90 on the inspection portion 16 can be performed. Further, as shown in FIGS. 2 and 5, a beam 31 is protruded below the test machine arrangement space A6.

As described above, the inspection apparatus 1 cools the IC element 90 and performs inspection in a low temperature environment. In this cooling, the cooling unit 300 is used. The cooling unit 300 is a refrigerant supply device (cooling device) that supplies the refrigerant C to the electronic component placement unit 30 that is to be cooled, and cools the IC component 90 on the electronic component placement unit 30. As the refrigerant C, for example, a liquid nitrogen can be used for vaporization.

Further, dry air DA is supplied to the supply area A2, the inspection area A3, and the like. Thereby, the humidity adjustment is performed to the extent that condensation can be prevented during cooling.

As shown in FIG. 7, in the cooling unit 300, the supply path 303 is connected via the flow path 302 to the storage tank 301 which is the supply part of the liquid nitrogen. The supply path 303 is a tube having substantially the same flow path sectional area and is connected to the electronic component placement unit 30. A valve 304 is disposed in the supply path 303, and the valve 304 opens and closes the supply path 303 to control the supply amount of the liquid nitrogen to the vaporization chamber 305.

A heat exchanger 307 is disposed in the supply paths 303. The heat exchanger 307 is a so-called plate heat exchanger, and is disposed on the downstream side of the valve 304 and covered by the heat insulating material 308. In the heat exchanger 307, the supply path 303 is connected to the fluid in the heat exchanger 307, and the supply path 303 is connected to the vaporization chamber 305. The vaporization chamber 305 is formed to have a larger cross-sectional area of the flow path than the flow path of the supply path 303, and therefore has a ratio The supply path 303 is larger in the area and volume of the flow path. The liquid nitrogen flowing into the vaporization chamber 305 becomes nitrogen gas having a temperature lower than the target temperature by being exposed to the inside of the heat exchanger 307 whose temperature is higher than the boiling point of the liquid nitrogen, and flows out from the heat exchanger 307. In other words, the heat exchanger 307 functions as a vaporization vessel that vaporizes liquid nitrogen, and does not cause the refrigerant C to expand to lower the temperature of the refrigerant C, and does not allow the refrigerant C to actively absorb the heat around the heat exchanger 307. . Further, the low-temperature nitrogen gas vaporized in the heat exchanger 307 is sent to the electronic component placement unit 30.

Further, a discharge path 309 is connected to the discharge port of the electronic component placement unit 30. The discharge path 309 introduces the nitrogen gas discharged from the electronic component placement unit 30 into a storage box (not shown).

A check valve 310 that restricts the flow of gas into the electronic component placement portion 30 is disposed in the discharge path 309.

Further, a heat exchanger 311 as a temperature rising portion for raising the temperature of the nitrogen gas flowing through the discharge path 309 to a normal temperature is disposed in the discharge path 309. The heat exchanger 311 is a so-called plate heat exchanger, and the nitrogen gas flowing through the discharge path 309 flows into the low temperature fluid chamber 312, and the dry air DA generated by the dry air supply source 313 flows into the high temperature fluid chamber 314. The nitrogen gas and the dry air DA are distributed in the heat exchanger 311 so as to flow in parallel. The dry air supply source 313 is constituted by a compressor or a dryer, and the dry air DA from the dry air supply source 313 is heated by the air heater 315 to a temperature higher than a normal temperature. Further, the dry air DA is cooled to a normal temperature by heat exchange with nitrogen gas in the discharge path 309 in the heat exchanger 311, and then introduced into the storage box. Further, on the discharge path 309, a check valve 316 that restricts the flow of gas into the low temperature fluid chamber 312 is disposed on the downstream side of the heat exchanger 311.

As shown in FIG. 1, FIG. 2, and FIG. 4, the cooling unit 300 having the internal structure described above has a rectangular shape in which the entire outer shape is elongated in the X direction. Further, the cooling unit 300 is disposed and fixed to an area in which the electronic component placement unit 30 is provided (supply area) A2, the vertical direction of the inspection area A3) (positive side of the Z axis), that is, the vertical direction of the path of the transport IC element 90. In this manner, the inspection apparatus 1 is a unit in which the cooling unit 300 is mounted in advance (hereinafter, this configuration is referred to as "unitization"). By unitizing, the following effects are exerted.

(1)

As described above, the inspection apparatus 1 is connected to the test machine 600 and used. Further, for example, the factory or the test room is provided with a plurality of test machines 600 of the IC component 90 depending on each inspection. In general, when the inspection apparatus 1 is, for example, a "logic system handler", the inspection apparatus 1 is moved and transported to the side of the test machine 600 for use. On the other hand, the test machine 600 is less likely to be transported than the inspection device 1, and it is preferable that the test machine 600 is kept in a fixed state without being transported as much as possible. Therefore, since the inspection apparatus 1 is a unitized person, it can be conveyed together with the cooling unit 300, and the conveyance operation becomes easy. This unitization and cooling unit 300 are placed separately from the inspection apparatus 1 (see, for example, Patent Document 1), and are extremely effective in transportation.

(2)

Moreover, it is possible to carry out the transportation without dissolving the piping between the cooling unit 300 and the electronic component placement unit 30 by unitization. Thereby, after the inspection apparatus 1 is conveyed to the bottom of the test machine 600, it can be used rapidly, that is, it is easy to set up an operation. Thereby, the suppression of the inspection cost (test cost) of the IC component 90 can be achieved.

(3)

The piping path between the cooling unit 300 and the electronic component placement portion 30 can be shortened as compared with the case where the cooling unit 300 is placed separately from the inspection device 1 by unitization. Thereby, the range for insulating the piping path can be suppressed. Moreover, it is possible to suppress or prevent the refrigerant C from being warmed before the cooling unit 300 reaches the electronic component arrangement portion 30, and the cooling accuracy is improved. Furthermore, it also contributes to a reduction in power consumption, that is, energy saving.

(4)

Moreover, when the cooling unit 300 is placed separately, it must be ensured and cold on the floor. However, the unit 300 has a corresponding space for setting, but space saving can be achieved by unitization.

(5)

Further, by the unitization, the region in which the electronic component placement portion 30 to be cooled is provided is located immediately below the cooling unit 300. Thereby, in this area, there is a tendency that air directly under the cooling unit 300 accumulates below. Even if the air is used, the periphery of the electronic component placement unit 30 can be cooled, and the cooling efficiency can be improved.

As described above, the cooling unit 300 is located vertically above the region in which the electronic component placement portion 30 is provided. However, it is particularly preferable to arrange the cooling unit 300 in a region spanning the supply region A2 and the recovery region A4 (see FIG. 4). This area is also an area that does not overlap with any of the tray supply area A1 and the tray removal area A5 in the plan view of the inspection apparatus 1. In this manner, by arranging the cooling unit 300, the center of gravity CG _{300 of the} cooling unit 300 is disposed in a region outside the region overlooking the tester arrangement space A6 (see FIG. 5).

Let us now turn, as shown in Figure 5, the center of gravity of the load before the inspection apparatus 300 of the cooling unit ₁ CG 1 lines arranged in a top region of A6 tester configuration space. When the cooling unit 300 is loaded from this state, the center of gravity CG _{1 of the} inspection apparatus 1 is moved to the center of gravity CG ₃₀₀ by the above-described position of the center of gravity CG ₃₀₀ , and is placed in the plan tester configuration in the same manner as the center of gravity CG _300. An area outside the area of space A6. Thereby, the inspection apparatus 1 is stably set.

Further, the total length of the cooling unit 300 in the X direction is preferably 50% or more and 100% or less, more preferably 80% or more and 100% or less of the total length of the inspection apparatus 1 in the X direction. The depth of the cooling unit 300 in the Y direction is preferably 20% or more and 50% or less, more preferably 20% or more and 30% or less of the depth of the inspection apparatus 1 in the Y direction. The height of the cooling unit 300 in the Z direction is preferably 20% or more and 50% or less, more preferably 20% or more and 30% or less of the height of the inspection apparatus 1 in the Z direction.

Further, the total weight of the cooling unit 300 is preferably 10% or more and 30% or less, more preferably 20% or more and 30% or less, based on the total weight of the inspection apparatus 1.

As shown in FIG. 7, in the cooling unit 300, a flow path 302 and a supply path are provided. 303, and a discharge path 309. The inspection device 1 can constitute the flow paths (see Fig. 8), for example, by means of the tubes 4.

In the configuration shown in FIG. 8, the cooling unit 300 that supplies the refrigerant C and the cooling target (electronic component placement unit 30) that is cooled by the refrigerant C are connected by two tubes 4. Among the two tubes 4, one tube 4 functions as a supply line for supplying the refrigerant C from the cooling unit 300 to the cooling target, and the other tube 4 functions as a recovery line for recovering the cooling medium C for cooling. .

As shown in FIG. 9 and FIG. 10, the pipe 4 is a first pipe 41 having the refrigerant C flowing (filled), and the first pipe 41, that is, the second pipe 42 through which the first pipe 41 is inserted. Casing structure.

The first pipe 41 is a pipe body in which the refrigerant C flows down and is filled. The first pipe 41 is an outer diameter d _{1-1 is} preferably, for example, 4 mm or more and 8 mm or less, and has an inner diameter d _{1-2 is} preferably 2 mm or more and 6 mm or less. In addition, the constituent material of the first pipe 41 is not particularly limited, and for example, polytetrafluoroethylene or the like can be used.

Further, a heat insulating layer 43 is formed on the outer peripheral portion of the first pipe 41. Thereby, the first pipe 41 can be insulated from the outside. The thickness t of the heat insulating layer 43 is preferably, for example, 6 mm or more and 9 mm or less. Further, the constituent material of the heat insulating layer 43 is not particularly limited, and for example, a foamed rubber can be used.

The portion between the second pipe 42 and the first pipe 41 is a pipe body that is filled with air having a predetermined humidity and is filled. As this air, it can be set as dry air DA. Furthermore, the second pipe 42 is an outer diameter d _{2-1 is} preferably, for example, 30 mm or more and 50 mm or less, and has an inner diameter d _{2-2 is} preferably 20 mm or more and 40 mm or less. The constituent material of the second pipe 42 is not particularly limited, and for example, a polyurethane or the like can be used.

In this manner, the tube 4 is configured such that the innermost portion is filled with the refrigerant C, and the outer side thereof is covered with the heat insulating layer 43, and the outer side is filled with the dry air DA. Thereby, it is possible to prevent the heat insulating layer 43 from coming into contact with the outside air, and it is possible to prevent dew condensation between the heat insulating layer 43 and the second pipe 42.

Further, it is preferable that the second pipe 42 has a large number of irregularities. That is, the second pipe 42 preferably has a bellows shape. Thereby, the tube 4 is easily bent as a whole, whereby the winding (pipe) of the tube 4 becomes easy.

As shown in FIG. 10, the tube 4 is provided with a positioning member 44 that positions the first pipe 41 and the second pipe 42 concentrically. The positioning members 44 are disposed at a plurality of intervals along the longitudinal direction of the tube 4. Thereby, the positioning of the first pipe 41 and the second pipe 42 is facilitated.

The positioning member 44 is annular and fitted between the first pipe 41 and the second pipe 42. Further, at least one of the positioning members 44 is formed with a defective portion (through hole) 441 through which the dry air DA passes.

As shown in FIG. 6, the first liquid leakage receiving portion 51 that receives the liquid leakage from the refrigerant C of the cooling unit 300 is provided below the cooling unit 300, and the liquid leakage flows from the first liquid leakage receiving portion 51 downward. The piping 52 and the second liquid leakage receiving portion 53 that receives the liquid leakage from the piping 52.

The first liquid leakage receiving portion 51 is disposed in a dish-like member that is disposed directly under the cooling unit 300 and that covers the entire bottom portion of the cooling unit 300. Thereby, it is possible to prevent the liquid from scattering to the supply region A2 or the recovery region A4.

The pipe 52 is a flexible pipe that communicates with the inside of the first liquid leakage receiving portion 51. This pipe 52 bypasses the supply area A2 or the recovery area A4 and extends to the lowermost position of the inspection apparatus 1. The liquid accumulated in the first liquid leakage receiving portion 51 can flow down in the pipe 52.

The second liquid leakage receiving portion 53 is a member that is placed on a dish in the floor. The mouth portion 521 of the pipe 52 is opened in the second liquid leakage receiving portion 53. Thereby, the liquid that has flowed down in the pipe 52 can be received by the second liquid leakage receiving portion 53, and the liquid can be prevented from scattering to the floor.

Further, in the inspection apparatus 1, the second liquid leakage receiving portion 53 can be omitted.

As shown in FIG. 5 and FIG. 6 , a plurality of (four in FIG. 5 ) casters 61 are disposed vertically below the electronic component placement unit 30 , that is, at the bottom of the inspection apparatus 1 . A plurality of (seven in FIG. 5) adjustment feet 62 of the distributed configuration. Furthermore, at least one of the adjustment legs 62 is preferably disposed on the beam 31.

The transfer of the inspection device 1 is facilitated by the casters 61. Moreover, the inspection apparatus 1 after the conveyance can be fixed to the floor by adjusting the foot 62, whereby the inspection can be performed stably.

<Second embodiment>

Fig. 11 is a schematic plan view showing an electronic component inspection device (second embodiment) of the present invention.

In the following, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the arrangement position of the refrigerant supply device is different.

As shown in FIG. 11, in the present embodiment, the cooling unit 300 is disposed in a substantially uniform manner in the Y direction of the recovery area A4 in a plan view of the inspection apparatus 1. Also by so configured, and after the load test apparatus 300 of the center of gravity of the cooling unit ₁ CG 1 disposed in a region other than a top region of the configuration space A6 of the testing machine. Thereby, the inspection apparatus 1 is stably set.

<Third embodiment>

FIG. 12 is a transverse cross-sectional view showing a state of piping between a refrigerant supply device and a cooling target in the electronic component inspection device (third embodiment) of the present invention.

In the following, the third embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the configuration of the tube is different.

As shown in FIG. 12, in the present embodiment, the tube 4 is composed of two first pipes 41 which are covered by the second pipe 42 in a bundle. In this way, one of the two first pipes 41 can be used for supplying the refrigerant C to the cooling target, and the other first pipe 41 can be used to recover the refrigerant C from the cooling target. Recycling use.

In addition, the number of the first pipes 41 is two in the present embodiment, but the number of the first pipes is not limited thereto, and may be three or more.

<Fourth embodiment>

FIG. 13 is a view showing a piping state between the refrigerant supply device and the cooling target in the electronic component inspection device (fourth embodiment) of the present invention.

In the following, the fourth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the arrangement of the tubes is different.

As shown in Fig. 13, in the present embodiment, one of the tubes 4 in the longitudinal direction is surrounded by the casing 400, that is, stored. The tank 400 is temporarily filled with dry air DA, whereby the dry air DA can be distributed, for example, to a portion using the dry air DA (for example, the tube 4).

<Fifth Embodiment>

Fig. 14 is a view showing a state of piping between a refrigerant supply device and a cooling target in the electronic component inspection device (fifth embodiment) of the present invention.

In the following, the fifth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the same matters will not be described.

This embodiment is the same as the above-described first embodiment except that the arrangement of the tubes is different.

As shown in Fig. 14, in the present embodiment, both end portions of the tube 4 are connected to the box-shaped connecting portion 500, respectively. The connecting portions 500 communicate with each other via the second pipes 42 of the tubes 4 . Thereby, for example, when the dry air DA is conveyed to the connecting portion 500 on the left side in FIG. 14, the dry air DA flows down in the second pipe 42 to reach the connecting portion 500 on the right side in FIG.

As described above, the electronic component conveying device and the electronic component inspection device of the present invention have been described based on the embodiments of the present invention. However, the present invention is not limited thereto, and various components constituting the electronic component conveying device and the electronic component inspection device can be utilized. Any component of the same function is replaced. Further, any constituent may be added.

Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be formed by combining any two or more of the above-described configurations (features).

1‧‧‧Inspection device (electronic parts inspection device)

31‧‧‧ beams

71‧‧‧ side shell

73‧‧‧ rear casing

74‧‧‧ top shell

80‧‧‧Control Department

300‧‧‧Cooling unit

A2‧‧‧Component supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Component recycling area (recycling area)

A6‧‧‧Tester configuration space

Claims (7)

An electronic component transporting apparatus comprising: an electronic component arranging unit for arranging electronic components; a casing covering the electronic component arranging unit; and a refrigerant supply device for supplying the refrigerant to the electronic component arranging unit, wherein the refrigerant supply device is disposed The electronic component placement portion is vertically above and outside the casing. The electronic component transport apparatus according to claim 1, comprising: an inspection unit arrangement unit that can be configured to inspect the inspection unit of the electronic component; and a test machine arrangement space in which a test machine connected to the inspection unit is disposed, and is vertically above The position of the center of gravity of the refrigerant supply device in a plan view is located in a region outside the region from the vertical upper side of the test machine arrangement space. The electronic component transport apparatus according to claim 1 or 2, wherein the refrigerant supply device is disposed above a vertical path of a path for transporting the electronic component. The electronic component conveying apparatus according to claim 1 or 2, wherein the refrigerant supply device and the electronic component placement unit are connected by a first pipe through which the refrigerant flows, and the first pipe is covered by the second pipe, and the first pipe is At least a portion of the piping and the second piping are filled with a gas of a predetermined humidity. The electronic component transport apparatus according to claim 1 or 2, wherein a liquid leakage receiving portion that receives a liquid leakage from a refrigerant of the refrigerant supply device and a drain liquid from the leak are provided below the refrigerant supply device The liquid receiving portion flows to a pipe vertically below. The electronic component transporting apparatus according to claim 1 or 2, wherein the caster is provided vertically below the electronic component disposing section. An electronic component inspection device characterized by comprising: An electronic component arranging unit for arranging an electronic component, a casing covering the electronic component arranging unit, a refrigerant supply device for supplying the refrigerant to the electronic component arranging unit, and an inspection unit for inspecting the electronic component, wherein the refrigerant supply device is disposed in the electronic device The part arrangement portion is vertically above and outside the casing.