JP2017044592A - Electronic component transportation device and electronic component inspection system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component transportation device and an electronic component inspection system capable of uniformly cooling an electronic component on a cooling member.SOLUTION: An electronic component inspection system 1 comprises a temperature adjustment part 12 as a cooling member for cooling an electronic component. The temperature adjustment part 12 comprises a first flow path 37 through which a coolant RF flows in and a second flow path 38 communicating with the first flow path 37 through which the coolant RF flows out. In a plan view of the temperature adjustment part 12, the first flow path 37 is disposed enclosing a part of the second flow path 38.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of electronic components such as semiconductor elements is known. A cooling plate that cools and maintains a desired temperature is incorporated (see, for example, Patent Document 1). In the electronic component inspection apparatus described in Patent Document 1, the cooling plate has a flow groove formed in a meandering manner (in a continuous S shape). And it is comprised so that cooling with respect to an electronic component may be performed on a cooling plate, when liquefied nitrogen flows down a flow groove.

JP 2003-194874 A

  However, in the electronic component inspection apparatus described in Patent Document 1, the cooling plate tends to allow heat to enter and exit from the outer peripheral portion rather than the central portion thereof. Uniform cooling on the cooling plate was impossible only by flowing down.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

The electronic component transport device of the present invention has a cooling member for cooling the electronic component,
The cooling member includes a first flow path into which a refrigerant flows;
A second flow path that communicates with the first flow path and through which the refrigerant flows out,
When the cooling member is viewed in plan, the first flow path is disposed so as to surround a part of the second flow path.

  Thereby, the temperature of the refrigerant flowing down the first flow path located outside is lower than the temperature of the refrigerant flowing down the second flow path inside the first flow path. Therefore, even if the cooling member has a tendency that heat is more likely to enter and exit from the outer peripheral portion than the central portion, a decrease in the cooling function in the first flow path is prevented, and a sufficient cooling function is exhibited. be able to. Therefore, uniform cooling can be performed on the electronic component on the cooling member.

  In the electronic component transport device of the present invention, the cooling member has a first side, a second side, a third side, and a fourth side. In the first side, the second side, and the third side, When the cooling member is viewed in plan, the first flow path is preferably disposed outside the second flow path.

  As a result, the temperature of the refrigerant flowing down the first flow path on the outer side is significantly lower than the temperature of the refrigerant flowing down the second flow path inside the first flow path. Therefore, even if the cooling member has a tendency that heat is more likely to enter and exit from the outer peripheral portion than the central portion, a decrease in the cooling function in the first flow path is preferably prevented, and a more sufficient cooling function. Can be demonstrated. Therefore, more uniform cooling can be performed on the electronic component on the cooling member.

  In the electronic component conveying apparatus of the present invention, it is preferable that the first side and the second side face each other, and the third side and the fourth side face each other.

  As a result, the cooling member has a relatively simple outer shape. Therefore, when the cooling member is obtained by machining from the base material of the metal plate, the machining can be easily performed.

In the electronic component transport device of the present invention, the cooling member includes the first side, the second side parallel to the first side, the third side orthogonal to the first side, and parallel to the third side. A rectangle having a fourth side;
It is preferable that an inflow port through which the refrigerant flows into the first flow path and an outflow port through which the refrigerant flows out from the second flow path are arranged on the fourth side.

  Thereby, the inflow port and the outflow port can be made as close as possible to each other, so that, for example, the supply of the refrigerant to the cooling member and the discharge of the refrigerant can be performed using one manifold joint.

  In the electronic component transport device of the present invention, it is preferable that the lengths of the first side and the second side are longer than the lengths of the third side and the fourth side.

  As a result, the cooling member has a relatively simple outer shape. Therefore, when the cooling member is obtained by machining from the base material of the metal plate, the machining can be easily performed.

  In the electronic component transport device according to the aspect of the invention, it is preferable that a portion where the first flow path and the second flow path are connected is arranged on the fourth side with respect to the third side.

  Thereby, it is possible to ensure the entire length of the first flow path as long as possible, thereby contributing to uniform cooling of the electronic component.

  In the electronic component transport device of the present invention, the cooling member includes two cooling members, and the fourth side of one of the cooling members is disposed to face the fourth side of the other cooling member. preferable.

  Thereby, the manifold joint which performs supply of the refrigerant | coolant with respect to each cooling member, and discharge | emission of a refrigerant | coolant collectively can be arrange | positioned on the back side between one cooling member and the other cooling member.

  In the electronic component transport device of the present invention, it is preferable that a part of the first flow path and the second flow path are arranged side by side.

  Accordingly, the temperature of the cooling member itself is uniform as a whole, and thus contributes to uniform cooling of the electronic component.

  In the electronic component transport device of the present invention, the third flow path for allowing the refrigerant to flow into the first flow path and the fourth flow path for allowing the refrigerant flowing out of the second flow path to flow into the back surface of one cooling member. It is preferable to have.

  Thereby, the arrangement | positioning direction of a 3rd flow path and a 4th flow path can be made into the same direction, Therefore The piping operation | work of the tube which comprises each flow path becomes easy.

  In the electronic component transport device of the present invention, it is preferable that the cooling member is a soak plate that cools the electronic component before inspection in advance.

  Thereby, when cooling an electronic component on a soak plate beforehand before a test | inspection, the cooling can be performed uniformly.

  In the electronic component transport apparatus of the present invention, it is preferable that the cooling member is a shuttle plate that can be moved by a drive unit and can transport the electronic component.

  Thus, when the electronic component is cooled while being transported by the shuttle plate, the cooling can be performed uniformly.

The electronic component inspection apparatus of the present invention has a cooling member for cooling the electronic component,
The cooling member includes a first flow path into which a refrigerant flows;
A second flow path that communicates with the first flow path and through which the refrigerant flows;
An inspection unit for inspecting the electronic component,
When the cooling member is viewed in plan, the first flow path is disposed so as to surround a part of the second flow path.

  Thereby, the temperature of the refrigerant flowing down the first flow path located outside is lower than the temperature of the refrigerant flowing down the second flow path inside the first flow path. Therefore, even if the cooling member has a tendency that heat is more likely to enter and exit from the outer peripheral portion than the central portion, a decrease in the cooling function in the first flow path is prevented, and a sufficient cooling function is exhibited. be able to. Therefore, uniform cooling can be performed on the electronic component on the cooling member.

FIG. 1 is a schematic perspective view of an electronic component inspection apparatus according to an embodiment of the present invention as viewed from the front side. FIG. 2 is a schematic plan view of the electronic component inspection apparatus shown in FIG. FIG. 3 is a piping diagram for connecting a liquid nitrogen supply source and a liquid nitrogen supply destination. FIG. 4 is a plan view showing an arrangement state of two soak plates in FIG. FIG. 5 is a horizontal sectional view of the lower soak plate in FIG. 4. FIG. 6 is a cross-sectional view taken along the line AA in FIG. 4 (a state where the change kit is placed). FIG. 7 is a horizontal sectional view showing a supply line of liquid nitrogen to the two soak plates in FIG. 2 and a discharge line of liquid nitrogen from the two soak plates. FIG. 8 is a horizontal sectional view of one supply shuttle plate in FIG.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

  FIG. 1 is a schematic perspective view of an electronic component inspection apparatus according to an embodiment of the present invention as viewed from the front side. FIG. 2 is a schematic plan view of the electronic component inspection apparatus shown in FIG. FIG. 3 is a piping diagram for connecting a liquid nitrogen supply source and a liquid nitrogen supply destination. FIG. 4 is a plan view showing an arrangement state of two soak plates in FIG. FIG. 5 is a horizontal sectional view of the lower soak plate in FIG. 4. FIG. 6 is a cross-sectional view taken along the line AA in FIG. 4 (a state where the change kit is placed). FIG. 7 is a horizontal sectional view showing a supply line of liquid nitrogen to the two soak plates in FIG. 2 and a discharge line of liquid nitrogen from the two soak plates. FIG. 8 is a horizontal sectional view of one supply shuttle plate in FIG. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIGS. 1 and 2 includes, for example, an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, an LCD (Liquid Crystal Display), a CIS (CMOS This is a device for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as an image sensor. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 2, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component conveyance apparatus that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 800. In addition, the inspection apparatus 1 includes a monitor 300 and a signal lamp 400.

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are arranged (the lower side in FIG. 2) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is arranged (FIG. 2 is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray (arrangement member) 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2. The tray conveyance mechanism 11 </ b> A is a moving unit that can move the tray 200 in the Y direction together with the IC devices 90 placed on the tray 200. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200.

  In the supply area A2, a temperature adjustment unit 12, a device transport head 13, and a tray transport mechanism (first transport device) 15 are provided.

  The temperature adjustment unit 12 is a cooling member that can collectively cool a plurality of IC devices 90, and may be referred to as a “soak plate”. With the soak plate, the IC device 90 before being inspected by the inspection unit 16 can be cooled in advance and adjusted to a temperature suitable for the inspection. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the tray transport mechanism 11A is transported to one of the temperature adjustment units 12.

  The plurality of IC devices 90 are exchanged for each type of IC device 90 and are arranged in pockets (recesses) 101 of the electronic component placement member 100 called “change kit”, and are soak plates. It is mounted on a certain temperature adjustment part 12 (refer FIG. 6). The plurality of IC devices 90 are cooled together with the electronic component placement member 100 for the soak plate.

  The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports an empty tray 200 in a state where all IC devices 90 have been removed in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit 14, an inspection unit 16, a device transport head 17, and a device collection unit 18 are provided.

  The device supply unit 14 is a moving unit on which the temperature-adjusted IC device 90 is placed and can transport (move) the IC device 90 to the vicinity of the inspection unit 16, and is referred to as a “supply shuttle plate”. Sometimes. The device supply unit 14 is supported so as to be movable in the horizontal direction along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to one of the device supply units 14.

  Similarly to the temperature adjustment unit 12, the device supply unit 14 is also used by mounting a change kit that is exchanged for each type of IC device 90, and cooling a plurality of IC devices 90 together with the change kit. It becomes the cooling member to do.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. Note that the inspection unit 16 can cool the IC device 90 and adjust the IC device 90 to a temperature suitable for the inspection, similar to the temperature adjustment unit 12 (see FIG. 3).

  The device transport head 17 is supported so as to be movable in the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16. The device transport head 17 is also a cooling member that can cool the IC device 90.

  The device collection unit 18 is a moving unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed and can transport (move) the IC device 90 to the collection region A4. Sometimes called a “plate”. The device collection unit 18 is supported so as to be movable in the horizontal direction along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  In addition, the device collection unit 18 and the inspection unit 16 are also used by placing a change kit that is exchanged for each type of IC device 90, similarly to the temperature adjustment unit 12.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism (second conveyance device) 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 is placed, and is fixed in the collection area A4. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction. The empty trays 200 are also placement units on which the IC devices 90 are placed, and three empty trays 200 are arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200. Thus, in the inspection apparatus 1, the tray transport mechanism 21 is provided in the collection area A4, and the tray transport mechanism 15 is provided in the supply area A2. Thereby, for example, the throughput (the number of IC devices 90 to be transported per unit time) can be improved as compared to transporting an empty tray 200 in the X direction with a single transport mechanism.

  The configurations of the tray transport mechanisms 15 and 21 are not particularly limited. For example, the tray transport mechanisms 15 and 21 include a suction member that sucks the tray 200 and a support mechanism such as a ball screw that supports the suction member so as to be movable in the X direction. Is mentioned.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one in the horizontal direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22 </ b> A is a moving unit that can move the tray 200 in the Y direction together with the inspected IC devices 90 placed on the tray 200. Thus, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a moving unit that can move an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The control unit 800 has, for example, a drive control unit. The drive control unit includes, for example, tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and tray conveyance mechanism 22A, 22B is controlled.

  The test control unit of the tester inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a memory (not shown), for example.

  The operator can set or confirm the temperature condition or the like when the inspection apparatus 1 is operated via the monitor 300. The monitor 300 includes a display screen 301 configured by, for example, a liquid crystal screen, and is disposed on the front side upper portion of the inspection apparatus 1. As shown in FIG. 1, on the right side of the tray removal area A5 in the figure, there is provided a mouse table 600 on which a mouse used for operating a screen displayed on the monitor 300 is placed.

  Further, the signal lamp 400 can notify the operating state or the like of the inspection apparatus 1 by a combination of colors that emit light. The signal lamp 400 is arranged on the upper part of the inspection apparatus 1. Note that the inspection device 1 has a built-in speaker 500, and the operation state of the inspection device 1 can also be notified by the speaker 500.

  As shown in FIG. 2, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (partitioned) by the first partition wall 61, and the supply area A2 and the inspection area A3 are separated. It is divided by the second partition wall 62, the inspection area A3 and the collection area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. ing. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each region. Furthermore, the outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74. Note that an inner partition 66 is disposed inside the rear cover 73.

  As described above, the temperature adjustment unit 12 is a cooling member that can cool the IC device 90. The temperature adjustment unit 12 is configured to cool the IC device 90 when the refrigerant RF flows down inside.

  Note that the refrigerant RF is, for example, liquid nitrogen (liquefied nitrogen) and has a relatively high cooling efficiency (cooling capacity), and thus is preferably used for cooling the IC device 90. As shown in FIGS. 1 and 2, the refrigerant RF is preliminarily filled in a tank 700 installed outside the inspection apparatus 1. As shown in FIG. 3, the tank 700 is connected to the temperature adjustment unit 12, the device supply unit 14, the device transport head 17, and the inspection unit 16 via a pipe 23. As a result, the refrigerant RF is supplied to the temperature adjustment unit 12, the device supply unit 14, the device transport head 17, and the inspection unit 16, respectively. Further, a valve 24 a is provided in the middle of the pipe 23 toward the temperature adjustment unit 12. By controlling the opening and closing of the valve 24a, the supply of the refrigerant RF to the temperature adjusting unit 12 and the stop of the supply can be switched. Similarly, a valve 24 b is provided on the way of the piping 23 toward the device supply unit 14. By controlling the opening and closing of the valve 24b, the supply of the refrigerant RF to the device supply unit 14 and the stop of the supply can be switched. A valve 24 c is also provided on the way of the piping 23 toward the device transport head 17. By controlling the opening and closing of the valve 24c, the supply of the refrigerant RF to the device transport head 17 and the stop of the supply can be switched. Further, a valve 24 d is provided on the way to the inspection unit 16 of the pipe 23. By controlling the opening and closing of the valve 24d, the supply of the refrigerant RF to the inspection unit 16 and the stop of the supply can be switched.

  As shown in FIG. 4, the inspection apparatus 1 is provided with two temperature adjustment units 12, and these two temperature adjustment units 12 are arranged in the Y direction, that is, up and down in FIG. 4. . Hereinafter, the lower temperature adjustment unit 12 in FIG. 4 may be referred to as “temperature adjustment unit 12A”, and the upper temperature adjustment unit 12 may be referred to as “temperature adjustment unit 12B”. Since the temperature adjustment unit 12A and the temperature adjustment unit 12B have the same configuration except that the arrangement locations are different, the temperature adjustment unit 12A will be described as a representative.

  As shown in FIG. 6, the temperature adjusting unit 12 </ b> A is configured by laminating and joining a first member 3 a having a flat plate shape and a second member 3 b having a flat plate shape. Thereby, a groove can be formed in the lower surface 31 of the first member 3a, the upper surface 32 of the second member 3b, or both surfaces, and the groove can be used as the flow path 33 through which the refrigerant RF flows. Therefore, it is possible to omit separately providing the members constituting the flow path 33, and the temperature adjusting unit 12A can have a simple configuration. In the present embodiment, a groove is formed on the lower surface 31 of the first member 3 a and the groove is used as the flow path 33. Moreover, as a joining method of the 1st member 3a and the 2nd member 3b, the method by the fastening using a some volt | bolt is employable, for example.

  A groove 34 is formed in parallel with the flow path 33 on the lower surface 31 of the first member 3a. A sealing member 30 is disposed along the groove 34 in the groove 34. The sealing member 30 is made of an elastic material, and is compressed between the first member 3a and the second member 3b. Thereby, the liquid-tightness (or airtightness) between the 1st member 3a and the 2nd member 3b, ie, the flow path 33, can be hold | maintained. Therefore, it is possible to prevent the refrigerant RF flowing down the flow path 33 from leaking between the first member 3a and the second member 3b. In addition, it does not specifically limit as an elastic material which comprises the sealing member 30, For example, various rubber materials, such as urethane rubber, silicone rubber, and fluororubber, can be used.

  As described above, the groove used as the flow path 33 is formed on the lower surface 31 of the first member 3a. For example, depending on the formation region of the groove (flow path 33) and other lengths and depths of the groove, the first member 3a alone (itself) may be slightly warped.

  Since the electronic component placing member 100 is placed on the upper surface 35 of the first member 3a, if the first member 3a remains warped, the electronic component placing member 100 on the upper surface 35 also follows the first member 3a. May be warped. In this state, even if the IC device 90 in the pocket 101 of the electronic component mounting member 100 is gripped by the device transport head 13 and is pulled upward, the electronic component mounting member 100 is warped. May not be gripped, that is, gripping may be insufficient.

  Therefore, even if the first member 3a is warped, the temperature adjusting unit 12 is joined to the second member 3b that is thicker than the first member 3a in order to eliminate the warp. As a result, the upper surface 35 of the first member 3a can be corrected to a horizontal plane, and thus the electronic component placing member 100 on the upper surface 35 is also prevented from warping. From the electronic component placement member 100 in this state, the IC device 90 can be stably lifted by the device transport head 13.

The thickness _{t 3b} of the second member 3b is greater the preferably than the thickness _{t 3a} of the first member 3a, for example, more than 1.2 times the thickness _{t 3a,} that is 3 times or less preferably More preferably, it is 1.5 times or more and 2 times or less. Thus, while suppressing that the thickness t _3b increases, regardless of the warping of the first member 3a, it is possible to eliminate the warpage.

  As shown in FIGS. 4 and 5, the first member 3a and the second member 3b have the same shape and size in plan view.

  The first member 3a (the same applies to the second member 3b) includes a first side 361, a second side 362 parallel to the first side 361, and a third side 363 and a third side 363 orthogonal to the first side 361. And a rectangular shape (rectangular shape) having a fourth side 364 parallel thereto. In the present embodiment, the first member 3a has a long rectangle in the Y-axis direction, and the length of the first side 361 and the second side 362 is longer than the length of the third side 363 and the fourth side 364. It has become. By making such a relatively simple outer shape, when the first member 3a is obtained by machining from the base material of the metal plate, the machining can be performed easily and at low cost.

  As a constituent material of the first member 3a and the second member 3b, for example, various metal materials can be used, and among these metal materials, aluminum that has a relatively high thermal conductivity and is easy to machine is preferable.

  By the way, as in the cooling plate described in Patent Document 1, for example, liquefied nitrogen simply flows down through a meandering flow groove, and uniform cooling on the cooling plate is impossible. This is because the cooling plate tends to allow heat to enter and exit from the outer periphery rather than the center.

  Therefore, the temperature adjustment unit 12A is configured to be able to uniformly cool the plurality of IC devices 90 on the temperature adjustment unit 12A. Hereinafter, this configuration will be described.

  As described above, the temperature adjusting unit 12A is provided with the flow path 33 through which the refrigerant RF flows down. As shown in FIG. 5, the flow path 33 includes a first flow path 37 into which the refrigerant RF flows and a second flow path 38 that communicates with the first flow path 37 and flows out the refrigerant RF.

  When the temperature adjustment unit 12A is viewed in plan, the first flow path 37 starts from the inlet 371 into which the refrigerant RF flows into the first flow path 37 as close to the outer peripheral side as possible (unevenly distributed). The first side 361, the third side 363, the second side 362, and the fourth side 364 are formed along each side in this order.

  In a portion along the first side 361 of the first flow path 37, a linear portion 372 that is linear from the upstream side to the downstream side, a crank-like portion 373 that is curved or bent in a crank shape, and a linear shape The linear part 374 which makes | forms is formed.

  The first flow path 37 changes direction on the corner (corner) 365 side formed by the first side 361 and the third side 363, and a linear part that forms a straight line in the portion along the third side 363. 375 is formed.

  In addition, the first flow path 37 changes its direction on the corner (corner) 366 side formed by the third side 363 and the second side 362, and a linear part that forms a straight line in the portion along the second side 362. 376 is formed.

  Further, the first flow path 37 changes its direction at the corner (corner) 367 side formed by the second side 362 and the fourth side 364, and a linear part that forms a straight line in the portion along the fourth side 364. 377 is formed.

  The flow path 33 is a folded portion 331 that is folded back in a “U” shape immediately after the linear portion 377, and enters the inner side of the first flow path 37, that is, toward the center of the temperature adjustment unit 12A. The first flow path 37 that is the forward path turns to the second flow path 38 that is the return path. The folded portion 331 is a portion where the first flow path 37 and the second flow path 38 are connected.

  When the temperature adjustment unit 12 </ b> A is viewed in plan, the second flow path 38 is inside the first flow path 37 and opposite to the first flow path 37, the fourth side 364, the second side 362, and the third side 363. The first side 361 is formed along each side.

  In a portion along the fourth side 364 of the second flow path 38, a linear portion 381 having a linear shape is formed. The linear portion 381 is in a state of being juxtaposed with the linear portion 377 of the first flow path 37, and the flow direction is also opposite to the linear portion 377.

  The second flow path 38 changes its direction on the corner portion 367 side, and a linear portion 382 that forms a straight line is formed in a portion along the second side 362. The linear portion 382 is in a state of being juxtaposed with the linear portion 376 of the first flow path 37, and the flow direction is also opposite to the linear portion 376.

  The second flow path 38 changes its direction on the corner portion 366 side, and a linear portion 383 that forms a straight line is formed in a portion along the third side 363. The linear portion 383 is in a state of being juxtaposed with the linear portion 375 of the first flow path 37, and the flow direction is also opposite to the linear portion 375.

  Further, the second flow path 38 changes direction on the corner portion 365 side, and the portion along the first side 361 meanders so as to repeat approach and separation with respect to the linear portion 374 of the first flow path 37. The meandering portion 384 and the straight portion 385 that forms a straight line downstream from the meandering portion 384 are formed. The meandering portion 384 is in a state of being juxtaposed with the linear portion 374 of the first flow path 37, and the flow direction is also opposite to the linear portion 374. The linear portion 385 is in a state of being juxtaposed with the linear portion 372 of the first flow path 37, and the flow direction is also opposite to the linear portion 372.

  The second flow path 38 ends at an outlet 386 through which the refrigerant RF flows out from the second flow path 38.

  As described above, the flow path 33 includes the first side 361, the second side 362, the third side 363, and the fourth side 364 from the linear part 372 to the linear part 377 of the first flow path 37. It is disposed outside the two flow paths 38 and surrounds the linear portion 381 to the meandering portion 384 of the second flow path 38. The temperature of the refrigerant RF flowing down the first flow path 37 on the outer side is lower than the temperature of the refrigerant RF flowing down on the second flow path 38 on the inner side. Thereby, even in the temperature adjustment part 12A in which the outer peripheral part tends to easily enter and exit from the center part, a decrease in the cooling function in the first flow path 37 is prevented, and a sufficient cooling function is provided. It can be demonstrated. Therefore, uniform cooling of the plurality of IC devices 90 is performed on the temperature adjustment unit 12A.

  In the present embodiment, when the average temperature of the refrigerant RF that reaches the entire flow path 33 is measured, a portion that is lower than the average temperature is referred to as a “first flow path 37”, and a portion that is higher than the average temperature is referred to as a “second flow path 38. However, it is not limited to this. For example, in the entire flow path 33, 1/2 on the upstream side may be the “first flow path 37” and 1/2 on the downstream side may be the “second flow path 38”.

  As shown in FIG. 5, the inflow port 371 and the outflow port 386 are arranged unevenly on the fourth side 364 side of the first side 361 to the fourth side 364. Thereby, the inflow port 371 and the outflow port 386 can be brought close to each other as close as possible. Therefore, the supply of the refrigerant RF to the temperature adjusting unit 12A and the refrigerant using one manifold joint 5 (see FIG. 7) described later. The RF can be discharged.

  Further, the folded portion 331 is also arranged unevenly on the fourth side 364 side. As a result, the first flow path 37 is along the first side 361 to the fourth side 364. Therefore, the entire length of the first flow path 37 can be ensured as long as possible, and the plurality of IC devices 90 can be secured. Contributes to uniform cooling against.

  As shown in FIG. 4, the temperature adjustment unit 12 </ b> A and the temperature adjustment unit 12 </ b> B are arranged with the fourth sides 364 facing each other. That is, the temperature adjusting unit 12A and the temperature adjusting unit 12B are arranged point-symmetrically with respect to each other's intermediate point. Thereby, as shown in FIG. 7, the manifold joint 5 can be arrange | positioned in the back side (Z-axis direction negative side) between the temperature adjustment part 12A and the temperature adjustment part 12B.

  The manifold joint 5 has a manifold body 51 and joints 52 to 57 connected to the manifold body 51.

  The manifold body 51 has an internal flow path 511 in which the refrigerant RF is directed from the joint 52 to the joint 53 and the joint 54, and an internal flow path 512 in which the refrigerant RF is directed from the joint 55 and the joint 56 to the joint 57.

  The joint 52 is connected to a tube (third flow path) 701 through which the refrigerant RF from the tank 700 flows down. The joint 53 is connected to the inlet 371 of the temperature adjustment unit 12 </ b> A via the tube 702. The joint 54 is connected to the inlet 371 of the temperature adjustment unit 12B via the tube 703. With such a connection, the refrigerant RF from the tank 700 is supplied to the temperature adjustment unit 12A and the temperature adjustment unit 12B, respectively.

  The joint 55 is connected to the outlet 386 of the temperature adjustment unit 12 </ b> A via the tube 704. The joint 56 is connected to the outlet 386 of the temperature adjustment unit 12 </ b> B via the tube 705. The joint 57 is connected to a drainage unit (not shown) via a tube (fourth flow path) 706. With such a connection, the refrigerant RF discharged from the temperature adjustment unit 12A and the temperature adjustment unit 12B is collected by the drainage unit.

  As described above, the device supply unit 14 is a cooling member that can cool the IC device 90 in the same manner as the temperature adjustment unit 12. Hereinafter, it will be described that the device supply unit 14 is configured to be capable of uniformly cooling the plurality of IC devices 90 as well as the temperature adjustment unit 12A with reference to FIG. Differences will be mainly described, and description of similar matters will be omitted. The device supply unit 14 is substantially the same as the temperature adjustment unit 12A except that the shape of the flow path 83 through which the refrigerant RF flows is different in plan view.

  As shown in FIG. 8, the device supply unit 14 also includes a first member 8a and a second member 8b, and a flow path 83 is formed in the first member 8a. Further, a groove 84 is formed along the flow path 83 in the first member 8a. A sealing member (not shown) that maintains liquid tightness (or air tightness) in the flow path 83 is disposed in the groove 84.

  In addition, the first member 8a (the same applies to the second member 8b) includes a first side 861, a second side 862 that is parallel to the first side 861, a third side 863 that is orthogonal to the first side 861, and a third side. A rectangular shape having a fourth side 864 parallel to the side 863 is formed. In the present embodiment, the first member 8a has a long rectangle in the X-axis direction, and the length of the first side 861 and the second side 862 is longer than the length of the third side 863 and the fourth side 864. It has become.

  As shown in FIG. 8, the flow path 83 includes a first flow path 87 into which the refrigerant RF flows and a second flow path 88 that communicates with the first flow path 87 and flows out the refrigerant RF.

  When the device supply unit 14 is seen in a plan view, the first flow path 87 starts from the inlet 871 into which the refrigerant RF flows into the first flow path 87 as a starting point and approaches the outer peripheral side of the device supply unit 14 as much as possible. The first side 361, the third side 363, and the second side 362 are formed along each side in this order.

  In a portion along the first side 361 of the first flow path 87, a linear portion 872 having a linear shape is formed.

  The first flow path 87 changes direction on the corner 865 side formed by the first side 861 and the third side 863, and a linear part that forms a straight line in the portion along the third side 863. 873 is formed.

  In addition, the first flow path 87 changes direction on the corner 866 side formed by the third side 863 and the second side 862, and a linear part that forms a straight line in the portion along the second side 862. 874 is formed.

  The flow channel 83 is a folded portion 831 that is folded in a “U” shape immediately after the linear portion 874, and enters the inside of the first flow channel 87, that is, toward the center side of the device supply unit 14. The first flow path 87 that is the forward path turns to the second flow path 88 that is the return path. The folded portion 831 is a portion where the first flow path 87 and the second flow path 88 are connected.

  When the device supply unit 14 is viewed in plan, the second flow path 88 is on the inner side of the first flow path 87 and opposite to the first flow path 87, the second side 862, the third side 863, and the first side 861. Are formed along each side in this order.

  In a portion along the second side 862 of the second flow path 88, a linear portion 881 having a linear shape is formed. The linear portion 881 is in a state of being juxtaposed with the linear portion 874 of the first flow path 87, and the flow direction is also opposite to the linear portion 874.

  Further, the second flow path 88 changes its direction on the corner portion 866 side, and a linear portion 882 that forms a straight line is formed in a portion along the third side 863. The linear portion 882 is in a state of being juxtaposed with the linear portion 873 of the first flow path 87, and the flow direction is also opposite to the linear portion 873.

  Further, the second flow path 88 changes its direction on the corner 865 side, and the portion along the first side 861 meanders so as to repeat approach and separation with respect to the linear portion 872 of the first flow path 87. The meandering portion 883 and the linear portion 884 that form a straight line downstream from the meandering portion 883 are formed. The meandering portion 883 and the linear portion 884 are arranged in parallel with the linear portion 872 of the first flow path 87, and the flow direction is also opposite to the linear portion 872.

  The second flow path 88 ends at an outlet 885 from which the refrigerant RF flows out from the second flow path 88.

  As described above, the flow path 83 has the first side 861, the second side 862, and the third side 863, from the straight part 872 to the straight part 874 of the first flow path 87. It arrange | positions on the outer side and surrounds from the linear part 881 of the said 2nd flow path 88 to the linear part 884. FIG. The temperature of the refrigerant RF that flows down the first flow path 87 on the outside is lower than the temperature of the refrigerant RF that flows down on the second flow path 88 on the inside. Thereby, even if it is the device supply part 14 in which the outer peripheral part tends to go in and out more easily than a center part, the fall of the cooling function in the 1st flow path 87 is prevented, and sufficient cooling function is provided. It can be demonstrated. Therefore, uniform cooling of the plurality of IC devices 90 is performed on the device supply unit 14.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Further, the temperature adjustment unit has one set of the first member and the second member in the above embodiment, but is not limited to this, and has a plurality of sets, which are laminated in multiple layers. Also good. In this case, the temperature in the temperature adjustment unit is more averaged as a whole, that is, the temperature is made more uniform in the temperature adjustment unit as a whole.

  Further, the first member (the same applies to the second member) is not limited to the rectangle, and may be another rectangle having at least four sides of the first side to the fourth side. Note that other rectangles include squares.

  In addition, the refrigerant used for cooling the IC device is a liquid in the embodiment, but is not limited to this, and may be a gas.

  In addition, the cooling member that cools the IC device is applied to the temperature adjustment unit and the device supply unit in the embodiment, but is not limited to this. For example, a device that holds and transports the IC device in the inspection region It can also be applied to a transport head.

  Further, the temperature adjustment unit, the device supply unit, and other device transport heads may be configured to heat the IC device.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus (electronic component inspection apparatus), 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 12A ... Temperature adjustment part, 12B ... Temperature adjustment part, 13 ... Device conveyance head, 14 ... Device Supply unit, 15 ... tray transport mechanism (first transport device), 16 ... inspection unit, 17 ... device transport head, 18 ... device recovery unit, 19 ... recovery tray, 20 ... device transport head, 21 ... tray transport mechanism ( Second transport device), 22A ... Tray transport mechanism, 22B ... Tray transport mechanism, 23 ... Piping, 24a ... Valve, 24b ... Valve, 24c ... Valve, 24d ... Valve, 3a ... First member, 3b ... Second member, 30 ... Sealing member, 31 ... Lower surface, 32 ... Upper surface, 33 ... Flow path, 331 ... Folded part, 34 ... Groove, 35 ... Upper surface, 361 ... First side, 362 ... Second side, 363 ... Third 364, 4th side, 365, corner (corner), 366, corner (corner), 367, corner (corner), 37, first flow path, 371, inlet, 372, linear portion, 373 ... Crank-shaped portion, 374 ... Linear portion, 375 ... Linear portion, 376 ... Linear portion, 377 ... Linear portion, 38 ... Second flow path, 381 ... Linear portion, 382 ... Linear portion, 383 ... Linear portion, 384 ... serpentine portion, 385 ... linear portion, 386 ... outlet, 5 ... manifold joint, 51 ... manifold body, 511 ... internal flow path, 512 ... internal flow path, 52 ... joint, 53 ... joint, 54 ... Joint, 55 ... Joint, 56 ... Joint, 57 ... Joint, 61 ... First partition, 62 ... Second partition, 63 ... Third partition, 64 ... Fourth partition, 65 ... Fifth partition, 66 ... Inner partition , 70 ... Front cover, 71 ... Side cover, 72 ... Side Bar, 73 ... Rear cover, 74 ... Top cover, 8a ... First member, 8b ... Second member, 83 ... Flow path, 831 ... Folded portion, 84 ... Groove, 861 ... First side, 862 ... Second side, 863 3rd side, 864 ... 4th side, 865 ... Corner (corner), 866 ... Corner (corner), 87 ... 1st flow path, 871 ... Inlet, 872 ... Linear part, 873 ... Linear part , 874 ... linear part, 88 ... second flow path, 881 ... linear part, 882 ... linear part, 883 ... meandering part, 884 ... linear part, 885 ... outlet, 90 ... IC device, 100 ... electronic Component placement member, 101 ... pocket, 200 ... tray (arrangement member), 300 ... monitor, 301 ... display screen, 400 ... signal lamp, 500 ... speaker, 600 ... mouse base, 700 ... tank, 701 ... tube (third) Flow path), 702... Tube, 703 ... Tube, 704 ... Tube, 705 ... Tube, 706 ... Tube (fourth flow path), 800 ... Control unit, A1 ... Tray supply area, A2 ... Device supply area (supply area), A3 ... Inspection area, A4 ... Device collection area (collection area), A5 ... Tray removal area, RF ... Refrigerant, _t3a ... Thickness, _t3b ... Thickness

Claims (12)

A cooling member for cooling the electronic component;
The cooling member includes a first flow path into which a refrigerant flows;
A second flow path that communicates with the first flow path and through which the refrigerant flows out,
When the cooling member is viewed in plan, the first flow path is disposed so as to surround a part of the second flow path.   The cooling member has a first side, a second side, a third side, and a fourth side. In the first side, the second side, and the third side, when the cooling member is viewed in plan view, The electronic component transport apparatus according to claim 1, wherein the first flow path is disposed outside the second flow path.   The electronic component transport apparatus according to claim 1, wherein the first side and the second side are opposed to each other, and the third side and the fourth side are opposed to each other. The cooling member is a rectangle having the first side, the second side parallel to the first side, the third side orthogonal to the first side, and the fourth side parallel to the third side,
4. The electron according to claim 2, wherein an inflow port through which the refrigerant flows into the first flow path and an outflow port through which the refrigerant flows out from the second flow path are arranged on the fourth side. Parts transport device.   The length of the said 1st edge | side and the said 2nd edge | side is an electronic component conveying apparatus of any one of Claim 2 thru | or 4 longer than the length of the said 3rd edge | side and the said 4th edge | side.   6. The electronic component conveyance according to claim 2, wherein a portion where the first flow path and the second flow path are connected to each other is disposed closer to the fourth side than the third side. apparatus.   It has two said cooling members, The said 4th edge | side of one said cooling member is arrange | positioned facing the said 4th edge | side of the other said cooling member. The electronic component conveying apparatus as described.   The electronic component conveying apparatus according to claim 1, wherein a part of the first flow path and the second flow path are arranged side by side.   9. The first flow path has a third flow path for allowing the refrigerant to flow into the first flow path and a fourth flow path for flowing the refrigerant flowing out of the second flow path on the back surface of one cooling member. The electronic component conveying apparatus according to any one of the above.   The electronic component transport apparatus according to claim 1, wherein the cooling member is a soak plate that cools the electronic component before inspection in advance.   The electronic component transport apparatus according to claim 1, wherein the cooling member is a shuttle plate that can be moved by a drive unit and transports the electronic component. A cooling member for cooling the electronic component;
The cooling member includes a first flow path into which a refrigerant flows;
A second flow path that communicates with the first flow path and through which the refrigerant flows;
An inspection unit for inspecting the electronic component,
When the cooling member is viewed in plan, the first flow path is disposed so as to surround a part of the second flow path.

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