TWI555117B - Electronic parts conveyor and electronic parts inspection device - Google Patents

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

In the prior art, for example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (Integrated Circuit) device is known, and the electronic component inspection device is assembled to transport the IC device to the inspection portion. The electronic component transport device up to the holding unit. When the IC device is inspected, the IC device is placed in the holding portion, and the IC device is positioned with respect to the holding portion, so that a plurality of probe pins (electrodes) provided in the holding portion are in contact with the respective terminals of the IC device.

In such an electronic component inspection apparatus, if the terminal of the IC device is made fine, it is necessary to position the IC device in the positioning mechanism of the holding portion.

Patent Document 1 discloses a positioning mechanism that presses an electronic component in two directions orthogonal to each other by two pressing members, and presses the electronic component against a contact portion provided in the holding portion. To locate it.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-122774

However, in the device described in Patent Document 1, the electronic component conveying device grips the electronic component and conveys it to the holding portion, and releases the electronic component to drop it to the holding portion. In the meantime, the positioning mechanism is not notified that the electronic component has been released, so the positioning mechanism performs the positioning of the electronic component without knowing when the electronic component is released. Therefore, there is a flaw in the timing of starting the positioning of the electronic component. If the timing is mistaken, the electronic component is damaged. Further, for example, if the timing of starting the positioning of the electronic component is sufficiently delayed so that the electronic component is completely disposed in the holding portion, it takes a long time until the positioning ends.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can suppress damage of an electronic component and can quickly position the electronic component to the holding portion.

The present invention has been made in order to solve at least a part of the above problems, and can be realized in the following aspects or application examples.

[Application Example 1]

An electronic component transporting apparatus according to the present invention includes: a gripping portion that grips an electronic component; a holding portion that holds the electronic component; and a positioning mechanism that positions the electronic component at a specific position of the holding portion; After the grip portion releases the electronic component, the positioning mechanism is actuated to position the electronic component.

Thereby, the positioning of the electronic component can be quickly performed after the grip portion releases the electronic component. Moreover, since the positioning of the electronic component is performed after the grip portion is released from the electronic component, damage of the electronic component can be suppressed.

[Application Example 2]

In the electronic component conveying apparatus of the present invention, preferably, the positioning means moves the electronic component disposed in the holding portion by using a fluid when the electronic component is positioned.

Thereby, for example, the fluid is ejected to the holding portion, and the electronic component is moved by the fluid to be positioned, whereby the damage of the electronic component can be suppressed as compared with the case where the pressing member presses the electronic component to perform positioning.

[Application Example 3]

Preferably, the electronic component transporting apparatus of the present invention includes: a transporting mechanism having the gripping portion and transporting the electronic component; an electronic component transport control unit that controls an operation of the transport mechanism; and a positioning control unit; The electronic component transport control unit transmits a first signal for notifying that the electronic component has been released to the positioning control unit.

Thereby, the positioning control portion can know that the grip portion has released the electronic component, whereby the damage of the electronic component can be suppressed.

[Application Example 4]

In the electronic component transport apparatus of the present invention, preferably, after the transmitting the first signal, the positioning control unit controls the positioning of the positioning mechanism to perform positioning of the electronic component, and when the positioning is completed, notifying that the positioning has been performed. The second signal that has ended is sent to the electronic component transport control unit.

Thereby, it is possible to suppress damage of the electronic component when the electronic component is positioned.

Further, the electronic component transport control unit can know that the positioning of the electronic component has been completed, whereby the control of the next operation can be quickly performed in a state where the positioning of the electronic component is completed.

[Application 5]

In the electronic component transport apparatus of the present invention, preferably, the positioning control unit controls the positioning of the positioning mechanism to perform positioning of the electronic component, and when the positioning is completed, transmits a second signal indicating that the positioning has been completed to the Electronic parts transport control unit.

Thereby, the electronic component conveyance control unit can know that the positioning of the electronic component has been completed, whereby the control of the next operation can be quickly performed in a state where the positioning of the electronic component is completed.

[Application Example 6]

In the electronic component transport apparatus of the present invention, preferably, after transmitting the second signal, the electronic component transport control unit controls the operation of the transport mechanism to bring the grip portion closer to the holding portion.

Thereby, the electronic component conveyance control unit can quickly control the operation of bringing the gripping portion closer to the holding portion in a state where the positioning of the electronic component is completed.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, it is preferable that the gripping portion has a suction mechanism that sucks gas, and the gas is sucked by the suction mechanism, and the electronic component is gripped by adsorbing the electronic component.

Thereby, it is possible to suppress the damage of the electronic component by the grip portion.

[Application Example 8]

In the electronic component transport apparatus of the present invention, preferably, the electronic component transport control unit transmits the first signal to the positioning control unit after the suction mechanism stops the suction of the gas.

When the suction mechanism stops the suction of the gas, the electronic component is released from the grip portion, whereby the positioning control portion can know that the grip portion has released the electronic component based on the transmission of the first signal.

[Application Example 9]

In the electronic component transport apparatus of the present invention, preferably, the electronic component transport control unit transmits the first signal to the positioning control unit after a lapse of a predetermined time after the suction mechanism stops the suction of the gas.

If the suction mechanism stops the suction of the gas, the electronic component is released from the gripping portion, if After the specific time has elapsed, the electronic component is placed in the holding portion. Therefore, the positioning control unit can know that the gripping portion has released the electronic component and has placed the electronic component on the holding portion based on the transmission of the first signal.

[Application Example 10]

In the electronic component conveying apparatus of the present invention, preferably, the control unit is configured to control the operation of the electronic component conveying device, and the control unit controls the operation of the positioning mechanism after a predetermined time has elapsed after the electronic component is released. Perform the positioning of the above electronic parts.

When a certain time elapses after the grip portion releases the electronic component, the electronic component is placed on the holding portion, whereby the electronic component can be positioned after the electronic component is placed on the holding portion.

[Application Example 11]

Preferably, the electronic component transporting apparatus according to the present invention includes a transporting mechanism that includes the gripping unit and transports the electronic component, and the control unit controls the operation of the transporting mechanism when the positioning is completed. The grip portion is close to the holding portion.

Thereby, the control unit can control the operation of bringing the grip portion closer to the holding portion in a state where the positioning of the electronic component is completed.

[Application Example 12]

An electronic component inspection apparatus according to the present invention is characterized by comprising: a grip portion that grips an electronic component; a holding portion that holds the electronic component; and a positioning mechanism that positions the electronic component at a specific position of the holding portion; and a part that inspects the electronic component; and after the gripping portion releases the electronic component, the positioning mechanism is actuated Perform the positioning of the above electronic parts.

Thereby, after the electronic component is released by the grip portion, the positioning of the electronic component can be quickly performed. Moreover, since the positioning of the electronic component is performed after the grip portion is released from the electronic component, damage of the electronic component can be suppressed.

1‧‧‧Checking device

2‧‧‧Supply Department

3‧‧‧Supply side alignment

4‧‧‧Transportation Department

5‧‧‧Inspection Department

6‧‧‧Recycling side alignment

7‧‧Recycling Department

8‧‧‧Control Department

9‧‧‧IC devices

10‧‧‧Transporting device

11‧‧‧Base

12‧‧‧ 盖部

41‧‧‧Transport shuttle

42‧‧‧Supply robot

43‧‧‧Check the robot

44‧‧‧Recycling robot

51‧‧‧ Keeping Department

52‧‧‧ Keep face

53‧‧‧ wall

54‧‧‧Substrate

55‧‧‧ recess

81‧‧‧Transportation Control Department

82‧‧‧ Positioning Control Department

83‧‧‧Check Control Department

91‧‧‧ Body Department

92‧‧‧ terminals

93‧‧‧Terminal configuration surface

100‧‧‧ Positioning mechanism

111‧‧‧ base surface

131‧‧‧pipe body

132‧‧‧ tube body

133‧‧‧ tube body

134‧‧‧pipe body

141‧‧‧ Valve

142‧‧‧ valve

143‧‧‧ valve

144‧‧‧ valve

151‧‧‧ pump

152‧‧‧ pump

153‧‧‧ pump

154‧‧‧ pump

155‧‧ ‧ suction pump

161‧‧‧pressure sensor

162‧‧‧pressure sensor

341‧‧‧mounting table

411‧‧‧ Bag Department

421‧‧‧Support framework

422‧‧‧Mobile framework

423‧‧‧Hand unit

431‧‧‧Support framework

432‧‧‧Mobile framework

433‧‧‧Hand unit

434‧‧‧Adsorption nozzle

441‧‧‧Support framework

442‧‧‧Mobile framework

443‧‧‧Hand unit

510‧‧‧ Keeping the body

531‧‧‧ sloped surface

551‧‧‧ corner

552‧‧‧ corner

553‧‧‧ face

554‧‧‧ Face

555‧‧‧ face

556‧‧‧ Face

1311‧‧‧ openings

1321‧‧‧ openings

1331‧‧‧ openings

1341‧‧‧ openings

S101‧‧‧Steps

S102‧‧‧Steps

S103‧‧‧Steps

S104‧‧‧Steps

S105‧‧‧Steps

S106‧‧‧Steps

S107‧‧‧Steps

S108‧‧‧Steps

S109‧‧‧Steps

S110‧‧‧Steps

S111‧‧‧Steps

S112‧‧‧Steps

S113‧‧‧ steps

S114‧‧‧Steps

S115‧‧‧Steps

S201‧‧‧ steps

S202‧‧‧Steps

S203‧‧‧Steps

S204‧‧‧Steps

S205‧‧‧Steps

S206‧‧‧ steps

S207‧‧‧Steps

O‧‧‧ center axis

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention.

Fig. 2 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1;

Fig. 3 is a cross-sectional view showing a holding portion of an inspection portion of the electronic component inspection device shown in Fig. 1;

Figure 4 is a cross-sectional view taken along line A-A of Figure 3.

FIG. 5 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in FIG. 1.

Fig. 6 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in Fig. 1.

Fig. 7 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in Fig. 1.

FIG. 8 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in FIG. 1.

FIG. 9 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in FIG. 1.

FIG. 10 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in FIG. 1.

Fig. 11 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.

Fig. 12 is a view showing the conveyance in the second embodiment of the electronic component inspection device of the present invention; Department and inspection department map.

Fig. 13 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 12.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on the embodiments shown in the drawings.

<First embodiment>

Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1; Fig. 3 is a cross-sectional view showing a holding portion of an inspection portion of the electronic component inspection device shown in Fig. 1; Figure 4 is a cross-sectional view taken along line A-A of Figure 3. 5 to 10 are views for explaining the operation in the case where the electronic component is positioned in the holding portion in the electronic component inspection device shown in Fig. 1. Fig. 11 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.

In the following, for the sake of convenience, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is referred to as "X direction", the direction parallel to the Y axis is referred to as "Y direction", and the direction parallel to the Z axis is referred to as "Z direction". In addition, the upstream side of the transport direction of the electronic component is simply referred to as "upstream side", and the downstream side of the transport direction of the electronic component is simply referred to as "downstream side". Moreover, the "level" mentioned in the specification of the present invention is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as it does not hinder the conveyance of the electronic component.

In addition, the upper side in FIG. 4 to FIG. 6, FIG. 8, and FIG. 10 is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower".

In addition, one of the four holding parts of the inspection unit is shown in FIG. 3 to FIG. 10, and one of the four hand units of the conveyance unit is shown. In addition, in FIGS. 3 to 10, the probe pins and the like which are in contact with the terminals of the electronic component are omitted from the holding portion.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is, for example, an IC device such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package, and an LCD (Liquid). A device for inspecting and testing (hereinafter referred to as "inspection") for electrical characteristics of electronic components such as a crystal display (Crystal Display), a CIS (CMOS (Complementary Metal Oxide Semiconductor) Image Sensor, and a complementary MOS image sensor). In the following, for convenience of explanation, a case where the IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 9". In the following, a BGA package will be described as an example of the IC device 9.

First, the IC device 9 will be described.

As shown in FIGS. 5 and 6, the IC device 9 is a BGA package and has a body portion 91 and a plurality of terminals (electrodes) 92 provided outside the body portion 91. The shape of the main body portion 91 is not particularly limited. However, in the present embodiment, the shape is formed into a plate shape, and the square shape is formed when viewed from the thickness direction (the Z direction in the state in which the IC device 9 is held by the holding portion 51). Furthermore, in the present embodiment, the quadrilateral is a square or a rectangle.

The lower surface of the main body portion 91 in FIG. 5 is a terminal arrangement surface 93, and a plurality of terminals 92 are arranged in a lattice shape on the terminal arrangement surface 93. Further, each of the terminals 92 is a semicircular solder ball. Further, the shape of each terminal 92 is of course not limited to a semicircular shape.

Next, the inspection apparatus 1 will be described.

As shown in FIG. 1, the inspection apparatus 1 is provided with a conveyance apparatus (electronic component conveyance apparatus) 10 which has the positioning mechanism 100 which performs the positioning of the IC device 9.

In other words, the inspection device 1 includes the supply unit 2, the supply side array unit 3, the transport unit (transport mechanism) 4, the inspection unit 5, the collection side array unit 6, the collection unit 7, and the respective units (inspection unit 1). The conveyance control unit (electronic component conveyance control unit) (first control unit) 81, the positioning control unit (second control unit) 82, and the inspection control unit (third control unit) 83 of the control unit. Further, the transport control unit 81 controls the operation (drive) of the transport unit 4 and the like, and the positioning control unit 82 It controls the operation of the positioning mechanism 100 and the like.

Further, the inspection apparatus 1 includes a susceptor 11 for arranging the supply unit 2, the supply-side arranging unit 3, the conveying unit 4, the inspection unit 5, the collection-side arranging unit 6, and the collecting unit 7, and a lid portion 12 for accommodating The supply-side arranging unit 3, the conveying unit 4, the inspection unit 5, and the collection-side arranging unit 6 are covered on the susceptor 11. Further, the base surface 111 on the upper surface of the susceptor 11 is substantially horizontal, and the supply side arranging portion 3, the conveying portion 4, the inspection portion 5, and the recovery side arranging portion 6 are disposed on the base surface 111. Further, in addition, the inspection apparatus 1 may have a heater or a chamber or the like for heating the IC device 9 as needed.

The inspection apparatus 1 is configured such that the supply unit 2 supplies the IC device 9 to the supply side array unit 3, the supply side array unit 3 arranges the supplied IC devices 9, and the transport unit 4 arranges the ICs. The device 9 is transported to the inspection unit 5, and the inspection unit 5 inspects the transported IC device 9. The transport unit 4 transports/arranges the IC device 9 that has been inspected to the recovery side array unit 6, and the collection unit 7 collects and collects the array side on the recovery side. 6 IC device 9. According to such an inspection apparatus 1, the supply, inspection, and recovery of the IC device 9 can be automatically performed. In the inspection apparatus 1, the transport apparatus (electronic component transport apparatus) 10 includes a supply unit 2, a supply side array unit 3, a transport unit 4, a part of the inspection unit 5, a collection side array unit 6, a collection unit 7, and a transport unit. The control unit 81, the positioning control unit 82, and the like. The transport device 10 performs transport of the IC device 9, positioning of the IC device 9 of the positioning mechanism 100 to a specific position of the holding portion 51 of the inspection portion 5, and the like. Further, the specific position at which the IC device 9 is positioned at the holding portion 51 is also simply referred to as "positioning the IC device 9 to the holding portion 51".

Hereinafter, the configuration of the transport unit 4, the inspection unit 5, and the positioning mechanism 100 will be described.

"Transport Department"

As shown in FIG. 2, the transport unit 4 is a unit that transports the IC device 9 disposed on the mounting table 341 of the supply-side arranging unit 3 to the inspection unit 5, and the inspection by the inspection unit 5 is completed. The IC device 9 is transported to the recovery side array portion 6. The transport unit 4 includes a transport shuttle 41, a supply robot 42, an inspection robot 43, and a recovery robot 44.

- Handling shuttle -

The transport shuttle 41 is a transport shuttle for transporting the IC device 9 on the mounting table 341 to the vicinity of the inspection unit 5, and further transports the IC device 9 that has been inspected by the inspection unit 5 to the inspection. The vicinity of the collection side alignment portion 6 is collected. In the transport shuttle 41, four pocket portions 411 for accommodating the IC device 9 are formed in parallel in the X direction. Further, the transport shuttle 41 is guided by the linear motion guide, and is reciprocally movable in the X direction by a drive source such as a linear motor.

-Supply robots -

The supply robot 42 transports the IC device 9 disposed on the mounting table 341 to the robot of the transport shuttle 41. Such a supply robot 42 has a support frame 421 supported by the base 11 and a moving frame 422 supported by the support frame 421 and reciprocally movable in the Y direction with respect to the support frame 421; and 4 hand units ( The gripping robot 423, which is supported by the moving frame 422. Each of the hand units 423 includes an elevating mechanism and an adsorption nozzle, and the IC device 9 can be gripped by suction.

- Check the robot -

The inspection robot 43 transports the IC device 9 housed in the transport shuttle 41 to the inspection unit 5, and transports the IC device 9 that has finished the inspection from the inspection unit 5 to the transport shuttle 41. Further, the inspection robot 43 can also apply a specific inspection pressure to the IC device 9 by pressing the IC device 9 against the inspection portion 5 at the time of inspection. Such an inspection robot 43 has a support frame 431 supported by the base 11 and a moving frame 432 supported by the support frame 431 and reciprocally movable in the Y direction with respect to the support frame 431; and 4 hand units ( A gripping robot) (grip) 433, which is supported by the moving frame 432.

Each of the hand units 433 includes an elevating mechanism and an adsorption nozzle 434 (see FIG. 5), and the IC device 9 can be grasped (held) by adsorption. Each of the hand units 433 is the same, and therefore one of them will be described below.

When viewed from the Z direction (vertical direction), the hand unit 433 is formed with the inspection unit 5 described below. The concave portion 55 of the holding portion 51 has a corresponding shape. Specifically, when viewed from the Z direction, the hand unit 433 is formed in a quadrangular shape and slightly smaller than the inner peripheral portion of the concave portion 55. Furthermore, in the present embodiment, the quadrilateral is a square or a rectangle. In the hand unit 433, when the air is ejected from the pumps 151 and 152, and the pumps 153 and 154 suck the air, they are disposed at a predetermined distance from the holding portion 51, whereby the recess 55 can be covered by the hand unit 433 (refer to the figure). 8).

Further, a pipe body is connected to the adsorption nozzle 434, and the pipe body is connected to a suction pump 155 that sucks air (gas), and the gas is sucked by the operation of the suction pump 155 to adsorb the IC device 9 (refer to Figure 5). Further, the operation of the elevating mechanism and the suction pump 155 is controlled by the transport control unit 81. Further, the suction mechanism that sucks air (gas) includes an adsorption nozzle 434, a suction pump 155, and a tube that connects the adsorption nozzle 434 to the suction pump 155.

-Recycling robots -

The collection robot 44 is a robot that transports the IC device 9 that has been inspected by the inspection unit 5 to the collection-side arranging unit 6. Such a recycling robot 44 has a support frame 441 supported by the base 11 and a moving frame 442 supported by the support frame 441 and reciprocally movable in the Y direction with respect to the support frame 441; and 4 hand units ( The gripping robot 443 is supported by the moving frame 442. Each of the hand units 443 includes an elevating mechanism and an adsorption nozzle, and the IC device 9 can be gripped by suction.

The transfer unit 4 transports the IC device 9 as follows. First, the transport shuttle 41 moves to the left in the drawing, and the supply robot 42 transports the IC device 9 on the mount 341 to the transport shuttle 41 (STEP 1). Next, the transport shuttle 41 moves toward the center, and the inspection robot 43 transports the IC device 9 on the transport shuttle 41 to the inspection unit 5 (STEP 2). Next, the inspection robot 43 transports the IC device 9 that has finished the inspection by the inspection unit 5 to the transport shuttle 41 (STEP 3). Then, the transport shuttle 41 moves to the right side in the drawing, and the recovery robot 44 transports the inspected IC device 9 on the transport shuttle 41 to the recovery side array portion 6. By repeating such STEPs 1 to STEP 3, the IC device 9 can be transported to the recovery side arranging unit 6 via the inspection unit 5.

Although the configuration of the transport unit 4 has been described above, the configuration of the transport unit 4 is The IC device 9 on the mounting table 341 can be transported to the inspection unit 5, and the IC device 9 that has finished the inspection is transported to the recovery side array unit 6, and is not particularly limited. For example, the transfer robot 41 may be omitted, and any one of the supply robot 42, the inspection robot 43, and the recovery robot 44 may be used to transport the self-mounted table 341 to the inspection unit 5 and the self-inspection unit 5 to the recovery-side alignment unit 6. .

Inspection Department

The inspection unit 5 is a unit that inspects and tests the electrical characteristics of the IC device 9. As shown in FIG. 2, the inspection unit 5 has four holding portions 51 for arranging the IC device 9. A plurality of probe pins (not shown) electrically connected to the terminals of the IC device 9 are provided in the holding portions 51, respectively. Each probe pin is electrically connected to the inspection control unit 83. When the IC device 9 is inspected, one IC device 9 is placed (held) in one holding portion 51. Each of the terminals 92 of the IC device 9 disposed in the holding portion 51 is pressed against each of the probe pins with a specific inspection pressure by the pressing of the hand unit 433 of the inspection robot 43. Thereby, each terminal 92 of the IC device 9 can be electrically connected (contacted) to each probe pin, and the IC device 9 can be inspected via the probe pin. The inspection of the IC device 9 is performed based on the program stored in the inspection control unit 83. Further, the holding portion 51 will be described in detail below.

"Control Departments"

The conveyance control unit 81 controls the operation of the conveyance unit 4 and the like. The conveyance control unit 81 controls the operation of each of the supply unit 2, the supply-side arranging unit 3, the transport unit 4, the collection-side arranging unit 6, and the recovery unit 7, for example, to carry out the transport of the IC device 9.

Further, the positioning control unit 82 controls the operation of the positioning mechanism 100 and the like. The positioning control unit 82 controls the operation of each of the transport unit 4, the inspection unit 5, the collection side array unit 6, and the collection unit 7, for example, and positions the IC device 9 to the holding unit 51.

In addition, the inspection control unit 83 performs inspection of electrical characteristics of the IC device 9 disposed in the inspection unit 5, for example, based on a program stored in a memory (not shown).

Furthermore, it is configured to be movable between the transport control unit 81 and the positioning control unit 82. Communication between the control unit 81 and the inspection control unit 83, and between the positioning control unit 82 and the inspection control unit 83 are performed.

Positioning Agency

Next, the positioning mechanism 100 will be described. However, the positioning mechanisms 100 of the four holding portions 51 of the inspection unit 5 are the same, and therefore, one of them will be described below. (The descriptions regarding the positioning, inspection, and actions of the IC devices described below are also the same).

As shown in FIG. 3 to FIG. 5, the positioning mechanism 100 has a holding portion 51 having a holding portion body 510, four tubes 131, 132, 133 and 134, four valves 141, 142, 143 and 144; four Pumps 151, 152, 153, and 154; hand unit 433; and two pressure sensors (detection portions) 161 and 162. The inner chambers of the tubes 131, 132, 133, and 134 are flow paths through which air (fluid) flows. Further, a portion (one end portion) of the tubular bodies 131 to 134 that is inserted into the lower wall portion 53 of the holding portion main body 510 is a constituent element of the holding portion 51. That is, the holding portion 51 that holds the IC device 9 includes the holding portion main body 510, and a portion (one end portion) into which the tube portions 131 to 134 are inserted into the wall portion 53 and the like. Further, the pressure sensor 161 is a sensor that detects the pressure in the tube body 133, and the detection result of the pressure sensor 161 is sent to the positioning control unit 82. Further, the pressure sensor 162 is a sensor that detects the pressure in the tube 134, and the detection result of the pressure sensor 162 is sent to the positioning control unit 82.

The holder main body 510 includes a substrate 54 having a holding surface (electronic component holding surface) 52 that holds the IC device 9 and a wall portion 53 that is provided on the substrate so as to surround the holding surface 52. Furthermore, the holding surface 52 is parallel to the XY plane.

The shape of the holding portion main body 510 is not particularly limited. However, in the present embodiment, a quadrangular shape is formed when viewed from the Z direction (vertical direction) (the direction orthogonal to the holding surface). Furthermore, in the present embodiment, the quadrilateral is a square or a rectangle.

Further, the shape of the wall portion 53 is not particularly limited. However, in the present embodiment, the wall portion 53 is formed in a rectangular frame shape and formed on the outer peripheral portion of the substrate 54. That is, the shape of the inner surface of the wall portion 53 and the shape of the outer surface are respectively quadrangular when viewed from the Z direction. Furthermore, In this embodiment, the quadrilateral is a square or a rectangle. Thereby, the holding portion main body 510 is formed with a concave portion 55 which is formed in a quadrangular shape when viewed from the Z direction. The bottom surface of the recess 55 is a holding surface 52. Further, in the present embodiment, as shown in FIG. 9, the IC device 9 is positioned such that its corner portion is disposed at the lower left corner portion 552 of FIG. 9 of the concave portion 55 (wall portion 53).

Further, an inclined surface 531 whose inner side is lower than the outer side is formed on the upper portion of the inner peripheral portion of the wall portion 53. Thereby, when the IC device 9 is placed on the holding portion 51, the IC device 9 can be easily inserted into the concave portion 55 along the inclined surface 531 and disposed on the holding surface 52.

Further, one end of the tubular bodies 131 to 134 is connected to the outer peripheral portion of the holding portion main body 510, that is, the wall portion 53. In this case, one end of the tubular bodies 131 to 134 is disposed on four sides of the quadrilateral. Further, the openings (openings) 1311 to 1341 at one end of the tubular bodies 131 to 134 are open to the inner surface of the wall portion 53.

Further, the first flow path includes a portion (one end portion) of the tubular body 131 inserted into the wall portion 53, and the second flow path includes a portion (one end portion) of the tubular body 132 inserted into the wall portion 53, and the third flow path includes The tubular body 133 is inserted into a portion (one end portion) of the wall portion 53, and the fourth flow path includes a portion (one end portion) of the tubular body 134 that is inserted into the wall portion 53.

Further, in the present embodiment, one end of the tubular bodies 131 and 132 is disposed in the vicinity of the corner portion 551 of the corner portions 551 and 552 on the diagonal line of the concave portion 55, and one end portion of the tubular bodies 133 and 134 is disposed in the concave portion 55. The vicinity of the corner 552 of the corner portions 551, 552 on the diagonal line. That is, one end of the tubular body 131 and one end of the tubular body 133 are offset in the X direction, and one end of the tubular body 132 is offset from the end of the tubular body 134 in the Y direction.

Further, in the present embodiment, one of the end portions of the tubular bodies 131 to 134 is orthogonal to the four faces 553, 554, 555 and 556 constituting the inner surface of the concave portion 55 (wall portion 53). Thereby, the flow path direction of one end portion of the pipe body 131 is orthogonal to the flow path direction of one end portion of the pipe body 132, and the flow path direction of one end portion of the pipe body 133 is orthogonal to the flow path direction of one end portion of the pipe body 134. . That is, the angle between the first vector indicating the flow of the fluid flowing through one end of the tubular body 131 and the second vector indicating the flow of the fluid flowing through one end of the tubular body 132 is 90 degrees, indicating that the flow through the tube The third vector of the flow of the fluid at one end of the body 133 forms an angle of 90 degrees with the fourth vector representing the flow of the fluid flowing through one end of the tubular body 134. Thereby, the IC device 9 can be easily moved in the X direction and the Y direction by the air flow.

Further, the flow path direction of one end portion of the pipe body 131 and the flow path direction of one end portion of the pipe body 132 may be crossed, and the flow path direction of one end portion of the pipe body 133 and one end portion of the pipe body 134 may flow. Just cross the direction of the road. That is, the angle between the first vector indicating the flow of the fluid flowing through one end of the tubular body 131 and the second vector indicating the flow of the fluid flowing through one end of the tubular body 132 is not necessarily 0 degrees and 180 degrees. The angle between the third vector indicating the flow of the fluid flowing through one end of the tubular body 133 and the fourth vector indicating the flow of the fluid flowing through one end of the tubular body 134 may be 0 degrees and 180 degrees. can.

Further, as shown in FIG. 6, the openings 1311 to 1341 are disposed such that the IC device 9 is held by the holding portion 51, and is disposed above and below the Z-direction in the Z-direction. By arranging one of the openings 1311 to 1341 in the Z direction below the terminal arrangement surface 93, the IC device 9 can be floated by the air flow, and a part of the openings 1311 to 1341 can be arranged in the terminal arrangement. The face 93 is further above the Z direction, and a stronger force can be applied to the IC device 9 by the air flow, whereby the IC device 9 can be easily moved when the IC device 9 is positioned.

Further, the openings 1311 to 1341 may be disposed only below the terminal arrangement surface 93 in the Z direction while the IC device 9 is held by the holding portion 51, or may be disposed only on the terminal arrangement surface 93. It is above the Z direction.

Further, the central axis (the central axis of the flow path) O of one end of the tubular bodies 131 to 134 is between the terminal arrangement surface 93 and the holding surface 52 while the IC device 9 is held by the holding portion 51. Thereby, the IC device 9 can be easily moved when the positioning of the IC device 9 is performed.

Further, as shown in FIGS. 3 and 4, pumps 151 to 154 are provided at the other end portions different from the end portions of the tubular bodies 131 to 134, respectively. Moreover, it is provided in the middle of the tubes 131 to 134, respectively. Valves 141~144. The pumps 151 and 152 are injection portions for injecting air (fluid), respectively, and the pumps 153 and 154 are suction portions for sucking air (fluid), respectively. When air is injected from the pumps 151 and 152 by the actuation of the pumps 151 and 152, the air flows into the tubes 131 and 132 and is ejected from the openings 1311 and 1321 into the recess 55. Further, when the pumps 153 and 154 are sucked by the operation of the pumps 153 and 154, the air in the recess 55 is sucked (discharged) from the openings 1331 and 1341, and the air flows in the tubes 133 and 134. And discharged to the outside. Further, the arrows shown in the vicinity of the pumps 151 to 154 in Figs. 3 and 4 indicate the direction in which the air flows.

Further, the inner cavities of the tubular bodies 131 to 134 are opened and closed by the opening and closing of the valves 141 to 144. Further, as the valves 141 to 144, if the opening degree can be adjusted, the flow rate of the air flowing through the tubes 131 to 134 can be adjusted by the adjustment of the opening degree. Further, the flow rate of the air flowing through the tubes 131 to 134 can be adjusted by adjusting the outputs of the pumps 151 to 154. Further, the driving of the pumps 151 to 154 and the valves 141 to 144 is controlled by the positioning control unit 82.

"Locating, Checking, and Actions of IC Devices"

Next, the operation and control when the IC device 9 is positioned in the holding portion 51 and inspected will be described based on FIGS. 5 to 11 .

As shown in Fig. 11, first, the suction pump 155 is actuated to suck air, and the IC device 9 is attracted to the adsorption nozzle 434, whereby the IC device 9 is grasped by the hand unit 433 and the IC device 9 is carried to the holding. In the portion 51, as shown in FIG. 5, the IC device 9 is inserted into a specific position in the concave portion 55 of the holding portion 51 (step S101). In the present embodiment, the lower end portion of the hand unit 433 is disposed at the upper end portion of the recess portion 55, and the hand unit 433 is stopped. Thereby, the recess 55 is covered by the hand unit 433. Thereby, leakage of air from the concave portion 55 can be suppressed, and the IC device 9 can be prevented from flying out of the concave portion 55 due to the air flow.

Next, as shown in FIGS. 6 and 7, the suction of the air of the suction pump 155 is stopped, whereby the IC device 9 is released from the hand unit 433. That is, the IC device 9 is detached from the hand unit 433 and dropped (step S102). Further, here, after the suction of the air of the suction pump 155 is stopped, that is, after the IC unit 9 is released by the hand unit 433, the IC device 9 is waited for being placed on the holding surface. The specific time before 52. Thereby, the IC device 9 is inserted into the recess 55 and disposed on the holding surface 52. Moreover, step S103 is performed after the lapse of the above specific time.

Next, the transport control unit 81 transmits the first signal that the notification hand unit 433 has released the IC device 9 to the positioning control unit 82 (step S103), and the positioning control unit 82 receives the first signal (step S104). Thereby, the positioning control unit 82 grasps that the hand unit 433 releases the IC device 9, and the IC device 9 is disposed on the holding surface 52.

Next, the positioning of the IC device 9 to the holding portion 51 is performed (step S105). The positioning of the IC device 9 is performed in the following manner.

First, as shown in Figs. 8 and 9, the valves 141 to 144 are opened to operate the pumps 151 to 154. Air is injected from the pumps 151 and 152 by the actuation of the pumps 151 and 152, and the air flows in the tubes 131 and 132 and is ejected from the openings 1311 and 1321 into the recess 55. Further, by the operation of the pumps 153 and 154, the pumps 153 and 154 suck the air, and the air in the recess 55 is sucked from the openings 1331 and 1341, and the air flows in the tubes 133 and 134 and is discharged to the outside. Thereby, an air flow is generated in the recess 55, and the IC device 9 is moved toward the faces 555 and 556 by the air flow, and is pressed against the faces 555 and 556, thereby arranging the corners of the IC device 9 at the corner of the recess 55. Part 552. Above, the positioning of the IC device 9 is completed (end).

Here, the positioning control unit 82 detects that the positioning of the IC device 9 is completed as follows.

First, the pressures in the tubes 133, 134 are detected by the pressure sensors 161, 162.

The IC device 9 is away from the openings 1331, 1341 before being positioned, but is disposed at a position where one of the openings 1331 and a portion of the opening 1341 are closed when the positioning is completed. Thereby, the pressure in the tubes 133, 134 is lowered. Therefore, when a specific threshold is set and the pressure in the tubes 133, 134 detected by the pressure sensors 161, 162 is less than the above threshold, it is judged that the positioning of the IC device 9 is completed.

Further, of course, instead of detecting the pressure in the tubular bodies 133 and 134 by the pressure sensors 161 and 162, the self-opening may be used in the same manner as in the second embodiment described below. The method of waiting for a predetermined time before starting the positioning of the IC device 9.

Next, the positioning control unit 82 transmits a second signal indicating that the positioning of the IC device 9 has been completed to the transport control unit 81 (step S106), and the transport control unit 81 receives the second signal (step S107). Thereby, the conveyance control unit 81 grasps the state in which the positioning of the IC device 9 is completed.

Next, as shown in FIG. 10, the hand unit 433 is lowered and approaches the holding portion 51, and the IC device 9 is pressed downward by the hand unit 433 (step S108). By pressing the hand unit 433, the terminals 92 of the IC device 9 are electrically connected to the probe pins, thereby completing the preparation for inspection of the IC device 9.

Next, the transport control unit 81 transmits a third signal informing that the preparation of the IC device 9 has been completed to the inspection control unit 83 (step S109), and the inspection control unit 83 receives the third signal (step S110). Thereby, the inspection control unit 83 grasps that the preparation for the inspection of the IC device 9 has been completed.

Next, the inspection of the IC device 9 is performed (step S111).

Then, the inspection control unit 83 transmits a fourth signal indicating that the inspection of the IC device 9 has been completed to the transport control unit 81 (step S112), and the transport control unit 81 receives the fourth signal (step S113). Thereby, the conveyance control unit 81 grasps that the inspection of the IC device 9 has ended.

Next, the IC device 9 is grasped by the hand unit 433, and taken out from the holding portion 51 (step S114), and the IC device 9 is transported to a specific position (step S115). Hereinafter, each operation (work) such as classification of the IC device 9 is performed.

Here, in the present embodiment, the operation of opening the valves 141 to 144 to operate the pumps 151 to 154 is performed after the IC device 9 is placed on the holding surface 52 of the holding portion 51, but the present invention is not limited thereto. It can also be performed before the IC device 9 is placed on the holding surface 52.

Further, it is preferable that the first timing of disengaging the IC device 9 from the hand unit 433 and the second timing of injecting air from the pumps 151 and 152 by the pumps 151 to 154 and the pumps 153 and 154 sucking air are preferably the same or As described above, the first timing is earlier (first) than the second timing.

If the first timing is later than the second timing, the time during which the IC device 9 is exposed to the air flow becomes longer. Although the IC device 9 is cooled by the air flow, if the first timing is the same as the second timing or the first timing is earlier than the second timing, the IC device 9 can be prevented from being cooled by the air flow.

Further, when the first timing is earlier than the second timing, it is preferable to start the air injection from the pumps 151 and 152 before the IC device 9 reaches the holding surface 52, and to start pumping the air by the pumps 153 and 154. Thereby, in addition to generating an air flow between the holding surface 52 and the terminal arrangement surface 93 of the IC device 9, there is also an air flow between the holding surface 52 and each terminal 92 of the IC device 9, by which the air flow The IC device 9 can be easily floated.

Furthermore, the timing of the air injection from the pumps 151 and 152 is the same as the timing at which the air is injected into the recess 55 from the openings 1311 and 1321, and the timing of the suction of the air by the pumps 153 and 154 and the suction recess 55 from the openings 1331 and 1341. The timing of the air is the same.

As described above, in the inspection apparatus 1, the positioning of the IC device 9 can be quickly performed after the hand unit 433 releases the IC device 9.

Further, since the positioning of the IC device 9 is performed after the hand unit 433 releases the IC device 9, the damage of the IC device 9 can be suppressed.

Further, since the IC device 9 is moved by the air flow to perform positioning, damage of the IC device 9 can be suppressed.

Further, in the state where the positioning of the IC device 9 is completed, the IC device 9 can be quickly pressed downward by the hand unit 433, whereby the terminals 92 of the IC device 9 and the respective probe pins can be quickly electrically connected. connection.

Further, in the present embodiment, when the IC device 9 is positioned, both the ejection and the suction of the air are performed. However, the present invention is not limited thereto. For example, the ejection and the suction of the air may not be performed. Either.

That is, in the case where the suction of the air is not performed, the air in the recess 55 can be discharged by the tubes 133 and 134 to form an air flow. Further, even when the air is not sprayed, the air can be introduced into the recess 55 by the tubes 131 and 132. Furthermore, if you don’t In the case of suction of air, the tubes 133 and 134 may be omitted, and the holes (flow paths) for discharging the air may be provided in the wall portion 53. Further, when the air is not sprayed, the tubes 131 and 132 may be omitted, and the wall 53 may be provided with a hole (flow path) for introducing air.

Further, when the IC device 9 is positioned, the time difference is given and the operations of the pumps 151 to 154 are not simultaneously performed. That is, the injection timing of the air of the pump 151 and the pump 152 is different, and the pumping period of the air of the pump 153 and the pump 154 is different. The two methods are described below.

In the first method, first, the pumps 151 and 153 are actuated, and the air is ejected from the opening 1311 into the recess 55 by the action of the pump 151, and the pump 153 is actuated to suck the recess 55 from the opening 1331. The air. Thereby, an air flow is generated in the recess 55, and the IC device 9 moves toward the surface 555 by the air flow and is pressed against the surface 555.

Next, the pumps 152 and 154 are actuated, and the air is ejected from the opening 1321 into the recess 55 by the action of the pump 152, and the air in the recess 55 is sucked from the opening 1341 by the action of the pump 154. Thereby, an air flow is generated in the concave portion 55, and the IC device 9 is moved toward the surface 556 by the air flow and pressed against the surface 556, thereby arranging the corner portion of the IC device 9 at the corner portion 552 of the concave portion 55 (refer to Figure 9). Above, the positioning of the IC device 9 is completed.

In the second method, first, the pumps 152 and 154 are actuated, and the air is ejected from the opening 1321 into the recess 55 by the action of the pump 152, and the suction portion 55 is sucked from the opening 1341 by the action of the pump 154. air. Thereby, an air flow is generated in the recess 55, and the IC device 9 is moved toward the face 556 by the air flow, and is pressed against the face 556.

Next, the pumps 151 and 153 are actuated, and the air is ejected from the opening 1311 into the recess 55 by the action of the pump 151, and the air in the recess 55 is sucked from the opening 1331 by the action of the pump 153. Thereby, an air flow is generated in the concave portion 55, and the IC device 9 is moved toward the surface 555 and pressed against the surface 555 by the air flow, thereby arranging the corner portion of the IC device 9 at the corner portion 552 of the concave portion 55 (refer to Figure 9). Above, the positioning of the IC device 9 is completed.

Further, a temperature adjustment unit that adjusts the temperature of the air (fluid) injected by the pump 151 and a temperature adjustment for adjusting the temperature of the air (fluid) injected by the pump 152 may be provided. unit. Thereby, in the inspection performed at a relatively high set temperature (for example, 100 ° C) called a high temperature inspection, the temperature of the IC device 9 can be performed even when air is injected in the case of performing the positioning of the IC device 9. Maintain at the above set temperature.

<Second embodiment>

Fig. 12 is a view showing a conveying unit and an inspection unit in a second embodiment of the electronic component inspection device according to the present invention. Fig. 13 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 12.

In the following, the second embodiment will be described, but the description of the same matters will be omitted.

As shown in FIG. 12, in the inspection apparatus 1 of the second embodiment, the transport control unit 81, the positioning control unit 82, and the inspection control unit 83 shown in FIG. 1 are constituted by one control unit 8.

Hereinafter, the operation and control when the IC device 9 is positioned in the holding portion 51 and inspected will be described based on FIGS. 5 to 10 and FIG.

As shown in Fig. 13, first, the suction pump 155 is actuated to suck air, and the IC device 9 is attracted to the adsorption nozzle 434, whereby the IC device 9 is grasped by the hand unit 433, and the IC device 9 is transported. As shown in FIG. 5, the holding portion 51 is inserted into the specific position in the concave portion 55 of the holding portion 51 (step S201). In the present embodiment, the lower end portion of the hand unit 433 is disposed at the upper end portion of the recess portion 55, and the hand unit 433 is stopped. Thereby, the recess 55 is covered by the hand unit 433. Thereby, leakage of air from the concave portion 55 can be suppressed, and the IC device 9 can be prevented from flying out of the concave portion 55 due to the air flow.

Next, as shown in FIGS. 6 and 7, the suction of the air of the suction pump 155 is stopped, whereby the IC device 9 is released from the hand unit 433. That is, the IC device 9 is detached from the hand unit 433 and dropped (step S202). Here, after the suction of the air of the suction pump 155 is stopped, that is, after the IC unit 9 is released by the hand unit 433, it waits for a specific time until the IC device 9 is placed on the holding surface 52. Thereby, the IC device 9 is inserted into the recess 55 and disposed on the holding surface 52. Then, after the specific time has elapsed, the IC device 9 is moved to the holding portion. Positioning 51 (step S203). The positioning of the IC device 9 is performed in the same manner as in the first embodiment described above.

After the positioning of the IC device 9 is completed, the following step S204 is performed. Here, at the time of starting the positioning of the IC device 9, that is, when the valves 141 to 144 are opened and the pumps 151 to 154 are actuated, the predetermined time is preset. The specific time described above is set to be equal to or slightly longer than the time from the start of positioning of the IC device 9 to the end of positioning. Thereby, the positioning of the IC device 9 is ended by waiting for the specific time described above.

Further, of course, instead of the method of waiting for the specific time described above, a method of detecting the pressure in the tubes 133 and 134 by the pressure sensors 161 and 162 may be used in the same manner as in the first embodiment.

Next, as shown in FIG. 10, the hand unit 433 is lowered and brought close to the holding portion 51, and the IC device 9 is pressed downward by the hand unit 433 (step S204). By pressing the hand unit 433, the terminals 92 of the IC device 9 are electrically connected to the probe pins, and the preparation for inspection of the IC device 9 is completed.

Next, the inspection of the IC device 9 is performed (step S205).

Next, the IC device 9 is gripped by the hand unit 433, and taken out from the holding unit 51 (step S206), and the IC device 9 is transported to a specific position (step S207). Hereinafter, each operation (work) such as classification of the IC device 9 is performed.

According to the second embodiment described above, the same effects as those of the first embodiment described above can be exhibited.

In the present embodiment, the transport control unit 81, the positioning control unit 82, and the inspection control unit 83 are configured by one control unit 8. However, the present invention is not limited thereto, and may be, for example, a transport control unit 81 and a positioning control unit. The 82 is composed of one control unit, and the inspection control unit 83 is provided to be open to the control unit.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each unit is also It can be replaced with any configuration having the same function. Further, any other constituents may be added to the present invention.

Further, in the above embodiment, the number of the flow paths is four, but the number of the flow paths may be one, two, three or five or more. Further, for example, when the number of the flow paths is two, one of them may be used for the ejection of air and the other for the suction of the air. Further, in this case, either one of air injection and suction may not be performed.

In the above embodiment, air is used as the fluid. However, the present invention is not limited thereto. For example, nitrogen gas, argon gas, carbon dioxide gas, fluorine gas, or various insulating gases including the mixed gas may be used. Wait for the gas.

Further, in the above-described embodiment, the positioning mechanism directly moves the electronic component by the fluid. However, the present invention is not limited thereto. For example, the pressing member may be moved by the fluid, and the electronic component may be pressed by the pressing member. And make it move. Further, the pressing member can be moved by a driving source such as a motor, and the electronic component can be pressed and moved by the pressing member.

Further, in the above-described embodiment, the pressure sensor is used as the detecting portion for detecting the completion of the positioning of the electronic component. However, the present invention is not limited thereto, and examples thereof include a flow rate sensor and a contact sensor. Light sensor, etc.

51‧‧‧ Keeping Department

52‧‧‧ Keep face

53‧‧‧ wall

54‧‧‧Substrate

55‧‧‧ recess

100‧‧‧ Positioning mechanism

131‧‧‧pipe body

132‧‧‧ tube body

133‧‧‧ tube body

134‧‧‧pipe body

141‧‧‧ Valve

142‧‧‧ valve

143‧‧‧ valve

144‧‧‧ valve

151‧‧‧ pump

152‧‧‧ pump

153‧‧‧ pump

154‧‧‧ pump

161‧‧‧pressure sensor

162‧‧‧pressure sensor

510‧‧‧ Keeping the body

551‧‧‧ corner

552‧‧‧ corner

553‧‧‧ face

554‧‧‧ Face

555‧‧‧ face

556‧‧‧ Face

1311‧‧‧ openings

1321‧‧‧ openings

1331‧‧‧ openings

1341‧‧‧ openings

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Claims (10)

An electronic component conveying apparatus comprising: a gripping portion that grips an electronic component; a holding portion that holds the electronic component; and a positioning mechanism that positions the electronic component at a specific position of the holding portion; and a conveying mechanism The electronic component is transported by the electronic component, the electronic component transport control unit controls the operation of the transport mechanism, and the positioning control unit controls the actuation of the positioning mechanism; and the electronic component is released from the gripping portion. After the component, the positioning mechanism is activated to perform positioning of the electronic component, and the electronic component transport control unit transmits a first signal for notifying that the electronic component has been released to the positioning control unit; the gripping portion has a suction gas The suction mechanism sucks the electronic component by sucking the gas by the suction mechanism to grip the electronic component. The electronic component transporting apparatus according to claim 1, wherein the positioning mechanism is configured to move the electronic component disposed in the holding portion using a fluid when the electronic component is positioned. The electronic component transport apparatus according to claim 1, wherein the positioning control unit controls the positioning of the positioning mechanism to perform positioning of the electronic component, and when the positioning is completed, notifying that the positioning is completed. The second signal is transmitted to the electronic component transport control unit. The electronic component conveying device of claim 1, wherein the positioning control unit controls The positioning of the electronic component is performed by the positioning mechanism, and when the positioning is completed, the second signal indicating that the positioning has been completed is transmitted to the electronic component transport control unit. The electronic component transport apparatus according to claim 3 or 4, wherein, after transmitting the second signal, the electronic component transport control unit controls the operation of the transport mechanism to bring the gripping portion closer to the holding portion. The electronic component transporting apparatus according to claim 1, wherein the electronic component transport control unit transmits the first signal to the positioning control unit after the suction mechanism stops the suction of the gas. The electronic component transporting apparatus according to claim 1, wherein the electronic component transport control unit transmits the first signal to the positioning control unit after a lapse of a predetermined time after the suction mechanism stops the suction of the gas. The electronic component conveying apparatus according to claim 1 or 2, further comprising: a control unit that controls an operation of the electronic component conveying device, wherein the control unit controls the actuation of the positioning mechanism after a lapse of a certain time after the electronic component is released The positioning of the above electronic components is performed. An electronic component transporting apparatus according to claim 8 comprising: a transporting mechanism having the gripping unit and transporting the electronic component, wherein the control unit controls the operation of the transporting mechanism to cause the grasping when the positioning is completed The holding portion is close to the above holding portion. An electronic component inspection device comprising: a grip portion that grips an electronic component; a holding portion that holds the electronic component; and a positioning mechanism that positions the electronic component at a specific position of the holding portion; the inspection portion It checks the above electronic parts a transport mechanism having the grip portion and transporting the electronic component; an electronic component transport control unit that controls an operation of the transport mechanism; and a positioning control unit that controls actuation of the positioning mechanism; and the loose grip portion After the electronic component is opened, the positioning of the electronic component is performed by the positioning mechanism, and the electronic component transport control unit transmits a first signal for notifying that the electronic component has been released to the positioning control unit; the gripping portion has a pumping The suction mechanism for sucking gas sucks the electronic component by sucking the gas by the suction mechanism, thereby gripping the electronic component.