JP2020034302A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

To provide an electronic component conveyance device and an electronic component inspection device with which it is possible to output a detection signal having accuracy.SOLUTION: The electronic component conveyance device comprises: a conveyance unit for conveying an electronic component between a container in which the electronic component is placed and an inspection unit for inspecting the electric characteristic of the electronic component; a holding unit for holding the electronic component and arranged in the conveyance unit; a passage formation unit in which a passage communicating with the holding unit is provided; a pump for reducing the pressure in the passage to below the atmospheric pressure and connected to the holding unit via the passage; a pressure detection unit for detecting the pressure in the passage; a gas inflow unit for allowing a gas to flow into the passage and connected to the holding unit moved by the conveyance unit and communicating with the passage; and an abnormality detection unit for detecting the abnormality of the passage on the basis of the pressure in the passage while the passage and the gas inflow unit communicate with each other.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic component transport device and an electronic component inspection device.

  As an inspection apparatus for electrically inspecting a sample such as an IC device, there is an automatic sample collection system described in Patent Document 1. The sample automatic recovery system described in Patent Document 1 includes a sample positioning unit that aligns and arranges a sample, a sample inspection unit that inspects a sample, and a method that moves the sample between the sample positioning unit and the sample inspection unit. And a sample transport unit for transporting the sample. Each of the sample transport unit, the sample positioning unit, and the sample inspection unit has a vacuum tube and a vacuum sensor that detects the pressure in the vacuum tube, and the sample is evacuated by reducing the pressure in the vacuum tube. Can be adsorbed.

  In the automatic recovery system having such a configuration, the sample transport device, the sample positioning unit, and the sample inspection unit each attempt a sample suction operation, and turn on / off a detection signal output from each vacuum sensor. Thus, the presence or absence of a sample in the sample transport device, the sample positioning unit, and the sample inspection unit can be determined.

JP 2002-270481 A

  However, in the automatic recovery system described in Patent Literature 1, for example, a user can easily change a threshold for turning on / off a detection signal output from each vacuum sensor according to the weight of the sample. In addition, there are cases where the user forgets to return the changed threshold value or forgets to change the threshold value to a value suitable for a new sample. Therefore, there is a possibility that the detection signal output from each vacuum sensor is not accurate.

The electronic component transport device of the present invention, a transport unit that transports the electronic component between a container on which the electronic component is placed and an inspection unit that inspects the electrical characteristics of the electronic component,
A holding unit that is arranged in the transport unit and holds the electronic component;
A flow channel forming portion provided with a flow channel communicating with the holding portion,
A pump connected to the holding unit through the flow path, and configured to reduce the pressure in the flow path to atmospheric pressure;
A pressure detector for detecting the pressure in the flow path,
A gas inflow unit that connects to the holding unit moved by the transport unit, communicates with the flow path, and allows gas to flow into the flow path;
An abnormality detection unit that detects an abnormality in the flow path based on a pressure in the flow path in a state where the flow path and the gas inflow section are in communication with each other.

The electronic component inspection device of the present invention, an inspection unit that inspects the electrical characteristics of the electronic component,
A transport unit that transports the electronic component between a container on which the electronic component is mounted and the inspection unit,
A holding unit that is arranged in the transport unit and holds the electronic component;
A flow channel forming portion provided with a flow channel communicating with the holding portion,
A pump connected to the holding unit through the flow, and configured to reduce the pressure in the flow path to atmospheric pressure;
A pressure detector for detecting the pressure in the flow path,
A gas inflow unit that connects to the holding unit moved by the transport unit, communicates with the flow path, and allows gas to flow into the flow path;
An abnormality detection unit that detects an abnormality in the flow path based on a pressure in the flow path in a state where the flow path and the gas inflow section are in communication with each other.

FIG. 1 is a perspective view of a first embodiment of an electronic component inspection apparatus of the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operation state of the electronic component inspection device shown in FIG. FIG. 3 is a perspective view showing the device transport head. FIG. 4 is a cross-sectional view illustrating the abnormality inspection unit. FIG. 5 is a graph showing the relationship between the amount of gas flowing into the flow channel and the pressure in the flow. FIG. 6 is a graph showing the relationship between the amount of gas flowing into the flow channel and the pressure in the flow. FIG. 7 is a graph showing the relationship between the amount of gas flowing into the flow channel and the pressure in the flow. FIG. 8 is a flowchart illustrating a procedure for determining whether the flow path is normal or abnormal. FIG. 9 is a schematic plan view showing a modification of the electronic component inspection device. FIG. 10 is a plan view illustrating a first gas inflow portion included in an electronic component inspection device according to a second embodiment of the present invention. FIG. 11 is a plan view illustrating a second gas inflow portion included in a second embodiment of the electronic component inspection device of the present invention. FIG. 12 is a cross-sectional view illustrating a gas inflow portion included in a third embodiment of the electronic component inspection device of the present invention. FIG. 13 is a sectional view showing a modification of the gas inflow section shown in FIG.

  Hereinafter, an electronic component transport device and an electronic component inspection device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First embodiment>
Hereinafter, a first embodiment of an electronic component transport device and an electronic component inspection device of the present invention will be described with reference to FIGS. In the following, for convenience of description, as shown in FIG. 1, three axes orthogonal to each other are defined as an X axis, a Y axis, and a Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. The direction in which the arrow points in each direction is referred to as “positive”, and the opposite direction is referred to as “negative”. The term “horizontal” as used in the specification of the present application is not limited to perfect horizontal, but also includes a state in which the electronic component is slightly inclined, for example, less than 5 ° with respect to the horizontal as long as the conveyance of the electronic component is not hindered. The positive side in the Z direction may be referred to as “up” or “upper”, and the negative side in the Z direction may be referred to as “down” or “lower”.

  The electronic component inspection device 1 has the appearance shown in FIG. 1, and the outermost cover is covered with a cover. The electronic component inspection apparatus 1 includes an electronic component transport device 10 as a handler, transports an electronic component such as an IC device such as a BGA (Ball Grid Array) package, and inspects the electrical characteristics of the electronic component during the transport process. -The device to be tested. The “inspection / test” is simply referred to as “inspection” below.

  Hereinafter, for convenience of explanation, a case where an IC device is used as an electronic component will be described as a representative, and this will be referred to as “IC device 90”. The IC device 90 is not particularly limited, and may be, for example, an LSI (Large Scale Integration), a CMOS (Complementary MOS), a CCD (Charge Coupled Device), or a module IC in which a plurality of IC devices are packaged. Also, various sensor devices such as a crystal device, a pressure sensor, an acceleration sensor, an angular velocity sensor, and a fingerprint sensor can be used.

As shown in FIG. 2, the electronic component inspection apparatus 1 includes a tray supply area A1, a device supply area A2, an inspection area A3, a device collection area A4, and a tray removal area A5. These areas are partitioned by walls. IC device 90, from the tray supply area A1 to the tray removal area A5 via sequentially the respective regions in the arrow alpha ₉₀ direction, a check is made in the course of the inspection area A3.

  The electronic component inspection apparatus 1 includes a transport unit 25 that transports the IC device 90 so as to pass through each area, and an inspection unit 16 that performs an inspection in the inspection area A3. In addition, as shown in FIG. 1, the electronic component inspection apparatus 1 further includes a control unit 800 that controls each unit, a monitor 300, a signal lamp 400, and an operation panel 700. In the present embodiment, the electronic component transport device 10 is configured by a configuration excluding the inspection unit 16 from these configurations.

  Further, the electronic component inspection apparatus 1 is used by mounting in advance what is called a “change kit” which is exchanged for each type of the IC device 90. This change kit includes a mounting portion on which the IC device 90 is mounted. In the electronic component inspection device 1, the mounting portions are installed at a plurality of locations. The placement unit includes, for example, a temperature adjustment unit 12, a device supply unit 14, and a device collection unit 18, which will be described later. In addition, apart from the above-mentioned change kit, the mounting section includes a tray 200 prepared by a user, a collection tray 19, and an inspection section 16 in addition to the above.

  The tray supply area A1 is an area to which a tray 200 in which a plurality of untested IC devices 90 are arranged is supplied. A plurality of pockets are arranged in a matrix on each tray 200, and one IC device 90 can be stored and placed in each pocket.

The device supply area A2 is an area for transporting the IC device 90 on the tray 200 transported from the tray supply area A1 to the inspection area A3. Tray transport mechanisms 11A and 11B are provided so as to straddle the tray supply area A1 and the device supply area A2. The tray transport mechanism 11A is a part of the transport unit 25, and can move the tray 200 in the direction of the arrow _{α11A in} FIG. Thereby, the IC device 90 can be sent from the tray supply area A1 to the device supply area A2. The tray transport mechanism 11B is a moving unit that can move the tray 200 in the direction of the arrow _α11B in FIG. Thus, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

  In the device supply area A2, a temperature adjustment unit 12, a device transport head 13, and a tray transport mechanism 15 are provided. The device supply area A2 is also provided with a device supply unit 14 that moves across the device supply area A2 and the inspection area A3.

  The temperature adjustment section 12 is a mounting section on which the IC device 90 is mounted. The temperature adjustment unit 12 is called a “soak plate” that can heat or cool the mounted IC device 90. By the temperature adjustment unit 12, the IC device 90 before being inspected by the inspection unit 16 can be heated or cooled in advance and adjusted to a temperature suitable for a high-temperature inspection or a low-temperature inspection. In the configuration illustrated in FIG. 2, two temperature adjustment units 12 are arranged in the Y direction, and the IC device 90 on the tray 200 is transported to any one of the temperature adjustment units 12 by the device transport head 13.

The device transport head 13 holds the IC device 90 and can move in the X and Y directions within the device supply area A2, and can also move in the Z direction. The device transfer head 13 is also a part of the transfer unit 25, and transfers the IC device 90 between the tray 200 and the temperature adjustment unit 12, and transfers the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14. And transport. In FIG. 2, the movement of the device transport head 13 in the X direction is indicated by an arrow _α13X , and the movement of the device transport head 13 in the Y direction is indicated by an arrow _α13Y .

  The device supply unit 14 is a placement unit on which the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 is placed. The device supply unit 14 is also called a “supply shuttle plate” or simply “supply shuttle” that can transport the placed IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 can also be a part of the transport unit 25. The device supply unit 14 has a plurality of pockets in which the IC device 90 is stored and placed.

The device supply unit 14 is able to reciprocate along between the examination region A3 and the device supply region A2 in the arrow alpha ₁₄ direction. Thereby, the device supply unit 14 can transport the IC device 90 from the device supply area A2 to the vicinity of the inspection unit 16 in the inspection area A3, and removes the IC device 90 by the device transport head 17 in the inspection area A3. After that, it can return to the device supply area A2 again.

  In the configuration shown in FIG. 2, two device supply units 14 are arranged side by side in the Y direction. In the following, for convenience of description, the device supply unit 14 on the negative side in the Y direction may be referred to as “device supply unit 14A”, and the device supply unit 14 on the positive side in the Y direction may be referred to as “device supply unit 14B”. The IC device 90 on the temperature adjustment unit 12 is transported to the device supply unit 14A or 14B in the device supply area A2.

Tray transporting mechanism 15 is a mechanism for transporting the arrow alpha ₁₅ direction empty tray 200 in a state where all of the IC devices 90 is removed in the device supply region A2. After the transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

  The inspection area A3 is an area for inspecting the IC device 90. In the inspection area A3, an inspection section 16 for inspecting the IC device 90 and a device transport head 17 are provided.

The device transport head 17 can reciprocate in the Y direction and the Z direction within the inspection area A3. In FIG. 2, the movement of the device transport head 17 in the Y direction is indicated by an arrow _α17Y . In the configuration shown in FIG. 2, two device transport heads 17 are arranged side by side in the Y direction. In the following, for convenience of description, the device transport head 17 on the negative side in the Y direction may be referred to as “device transport head 17A”, and the device transport head 17 on the positive side in the Y direction may be referred to as “device transport head 17B”.

  The device transport head 17A transports the IC device 90 from the device supply unit 14A to the inspection unit 16 within the inspection area A3, and the device transport head 17B transmits the IC device from the device supply unit 14B to the inspection unit 16 within the inspection area A3. The device 90 is transported. The device transport head 17A transports the IC device 90 from the inspection unit 16 to the device collection unit 18A in the inspection area A3, and the device transport head 17B moves the IC device 90 from the inspection unit 16 to the device collection unit 18B in the inspection area A3. The IC device 90 is transported to

  The inspection unit 16 is a mounting unit that mounts the IC device 90 and inspects the electrical characteristics of the IC device 90. The inspection unit 16 has a pocket in which the IC device 90 is stored and placed, and a plurality of probe pins (not shown) are provided on the bottom surface of the pocket. When the IC device 90 is placed in the pocket, the terminals of the IC device 90 come into contact with the probe pins, so that the IC device 90 can be inspected. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16.

  The device collection area A4 is an area where the IC device 90 that has been inspected by the inspection unit 16 is collected. As shown in FIG. 2, in the device collection area A4, a collection tray 19, a device transport head 20, and a tray transport mechanism 21 are provided. The device collection area A4 is also provided with a device collection unit 18 that moves across the inspection area A3 and the device collection area A4. An empty tray 200 is also provided in the device collection area A4.

  The device collection unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed and that can transport the IC device 90 to the device collection area A4. The device collection unit 18 is also called a “collection shuttle plate” or simply “collection shuttle”. The device collection unit 18 can also be a part of the transport unit 25.

Device recovery unit 18 can be reciprocated along between the examination region A3 and the device collection area A4 in the arrow alpha ₁₈ direction. In the configuration illustrated in FIG. 2, two device collection units 18 are arranged in the Y direction similarly to the device supply unit 14. As described above, for convenience of description, the device collection unit 18 on the negative side in the Y direction is referred to as “device collection unit 18A”, and the device collection unit 18 on the positive side in the Y direction is referred to as “device collection unit 18B”. is there. Then, the IC device 90 on the inspection unit 16 is transported by the device transport head 17 to the device collection unit 18A or the device collection unit 18B, and is placed.

  The collection tray 19 is a mounting portion on which the IC device 90 inspected by the inspection unit 16 is mounted, and is fixed so as not to move in the device collection area A4. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

  Also, three empty trays 200 are arranged along the X direction. This empty tray 200 also serves as a mounting unit on which the IC device 90 inspected by the inspection unit 16 is mounted. The IC device 90 on the device collection unit 18 that has moved to the device collection area A4 is transported to and placed on one of the collection tray 19 and an empty tray 200. For example, by dividing the tray 200 to be placed for each test result of the IC device 90, the IC device 90 can be collected and classified into good / defective products for each test result.

The device transport head 20 is movably supported in the X direction and the Y direction in the device collection area A4, and has a portion that is also movable in the Z direction. The device transfer head 20 is a part of the transfer unit 25 and can transfer the IC device 90 from the device collection unit 18 to the collection tray 19 or an empty tray 200. In FIG. 2, the movement of the device transfer head 20 in the X direction is indicated by an arrow α _20X , and the movement of the device transfer head 20 in the Y direction is indicated by an arrow α _20Y .

Tray transporting mechanism 21 is conveyed in the arrow alpha ₂₁ direction empty tray 200 is conveyed from the tray removal area A5 in the device collection region within A4. After the transfer, the empty tray 200 is to be disposed at a position where the IC device 90 is collected, that is, it can be any one of the three empty trays 200.

  The tray removal area A5 is a removal section where the tray 200 on which the plurality of IC devices 90 in the inspected state are collected and removed. In the tray removal area A5, many trays 200 can be stacked.

Further, a tray transport mechanism 22A and a tray transport mechanism 22B that transport the trays 200 one by one in the Y direction across the device collection area A4 and the tray removal area A5 are provided. The tray transport mechanism 22A is a part of the transport unit 25, and is a moving unit that can reciprocate the tray 200 in the direction of the arrow _α22A . Thereby, the inspected IC device 90 can be transported from the device collection area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 in the direction of the arrow _α22B . Thus, the empty tray 200 can be moved from the tray removal area A5 to the device collection area A4.

  The control unit 800 includes, for example, a tray transport mechanism 11A, a tray transport mechanism 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, a device transport The operations of the head 17, the device collection unit 18, the device transport head 20, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B can be controlled.

  The operator can set and confirm operating conditions and the like of the electronic component inspection device 1 via the monitor 300. The monitor 300 has a display screen 301 made up of, for example, a liquid crystal screen, and is arranged on the upper front side of the electronic component inspection apparatus 1. As shown in FIG. 1, a mouse stand 600 for mounting a mouse is provided on the right side of the tray removal area A5 in the drawing. This mouse is used when operating the screen displayed on the monitor 300.

  An operation panel 700 is arranged near the monitor 300. The operation panel 700 is for instructing the electronic component inspection apparatus 1 to perform a desired operation separately from the monitor 300. In addition, the signal lamp 400 can notify the operating state and the like of the electronic component inspection device 1 by a combination of colors of light emission. The signal lamp 400 is disposed above the electronic component inspection device 1. Further, the electronic component inspection device 1 has a built-in speaker 500, and the speaker 500 can also notify the operating state of the electronic component inspection device 1 and the like.

  The overall configuration of the electronic component inspection device 1 has been briefly described above. In the electronic component inspection apparatus 1 as described above, the IC devices 90 are transported to the respective units by the device transport heads 13, 17, and 20, as described above. The device transport heads 13, 17, and 20 hold the IC device 90 by suction, but the suction force fluctuates from an appropriate value due to various causes including an example described later, and suctions the IC device 90 with a suitable suction force. May not be able to do so. If the attraction force of the IC device 90 is higher than the appropriate value, excessive stress is applied to the IC device 90, which may cause damage to the IC device 90. If the attraction force of the IC device 90 is lower than the appropriate value, the IC The device 90 may not be able to be sucked, or may be unintentionally released during the transportation, and the stable transportation of the IC device 90 may be hindered. Therefore, the electronic component inspection apparatus 1 includes an attraction force inspection unit 900 that inspects whether the attraction force of the device transport heads 13, 17, and 20 is normal or abnormal.

  Since the device transport heads 13, 17, and 20 have the same configuration as each other, the device transport head 13 will be representatively described below for convenience of description, and the device transport heads 17, 20 will be referred to as the respective devices. Description is omitted. The device transport heads 13, 17, and 20 may have different configurations, and at least one of them may have the configuration described below.

  As illustrated in FIG. 3, the device transport head 13 includes a holding unit 131 that holds the IC device 90 by suction, a flow path forming unit 130 in which a flow path 132 that communicates with the holding unit 131 is provided, and an inside of the flow path 132. A vacuum pump 133 as a pump for adsorbing the IC device 90 to the holding unit 131 by reducing the pressure, a valve 134 provided in the middle of the flow path 132, and a pressure as a pressure detection unit for detecting the pressure in the flow path 132 And a sensor 135.

  The holding portion 131 has a cylindrical shape, and has a tapered shape whose outer diameter gradually decreases downward. In addition, the lower end surface of the holding portion 131 serves as a suction surface 131a for sucking the IC device 90. The flow path forming section 130 has a tubular member, and has a flow path 132 formed therein. The flow path 132 is partially provided to extend into the holding portion 131, one end 132 a is open to the suction surface 131 a, and the other end 132 b is connected to the vacuum pump 133. . The valve 134 disposed in the middle of the flow path 132 closes the vacuum pump 133 of the flow path 132 and opens the holding portion 131 of the flow path 132 in a closed state. It can be switched to an open state in which a connection is made between the power supply and the holding unit 131 side. As such a valve 134, for example, an electromagnetic valve can be used.

  The pressure sensor 135 is built in the valve 134, and detects the pressure in a portion of the flow path 132 closer to the holding portion 131 than the valve 134, that is, in a region between the end 132a and the valve 134. By incorporating the pressure sensor 135 in the valve 134 in this way, the pressure sensor 135 and the valve 134 are integrated, so that the size of the device transport head 13 can be reduced. However, the arrangement of the pressure sensor 135 is not particularly limited. For example, the pressure sensor 135 may be arranged at a location different from the valve 134. In this case, the pressure sensor 135 may be located closer to the holding unit 131 than the valve 134 or may be located closer to the vacuum pump 133.

  In the device transport head 13 having such a configuration, for example, by operating the valve 134 while the operation of the vacuum pump 133 is continued, the IC device 90 can be sucked and released (released). For example, by closing the valve 134, pressing the suction surface 131a against the upper surface of the IC device 90, closing the opening on the end 132a side of the flow path 132 with the IC device 90, and opening the valve 134 in this state, the vacuum pump 133 As a result, the pressure in the flow path 132 is reduced with respect to the atmospheric pressure, and the IC device 90 is adsorbed on the adsorption surface 131a. Conversely, if the valve 134 is opened while the IC device 90 is being sucked on the suction surface 131a, the decompression state in the flow path 132 is released, and the IC device 90 is released from the suction surface 131a. Note that the method of adsorbing and releasing the IC device 90 on the adsorption surface 131a is not limited to the method described above.

  Here, the electronic component inspection apparatus 1 includes a suction detection unit 950 that determines that the IC device 90 is properly suctioned on the suction surface 131a based on the pressure in the flow path 132 detected by the pressure sensor 135. Have. If the IC device 90 is properly held on the suction surface 131a, the opening of the flow path 132 is closed by the IC device 90, and the inflow of gas from the outside to the flow path 132 is reduced. If the IC device 90 is not held properly, a gap is formed between the opening of the flow channel 132 and the IC device 90, and the flow of gas from the outside into the flow channel 132 increases. Therefore, in the state where the IC device 90 is not properly held on the suction surface 131a, the pressure in the flow path 132 is higher than in the state where the IC device 90 is properly held on the suction surface 131a.

  The suction detection unit 950 is lower than the pressure in the flow path 132 in a state where the IC device 90 is not properly held on the suction surface 131a, and is in a state where the IC device 90 is properly held on the suction surface 131a. A threshold value P0 higher than the pressure in the flow path 132 is stored. Then, if the pressure in the flow path 132 is lower than the threshold value P0, the suction detection unit 950 outputs an on signal indicating that the IC device 90 is properly held on the suction surface 131a, and the pressure in the flow path 132 becomes lower. If it is higher than the threshold value P0, it is determined that the IC device 90 is not properly held on the suction surface 131a, and an off signal is output. The control unit 800 starts transporting the IC device 90 by the device transport head 13 when the on signal is output from the suction detection unit 950, and starts the transport by the device transport head 13 when the off signal is output from the suction detection unit 950. The operator is notified by the monitor 300, the signal lamp 400, the speaker 500, etc., without starting the transport of the IC device 90.

  Here, for example, when foreign matter is sucked into the flow path 132 when the IC device 90 is attracted and the flow path 132 is clogged by the foreign matter, even if the vacuum pump 133 is operated with the same power, the flow path in the flow path 132 The pressure may fluctuate from a normal state without clogging. Further, for example, even if a crack is formed in any part of the flow path forming unit 130, similarly, the pressure in the flow path 132 may fluctuate from a normal state where there is no crack. As described above, if the pressure in the flow path 132 fluctuates from the normal state, the IC device 90 cannot be properly sucked, and the IC device 90 may be damaged, or the IC device 90 may be damaged by the device transport head 13. There is a possibility that stable conveyance of the 90 may become difficult. Therefore, as described above, the electronic component inspection apparatus 1 includes the suction force inspection unit 900 that checks whether the suction force of the device transport head 13 is normal or abnormal.

  As shown in FIG. 4, the suction force inspection unit 900 includes a gas inflow portion 910 that can communicate with the channel 132, and a gas inflow portion 910 in a state where the channel 132 and the gas inflow portion 910 communicate with each other. And an abnormality detector 990 for detecting an abnormality of the flow path 132 based on the pressure of the flow path 132.

  Further, the gas inflow portion 910 has a first gas inflow portion 920 and a second gas inflow portion 930 formed in the base 980. The first gas inflow portion 920 is formed of a through hole vertically penetrating the base 980, and an opening at an upper end side is a first connection port 921 connected to the flow path 132, and an opening at a lower end side is a flow path 132 The first inflow port 922 through which the gas flows into the air. Similarly, the second gas inflow portion 930 is formed of a through hole, and an opening on the upper end side serves as a second connection port 931 connected to the flow path 132, and an opening on the lower end side flows gas into the flow path 132. A second inflow port 932 is formed.

  The holding section 131 can be selectively connected to the first connection port 921 of the first gas inflow section 920 and the second connection port 931 of the second gas inflow section 930.

  The diameter W2 of the second gas inflow section 930 is larger than the diameter W1 of the first gas inflow section 920, that is, the cross-sectional area of the second gas inflow section 930 cut in the xy direction is the first gas inflow section. It is larger than the cross-sectional area of a cross section obtained by cutting the portion 920 in the xy directions. Therefore, the second gas inflow portion 930 has a larger gas inflow amount (suction amount) per unit time than the first gas inflow portion 920. Specifically, when connected to the flow channel 132 and the vacuum pump 133 sucks the inside of the flow channel 132 with the same suction force, the gas flowing into the flow channel 132 via the first gas inflow portion 920 per unit time The amount of gas flowing into the flow path 132 via the second gas inflow portion 930 per unit time is larger than the amount of gas. Each of the diameters W1 and W2 is smaller than the opening diameter of the flow path 132.

  As shown in FIG. 5, the larger the gas inflow per unit time, the higher the pressure in the flow path 132 when the vacuum pump 133 is operated and the valve 134 is opened. That is, the degree of vacuum in the flow path 132 decreases. Therefore, the pressure P1 in the flow path 132 detected by the pressure sensor 135 when the flow path 132 is connected to the first gas inflow portion 920, the vacuum pump 133 is operated, and the valve 134 is opened, The pressure is lower than the pressure P2 in the flow path 132 detected by the pressure sensor 135 when the vacuum pump 133 is operated and the valve 134 is opened by connecting to the second gas inflow portion 930. That is, the relationship of P1 <P2 is satisfied.

  In the present embodiment, the diameters W1 and W2 are made different from each other to give a difference to the above-described gas inflow amount, but the present invention is not limited to this. As another method, for example, by making the opening area of the second inlet 932 larger than the opening area of the first inlet 922, a difference may be given between the two gas inflow amounts, or the first gas inflow portion may be provided. The through holes 920 and the second gas inflow portion 930 may have the same width, and a narrow portion such as a constriction or an orifice may be provided inside the first gas inflow portion to provide a difference between the two gas inflow amounts. .

  Here, when the flow path 132 is normal, as shown in FIG. 5, the pressure P1 is set lower than the threshold value P0, and the pressure P2 is set higher than the threshold value P0. That is, the pressures P1 and P2 are set so as to satisfy the relationship of P1 <P0 <P2. On the other hand, when an abnormality occurs in the flow path 132, the pressures P1 and P2 fluctuate from the normal values, and depending on the manner in which the abnormality occurs, as shown in FIG. On the contrary, as shown in FIG. 7, both the pressures P1 and P2 become lower than the threshold value P0. That is, when an abnormality occurs in the flow path 132, P0 <P1 <P2 or P1 <P2 <P0.

  Therefore, the abnormality detecting unit 990 compares the pressures P1 and P2 with the threshold value P0, and if P1 <P0 <P2, the flow path 132 is normal, and the holding unit 131 has the IC device with normal suction force. 90 is adsorbed, and if the relationship of P0 <P1 <P2 or P1 <P2 <P0 is satisfied, an abnormality has occurred in the flow path 132, and the holding unit 131 has an IC with a normal adsorption force. It is determined that the device 90 cannot be sucked.

  In the present embodiment, the abnormality detection unit 990 outputs an on signal from the suction detection unit 950 when the first gas inflow unit 920 is sucked, and turns off the suction detection unit 950 when the second gas inflow unit 930 is sucked. When a signal is output, when it is determined that the flow path 132 is normal and the holding unit 131 can suck the IC device 90 with a normal suction force, and the first gas inflow unit 920 is sucked, When the on signal is output from the adsorption detection unit 950 or the off signal is output together when the second gas inflow unit 930 is sucked, an abnormality has occurred in the flow path 132 and the holding unit 131 is normal. It is determined that the IC device 90 cannot be suctioned with a suitable suction force.

  When the abnormality detecting unit 990 determines that “the flow path 132 is normal”, the transport of the IC device 90 by the device transport head 13 is continued, and it is determined that “the flow path 132 is abnormal”. In this case, the operator is notified by the monitor 300, the signal lamp 400, the speaker 500, and the like, and the subsequent transport of the IC device 90 by the device transport head 13 is stopped. This prevents the IC device 90 from being transported in a state where there is an abnormality in the flow path 132, and prevents the holding unit 131 from holding the IC device 90 or causing unintended detachment of the IC device 90. Generation can be effectively suppressed.

  Next, a procedure for determining whether the flow path 132 is normal or abnormal based on the flowchart shown in FIG. 8 will be described. It is assumed that the vacuum pump 133 continues to operate during the following procedure. First, as step S1, the holding unit 131 is connected to the first gas inflow unit 920. Next, as step S2, the valve 134 is opened, and the pressure P1 in the flow path 132 is detected by the pressure sensor 135. Next, as step S3, the pressure P1 is compared with the threshold value P0. If P1 ≧ P0, it is determined in step S4 that the flow path 132 is abnormal, and if P1 <P0, the valve 134 is closed and the holding unit 131 is moved into the second gas inflow in step S5. Unit 930. Next, as step S6, the valve 134 is opened, and the pressure P2 in the flow path 132 is detected by the pressure sensor 135. Next, as step S7, the pressure P2 is compared with the threshold value P0. If P2 ≦ P0, the flow path 132 is determined to be abnormal at step S8, and if P2> P0, the flow path 132 is determined to be normal at step S9.

  In FIG. 8, the comparison between the pressure P1 and the threshold value P0 is performed before the comparison between the pressure P2 and the threshold value P0. However, the present invention is not limited to this. It may be performed after the comparison with the threshold value P0. The timing at which the pressures P1 and P2 are detected, that is, the timing at which the determination procedure shown in FIG. 8 is executed is not particularly limited. For example, the timing may be when the power of the electronic component inspection apparatus 1 is turned on, or may be a predetermined number. May be completed every time the transfer of the IC device 90 is completed, or may be performed every predetermined driving time. Further, it is preferable that the detection of the pressures P1 and P2 is performed continuously. That is, it is preferable to detect the pressures P1 and P2 without interposing the transfer of the IC device 90 therebetween. Thereby, the state in the flow path 132 becomes substantially the same, and the above-described determination can be performed with higher accuracy.

  By judging whether the flow path 132 is normal or abnormal by such a method, it is possible to effectively suppress the operator from changing the threshold value P0 and forgetting to return the changed threshold value P0 as in the related art. Therefore, the determination of the normal / abnormal of the flow path 132 based on the detection result of the pressure sensor 135, that is, the on signal / off signal becomes more accurate and reliable. More specifically, in the present embodiment, the sizes of the first and second gas inflow portions 920 and 930 are determined based on a preset threshold value P0 such that P1 <P0 <P2 in a normal state. I have. Therefore, for example, if the operator changes the threshold value P0, the relationship of P1 <P0 <P2 is broken and P1 <P2 <P0 or P0 <P1 <P2. That is, although the flow path 132 is normal, the abnormality detection unit 990 determines that “the flow path 132 is abnormal”, so that the IC device 90 cannot be transported thereafter. As described above, if the operator changes the threshold value P0 without permission, the IC device 90 cannot be transported thereafter. Therefore, the operator cannot change the threshold value P0 without permission, and as a result, it is possible to effectively suppress the operator from changing the threshold value P0 and forgetting to return the changed threshold value P0.

  In the above description, the abnormality detection unit 990 determines whether the flow path 132 is normal or more. However, for example, the abnormality detection unit 990 can also detect, for example, deterioration of the vacuum pump 133. For example, if the vacuum pump 133 deteriorates over time, its suction force is reduced, so that the relationship of P1 <P2 <P0 may be satisfied. Therefore, when the relationship of P1 <P2 <P0 is established, it may be determined that the vacuum pump 133 has deteriorated. In this case, the abnormality detection unit 990 may have a function of further determining whether the vacuum pump 133 is deteriorated or the flow path 132 is abnormal, for example.

  As described above, the suction force inspection unit 900 has been described. In the present embodiment, as shown in FIG. 4, the gas inflow unit 910 is formed on the tray 200 which is a container. That is, the tray 200 constitutes the base 980. By forming the gas inflow section 910 in the tray 200 in this way, the tray 200 can be easily exchanged for a gas inflow section 910 suitable for various IC devices 90 by exchanging the tray 200.

  However, the present invention is not limited to this, and the gas inflow section 910 may be formed in the temperature adjustment section 12, the device supply section 14, or the like, or may be formed in another area of the device supply area A2. In the latter case, for example, as shown in FIG. 9, a first dummy device DD1 having a first gas inflow portion 920 formed at a position not overlapping with each portion arranged in the device supply region A2, and a second gas The second dummy device DD2 on which the inflow portion 930 is formed can be fixedly arranged. Further, for example, instead of fixing the first and second dummy devices DD1 and DD2, the first and second dummy devices DD1 and DD2 are placed on the tray 200 in the same manner as the IC device 90, and are transported by the device transport heads 13, 17, and 20. May be collected.

  Further, in the present embodiment, the gas inflow section 910 has the first gas inflow section 920 and the second gas inflow section 930, but the present invention is not limited to this, and one of them may be omitted, A third or fourth gas inflow portion having a different gas inflow amount per unit time or more gas inflow portions may be provided. Here, for example, when the gas inflow section 910 has only the first gas inflow section 920, the abnormality detection section 990 determines that the flow path 132 is normal if P1 <P0, and if P1 ≧ P0. What is necessary is just to determine that the flow path 132 is abnormal. Further, for example, when the gas inflow section 910 has only the second gas inflow section 930, the abnormality detection section 990 determines that the flow path 132 is normal if P2> P0, and if P2 ≦ P0, the abnormality detection section 990 determines that the flow path 132 is normal. It may be determined that the road 132 is abnormal.

  The electronic component transport device 10 and the electronic component inspection device 1 have been described above. As described above, the electronic component transport device 10 is provided between the tray 200 as a container on which the IC device 90 as an electronic component is placed and the inspection unit 16 for inspecting the electrical characteristics of the IC device 90. A transport unit 25 for transporting the IC device 90, a holding unit 131 for holding the IC device 90, a flow path forming unit 130 provided with a flow path 132 communicating with the holding unit 131, A vacuum pump 133 as a pump connected to the holding unit 131 via the 132 to reduce the pressure in the flow path 132 with respect to the atmospheric pressure; a pressure sensor 135 as a pressure detection unit for detecting the pressure in the flow path 132; A gas inflow section 910 that connects to the holding section 131 moved by the transport section 25 and communicates with the flow path 132 to flow gas into the flow path 132, and a flow path 132 and a gas inflow section 91. Bets are provided based on the pressure in the flow path 132 in a state in communication, and the abnormality detecting unit 990 for detecting an abnormality of the flow channel 132, a. With such a configuration, it is possible to effectively suppress the operator from changing the threshold value P0 or forget to return the changed threshold value P0, and it is possible to accurately determine whether the flow path 132 is normal or abnormal. As a result, the IC device 90 can be transported with an appropriate suction force.

  Further, as described above, the electronic component inspection apparatus 1 includes an inspection unit 16 for inspecting the electrical characteristics of the IC device 90 and an IC device between the inspection unit 16 and the tray 200 on which the IC device 90 is placed. 90, a holding unit 131 disposed in the transfer unit 25 and holding the IC device 90, a flow passage forming unit 130 provided with a flow passage 132 communicating with the holding unit 131, and a flow passage 132. A vacuum pump 133 as a pump for reducing the pressure in the flow path 132 with respect to the atmospheric pressure, a pressure sensor 135 as a pressure detection section for detecting the pressure in the flow path 132, The gas inflow section 910 that connects to the holding section 131 moved by the section 25 and communicates with the flow path 132 to flow gas into the flow path, and the flow path 132 and the gas inflow section 910 communicate with each other. Based on the pressure in the flow path 132 in the state, and a fault detecting unit 990 for detecting an abnormality of the flow channel 132, a. With such a configuration, it is possible to effectively suppress the operator from changing the threshold value P0 or forget to return the changed threshold value P0, and it is possible to accurately determine whether the flow path 132 is normal or abnormal. As a result, the IC device 90 can be transported with an appropriate suction force.

  In addition, as described above, the gas inflow section 910 allows the gas to flow into the flow path 132 and the gas inflow into the flow path 132, and the gas flow rate per unit time is greater than that of the first gas inflow section 920. A second gas inflow portion 930 having a large gas inflow amount. Accordingly, the pressure P1 in the flow path 132 when the holding unit 131 adsorbs the first gas inflow unit 920 and the pressure P2 in the flow passage 132 when the holding unit 131 adsorbs the second gas inflow unit 930 are determined. Since the normality / abnormality of the flow path 132 can be determined based on the two factors, the determination becomes more accurate.

  Further, as described above, each of the first gas inflow section 920 and the second gas inflow section 930 is configured by a through hole. The diameter W2 of the second gas inflow portion 930 is larger than the diameter W1 of the first gas inflow portion 920. Thereby, the second gas inflow section 930 having a larger gas inflow rate per unit time than the first gas inflow section 920 can be obtained with a simple configuration.

  Further, as described above, the gas inflow section 910 is provided on the tray 200. Thus, by replacing the tray 200, it is possible to easily replace the tray 200 with a gas inflow portion 910 having a size suitable for various IC devices 90.

<Second embodiment>
Hereinafter, a second embodiment of an electronic component transport device and an electronic component inspection device according to the present invention will be described with reference to FIGS. 10 and 11, but different points from the above-described embodiment will be mainly described, and similar items will be described. Will not be described. This embodiment is the same as the first embodiment except that the configuration of the gas inflow section 910 is different.

  As shown in FIGS. 10 and 11, the first gas inflow portion 920 and the second gas inflow portion 930 are each formed by a groove with a bottom that opens on the upper surface of the base 980. The first gas inflow portion 920 and the second gas inflow portion 930 each extend longer than the width of the adsorption surface 131a of the holding portion 131. In the first gas inflow portion 920 having such a configuration, when adsorbing by the holding portion 131, a portion of the opening overlapping the flow path 132 becomes the first connection port 921, and a portion exposed from the adsorption surface 131a becomes the first connection port 921. It becomes the inflow port 922. Similarly, in the second gas inflow portion 930, when the holding portion 131 sucks, the portion of the opening overlapping the flow path 132 becomes the second connection port 931, and the portion exposed from the suction surface 131 a is the second inlet port. 932. With such a configuration, the same effect as in the first embodiment can be exerted.

<Third embodiment>
Hereinafter, a third embodiment of an electronic component transport device and an electronic component inspection device according to the present invention will be described with reference to FIGS. 12 and 13, but different points from the above-described embodiment will be mainly described, and similar items will be described. Will not be described. This embodiment is the same as the first embodiment except that the configuration of the gas inflow section 910 is different.

  As shown in FIG. 12, the first gas inflow section 920 and the second gas inflow section 930 are provided in the flow path forming section 130, respectively. Specifically, each of the first gas inflow section 920 and the second gas inflow section 930 is configured by a flow path that branches off in the middle of the flow path 132. The first gas inflow section 920 has one end connected to the flow path 132 and the other end open. Further, a valve 923 is provided in the middle of the first gas inflow section 920, and the first gas inflow section 920 can be opened and closed by the valve 923. Similarly, the second gas inflow portion 930 has one end connected to the flow path 132 and the other end open. Further, a valve 933 is provided in the middle of the second gas inflow portion 930, and the valve 933 can open and close the second gas inflow portion 930.

  In such a configuration, when transporting the IC device 90, both the valves 923 and 933 are closed, and when detecting the pressure P1, the valve 923 is opened with the valve 933 closed and the pressure P2 is detected. In this case, the valve 933 may be opened while the valve 923 is closed. By providing the first gas inflow section 920 and the second gas inflow section 930 in the flow path 132 in this way, these configurations can be simplified.

  Note that, in the present embodiment, by making the diameter W2 of the second gas inflow section 930 larger than the diameter W1 of the first gas inflow section 920, the first gas inflow section 920 is more likely to have a larger gas inflow rate per unit time. Although the gas inflow amount per unit time of the second gas inflow section 930 is increased, the present invention is not limited to this. For example, the diameters W1 and W2 may be the same, and the opening area of the valve 933 may be larger than that of the valve 923.

  As described above, the gas inflow section 910 is provided in the flow path forming section 130. Thereby, the configuration of the gas inflow section 910 is simplified.

  As a modified example of the present embodiment, for example, as shown in FIG. 13, a configuration is provided in which one gas inflow portion 910 branched from the flow path 132 and a valve 911 provided in the middle thereof. You may. In this case, the configuration is such that the valve 911 can be opened at least in two stages having different opening degrees. One of the two stages of opening is an opening area corresponding to the first gas inflow section 920 described above, and the other is an opening area corresponding to the second gas inflow section 930 described above. In such a configuration, the pressure P1 can be detected by opening the valve 911 at the one opening, and the pressure P2 can be detected by opening the valve 911 at the other opening.

  As described above, the electronic component transport device and the electronic component inspection device of the present invention have been described with respect to the illustrated embodiment. However, the present invention is not limited to this, and each component configuring the electronic component transport device and the electronic component inspection device is described. Can be replaced with any of those having the same function. Further, an arbitrary component may be added.

  Further, the electronic component transport device and the electronic component inspection device of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

DESCRIPTION OF SYMBOLS 1 ... Electronic component inspection apparatus, 10 ... Electronic component conveyance apparatus, 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 13 ... Device conveyance head, 14, 14A, 14B ... Device supply part, 15 ... Tray transport mechanism, 16: inspection unit, 17, 17A, 17B: device transport head, 18, 18A, 18B: device collection unit, 19: collection tray, 20: device transport head, 21, 22A, 22B: tray transport mechanism , 25 ... conveying unit, 90 ... IC device, 130 ... channel forming unit, 131 ... holding unit, 131a ... suction surface, 132 ... channel, 132a ... end, 132b ... end, 133 ... vacuum pump, 134 ... Valve: 135: pressure sensor, 200: tray, 300: monitor, 301: display screen, 400: signal lamp, 500: speaker, 6 0 ... Mouse stand, 700 ... Operation panel, 800 ... Control unit, 900 ... Adsorption force inspection unit, 910 ... Gas inflow unit, 911 ... Valve, 920 ... First gas inflow unit, 921 ... First connection port, 922 ... No. 1 inlet, 923 ... valve, 930 ... second gas inflow section, 931 ... second connection port, 932 ... second inlet, 933 ... valve, 950 ... adsorption detection section, 980 ... base, 990 ... abnormality detection section, A1: tray supply area, A2: device supply area, A3: inspection area, A4: device collection area, A5: tray removal area, DD1: first dummy device, DD2: second dummy device, P0: threshold value, P1, P2 ... pressure, S1-S9 ... _{step, α 11A, α 11B, α} 13X, α 13Y, α 14, α 15, α 17Y, α 18, α 20X, α 20Y, α 21, α 22A, α 2 _{B, α 90 ...} arrow

Claims (8)

A transport unit that transports the electronic component between a container on which the electronic component is mounted and an inspection unit that inspects electrical characteristics of the electronic component,
A holding unit that is arranged in the transport unit and holds the electronic component;
A flow channel forming portion provided with a flow channel communicating with the holding portion,
A pump connected to the holding unit through the flow path, and configured to reduce the pressure in the flow path to atmospheric pressure;
A pressure detector for detecting the pressure in the flow path,
A gas inflow unit that connects to the holding unit moved by the transport unit, communicates with the flow path, and allows gas to flow into the flow path;
An electronic component carrier, comprising: an abnormality detection unit that detects an abnormality in the flow path based on a pressure in the flow path in a state where the flow path and the gas inflow unit are in communication with each other. apparatus.   The gas inflow section includes a first gas inflow section that allows gas to flow into the flow path, and a second gas that allows gas to flow into the flow path and has a larger gas inflow amount per unit time than the first gas inflow section. The electronic component conveying device according to claim 1, further comprising an inflow portion. The first gas inflow portion and the second gas inflow portion are each configured with a through hole,
The electronic component conveying device according to claim 2, wherein a diameter of the second gas inflow portion is larger than a diameter of the first gas inflow portion.   The electronic component carrier according to claim 1, wherein the gas inlet is provided in the container. An inspection unit for inspecting electrical characteristics of the electronic component,
A transport unit that transports the electronic component between a container on which the electronic component is mounted and the inspection unit,
A holding unit that is arranged in the transport unit and holds the electronic component;
A flow channel forming portion provided with a flow channel communicating with the holding portion,
A pump connected to the holding unit through the flow, and configured to reduce the pressure in the flow path to atmospheric pressure;
A pressure detector for detecting the pressure in the flow path,
A gas inflow section connected to the holding section moved by the transport section, communicates with the flow path, and allows gas to flow into the flow path;
An electronic component inspection, comprising: an abnormality detection unit that detects an abnormality in the flow path based on a pressure in the flow path in a state where the flow path and the gas inflow unit communicate with each other. apparatus.   The gas inflow section includes a first gas inflow section that allows gas to flow into the flow path, and a second gas that allows gas to flow into the flow path and has a larger gas inflow amount per unit time than the first gas inflow section. The electronic component inspection device according to claim 5, further comprising an inflow portion. The first gas inflow portion and the second gas inflow portion are each configured with a through hole,
The electronic component conveying device according to claim 6, wherein a diameter of the second gas inflow portion is larger than a diameter of the first gas inflow portion.   The electronic component carrier according to claim 5, wherein the gas inflow portion is provided in the container.

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