JP2018054465A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device with which it is possible to bring each terminal of an electronic component evenly into contact with each terminal of an inspection unit when, for example, electrical inspection on an electronic component is performed by the inspection unit.SOLUTION: The electronic component conveyance device comprises: a suction unit capable of holding an electronic component by suction and moving the electronic component in a direction of suction in which it is drawn in; and an urging unit capable of urging the suction unit in a direction opposite the direction of suction and shrinkable in the direction of suction while keeping the electronic component drawn in.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, a test apparatus that tests an electronic component such as an IC package is known (see, for example, Patent Document 1). The test apparatus described in Patent Document 1 is a pusher that presses an electronic component against a test socket while holding the electronic component, and a pressure (when the pusher presses the electronic component against the socket). And a pressure detection unit for detecting a pressing force). Then, in the test apparatus described in Patent Document 1, it is detected based on the detection result of the pressure detection unit whether or not the pusher has pressed the electronic component against the socket with a predetermined pressure when testing the electronic component. can do.

JP 2003-161758 A

  However, in the test apparatus described in Patent Document 1, even if the pusher presses the electronic component against the socket with a predetermined pressure, for example, depending on the size (thickness) or shape (warp) of the electronic component, The terminals of each solder ball and the contact pins of the socket do not always come into uniform contact. If the terminals of the solder balls and the contact pins are not in uniform contact with each other, there is a problem that the test for the electronic component cannot be performed accurately.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

The electronic component transport device of the present invention is capable of gripping an electronic component by suction, and a suction unit that is movable in a suction direction for sucking the electronic component;
An urging portion that can urge the suction portion in a direction opposite to the suction direction and can contract in the suction direction in a state where the electronic component is sucked.

  Thereby, even if there is an individual difference in the electronic component, the difference can be offset by the urging portion that can contract while the electronic component is sucked. For example, when performing an electrical inspection on an electronic component in the inspection unit, it is possible to make each terminal of the electronic component uniformly contact each terminal of the inspection unit regardless of individual differences of the electronic component. Inspection can be performed accurately.

In the electronic component transport device of the present invention, the electronic component transport device has a contact portion that contacts the suction portion, and a placement portion on which the electronic component is placed can be disposed.
It is preferable to have a posture adjusting unit capable of adjusting the posture of the suction part in a state where the suction part and the contact part are in contact with each other.

  Thereby, for example, when the mounting portion performs an electrical inspection on the electronic component, it is possible to contribute to sufficient contact between each terminal of the electronic component and each terminal of the mounting portion.

  In the electronic component transport device of the present invention, it is preferable that the contact portion is formed of a plate-like member whose thickness can be changed.

  Thereby, for example, when the placement unit performs an electrical inspection on the electronic component, the placement unit can be made suitable for the inspection of the electronic component according to the thickness of the electronic component.

In the electronic component transport device of the present invention, it is preferable that the contact portion has a piezo element.
Thereby, the thickness of the contact portion can be easily and quickly changed according to the magnitude of the voltage applied to the piezo element.

  In the electronic component transport device according to the present invention, it is preferable that the placement unit includes an electronic component urging unit that urges the electronic component placed on the placement unit in the suction direction.

  As a result, for example, when the mounting portion is to perform an electrical inspection on the electronic component, each terminal of the electronic component and each terminal of the mounting portion can be sufficiently brought into contact with each other. Can be performed accurately.

  In the electronic component transport device of the present invention, it is preferable that the urging portion is configured by a coil spring.

  Thereby, while being able to simplify the structure of an urging | biasing part, weight reduction of an urging | biasing part can be achieved.

  In the electronic component conveying apparatus of the present invention, it is preferable that a spring constant of the coil spring is 1 N / mm or more and 90 N / mm or less.

  Thereby, when performing the electrical test | inspection with respect to an electronic component, the biasing force suitable for a test | inspection can be provided with respect to this electronic component. Further, the coil spring can maintain a state in which it can contract in the suction direction in a state where the suction part sucks the electronic component.

In the electronic component conveying apparatus of the present invention, it is preferable that the outer diameter of the coil spring is 7 mm or more and 20 mm or less.
Thereby, the coil spring can be of a size that can be built in a predetermined part.

In the electronic component conveying apparatus of the present invention, it is preferable that the inner diameter of the coil spring is 5 mm or more and 10 mm or less.
Thereby, the coil spring can be of a size that can be built in a predetermined part.

In the electronic component conveying apparatus of the present invention, it is preferable that the coil spring has a wire diameter of 0.3 mm or more and 2 mm or less.
Thereby, the coil spring can be of a size that can be built in a predetermined part.

  In the electronic component transport device of the present invention, it is preferable that the maximum suction force of the suction portion is −95 kPa or more and −30 kPa or less.

  Thereby, electronic parts of various sizes (weights) can be stably sucked and gripped. And an electronic component can be conveyed, with the holding state maintained. Thereby, it can prevent that an electronic component falls during conveyance.

  In the electronic component transport device of the present invention, it is preferable that the suction force of the suction portion can be changed.

  Thereby, electronic parts of various sizes (weights) can be stably sucked and gripped. And an electronic component can be conveyed, with the holding state maintained. Thereby, it can prevent that an electronic component falls during conveyance.

In the electronic component transport device of the present invention, a suction nozzle that contacts the electronic component and sucks the electronic component;
A pressure adjusting mechanism capable of changing a suction force for sucking the electronic component, and
It is preferable that the pressing force with which the suction nozzle presses the electronic component can be changed by changing the suction force.

  Thereby, electronic parts of various sizes (weights) can be stably sucked and gripped. And an electronic component can be conveyed, with the holding state maintained. Thereby, it can prevent that an electronic component falls during conveyance.

The electronic component inspection apparatus of the present invention is capable of gripping an electronic component by suction, and a suction part movable in a suction direction for sucking the electronic component;
An urging portion capable of urging the suction portion in a direction opposite to the suction direction, and capable of contracting in the suction direction in a state of sucking the electronic component;
An inspection unit for inspecting the electronic component.

  Thereby, even if there is an individual difference in the electronic component, the difference can be offset by the urging portion that can contract while the electronic component is sucked. For example, when performing an electrical inspection on an electronic component in the inspection unit, it is possible to make each terminal of the electronic component uniformly contact each terminal of the inspection unit regardless of individual differences of the electronic component. Inspection can be performed accurately. Further, the electronic component can be transported to the inspection unit, and thus the inspection for the electronic component can be performed by the inspection unit. Moreover, the electronic component after inspection can be conveyed from the inspection unit.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a schematic partial vertical sectional view sequentially illustrating the operating states of the device transport heads installed in the inspection area in FIG. FIG. 4 is a schematic partial vertical sectional view sequentially illustrating the operating states of the device transport heads installed in the inspection area in FIG. FIG. 5 is a schematic partial vertical sectional view sequentially illustrating the operating states of the device transport heads installed in the inspection region in FIG. FIG. 6 is a partial vertical cross-sectional perspective view showing another configuration example of the suction nozzle provided in the device transport head in FIGS. FIG. 7 shows an IC device in which the distance (H ₉₀ ) from the lower surface to each terminal of the IC device varies with respect to the lower surface (suction surface) of the suction nozzle. It is a vertical sectional view showing a state where the probe pin can come into contact. FIG. 8 shows an IC device in which the distance (H ₉₀ ) from the lower surface to each terminal of the IC device varies with respect to the lower surface (suction surface) of the suction nozzle. It is a vertical sectional view showing a state where the probe pin can come into contact. FIG. 9 shows an IC device in which the distance (H ₉₀ ) from the lower surface to each terminal of the IC device varies with respect to the lower surface (suction surface) of the suction nozzle. It is a vertical sectional view showing a state where the probe pin can come into contact. FIG. 10 is a vertical cross-sectional view showing an inspection unit installed in an inspection region of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 11 is a vertical cross-sectional view showing an inspection unit installed in an inspection region of the electronic component inspection apparatus (second embodiment) of the present invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
Hereinafter, with reference to FIGS. 1-9, 1st Embodiment of the electronic component conveying apparatus and electronic component inspection apparatus of this invention is described. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as an “X direction (first direction)”, a direction parallel to the Y axis is also referred to as a “Y direction (second direction)”, and a direction parallel to the Z axis is referred to as “ Also referred to as “Z direction (third direction)”. The direction in which the arrow in each direction is directed is called “positive”, and the opposite direction is called “negative”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered. In addition, the upper side in FIGS. 1 and 3 to 9 (the same applies to FIGS. 10 and 11) may be referred to as “upper” or “upper”, and the lower side may be referred to as “lower” or “lower”.

Electronic component conveying device 10 of the present invention can be grasped by suction the electronic component, the movable suction unit 3 in the direction of suction alpha ₃ for sucking the electronic component (suction nozzles 31), the suction unit 3 (the suction nozzle 31 ) the direction of suction alpha ₃ a are energizable in opposite directions, while sucking the electronic component comprises a coil spring 4 as an urging portion capable contracted in the direction of suction alpha _3, a.

  As a result, as will be described later, even if there is an individual difference in the electronic component (IC device 90), the difference can be offset by the coil spring 4 that can contract while the electronic component is sucked. For example, when an electrical inspection of an electronic component is performed by the inspection unit 16, each terminal (terminal 901) of the electronic component is uniformly placed on each terminal (probe pin 163) of the inspection unit 16 regardless of individual differences of the electronic component. Therefore, the inspection can be performed accurately.

Moreover, the electronic component inspection apparatus 1 of this invention has the electronic component conveyance apparatus 10 of this invention, and is further provided with the test | inspection part 16 which test | inspects an electronic component. That is, the electronic component inspection apparatus 1 of the present invention can be grasped by suction the electronic component, the movable suction unit 3 (the suction nozzle 31) in the direction of suction alpha ₃ for sucking the electronic component, the suction unit 3 (adsorption the direction of suction alpha ₃ of the nozzle 31) are energizable in opposite directions, while sucking the electronic parts, a coil spring 4 as an urging portion capable contracted in the direction of suction alpha _3, to inspect the electronic components And an inspection unit 16.

  Thereby, the electronic component inspection apparatus 1 which has the advantage of the electronic component conveying apparatus 10 mentioned above is obtained. Further, the electronic component can be transported to the inspection unit 16, and therefore, the inspection unit 16 can inspect the electronic component. In addition, the inspected electronic component can be transported from the inspection unit 16.

Hereinafter, the configuration of each unit will be described.
As shown in FIGS. 1 and 2, an electronic component inspection apparatus 1 incorporating an electronic component transport apparatus 10 transports electronic components such as an IC device that is a BGA (Ball Grid Array) package, for example. This is an apparatus for inspecting and testing the electrical characteristics of parts (hereinafter simply referred to as “inspection”). In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be described as a representative, and this will be referred to as “IC device 90”. In this embodiment, the IC device 90 has a flat plate shape. A plurality of hemispherical terminals 901 are arranged on the lower surface of the IC device 90.

  In addition to the above-mentioned IC devices, for example, “LSI (Large Scale Integration)”, “CMOS (Complementary MOS)”, “CCD (Charge Coupled Device)”, or “modules” in which a plurality of IC devices are packaged. IC "," quartz device "," pressure sensor "," inertial sensor (acceleration sensor) "," gyro sensor "," fingerprint sensor ", and the like.

  Also, the electronic component inspection apparatus 1 (electronic component transport apparatus 10) is used by mounting in advance a so-called “change kit” that is exchanged for each type of IC device 90. This change kit includes a mounting unit on which the IC device 90 is mounted. Examples of the mounting unit include a temperature adjustment unit 12 and a device supply unit 14 described later. In addition to the change kit as described above, the placement unit on which the IC device 90 is placed includes the inspection unit 16 and the tray 200 prepared by the user.

The electronic component inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, a device collection area (hereinafter simply referred to as “collection area”) A4, The tray removal area A5 is provided, and these areas are divided by each wall as will be described later. Then, the IC device 90 passes through the respective areas in the direction of the arrow α ₉₀ from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the electronic component inspection apparatus 1 includes the handler that is the electronic component conveyance device 10 that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 800. It has become. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 is the front side, and the inspection area A3 is arranged, that is, in FIG. The upper side is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

The supply area A2 is an area where a plurality of IC devices 90 on the tray 200 conveyed from the tray supply area A1 are conveyed and supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2. The tray transport mechanism 11A is a moving unit that can move the tray 200 together with the IC device 90 placed on the tray 200 in the positive direction in the Y direction, that is, in the direction of the arrow _α11A in FIG. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 in the negative direction in the Y direction, that is, in the direction of the arrow _α11B in FIG. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1.

  In the supply area A2, a temperature adjustment unit (soak plate (English notation: soak plate, Chinese notation (example): soaking plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. .

  The temperature adjustment unit 12 is configured as a mounting unit on which a plurality of IC devices 90 are mounted, and is referred to as a “soak plate” that can heat or cool the mounted IC devices 90 in a lump. With this soak plate, the IC device 90 before being inspected by the inspection unit 16 can be heated or cooled in advance and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any one of the temperature adjustment units 12. Note that the temperature adjustment unit 12 as the mounting unit is fixed, so that the temperature can be stably adjusted with respect to the IC device 90 on the temperature adjustment unit 12.

The device transport head 13 is supported so as to be movable in the X direction and the Y direction within the supply region A2, and further has a portion that can also move in the Z direction. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90. In FIG. 2, the movement of the device transport head 13 in the X direction is indicated by an arrow α _13X , and the movement of the device transport head 13 in the Y direction is indicated by an arrow α _13Y .

Tray transporting mechanism 15, the positive side of the X direction empty tray 200 in a state where all of the IC devices 90 is removed in the feed region A2, i.e., a mechanism for conveying the arrow alpha ₁₅ direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 for inspecting the IC device 90 and a device transport head 17 having the suction unit 3 are provided. In addition, a device supply unit 14 that moves so as to straddle the supply region A2 and the inspection region A3 and a device recovery unit 18 that moves so as to straddle the inspection region A3 and the recovery region A4 are also provided.

  The device supply unit 14 is configured as a mounting unit on which the IC device 90 temperature-adjusted by the temperature adjusting unit 12 is mounted, and can transport the IC device 90 to the vicinity of the inspection unit 16 “supply shuttle plate” "Or simply called a" supply shuttle ".

The device supply unit 14 as the mounting portion is between the supply region A2 and the inspection area A3 X direction, i.e., are reciprocally movably supported along an arrow alpha ₁₄ direction. Thereby, the device supply unit 14 can stably transport the IC device 90 from the supply region A2 to the vicinity of the inspection unit 16 in the inspection region A3, and the IC device 90 is moved by the device transport head 17 in the inspection region A3. After being removed, it can return to the supply area A2.

  In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to one of the device supply units 14. Further, like the temperature adjustment unit 12, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14. Accordingly, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be transported to the vicinity of the inspection unit 16 in the inspection area A3 while maintaining the temperature adjustment state.

The device transport head 17 is an operation unit that grips the IC device 90 in which the temperature adjustment state is maintained and transports the IC device 90 in the inspection area A3. The device transport head 17 is supported so as to be reciprocally movable in the Y direction and the Z direction in the inspection area A3, and is a part of a mechanism called an “index arm”. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16. In FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α _17Y . The device transport head 17 is supported so as to be reciprocally movable in the Y direction, but is not limited thereto, and may be supported so as to be reciprocally movable in the X direction.

  Further, the device transport head 17 is configured to be able to heat or cool the gripped IC device 90 in the same manner as the temperature adjustment unit 12. Thereby, the temperature adjustment state in the IC device 90 can be continuously maintained from the device supply unit 14 to the inspection unit 16.

  The inspection unit 16 is configured as a mounting unit that mounts an IC device 90 that is an electronic component and inspects the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins 163 that are electrically connected to the terminals 901 of the IC device 90 (see FIGS. 4 and 5). Then, when the terminal 901 of the IC device 90 and the probe pin 163 are electrically connected, that is, contacted, the IC device 90 can be inspected. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. Note that, similarly to the temperature adjustment unit 12, the inspection unit 16 can also heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for the inspection.

  The device collection unit 18 is configured as a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed and can transport the IC device 90 to the collection area A4. It is simply called the “recovery shuttle”.

The device collecting section 18, X-direction between the examination region A3 and the collection area A4, i.e., are reciprocally movably supported along the arrow alpha ₁₈ direction. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected in the inspection area A3 and completed the inspection are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed, and is fixed so as not to move in the collection region A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. Become. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

  Three empty trays 200 are also arranged along the X direction. This empty tray 200 is also a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

The device transport head 20 is supported so as to be movable in the X direction and the Y direction within the collection area A4, and further has a portion that can also move in the Z direction. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In FIG. 2, the movement of the device transport head 20 in the X direction is indicated by an arrow α _20X , and the movement of the device transport head 20 in the Y direction is indicated by an arrow α _20Y .

Tray transfer mechanism 21, X-direction empty tray 200 is conveyed from the tray removal area A5 in the collection area A4, i.e., a mechanism for conveying the arrow alpha ₂₁ direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving unit that can reciprocate the tray 200 in the Y direction, that is, the arrow α _22A direction. Thus, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 in the positive direction in the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the collection area A4.

  For example, the control unit 800 includes a tray transport mechanism 11A, a tray transport mechanism 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport. The operation of each part of the head 17, the device recovery unit 18, the device transport head 20, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B can be controlled.

  The operator can set or confirm the operating conditions of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the electronic component inspection apparatus 1. As shown in FIG. 1, a mouse table 600 on which a mouse is placed is provided on the right side of the tray removal area A5 in the drawing. This mouse is used when operating the screen displayed on the monitor 300.

  In addition, an operation panel 700 is arranged on the lower right side of FIG. The operation panel 700 instructs the electronic component inspection apparatus 1 to perform a desired operation separately from the monitor 300.

  Further, the signal lamp 400 can notify the operating state of the electronic component inspection apparatus 1 and the like by a combination of colors that emit light. The signal lamp 400 is disposed on the electronic component inspection apparatus 1. Note that the electronic component inspection apparatus 1 has a built-in speaker 500, and the operational state of the electronic component inspection apparatus 1 can also be notified by the speaker 500.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated by the first partition 231 and the supply area A2 and the inspection area A3 are separated by the second partition 232, The inspection area A3 and the collection area A4 are separated by a third partition wall 233, and the collection area A4 and the tray removal area A5 are separated by a fourth partition wall 234. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 235.

  The outermost exterior of the electronic component inspection apparatus 1 is covered with a cover. Examples of the cover include a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

  As described above, the device transport head 17 is supported so as to be movable in the Y direction and the Z direction. The device transport head 17 transports the IC device 90 in the inspection area A3. As shown in FIGS. 3 to 5, the device transport head 17 includes a suction unit 3, a coil spring 4 as an urging unit, a posture adjusting unit 5, and a heat insulating unit 6.

  The suction unit 3 is a suction unit configured to be able to grip an IC device 90 that is an electronic component by suction. The suction unit 3 includes a suction nozzle 31, a first block 32, a second block 33, and a third block 34. In addition, although the number of installation of the suction part 3 is one in the structure shown in FIGS. 3-5, it is not limited to this, A plurality may be sufficient.

The ejector 72 serving as a vacuum generation source gives a suction force F ₃ to the suction unit 3. A negative pressure is generated by the operation of the ejector 72, and the pressure is appropriately adjusted by a regulator 73 that is a pressure adjusting mechanism, and the lumen portion 324 and the lumen portion 333 become negative pressure via the pipe 71 and the joint 36.

The suction nozzle 31 is capable of sucking the IC device 90 and is formed of a cylindrical member having a lumen portion 313 that opens to the upper surface 311 and the lower surface 312. The lumen part 313 functions as a flow path through which air passes. Then, the lumen portion 324 and the lumen portion 333 become negative pressure, and the lumen portion 313 communicating with the lumen portion 324 becomes negative pressure, that is, the air flows upward in the lumen portion 313, so that the lower surface A suction force F ₃ is generated at the opening (suction port) 314 of 312. Thus, the IC device 90 can be sucked using the lower surface 312 as the suction surface. In addition, air flows into the lumen 313 and the pressure increases, that is, the air flows downward in the lumen 313 or the upward flow of air stops, so that the suction force is increased. F ₃ decreases and eventually disappears, and the IC device 90 can be released (released) from the lower surface 312. Hereinafter, the direction in which the IC device 90 is sucked, that is, the direction in which the suction force F ₃ acts may be referred to as “suction direction α ₃ ”. The suction direction alpha ₃ is oriented positive side of the Z-direction.

The maximum value of the suction force _{F 3} (maximum suction force in the suction section 3) is not particularly limited, for example, more than -95KPa, but preferably not more than -30 kPa, -90 kPa or more, or less -50kPa Is more preferable. Further configured to changeable suction force F ₃ of the suction unit 3 by the pressure setting of the regulator 73. For example, an electropneumatic regulator is preferably used as the regulator 73. Thus, the suction force F ₃ to change steplessly (adjust) can. Such attraction force F _3, it is possible to adjust the degree of vacuum in the area that is sealed by (O-ring in the example embodiment) packing 35 mounted on the suction nozzle 31. The degree of vacuum is a force that pulls up the suction nozzle 31 (area × degree of vacuum), but the pressing force by the coil spring 4 can be reduced by the amount of the pulling-up force. That is, by adjusting the suction force F _3, it is possible to adjust the reaction force of the coil spring 4, it is possible to adjust the pressing. And IC device 90 can be conveyed within inspection field A3, maintaining the adsorption state. Thereby, it is possible to prevent the IC device 90 from falling during conveyance.

  A flange portion 315 whose outer diameter is enlarged is formed on the outer peripheral portion of the suction nozzle 31 so as to protrude in the middle of the longitudinal direction. The flange portion 315 functions as a spring seat with which the lower end 41 of the coil spring 4 abuts. Moreover, the flange part 315 can contact | abut to the 3rd block 34, and can prevent that the adsorption nozzle 31 falls off from the suction part 3 (refer FIG. 3).

  A groove 316 is formed on the outer peripheral portion of the suction nozzle 31 above the flange portion 315. The groove 316 is formed in a ring shape along the circumferential direction of the suction nozzle 31. A ring-shaped packing 35 is disposed in the groove 316. As a result, the packing 35 is compressed between the suction nozzle 31 and the second block 33.

  A first block 32 is disposed above the suction nozzle 31. The first block 32 is composed of a block-shaped (or plate-shaped) member having a flat upper surface 321 and a lower surface 322. The first block 32 has a lumen 324 that opens to the lower surface 322 and the side surface 323. This lumen portion 324 functions as a flow path through which air passes, like the lumen portion 313 of the suction nozzle 31.

  Further, the joint 36 is airtightly connected to the lumen portion 324 from the side surface 323 side. The joint 36 is connected to the ejector 72 via a pipe 71. A regulator 73 is disposed in the middle of the pipe 71, that is, between the joint 36 and the ejector 72.

  In addition, the first block 32 may include, for example, a heater (not shown) that heats the IC device 90 sucked by the suction nozzle 31.

  A second block 33 is disposed below the first block 32. The second block 33 is composed of a block-like (or plate-like) member having a flat upper surface 331 and a lower surface 332, and the upper surface 331 is in contact with the lower surface 322 of the first block 32.

  The second block 33 has a lumen portion 333 that opens to an upper surface 331 and a lower surface 332. A portion above the flange portion 315 of the suction nozzle 31 is inserted into the lumen portion 333. Thereby, the suction nozzle 31 can move in the Z direction.

  The lumen portion 333 also functions as a flow path through which air passes, and the lumen portion 313 of the suction nozzle 31 and the lumen portion 324 of the first block 32 communicate with each other through the lumen portion 333. Thereby, a series of flow paths through which air passes are formed.

  On the upper surface 331 of the second block 33, a groove 334 is formed concentrically with the lumen portion 333 in a ring shape. A ring-shaped packing 37 is disposed in the groove 334. As a result, the packing 37 is compressed between the first block 32 and the second block 33, and together with the packing 35, the airtightness of the series of flow paths can be maintained.

  On the lower surface 332 of the second block 33, a groove 335 is formed concentrically with the lumen 333 in a ring shape. The bottom of the groove 335 functions as a spring seat with which the upper end 42 of the coil spring 4 abuts.

  A third block 34 is disposed below the second block 33. The third block 34 is configured by a block-shaped (or plate-shaped) member having a flat upper surface 341 and a lower surface 342, and the upper surface 341 is in contact with the lower surface 332 of the second block 33.

  A concave portion 343 larger than the flange portion 315 of the suction nozzle 31 is formed on the upper surface 341 of the third block 34 in plan view. Within the recess 343, the flange portion 315 can move in the Z direction. As shown in FIG. 3, when the flange portion 315 is in contact with the bottom of the recess 343, the movement limit at the lower position of the suction nozzle 31 is restricted, thereby preventing the suction nozzle 31 from falling off. be able to. On the contrary, when the flange portion 315 is in contact with the lower surface 332 of the second block 33, the movement limit at the upper position of the suction nozzle 31 is restricted. In addition, the movable range in which the suction nozzle 31 is movable is sufficiently secured so as to correspond to the thickness of various IC devices 90.

  A through hole 344 that penetrates to the lower surface 342 is formed at the bottom of the recess 343. Regardless of the position of the suction nozzle 31, a portion below the flange portion 315 can protrude from the through hole 344.

  In the third block 34, a guide hole 345 penetrating from the upper surface 341 to the lower surface 342 is formed. In the configuration shown in FIGS. 3 to 5, two guide holes 345 are formed. A guide pin 164 of the inspection unit 16 is inserted into each guide hole 345. Thereby, when the suction nozzle 31 (suction unit 3) presses the IC device 90 against the inspection unit 16, the IC device 90 and the inspection unit 16 are positioned. By this positioning, each terminal 901 of the IC device 90 and each probe pin 163 of the inspection unit 16 can come into contact with each other.

  As shown in FIG. 6, the suction unit 3 includes a guide member 38 that guides the moving suction nozzle 31. The guide member 38 is composed of a rod-shaped member arranged in parallel with the Z direction, and is fixed to the second block 33 and the third block 34. The flange portion 315 of the suction nozzle 31 is formed with a defective portion 317 through which the guide member 38 passes. Such a guide member 38 and the missing portion 317 constitute a rotation prevention mechanism for the suction nozzle 31. The suction nozzle 31 is stable in the Z direction without rotating with respect to the second block 33 and the third block 34. Can move. In the suction part 3, such a rotation prevention mechanism can be omitted.

  As shown in FIGS. 3 to 5, the coil spring 4, which is an urging portion, is built in the suction portion 3 and is disposed concentrically with the suction nozzle 31 on the outer peripheral side of the suction nozzle 31. In the state shown in FIG. 3, the coil spring 4 may be a natural length between the flange portion 315 of the suction nozzle 31 and the second block 33, but is preferably in a compressed state.

The coil spring 4, the suction nozzle 31 of the suction unit 3 to the suction direction alpha ₃ opposite direction, i.e., an urging portion for urging the negative side of the Z-direction. Since the urging portion is configured by the coil spring 4 in this way, the configuration of the urging portion can be simplified. Further, as the urging portion, a light weight suitable for being incorporated in the suction portion 3 can be used. The constituent material of the coil spring 4 is not particularly limited, and for example, it is preferable to use a metal material that exhibits sufficient elasticity, such as stainless steel.

As described above, the suction nozzle 31 can move in the Z direction along the lumen portion 333. As shown in FIGS. 4 and 5, when the suction nozzle 31 sucks the IC device 90, the inside of the lumen 333 is in a negative pressure state. attraction force F ₃ corresponding to the ₃ '(pulling upward force) occurs. This suction force F ₃ ′ acts on the suction nozzle 31 itself and pulls up the suction nozzle 31 in the suction direction α ₃ (the positive side in the Z direction). At this time, the coil spring 4 is contracted, the not completely shrink, i.e., without lead to shrinkage limit (referred to as "contractible state" the state less) condition can be further shrunk in the direction of suction alpha ₃ It has become.

The spring constant of the coil spring 4 is preferably 1 N / mm or more and 90 N / mm or less, and more preferably 50 N / mm or more and 70 N / mm or less. Further, the outer diameter φD _4-1 of the coil spring 4 is preferably 7 mm or more and 20 mm or less, and more preferably 10 mm or more and 15 mm or less. The inner diameter [phi] D _4-2 of the coil spring 4, 5 mm or more, preferably at 10mm or less, 5 mm or more, more preferably 7mm or less. Further, the wire diameter φD _{4-3 of the} coil spring 4 is preferably 0.3 mm or more and 2 mm or less, and more preferably 0.5 mm or more and 1.4 mm or less. When the coil spring 4 satisfies such conditions, the coil spring 4 can be incorporated in the suction portion 3 relatively easily. Further, an urging force (pressing force) suitable for inspection can be applied to the IC device 90. Further, the coil spring 4 can be maintained in a contractible state.

  An attitude adjustment unit 5 is disposed above the suction unit 3. The posture adjustment unit 5 is called a “compliance unit” that adjusts the posture of the suction unit 3 in the state shown in FIG. 5. The attitude adjustment unit 5 includes a first adjustment mechanism 51 and a second adjustment mechanism 52.

  The first adjustment mechanism 51 includes an air cylinder, and can perform posture adjustment around the X axis of the suction unit 3 and posture adjustment around the Y axis of the suction unit 3 among posture adjustments of the suction unit 3. .

  A second adjustment mechanism 52 is disposed below the first adjustment mechanism 51. The second adjustment mechanism 52 has two plate members 521 stacked in the Z direction. These two plate members 521 can relatively move in the XY plane direction. Accordingly, the second adjustment mechanism 52 adjusts the posture adjustment of the suction portion 3 in the X direction, the posture adjustment of the suction portion 3 in the Y direction, and the posture of the suction portion 3 around the Z axis among the posture adjustments of the suction portion 3. Can be responsible for coordination.

  Further, the posture adjusting unit 5 is connected to a mechanism (not shown) that supports the entire device transport head 17 so as to be reciprocally movable in the Y direction and the Z direction via a connecting unit 171.

  A heat insulating part 6 is arranged between the suction part 3 and the posture adjusting part 5. The heat insulating unit 6 can prevent or suppress heat from the heater built in the first block 32 from being transmitted to the posture adjusting unit 5. Thereby, the posture adjustment unit 5 is prevented from malfunctioning due to the heat, and thus operates normally, that is, the posture of the suction unit 3 can be accurately adjusted.

  In this embodiment, the heat insulation part 6 is comprised with the some heat insulation member 61 which makes a column shape. Each heat insulating member 61 is arranged away from each other. In addition, it does not specifically limit as a constituent material of the heat insulation member 61, For example, various heat insulating materials, such as a glass epoxy resin, can be used.

  As described above, the inspection unit 16 is disposed in the inspection region A3. The inspection unit 16 is a mounting unit on which the IC device 90 that is an electronic component is mounted, and is a socket that inspects the IC device 90 in the mounted state. As shown in FIGS. 4 and 5, the inspection unit 16 includes an inspection unit main body 161, a contact portion 162, a probe pin 163, and a guide pin 164.

  The inspection unit main body 161 is formed with a recessed portion (pocket) 165 in which the IC device 90 is placed and stored. In addition, although the number of formation of the recessed part 165 is one in the structure shown in FIG.4 and FIG.5, it is not limited to this, A plurality may be sufficient.

  The same number of probe pins 163 as the terminals 901 of the IC device 90 protrude from the bottom of the recess 165.

The inspection unit 16 (mounting portion) has a checking unit 16 electronic component biasing unit 166 that biases the IC device 90 is an electronic component placed on the (mounting portion) in the direction of suction alpha _3. The electronic component urging portion 166 is configured by a coil spring built in each probe pin 163. Thereby, coupled with the pressure from the suction unit 3 side against the IC device 90, each terminal 901 of the IC device 90 and each probe pin 163 can be sufficiently brought into contact with each other. Therefore, it is possible to accurately inspect the IC device 90.

  As described above, in the inspection area A3, the inspection unit 16 that is a placement portion on which the IC device 90 that is an electronic component is placed can be arranged. And the inspection part 16 which is this mounting part has the contact part 162. FIG. The abutting portion 162 is configured by a plate-like member, and is placed on the inspection portion main body 161 so as to overlap. Thereby, the contact part 162 can contact | abut with the lower surface 342 of the 3rd block 34 of the suction part 3 with which the device conveyance head 17 is provided. Further, the device transport head 17 has a posture adjustment unit 5 that can adjust the posture of the suction unit 3. Here, it is assumed that the entire inspection unit 16 is inclined by 1 degree with respect to the XY plane (horizontal plane), for example. Even in such a case, as shown in FIG. 5, when the suction unit 3 and the contact unit 162 are in contact with each other, the posture adjustment unit 5 causes the suction unit 3 to be in the same inclined posture as the inspection unit 16. You can make it. Such posture adjustment of the suction unit 3 contributes to contact between each terminal 901 of the IC device 90 and each probe pin 163.

  The guide pins 164 are disposed in the inspection unit main body 161 corresponding to the respective guide holes 345 of the suction unit 3. Each guide pin 164 is fixed to the inspection unit main body 161 and protrudes upward. As described above, the guide pin 164 is inserted into the guide hole 345 of the suction unit 3, whereby the IC device 90 and the inspection unit 16 are positioned. Thereby, each terminal 901 of the IC device 90 and each probe pin 163 of the test | inspection part 16 can contact.

By the way, in the IC device 90 sucked by the suction nozzle 31, the distance H ₉₀ from the lower surface 312 to each terminal 901 may vary when the lower surface 312 (suction surface) of the suction nozzle 31 is used as a reference. As the cause, for example, even in the same kind of IC device 90, there is a difference (variation) in the thickness of the IC device 90, that is, the thickness error is large (see FIGS. 7 and 8). In addition, there are individual differences such as that the IC device 90 is warped (see FIG. 9). 7 shows a state in which the IC device 90 itself has a thickness, and FIG. 8 shows a state in which there is a thin IC device 90 or a thick IC device 90 even between the same kind of IC devices 90. Indicates a state in which the IC device 90 is warped.

For example, when the distance H ₉₀ is relatively small, there may be a terminal 901 that cannot reach the probe pin 163 of the inspection unit 16 in each terminal 901. In this case, contact failure occurs and it is difficult to perform an accurate inspection.

Further, when the distance H ₉₀ is relatively large, each terminal 901 can reach and contact the probe pin 163 of the inspection unit 16, but there may be a terminal 901 whose contact pressure is excessive. In this case also, it is difficult to perform an accurate inspection.

  Therefore, the electronic component inspection apparatus 1 (electronic component transport apparatus 10) of the present invention has a configuration that can eliminate such a phenomenon. This configuration and operation will be described below with reference to FIGS.

  [1] As shown in FIG. 3, the device transport head 17 is in a state where the IC device 90 has not yet been sucked by the suction unit 3. Further, the coil spring 4 is in a state of being extended to the maximum, and the flange portion 315 of the suction nozzle 31 is in contact with the third block 34.

[2] The device transport head 17 can suck the IC device 90 on the device supply unit 14 that has entered the inspection area A3 with the suction unit 3. Thereby, the device conveyance head 17 will be in the state shown in FIG. In the state shown in FIG. 4, IC device 90 is sucked by the suction nozzle 31 by the suction force F _3. Further, as described above, when the IC device 90 is suctioned, the suction nozzle 31 moves to the positive side in the Z direction (suction direction α ₃ ) from the state shown in FIG.

  Then, by moving the device transport head 17 while the IC device 90 is sucked, the sucked IC device 90 can be disposed immediately above the recess 165 of the inspection unit 16.

  [3] Thereafter, as shown in FIG. 5, the device transport head 17 can be lowered until the suction unit 3 contacts the inspection unit 16. Accordingly, the suction unit 3 can be accommodated while pressing the IC device 90 against the recess 165 of the inspection unit 16 while following the posture of the inspection unit 16. At this time, the suction nozzle 31 receives a reaction force from the inspection unit 16 via the IC device 90 and moves further to the positive side in the Z direction than the state shown in FIG. By this movement, the coil spring 4 contracts, but does not reach the contraction limit and enters the contractible state described above. In addition, the coil spring 4 at this time is also in an extendable state that can be extended.

Since the coil spring 4 is in a contractible state and in an extendable state in this way, the coil spring 4 is directed to the IC device 90 toward the inspection unit 16 via the suction nozzle 31 and appropriately with a force suitable for the inspection. Can be energized. Accordingly, for example, as shown in FIGS. 7 to 9, each terminal 901 of the IC device 90 is brought into uniform contact with the probe pin 163 of the inspection unit 16 regardless of the distance H ₉₀ . Therefore, the inspection of the IC device 90 can be performed accurately. Therefore, it can be said that the coil spring 4 functions as a “buffer portion” that cancels out variations in the distance H ₉₀ .

Second Embodiment
Hereinafter, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to FIGS. 10 and 11. However, the differences from the above-described embodiment will be mainly described, and similar matters will be described. Will not be described.

This embodiment is the same as the first embodiment except that the configuration of the inspection unit is different.
As shown in FIGS. 10 and 11, in the present embodiment, the contact portion 162 is configured by a plate-like member (spacer) whose thickness can be changed. The abutting portion 162 is a laminated body having at least one layer composed of the piezo elements 167. Accordingly, the thickness of the contact portion 162 can be easily and quickly changed depending on the magnitude of the voltage applied to the piezo element 167. Thereby, after using the test | inspection part 16 in the state shown in FIG. 10, for example, when the IC device 90 used as test object is changed into a thicker thing, it can test | inspect as the state shown in FIG. . As described above, in the present embodiment, the inspection unit 16 can be made suitable for the inspection of the IC device 90 according to the thickness of the IC device 90.

  The range in which the thickness can be changed by the piezo element 167 is not particularly limited, and is preferably 0.1 mm or more and 0.5 mm or less, for example, 0.1 mm or more and 0.3 mm or less. More preferred.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  In addition, the urging unit that urges the suction nozzle of the suction unit to the negative side in the Z direction is configured by a coil spring in each of the above embodiments, but is not limited thereto, and is configured by, for example, an air spring. May be.

  Further, the thickness of the contact portion can be changed by the operation of the piezo element in the second embodiment, but the invention is not limited to this. For example, a plurality of 0.1 mm shims can be stacked, It may be performed by increasing or decreasing the number of sheets.

DESCRIPTION OF SYMBOLS 1 ... Electronic component inspection apparatus, 10 ... Electronic component conveyance apparatus, 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 13 ... Device conveyance head, 14 ... Device supply part, 15 ... Tray conveyance mechanism, DESCRIPTION OF SYMBOLS 16 ... Test | inspection part, 161 ... Test | inspection part main body, 162 ... Contact part, 163 ... Probe pin, 164 ... Guide pin, 165 ... Recessed part (pocket), 166 ... Electronic component biasing part, 167 ... Piezo element, 17 ... Device Conveying head, 171 ... connecting part, 18 ... device collecting part, 19 ... collecting tray, 20 ... device conveying head, 21 ... tray conveying mechanism, 22A ... tray conveying mechanism, 22B ... tray conveying mechanism, 231 ... first partition, 232 ... 2nd partition, 233 ... 3rd partition, 234 ... 4th partition, 235 ... 5th partition, 241 ... Front cover, 242 ... Side cover, 243 Side cover, 244 ... rear cover, 245 ... top cover, 3 ... suction part, 31 ... suction nozzle, 311 ... upper surface, 312 ... lower surface, 313 ... lumen, 314 ... opening (suction port), 315 ... flange part, 316 ... groove, 317 ... defect, 32 ... first block, 321 ... upper surface, 322 ... lower surface, 323 ... side surface, 324 ... luminal portion, 33 ... second block, 331 ... upper surface, 332 ... lower surface, 333 ... inside Cavity, 334 ... groove, 335 ... groove, 34 ... third block, 341 ... upper surface, 342 ... lower surface, 343 ... concave, 344 ... through hole, 345 ... guide hole, 35 ... packing, 36 ... joint, 37 ... packing 38 ... Guide member, 4 ... Coil spring, 41 ... Lower end, 42 ... Upper end, 5 ... Posture adjustment part, 51 ... First adjustment mechanism, 52 ... Second adjustment mechanism, 521 ... Plate member, 6 ... Heat insulation part, 61 ... Heat insulation 71 ... Piping, 72 ... Ejector, 73 ... Regulator, 90 ... IC device, 901 ... Terminal, 200 ... Tray, 300 ... Monitor, 301 ... Display screen, 400 ... Signal lamp, 500 ... Speaker, 600 ... Mouse stand, 700 ... operation panel, 800 ... control unit, A1 ... tray supply area, A2 ... device supply area (supply area), A3 ... examination region, A4 ... device collection area (recovery area), A5 ... tray removal area, F 3 _... suction Force, F ₃ ′… suction force, H ₉₀ ... distance, α ₃ ... suction direction, α _11A ... arrow, α _11B ... arrow, α _13X ... arrow, α _13Y ... arrow, α ₁₄ ... arrow, α ₁₅ ... arrow, alpha _{17Y ...} arrows, alpha _{18 ...} arrow, alpha _{21 ...} arrow, alpha _{20X ...} arrows, alpha _{20Y ...} arrows, alpha _{22A ...} arrows, alpha _{22B ...} arrows, alpha _{90 ...} arrow, [phi] D _{4 1} ... outer diameter, φD _{4-2 ...} inside diameter, φD _{4-3 ...} wire diameter

Claims (14)

A suction part capable of gripping the electronic component by suction and movable in a suction direction for sucking the electronic component;
An electronic component transport comprising: an urging portion capable of urging the suction portion in a direction opposite to the suction direction, and contracting in the suction direction in a state where the electronic component is sucked. apparatus. It has a contact part that contacts the suction part, and a placement part on which the electronic component is placed can be arranged,
The electronic component carrying device according to claim 1, further comprising a posture adjusting unit capable of adjusting a posture of the suction unit in a state where the suction unit and the contact unit are in contact with each other.   The electronic component transport device according to claim 2, wherein the contact portion is formed of a plate-like member whose thickness can be changed.   The electronic component conveying apparatus according to claim 2, wherein the contact portion includes a piezo element.   The electronic component transport device according to claim 2, wherein the placement unit includes an electronic component urging unit that urges the electronic component placed on the placement unit in the suction direction.   The electronic component conveying apparatus according to claim 1, wherein the urging portion is configured by a coil spring.   The electronic component transport apparatus according to claim 6, wherein a spring constant of the coil spring is 1 N / mm or more and 90 N / mm or less.   The electronic component conveying apparatus according to claim 6, wherein an outer diameter of the coil spring is 7 mm or more and 20 mm or less.   The electronic component conveying apparatus according to claim 6, wherein an inner diameter of the coil spring is 5 mm or more and 10 mm or less.   The electronic component transport apparatus according to claim 6, wherein a wire diameter of the coil spring is 0.3 mm or more and 2 mm or less.   The electronic component transport apparatus according to claim 1, wherein a maximum suction force of the suction unit is −95 kPa or more and −30 kPa or less.   The electronic component transport apparatus according to claim 1, wherein the suction force of the suction unit is configured to be changeable. A suction nozzle that contacts the electronic component and sucks the electronic component;
A pressure adjusting mechanism capable of changing a suction force for sucking the electronic component, and
The electronic component transport apparatus according to claim 1, wherein the suction force of the suction nozzle can be changed by changing the suction force. A suction part capable of gripping the electronic component by suction and movable in a suction direction for sucking the electronic component;
An urging portion capable of urging the suction portion in a direction opposite to the suction direction, and capable of contracting in the suction direction in a state of sucking the electronic component;
An electronic component inspection apparatus comprising: an inspection unit that inspects the electronic component.

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