JP2019190879A - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

To provide an electronic component conveying device and an electronic component inspection device with which, when an electronic component is left in an electronic component mounting unit, it is possible to detect the remaining state of it.SOLUTION: Provided is an electronic component conveying device including a conveyance unit having: a suction unit which conveys an electronic component to an electronic component mounting unit and sticks fast to the electronic component; and a support unit which movably supports the suction unit. The electronic component conveying device comprises: a first passage which has pressure lower than the atmospheric pressure and provides a suction force for sucking the electronic component and causing the suction unit to stick fast to the electronic component; a sensor which detects a flow rate or pressure in the first passage; and a detection unit which detects a position of the suction unit relative to the support unit. The suction unit sticks fast to the electronic component and while the support unit is brought into contact with the electronic component mounting unit, moves to a first position or a second position where the first passage communicates with a second passage whose pressure is higher than the atmospheric pressure or a third passage whose pressure is equal to the atmospheric pressure. The detection unit detects one of the first and second positions on the basis of the flow rate or pressure of the first passage.SELECTED DRAWING: Figure 7

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, a test apparatus that performs an electrical test on an IC package is known (for example, see Patent Document 1). The test apparatus described in Patent Document 1 is configured to inspect an IC package by pressing the IC package against a socket. Moreover, in the inspection apparatus described in Patent Document 1, when the IC package is pressed against the socket, the pressure (pressing force) can be detected. As a result, the terminals of the IC package and the terminals of the socket can be brought into electrical contact with each other without excess or deficiency, so that an accurate test can be performed.

JP 2003-161758 A

  However, in the test apparatus described in Patent Document 1, for example, if an IC package remains in the socket, there is a possibility that the IC package to be tested will overlap with the remaining package by mistake. Even if they are stacked, it is impossible to determine whether they are stacked.

  The present invention has been made to solve the above-described problems, and can be realized as the following.

An electronic component transport apparatus according to the present invention is configured to transport the electronic component to an electronic component placement portion on which the electronic component is placed, suck the electronic component, a support portion that moves and supports the suction portion, An electronic component conveying device including a conveying unit having
A first flow path having a pressure lower than atmospheric pressure, sucking the electronic component, and applying a suction force to suck the electronic component to the suction portion;
A sensor for detecting the flow rate or pressure of the first flow path;
A detection unit that detects a position of the adsorption unit with respect to the support unit,
The adsorbing portion adsorbs the electronic component and is different from the first position in a state where the supporting portion is brought into contact with the electronic component mounting portion. Move to either the second flow path having a pressure higher than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure;
The detection unit detects either the first position or the second position based on the flow rate or pressure of the first flow path.

An electronic component transport apparatus according to the present invention is configured to transport the electronic component to an electronic component placement portion on which the electronic component is placed, suck the electronic component, a support portion that moves and supports the suction portion, An electronic component conveying device including a conveying unit having
A first flow path having a pressure lower than atmospheric pressure, sucking the electronic component, and applying a suction force to suck the electronic component to the suction portion;
A second flow path having a pressure higher than atmospheric pressure and applying an urging force by air to the adsorption portion;
A sensor for detecting the flow rate or pressure of the second flow path;
A detection unit that detects a position of the adsorption unit with respect to the support unit,
The adsorbing portion adsorbs the electronic component and is different from the first position in a state where the supporting portion is brought into contact with the electronic component mounting portion, and the second flow path has a large size. Move to either the first flow path whose pressure is lower than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure;
The detection unit detects either the first position or the second position based on a flow rate or pressure of the second flow path.

An electronic component transport apparatus according to the present invention is configured to transport the electronic component to an electronic component placement portion on which the electronic component is placed, suck the electronic component, a support portion that moves and supports the suction portion, A transport unit having
An electronic component transport device comprising a processor,
A first flow path having a pressure lower than atmospheric pressure, sucking the electronic component, and applying a suction force to suck the electronic component to the suction portion;
A sensor for detecting the flow rate or pressure of the first flow path,
The adsorbing portion adsorbs the electronic component and is different from the first position in a state where the supporting portion is brought into contact with the electronic component mounting portion. Move to either the second flow path having a pressure higher than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure;
The processor detects either the first position or the second position based on the flow rate or pressure of the first flow path. It is determined that the electronic parts are placed in an overlapping manner.

An electronic component transport apparatus according to the present invention is configured to transport the electronic component to an electronic component placement portion on which the electronic component is placed, suck the electronic component, a support portion that moves and supports the suction portion, A transport unit having
An electronic component transport device comprising a processor,
A first flow path having a pressure lower than atmospheric pressure, sucking the electronic component, and applying a suction force to suck the electronic component to the suction portion;
A second flow path having a pressure higher than atmospheric pressure and applying an urging force by air to the adsorption portion;
A sensor for detecting the flow rate or pressure of the second flow path,
The suction portion sucks the electronic component, and in a state where the support portion is brought into contact with the electronic component mounting portion, the second flow path is different from the first position and the first position. Move to either the first flow path or the second position communicating with the outside,
The processor detects either the first position or the second position on the basis of the flow rate or pressure of the second flow path, and when detecting the second position, the processor places a plurality of pieces on the electronic component placement unit. It is determined that the electronic parts are placed in an overlapping manner.

The electronic component inspection apparatus of the present invention has an electronic component placement portion on which an electronic component is placed, and an inspection portion that inspects the electronic component;
An electronic component inspection apparatus comprising: a conveyance unit that conveys the electronic component to the inspection unit and adsorbs the electronic component; and a support unit that moves and supports the adsorption unit.
A first flow path having a pressure lower than atmospheric pressure, sucking the electronic component, and applying a suction force to suck the electronic component to the suction portion;
A sensor for detecting the flow rate or pressure of the first flow path;
A detection unit that detects a position of the adsorption unit with respect to the support unit,
The adsorbing portion adsorbs the electronic component and is different from the first position in a state where the supporting portion is brought into contact with the electronic component mounting portion. Move to either the second flow path having a pressure higher than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure;
The detection unit detects either the first position or the second position based on the flow rate or pressure of the first flow path.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a schematic partial vertical sectional view showing the operating state of the device transport head installed in the inspection region in FIG. FIG. 4 is a schematic partial vertical sectional view showing an operating state of the device transport head installed in the inspection region in FIG. FIG. 5 is a schematic partial vertical sectional view showing an operating state of the device transport head installed in the inspection region in FIG. FIG. 6 is a schematic partial vertical sectional view showing the operating state of the device transport head installed in the inspection region in FIG. FIG. 7 is a schematic partial vertical sectional view showing an operating state of the device transport head installed in the inspection region in FIG. FIG. 8 is a flowchart showing a control program of the electronic component inspection apparatus shown in FIG. FIG. 9 is a schematic partial vertical sectional view showing the operating state of the device transport head installed in the inspection region of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 10 is a schematic partial vertical sectional view showing the operating state of the device transport head installed in the inspection region of the electronic component inspection apparatus (third embodiment) of the present invention. FIG. 11 is a schematic partial vertical sectional view showing the operating state of the device transport head installed in the inspection area of the electronic component inspection apparatus (third embodiment) of the present invention. FIG. 12 is a schematic partial vertical sectional view showing the operating state of the device transport head installed in the inspection region of the electronic component inspection apparatus (fourth embodiment) of the present invention. FIG. 13 is a schematic partial vertical sectional view showing the operating state of the device transport head installed in the inspection area of the electronic component inspection apparatus (fourth embodiment) of the present invention. FIG. 14 is a schematic partial vertical sectional view showing the operating state of the device transport head installed in the inspection area of the electronic component inspection apparatus (fifth embodiment) of the present invention. FIG. 15 is a schematic partial vertical sectional view showing the operating state of the device transport head installed in the inspection region of the electronic component inspection apparatus (fifth embodiment) of the present invention. FIG. 16 is a block diagram showing an electronic component inspection apparatus (sixth embodiment) of the present invention and its periphery. FIG. 17 is a block diagram showing an electronic component inspection apparatus (seventh embodiment) of the present invention and its periphery.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
Hereinafter, with reference to FIGS. 1-8, 1st Embodiment of the electronic component conveying apparatus and electronic component inspection apparatus of this invention is described. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as an “X direction (first direction)”, a direction parallel to the Y axis is also referred to as a “Y direction (second direction)”, and a direction parallel to the Z axis is referred to as “ Also referred to as “Z direction (third direction)”. The direction in which the arrow in each direction is directed is called “positive” and the opposite direction is called “negative”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered. In addition, the term “vertical” as used in the present specification is not limited to complete vertical, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered. 1 and 3 to 7 (the same applies to FIGS. 9 to 15), that is, the Z-axis direction positive side is “up” or “upward”, and the lower side, that is, the Z-axis direction negative side. May be referred to as “down” or “down”.

The electronic component conveying apparatus 10 of the present invention is a handler having the appearance shown in FIG. As shown in FIG. 2, the electronic component transport apparatus 10 transports an IC device 90 (electronic component) to an electronic component mounting portion 26 on which an IC device 90 that is an electronic component is mounted, and the IC device 90 (electronic The electronic component transport apparatus 10 includes a transport unit 25 having a suction nozzle (suction unit) 31 that sucks a component) and a support unit 38 that moves and supports the suction nozzle (suction unit) 31. The electronic component transport apparatus 10 has a suction force F ₃ that is lower than atmospheric pressure, sucks the IC device 90 (electronic component), and sucks the IC device 90 (electronic component) to the suction nozzle (suction portion) 31. The suction channel (first channel) 43 to be applied, the sensor 74 for detecting the flow rate or pressure of the suction channel (first channel) 43, and the position of the suction nozzle (suction unit) 31 with respect to the support unit 38 are detected. And a control unit 800 (see FIG. 2) having a function as a detection unit. The suction nozzle (suction part) 31 sucks the IC device 90 (electronic component), and the suction part (suction part) 31 is different from the first position in the state where the support part 38 is brought into contact with the electronic component mounting part 26. The flow path (first flow path) 43 moves to either the energizing flow path (second flow path) 44 having a pressure higher than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure. To do. The control unit 800 (detection unit) can detect either the first position or the second position based on the flow rate or pressure of the suction channel (first channel) 43.

In addition, the electronic component transport apparatus 10 of the present invention transports the IC device 90 (electronic component) to the electronic component mounting portion 26 on which the IC device 90 that is an electronic component is mounted, and the IC device 90 (electronic component) is transported. The electronic component transport apparatus 10 includes a transport unit 25 having a suction nozzle (suction unit) 31 that sucks and a support unit 38 that moves and supports the suction nozzle (suction unit) 31, and a processor 802. The electronic component conveying device 10 has a lower pressure than the atmospheric pressure, the IC device 90 by suction (electronic components), the suction force F ₃ adsorbing suction nozzle (suction part) 31 on the IC device 90 (electronic component) And a sensor 74 that detects the flow rate or pressure of the suction channel (first channel) 43.

  The suction nozzle (suction part) 31 sucks the IC device 90 (electronic component), and the suction part (suction part) 31 is different from the first position in the state where the support part 38 is brought into contact with the electronic component mounting part 26. The flow path (first flow path) 43 moves to either the energizing flow path (second flow path) 44 having a pressure higher than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure. To do. The processor 802 detects either the first position or the second position based on the flow rate or pressure of the suction flow path (first flow path) 43, and when the second position is detected, the electronic component placement unit 26 is detected. It can be determined that a plurality of IC devices 90 (electronic components) are placed on top of each other.

  By the way, for example, as shown in FIGS. 6 and 7, when the IC device 90 remains in the inspection unit 16, the IC device 90 to be inspected next is placed on the IC device 90 in an overlapping manner. There is a fear. In such a state, it may be difficult to accurately inspect the IC device 90.

  Therefore, according to the present invention, as will be described later, based on the flow rate or pressure of the suction flow path 43 detected by the sensor 74, the position of the suction nozzle 31 relative to the support portion 38, that is, the suction nozzle 31 is the first position. Or in the second position can be detected. When it is detected that the suction nozzle 31 is in the second position, it can be determined that a plurality of IC devices 90 are placed on the inspection unit 16 in an overlapping manner. Thereby, for example, the operator can eliminate the state in which the IC devices 90 are overlapped, so that the IC device 90 can be accurately inspected.

  As shown in FIG. 2, in the present embodiment, the electronic component placement unit 26 is applied to the inspection unit 16. However, the present invention is not limited to this. The adjustment unit 12, the device supply unit 14, the device collection unit 18, the collection tray 19, or the tray 200 may be applied.

As shown in FIG. 2, the electronic component inspection apparatus 1 of the present invention is a test system that includes an electronic component transport apparatus 10 and further includes an inspection unit 16 that inspects electronic components. That is, the electronic component inspection apparatus 1 of the present invention includes an electronic component placement unit 26 on which an IC device 90 that is an electronic component is placed, and an inspection unit 16 that inspects the IC device 90 (electronic component). A suction nozzle (suction part) 31 that transports the IC device 90 (electronic component) to the inspection unit 16 and sucks the IC device 90 (electronic part); a support part 38 that moves and supports the suction nozzle (suction part) 31; The electronic component inspection apparatus 1 includes a transport unit 25 having The electronic component testing apparatus 1 has a lower pressure than the atmospheric pressure, the IC device 90 by suction (electronic components), the suction force F ₃ adsorbing suction nozzle (suction part) 31 on the IC device 90 (electronic component) The position of the suction nozzle (adsorption part) 31 with respect to the support part 38 and the sensor 74 that detects the flow rate or pressure of the suction flow path (first flow path) 43, and the suction flow path (first flow path) 43. And a control unit 800 (see FIG. 2) having a function as a detection unit for detection. The suction nozzle (suction part) 31 sucks the IC device 90 (electronic component), and the suction part (suction part) 31 is different from the first position in the state where the support part 38 is brought into contact with the electronic component mounting part 26. The flow path (first flow path) 43 moves to either the energizing flow path (second flow path) 44 having a pressure higher than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure. To do. The control unit 800 (detection unit) can detect either the first position or the second position based on the flow rate or pressure of the suction channel (first channel) 43.

  Thereby, the electronic component inspection apparatus 1 which has the advantage of the electronic component conveying apparatus 10 mentioned above is obtained. Further, the IC device 90 can be transported to the inspection unit 16, and thus the inspection of the IC device 90 can be performed by the inspection unit 16. Further, the inspected IC device 90 can be transported from the inspection unit 16.

Hereinafter, the configuration of each unit will be described in detail.
As shown in FIGS. 1 and 2, an electronic component inspection apparatus 1 having an electronic component transport apparatus 10 transports an electronic component such as an IC device that is, for example, a BGA (Ball Grid Array) package, and the electronic component in the transport process. It is a device for inspecting and testing (hereinafter simply referred to as “inspection”) the electrical characteristics of In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be described as a representative, and this will be referred to as “IC device 90”. In this embodiment, the IC device 90 has a flat plate shape. A plurality of hemispherical terminals 901 are disposed on the lower surface of the IC device 90 (see, for example, FIG. 4).

  In addition to the above-mentioned IC devices, for example, “LSI (Large Scale Integration)”, “CMOS (Complementary MOS)”, “CCD (Charge Coupled Device)”, or “modules” in which a plurality of IC devices are packaged IC "," quartz device "," pressure sensor "," inertial sensor (acceleration sensor) "," gyro sensor "," fingerprint sensor ", and the like.

The electronic component inspection apparatus 1 (electronic component transport apparatus 10) includes a tray supply area A1, a device supply area A2, an inspection area A3, a device collection area A4, and a tray removal area A5. As will be described later, each wall is divided. Then, the IC device 90 passes through the respective areas in the direction of the arrow α ₉₀ from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the electronic component inspection apparatus 1 includes the electronic component transport apparatus 10 having the transport unit 25 that transports the IC device 90 so as to pass through each region, the inspection unit 16 that performs inspection in the inspection region A3, and the industrial use. It is provided with a control unit 800 constituted by a computer. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 is the front side, and the inspection area A3 is arranged, that is, in FIG. The upper side is used as the back side.

  In addition, the electronic component inspection apparatus 1 is used by mounting in advance a so-called “change kit” that is exchanged for each type of IC device 90. This change kit includes, for example, a temperature adjustment unit 12, a device supply unit 14, and a device collection unit 18. In addition to such a change kit, what is exchanged for each type of IC device 90 includes, for example, a tray 200 prepared by a user, a collection tray 19, and an inspection unit 16.

  The tray supply area A1 is a material supply unit to which a tray 200 in which a plurality of untested IC devices 90 are arranged is supplied. The tray supply area A1 can also be said to be a mounting area in which a plurality of trays 200 can be stacked and mounted. In the present embodiment, each tray 200 has a plurality of recesses (pockets) arranged in a matrix. One IC device 90 can be stored and placed in each recess.

The device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 conveyed from the tray supply area A1 are respectively conveyed and supplied to the inspection area A3. Note that a tray transport mechanism 11A and a tray transport mechanism 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the device supply area A2. The tray transport mechanism 11A is a part of the transport unit 25, and moves the tray 200 together with the IC device 90 placed on the tray 200 in the positive direction in the Y direction, that is, in the direction of the arrow _{α11A in} FIG. be able to. As a result, the IC device 90 can be stably fed into the device supply area A2. Further, the tray transport mechanism 11B can move the empty tray 200 in the negative direction in the Y direction, that is, in the direction of the arrow _{α11B in} FIG. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

  In the device supply area A2, a temperature adjustment unit (soak plate (English notation: soak plate, Chinese notation (example): soaking plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. Yes. Further, a device supply unit 14 that moves so as to straddle the device supply area A2 and the inspection area A3 is also provided.

  The temperature adjustment unit 12 is referred to as a “soak plate” on which a plurality of IC devices 90 are mounted, and the mounted IC devices 90 can be heated or cooled collectively. With this soak plate, the IC device 90 before being inspected by the inspection unit 16 can be heated or cooled in advance and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection).

The temperature adjusting unit 12 as such a mounting unit is fixed. As a result, the temperature of the IC device 90 on the temperature adjustment unit 12 can be adjusted stably.
Further, the temperature adjusting unit 12 is grounded (grounded).

  In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any one of the temperature adjustment units 12.

The device transport head 13 holds the IC device 90, and is supported so as to be movable in the X direction and the Y direction within the device supply region A2, and further supported so as to be movable in the Z direction. The device transport head 13 is also a part of the transport unit 25, and transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, the temperature adjustment unit 12, and a device described later. The IC device 90 can be transported to and from the supply unit 14. In FIG. 2, the movement of the device transport head 13 in the X direction is indicated by an arrow α _13X , and the movement of the device transport head 13 in the Y direction is indicated by an arrow α _13Y .

  The device supply unit 14 is mounted with the IC device 90 temperature-adjusted by the temperature adjustment unit 12 and can transport the IC device 90 to the vicinity of the inspection unit 16 or simply “supply shuttle”. It is called. The device supply unit 14 can also be a part of the transport unit 25. The device supply unit 14 has a recess (pocket) in which the IC device 90 is stored and placed.

The device supply unit 14, while the X direction and the inspection area A3 and the device supply area A2, i.e., are supported by a reciprocally movable (movable) in the arrow alpha ₁₄ direction. As a result, the device supply unit 14 can stably transport the IC device 90 from the device supply region A2 to the vicinity of the inspection unit 16 in the inspection region A3, and the IC device 90 can be transferred to the device transport head 17 in the inspection region A3. After being removed, the device supply area A2 can be returned again.

  In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction. The device supply unit 14 on the Y direction negative side is referred to as “device supply unit 14A”, and the device supply unit on the Y direction positive side. 14 may be referred to as “device supply unit 14B”. Then, the IC device 90 on the temperature adjustment unit 12 is transported to the device supply unit 14A or the device supply unit 14B in the device supply region A2. Further, like the temperature adjustment unit 12, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14. As a result, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be transported to the vicinity of the inspection unit 16 in the inspection region A3 while maintaining the temperature adjustment state. The device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

Tray transporting mechanism 15, the positive side of the X direction empty tray 200 in a state where all of the IC devices 90 is removed in the device supply area A2, i.e., a mechanism for conveying the arrow alpha ₁₅ direction. After this transport, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 for inspecting the IC device 90 and a device transport head 17 are provided.

  The device transport head 17 is a part of the transport unit 25 and is configured to be able to heat or cool the gripped IC device 90 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 in which the temperature adjustment state is maintained can be gripped, and the IC device 90 can be transported in the inspection area A3 while maintaining the temperature adjustment state.

  Such a device transport head 17 is supported so as to be able to reciprocate in the Y direction and the Z direction within the inspection area A3, and is a part of a mechanism called an “index arm”. Accordingly, the device transport head 17 can lift the IC device 90 from the device supply unit 14 carried in from the device supply region A2, transport the IC device 90 on the inspection unit 16, and place the device.

In FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α _17Y . The device transport head 17 is responsible for transporting the IC device 90 from the device supply unit 14A to the inspection unit 16 and transporting the IC device 90 from the device supply unit 14B to the inspection unit 16 in the inspection area A3. Can do. The device transport head 17 is supported so as to be reciprocally movable in the Y direction, but is not limited thereto, and may be supported so as to be reciprocally movable in the X direction.

  In the present embodiment, two device transport heads 17 are arranged in the Y direction (see FIG. 2). Hereinafter, the device transport head 17 on the Y direction negative side may be referred to as “device transport head 17A”, and the device transport head 17 on the Y direction positive side may be referred to as “device transport head 17B”. The device transport head 17A can take charge of transporting the IC device 90 from the device supply unit 14A to the test unit 16 in the inspection area A3, and the device transport head 17B is a device of the IC device 90 in the test area A3. Transport from the supply unit 14B to the inspection unit 16 can be performed. Further, the device transport head 17A can carry the transport from the inspection unit 16 to the device collection unit 18A of the IC device 90 in the inspection area A3, and the device transport head 17B can be transported in the inspection area A3. To the device collection unit 18B.

  The inspection unit 16 can place an IC device 90 that is an electronic component and inspect the electrical characteristics of the IC device 90. The inspection section 16 is provided with a plurality of probe pins 163 that are electrically connected to the terminals 901 of the IC device 90 (see, for example, FIG. 4). Then, when the terminal 901 of the IC device 90 and the probe pin 163 are electrically connected, that is, contacted, the IC device 90 can be inspected. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. Note that, similarly to the temperature adjustment unit 12, the inspection unit 16 can also heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for the inspection.

  The device collection area A4 is an area in which a plurality of IC devices 90 that have been inspected in the inspection area A3 and completed the inspection are collected. In the device recovery area A4, a recovery tray 19, a device transport head 20, and a tray transport mechanism 21 are provided. In addition, a device collection unit 18 that moves across the inspection area A3 and the device collection area A4 is also provided. An empty tray 200 is also prepared in the device collection area A4.

  The device collection unit 18 is called a “collection shuttle plate” or simply a “collection shuttle” on which the IC device 90 that has been inspected by the inspection unit 16 is placed and transports the IC device 90 to the device collection area A4. The device collection unit 18 can also be a part of the transport unit 25.

The device collecting unit 18, between the examination region A3 and the device collection area A4 X-direction, i.e., are reciprocally movably supported along the arrow alpha ₁₈ direction. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the device collection unit 18 on the Y direction negative side is referred to as “device collection unit 18 </ b> A”. In other words, the device collection unit 18 on the Y direction positive side may be referred to as a “device collection unit 18B”. Then, the IC device 90 on the inspection unit 16 is transported to and placed on the device collection unit 18A or the device collection unit 18B. The device transport head 17 is responsible for transporting the IC device 90 from the inspection unit 16 to the device recovery unit 18A and transporting the IC device 90 from the test unit 16 to the device recovery unit 18B within the inspection area A3. Can do. The device collection unit 18 is also grounded, like the temperature adjustment unit 12 and the device supply unit 14.

  The collection tray 19 is mounted so that the IC device 90 inspected by the inspection unit 16 is placed and does not move in the device collection area A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the device collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. It becomes. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

  Three empty trays 200 are also arranged along the X direction. The empty tray 200 is also loaded with the IC device 90 inspected by the inspection unit 16. Then, the IC device 90 on the device recovery unit 18 that has moved to the device recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

The device transport head 20 is supported so as to be movable in the X direction and the Y direction within the device collection area A4, and further has a portion that is also movable in the Z direction. The device transport head 20 is a part of the transport unit 25, and can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In FIG. 2, the movement of the device conveyance head 20 in the X direction is indicated by an arrow α _20X , and the movement of the device conveyance head 20 in the Y direction is indicated by an arrow α _20Y .

Tray transfer mechanism 21, X-direction empty tray 200 is conveyed from the tray removal area A5 in the device collection region within A4, i.e., a mechanism for conveying the arrow alpha ₂₁ direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

Further, a tray transport mechanism 22A and a tray transport mechanism 22B that transport the trays 200 one by one in the Y direction are provided so as to straddle the device collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a part of the transport unit 25, and can reciprocate the tray 200 in the Y direction, that is, the arrow α _22A direction. Thereby, the inspected IC device 90 can be transported from the device collection area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 in the positive direction in the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device collection area A4.

  For example, the control unit 800 includes a tray transport mechanism 11A, a tray transport mechanism 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport. The operation of each part of the head 17, the device recovery unit 18, the device transport head 20, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B can be controlled. In the present embodiment, for example, the control unit 800 includes at least one processor 802 (at least one processor) and at least one memory 803 (see FIG. 2). The processor 802 can read various information (for example, a determination program, an instruction / command program, etc.) stored in the memory 803 and execute a determination or a command (command).

  The control unit 800 may be built in the electronic component inspection apparatus 1 (electronic component transport apparatus 10) or may be provided in an external device such as an external computer. The external device may be, for example, communicated with the electronic component inspection apparatus 1 via a cable, wirelessly connected, or connected to the electronic component inspection apparatus 1 via a network (for example, the Internet). is there.

  The operator can set or confirm the operating conditions of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the electronic component inspection apparatus 1. As shown in FIG. 1, a mouse table 600 on which a mouse is placed is provided on the right side of the tray removal area A5 in the drawing. This mouse is used when operating the screen displayed on the monitor 300.

  In addition, an operation panel 700 is arranged on the lower right side of FIG. The operation panel 700 instructs the electronic component inspection apparatus 1 to perform a desired operation separately from the monitor 300.

  Further, the signal lamp 400 can notify the operating state of the electronic component inspection apparatus 1 and the like by a combination of colors that emit light. The signal lamp 400 is disposed on the electronic component inspection apparatus 1. Note that the electronic component inspection apparatus 1 has a built-in speaker 500, and the operational state of the electronic component inspection apparatus 1 can also be notified by the speaker 500.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the device supply area A2 are separated by a first partition 231 and the device supply area A2 and the inspection area A3 are separated by a second partition 232. The inspection area A3 and the device collection area A4 are separated by a third partition wall 233, and the device collection area A4 and the tray removal area A5 are separated by a fourth partition wall 234. The device supply area A2 and the device collection area A4 are also partitioned by the fifth partition wall 235.

  The outermost exterior of the electronic component inspection apparatus 1 is covered with a cover. Examples of the cover include a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

  As described above, in the inspection area A3, the inspection unit 16 on which the IC device 90 can be mounted and inspected is disposed. For example, as shown in FIGS. 6 and 7, when the IC device 90 remains in the inspection unit 16 (hereinafter, this IC device 90 is referred to as “residual device 90 </ b> A”), the inspection unit 16 performs the inspection. There is a possibility that the next IC device 90 (hereinafter, this IC device 90 is referred to as “untested device 90B”) may be placed on the remaining device 90A. In such a state, it may be difficult to accurately inspect the uninspected device 90B.

  Therefore, the electronic component inspection apparatus 1 has a configuration that can eliminate such a phenomenon. Hereinafter, this configuration and operation will be described.

  As described above, the device transport head 17 is supported so as to be movable in the Y direction and the Z direction. The device transport head 17 transports the IC device 90 in the inspection area A3. As shown in FIG. 3, the device transport head 17 includes a suction unit 3, a posture adjustment unit 5, and a heat insulation unit 6.

  The suction unit 3 is a suction unit configured to be able to grip an IC device 90 that is an electronic component by suction (suction). The suction unit 3 includes a suction nozzle (suction unit) 31, a first block 32, a second block 33, and a third block 34. The number of the suction units 3 is one in the illustrated configuration, but is not limited to this and may be plural.

The ejector 72 that is a vacuum generation source applies a suction force F ₃ to the suction unit 3. A negative pressure is generated by the operation of the ejector 72, and the pressure is appropriately adjusted by a regulator 73 that is a pressure adjusting mechanism, and the lumen portion 324 and the lumen portion 324 of the first block 32 are connected via the pipe 71 and the joint 36. A negative pressure is generated in the lumen 333 of the second block 33 communicating with. The ejector 72 may be an in-facility piping (vacuum line) of a facility where a vacuum pump or an electronic component inspection apparatus is installed.

The suction nozzle 31 is capable of sucking the IC device 90 and is formed of a cylindrical member having a lumen portion 313 that opens to the upper surface 311 and the lower surface 312. The lumen part 313 functions as a flow path through which air passes. Then, the lumen portion 324 and the lumen portion 333 become negative pressure, and the lumen portion 313 communicating with the lumen portion 324 becomes negative pressure, that is, the air flows upward in the lumen portion 313, so that the lower surface A suction force F ₃ is generated at the opening (suction port) 314 of 312. Thus, the IC device 90 can be sucked using the lower surface 312 as the suction surface (see, for example, FIG. 4). In addition, air flows into the lumen 313 and the pressure increases, that is, the air flows downward in the lumen 313 or the upward flow of air stops, so that the suction force is increased. F ₃ decreases and eventually disappears, and the IC device 90 can be released (released) from the lower surface 312.

The maximum value of the suction force _{F 3} (maximum suction force in the suction section 3) is not particularly limited, for example, more than -95KPa, but preferably not more than -30 kPa, -90 kPa or more, or less -50kPa Is more preferable. Further configured to changeable suction force F ₃ of the suction unit 3 by the pressure setting of the regulator 73. For example, an electropneumatic regulator is preferably used as the regulator 73. Thus, the suction force F ₃ to change steplessly (adjust) can. With such a suction force F ₃ , the degree of vacuum in the region sealed by the packing 35 (for example, an O-ring in the present embodiment) mounted on the upper portion of the suction nozzle 31 can be adjusted. In the present embodiment, the vacuum degree of the suction nozzle 31 is assumed to be constant. Further, the packing 35 may be omitted, for example, a metal seal.

  A flange portion 315 whose outer diameter is enlarged is formed on the outer peripheral portion of the suction nozzle 31 so as to protrude in the middle of the longitudinal direction. The flange portion 315 can contact the third block 34 and prevent the suction nozzle 31 from falling off the suction portion 3 (see FIG. 3). A ring-shaped packing 317 is provided on the outer peripheral portion of the flange portion 315 between the inner peripheral portion of the concave portion 343 of the third block 34. Thereby, the pressure in the recessed part 343 can be maintained. Further, the packing 317 may be omitted and, for example, a metal seal may be used.

  A first block 32 is disposed above the suction nozzle 31. The first block 32 is composed of a block-shaped (or plate-shaped) member having a flat upper surface 321 and a lower surface 322. The first block 32 has a lumen 324 that opens to the upper surface 321 and the lower surface 322. This lumen portion 324 functions as a flow path through which air passes, like the lumen portion 313 of the suction nozzle 31.

  A joint 36 is airtightly connected to the lumen 324 from the upper surface 321 side. The joint 36 is connected to the ejector 72 via a pipe 71. A regulator 73 is disposed in the middle of the pipe 71, that is, between the joint 36 and the ejector 72.

  In addition, the first block 32 may include, for example, a heater (not shown) that heats the IC device 90 sucked by the suction nozzle 31.

  A second block 33 is disposed below the first block 32. The second block 33 is composed of a block-like (or plate-like) member having a flat upper surface 331 and a lower surface 332, and the upper surface 331 is in contact with the lower surface 322 of the first block 32.

  The second block 33 has a lumen portion 333 that opens to an upper surface 331 and a lower surface 332. A portion above the flange portion 315 of the suction nozzle 31 is inserted into the lumen portion 333. Thereby, the suction nozzle 31 can move in the Z direction.

The lumen portion 333 also functions as a flow path through which air passes, and the lumen portion 313 of the suction nozzle 31 and the lumen portion 324 of the first block 32 communicate with each other through the lumen portion 333. Thereby, a series of flow paths through which air passes are formed. Then, this series of flow paths, the ejector 72, the regulator 73, by sucking the IC device 90, the suction channel 43 for imparting a suction force _{F 3} to adsorb IC device 90 to the suction nozzle 31.

  As shown in FIG. 3, the lumen portion 333 has an enlarged diameter portion 334 whose inner diameter is enlarged from the middle in the vertical direction. The packing 35 of the suction nozzle 31 is in contact with the inner peripheral portion of the lumen portion 333 in the state shown in FIGS. 4 to 6, but is separated from the inner peripheral portion of the enlarged diameter portion 334 in the state shown in FIG. 7. A gap is formed. In addition, although the internal diameter of the enlarged diameter part 334 is constant along an up-down direction, it is not limited to this, For example, you may increase gradually toward upper direction.

  A sensor 74 that detects the pressure in the suction flow path 43 is disposed between the joint 36 and the regulator 73. The sensor 74 includes, for example, a diaphragm and a semiconductor strain gauge provided on the surface of the diaphragm, and changes in electrical resistance due to a piezoresistance effect generated by the diaphragm being deformed by an external force (pressure). Can be used to convert the signal into an electric signal. Further, in the present embodiment, the sensor 74 that detects the pressure of the suction flow path 43 is used as the sensor 74, but the sensor 74 is not limited to this, and a sensor that detects the flow rate of the suction flow path 43 may be used. In the case where the sensor 74 detects the flow rate of the suction flow path 43, as the sensor 74, for example, a mass flow rate type such as a thermal type, a Coriolis type, a Karman vortex type or a volume flow rate type is used. be able to.

  On the upper surface 331 side of the second block 33, a ring-shaped packing 37 disposed concentrically with the lumen portion 333 is disposed outside the lumen portion 333. As a result, the packing 37 is compressed between the first block 32 and the second block 33, and together with the packing 35, the airtightness of the series of flow paths can be maintained.

  Further, the second block 33 has a crank-shaped lumen 336 in the present embodiment at a position different from the lumen 333. The joint 41 is hermetically connected to the lumen portion 336 via the lumen portion 325 of the first block 32. The joint 41 is connected to the working fluid supply unit 85 via the pipe 8 (pipe 81).

  The working fluid supply unit 85 supplies the working fluid R (for example, air) to the inside of the posture adjustment unit 5 and the recess 343 of the third block 34. By providing a common working fluid supply unit 85 for the inside of the posture adjustment unit 5 and the recess 343 of the third block 34, the apparatus configuration can be simplified. In addition, since the working fluid R can enter and exit from the inside of the posture adjustment unit 5 and the recess 343 of the third block 34, the piston 512 can slide in the cylinder 511, as will be described later. The suction nozzle 31 can slide in the support portion 38.

  Here, the pressure of the working fluid R supplied to the inside of the posture adjustment unit 5 and the recess 343 of the third block 34 is the same pressure in the present embodiment, but may be different. The working fluid supply unit 85 can perform suction (recovery of the working fluid R) in addition to supplying the working fluid.

  In addition, by supplying the working fluid R to the concave portion 343 of the third block 34, the suction nozzle 31 can be urged downward. As described above, in the present embodiment, the device transport head 17 includes the biasing channel 44 that applies the biasing force of the working fluid R (air) to the suction nozzle 31 (suction portion) as the second channel. It has become. In the present embodiment, the energizing flow path 44 includes, in addition to the working fluid supply unit 85, a regulator 84, a tank 83, a first block lumen 325, and a second block lumen 336. , And a recess 343 of the third block 34. The urging force of the urging flow path 44 can press the IC device 90 sucked by the suction nozzle 31 against the inspection unit 16 as shown in FIG. Each probe pin 163 can be contacted without excess or deficiency. As a result, an accurate inspection of the IC device 90 can be performed. Further, the suction nozzle 31 can be brought into intimate contact with the IC device 90, so that the pressure in the suction flow path 43 is prevented from rising, and the IC device 90 can be sufficiently adsorbed to the suction nozzle 31.

  On the upper surface 331 side of the second block 33, a ring-shaped packing 39 is disposed outside the lumen portion 336 and concentrically with the lumen portion 336. Thereby, the packing 39 is compressed between the first block 32 and the second block 33, and the airtightness of the urging flow path 44 can be maintained.

  A third block 34 is disposed below the second block 33. The third block 34 is configured by a block-shaped (or plate-shaped) member having a flat upper surface 341 and a lower surface 342, and the upper surface 341 is in contact with the lower surface 332 of the second block 33.

  On the upper surface 341 side of the third block 34, a recess 343 that is open to the upper surface 341 and is larger than the flange portion 315 of the suction nozzle 31 in a plan view is formed. Within the recess 343, the flange portion 315 can move in the Z direction. As shown in FIG. 3, when the flange portion 315 is in contact with the bottom portion of the recess 343, the movement limit at the lower position of the suction nozzle 31 is restricted, thereby preventing the suction nozzle 31 from falling off. be able to. On the contrary, when the flange portion 315 is in contact with the lower surface 332 of the second block 33, the movement limit at the upper position of the suction nozzle 31 is restricted. In addition, the movable range in which the suction nozzle 31 is movable is sufficiently secured so as to correspond to the thickness of various IC devices 90.

  Thus, in this embodiment, the 2nd block 33 and the 3rd block 34 are the support parts 38 which support the adsorption nozzle 31 so that a movement to a Z direction is possible.

  A through hole 344 that penetrates to the lower surface 342 is formed at the bottom of the recess 343. Regardless of the position of the suction nozzle 31, a portion below the flange portion 315 can protrude from the through hole 344.

  A rotation stopper 346 that restricts rotation of the suction nozzle 31 around the central axis is provided inside the recess 343. When the flange portion 315 of the suction nozzle 31 is engaged with the rotation stopper 346, the rotation of the suction nozzle 31 around the central axis is restricted. Thereby, the IC device 90 is maintained in the posture around the central axis of the suction nozzle 31 in a state of being sucked by the suction nozzle 31, and is thus stably stored in the recess 165 of the inspection unit 16, for example.

  In the third block 34, a guide hole 345 penetrating from the upper surface 341 to the lower surface 342 is formed. In the present embodiment, two guide holes 345 are formed. A guide pin 164 of the inspection unit 16 is inserted into each guide hole 345. Thereby, when the suction nozzle 31 (suction unit 3) presses the IC device 90 against the inspection unit 16, the IC device 90 and the inspection unit 16 are positioned. By this positioning, each terminal 901 of the IC device 90 and each probe pin 163 of the inspection unit 16 can come into contact with each other.

  An attitude adjustment unit 5 is disposed above the suction unit 3. The posture adjustment unit 5 is called a “compliance unit” that adjusts the posture of the suction unit 3 in the state shown in FIGS. 5 and 7. As shown in FIG. 3, the posture adjustment unit 5 includes a first adjustment mechanism 51 and a second adjustment mechanism 52.

  The first adjustment mechanism 51 is responsible for posture adjustment around the X axis of the suction unit 3 and posture adjustment around the Y axis of the suction unit 3 in the posture adjustment of the suction unit 3.

  The first adjustment mechanism 51 includes a cylinder 511 and a piston 512 that can slide in the Z direction with respect to the cylinder 511. The cylinder 511 has a lumen portion 513 inside. A piston 512 is inserted inside the lumen portion 513. The piston 512 includes a flange portion 514 and a piston rod 515 that connects the flange portion 514 and the second adjustment mechanism 52. Moreover, it is preferable that the outer peripheral part of the flange part 514 is rounded. Thereby, the posture of the piston 512 can be changed so that the rounded outer peripheral portion is inclined with respect to the central axis of the piston 512. Therefore, the piston 512 can change its posture so as to follow the direction of the surface of the contact portion 162 of the inspection portion 16.

  As shown in FIG. 3, the cylinder 511 is provided with a through hole 516 that penetrates the inner peripheral portion and the outer peripheral portion. A joint 42 is airtightly connected to the through hole 516 from the outside. The joint 42 is connected to the working fluid supply unit 85 via the pipe 8 (pipe 82).

  The pipe 8 is configured to branch into the pipe 81 and the pipe 82 from the middle. Further, a tank 83 and a regulator 84 are provided between the branch point 86 and the working fluid supply unit 85 of the pipe 8. The regulator 84 is disposed closer to the working fluid supply unit 85 than the tank 83. The regulator 84 can have the same configuration as the regulator 73.

  The tank 83 can store the working fluid R supplied from the working fluid supply unit 85 inside and functions as a reservoir tank or a buffer tank for the working fluid R. In addition, the tank 83 communicates with the inside of the cylinder 511 through the pipe 81. Thereby, even if the pressure in the cylinder 511 fluctuates due to the movement of the suction nozzle 31, the fluctuation can be mitigated. As a result, the suction nozzle 31 can stably press the IC device 90. As described above, the tank 83 functions as a relaxation portion that reduces the fluctuation of the pressure in the cylinder 511.

  A second adjustment mechanism 52 is disposed below the first adjustment mechanism 51. The second adjustment mechanism 52 has two plate members 521 stacked in the Z direction. These two plate members 521 can relatively move in the XY plane direction. As a result, the second adjustment mechanism 52 adjusts the posture adjustment of the suction portion 3 in the X direction, the posture adjustment of the suction portion 3 in the Y direction, and the posture of the suction portion 3 around the Z axis. Can be responsible for coordination.

  Further, the posture adjusting unit 5 is connected to a mechanism (not shown) that supports the entire device transport head 17 so as to be reciprocally movable in the Y direction and the Z direction via a connecting unit 171.

  A heat insulating part 6 is arranged between the suction part 3 and the posture adjusting part 5. The heat insulating unit 6 can prevent or suppress the heat from the heater built in the first block 32 from being transmitted to the posture adjusting unit 5. As a result, the posture adjustment unit 5 is prevented from malfunctioning due to the heat, and thus operates normally, that is, the posture of the suction unit 3 can be accurately adjusted.

  In this embodiment, the heat insulation part 6 is comprised with the some heat insulation member 61 which makes a column shape. Each of the heat insulating members 61 has a relatively small thermal conductivity, and a plurality of the heat insulating members 61 are spaced apart from each other. In addition, it does not specifically limit as a constituent material of the heat insulation member 61, For example, various heat insulating materials, such as a glass epoxy resin, can be used. The first block 32 and the plate member 521 are connected by a heat insulating member 61 that is spaced apart from each other, and since there is a gap between the heat insulating members 61, heat conduction between the first block 32 and the plate member 521 is suppressed. The

  As described above, the inspection unit 16 is disposed in the inspection region A3. The inspection unit 16 is an electronic component placement unit on which the IC device 90 that is an electronic component is placed, and is a socket that inspects the IC device 90 in the placed state. As shown in FIGS. 4 to 7, the inspection unit 16 includes an inspection unit main body 161, a contact portion 162, a probe pin 163, and a guide pin 164.

  The inspection unit main body 161 is formed with a recessed portion (pocket) 165 in which the IC device 90 is placed and stored. In addition, although the formation number of the recessed part 165 is one in the structure shown in FIGS. 4-7, it is not limited to this, Plural may be sufficient.

  The same number of probe pins 163 as the terminals 901 of the IC device 90 protrude from the bottom of the recess 165.

  The inspection unit 16 preferably includes an electronic component urging unit that urges the IC device 90 placed on the inspection unit 16 upward. For example, the electronic component urging portion can be constituted by a coil spring built in each probe pin 163. Thereby, coupled with the pressure from the suction unit 3 side against the IC device 90, each terminal 901 of the IC device 90 and each probe pin 163 can be sufficiently brought into contact with each other. Therefore, it is possible to accurately inspect the IC device 90.

  As described above, the inspection unit 16 has the contact part 162. The abutting portion 162 is configured by a plate-like member, and is placed on the inspection portion main body 161 so as to overlap. Thereby, as shown in FIG. 5 and FIG. 7, the abutting portion 162 can abut on the lower surface 342 of the third block 34 of the suction portion 3 included in the device transport head 17. Further, the device transport head 17 has a posture adjustment unit 5 that can adjust the posture of the suction unit 3. Here, it is assumed that the entire inspection unit 16 is inclined by 1 degree with respect to the XY plane (horizontal plane), for example. Even in such a case, in a state where the suction part 3 and the contact part 162 are in contact with each other, the posture adjustment part 5 can make the suction part 3 have the same inclined posture as that of the inspection part 16. Such posture adjustment of the suction unit 3 contributes to contact between each terminal 901 of the IC device 90 and each probe pin 163.

  The guide pins 164 are disposed in the inspection unit main body 161 corresponding to the respective guide holes 345 of the suction unit 3. Each guide pin 164 is fixed to the inspection unit main body 161 and protrudes upward. As described above, the guide pin 164 is inserted into the guide hole 345 of the suction unit 3, whereby the IC device 90 and the inspection unit 16 are positioned. Thereby, each terminal 901 of the IC device 90 and each probe pin 163 of the test | inspection part 16 can contact.

  In the device transport head 17, the suction nozzle 31 sucks the IC device 90 and the inspection unit 16 is in contact with the support unit 38. It depends on whether or not it remains. In this case, the suction nozzle 31 moves to either the first position (see FIG. 5) or the second position (see FIG. 7).

  As shown in FIG. 4, the device transport head 17 is in a state where the suction nozzle 31 sucks the uninspected device 90B. At this time, the packing 35 of the suction nozzle 31 does not reach the diameter-enlarged portion 334 of the lumen portion 333 but is in close contact with the inner peripheral portion below the diameter-enlarged portion 334. Thereby, the suction flow path 43 and the biasing flow path 44 are in a state of being blocked from each other. The inspection unit 16 is empty because the residual device 90 </ b> A does not remain in the recess 165.

  When the device transport head 17 is lowered from the state shown in FIG. 4, the state shown in FIG. 5 is obtained. In the state shown in FIG. 5, the suction nozzle 31 is still sucking the IC device 90, and the support portion 38 is in contact with the inspection portion 16. At this time, the uninspected device 90B is pressed against the probe pin 163 of the inspection unit 16, and each terminal 901 is electrically connected to each probe pin 163. As a result, the uninspected device 90B can be inspected. Further, the suction nozzle 31 moves upward in response to a reaction force from the probe pin 163 of the inspection unit 16 via the uninspected device 90B. This destination position is the first position. In this first position, the packing 35 of the suction nozzle 31 does not reach the diameter-enlarged part 334 of the lumen part 333 but is in close contact with the inner peripheral part below the diameter-enlarged part 334. As a result, the suction channel 43 and the urging channel 44 remain blocked from each other. Therefore, the pressure in the suction flow path 43 detected by the sensor 74 is hardly changed compared to the state shown in FIG.

  On the other hand, in the state shown in FIG. 6, as in FIG. 4, the device transport head 17 is in a state where the suction nozzle 31 sucks the uninspected device 90B. At this time, the packing 35 of the suction nozzle 31 does not reach the diameter-enlarged portion 334 of the lumen portion 333 but is in close contact with the inner peripheral portion below the diameter-enlarged portion 334. Thereby, the suction flow path 43 and the biasing flow path 44 are in a state of being blocked from each other. In the inspection unit 16, the residual device 90A remains in the recess 165.

  When the device transport head 17 is lowered from the state shown in FIG. 6, the state shown in FIG. 7 is obtained. In the state shown in FIG. 7, the suction nozzle 31 still sucks the IC device 90, and the support portion 38 is in contact with the inspection portion 16. At this time, the uninspected device 90B overlaps the residual device 90A. As a result, the suction nozzle 31 is pushed up together with the uninspected device 90B and moves upward. This destination position is the second position. The second position is a position higher than the first position by the thickness of the residual device 90A. In this second position, the packing 35 of the suction nozzle 31 enters the enlarged diameter portion 334 of the lumen portion 333 and is separated from the inner peripheral portion of the enlarged diameter portion 334. As a result, the suction flow path 43 (first flow path) and the energization flow path 44 (second flow path) are located on the outer peripheral portion of the suction nozzle 31 and the inner diameter portion 334 below the lumen portion 333. It communicates with the periphery (gap 40). The clearance 40 is a clearance that allows the outer periphery of the suction nozzle 31 to slide relative to the inner periphery of the support portion 38 (second block 33). By this communication, the working fluid R (air) from the energizing flow path 44 (second flow path) flows (leaks) into the suction flow path 43 (first flow path). Accordingly, the pressure in the suction flow path 43 detected by the sensor 74 increases as compared to the state shown in FIG. The enlarged diameter portion 334 can be referred to as a “leakage channel 335” that causes the working fluid R to leak from the biasing channel 44 to the suction channel 43.

  The processor 802 can detect whether the suction nozzle 31 is in the first position or the second position based on the pressure of the suction flow path 43 detected by the sensor 74. When it is detected that the suction nozzle 31 is in the second position, it can be determined that a plurality of IC devices 90 are placed on the inspection unit 16 in an overlapping manner. After this determination, for example, the operator cancels the state in which the IC devices 90 are overlapped (hereinafter referred to as “overlapping state of the IC devices 90”), and inspects the uninspected device 90B as shown in FIGS. Can be made possible.

  Further, when detecting whether the suction nozzle 31 is in the first position or the second position, for example, an optical or magnetic proximity sensor is installed in the suction nozzle 31 and the detection is performed. It is possible. However, the proximity sensor may vary in detection accuracy depending on the surrounding environment (for example, a high temperature environment). Therefore, it is not suitable for position detection like this embodiment.

  Further, in the overlapping state of the IC devices 90, the pressure of the suction flow path 43 increases, but the size of the leakage flow path 335 is set so that the suction to the untested device 90B is not released. .

  Further, even when the IC devices 90 are overlapped, the IC devices 90 are prevented from being deformed or damaged. This is because the working fluid R leaks from the energizing flow path 44, and the energizing force of the energizing flow path 44 acting on each IC device 90 is reduced.

  Further, the residual device 90A is horizontally stored in the recess 165 of the inspection unit 16, but is not limited thereto, and may be stored in an inclined manner. Also in this case, the overlapping state of the IC devices 90 can be detected.

  Further, the inner peripheral portion of the enlarged diameter portion 334 may be tapered so that the inner peripheral portion becomes wider as going upward. In this case, when pressing, the amount of leakage of the working fluid R can be gradually increased as the suction nozzle 31 moves from the first position to the second position. Therefore, even if the index arm (device transport head 17) is lowered in the overlapping state, the index arm (device transport head 17) weakens the force that pushes the untested IC device 90 and the remaining IC device 90. And damage to each IC device 90 can be prevented.

  Next, a control program that enables the inspection of the IC device 90 regardless of whether or not the IC device 90 is overlapped will be described based on the flowchart shown in FIG.

  The device transport head 17 stops on the concave portion 165 of the inspection unit 16 with the suction nozzle 31 sucking the IC device 90 (step S101). At this time, the IC device 90 is in a state of facing the recess 165.

  Next, the device transport head 17 starts to descend (step S102), and stops descending when the support portion 38 (third block 34) contacts the contact portion 162 of the inspection unit 16 (step S103). As a result, the IC device 90 is housed in the recess 165 of the inspection unit 16.

Then, the pressure in the suction channel 43 (hereinafter referred to as "pressure P") detected by the sensor 74, it is determined whether the pressure P exceeds the threshold value (hereinafter referred to as "threshold value P _0") (step S104 ). When pressure P> threshold value P ₀ , the state shown in FIG. 7, that is, the suction nozzle 31 is located at the second position, and the IC device 90 is overlapped. In contrast, if not the pressure P> threshold P _0, the state shown in FIG. 5, i.e., the suction nozzle 31 is positioned at the first position, IC device 90 is electrically connected to the inspection part 16 Thus, the IC device 90 can be inspected. Further, in the electronic component inspecting apparatus 1, the threshold P ₀ may be set arbitrarily changed.

If it is determined not to be the pressure P> threshold P ₀ at step S104, to start the test for IC device 90 (step S105), the "test complete" from the inspection controller of the tester connected to the inspecting section 16 When the signal is received, the inspection for the IC device 90 is completed (step S106).

  Next, the device transport head 17 starts to rise in a state where the suction nozzle 31 sucks the IC device 90 (step S107). When the device transport head 17 returns to the position in step S101, the device transport head 17 stops the rise (step S108). As a result, the IC device 90 is removed from the recess 165 of the inspection unit 16, that is, detached. Thereafter, the IC device 90 is classified and collected according to the inspection result.

Further, if it is determined that the pressure P> threshold _{P 0} at step S104, it is determined as "overlapped state of the IC device 90" (step S109).

  Next, the device transport head 17 starts to rise in a state where the suction nozzle 31 sucks the IC device 90 (step S110), and stops returning after returning to the position in step S101 (step S111). Thereby, the IC device 90 sucked by the suction nozzle 31 can be removed from the recess 165 of the inspection unit 16 and separated from the IC device 90 remaining in the recess 165. Further, since the device transport head 17 is stopped on the concave portion 165 of the inspection unit 16, even if the inspection is resumed, the device transport head 17 does not move to the shuttle (device supply unit 14) and only needs to be lowered. Quick inspection.

  Next, a notification of “the overlapping state of the IC devices 90” is given (step S112). For example, when the operator can confirm this notification, the operator can take a predetermined measure for eliminating the overlapping state of the IC devices 90. As a result, the IC device 90 can be inspected. This notification is preferably performed by, for example, the monitor 300, the signal lamp 400, the speaker 500, or a combination thereof.

  As described above, the device transport head 17 can move in the vertical direction as a whole, that is, move up and down. Therefore, as shown in FIGS. 4 to 7, the suction nozzle (suction part) 31 has a support part when the IC device 90 (electronic component) is placed on the inspection part 16 (electronic component placement part 26). The position of the suction nozzle 31 is detected by the processor 802 (detection unit) and the position of the suction nozzle 31 is detected by the processor 802 (detection unit). Thereby, for example, the IC device 90 in the state of being sucked by the suction nozzle 31 is stably carried into and out of the inspection unit 16.

  Further, it is preferable that the suction nozzle (suction part) 31 has a lower rising speed when the second position is detected than when the first position is detected. Since the packing 35 of the suction nozzle 31 is pushed up to the second position, that is, the position of the enlarged diameter portion 334 of the lumen portion 333, the suction force may not be sufficient. When the suction nozzle 31 rises in the overlapping state of 90, the packing 35 waits to move to a position below the enlarged diameter portion 334 due to its own weight and the biasing force applied to the suction nozzle 31. Since the uninspected IC device 90 can be reliably sucked and held, the uninspected IC device 90 is not dropped.

Second Embodiment
Hereinafter, a second embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to FIG. 9, and the description will focus on differences from the above-described embodiment, and the same matters will be described. Is omitted.
This embodiment is the same as the first embodiment except that the shape of the leakage flow path is different.

  As shown in FIG. 9, in the present embodiment, the leakage flow path 335 is formed in the inner peripheral portion of the lumen portion 333 of the second block 33 so as to open at two different locations in the vertical direction. Such a leakage flow path 335 can take a large gap (flow path), can increase the change in flow rate or pressure compared to the flow rate or pressure during vacuum, and the suction nozzle 31 can be moved to the first position. It is easier to detect whether it is in the second position. Further, for example, since the leakage flow path 335 can be designed freely, the formation range of the leakage flow path 335 can also be suppressed. In this case, the device transport head 17 can be reduced in size.

<Third Embodiment>
Hereinafter, the third embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 10 and 11. However, the differences from the above-described embodiment will be mainly described and the same matters will be described. Will not be described.
This embodiment is the same as the first embodiment except that the configuration of the suction channel is different.

  As shown in FIGS. 10 and 11, in this embodiment, a valve 45 that opens and closes the lumen portion 333 of the second block 33 is installed in the middle of the suction flow path 43. The valve 45 is formed of an elastic piece that is cantilevered on the upper surface 331 of the second block 33. The valve 45 arranged in this manner is in a closed state until the suction nozzle 31 moves to the second position (see FIG. 10), but when the suction nozzle 31 moves to the second position, the suction nozzle 31 And is opened (see FIG. 11).

  The second block 33 is formed with a relay flow path 337 communicating with the lumen portion 333. The lumen portion 333 communicates with the lumen portion 324 of the first block 32 via the relay flow path 337. The relay flow path 337 is located above the packing 35 regardless of the position of the suction nozzle 31.

  As shown in FIG. 11, when the suction nozzle 31 is moved to the second position, the valve 45 is opened as described above. At this time, the air G flows into the suction channel 43 (first channel) from the outside (outside the suction channel 43) through the gap 40 (third channel) that is equal to the atmospheric pressure. Due to the inflow of the air G, the pressure of the suction flow path 43 detected by the sensor 74 increases as compared with the state shown in FIG.

  In the electronic component inspection apparatus 1 (device transport head 17) having such a configuration, even if the IC device 90 is relatively thin (for example, the thickness is 0.1 mm or more and 0.4 mm or less), The overlapping state can be accurately detected.

<Fourth embodiment>
Hereinafter, the fourth embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 12 and 13, but the differences from the above-described embodiment will be mainly described and similar matters will be described. Will not be described.

  This embodiment is the same as the first embodiment except that a sensor for detecting the flow rate or pressure of the energizing flow path is installed.

In the present embodiment, the electronic component transport apparatus 10 transports the IC device 90 (electronic component) to the electronic component placement unit 26 on which the IC device 90 that is an electronic component is placed, and the IC device 90 (electronic component) is transported. The electronic component transport apparatus 10 includes a transport unit 25 having a suction nozzle (suction unit) 31 that sucks and a support unit 38 that moves and supports the suction nozzle (suction unit) 31. The electronic component conveying device 10 has a lower pressure than the atmospheric pressure, the IC device 90 by suction (electronic components), the suction force F ₃ adsorbing suction nozzle (suction part) 31 on the IC device 90 (electronic component) A suction flow path (first flow path) 43 for imparting pressure, and an energization flow path (second flow path) 44 having a pressure higher than atmospheric pressure and imparting a biasing force by air to the suction nozzle (adsorption portion) 31; A sensor 87 that detects the flow rate or pressure of the energizing flow path (second flow path) 44, and a control section 800 that functions as a detection section that detects the position of the suction nozzle (suction section) 31 with respect to the support section 38. It is equipped with. The suction nozzle (suction part) 31 is different from the first position and the first position in a state where the IC device 90 (electronic component) is sucked and the support part 38 is brought into contact with the electronic component mounting part 26. The flow path (second flow path) 44 moves to either the suction flow path (first flow path) 43 whose pressure is lower than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure. To do. The control unit 800 (detection unit) can detect either the first position or the second position based on the flow rate or pressure of the urging channel (second channel) 44.

In the present embodiment, the electronic component transport apparatus 10 transports the IC device 90 (electronic component) to the electronic component placement unit 26 on which the IC device 90 that is an electronic component is placed, and the IC device 90 (electronic component) The electronic component transport apparatus 10 includes a transport section 25 having a suction nozzle (suction section) 31 that sucks the suction nozzle), a support section 38 that moves and supports the suction nozzle (suction section) 31, and a processor 802. . The electronic component conveying device 10 has a lower pressure than the atmospheric pressure, the IC device 90 by suction (electronic components), the suction force F ₃ adsorbing suction nozzle (suction part) 31 on the IC device 90 (electronic component) A suction flow path (first flow path) 43 for imparting pressure, and an energization flow path (second flow path) 44 having a pressure higher than atmospheric pressure and imparting a biasing force by air to the suction nozzle (adsorption portion) 31; , And a sensor 87 for detecting the flow rate or pressure of the energizing flow path (second flow path) 44. The suction nozzle (suction part) 31 is different from the first position and the first position in a state where the IC device 90 (electronic component) is sucked and the support part 38 is brought into contact with the electronic component mounting part 26. The force flow path (second flow path) 44 moves to either the suction flow path (first flow path) 43 or the second position communicating with the outside. The processor 802 detects either the first position or the second position based on the flow rate or pressure of the energizing flow path (second flow path) 44, and when the second position is detected, the electronic component placement unit 26, it can be determined that a plurality of IC devices 90 (electronic components) are placed on top of each other.

  According to the present invention, as in the first embodiment, the position of the suction nozzle 31 relative to the support portion 38, that is, the suction nozzle, based on the flow rate or pressure of the urging flow path 44 detected by the sensor 87. Whether 31 is in the first position or the second position can be detected. When it is detected that the suction nozzle 31 is in the second position, it can be determined that a plurality of IC devices 90 are placed on the electronic component placement unit 26 (inspection unit 16). Thereby, for example, the operator can eliminate the state in which the IC devices 90 are overlapped, so that the IC device 90 can be accurately inspected.

  In the present embodiment, the electronic component placement unit 26 is applied to the inspection unit 16 as in the first embodiment. However, the present invention is not limited to this. For example, the electronic component placement unit 26 may be described later. The temperature adjusting unit 12, the device supply unit 14, the device recovery unit 18, the recovery tray 19, or the tray 200 may be applied.

  As shown in FIGS. 12 and 13, a sensor 87 that detects the flow rate of the urging channel 44 is installed in the urging channel 44 in the middle of the pipe 81. As the sensor 87, for example, a mass flow rate type such as a thermal type, a Coriolis type, a Karman vortex type or a volume flow rate type can be used. Further, in the present embodiment, the sensor 87 that detects the flow rate of the urging channel 44 is used, but the sensor 87 is not limited to this, and a sensor that detects the pressure of the urging channel 44 may be used. . When the sensor 87 detects the pressure of the energizing flow path 44, the sensor 87 includes, for example, a diaphragm and a semiconductor strain gauge provided on the surface of the diaphragm, and the diaphragm is generated by an external force (pressure). It is possible to use a device that converts a change in electrical resistance due to the piezoresistance effect generated by deformation into an electrical signal.

  Moreover, the recessed part 343 of the 3rd block 34 has the enlarged diameter part 347 to which the internal diameter expanded from the middle of the up-down direction. The packing 317 of the suction nozzle 31 is in contact with the inner periphery of the recess 343 in the state shown in FIG. 12, but in the state shown in FIG. 13, it is separated from the inner periphery of the enlarged diameter portion 347 to form a gap. The The clearance is formed so that the outer periphery of the suction nozzle 31 can slide with respect to the inner periphery of the support portion 38 (third block 34). In the state shown in FIG. 13, the working fluid R in the energizing flow path 44 leaks from the enlarged diameter portion 347 to the outside through the concave portion 343 (third flow path) equal to the atmospheric pressure. Become. As a result, the flow rate of the urging flow path 44 detected by the sensor 87 increases compared to the state shown in FIG. The enlarged diameter portion 347 can be referred to as a “leakage channel 348” that causes the working fluid R to leak out from the biasing channel 44 to the outside.

  The processor 802 determines whether the suction nozzle 31 is in the first position (the state shown in FIG. 12) or the second position (the state shown in FIG. 13) based on the flow rate of the urging flow path 44 detected by the sensor 87. ) Can be detected. When it is detected that the suction nozzle 31 is in the second position, it can be determined that a plurality of IC devices 90 are placed on the inspection unit 16 in an overlapping manner. After this determination, for example, the operator can cancel the overlapping state of the IC devices 90 and make the IC device 90 inspectable.

  Further, in the first embodiment and the second embodiment, the flow rate or pressure is detected by the sensor 74 of the suction flow path 43, but a sensor 87 is provided in the biasing flow path 44 as in the present embodiment, The sensor 87 may detect the flow rate or pressure of the urging channel 44.

<Fifth Embodiment>
Hereinafter, the fifth embodiment of the electronic component transport apparatus and the electronic component inspection apparatus of the present invention will be described with reference to FIGS. 14 and 15. Will not be described.
The present embodiment is the same as the first embodiment except that the urging channel is omitted.

  As shown in FIGS. 14 and 15, in this embodiment, a coil spring 46 is installed as a biasing member that biases the suction nozzle 31 downward instead of the biasing flow path 44. The coil spring 46 is compressed between the second block 33 and the flange portion 315 of the suction nozzle 31 in the concave portion 343 of the third block 34. Thereby, the suction nozzle 31 can be urged downward.

  By using such a coil spring 46, the biasing passage 44 can be omitted, and the configuration of the device transport head 17 can be simplified (reduction in the number of parts).

  The biasing member is the coil spring 46 in the present embodiment, but is not limited thereto, and may be, for example, a tension coil spring or other spring member.

  Further, the suction nozzle 31 is one in which the packing 35 is omitted. As shown in FIG. 15, when the suction nozzle 31 is located at the second position, the inner cavity 333 of the second block 33 has a gap 40 and a recess 343 of the third block 34 equal to the atmospheric pressure (third flow path). And the like, and communicated with the recess 165 of the inspection unit 16. In this state, the air G in the recess 165 of the inspection unit 16 flows into the suction flow path 43. Accordingly, the pressure in the suction flow path 43 detected by the sensor 74 increases as compared to the state shown in FIG. Thereby, the overlapping state of the IC device 90 can be detected.

<Sixth Embodiment>
Hereinafter, the sixth embodiment of the electronic component transport apparatus and the electronic component inspection apparatus of the present invention will be described with reference to FIG. 16, but the description will focus on the differences from the above-described embodiment, and the same matters will be described. Is omitted.

  This embodiment is the same as the first embodiment except that the configuration of the test system (electronic component inspection apparatus) is different.

  As shown in FIG. 16, in this embodiment, the electronic component transport apparatus 10 as a handler includes a motor control device 91 and an air pressure control device 92 in addition to a control unit 800 configured by an industrial computer. Furthermore, other control device 93 is also incorporated.

  The control unit 800 is connected to a motor control device 91, a pneumatic control device 92, and other control devices 93. In the control unit 800, the processor 802 can read a command from the memory 803 and execute control. Further, the control unit 800 is preferably connected to an I / F board (not shown) connected to the tester.

  The motor control device 91 includes a processor 911 and a memory 912. The processor 911 can read a command from the memory 912 and execute control. The motor control device 91 is connected to the motor 913 and can control the operation of the motor 913. The motor 913 includes, for example, a tray transport mechanism 11A, a tray transport mechanism 11B, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, a device transport head 17, a device collection unit 18, a device transport head 20, and a tray transport. This is a drive source for driving the mechanism 21, the tray transport mechanism 22A or the tray transport mechanism 22B.

  The pneumatic control device 92 includes a processor 921 and a memory 922. The processor 921 can read a command from the memory 922 and execute control. The pneumatic control device 92 is connected to pneumatic devices such as an ejector 72, a regulator 73, and a regulator 84, and can control the operation of these pneumatic devices.

  It should be noted that the processor 802 of the control unit 800 can read the command from the memory 912 of the motor control device 91 and the memory 922 of the pneumatic control device 92 and execute control.

  Examples of the other control device 93 include a device that controls the operation of the monitor 300 and the like.

  Moreover, each said control apparatus may be separate from the control object member, and may be integral. For example, the motor control device 91 may be integrated with the motor 913.

  In addition, the control unit 800 is connected to the computer 94 outside the electronic component transport apparatus 10 that is a handler. The computer 94 includes a processor 941 and a memory 942. Then, the processor 802 of the control unit 800 can read a command from the memory 942 and execute control.

The computer 94 is connected to the cloud 96 via a network 95 such as a LAN. The cloud 96 includes a processor 961 and a memory 962. Then, the processor 802 of the control unit 800 can read a command from the memory 962 and execute control.
Note that the control unit 800 may be directly connected to the network 95.

<Seventh embodiment>
Hereinafter, the seventh embodiment of the electronic component transport apparatus and the electronic component inspection apparatus of the present invention will be described with reference to FIG. 17, but the description will focus on the differences from the above-described embodiment, and the same matters will be described. Is omitted.

  This embodiment is the same as the sixth embodiment except that the configuration of the test system (electronic component inspection apparatus) is different.

  In the present embodiment shown in FIG. 17, the control unit 800 has a control function of the motor control device 91, a control function of the pneumatic control device 92, and a control function of other control devices 93. That is, the control unit 800 has a configuration in which the motor control device 91, the pneumatic control device 92, and other control devices 93 are built (integrated). Such a configuration contributes to downsizing of the control unit 800.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

DESCRIPTION OF SYMBOLS 1 ... Electronic component inspection apparatus, 10 ... Electronic component conveyance apparatus, 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 13 ... Device conveyance head, 14 ... Device supply part, 14A ... Device supply part, 14B ... Device supply unit, 15 ... Tray transport mechanism, 16 ... Inspection unit, 161 ... Inspection unit body, 162 ... Abutment unit, 163 ... Probe pin, 164 ... Guide pin, 165 ... Recess (pocket), 17 ... Device transport Head, 17A ... Device transport head, 17B ... Device transport head, 171 ... Connection section, 18 ... Device recovery section, 18A ... Device recovery section, 18B ... Device recovery section, 19 ... Collection tray, 20 ... Device transport head, 21 ... Tray transport mechanism, 22A ... Tray transport mechanism, 22B ... Tray transport mechanism, 231 ... First partition, 232 ... Second partition 233 ... third partition, 234 ... fourth partition, 235 ... fifth partition, 241 ... front cover, 242 ... side cover, 243 ... side cover, 244 ... rear cover, 245 ... top cover, 25 ... conveying section, 26 ... electronics Component placement unit, 3 ... suction unit, 31 ... suction nozzle (suction unit), 311 ... upper surface, 312 ... lower surface, 313 ... lumen, 314 ... opening (suction port), 315 ... flange, 317 ... packing 32 ... first block, 321 ... upper surface, 322 ... lower surface, 324 ... lumen, 325 ... lumen, 33 ... second block, 331 ... upper surface, 332 ... lower surface, 333 ... lumen, 334 ... expanded Diameter portion, 335 ... Leakage flow path, 336 ... Lumen portion, 337 ... Relay flow path, 34 ... Third block, 341 ... Upper surface, 342 ... Lower surface, 343 ... Recess, 344 ... Through hole, 345 ... Guide hole, 346 ... Detents, 347 ... Expanded diameter part, 348 ... Leakage flow path, 35 ... Packing, 36 ... Fitting, 37 ... Packing, 38 ... Supporting part, 39 ... Packing, 40 ... Gap, 41 ... Fitting, 42 ... Fitting, 43 ... Suction flow path (first flow path), 44 ... Biasing flow path (second flow path), 45 ... Valve, 46 ... Coil spring, 5 ... Attitude adjustment unit, 51 ... First adjustment mechanism, 511 ... Cylinder, 512 ... Piston, 513 ... lumen portion, 514 ... flange portion, 515 ... piston rod, 516 ... through hole, 52 ... second adjusting mechanism, 521 ... plate member, 6 ... heat insulating portion, 61 ... heat insulating member, 71 ... piping, 72 ... Ejector 73 ... Regulator 74 ... Sensor 8 ... Piping 81 ... Piping 82 ... Piping 83 ... Tank 84 ... Regulator 85 ... Working fluid supply part 86 ... Branch point 87 ... Sensor 90 ... IC Device, 90A ... Residual device, 90B ... Untested device, 901 ... Terminal, 91 ... Motor controller, 911 ... Processor, 912 ... Memory, 913 ... Motor, 92 ... Pneumatic controller, 921 ... Processor, 922 ... Memory, 93 ... Others 94, computer, 941, processor, 942 ... memory, 95 ... network, 96 ... cloud, 961 ... processor, 962 ... memory, 200 ... tray, 300 ... monitor, 301 ... display screen, 400 ... signal lamp, 500 ... Speaker, 600 ... Mouse stand, 700 ... Operation panel, 800 ... Control unit, 802 ... Processor, 803 ... Memory, A1 ... Tray supply area, A2 ... Device supply area (supply area), A3 ... Inspection area, A4 ... Device collection area (collection area), A5 ... G Lee removing region, F 3 _... suction force, G ... air, R ... working fluid, S101～S112 ... step, alpha _{11A ...} arrows, alpha _{11B ...} arrows, alpha _{13X ...} arrows, alpha _{13Y ...} arrows, alpha _{14 ...} arrow α ₁₅ ... Arrow, α _17Y ... Arrow, α ₁₈ ... Arrow, α _20X ... Arrow, α _20Y ... Arrow, α ₂₁ ... Arrow, α _22A ... Arrow, α _22B ... Arrow, α ₉₀ ... Arrow

Claims (8)

An electronic component comprising a transport unit having a suction unit that transports the electronic component to an electronic component placement unit on which the electronic component is placed and sucks the electronic component, and a support unit that moves and supports the suction unit. A conveying device,
A first flow path having a pressure lower than atmospheric pressure, sucking the electronic component, and applying a suction force to suck the electronic component to the suction portion;
A sensor for detecting the flow rate or pressure of the first flow path;
A detection unit that detects a position of the adsorption unit with respect to the support unit,
The adsorbing portion adsorbs the electronic component and is different from the first position in a state where the supporting portion is brought into contact with the electronic component mounting portion. Move to either the second flow path having a pressure higher than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure;
The electronic component conveying apparatus, wherein the detection unit detects either the first position or the second position based on a flow rate or pressure of the first flow path.   The electronic component transport apparatus according to claim 1, further comprising an urging channel that applies an urging force by air to the adsorption unit as the second channel.   When the electronic component is placed on the electronic component placement portion, the suction portion descends together with the support portion and is detected by the detection portion. After the detection by the detection portion, the support portion The electronic component conveying apparatus according to claim 1, which rises together.   The electronic component conveying apparatus according to claim 3, wherein when the second position is detected, the suction portion has a lower rising speed when the second position is detected than when the first position is detected. An electronic component comprising a transport unit having a suction unit that transports the electronic component to an electronic component placement unit on which the electronic component is placed and sucks the electronic component, and a support unit that moves and supports the suction unit. A conveying device,
A first flow path having a pressure lower than atmospheric pressure, sucking the electronic component, and applying a suction force to suck the electronic component to the suction portion;
A second flow path having a pressure higher than atmospheric pressure and applying an urging force by air to the adsorption portion;
A sensor for detecting the flow rate or pressure of the second flow path;
A detection unit that detects a position of the adsorption unit with respect to the support unit,
The adsorbing portion adsorbs the electronic component and is different from the first position in a state where the supporting portion is brought into contact with the electronic component mounting portion, and the second flow path has a large size. Move to either the first flow path whose pressure is lower than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure;
The electronic component conveying apparatus, wherein the detection unit detects either the first position or the second position based on a flow rate or pressure of the second flow path. A transport unit that transports the electronic component to an electronic component placement unit on which the electronic component is placed and sucks the electronic component; and a support unit that moves and supports the suction unit;
An electronic component transport device comprising a processor,
A first flow path having a pressure lower than atmospheric pressure, sucking the electronic component, and applying a suction force to suck the electronic component to the suction portion;
A sensor for detecting the flow rate or pressure of the first flow path,
The adsorbing portion adsorbs the electronic component and is different from the first position in a state where the supporting portion is brought into contact with the electronic component mounting portion. Move to either the second flow path having a pressure higher than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure;
The processor detects either the first position or the second position based on the flow rate or pressure of the first flow path. It is determined that the electronic components are stacked and placed. A transport unit that transports the electronic component to an electronic component placement unit on which the electronic component is placed and sucks the electronic component; and a support unit that moves and supports the suction unit;
An electronic component transport device comprising a processor,
A first flow path having a pressure lower than atmospheric pressure, sucking the electronic component, and applying a suction force to suck the electronic component to the suction portion;
A second flow path having a pressure higher than atmospheric pressure and applying an urging force by air to the adsorption portion;
A sensor for detecting the flow rate or pressure of the second flow path,
The suction portion sucks the electronic component, and in a state where the support portion is brought into contact with the electronic component mounting portion, the second flow path is different from the first position and the first position. Move to either the first flow path or the second position communicating with the outside,
The processor detects either the first position or the second position on the basis of the flow rate or pressure of the second flow path, and when detecting the second position, the processor places a plurality of pieces on the electronic component placement unit. It is determined that the electronic components are stacked and placed. An electronic component placement unit on which the electronic component is placed, and an inspection unit for inspecting the electronic component;
An electronic component inspection apparatus comprising: a conveyance unit that conveys the electronic component to the inspection unit and adsorbs the electronic component; and a support unit that moves and supports the adsorption unit.
A first flow path having a pressure lower than atmospheric pressure, sucking the electronic component, and applying a suction force to suck the electronic component to the suction portion;
A sensor for detecting the flow rate or pressure of the first flow path;
A detection unit that detects a position of the adsorption unit with respect to the support unit,
The adsorbing portion adsorbs the electronic component and is different from the first position in a state where the supporting portion is brought into contact with the electronic component mounting portion. Move to either the second flow path having a pressure higher than the atmospheric pressure or the second position communicating with the third flow path equal to the atmospheric pressure;
The electronic component inspection apparatus, wherein the detection unit detects either the first position or the second position based on a flow rate or pressure of the first flow path.

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