CN110007211B - Electronic component conveying device and electronic component inspection device - Google Patents

Electronic component conveying device and electronic component inspection device Download PDF

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Publication number
CN110007211B
CN110007211B CN201811592175.0A CN201811592175A CN110007211B CN 110007211 B CN110007211 B CN 110007211B CN 201811592175 A CN201811592175 A CN 201811592175A CN 110007211 B CN110007211 B CN 110007211B
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China
Prior art keywords
electronic component
unit
working fluid
space
inspection
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CN201811592175.0A
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CN110007211A (en
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中村敏
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North Star Technology Co ltd
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North Star Technology Co ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Provided are an electronic component conveying device and an electronic component inspection device, wherein the electronic component conveying device is provided with: a conveying section that conveys the electronic component to the inspection section, the conveying section having a first component and a second component, the first component having a first base portion, a first sliding portion that slides with respect to the first base portion, and a first space defined by the first base portion and the first sliding portion, the second component having a second base portion that is attached to the first sliding portion, a second sliding portion that slides with respect to the second base portion and that abuts the electronic component, and a second space defined by the second base portion and the second sliding portion; a duct portion having a flow path that communicates with the second space and supplies the working fluid to the second space; a flow sensor disposed in the flow path and detecting a flow rate of the working fluid; a pressure regulating part for regulating the pressure of the working fluid; and a control unit that causes the second sliding unit to hold the electronic component and causes the second sliding unit to press the electronic component against the inspection unit.

Description

Electronic component conveying device and electronic component inspection device
Technical Field
The invention relates to an electronic component conveying device and an electronic component inspection device.
Background
Conventionally, a test apparatus for testing an electronic component such as an IC package is known (for example, see patent document 1). The test apparatus described in patent document 1 includes: a pusher for pressing the electronic component to the test socket while holding the electronic component; and a pressure detection unit connected to the pusher and detecting a pressure (pressing force) when the pusher presses the electronic component to the socket. Further, in the testing device described in patent document 1, when the electronic component is tested, it is possible to detect whether the pusher presses the electronic component to the socket with a predetermined pressure based on the detection result of the pressure detecting unit.
Patent document 1: japanese patent laid-open publication No. 2003-161758
However, in the test apparatus described in patent document 1, the terminals of the solder balls of the electronic component and the contact pins of the socket are not limited to uniformly contacting due to, for example, the size (thickness) and shape (curved and inclined shape) of the electronic component, the parallelism between the electronic component mounting part (socket) and the pusher, and the like. If the terminals of the solder balls and the contact pins are not uniformly in contact with each other, the electronic component may not be accurately tested.
Disclosure of Invention
The present invention is made to solve the above-described problems, and can be implemented as the following modes or application examples.
Application example 1 an electronic component transfer apparatus according to the present embodiment includes: a conveying section including a first member having a first base portion and a first sliding portion that slides with respect to the first base portion, and a second member having a second base portion that is detachably disposed on the first sliding portion and a second sliding portion that slides with respect to the second base portion and abuts against the electronic component; a flow path that communicates with the second space and supplies a working fluid to the second space; a flow sensor provided in the flow path and detecting a flow rate of the working fluid; and a pressure adjusting unit that adjusts a pressure of the working fluid, wherein the first member forms a first space between the first base portion and the first sliding portion, and the second member forms a second space between the second base portion and the second sliding portion, and holds the electronic component by the second sliding portion, and presses the electronic component to a probe of an inspection unit.
According to the present embodiment, when the inspection unit performs electrical inspection of the electronic component, each terminal of the electronic component can be brought into uniform contact with each terminal of the inspection unit regardless of individual differences of the electronic component, and therefore, the inspection can be performed accurately.
Application example 2 in the electronic component transfer device according to the application example, it is preferable that the working fluid be able to enter and exit the first space and the second space.
According to the present application example, the first sliding portion can be slid and the second sliding portion can be slid.
Application example 3 the electronic component transfer apparatus according to the application example preferably includes: an opening/closing unit that is provided in the flow path and opens and closes the flow path; and a determination unit that determines opening and closing of the opening and closing unit based on the flow rate detected by the flow rate sensor.
According to the present application example, leakage of the working fluid from the second space can be prevented.
Application example 4 in the electronic component transfer apparatus according to the application example, it is preferable that the flow sensor is disposed between the opening/closing unit and the second space of the second component.
According to the present application example, since the leading end of the opening/closing unit is cut off, erroneous detection can be prevented.
Application example 5 in the electronic component transfer device according to the above application example, it is preferable that the determination unit outputs an alarm when the flow rate sensor detects a predetermined flow rate of the working fluid.
According to the application example, the preset flow can be detected according to the alarm.
Application example 6 in the electronic component transfer device according to the application example, it is preferable that the second base portion be capable of coming into contact with an electronic component mounting portion on which the electronic component is mounted.
According to the present application example, the posture of the second base can be made to follow the shape of the electronic component mounting portion. Therefore, the second sliding portion can be brought into contact with the electronic component in this copied state. As a result, for example, when the electronic component mounting part is an apparatus for electrically inspecting the electronic component, even when there is no parallelism between the electronic component mounting part (socket) and the pusher, it is possible to contribute to making the terminals of the electronic component and the terminals of the mounting part sufficiently contact each other.
Application example 7 in the electronic component transfer device according to the application example, it is preferable that a contact force with which the second sliding portion contacts the electronic component is different from a contact force with which the second base portion contacts the electronic component placement portion.
According to the present application example, for example, the contact force with which the second sliding portion contacts the electronic component is smaller than the contact force with which the second base portion contacts the electronic component mounting portion, whereby the above-described effects can be exhibited and excessive pressing of the electronic component can be prevented.
Application example 8 the electronic component transfer apparatus according to the application example preferably includes a working fluid supply unit configured to supply the working fluid to the first space and the second space.
According to the present application example, the device configuration can be simplified by providing the common working fluid supply unit in the first space and the second space.
Application example 9 the electronic component transfer apparatus according to the application example preferably includes a third space communicating with the second space.
According to the present application example, it is possible to suppress variation in pressure of the second space by the amount of the third space.
Application example 10 in the electronic component transfer apparatus according to the application example, it is preferable that an area of a first pressure receiving surface of the first sliding portion receiving the working fluid is larger than an area of a second pressure receiving surface of the second sliding portion receiving the working fluid.
According to the present application example, when the pressures of the first space and the second space are made equal to each other, the force applied to the first sliding portion can be made larger than the force applied to the second sliding portion.
Application example 11 in the electronic component transfer device according to the application example, it is preferable that the second base portion be capable of coming into contact with a part of the electronic component.
According to the present application example, for example, in a state where the second base portion presses a part of the electronic component, the second sliding portion can press the remaining part of the electronic component.
Application example 12 in the electronic component transfer device according to the application example, it is preferable that a contact force with which the second sliding portion contacts the electronic component is different from a contact force with which the second base portion contacts the electronic component.
According to the present application example, the load on the portion of the electronic component where the second sliding portion abuts against the electronic component can be reduced, or the load on the portion of the electronic component where the second base portion abuts against the electronic component can be reduced. That is, the contact force can be made different depending on the position of the electronic component.
Application example 13 in the electronic component transfer apparatus according to the application example, it is preferable that the second base and the second slide part abut against the electronic component at different positions.
According to the present application example, for example, in a state where the second base portion presses a part of the electronic component, the second sliding portion can press the remaining part of the electronic component.
Application example 14 in the electronic component transfer apparatus according to the application example, it is preferable that the pressure of the working fluid flowing in the first space and the pressure of the working fluid flowing in the second space can be changed.
According to the present application example, the force applied to the first sliding portion and the force applied to the second sliding portion can be made different.
Application example 15 the electronic component transfer apparatus according to the application example preferably includes: a movable section capable of placing and moving the electronic component; and a force detection unit that is provided in the movable unit and can detect a force, the force detection unit being capable of coming into contact with the electronic component that is in contact with the second slide unit.
According to the present application example, for example, when the inspection section performs electrical inspection of the electronic component, the actual contact force when the electronic component in contact with the second sliding section is in contact with the inspection section can be replaced with the contact force detected by the force detection section. Further, it is possible to determine whether or not the contact force at the time of inspecting the electronic component is a magnitude that is neither excessive nor insufficient for the electronic component, based on the magnitude of the contact force detected by the force detecting section.
Application example 16 an electronic component inspection apparatus according to the present embodiment includes: a conveying section including a first member having a first base portion and a first sliding portion that slides with respect to the first base portion, and a second member having a second base portion that is detachably disposed on the first sliding portion and a second sliding portion that slides with respect to the second base portion and abuts against the electronic component; a flow path that communicates with the second space and supplies a working fluid to the second space; a flow sensor provided in the flow path and detecting a flow rate of the working fluid; a pressure adjusting unit that adjusts the pressure of the working fluid; and an inspection unit that inspects the electronic component, wherein the first component has a first space formed between the first base and the first sliding unit, and the second component has a second space formed between the second base and the second sliding unit, and holds the electronic component by the second sliding unit, and presses the electronic component to a probe of the inspection unit.
According to the present embodiment, the pressures of the working fluid in the first space and the second space can be adjusted. Further, for example, when the inspection unit performs electrical inspection of the electronic component, each terminal of the electronic component can be brought into uniform contact with each terminal of the inspection unit regardless of individual differences of the electronic component, and therefore, the inspection can be performed accurately.
Application example 17 an electronic component transfer apparatus according to the present embodiment is an electronic component transfer apparatus that transfers an electronic component to an inspection unit that inspects electrical characteristics of the electronic component, the electronic component transfer apparatus including: a conveying unit that conveys the electronic component to the inspection unit, the conveying unit including a first component having a first base portion, a first slide portion that slides with respect to the first base portion, and a first space defined by the first base portion and the first slide portion, and a second component having a second base portion that is attached to the first slide portion, a second slide portion that slides with respect to the second base portion and that abuts against the electronic component, and a second space defined by the second base portion and the second slide portion; a duct portion having a flow path that communicates with the second space and supplies a working fluid to the second space; a flow rate sensor disposed in the flow path and detecting a flow rate of the working fluid; a pressure adjusting unit that adjusts the pressure of the working fluid; and a control unit that causes the second sliding unit to hold the electronic component and causes the second sliding unit to press the electronic component to the inspection unit.
According to the present embodiment, when the inspection unit performs electrical inspection of the electronic component, each terminal of the electronic component can be brought into uniform contact with each terminal of the inspection unit regardless of individual differences of the electronic component, and therefore, the inspection can be performed accurately.
Application example 18 an electronic component inspection apparatus according to the present embodiment includes: an inspection unit for inspecting electrical characteristics of the electronic component; a conveying unit that conveys the electronic component to the inspection unit, the conveying unit including a first component having a first base portion, a first slide portion that slides with respect to the first base portion, and a first space defined by the first base portion and the first slide portion, and a second component having a second base portion that is attached to the first slide portion, a second slide portion that slides with respect to the second base portion and that abuts against the electronic component, and a second space defined by the second base portion and the second slide portion; a duct portion having a flow path that communicates with the second space and supplies a working fluid to the second space; a flow rate sensor disposed in the flow path and detecting a flow rate of the working fluid; a pressure adjusting unit that adjusts the pressure of the working fluid; and a control unit that causes the second sliding unit to hold the electronic component and causes the second sliding unit to press the electronic component to the inspection unit.
According to the present embodiment, the pressures of the working fluid in the first space and the second space can be adjusted. Further, for example, when the inspection unit performs electrical inspection of the electronic component, each terminal of the electronic component can be brought into uniform contact with each terminal of the inspection unit regardless of individual differences of the electronic component, and therefore, the inspection can be performed accurately.
Drawings
Fig. 1 is a schematic perspective view of an electronic component inspection apparatus according to a first embodiment, as viewed from the front side.
Fig. 2 is a schematic plan view showing an operation state of the electronic component inspection apparatus shown in fig. 1.
Fig. 3 is a perspective view showing the apparatus transporting head provided in the inspection area in fig. 2.
Fig. 4 is a schematic partial vertical sectional view sequentially showing an operation state of the apparatus transporting head provided in the inspection area in fig. 2.
Fig. 5 is a schematic partial vertical sectional view sequentially showing an operation state of the apparatus transporting head provided in the inspection area in fig. 2.
Fig. 6 is a schematic partial vertical sectional view sequentially showing an operation state of the apparatus transporting head provided in the inspection area in fig. 2.
Fig. 7 is a vertical cross-sectional view showing a state in which each terminal can contact each probe of the inspection portion even in an IC device in which distances from the lower surface to each terminal of the IC device vary when the lower surface (suction surface) of the suction nozzle is set as a reference.
Fig. 8 is a vertical cross-sectional view showing a state in which each terminal can contact each probe of the inspection portion even in an IC device in which distances from the lower surface to each terminal of the IC device vary when the lower surface (suction surface) of the suction nozzle is set as a reference.
Fig. 9 is a vertical cross-sectional view showing a state in which each terminal can be brought into contact with each probe of the inspection portion even in an IC device in which distances from the lower surface to each terminal of the IC device vary when the lower surface (suction surface) of the suction nozzle is set as a reference.
Fig. 10 is a flowchart showing an opening/closing sequence of the solenoid valve for shutoff.
Fig. 11 is a schematic partial vertical sectional view of the transfer head of the apparatus according to the second embodiment.
Fig. 12 is a schematic partial vertical sectional view of a transfer head of the apparatus according to the third embodiment.
Fig. 13 is a schematic partial vertical sectional view of the apparatus transport head and the movable section according to the fourth embodiment.
Fig. 14 is a schematic partial vertical sectional view of a transfer head of the apparatus according to the fifth embodiment.
Fig. 15 is a schematic partial vertical sectional view of a transfer head of the apparatus according to the sixth embodiment.
Description of the reference numerals
1 … electronic component inspection device; 3 … suction part (second member) (conveying part); 5 … posture adjustment part (first member); 6 … heat insulation; 7 … X direction moving mechanism; 8 … pipes; 9 … force detection part; 10 … electronic component conveying device; 11A, 11B … tray conveying mechanism; 12 … temperature adjustment part; 13 … equipment delivery head; 14 … equipment supply; 15 … tray conveying mechanism; 16 … inspection part; 17. 17A, 17B … equipment delivery heads; 18 … facility recovery section; 19 … tray for recovery; 20 … equipment delivery head; 21. 22A, 22B … tray transport mechanism; 30 … movable part; 31 … suction nozzle (second sliding part) (conveying part); 32 … first piece; 33 … second block portion; 34 … third block (second base) (conveying part); a 35 … gasket; 36 … joint; 37. a 38 … gasket; 41. a 42 … joint; 43 … gasket; 51 … a first adjustment mechanism; 52 … second adjustment mechanism; 53 … a membrane; 61 … heat insulating members; 71 … a pipe; 71a … linear guide; 72 … ejector; 72A … support base; 73 … regulator; 73A … pad; 80. 81, 82 … pipes (flow paths); 83 … storage tank; 84 … regulator (pressure regulating part); 85 … working fluid supply; 86 … divergence point; 87 … flow sensor; 88 … cut-off solenoid valve (opening/closing section); 89 … divergence point; 90 … IC devices (electronic components); 141 … recesses (dimples); 150 … grooves; 152 … guide pins; 161 … inspection part main body; 162 … abutment; a 163 … probe; 165 … recesses (dimples); 166 … electronic component force application part; 171 … connecting part; 181 … recess (dimples); 200 … trays; 231 … first partition wall; 232 … second partition wall; 233 … third bulkhead; 234 … fourth bulkhead; 235 … fifth bulkhead; 241 … front cover; 242. 243 … side cover; 244 … rear cover; 245 … top cover; a 300 … monitor; 301 … display a screen; 311 … above; below 312 …; 313 … inner cavity portion; 314 … opening (suction port); 315 … flange portion; 316 … groove; 321 …; 322 … below; 324 … inner cavity portion; 325 … recess; 331 … above; 332 … below; 333 … inner chamber portion; 334 … grooves; 336 … inner cavity portion; 338. 340 … grooves; 341 … above; 342 …; 344 … through holes; 346 … projection; 348 … recess; 400 … signal light; a 500 … speaker; 511 … cylinder (first base); a 512 … piston (first sliding portion); 513 … inner cavity portion; 514 … flange portion; 515 … piston rod; 516 … through holes; 521 … a plate member; 531 … below; 600 … mouse pad; 700 … operating panel; 711A … guide rail; 712a … slider; 800 … control section; 901 … terminals; 902 … a substrate; 903 … projection; a1 … tray supply area; a2 … equipment supply area (supply area); a3 … examination area; a4 … facility recovery area (recovery area); a5 … tray removal area; f3, F3' … attractive force; f90 … abutment force; the H90 … distance; s1 … a first space; s2 … second space.
Detailed Description
Hereinafter, an electronic component transfer apparatus and an electronic component inspection apparatus according to the present invention will be described in detail based on preferred embodiments shown in the drawings.
< first embodiment >
A first embodiment of an electronic component transfer apparatus and an electronic component inspection apparatus according to the present invention will be described below with reference to fig. 1 to 9. For convenience of explanation, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis as shown in fig. 1. An XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is referred to as an "X direction (first direction)", a direction parallel to the Y axis is referred to as a "Y direction (second direction)", and a direction parallel to the Z axis is referred to as a "Z direction (third direction)". The direction in which the arrow in each direction is directed is referred to as "positive", and the opposite direction is referred to as "negative". The term "horizontal" as used herein is not limited to a complete horizontal state, and includes a state in which the electronic component is slightly (for example, less than 5 °) inclined with respect to the horizontal state as long as the electronic component is not hindered from being conveyed. In fig. 1 and 4 to 9 (the same applies to fig. 11 to 15), the upper side is referred to as "upper" or "upper" and the lower side is referred to as "lower" or "lower".
As shown in fig. 4, the electronic component transfer apparatus 10 according to the present embodiment includes: a conveyance unit having an attitude adjustment unit 5 as a first member and a suction unit 3 as a second member, the attitude adjustment unit 5 having a cylinder 511 as a first base and a piston 512 as a first sliding unit that slides with respect to the cylinder 511, the suction unit 3 having a third block 34 as a second base that is detachably disposed on the piston 512 and a suction nozzle 31 as a second sliding unit that slides with respect to the third block 34 and comes into contact with an electronic component; a duct 81 serving as a flow path communicating with the second space S2 and supplying the working fluid R to the second space S2; a flow sensor 87 provided in the pipe 81 and detecting the flow rate of the working fluid R; and a regulator 84, as a pressure adjusting portion for adjusting the pressure of the working fluid R, the posture adjusting portion 5 has a first space S1 formed between the cylinder 511 and the piston 512, the suction portion 3 has the second space S2 formed between the second base portion and the second sliding portion, and the electronic component is held by the third block portion 34 and is pressed against the probe 163 (see fig. 5) of the inspection portion 16 (see fig. 5).
Thus, even if there is an individual difference in the electronic components, the difference can be offset by adjusting the pressure of the working fluid R in the first space S1 and the second space S2. Further, for example, when the inspection unit 16 (see fig. 5) performs electrical inspection of the electronic component, each terminal of the electronic component can be brought into uniform contact with each terminal of the inspection unit 16 regardless of individual differences of the electronic component, and therefore, the inspection can be performed accurately. Further, by detecting the flow rate of the working fluid R in the pipe 81, it is possible to detect whether the working fluid R leaks from the pipe 81.
The electronic component inspection apparatus 1 according to the present embodiment includes the electronic component conveying apparatus 10 according to the present embodiment, and further includes an inspection unit 16 for inspecting the electronic component. That is, the electronic component inspection apparatus 1 of the present embodiment includes: a transport unit having an attitude adjustment unit 5 as a first member and a suction unit 3 as a second member, the attitude adjustment unit 5 having a cylinder 511 as a first base and a piston 512 as a first sliding unit that slides with respect to the cylinder 511, the suction unit 3 having a third block 34 as a second base that is detachably disposed on the piston 512 and a suction nozzle 31 as a second sliding unit that slides with respect to the third block 34 and comes into contact with an electronic component; a duct 81 serving as a flow path communicating with the second space S2 and supplying the working fluid R to the second space S2; a flow sensor 87 provided in the pipe 81 and detecting the flow rate of the working fluid R; a regulator 84 serving as a pressure adjusting unit for adjusting the pressure of the working fluid R; and an inspection unit 16 for inspecting the electronic component, wherein the attitude adjustment unit 5 forms a first space S1 between the cylinder 511 and the piston 512, and the suction unit 3 forms a second space S2 between the third block 34 and the suction nozzle 31, holds the electronic component by the suction nozzle 31, and presses the electronic component against the probe 163 of the inspection unit 16.
Thereby, the electronic component inspection apparatus 1 having the advantages of the electronic component conveyance apparatus 10 described above is obtained. Further, the electronic component can be conveyed to the inspection unit 16, and thus the inspection of the electronic component can be performed in the inspection unit 16. Further, the inspected electronic component can be conveyed out from the inspection unit 16.
The structure of each portion will be described below. Fig. 1 is a schematic perspective view of an electronic component inspection apparatus according to the present embodiment, as viewed from the front side. Fig. 2 is a schematic plan view showing an operation state of the electronic component inspection apparatus shown in fig. 1. As shown in fig. 1 and 2, an electronic component inspection apparatus 1 incorporating an electronic component transfer apparatus 10 is an apparatus that transfers electronic components such as bga (ball Grid array) packaged IC devices and performs inspection or test (hereinafter simply referred to as "inspection") of electrical characteristics of the electronic components during the transfer. For convenience of description, a case where an IC device is used as an electronic component will be described below as a representative example, and will be referred to as "IC device 90". In the present embodiment, the IC device 90 has a flat plate shape. Further, a plurality of hemispherical terminals 901 are arranged on the lower surface of the IC device 90 (see fig. 5 and 6).
In addition to the above-described devices, examples of the IC device include "lsi (large Scale integration)", "cmos (complementary mos)", "ccd (charge Coupled device)", and "module IC" in which a plurality of IC device modules are packaged, and "crystal device", "pressure sensor", "inertial sensor", "gyro sensor", "fingerprint sensor", and the like.
The electronic component inspection apparatus 1 (electronic component transfer apparatus 10) is mounted in advance and uses a kit called a "replacement kit" that is replaced for each type of IC device 90. The replacement kit includes a mounting unit on which the IC device 90 is mounted, and examples of the mounting unit include a temperature adjustment unit 12 and a device supply unit 14, which will be described later. Further, as a mounting portion on which the IC device 90 is mounted, there is also an inspection portion 16 or a tray 200 prepared by a user, which is separate from the replacement kit as described above. In the present embodiment, the second block 33 and the third block 34 of the suction unit 3 shown in fig. 4 correspond to a replacement kit.
The electronic component inspection apparatus 1 includes a tray supply area a1, a device supply area (hereinafter simply referred to as "supply area") a2, an inspection area A3, a device collection area (hereinafter simply referred to as "collection area") a4, and a tray removal area a5, which are partitioned by wall portions as described later. Further, the IC device 90 is moved from the tray supply area a1 to the tray removal area a5 as indicated by arrow α90The direction sequentially passes through the respective regions, and the inspection is performed in the inspection region a3 on the way. In this manner, the electronic component inspection apparatus 1 includes: an electronic component conveying apparatus 10, i.e., an automatic sorting machine, which conveys the IC devices 90 in each area; an inspection unit 16 for performing an inspection in an inspection area a 3; and a control section 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.
Note that, in the electronic component inspection apparatus 1, the side where the tray supply region a1 and the tray removal region a5 are arranged, that is, the lower side in fig. 2 is the front side, and the side where the inspection region A3 is arranged, that is, the upper side in fig. 2 is the rear side.
The tray supply area a1 is a material supply portion that supplies the trays 200 in which a plurality of IC devices 90 in an unchecked state are arrayed. In the tray supply area a1, a plurality of trays 200 can be stacked.
The supply area a2 is an area for conveying and supplying the plurality of IC devices 90 on the tray 200 conveyed from the tray supply area a1 to the inspection area A3, respectively. Tray conveying mechanisms 11A and 11B for conveying the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply area a1 and the supply area a 2. The tray conveying mechanism 11A is capable of moving the tray 200 and the IC device 90 mounted on the tray 200 to the Y direction front side, that is, arrow α in fig. 211AA moving part moving in the direction. This enables the IC device 90 to be stably loaded into the supply area a 2. The tray conveying mechanism 11B is capable of moving the empty tray 200 to the negative side in the Y direction, i.e., arrow α in fig. 211BA moving part moving in the direction. This allows the empty tray 200 to be moved from the supply area a2 to the tray supply area a 1.
The supply area a2 is provided with a temperature adjustment unit (ソークプレート (a soak plate, a chinese expression (an example): vapor chamber)) 12, a device transport head 13, and a tray transport mechanism 15.
The temperature adjustment unit 12 is a mounting unit configured to mount a plurality of IC devices 90 thereon, and is referred to as a "temperature equalization plate" capable of collectively heating or cooling the mounted IC devices 90. The temperature equalization plate can heat or cool the IC device 90 before the inspection of the part under inspection 16 in advance, and adjust the temperature to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). In the configuration shown in fig. 2, two temperature adjustment units 12 are disposed and fixed in the Y direction. Then, the IC devices 90 on the tray 200 conveyed from the tray supply area a1 by the tray conveying mechanism 11A are conveyed to an arbitrary temperature adjusting unit 12. Since the temperature adjustment unit 12 as the mounting unit is fixed, the IC device 90 on the temperature adjustment unit 12 can be stably temperature-adjusted.
The device transport head 13 is supported in the supply area a2 so as to be movable in the X direction and the Y direction, and includes a portion movable in the Z direction. Thus, the device transfer head 13 can carry the IC devices 90 between the tray 200 and the temperature adjustment unit 12, which are transferred from the tray supply area a1, and the IC devices 90 between the temperature adjustment unit 12 and the device supply unit 14, which will be described later. In fig. 2, the X-direction movement of the device transfer head 13 is indicated by an arrow α13XThe movement of the equipment transfer head 13 in the Y direction is indicated by arrow alpha13YAnd (4) showing.
The tray conveying mechanism 15 is an empty tray 200 with all the IC devices 90 removed, and the tray 200 is directed to the positive side in the X direction in the supply area a2, that is, the arrow α15And a directional conveying mechanism. After the conveyance, the empty tray 200 is returned from the supply area a2 to the tray supply area a1 by the tray conveying mechanism 11B.
The inspection area a3 is an area where the IC device 90 is inspected. In the inspection area a3, an inspection unit 16 for inspecting the IC device 90 and a device transfer head 17 having a suction unit 3 are provided. Further, a facility supply unit 14 that moves so as to cross the supply area a2 and the inspection area A3, and a facility collection unit 18 that moves so as to cross the inspection area A3 and the collection area a4 are provided.
The device supplying unit 14 is configured as a mounting unit on which the IC device 90 temperature-adjusted by the temperature adjusting unit 12 is mounted, and is capable of transporting the IC device 90 to the vicinity of the inspection unit 16, and is called a "supply shuttle plate" or simply a "supply shuttle".
The device supply unit 14 as the placement unit is disposed between the supply area a2 and the inspection area A3 so as to be movable in the X direction, i.e., arrow α14The direction is supported so as to reciprocate. Thus, the device supplying section 14 can stably carry the IC device 90 from the supply area a2 to the vicinity of the inspection section 16 of the inspection area A3, and can return to the supply area a2 again after the IC device 90 is removed from the inspection area A3 by the device transfer head 17.
In the configuration shown in fig. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is conveyed to any of the device supply units 14. Further, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14, as in the temperature adjustment unit 12. Thus, the IC device 90 whose temperature has been adjusted by the temperature adjuster 12 can be conveyed to the vicinity of the inspection unit 16 in the inspection area a3 while maintaining the temperature adjusted state.
The device transfer head 17 is a type of a transfer unit that holds the IC device 90 in a temperature-adjusted state and transfers the IC device 90 to an operation unit in the inspection area a 3. The device transport head 17 is supported so as to be movable back and forth in the Y direction and the Z direction in the inspection area a3, and is a part of a mechanism called an "index arm". Thus, the device transfer head 17 can transfer and place the IC devices 90 on the device supply unit 14 transferred from the supply area a2 onto the inspection unit 16. In fig. 2, the reciprocating movement of the device transfer head 17 in the Y direction is indicated by arrow α17YAnd (4) showing. In addition, although the equipment delivery head 17 is as capableThe support is supported so as to be movable back and forth in the Y direction and the Z direction, but the support is not limited thereto, and may be supported so as to be movable back and forth in the X direction.
In addition, the device transfer head 17 is configured to be able to heat or cool the held IC device 90, as in the case of the temperature adjustment unit 12. This allows the temperature adjustment state of the IC device 90 to be continuously maintained from the device supply unit 14 to the inspection unit 16.
The inspection unit 16 is configured as a mounting unit for mounting an IC device 90 as an electronic component and inspecting electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probes 163 (see fig. 5 and 6) electrically connected to the terminals 901 of the IC device 90. Further, the terminals 901 of the IC device 90 and the probes 163 are electrically connected, i.e., brought into contact, whereby the IC device 90 can be inspected. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a measuring instrument (not shown) connected to the inspection unit 16. Similarly to the temperature adjustment unit 12, the inspection unit 16 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.
The device collecting unit 18 is configured to be able to place the IC device 90 whose detection is completed in the inspection unit 16 and to transport the IC device 90 to a placement unit of the collecting area a4, and is referred to as a "collecting shuttle" or simply a "collecting shuttle".
In addition, the device collecting section 18 is arranged between the inspection area A3 and the collecting area A4 along the X direction, i.e., arrow a18The direction is supported so as to reciprocate. In the configuration shown in fig. 2, two device collecting units 18 are arranged in the Y direction, similarly to the device supplying unit 14, and the IC device 90 on the inspection unit 16 is transported to and placed on any of the device collecting units 18. This transport is performed by the apparatus transport head 17.
The recovery area a4 is an area where a plurality of IC devices 90 that have been inspected in the inspection area A3 and have completed the inspection are recovered. The collection area a4 is provided with a collection tray 19, a device transport head 20, and a tray transport mechanism 21. In addition, the recovery area a4 is also prepared with empty trays 200.
The recovery tray 19 is a placement portion to be placed on the IC device 90 to be inspected by the inspection unit 16, and is fixed so as not to move within the recovery area a 4. Thus, even in the collection area a4 where a large number of various movable parts such as the device transfer heads 20 are arranged, the IC devices 90 whose inspection has been completed can be stably placed on the collection tray 19. In the configuration shown in fig. 2, three recovery trays 19 are arranged in the X direction.
Three empty trays 200 are also arranged in the X direction. The empty tray 200 is also a placement portion for placing the IC device 90 to be inspected in the inspection portion 16. The IC device 90 on the device collecting unit 18 that has moved to the collecting area a4 is conveyed and placed on either the collecting tray 19 or the empty tray 200. Thereby, the IC devices 90 are sorted and recovered according to the inspection result.
The device transport head 20 is supported in the collection area a4 so as to be movable in the X direction and the Y direction, and further includes a portion movable in the Z direction. Thus, the device transfer head 20 can transfer the IC device 90 from the device collecting unit 18 to the collecting tray 19 or the empty tray 200. In fig. 2, the X-direction movement of the device transfer head 20 is indicated by an arrow α20XThe movement of the apparatus delivery head 20 in the Y direction is shown by arrow alpha20YAnd (4) showing.
The tray conveying mechanism 21 conveys the empty tray 200 conveyed from the tray removing area a5 in the X direction, i.e., arrow α, in the collection area a421And a directional conveying mechanism. After the conveyance, the empty tray 200 can be placed at the position where the IC devices 90 are collected, that is, any one of the three empty trays 200.
The tray removal area a5 is a material removal portion that collects and removes the tray 200 in which the plurality of IC devices 90 in the inspection-completed state are arrayed. In the tray removal area a5, a plurality of trays 200 can be stacked.
Further, tray conveying mechanisms 22A and 22B for conveying each tray 200 in the Y direction are provided so as to straddle the collection area a4 and the tray removal area a 5. The tray conveying mechanism 22A can make the tray 200 in the Y direction, i.e. arrow alpha22AA moving part moving back and forth. Thereby, the IC device 90 having completed the inspection can be conveyed from the recovery area a4 to the tray removal area a 5. The tray conveying mechanism 22B can also move the empty tray 200 for collecting the IC devices 90 to the Y direction positive side, that is, arrow α22BThe direction is moved. This allows the empty tray 200 to be moved from the tray removal area a5 to the collection area a 4.
The control unit 800 can control the operations of the respective units, for example, the tray conveying mechanism 11A, the tray conveying mechanism 11B, the temperature adjustment unit 12, the device conveying head 13, the device supply unit 14, the tray conveying mechanism 15, the inspection unit 16, the device conveying head 17, the device collection unit 18, the device conveying head 20, the tray conveying mechanism 21, the tray conveying mechanism 22A, and the tray conveying mechanism 22B. The control unit 800 can determine the opening and closing of the shutoff solenoid valve 88 based on the flow rate detected by the flow rate sensor 87. This can prevent the working fluid R from leaking from the second space S2 and the duct 81, which will be described later.
The operator can set and confirm the operating conditions and the like of the electronic component inspection apparatus 1 through the monitor 300. The monitor 300 includes a display screen 301 made of, for example, a liquid crystal screen, and is disposed on the upper front side of the electronic component inspection apparatus 1. As shown in fig. 1, a mouse table 600 on which a mouse is placed is provided on the right side of the tray removal area a5 in the drawing. The mouse is used when a screen displayed on the monitor 300 is operated.
Further, an operation panel 700 is disposed at the lower right of the monitor 300 in fig. 1. The operation panel 700 is a device for commanding a desired operation of the electronic component inspection apparatus 1, in addition to the monitor 300.
The signal lamp 400 can inform the operation state of the inspection apparatus 1 and the like by a combination of colors of light emission. The signal lamp 400 is disposed above the inspection apparatus 1. The electronic component inspection apparatus 1 incorporates the speaker 500, and the operation state of the inspection apparatus 1 and the like can be notified by the speaker 500.
In the electronic component inspection apparatus 1, the tray supply area a1 and the supply area a2 are partitioned by a first partition 231, the supply area a2 and the inspection area A3 are partitioned by a second partition 232, the inspection area A3 and the device recovery area a4 are partitioned by a third partition 233, and the device recovery area a4 and the tray removal area a5 are partitioned by a fourth partition 234. The supply area a2 and the facility collection area a4 are also partitioned by a fifth partition 235.
The outermost part of electronic component inspection apparatus 1 is covered with a cover, for example, front cover 241, side cover 242, side cover 243, rear cover 244, and top cover 245.
Fig. 3 is a perspective view showing an apparatus transporting head in which the inspection area in fig. 2 is provided. Fig. 4 to 6 are schematic partial vertical sectional views sequentially showing the operation state of the device transport head provided in the inspection area in fig. 2. In fig. 3, the left side of the drawing shows the state of the second block 33 and the third block 34 attached to the first block 32, and the right side of the drawing shows the state of the second block 33 and the third block 34 detached from the first block 32.
As described above, the device transport head 17 is supported so as to be movable in the Y direction and the Z direction. The device transfer head 17 is used to transfer the IC device 90 within the inspection area a 3. As shown in fig. 4 to 6, the device transport head 17 includes the suction unit 3, the posture adjustment unit 5, and the heat insulation unit 6.
The suction unit 3 is a suction unit configured to be capable of holding the IC device 90 as an electronic component by suction (adsorption). The suction unit 3 includes a suction nozzle 31, a first block 32, a second block 33, and a third block 34. The second block portion 33 and the third block portion 34 correspond to the aforementioned "replacement kit". The second block portion 33 and the third block portion 34 can be replaced, that is, attached and detached, according to the type of the IC device 90. The second block portion 33 and the third block portion 34 are independent from each other, but are not limited thereto and may be integrally formed. The number of suction units 3 provided is one in the configurations shown in fig. 4 to 6, but the present invention is not limited to this, and a plurality of suction units may be provided.
The ejector 72 as a vacuum generation source applies a suction force F3 to the suction portion 3. A negative pressure is generated by the operation of the ejector 72, an appropriate pressure is adjusted by an adjuster 73 serving as a pressure adjusting mechanism, and the inner chamber section 324 and the inner chamber section 333 are brought into a negative pressure by the pipe 71 and the joint 36. Leakage of air can be prevented by the joint 36.
The suction nozzle 31 is capable of sucking the IC device 90, and is formed of a cylindrical member having an inner cavity portion 313 with an upper surface 311 and a lower surface 312 opened. The inner chamber section 313 functions as a flow channel through which air passes. The inner cavity portion 324 and the inner cavity portion 333 are at a negative pressure, and the inner cavity portion 313 communicating therewith is at a negative pressure, that is, air flows upward in the inner cavity portion 313, so that a suction force F3 is generated at the opening portion (suction port) 314 of the lower surface 312. Thereby, the IC device 90 can be sucked with the lower surface 312 as a suction surface. Further, the suction force F3 is reduced until the air flows into the inner cavity 313 and the pressure is increased, that is, the air flows downward in the inner cavity 313 or the air flow upward is stopped, and the IC device 90 can be released (detached) from the lower surface 312. Hereinafter, the direction in which the IC device 90 is attracted, i.e., the direction in which the attraction force F3 acts, will be referred to as "attraction direction α3". In addition, the suction direction α3Facing the positive side in the Z direction (see fig. 5).
The maximum value of the suction force F3 (the maximum suction force of the suction section 3) is not limited, and is, for example, preferably from-95 kPa to-30 kPa, more preferably from-90 kPa to-50 kPa. Further, the suction force F3 of the suction unit 3 can be changed by setting the pressure of the regulator 73. As the regulator 73, for example, an electropneumatic regulator is preferable. This allows suction force F3 to be continuously changed (adjusted). The suction force F3 can adjust the degree of vacuum in the region sealed by the gasket 35 (e.g., an O-ring in the present embodiment) attached to the nozzle 31. In the present embodiment, the vacuum degree of the suction nozzle 31 is set to be constant.
An outer peripheral portion of the suction nozzle 31 has a flange portion 315 having an enlarged outer diameter formed to protrude halfway in the longitudinal direction. The flange 315 abuts against the third block 34, and can prevent the suction nozzle 31 from falling off from the suction unit 3 (see fig. 4). A groove 340 is formed in the outer peripheral portion of the flange 315. The groove 340 is formed annularly along the circumferential direction of the flange portion 315. An annular gasket 43 is disposed in the groove 340. Thereby, the pressure of the second space S2 can be maintained. Further, a groove 150 is formed below the flange portion 315. Forming a slot 150. The guide pins 152 of the third block portion 34 are inserted into the slots 150. This prevents the suction nozzle 31 from rotating relative to the third block 34.
Further, a groove 316 is formed in the outer peripheral portion of the suction nozzle 31 above the flange 315. The groove 316 is formed in a ring shape in the circumferential direction of the suction nozzle 31. An annular gasket 35 is disposed in the groove 316. Thereby, the gasket 35 is compressed between the suction nozzle 31 and the second block 33.
A first block 32 is disposed above the suction nozzle 31. The first block portion 32 is formed of a block-shaped (or plate-shaped) member having a flat upper surface 321 and a flat lower surface 322. The first block portion 32 is provided with a recess 325 that opens at the lower face 322. The portion of the suction nozzle 31 above the flange 315 is inserted into the recess 325. Thereby, the suction nozzle 31 can move in the Z direction. The first block portion 32 has an inner cavity portion 324 opened in the lower surface 322 and the upper surface 321. The inner cavity portion 324 functions as a flow path through which air passes, similarly to the inner cavity portion 313 of the suction nozzle 31.
The joint 36 is air-tightly connected to the inner chamber section 324 from the upper surface 321 side. The nipple 36 is connected to an injector 72 via a pipe 71. A regulator 73 is disposed midway in the pipe 71, i.e., between the joint 36 and the injector 72.
Further, a heater (not shown) for heating the IC device 90 sucked by the suction nozzle 31, for example, may be built in the first block 32.
A second block portion 33 is disposed below the first block portion 32. The second block portion 33 is formed of a block-shaped (or plate-shaped) member having a flat upper surface 331 and a flat lower surface 332, and the upper surface 331 is in contact with the lower surface 322 of the first block portion 32.
The second block 33 has an inner cavity 333 opened in the upper surface 331 and the lower surface 332. The portion of the suction nozzle 31 above the flange 315 is inserted into the cavity 333. Thereby, the suction nozzle 31 can move in the Z direction.
The inner cavity 333 also functions as a flow path through which air passes, and the inner cavity 313 of the suction nozzle 31 and the inner cavity 324 of the first block 32 communicate with each other through the inner cavity 333. This forms a series of flow paths through which air passes.
On the upper surface 331 side of the second block portion 33, a groove 334 opening on the upper surface 331 is formed in an annular shape concentric with the cavity 333. The groove 334 is provided with an annular gasket 37. Thereby, the gasket 37 is compressed between the first block portion 32 and the second block portion 33, and together with the gasket 35, the airtightness of the series of flow paths can be maintained.
The first block portion 32 and the second block portion 33 include an inner cavity portion 336 that communicates an outer peripheral portion of the first block portion 32 and an outer peripheral portion of the second block portion 33. The joint 41 is connected to the inner cavity 336 in an airtight manner from the outside. The joint 41 is connected to the working fluid supply portion 85 through the pipe 8 (pipe 81). The leakage of air can be prevented by the joint 41.
On the upper surface 331 side of the second block portion 33, a groove 338 opening to the upper surface 331 is formed in an annular shape concentric with the inner cavity 336. The groove 338 is provided with an annular gasket 38. Thereby, the gasket 38 is compressed between the first block portion 32 and the second block portion 33, and together with the gasket 35, the airtightness of the series of flow paths can be maintained.
The working fluid supply unit 85 supplies a working fluid R (for example, air) to the first space S1 and the second space S2, which will be described later. By providing the common working fluid supply unit 85 in the first space S1 and the second space S2, the apparatus configuration can be simplified. Further, in the first space S1 and the second space S2, the dedicated working fluid supply units can be omitted. Therefore, the device structure can be further simplified. Further, by allowing the working fluid R to enter and exit the first space S1 and the second space S2, the piston 512 can be slid in the cylinder 511 and the suction nozzle 31 can be slid in the through hole 344 as described later.
Here, although the pressures of the working fluid R supplied to the first space S1 and the second space S2 are the same in the present embodiment, they may be different. The working fluid supply unit 85 can perform suction (collection of the working fluid R) in addition to supply of the working fluid.
A third block portion 34 is disposed below the second block portion 33. The third block portion 34 is formed of a block-shaped (or plate-shaped) member having flat upper and lower surfaces 341 and 342, and the upper surface 341 is in contact with the lower surface 332 of the second block portion 33.
The third portion 34 has a recess 348 formed on the upper surface 341 side thereof, the recess having an open upper surface 341 and being larger than the flange 315 of the mouthpiece 31 in a plan view. In the recess 348, the flange 315 is movable in the Z direction.
As shown in fig. 4, in a state where the flange portion 315 is in contact with the bottom of the recess 348, the limit of movement at the position below the suction nozzle 31 is restricted, and therefore, the suction nozzle 31 can be prevented from falling off. In contrast, in a state where the flange portion 315 is in contact with the lower surface 332 of the second block portion 33, the limit of movement of the position above the suction nozzle 31 is restricted. Note that a movable area where the suction nozzle 31 can move is sufficiently secured to be able to correspond to the thickness of various IC devices 90. The space partitioned by the lower surface 332 of the second block 33 and the second pressure receiving surface M2 functions as the second space S2 to which the working fluid R is supplied.
Further, a through hole 344 penetrating to the lower surface 342 is formed in the bottom of the recess 348. Regardless of the position of the suction nozzle 31, a portion below the flange portion 315 can protrude from the through hole 344.
The third block portion 34 includes guide pins 152. The guide pins 152 are disposed in the third block 34 corresponding to the grooves 150 of the suction nozzle 31. The guide pin 152 is fixed to the third block 34 and protrudes upward. As described above, the guide pins 152 are inserted into the grooves 150 of the suction nozzle 31, whereby the suction nozzle 31 and the concave portion 348 can be positioned. This prevents the suction nozzle 31 from rotating relative to the third block 34.
The attitude adjusting section 5 is disposed above the suction section 3. The posture adjustment unit 5 is referred to as "compliance means" for adjusting the posture of the suction unit 3 in the state shown in fig. 6. The posture adjustment unit 5 includes a first adjustment mechanism 51 and a second adjustment mechanism 52.
The first adjustment mechanism 51 performs the posture adjustment of the suction unit 3 about the X axis and the posture adjustment of the suction unit 3 about the Y axis in the posture adjustment of the suction unit 3.
The first adjustment mechanism 51 includes a cylinder 511 and a piston 512 slidable in the Z direction with respect to the cylinder 511. The cylinder block 511 includes an inner cavity 513 inside. The piston 512 is inserted into the inner side of the inner chamber 513. The piston 512 includes a flange portion 514 and a piston rod 515 that connects the flange portion 514 and the second adjustment mechanism 52. Further, the outer peripheral portion of the flange portion 514 has a round shape. This allows the outer peripheral portion of the piston 512 having rounded corners to change to a posture in which the central axis of the piston 512 is inclined. Therefore, the piston 512 can change its posture so as to follow the orientation of the surface of the contact portion 162 of the inspection portion 16. The round corners of the piston 512 may be omitted, and a gasket separate from the piston 512 may be provided. In this case, the gasket may be made of an elastic body, and the piston 512 may be changed to have a posture in which the central axis thereof is inclined, as described above.
As shown in fig. 4, the cylinder 511 is provided with a through hole 516 penetrating the inner circumferential portion and the outer circumferential portion. The joint 42 is connected to the through hole 516 in an airtight manner from the outside. The joint 42 is connected to the working fluid supply portion 85 through the pipe 8 (pipe 82). Leakage of air can be prevented by the joint 42.
The duct 8 is configured to be branched into the duct 81 and the duct 82 from the middle. Further, a reservoir 83 and a regulator 84 as a pressure adjusting portion are provided between the branch point 86 of the conduit 8 and the working fluid supply portion 85. The regulator 84 is disposed closer to the working fluid supply portion 85 than the tank 83. The regulator 84 regulates the pressure of the working fluid R. The regulator 84 may have the same configuration as the regulator 73.
Two or more electropneumatic regulators may be mounted separately (for the compliance unit and the air spring (in the present embodiment, the mechanism including the second space S2 is referred to as an air spring)).
The reservoir 83 can store the working fluid R supplied from the working fluid supply unit 85 inside, and functions as a backup tank or a buffer tank for the working fluid R. In addition, the inner space of the tank 83 communicates with the second space S2 through the duct 81. That is, the tank 83 functions as a third space communicating with the second space S2. Thus, even if the pressure of the second space S2 fluctuates due to the movement of the suction nozzle 31, the working fluid R flows out to the reservoir 83 or the working fluid R enters from the third space because of the communication with the reservoir 83. Therefore, the internal pressure fluctuation of the second space S2 can be alleviated. As a result, the suction nozzle 31 can stably press the IC device 90. In this way, the accumulator 83 functions as a relaxation section for relaxing the pressure fluctuation in the second space S2.
The electronic component conveying apparatus 10 includes a cutting solenoid valve 88 provided in the duct 81 and serving as an opening/closing portion (valve) for opening/closing the duct 81, and a control portion 800 (see fig. 1) serving as a determination portion for determining opening/closing of the cutting solenoid valve 88 based on the flow rate detected by the flow rate sensor 87. This can prevent the working fluid R from leaking from the second space S2.
In addition, when the working fluid R leaks from the second space S2, the pressure of the first space S1 can be prevented from dropping, and it is difficult to offset the individual difference of the electronic components by the pressure adjustment of the working fluid R of the first space S1.
Further, in particular, when the replacement kit is replaced with a replacement kit including a mechanical spring (in the present embodiment, a mechanism not including the second space S2 is referred to as a mechanical spring), such a problem may occur, and thus, even if the replacement kit including a mechanical spring is mounted, it is possible to prevent the pressure of the first space S1 from being lowered due to air leakage and the contact property from being deteriorated. In addition, setting errors by the operator can be prevented, and stable inspection (contact) can be always performed. The flow sensor 87 may be a sensor for determining whether or not the attached replacement kit is a replacement kit provided with a mechanical spring.
The flow rate sensor 87 is disposed between the shutoff solenoid valve 88 and the second space S2 of the suction unit 3. This cuts the leading end of the solenoid valve 88 for cutting, thereby preventing erroneous detection. For example, when a replacement set including a mechanical spring is attached, the flow rate of the working fluid R is not changed because the leading end of the replacement set is cut off from the cutting solenoid valve 88. Therefore, there is no false detection. In addition, even when the replacement kit is forgotten to be attached, leakage of the working fluid R can be prevented.
A flow sensor 87 for detecting the flow rate of the working fluid R is provided midway in the pipe 81. The flow sensor 87 is located in the pipe 81 and is provided in the vicinity of the shutoff solenoid valve 88. The flow sensor 87 can detect the flow rate between the joint 41 of the pipe 81 and the shutoff solenoid valve 88. As another method of detecting the flow rate of the working fluid R by the flow rate sensor 87, for example, a hot wire flowmeter is used as the flow rate sensor 87, and the flow rate sensor 87 is disposed in the pipe 81 to detect the flow rate of the working fluid R.
The flow sensor 87 may be a sensor capable of detecting 5L/min at maximum. In the flow rate detection of the flow rate sensor 87, the non-leakage state is a flow rate of 0 to 0.3L/min, or may be 0 to 0.1L/min. Alternatively, the flow sensor 87 may be incorporated in the regulator 84.
The flow rate sensor 87 may be configured to detect a flow rate, and is not particularly limited. The flow sensor 87 may be, for example, an electromagnetic flowmeter, a vortex flowmeter, a turbine flowmeter, an area flowmeter, a differential pressure flowmeter, an ultrasonic flowmeter, or a coriolis flowmeter. The flow rate sensor is not limited to the flow rate sensor, and may be, for example, a pressure sensor for detecting the pressure of the working fluid R flowing through the lumen of the pipe. In addition, a sensor capable of detecting a flow rate, such as a temperature sensor, may be used.
A signal indicating the flow rate of the working fluid R detected by the flow rate sensor 87 is input to the control unit 800, and the control unit 800 grasps the flow rate of the working fluid R detected by the flow rate sensor 87. The flow rate sensor 87 may be a sensor that can detect the flow rate of the working fluid R flowing through the pipe 81, may be a sensor that is set in the pipe 81 in advance, or may be installed later.
When the flow rate exceeds the threshold value of the flow rate sensor 87, the shutoff solenoid valve 88 can shut off the working fluid R supplied to the second space S2 of the suction portion 3.
When the flow rate sensor 87 detects a predetermined flow rate of the working fluid R, the control unit 800 can output an alarm. Thereby, the predetermined flow rate can be detected by the alarm. In the leak check, that is, when it is determined whether or not the flow rate of the working fluid R described later is equal to or less than a predetermined value, a warning may be issued when a flow rate of 80% or more (4L/min if the maximum detected flow rate is 5L/min) of the maximum detected flow rate is detected.
A second adjustment mechanism 52 is disposed below the first adjustment mechanism 51. The second adjustment mechanism 52 includes two plate members 521 that are overlapped in the Z direction. The two plate members 521 are relatively movable in the XY plane direction. Thus, the second adjustment mechanism 52 can perform the posture adjustment of the suction unit 3 in the X direction, the posture adjustment of the suction unit 3 in the Y direction, and the posture adjustment of the suction unit 3 about the Z axis in the posture adjustment of the suction unit 3.
The posture adjustment unit 5 is coupled to a mechanism (not shown) for supporting the entire device transport head 17 so as to be movable back and forth in the Y direction and the Z direction via a coupling unit 171.
A heat insulating section 6 is disposed between the suction section 3 and the posture adjustment section 5. The heat insulating portion 6 can prevent or suppress heat from the heater built in the first block portion 32 from being transferred to the posture adjustment portion 5. This prevents the posture adjustment unit 5 from malfunctioning due to the heat, and thus the posture adjustment unit can operate normally, that is, the posture of the suction unit 3 can be accurately adjusted.
In the present embodiment, the heat insulating portion 6 is formed of a plurality of heat insulating members 61 having a columnar shape. Each of the heat insulating members 61 has relatively low thermal conductivity, and a plurality of the heat insulating members are arranged apart from each other. The material of the heat insulating material 61 is not limited, and various heat insulating materials such as glass epoxy resin can be used. The first block 32 and the plate member 521 are connected by the heat insulating members 61 spaced apart from each other, and since the heat insulating members 61 have a gap therebetween, heat transfer between the first block 32 and the plate member 521 can be suppressed.
As described above, the inspection unit 16 is disposed in the inspection area a 3. The inspection unit 16 is a mounting unit on which the IC device 90, which is an electronic component, is mounted, and is a socket for inspecting the IC device 90 in the mounted state. As shown in fig. 5 and 6, the inspection unit 16 includes an inspection unit main body 161, an abutting portion 162, and a probe 163.
The inspection section main body 161 is formed with a recess (depression) 165 for mounting and accommodating the IC device 90. The number of the concave portions 165 is one in the configurations shown in fig. 5 and 6, but the number is not limited to this, and a plurality of concave portions may be provided.
The bottom of the recess 165 is provided with the same number of probes 163 as the terminals 901 of the IC device 90.
The inspection unit (placement unit) 16 has an IC device 90 as an electronic component placed on the inspection unit (placement unit) 16 in the suction direction α3And an electronic component biasing section 166 for biasing. The electronic component biasing unit 166 is constituted by a coil spring incorporated in each probe 163. This makes it possible to bring each terminal 901 of the IC device 90 into sufficient contact with each probe 163 in conjunction with the pressing of the IC device 90 from the suction unit 3 side. Therefore, the inspection of the IC device 90 can be performed accurately.
As described above, the inspection unit 16 as a mounting unit on which the IC device 90 as an electronic component is mounted can be disposed in the inspection area a 3. The inspection unit 16 serving as the placement unit includes an abutment 162. The contact portion 162 is formed of a plate-like member, and is provided to overlap the inspection portion main body 161. Thus, the contact portion 162 can contact the lower surface 342 of the third block portion 34 of the suction portion 3 provided in the device transfer head 17. The device transport head 17 is provided with an attitude adjustment unit 5 capable of adjusting the attitude of the suction unit 3. Here, for example, assume a case where the entire inspection unit 16 is inclined by 1 degree with respect to the XY plane (horizontal plane). Even in such a case, as shown in fig. 6, in a state where the suction unit 3 and the contact portion 162 are in contact with each other, the posture adjustment unit 5 can cause the suction unit 3 to follow the same inclined posture as the inspection unit 16. Such posture adjustment of the suction portion 3 contributes to contact between each terminal 901 of the IC device 90 and each probe 163.
Fig. 7 to 9 are vertical cross-sectional views showing a state in which each terminal can contact each probe of the inspection portion even in an IC device in which the distance (H90) from the lower surface to each terminal of the IC device varies when the lower surface (suction surface) of the suction nozzle is set as a reference. However, in the IC device 90 sucked by the suction nozzle 31, when the lower surface (suction surface) 312 of the suction nozzle 31 is set as a reference, the distance H90 from the lower surface 312 to each terminal 901 may vary. This is because, for example, even with the same type of IC device 90, there are individual differences such as differences in thickness (in design or variations), that is, differences in thickness (see fig. 7 and 8), or bending (see fig. 9) of the IC device 90. Fig. 7 shows a state in which the IC devices 90 themselves have different thicknesses, fig. 8 shows a state in which a thin IC device 90 and a thick IC device 90 are present between each other even in the same type of IC devices 90, and fig. 9 shows a state in which the IC devices 90 themselves are bent. As shown in fig. 7, the case where the deviation occurs in the distance H90 includes: the upper surface (surface in contact with the lower surface 312) of the IC device 90 is parallel to the lower surface (suction surface) 312, and the lower surface (surface on which the terminals 901 are provided) of the IC device 90 is inclined; the upper surface (surface in contact with the lower surface 312) of the IC device 90 is inclined, and the lower surface (surface on which the terminals 901 are provided) of the IC device 90 is parallel to the lower surface (suction surface) 312; and the upper surface (surface in contact with the lower surface 312) of the IC device 90 is inclined, and the lower surface (surface on which the terminals 901 are provided) of the IC device 90 is inclined.
For example, when the distance H90 is relatively small, among the terminals 901, there is a terminal 901 that cannot reach the probe 163 of the inspection unit 16. In this case, it is difficult to perform a precise inspection for the contact failure.
In addition, when the distance H90 is relatively large, although each terminal 901 can reach and contact the probe 163 of the inspection portion 16, there is a terminal 901 whose contact pressure is excessive. In this case, too, it is difficult to perform a correct inspection.
Here, the electronic component inspection apparatus 1 (electronic component transfer apparatus 10) of the present invention is configured to solve such a phenomenon. This structure and operation will be described below with reference to fig. 4 to 6.
[1] As shown in fig. 4, the device transfer head 17 is in a state where the suction unit 3 has not yet sucked the IC device 90. Note that, at this time, the ejector 72 has already performed suction. The working fluid R is supplied to the first space S1 and the second space S2, and the first space S1 and the second space S2 are at positive pressure. The second space S2 is a positive pressure, and the flange 315 of the nozzle 31 is in contact with the bottom of the recess 348 of the third block 34.
[2]Then, the device transfer head 17 can suck the IC device 90 on the device supply unit 14 entering the inspection area a3 by the suction unit 3. Thereby the device is provided withThe device transfer head 17 is in the state shown in fig. 5. In the state shown in fig. 5, the IC device 90 is sucked by the suction nozzle 31 by the suction force F3. In addition, as described above, when the IC device 90 is sucked, the suction nozzle 31 is positioned more to the positive side in the Z direction (the suction direction α) than the state shown in fig. 43) And (4) moving. That is, the flange 315 of the suction nozzle 31 is spaced apart from the bottom of the recess 348 of the third block 34.
Then, by moving the device transfer head 17 while maintaining the state of sucking the IC device 90, the sucked IC device 90 can be disposed directly above the recess 165 of the inspection unit 16.
[3] Thereafter, as shown in fig. 6, the device transport head 17 can lower the suction unit 3 until it comes into contact with the inspection unit 16. Thereby, the suction unit 3 can press and store the IC device 90 into the recess 165 of the inspection unit 16 while following the posture of the inspection unit 16 (hereinafter, this state is referred to as a "pressed and stored state"). At this time, the suction nozzle 31 receives a reaction force from the inspection unit 16 via the IC device 90, and moves to the positive side in the Z direction from the state shown in fig. 5. That is, in the press-accommodating state, the distance separating the flange portion 315 of the suction nozzle 31 from the bottom of the concave portion 348 of the third block 34 is further increased as compared with the state shown in fig. 5.
In this manner, in the press-accommodating state shown in fig. 6, since the suction nozzle 31 is separated from the bottom of the concave portion 348 of the third block 34, the working fluid R is further supplied to the second space S2, whereby the suction nozzle 31 can move in the-Z direction. Therefore, the IC device 90 can be appropriately biased toward the inspection portion 16 by the suction nozzle 31 with a force suitable for inspection. Thus, for example, as shown in fig. 7 to 9, regardless of the size of the distance H90, the terminals 901 of the IC device 90 can be brought into uniform contact (contact) with the probes 163 of the inspection unit 16 without excess or deficiency, and therefore, the IC device 90 can be accurately inspected.
In particular, depending on the degree of individual difference (the above concave-convex shape, etc.) of the IC devices 90, the magnitude of the suction force F3' may vary depending on the types of the IC devices 90, and the suction nozzle 31 may be in a state of being in contact with the bottom of the concave portion 348 of the third block 34 in the press-accommodated state. In this case, it becomes difficult to further press the IC device 90 against the concave portion 165 of the inspection portion 16 by the suction nozzle 31. In contrast, in the electronic component transfer apparatus 10, the supply amount of the working fluid R to the second space S2 can be adjusted. Thus, in the press-accommodated state, the supply amount of the working fluid R can be adjusted so that the suction nozzle 31 is spaced apart from the bottom of the concave portion 348 of the third block 34. Therefore, in the pressed and accommodated state, the IC device 90 can be further pressed against the recess 165 of the inspection unit 16 by the suction nozzle 31.
The third block portion 34 as the second base portion can be brought into contact with the inspection portion 16 as an electronic component mounting portion on which the IC device 90 as an electronic component is mounted. Thus, the third block 34 presses the inspection unit 16, and the posture of the third block 34 can be made to follow the shape of the contact portion 162 of the inspection unit 16. Therefore, the IC device 90 can be brought into contact with the suction nozzle 31 in this copied state. As a result, the terminals 901 of the IC device 90 can be more reliably brought into uniform contact (contact) with the probes 163 of the inspection unit 16 without excess or deficiency, and therefore, the IC device 90 can be accurately inspected.
As shown in fig. 4, the area of the first pressure receiving surface M1 on which the flange portion 514 of the piston 512 serving as the first sliding portion receives the working fluid R in the first space S1 is larger than the area of the second pressure receiving surface M2 on which the nozzle 31 serving as the second sliding portion receives the working fluid R in the second space S2. Thus, in the configuration in which the working fluid R of the same pressure is supplied to the first space S1 and the second space S2 as in the present embodiment, the force received by the second pressure receiving surface M2 from the working fluid R can be made smaller than the force received by the first pressure receiving surface M1 from the working fluid R. As a result, the force (second contact force) with which the IC device 90 is pressed by the suction nozzle 31 can be made smaller than the contact force (first contact force) with which the inspection portion 16 is pressed by the third block portion 34. Therefore, the IC device 90 can be prevented from being excessively pressed by the suction nozzle 31.
In this way, in the electronic component transfer apparatus 10, the contact force (second contact force) with which the suction nozzle 31 as the second sliding portion contacts the IC device 90 as the electronic component is different from the contact force (first contact force) with which the third block 34 as a part of the second base portion contacts the inspection portion 16 as the electronic component mounting portion. In the present embodiment, as described above, since the second abutting force is smaller than the first abutting force, the IC device 90 can be prevented from being excessively pressed by the suction nozzle 31.
The first pressure receiving surface M1 presses the entire suction unit 3, which is a portion below the first pressure receiving surface M1. On the other hand, the second pressure receiving surface M2 presses a portion of the nozzle 31 that is lower than the second pressure receiving surface M2. Therefore, the pressing force of the first pressure receiving surface M1 is preferably made larger than the pressing force of the second pressure receiving surface M2. Accordingly, the area of the first pressure receiving surface M1 is larger than the area of the second pressure receiving surface M2.
The area of the first pressure receiving surface M1 is preferably 2 times or more and 20 times or less, and more preferably 3 times or more and 15 times or less, the area of the second pressure receiving surface M2. This can more reliably exhibit the above-described effects.
In the present embodiment, the piston 512 as the first sliding portion and the third block portion 34 as the second base portion are formed separately, but may be formed integrally.
Fig. 10 is a flowchart showing an opening and closing process of the solenoid valve for shutoff 88. First, in step S10, the control unit 800 turns off the shutoff solenoid valve 88. The control unit 800 cuts off the working fluid R. After the process of step S10 is completed, control unit 800 advances the process to step S20.
Next, in step S20, the control unit 800 determines whether or not the flow rate of the working fluid R detected by the flow rate sensor 87 is 0L/min. When the flow rate detected by the flow rate sensor 87 is 0L/min, the control unit 800 determines yes and advances the process to step S40. When the flow rate detected by the flow rate sensor 87 is not less than 0L/min, the control unit 800 determines no, and advances the process to step S30.
Next, in step S30, the control unit 800 resets the value of the flow rate detected by the flow rate sensor 87 to 0L/min. After the process of step S30 is completed, control unit 800 advances the process to step S20.
Next, in step S40, the control unit 800 turns on the shutoff solenoid valve 88. The control unit 800 supplies the working fluid R. After the process of step S40 is completed, control unit 800 advances the process to step S50.
Next, in step S50, the control unit 800 determines whether or not the flow rate of the working fluid R detected by the flow rate sensor 87 is 0.1L/min or less (leak check). When the flow rate detected by the flow rate sensor 87 is 0.1L/min or less, the control unit 800 determines yes and completes the process. In the case of yes, the control unit 800 may determine that there is no leakage. When the flow rate detected by the flow rate sensor 87 exceeds 0.1L/min, the control unit 800 determines no, and advances the process to step S60. If not, the control unit 800 may determine that there is a leak.
Next, in step S60, the control unit 800 turns off the shutoff solenoid valve 88. The control portion 800 recognizes that the working fluid R leaks from the second space S2 or the pipe 81 to disconnect the solenoid valve 88 for cutoff. Thus, by detecting the flow rate of the working fluid R in the duct 81, it is possible to detect whether the working fluid R leaks from the second space S2 and the duct 81. After the process of step S60 is completed, control unit 800 completes the process.
In step S50, the control unit 800 may cause the working fluid R to flow at the maximum pressure. For example, the pressure of the working fluid R is set to 0.5MPa by the regulator 84. Then, the normal pressure is returned after the leak check. For example, the pressure of the working fluid R is set to 0.1MPa by the regulator 84. Further, when the flow rate of the working fluid R detected by the flow rate sensor 87 exceeds 5L/min, the control unit 800 may recognize that the replacement kit is not attached and issue an alarm.
If yes in step S50, that is, if there is no leakage, the control unit 800 may further determine that the replacement kit to be attached is not a replacement kit including a mechanical spring. In the case of no in step S50, that is, in the case of a leak, the control unit 800 may further determine that the replacement kit to be attached is a replacement kit including a mechanical spring.
Further, the second abutting force in the case of yes at step S50, that is, in the case of no leakage, and the second abutting force in the case of no at step S50, that is, in the case of leakage may be selected to have different values. For example, the second contact force in the case where there is no leakage may be selected based on the size of the cylinder inner diameter, or the second contact force in the case where there is leakage may be selected based on the size of the cylinder inner diameter of the first sliding portion (piston 512).
In this case, the control unit 800 may select an equation based on the cylinder bore size from the plurality of equations, calculate and select the second contact force in the case where there is no leakage based on the selected equation, or the control unit 800 may select a value based on the cylinder bore size from the plurality of values, and select the second contact force in the case where there is no leakage.
In this case, the control unit 800 may select an equation based on the magnitude of the cylinder inner diameter of the first sliding portion (piston 512) from among the plurality of equations, calculate and select the second contact force in the case where there is a leak based on the selected equation, or the control unit 800 may select a value based on the magnitude of the cylinder inner diameter of the first sliding portion (piston 512) from among a plurality of values, and select the second contact force in the case where there is a leak. The plurality of equations may be equations stored in advance in a storage unit (not shown) or may be equations inputted from the outside, and the plurality of values may be values stored in advance in the storage unit or may be values inputted from the outside.
< second embodiment >
Fig. 11 is a schematic partial vertical sectional view of the apparatus transfer head according to the present embodiment. Hereinafter, a second embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to fig. 11, and differences from the above-described embodiments will be mainly described, and descriptions of the same matters will be omitted.
This embodiment is the same as the first embodiment except that the electronic component, the second base, and the inspection unit have different structures.
In the present embodiment, the IC device 90 includes a substrate 902 and a protrusion 903 protruding from the + Z side surface of the substrate 902. A plurality of terminals 901 are provided on the-Z side surface of the substrate 902. The size of the protrusion 903 in plan view is substantially the same as the size of the lower end surface of the nozzle 31.
In the electronic component transfer apparatus 10, the recess 165 of the inspection unit 16 is sized to allow the substrate 902 to enter.
In the present embodiment, the pipe 81 and the pipe 82 are formed of independent flow paths, and the pipe 81 and the pipe 82 are connected to the tank 83, the regulator 84, and the working fluid supply unit 85, respectively. Thereby, the pressures of the first space S1 and the second space S2 can be independently adjusted. That is, the pressure of the working fluid R (not shown) flowing to the first space S1 and the pressure of the working fluid R flowing to the second space S2 can be changed and set independently. Therefore, the force with which the suction nozzle 31 presses the IC device 90 and the force with which the third block 34 presses the IC device 90 and the inspection portion 16 can be independently adjusted. Although not shown, such a configuration is advantageous in that the design for setting the ratio of the first pressure receiving surface M1 to the second pressure receiving surface M2 to a desired value can be omitted. The pressure in the first space S1 and the second space S2 can be set to operate on the monitor 300 shown in fig. 1.
Further, with this configuration, the contact force with which the nozzle 31 as the second slide portion contacts the IC device 90 as the electronic component can be made different from the contact force with which the third block portion 34 as a part of the second base portion contacts the IC device 90 as the electronic component. Thus, for example, when the load on the substrate 902 is to be reduced, the contact force on the substrate 902 can be made weaker than the contact force on the protrusion 903, and when the load on the protrusion 903 is to be reduced, the contact force on the protrusion 903 can be made weaker than the contact force on the substrate 902.
In the electronic component conveying apparatus 10, the third block portion 34 of the suction portion 3 includes a protrusion 346 protruding in the-Z direction from the lower surface 342. The protrusion 346 enters the recess 165 of the inspection unit 16 in a press-receiving state. In addition, the protruding portion 346 abuts against the substrate 902 of the IC device 90 in the press-accommodated state. That is, the protrusion 346 which is a part of the second base portion can be brought into contact with the substrate 902 which is a part of the IC device 90 which is an electronic component. Thereby, the protruding portion 346 can press the substrate 902 of the IC device 90.
In addition, in the press-accommodated state, the protruding portion 903 of the IC device 90 enters the through hole 344 of the third block 34, and is pressed by the suction nozzle 31. The protruding portion 346 of the third block 34 which is a part of the second base and the suction nozzle 31 which is the second slider abut on different positions with respect to the IC device 90 which is an electronic component. Thereby, the protrusion 346 can be pressed against the substrate 902 of the IC device 90, and the nozzle 31 can be pressed against the protrusion 903 of the IC device 90.
In the pressed state, the lower surface 342 of the third block 34 abuts against the abutment portion 162 of the inspection unit 16, and the inspection unit 16 is pressed by the third block 34.
In this way, in the present embodiment, the nozzle 31 presses the protrusion 903 of the IC device 90, the protrusion 346 of the third block 34 presses the substrate 902 of the IC device 90, and the lower surface 342 of the third block 34 presses the inspection portion 16. Thus, even in the IC device 90 having a step as in the present embodiment, the terminals 901 of the IC device 90 can be brought into uniform contact (contact) with the probes 163 of the inspection unit 16 without excess or deficiency, and therefore, the IC device 90 can be accurately inspected.
< third embodiment >
Fig. 12 is a schematic partial vertical sectional view of the apparatus transfer head according to the present embodiment. Hereinafter, a third embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to fig. 12, and differences from the above-described embodiments will be mainly described, and descriptions of the same matters will be omitted.
This embodiment is the same as the second embodiment except that the electronic component and the second base have different structures.
In the present embodiment, the IC device 90 is a device in which the center S903 of the protrusion 903 and the center S902 of the substrate 902 are displaced in the X direction and the Y direction. That is, the protrusion 903 is disposed eccentrically with respect to the substrate 902. The term "center" refers to a point of intersection of two diagonal lines when the shape in plan view is a quadrangle.
In the present embodiment, the through-hole 344 is disposed offset in the X direction and the Y direction with respect to the center of the protrusion 346 of the third block 34 in accordance with the offset between the center S902 and the center S903. That is, the through hole 344 is disposed eccentrically with respect to the protrusion 346. This allows the nozzle 31 sliding in the through hole 344 to press the protrusion 903 of the IC device 90.
As described above, in the present embodiment, even if the center S903 of the protruding portion 903 and the center S902 of the substrate 902 are displaced in the X direction and the Y direction, the terminals 901 of the IC device 90 can be brought into uniform contact (contact) with the probes 163 of the inspection portion 16 without excess or deficiency, and therefore, the inspection of the IC device 90 can be accurately performed.
< fourth embodiment >
Fig. 13 is a schematic partial vertical cross-sectional view of the apparatus transport head and the movable portion according to the present embodiment. Hereinafter, a fourth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to fig. 13, and differences from the above-described embodiments will be mainly described, and descriptions of the same matters will be omitted.
This embodiment is the same as the second embodiment except for the structure of the inspection unit. As shown in fig. 13, the device supply unit 14 is a pre-inspection electronic component mounting unit on which the IC device 90, which is an electronic component before inspection, is mounted, and the device collection unit 18 is a post-inspection electronic component mounting unit on which the IC device 90, which is an electronic component after inspection, is mounted. As shown in fig. 13, the device supply unit 14 and the device collection unit 18 are unitized as a movable unit 30 on which an IC device 90 as an electronic component can be placed and moved. The movable unit 30 includes an X-direction moving mechanism 7 in addition to the device supply unit 14 and the device collection unit 18.
The device supply section 14 is formed in a recessed portion (depression) 141 in which the IC device 90 is placed and housed. In the present embodiment, it is preferable that the number of the recesses 141 is eight, and the arrangement thereof is the same as the arrangement of the eight suction portions 3 of the device transport head 17A and the device transport head 17B, that is, four recesses are arranged in the X direction and four recesses are arranged in the Y direction.
The device collection unit 18 is also formed with a recess (dimple) 181 in which the IC device 90 is placed and housed. In the present embodiment, it is preferable that the number of the recesses 181 is eight, and the arrangement is the same as the arrangement of the eight suction portions 3 of the device transport head 17, that is, four recesses are arranged in the X direction and four recesses are arranged in the Y direction.
The X-direction moving mechanism 7 includes a linear guide 71A and a support base 72A that supports the equipment supply unit 14 and the equipment collection unit 18 together. The linear guide 71A includes a guide 711A and two sliders 712A. A support base 72A is fixed to the two sliders 712A.
The electronic component transfer apparatus 10 includes a force detection unit 9 that is provided in the movable unit 30 (in the illustrated configuration, the device supply unit 14) and is capable of detecting a force. The force detection unit 9 is disposed on the pad 73A of the device supply unit 14.
The force detection unit 9 is not limited, and for example, a load sensor is preferably used. The load cell incorporates a strain gauge, which is a transducer that converts the magnitude of force into an electrical signal. This makes it possible to detect the contact force F90 as accurately as possible, not as a design value (calculated value) but as an actual measurement value.
The detection result detected by the force detection unit 9, that is, the magnitude of the contact force, is stored in a storage unit (not shown) of the control unit 800.
The force detection unit 9 is disposed on the pad 73A of the device supply unit 14 and can be brought into contact with the IC device 90, which is an electronic component that is brought into contact with (sucked by) the suction nozzle 31, which is a second slide unit.
In the present embodiment, for example, as shown in fig. 13, before the IC device 90 is set in the press-accommodated state, that is, before the IC device is inspected, the IC device 90 is pressed against the force detection unit 9, and the contact force F90 is detected. Then, the pressing force can be adjusted based on the detected contact force F90.
As the timing of detecting the abutting force F90, for example, it is preferable to detect the position at which the position where the IC device 90 starts to abut against the force detecting unit 9 is further lowered by 0.1mm to 2.0 mm.
In the contact force detection described above, a force detection member having the same size as the IC device 90 may be used instead of the IC device.
< fifth embodiment >
Fig. 14 is a schematic partial vertical sectional view of the apparatus transfer head according to the present embodiment. Hereinafter, a fifth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to fig. 14, and differences from the above-described embodiments will be mainly described, and descriptions of the same matters will be omitted.
This embodiment is the same as the first embodiment except for the structure of the first sliding portion. As shown in fig. 14, a diaphragm 53 having elasticity is provided inside the cylinder 511. The diaphragm 53 is provided midway in the Z direction of the cylinder 511 and is located on the-Z side of the through hole 516. The lower surface 531 of the diaphragm 53 abuts on the flange 514 of the piston 512. Although not shown, the diaphragm 53 is parallel to the X axis and the Y axis in a natural state. In the present embodiment, the space on the + Z side of the diaphragm 53 is the first space S1.
As shown in fig. 14, in a state where the piston 512 pushes up the diaphragm 53 to the + Z side to deform the diaphragm 53, the piston 512 receives a restoring force to restore the diaphragm 53 to a natural state. Thus, the membrane 53 can be parallel to the XY plane. As a result, the third block 34 can press the inspection unit 16 in a state where parallelism is generated.
The flow sensor 87 may be disposed between the shutoff solenoid valve 88 and the reservoir 83. When the working fluid R is supplied to the second space S2 of the suction unit 3 of another equipment transfer head and the pipe 81 is branched from the pipe 80, the flow sensor 87 may be provided between the branching point 89 of the pipe 81 and the tank 83. Thus, even in the case of only one flow sensor 87, for example, when the shutoff solenoid valve 88 provided in the line 81 is off (shut off) and the shutoff solenoid valve provided in the line 80 is on (connected), it is possible to detect the leakage of the working fluid R of the facility delivery head connected to the line 80.
< sixth embodiment >
Fig. 15 is a schematic partial vertical sectional view of the apparatus transfer head according to the present embodiment. Hereinafter, a sixth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to fig. 15, and differences from the above-described embodiments will be mainly described, and descriptions of the same matters will be omitted.
This embodiment is the same as the first embodiment except for the configuration of the replacement kit. As shown in fig. 15, when the working fluid R continuously leaks from the inner chamber portion 336 by installing the replacement kit including the mechanical spring, the pressure of the first space S1 also decreases, and it is difficult to compensate for individual differences of the IC devices 90 by adjusting the pressure of the working fluid R in the first space S1.
In the present embodiment, the flow sensor 87 detects the amount of leakage of the working fluid R, and automatically determines whether or not the replacement kit to be attached includes an air spring, and the supply of the working fluid R can be shut off when the replacement kit does not include an air spring, that is, when the replacement kit includes a mechanical spring. The shutoff solenoid valve 88 prevents the working fluid R from leaking from the inner chamber portion 336.
Further, since the end of the flow sensor 87 is cut off from the cutting solenoid valve 88, the flow rate of the fluid is not changed in the flow sensor 87. Therefore, there is no false detection. In addition, even when the replacement set is forgotten to be attached, the working fluid R can be prevented from leaking from the cavity portion 336.
The electronic component transfer device and the electronic component inspection device according to the present invention have been described above with reference to the illustrated embodiments, but the present invention is not limited thereto, and each part constituting the electronic component transfer device and the electronic component inspection device may be replaced with any structure capable of exhibiting the same function. In addition, any structure can be added. For example, although the device transfer head 17 is described as the transfer unit of the present invention, the transfer unit may be a device that transfers the IC device, and the transfer unit of the present invention may be provided in the device transfer head 13 or the device transfer head 20.
In addition, in the electronic component transfer apparatus and the electronic component inspection apparatus according to the present invention, any two or more configurations (features) of the above-described embodiments may be combined.

Claims (14)

1. An electronic component conveying apparatus that conveys an electronic component to an inspection section that inspects electrical characteristics of the electronic component, the electronic component conveying apparatus comprising:
a conveying unit that conveys the electronic component to the inspection unit, the conveying unit including a first component and a second component, the first component including a first base portion, a first slide portion, and a first space defined by the first base portion and the first slide portion, the first slide portion being provided inside the first base portion and sliding with respect to the first base portion, the first slide portion being changeable to a posture in which a central axis is inclined, the second component including a second base portion attached to the first slide portion, a second slide portion sliding with respect to the second base portion and abutting against the electronic component, and a second space defined by the second base portion and the second slide portion;
a duct portion having a flow path that communicates with the second space and supplies a working fluid to the second space;
a flow rate sensor disposed in the flow path and detecting a flow rate of the working fluid;
a pressure adjusting unit that adjusts the pressure of the working fluid; and
a control unit that causes the second sliding unit to hold the electronic component and causes the second sliding unit to press the electronic component to the inspection unit,
the working fluid flows into the first space and the second space,
the first member adjusts the attitude of the second member by the working fluid.
2. The electronic component transfer apparatus according to claim 1,
the electronic component conveying device is provided with an opening and closing part which is arranged on the flow path and opens and closes the flow path,
the control unit determines opening and closing of the opening and closing unit based on the flow rate detected by the flow rate sensor.
3. The electronic component transfer apparatus according to claim 2,
the flow sensor is disposed in the flow path between the opening/closing portion and the second space.
4. The electronic component transfer apparatus according to claim 2,
and if the flow sensor detects the preset flow of the working fluid, the control part outputs an alarm.
5. The electronic component transfer apparatus according to claim 1,
the electronic component conveying device is provided with an electronic component placing part for placing the electronic component,
the second base portion abuts against the electronic component mounting portion.
6. The electronic component transfer apparatus according to claim 5,
the force with which the second sliding portion presses the electronic component is different from the force with which the second base portion presses the electronic component placement portion.
7. The electronic component transfer apparatus according to claim 1,
the electronic component conveying device includes a working fluid supply unit that supplies the working fluid to the first space and the second space.
8. The electronic component transfer apparatus according to claim 1,
the electronic component conveying device includes a relaxation section configured to relax a pressure variation in the second space, and the relaxation section is disposed in the flow path between the pressure adjusting section and the second component, and the working fluid flows from the second space into the relaxation section.
9. The electronic component transfer apparatus according to claim 1,
the first sliding portion has a first pressure receiving surface that receives a force from the working fluid,
the second sliding portion has a second pressure receiving surface receiving a force from the working fluid,
the area of the first pressure receiving surface is larger than that of the second pressure receiving surface.
10. The electronic component transfer apparatus according to claim 1,
the second base portion abuts against the electronic component.
11. The electronic component transfer apparatus according to claim 10,
the force with which the second sliding portion presses the electronic component is different from the force with which the second base portion presses the electronic component.
12. The electronic component transfer apparatus according to claim 1,
the pressure of the working fluid flowing into the first space is different from the pressure of the working fluid flowing into the second space.
13. The electronic component transfer apparatus according to claim 1,
the electronic component conveying device is provided with:
a movable section for placing and moving the electronic component; and
a force detection unit provided in the movable unit for detecting a force,
the force detection unit is in contact with the electronic component.
14. An electronic component inspection apparatus, comprising:
an inspection unit for inspecting electrical characteristics of the electronic component;
a conveying unit that conveys the electronic component to the inspection unit, the conveying unit including a first component and a second component, the first component including a first base portion, a first slide portion, and a first space defined by the first base portion and the first slide portion, the first slide portion being provided inside the first base portion and sliding with respect to the first base portion, the first slide portion being changeable to a posture in which a central axis is inclined, the second component including a second base portion attached to the first slide portion, a second slide portion sliding with respect to the second base portion and abutting against the electronic component, and a second space defined by the second base portion and the second slide portion;
a duct portion having a flow path that communicates with the second space and supplies a working fluid to the second space;
a flow rate sensor disposed in the flow path and detecting a flow rate of the working fluid;
a pressure adjusting unit that adjusts the pressure of the working fluid; and
a control unit that causes the second sliding unit to hold the electronic component and causes the second sliding unit to press the electronic component to the inspection unit,
the working fluid flows into the first space and the second space,
the first member adjusts the attitude of the second member by the working fluid.
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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI748577B (en) * 2020-07-24 2021-12-01 鴻勁精密股份有限公司 Detection unit for connecting apparatus and handler having the same

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145220A (en) * 1997-10-06 1999-05-28 Samsung Electron Co Ltd Performance board for semiconductor tester and semiconductor tester with the board
JP2000105267A (en) * 1998-09-29 2000-04-11 Matsushita Electronics Industry Corp Semiconductor part inspecting device
JP2000193716A (en) * 1998-12-25 2000-07-14 Shinano Electronics:Kk Ic test handler
JP2000340321A (en) * 1999-05-25 2000-12-08 Nec Corp Contactor for ic socket
JP2003161758A (en) * 2001-11-28 2003-06-06 Nec Machinery Corp Contact method for electrode terminal
CN1720460A (en) * 2002-12-04 2006-01-11 株式会社爱德万测试 Pressing member and electronic component handling device
CN101228448A (en) * 2005-07-21 2008-07-23 爱德万测试株式会社 Pusher, pusher unit as well as semiconductor test device
CN101617241A (en) * 2007-02-23 2009-12-30 株式会社爱德万测试 Electronic unit press device and apparatus for electronic device test
CN104122462A (en) * 2013-04-23 2014-10-29 精工爱普生株式会社 Handler and inspection apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI524077B (en) * 2013-12-03 2016-03-01 Tohoku Seiki Ind Co Ltd IC processor
JP2016075550A (en) * 2014-10-06 2016-05-12 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device
TWI603096B (en) * 2015-06-19 2017-10-21 Seiko Epson Corp Electronic parts conveying apparatus and electronic parts inspection apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145220A (en) * 1997-10-06 1999-05-28 Samsung Electron Co Ltd Performance board for semiconductor tester and semiconductor tester with the board
JP2000105267A (en) * 1998-09-29 2000-04-11 Matsushita Electronics Industry Corp Semiconductor part inspecting device
JP2000193716A (en) * 1998-12-25 2000-07-14 Shinano Electronics:Kk Ic test handler
JP2000340321A (en) * 1999-05-25 2000-12-08 Nec Corp Contactor for ic socket
JP2003161758A (en) * 2001-11-28 2003-06-06 Nec Machinery Corp Contact method for electrode terminal
CN1720460A (en) * 2002-12-04 2006-01-11 株式会社爱德万测试 Pressing member and electronic component handling device
CN101228448A (en) * 2005-07-21 2008-07-23 爱德万测试株式会社 Pusher, pusher unit as well as semiconductor test device
CN101617241A (en) * 2007-02-23 2009-12-30 株式会社爱德万测试 Electronic unit press device and apparatus for electronic device test
CN104122462A (en) * 2013-04-23 2014-10-29 精工爱普生株式会社 Handler and inspection apparatus

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