TW201939043A - Electronic component conveying device and electronic component inspection device capable of allowing each terminal of an electronic component to uniformly contact each terminal of an inspection unit - Google Patents

Abstract

The present invention provides an electronic component conveying device and an electronic component inspection device capable of allowing each terminal of an electronic component to uniformly contact each terminal of an inspection unit when an electrical inspection of the electronic component is performed by the inspection unit. The electronic component conveying device 10 of the present invention includes a conveying unit which has a first member 5 and a second member 3, wherein the first member 5 has a first base portion 511 and a first sliding portion 512 that slides with respect to the first base portion 511, and the second member 3 has a second base portion 34 that is detachably disposed on the first sliding portion 512 and a second sliding portion 31 that slides with respect to the second base portion 34 and abuts against the electronic component; a flow path 81 which communicates with a second space S2 and supplies an actuating fluid R to the second space S2; a flow sensor 87 which is disposed in the flow path 81 for detecting a flow rate of the actuating fluid R; and a pressure regulating unit 84 which adjusts the pressure of the actuating fluid R. The first member 5 forms a first space S1 between the first base portion 511 and the first sliding portion 512. The second member 3 forms a second space S2 between the second base portion 34 and the second sliding portion 31. The second sliding portion 31 is used to hold the electronic component and push the electronic component to a probe pin of the inspection unit.

Description

Electronic component transfer device and electronic component inspection device

The invention relates to an electronic component conveying device and an electronic component inspection device.

There has been known a test device that tests electronic components such as IC (Integrated Circuit) packages (see, for example, Patent Document 1). The test device described in Patent Document 1 includes a push rod that presses the electronic component to a test socket while holding the electronic component, and a pressure detection unit connected to the push rod and detects the push rod. The pressure (pushing force) when the lever pushes the electronic part to the socket. Furthermore, in the test device described in Patent Document 1, when a test for an electronic component is performed, it can be detected whether or not the pusher has pushed the electronic component to the socket with a specific pressure based on a detection result of the pressure detection unit. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2003-161758

[Problems to be solved by the invention]

However, in the test device described in Patent Document 1, for example, according to the size (thickness) or shape (warped or inclined shape) of the electronic component, the parallelism between the electronic component mounting portion (socket) and the pusher, etc. The terminals of the solder balls of the parts and the contacts of the sockets may not evenly contact. In addition, if the terminals of the solder balls and the contact pins are unevenly contacted, there is a possibility that the test for electronic parts cannot be performed accurately. [Technical means to solve the problem]

The present invention has been made in order to solve the above problems, and can be implemented as the following forms or application examples.

[Application Example 1] The electronic component transfer device according to this embodiment is characterized by including a transfer unit having a first member and a second member, the first member having a first base portion, and a first member sliding relative to the first base portion. 1 sliding part, the second member has a second base part which is arranged on the first sliding part and is detachable, and a second sliding part which slides on the second base part and abuts on the electronic component; 2 is in communication with each other, and supplies an actuating fluid to the second space; a flow rate sensor provided in the flow path and detecting the flow rate of the actuating fluid; and a pressure regulating unit that adjusts the pressure of the actuating fluid; and the first One member forms a first space between the first base portion and the first sliding portion, and the second member forms the second space between the second base portion and the second sliding portion, and is held by the second sliding portion. The electronic component is pushed to the probe pin of the inspection part.

According to this embodiment, when an electrical inspection of an electronic part is performed by the inspection unit, the terminals of the electronic part can be uniformly abutted against the terminals of the inspection unit regardless of the individual difference of the electronic parts. Perform this check.

[Application Example 2] In the electronic component transfer device described in the application example, it is preferable that the working fluid can enter and exit the first space and the second space.

According to this application example, the first sliding portion can be slid, and the second sliding portion can be slid.

[Application Example 3] In the electronic component conveying device described in the above application example, it is preferable that the electronic component transfer device includes: an opening and closing section provided in the flow path to open and close the flow path; and a determination section based on the flow rate sense. The flow rate detected by the detector determines the opening and closing of the opening and closing section.

According to this application example, leakage of the working fluid from the second space can be prevented.

[Application Example 4] In the electronic component conveying device described in the application example, it is preferable that the flow sensor is disposed between the opening and closing section and the second space of the second member.

According to this application example, since the front end is blocked more than the opening / closing part, false detection can be prevented.

[Application Example 5] In the electronic component transporting device described in the application example, preferably, if the flow sensor detects a specific flow rate of the working fluid, the determination unit outputs a warning.

According to this application example, a specific flow rate can be detected by a warning.

[Application Example 6] In the electronic component conveying device described in the above application example, it is preferable that the second base portion can be abutted to an electronic component placement portion on which the electronic component is placed.

According to this application example, the posture of the second base portion can be set to a state that imitates the shape of the electronic component placement portion. Thereby, the second sliding portion can be brought into contact with the electronic component in this emulated state. As a result, for example, in a case where the electronic component mounting portion is an electronic inspector for electronic components, even when the parallelism between the electronic component mounting portion (socket) and the pusher does not occur, It helps to make full contact between each terminal of the electronic component and each terminal of the mounting portion.

[Application Example 7] In the electronic component conveying device described in the above application example, it is preferable that the contact force of the second sliding portion abutting the electronic component and the second base portion abutting the electronic component placement portion The abutment force is different.

According to this application example, for example, by making the contact force of the second sliding portion contacting the electronic component smaller than the contact force of the second base portion contacting the electronic component mounting portion, the above-mentioned effect can be exerted while preventing the electronic component from being excessively pressed. Push.

[Application Example 8] In the electronic component transporting device described in the above application example, it is preferable to include an operating fluid supply unit that supplies the operating fluid to the first space and the second space.

According to this application example, by providing a common operating fluid supply unit in the first space and the second space, the device configuration can be simplified.

[Application Example 9] In the electronic component transporting device described in the application example described above, it is preferable to have a third space, and the third space communicates with the second space.

According to this application example, it is possible to suppress a change in the pressure in the second space in accordance with the installation of the third space.

[Application Example 10] In the electronic component transporting device described in the above application example, it is preferable that an area of the first pressure receiving surface of the first sliding portion receiving the working fluid is larger than an area of the second sliding portion receiving the working fluid. The area of the second pressure surface.

According to this application example, when the pressure in the first space and the second space are the same, the force applied to the first sliding portion can be made larger than the force applied to the second sliding portion.

[Application Example 11] In the electronic component transporting device described in the application example, it is preferable that the second base portion can be in contact with a part of the electronic component.

According to this application example, for example, the second sliding portion can press the remaining portion of the electronic component in a state where the second base portion presses a portion of the electronic component.

[Application Example 12] In the electronic component conveying device described in the above application example, it is preferable that the contact force with which the second sliding portion abuts the electronic component and the contact force with which the second base portion abuts the electronic component different.

According to this application example, it is possible to reduce the load on the portion where the second sliding portion and the electronic component abut the electronic component, or reduce the load on the portion where the second base portion and the electronic component abut the electronic component. That is, the contact force can be different depending on the location of the electronic component.

[Application Example 13] In the electronic component conveying device described in the above application example, it is preferable that the second base portion and the second sliding portion abut at different positions with respect to the electronic component.

According to this application example, for example, the second sliding portion can press the remaining portion of the electronic component in a state where the second base portion presses a portion of the electronic component.

[Application Example 14] In the electronic component transporting device described in the application example, it is preferable that the pressure of the working fluid to the first space and the pressure of the working fluid to the second space can be changed, respectively.

According to this application example, the force applied to the first sliding portion can be made different from the force applied to the second sliding portion.

[Application Example 15] In the electronic component conveying device described in the above application example, it is preferable that the electronic component transfer device includes: a movable section capable of placing and moving the electronic component; and a force detection section provided in the movable section and capable of Detecting force; the force detecting section can be in contact with the electronic component that is in contact with the second sliding section.

According to this application example, for example, when inspecting an electronic component using the inspection section, the actual contact force when the electronic component that is in contact with the second sliding section is brought into contact with the inspection section may be replaced with the use force detection. Contact force detected by the Ministry. In addition, based on the magnitude of the abutment force detected by the force detection unit, it can be determined whether the abutment force at the time of the inspection of the electronic component is exactly the size of the electronic component.

[Application Example 16] The electronic component inspection device according to this embodiment is characterized by including a conveying unit including a first member and a second member, the first member having a first base portion, and a first member sliding relative to the first base portion. 1 sliding part, the second member has a second base part which is arranged on the first sliding part and is detachable, and a second sliding part which slides on the second base part and abuts on the electronic component; 2 spaces communicate with each other, and supply an actuating fluid to the second space; a flow sensor provided in the flow path and detecting the flow rate of the actuating fluid; a pressure regulating unit that adjusts the pressure of the actuating fluid; and an inspection unit, It inspects the electronic component, and the first member forms a first space between the first base portion and the first sliding portion, and the second member forms the second space between the second base portion and the second sliding portion. In the space, the electronic component is held by the second sliding portion, and the electronic component is pushed to a probe pin of the inspection portion.

According to this embodiment, the pressure of the working fluid in the first space and the second space can be adjusted. In addition, for example, when performing an electrical inspection of an electronic part using the inspection unit, the terminals of the electronic part can be uniformly abutted against the terminals of the inspection unit regardless of the individual difference of the electronic parts. The check.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings.

<First Embodiment> Hereinafter, a first embodiment of an electronic component transfer device and an electronic component inspection device according to the present invention will be described with reference to FIGS. 1 to 9. In the following, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are the X axis, the Y axis, and the Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction (first direction)", a direction parallel to the Y axis is also referred to as "Y direction (second direction)", and a direction parallel to the Z axis is also It is called "Z direction (third direction)". In addition, the direction to which the arrows in each direction are directed is referred to as "positive", and the opposite direction is referred to as "negative". In addition, the "horizontal" mentioned in the specification of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state inclined slightly (for example, less than about 5 °) with respect to the level. The upper side in FIGS. 1, 4 to 9 (the same applies to FIGS. 11 to 15) may be referred to as “upper” or “upper”, and the lower side may be referred to as “lower” or “lower”.

As shown in FIG. 4, the electronic component conveying device 10 according to the present embodiment includes a conveying section including an attitude adjusting section 5 as a first member and a suction section 3 as a second member. The cylinder 511 of the first base, and the piston 512 as the first sliding part sliding relative to the cylinder 511, the suction part 3 has a third block 34 as the second base which is detachably arranged on the piston 512, and is opposite to The third block 34 slides and abuts the suction nozzle 31 as the second sliding part of the electronic component; the piping 81 as the flow path communicates with the second space S2 and supplies the working fluid R to the second space S2; the flow rate A sensor 87 is provided on the piping 81 and detects the flow rate of the operating fluid R; and an adjuster 84 as a pressure regulator adjusts the pressure of the operating fluid R; and the attitude adjusting unit 5 is between the cylinder 511 and the piston 512 A first space S1 is formed, and the suction portion 3 forms the second space between the second base portion and the second sliding portion. The third block 34 holds the electronic component and pushes the electronic component to the inspection portion 16. (See FIG. 5) Probe pin 163 (see FIG. 5).

Thus, even if there is an individual difference in the electronic components, the difference can be offset by adjusting the pressure of the working fluid R in the first space S1 and the second space S2. In addition, for example, when performing an electrical inspection on an electronic component using the inspection unit 16 (see FIG. 5), the terminals of the electronic component can be uniformly abutted against the terminals of the inspection unit 16 regardless of the individual differences of the electronic components. Thereby, this inspection can be performed accurately. In addition, by detecting the flow rate of the working fluid R in the pipe 81, it is possible to detect whether the working fluid R leaks from the pipe 81 or not.

The electronic component inspection device 1 according to this embodiment includes the electronic component transfer device 10 according to this embodiment, and further includes an inspection unit 16 for inspecting electronic components. That is, the electronic component inspection apparatus 1 according to the present embodiment includes a transporting unit including a posture adjustment unit 5 as a first member and a suction unit 3 as a second member. The posture adjustment unit 5 includes a cylinder as a first base. 511, and a piston 512 as a first sliding part sliding with respect to the cylinder 511, the suction part 3 has a third block 34 as a second base part which is arranged on the piston 512 and is detachable, and a third block with respect to the third block 34 slides and abuts the suction nozzle 31 as the second sliding part of the electronic component; the piping 81 as the flow path communicates with the second space S2 and supplies the working fluid R to the second space S2; the flow sensor 87 It is arranged on the piping 81 and detects the flow rate of the actuating fluid R; the regulator 84 as a pressure regulator adjusts the pressure of the actuating fluid R; and the inspection unit 16 inspects the electronic parts; and the posture adjustment unit 5 is on the cylinder 511 A first space S1 is formed between the piston 512 and the suction section 3 forms a second space S2 between the third block 34 and the suction nozzle 31. The suction nozzle 31 holds the electronic components and pushes the electronic components to the inspection section. 16 of the probe pin 163.

Thereby, the electronic component inspection apparatus 1 which has the advantage of the said electronic component conveying apparatus 10 can be obtained. In addition, the electronic component can be transported to the inspection unit 16, so that the inspection of the electronic component can be performed by the inspection unit 16. In addition, electronic components after inspection can be transported from the inspection unit 16.

The configuration of each unit will be described below. FIG. 1 is a schematic perspective view of the electronic component inspection device according to this embodiment as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG. As shown in FIG. 1 and FIG. 2, the electronic component inspection device 1 with the built-in electronic component transfer device 10 is, for example, a BGA (Ball Grid Array, Ball Grid Array) package, which is an electronic component such as an IC component, and electronic components are transferred during the transfer A device for inspecting and testing electrical characteristics (hereinafter referred to as "inspection"). In the following, for convenience of explanation, a case where an IC element is used as an electronic component will be described as a representative, and it will be referred to as "IC element 90". In this embodiment, the IC element 90 is a flat plate. A plurality of hemispherical terminals 901 are arranged on the lower surface of the IC element 90 (see FIGS. 5 and 6).

In addition, as the IC element, in addition to the above, for example, "LSI (Large Scale Integration)", "CMOS (Complementary MOS)", and "CCD (Charge)" Coupled Device (charge-coupled device) ", or" module IC ", or" crystal device "," pressure sensor "," inertial sensor (acceleration sensor) " Device "," Gyro sensor "," Fingerprint sensor ", etc.

In addition, the electronic component inspection device 1 (electronic component transfer device 10) is used in advance by a person called a "replacement kit" that is replaced for each type of the IC element 90. The replacement kit includes a mounting portion on which the IC component 90 is mounted. As the mounting portion, for example, the following temperature adjustment portion 12 and component supply portion 14 are provided. In addition, as the mounting portion on which the IC component 90 is mounted, in addition to the replacement kit described above, there is also an inspection portion 16 or a tray 200 prepared by the user. In this embodiment, the second block 33 and the third block 34 of the suction unit 3 shown in FIG. 4 correspond to the replacement kit.

The electronic component inspection apparatus 1 includes a tray supply area A1, a component supply area (hereinafter referred to as a "supply area") A2, an inspection area A3, a component recovery area (hereinafter referred to as a "recycling area") A4, and a tray removal area A5. The isoregions are partitioned by the wall portions as described below. In addition, the IC component 90 passes through each area in the direction of the arrow α90 from the tray supply area A1 to the tray removal area A5, and performs inspection in the inspection area A3 in the middle. As described above, the electronic component inspection device 1 includes a processor, which is an electronic component transfer device 10 that transports IC components 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 800. In addition, the electronic component inspection apparatus 1 further includes a monitor 300, a signal lamp 400, and an operation panel 700.

In addition, the electronic component inspection apparatus 1 is a side where the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 becomes the front side, and the side where the inspection area A3 is arranged, that is, the upper side in FIG. Side by side.

The tray supply area A1 is a feed section for supplying a tray 200 in which a plurality of IC components 90 are arranged in an unchecked state. In the tray supply area A1, a plurality of trays 200 may be overlapped.

The supply area A2 is an area where a plurality of IC components 90 on the tray 200 transferred from the tray supply area A1 are transferred and supplied to the inspection area A3, respectively. Further, tray transfer mechanisms 11A and 11B are provided so as to straddle the tray supply area A1 and the supply area A2 in order to transfer the tray 200 one by one in the horizontal direction. The tray conveying mechanism 11A is a moving part that can move the tray 200 together with the IC components 90 placed on the tray 200 to the positive side in the Y direction, that is, in the direction of the arrow α11A in FIG. Thereby, the IC element 90 can be stably fed into the supply area A2. The tray conveyance mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, in the direction of the arrow α11B in FIG. 2. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1.

A temperature adjustment section (a soaking plate (English notation: soap plate, Chinese notation (one example): soaking plate)) 12, a component transfer head 13, and a tray transfer mechanism 15 are provided in the supply area A2.

The temperature adjustment section 12 is a mounting section on which a plurality of IC elements 90 are mounted, and the mounted IC elements 90 can be collectively heated or cooled, and is referred to as a "heat equalizing plate". With this soaking plate, the IC element 90 before being inspected by the inspection unit 16 can be heated or cooled in advance, and adjusted to a temperature suitable for the inspection (high-temperature inspection or low-temperature inspection). In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged in the Y direction and fixed. Then, the IC components 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A are transferred to any one of the temperature adjustment sections 12. Furthermore, the temperature adjustment section 12 serving as the mounting section is fixed, whereby the temperature of the IC element 90 on the temperature adjustment section 12 can be stably adjusted.

The component transfer head 13 is supported in the supply area A2 so as to be movable in the X direction and the Y direction, and further includes a portion capable of moving in the Z direction. Thereby, the component transfer head 13 can transfer the IC components 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC components 90 between the temperature adjustment section 12 and the component supply section 14 described below. Of transportation. In FIG. 2, the movement in the X direction of the component transfer head 13 is indicated by an arrow α13X, and the movement in the Y direction of the component transfer head 13 is indicated by an arrow α13Y.

The tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all IC components 90 have been removed, to the positive side in the X direction, that is, in the direction of arrow α15 in the supply area A2. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

The inspection area A3 is an area where the IC element 90 is inspected. In the inspection area A3, an inspection section 16 for inspecting the IC component 90 and a component transfer head 17 having a suction section 3 are provided. Further, a component supply unit 14 that moves across the supply area A2 and the inspection area A3, and a component recovery unit 18 that moves across the inspection area A3 and the recovery area A4 are also provided.

The component supply section 14 is a mounting section for mounting the IC component 90 whose temperature has been adjusted by the temperature adjustment section 12. The component supply section 14 can be transported to the vicinity of the inspection section 16 and is referred to as a “supply shuttle plate”. Or simply referred to as the "supply shuttle".

In addition, the component supply section 14 serving as the mounting section is supported so as to be movable back and forth between the supply area A2 and the inspection area A3 in the X direction, that is, in the direction of the arrow α14. With this, the component supply section 14 can stably transport the IC component 90 from the supply area A2 to the vicinity of the inspection section 16 of the inspection area A3. After the IC component 90 is removed by the component transfer head 17 in the inspection area A3, it can be transported again Return to supply area A2.

In the configuration shown in FIG. 2, two component supply sections 14 are arranged in the Y direction, and the IC components 90 on the temperature adjustment section 12 are transported to any one of the component supply sections 14. The component supply unit 14 is configured to be capable of heating or cooling the IC device 90 placed on the component supply unit 14 in the same manner as the temperature adjustment unit 12. Accordingly, the IC device 90 whose temperature is adjusted by the temperature adjustment section 12 can be transported to the vicinity of the inspection section 16 of the inspection area A3 while maintaining its temperature adjustment state.

The component transfer head 17 is an operation portion that holds the IC component 90 maintained in a temperature-adjusted state and transfers the IC component 90 in the inspection area A3, and is one of the transfer portions. The component transfer head 17 is supported in the inspection area A3 so as to be able to move back and forth in the Y direction and the Z direction, and becomes a part of a mechanism called an "indexing arm". With this, the component transfer head 17 can transfer and place the IC components 90 on the component supply section 14 carried in from the supply area A2 and place them on the inspection section 16. In FIG. 2, the Y-direction reciprocating movement of the component transfer head 17 is indicated by an arrow α17Y. In addition, the component transfer head 17 is supported to be capable of reciprocating in the Y direction and the Z direction, but is not limited thereto, and may also be supported to be capable of reciprocating in the X direction.

The component transfer head 17 is configured to be capable of heating or cooling the held IC component 90 in the same manner as the temperature adjustment unit 12. Thereby, the temperature adjustment state of the IC element 90 can be continuously maintained from the component supply section 14 to the inspection section 16.

The inspection unit 16 is configured as a placement unit for placing an IC component 90 that is an electronic component and inspecting the electrical characteristics of the IC element 90. A plurality of probe pins 163 (see FIGS. 5 and 6) electrically connected to the terminals 901 of the IC element 90 are provided in the inspection section 16. In addition, by the terminal 901 of the IC element 90 and the probe pin 163 being electrically connected or contacted, the inspection of the IC element 90 can be performed. The inspection of the IC element 90 is performed based on a program stored in an inspection control section provided in a tester (not shown) connected to the inspection section 16. In addition, the inspection unit 16 can heat or cool the IC element 90 similarly to the temperature adjustment unit 12, and adjust the IC element 90 to a temperature suitable for inspection.

The component recovery section 18 is a mounting section configured to place the IC components 90 after the inspection by the use inspection section 16 and can transport the IC components 90 to the collection area A4, which is referred to as a "recycling shuttle" or simply referred to as "Recycling shuttle".

In addition, the component recovery unit 18 is supported to be able to move back and forth between the inspection area A3 and the recovery area A4 in the X direction, that is, in the direction of the arrow α18. In the configuration shown in FIG. 2, two component recovery sections 18 are arranged in the Y direction in the same manner as the component supply section 14, and the IC components 90 on the inspection section 16 are transported and placed in any one of the component recovery sections. 18. This transfer is performed by the component transfer head 17.

The collection area A4 is a collection area of the plurality of IC components 90 that have been inspected in the inspection area A3 and the inspection has ended. A collection tray 19, a component transfer head 20, and a tray transfer mechanism 21 are provided in the collection area A4. An empty tray 200 is also prepared in the collection area A4.

The collection tray 19 is a mounting portion on which the IC component 90 after the inspection by the use inspection portion 16 is placed, and is fixed so as not to move within the collection area A4. Thereby, even if the recovery area A4 where various movable parts such as the component transfer head 20 are relatively arranged, the inspected IC components 90 are stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

Three empty trays 200 are also arranged along the X direction. The empty tray 200 also serves as a mounting section on which the IC components 90 after the inspection by the inspection section 16 are placed. Then, the IC component 90 on the component collection unit 18 moved to the collection area A4 is transferred and placed in any one of the collection tray 19 and the empty tray 200. Thereby, the IC element 90 is classified and collected for each inspection result.

The component transfer head 20 is supported in the recovery area A4 so as to be movable in the X direction and the Y direction, and further includes a portion capable of moving in the Z direction. Accordingly, the component transfer head 20 can transfer the IC components 90 from the component collection unit 18 to the collection tray 19 or the empty tray 200. In FIG. 2, the movement in the X direction of the component transfer head 20 is represented by an arrow α20X, and the movement in the Y direction of the component transfer head 20 is represented by an arrow α20Y.

The tray conveyance mechanism 21 is a mechanism that conveys the empty tray 200 carried in from the tray removal area A5 in the recovery area A4 in the X direction, that is, in the direction of the arrow α21. After the transfer, the empty tray 200 is placed at a position where the IC components 90 are collected, that is, it may become any of the three empty trays 200.

The tray removal area A5 collects and removes the material removal portion of the tray 200 in which the plurality of IC components 90 in the inspected state are arranged. In the tray removal area A5, a plurality of trays 200 may be overlapped.

Further, tray transfer mechanisms 22A and 22B are provided so as to straddle the recovery area A4 and the tray removal area A5, and transfer the tray 200 one by one in the Y direction. The tray conveyance mechanism 22A is a moving portion that can move the tray 200 back and forth in the Y direction, that is, in the direction of the arrow α22A. Thereby, the inspected IC component 90 can be transferred from the recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B can be used to move the empty tray 200 of the recovered IC components 90 toward the positive side in the Y direction, that is, in the direction of the arrow α22B. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the collection area A4.

The control unit 800 can control, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the component transfer head 13, the component supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the component transfer head 17, the component recovery unit 18, The operations of the components of the component transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B. The control unit 800 can determine the opening and closing of the blocking solenoid valve 88 based on the flow rate detected by the flow sensor 87. This can prevent the working fluid R from leaking from the second space S2 and the piping 81 described below.

The operator can set or confirm the operating conditions and the like of the electronic component inspection device 1 via the monitor 300. This monitor 300 includes, for example, a display screen 301 composed of a liquid crystal screen, and is arranged on the upper part of the front side of the electronic component inspection device 1. As shown in FIG. 1, a mouse table 600 for placing a mouse is provided on the right side in the drawing of the tray removal area A5. This mouse is used when the screen displayed on the monitor 300 is operated.

An operation panel 700 is disposed at the lower right of FIG. 1 for the monitor 300. The operation panel 700 is an operator required to instruct the electronic component inspection apparatus 1 separately from the monitor 300.

In addition, the signal lamp 400 can report the operation state of the electronic component inspection device 1 and the like by a combination of the colors of light emission. The signal lamp 400 is arranged on the upper part of the electronic component inspection apparatus 1. Furthermore, a speaker 500 is built into the electronic component inspection device 1, and the operating state of the electronic component inspection device 1 and the like may be reported through the speaker 500.

In the electronic component inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated by a first partition wall 231, the supply area A2 and the inspection area A3 are separated by a second partition wall 232, and the inspection area A3 and the collection area A4 is separated by a third partition wall 233, and the collection area A4 and the tray removal area A5 are separated by a fourth partition wall 234. The supply area A2 and the recovery area A4 are also separated by a fifth partition wall 235.

The outermost part of the electronic component inspection device 1 is covered by a casing, which includes, for example, a front casing 241, a side casing 242, a side casing 243, a rear casing 244, and an upper casing 245.

FIG. 3 is a perspective view showing a component transfer head provided in the inspection area in FIG. 2. 4 to 6 are schematic partial vertical cross-sectional views sequentially showing operating states of the component transfer heads provided in the inspection area in FIG. 2. In addition, FIG. 3 shows the state of the second block 33 and the third block 34 mounted on the first block 32 on the left side of the figure, and the second block unloaded from the first block 32 on the right side of the figure. Status of block 33 and third block 34.

As described above, the component transfer head 17 is supported so as to be movable in the Y direction and the Z direction. The component transfer head 17 transfers IC components 90 in the inspection area A3. As shown in FIGS. 4 to 6, the component transfer head 17 includes a suction section 3, an attitude adjustment section 5, and a heat insulation section 6.

The suction unit 3 is configured as a suction unit capable of holding the IC component 90 which is an electronic component by suction (suction). The suction unit 3 includes a suction nozzle 31, a first block 32, a second block 33, and a third block 34. The second block 33 and the third block 34 correspond to the "replacement kit" described above. The second block 33 and the third block 34 are replaced, that is, detached, for each type of the IC element 90. In addition, the second block 33 and the third block 34 are independent individuals, but are not limited thereto, and may be integrally formed. The number of the suction units 3 is one in the configuration shown in FIGS. 4 to 6, but it is not limited to this, and may be plural.

The ejector 72 as a vacuum generation source applies a suction force F3 to the suction section 3. Negative pressure is generated by the operation of the ejector 72, the pressure is appropriately adjusted by the regulator 73 as a pressure regulating mechanism, and the inner cavity portion 324 and the inner cavity portion 333 become negative pressure through the pipe 71 and the joint 36. With the joint 36, air leakage can be prevented.

The suction nozzle 31 is a device capable of sucking the IC element 90 and is formed of a cylindrical member having an inner cavity portion 313 opened at the upper surface 311 and the lower surface 312. The inner cavity portion 313 functions as a flow path through which air passes. In addition, the inner cavity portion 324 and the inner cavity portion 333 become negative pressure, and the inner cavity portion 313 communicating with the inner cavity portion 313 becomes negative pressure, that is, the air flows upward in the inner cavity portion 313, thereby opening the lower portion 312 ( The suction port 314 generates a suction force F3. Thereby, the IC element 90 can be attracted | sucked with the lower surface 312 as a suction surface. In addition, the air flows into the inner cavity portion 313 and the pressure rises, that is, the air flows downward in the inner cavity portion 313, or the upward flow of air stops, whereby the suction force F3 decreases and disappears shortly, so that the IC can be reduced. The element 90 is released (detached) from the lower surface 312. Hereinafter, the direction in which the IC element 90 is sucked, that is, the direction in which the suction force F3 acts is sometimes referred to as "suction direction α3". The suction direction α3 faces the positive side of the Z direction (see FIG. 5).

The maximum value of the suction force F3 (the maximum suction force in the suction section 3) is not particularly limited. For example, it is preferably -95 kPa or more and -30 kPa or less, more preferably -90 kPa or more and- Below 50 kPa. Furthermore, it is comprised so that the suction force F3 of the suction part 3 can be changed by the pressure setting of the regulator 73. As the regulator 73, for example, an electropneumatic regulator is preferably used. Thereby, the suction force F3 can be changed (adjusted) steplessly. By such a suction force F3, the degree of vacuum of the area sealed by the gasket 35 (for example, an O-ring in this embodiment) mounted on the suction nozzle 31 can be adjusted. In this embodiment, the degree of vacuum of the adsorption nozzle 31 is fixed.

A flange portion 315 having an enlarged outer diameter is formed on the outer peripheral portion of the suction nozzle 31 so as to protrude halfway in the longitudinal direction. The flange portion 315 is in contact with the third block 34 and prevents the suction nozzle 31 from falling off from the suction portion 3 (see FIG. 4). Further, a groove 340 is formed in the outer peripheral portion of the flange portion 315. The groove 340 is formed in a ring shape along the circumferential direction of the flange portion 315. A ring-shaped washer 43 is disposed in the groove 340. Thereby, the pressure in the second space S2 can be maintained. A groove 150 is formed below the flange portion 315. One groove 150 is formed. A guide pin 152 of the third block 34 is inserted into the groove 150. Thereby, the rotation of the adsorption nozzle 31 with respect to the third block 34 can be stopped.

A groove 316 is formed on the outer peripheral portion of the suction nozzle 31 above the flange portion 315. The groove 316 is formed in a ring shape along the circumferential direction of the adsorption nozzle 31. A ring-shaped gasket 35 is arranged in the groove 316. Thereby, the washer 35 is compressed between the suction nozzle 31 and the second block 33.

A first block 32 is arranged above the adsorption nozzle 31. The first block 32 is composed of a block (or plate) member having a flat upper surface 321 and a lower surface 322. The first block 32 includes a recessed portion 325 opened at the lower surface 322. The suction nozzle 31 is inserted into the recessed portion 325 at a position higher than the flange portion 315. Thereby, the adsorption nozzle 31 can be moved in the Z direction. The first block 32 includes an inner cavity portion 324 which is opened at the lower surface 322 and the upper surface 321. The inner cavity portion 324 functions as a flow path through which air passes, similarly to the inner cavity portion 313 of the adsorption nozzle 31.

A joint 36 is hermetically connected to the inner cavity portion 324 from the upper surface 321 side. The joint 36 is connected to the ejector 72 via a pipe 71. Further, an adjuster 73 is arranged in the middle of the pipe 71, that is, between the joint 36 and the ejector 72.

Further, a heater (not shown) for heating the IC element 90 adsorbed by the adsorption nozzle 31 may be built in the first block 32, for example.

A second block 33 is arranged below the first block 32. The second block 33 is composed of a block (or plate) member having a flat upper surface 331 and a lower surface 332, and the upper surface 331 is in contact with the lower surface 322 of the first block 32.

The second block 33 includes an inner cavity portion 333 opened at the upper surface 331 and the lower surface 332. The suction nozzle 31 is inserted into the inner cavity portion 333 at a position higher than the flange portion 315. Thereby, the adsorption nozzle 31 can be moved in the Z direction.

The inner cavity portion 333 also functions as a flow path through which air passes, and the inner cavity portion 313 of the suction nozzle 31 and the inner cavity portion 324 of the first block 32 communicate with each other through the inner cavity portion 333. Thereby, a series of flow paths are formed through which air passes.

On the side of the upper surface 331 of the second block 33, the groove 334 opened on the upper surface 331 and the inner cavity portion 333 are formed in a ring shape concentrically. An annular washer 37 is disposed in the groove 334. Thereby, the washer 37 is compressed between the first block 32 and the second block 33, and the airtightness of the above-mentioned series of flow paths can be maintained together with the washer 35.

The first block 32 and the second block 33 include an inner cavity portion 336 that communicates the outer peripheral portion of the first block 32 and the outer peripheral portion of the second block 33. A joint 41 is air-tightly connected to the inner cavity portion 336 from the outside. The joint 41 is connected to the working fluid supply unit 85 via a pipe 8 (pipe 81). With the joint 41, air leakage can be prevented.

On the side of the upper surface 331 of the second block 33, the groove 338 opened on the upper surface 331 and the inner cavity portion 336 are formed into a ring shape concentrically. An annular washer 38 is disposed in the groove 338. Thereby, the gasket 38 is compressed between the first block 32 and the second block 33, and the airtightness of the above-mentioned series of flow paths can be maintained together with the gasket 35.

The working fluid supply unit 85 supplies a working fluid R (for example, air) to the first space S1 and the second space S2 described below. By providing a common operating fluid supply unit 85 in the first space S1 and the second space S2, the device configuration can be simplified. Furthermore, it is possible to omit the steps of providing dedicated operating fluid supply units in the first space S1 and the second space S2, respectively. This can further simplify the device configuration. In addition, the working fluid R can enter and exit the first space S1 and the second space S2, whereby the piston 512 can slide in the cylinder 511 and the suction nozzle 31 can slide in the through hole 344 as described below.

Here, in this embodiment, the pressures of the working fluids R supplied to the first space S1 and the second space S2 are the same pressure, but may be different. In addition to the supply of the working fluid, the working fluid supply unit 85 may perform suction (recovery of the working fluid R).

A third block 34 is arranged below the second block 33. The third block 34 is composed of a block-like (or plate-shaped) member having a flat upper surface 341 and a lower surface 342, and the upper surface 341 is in contact with the lower surface 332 of the second block 33.

A concave portion 348 is formed on the upper surface 341 side of the third block 34. The concave portion 348 is opened on the upper surface 341 and is larger than the flange portion 315 of the adsorption nozzle 31 in a plan view. Within the recessed portion 348, the flange portion 315 is movable in the Z direction.

In addition, as shown in FIG. 4, in a state where the flange portion 315 abuts on the bottom of the recessed portion 348, the movement limit at the position below the suction nozzle 31 is restricted, thereby preventing the suction nozzle 31 from falling off. In contrast, in a state where the flange portion 315 is in contact with the lower surface 332 of the second block 33, the movement limit of the position on the upper side of the suction nozzle 31 is restricted. Furthermore, the movable area where the suction nozzle 31 can move is sufficiently secured so as to correspond to the thickness of various IC elements 90. The space partitioned by the lower surface 332 of the second block 33 and the second pressure receiving surface M2 functions as a second space S2 to which the working fluid R is supplied.

A through hole 344 is formed in the bottom of the recessed portion 348 and penetrates to the lower surface 342. Regardless of the position of the suction nozzle 31, a portion lower than the flange portion 315 may protrude from the through hole 344.

The third block 34 includes a guide pin 152. The guide pin 152 is arranged in the third block 34 corresponding to the groove 150 of the suction nozzle 31. The guide pin 152 is fixed to the third block 34 and protrudes upward. As described above, the guide pin 152 is inserted into the groove 150 of the suction nozzle 31, thereby positioning the suction nozzle 31 and the recessed portion 348. Thereby, the rotation of the adsorption nozzle 31 with respect to the third block 34 can be stopped.

A posture adjustment unit 5 is disposed above the suction unit 3. The posture adjustment unit 5 is a so-called “adaptive unit” that adjusts the posture of the suction unit 3 in the state shown in FIG. 6. The posture adjustment unit 5 includes a first adjustment mechanism 51 and a second adjustment mechanism 52.

The first adjustment mechanism 51 is responsible for adjusting the posture of the suction section 3 around the X axis and the posture of the suction section 3 around the Y axis.

The first adjustment mechanism 51 includes a cylinder 511 and a piston 512 that can slide in the Z direction relative to the cylinder 511. The cylinder 511 includes an inner cavity portion 513 on the inside. A piston 512 is inserted inside the inner cavity portion 513. The piston 512 includes a flange portion 514 and a piston rod 515 that connects the flange portion 514 and the second adjustment mechanism 52. The outer peripheral portion of the flange portion 514 is curved. Thereby, the outer periphery of the piston 512 with an arc can be changed in posture so that the central axis of the piston 512 is inclined. Accordingly, the piston 512 can change its posture in a manner similar to that of the surface of the abutting portion 162 of the inspection portion 16. Furthermore, the radian of the piston 512 may be omitted, and a gasket different from the piston 512 may be provided. In this case, as long as the washer is made of an elastic body, the posture of the piston 512 can be changed such that the center axis thereof is inclined in the same manner as described above.

As shown in FIG. 4, the cylinder 511 is provided with a through hole 516 penetrating the inner peripheral portion and the outer peripheral portion. A joint 42 is air-tightly connected to the through hole 516 from the outside. The joint 42 is connected to the working fluid supply unit 85 via a pipe 8 (pipe 82). The joint 42 prevents air leakage.

In addition, the pipe 8 is configured to branch into a pipe 81 and a pipe 82 from the middle. A tank 83 and a regulator 84 as a pressure regulator are provided between the branch point 86 of the pipe 8 and the working fluid supply unit 85. The regulator 84 is disposed closer to the working fluid supply portion 85 than the tank 83. The regulator 84 adjusts the pressure of the working fluid R. The adjuster 84 may have the same configuration as the adjuster 73.

In addition, two or more electro-pneumatic regulators (for adaptive units and air springs (in this embodiment, the mechanism having the second space S2 is referred to as an air spring)) may be installed.

The tank 83 is a person that can store the working fluid R supplied from the working fluid supply unit 85 inside, and functions as a liquid storage tank or a buffer tank of the working fluid R. The internal space of the box 83 communicates with the second space S2 via a pipe 81. That is, the box 83 functions as a third space communicating with the second space S2. Thereby, even if the pressure of the second space S2 changes due to the movement of the adsorption nozzle 31, since the communication with the tank 83, the working fluid R will escape to the tank 83 or the working fluid R will enter from the third space. As a result, fluctuations in the internal pressure of the second space S2 can be reduced. As a result, the suction nozzle 31 can stably press the IC element 90. In this way, the tank 83 functions as a moderating unit that mitigates a change in pressure in the second space S2.

The electronic component conveying device 10 includes a blocking solenoid valve 88 as an opening and closing section (valve), which is provided on the piping 81 and opens and closes the piping 81; The opening and closing of the blocking solenoid valve 88 is determined based on the flow rate detected by the flow sensor 87. This can prevent the working fluid R from leaking from the second space S2.

In addition, when the working fluid R from the second space S2 remains leaking, the pressure in the first space S1 is also reduced, and it is difficult to adjust the pressure of the working fluid R in the first space S1 to adjust the pressure of the electronic parts. Individual differences offset.

Furthermore, such a problem may occur particularly when the replacement kit is replaced with a mechanical spring (in this embodiment, a mechanism that does not have the second space S2 is referred to as a mechanical spring). Even if a replacement kit with a mechanical spring is installed, air leakage can be prevented, the pressure in the first space S1 is reduced, and the contact is deteriorated. In addition, it is possible to prevent incorrect setting by the operator and to perform a stable inspection (contact) at all times. The flow sensor 87 may also be a sensor for determining whether the installed replacement kit is a replacement kit with a mechanical spring.

The flow sensor 87 is arranged between the blocking solenoid valve 88 and the second space S2 of the suction unit 3. With this, the front end is blocked more than the blocking solenoid valve 88, so that erroneous detection can be prevented. For example, when a replacement kit with a mechanical spring is installed, since the front end is blocked than the blocking solenoid valve 88, the flow rate of the working fluid R does not change. Therefore, no false detection is performed. In addition, when forgetting to install the replacement kit, leakage of the working fluid R can also be prevented.

A flow rate sensor 87 that detects the flow rate of the working fluid R is provided in the middle of the pipe 81. The flow sensor 87 is provided in the pipe 81 and near the blocking solenoid valve 88. The flow sensor 87 can detect the flow between the joint 41 of the piping 81 and the blocking solenoid valve 88. As another method for detecting the flow rate of the working fluid R by the flow rate sensor 87, for example, a hot wire flow meter is used as the flow rate sensor 87, and the flow rate sensor 87 is arranged in the pipe 81 to detect the working fluid R Of traffic.

In addition, the flow sensor 87 may be capable of detecting a maximum of 5 L / min. In the detection of the flow rate of the flow sensor 87, the state of no leakage can also be set to a flow rate of 0 to 0.3 L / min, or 0 to 0.1 L / min. The flow sensor 87 may be incorporated in the regulator 84.

The form of the flow sensor 87 is not particularly limited as long as the flow can be detected. The flow sensor 87 may be, for example, an electromagnetic flowmeter, a vortex flowmeter, a turbine flowmeter, an area flowmeter, a differential pressure flowmeter, an ultrasonic flowmeter, or a Coriolis flowmeter. Furthermore, the present invention is not limited to a flow sensor, and may be, for example, a pressure sensor that detects the pressure of the working fluid R flowing through the inner cavity of the pipe. In addition, it may be a temperature sensor or the like, as long as it can detect the flow rate.

A signal indicating the flow rate of the working fluid R detected by the flow sensor 87 is input to the control unit 800, and the control unit 800 grasps the flow rate of the working fluid R detected by the flow sensor 87. In addition, as the flow rate sensor 87, as long as it can detect the flow rate of the working fluid R flowing through the pipe 81, it may be set in the pipe 81 in advance, or it may be a post-attachment.

When a flow exceeding the threshold of the flow sensor 87 flows, the blocking solenoid valve 88 can block the working fluid R supplied to the second space S2 of the suction unit 3.

When the flow rate sensor 87 detects a specific flow rate of the working fluid R, the control unit 800 may output a warning. This allows specific traffic to be detected with warnings. In addition, if the flow rate of the actuating fluid R is less than a specific value is determined at the time of the leak check, it will be 80% or more of the maximum detection flow rate (4 if the maximum detection flow rate is 5 L / min). L / min).

A second adjustment mechanism 52 is disposed below the first adjustment mechanism 51. The second adjustment mechanism 52 includes two plate members 521 that overlap in the Z direction. The two plate members 521 are movable relative to the XY plane direction. With this, the second adjustment mechanism 52 can assume the posture adjustment of the suction section 3 in the X direction, the posture adjustment of the suction section 3 in the Y direction, and the suction section 3 around the Z axis. Posture adjustment.

In addition, the posture adjustment unit 5 is connected to a mechanism (not shown) that supports the entire component transfer head 17 so as to be able to move back and forth in the Y direction and the Z direction via the connection portion 171.

A heat insulation section 6 is disposed between the suction section 3 and the posture adjustment section 5. The heat insulation section 6 can prevent or suppress heat transfer from the above-mentioned heater built in the first block 32 to the posture adjustment section 5. This prevents the posture adjustment unit 5 from malfunctioning due to the heat described above, thereby enabling normal operation, that is, the posture of the suction unit 3 can be accurately adjusted.

In the present embodiment, the heat insulation section 6 includes a plurality of heat insulation members 61 having a columnar shape. The thermal conductivity of each heat insulation member 61 is relatively small, and a plurality of heat insulation members 61 are arranged apart from each other. The constituent material of the heat-insulating member 61 is not particularly limited. For example, various heat-insulating materials such as glass epoxy resin can be used. The first block 32 and the plate member 521 are connected by a heat insulating member 61 spaced apart from each other, and there is a gap between each of the heat insulating members 61. Therefore, the heat conduction between the first block 32 and the plate member 521 is suppressed.

As described above, the inspection section 16 is arranged in the inspection area A3. The inspection section 16 is a mounting section for mounting electronic components, that is, the IC element 90, and is a socket for performing inspection on the IC element 90 in the mounted state. As shown in FIGS. 5 and 6, the inspection section 16 includes an inspection section body 161, an abutting section 162, and a probe pin 163.

The inspection unit main body 161 has a recessed portion (groove) 165 in which the IC element 90 is placed and received. The number of the recessed portions 165 is one in the configuration shown in FIG. 5 and FIG. 6, but it is not limited to this, and may be plural.

Protrudingly disposed at the bottom of the recessed portion 165 are the same number of probe pins 163 as the terminals 901 of the IC element 90.

The inspection unit (mounting unit) 16 includes an electronic component ejection unit 166 that pushes the IC element 90 that is an electronic component mounted on the inspection unit (mounting unit) 16 in the suction direction α3. The electronic component ejection portion 166 is composed of a coil spring built into each probe pin 163. Thereby, it is possible to interact with the pressing of the IC element 90 from the side of the suction part 3, so that each terminal 901 of the IC element 90 and each probe pin 163 are fully contacted. Thereby, inspection of the IC element 90 can be performed accurately.

As described above, the inspection section 16 which is a mounting section on which the IC component 90 which is an electronic component is placed can be disposed in the inspection area A3. In addition, the inspection portion 16 which is the mounting portion includes a contact portion 162. The abutting portion 162 is formed of a plate-like member and is provided on the inspection portion main body 161 in an overlapping manner. Thereby, the abutting portion 162 can abut against the lower surface 342 of the third block 34 of the suction portion 3 provided in the component transfer head 17. The component transfer head 17 includes a posture adjustment unit 5 capable of adjusting the posture of the suction unit 3. Here, for example, it is assumed that the entire inspection unit 16 is inclined by 1 degree with respect to the XY plane (horizontal plane). In this case, as shown in FIG. 6, in a state where the suction section 3 is in contact with the abutting section 162, the posture adjustment section 5 can also make the suction section 3 follow the same inclined posture as the inspection section 16. . Such a posture adjustment of the suction portion 3 facilitates the contact between the terminals 901 of the IC element 90 and the probe pins 163.

Figures 7 to 9 show the IC components with different distances (H90) from the bottom surface to the terminals of the IC component when the lower surface (suction surface) of the suction nozzle is used as a reference. A vertical cross-sectional view of a state where the pins can also be contacted. However, the IC device 90 adsorbed by the adsorption nozzle 31 may have a case where the distance H90 from the lower surface 312 to each terminal 901 is uneven when the lower surface (the adsorption surface) 312 of the adsorption nozzle 31 is used as a reference. For this reason, for example, even if it is the same type of IC element 90, the thickness of the IC element 90 may be different (design or uneven), that is, there is a large thickness error (see FIG. 7 and FIG. 8). In addition, individual differences such as warpage (see FIG. 9) occur in the IC element 90. In addition, FIG. 7 shows a state where the IC element 90 itself has a thickness, FIG. 8 shows a state where the same type of IC element 90 also has a thin IC element 90 or a thick IC element 90, and FIG. 9 shows the IC element 90 Warped state itself. In addition, when the above-mentioned distance H90 is uneven, the following situations are also included: as shown in FIG. 7, the upper surface (the surface contacting the lower surface 312) of the IC element 90 is parallel to the lower surface (the adsorption surface) 312 and When the lower surface of the IC element 90 (the surface on which the terminals 901 are provided) is inclined, or the upper surface of the IC element 90 (the surface that is in contact with the lower surface 312) is inclined and the lower surface of the IC element 90 (the terminals 901 are provided) When the surface is parallel to the lower surface (suction surface) 312, or the upper surface of the IC element 90 (the surface contacting the lower surface 312) is inclined and the lower surface of the IC element 90 (the surface on which each terminal 901 is provided) is inclined Situation.

For example, when the distance H90 is relatively small, there is a case where among the terminals 901 are terminals 901 that cannot reach the probe pins 163 of the inspection section 16. In this case, the contact becomes poor, making it difficult to perform an accurate inspection.

Also, when the distance H90 is relatively large, each terminal 901 can reach and contact the probe pin 163 of the inspection section 16, but there are cases where there is a terminal 901 whose contact pressure is excessive. In this case, it is also difficult to perform an accurate inspection.

Therefore, the electronic component inspection device 1 (electronic component transfer device 10) of the present invention has a configuration capable of eliminating such a phenomenon. Hereinafter, this configuration and operation will be described with reference to FIGS. 4 to 6.

[1] As shown in FIG. 4, the component transfer head 17 is in a state in which the IC component 90 has not been suctioned by the suction section 3. Furthermore, at this time, the ejector 72 has been sucked. The working fluid R is supplied to the first space S1 and the second space S2, and the first space S1 and the second space S2 become a positive pressure. By making the second space S2 a positive pressure, the flange portion 315 of the suction nozzle 31 is brought into contact with the bottom of the concave portion 348 of the third block 34.

[2] Also, the component transfer head 17 can suck the IC component 90 on the component supply section 14 into the inspection area A3 by the suction section 3. Thereby, the component transfer head 17 is in the state shown in FIG. In the state shown in FIG. 5, the IC element 90 is sucked by the suction nozzle 31 by the suction force F3. As described above, when the IC element 90 is being sucked, the suction nozzle 31 is moved to the positive side in the Z direction (suction direction α3) than the state shown in FIG. 4. That is, the flange portion 315 of the suction nozzle 31 is in a state separated from the bottom of the concave portion 348 of the third block 34.

Then, the state of the suctioned IC element 90 is maintained, and the suctioned IC element 90 can be arranged directly above the recessed portion 165 of the inspection portion 16 by moving the component transfer head 17.

[3] Thereafter, as shown in FIG. 6, the component transfer head 17 may be lowered until the suction section 3 abuts the inspection section 16. Thereby, the suction unit 3 can be stored while imitating the posture of the inspection unit 16 while pushing the IC element 90 to the recessed portion 165 of the inspection unit 16 (hereinafter, this state is referred to as a "pressed storage state"). At this time, the suction nozzle 31 receives a reaction force from the inspection unit 16 via the IC element 90 and moves toward the positive side in the Z direction from the state shown in FIG. 5. That is, in a state of being pushed and stored, the distance between the flange portion 315 of the suction nozzle 31 and the bottom of the recessed portion 348 of the third block 34 is larger than that in the state shown in FIG. 5.

In this way, in the pressed and stored state shown in FIG. 6, the suction nozzle 31 is separated from the bottom of the recessed portion 348 of the third block 34, and therefore, by supplying the operating fluid R to the second space S2, the suction nozzle 31 can Move in the -Z direction. Accordingly, the IC element 90 can be appropriately pushed toward the inspection section 16 through the suction nozzle 31 with a force suitable for inspection. By this, for example, as shown in FIG. 7 to FIG. 9, regardless of the distance H90, the terminals 901 of the IC element 90 can be brought into contact with (protrude) the probe pins 163 of the inspection section 16 accurately and uniformly. Thereby, inspection of the IC element 90 can be performed accurately.

In particular, the magnitude of the suction force F3 ′ differs for each IC element 90 according to the degree of the individual difference of the IC element 90 (the uneven shape of the upper surface, etc.). In a state of being pushed and stored, the suction nozzle 31 may It comes into contact with the bottom of the concave portion 348 of the third block 34. In this case, it is difficult to further press the IC element 90 against the recessed portion 165 of the inspection portion 16 by the suction nozzle 31. In contrast, in the electronic component transfer device 10, the supply amount of the working fluid R to the second space S2 can be adjusted. Thereby, the supply amount of the working fluid R can be adjusted in a state where the suction nozzle 31 is separated from the bottom of the recessed portion 348 of the third block 34 in the pressed and stored state. Accordingly, in the state of being pressed and stored, the IC element 90 can be further pressed against the recessed portion 165 of the inspection portion 16 by the suction nozzle 31.

In addition, the third block 34 as the second base portion can be brought into contact with the inspection portion 16 as the electronic component placement portion where the IC component 90 which is an electronic component is placed. Thereby, the third block 34 can press the inspection section 16 and the posture of the third block 34 is set to a state that follows the shape of the abutting section 162 of the inspection section 16. Accordingly, the suction nozzle 31 can be brought into contact with the IC element 90 in this emulated state. As a result, the terminals 901 of the IC element 90 can be more accurately and uniformly contacted (abutted) with the probe pins 163 of the inspection unit 16, and thus the inspection of the IC element 90 can be performed accurately.

As shown in FIG. 4, the area of the first pressure receiving surface M1 of the flange portion 514 of the piston 512 serving as the first sliding portion in the first space S1 is larger than that of the adsorption nozzle 31 that is the second sliding portion The area of the second pressure receiving surface M2 of the working fluid R in the second space S2. As a result, as in this embodiment, in the configuration in which the working fluid R is supplied to the first space S1 and the second space S2 at the same pressure, the second pressure surface M2 can receive less force from the working fluid R than the first The pressure surface M1 receives a force from the actuating fluid R. As a result, the force (second contact force) of the suction nozzle 31 pressing the IC element 90 can be made smaller than the force (first contact force) of the third block 34 pressing the inspection unit 16. This prevents the suction nozzle 31 from excessively pressing the IC element 90.

As described above, in the electronic component transporting device 10, the contact force (second contact force) of the suction nozzle 31, which is the second sliding portion, abuts against the IC element 90, which is the electronic component, and the third block 34 which is a part of the second base portion. The contact force (first contact force) of the inspection unit 16 which is an electronic component mounting portion is different. In this embodiment, as described above, the second contact force is smaller than the first contact force, so that the suction nozzle 31 can be prevented from pressing the IC element 90 excessively.

In addition, the first pressure-receiving surface M1 presses the entire suction portion 3 which is a portion lower than the first pressure-receiving surface M1. On the other hand, the second pressure-receiving surface M2 presses a portion lower than the second pressure-receiving surface M2, that is, a portion of the adsorption nozzle 31. Therefore, it is preferable to make the pressing force of the first pressure receiving surface M1 larger than that of the second pressure receiving surface M2. Therefore, the area of the first pressure receiving surface M1 is larger than the area of the second pressure receiving surface M2.

The area of the first pressure-receiving surface M1 is preferably 2 times to 20 times the area of the second pressure-receiving surface M2, and more preferably 3 times to 15 times. Thereby, the above-mentioned effect can be exhibited more reliably.

Furthermore, in this embodiment, the piston 512 as the first sliding portion and the third block 34 which is the second base portion are configured separately, but they may be integrally formed.

FIG. 10 is a flowchart showing the opening and closing sequence of the blocking solenoid valve 88. First, in step S10, the control unit 800 closes the blocking solenoid valve 88. The control unit 800 blocks the working fluid R. After the processing of step S10 is completed, the control unit 800 advances the processing to step S20.

Next, in step S20, the control unit 800 determines whether the flow rate of the working fluid R detected by the flow rate sensor 87 is 0 L / min. When the flow rate detected by the flow rate sensor 87 is 0 L / min, the control unit 800 determines YES, and advances the process to step S40. When the flow rate detected by the flow rate sensor 87 is other than 0 L / min, the control unit 800 determines NO, and advances the process to step S30.

Next, in step S30, the control unit 800 resets the value of the flow rate detected by the flow sensor 87 to 0 L / min. After the processing of step S30 is completed, the control unit 800 advances the processing to step S20.

Next, in step S40, the control unit 800 opens the blocking solenoid valve 88. The control unit 800 supplies the working fluid R. After the processing in step S40 is completed, the control unit 800 advances the processing to step S50.

Next, in step S50, the control unit 800 determines whether the flow rate of the working fluid R detected by the flow rate sensor 87 is 0.1 L / min or less (leak check). When the flow rate detected by the flow rate sensor 87 is 0.1 L / min or less, the control unit 800 judges YES and ends the processing. In this case, the control unit 800 may determine that there is no leakage. When the flow rate detected by the flow rate sensor 87 exceeds 0.1 L / min, the control unit 800 determines No, and advances the process to step S60. If not, the control unit 800 may determine that there is a leak.

Next, in step S60, the control unit 800 closes the blocking solenoid valve 88. The control unit 800 is configured to leak the working fluid R from the second space S2 or the piping 81 to close the blocking solenoid valve 88. Thereby, by detecting the flow rate of the working fluid R in the pipe 81, it is possible to detect whether the working fluid R leaks from the second space S2 and the pipe 81. After the processing of step S60 is completed, the control unit 800 ends the processing.

Furthermore, in step S50, the control unit 800 may cause the working fluid R to flow at a maximum pressure. For example, the pressure of the working fluid R is set to 0.5 MPa by the regulator 84. And after the leak check, it returned to normal pressure. For example, the pressure of the working fluid R is set to 0.1 MPa by the regulator 84. When the flow rate of the working fluid R detected by the flow rate sensor 87 exceeds 5 L / min, the control unit 800 may be set to issue a warning without installing a replacement kit.

In the case of YES in step S50, that is, when there is no leakage, the control unit 800 may further determine that the installed replacement set is not a replacement set provided with a mechanical spring. In the case of NO in step S50, that is, when there is a leak, the control unit 800 may further determine that the installed replacement kit is a replacement kit provided with a mechanical spring.

In addition, the second contact force in the case of Yes in step S50, that is, the case where there is no leakage, and the second contact force in the case of No in step S50, that is, when there is a leak, may be set to a different value. . For example, the second abutment force when there is no leakage may also be determined based on the cylinder inner diameter, and the second abutment force when there is a leak may also be based on the cylinder inner diameter of the first sliding portion (piston 512). It depends.

At this time, the control unit 800 may select a calculation formula based on the size of the cylinder inner diameter from a plurality of calculation formulas, and calculate and determine the second abutment force when there is no leakage based on the selected calculation formula, and the control unit 800 800 can also select a value based on the size of the cylinder inner diameter from a plurality of values, and determine the second contact force when there is no leakage.

At this time, the control unit 800 may select a calculation formula based on the size of the cylinder inner diameter of the first sliding portion (piston 512) from among a plurality of calculation formulas, and calculate and determine a leak situation based on the selected calculation formula. The second contact force at that time, and the control unit 800 may also select a value based on the size of the cylinder inner diameter of the first sliding portion (piston 512) from a plurality of values, and determine the second contact when there is a leak. relay. The plurality of calculation formulas may be calculation formulas stored in the memory section (not shown) in advance, or calculation formulas input from the outside. The plurality of values may be values stored in the memory section in advance, or may be externally stored. Enter the value.

<Second Embodiment> Fig. 11 is a schematic partial vertical cross-sectional view of a component transfer head of this embodiment. Hereinafter, a second embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. 11, but the differences from the above embodiment will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the first embodiment described above except that the configuration of the electronic component, the second base portion, and the inspection portion is different.

In this embodiment, the IC element 90 includes a substrate 902 and a protruding portion 903 protrudingly provided on a surface on the + Z side of the substrate 902. Furthermore, a plurality of terminals 901 are provided on a surface on the -Z side of the substrate 902. The size of the protruding portion 903 in plan view is substantially the same as that of the lower end surface of the suction nozzle 31.

Moreover, in the electronic component conveying apparatus 10, the recessed part 165 of the inspection part 16 becomes the magnitude | size which the board | substrate 902 can enter.

In the present embodiment, the piping 81 and the piping 82 are constituted by independent flow paths, and a box 83, a regulator 84, and an operating fluid supply unit 85 are connected to the piping 81 and the piping 82, respectively. Thereby, the pressures in the first space S1 and the second space S2 can be adjusted independently. That is, the pressure of the actuating fluid R (not shown) on the first space S1 and the pressure of the actuating fluid R on the second space S2 can be individually changed and can be set differently. Thereby, the force by which the suction nozzle 31 presses the IC element 90 and the force by which the third block 34 presses the IC element 90 and the inspection portion 16 can be independently adjusted. Although this structure is not shown, it is advantageous to omit the step of designing such that the ratio of the first pressure receiving surface M1 to the second pressure receiving surface M2 becomes a desired value. In addition, the pressure setting of the first space S1 and the second space S2 may be configured to be operated on the monitor 300 shown in FIG. 1.

With such a configuration, the contact force of the suction nozzle 31 as the second sliding portion against the IC component 90 which is an electronic component and the third block 34 which is a part of the second base portion can be brought into contact with the electronics. The contact force of the IC element 90, which is a component, is different. By this, for example, when the load on the substrate 902 is to be reduced, the contact force to the substrate 902 can be made weaker than the contact force to the protrusion 903, or when the load on the protrusion 903 is to be reduced. , The contact force to the protruding portion 903 can be made weaker than the contact force to the substrate 902.

Moreover, in the electronic component transfer apparatus 10, the third block 34 of the suction unit 3 includes a protruding portion 346 protruding from the lower surface 342 in the -Z direction. The protruding portion 346 enters the recessed portion 165 of the inspection portion 16 in a pressed and stored state. In addition, the protruding portion 346 comes into contact with the substrate 902 of the IC element 90 in a pressed and stored state. That is, the protruding portion 346 which is a part of the second base portion can be brought into contact with the substrate 902 which is a part of the IC element 90 which is an electronic component. Thereby, the protruding portion 346 can press the substrate 902 of the IC element 90.

In the state of being pressed and stored, the protruding portion 903 of the IC element 90 enters the through hole 344 of the third block 34 and is pressed by the suction nozzle 31. The protruding portion 346 of the third block 34 which is a part of the second base portion and the suction nozzle 31 which is the second sliding portion are in contact with the IC element 90 which is an electronic component at different positions. Thereby, the protruding portion 346 can press the substrate 902 of the IC element 90, and the suction nozzle 31 can press the protruding portion 903 of the IC element 90.

In the state of being pressed and stored, the lower surface 342 of the third block 34 comes into contact with the abutting portion 162 of the inspection portion 16, and the inspection portion 16 is pressed by the third block 34.

Thus, in this embodiment, the suction nozzle 31 presses the protruding portion 903 of the IC element 90, the protruding portion 346 of the third block 34 presses the substrate 902 of the IC element 90, and the lower surface 342 of the third block 34 presses Examination Department 16. Thereby, even if it is an IC element 90 having a step as in this embodiment, each terminal 901 of the IC element 90 can be brought into contact with (abut on) the probe pin 163 of the inspection section 16 precisely and uniformly, Accordingly, inspection of the IC element 90 can be performed accurately.

<Third Embodiment> Fig. 12 is a schematic partial vertical cross-sectional view of a component transfer head of this embodiment. Hereinafter, a third embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. 12. However, the differences from the above embodiment will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the second embodiment described above except that the configuration of the electronic component and the second base is different.

In this embodiment, the IC element 90 is the one in which the center S903 of the protruding portion 903 and the center S902 of the substrate 902 deviate in the X direction and the Y direction. That is, the protruding portion 903 is disposed eccentrically with respect to the substrate 902. The "center" refers to a point where two diagonal lines intersect when the plan view shape is a quadrangle.

In the present embodiment, the through-holes 344 are offset from the center of the protruding portion 346 of the third block 34 in the X direction and the Y direction in accordance with the deviation of the center S902 and the center S903. That is, the through-holes 344 are arranged eccentrically with respect to the protruding portion 346. Thereby, the suction nozzle 31 sliding in the through hole 344 can press the protruding portion 903 of the IC element 90.

Thus, in this embodiment, even if the center S903 of the protruding portion 903 and the center S902 of the substrate 902 deviate in the X direction and the Y direction, the terminals 901 of the IC element 90 can be brought into contact with (but abutted to) the uniform and even contact with The probe pin 163 of the inspection unit 16 can accurately perform inspection on the IC component 90.

<Fourth Embodiment> FIG. 13 is a schematic partial vertical cross-sectional view of a component transfer head and a movable portion of this embodiment. Hereinafter, a fourth embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. 13. However, the differences from the above embodiment will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the second embodiment described above except that the configuration of the inspection section is different. As shown in FIG. 13, the component supply unit 14 is a pre-inspection electronic component placement unit for placing electronic components before the inspection, that is, IC components 90, and the component recovery unit 18 is an electronic part placement IC, which is used to place the electronic components after inspection. The electronic part mounting section after inspection. As shown in FIG. 13, the component supply section 14 and the component recovery section 18 are unitized as a movable section 30 that can mount and move an IC component 90 that is an electronic component. This movable section 30 includes an X-direction moving mechanism 7 in addition to the component supply section 14 and the component recovery section 18.

The component supply portion 14 has a recessed portion (groove) 141 in which an IC component 90 is placed and received and formed in a recessed manner. In this embodiment, the number of the recessed portions 141 is eight, and the configuration is preferably the same as the configuration of the eight suction portions 3 in the component transfer head 17A or the component transfer head 17B, that is, There are four states each in the X direction and the Y direction.

The component recovery portion 18 is also recessed with a recessed portion (groove) 181 on which the IC component 90 is placed and stored. In this embodiment, the number of the recessed portions 181 is eight, and the configuration is preferably the same as the configuration of the eight suction portions 3 in the component transfer head 17, that is, in the X direction and the Y direction. Each configuration has 4 states.

The X-direction moving mechanism 7 includes a linear guide 71A and a support base 72A that collectively supports the component supply section 14 and the component recovery section 18. The linear guide 71A includes a rail 711A and two sliders 712A. A support base 72A is fixed to the two sliders 712A.

The electronic component transporting apparatus 10 includes a force detection unit 9 that is provided in the movable unit 30 (the component supply unit 14 in the configuration shown in the figure) and can detect a force. The force detection section 9 is arranged on the spacer 73A on the component supply section 14.

The force detection unit 9 is not particularly limited, and for example, a load cell is preferably used. Load cells are converters with built-in strain gauges that convert the magnitude of force into electrical signals. Thereby, the contact force F90 can be set to an actual measured value instead of a design value (calculated value), and the detection can be performed as accurately as possible.

The detection result detected by the force detection unit 9, that is, the magnitude of the contact force is memorized in a memory unit (not shown) of the control unit 800.

The force detection section 9 is arranged on the spacer 73A on the component supply section 14 and can be brought into contact with the IC component 90 that is an electronic component that is in contact with (adsorbed on) the adsorption nozzle 31 that is the second sliding section.

In this embodiment, for example, as shown in FIG. 13, the IC element 90 is pressed against the force detection unit 9 before the IC element 90 is put into the storage state, that is, before the inspection is performed, and the contact force is detected. F90. Then, the pressing force can be adjusted based on the detected contact force F90.

In addition, for detecting the contact force F90, for example, it is preferable to perform detection at a position where the position where the IC element 90 abuts against the force detection section 9 further falls within a range of 0.1 mm to 2.0 mm.

Furthermore, the detection of the contact force as described above may be performed without using the IC element 90, but using a force detection member having the same size as the IC element 90.

<Fifth Embodiment> Fig. 14 is a schematic partial vertical cross-sectional view of a component transfer head of this embodiment. Hereinafter, a fifth embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. 14. However, the differences from the above embodiment will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the first embodiment described above except that the configuration of the first sliding portion is different. As shown in FIG. 14, an elastic diaphragm 53 is provided inside the cylinder 511. The diaphragm 53 is provided midway in the Z direction of the cylinder 511 and is closer to the -Z side than the through hole 516. The lower surface 531 of the diaphragm 53 is in contact with the flange portion 514 of the piston 512. Although not shown, the diaphragm 53 is parallel to the X-axis and the Y-axis in a natural state. In this embodiment, the space on the + Z side from the diaphragm 53 becomes the first space S1.

As shown in FIG. 14, in a state where the piston 512 lifts the diaphragm 53 to the + Z side and deforms the diaphragm 53, the piston 512 receives the restoring force of the diaphragm 53 to return to the natural state. Thereby, the parallelism with respect to the XY plane can be generated by the diaphragm 53. As a result, the third block 34 can push the inspection unit 16 in a state where the parallelism is generated.

The flow sensor 87 may be disposed between the blocking solenoid valve 88 and the tank 83. When the piping 81 such as the second space S2 that supplies the working fluid R to the suction section 3 of the other component transfer head is branched into the piping 80 from the middle, the flow sensor 87 may be provided at the branch point of the piping 81 Between 89 and 83. Accordingly, even when there is only one flow sensor 87, for example, the blocking solenoid valve 88 provided in the pipe 81 is opened (blocked) and the blocking solenoid valve provided in the pipe 80 is connected. It is also possible to detect the leakage of the working fluid R of the component transfer head connected to the piping 80 when it is turned on.

<Sixth Embodiment> FIG. 15 is a schematic partial vertical cross-sectional view of a component transfer head of this embodiment. Hereinafter, a sixth embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 15. However, the differences from the above embodiment will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the first embodiment described above except that the configuration of the replacement kit is different. As shown in FIG. 15, by installing a replacement kit provided with a mechanical spring, when the operating fluid R from the inner cavity portion 336 remains leaking, the pressure in the first space S1 is also reduced, and it is difficult to use the first space S1. The adjustment of the pressure of the working fluid R in the space S1 cancels the individual difference of the IC element 90.

In this embodiment, the flow sensor 87 is used to detect the leakage amount of the working fluid R, and it is automatically determined whether the installed replacement kit has an air spring. In the case of an air spring, that is, a replacement kit with a mechanical spring At this time, the supply of the working fluid R can be blocked. The blocking solenoid valve 88 prevents leakage of the working fluid R from the inner cavity portion 336.

In addition, since the front end is blocked more than the blocking solenoid valve 88, the flow rate in the flow sensor 87 does not change. Therefore, no false detection is performed. In addition, when forgetting to install the replacement kit, the operating fluid R can be prevented from leaking from the inner cavity portion 336.

In the above, the illustrated embodiments of the electronic component transfer device and the electronic component inspection device according to the present invention have been described, but the present invention is not limited to this, and each part constituting the electronic component transfer device and the electronic component inspection device can play a role The same function can be replaced by any constituent. Moreover, you may add arbitrary structures. For example, although the component transfer head 17 has been described as the transfer unit of the present invention, the transfer unit may be any one that transfers IC components, and the transfer unit of the present invention may be provided on the component transfer head 13 or the component transfer head 20.

The electronic component transfer device and the electronic component inspection device according to the present invention may be a combination of any two or more configurations (features) in each of the embodiments described above.

1‧‧‧Electronic parts inspection device

3‧‧‧Suction section (second member) (transport section)

5‧‧‧ Posture adjustment unit (first component)

6‧‧‧Insulation

7‧‧‧X-direction moving mechanism

8‧‧‧Piping

9‧‧‧ Force detection department

10‧‧‧Electronic parts transfer device

11A‧‧‧Tray transfer mechanism

11B‧‧‧Tray transfer mechanism

12‧‧‧Temperature Adjustment Department

13‧‧‧component transfer head

14‧‧‧Component Supply Department

15‧‧‧pallet transfer mechanism

16‧‧‧ Inspection Department

17‧‧‧ component transfer head

17A‧‧‧component transfer head

17B‧‧‧component transfer head

18‧‧‧Component Recycling Department

19‧‧‧Recycling tray

20‧‧‧component transfer head

21‧‧‧Tray transfer mechanism

22A‧‧‧Tray transfer mechanism

22B‧‧‧Tray transfer mechanism

30‧‧‧ Movable section

31‧‧‧Adsorption nozzle (second sliding part) (conveying part)

32‧‧‧ Block 1

33‧‧‧ Block 2

34‧‧‧The third block (the second base)

35‧‧‧washer

36‧‧‧ connector

37‧‧‧washer

38‧‧‧washer

41‧‧‧ connector

42‧‧‧ connector

43‧‧‧washer

51‧‧‧The first adjustment mechanism

52‧‧‧The second adjustment mechanism

53‧‧‧ diaphragm

61‧‧‧Insulation member

71‧‧‧Piping

71A‧‧‧ Linear Guide

72‧‧‧ Ejector

72A‧‧‧Support base

73‧‧‧Adjuster

73A‧‧‧ spacer

80‧‧‧Piping (flow path)

81‧‧‧Piping (flow path)

82‧‧‧Piping (flow path)

83‧‧‧carton

84‧‧‧Adjuster (pressure regulator)

85‧‧‧ Actuating fluid supply unit

86‧‧‧ branch point

87‧‧‧Flow sensor

88‧‧‧ blocking solenoid valve

89‧‧‧ branch point

90‧‧‧IC components (electronic parts)

141‧‧‧ recess (groove)

150‧‧‧slot

152‧‧‧Guide Pin

161‧‧‧ Inspection Department

162‧‧‧Abutment Department

163‧‧‧Probe Pin

165‧‧‧ recess (groove)

166‧‧‧Electronic parts ejector

171‧‧‧Connection Department

181‧‧‧concave (groove)

200‧‧‧tray

231‧‧‧The first partition

232‧‧‧Second partition

233‧‧‧ 3rd partition

234‧‧‧ 4th partition

235‧‧‧ 5th partition

241‧‧‧Front housing

242‧‧‧side shell

243‧‧‧side shell

244‧‧‧ rear shell

245‧‧‧ Upper shell

300‧‧‧ monitor

301‧‧‧display

311‧‧‧upper surface

312‧‧‧ lower surface

313‧‧‧ Internal cavity

314‧‧‧ opening (suction port)

315‧‧‧ flange

316‧‧‧slot

321‧‧‧upper surface

322‧‧‧ lower surface

324‧‧‧Inner cavity

325‧‧‧concave

331‧‧‧upper surface

332‧‧‧ lower surface

333‧‧‧Inner cavity

334‧‧‧slot

336‧‧‧ Internal cavity

338‧‧‧slot

340‧‧‧slot

341‧‧‧ Top surface

342‧‧‧lower surface

344‧‧‧through hole

346‧‧‧ protrusion

348‧‧‧ recess

400‧‧‧ signal light

500‧‧‧Speaker

511‧‧‧cylinder (first base)

512‧‧‧Piston (1st sliding part)

513‧‧‧ Internal cavity

514‧‧‧ flange

515‧‧‧Piston rod

516‧‧‧through hole

521‧‧‧ plate member

531‧‧‧ lower surface

600‧‧‧Mouse Station

700‧‧‧ operation panel

711A‧‧‧track

712A‧‧‧Slider

800‧‧‧ Control Department

901‧‧‧terminal

902‧‧‧ substrate

903‧‧‧ protrusion

A1‧‧‧Tray supply area

A2‧‧‧component supply area (supply area)

A3‧‧‧ Inspection area

A4‧‧‧component recycling area (recycling area)

A5‧‧‧Tray removal area

F3‧‧‧Suction

F3'‧‧‧Suction

F90‧‧‧ abutment force

H90‧‧‧Distance

M1‧‧‧The first pressure surface

M2‧‧‧Second pressure surface

R‧‧‧Motion fluid

S1‧‧‧The first space

S2‧‧‧Second Space

S902‧‧‧ Center

S903‧‧‧Center

S10 ～ S60‧‧‧‧steps

X‧‧‧axis

Y‧‧‧axis

Z‧‧‧axis

α3‧‧‧Suction direction

α11A‧‧‧Arrow

α11B‧‧‧Arrow

α13X‧‧‧arrow

α13Y‧‧‧Arrow

α14‧‧‧Arrow

α15‧‧‧Arrow

α17Y‧‧‧Arrow

α18‧‧‧ Arrow

α20X‧‧‧Arrow

α20Y‧‧‧Arrow

α21‧‧‧ Arrow

α22A‧‧‧Arrow

α22B‧‧‧Arrow

α90‧‧‧ Arrow

FIG. 1 is a schematic perspective view of the electronic component inspection apparatus of the first embodiment as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is a perspective view showing a component transfer head provided in the inspection area in FIG. 2. FIG. 4 is a schematic partial vertical cross-sectional view sequentially showing an operating state of a component transfer head provided in the inspection area in FIG. 2. FIG. 5 is a schematic partial vertical cross-sectional view sequentially showing an operating state of a component transfer head provided in the inspection area in FIG. 2. FIG. 6 is a schematic partial vertical cross-sectional view sequentially showing an operating state of a component transfer head provided in the inspection area in FIG. 2. FIG. 7 shows that when the lower surface (suction surface) of the suction nozzle is used as a reference, even if the IC device has an uneven distance from the lower surface to the terminals of the IC device, each terminal can contact the probe pins of the inspection unit. Vertical sectional view of the state. FIG. 8 shows that when the lower surface (suction surface) of the suction nozzle is used as a reference, even if the IC device has an uneven distance from the lower surface to the terminals of the IC device, each terminal can contact the probe pins of the inspection unit. Vertical sectional view of the state. Fig. 9 shows that when the lower surface (suction surface) of the suction nozzle is used as a reference, even if the IC device has an uneven distance from the lower surface to the terminals of the IC device, each terminal can contact the probe pins of the inspection unit. Vertical sectional view of the state. FIG. 10 is a flowchart showing the opening and closing sequence of a blocking solenoid valve. Fig. 11 is a schematic partial vertical sectional view of a component transfer head according to a second embodiment. Fig. 12 is a schematic partial vertical sectional view of a component transfer head according to a third embodiment. Fig. 13 is a schematic partial vertical cross-sectional view of a component transfer head and a movable portion of a fourth embodiment. Fig. 14 is a schematic partial vertical sectional view of a component transfer head according to a fifth embodiment. Fig. 15 is a schematic partial vertical sectional view of a component transfer head according to a sixth embodiment.

Claims (15)

An electronic component conveying device for conveying the electronic component to an inspection unit for inspecting the electrical characteristics of the electronic component, and comprising: a conveying unit including a first member and a second member, and conveying the electronic component to the inspection unit The first member has a first base portion, a first sliding portion that slides with respect to the first base portion, and a first space defined by the first base portion and the first sliding portion. The second member has a position mounted on the first portion. A second base portion of the first sliding portion, a second sliding portion sliding relative to the second base portion and abutting on the electronic component, and a second space defined by the second base portion and the second sliding portion; a piping portion, It has a flow path that communicates with the second space and supplies an actuating fluid to the second space; a flow sensor that is arranged in the flow path and detects the flow rate of the actuating fluid; a pressure regulating unit that adjusts the above A pressure of a working fluid; and a control unit that holds the electronic component to the second sliding portion and causes the second sliding portion to press the electronic component to the inspection portion. The electronic component transfer device according to claim 1, wherein the working fluid flows into the first space and the second space. For example, the electronic component transporting device of claim 1 includes an opening and closing section provided in the flow path to open and close the flow path, and the control section determines the opening and closing based on a flow rate detected by the flow sensor. Ministry of opening and closing. The electronic component transfer device according to claim 3, wherein the flow sensor is disposed in the flow path between the opening and closing section and the second space. For example, the electronic component transfer device of item 3, wherein if the flow sensor detects a specific flow of the above-mentioned working fluid, it outputs a warning. For example, the electronic component transfer device according to claim 1 further includes an electronic component mounting portion for mounting the electronic component, and the second base portion abuts the electronic component mounting portion. In the electronic component conveying device according to claim 6, wherein the force with which the second sliding portion presses the electronic component is different from the force with which the second base portion presses the electronic component placing portion. The electronic component transporting device according to claim 1, further comprising an operating fluid supply unit that supplies the operating fluid to the first space and the second space. The electronic component transporting device according to claim 1, further comprising a relaxation portion which is disposed in the flow path between the pressure regulating portion and the second member, and allows the working fluid to flow in from the second space. For example, the electronic component conveying device according to claim 2, wherein the first sliding portion has a first pressure-receiving surface receiving a force from the working fluid, and the second sliding portion has a second pressure-receiving surface receiving a force from the working fluid. The area of the first pressure receiving surface is larger than the area of the second pressure receiving surface. For example, the electronic component transfer device according to claim 1, wherein the second base portion is in contact with the electronic component. According to the electronic component transfer device of claim 11, wherein the force with which the second sliding portion presses the electronic component is different from the force with which the second base portion presses the electronic component. For example, in the electronic component transfer device of claim 2, the pressure of the working fluid flowing into the first space is different from the pressure of the working fluid flowing into the second space. For example, the electronic component transporting device of claim 1 includes: a movable portion that mounts and moves the electronic component; and a force detection portion that is provided in the movable portion and detects the force; the force detection portion and the electronic component are in contact with each other. Pick up. An electronic component inspection device includes: an inspection section that inspects electrical characteristics of an electronic component; a transport section including a first member and a second member, and transporting the electronic component to the inspection section, the first member having a first section A first base part, a first sliding part sliding relative to the first base part, and a first space defined by the first base part and the first sliding part, and the second member has a second part mounted on the first sliding part A base portion, a second sliding portion which slides relative to the second base portion and abuts the electronic component, and a second space defined by the second base portion and the second sliding portion; a piping portion having a flow path, and the flow The flow path communicates with the second space and supplies the working fluid to the second space; a flow sensor disposed in the flow path and detects the flow rate of the working fluid; a pressure regulating unit that adjusts the pressure of the working fluid; and The control unit holds the electronic component on the second sliding portion, and causes the second sliding portion to press the electronic component to the inspection portion.