KR100251650B1 - Performance board of inspectional equiment of a semiconductor device and inspectional equipment - Google Patents

Abstract

PURPOSE: A performance board of a semiconductor testing apparatus and testing apparatus including the performance board are provided which uniformly distributes force applied to pins when the performance board comes into contact with the pins during execution of EDS process to protect the pins from being damaged, improves the reliability of EDS process data and prevents the testing apparatus from being damaged. CONSTITUTION: A performance board of a semiconductor testing apparatus includes an upper board to which an electric signal generated by a tester part for testing semiconductor devices is applied, and a lower board connected to the upper board to receive the electric signal to apply the signal to a probe part. A buffer(28) connects the upper and low boards to each other to buffer a predetermined distance when the upper and low boards are moved. The buffer has a lower fixing member(36) which is connected to the lower board, an upper fixing member(42) connected to the upper board, and an elastic member(30) placed between the upper and low fixing members to provide predetermined elastic force. The lower fixing member has a polygonal tube shape so that the upper fixing member can be inserted into the lower fixing member. The upper fixing member has a tub shape to be inserted into the lower fixing member.

Description

Performance board of semiconductor inspection apparatus and inspection apparatus having same {Performance board of inspectional equiment of a semiconductor device and inspectional equipment}

The present invention relates to a performance board of a semiconductor inspection device and an inspection device having the same, and more specifically, a lower board of a performance board provided between a tester part and a prober part. The present invention relates to a performance board of a semiconductor inspection apparatus having an elastic member that can flow up and down with respect to an upper board, and an inspection apparatus having the same.

In general, in the manufacture of a semiconductor device, a fabrication process of forming a pattern on a wafer and an assembly process of assembling the wafer on which the pattern is formed into each unit chip are performed. .

In addition, a process of Electrical Die Sorting (EDS), which inspects electrical characteristics of each unit chip constituting the wafer, is performed between the processes.

The EDS process is performed to reduce assembly costs and inspection costs in the assembly process by recognizing defective chips from the unit chips constituting the wafer and regenerating the defective chips or removing them early.

In the EDS process, an inspection apparatus for determining a defect as a result of applying an electrical signal to a unit chip of a wafer and outputting the electrical signal is mainly used.

Such an inspection apparatus is provided with a head and a tester for generating an electrical signal, a prober for loading and aligning a wafer, and a probe card for transferring the electrical signal generated in the tester to a unit chip of a wafer. It consists of a prober part provided with a back.

A performance board is provided between the tester unit and the prober unit to transmit an electrical signal to the tester unit.

Here, the performance board varies in configuration depending on the pattern of the chip implemented on the wafer, but in general, the upper board 12 and the prober unit (not shown) provided in the tester unit 10 as shown in FIG. ), I.e., the lower board 16 in contact with the measuring 14 of the probe card (not shown), and the connecting portion 18 connecting the upper board 12 and the lower board 16 to each other.

The measuring ring 14 is a facility for supplying the electrical signal to the probe card when the electrical signal is input from the tester 10 in the test facility for testing a semiconductor device through the performance board (1). It is part of.

In the performance of the EDS process using the conventional inspection apparatus provided with the performance board 1 consisting of the upper board 12, the lower board 16, and the connecting portion 18 as described above, the electrical signal generated by the tester unit 10 Is transmitted to the probe card of the prober portion through the performance board (1).

That is, the performance board 1 presses a pogo pin 19 provided on the measuring ring 14 to transmit an electrical signal to the prober unit.

Here, when the performance board 1 presses the pogo pin 19 of the measuring ring 14 to transmit an electrical signal to the prober part, the performance board 1 is kept in a state where the measuring board 14 is correctly maintained . Must press the pogo pin (19).

However, although the connection part 18 of the conventional performance board 1 was able to flow left and right, it did not flow up and down.

Therefore, since the connection part 18 of the performance board 1 could not flow up and down, the tester part 10 to which the performance board 1 was mounted is the pogo pin 19 of the measuring ring 14. Pressing the weight of the tester unit 10 and the force applied by the performance board 1 is transmitted to the pogo pin 19 of the measuring ring 14 without filtering or buffering is provided in the lower portion of the measuring ring 14 This affected the probe card of the prober part.

For example, as shown in FIG. 2, when the performance board 1 is not leveled, pressing the pogo pin 19 of the measuring ring 14 is fixed to the pogo pin 19 of the measuring ring 14. The force was not evenly applied.

As a result, intensive force is applied to the pogo pins 19 of the measuring ring 14 in contact with the inclined portion of the performance board 1, thereby damaging the probe card of the prober portion provided below the measuring ring 14. I was.

In addition, the probe card of the prober portion in contact in the above-described state also affected the contact of the wafer, thereby lowering the data reliability of the EDS process of inspecting the electrical state of the wafer.

In addition, the pogo pin 19 of the measuring ring 14 is not uniformly applied to the pogo pin 19 of the measuring ring 14 by performing a process in which one side of the performance board 1 is inclined. The back was also damaged.

Therefore, in the conventional EDS process, the performance board is inclined and the pogo pin is in contact with the pogo pin, and more force is applied to the inclined portion, which causes wear and tear, thereby reducing the reliability of the process performance data. There was a problem that the productivity is reduced by damaging the inspection apparatus used in the process.

An object of the present invention is to solve the above-mentioned problems, when the performance board is in contact with the pogo pin when performing the EDS process, the force received by each pogo pin is evenly distributed to prevent damage to the pogo pin, EDS process The present invention provides a performance board of a semiconductor inspection apparatus for improving productivity by improving data reliability and preventing damage to an inspection apparatus, and an inspection apparatus having the same.

1 and 2 are schematic diagrams showing a conventional semiconductor inspection apparatus.

3 and 6 are schematic diagrams showing an embodiment of a semiconductor inspection apparatus according to the present invention.

Fig. 4 is a detailed view of Fig. 3A, showing the elastic member of the present invention.

5 is a view showing an elastic member of the present invention.

※ Explanation of symbols for main parts of drawing

1, 2: Performance board 10, 20: Tester part

12, 24: upper board 14, 22: measuring

16, 26: lower board 18: connection

19, 23: pogo pin 28, 48: buffer

30: elastic member 32, 38: cylinder

34: inner cylinder 36, 50: lower fixing station

40: inner rod 42, 52: upper fixing stand

54: protective casing

The performance board of the semiconductor test apparatus according to the present invention for achieving the above object, the upper board is supplied with an electrical signal generated in the tester (Tester Part) for testing a semiconductor device, and the electrical signal is connected to the upper board In the performance board of the semiconductor inspection apparatus provided with a lower board in contact with the prober part to receive the applied to the prober part (Prober Part), the lower board is connected to the lower board, the tubular shape of the polygon is inserted The buffer is made of an elastic member that is provided between the lower fixing stand, and the upper fixing board connected to the upper board, the upper fixing stand made of a cylindrical shape to be inserted into the lower fixing stand and the lower fixing stand and the upper fixing stand to provide a predetermined elastic force. Upper board The lower board is connected to the upper board and the lower board when the flow is made to buffer a predetermined interval.

In addition, the lower fixing rod is provided with an inner cylinder which reduces the diameter of the inlet in one of the open cylinder of the one side is fixed to the lower board, the upper fixing rod is open on one side to be inserted into the lower fixing stand. The inner end of the cylinder is provided with a larger than the diameter of the inner cylinder of the lower fixing rod may be made so that the inner rod inserted into the inner cylinder is integrally fixed to the upper board.

In another example, the lower fixing stand is fixed to the lower board is provided with a cylindrical cylinder on one side, the upper fixing stand is fixed to the upper board is provided with a rod inserted into the lower fixing stand, the elastic member It may be extended to the ends of the upper and lower fixing rod may be provided on the outer side of the cylinder of the lower fixing. At this time, the outer side of the elastic member is preferably provided with a protective cylinder surrounding the outer side of the elastic member to protect it.

The above-mentioned elastic member is preferably made of a spring having a predetermined elastic force.

It is preferable that the upper and lower fixing rods fixed to the upper board and the lower board are fixed by screwing.

In accordance with another aspect of the present invention, a semiconductor inspection apparatus includes a tester unit configured to generate an electrical signal and determine an electrical state of each unit chip constituting a wafer; A probe card having a chuck on which the wafer is seated, a prober for aligning the wafer seated on the chuck, a needle for contacting the wafer to apply an electrical signal, and an electrical signal to the needle A prober portion including a measuring ring having a pogo pin to transmit the electrical signal to the wafer; And an upper board provided in the tester unit and a lower board contacting the prober part, and connected to the lower board so that the lower board flows up and down with respect to the upper board, and has a polygonal tubular shape. And a lower fixing stand into which the upper fixing stand can be inserted, and an upper fixing stand which is connected to the upper board and can be inserted into the lower fixing stand, and is installed between the lower fixing stand and the upper fixing stand to provide a predetermined elastic force. It is provided with a performance board made of a buffer.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, FIG. 3 shows a state in which a tester 20 for generating an electrical signal when an EDS process is performed, and a performance board 2 provided below the tester 20.

And, the lower side of the performance board (2) is in contact with the performance board (2) to transfer the electrical signal generated by the tester unit 20 to the probe card (not shown) of the prober portion (not shown) (22) is provided.

Here, the measuring ring 22 is provided with a plurality of pogo pins 23, and in the embodiment, the measuring ring 22 having 1,280 pogo pins 23 is used.

And the performance board 2 of the present invention, the lower board 26 and the upper board 24 in contact with the upper board 24 and the pogo pin 23 of the measuring ring 22 provided in the tester unit 20 And a buffer unit 28 for connecting the lower board 26 to the lower board 26 so that the lower board 26 can flow up and down with respect to the upper board 24 of the performance board 2. An elastic member 30 as shown in FIG. 4 is provided.

Here, the buffer unit 28 of the present embodiment may be formed of a lower fixing stand 36, an upper fixing stand 42, and an elastic member 30. The lower fixing stand 36 is integrally provided with an inner cylinder 34 in which the diameter of the inlet is reduced in the inside of the cylinder 32 in which one side is opened and fixed to the lower board 26. The upper fixing stand 42 has an end portion larger than the diameter of the inner cylinder 34 of the lower fixing stand 36 so that one end of the upper fixing stand 42 is inserted into the lower fixing stand 36. Inner rod 40 to be inserted into) is fixed to the upper board 24 integrally. And the elastic member 30 is made of a spring or the like provided between the upper fixing table 42 and the inner rod 40.

As another embodiment, the buffer unit 28 may be formed by reversing the positions of the upper fixing table 42 and the lower fixing table 36.

In addition, as shown in Figure 5, the buffer unit 48, one side is provided with an open cylinder is fixed to the lower side board 26, the lower side stand 50, the rod is inserted into the lower side stand (50) The upper fixing base 52 is provided to be fixed to the upper board 24 is provided, and also extended to the end between the upper fixing unit 52 and the lower fixing unit 50 to allow them to flow, the spring to provide a predetermined elastic force It is made of an elastic member 30, such as. In another embodiment, the buffer 48 may be configured by changing the positions of the upper fixing stand 52 and the lower fixing stand 50 up and down.

In addition, the shock absorbing portion 48 formed as shown in FIG. 5 may further include a protective tube 54 surrounding the outer portion of the elastic member 30 so that the elastic member 30 is protected, and fixed to the upper board 24. The upper fixing table 52 and the lower fixing plate 50 fixed to the lower board 26 may be fixed by screwing.

6 is a view showing the performance of the EDS process by using the performance board 2 having the elastic member 30, where an embodiment of the present invention shows the performance board 2 during the performance of the EDS process. The horizontal state is made by the elastic member 30.

That is, it is because the elastic member 30 buffers the force applied to the pogo pin 23 when pressing the pogo pin 23 of the measuring ring 22 by using the performance board (2).

According to the present invention having such a configuration, since the horizontal state of the performance board 2 can be kept constant by using the elastic member 30 when performing the EDS process, the reliability of the EDS process data can be improved, and the EDS process can be used. It is possible to prevent damage to the inspection device.

Actions and effects on specific embodiments according to the present invention having the above-described configuration will be described.

First, the tester 20 equipped with the performance board 2 presses the pogo pin 23 of the measuring ring 22 (including the force of the air and the motor pressing the tester) at 161 Kg, and 1,280 pogos. The EDS process is performed using the measuring ring 22 having the pins 23.

First, the pogo pin 23 of the measuring ring 22 is pressed using the tester part 20 on which the performance board 2 is mounted.

Here, the performance board 2 on which the tester 20 is mounted is 161 Kg, and the measuring ring 22 includes 1,280 pogo pins 23 so that the performance board 2 measures the measuring ring 22 during the EDS process. When pressing the pogo pin 23, the force applied to one pogo pin 23 is about 125.8g on average.

That is, as described above, when the 125.8 g of force is applied to one pogo pin 23 of the measuring ring 22, the performance board 2 is maintained in a horizontal manner. By applying the force to the pogo pin 23 of the measuring ring 22 while the performance board 2 is inclined, the elastic member 30 acts as a buffer so that the above force is applied to the poling pin of the measuring ring 22. It may be delivered to the pin (23).

The elastic member 30 in the present invention using the numerical value by such a calculation has a different elastic force according to the force applied to the pogo pin 23 of the measuring ring 22 by the tester unit 20 on which the performance board 2 is mounted. It may be provided as.

For example, in order to press one pogo pin 23 of the measuring ring 22 about 1 mm, a force of 27.2 g and a lower 30g need to be pressed at the top of the pogo pin 23 of the measuring ring 22, and press about 2 mm. This requires 35.6g at the top and 40.2g at the bottom.

Here, in order to press one pogo pin 23 of the measuring ring 22 about 3mm to 4mm, a force of about 88.2g to 93.2g is required, and 1,280 pogo pins 23 are simultaneously about 3mm to 4mm as in the embodiment. In order to press the force of about 113Kg to 120Kg is required, and thus the pressing force of the pogo pin 23 of the measuring ring 22 should not be biased to one side.

When the pogo pin 23 of the measuring ring 22 is pressed by the force as described above, the present invention can prevent the force from being biased to one side by using the elastic member 30. That is, when the performance board 2 presses the pogo pin 23 of the measuring ring 22 by about 4 mm, the force applied to the pogo pin 23 of the measuring ring 22 is about 120 kg, and the force of 120 kg is applied. The elastic member 30 is provided on the performance board 2 so that the balance of the force is applied, even when the pogo pin 23 of the measuring ring 22 is pressed with a force of 120 Kg or more. By performing the buffering function, the performance board 2 can be kept horizontal.

Accordingly, when the elastic member 30 is provided on the performance board 2 and a predetermined force or more is applied, the elastic member 30 flows up and down the performance board 2 to perform a buffering action, so that Force can be applied constantly.

That is, the performance board 2 of the present invention is provided with an elastic member 30 so that a uniform force is applied to the pogo pins 23 of the measuring ring 22. This can be kept constant without deformation.

Therefore, since the pogo pin 23 of the measuring ring 22 is pressed in a state in which a constant force is evenly applied, it is possible to prevent the deformation of the probe card of the prober part, so that the EDS process is accurately performed, thereby improving the reliability of the EDS process data. Can be.

In addition, damage to the pogo pin 23 of the measuring ring 22 and the probe card of the prober part can be minimized, and operations such as checking the horizontal state of the performance board 2 can be omitted, thereby improving maintenance efficiency. You can.

Therefore, according to the present invention, the lower board of the performance board makes contact with the pogo pins with a uniform force, thereby preventing damage to the pogo pins, improving reliability of the EDS process data, and minimizing damage to the EDS process inspection apparatus, thereby improving productivity. There is an effect to be improved.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (8)

An upper board to which an electrical signal generated from a tester part for testing a semiconductor device is supplied, and connected to the upper board to contact the prober part to receive the electrical signal and to be applied to a prober part. In the performance board of the semiconductor inspection device provided with a lower board, A lower fixing stand connected to the lower board and having a polygonal tubular shape, into which the upper fixing stand can be inserted; An upper fixing rod connected to the upper board and having a tubular shape so as to be inserted into the lower fixing rod; And An elastic member installed between the lower fixing stand and the upper fixing stand to provide a predetermined elastic force; The upper board and the lower board is connected to the buffer portion consisting of the performance board of the semiconductor inspection device, characterized in that the upper board and the lower board is buffered at a predetermined interval when the flow. The method of claim 1, The lower fixing stand is fixed to the lower board is provided with an internal cylinder that is reduced in diameter of the inlet in the interior of the open cylinder on one side, The upper fixing rod is provided with an end larger than the diameter of the inner cylinder of the lower fixing rod in one end of the open cylinder to be inserted into the lower fixing unit, the inner rod inserted into the inner cylinder is fixed to the upper board integrally A performance board of the semiconductor inspection device, characterized in that. The method according to claim 1 or 2, The elastic member is a performance board of the semiconductor inspection device, characterized in that made of a spring having a predetermined elastic force. The method of claim 1, The lower fixing stand is fixed to the lower board is provided with an open cylinder on one side, The upper fixing stand is provided with a rod inserted into the lower fixing stand is fixed to the upper board, The elastic member is extended to the ends of the upper and lower fixing rods, the performance board of the semiconductor inspection apparatus, characterized in that provided on the outer side of the cylinder of the lower fixing. The method of claim 5, The performance board of the semiconductor inspection device, characterized in that the protective member further surrounding the outer periphery of the elastic member so that the elastic member is protected. The method of claim 5, Upper board fixed to the upper board is a performance board of the semiconductor inspection device, characterized in that fixed by screw coupling. The method of claim 5, A lower board fixed to the lower board is a performance board of the semiconductor inspection device, characterized in that fixed by screw coupling. A tester unit generating an electrical signal to determine an electrical state of each unit chip constituting the wafer; A probe card having a chuck on which the wafer is seated, a prober for aligning the wafer seated on the chuck, a needle for contacting the wafer to apply an electrical signal, and an electrical signal to the needle A prober portion including a measuring ring having a pogo pin to transmit the electrical signal to the wafer; And The upper board provided in the tester portion and the lower board in contact with the prober portion is connected, and the lower board is connected to the lower board so that the upper and lower flows with respect to the upper board, the tubular shape of the polygon is The lower fixing stand which can be inserted into the lower fixing stand, and the upper fixing stand which is connected to the upper board, can be inserted into the lower fixing stand and the elastic member is provided between the lower fixing stand and the upper fixing stand to provide a predetermined elastic force. Performance board consisting of a buffer; Semiconductor inspection device characterized in that the provided.

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