KR20070111585A - The inspection device for semi-conductor - Google Patents

Abstract

An inspection device for a semiconductor device is provided to improve test efficiency by coupling test pins at upper and lower ends of a semiconductor device lead. An inspection device for a semiconductor device includes a pair of test units and a body bed(A). The upper and lower test units are fixed on an upper surface of the body bed and a jig(4) which is driven by a hydraulic/pneumatic cylinder using a screw. When a cylinder is operated, the test unit is contacted with a device pin at two contact points. The test unit includes plural test pins(6), which are formed on a contact body(8) with a constant distance between them. A contact lead body is inserted into a space between the contact body and the test pin. The contact lead body is connected to a flexible cable, such that a width of the contact lead body is adjusted.

Description

Semiconductor device inspection device {the inspection device for semi-conductor}

1 is a perspective view of the present invention.

2 is a front view of the present invention.

3 is an enlarged front view of a contact for performing the device inspection of the present invention;

4 is a perspective view showing a test pin connected with a flexible cable.

5 is a perspective view of a conventional device inspection apparatus.

Explanation of symbols on the main parts of the drawing

The present invention relates to an apparatus for inspecting a semiconductor device, and more particularly, a test is performed by contacting test pins above and below a semiconductor device lead, thereby making it possible to make two-contact contact without being affected by contact surface clearance. An object of the present invention is to provide an inspection apparatus having a long life and a high inspection yield.

In recent years, with the development of microfabrication technology, the miniaturization of semiconductor devices is also gradually progressing. As such, as semiconductor devices become more miniaturized, various defects such as short circuits of circuit patterns and current leakage between circuit patterns are gradually increasing in semiconductor devices. Accordingly, the characteristics of the final semiconductor device are accurately tested. This process is indispensable for securing excellent quality of semiconductor devices.

Recently, various semiconductor device characteristic test apparatuses have been developed and widely used in actual processes.

For example, such a semiconductor device characteristic test apparatus is divided into a tester for directly testing the characteristics of the semiconductor device, and a handler for automatically classifying the semiconductor devices by grades according to test results conducted in the tester.

In this case, the semiconductor device to be tested for characteristics may be directly loaded onto the characteristic test apparatus main body and then tested. In this case, however, the structure of the entire apparatus becomes complicated and an unexpected signal distortion occurs.

Therefore, in the conventional case, instead of refraining from directly testing the semiconductor device in the apparatus main body, a test head having a structure suitable for testing the semiconductor device is separately disposed in the vicinity of the main body and connected to the tester, so that By enabling rapid test signal transmission and reception, a smooth semiconductor device test is being conducted while greatly simplifying the structure of the apparatus main body.

 The semiconductor device test apparatus is shown in FIG. The test equipment quickly tests the characteristics of semiconductor devices by sending a constant test signal as the left and right contacts come into contact with the device leads.

However, there is a serious problem with this conventional semiconductor device test apparatus.

As described above, when the semiconductor device enters the tester to proceed with the test, the test pins are pressurized only by their edges because the left and right cylinders push the test pins to contact the device contacts. As a result of the test pin being opened, the contact is bad, and the transmission and reception of the test signal transmitted from the tester is interrupted.

This disturbance of the test signal causes the tester to be unable to conduct accurate semiconductor device testing. In this case, another problem is caused that the reliability of the finally completed semiconductor device is significantly lowered.

In addition, since the test pins are directly pushed, the test pins have a significantly shorter lifespan, and test yields are lowered.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to inspect the test pins in contact with the test pins above and below the semiconductor device lead, thereby not being affected by contact surface clearance. It is an object of the present invention to provide an inspection device having a long contact life and a high inspection yield since contact is possible.

Another object of the present invention is to configure the cable connecting the test pin and the tester in the Viking socket method to be able to adjust the left and right widths to test a variety of semiconductor devices.

This invention aims to provide an accurate semiconductor device by a perfect tester by suppressing the transmission / reception of a test signal.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, in describing each of the drawings, the same components have the same reference numerals as much as possible even though they are shown in different drawings.

1 is a perspective view of the present invention, FIG. 2 is a front view of the present invention, FIG. 3 is a front view showing an enlarged view of a contact for performing the device inspection of the present invention, and FIG. 4 is a perspective view showing a test pin connected with a flexible cable. to be.

Referring to the accompanying drawings, the present invention will be described in detail. First, referring to FIG. 1, in the semiconductor device inspection apparatus of the present invention, a test part 2 including a pair of upper and lower parts is operated by an upper surface of a body bed A and a hydraulic / pneumatic cylinder. It is screwed to the jig (4) to be configured to be in contact with the test additional device pins by two contacts by the operation of the cylinder.

The test part is configured such that a plurality of test pins 6 are integrally formed in the contact body 8 at uniform intervals, and the contact lead body 10 can be inserted in a socket shape between the contact body and the test pins. The contact lead body is connected to the flexible cable 12 to configure the left and right width adjustment.

In this case, the test pin 6 formed in the test part is configured such that the test pin 6 fixed to the jig 4 is bent downward, and the lower test pin 6a fixed to the upper surface of the bed is bent upward. This ensures stable contact with the device pins with uniform pressure during up and down operation.

In addition, the test part is fixed to the upper surface of the main body bed and the jig to process the Nasan acid (16) on the left and right sides of the contact lead body and screwed it to the jig (4) and the bed (A) of the main body so that the contact body can be easily replaced. .

According to the present invention configured as described above, when the device package to be automatically transported enters the test unit 2, the sensor detects the hydraulic / pneumatic cylinder to operate and the jig 4 body is pressed downward according to the operation of the pneumatic cylinder. Accordingly, the test pins 6 and 6a, which are integrated with the upper and lower test parts coupled to the jig body, come into contact with each other, and come into contact with two contacts at the top and bottom of the device pins. You can check it.

On the other hand, depending on the type of device package, when the test part is replaced or the wear of the test part is different, the contact body 8, which is a viking socket type, can be detached and other contact bodies can be easily combined, thereby making it easier to troubleshoot and repair. Simple to use.

As described above, the present invention can be configured in a two-point system up and down without being affected by the space of the contact surface, thereby suppressing transmission and reception disturbances of the test signal, thereby providing an accurate semiconductor device by a perfect tester, and by using a socket method. The invention is an advantage that can be adjusted to the left and right width by separating the body.

Claims (3)

And a test unit consisting of a pair of upper and lower screws is fixed to a jig operated by an upper surface of the main body bed and a hydraulic / pneumatic cylinder, and is configured to come into contact with two contact pins of the test additional device by operation of the cylinder. The contact lead of claim 1, wherein the test unit is configured such that a plurality of test pins are integrally formed in the contact body at uniform intervals, and the contact lead body can be inserted in the socket shape between the contact body and the test pin. The body is connected with a flexible cable, the semiconductor device inspection device, characterized in that configured to enable the adjustment of the left and right width. The test pin of claim 1, wherein the test pin fixed to the jig is configured to be bent to the bottom, and the test pin at the bottom fixed to the upper surface of the bed is configured to be bent upwards to the device pin at a uniform pressure during up and down operation. An apparatus for inspecting semiconductor devices, which allows stable contact.

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