KR20160127967A

KR20160127967A - Data inspection device for semiconductor memory

Info

Publication number: KR20160127967A
Application number: KR1020150059562A
Authority: KR
Inventors: 이규연
Original assignee: (주)케이엔
Priority date: 2015-04-28
Filing date: 2015-04-28
Publication date: 2016-11-07
Also published as: KR101678080B1

Abstract

The present invention relates to a data inspection device of a semiconductor memory element, comprising: a pallet formed to be loaded with a plurality of semiconductor memory elements; a moving device capable of moving the pallet to a conveyor belt; an arrangement device for arranging the moved pallet on a position for inspection; a jig device disposed on a lower part of the arrangement device to be coupled with the pallet that is arranged on the position for inspection; a compression device formed on an upper part of the jig device, and configured to compress the pallet in order to input data to the semiconductor memory elements or to inspect the data; an input unit for simultaneously inputting the data to the semiconductor memory elements loaded on the compressed pallet; an inspection unit for inspecting the input data to check whether the data is error, and recording a scanned product number bar code; and a discharge device for separately discharging a corresponding pallet if one or more semiconductor memory elements loaded on the pallet are determined to be error.

Description

[Technical Field] The present invention relates to a data inspection device for semiconductor memory devices,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a data checking apparatus for a semiconductor memory element, and more particularly, to a data checking apparatus for a semiconductor memory element for simultaneously inputting and checking data in a plurality of non-volatile semiconductor memory elements.

The nonvolatile semiconductor memory device is a memory formed so that input data is not erased even when power is cut off so that various electronic devices can operate in a designated manner.

Examples of the nonvolatile semiconductor memory device include a mask ROM (Mask ROM) for inputting a program at design time, a programmable ROM (ROM) for programming by the user, an erasable programmable ROM (EPROM) for erasing the information stored in ultraviolet rays, , And Electrically Erasable Programmable ROM (EEPROM), which can erase information using an electrical signal.

However, if data is not correctly input to the nonvolatile semiconductor memory device, the electronic device is not normally operated, and therefore, a process of verifying the data is indispensable.

Korean Patent Laid-Open Publication No. 10-2007-0111585 relates to an apparatus for inspecting a semiconductor device, wherein a test part composed of a pair of upper and lower parts is screwed to a jig operated by an upper surface of a main body bed and an oil / pneumatic cylinder, The device can be configured as two contact points on the device pin, so that it can be configured as a two-contact type top and bottom because it is not affected by the space on the contact surface. By suppressing the trouble of transmitting and receiving test signals, it is possible to provide an accurate semiconductor device by a perfect tester, So that the lateral width can be adjusted by separating and connecting the contact body.

However, in the conventional method as described above, it is inconvenient that the inspection time is long because many semiconductor devices can not be inspected at the same time.

Korean Patent Publication No. 10-2007-0111585

An object of the present invention is to provide a device for inspecting data of a semiconductor memory device, which can input a plurality of semiconductor memory elements to input data simultaneously and shorten a production time by inspecting the data.

Another object of the present invention is to provide a semiconductor memory device which presses a part of a pallet and a semiconductor memory element to prevent a contact failure from occurring during data input or inspection.

It is another object of the present invention to provide a semiconductor memory device data inspection apparatus capable of separately separating semiconductor memory elements into which data has not normally been input.

According to another aspect of the present invention, there is provided a data checking apparatus for a semiconductor memory device, comprising: a pallet formed to allow a plurality of semiconductor memory elements to be stacked; a moving device capable of moving the pallet to a conveyor belt; A jig device disposed at a lower portion of the aligning device and coupled with the pallet aligned at the inspection position; a pressing device formed on the jig device for pressing or pressing the pallet to input or inspect data in the semiconductor storage device; An inspection unit for inspecting the input data to confirm that the input data is defective and to record the scanned product number barcode, and a semiconductor memory element mounted on the pallet, And a discharge device for discharging only the pallet separately when it is judged to be defective It shall be.

Further, the aligning device of the data checking device of the semiconductor memory device of the present invention may include a stopper operated by a cylinder for stopping or passing the pallet drawn by the moving device, or a conveyor belt And the variable rail further includes at least one of the variable rails.

Further, the pressing device of the data checking device of the semiconductor memory device of the present invention is characterized in that the height can be adjusted according to the size and shape characteristics of the pallet and the semiconductor memory device.

Further, the data inspection apparatus of the semiconductor memory device of the present invention is characterized in that the material of the pressure plate or the pressure block, which is brought into contact with the pallet of the pressure device and pressurized, is ultem material.

Further, the jig device of the data checking device for a semiconductor memory element of the present invention is characterized in that it can be attached and detached by changing the type, shape and size of the semiconductor memory element.

Further, in the discharging device of the data checking device of the semiconductor memory element of the present invention, when the pallet loaded with the semiconductor memory element judged to be defective by the inspection part is pulled, the rising plate rises and is discharged separately from good products.

According to another aspect of the present invention, there is provided a data inspection apparatus for a semiconductor memory device, the apparatus further comprising a scan unit located between the inspection unit and the input unit for scanning the product number barcode of the semiconductor storage device and transmitting the scanned information to the inspection unit.

As described above, according to the data checking apparatus for a semiconductor memory device according to the present invention, there is an effect that a plurality of semiconductor memory elements are pulled in, data is input simultaneously, and the time is shortened by inspecting the same.

Further, according to the data checking apparatus for a semiconductor memory element according to the present invention, there is an effect that a part of the pallet and the semiconductor memory element is pressed to prevent contact failure during data input or inspection.

Further, according to the data checking apparatus for a semiconductor memory device according to the present invention, there is an effect that a semiconductor memory element to which data is not normally inputted can be separated and discharged.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a combined state of a data checking apparatus for a semiconductor memory device according to the present invention. FIG.
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a semiconductor memory device, and more particularly,
3 is a perspective view showing an input unit of an apparatus for inspecting data of a semiconductor memory device and an internal device of an inspection unit according to the present invention.
4 is a perspective view showing a pallet moved by a moving device and an aligning device of a data testing device of a semiconductor memory device according to the present invention;
5 is a perspective view showing a jig device coupled with a pallet of a data testing device of a semiconductor memory device according to the present invention.
6 is a perspective view showing a pressing apparatus for pressing a pallet of a data checking apparatus for a semiconductor memory element according to the present invention.
Fig. 7 is a perspective view showing a state in which the A coupled to the pressurizing device shown in Fig. 6 is viewed from the bottom; Fig.
Fig. 8 is a side view of a side view of A depicting the pallet of the pressurizing device shown in Fig. 7; Fig.
FIG. 9 is a perspective view showing a press plate formed in a pressing device of a data testing device of a semiconductor memory device according to the first embodiment, formed by a pressing block and a supporting block. FIG.
10 is a perspective view showing a configuration of a barcode portion of a data checking device for a semiconductor memory device according to the present invention.
11 is a perspective view showing an internal structure of a discharge portion of a data checking apparatus for a semiconductor memory element according to the present invention.
12 is a plan view showing an internal configuration of a discharge portion of a data checking apparatus for a semiconductor memory element according to the present invention in a plan view.

Specific features and advantages of the present invention will be described in detail below with reference to the accompanying drawings. The detailed description of the functions and configurations of the present invention will be omitted if it is determined that the gist of the present invention may be unnecessarily blurred.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a combined state of a data checking apparatus for a semiconductor memory device according to the present invention.

1, an apparatus for inspecting data of a semiconductor memory device according to the present invention includes an input unit 100 for simultaneously inputting data into a plurality of semiconductor memory elements 10, A barcode unit 200 for reading a product number formed in each of the semiconductor storage elements 10 to which data has been inputted; An input unit 100, an input unit 100, and a barcode unit 100. The input unit 100 includes an input unit 100, an input unit 100, 200, an inspection unit 300, a control unit for controlling the discharge unit 400, and a display unit for operating the control unit or checking the inspection progress status visually.

2 is a perspective view showing a state in which a plurality of semiconductor memory elements are mounted on a pallet of a data checking apparatus for a semiconductor memory device according to the present invention.

2, the pallet 500 includes grooves (not shown) such that a plurality of semiconductor memory elements 10 are stacked and fixed and pins (not shown) of the semiconductor memory element 10 are exposed. And a fixing hole 510 are formed.

The groove formed in the pallet 500 is formed so as to fix the position of the semiconductor memory element 10 so that the connection terminal 850 of FIG. 4 can be inserted into contact with the pin of the semiconductor memory element 10, 510 may be formed to have the same size as the fixing pin 840 of FIG. 4 so that the pallet 500 can be fixed in position by the fixing pin 840.

3 is a perspective view showing an input unit of an apparatus for inspecting data of a semiconductor memory device and an internal device of an inspection unit according to the present invention.

3, the input unit 100 and the inspection unit 300 of the data checking apparatus of the semiconductor memory device according to the present invention include a moving device 600 capable of moving the pallet 500 of FIG. 2, 2 aligned with the inspection position and positioned under the alignment device 700 and adapted to be coupled to the pallet 500 of FIG. A palette 500 of FIG. 2 for inputting or inspecting data by coupling the semiconductor memory device 10 to the jig device 800 formed on the jig device 800, And a pressing device 900 for pressing the semiconductor memory element 10.

4 is a perspective view showing a pallet moved by a moving device and an aligning device of a data testing device for a semiconductor memory device according to the present invention.

4, the moving device 600 of the data checking apparatus of the semiconductor memory device according to the present invention includes a conveyor belt (not shown) formed on both sides so as to move the pallet 500 on which the semiconductor memory element 10 is loaded, 610 and a belt drive motor 620 for driving the conveyor belt and the aligning device 700 comprises a cylinder operated stopper (not shown) for stopping or passing the pallet 500 drawn by the moving device 600 710 and a variable rail 720 in which the other conveyor belt 610 of the moving device 600 is embedded and can move inward or outward.

The conveyor belt 610 of the moving device 600 is formed below both sides of the pallet 500 so as to be able to convey the pallet 500 and receives the driving force by the belt driving motor 620, Thereby transporting the pallet 500.

The belt drive motor 620 senses the pallet 500 that is drawn through a photosensor (not shown) and drives the conveyor belt 610 to move to the inspection position. By the stopper 710 of the alignment apparatus 700, And when the pallet 500 is positioned at the inspection position, the belt driving motor 620 is stopped so that the pallet 500 can be stopped.

When the pallet 500 is pulled up by using the stopper 710 raised or lowered by the stopper cylinder 711, the aligner 700 stops the stopper 710 at the inspection position by the stopper cylinder 711, The variable rail 720 with the other conveyor belt 610 of the moving device 600 is moved in the direction of the one conveyor belt 610 by the rail drive motor 721 so that both sides of the pallet 500 are aligned in a straight line .

When the rail driving motor 721 is rotated, the variable rail 720 is moved in a pallet (not shown) by using a ball screw (not shown) or an LM guide (not shown) 500 may be pressed and aligned.

At this time, when the step motor or the servomotor is used, the rail drive motor 721 moves the variable rail 720 by a set value corresponding to the size of the pallet 500, so that the pallet 500 is pressed, Thereby preventing a problem that alignment is not performed properly.

5 is a perspective view showing a jig device coupled with a pallet of a data checking apparatus for a semiconductor memory device according to the present invention.

5, the jig device 800 includes a jig 810 coupled to the lower surface of the pallet 500 of FIG. 2 and replaceable according to the characteristics of the pallet 500 and the semiconductor storage element 10, A connecting terminal 850 which is formed on the surface of the jig 810 and contacts the pin (not shown) of the semiconductor storage element 10 of FIG. 2 to input and output power and data, and a connection terminal 850 which supports the jig 810, And a fixing pin 840 formed to fix the jig 810 and the pallet 500 shown in Fig.

The connection terminal 850 formed in the jig 810 can be inserted into the groove (not shown) of the pallet 500 loaded with the semiconductor memory element 10 of Fig. 2 and contacted with the pin of the semiconductor memory element 10 .

The fixing pin 840 formed on the jig support base 820 may have a sharp end so as to be able to be combined with the position of the pallet 500 when it is combined with the pallet 500 of FIG. Thereby fixing the position of the light source 500.

The jig cylinder 830 is configured to raise the jig support 820 so that the jig 810 formed on the jig support 820 can be engaged with the pallet 500 stopped at the inspection position by the alignment device 700 of Fig. The fixing pin 840 formed on the jig support 820 is inserted into the fixing hole 510 formed in the pallet 500 of FIG. 2 to fix the position and the connecting terminal 850 is fixed to the semiconductor memory element 10, As shown in FIG.

Further, the jig 810 of the jig apparatus 800 can be detachably attached to the semiconductor storage element 10 by changing the type, shape, and size of the semiconductor storage element 10.

The jig 810 can replace the pallet 500 and the semiconductor storage element 10 of FIG. 2 and can use the same jig support 820, thereby reducing preparation replacement time due to model changes.

Since the semiconductor storage element 10 of FIG. 2 can be changed in size and shape according to the shape and capacity of the electronic product and the pallet 500 is also manufactured accordingly, the jig 810 must be coupled with the pallet 500, 500) to be replaced.

6 is a perspective view showing a pressing apparatus for pressing a pallet of a data checking apparatus for a semiconductor memory element according to the present invention.

6, the pressurizing apparatus 900 includes a pressure plate 910 which contacts the pallet 500 of FIG. 4 and presses the pallet 500, and a pressure plate 910 which is located above the pallet 500 of FIG. And a lower plate 930 coupled to an end of the pressurizing cylinder and coupled to a pressure plate 910 on the other side of the pressure cylinder 920.

The pressing device 900 presses the pallet 500 from the upper direction to the lower direction when the jig 810 of FIG. 5 is moved upward to engage with the pallet 500 of FIG. 4 to press the pallet 500 and the jig 810 So that the lifting phenomenon does not occur in the semiconductor storage element 10 of FIG. 4 and the connection terminal 850 of FIG. 5, and the pressure plate 910 directly contacts and presses the pallet 500 of FIG.

FIG. 7 is a perspective view showing a state in which A coupled to the pressurizing device 900 shown in FIG. 6 is viewed from the bottom.

7, a step space is formed in the pressure plate 910 so as not to pressurize a portion where the shield can (not shown) of the semiconductor storage element 10 is placed on the pallet 500 of FIG. 2 .

The pressure plate 910 presses a portion of the semiconductor storage element 10 of FIG. 2 except for the shield can 11, so that a part of the semiconductor storage element 10 may rise, So that a part of the semiconductor memory element 10 can not be heard.

Here, the pressing plate 910, which is in contact with the pallet 500 of FIG. 2 and pressurized, is made of ultem resin. Ultem resin is an amorphous thermoplastic which has excellent strength, hardness, electrical characteristics, resistance to steam, heat resistance and good dimensional stability.

The support block 911 may further include a height adjustment bolt 916 to be coupled to the pressure plate 910 and the coupling bolt 915 and to adjust the height according to the height of the shield can 11.

Fig. 8 is a side view showing a side view of the pallet 500 of the pressurizing device 900 shown in Fig. 7; Fig.

8, a step space is formed in the pressure plate 910 so as to press a portion of the semiconductor storage element (not shown) loaded on the pallet 500 except for the shield can 11, The support block 911 can be formed to support the shield can 11 so that the shield can 11 can not be heard.

The support block 911 is coupled to the pressure plate 910 by a coupling bolt 915 as shown in FIG. 8B, and a height adjusting bolt 916 is formed inside the coupling bolts 915, Similarly, the height of the support block 911 can be adjusted by separating the support block 911 from the pressure plate 910.

The adjustment bolt 915 is fixed to the pressure plate 910 so that the support block 911 is completely in contact with and in parallel with the pressure plate 910 until the height adjustment bolt 916 ). Thereafter, the coupling bolt 915 is loosened again to allow the height of the support block 911 to be increased to a desired height, and the height adjustment bolt 916 is tightened to cover the gap formed between the pressing plate 910 and the support block 911, As shown in Fig.

The height adjustment of the support block 911 can not properly support the shield can 11 when a gap between the shield can 11 and the support block 911 is large and a part of the semiconductor memory element 10 of Fig. Since the contact failure may occur, the height of the support block 911 may be adjusted to prevent it.

The material of the support block 911 may be made of urethane or silicon so that the shield can 11 is not damaged when the shield can 11 touches the support block 911 so as to mitigate the impact.

9 is a perspective view showing a state in which the pressure plate 910 of the data testing device of the semiconductor memory device according to the first embodiment is formed by the pressing block 912 and the supporting block 911.

9, the pressure plate 910 according to the first embodiment is formed in a flat plane, and presses the semiconductor storage element 10 excluding the pallet 500 and the shield can (not shown) And a plurality of support blocks 911 for supporting the plurality of pressure blocks 912 and the shield can 11 so that they can not be heard.

The press block 912 is made of untem resin and has a bolt 915 and a height adjusting bolt 916 formed thereon and is adjustable in height and formed as a plurality of press blocks 912, Therefore, when the pressing block 912 is worn, the parallelism can be adjusted or replaced.

The support block 911 is made of silicon or urethane and has an adjustment bolt 915 and a height adjustment bolt 916. The height adjustment bolt 916 is adjustable according to the height of the shield can 11, So that they can be partially used for replacement.

Since the press block 912 and the support block 911 can be replaced, the press block 912 or the support block 911, which is frequently in contact failure, can be replaced and reused, There is an effect that occurs less.

In addition, since only the pressing block 912 and the supporting block 911 can be used in accordance with the size and shape characteristics of the semiconductor memory element 10 and the pallet 500 of FIG. 2, It is effective.

Since the semiconductor storage element 10 of FIG. 2 can be changed in size or shape according to the shape and capacity of the electronic product and the pallet 500 is also manufactured to fit therewith, the pressing block 912 and the supporting block 911 are connected to the pallet 500, and the semiconductor memory element 10, as shown in FIG.

Also, the shield can 11 of FIG. 8 can be made higher or lower in height depending on the size and shape according to the shape and the capacity of the electronic product of the semiconductor storage element 10. Therefore, the height of the shield can 11 is adjusted by the height adjusting bolt 916 formed on the base block 911 and the height of the shield can 11 is too high or low so that the base block 911 supports the shield can 11 with the height adjusting bolt 916 It may be replaced with a support block 911 formed to have a different height.

10 is a perspective view showing a configuration of a barcode portion of a data checking device for a semiconductor memory device according to the present invention.

As shown in Fig. 10, the barcode portion 200 includes a moving device (not shown) for moving the pallet 500 of Fig. 2, and a pallet 500 of Fig. 2 And an alignment device 700. The alignment device 700 moves along the rotation axis 220 and scans the product number barcode of the semiconductor memory device 10 of FIG. 2 and transmits the scanned information to the inspection unit 300 And a scanning device 210 for transmitting the image data.

The moving device 600 and the alignment device 700 are the same as those formed in the input unit 100 and the inspection unit 300, and the description with reference to FIG. 4 will be referred to for the detailed description.

When the semiconductor storage element 10 mounted on the pallet 500 of FIG. 2, in which the data input in the input unit 100 of FIG. 1 is completed, is drawn into the barcode unit 200 by the moving device 600, The stopper 710 rises to stop the pallet 500 and the variable rail 720 of the aligning apparatus 700 aligns the pallet 500.

When the pallet 500 shown in FIG. 2 is aligned, the scanning device 210 located below the aligning device 700 scans the barcode on which the part number or the production number of the semiconductor memory device 10 loaded in the pallet 500 is formed And transmits the data to the inspection unit 300 how many times each semiconductor memory element 10 is.

At this time, the scan unit 210 is driven by a servo motor (not shown) to move along the rotation axis 220. When the scan is completed, the scan unit 210 returns to the origin and then the stopper 710 descends, The pallet 500 of FIG. 2 enters the inspection unit 300 of FIG.

The inspection unit 300 of FIG. 1 is formed in the same manner as the input unit 100 and reads and verifies data input to the semiconductor memory device 10 of FIG. 2 by the input unit 100 to verify whether data is missing or not The semiconductor memory device 10 is transferred to the control unit of FIG. 1 to be separately discharged from the discharge unit 400 shown in FIG. 1, and is displayed on the display unit so that the operator can check it.

FIG. 11 is a perspective view showing an internal configuration of a discharge portion of a semiconductor memory element data inspection apparatus according to the present invention, and FIG. 12 is a plan view showing an internal configuration of a discharge portion of a semiconductor memory element data inspection apparatus according to the present invention .

11 to 12, the discharging unit 400 of the data checking apparatus of the semiconductor memory device according to the present invention has one or more defective semiconductor storage elements 10 mounted on the pallet 500 of FIG. 2 A discharging device 410 for discharging the pallet 500 separately and a moving device 600 having upper and lower sides for moving the pallet 500 of FIG. 2, which has been inspected by the inspector 300 of FIG. 1, And an alignment device 700 for aligning the pallet 500 of FIG. 2.

The moving device 600 includes a conveyor belt 610 formed in a double shape as shown in FIG. 11, and the pallet 500 shown in FIG. 2, which has been inspected by the inspection unit 300 shown in FIG. 1, And moves. The belt drive motor 620 is formed on the upper and lower conveyor belts 610 as shown in Fig. 12 and is mounted on the pallet (Fig. 1), on which the semiconductor storage element 10 of Fig. The belt driving motor 620 connected to the upper conveyor belt 610 is operated and discharged.

The aligning apparatus 700 is configured to adjust the rail drive motor 721 to fit the pallet 500 of FIG. 2 using the variable rail 720 and the variable rail 720 is connected to the upper and lower conveyor belts 610 They are combined in a plate form so that they can move at the same time.

The discharging device 410 includes a lifting plate 420 supporting the moving device 600 and the positioning unit and a discharging driving motor 430 raising the lifting plate 420 in the upward direction.

When the pallet 500 loaded with the semiconductor memory element 10 of FIG. 2, which is determined to be defective in the inspection unit 300 of FIG. 1, is pulled by the upper conveyor belt 610, 420) to separate them from the good products.

When the lifting plate 420 is lifted, the lower conveyor belt 610 is driven to move the pallet 500 of FIG. 2 drawn in the inspection unit 300 of FIG. 1, and when the upper conveyor belt 610 is determined to be defective The lift plate 420 is lowered after moving the pallet 500 on which the semiconductor memory element 10 of FIG. 2 is loaded, separately.

Here, the discharge drive motor 430 can lift the riser 430 using a ball screw (not shown) that changes the rotation into linear motion, or through the LM guide or cylinder.

Therefore, even if the pallet 500 loaded with the semiconductor storage element 10 of FIG. 2 determined to be defective is introduced, the production line can be continuously produced without stopping, and the quality can be improved because the defects are not mixed Occurs.

As described above, according to the data checking apparatus for a semiconductor memory device according to the present invention, a plurality of semiconductor memory elements can be pulled in, data can be simultaneously input and examined to shorten the production time, It is possible to prevent the occurrence of contact failure during data input or inspection and to separate semiconductor memory elements into which data has not normally been input.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken as a limitation of the scope of the present invention. Or modify it. The scope of the invention should, therefore, be construed in light of the claims set forth to cover many of such variations.

10: semiconductor memory element 11: shielded can
100: input unit 200: bar code unit
210: scanning device 220: rotating shaft
300: Inspection unit 400:
410: Exhaust device 420: Lift plate
430: Discharge drive motor 500: pallet
510: Fixing hole 600: Moving device
610: Conveyor belt 620: Belt drive motor
700: alignment device 710: stopper
711: Stopper cylinder 720: Variable rail
721: Rail drive motor 800: Jig device
810: Jig 820: Jig support
830: Jig cylinder 840: Fixing pin
850: connection terminal 900: pressure device
910: pressure plate 911: support block
912: Press block 915: Coupling bolt
916: height adjustment bolt 920: pressure cylinder
930: Lower steel plate

Claims

A pallet formed so that a plurality of semiconductor memory elements can be stacked thereon;
A moving device capable of moving the pallet to a conveyor belt;
An aligning device for aligning the moved pallet to the inspection position;
A jig device located under the alignment device and coupled to the pallet aligned at the inspection position;
A pressing device formed on the jig device for pressing the pallet to input or inspect data in the semiconductor memory device;
An input unit for simultaneously inputting data into the semiconductor memory device loaded on the pressed pallet;
An inspection unit for inspecting the input data to confirm that the data is defective and to record the scanned product number barcode;
And a discharging device for discharging only the pallet separately if at least one of the semiconductor storage elements loaded on the pallet is determined to be defective
A device for inspecting data of a semiconductor memory device.

The method according to claim 1,
The alignment device comprising: a cylinder-actuated stopper for stopping or passing a pallet drawn by the moving device; Or a variable rail in which the other conveyor belt of the moving device is embedded and can move inward or outward; Or more than one of < RTI ID = 0.0 >
A device for inspecting data of a semiconductor memory device.

The method according to claim 1,
The pressing device is characterized in that the height can be adjusted according to the size and shape characteristics of the pallet and the semiconductor memory device
A device for inspecting data of a semiconductor memory device.

The method according to claim 1,
Characterized in that the material of the pressing plate or the pressing block which presses in contact with the pallet of the pressing device is an ultem material
A device for inspecting data of a semiconductor memory device.

The method according to claim 1,
Wherein the jig device is detachably attached to the semiconductor memory device by changing the type, shape and size of the semiconductor memory device
A device for inspecting data of a semiconductor memory device.

The method according to claim 1,
Wherein the discharge device ascends the rising plate when the pallet loaded with the semiconductor memory element judged to be defective by the inspection part is drawn,
A device for inspecting data of a semiconductor memory device.

The method according to claim 1,
And a scan unit located between the inspection unit and the input unit to scan the product number bar code of the semiconductor memory device and transmit the scanned information to the inspection unit.
A device for inspecting data of a semiconductor memory device.