KR20100058113A - Contact connection device for semiconductor device and contact connection method to semiconductor device using the same - Google Patents

Abstract

PURPOSE: A contact connection device for a semiconductor device and a contact is provided to maintain the pressure on a socket a creation level by controlling the pressurized distance of a presser portion. CONSTITUTION: An interface board comprises a plurality of sockets. A plurality of sockets are connected to a plurality of semiconductor devices through a respective contact. Presser portion(210,220) pressurize a test tray to the interface board. The presser portion enable the semiconductor device to be connected to the socket. A pressure measuring unit measures the applied pressure from the presser portion.

Description

Contact connection device for semiconductor device and method of contact connection using same {{contact connection device for semiconductor device and contact connection method to semiconductor device using the same}

The present invention relates to a semiconductor device contact connection device and a semiconductor device contact connection method using the same. In detail, the present invention allows the test target semiconductor device loaded on the test tray to be connected to a socket provided on an interface board (aka, Hi-Fix board) so that the tester and the test target semiconductor device are connected to each other. The present invention relates to a semiconductor device contact connection device and a semiconductor device contact connection method using the same.

In the process of manufacturing a semiconductor device, a process of screening each manufactured semiconductor device and screening a good semiconductor device and a defective semiconductor device is required. In this case, a test signal is generated and applied to distinguish between the semiconductor device and the semiconductor device. A tester is a tester that receives a response signal corresponding to a test signal from the analyzer, analyzes the received signal, and determines whether the semiconductor device is good or bad.

As described above, in order to test the quality of the semiconductor device using the tester, each semiconductor device to be inspected must be signal-connected with the tester, and the signal connection can be made through the semiconductor device contact connection device.

The semiconductor device contact connecting device includes a test tray in which a plurality of inspection target semiconductor devices are loaded, an interface board having a plurality of sockets for contacting a plurality of semiconductor devices loaded on the test tray to perform signal connection, and a test. And a pressing unit for pressing the test tray in the direction of the interface board such that the plurality of semiconductor devices mounted on the tray and the corresponding plurality of sockets provided on the interface board are connected to each other via a contact signal.

The inspection of the semiconductor device through the configuration of the semiconductor device contact connection device is performed as shown in FIG. 1.

First, a test tray on which a plurality of inspection target semiconductor elements are loaded is moved to a position corresponding to an interface board (s10). Then, the pressing unit is moved to a position corresponding to the test tray (s20), and the pressing unit presses the test tray so that the semiconductor elements loaded on the test tray are in contact with the corresponding sockets of the interface board to be connected to the signal (s30). As such, when the semiconductor device and the socket are connected to each other, the test signal is applied to the semiconductor device loaded in the test tray, and a response signal is received from the semiconductor device to perform a test on the semiconductor device (S40).

At this time, the pressing force of the pressing unit is very important in order for the plurality of semiconductor elements to be exactly in contact with the corresponding plurality of sockets. That is, when the semiconductor device is not sufficiently pressed into the socket, a signal connection may not be made between the semiconductor device and the socket, and if the semiconductor device is pressed too strongly against the socket, the semiconductor device may be damaged by the socket. .

On the other hand, the inspection of the semiconductor device is carried out under a variety of environments, such an environmental temperature can be changed drastically, such as -10 ℃, -5 ℃, 85 ℃, and 100 ℃, such a change in temperature is the test tray, interface Volume change of the board and the semiconductor device contact connecting device such as the pressing part.

As described above, when a volume change occurs in the semiconductor element contact connecting device, even when the pressing unit moves the same distance to press the test tray to connect the semiconductor element and the socket, the pressing force applied to the semiconductor element loaded on the test tray There will be a difference. That is, the semiconductor device may not be sufficiently pressed into the socket, or may be pressed too strongly, so that the inspection of the semiconductor device may not be accurately performed or even the semiconductor device may be broken through the inspection process.

In particular, in order to speed up and mass-produce a recent semiconductor device manufacturing process, the number of semiconductor devices to be inspected tends to increase through a single inspection process, so that the size of a test tray, a corresponding interface board, and a pressing unit for pressing the same may be increased. Is becoming larger. In this case, when the semiconductor device contact connection device is enlarged, the volume change of the semiconductor device contact connection device becomes more severe according to the temperature change, and thus the error of the semiconductor device inspection as described above may be more serious.

In order to solve the problems of the prior art as described above, the present invention provides a semiconductor device loaded on a test tray by adjusting the pressing distance of the pressing unit when a volume change occurs in the device due to a change in temperature environment for inspection of the semiconductor device. Disclosed are a semiconductor device contact connecting device and a method of connecting a semiconductor device using the same, which can maintain a pressing force pressed against a corresponding socket provided in an interface board within a predetermined range.

The semiconductor device contact connecting device according to an aspect of the present invention for solving the above problems is to press the test tray on which the plurality of inspection target semiconductor elements are loaded, so that the plurality of inspection target semiconductor elements make a signal connection with the tester. An apparatus comprising: an interface board having a plurality of sockets respectively connected to the plurality of semiconductor elements by contact signals; A pressing unit for pressing the test tray toward the interface board so that the plurality of semiconductor devices loaded on the test tray are connected to the corresponding plurality of sockets of the interface board, respectively; A pressing force measuring unit measuring a pressing force applied by the pressing unit; And a pressing force adjusting unit controlling the pressing force applied by the pressing unit by using the pressing force value measured by the pressing force measuring unit.

The pressurizing part of the semiconductor device contact connecting device of the present invention includes a pressurizing plate contacting and pressing the test tray; And a driving unit for moving the pressing plate by a pressing distance to press the test tray, wherein the pressing adjusting part adjusts the pressing distance according to the measured pressing force value.

According to another aspect of the present invention, there is provided a method of contact connecting a semiconductor device by using a semiconductor device contact connecting device to pressurize the test tray so that the plurality of test target semiconductor devices are contact signal-connected to the tester. Positioning the test tray and the pressing unit such that the test tray is pressed against the interface board by the pressing unit; And b) pressing the test tray while adjusting the pressing force such that the plurality of semiconductor devices are connected to the corresponding plurality of sockets by a contact signal with a pressing range of a predetermined range.

In the semiconductor device contact connection method of the present invention, the pressing force adjusting process of step b) is repeatedly performed until the measured pressing force value falls within the predetermined range, and the number of times of repeating the pressing force adjusting process is a predetermined number of times. If the time exceeds the time or the time required for the pressure adjustment process exceeds a predetermined time, the pressing force adjustment unit may be configured to determine this as an error.

In the semiconductor device contact connection method of the present invention, when a plurality of the pressing units are provided with respect to one test tray, the pressing force adjusting unit compares the pressing force values measured from the plurality of pressing units to determine whether there is an error. It may be configured to perform further steps.

In step b) of the semiconductor device contact connection method of the present invention, the pressing force measuring unit measures the pressing force value n times, and the pressing force adjusting part compares the maximum pressing force value and the minimum pressing force value among the pressing force values measured n times. It may be configured to further perform the step of determining whether or not.

In the step b) of the semiconductor device contact connection method of the present invention, wherein the pressing portion includes a pressing plate for contact and pressurizing the test tray, and a driving portion for moving the pressing plate by a pressing distance to press the test tray. The pressing force adjusting unit may include: i) determining whether the measured pressing force value falls within a preset pressing force range; ii) shortening and adjusting the pressing distance of the pressing unit when the measured pressing force value exceeds a preset pressing range; And iii) adjusting the pressing distance of the pressing unit when the measured pressing force value is less than a preset pressing force range.

In this case, the pressing force adjusting unit may be configured to repeat steps i) to iii) until the measured pressing force value falls within the pressing force range.

According to the semiconductor device contact connecting device of the present invention, a plurality of semiconductor devices loaded on the test tray are interfaced by adjusting the moving distance of the pressing unit for pressing the test tray toward the interface board according to the volume change of the semiconductor device contact connecting device. Each of the corresponding sockets provided in the board can be maintained in contact with a constant pressing force. Accordingly, the entirety of the plurality of semiconductor devices loaded on the test tray can make an appropriate contact signal connection to the corresponding plurality of sockets provided in the interface board, thereby ensuring the accuracy of the semiconductor device inspection.

Therefore, when the contact signal connection of the semiconductor device is performed using the semiconductor device contact connection device of the present invention, there are frequent environmental condition changes for the inspection of the semiconductor device, and volume changes occur in the mechanisms of the semiconductor device contact connection device. Even though the pressing force of the semiconductor element against the socket of the interface board can be maintained within a certain range, it is possible to prevent the error of the semiconductor element inspection and the occurrence of the defect of the semiconductor element due to the volume change of the mechanism when attempting to connect the contact signal to the socket of the semiconductor element. This can greatly improve plant operating efficiency and productivity.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

First, a configuration of a semiconductor device contact connecting apparatus according to an embodiment of the present invention will be described in detail with reference to FIG. 2.

As specifically disclosed in FIG. 2, the semiconductor device contact connection device according to an exemplary embodiment may include a test tray 100 in which a plurality of inspection target semiconductor devices may be stacked, and a plurality of test stacks 100 mounted in the test tray 100. The plurality of semiconductor devices mounted on the test tray 100 by pressing the interface board 300 and the test tray 100 in the direction of the interface board 300 are provided with a plurality of sockets connected to the semiconductor devices, respectively. Pressing units 210 and 220 for contact signal connection to a plurality of corresponding sockets of the interface board 300, a pressing force measuring unit (not shown) for measuring the pressing force applied by the pressing units 210 and 220, and the pressing force And a pressing force adjusting unit (not shown) for adjusting the pressing force applied by the pressing units 210 and 220 using the pressing force values measured by the measuring unit.

In the present embodiment, the pressurizing parts 210 and 220 are provided as two as shown in FIG. 2 to apply a uniform pressing force to the entire test tray 100 when the apparatus such as the test tray 100 is enlarged. Although described, the number of the pressing portions is not limited thereto.

In this embodiment, the pressing force measuring unit measures the pressing force applied by the respective pressing units 210 and 220, and the measured pressing force is evaluated by the pressing force adjusting unit. In addition, the pressing force adjusting unit adjusts the pressing force by the pressing units 210 and 220 according to the evaluation of the measured pressing force.

Specifically, as shown in FIG. 2, the pressing units 210 and 220 may be configured to store the pressing plates 211 and 221 and the pressing plates 211 and 221 which contact and press the test tray 100. It comprises a drive unit (212, 222) to move as much as the test tray 100 is pressed.

At this time, the pressing force measuring unit measures the pressing force in the pressing plates 211 and 221 moved by the pressing distance. In addition, the pressing force adjusting part adjusts the pressing force in the pressing plates 211 and 221 by adjusting the pressing distance of the pressing part according to the evaluation of the measured pressing force.

In the present embodiment, since the configuration of the other test tray 100, the interface board 300, and the pressing unit 210, 220 may be implemented by a conventional device, a detailed description thereof will be omitted.

Hereinafter, a semiconductor device contact connection method by a semiconductor device contact connection device according to an embodiment of the present invention will be described in detail with reference to FIGS. 3 and 4.

First, as shown in FIGS. 2 and 3, the method for connecting a semiconductor device according to the present disclosure is started by moving the test tray 100 to a position corresponding to the interface board 300 (S100).

When the test tray 100 is moved to a position corresponding to the interface board 300, the pressing units 210 and 220 are moved to a position corresponding to the test tray 100 as shown in FIG. 2 ( s200). In detail, the driving units 212 and 222 of the pressing units 210 and 220 position the pressing plates 211 and 221 so that the pressing plates 211 and 221 correspond to the test tray 100.

Then, the pressing units 210 and 220 pressurize the test tray 100 while adjusting the pressing distance through the pressing force adjusting unit so that a plurality of semiconductor devices loaded on the test tray 100 are connected to the corresponding sockets of the interface board 300. The contact signal is connected to the pressing force within a predetermined range (s300). At this time, the pressing unit (210, 220) is performed repeatedly to adjust the pressing distance until the pressing force is within the predetermined range. At this time, when the repeated number of times of the pressing distance adjusting process of the pressing unit 210, 220 exceeds a predetermined number of times, or when the time required for the pressing distance adjusting process exceeds a predetermined time, the pressing force adjusting unit is determined to be an error situation. It may be configured to shut down the facility and to provide an error indication to the administrator.

As such, when a plurality of semiconductor elements loaded on the test tray 100 through the pressure adjusting unit are contacted with a corresponding pressure in a predetermined range to the corresponding plurality of sockets of the interface board 300, the tester (not shown) is connected to the interface board. The test signal is transmitted to the test target semiconductor device through the socket of 300, the response signal is received from the semiconductor device, and the test is started for the semiconductor device (S400).

Hereinafter, referring to FIG. 4, the pressing distance adjusting process performed through the pressing force adjusting unit will be described in detail.

First, as shown in FIG. 4, the pressing units 210 and 220 are moved by a predetermined pressing distance to contact and press the test tray 100 in the direction of the interface board 300 (S305). That is, referring to FIG. 2, the driving units 212 and 222 of the pressing units 210 and 220 move the pressing plates 211 and 221 by a pressing distance to contact and press the test tray 100 toward the interface board 300. (S305).

In this case, the pressing force measuring unit measures the pressing force of the pressing parts 210 and 220, that is, the pressing force in the pressing plates 211 and 221 n times (S310). The number of times of pressing force measurement is not particularly limited, but in this embodiment, the measurement is made five times.

Here, the pressing force may be measured in various units of measurement, but in this embodiment, the pressing force is measured by a torque value.

In addition, among the pressing force values measured by the pressing force measuring unit, the maximum pressing force value and the minimum pressing force value are compared to determine whether the difference is within 1% (s320). In this embodiment, the difference between the maximum pressure value and the minimum pressure value is 1%, but is not limited thereto.

 At this time, when the difference between the maximum pressing force value and the minimum pressing force value is 1% or more, it is determined that the pressing force transmission duration by the pressurizing parts 210 and 220 is not performed smoothly, and the process is repeated from step s305 to step s320.

Then, it is determined whether the pressure value thus obtained falls within a predetermined range prescribed by the following general formula (1) (s330).

[Formula 1]

Reference pressure value ≤ acquired pressure value <reference pressure value + 5

In this case, the reference pressing force value uses a preset value as a pressing force value suitable for the semiconductor device loaded on the test tray 100 to make an accurate contact signal connection to the socket of the interface board 300. This reference pressing force value may be set differently according to the measurement unit of the pressing force, but in this embodiment, it is assumed to be 35 as the torque value. In addition, in the present embodiment, the numerical value added to the reference pressing force value is 5, which means a value corresponding to 5% of the reference pressing force value, which may be appropriately selected, and the scope of the present invention is limited thereto. Can not be done.

And, the pressure value obtained here is preferably used as the final value of the value previously measured n times.

 At this time, when the pressure value thus obtained does not fall within the range defined by the general formula 1, the pressing force adjusting unit performs a process of adjusting the pressurization unit press distance so that the pressurized value falls within the range defined by the general formula 1 do.

First, when the obtained pressing force value is large enough to exceed the range prescribed by the general formula (1), that is, when the obtained pressing force value exceeds the reference pressing force value +5 value, the mechanism configuration of the semiconductor element contact connecting device is changed by high temperature. This is the case where the actual distance between the pressurizing parts 210 and 220 and the test tray 100 is closer by expanding. Therefore, in this case, the pressing distance of the pressing parts 210 and 220 is shortened and adjusted (s363). The shortened distance at this time is 0.05mm in this embodiment.

On the other hand, when the obtained pressing force value is smaller than the range prescribed by the general formula (1), that is, when the obtained pressing force value is smaller than the reference pressing value, the mechanism configuration of the semiconductor element contact connecting device is contracted by the low temperature and pressurized. This corresponds to a case where the actual distance between the units 210 and 220 and the test tray 100 is further distanced. Therefore, in this case, the pressurization distance of the pressurizing parts 210 and 220 is extended. However, in the present embodiment, it is configured to perform the pressing distance extension adjustment in two steps as shown in FIG.

That is, the pressurizing unit press distance is adjusted by distinguishing a case where the obtained pressing force value is less than the reference pressing force value -5 and the case where the obtained pressing force value is lower than the reference pressing value -5.

Specifically, when the obtained pressing force value is less than the reference pressing force value -5 value (s350), since the contraction of the mechanism configuration of the semiconductor element contact connection device is severe, the pressing distance of the pressing parts 210 and 220 is greater than that. The unit extends by 0.1 mm in this embodiment (s361). However, when the obtained pressing force value is greater than or equal to the reference pressing force value of −5 (s350), since the contraction of the mechanism configuration of the semiconductor element contact connecting device is not severe, the pressing distance of the pressing units 210 and 220 may be smaller than the unit. In the present embodiment, it extends by 0.05 mm (s362).

When the pressing distance of the pressing unit 210, 220 is adjusted by the pressing unit adjusting unit as described above, the pressing force obtained by repeating the above procedure from step s305 again falls within the range of the general formula (1).

On the other hand, when the pressure value thus obtained falls within the range defined by the general formula 1, it is confirmed in the above procedure whether the pressing distance of the pressing unit (210, 220) is changed through the pressure adjusting unit (s370), the pressing distance is If changed, the changed pressure distance is stored in the pressure control unit as the pressure distance values of the pressure units 210 and 220 (S380).

The pressure distance value stored in the pressure control unit is used again in the inspection process of the semiconductor device of the following sequence.

On the other hand, the contact connection method of the semiconductor device disclosed in Figures 3 and 4 has been described on the assumption that the pressing force by the two pressing unit (210, 220) is the same, but the pressing force of the two pressing unit (210, 220) Can be measured differently from each other. Therefore, in this case, it is necessary to compare the pressing force measured by the pressing unit 210 and the pressing force measured by the pressing unit 220 with each other. The comparison process may be configured in various ways, but in the present embodiment, when the difference between the pressing force measured by the pressing unit 210 and the pressing force measured by the pressing unit 220 exceeds 6% from each other, the pressing force adjusting unit may make an error. The situation may be determined to shut down the equipment and provide an error indication to the administrator.

Of course, the pressing force of the two pressing portions 210 and 220 may be configured to separately adjust the pressing distances of the two pressing portions 210 and 220 through the pressing force adjusting unit, even if they are different from each other. It is obvious that all such embodiments belong to the appended claims of the present invention.

 Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications can be made within the scope of the technical idea of the present invention, and it is obvious that the present invention belongs to the appended claims. Do.

1 is a flowchart schematically showing a general method of connecting a semiconductor device by a semiconductor device contact connection device.

2 is an exploded perspective view schematically illustrating a semiconductor device contact connecting apparatus according to an embodiment of the present invention.

3 is a flowchart schematically illustrating a method for connecting a semiconductor device by a semiconductor device contact connecting device according to an exemplary embodiment of the present invention.

FIG. 4 is a flowchart schematically illustrating an example of a method of adjusting a pressing distance of a pressing unit in the method of contact connecting the semiconductor devices of FIG. 3.

Claims (8)

A semiconductor element contact connecting device for pressing a test tray on which a plurality of inspected semiconductor elements are mounted so that a plurality of inspected semiconductor elements make a signal connection with a tester, An interface board having a plurality of sockets respectively connected to the plurality of semiconductor devices by contact signals; A pressing unit for pressing the test tray toward the interface board so that the plurality of semiconductor devices loaded on the test tray are connected to the corresponding plurality of sockets of the interface board, respectively; A pressing force measuring unit measuring a pressing force applied by the pressing unit; And A pressing force adjusting unit for adjusting the pressing force applied by the pressing unit by using the pressing force value measured by the pressing force measuring unit; Semiconductor device contact connection device comprising a. The method of claim 1, The pressing unit A pressure plate contacting and pressing the test tray; And A driving unit for moving the pressing plate by a pressing distance to press the test tray; Including; And the pressure controller is configured to adjust the pressing force by adjusting the pressing distance according to the measured pressing force value. The semiconductor device contact connection method of claim 1, wherein the test tray is pressed using the semiconductor device contact connection device to contact the plurality of test target semiconductor devices with the tester. a) positioning the test tray and the pressing unit such that the test tray is pressed against the interface board by the pressing unit; And b) pressing the test tray while adjusting the pressing force such that the plurality of semiconductor elements are connected to the corresponding plurality of sockets by a contact signal with a predetermined range of pressing forces; Semiconductor device contact connection method comprising a. The method of claim 3, The pressing force adjusting process of step b) is repeatedly performed until the measured pressing force value falls within the predetermined range, and the time taken for the repeated number of times of the pressing force adjusting process exceeds a predetermined number or is required for the pressing force adjusting process. And if the predetermined time is exceeded, the pressing force adjusting unit determines that the error is an error. The method of claim 3, When the pressing unit is provided in plural with respect to one test tray, And comparing the pressing force values measured from the plurality of pressing parts to determine whether there is an error. The method of claim 3, In step b), The pressing force measuring unit measures the pressing force value n times, The pressing force control unit further comprises the step of determining whether the error by comparing the maximum pressure value and the minimum pressure value among the n times the measured pressure value of the semiconductor element contact connection method. The method of claim 3, In step b), When the pressing unit includes a pressing plate for contact and pressurizing the test tray, and the eastern portion for moving the pressing plate by a pressing distance to press the test tray, The pressing force adjusting unit i) determining whether the measured pressing force value is within a preset pressing force range; ii) shortening and adjusting the pressing distance of the pressing unit when the measured pressing force value exceeds a preset pressing range; And iii) adjusting the pressing distance of the pressing unit when the measured pressing force value is less than a preset pressing force range; The semiconductor device contact connection method characterized in that for performing. The method of claim 7, wherein And said pressing force adjusting part repeats steps i) to iii) until the measured pressing value falls within the pressing range.

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