KR20010019420A - Test Fixture for Semiconductor Package - Google Patents

Abstract

PURPOSE: An apparatus for testing a semiconductor package is provided to reduce cost for a test and to test a semiconductor package module or a semiconductor unit element under the same circumstances as a customer, by using an inexpensive personal computer instead of an expensive test apparatus. CONSTITUTION: A connector(203) is mounted in a socket(201) of a memory module of a mother board(204) of a personal computer. A test socket board(202) is mounted on the connector and is electrically connected to the mother board. A module socket is mounted on the test socket board, wherein a semiconductor package module to be tested can be detachably installed in the module socket.

Description

Test Fixture for Semiconductor Package

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test apparatus for a semiconductor package, and more particularly, to a test apparatus for a semiconductor package for implementing low cost test equipment using a memory socket located on a motherboard of a personal computer without using expensive semiconductor test equipment. will be.

In the case of semiconductor memory devices such as dynamic random access memory (DRAM), Rambus DRAM, or static random access memory (SRAM), the sockets are used to check the reliability of internal circuits after the chip package process. Tested by expensive equipment.

As is well known, semiconductor packages undergo various electrical characteristics tests such as quality assurance tests, shipment inspections, and acceptance inspections through expensive equipment to ensure the reliability of the products after assembly is completed. have.

As described above, in testing various electrical characteristics such as a quality assurance test, a shipment inspection, and a storage inspection of the semiconductor package, a characteristic test apparatus as shown in FIG. 1 is used.

In the semiconductor test system, a plurality of test sockets 130 are positioned on the test board 120 on the test head 110, and the handler 140 mounts the semiconductor package and the module 131 to the test socket 130. .

Accordingly, an electrical signal from the tester 100 is applied to the semiconductor package and the module 131 through the head 110, the test board 120, and the test socket 130, and the applied signal is again applied to the tester 100. By feeding back), various electrical characteristics can be tested.

However, such a general semiconductor test system requires a test socket to be mounted on expensive test equipment to perform various electrical, physical, and other characteristics tests of the semiconductor package, which adds to the economic burden, which is one factor in the price increase of the semiconductor. There is a problem.

In addition, the test socket is also easily worn due to frequent detachment and detachment of the semiconductor package to be replaced frequently, but this is also expensive, the cost burden is large.

Accordingly, it is an object of the present invention to test the electrical and physical characteristics of a semiconductor package by detachably mounting a tester socket for testing the whole or unit of a semiconductor package on the motherboard of a low-cost personal computer, and when replacing the test socket. It is an object of the present invention to provide a test apparatus for a semiconductor package that can reduce the burden of cost.

1 illustrates a semiconductor test system in accordance with general techniques.

2 is an exploded view of a test apparatus of a semiconductor package according to a first embodiment of the present invention.

3 is a coupling diagram of FIG. 2.

4 is a side view of FIG. 3;

5 is an exploded view of a test apparatus for a semiconductor package according to a second embodiment of the present disclosure.

6 is a coupling diagram of FIG. 5.

7 is a side view of FIG. 6;

8 is a coupling diagram of a semiconductor module test apparatus according to a third exemplary embodiment of the present invention.

<Description of the code | symbol about the main part of drawing>

200,400: package module 200a: unit device

200b: unit connection 201,401: module socket

201a: Insertion groove 202,301: test socket board

203: connector 204,305,404: motherboard

300: unit socket 302: connection board mounting socket

303: connection board 304: motherboard mounting socket

402: socket mounting support 403: receptacle

In accordance with another aspect of the present invention, a test apparatus for a semiconductor package includes: a connector mounted at a location of a memory module socket of a personal computer motherboard; A test socket board mounted on the connector and electrically connected to the motherboard; The semiconductor package module mounted on top of the test socket board is configured to include a module socket detachably detachable.

Hereinafter, a first embodiment of a test socket of a semiconductor package according to the present invention will be described in detail with reference to the accompanying drawings.

2 is an exploded view illustrating the test socket of the semiconductor package according to the first embodiment of the present invention, and FIG. 3 is a cross-sectional view illustrating the test socket of the semiconductor package according to the first embodiment.

First, the plurality of memory module sockets located on the motherboard 204 of the personal computer are removed, and then the connector 203 is mounted in place by soldering.

A test socket board 202 in the form of a plate is mounted on top of the mounted connector 203, which is also coupled to the connector 203 to be stably supported by soldering, and is electrically connected to the motherboard 204. .

The module socket 201 for substantially mounting the semiconductor package module 200 on the test socket board 202 is mounted and soldered by the unit connection portion 201b, thereby providing a motherboard 204, a connector 203, It is structurally and electrically securely coupled through the test socket board 202.

The module socket 201 has an insertion groove 201a formed in a lengthwise direction at an upper portion thereof so as to be electrically detachable from the unit connection portion 200b of the package module 200, and a unit connection portion 201b of a conductor formed at a lower end thereof. do.

Therefore, when the package module 200 is connected to the module socket 201, the test signal applied from the motherboard 204 is applied to the semiconductor unit element connected to the unit socket 200a through the unit connection part 200b. .

When the semiconductor package module 200 is desired to be tested, it is electrically connected to the module socket 201 by the unit connection part 200b. In the case where the wear of the insertion groove 201a occurs due to frequent connection, the module socket 201 Can be replaced.

3 is a diagram showing a state of engagement thereof, wherein the motherboard 204 and the test socket board 202 are electrically connected to each other only if the connector 203 is stably supported therebetween.

In addition, the upper part of the test socket board 202 shows a state in which the module socket 201 is detachably mounted.

4 shows this coupling state from another side, in which a plurality of connectors 203 are connected to the test socket board 202 on the mother board 204 to stably support the coupling state of the test socket board 202. Since the number of module sockets 201 corresponding to the connector 203 is mounted on the upper portion, the plurality of semiconductor package modules 200 may be tested at the same time.

Of course, the test socket board 202 is an electrical pattern is formed to electrically connect the connector 203 and the module socket 201.

A test apparatus for a semiconductor package according to a second exemplary embodiment of the present invention includes a motherboard mounting socket mounted on a motherboard of a personal computer to supply a test signal; A connection board mounted to the motherboard mounting socket and electrically coupled to the connection board mounting socket; A connection board mounting socket coupled to an upper portion of the connection board and electrically coupled to a test socket board; A test socket board mounted on an upper portion of the connection board mounting socket to stably support and electrically connect one or more unit sockets; And a unit socket mounted on the test socket board so that the semiconductor unit element is detachable.

Hereinafter, a second exemplary embodiment of a test apparatus for a semiconductor package according to the present invention will be described in detail with reference to the accompanying drawings.

5 is an exploded view illustrating a test apparatus of a semiconductor package according to a second exemplary embodiment of the present invention, and FIG. 6 is a cross-sectional view illustrating a test apparatus of the semiconductor package according to the second exemplary embodiment.

First, a plurality of motherboard mounting sockets 304 are mounted on the motherboard 204 of the personal computer by the unit connecting portion 304a, which uses the memory module sockets pre-mounted on the motherboard of the personal computer. It is okay.

The connection board 303 is mounted to the motherboard connection socket 304 by the unit connection part 303a to stably support the connection board mounting socket 302 and to electrically connect it.

At this time, the connection board mounting socket 302 is inserted into the connection board 303 from the bottom in the form of upside down the motherboard mounting socket 302 as an example, the unit connection portion in the upper portion of the connection board mounting socket 302 The test socket board 301 is mounted and soldered through 302a to be electrically connected thereto.

Of course, the connection board 303 is connected so that attachment and detachment are possible from the motherboard and the connection board attachment socket 302. FIG.

In addition, at least one unit socket for inserting and testing a semiconductor unit element on the test socket board 301 is mounted by a receptacle to provide a test signal applied from the motherboard 305 to the semiconductor unit element. .

In this case, since the connection board mounting socket 302, the test socket board 301, and the unit socket 300 are connected by a receptacle, when the wear of the unit socket 300 occurs, the unit socket 300 is connected to the test socket board. Departing from 301, a new unit socket can be inserted to test a continuous semiconductor unit element.

FIG. 6 is a view illustrating a coupling state of the connection board, and the connection board 303 is inserted between the motherboard mounting socket 304 and the connection board mounting socket 302 located above the mother board 305 so as to be spaced apart from each other by a predetermined distance. It is supported and electrically connected.

7 shows this coupling state from another side, wherein a plurality of motherboard mounting sockets 304 are connected to the connection board mounting sockets 302 through the connection boards 303 on the motherboard 305, respectively. It is stably supported by the connection board mounting socket 302 and the soldered test socket board 301, and a plurality of unit sockets 300 are provided thereon.

The reason for the electrical connection through the connection board 303 is to occupy more area than the package module mounted on the motherboard when the semiconductor unit elements are individually tested. This is for the test by the unit socket 300.

The test socket of the semiconductor package according to the third embodiment of the present invention includes a receptacle inserted into and soldered to a motherboard of a personal computer; A module socket removably inserted into the receptacle, electrically connected to the motherboard by the receptacle, and a semiconductor package module inserted into the receptacle; In order to reliably mount the module socket to the receptacle is characterized in that it comprises a socket mounting support located between the motherboard and the module socket.

First, as shown in FIG. 8, the receptacle 403 is fixed by soldering to a position where the memory module socket of the motherboard 404 of the personal computer is located, and the module socket 401 is mounted on the motherboard 404. ) Is mounted to the socket mounting support 402 for stably mounting, the receptacle 403 is installed through the socket mounting support 402.

When the semiconductor package module 400 is inserted into the receptacle 403 by inserting the module socket 401 into the socket mounting support 402, the test signal provided from the motherboard 404 is transmitted to the semiconductor package module ( 400).

In this case, when the module socket 401 is worn out due to frequent detachment of the semiconductor package module 400, the module socket 401 may be easily replaced with a new module socket by simply removing the module socket 401 from the receptacle 403.

As a result, according to the present invention, expensive measurement equipment is eliminated during the electrical and physical characteristics test of the semiconductor package, and there is an advantage of testing by a relatively inexpensive personal computer.

In addition, although specific embodiments of the present invention have been described and illustrated above, it is obvious that the present invention may be variously modified and implemented by those skilled in the art.

Such modified embodiments should not be individually understood from the technical spirit or the prospect of the present invention, and such modified embodiments should fall within the appended claims of the present invention.

It is clear from the above description that the test apparatus for semiconductor packages according to the present invention reduces test costs by testing semiconductor package modules or semiconductor unit elements through a low-cost personal computer without using expensive test equipment. It is possible to test the same as the environment used by the customer, which has the effect of easy and accurate defect detection.

Claims (3)

A connector mounted in the position of the memory module socket of the personal computer motherboard; A test socket board mounted on the connector and electrically connected to the motherboard; And a module socket mounted on an upper portion of the test socket board and configured to detach a semiconductor package module to be tested. A motherboard mounting socket mounted on a motherboard of the personal computer for supplying a test signal; A connection board mounted to the motherboard mounting socket and electrically coupled to the connection board mounting socket; A connection board mounting socket coupled to an upper portion of the connection board and electrically coupled to a test socket board; A test socket board mounted on an upper portion of the connection board mounting socket to stably support and electrically connect one or more unit sockets; And a unit socket mounted on the test socket board to allow the semiconductor unit element to be detachable. A receptacle inserted into and soldered to the motherboard of the personal computer; A module socket removably inserted into the receptacle, electrically connected to the motherboard by the receptacle, and a semiconductor package module inserted into the receptacle; And a socket mounting support disposed between the motherboard and the module socket to stably mount the module socket to the receptacle.