KR19980083888A - Mounting Structure of Semiconductor Device Module - Google Patents

Abstract

The semiconductor device module according to the present invention is inserted and fixed in a module socket fixed to the motherboard. At this time, as the height of the module socket is continuously increased with respect to the motherboard, the height of the module is continuously increased, so that the semiconductor devices mounted in each module are directly exposed to convection, thereby improving the heat dissipation effect and the removal of the module. It becomes easy.

Description

Mounting Structure of Semiconductor Device Module

No content

The present invention relates to a mounting structure of a semiconductor device module, and more particularly, when mounting a module mounted with a semiconductor device to the module socket so that the heat generated from the semiconductor device by the cooling fan can be effectively released by convection action. The mounting structure of a semiconductor device module is such that the height of the modules is continuously increased.

Due to the high functional and high integration trend of semiconductor devices, as the operating power of electronic components increases and the operating speed becomes faster, heat dissipation according to the type and structure of materials constituting the electronic components has become a problem. Accordingly, a device such as a heat sink is employed to effectively release heat generated inside the semiconductor device into the atmosphere during the operation of the electronic component. However, such a device uses only a conductive method for heat transfer, and thus, there is a limit in obtaining a satisfactory cooling effect through structural design changes thereto.

1, there is shown a cross-sectional view showing a mounting structure of a conventional semiconductor device module.

As shown, a module in which a plurality of module sockets 20 are fixed on a motherboard 10 and a semiconductor device 40 is mounted in an insertion slot 25 in the module socket 20. 30 are inserted respectively.

In such a structure, when the air is sucked out using a predetermined cooling fan (not shown), convection W is generated around the module 20, and heat generated from the semiconductor device 40 is released along the convection W, thereby shortly. The semiconductor device 40 is cooled.

However, as shown, since each module socket 20 has the same height with respect to the motherboard 10, the modules 30 inserted therein also have the same height. Therefore, even if the convection W is formed toward the module 30 side, the module 30a located first in the direction in which the convection W faces blocks the convection W, thereby preventing movement to another module.

As a result, convection does not move to the first and subsequent modules, which causes a problem that the heat dissipation capacity in the spaces between modules is degraded.

Accordingly, an object of the present invention is to smoothly move the convection by the cooling fan even in a structure in which a plurality of modules are mounted in series, thereby improving the heat dissipation capability between the modules and providing a step to the height of the module socket, thereby removing the mounting from the motherboard. To facilitate it.

1 is a cross-sectional view showing a mounting structure of a conventional semiconductor device module,

2 is a cross-sectional view illustrating a mounting structure of a semiconductor device module according to an embodiment of the present invention;

3 is a cross-sectional view illustrating a mounting structure of a semiconductor device module according to another exemplary embodiment of the present invention.

<Description of the symbols used in the main parts of the drawing>

10: motherboard 20: module socket

30 module 40 semiconductor device

50: module socket base

According to the present invention, there is provided a plurality of modules on which at least one semiconductor device is mounted, a plurality of module sockets on which the modules are mounted, and a motherboard to which the module sockets are fixed, wherein the semiconductor devices are each directly in convection. A mounting structure of a semiconductor device module is disclosed, wherein the modules are arranged to be exposed.

Preferably, the height of the module is adjusted to be directly exposed to convection, more preferably the height of the modules is continuously increased relative to the motherboard.

Also preferably, the height of the modules is adjusted according to the height of the module socket.

Optionally, the module sockets are fixed to the motherboard via an integrally formed module socket base, and insert slots into which the modules are inserted are formed inside the module sockets.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2, a cross-sectional view of a mounting structure of a semiconductor device module according to an embodiment of the present invention is shown. In this embodiment, a personal computer is described as an example for convenience of explanation, but the technical idea of the present invention is not limited thereto, and it is obvious that various modifications are possible.

As shown, a plurality of module sockets 20 are mounted and fixed on the motherboard 10. The motherboard 10 may be, for example, a motherboard mounted in a personal computer or a baseboard mounted in an electronic device. The module socket 20 is usually formed of an epoxy resin or the like, and an insertion slot 25 is formed therein to form a conductive terminal 28 in the sidewall portion.

According to the present invention, each of the module sockets 20 are arranged so that convection between the modules 30 is smooth. Preferably the height of each module socket 20 relative to the motherboard 10 increases continuously in the direction that the convection W faces. That is, as shown in Fig. 2, the second module socket 20b is higher than H than the first module socket 20a and the third module socket 20c is higher than H than the second module socket 20b. Is set. The height H is determined by the size of the system and the amount of heat released from the semiconductor device 40 of each module 30. For example, the height H is determined in consideration of the convective effect on the semiconductor device 40 of each module through simulation or the like. Just do it. In addition, the depth of the insertion slot 25 is different for each module socket 20 because the height of each module socket 20 is different. The conductive terminal protrudes to the rear surface of the module socket 20 and is electrically connected to the motherboard 10.

On the other hand, the insertion slot 25 of the module socket 20 is inserted into the module 30 in which the semiconductor device (or semiconductor package) 40 is mounted and electrically connected to the conductive terminals in the insertion slot 25. Other electronic components may be mounted on the module 30 together with the semiconductor device 40. In addition, since the depth to be inserted into the insertion slot 25 of the module 30 is different for each module 30, this should be considered when designing the module 30.

When air flows out to the cooling fan in the mounting structure configured as described above, convection W is generated and moves in the direction shown. At this time, according to the present invention, since each module socket 20 has a continuously increasing height, the inserted modules 20 are directly exposed to convection W, thereby improving heat dissipation efficiency in the semiconductor device 40. In addition, a strong vortex is formed between the modules 20, and heat is released through the convection W, so that the heat accumulated between the modules 20 can be released in a short time.

Referring to FIG. 3, there is shown a cross-sectional view of a mounting structure of a semiconductor device module in accordance with another embodiment of the present invention.

As shown, unlike one embodiment, each module socket 20 is integrally formed on the module socket base 50. That is, the module socket 20 and the module socket base 50 can be formed at the same time during manufacture.

By doing in this way, in addition to having the same effect as the above-described embodiment, the entire module socket 20 can be handled as one unit, and thus there is an advantage in that the mounting is easy. In addition, if the most suitable height dimension between each module socket 20 is determined through a simulation, there is an advantage that can be produced module socket unit that the dimensions determined by the molding molding method accurately reflected each other.

According to the present invention, the heat generated from the semiconductor device by the cooling fan and the heat accumulated between the modules by the convection action by causing the height of the modules to be continuously increased when the module mounted with the semiconductor device is mounted on the module socket. It can release effectively. In addition, since a step is formed between the modules, there is an advantage that it is easy to handle by hand when removing the modules.

Although the present invention has been described using a personal computer as an example, it can be used in electronic devices in which heat dissipation greatly affects the performance of the device. For example, high-performance high-end audio and video equipment can also be used to dissipate the heat emitted from the inside to the outside by convection in addition to the heat sink conduction method.

Claims (6)

A plurality of modules mounted with at least one semiconductor device; A plurality of module sockets to which the modules are mounted; The module socket includes a fixed motherboard, And the modules are arranged such that each of the semiconductor devices is directly exposed to convection. 2. The mounting structure of a semiconductor device module according to claim 1, wherein the height of the module is adjusted to be directly exposed to the convection. The mounting structure of a semiconductor device module according to claim 1, wherein the heights of the modules increase continuously with respect to the motherboard. 4. The mounting structure of a semiconductor device module according to claim 3, wherein the height of the modules is adjusted according to the height of the module socket. 5. The mounting structure of claim 4, wherein the module sockets are fixed to the motherboard through integrally formed module socket bases. 6. The mounting structure of a semiconductor device module according to claim 5, wherein insertion slots into which the modules are inserted are formed in the module sockets, respectively.