JP6503772B2 - Electronic component conveying apparatus and electronic component inspection apparatus - Google Patents

Description

  The present invention relates to an electronic component conveyance device and an electronic component inspection device.

  Conventionally, an electronic component inspection apparatus for inspecting the electrical characteristics of an electronic component such as an IC device is known, and in this electronic component inspection apparatus, an electronic component for conveying the IC device to the holding unit of the inspection unit A transport device is incorporated. When testing an IC device, the IC device is disposed in the holder, and a plurality of probe pins provided in the holder are brought into contact with the respective terminals of the IC device.

  The electronic component transport apparatus transports a soak plate for adjusting the temperature of the IC device to a temperature suitable for inspection by heating or cooling the IC device in advance and the IC device whose temperature is adjusted with the soak plate to the vicinity of the inspection unit First device transport head for transporting the IC device between the supply shuttle and the tray on which the IC device is disposed and the soak plate and transporting the IC device between the soak plate and the supply shuttle, and the IC after inspection A recovery shuttle for transporting the device, a second device transport head for transporting the IC device between the supply shuttle and the inspection unit, and an IC device between the inspection unit and the recovery shuttle, and the recovery shuttle Device has a third device transport head that transports IC devices to and from the tray where IC devices are placed. To have. The feed shuttle and the recovery shuttle each have a plurality of pockets in which IC devices are located.

  Further, Patent Document 1 discloses an electronic component test apparatus capable of determining whether or not an IC device remains on a socket.

  The electronic component testing apparatus includes an imaging unit for imaging a socket, a storage unit for storing reference image data of the socket in a state in which the IC device is not mounted and acquired by imaging by the imaging unit, and an IC device in the socket. And residual determination means for determining whether or not there is residual. Then, in this electronic component test apparatus, the socket is imaged by the image pickup means, the inspection image data of the socket is acquired, the inspection image data and the reference image data are compared by the residual judgment means, and the IC is mounted on the socket. It is determined whether the device remains.

International Publication No. 2007/17953

  In the conventional electronic component transport apparatus, after the inspection of the IC device is completed, the IC device is transported to the recovery shuttle by the second device transport head and placed in the pocket of the recovery shuttle, but the IC device in the pocket is If the seating condition is bad, the movement of the recovery shuttle may cause the IC device to pop out of the pocket. As a result, there is a possibility that the non-defective IC device may be destroyed, and the drive of the electronic component transfer device is stopped, which causes a problem that the time efficiency of the inspection decreases.

  In addition, a device for determining whether or not an IC device remains on a socket in the electronic component testing device described in Patent Document 1, and whether or not an IC device remains in a pocket of a recovery shuttle in the electronic component transporting device. When applied to an apparatus for determining whether there is a problem that the apparatus becomes large in hardware and software respectively, that is, the apparatus becomes large and the configuration and control of the apparatus become complicated.

  The object of the present invention is to make it possible to easily determine the presence or absence of an electronic component on the electronic component conveyance unit with a simple configuration, and to make the electronic component on the electronic component conveyance unit in a good sitting condition. An object of the present invention is to provide a component transfer device and an electronic component inspection device.

  The present invention has been made to solve at least a part of the above-described problems, and can be realized as the following modes or application examples.

Application Example 1
An electronic component transfer apparatus according to the present invention includes an electronic component transfer unit in which an electronic component is disposed and which can transfer the electronic component.
A fluid suction unit capable of suctioning a fluid;
The electronic component transfer unit is movable to an electronic component arrangement position where the electronic component is arranged,
The fluid suction unit sucks the fluid when the electronic component transfer unit is positioned at the electronic component placement position;
It is characterized in that whether or not the electronic component is disposed in the electronic component conveyance unit is determined based on the result of detecting the pressure or flow rate of the fluid.

  Thereby, according to various situations, the presence or absence of the electronic component on the electronic component conveyance unit can be easily and accurately determined with a simple configuration. For example, the presence or absence of a transparent electronic component that can not be detected by an optical sensor can be determined.

  Further, the fluid suction unit can suction the electronic component disposed in the electronic component conveyance unit. Thus, the electronic component can be disposed in the electronic component transport unit, and the seating condition of the electronic component can be improved, and the electronic component transport unit can be moved by improving the seating condition of the electronic component. It is possible to prevent the electronic component from jumping out of the electronic component transport unit.

Application Example 2
In the electronic component transfer apparatus of the present invention, it is preferable to include a detection unit capable of detecting at least one of the pressure of the fluid and the flow rate of the fluid.

  Thereby, at least one of the pressure of the fluid and the flow rate of the fluid can be accurately detected, and based on the detection result, it is determined whether the electronic component is disposed in the electronic component transport unit. Can.

Application Example 3
In the electronic component transfer apparatus of the present invention, the detection unit preferably has a filter.
As a result, dust, dirt and the like can be prevented from entering the detection unit.

Application Example 4
In the electronic component transfer apparatus of the present invention, it is preferable to detect a clogged state of the filter based on the result of detecting the pressure or flow rate of the fluid.

  Thus, when the filter is clogged, the filter can be replaced, cleaned, etc. properly.

Application Example 5
In the electronic component transfer apparatus according to the present invention, a first port provided in the electronic component transfer unit and capable of circulating the fluid;
A second port connected to the fluid suction portion;
It is preferable that the fluid is in contact with the first port and the second port so that the fluid can flow when the electronic component transfer unit is positioned at the electronic component placement position.

  As a result, compared to the case where a tube or the like for suctioning fluid is always connected to the electronic component transfer unit, the tube or the like does not get in the way while the electronic component transfer unit is moving.

Application Example 6
In the electronic component transfer apparatus of the present invention, the electronic component transfer unit includes an electronic component placement unit in which the electronic component is placed,
Preferably, the electronic component placement portion is provided with a plurality of concave portions into which a plurality of terminal portions of the electronic component are inserted.

  As a result, when the electronic component is arranged in the electronic component conveyance section in a favorable sitting state, the terminal section of the electronic component is inserted into the recess, whereby a gap is formed between the electronic component conveyance section and the electronic component. Can be prevented.

Application Example 7
In the electronic component transfer apparatus of the present invention, the electronic component transfer unit includes an electronic component placement unit in which the electronic component is placed,
Preferably, an elastic member is provided in the electronic component placement portion.

  In the case where the electronic component has a plurality of terminal portions, the elastic member is elastically deformed in accordance with the shape of the terminal portion of the electronic component when the electronic component is disposed in the electronic component conveyance portion in a good sitting condition. As a result, it is possible to prevent the occurrence of a gap between the electronic component conveyance unit and the electronic component.

Application Example 8
In the electronic component transfer apparatus according to the present invention, the electronic component transfer unit includes a plurality of electronic component placement units in which a plurality of the electronic components are disposed;
And a channel communicating with the plurality of electronic component placement parts,
It is preferable that the fluid suction unit sucks the fluid from the flow path when the electronic component transfer unit is positioned at the electronic component arrangement position.

  Thus, one detecting unit or the like may be provided for a plurality of electronic component placement units, and the structure can be simplified.

Application Example 9
In the electronic component transfer device of the present invention, it is preferable to have a valve for adjusting the flow rate of the fluid.

  Thereby, in the case where the plurality of electronic components are arranged in the electronic component transfer unit, when the ability of the fluid suction unit is low, the flow rate of the fluid is reduced to allow the fluid suction unit to Suction can be performed stably.

Application Example 10
In the electronic component transfer apparatus according to the present invention, it is preferable to determine whether the seating state of the electronic component on the electronic component transfer portion is good or not based on the result of detecting the pressure or flow rate of the fluid.

  As a result, it is possible to properly cope with an electronic component having a poor seating state, such as changing the seating state to a good one.

Application Example 11
In the electronic component transfer apparatus of the present invention, it is preferable that the electronic component transfer apparatus further includes a vibration applying unit that vibrates the electronic component transfer unit when the seating state of the electronic component is determined to be defective.

  As a result, when there is an electronic component in which the seating state is defective, the seating state of the electronic component can be restored to a good state by vibrating the electronic component conveyance unit by the vibration applying unit.

Application Example 12
An electronic component inspection apparatus according to the present invention includes an electronic component conveyance unit in which an electronic component is disposed and which can convey the electronic component.
A fluid suction unit capable of suctioning a fluid;
And an inspection unit for inspecting the electronic component,
The electronic component transfer unit is movable to an electronic component arrangement position where the electronic component is arranged,
The fluid suction unit sucks the fluid when the electronic component transfer unit is positioned at the electronic component placement position;
It is characterized in that whether or not the electronic component is disposed in the electronic component conveyance unit is determined based on the result of detecting the pressure or flow rate of the fluid.

  Thereby, according to various situations, the presence or absence of the electronic component on the electronic component conveyance unit can be easily and accurately determined with a simple configuration. For example, the presence or absence of a transparent electronic component that can not be detected by an optical sensor can be determined.

  Further, the fluid suction unit can suction the electronic component disposed in the electronic component conveyance unit. Thus, the electronic component can be disposed in the electronic component transport unit, and the seating condition of the electronic component can be improved, and the electronic component transport unit can be moved by improving the seating condition of the electronic component. It is possible to prevent the electronic component from jumping out of the electronic component transport unit.

It is a schematic plan view which shows 1st Embodiment of the electronic component test | inspection apparatus of this invention. It is a block diagram of the electronic component inspection apparatus shown in FIG. It is sectional drawing of the device collection | recovery part of the electronic component test | inspection apparatus shown in FIG. It is sectional drawing of the device collection | recovery part of the electronic component test | inspection apparatus shown in FIG. It is sectional drawing of the device collection | recovery part of the electronic component test | inspection apparatus shown in FIG. It is sectional drawing of the device collection | recovery part in 2nd Embodiment of the electronic component test | inspection apparatus of this invention. It is sectional drawing of the device collection | recovery part in 3rd Embodiment of the electronic component test | inspection apparatus of this invention. It is sectional drawing of the device collection | recovery part in 4th Embodiment of the electronic component test | inspection apparatus of this invention. It is sectional drawing which shows a part of device collection | recovery part and electronic component in 5th Embodiment of the electronic component test | inspection apparatus of this invention. It is sectional drawing which shows a part of device collection | recovery part and electronic component in 5th Embodiment of the electronic component test | inspection apparatus of this invention. It is sectional drawing which shows a part of device collection | recovery part and electronic component in 6th Embodiment of the electronic component test | inspection apparatus of this invention.

  Hereinafter, an electronic component conveyance device and an electronic component inspection device according to the present invention will be described in detail based on embodiments shown in the attached drawings.

First Embodiment
FIG. 1 is a schematic plan view showing a first embodiment of the electronic component inspection device of the present invention. FIG. 2 is a block diagram of the electronic component inspection device shown in FIG. 3 to 5 are cross-sectional views of the device recovery unit of the electronic component inspection device shown in FIG. 1, respectively.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are taken as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction", a direction parallel to the Y axis is also referred to as "Y direction", and a direction parallel to the Z axis is also referred to as "Z direction". Further, the directions of the arrows of the X, Y, and Z axes are referred to as the plus side, and the direction opposite to the arrow is referred to as the minus side. Further, the upstream side in the transport direction of the electronic component is simply referred to as "upstream side", and the downstream side is simply referred to as "downstream side". In addition, “horizontal” referred to in the specification of the present application is not limited to perfect horizontal, and includes a state of being slightly inclined (for example, less than about 5 °) with respect to horizontal unless transport of electronic components is inhibited.

  In the following, for convenience of explanation, the upper side in FIGS. 3 to 5 is referred to as “upper” or “upper”, the lower side as “lower” or “lower”, the right side as “right”, and the left side as “left”. (The same applies to FIGS. 6 to 11).

  The inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 is, for example, an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, an LCD (Liquid Crystal Display), a CIS (CMOS Image Sensor) Etc. for testing and testing the electrical characteristics of electronic components (hereinafter simply referred to as "checking"). In the following, for convenience of explanation, the case of using an IC device as the electronic component to be inspected will be representatively described, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, and a device recovery area (hereinafter simply "recovery area"). It is divided into A4 and tray removal area A5. Each of these regions is separated from each other by a wall, a shutter, or the like (not shown). The supply area A2 is a first chamber R1 defined by a wall, a shutter or the like, and the inspection area A3 is a second chamber R2 defined by a wall, a shutter or the like. The recovery area A4 is a third chamber R3 defined by a wall, a shutter, and the like. In addition, the first chamber R1 (supply region A2), the second chamber R2 (inspection region A3) and the third chamber R3 (collection region A4) are each configured to be able to ensure airtightness and heat insulation. ing. Thereby, the first chamber R1, the second chamber R2, and the third chamber R3 can maintain the humidity and the temperature as much as possible. The insides of the first chamber R1 and the second chamber R2 are controlled to have a predetermined humidity and a predetermined temperature, respectively.

  In the IC device 90, the inspection is performed in the inspection area A3 halfway through the respective areas from the tray supply area A1 to the tray removal area A5 in order. As described above, the inspection apparatus 1 transports the IC device 90 in each area and includes the electronic component transfer apparatus having the control unit 80, the inspection unit 16 which performs the inspection in the inspection area A3, and the inspection control unit (not shown). It has become In the inspection apparatus 1, the electronic component transfer apparatus is configured by the configuration excluding the inspection unit 16 and the inspection control unit.

  The tray supply area A1 is an area to which a tray 200 in which a plurality of untested IC devices 90 are arrayed is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area for supplying the plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3. A first tray conveyance mechanism 11A and a second tray conveyance mechanism 11B for conveying the trays 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  The supply area A2 is provided with a temperature adjustment unit (soak plate) 12 which is an arrangement unit for arranging the IC device 90, a first device transfer head (transfer unit) 13, and a third tray transfer mechanism 15. ing.

  The temperature adjustment unit 12 is a device that heats or cools the plurality of IC devices 90 to adjust (control) the IC devices 90 to a temperature suitable for inspection. That is, the temperature control unit 12 is a temperature control member (member) capable of arranging the IC device 90 and performing both heating and cooling of the IC device 90. In the configuration shown in FIG. 1, two temperature adjustment units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in (conveyed) from the tray supply area A1 by the first tray conveyance mechanism 11A is conveyed to any one of the temperature control units 12 and placed.

  The first device transport head 13 is movably supported in the supply area A2. Thereby, the first device transport head 13 transports the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature control unit 12, the temperature control unit 12, and the device supply unit 14 described later And transport of the IC device 90 between them. Note that the first device transfer head 13 has a plurality of gripping portions (not shown) for gripping the IC device 90, and each gripping portion includes a suction nozzle to adsorb the IC device 90. Hold it.

  The third tray transport mechanism 15 transports the empty tray 200 in a state in which all the IC devices 90 have been removed in the X direction. Then, after this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray conveyance mechanism 11B.

  The inspection area A3 is an area for inspecting the IC device 90. In the inspection area A3, a device supply unit (supply shuttle) 14, which is an electronic component conveyance unit for conveying the IC device 90, an inspection unit 16, a second device conveyance head (contact unit) 17, and an IC device A device recovery unit (recovery shuttle) 18 which is an electronic component transfer unit for transferring 90 is provided.

  The device supply unit 14 includes an arrangement plate (electronic component arrangement plate) 141 on which the IC device 90 is arranged, and a device supply unit main body (transport unit) 142 capable of linear movement (movement) in the X direction. The placement plate 141 is detachably installed in the device supply unit main body 142. The device supply unit 14 is a device for transporting the temperature-controlled (temperature-controlled) IC device 90 to the vicinity of the inspection unit 16 and supports the movable between the supply area A2 and the inspection area A3 along the X direction. It is done. Further, in the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC devices 90 on the temperature adjustment unit 12 are transported to and mounted on one of the device supply units 14. . The device supply unit 14 can adjust the temperature of the IC device 90 to a temperature suitable for inspection by heating or cooling the IC device 90 as in the temperature adjustment unit 12.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, that is, a holding unit that holds the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminals of the IC device 90 and the probe pins are electrically connected (contacted), and the inspection of the IC device 90 is performed via the probe pins. The inspection of the IC device 90 is performed based on a program stored in a storage unit of an inspection control unit provided in a tester (not shown) connected to the inspection unit 16. In the inspection unit 16, as in the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The second device transport head 17 is movably supported in the inspection area A3. As a result, the second device transport head 17 can transport the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16 and place it. When the IC device 90 is to be inspected, the second device transfer head 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16. As a result, as described above, the terminal of the IC device 90 and the probe pin of the inspection unit 16 are electrically connected.

  As shown in FIG. 3, the second device transport head 17 has a plurality of (two in the illustrated configuration) hand units 175 as a gripping portion for gripping the IC device 90. The configuration of each hand unit 175 is the same, so in the following, one hand unit 175 will be representatively described. The hand unit 175 includes a suction nozzle 176 and holds the IC device 90 by suction. That is, the hand unit 175 drives the first pump (not shown) to suction air (fluid) in a state where the IC device 90 is disposed at the tip of the suction nozzle 176, and negative pressure is applied to the lumen of the suction nozzle 176. In this state, the tip of the suction nozzle 176 grips (sucks and holds) the IC device 90. Also, a second pump (not shown) is driven to supply air, and the negative pressure state of the lumen of the suction nozzle 176 is released to release the IC device 90 held by the suction nozzle 176.

  Further, in each hand unit 175 of the second device transfer head 17, the IC device 90 can be heated or cooled to adjust the temperature of the IC device 90 to a temperature suitable for inspection as in the temperature control unit 12.

  The device recovery unit 18 includes an arrangement plate (electronic component arrangement plate) 181 on which the IC device 90 is disposed, and a device recovery unit main body (transport unit) 182 which can linearly move (move) in the X direction. The placement plate 181 is detachably installed in the device recovery unit main body 182. The device recovery unit 18 is a device for transporting the IC device 90 which has been inspected by the inspection unit 16 to the recovery area A4, and supports the movement between the inspection area A3 and the recovery area A4 along the X direction. It is done. Further, in the configuration shown in FIG. 1, two device recovery units 18 are arranged in the Y direction as in the device supply unit 14, and the IC devices 90 on the inspection unit 16 are arranged in one of the device recovery units 18. It is transported and placed. This transfer is performed by the second device transfer head 17.

  The recovery area A4 is an area in which the IC device 90 for which the inspection has been completed is recovered. In the recovery area A4, a recovery tray 19, a third device transport head (transport unit) 20, and a sixth tray transport mechanism 21 are provided. In addition, an empty tray 200 is also prepared in the collection area A4.

  The recovery trays 19 are fixed in the recovery area A4, and in the configuration shown in FIG. 1, three are disposed along the X direction. Further, three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported to and placed on any of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The third device transport head 20 is movably supported in the recovery area A4. Thus, the third device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. The third device transport head 20 has a plurality of gripping portions (not shown) for gripping the IC device 90, and each gripping portion includes a suction nozzle to adsorb the IC device 90. Hold it.

  The sixth tray transport mechanism 21 transports the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after this conveyance, the empty tray 200 will be disposed at a position where the IC device 90 is collected, that is, it can be any of the three empty trays 200.

  The tray removal area A5 is an area in which the tray 200 in which the plurality of IC devices 90 in the inspected state are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  Further, a fourth tray conveyance mechanism 22A and a fifth tray conveyance mechanism 22B for conveying the trays 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A transports the tray 200 on which the tested IC device 90 is placed from the recovery area A4 to the tray removal area A5. The fifth tray transport mechanism 22B transports an empty tray 200 for recovering the IC device 90 from the tray removal area A5 to the recovery area A4.

  The inspection control unit of the tester performs, for example, an inspection of the electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on a program stored in a storage unit (not shown).

  Further, as shown in FIG. 2, the inspection apparatus 1 includes a pump (fluid suction unit) 131 for sucking air (fluid), and pressure sensors (detection units) 411 and 412 for detecting the pressure of air (fluid). And an operation unit 6 for performing each operation of the inspection apparatus 1. The control unit 80 also has a storage unit 801 for storing each information, and a determination unit 803 for performing each determination (discrimination). For example, the first tray conveyance mechanism 11A and the second tray conveyance mechanism 11B , Temperature control unit 12, first device transfer head 13, device supply unit 14, third tray transfer mechanism 15, inspection unit 16, second device transfer head 17, device recovery unit 18 and , Drive control of each component such as the third device transport head 20, the sixth tray transport mechanism 21, the fourth tray transport mechanism 22A, the fifth tray transport mechanism 22B, the pump 131, the display unit 62, etc. Do. The detection results of the pressure sensors 411 and 412 are input to the control unit 80.

  The operation unit 6 also has an input unit 61 for performing each input and a display unit 62 for displaying an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. Further, the display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel, an organic EL display panel, and the like. For example, the operation of the operation unit 6 by the operator (operator) operates the input unit 61, moves the cursor to the position of each operation button (icon) displayed on the display unit 62, and selects (clicks) In the following, this operation is also referred to as "pressing an operation button".

  Note that some or all of the operation buttons displayed on the display unit 62 may be provided as mechanical operation buttons such as a push button.

Moreover, as the operation part 6, not only the thing of the said structure, for example, the device etc. which can input the input of a touchscreen etc., and an image etc. are mentioned.
The display unit 62 of the operation unit 6 constitutes a notification unit.

  In the inspection apparatus 1, the device recovery unit 18 determines whether the IC device 90 is present on the device recovery unit 18, that is, whether or not the IC device 90 is disposed in the device recovery unit 18, as described below. It is configured to be capable of discriminating (detecting) the seating state of 90. The same applies to the device supply unit 14. The configuration will be described in detail below, but since the configurations of the device supply unit 14 and the device recovery unit 18 are the same, the device recovery unit 18 will be representatively described below.

  As shown in FIG. 3, the device recovery unit 18 includes a placement plate 181 and a device recovery unit main body 182, and is movably installed on the base 11. The device recovery unit 18 arranges the electronic component placement position (first position) at which the operation of placing the IC device 90 which has been inspected in the inspection unit 16 in the device recovery unit 18 and the device recovery unit in the recovery area A4. The IC device 90 is movable between the second position 18 and the second position where the IC device 90 is taken out.

  Further, on the upper surface of the placement plate 181, that is, on the surface of the placement plate 181 opposite to the device recovery unit main body 182, there are pockets (electronic component placement parts) 811 which are a plurality of recesses for housing (placement) the IC devices 90. It is provided. Each IC device 90 is accommodated in each pocket 811 and thereby disposed on the placement plate 181.

  The shape, size (size) and arrangement (position) of each pocket 811 are set based on the shape, size (size) of the IC device 90 to be inspected, the arrangement position of the IC device 90 in the inspection section 16, etc. There is.

  In the present embodiment, when viewed from the upper side in FIG. 3 (the Z direction in FIG. 1), the outer shape of the IC device 90 is square, and therefore the outer shape of the pocket 811 is the outer shape of the IC device 90. It has a corresponding shape, ie a square.

  Further, the number of pockets 811 is not particularly limited, but in the present embodiment, two cases will be illustrated and described as an example.

  Further, the placement plate 181 is provided with a first flow passage 812 in communication. The first channel 812 communicates with the pocket 811 and is open to the upper and lower surfaces of the disposition plate 181. Note that the number of first channels 812 is equal to the number of pockets 811 and is two in the present embodiment.

  In addition, the device recovery unit main body 182 is provided with a second flow passage 821 in communication. The second flow passage 821 is in communication with the first flow passage 812 and is open to the upper surface and the side surface of the device recovery unit main body 182. The number of the second flow paths 821 is equal to the number of the pockets 811 and the first flow paths 812 and is two in the present embodiment.

  In addition, two second ports 152A and 152B through which air (fluid) can flow are attached to the base 11.

  In addition, pipes 171 and 172 through which air (fluid) flows are connected to the second ports 152A and 152B, respectively. And the pipe body 171 and the pipe body 172 are connected to the pump 131 which attracts | sucks air, after joining to one. As will be described later, air can be sucked from the first flow paths 812 and the second flow paths 821 by the pump 131. The lumens of the respective first flow paths 812, the respective second flow paths 821, and the first ports 151 A and 151 B described later, the lumens of the second ports 152 A and 152 B, and the tube 171 , 172 and the lumen of the tube body after merging form a flow path through which air flows.

  Further, pressure sensors 411 and 412 for detecting the pressure of air (fluid) flowing through the lumens (channels) of the tubes 171 and 172 are provided as detection units in the middle of the tubes 171 and 172, respectively. There is.

  Further, at the lower end portion of the device recovery unit main body 182, first ports 151A and 151B which are in communication with the respective second flow paths 821 and through which air (fluid) can flow are attached. Each of the first ports 151A and 151B has a cylindrical portion 1511 having a bottomed cylindrical shape, and a connection portion 1513 provided on the side surface of the cylindrical portion 1511 and having a cylindrical shape. The connecting portion 1513 is disposed at the position of the side hole 1512 provided on the side surface of the cylindrical portion 1511, and the inner cavity of the connecting portion 1513 communicates with the inner cavity of the cylindrical portion 1511 via the side hole 1512. There is. The connection portion 1513 is formed of an elastic member.

  As shown in FIG. 3, when the device recovery unit 18 is positioned at the electronic component placement position (first position) where the operation of placing the IC device 90 in the device recovery unit 18 is performed, the first port 151A And 151B and the second ports 152A and 152B are connected (air flowably abuts), the lumen of the first port 151A and the lumen of the 151B and the lumen of the second port 152A and the lumen 152B It communicates with the cavity. That is, the pump 131 is connected to the respective first flow paths 812 and the respective second flow paths 821. In this case, since the connection portion 1513 is formed of an elastic member, the connection portion 1513 is elastically deformed to prevent a gap from being generated between the first ports 151A and 151B and the second ports 152A and 152B. can do. Further, since the connection portion 1513 is formed of an elastic member, even when the first ports 151A and 151B and the second ports 152A and 152B come close to each other, the connection portion 1513 is resiliently deformed. be able to.

  Further, as shown in FIG. 4, when the device recovery unit 18 is separated from the electronic component arranging position, the first ports 151A and 151B and the second ports 152A and 152B are separated, and the first ports 151A and 151B are separated. The connection (contact) with the second ports 152A and 152B is released. By providing such first ports 151A, 151B and second ports 152A, 152B, a plurality of tubes etc. for connecting the respective first flow paths 812 and the respective second flow paths 821 and the pump 131 can be obtained. There is no need to arrange, and thereby the structure can be simplified, and the respective tubes and the like do not get in the way during movement of the device recovery unit 18.

  Next, an operation in the case where the presence or absence of the IC device 90 on the device recovery unit 18 and the seating state of the IC device 90 are determined will be described.

  First, as shown in FIG. 3, the device recovery unit 18 is located at the electronic component arrangement position, and the inspection apparatus 1 checks each IC device 90 after inspection by the second device transport head 17 from the inspection unit 16. It is transported onto each pocket 811 of the device recovery unit 18.

  Then, the second device transport head 17 is a IC device, while the pump 131 sucks air from the first flow passage 812 and the second flow passage 821 via the pipes 171 and 172, respectively. Release 90. That is, suction of air by the pump 131 is performed when the IC device 90 is disposed in each pocket 811. Thereby, it is possible to suction the IC device 90 disposed in each pocket 811, thereby enabling the IC device 90 to be disposed in each pocket 811 and to improve the seating condition of the IC device 90. .

  In addition, after the operation of arranging the IC device 90 in each pocket 811 is performed, before the device recovery unit 18 is moved, the pump 131 allows the respective first flow paths 812 and the respective first flow paths 812 and The pressure sensors 411 and 412 detect the pressure of air flowing through the tubes 171 and 172 while drawing air from the second flow paths 821.

  Then, the determination unit 803 of the control unit 80 determines the presence or absence of the IC device 90 in each pocket 811 based on the detection results of the pressure sensors 411 and 412, that is, whether the IC device 90 is disposed in the device recovery unit 18. The heel and the seating state of the IC device 90 are determined. Hereinafter, the principle and the detailed configuration will be described. In the following, typically, the presence or absence of the IC device 90 in the pocket 811 and the seating state of the IC device 90 are determined based on the detection result of the pressure sensor 411 Will be explained.

  First, the pressure of air detected by the pressure sensor 411 is different between the case where the IC device 90 is disposed in the pocket 811 and the case where the IC device 90 is not disposed. That is, as shown in the left pocket 811 in FIG. 5, when the IC device 90 is disposed in the pocket 811, a part of the opening 813 on the pocket 811 side of the first flow passage 812 by the IC device 90 Since the whole is closed, the pressure of air detected by the pressure sensor 411 when the IC device 90 is not disposed in the pocket 811 is higher than the pressure of the air when disposed.

  Further, even when the IC device 90 is disposed in the pocket 811, as shown in the left pocket 811 in FIG. 5, the seating condition of the IC device 90 in the pocket 811 is good, and the right side in FIG. As shown in the pocket 811, the pressure of the air detected by the pressure sensors 411, 412 is different in a defective case, for example, when a part of the IC device 90 is floating. That is, the pressure of air detected by the pressure sensor 412 when the seating state of the IC device 90 in the pocket 811 is poor is higher than the pressure of air detected by the pressure sensor 411 in a good case. When the seating state of the IC device 90 is good, the pressure of the air approaches the pressure of vacuum.

  Therefore, in the inspection apparatus 1, the threshold for each determination is set in advance, and the determination is performed by comparing the threshold with the pressure of air detected by the pressure sensors 411 and 412.

  Specifically, the IC device 90 is disposed in the pocket 811, and there are three cases where the seating state is good, the seating state is poor, and the IC device 90 is not disposed in the pocket 811. In order to determine the state, a first threshold and a second threshold smaller than the first threshold are set.

  Then, the first threshold is compared with the pressure of air detected by the pressure sensors 411 and 412, and when the pressure of the air is larger than the first threshold, the IC device 90 is disposed in the pocket 811 If it is determined that the pressure of the air is equal to or less than a first threshold value, it is determined that the IC device 90 is disposed in the pocket 811.

  Further, when the pressure of the air is less than the first threshold, the second threshold is further compared with the pressure of the air, and when the pressure of the air is greater than the second threshold, the pocket 811 is It is determined that the seating state of the IC device 90 in the case is defective, and that the seating state of the IC device 90 in the pocket 811 is good if the pressure of the air is equal to or less than the second threshold.

  The first threshold and the second threshold are experimentally obtained in advance and stored in the storage unit 801 of the control unit 80.

  In addition, the determination result in each pocket 811 is displayed on the display unit 62. As a result, in each of the pockets 811, the worker can individually determine the state of the IC device 90 when the IC device 90 is not disposed in the pocket 811, although the IC device 90 is disposed in the pocket 811. It can be grasped which of the case where the seating condition of 90 is defective and the case where the seating condition of the IC device 90 is good.

  Further, in at least one of the pockets 811, the IC device 90 is not disposed in the pocket 811 and the IC device 90 is disposed in the pocket 811, but the seating state of the IC device 90 is defective If it is one of the cases, the inspection apparatus 1 stops its operation. Then, for example, the worker manually arranges the IC device 90 in a good sitting state in the corresponding pocket 811 and then operates the input unit 61 to operate the inspection apparatus 1.

  In the above, the case where the pressure sensors 411 and 412 are used as the detection unit has been described. However, the detection units are not limited to the pressure sensors 411 and 412, for example, air flowing in the lumens of the tubes 171 and 172. There is a flow rate sensor that detects the flow rate.

  Also, the detection unit may not be initially provided in the inspection apparatus 1, and may be configured to be attached separately later. That is, the detection unit may not be in the inspection device 1 at first, and may be configured to be able to determine based on the detection result after the detection unit is installed.

  The device supply unit 14 is the same as the device recovery unit 18, and thus the description thereof is omitted.

  As described above, according to the inspection apparatus 1, by sucking the air by the pump 131, the IC device 90 disposed in the pocket 811 of the disposition plate 181 can be attracted. Thus, the IC device 90 can be disposed in the pocket 811 of the placement plate 181, and the seating state of the IC device 90 can be improved. Further, by improving the seating state of the IC device 90, it is possible to prevent the IC device 90 from jumping out of the pocket 811 of the placement plate 181 while the device recovery unit 18 is moving.

  Further, according to various situations, the presence or absence of the IC device 90 in the pocket 811 of the placement plate 181 can be easily and accurately determined with a simple configuration, and the seating state of the IC device 90 can be determined. it can. For example, even if it is a transparent IC device etc. which can not be detected by an optical sensor, the presence or absence and the seating condition can be determined.

  Further, the IC device 90 is disposed in the pocket 811 of the placement plate 181 by one mechanism having the pump 131, the pressure sensor 411, 412, etc., and the seating condition of the IC device 90 is improved. The presence or absence of the IC device 90 in the pocket 811 and the determination of the seating state can be performed almost simultaneously.

  The device supply unit 14 is the same as the device recovery unit 18, and thus the description thereof is omitted. The same effect as the device recovery unit 18 can be obtained for the device supply unit 14.

Second Embodiment
FIG. 6 is a cross-sectional view of a device recovery unit in a second embodiment of the electronic component inspection device of the present invention.

  Hereinafter, although 2nd Embodiment is described, it demonstrates focusing on difference with 1st Embodiment mentioned above, and the same matter abbreviate | omits the description.

  As shown in FIG. 6, the inspection apparatus 1 of the second embodiment has a cylinder 110 as a vibration applying unit that vibrates the device recovery unit 18. The cylinder 110 is disposed in the vicinity of the disposition plate 181 of the device recovery unit 18, that is, at a position where the disposition plate 181 can be struck by the piston rod 111 of the cylinder 110. Further, the drive of the cylinder 110 is controlled by the control unit 80.

  In the inspection apparatus 1, when the seating state of the IC device 90 is determined to be defective by the determination unit 803 of the control unit 80, the cylinder 110 is driven to vibrate the arrangement plate 181 of the device recovery unit 18. Thereby, it is expected that the seating state of the IC device 90 will be in a good state.

  Moreover, as a vibration provision part, not only cylinder 110 but each actuator, such as a solenoid, a piezoelectric motor which has a piezoelectric element, a vibration motor, etc. are mentioned, for example.

  The device supply unit 14 is the same as the device recovery unit 18, and thus the description thereof is omitted.

  According to the second embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

Third Embodiment
FIG. 7 is a cross-sectional view of a device recovery unit in a third embodiment of the electronic component inspection device of the present invention.

  Hereinafter, although 3rd Embodiment is described, it demonstrates focusing on difference with 1st Embodiment mentioned above, and the same matter abbreviate | omits the description.

  As shown in FIG. 7, in the inspection apparatus 1 according to the third embodiment, the air (fluid) flowing through the pipe 171 between the pressure sensor 411 and the pump 131 in the configuration shown in the middle of the pipe 171. A valve 121 is provided to adjust the flow rate. Similarly, in the middle of the tube 172, in the illustrated configuration, a valve 122 for adjusting the flow rate of air flowing through the tube 172 is provided between the pressure sensor 412 and the pump 131 in the illustrated configuration. The valves 121 and 122 are not particularly limited as long as they can adjust the flow rate of air, and examples thereof include throttle valves and the like.

  Thus, when the capacity of the pump 131 is low, suction of air by the pump 131 can be stably performed by reducing the flow rate of air by the valves 121 and 122.

  The device supply unit 14 is the same as the device recovery unit 18, and thus the description thereof is omitted.

  According to the third embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

Fourth Embodiment
FIG. 8 is a cross-sectional view of a device recovery unit in a fourth embodiment of the electronic component inspection device of the present invention.

  Hereinafter, although 4th Embodiment is described, it demonstrates focusing on difference with 1st Embodiment mentioned above, and the same matter abbreviate | omits the description.

  As shown in FIG. 8, in the device recovery unit 18 of the inspection apparatus 1 of the fourth embodiment, the placement plate 181 includes a plurality of (two in the illustrated configuration) pockets 811 and a plurality (two in the illustrated configuration) The first flow channel 812 is provided, but the device recovery unit main body 182 is provided with one second flow channel (flow channel) 821.

  Further, the second flow path 821 extends in the direction in which the two first flow paths 812 are aligned (the left-right direction in FIG. 8), and the direction in which the two first flow paths 812 are aligned. It is formed to be long. And each 1st flow path 812 and the 2nd flow path 821 are connected. That is, each pocket 811 is in communication with the second flow passage 821 via the corresponding first flow passage 812.

  Thus, although the presence or absence of the IC device 90 in each of the pockets 811 of the placement plate 181 can not be determined, the IC device 90 is not disposed in any of the pockets 811 or the seating state is defective. It is possible to determine that the IC device 90 is disposed in all the pockets 811 and that the seating condition is good.

  When it is detected that the IC device 90 is not arranged in any of the pockets 811, for example, the worker may visually check that the IC device 90 is not arranged or the seating state is poor. 811 is found, the IC device 90 is manually placed in a good sitting condition, and then the input unit 61 is operated to activate the inspection apparatus 1.

  In the inspection apparatus 1, one pressure sensor or the like may be provided for the two pockets 811, and the structure can be simplified.

  The device supply unit 14 is the same as the device recovery unit 18, and thus the description thereof is omitted.

  According to the fourth embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

Fifth Embodiment
FIG. 9 and FIG. 10 are cross-sectional views showing a part of the device recovery unit and the electronic component in the fifth embodiment of the electronic component inspection device of the present invention, respectively.

  Hereinafter, although 5th Embodiment is described, it demonstrates focusing on difference with 1st Embodiment mentioned above, and the same matter abbreviate | omits the description. The fifth embodiment is characterized in each pocket 811 of the device recovery unit 18, but each pocket 811 is the same, so in the following, one pocket 811 will be representatively illustrated and described.

  As shown in FIG. 9, in the device recovery unit 18 of the inspection apparatus 1 of the fifth embodiment, a plurality of recessed portions 814 into which the plurality of terminal portions 901 of the IC device 90 are inserted in the bottom surface 8111 of the pocket 811 of the disposition plate 181. Is provided. The shape of the recess 814 may be any shape as long as the terminal portion 901 can be inserted, and the number of the recesses 814 may be the same as or different from the number of the terminal portions 901. That is, it is sufficient that the bottom surface of the IC device 90 can function as a lid of the opening 813 of the first flow passage 812.

  Accordingly, when the IC device 90 is disposed in the pocket 811 of the placement plate 181 in a favorable state of being seated, the terminal portion 901 of the IC device 90 is inserted into the recess 814. This can prevent a gap from occurring between the placement plate 181 and the IC device 90, and can close the opening 813 of the first flow passage 812.

  Further, instead of the above configuration, the portion of the pocket 811 of the disposition plate 181 in contact with the IC device 90 may be made of an elastic member.

  Thus, when the IC device 90 is disposed in the pocket 811 of the placement plate 181 in a favorable sitting state, the elastic member is elastically deformed in accordance with the shape of the terminal portion 901 of the IC device 90. This can prevent a gap from occurring between the placement plate 181 and the IC device 90, and can close the opening 813 of the first flow passage 812.

  The device supply unit 14 is the same as the device recovery unit 18, and thus the description thereof is omitted.

  According to the fifth embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

Sixth Embodiment
FIG. 11 is a cross-sectional view showing a part of the device recovery unit and the electronic component in the sixth embodiment of the electronic component inspection device of the present invention.

  The sixth embodiment will be described below, but differences from the first embodiment described above will be mainly described, and the same matters will not be described. The sixth embodiment is characterized in each pocket 811 of the device recovery unit 18, but each pocket 811 is the same. Therefore, in the following, one pocket 811 will be representatively illustrated and described.

  As shown in FIG. 11, in the inspection apparatus 1 of the sixth embodiment, the width of the bottom surface 8111 of the pocket 811 of the placement plate 181 is made narrower than the width of the IC device 90, and each side surface 8112 of the pocket 811 is inclined. Make it

  As a result, when the IC device 90 is disposed in the pocket 811 of the placement plate 181 in a well-seated state, the IC device 90 contacts the side surfaces 8112 of the pocket 811, thereby the first flow path 812. Opening 813 can be closed.

  The device supply unit 14 is the same as the device recovery unit 18, and thus the description thereof is omitted.

  According to the sixth embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

Seventh Embodiment
Hereinafter, the seventh embodiment will be described, but differences from the first embodiment described above will be mainly described, and the description of the same matters will be omitted.

  In the inspection apparatus 1 of the seventh embodiment, each of the pressure sensors 411 and 412 has a filter so that dust and dirt can be prevented from entering the pressure sensors 411 and 412. It has become.

  Further, in the inspection apparatus 1, the device recovery unit 18 determines (detects) the state in which the filter is clogged in addition to the presence or absence of the IC device 90 on the device recovery unit 18 and the seating state of the IC device 90. Is configured to be possible.

  That is, based on the detection results of the pressure sensors 411 and 412, the determination unit 803 of the control unit 80 determines the presence or absence of the IC device 90 in each pocket 811, the seating state of the IC device 90, and whether the filter is clogged Determine. Hereinafter, the principle of determining the clogged state of the filter will be described.

  The pressure of the air detected by the pressure sensors 411 and 412 differs between when the filter is clogged and when the filter is not clogged and the seating state of the IC device 90 in the pocket 811 is poor. That is, the pressure of the air detected by the pressure sensors 411 and 412 when the filter is not clogged and the seating state of the IC device 90 in the pocket 811 is poor is detected by the pressure sensors 411 and 412 when the filter is clogged It is higher than the pressure of air.

  Therefore, in the inspection apparatus 1, in addition to the above-described first threshold and second threshold, a third threshold smaller than the second threshold is set.

  Then, the third threshold is compared with the pressure of air detected by the pressure sensors 411 and 412, and if the pressure of the air is less than the second threshold and greater than the third threshold, the filter is clogged. It is determined that When the pressure of the air is equal to or less than the third threshold, it is determined that the seating state of the IC device 90 in the pocket 811 is good. The determination result is displayed on the display unit 62.

  As a result, when the filter is clogged, the operator can appropriately cope with it, such as replacing the filter or cleaning it.

  The device supply unit 14 is the same as the device recovery unit 18, and thus the description thereof is omitted.

  According to the seventh embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

  As mentioned above, although the electronic component conveyance apparatus and the electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part has the same function. It can be replaced with any configuration. Also, any other component may be added.

  The present invention may be a combination of any two or more configurations (features) of the above-described embodiments.

  In the above embodiment, the first ports 151A and 151B and the second ports 152A and 152B are configured to be connected only when the IC device 90 is located at the electronic component arrangement position. However, the present invention is not limited to this, and for example, the pump 131 may always be connected to each first flow passage 812 and each second flow passage 821. In this case, it is possible to prevent the IC device 90 from jumping out of each pocket 811 by suctioning air by the pump 131 while the device recovery unit 18 is moving.

1 ... Inspection device (Electronic component inspection device)
11: Base 11A: first tray conveyance mechanism 11B: second tray conveyance mechanism 12: temperature adjustment unit (soak plate)
13: First device transfer head 14: Device supply unit (supply shuttle)
141: placement plate 142: device supply unit main body 15: third tray conveyance mechanism 16: inspection unit 17: second device conveyance head 175: hand unit 176: suction nozzle 18: device collection Department (collection shuttle)
181: Arrangement plate 182: Device recovery unit main body 811: Pocket (electronic component arrangement unit)
8111 ...... bottom 8112 ...... side 812 ...... first flow path 813 ...... opening 814 ...... recess 821 ...... second flow path 19 ...... collecting tray 20 ...... third device carrying head 21 ...... Sixth tray conveyance mechanism 22A: fourth tray conveyance mechanism 22B: fifth tray conveyance mechanism 411, 412: pressure sensor 6: operation unit 61: input unit 62: display unit 80: control Section 801: Memory section 803: Discrimination section 90: IC device 901: Terminal section 110: Cylinder 111: Piston rod 121, 122: Valve 131: Pump 151A, 151B: First port 152A , 152 B: second port 1511: cylindrical portion 1512: side hole 1513: connection portion 171, 172: tube 200: tray 200: tray A1: tray Supply area A2: Device supply area (supply area)
A3 ... inspection area A4 ... device collection area (collection area)
A5: Tray removal area R1: First room R2: Second room R3: Third room

Claims (11)

An electronic component transporting unit which an electronic component is moved to the electronic component placement positions that will be arranged to convey the electronic component,
And a fluid suction unit for suctioning a fluid;
The electronic component transfer unit has a first port through which the fluid flows,
A second port connected to the fluid suction portion and in which the fluid flows is disposed at the electronic component placement position,
The first port and the second port are separated when the electronic component transport unit is not located at the electronic component disposition position,
When the electronic component transfer unit is located at the electronic component disposition position, the first port and the second port are in contact with each other , and the fluid of the first port and the second port flows. An electronic component conveying apparatus that circulates and sucks the fluid by the fluid suction unit. Electronic component conveying apparatus according to claim 1, further comprising a detector for detecting the flow amount of the pressure or the fluid before Symbol fluid.   The said detection part is an electronic component conveying apparatus of Claim 2 which has a filter.   The electronic component conveying apparatus according to claim 3, wherein a clogged state of the filter is detected based on a result of detecting a pressure or a flow rate of the fluid. The electronic component conveyance unit includes an electronic component placement unit in which the electronic component is disposed,
The electronic parts conveying apparatus according to any one of claims 1 to 4 , wherein the electronic parts arranging part is provided with a plurality of concave parts into which a plurality of terminal parts of the electronic parts are inserted. The electronic component conveyance unit includes an electronic component placement unit in which the electronic component is disposed,
The electronic parts conveying apparatus according to any one of claims 1 to 5 , wherein an elastic member is provided in the electronic parts arranging portion. The electronic component transfer unit includes a plurality of electronic component placement units in which a plurality of the electronic components are disposed;
And a channel communicating with the plurality of electronic component placement parts,
The electronic component transfer apparatus according to any one of claims 1 to 6 , wherein the fluid suction unit sucks the fluid from the flow path when the electronic component transfer unit is positioned at the electronic component arrangement position. The electronic component conveying apparatus according to any one of claims 1 to 7 , further comprising a valve that adjusts the flow rate of the fluid. Based on the result of detecting the pressure or flow rate of the fluid, it is determined whether or not the electronic component is disposed in the electronic component transport unit , or whether the seating condition of the electronic component on the electronic component transport unit is good or not The electronic component conveying apparatus according to any one of claims 1 to 8 . The electronic component conveying apparatus according to claim 9 , further comprising: a vibration applying unit that vibrates the electronic component conveying unit when the seating state of the electronic component is determined to be defective. An electronic component transporting unit which an electronic component is moved to the electronic component placement positions that will be arranged to convey the electronic component,
A fluid suction unit for suctioning fluid;
It includes a checking unit to check the previous Symbol electronic parts, the,
The electronic component transfer unit has a first port through which the fluid flows,
A second port connected to the fluid suction portion and in which the fluid flows is disposed at the electronic component placement position,
The first port and the second port are separated when the electronic component transport unit is not located at the electronic component disposition position,
When the electronic component transfer unit is located at the electronic component disposition position, the first port and the second port are in contact with each other , and the fluid of the first port and the second port flows. An electronic component inspection device which circulates and sucks the fluid by the fluid suction unit.

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