JP2016148573A - Electronic component carrier device and electronic component inspection apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component carrier device capable of easily determining existence/absence of an electronic component on an electronic component carrier while satisfactorily maintaining the seating state of the electronic component on the electronic component carrier with a simple configuration, and to provide an electronic component inspection apparatus.SOLUTION: The electronic component carrier device includes: an electronic component carrier capable of carrying an electronic component placed thereon; and a fluid suction part capable of sucking a fluid. The electronic component carrier is arranged movable to an electronic component placement position where the electronic component is placed. When the electronic component carrier is positioned at the electronic component placement position, the fluid suction part sucks the fluid and determines whether the electronic component is placed on the electronic component carrier or not on the basis of the detection result of the pressure or the flow rate of the fluid.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device has been known. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device.

  The electronic component conveying apparatus heats or cools the IC device in advance to adjust the IC device to a temperature suitable for inspection, and conveys the IC device whose temperature is adjusted by the soak plate to the vicinity of the inspection unit. A supply shuttle, a first device transport head for transporting the IC device between the tray on which the IC device is disposed and the soak plate, and transporting the IC device between the soak plate and the supply shuttle, and the IC after the inspection A recovery shuttle that transports the device, a second device transport head that transports the IC device between the supply shuttle and the inspection unit, and an IC device between the inspection unit and the recovery shuttle, and the recovery shuttle There is a third device transport head that transports the IC device to and from the tray where the IC device is placed. To have. The supply shuttle and the recovery shuttle each have a plurality of pockets in which IC devices are placed.

  Patent Document 1 discloses an electronic component testing apparatus that can determine whether or not an IC device remains on a socket.

  The electronic component testing apparatus includes an imaging unit that images a socket, a storage unit that stores the reference image data of the socket in a state in which the IC device is not mounted and is acquired by imaging by the imaging unit, and the IC device is in the socket. And residual determination means for determining whether or not it remains. In this electronic component testing apparatus, the socket is imaged by the imaging means, the inspection image data of the socket is acquired, the residual determination means is compared with the inspection image data and the reference image data, and the IC is connected to the socket. Determine whether the device remains.

International Publication No. 2007/17953

  In the conventional electronic component transport apparatus, after the inspection of the IC device is completed, the IC device is transported to the recovery shuttle by the second device transport head and is placed in the pocket of the recovery shuttle. When the seating state is poor, the IC device may jump out of the pocket due to the movement of the recovery shuttle. As a result, the non-defective IC device may be destroyed, and the driving of the electronic component transport device is stopped, which causes a problem that the time efficiency of the inspection is lowered.

  Further, an apparatus for determining whether or not an IC device remains on a socket in the electronic component test apparatus described in Patent Document 1 is used to determine whether or not an IC device remains in a pocket of a recovery shuttle in the electronic component transport apparatus. When applied to an apparatus for determining whether or not, there is a problem that the apparatus becomes large in both hardware and software aspects, that is, the apparatus becomes large and the configuration and control of the apparatus become complicated.

  An object of the present invention is to provide an electronic device that can easily determine the presence / absence of an electronic component on the electronic component transport unit with a simple configuration and can improve the seating state of the electronic component on the electronic component transport unit. The object is to provide a component conveying device and an electronic component inspection device.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
An electronic component transport apparatus according to the present invention, an electronic component is disposed, and an electronic component transport unit capable of transporting the electronic component;
A fluid suction part capable of sucking fluid,
The electronic component transport unit is movable to an electronic component placement position where the electronic component is placed,
When the electronic component transport unit is located at the electronic component placement position, the fluid is sucked by the fluid suction unit,
Based on the result of detecting the pressure or flow rate of the fluid, it is determined whether or not the electronic component is arranged in the electronic component transport unit.

  Thereby, according to various situations, the presence or absence of an electronic component on the electronic component transport unit can be easily and accurately determined with a simple configuration. For example, the presence or absence of a transparent electronic component that cannot be detected by an optical sensor can be determined.

  Moreover, the electronic component arrange | positioned at an electronic component conveyance part can be attracted | sucked by a fluid suction part. As a result, the electronic component can be arranged in the electronic component transport unit, and the seating state of the electronic component can be made good. It is possible to prevent the electronic component from jumping out of the electronic component transport unit.

[Application Example 2]
In the electronic component conveying apparatus of the present invention, it is preferable to include a detection unit capable of detecting at least one of the pressure of the fluid and the flow rate of the fluid.

  Thereby, at least one of the pressure of the fluid and the flow rate of the fluid can be accurately detected, and based on the detection result, it is determined whether or not the electronic component is arranged in the electronic component transport unit. Can do.

[Application Example 3]
In the electronic component transport device of the present invention, it is preferable that the detection unit has a filter.
Thereby, it can prevent that a dust, dust, etc. enter into a detection part.

[Application Example 4]
In the electronic component conveying apparatus of the present invention, it is preferable to detect a state in which the filter is clogged based on a result of detecting the pressure or flow rate of the fluid.

  As a result, when the filter is clogged, it can be dealt with appropriately, such as replacing the filter or cleaning the filter.

[Application Example 5]
In the electronic component transport apparatus of the present invention, a first port provided in the electronic component transport unit and capable of circulating the fluid;
A second port connected to the fluid suction part,
It is preferable that the first port and the second port are in contact with each other so that the fluid can flow when the electronic component transport unit is located at the electronic component placement position.

  Thereby, compared with the case where the tube etc. for attracting | sucking a fluid are always connected to the electronic component conveyance part, the said tube etc. do not become obstructive during the movement of an electronic component conveyance part.

[Application Example 6]
In the electronic component transport apparatus of the present invention, the electronic component transport unit includes an electronic component placement unit on which the electronic component is placed,
It is preferable that the electronic component placement portion is provided with a plurality of recesses into which a plurality of terminal portions of the electronic component are inserted.

  As a result, when the electronic component is placed in a good seated state in the electronic component transport portion, the terminal portion of the electronic component is inserted into the recess, and thereby, a gap is formed between the electronic component transport portion and the electronic component. Can be prevented.

[Application Example 7]
In the electronic component transport apparatus of the present invention, the electronic component transport unit includes an electronic component placement unit on which the electronic component is placed,
It is preferable that an elastic member is provided in the electronic component placement portion.

  When the electronic component has a plurality of terminal portions, this allows the elastic member to be elastically deformed according to the shape of the terminal portion of the electronic component when the electronic component is placed in a good seating state in the electronic component conveying portion. Thus, it is possible to prevent a gap from being generated between the electronic component transport unit and the electronic component.

[Application Example 8]
In the electronic component transport device of the present invention, the electronic component transport unit includes a plurality of electronic component placement units in which the plurality of electronic components are disposed,
A flow path communicating with the plurality of electronic component placement portions,
It is preferable that the fluid is sucked from the flow path by the fluid suction unit when the electronic component transport unit is located at the electronic component placement position.

  Thereby, one detection part etc. should just be provided with respect to several electronic component arrangement | positioning part, and a structure can be simplified.

[Application Example 9]
In the electronic component conveying apparatus of the present invention, it is preferable to have a valve for adjusting the flow rate of the fluid.

  As a result, in the case where a plurality of electronic components are arranged in the electronic component transport unit, when the capacity of the fluid suction unit is low, the flow rate of the fluid by the fluid suction unit is reduced by reducing the flow rate of the fluid. Suction can be performed stably.

[Application Example 10]
In the electronic component transport apparatus according to the present invention, it is preferable to determine whether the electronic component is seated on the electronic component transport unit based on the result of detecting the pressure or flow rate of the fluid.

  As a result, it is possible to accurately cope with an electronic component having a poor seating state, for example, by changing the seating state to a good state.

[Application Example 11]
In the electronic component conveying apparatus of the present invention, it is preferable that the electronic component conveying device includes a vibration applying unit that vibrates the electronic component conveying unit when the seating state of the electronic component is determined to be defective.

  Thereby, when there exists an electronic component with a poor seating state, the seating state of the electronic component can be corrected to a good state by vibrating the electronic component transport unit with the vibration applying unit.

[Application Example 12]
An electronic component inspection apparatus according to the present invention, an electronic component is disposed, and an electronic component transport unit capable of transporting the electronic component;
A fluid suction part capable of sucking fluid,
An inspection unit for inspecting the electronic component,
The electronic component transport unit is movable to an electronic component placement position where the electronic component is placed,
When the electronic component transport unit is located at the electronic component placement position, the fluid is sucked by the fluid suction unit,
Based on the result of detecting the pressure or flow rate of the fluid, it is determined whether or not the electronic component is arranged in the electronic component transport unit.

  Thereby, according to various situations, the presence or absence of an electronic component on the electronic component transport unit can be easily and accurately determined with a simple configuration. For example, the presence or absence of a transparent electronic component that cannot be detected by an optical sensor can be determined.

  Moreover, the electronic component arrange | positioned at an electronic component conveyance part can be attracted | sucked by a fluid suction part. As a result, the electronic component can be arranged in the electronic component transport unit, and the seating state of the electronic component can be made good. It is possible to prevent the electronic component from jumping out of the electronic component transport unit.

It is a schematic plan view which shows 1st Embodiment of the electronic component inspection apparatus of this invention. It is a block diagram of the electronic component inspection apparatus shown in FIG. It is sectional drawing of the device collection | recovery part of the electronic component inspection apparatus shown in FIG. It is sectional drawing of the device collection | recovery part of the electronic component inspection apparatus shown in FIG. It is sectional drawing of the device collection | recovery part of the electronic component inspection apparatus shown in FIG. It is sectional drawing of the device collection | recovery part in 2nd Embodiment of the electronic component inspection apparatus of this invention. It is sectional drawing of the device collection | recovery part in 3rd Embodiment of the electronic component inspection apparatus of this invention. It is sectional drawing of the device collection | recovery part in 4th Embodiment of the electronic component inspection apparatus of this invention. It is sectional drawing which shows a part of device collection part and electronic component in 5th Embodiment of the electronic component inspection apparatus of this invention. It is sectional drawing which shows a part of device collection part and electronic component in 5th Embodiment of the electronic component inspection apparatus of this invention. It is sectional drawing which shows a part of device collection part and electronic component in 6th Embodiment of the electronic component inspection apparatus of this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. 3 to 5 are cross-sectional views of the device recovery unit of the electronic component inspection apparatus shown in FIG.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. The direction of the arrow of each axis of the X axis, the Y axis, and the Z axis is referred to as a plus side, and the direction opposite to the arrow is referred to as a minus side. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  Hereinafter, for convenience of explanation, the upper side in FIGS. 3 to 5 is referred to as “upper” or “upper”, the lower side is referred to as “lower” or “lower”, the right side is referred to as “right”, and the left side is referred to as “left”. (The same applies to FIGS. 6 to 11).

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Each of these regions is partitioned from each other by a wall portion, a shutter, or the like (not shown). The supply area A2 is a first chamber R1 defined by walls and shutters, and the inspection area A3 is a second chamber R2 defined by walls and shutters. In addition, the collection area A4 is a third chamber R3 defined by walls and shutters. The first chamber R1 (supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (collection region A4) are each configured to ensure airtightness and heat insulation. ing. Thereby, each of the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible. The interiors of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively.

  The IC device 90 is inspected in the intermediate inspection area A3 through the respective areas in order from the tray supply area A1 to the tray removal area A5. As described above, the inspection apparatus 1 includes the electronic component transport apparatus that transports the IC device 90 in each region and has the control unit 80, the inspection unit 16 that performs inspection in the inspection region A3, and the inspection control unit (not shown). It has become. In the inspection apparatus 1, an electronic component transport apparatus is configured by a configuration excluding the inspection unit 16 and the inspection control unit.

  The tray supply area A1 is an area to which a tray 200 in which a plurality of IC devices 90 in an uninspected state are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3. A first tray transport mechanism 11A and a second tray transport mechanism 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  The supply area A2 is provided with a temperature adjustment unit (soak plate) 12, which is an arrangement unit in which the IC device 90 is arranged, a first device transfer head (transfer unit) 13, and a third tray transfer mechanism 15. ing.

  The temperature adjustment unit 12 is an apparatus that heats or cools the plurality of IC devices 90 to adjust (control) the IC devices 90 to a temperature suitable for inspection. That is, the temperature adjustment unit 12 is a temperature control member (member) that can arrange the IC device 90 and can perform both heating and cooling of the IC device 90. In the configuration shown in FIG. 1, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the first tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The first device transport head 13 is supported so as to be movable in the supply region A2. Thereby, the first device transport head 13 transports the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, the temperature adjustment unit 12, and a device supply unit 14 to be described later. And the IC device 90 can be transported between them. The first device transport head 13 has a plurality of gripping portions (not shown) that grip the IC device 90. Each gripping portion includes a suction nozzle and sucks the IC device 90. Hold it.

  The third tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state where all the IC devices 90 are removed in the X direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, which is an electronic component transport unit that transports the IC device 90, an inspection unit 16, a second device transport head (contact portion) 17, and an IC device A device collection unit (collection shuttle) 18 which is an electronic component conveyance unit for conveying 90 is provided.

  The device supply unit 14 includes an arrangement plate (electronic component arrangement plate) 141 on which the IC device 90 is arranged, and a device supply unit main body (conveyance unit) 142 that can move (move) in the X direction. The arrangement plate 141 is detachably installed on the device supply unit main body 142. The device supply unit 14 is a device that transports the temperature-adjusted (temperature-controlled) IC device 90 to the vicinity of the inspection unit 16, and supports the supply region A2 and the inspection region A3 so as to be movable along the X direction. Has been. In the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. . In the device supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, that is, a holding unit that holds the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in a storage unit of an inspection control unit provided in a tester (not shown) connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  The second device transport head 17 is supported so as to be movable in the inspection area A3. Accordingly, the second device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply region A2 onto the inspection unit 16. When inspecting the IC device 90, the second device transport head 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16. Thereby, as described above, the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected.

  As shown in FIG. 3, the second device transport head 17 has a plurality of (two in the illustrated configuration) hand units 175 as gripping portions that grip the IC device 90. Since the configuration of each hand unit 175 is the same, one hand unit 175 will be typically described below. The hand unit 175 includes a suction nozzle 176 and grips the IC device 90 by suction. That is, the hand unit 175 drives the first pump (not shown) with the IC device 90 disposed at the tip of the suction nozzle 176 to suck air (fluid), and negative pressure is applied to the lumen of the suction nozzle 176. By setting the state, the IC device 90 is gripped (suction grip) by the tip of the suction nozzle 176. Further, the IC device 90 held by the suction nozzle 176 is released by driving a second pump (not shown) to supply air and releasing the negative pressure state of the lumen of the suction nozzle 176.

  Further, in each hand unit 175 of the second device transport head 17, like the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The device collection unit 18 includes an arrangement plate (electronic component arrangement plate) 181 on which the IC device 90 is arranged, and a device collection unit main body (conveyance unit) 182 that can move (move) in the X direction. The arrangement plate 181 is detachably installed on the device collection unit main body 182. The device collection unit 18 is a device that transports the IC device 90 that has been inspected by the inspection unit 16 to the collection region A4, and is supported so as to be movable along the X direction between the inspection region A3 and the collection region A4. Has been. In the configuration shown in FIG. 1, two device collection units 18 are arranged in the Y direction, like the device supply unit 14, and the IC device 90 on the inspection unit 16 is connected to any one of the device collection units 18. Transported and placed. This transport is performed by the second device transport head 17.

  The collection area A4 is an area where the IC device 90 that has been inspected is collected. In the collection area A4, a collection tray 19, a third device transport head (transport section) 20, and a sixth tray transport mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 1, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The third device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the third device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. The third device transport head 20 has a plurality of gripping portions (not shown) that grip the IC device 90, and each gripping portion includes a suction nozzle and sucks the IC device 90. Grab.

  The sixth tray transport mechanism 21 is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, a fourth tray transport mechanism 22A and a fifth tray transport mechanism 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism for transporting an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The test control unit of the tester, for example, inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a storage unit (not shown).

  As shown in FIG. 2, the inspection apparatus 1 includes a pump (fluid suction part) 131 that sucks air (fluid), pressure sensors (detection parts) 411 and 412 that detect the pressure of air (fluid), And an operation unit 6 for performing each operation of the inspection apparatus 1. In addition, the control unit 80 includes a storage unit 801 that stores information and a determination unit 803 that performs each determination (discrimination). For example, the control unit 80 includes a first tray transport mechanism 11A, a second tray transport mechanism 11B, and the like. The temperature adjustment unit 12, the first device transport head 13, the device supply unit 14, the third tray transport mechanism 15, the inspection unit 16, the second device transport head 17, and the device recovery unit 18. Control the drive of each part such as the third device transport head 20, the sixth tray transport mechanism 21, the fourth tray transport mechanism 22A, the fifth tray transport mechanism 22B, the pump 131, and the display unit 62. To do. The detection results of the pressure sensors 411 and 412 are input to the control unit 80.

  The operation unit 6 includes an input unit 61 that performs each input and a display unit 62 that displays an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. For example, the operator (operator) operates the operation unit 6 by operating the input unit 61, moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking). In the following, this operation is also referred to as “pressing the operation button”.

  Note that some or all of the operation buttons displayed on the display unit 62 may be provided as mechanical operation buttons such as push buttons.

Further, the operation unit 6 is not limited to the one having the above-described configuration, and examples thereof include a device such as a touch panel that can input and display an image.
The display unit 62 of the operation unit 6 constitutes a notification unit.

  In this inspection apparatus 1, as described below, the device collection unit 18 includes the presence or absence of the IC device 90 on the device collection unit 18, that is, whether or not the IC device 90 is disposed in the device collection unit 18, and the IC device. 90 seating states can be discriminated (detected). The same applies to the device supply unit 14. Hereinafter, the configuration thereof will be described in detail. Since the configurations of the device supply unit 14 and the device collection unit 18 are the same, the device collection unit 18 will be typically described below.

  As shown in FIG. 3, the device collection unit 18 includes an arrangement plate 181 and a device collection unit main body 182, and is movably installed on the base 11. The device collection unit 18 includes an electronic component arrangement position (first position) where the IC device 90 that has been inspected by the inspection unit 16 is arranged in the device collection unit 18, and a device collection unit in the collection area A4. The IC device 90 can be moved from the second position where the IC device 90 is taken out from the second position.

  Further, on the upper surface of the arrangement plate 181, that is, the surface of the arrangement plate 181 opposite to the device recovery unit main body 182, pockets (electronic component arrangement portions) 811 that are a plurality of recesses for accommodating (arranging) the IC devices 90 are provided. Is provided. Each IC device 90 is accommodated in each pocket 811, thereby being arranged on the arrangement plate 181.

  The shape, size (dimension), and arrangement (position) of each pocket 811 are set based on the shape and size (dimension) of the IC device 90 to be inspected, the arrangement position of the IC device 90 in the inspection unit 16, and the like. Yes.

  In the present embodiment, when viewed from the upper side in FIG. 3 (Z direction in FIG. 1), the outer shape of the IC device 90 is a square, and therefore the outer shape of the pocket 811 is the same as the outer shape of the IC device 90. It has a corresponding shape, that is, a quadrangle.

  Further, the number of pockets 811 is not particularly limited, but in the present embodiment, two cases will be illustrated and described as an example.

  In addition, the arrangement plate 181 is provided with a first flow path 812 that communicates. The first flow path 812 communicates with the pocket 811 and opens to the upper surface and the lower surface of the arrangement plate 181. In addition, the number of the 1st flow paths 812 is equal to the number of the pockets 811, and is two in this embodiment.

  The device recovery unit main body 182 is provided with a second flow path 821 that communicates. The second flow channel 821 communicates with the first flow channel 812 and opens to the upper surface and side surfaces of the device recovery unit main body 182. In addition, the number of the 2nd flow paths 821 is equal to the number of the pockets 811 and the 1st flow paths 812, and is two in this embodiment.

  The base 11 is provided with two second ports 152A and 152B through which air (fluid) can flow.

  Further, pipe bodies 171 and 172 through which air (fluid) flows are connected to the second ports 152A and 152B, respectively. The pipe body 171 and the pipe body 172 are connected to a pump 131 that sucks air after joining together. As will be described later, the pump 131 can suck air from the first flow paths 812 and the second flow paths 821. It should be noted that each first flow path 812, each second flow path 821, the lumen of first ports 151A and 151B, which will be described later, the lumen of second ports 152A and 152B, and the tube 171 , 172 and the lumen of the tubular body after merging thereof constitute a flow path through which air flows.

  Further, pressure sensors 411 and 412 for detecting the pressure of air (fluid) flowing through the lumens (flow paths) of the pipe bodies 171 and 172 are provided in the middle of the pipe bodies 171 and 172, respectively. Yes.

  Further, first ports 151A and 151B that are in communication with the respective second flow paths 821 and through which air (fluid) can flow are attached to the lower end of the device recovery unit main body 182. Each of the first ports 151A and 151B includes a cylindrical portion 1511 having a bottomed cylindrical shape, and a connecting portion 1513 provided on a side surface of the cylindrical portion 1511 and having a cylindrical shape. The connection portion 1513 is disposed at a position of a side hole 1512 provided in the side surface of the cylindrical portion 1511, and the lumen of the connection portion 1513 communicates with the lumen of the cylindrical portion 1511 through the side hole 1512. Yes. Moreover, the connection part 1513 is comprised with the elastic member.

  As shown in FIG. 3, when the device collection unit 18 is located at the electronic component placement position (first position) where the operation of placing the IC device 90 in the device collection unit 18 is performed, the first port 151A 151B and the second ports 152A and 152B are connected (air abuts so that air can flow), and the lumen of the first port 151A and the lumen of 151B and the lumen of the second port 152A and the inside of 152B Communication with the cavity. That is, the pump 131 is connected to each first flow path 812 and each second flow path 821. In this case, since the connection portion 1513 is made of an elastic member, the connection portion 1513 is elastically deformed to prevent a gap from being generated between the first ports 151A and 151B and the second ports 152A and 152B. can do. In addition, since the connection portion 1513 is formed of an elastic member, even when the first ports 151A and 151B and the second ports 152A and 152B are too close, the connection portion 1513 is elastically deformed. be able to.

  As shown in FIG. 4, when the device collection unit 18 is separated from the electronic component placement position, the first ports 151A and 151B and the second ports 152A and 152B are separated from each other, and the first ports 151A and 151B are separated from each other. The connection (contact) with the second ports 152A and 152B is released. By providing the first ports 151A and 151B and the second ports 152A and 152B, a plurality of tubes and the like for connecting the first flow paths 812 and the second flow paths 821 to the pump 131 can be provided. There is no need to arrange the tubes, whereby the structure can be simplified, and the tubes and the like do not get in the way during the movement of the device collection unit 18.

  Next, an operation for determining the presence / absence of the IC device 90 on the device collection unit 18 and the seating state of the IC device 90 will be described.

  First, as shown in FIG. 3, the device recovery unit 18 is located at the electronic component placement position, and the inspection apparatus 1 uses the second device transport head 17 to transfer each IC device 90 after inspection from the inspection unit 16. It is conveyed onto each pocket 811 of the device collection unit 18.

  Then, the second device transport head 17 is connected to each IC device while sucking air from the first flow paths 812 and the second flow paths 821 through the tubular bodies 171 and 172 by the pump 131. Release 90. That is, air is sucked by the pump 131 when the IC device 90 is placed in each pocket 811. As a result, the IC device 90 disposed in each pocket 811 can be sucked, whereby the IC device 90 can be disposed in each pocket 811 and the IC device 90 can be satisfactorily seated. .

  In addition, after the operation of placing the IC device 90 in each pocket 811 and before the device collection unit 18 moves, the first flow path 812 and the first flow path 812 and the While sucking air from each second flow path 821, the pressure of air flowing through each tubular body 171 and 172 is detected by each pressure sensor 411 and 412.

  Based on the detection results of the pressure sensors 411 and 412, the determination unit 803 of the control unit 80 determines whether or not the IC device 90 is present in each pocket 811, that is, whether or not the IC device 90 is disposed in the device collection unit 18. And the seating state of the IC device 90 are discriminated. Hereinafter, this principle and detailed configuration will be described. In the following, typically, the presence / absence of the IC device 90 in the pocket 811 and the seating state of the IC device 90 are determined based on the detection result of the pressure sensor 411. Will be described.

  First, the pressure of the air detected by the pressure sensor 411 differs between when the IC device 90 is disposed in the pocket 811 and when it is not disposed. That is, as shown in the left pocket 811 in FIG. 5, when the IC device 90 is arranged in the pocket 811, a part of the opening 813 on the pocket 811 side of the first flow path 812 or the Since the whole is closed, the pressure of the air detected by the pressure sensor 411 when the IC device 90 is not disposed in the pocket 811 is higher than the pressure of the air when the IC device 90 is disposed.

  Even when the IC device 90 is disposed in the pocket 811, as shown in the left pocket 811 in FIG. 5, the IC device 90 is satisfactorily seated in the pocket 811 and the right side in FIG. 5. As shown in the pocket 811, the air pressure detected by the pressure sensors 411, 412 is different from when the IC device 90 is floating, for example, when it is defective. That is, the air pressure detected by the pressure sensor 412 when the seating state of the IC device 90 in the pocket 811 is poor is higher than the air pressure detected by the pressure sensor 411 when it is good. When the seating state of the IC device 90 is good, the air pressure approaches the vacuum pressure.

  Therefore, in the inspection apparatus 1, a threshold value for each determination is set in advance, and the determination is performed by comparing the threshold value with the air pressure detected by the pressure sensors 411 and 412.

  Specifically, the IC device 90 is arranged in the pocket 811, and the seating state is good, the seating state is bad, and the IC device 90 is not arranged in the pocket 811. In order to determine the state, a first threshold and a second threshold smaller than the first threshold are set.

  Then, the first threshold value is compared with the air pressure detected by the pressure sensors 411 and 412. When the air pressure is larger than the first threshold value, the IC device 90 is disposed in the pocket 811. If the air pressure is equal to or lower than the first threshold value, it is determined that the IC device 90 is disposed in the pocket 811.

  When the air pressure is equal to or lower than the first threshold value, the second threshold value is compared with the air pressure. When the air pressure is larger than the second threshold value, the pocket 811 is compared. It is determined that the seating state of the IC device 90 is poor, and if the air pressure is equal to or lower than the second threshold, it is determined that the seating state of the IC device 90 in the pocket 811 is good.

  Note that the first threshold value and the second threshold value are experimentally obtained in advance and stored in the storage unit 801 of the control unit 80.

  Each discrimination result in each pocket 811 is displayed on the display unit 62. As a result, the operator has the IC device 90 in each pocket 811 when the IC device 90 is not disposed in the pocket 811 and when the IC device 90 is disposed in the pocket 811. Whether the seating state of 90 is bad or the seating state of the IC device 90 is good can be grasped.

  Further, in at least one of the pockets 811, when the IC device 90 is not disposed in the pocket 811 and when the IC device 90 is disposed in the pocket 811, the sitting state of the IC device 90 is poor. In the case of any one of the cases, the inspection apparatus 1 stops its operation. Then, for example, the operator manually arranges the IC device 90 in the appropriate pocket 811 so as to be in a good sitting state, and then operates the input unit 61 to operate the inspection apparatus 1.

  In addition, although the case where the pressure sensors 411 and 412 are used as the detection unit has been described above, the detection unit is not limited to the pressure sensors 411 and 412, for example, the air flowing through the lumens of the tubular bodies 171 and 172 A flow rate sensor for detecting the flow rate can be used.

  Further, for example, the detection unit may not be initially provided in the inspection apparatus 1 but may be configured to be attached separately later. That is, the detection unit may not be initially in the inspection apparatus 1 and may be configured to be able to determine based on the detection result after the detection unit is installed.

  The device supply unit 14 is the same as the device collection unit 18, and thus description thereof is omitted.

  As described above, according to the inspection apparatus 1, the IC device 90 arranged in the pocket 811 of the arrangement plate 181 can be sucked by sucking air with the pump 131. Thereby, the IC device 90 can be arranged in the pocket 811 of the arrangement plate 181, and the sitting state of the IC device 90 can be made favorable. Further, by making the sitting state of the IC device 90 good, it is possible to prevent the IC device 90 from jumping out of the pocket 811 of the arrangement plate 181 during the movement of the device collection unit 18.

  Further, according to various situations, the presence or absence of the IC device 90 in the pocket 811 of the placement plate 181 can be easily and accurately determined with a simple configuration, and the seating state of the IC device 90 can be determined. it can. For example, the presence / absence and seating state of a transparent IC device that cannot be detected by an optical sensor can be determined.

  Further, the IC device 90 is arranged in the pocket 811 of the arrangement plate 181 by one mechanism having the pump 131, the pressure sensors 411, 412 and the like, and the seating state of the IC device 90 is improved, The presence / absence of the IC device 90 and the sitting state in the pocket 811 can be determined almost simultaneously.

  Since the device supply unit 14 is the same as the device collection unit 18 and the description thereof is omitted, the device supply unit 14 can obtain the same effect as the device collection unit 18.

Second Embodiment
FIG. 6 is a cross-sectional view of a device collection unit in the second embodiment of the electronic component inspection apparatus of the present invention.

  Hereinafter, although the second embodiment will be described, the description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As illustrated in FIG. 6, the inspection apparatus 1 according to the second embodiment includes a cylinder 110 as a vibration applying unit that vibrates the device collection unit 18. The cylinder 110 is arranged in the vicinity of the arrangement plate 181 of the device recovery unit 18, that is, a position where the arrangement plate 181 can be hit by the piston rod 111 of the cylinder 110. The driving of the cylinder 110 is controlled by the control unit 80.

  In the inspection apparatus 1, when the determination unit 803 of the control unit 80 determines that the seating state of the IC device 90 is defective, the cylinder 110 is driven to vibrate the arrangement plate 181 of the device collection unit 18. Thereby, it is expected that the sitting state of the IC device 90 is in a good state.

  The vibration applying unit is not limited to the cylinder 110, and examples thereof include solenoids, piezoelectric motors having piezoelectric elements, actuators such as vibration motors, and the like.

  The device supply unit 14 is the same as the device collection unit 18, and thus description thereof is omitted.

  According to the second embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

<Third Embodiment>
FIG. 7 is a cross-sectional view of a device recovery unit in the third embodiment of the electronic component inspection apparatus of the present invention.

  Hereinafter, the third embodiment will be described, but the description will be focused on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As shown in FIG. 7, in the inspection apparatus 1 of the third embodiment, air (fluid) that flows through the tubular body 171 in the middle of the tubular body 171 and between the pressure sensor 411 and the pump 131 in the illustrated configuration. There is provided a valve 121 for adjusting the flow rate. Similarly, a valve 122 that adjusts the flow rate of air flowing through the pipe body 172 is provided between the pressure sensor 412 and the pump 131 in the illustrated configuration in the middle of the pipe body 172. The valves 121 and 122 are not particularly limited as long as the flow rate of air can be adjusted, and examples thereof include throttle valves.

  Thus, when the capacity of the pump 131 is low, the air flow by the valves 121 and 122 is reduced, so that the air can be stably sucked by the pump 131.

  The device supply unit 14 is the same as the device collection unit 18, and thus description thereof is omitted.

  According to the third embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
FIG. 8 is a cross-sectional view of a device recovery portion in the fourth embodiment of the electronic component inspection apparatus of the present invention.

  Hereinafter, although the fourth embodiment will be described, the description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As shown in FIG. 8, in the device collection unit 18 of the inspection apparatus 1 of the fourth embodiment, the arrangement plate 181 includes a plurality of (two in the illustrated configuration) pockets 811 and a plurality of (two in the illustrated configuration, two). ) Of the device recovery unit main body 182 is provided with one second flow path (flow path) 821.

  The second flow path 821 extends in the direction in which the two first flow paths 812 are aligned (the left-right direction in FIG. 8), and the direction in which the two first flow paths 812 are aligned. It is formed to be long. The first flow paths 812 and the second flow paths 821 communicate with each other. That is, each pocket 811 communicates with the second channel 821 via the corresponding first channel 812.

  As a result, the presence or absence of the IC device 90 in each pocket 811 of the placement plate 181 cannot be determined, but the IC device 90 is not placed in any of the pockets 811 or the seating state is poor. It can be determined that the IC devices 90 are disposed in all the pockets 811 and the seating state is good.

  When it is detected that the IC device 90 is not arranged in any of the pockets 811, for example, the operator visually recognizes the pocket where the IC device 90 is not arranged or the seating state is poor. 811 is found out, and the IC device 90 is manually placed so as to be in a good sitting state, and then the input unit 61 is operated to operate the inspection apparatus 1.

  In this inspection apparatus 1, only one pressure sensor or the like may be provided for the two pockets 811, and the structure can be simplified.

  The device supply unit 14 is the same as the device collection unit 18, and thus description thereof is omitted.

  According to the fourth embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

<Fifth Embodiment>
FIG. 9 and FIG. 10 are cross-sectional views showing a part of the device collection unit and the electronic component in the fifth embodiment of the electronic component inspection apparatus of the present invention, respectively.

  Hereinafter, the fifth embodiment will be described. The description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted. Further, the fifth embodiment is characterized by each pocket 811 of the device collection unit 18, but since each pocket 811 is the same, one pocket 811 will be representatively illustrated and described below.

  As shown in FIG. 9, in the device collection unit 18 of the inspection apparatus 1 of the fifth embodiment, a plurality of recesses 814 into which a plurality of terminal units 901 of the IC device 90 are inserted into the bottom surface 8111 of the pocket 811 of the arrangement plate 181. Is provided. The shape of the concave portion 814 may be any shape as long as the terminal portion 901 can be inserted, and the number of the concave portions 814 may be the same as or different from the number of the terminal portions 901. That is, it is only necessary that the bottom surface of the IC device 90 can function as a lid for the opening 813 of the first flow path 812.

  As a result, when the IC device 90 is placed in a good sitting state in the pocket 811 of the placement plate 181, the terminal portion 901 of the IC device 90 is inserted into the recess 814. Accordingly, it is possible to prevent a gap from being generated between the arrangement plate 181 and the IC device 90, and the opening 813 of the first flow path 812 can be closed.

  Moreover, it may replace with the said structure and you may comprise the part which contacts the IC device 90 of the pocket 811 of the arrangement | positioning board 181 with an elastic member.

  As a result, when the IC device 90 is arranged in a good seating state in the pocket 811 of the arrangement plate 181, the elastic member is elastically deformed according to the shape of the terminal portion 901 of the IC device 90. Accordingly, it is possible to prevent a gap from being generated between the arrangement plate 181 and the IC device 90, and the opening 813 of the first flow path 812 can be closed.

  The device supply unit 14 is the same as the device collection unit 18, and thus description thereof is omitted.

  According to the fifth embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

<Sixth Embodiment>
FIG. 11: is sectional drawing which shows a part of device collection part and electronic component in 6th Embodiment of the electronic component inspection apparatus of this invention.

  Hereinafter, the sixth embodiment will be described. The description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted. In addition, the sixth embodiment is characterized by each pocket 811 of the device collection unit 18, but since each pocket 811 is the same, a single pocket 811 will be typically illustrated and described below.

  As shown in FIG. 11, in the inspection apparatus 1 of the sixth embodiment, the width of the bottom surface 8111 of the pocket 811 of the arrangement plate 181 is made narrower than the width of the IC device 90, and each side surface 8112 of the pocket 811 is inclined. To.

  As a result, when the IC device 90 is placed in the pocket 811 of the placement plate 181 in a satisfactorily seated state, the IC device 90 comes into contact with each side surface 8112 of the pocket 811, thereby the first flow path 812. The opening 813 can be closed.

  The device supply unit 14 is the same as the device collection unit 18, and thus description thereof is omitted.

  According to the sixth embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

<Seventh embodiment>
Hereinafter, although the seventh embodiment will be described, the description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  In the inspection apparatus 1 according to the seventh embodiment, each of the pressure sensors 411 and 412 has a filter, so that it is possible to prevent dust and dirt from entering the pressure sensors 411 and 412. It has become.

  In the inspection apparatus 1, the device collection unit 18 determines (detects) a filter clogged state in addition to the presence / absence of the IC device 90 on the device collection unit 18 and the seating state of the IC device 90. Is configured to be possible.

  That is, the determination unit 803 of the control unit 80 determines whether or not the IC device 90 is present in each pocket 811, the seating state of the IC device 90, and whether or not the filter is clogged based on the detection results of the pressure sensors 411 and 412. Determine. Hereinafter, the principle of determining the clogged state will be described.

  The pressure of the air detected by the pressure sensors 411 and 412 differs between the case where the filter is clogged and the case where the filter is not clogged and the seating state of the IC device 90 in the pocket 811 is poor. That is, the air pressure detected by the pressure sensors 411 and 412 when the filter is not clogged and the IC device 90 is not seated in the pocket 811 is detected by the pressure sensors 411 and 412 when the filter is clogged. Is higher than the air pressure.

  Therefore, in this inspection apparatus 1, in addition to the first threshold value and the second threshold value described above, a third threshold value smaller than the second threshold value is set.

  Then, the third threshold value is compared with the air pressure detected by the pressure sensors 411, 412. If the air pressure is equal to or lower than the second threshold value and greater than the third threshold value, the filter is clogged. It is determined that If the air pressure is equal to or lower than the third threshold, it is determined that the seating state of the IC device 90 in the pocket 811 is good. The determination result is displayed on the display unit 62.

  As a result, when the filter is clogged, the operator can take an appropriate action such as replacing the filter or cleaning the filter.

  The device supply unit 14 is the same as the device collection unit 18, and thus description thereof is omitted.

  According to the seventh embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part has the same function. Any configuration can be substituted. Moreover, other arbitrary components may be added.

  Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  In the embodiment, the first ports 151A and 151B and the second ports 152A and 152B are connected only when the IC device 90 is located at the electronic component placement position. However, the present invention is not limited to this. For example, the pump 131 may always be connected to each first flow path 812 and each second flow path 821. In this case, it is possible to prevent the IC device 90 from jumping out of each pocket 811 by sucking air with the pump 131 while the device collection unit 18 is moving.

1 ... Inspection equipment (electronic parts inspection equipment)
11 ... Base 11A ... First tray transport mechanism 11B ... Second tray transport mechanism 12 ... Temperature adjustment section (soak plate)
13 …… First device transfer head 14 …… Device supply unit (supply shuttle)
141 …… Placement plate 142 …… Device supply unit body 15 …… Third tray transport mechanism 16 …… Inspection unit 17 …… Second device transport head 175 …… Hand unit 176 …… Suction nozzle 18 …… Device recovery Department (collection shuttle)
181 ... Placement plate 182 ... Device recovery unit body 811 ... Pocket (electronic component placement part)
8111: Bottom surface 8112: Side surface 812: First flow path 813: Opening 814: Recessed 821 ... Second flow path 19 ... Collection tray 20 ... Third device transport head 21 ... Sixth tray transport mechanism 22A ... Fourth tray transport mechanism 22B ... Fifth tray transport mechanism 411, 412 ... Pressure sensor 6 ... Operation unit 61 ... Input unit 62 ... Display unit 80 ... Control 801 …… Storage unit 803 …… Determination unit 90 …… IC device 901 …… Terminal unit 110 …… Cylinder 111 …… Piston rod 121, 122 …… Valve 131 …… Pump 151A, 151B …… First port 152A , 152B …… Second port 1511 …… Cylindrical portion 1512 …… Side hole 1513 …… Connection portion 171,172… Tube 200 …… Tray A1 …… Tray provided Supply area A2: Device supply area (supply area)
A3: Inspection area A4: Device collection area (collection area)
A5 …… Tray removal area R1 …… First chamber R2 …… Second chamber R3 …… Third chamber

Claims (12)

An electronic component is disposed and an electronic component transport unit capable of transporting the electronic component; and
A fluid suction part capable of sucking fluid,
The electronic component transport unit is movable to an electronic component placement position where the electronic component is placed,
When the electronic component transport unit is located at the electronic component placement position, the fluid is sucked by the fluid suction unit,
An electronic component transport apparatus that determines whether or not the electronic component is disposed in the electronic component transport unit based on a result of detecting the pressure or flow rate of the fluid.   The electronic component transport apparatus according to claim 1, further comprising a detection unit capable of detecting at least one of the pressure of the fluid and the flow rate of the fluid.   The electronic component conveying apparatus according to claim 2, wherein the detection unit includes a filter.   The electronic component transport apparatus according to claim 3, wherein a state where the filter is clogged is detected based on a result of detecting a pressure or a flow rate of the fluid. A first port provided in the electronic component transport unit and capable of flowing the fluid;
A second port connected to the fluid suction part,
The said 1st port and the said 2nd port contact | abut so that the said fluid can distribute | circulate when the said electronic component conveyance part is located in the said electronic component arrangement position. The electronic component conveying apparatus as described. The electronic component transport unit includes an electronic component placement unit on which the electronic component is placed,
The electronic component conveying apparatus according to any one of claims 1 to 5, wherein the electronic component placement portion is provided with a plurality of recesses into which a plurality of terminal portions of the electronic component are inserted. The electronic component transport unit includes an electronic component placement unit on which the electronic component is placed,
The electronic component conveying apparatus according to claim 1, wherein the electronic component arranging portion is provided with an elastic member. The electronic component transport unit includes a plurality of electronic component placement units on which a plurality of the electronic components are placed,
A flow path communicating with the plurality of electronic component placement portions,
The electronic component transport apparatus according to claim 1, wherein the fluid is sucked from the flow path by the fluid suction unit when the electronic component transport unit is located at the electronic component placement position.   The electronic component conveying apparatus according to claim 1, further comprising a valve that adjusts a flow rate of the fluid.   10. The electronic component transport apparatus according to claim 1, wherein whether or not the electronic component is seated on the electronic component transport unit is determined based on a result of detecting the pressure or flow rate of the fluid.   The electronic component transport apparatus according to claim 10, further comprising a vibration applying unit that vibrates the electronic component transport unit when the seating state of the electronic component is determined to be defective. An electronic component is disposed and an electronic component transport unit capable of transporting the electronic component; and
A fluid suction part capable of sucking fluid,
An inspection unit for inspecting the electronic component,
The electronic component transport unit is movable to an electronic component placement position where the electronic component is placed,
When the electronic component transport unit is located at the electronic component placement position, the fluid is sucked by the fluid suction unit,
An electronic component inspection apparatus that determines whether or not the electronic component is disposed in the electronic component transport unit based on a result of detecting the pressure or flow rate of the fluid.

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