JP2017044593A - Electronic component transportation device and electronic component inspection system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component transportation device and an electronic component inspection system capable of swiftly performing cooling and heating respectively on an electronic component.SOLUTION: An electronic component inspection system 1 comprises: an electronic component placement member 100 on which an IC device 90 as an electronic component part can be placed; a cooling member 121 on which the electronic component placement member 100 can be placed and capable of cooling the IC device 90; and a heating member 122 capable of heating the IC device 90. The cooling member 121 is disposed between the electronic component placement member 100 and the heating member 122.SELECTED DRAWING: Figure 6

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of electronic components such as semiconductor elements is known. A cooling plate that cools and maintains a desired temperature and a heating plate that preheats the electronic component and maintains the desired temperature are incorporated (for example, see Patent Document 1). In the electronic component inspection apparatus described in Patent Document 1, the cooling plate has a flow groove formed in a meandering manner (in a continuous S shape). The liquefied nitrogen flows down the flow groove to cool the electronic component. The heating plate has a heater that is heated by energization. The heating plate is overlaid on the cooling plate. Therefore, in the electronic component inspection apparatus described in Patent Document 1, the heating plate is disposed at a position closer to the cooling plate than the cooling plate.

JP 2003-194874 A

  In the electronic component inspection apparatus described in Patent Document 1, heat is generated relatively early when the heater is energized, and the heating plate is proximal to the electronic component, and the electronic component is rapidly heated with the heat. Can do. On the other hand, the liquefied nitrogen flowing down the flow groove of the cooling plate is usually supplied from a tank installed outside the electronic component inspection apparatus, so that the cooling capacity is reduced before reaching the cooling plate, Since the cooling plate is farther from the heating plate, it is difficult to cool the electronic component quickly.

  Therefore, comparing the thermal efficiency (energy loss) between the cooling plate and the heating plate, the cooling plate has a lower thermal efficiency than the heating plate, that is, the energy loss tends to be higher, and it is difficult to cool efficiently. there were.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

The electronic component transport device of the present invention includes an electronic component placement member on which an electronic component can be placed,
A cooling member capable of mounting the electronic component mounting member and cooling the electronic component;
A heating member capable of heating the electronic component,
The cooling member is disposed between the electronic component placing member and the heating member.

  When comparing the thermal efficiency (energy loss) between the cooling member and the heating member for the electronic component, the cooling member may have a lower thermal efficiency than the heating member, that is, the energy loss may be higher. In this case, the cooling member is disposed between the electronic component mounting member and the heating member, that is, the cooling member having high energy loss is disposed proximal to the electronic component, and the heating member having low energy loss is cooled. By adopting a configuration in which the electronic component is arranged distal to the member, the electronic component can be quickly cooled and heated, respectively.

  In the electronic component transport device of the present invention, it is preferable that the cooling member is configured by laminating a first member and a second member.

  As a result, a groove is formed in the surface of the first member facing the second member, the surface of the second member facing the first member, or both surfaces, and a fluid such as a refrigerant flows down the groove. It can be used as a flow path. Therefore, it is possible to omit separately providing members constituting the flow path, and the cooling member can have a simple configuration.

In the electronic component transport device of the present invention, the cooling member has a flow path through which a fluid as a refrigerant flows,
The flow path is preferably formed by a groove formed in the first member and through which the fluid passes.

  Thereby, it is possible to omit separately providing the members constituting the flow path, and thus the cooling member can be of a simple configuration.

  In the electronic component transport apparatus according to the present invention, it is preferable that a sealing member for maintaining liquid tightness or air tightness between the first member and the second member is disposed.

  Thereby, it is possible to prevent the fluid flowing down the flow path from leaking out between the first member and the second member.

  In the electronic component transport device of the present invention, it is preferable that the second member is disposed between the first member and the heating member.

  Thereby, when heating with respect to an electronic component, a 2nd member functions as a thermal storage part which accumulate | stores the heat which generate | occur | produced with the heating member temporarily, Therefore, with respect to the electronic component conveyed one by one (one by one) And can be heated continuously and stably.

  In the electronic component conveying apparatus of the present invention, it is preferable that the thickness of the second member is thicker than the thickness of the first member.

  Thereby, even if the first member is warped, the warp can be eliminated regardless of the magnitude of the warp.

In the electronic component conveying apparatus of the present invention, it is preferable that the cooling member is cooled with a fluid.
Thereby, for example, liquid nitrogen can be used as a cooling fluid. Liquid nitrogen is suitable for use in cooling electronic components because of its relatively high cooling efficiency (cooling capacity).

  In the electronic component transport device of the present invention, it is preferable that the cooling member has a flow path through which the fluid flows.

  Thereby, for example, liquid nitrogen can be used as a cooling fluid. And depending on the formation state of a flow path, liquid nitrogen can be spread over the whole cooling member, and a some electronic component can be cooled efficiently.

The electronic component inspection apparatus of the present invention includes an electronic component placement member on which an electronic component can be placed,
A cooling member capable of mounting the electronic component mounting member and cooling the electronic component;
A heating member capable of heating the electronic component;
An inspection unit for inspecting the electronic component,
The cooling member is disposed between the electronic component placing member and the heating member.

  When comparing the thermal efficiency (energy loss) between the cooling member and the heating member for the electronic component, the cooling member may have a lower thermal efficiency than the heating member, that is, the energy loss may be higher. In this case, the cooling member is disposed between the electronic component mounting member and the heating member, that is, the cooling member having high energy loss is disposed proximal to the electronic component, and the heating member having low energy loss is cooled. By adopting a configuration in which the electronic component is arranged distal to the member, the electronic component can be quickly cooled and heated, respectively.

FIG. 1 is a schematic perspective view of an electronic component inspection apparatus according to an embodiment of the present invention as viewed from the front side. FIG. 2 is a schematic plan view of the electronic component inspection apparatus shown in FIG. FIG. 3 is a piping diagram for connecting a liquid nitrogen supply source and a liquid nitrogen supply destination. FIG. 4 is a plan view showing an arrangement state of two soak plates in FIG. FIG. 5 is a horizontal sectional view of the lower soak plate in FIG. 4. FIG. 6 is a cross-sectional view taken along the line AA in FIG. 4 (a state where the change kit is placed). FIG. 7 is a horizontal sectional view showing a supply line of liquid nitrogen to the two soak plates in FIG. 2 and a discharge line of liquid nitrogen from the two soak plates.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

  FIG. 1 is a schematic perspective view of an electronic component inspection apparatus according to an embodiment of the present invention as viewed from the front side. FIG. 2 is a schematic plan view of the electronic component inspection apparatus shown in FIG. FIG. 3 is a piping diagram for connecting a liquid nitrogen supply source and a liquid nitrogen supply destination. FIG. 4 is a plan view showing an arrangement state of two soak plates in FIG. FIG. 5 is a horizontal sectional view of the lower soak plate in FIG. 4. FIG. 6 is a cross-sectional view taken along the line AA in FIG. 4 (a state where the change kit is placed). FIG. 7 is a horizontal sectional view showing a supply line of liquid nitrogen to the two soak plates in FIG. 2 and a discharge line of liquid nitrogen from the two soak plates. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIGS. 1 and 2 includes, for example, an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, an LCD (Liquid Crystal Display), a CIS (CMOS This is a device for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as an image sensor. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 2, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component conveyance apparatus that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 800. In addition, the inspection apparatus 1 includes a monitor 300 and a signal lamp 400.

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are arranged (the lower side in FIG. 2) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is arranged (FIG. 2 is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray (arrangement member) 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2. The tray conveyance mechanism 11 </ b> A is a moving unit that can move the tray 200 in the Y direction together with the IC devices 90 placed on the tray 200. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200.

  In the supply area A2, a temperature adjustment unit 12, a device transport head 13, and a tray transport mechanism (first transport device) 15 are provided.

  The temperature adjustment unit 12 includes a cooling member 121 that can collectively cool the plurality of IC devices 90 and a heating member 122 that can heat the plurality of IC devices 90 (see FIG. 6). ), Sometimes called “soak plate”. With the soak plate, the IC device 90 before being inspected by the inspection unit 16 can be cooled or heated in advance and adjusted to a temperature suitable for the inspection. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the tray transport mechanism 11A is transported to one of the temperature adjustment units 12.

  The plurality of IC devices 90 are exchanged for each type of IC device 90 and are arranged in pockets (recesses) 101 of the electronic component placement member 100 called “change kit”, and are soak plates. It is mounted on a certain temperature adjustment part 12 (refer FIG. 6). The plurality of IC devices 90 are cooled or heated together with the electronic component placement member 100 for the soak plate.

  The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports an empty tray 200 in a state where all IC devices 90 have been removed in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit 14, an inspection unit 16, a device transport head 17, and a device collection unit 18 are provided.

  The device supply unit 14 is a moving unit on which the temperature-adjusted IC device 90 is placed and can transport (move) the IC device 90 to the vicinity of the inspection unit 16, and is referred to as a “supply shuttle plate”. Sometimes. The device supply unit 14 is supported so as to be movable in the horizontal direction along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to one of the device supply units 14.

  Similarly to the temperature adjustment unit 12, the device supply unit 14 is also used by mounting a change kit that is exchanged for each type of IC device 90, and cooling a plurality of IC devices 90 together with the change kit. And a heating member capable of heating the plurality of IC devices 90 at once.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be cooled and heated to adjust the IC device 90 to a temperature suitable for the inspection.

  The device transport head 17 is supported so as to be movable in the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16. The device transport head 17 is also configured to be able to cool or heat the IC device 90.

  The device collection unit 18 is a moving unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed and can transport (move) the IC device 90 to the collection region A4. Sometimes called a “plate”. The device collection unit 18 is supported so as to be movable in the horizontal direction along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  In addition, the device collection unit 18 and the inspection unit 16 are also used by placing a change kit that is exchanged for each type of IC device 90, similarly to the temperature adjustment unit 12.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism (second conveyance device) 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 is placed, and is fixed in the collection area A4. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction. The empty trays 200 are also placement units on which the IC devices 90 are placed, and three empty trays 200 are arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200. Thus, in the inspection apparatus 1, the tray transport mechanism 21 is provided in the collection area A4, and the tray transport mechanism 15 is provided in the supply area A2. Thereby, for example, the throughput (the number of IC devices 90 to be transported per unit time) can be improved as compared to transporting an empty tray 200 in the X direction with a single transport mechanism.

  The configurations of the tray transport mechanisms 15 and 21 are not particularly limited. For example, the tray transport mechanisms 15 and 21 include a suction member that sucks the tray 200 and a support mechanism such as a ball screw that supports the suction member so as to be movable in the X direction. Is mentioned.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one in the horizontal direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22 </ b> A is a moving unit that can move the tray 200 in the Y direction together with the inspected IC devices 90 placed on the tray 200. Thus, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a moving unit that can move an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The control unit 800 has, for example, a drive control unit. The drive control unit includes, for example, tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and tray conveyance mechanism 22A, 22B is controlled.

  The test control unit of the tester inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a memory (not shown), for example.

  The operator can set or confirm the temperature condition or the like when the inspection apparatus 1 is operated via the monitor 300. The monitor 300 includes a display screen 301 configured by, for example, a liquid crystal screen, and is disposed on the front side upper portion of the inspection apparatus 1. As shown in FIG. 1, on the right side of the tray removal area A5 in the figure, there is provided a mouse table 600 on which a mouse used for operating a screen displayed on the monitor 300 is placed.

  Further, the signal lamp 400 can notify the operating state or the like of the inspection apparatus 1 by a combination of colors that emit light. The signal lamp 400 is arranged on the upper part of the inspection apparatus 1. Note that the inspection device 1 has a built-in speaker 500, and the operation state of the inspection device 1 can also be notified by the speaker 500.

  As shown in FIG. 2, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (partitioned) by the first partition wall 61, and the supply area A2 and the inspection area A3 are separated. It is divided by the second partition wall 62, the inspection area A3 and the collection area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. ing. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each region. Furthermore, the outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74. Note that an inner partition 66 is disposed inside the rear cover 73.

  As described above, the temperature adjustment unit 12 includes the cooling member 121 that can cool the IC device 90 and the heating member 122 that can heat the IC device 90. As shown in FIG. 4, the inspection apparatus 1 is provided with two temperature adjustment units 12, and these two temperature adjustment units 12 are arranged in the Y direction, that is, up and down in FIG. 4. . Hereinafter, the lower temperature adjustment unit 12 in FIG. 4 may be referred to as “temperature adjustment unit 12A”, and the upper temperature adjustment unit 12 may be referred to as “temperature adjustment unit 12B”. Since the temperature adjustment unit 12A and the temperature adjustment unit 12B have the same configuration except that the arrangement locations are different, the temperature adjustment unit 12A will be described as a representative.

  The cooling member 121 is configured to cool the IC device 90 when the refrigerant RF flows down inside.

  Note that the refrigerant RF is, for example, liquid nitrogen (liquefied nitrogen) and has a relatively high cooling efficiency (cooling capacity), and thus is preferably used for cooling the IC device 90. As shown in FIGS. 1 and 2, the refrigerant RF is preliminarily filled in a tank 700 installed outside the inspection apparatus 1. As shown in FIG. 3, the tank 700 is connected to the temperature adjustment unit 12, the device supply unit 14, the device transport head 17, and the inspection unit 16 via a pipe 23. As a result, the refrigerant RF is supplied to the temperature adjustment unit 12, the device supply unit 14, the device transport head 17, and the inspection unit 16, respectively. Further, a valve 24 a is provided in the middle of the pipe 23 toward the temperature adjustment unit 12. By controlling the opening and closing of the valve 24a, the supply of the refrigerant RF to the temperature adjusting unit 12 and the stop of the supply can be switched. Similarly, a valve 24 b is provided on the way of the piping 23 toward the device supply unit 14. By controlling the opening and closing of the valve 24b, the supply of the refrigerant RF to the device supply unit 14 and the stop of the supply can be switched. A valve 24 c is also provided on the way of the piping 23 toward the device transport head 17. By controlling the opening and closing of the valve 24c, the supply of the refrigerant RF to the device transport head 17 and the stop of the supply can be switched. Further, a valve 24 d is provided on the way to the inspection unit 16 of the pipe 23. By controlling the opening and closing of the valve 24d, the supply of the refrigerant RF to the inspection unit 16 and the stop of the supply can be switched.

  As shown in FIG. 6, the cooling member 121 is configured by laminating and joining a flat plate-like first member 3 a and a flat plate-like second member 3 b. Thereby, a groove can be formed in the lower surface 31 of the first member 3a, the upper surface 32 of the second member 3b, or both surfaces, and the groove can be used as the flow path 33 through which the refrigerant RF flows. Therefore, it is possible to omit separately providing the members constituting the flow path 33, and the cooling member 121 can have a simple structure. In the present embodiment, a groove is formed on the lower surface 31 of the first member 3 a and the groove is used as the flow path 33. Moreover, as a joining method of the 1st member 3a and the 2nd member 3b, the method by the fastening using a some volt | bolt is employable, for example.

  A groove 34 is formed in parallel with the flow path 33 on the lower surface 31 of the first member 3a. A sealing member 30 is disposed along the groove 34 in the groove 34. The sealing member 30 is made of an elastic material, and is compressed between the first member 3a and the second member 3b. Thereby, the liquid-tightness (or airtightness) between the 1st member 3a and the 2nd member 3b, ie, the flow path 33, can be hold | maintained. Therefore, it is possible to prevent the refrigerant RF flowing down the flow path 33 from leaking between the first member 3a and the second member 3b. In addition, it does not specifically limit as an elastic material which comprises the sealing member 30, For example, various rubber materials, such as urethane rubber, silicone rubber, and fluororubber, can be used.

  As described above, the groove used as the flow path 33 is formed on the lower surface 31 of the first member 3a. For example, depending on the formation region of the groove (flow path 33) and other lengths and depths of the groove, the first member 3a alone (itself) may be slightly warped.

  Since the electronic component placing member 100 is placed on the upper surface 35 of the first member 3a, if the first member 3a remains warped, the electronic component placing member 100 on the upper surface 35 also follows the first member 3a. May be warped. In this state, even if the IC device 90 in the pocket 101 of the electronic component mounting member 100 is gripped by the device transport head 13 and is pulled upward, the electronic component mounting member 100 is warped. May not be gripped, that is, gripping may be insufficient.

  Therefore, even if the first member 3a is warped, the cooling member 121 is joined to the second member 3b that is thicker than the first member 3a in order to eliminate the warp. As a result, the upper surface 35 of the first member 3a can be corrected to a horizontal plane, and thus the electronic component placing member 100 on the upper surface 35 is also prevented from warping. From the electronic component placement member 100 in this state, the IC device 90 can be stably lifted by the device transport head 13.

The thickness _{t 3b} of the second member 3b is greater the preferably than the thickness _{t 3a} of the first member 3a, for example, more than 1.2 times the thickness _{t 3a,} that is 3 times or less preferably More preferably, it is 1.5 times or more and 2 times or less. Thus, while suppressing that the thickness t _3b increases, regardless of the warping of the first member 3a, it is possible to eliminate the warpage.

  As shown in FIGS. 4 and 5, the first member 3a and the second member 3b have the same shape and size in plan view.

  The first member 3a (the same applies to the second member 3b) includes a first side 361, a second side 362 parallel to the first side 361, and a third side 363 and a third side 363 orthogonal to the first side 361. And a rectangular shape (rectangular shape) having a fourth side 364 parallel thereto. In the present embodiment, the first member 3a has a long rectangle in the Y-axis direction, and the length of the first side 361 and the second side 362 is longer than the length of the third side 363 and the fourth side 364. It has become. By making such a relatively simple outer shape, when the first member 3a is obtained by machining from the base material of the metal plate, the machining can be performed easily and at low cost.

  As a constituent material of the first member 3a and the second member 3b, for example, various metal materials can be used, and among these metal materials, aluminum that has a relatively high thermal conductivity and is easy to machine is preferable.

  By the way, as in the cooling plate described in Patent Document 1, for example, liquefied nitrogen simply flows down through a meandering flow groove, and uniform cooling on the cooling plate is impossible. This is because the cooling plate tends to allow heat to enter and exit from the outer periphery rather than the center.

  Therefore, the temperature adjustment unit 12A is configured to be able to uniformly cool the plurality of IC devices 90 on the cooling member 121. Hereinafter, this configuration will be described.

  As described above, the cooling member 121 is provided with the flow path 33 through which the refrigerant RF flows. As shown in FIG. 5, the flow path 33 includes a first flow path 37 into which the refrigerant RF flows and a second flow path 38 that communicates with the first flow path 37 and flows out the refrigerant RF.

  When the cooling member 121 is viewed in plan, the first flow path 37 starts from the inlet 371 through which the refrigerant RF flows into the first flow path 37 as close to the outer peripheral side as possible (is unevenly distributed). ), The first side 361, the third side 363, the second side 362, and the fourth side 364 are formed along each side in this order.

  In a portion along the first side 361 of the first flow path 37, a linear portion 372 that is linear from the upstream side to the downstream side, a crank-like portion 373 that is curved or bent in a crank shape, and a linear shape The linear part 374 which makes | forms is formed.

  The first flow path 37 changes direction on the corner (corner) 365 side formed by the first side 361 and the third side 363, and a linear part that forms a straight line in the portion along the third side 363. 375 is formed.

  In addition, the first flow path 37 changes its direction on the corner (corner) 366 side formed by the third side 363 and the second side 362, and a linear part that forms a straight line in the portion along the second side 362. 376 is formed.

  Further, the first flow path 37 changes its direction at the corner (corner) 367 side formed by the second side 362 and the fourth side 364, and a linear part that forms a straight line in the portion along the fourth side 364. 377 is formed.

The flow path 33 is a folded portion 331 that is folded back in a “U” shape immediately after the linear portion 377, and enters the inner side of the first flow path 37, that is, toward the center of the cooling member 121. The first flow path 37 that is the forward path turns to the second flow path 38 that is the return path. The folded portion 331 is a portion where the first flow path 37 and the second flow path 38 are connected.
When the cooling member 121 is viewed in a plan view, the second flow path 38 is inside the first flow path 37 and is opposite to the first flow path 37 in the fourth side 364, the second side 362, the third side 363, It is formed along each side in the order of the first side 361.

  In a portion along the fourth side 364 of the second flow path 38, a linear portion 381 having a linear shape is formed. The linear portion 381 is in a state of being juxtaposed with the linear portion 377 of the first flow path 37, and the flow direction is also opposite to the linear portion 377.

  The second flow path 38 changes its direction on the corner portion 367 side, and a linear portion 382 that forms a straight line is formed in a portion along the second side 362. The linear portion 382 is in a state of being juxtaposed with the linear portion 376 of the first flow path 37, and the flow direction is also opposite to the linear portion 376.

  The second flow path 38 changes its direction on the corner portion 366 side, and a linear portion 383 that forms a straight line is formed in a portion along the third side 363. The linear portion 383 is in a state of being juxtaposed with the linear portion 375 of the first flow path 37, and the flow direction is also opposite to the linear portion 375.

  Further, the second flow path 38 changes direction on the corner portion 365 side, and the portion along the first side 361 meanders so as to repeat approach and separation with respect to the linear portion 374 of the first flow path 37. The meandering portion 384 and the straight portion 385 that forms a straight line downstream from the meandering portion 384 are formed. The meandering portion 384 is in a state of being juxtaposed with the linear portion 374 of the first flow path 37, and the flow direction is also opposite to the linear portion 374. The linear portion 385 is in a state of being juxtaposed with the linear portion 372 of the first flow path 37, and the flow direction is also opposite to the linear portion 372.

  The second flow path 38 ends at an outlet 386 through which the refrigerant RF flows out from the second flow path 38.

  As described above, the flow path 33 includes the first side 361, the second side 362, the third side 363, and the fourth side 364 from the linear part 372 to the linear part 377 of the first flow path 37. It is disposed outside the two flow paths 38 and surrounds the linear portion 381 to the meandering portion 384 of the second flow path 38. The temperature of the refrigerant RF flowing down the first flow path 37 on the outer side is lower than the temperature of the refrigerant RF flowing down on the second flow path 38 on the inner side. Thereby, even if it is the cooling member 121 which the outer peripheral part tends to carry in and out of heat more easily than a center part, the fall of the cooling function in the 1st flow path 37 is prevented, and sufficient cooling function is demonstrated. can do. Therefore, uniform cooling of the plurality of IC devices 90 is performed on the cooling member 121.

  In the present embodiment, when the average temperature of the refrigerant RF that reaches the entire flow path 33 is measured, a portion that is lower than the average temperature is referred to as a “first flow path 37”, and a portion that is higher than the average temperature is referred to as a “second flow path 38. However, it is not limited to this. For example, in the entire flow path 33, 1/2 on the upstream side may be the “first flow path 37” and 1/2 on the downstream side may be the “second flow path 38”.

  As shown in FIG. 5, the inflow port 371 and the outflow port 386 are arranged unevenly on the fourth side 364 side of the first side 361 to the fourth side 364. Thereby, the inflow port 371 and the outflow port 386 can be brought close to each other as close as possible. Therefore, the supply of the refrigerant RF to the cooling member 121 and the refrigerant RF using one manifold joint 5 (see FIG. 7) described later. Can be discharged.

  Further, the folded portion 331 is also arranged unevenly on the fourth side 364 side. As a result, the first flow path 37 is along the first side 361 to the fourth side 364. Therefore, the entire length of the first flow path 37 can be ensured as long as possible, and the plurality of IC devices 90 can be secured. Contributes to uniform cooling against.

  As shown in FIG. 4, the cooling member 121 of the temperature adjustment unit 12 </ b> A and the cooling member 121 of the temperature adjustment unit 12 </ b> B are arranged with their fourth sides 364 facing each other. That is, the temperature adjusting unit 12A and the temperature adjusting unit 12B are arranged point-symmetrically with respect to each other's intermediate point. Thereby, as shown in FIG. 7, the manifold joint 5 can be arrange | positioned in the back side (Z-axis direction negative side) between the temperature adjustment part 12A and the temperature adjustment part 12B.

  The manifold joint 5 has a manifold body 51 and joints 52 to 57 connected to the manifold body 51.

  The manifold body 51 has an internal flow path 511 in which the refrigerant RF is directed from the joint 52 to the joint 53 and the joint 54, and an internal flow path 512 in which the refrigerant RF is directed from the joint 55 and the joint 56 to the joint 57.

  The joint 52 is connected to a tube (third flow path) 701 through which the refrigerant RF from the tank 700 flows down. The joint 53 is connected to the inlet 371 of the cooling member 121 of the temperature adjustment unit 12 </ b> A via the tube 702. The joint 54 is connected to the inlet 371 of the cooling member 121 of the temperature adjustment unit 12 </ b> B via the tube 703. With such a connection, the refrigerant RF from the tank 700 is supplied to the cooling member 121 of the temperature adjusting unit 12A and the cooling member 121 of the temperature adjusting unit 12B, respectively.

  The joint 55 is connected to the outlet 386 of the cooling member 121 of the temperature adjustment unit 12 </ b> A via the tube 704. The joint 56 is connected to the outlet 386 of the cooling member 121 of the temperature adjustment unit 12 </ b> B via the tube 705. The joint 57 is connected to a drainage unit (not shown) via a tube (fourth flow path) 706. With such a connection, the refrigerant RF discharged from the cooling member 121 of the temperature adjusting unit 12A and the cooling member 121 of the temperature adjusting unit 12B is collected by the drainage unit.

  The cooling member 121 having the above configuration is disposed between the electronic component placing member 100 and the heating member 122 (see FIG. 6).

The heating member 122 is a rubber heater that can heat the IC device 90. The rubber heater has a sheet shape and is configured to generate heat when energized. Thereby, the heating member 122 becomes thin. The power density of the rubber heater used as the heating member 122 is not particularly limited, and is preferably, for example, 0.5 W / cm ² or more and 20 W / cm ² or less, preferably 10 W / cm ² or more, 15 W / cm ^2. The following is more preferable. Further, the area of the rubber heater in plan view is preferably 0.6 times or more and 1.2 times or less of the area of the cooling member 121 in plan view, and is 0.8 times or more and 1 time or less. Is more preferable.

  In the temperature adjustment unit 12A, heat is generated relatively early if the heating member 122 is energized, and the IC device 90 can be rapidly heated with the heat. On the other hand, since the refrigerant RF flowing down the flow path 33 of the cooling member 121 is supplied from the tank 700 installed outside the inspection apparatus 1 as described above, the cooling capacity is reduced before reaching the cooling member 121. May end up. Thus, when comparing the thermal efficiency (energy loss) between the heating member 122 and the cooling member 121 with respect to the IC device 90, the cooling member 121 has a lower thermal efficiency than the heating member 122, that is, the energy loss tends to be higher. .

  Therefore, in the temperature adjustment unit 12A, the cooling member 121 with high energy loss is disposed proximal to the IC device 90, and the heating member 122 with low energy loss is disposed distal to the cooling member 121. Yes. With such an arrangement, the cooling and heating of the IC device 90 can be performed quickly and efficiently in a well-balanced manner.

  As shown in FIG. 6, the second member 3 b is disposed between the first member 3 a and the heating member 122, and the lower surface 39 is in contact with the heating member 122. Thus, when the temperature adjustment unit 12A heats the IC device 90, the second member 3b functions as a heat storage unit that temporarily stores heat generated by the heating member 122. Therefore, it is possible to continuously and stably heat the IC devices 90 conveyed one after another (one by one).

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Further, the cooling member of the temperature adjusting unit has one set of the first member and the second member in the above embodiment, but is not limited to this, and has a plurality of sets, which are laminated in multiple layers. It may be. In this case, the cooling temperature in the temperature adjusting unit is averaged as a whole, that is, the cooling temperature is made more uniform in the entire temperature adjusting unit.

  Further, the first member (the same applies to the second member) is not limited to the rectangle, and may be another rectangle having at least four sides of the first side to the fourth side. Note that other rectangles include squares.

  In addition, the refrigerant used for cooling the IC device is a liquid in the embodiment, but is not limited to this, and may be a gas.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus (electronic component inspection apparatus), 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 12A ... Temperature adjustment part, 12B ... Temperature adjustment part, 121 ... Cooling member, 122 ... Heating member DESCRIPTION OF SYMBOLS 13 ... Device conveyance head, 14 ... Device supply part, 15 ... Tray conveyance mechanism (1st conveyance apparatus), 16 ... Inspection part, 17 ... Device conveyance head, 18 ... Device collection | recovery part, 19 ... Collection tray, 20 ... Device transport head, 21 ... Tray transport mechanism (second transport device), 22A ... Tray transport mechanism, 22B ... Tray transport mechanism, 23 ... Piping, 24a ... Valve, 24b ... Valve, 24c ... Valve, 24d ... Valve, 3a ... 1st member, 3b ... 2nd member, 30 ... Sealing member, 31 ... Lower surface, 32 ... Upper surface, 33 ... Flow path, 331 ... Folding part, 34 ... Groove, 35 ... Upper surface, 361 ... 1 side, 362 ... 2nd side, 363 ... 3rd side, 364 ... 4th side, 365 ... corner (corner), 366 ... corner (corner), 367 ... corner (corner), 37 ... first flow Road, 371 ... Inlet, 372 ... Linear part, 373 ... Crank-like part, 374 ... Linear part, 375 ... Linear part, 376 ... Linear part, 377 ... Linear part, 38 ... Second flow path, 381 ... Linear portion, 382 ... Linear portion, 383 ... Linear portion, 384 ... Meandering portion, 385 ... Linear portion, 386 ... Outlet, 39 ... Lower surface, 5 ... Manifold joint, 51 ... Manifold body, 511 ... Internal flow path, 512 ... Internal flow path, 52 ... Joint, 53 ... Joint, 54 ... Joint, 55 ... Joint, 57 ... Joint, 57 ... Joint, 61 ... First partition, 62 ... Second partition, 63 ... Third Partition wall 64... Fourth partition wall 65. Fifth partition wall 66. Inner partition wall 70. Front cover, 71 ... Side cover, 72 ... Side cover, 73 ... Rear cover, 74 ... Top cover, 90 ... IC device, 100 ... Electronic component placement member, 101 ... Pocket, 200 ... Tray (placement member), 300 ... Monitor, 301: Display screen, 400: Signal lamp, 500: Speaker, 600 ... Mouse base, 700 ... Tank, 701 ... Tube (third flow path), 702 ... Tube, 703 ... Tube, 704 ... Tube, 705 ... Tube, 706 ... tube (fourth flow path), 800 ... control unit, A1 ... tray supply area, A2 ... device supply area (supply area), A3 ... inspection area, A4 ... device collection area (collection area), A5 ... tray removal area , RF ... refrigerant, t _3a ... thickness, t _3b ... thickness

Claims (9)

An electronic component mounting member on which the electronic component can be placed;
A cooling member capable of mounting the electronic component mounting member and cooling the electronic component;
A heating member capable of heating the electronic component,
The electronic component conveying apparatus, wherein the cooling member is disposed between the electronic component placing member and the heating member.   The electronic component conveying apparatus according to claim 1, wherein the cooling member is configured by laminating a first member and a second member. The cooling member has a flow path through which a fluid as a refrigerant flows,
The electronic component conveying apparatus according to claim 2, wherein the flow path is formed by a groove formed in the first member and through which the fluid passes.   The electronic component transport apparatus according to claim 3, wherein a sealing member that maintains liquid tightness or airtightness between the first member and the second member is disposed.   5. The electronic component conveying apparatus according to claim 2, wherein the second member is disposed between the first member and the heating member.   The thickness of the said 2nd member is an electronic component conveying apparatus of any one of Claim 2 thru | or 5 thicker than the thickness of the said 1st member.   The electronic component conveying apparatus according to claim 1, wherein the cooling member is cooled by a fluid.   The electronic component conveying apparatus according to claim 7, wherein the cooling member has a flow path through which the fluid flows. An electronic component mounting member on which the electronic component can be placed;
A cooling member capable of mounting the electronic component mounting member and cooling the electronic component;
A heating member capable of heating the electronic component;
An inspection unit for inspecting the electronic component,
The said cooling member is arrange | positioned between the said electronic component mounting member and the said heating member, The electronic component inspection apparatus characterized by the above-mentioned.

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