JP2016161355A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device that have excellent cooling responsibility to a contacting member.SOLUTION: An electronic component inspection device 1 includes: a plurality of heads 3 contacting with an electronic component; a supply flow passage 10A supplying a refrigerant RF to the heads 3; and a recovery flow passage 10B recovering the refrigerant RF from the heads 3. The supply flow passage 10A has a first supply flow passage 47 connected to a refrigerant source 28 and a supply flexible tube 5A serving as a second supply flow passage 53A branching from the first supply flow passage 47 and extending to the heads 3. The recovery flow passage 10B, on the other hand, has a first recovery flow passage 48 connected to the refrigerant source 28 and a recovery flexible tube 5B serving as a second recovery flow passage 53B branching from the first recovery flow passage 48 and extending to the heads 3.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device has been known. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device.

  Such an IC device inspection may be performed within a predetermined temperature range after cooling the IC device to a predetermined temperature (see, for example, Patent Document 1). Patent Document 1 discloses a configuration in which air from a fan is blown onto a heat sink attached to the front side surface of an IC device to cool it.

Japanese Patent Laid-Open No. 2007-5585

  However, in the cooling configuration described in Patent Document 1, some air from the fan does not hit the heat sink, and as a result, there arises a problem that cooling responsiveness is lowered.

  An object of the present invention is to provide an electronic component transport device and an electronic component inspection device that are excellent in cooling response in an abutting member.

Such an object is achieved by the present invention described below.
[Application Example 1]
The electronic component transport device of the present invention includes a contact member including a contact portion that contacts the electronic component;
A supply flow path for supplying a refrigerant to the contact member;
A recovery flow path for recovering the refrigerant from the contact member.
Thereby, it is excellent in the cooling responsiveness in an abutting member.

[Application Example 2]
In the electronic component conveying apparatus of the present invention, it is preferable that a plurality of the contact members are provided.
Thereby, it can contact | abut with respect to several electronic components collectively.

[Application Example 3]
In the electronic component transport device according to the aspect of the invention, it is preferable that the supply flow path includes a first supply flow path connected to a refrigerant supply unit and a second supply flow path branched into a plurality from the first supply flow path.
Thereby, a refrigerant | coolant can be supplied to a contact part with a simple structure.

[Application Example 4]
In the electronic component transport device of the present invention, it is preferable that the recovery channel includes a first recovery channel connected to a refrigerant recovery unit and a second recovery channel branched into a plurality from the first recovery channel.
Thereby, a refrigerant | coolant can be collect | recovered from a contact part by simple structure.

[Application Example 5]
In the electronic component conveying apparatus of the present invention, it is preferable to have a flow path member including the first supply flow path and the first recovery flow path.
This facilitates the routing of the first supply channel and the first recovery channel.

[Application Example 6]
In the electronic component transport device of the present invention, it is preferable that the flow path member surrounds the contact member in a plan view.

  Thereby, the contact member and the flow path member can be connected to each contact member through the second supply flow path and the second recovery flow path at the shortest distance possible.

[Application Example 7]
In the electronic component transport apparatus according to the present invention, it is preferable that the first supply channel is disposed either inside or outside the first recovery channel.

  Thereby, when forming a 1st supply flow path and a 1st collection | recovery flow path, it can form easily each independently, for example by drilling.

[Application Example 8]
In the electronic component conveying apparatus of the present invention, it is preferable that the second supply channel and the second recovery channel are flexible tubes.
Thereby, routing (pipe) becomes easy.

[Application Example 9]
In the electronic component transport device of the present invention, the electronic component transport device includes a flow path member including the first supply flow path and the first recovery flow path,
It is preferable that the pipe has a curved portion, and the curved portion is arranged vertically above the flow path member.

  Thereby, the second supply flow path and the second recovery flow path are unevenly distributed on the side where relatively few other structures that can interfere with the second supply flow path and the second recovery flow path are disposed, that is, Can be sent.

[Application Example 10]
In the electronic component transport device of the present invention, the electronic component transport device includes a flow path member that includes the first supply flow path and the first recovery flow path and surrounds the contact member in plan view.
It is preferable that each of the second supply channel and the second recovery channel is disposed inside the channel member.

  This restricts the second supply flow path and the second recovery flow path from being deformed and protruded outward from the flow path member, so that the second supply flow path and the second recovery flow path It can be prevented from being caught by the structure or the like.

[Application Example 11]
In the electronic component transport device of the present invention, the supply flow path connecting portion in which the first supply flow path and the second supply flow path are connected, and the first recovery flow path and the second recovery flow path are connected. It is preferable that the recovered flow path connecting portions are staggered.

  As a result, the adjacent second supply flow path and second recovery flow path can be arranged close together, that is, with a small interval, thereby contributing to the downsizing of the electronic component transport apparatus.

[Application Example 12]
In the electronic component transport device of the present invention, the electronic component transport device includes a flow path member including the first supply flow path and the first recovery flow path,
It is preferable that the supply flow path connection portion and the recovery flow path connection portion are disposed on a vertical upper surface of the flow path member.

  Thereby, the second supply flow path and the second recovery flow path are unevenly distributed on the side where relatively few other structures that can interfere with the second supply flow path and the second recovery flow path are disposed, that is, Can be sent.

[Application Example 13]
In the electronic component transport device of the present invention, it is preferable that the supply flow path connection portion and the recovery flow path connection portion include a relay block and are brazed to the relay block.

  Thereby, when exchanging a 2nd supply flow path and a 2nd collection | recovery flow path, it can replace | exchange for every relay block, Therefore The exchange operation | work becomes easy.

[Application Example 14]
In the electronic component transport device of the present invention, it is preferable that the relay block is connected to the flow path member by screwing.

  Thereby, when exchanging a 2nd supply flow path and a 2nd collection | recovery flow path, it can replace | exchange for every relay block, Therefore The exchange operation | work becomes easy.

[Application Example 15]
In the electronic component transport device of the present invention, it is preferable that the connection between the second supply flow path and the contact member and the connection between the second recovery flow path and the contact member are by brazing.

  This prevents the second supply channel and the second recovery channel from unintentionally leaving the contact member.

[Application Example 16]
In the electronic component conveying apparatus of the present invention, it is preferable to have a flow path member including the supply flow path and the recovery flow path.
Thereby, the supply channel and the recovery channel can be easily routed.

[Application Example 17]
In the electronic component conveying apparatus of the present invention, it is preferable that the flow path member has a frame shape.

  Thereby, the contact member and the flow path member can be connected to each contact member at the shortest possible distance.

[Application Example 18]
The electronic component inspection apparatus of the present invention includes a contact member including a contact portion that contacts the electronic component;
A supply flow path for supplying a refrigerant to the contact member;
A recovery flow path for recovering the refrigerant from the contact member;
And an inspection unit for inspecting the electronic component.
Thereby, it is excellent in the cooling responsiveness in an abutting member.

FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a perspective view of the device transport head in the inspection region provided in the electronic component inspection apparatus shown in FIG. FIG. 3 is a diagram (plan view) viewed from the direction of arrow A in FIG. FIG. 4 is a view (side view) seen from the direction of arrow B in FIG. FIG. 5 is a schematic horizontal cross-sectional view of the flow path member included in the device transport head shown in FIG. 6 is a cross-sectional view taken along line CC in FIG. FIG. 7 is a schematic vertical cross-sectional view of the contact member and its surroundings included in the device transport head shown in FIG. FIG. 8 is a schematic vertical cross-sectional view of the contact member and its surroundings included in the device transport head shown in FIG. FIG. 9 is a block diagram of the device transport head shown in FIG. 2 and its surroundings. FIG. 10 is a vertical cross-sectional view of a part of the device transport head in the inspection region provided in the electronic component inspection apparatus (second embodiment) of the present invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a perspective view of the device transport head in the inspection region provided in the electronic component inspection apparatus shown in FIG. FIG. 3 is a diagram (plan view) viewed from the direction of arrow A in FIG. FIG. 4 is a view (side view) seen from the direction of arrow B in FIG. FIG. 5 is a schematic horizontal cross-sectional view of the flow path member included in the device transport head shown in FIG. 6 is a cross-sectional view taken along line CC in FIG. 7 and 8 are schematic vertical cross-sectional views of the abutting member and its surroundings which the device transport head shown in FIG. 2 has, respectively. FIG. 9 is a block diagram of the device transport head shown in FIG. 2 and its surroundings. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component conveyance apparatus that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 80. In the inspection apparatus 1, from the tray supply area A1 to the tray removal area A5, the area from the supply area A2 to which the IC device 90 is conveyed to the collection area A4 can also be referred to as a “conveyance area (conveyance area)”.

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are disposed (the lower side in FIG. 1) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is disposed (see FIG. 1). 1 is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray (arrangement member) 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjusting unit (soak plate) 12, a device transport head 13, and a tray transport mechanism (first transport device) 15 are provided.

  The temperature adjustment unit 12 is a mounting unit on which a plurality of IC devices 90 are mounted, and can heat or cool the plurality of IC devices 90. Thereby, the IC device 90 can be adjusted to a temperature suitable for inspection. In the configuration shown in FIG. 1, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply region A1 by the tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports an empty tray 200 in a state where all IC devices 90 have been removed in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transport head 17, and a device recovery unit (recovery shuttle) 18 are provided.

  The device supply unit 14 is a mounting unit on which the temperature-adjusted IC device 90 is mounted, and can transport the IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. The

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  The device transport head 17 is supported so as to be movable in the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16.

  The device collection unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed, and can transport the IC device 90 to the collection region A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 1, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 includes any one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism (second conveyance device) 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 is placed, and is fixed in the collection area A4. In the configuration shown in FIG. 1, three collection trays 19 are arranged along the X direction. The empty trays 200 are also placement units on which the IC devices 90 are placed, and three empty trays 200 are arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200. Thus, in the inspection apparatus 1, the tray transport mechanism 21 is provided in the collection area A4, and the tray transport mechanism 15 is provided in the supply area A2. Thereby, for example, the throughput (the number of IC devices 90 to be transported per unit time) can be improved as compared to transporting an empty tray 200 in the X direction with a single transport mechanism.

  The configurations of the tray transport mechanisms 15 and 21 are not particularly limited. For example, the tray transport mechanisms 15 and 21 include a suction member that sucks the tray 200 and a support mechanism such as a ball screw that supports the suction member so as to be movable in the X direction. Is mentioned.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The control unit 80 has, for example, a drive control unit. The drive control unit includes, for example, tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and tray conveyance mechanism 22A, 22B is controlled.

  The test control unit of the tester inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a memory (not shown), for example.

  In the inspection apparatus 1 as described above, in addition to the temperature adjustment unit 12 and the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 are also configured to be able to heat or cool the IC device 90. Thereby, the temperature of the IC device 90 is kept constant while being transported. In the following, the case where the IC device 90 is cooled and inspected in a low temperature environment within a range of, for example, −60 ° C. to −40 ° C. will be described.

  As shown in FIG. 1, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (partitioned) by a first partition wall 61, and the supply area A2 and the inspection area A3 are separated. It is divided by the second partition wall 62, the inspection area A3 and the collection area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. ing. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each region. Further, the outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, side covers 71 and 72, and a rear cover 73.

  The supply area A2 is a first chamber R1 defined by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side cover 71, and the rear cover 73. A plurality of IC devices 90 in an uninspected state are carried into the first chamber R1 together with the tray 200.

  The inspection area A3 is a second chamber R2 defined by the second partition wall 62, the third partition wall 63, and the rear cover 73. In the second chamber R2, an inner partition 66 is disposed on the inner side of the rear cover 73.

  The collection area A4 is a third chamber R3 defined by the third partition wall 63, the fourth partition wall 64, the fifth partition wall 65, the side cover 72, and the rear cover 73. A plurality of IC devices 90 that have been inspected are carried into the third chamber R3 from the second chamber R2.

  As shown in FIG. 1, the side cover 71 is provided with a first door (left first door) 711 and a second door (left second door) 712. By opening the first door 711 and the second door 712, for example, maintenance in the first chamber R1, release of jam in the IC device 90, and the like (hereinafter collectively referred to as “operation”) can be performed. . The first door 711 and the second door 712 are so-called “folding doors” that open and close in opposite directions. In addition, when working in the first chamber R1, movable parts such as the device transport head 13 in the first chamber R1 are stopped. The first door 711 and the second door 712 can be locked and unlocked collectively by the operation of the cylinder 740.

  Similarly, the side cover 72 is provided with a first door (right first door) 721 and a second door (right second door) 722. By opening the first door 721 and the second door 722, for example, work in the third chamber R3 can be performed. The first door 721 and the second door 722 are also so-called “folding doors” that open and close in opposite directions. Further, during the work in the third chamber R3, the movable part such as the device transport head 20 in the third chamber R3 stops. The first door 721 and the second door 722 can be locked and unlocked collectively by the operation of the cylinder 745.

The rear cover 73 is also provided with a first door (back side first door) 731, a second door (back side second door) 732, and a third door (back side third door) 733. By opening the first door 731, for example, work in the first chamber R <b> 1 can be performed. By opening the third door 733, for example, work in the third chamber R3 can be performed. Further, the inner partition 66 is provided with a fourth door 75. Then, by opening the second door 732 and the fourth door 75, for example, work in the second chamber R2 can be performed. The first door 731, the second door 732, and the fourth door 75 open and close in the same direction, and the third door 733 opens and closes in the opposite direction to these doors. Further, during the work in the second chamber R2, the movable parts such as the device transport head 17 in the second chamber R2 are stopped. The first door 731 can be locked and unlocked by the operation of the cylinder 741, the second door 732 can be locked and unlocked by the operation of the cylinder 742, and the third door 733 can be operated by the cylinder 744. Can be unlocked and unlocked,
The fourth door 75 can be locked and unlocked by the operation of the cylinder 743.

  And by closing each door, the airtightness and heat insulation in each room | chamber corresponding can be ensured.

  As described above, in the inspection apparatus 1, the IC device 90 is inspected in a low temperature environment within a range of, for example, −60 ° C. to −40 ° C., so that the temperature adjustment unit 12, device transport head 13, device The supply unit 14, the device transport head 17, and the inspection unit 16 are configured to be able to cool the IC device 90. Among these, temperature management at the device transport head 17 in the inspection area A3 where the inspection is performed is relatively important. Hereinafter, the device transport head 17 will be described.

  As shown in FIGS. 2 to 4, the device transport head 17 includes a head unit 171 and a cooling unit (cooling structure) 172.

  As shown in FIG. 3, the head unit 171 includes 16 heads 3 and a support body 173 that supports these heads 3 collectively.

The support body 173 is a plate member that supports the 16 heads 3 from above.
In the present embodiment, the 16 heads 3 are arranged in a matrix of 2 rows in the Y direction and 8 columns in the X direction (see FIG. 3), and numbers “head 1” to “head 16” are sequentially assigned. (See FIGS. 7 and 8). Since these heads 3 have substantially the same configuration except that their arrangement locations are different, only one head 3 will be representatively described below.

  As shown in FIGS. 7 and 8, the head 3 is a contact member that contacts the IC device 90. The head 3 includes a contact portion 31, a heat transfer block 32, a cooling block 33, a housing 34, a Pt sensor 35, and a heater 36.

  The contact portion 31 includes a tip block portion 311 positioned below and a flange portion 312 provided on the top of the tip block portion 311. The contact portion 31 is made of a metal material such as aluminum.

  The tip block portion 311 is a portion that comes into contact with the upper surface 901 of the IC device 90 from above. The tip block portion 311 incorporates a Pt sensor 35 as a temperature detection portion that detects the temperature of the contact portion 31. The temperature detected by the Pt sensor 35 can be regarded as the temperature of the IC device 90 that is in contact with the tip block portion 311.

  As shown in FIG. 9, the Pt sensor 35 is electrically connected to the control unit 80, and the detection result when the temperature is detected is transmitted to the control unit 80. Since one Pt sensor 35 is provided for each head 3, there are a total of 16 Pt sensors 35 in the configuration shown in FIG.

  The flange portion 312 is a portion that is detachably attached to the housing 34. Thereby, the contact part 31 can be replaced | exchanged for every kind of IC device 90. FIG.

The housing 34 accommodates the heat transfer block 32 and the cooling block 33.
The heat transfer block 32 is fixed to the housing 34 and is in contact with the flange portion 312 of the contact portion 31. The heat transfer block 32 is made of a metal material such as aluminum. The heat transfer block 32 includes a heater 36. Thereby, the heat generated by the heater 36 can be transmitted to the IC device 90 through the heat transfer block 32 and the contact portion 31, and the IC device 90 can be heated.

  Above the heat transfer block 32, a cooling block 33 made of the same material as the heat transfer block 32 is disposed. The cooling block 33 has a flow path 331 through which the refrigerant RF from the cooling unit 172 passes.

  The cooling block 33 can slide up and down in the housing 34. The cooling block 33 is urged upward by an urging member (not shown). As a result, the cooling block 33 takes a state of being separated from the heat transfer block 32 (see FIG. 7) and a state of being in contact with the heat transfer block 32 against the biasing force of the biasing member (see FIG. 8). obtain. Then, the cooling block 33 in which the flow path 331 is filled with the refrigerant RF contacts the heat transfer block 32 at a predetermined timing, so that the heat of the IC device 90 is absorbed through the contact portion 31 and the heat transfer block 32. can do. The IC device 90 can be cooled by this heat absorption. During cooling, the heater 36 is stopped.

  Above the cooling block 33, a space 341 is defined by the cooling block 33 and the housing 34. The space 341 communicates with the pump 24 via the pipe 23. By operating the pump 24, the working fluid WF can be supplied to make the space 341 pressurized, so that the cooling block 33 resists the urging force of the urging member to the heat transfer block 32. Can abut.

  Further, a valve 25 is installed between the space 341 and the pump 24 in the pipe 23. Thereby, the supply of the working fluid WF into the space 341 and the stop of the supply can be switched.

  As shown in FIG. 9, the valve 25 is electrically connected to the control unit 80. When the IC device 90 is to be cooled based on the detection result of the Pt sensor 35, the control unit 80 opens the valve 25, supplies the working fluid WF into the space 341, and cools the IC device 90. When stopping, the valve 25 is closed and the supply of the working fluid WF is stopped. In addition, since one valve 25 is provided corresponding to each head 3, in the configuration shown in FIG.

  By providing a plurality of heads 3 having the above-described configuration (16 in the present embodiment), a plurality of IC devices 90 can be collectively pressed against the inspection unit 16, thereby facilitating quick inspection. Can be done.

  As shown in FIG. 2, the cooling unit 172 includes a flow path member 4, 16 supply flexible tubes 5 </ b> A, 16 recovery flexible tubes 5 </ b> B, a supply joint 37, and a recovery joint 38. And have.

  As shown in FIGS. 2 and 3, the flow path member 4 is an “O” -shaped frame that surrounds the head unit 171 (head 3) when viewed from above (in plan view). Thus, the head 3 and the flow path member 4 can be connected to each head 3 of the head unit 171 through the supply flexible tube 5A and the recovery flexible tube 5B at the shortest distance possible. it can.

  In the present embodiment, the flow path member 4 has a substantially rectangular outer shape when viewed from above in the vertical direction, along the long side 41 and the long side 43 extending along the X direction, and along the Y direction. And have a short side 42 and a short side 44 extending.

  Then, as shown in FIG. 5, the flow path member 4 collects the first supply flow path 47 that is a part of the supply flow path 10 </ b> A that supplies the refrigerant RF to each head 3 and the refrigerant RF from each head 3. The first recovery flow path 48 which is a part of the recovery flow path 10B to be formed is formed (included).

  The first supply flow path 47 starts from the long side 41 side of the flow path member 4 and starts from the start point 471 along the long side 41, the short side 42, and the long side 43, and the end point 472 on the short side 44 side. It has become. The refrigerant RF flows down from the start point 471 side toward the end point 472 side.

  Further, the first supply flow path 47 is connected to the supply joint 37 at the start point 471. The supply joint 37 is connected to the refrigerant source 28 via the pipe 26. The refrigerant source 28 functions as a refrigerant supply unit that supplies the refrigerant RF to the first supply flow path 47. In addition, it does not specifically limit as refrigerant | coolant RF, For example, liquids, such as a fluorinate, can be used.

  On the other hand, the first recovery flow path 48 starts from the long side 41 side of the flow path member 4 and starts from the start point 481 in order along the long side 41, the short side 42, the long side 43, and the short side 44. The end point 482 is on the side 41 side. The refrigerant RF flows down from the start point 481 side toward the end point 482 side.

  Further, the first recovery flow path 48 is connected to the recovery joint 38 at the end point 482. The recovery joint 38 is connected to the refrigerant source 28 via the pipe 27. The refrigerant source 28 also functions as a refrigerant recovery unit that recovers the refrigerant RF from the recovery joint 38.

  The supply joint 37 and the recovery joint 38 are so-called “elbow type” joints.

  As shown in FIG. 5, the first supply channel 47 is disposed outside the first recovery channel 48. Further, as shown in FIG. 6, the first supply channel 47 is disposed above the first recovery channel 48. Accordingly, FIG. 5 is a horizontal cross-sectional view, but the horizontal cross section in the first supply flow path 47 and the horizontal cross section in the first recovery flow path 48 are not the same horizontal cross section, but the horizontal cross section shifted in the vertical direction. It has become.

  Since the first supply flow path 47 and the first recovery flow path 48 are arranged in this manner, when the first supply flow path 47 is formed, the long side 41, the short side 42, the long side For each side of the side 43 and the short side 44, for example, a straight hole communicating with each other using a drill is formed, and when the first recovery channel 48 is formed, the long side 41, the short side 42, For each side of the long side 43 and the short side 44, straight holes communicating with each other can be formed using, for example, a drill. After the formation of each hole, the opening of the hole is sealed with a plug 49, whereby the first supply channel 47 and the first recovery channel 48 are obtained.

  Since the 16 supply flexible tubes 5A and the 16 collection flexible tubes 5B have the same configuration except that they are arranged differently, hereinafter, one supply connected to one head 3 will be described. The flexible tube 5A and one collection flexible tube 5B will be representatively described.

  As shown in FIG. 5, the supply flexible tube 5 </ b> A has one end serving as a supply flow path connecting portion 51 </ b> A and connected to the middle of the first supply flow path 47, and the other end connected to the head side flow path. The portion 52 </ b> A is connected to the entrance of the flow path 331 of the head 3. As a result, the hollow portion (lumen portion) of the supply flexible tube 5 </ b> A becomes a second supply flow channel 53 </ b> A that branches from the first supply flow channel 47 toward the flow channel 331 of one head 3. The second supply channel 53A and the first supply channel 47 constitute the supply channel 10A. Thereby, the refrigerant RF can be supplied to the head 3 with a simple configuration.

  One end of the recovery flexible tube 5B serves as a recovery flow path connecting portion 51B and is connected to the middle of the first recovery flow path 48, and the other end serves as a head side flow path connecting portion 52B. 3 is connected to the outlet of the third flow path 331. As a result, the hollow portion (lumen portion) of the recovery flexible tube 5 </ b> B becomes a second recovery flow channel 53 </ b> B that branches from the first recovery flow channel 48 and goes to the flow channel 331 of one head 3. The second recovery channel 53B and the first recovery channel 48 constitute a recovery channel 10B. Thereby, the refrigerant RF can be recovered from the head 3 with a simple configuration.

  Then, by having the supply flow path 10A and the recovery flow path 10B configured as described above, the refrigerant RF can be supplied to each head 3 without excess or deficiency while circulating the refrigerant RF. . Thereby, the cooling responsiveness in the supply flow path 10A is excellent, and thus the IC device 90 can be efficiently cooled.

  Further, since the supply flexible tube 5A and the recovery flexible tube 5B are each flexible, they can be easily routed. Thereby, as shown in FIG. 4, the supply flexible tube 5 </ b> A and the recovery flexible tube 5 </ b> B can be piped (arranged) as far as possible inside the flow path member 4. Such piping restricts the supply flexible tube 5 </ b> A and the recovery flexible tube 5 </ b> B from being deformed and projecting outward from the flow path member 4. Thereby, even if the device transport head 17 moves in the inspection area A3, the supply flexible tube 5A and the recovery flexible tube 5B are referred to as other structures (hereinafter simply referred to as “other structures”). ) Can be prevented.

  As shown in FIG. 2, in the supply flexible tube 5A, the supply flow path connecting portion 51A is disposed on the vertical upper surface 45 of the flow path member 4, and the recovery flexible tube 5B is also flown through the recovery flow path connecting portion 51B. It is arranged on the vertical upper surface 45 of the road member 4. Further, as shown in FIG. 4, the supply flexible tube 5A is provided with a curved portion 54A that is arranged vertically above the flow path member 4 and is curved in a hairpin shape. Further, a curved portion 54B that is arranged vertically above the flow path member 4 and is curved in a hairpin shape is formed. By such a pipe, the supply flexible tube 5A and the recovery flexible tube 5B can be unevenly distributed, that is, close to the side where a relatively small amount of other structures are disposed.

  As shown in FIG. 5, the supply flow path connection portion 51A and the recovery flow path connection portion 51B are staggered. As a result, the supply flexible tube 5A and the recovery flexible tube 5B adjacent to each other in the X direction can be arranged close to each other in the X direction, that is, with a small interval therebetween, and thus the device transport head 17 can be reduced in size. Contribute to.

  In the present embodiment, it is preferable that the supply flow path connection portion 51A and the recovery flow path connection portion 51B are connected to the flow path member 4 by brazing.

  Moreover, it is preferable that the head side flow path connection part 52A and the head side flow path connection part 52B are connected to the head 3 by brazing. As a result, the head-side flow path connection portion 52A and the head-side flow path connection portion 52B are unintentionally detached from the head 3, that is, the connection between the head-side flow path connection portion 52A and the head-side flow path connection portion 52B is unintentional. Is prevented from being released.

Second Embodiment
FIG. 10 is a vertical cross-sectional view of a part of the device transport head in the inspection region provided in the electronic component inspection apparatus (second embodiment) of the present invention.

  Hereinafter, the second embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to this drawing. However, the description will focus on differences from the above-described embodiment, and the same matters will be described. Is omitted.

  The present embodiment is the same as the first embodiment except that the configurations (connection modes) of the supply flow path connection portion and the recovery flow path connection portion are different.

  As shown in FIG. 10, in this embodiment, the supply flow path connecting portion 51A (or the recovery flow path connecting portion 51B) has a relay block 55, and the supply flexible tube 5A ( Alternatively, the recovery flexible tube 5B) is connected by brazing.

  Further, the relay block 55 has a plurality (two in the configuration shown in FIG. 10) counterbored holes 551. On the other hand, in the flow path member 4, screw holes 46 are formed at positions corresponding to the counterbore holes 551. Then, a bolt (hexagon socket head bolt) 56 can be inserted into each counterbore hole 551 and the bolt 56 and the screw hole 46 can be screwed together. Thereby, the relay block 55 can be connected by screwing.

  With the configuration as described above, when the supply flexible tube 5A is replaced, if the bolt 56 is loosened, the relay block 55 can be replaced together, thereby facilitating replacement.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Further, the number of heads included in the head unit is 16 in each of the above embodiments, but it is needless to say that the number is not limited to this.

  In addition, the flow path member is an “O” -shaped frame in each of the embodiments described above, but is not limited thereto, and may be a “U” -shaped frame.

  Moreover, although the 1st supply flow path is arrange | positioned outside the 1st collection | recovery flow path in the said embodiment, it is not limited to this, You may be arrange | positioned inside the 1st collection | recovery flow path.

  Moreover, although the 1st supply flow path is arrange | positioned above the 1st collection | recovery flow path in the said embodiment, it is not limited to this, You may arrange | position below the 1st collection | recovery flow path. .

1 ... Inspection equipment (electronic parts inspection equipment)
10A: Supply flow path 10B: Recovery flow path 11A, 11B: Tray transport mechanism 12: Temperature adjustment section (soak plate)
13 …… Device transport head 14 …… Device supply unit (supply shuttle)
15. Tray transport mechanism (first transport device)
16 …… Inspection unit 17 …… Device transfer head 171 …… Head unit 172 …… Cooling unit (cooling structure)
173 ... Support 18 ... Device recovery unit (recovery shuttle)
19 …… Tray for collection 20 …… Device transfer head 21 …… Tray transfer mechanism (first transfer device)
22A, 22B …… Tray transport mechanism 23 …… Pipe 24 …… Pump 25 …… Valve 26, 27 …… Pipe 28 …… Refrigerant source 3 …… Head 31 …… Abutting portion 311 …… Tip block portion 312 …… Flange 32 ... Heat transfer block 33 ... Cooling block 331 ... Flow path 34 ... Housing 341 ... Space 35 ... Pt sensor 36 ... Heater 37 ... Supply joint 38 ... Recovery joint 4 ... Flow path member 41... Long side 42... Short side 43... Long side 44... Short side 45... Vertical top surface 46... Screw hole 47 ... First supply flow path 471 ... Start point 472 ... End point 48 …… First recovery channel 481 …… Start point 482 …… End point 49 …… Plug 5A …… Supply flexible tube 51A …… Supply channel connection 52A …… Head side channel connection 53A …… Second supply Flow path 54A ... curved Portion 5B …… Flexible tube for recovery 51B …… Recovery flow channel connecting portion 52B …… Head side flow channel connecting portion 53B …… Second recovery flow channel 54B …… Bending portion 55 …… Relay block 551 …… Counterbore hole 56 ...... Bolt (Hexagon socket head cap screw)
61 …… First partition 62 …… Second partition 63 …… Third partition 64 …… Fourth partition 65 …… Fifth partition 66 …… Inner partition 70… Front cover 71 …… Side cover 711 …… First Door 712 ... Second door 72 ... Side cover 721 ... First door 722 ... Second door 73 ... Rear cover 731 ... First door 732 ... Second door 733 ... Third door 740, 741, 742, 743, 744, 745 ... Cylinder 75 ... Fourth door 80 ... Control unit 90 ... IC device 901 ... Upper surface 200 ... Tray (arrangement member)
A1 …… Tray supply area A2 …… Device supply area (supply area)
A3: Inspection area A4: Device collection area (collection area)
A5 …… Tray removal area R1 …… First chamber R2 …… Second chamber R3 …… Third chamber RF …… Refrigerant WF …… Working fluid

Claims (18)

A contact member including a contact part that contacts the electronic component;
A supply flow path for supplying a refrigerant to the contact member;
An electronic component transport apparatus comprising: a recovery flow path for recovering the refrigerant from the contact member.   The electronic component transport apparatus according to claim 1, wherein a plurality of the contact members are provided.   The electronic component conveying apparatus according to claim 2, wherein the supply flow path includes a first supply flow path connected to a refrigerant supply unit and a second supply flow path branched into a plurality from the first supply flow path.   The electronic component transport apparatus according to claim 3, wherein the recovery channel includes a first recovery channel connected to a refrigerant recovery unit and a second recovery channel branched into a plurality from the first recovery channel.   The electronic component transport apparatus according to claim 4, further comprising a flow path member including the first supply flow path and the first recovery flow path.   The electronic component conveying apparatus according to claim 5, wherein the flow path member surrounds the contact member in a plan view.   The electronic component transport apparatus according to claim 6, wherein the first supply channel is disposed either inside or outside the first recovery channel.   The electronic component conveying apparatus according to any one of claims 4 to 7, wherein the second supply channel and the second recovery channel are pipes having flexibility. A flow path member including the first supply flow path and the first recovery flow path;
The electronic component conveying apparatus according to claim 8, wherein the tube has a curved portion, and the curved portion is arranged vertically above the flow path member. A flow path member that includes the first supply flow path and the first recovery flow path and surrounds the contact member in plan view;
10. The electronic component conveying apparatus according to claim 4, wherein the second supply flow path and the second recovery flow path are each disposed inside the flow path member. 11.   What is a supply flow path connection part in which the first supply flow path and the second supply flow path are connected, and a recovery flow path connection part in which the first recovery flow path and the second recovery flow path are connected The electronic component carrying device according to claim 4, wherein the electronic component carrying device is arranged in a staggered manner. A flow path member including the first supply flow path and the first recovery flow path;
The electronic component transport apparatus according to claim 11, wherein the supply flow path connection portion and the recovery flow path connection portion are disposed on a vertical upper surface of the flow path member.   The electronic component conveying apparatus according to claim 12, wherein the supply flow path connecting portion and the recovery flow path connecting portion include a relay block and are brazed to the relay block.   The electronic component transport apparatus according to claim 13, wherein the relay block is connected to the flow path member by screws.   The connection according to any one of claims 4 to 14, wherein the connection of the second supply channel with the contact member and the connection of the second recovery channel with the contact member are performed by brazing. Parts transport device.   The electronic component carrying apparatus according to claim 1, further comprising a flow path member including the supply flow path and the recovery flow path.   The electronic component conveying apparatus according to claim 16, wherein the flow path member has a frame shape. A contact member including a contact part that contacts the electronic component;
A supply flow path for supplying a refrigerant to the contact member;
A recovery flow path for recovering the refrigerant from the contact member;
An electronic component inspection apparatus comprising: an inspection unit that inspects the electronic component.

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