WO2017056461A1

WO2017056461A1 - Electronic component conveying apparatus and electronic component inspection apparatus

Info

Publication number: WO2017056461A1
Application number: PCT/JP2016/004303
Authority: WO
Inventors: 大輔桐原; 政己前田; 聡興下島; 康敏夏井坂
Original assignee: セイコーエプソン株式会社
Priority date: 2015-09-30
Filing date: 2016-09-21
Publication date: 2017-04-06
Also published as: CN108012563A; TW201816410A; TW201713957A; TWI617819B

Abstract

Provided is an electronic component conveying apparatus and an electronic component inspection apparatus capable of locally spraying ionized, dry air on a target. The electronic component conveying apparatus comprises a dry air supply unit 3A capable of supplying dry air DA, an ion generation unit capable of ionizing the dry air, a spray unit 5A capable of spraying the dry air (ionized air IA) ionized by the ion generation unit, a temperature adjustment unit 12 that, as an electronic component disposition unit, capable of disposing and cooling an IC device 90, which is an electronic component, and a storage unit 8A that is capable of storing the temperature adjustment unit 12 and that has an opening 841 through which the IC device 90 can pass, wherein the spray unit 5A comprises at least one spray opening 511 capable of spraying the ionized air IA on the interior of the storage unit 8A.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects (tests) the electrical characteristics of an electronic component such as a semiconductor element (for example, an IC device) is known.

This electronic component inspection apparatus includes an apparatus that contacts ionized blow air while heating an electronic component being inspected by an inspection socket (see, for example, Patent Document 1). And the neutralization removal of the static electricity with respect to the said electronic component is performed by the contact of the ionized blow air.

Further, this electronic component inspection apparatus incorporates an electronic component transport apparatus for transporting an IC device (see, for example, Patent Document 2).
Further, in the electronic component inspection apparatus, a plurality of IC devices are placed on a tray, and the entire tray is placed in the apparatus, whereby the tray is transported to an inspection section where inspection is performed by the transport section. When the inspection is completed, the IC device is placed on the tray, conveyed along with the tray by the conveyance unit, and discharged outside the apparatus.

In such an electronic component transport device, a door (opening / closing part) is provided on the outermost layer cover. For example, when the operation of the transport part is stopped or maintenance is performed for some reason, May open the door.

JP 2010-223588 A Japanese Patent Laid-Open No. 11-11802

However, since the electronic component inspection apparatus described in Patent Document 1 is configured to fill a predetermined interior with ionized blow air, for example, the ionized blow air is locally applied to the cooled electronic component. If you want, it was impossible.

Moreover, in the electronic component inspection apparatus described in Patent Document 2, for example, an operator opens the door when the electronic component inspection apparatus is filled with a cooling gas or the internal temperature is relatively high. Even in an unfavorable state, it was difficult for the operator to determine whether or not to open the door.

The present invention has been made to solve at least a part of the problems described above, and can be realized as the following forms or application examples.

Application Example 1 An electronic component transport apparatus according to this application example includes a dry air supply unit capable of supplying dry air, an ion generation unit capable of ionizing dry air, and an injection unit capable of ejecting the ionized dry air. And an electronic component placement part that can place and cool the electronic component, and a storage part that can store the electronic component placement part and has an opening through which the electronic component can pass. It has at least 1 jet nozzle which can inject the said ionized dry air inside a storage part, It is characterized by the above-mentioned.

The electronic component conveying apparatus according to this application example can spray ionized dry air locally on the target by appropriately setting the position of the ejection port, and therefore performs static elimination at the target. Can do. In addition, since the inside of the storage unit is filled with the dry air from the dry air supply unit, it is possible to prevent the ionized dry air from decreasing the static elimination effect due to moisture.

Application Example 2 In the electronic component transport apparatus according to the application example, it is preferable that the storage unit is provided in an exterior of the electronic component transport apparatus.

This makes it possible to easily fill the portion necessary for preventing condensation with dry air from the dry air supply unit.

Application Example 3 In the electronic component transport apparatus according to the application example described above, the dry air from the dry air supply unit and the dry air from the ion generation unit are each lower than the humidity outside the exterior. Is preferred.

Thereby, it is possible to prevent the dew condensation from occurring in the storage unit regardless of the usage environment of the electronic component conveying apparatus.

Application Example 4 In the electronic component transport device according to the application example described above, it is preferable that the pressure inside the storage unit is higher than the pressure outside the storage unit.

As a result, the dry air from the dry air supply unit is ejected through the opening of the storage unit, and accordingly, relatively humid air outside the storage unit is prevented from flowing into the storage unit through the opening. can do.

Application Example 5 In the electronic component transport apparatus according to the application example described above, the electronic component placement unit is preferably a soak plate capable of adjusting the temperature of the electronic component.

Thus, when an electrical inspection is performed on an electronic component in the electronic component transport apparatus, the electronic component can be cooled or heated in advance before the inspection and adjusted to a temperature suitable for the inspection.

Application Example 6 In the electronic component transport apparatus according to the application example, it is preferable that the electronic component placement unit is a shuttle plate capable of transporting the electronic component.

Thus, when an electrical inspection is performed on an electronic component in the electronic component transport apparatus, the electronic component can be transported toward an inspection unit capable of the inspection.

Application Example 7 In the electronic component transport apparatus according to the application example, it is preferable that the storage unit includes a plurality of the openings and a shutter that opens and closes the plurality of openings.

Thereby, the opening can take an open state and a closed state. In the closed state, the airtightness of the storage unit can be ensured, and therefore relatively humid air outside the storage unit can be prevented from flowing into the storage unit through the opening. In the open state, the electronic component can be taken out of the storage unit.

Application Example 8 In the electronic component transport apparatus according to the application example described above, it is preferable that the installation height of the ejection port is higher than the upper surface of the electronic component placement unit.

Thereby, the ionized dry air can pass directly above the electronic component. At this time, the surface of the electronic component comes into contact with the dry air and is neutralized.

Application Example 9 In the electronic component transport apparatus according to the application example described above, it is preferable that the installation location of the ion generation unit is higher than the electronic component placement unit.

The dry air from the ion generator has a higher specific gravity than the atmosphere. For this reason, if the ion generation part is installed in the position higher than an electronic component arrangement | positioning part, the said dry air can flow down rapidly toward an electronic component arrangement | positioning part.

Application Example 10 In the electronic component transport apparatus according to the application example described above, when the electronic component placement unit is viewed in plan, there is at least one ion generating unit installed around the electronic component placement unit. Is preferred.

Thereby, for example, when a plurality of electronic component placement portions are provided, the ionized dry air can be directed as uniformly as possible to the electronic components on each electronic component placement portion.

Application Example 11 In the electronic component transport device according to the application example described above, the electronic component placement unit has a concave portion in which the electronic components are arranged one by one, and the installation location of the ejection port is that of the concave portion. It is preferable that it is upward.

This makes it possible to bring the jet outlet as close as possible to the electronic component in the recess, thereby improving the static elimination effect by the ionized dry air.

[Application Example 12] In the electronic component transport device according to the application example described above, it is preferable that the installation location of the ejection port corresponds to each of the recesses.

Thereby, ionized dry air can be individually blown against the electronic components located in the respective recesses, so that sufficient static elimination can be performed.

Application Example 13 In the electronic component transport apparatus according to the application example described above, it is preferable that a plurality of the ejection ports are provided, and the plurality of ejection ports are arranged in a planar direction.

Application Example 14 An electronic component inspection apparatus according to this application example includes a dry air supply unit that can supply dry air, an ion generation unit that can ionize dry air, and an injection unit that can inject the ionized dry air. An electronic component placement section that can place and cool the electronic component, a storage section that can store the electronic component placement section and has an opening through which the electronic component can pass, and an inspection section that inspects the electronic component The injection unit has at least one injection port capable of injecting the ionized dry air inside the storage unit.

The electronic component inspection apparatus according to this application example can spray ionized dry air locally on the target by appropriately setting the position of the jet outlet, and therefore performs static elimination at the target. Can do. In addition, since the inside of the storage unit is filled with the dry air from the dry air supply unit, it is possible to prevent the ionized dry air from decreasing the static elimination effect due to moisture.

Application Example 15 An electronic component transport apparatus according to this application example includes a transport unit capable of transporting an electronic component, an openable / closable opening / closing unit, a display unit capable of displaying an operating state of the transport unit, and the open / close unit. And a notifying unit for notifying whether or not opening and closing is possible.

This allows the operator to recognize whether the opening / closing part can be opened or closed. Therefore, for example, it is possible to prevent the operator from opening the opening / closing part even though the inside of the apparatus is not preferable for the operator. As a result, worker safety can be ensured.

Application Example 16 In the electronic component transport apparatus according to Application Example 15, it is preferable that the notification unit notifies using at least one of light and sound.

This allows the operator to recognize with high accuracy whether or not the opening / closing part can be opened and closed.

Application Example 17 In the electronic component transport device according to Application Example 15 or 16, it is preferable to include a lock unit that switches between maintaining the closed state of the opening / closing unit and releasing the closed state.

Thereby, for example, it is possible to prevent an operator from opening the opening / closing part by mistake during transportation of the electronic component.

[Application Example 18] In the electronic component transport device according to Application Example 17, it is preferable that the notification unit has a window part through which the operating state of the lock unit can be visually recognized.

Thereby, for example, provision of a device such as a display device as the notification unit can be omitted, and the configuration of the notification unit can be simplified.

Application Example 19 In the electronic component carrying device according to Application Example 18, the window portion includes a first display indicating that the opening / closing portion can be opened, and the first display portion. A second display indicating that the opening / closing part is restricted from being in the open state is provided at a position different from the display, and the notification part is in an operating state of the lock part. In conjunction, by moving between a first position that overlaps the first display via the window and a second position that overlaps the second display via the window, It is preferable to have an identification part for identifying whether the opening / closing part can be opened or closed.

Application Example 20 In the electronic component transport device according to any one of Application Examples 15 to 19, it is preferable that the notification unit is provided in the opening / closing unit.

Thus, when the operator performs the opening / closing operation of the opening / closing part, the operator can recognize with high accuracy whether the opening / closing part can be opened or closed.

[Application Example 21] In the electronic component transport device according to any one of Application Examples 15 to 20, it is preferable that the notification unit notifies information until the opening / closing unit can be opened.

Thereby, for example, when the information is time, the operator can grasp the time until the opening / closing part can be opened. Therefore, the operator can perform other operations before performing the operation of opening the opening / closing part.

[Application Example 22] In the electronic component conveyance device according to any one of Application Examples 15 to 21, the notification unit is positioned at a height of 600 mm or more and 2000 mm or less from an installation surface on which the electronic component conveyance device is installed. Is preferably arranged.

Thereby, when it is set as the structure which an alerting | reporting part alert | reports by visual recognition, it can alert | report to an operator with high accuracy.

[Application Example 23] In the electronic component carrying device according to any one of Application Examples 15 to 22, it is preferable that the display unit displays whether the opening / closing unit can be opened or closed.

Whether the opening / closing part can be opened or closed is displayed on the display part in addition to the notifying part, thereby making it easier for the operator to recognize.

[Application Example 24] An electronic component inspection apparatus according to this application example includes a transport unit capable of transporting an electronic component, an openable / closable opening / closing unit, a display unit capable of displaying an operating state of the transport unit, and the open / close unit. It is provided with the alerting | reporting part which alert | reports whether it can open and close, and the test | inspection part which test | inspects an electronic component.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a horizontal partial cross-sectional view of the soak plate provided in the electronic component inspection apparatus shown in FIG. 4 is a cross-sectional view taken along line AA in FIG. 3 (showing a state where the shutter is closed). FIG. 5 is a cross-sectional view taken along line AA in FIG. 3 (showing a state where the shutter is opened). 6 is a cross-sectional view taken along line BB in FIG. FIG. 7 is a horizontal partial cross-sectional view of the supply shuttle plate provided in the electronic component inspection apparatus shown in FIG. 8 is a cross-sectional view taken along the line CC in FIG. FIG. 9 is a plan view of a supply shuttle plate provided in the electronic component inspection apparatus (second embodiment) according to the present invention and its periphery. FIG. 10 is a schematic perspective view of the electronic component inspection apparatus (third embodiment) of the present invention viewed from the front side. FIG. 11 is a plan view of the electronic component inspection apparatus shown in FIG. FIG. 12 is a block diagram of the electronic component inspection apparatus shown in FIG. FIG. 13 is a diagram illustrating an opening / closing unit and a notification unit included in the electronic component inspection apparatus illustrated in FIG. 10. FIG. 14 is a diagram illustrating an opening / closing unit and a notification unit included in the electronic component inspection apparatus illustrated in FIG. 10. FIG. 15 is a diagram illustrating an opening / closing unit and a notification unit included in the electronic component inspection apparatus illustrated in FIG. 10. FIG. 16 is a diagram illustrating an opening / closing unit and a notification unit included in the electronic component inspection apparatus illustrated in FIG. 10. FIG. 17 is a flowchart showing a control operation of the electronic component inspection apparatus shown in FIG. FIG. 18 is a diagram illustrating an opening / closing unit and a notification unit included in the electronic component inspection apparatus (fourth embodiment) of the present invention. FIG. 19 is a diagram illustrating an opening / closing unit and a notification unit included in the electronic component inspection apparatus (fourth embodiment) of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments with reference to the accompanying drawings.
In the following embodiments, for convenience of explanation, three axes orthogonal to each other shown in the figure are defined as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. In each arrow indicating three axes, the tip side of the arrow is referred to as “positive side (+ side)”, and the base end side is referred to as “negative side (− side)”. Also, the + Z direction side in the figure may be referred to as “up (or upward)” and the −Z direction side may be referred to as “down (or downward)”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

<First Embodiment>
FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a horizontal partial cross-sectional view of the soak plate provided in the electronic component inspection apparatus shown in FIG. 4 is a cross-sectional view taken along the line AA in FIG. 3 showing a state where the shutter is closed, and FIG. 5 is a cross-sectional view taken along the line AA in FIG. 3 showing a state where the shutter is opened. is there. 6 is a cross-sectional view taken along line BB in FIG. FIG. 7 is a horizontal partial cross-sectional view of the supply shuttle plate provided in the electronic component inspection apparatus shown in FIG. 8 is a cross-sectional view taken along the line CC in FIG.

An inspection apparatus (electronic component inspection apparatus) 1 shown in FIGS. 1 and 2 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS). It is a device that transports electronic components such as Image® Sensors, and inspects and tests electrical characteristics (hereinafter simply referred to as “inspection”) during the transport process. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

As shown in FIGS. 1 and 2, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device recovery area (hereinafter simply referred to as “recovery area”). It is divided into A4 and a tray removal area A5. For example, in the normal transport mode, the IC device 90 sequentially passes through the tray supply area A1 to the tray removal area A5 (each area), and the inspection is performed in the intermediate inspection area A3.
As described above, the inspection apparatus 1 includes the electronic component conveyance device (handler) that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 80. . In addition, the inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700 (see FIG. 1).

In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are arranged (the −Y direction side in FIG. 2) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is arranged. (+ Y direction side in FIG. 2) is used as the back side.

The tray supply area A1 is a material supply unit to which a tray (mounting member) 200 in which a plurality of IC devices 90 in an uninspected state are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that

tray transport mechanisms

11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2.

The tray transport mechanism 11A is a moving unit that can move the tray 200 to the positive side in the Y direction together with the IC device 90 placed on the tray 200. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, from the supply area A2 to the tray supply area A1.

In the supply area A2, a temperature adjustment unit 12, a device transport head 13, and a tray transport mechanism 15 are provided.

As shown in FIGS. 4 to 6, the temperature adjustment unit 12 is disposed on the lower side of the cooling member 121 and has a plate-like cooling member 121 that can cool the plurality of IC devices 90 at once. It has a plate-like heating member 122 that can heat the IC device 90 in a lump, and is sometimes called a “soak plate”. With the soak plate, the IC device 90 before being inspected by the inspection unit 16 can be cooled or heated in advance and adjusted to a temperature suitable for the inspection.
In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the tray transport mechanism 11A is transported to one of the temperature adjustment units 12.

The plurality of IC devices 90 are arranged one by one in the pockets (recesses) 124 of the plate-like electronic component placement portion 123 called “change kit”, which is exchanged for each type of IC device 90. Then, it is placed on the cooling member 121 (see FIGS. 4 to 6). These IC devices 90 are cooled or heated together with the electronic component placement unit 123.

The device transport head 13 includes a suction unit 131 and is supported so as to be movable in the X and Y directions and further in the Z direction within the supply region A2. Thereby, the device transport head 13 transports the IC device 90 between the tray 200 carried in from the tray supply region A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and the device supply unit 14 described later. The IC device 90 can be transported.

The tray transport mechanism 15 is a mechanism for transporting an empty tray 200 from which all IC devices 90 have been removed to the positive side in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 and a device transport head 17 are provided. In addition, a device supply unit 14 that moves so as to straddle the supply region A2 and the inspection region A3 and a device recovery unit 18 that moves so as to straddle the inspection region A3 and the recovery region A4 are also provided.

The device supply unit 14 is a moving unit on which the IC device 90 temperature-adjusted by the temperature adjustment unit 12 is placed and can transport (move) the IC device 90 to the vicinity of the inspection unit 16. Sometimes called “shuttle plate”. The device supply unit 14 is supported so as to be movable in the horizontal direction along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to one of the device supply units 14.

Further, the device supply unit 14 is configured to maintain the temperature adjusted state of the temperature-adjusted IC device 90. As shown in FIG. 8, the device supply unit 14 is disposed on the lower side of the cooling member 141 and a plate-like cooling member 141 that can cool the plurality of IC devices 90 in a lump. And a plate-like heating member 142 that can be heated together. Thereby, the IC device 90 can be cooled or heated, and thus the temperature adjustment state of the IC device 90 can be maintained.

Similarly to the temperature adjustment unit 12, the device supply unit 14 is also used by placing on the cooling member 141 a plate-like electronic component placement unit 143 called a “change kit” that is exchanged for each type of IC device 90. (See FIG. 8). Then, the plurality of IC devices 90 transported by the device supply unit 14 are cooled or heated together with the electronic component placement unit 143 in a state of being placed one by one in the pocket (concave portion) 144 of the electronic component placement unit 143. It becomes.

As will be described later, in this embodiment, the temperature adjustment unit 12 constitutes a part of the first temperature adjustment unit 10A, and the device supply unit 14 constitutes a part of the second temperature adjustment unit 10B.

Further, the cooling member 121 of the temperature adjustment unit 12 and the cooling member 141 of the device supply unit 14 are formed with a flow path (not shown) through which a refrigerant such as liquid nitrogen passes. Can be cooled. In addition, it does not specifically limit as a constituent material of the cooling member 121 and the cooling member 141, and the electronic component arrangement | positioning part 123 and the electronic component arrangement | positioning part 143, For example, metal materials with comparatively high heat conductivity like aluminum etc. It is preferable that

The heating member 122 of the temperature adjustment unit 12 and the heating member 142 of the device supply unit 14 are each configured by a rubber heater that generates heat when a voltage is applied, and thereby the IC device 90 can be heated. .

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be cooled or heated to adjust the IC device 90 to a temperature suitable for the inspection.

The device transport head 17 is supported so as to be movable in the Y direction within the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16. The device transport head 17 can also cool or heat the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.

The device collection unit 18 is a moving unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed and can transport (move) the IC device 90 to the collection region A4. Sometimes called a “plate”. The device collection unit 18 is supported so as to be movable in the horizontal direction along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

Note that the device collection unit 18 and the inspection unit 16 are also used by placing a change kit that is exchanged for each type of IC device 90, similarly to the temperature adjustment unit 12.

The collection area A4 is an area where a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

The collection tray 19 is a mounting unit on which the IC device 90 inspected by the inspection unit 16 is mounted, and is fixed so as not to move in the recovery area A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. Become. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

Also, three empty trays 200 are arranged along the X direction. This empty tray 200 is also a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

The device transport head 20 is supported so as to be movable in the X direction, the Y direction, and further in the Z direction within the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried in from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200 described above.

The tray removal area A5 is a material removal unit where the tray 200 on which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

Also,

tray transport mechanisms

22A and 22B that transport the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving unit that can move the tray 200 in the Y direction. Thus, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a moving unit that can move an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

The control unit 80 (see FIG. 1) has, for example, a drive control unit. The drive control unit includes, for example,

tray transport mechanisms

11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and

tray conveyance mechanism

22A, 22B is controlled.

The test control unit of the tester inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on, for example, a program stored in a memory (not shown).

The operator can set or confirm the operating conditions of the inspection apparatus 1 via the monitor 300. The monitor 300 includes a display screen (display unit) 301 configured by, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the inspection apparatus 1. As shown in FIG. 1, on the right side (+ X direction side) of the tray removal area A5 in the drawing, there is provided a mouse base 600 on which a mouse used for operating the screen displayed on the monitor 300 is placed. Yes.

Further, an operation panel 700 is arranged on the lower right side in FIG. The operation panel 700 commands the inspection apparatus 1 to perform a desired operation separately from the monitor 300.

Moreover, the signal lamp 400 can notify the operating state of the inspection apparatus 1 by the combination of the colors to emit light. The signal lamp 400 is arranged on the upper part of the inspection apparatus 1. Note that the inspection device 1 has a built-in speaker 500, and the operation state of the inspection device 1 can also be notified by the speaker 500.

As shown in FIG. 2, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (partitioned) by the first partition wall 61, and the supply area A2 and the inspection area A3 are separated. It is divided by the second partition wall 62, the inspection area A3 and the collection area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. ing. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each region.

Further, the outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74.

The inspection apparatus 1 includes a first temperature adjustment unit 10A and a second temperature adjustment unit 10B. Hereinafter, a case where the IC device 90 is cooled by the first temperature adjustment unit 10A (temperature adjustment unit 12) and the second temperature adjustment unit 10B (device supply unit 14) will be described.

First, the first temperature adjustment unit 10A will be described with reference to FIGS.
As shown in FIGS. 3 to 6, the first temperature adjustment unit 10A includes a temperature adjustment unit 12, a dry air supply unit 3A, an ion generation unit 4A, an injection unit 5A, and a storage unit 8A. .

The storage portion 8A is a housing that collectively stores (includes) the two temperature adjustment portions 12 inside thereof, and includes a storage portion main body 81 and a shutter 82.

The storage unit main body 81 includes a side wall 83 that surrounds the two temperature adjusting units 12 along the circumferential direction, and a top plate 84 that covers the two temperature adjusting units 12 from above.

A plurality of openings 841 are formed in the top plate 84. These openings 841 are formed so as to face the pockets 124 arranged in a matrix in the electronic component placement section 123 of each temperature adjustment section 12. One IC device 90 can pass through each opening 841. Thereby, the IC device 90 can be taken out of the storage portion 8A.

The shutter 82 is arranged for each opening 841 arranged in the X direction, and opens and closes these openings 841. The shutter 82 is supported on the back side (lower side) of the top plate 84 so as to be movable in the Y direction. Thereby, the opening 841 can take the closed state shown in FIG. 4 and the open state shown in FIG.

In the closed state shown in FIG. 4, the airtightness of the storage portion 8A can be ensured. Thereby, it is possible to prevent relatively humid air (hereinafter referred to as “moist air”) in the supply region A2 from flowing into the storage portion 8A via the opening 841. In the storage unit 8A, the temperature adjustment unit 12 is in a cooling operation or the IC device 90 is cooled by the temperature adjustment unit 12. However, when moist air flows into the storage unit 8A, the temperature adjustment unit 12 or Condensation may occur in the IC device 90. However, in the closed state, the inflow of moist air is prevented, so that the occurrence of condensation can be prevented.

In the open state shown in FIG. 5, the suction unit 131 of the device transport head 13 can enter the storage unit 8 A through the opening 841. Thereby, the IC device 90 can be adsorbed and transported from the temperature adjustment unit 12 to the device supply unit 14.

The shutter 82 is connected to a drive source (not shown) such as an air cylinder or a motor. Thereby, the shutter 82 can be moved in the Y direction.

As shown in FIG. 3, the dry air supply unit 3 A has a hard tube body 31 that extends in the Y direction in the storage unit 8 A and is arranged in parallel with the two temperature adjustment units 12. The tube body 31 is connected to a dry air generation unit 900 that generates dry air DA.

As shown in FIG. 6, the tube body 31 is formed with a side hole 311 penetrating the tube wall. A plurality of side holes 311 are arranged at intervals along the longitudinal direction of the tubular body 31. Thereby, the dry air DA can be sufficiently supplied into the storage portion 8A, and the storage portion 8A can be filled with the dry air DA. The pressure inside the storage unit 8A filled with the dry air DA is higher than the pressure outside the storage unit 8A, that is, inside the supply region A2. As a result, as shown in FIG. 5, even if the opening 841 of the storage portion 8A is in an open state, the dry air DA is ejected from the opening 841, so that the humid air is stored in the storage portion via the opening 841. Inflow to 8A can be prevented. Such a configuration is suitable for preventing condensation in the storage portion 8A.

Moreover, it is preferable that the tubular body 31 is disposed as low as possible in the storage portion 8A, and is disposed below the upper surface 125 positioned at least vertically above the electronic component placement portion 123 of the temperature adjustment portion 12. Is more preferable. As a result, the momentum of the dry air DA ejected from the opening 841 can be increased, so that the inflow of moist air can be sufficiently prevented.

In addition, although the side hole 311 formed in the tubular body 31 faces the temperature adjusting unit 12 in the configuration shown in FIG. 6, the side hole 311 is not limited to this, and may face upward, for example. Moreover, in the tubular body 31, the side hole 311 which faces the temperature control part 12, and the side hole 311 which faces upward may each be formed.

The humidity of the dry air DA is set lower than the air (atmosphere) outside the outermost exterior (side cover 71 etc.) of the inspection apparatus 1. Thereby, it can prevent that dew condensation arises in 8 A of storage parts irrespective of the use environment of the inspection apparatus 1. FIG.

Further, in the inspection apparatus 1, the storage portion 8A is provided inside the outermost exterior of the inspection apparatus 1, that is, in a part of the supply area A2. Thereby, rather than filling the entire supply area A2 with the dry air DA, the periphery of the temperature adjustment unit 12 where condensation is likely to occur is partially covered with the case (casing) or the storage unit 8A as a cover, which is necessary for preventing condensation. The part can be easily filled with dry air DA.

The ion generator 4A is an ionizer that ionizes dry air to generate the ionized dry air (hereinafter referred to as “ionized air IA”). The ion generator 4A is not particularly limited, and for example, one using a corona discharge or one using ionizing radiation can be used.

The surface of the IC device 90 may be charged with static electricity, for example, while the IC device 90 is being transported. For this reason, it is necessary to remove the static electricity. Therefore, in the first temperature adjustment unit 10A, the ionization air IA generated by the ion generation unit 4A can be discharged by spraying the surface of the IC device 90 through the injection unit 5A.

As shown in FIG. 3, the ion generation unit 4 A is installed one by one around each temperature adjustment unit 12 in a plan view. Thereby, the ionized air IA can be directed to the IC devices 90 on each temperature adjustment unit 12 as uniformly as possible. In the configuration shown in FIG. 3, with respect to the temperature adjustment unit 12 on the Y direction positive side in the drawing, the ion generation unit 4A is arranged on the Y direction positive side, and the temperature adjustment unit 12 on the Y direction negative side in the drawing is arranged. On the other hand, although ion generating part 4A is arranged on the Y direction negative side, it goes without saying that the arrangement place of each ion generating part 4A is not limited to this.

Moreover, it is preferable that the ion generating unit 4A is installed at a position higher than the temperature adjusting unit 12. The ionized air IA that is dry air usually has a higher specific gravity than the atmosphere. For this reason, the ionized air IA can flow quickly from the ion generating unit 4A toward the temperature adjusting unit 12 when the ion generating unit 4A is installed at a position higher than the temperature adjusting unit 12.

Also, the ionized air IA is set to have a lower humidity than the air (atmosphere) outside the inspection apparatus 1, similarly to the dry air DA. Thereby, it can prevent that dew condensation arises in 8 A of storage parts irrespective of the use environment of the inspection apparatus 1. FIG.

As shown in Fig. 3, each ion generating unit 4A is connected to an injection unit 5A that injects ionized air IA. The injection unit 5 A includes a resin tube 51. Further, the tube 51 may be linear (see the tube 51 on the Y direction negative side in FIG. 3), although it depends on the positional relationship between the ion generator 4A and the temperature adjuster 12. The middle in the longitudinal direction may be bent or curved (see the tube 51 on the Y direction positive side in FIG. 3).

As shown in FIGS. 4 to 6, the tube body 51 has an ejection port 511 that opens into the storage portion 8A. The ionized air IA can be injected into the storage portion 8A through the jet port 511. The injection target of the ionized air IA, that is, the injection destination is the surface of the IC device 90. Therefore, for example, the ejection port 511 is installed such that the center line O ₅₁₁ is positioned higher in the vertical direction than the upper surface 125 of the electronic component placement unit 123 of the temperature adjustment unit 12 (see FIG. 4). Thereby, the ionized air IA ejected from the ejection port 511 can pass right above the IC device 90 in the horizontal direction, that is, along the upper surface 125. At this time, the surface of the IC device 90 comes into contact with the ionized air IA and is neutralized.

Thus, in the first temperature adjustment unit 10A, the ionized air IA can be locally sprayed toward the surface of the target IC device 90 by appropriately setting the position of the ejection port 511. As a result, static elimination can be performed on the surface of the IC device 90.

Further, as described above, since the inside of the storage portion 8A is filled with the dry air DA, it is possible to prevent a reduction in the charge removal effect of the ionized air IA due to moisture.

Here, let us consider a case where the ejection port 511 is installed at a position lower than the upper surface 125 of the electronic component placement unit 123. In this case, the ejection port 511 is in a state of opening toward the side surfaces of the electronic component placement portion 123 and the cooling member 121. When the ionized air IA is ejected in this state, the ions in the ionized air IA hit the side surface made of a metal material and are absorbed. For this reason, the neutralization effect of the ionized air IA on the IC device 90 cannot be expected.

In addition, although each injection part 5A becomes a structure which has one jet nozzle in this embodiment, it is not limited to this, For example, you may become a structure which has two or more jet nozzles.

Next, the second temperature adjustment unit 10B will be described with reference to FIGS. Here, the difference between the second temperature adjustment unit 10B and the first temperature adjustment unit 10A will be mainly described, and the description of the same matters will be omitted.

7 and 8, the second temperature adjusting unit 10B includes two sets of devices supply 14 which is symmetrically arranged with respect to the center line O ₁₆ along the X-direction of the inspection unit 16, dry air supply Part 3B, ion generation part 4B, injection part 5B, and storage part 8B are provided. Since each group has the same configuration except that the arrangement location is different, the configuration of one group (upper side in FIG. 7) will be representatively described.

As described above, the device supply unit 14 can move between the supply region A2 and the inspection region A3. Hereinafter, the stop position in the supply region A2 of the device supply unit 14 is referred to as “first stop position”, and the stop position in the inspection region A3 is referred to as “second stop position”. In the electronic component placement unit 143 of the device supply unit 14, pockets 144 are arranged in a matrix in the X direction and the Y direction. As shown in FIG. 7, in this embodiment, there are two rows of pockets 144 along the X direction, that is, “first row L ₁ ” and “second row L ₂ ”.

7 and 8, the storage portion 8B is a housing that encloses the device supply portion 14 in the first stop position. The storage unit 8B includes a side wall 85 that surrounds a part of the device supply unit 14 in the first stop position in the circumferential direction, and a top plate 86 that covers the device supply unit 14 in the first stop position from above. Yes.

A plurality of openings 861 are formed in the top plate 86. The openings 861 are formed so as to face the pockets 144 arranged in a matrix in the electronic component placement unit 143 of the device supply unit 14 at the first stop position. Then, one IC device 90 can pass through each opening 861. Thereby, the IC device 90 can be placed in the pocket 144 from the outside of the storage portion 8B.

As shown in FIG. 2, in the inspection apparatus 1, a storage unit 8 C that stores (includes) each device recovery unit 18 is provided on the recovery area A 4 side with the same configuration as the storage unit 8 B. The storage unit 8C may be configured to be supplied with the dry air DA and the ionized air IA.

As shown in FIG. 7, the dry air supply unit 3B includes a hard tube body 32 that extends in the X direction in the storage unit 8B and is arranged in parallel with the device supply unit 14 at the first stop position. Yes. Further, the tube body 32 is connected to a dry air generation unit 900 common to the tube body 31 of the dry air supply unit 3A.

As shown in FIG. 8, the tube body 32 is formed with a side hole 321 penetrating the tube wall in the same manner as the tube body 31. Thereby, the dry air DA can be supplied into the storage unit 8B, and the storage unit 8B can be filled with the dry air DA. The pressure inside the storage unit 8B filled with such dry air DA is higher than the pressure outside the storage unit 8B, that is, inside the supply region A2. As a result, dry air DA is ejected from each opening 861 of the storage portion 8B, and damp air is prevented from flowing into the storage portion 8B via the opening 861. Therefore, condensation in the storage portion 8B is prevented.

As shown in FIG. 7, two ion generation units 4 B are arranged adjacent to each other in the X direction around the device supply unit 14 at the first stop position (Y direction negative side) in plan view. These ion generating section 4B includes an ionization air IA generated by one of the ion generating unit 4B _1, the ionized air IA generated by the other ion generating section 4B ₂ at the same timing, or housing portion 8B at different timings Can be supplied within.

In the second temperature adjustment unit 10B, two injection units 5B are provided corresponding to the two ion generation units 4B. Of these injector 5B, one of the injection unit 5B ₁ is connected to the ion generating section 4B _1, the other injection unit 5B ₂ is connected to the ion generating section 4B _2.

The injection unit 5B ₁ has a tubular body 52. The tube body 52 is branched in two in the longitudinal direction, and thus has a jet port 521 and a jet port 522 opened in the side wall 85 of the storage portion 8B.

As shown in FIG. 7, in plan view, the opening direction of the jetting port 521 is a direction toward the first row L ₁ of the pocket 144, the opening direction of the jetting port 522, the second column L ₂ The direction is toward the pocket 144.
Further, as shown in FIG. 8, the ejection port 521 (same for the ejection port 522) is installed such that the center line O ₅₂₁ is higher than the upper surface 145 of the electronic component placement unit 143 of the device supply unit 14. ing. This arrangement, ionized air IA ejected from the ejection port 521, along the top surface 145 can pass through the right above the first row L ₁ of the IC device 90, this time, of the IC device 90 The surface is discharged by touching ionized air IA.
Similarly, ionized air IA ejected from the ejection port 522, along the top surface 145, it is possible to pass directly above the second row _{L 2} of the IC device 90, whereby the surface of the IC device 90, The static electricity is removed by touching the ionized air IA.

The injection unit 5B ₂ has a tubular body 53. This tubular body 53 has a portion along the Y direction, and in this portion, the spout 531 and the spout 532 that open to the top plate 86 of the storage portion 8B, that is, open toward the negative side in the Z direction. Are provided (see FIG. 7).

As shown in FIG. 8, in the middle of the device supply unit 14 moves from the first stop position to a second stop position, the IC device 90 disposed in the first column L ₁ of the pocket 144, corresponding to the jetting port 531 That is, it passes through the jet outlet 531 in order so that it may face. Then, at the time of this passage, the surface of the first column L ₁ of the IC device 90 is touching the ionized air IA, are more fully neutralization. Similarly, each IC device 90 disposed in the second column L ₂ of the pocket 144 is also in accordance with the movement of the device supply unit 14, passes directly under the spout 532 in order. Then, at the time of this passage, the surface of the second column L ₂ of the IC device 90 is touching the ionized air IA, are more fully neutralization.

In addition, although each injection part 5B becomes a structure which has two jet nozzles in this embodiment, it is not limited to this, For example, even if it becomes a structure which has one or three or more jet nozzles Good.

Second Embodiment
FIG. 9 is a plan view of a supply shuttle plate provided in the electronic component inspection apparatus (second embodiment) according to the present invention and its periphery.

Hereinafter, the second embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to this drawing. However, the description will focus on differences from the above-described embodiment, and the same matters will be described. Is omitted.

This embodiment is the same as the first embodiment except that the configuration of the injection unit of the second temperature adjustment unit is different.

As shown in FIG. 9, the inspection apparatus 1a of the present embodiment includes an injection unit 5C in the second temperature adjustment unit 10Ba. The injection unit 5C of the inspection apparatus 1a has one hollow plate-shaped member (sheet body) 54 disposed to face the device supply unit 14 at the first stop position. On the lower surface of the plate-like member 54, a plurality of jet ports 541 penetrating in the thickness direction are formed. These jet ports 541 are arranged in a matrix in the planar direction of the plate-like member 54. Thereby, each spout 541 will be in the state corresponding to each pocket 144 of the device supply part 14 in a 1st stop position. As a result, the ionized air IA can be individually blown against the IC devices 90 located in the respective pockets 144, and thus sufficient static elimination can be performed.

<Third Embodiment>
Hereinafter, a third embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to FIGS.

An inspection apparatus 101 (electronic component inspection apparatus) shown in FIGS. 10 and 11 incorporates an electronic component conveyance apparatus 10 and conveys an electronic component such as an IC device that is a BGA (Ball Grid Array) package, for example. This is a device for inspecting and testing electrical characteristics (hereinafter simply referred to as “inspection”) during the conveyance process.

The inspection apparatus 101 includes a transport unit 6 that can transport electronic components, an openable / closable unit 4 that can be opened and closed, a monitor 300 that can display an operating state of the transport unit 6, and whether the open / close unit 4 can be opened and closed. And a notifying unit 5 for informing the user and an inspection unit 116 for inspecting electronic components.

The electronic component transport apparatus 10 includes a transport unit 6 that can transport electronic components, an openable / closable unit 4 that can be opened and closed, a monitor 300 that can display the operating state of the transport unit 6, and the open / close unit 4. And an informing unit 5 for informing whether or not opening and closing is possible.

In the following, for convenience of explanation, the case where an IC device is used as an electronic component will be described as a representative, and this will be referred to as “IC device 90”. The IC device 90 is placed on a placement member that is the tray 200.

The inspection apparatus 101 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, a device collection area A4 (hereinafter simply referred to as “collection area”), and tray removal. It is divided into area A5. Then, IC device 90, from the tray supply area A1 to the tray removal area A5 through sequentially through each region of the arrow alpha ₉₀ direction, a check is made in the course of the inspection area A3. As described above, the inspection apparatus 101 includes the electronic component transport apparatus 10 (handler) that transports the IC device 90 in each of the areas A1 to A5, and the inspection unit 116 that performs inspection in the inspection area A3. Yes. In addition, the inspection apparatus 101 includes a signal lamp 400 and an operation panel 700.

In the inspection apparatus 101, the tray supply area A1 and the tray removal area A5 are arranged, that is, the Y direction negative side in FIG. 11 is the front side, and the inspection area A3 is arranged, that is, in FIG. The Y direction positive side is used as the back side.

The tray supply area A1 is a material supply unit to which a tray 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

The supply area A2 is an area where a plurality of IC devices 90 on the tray 200 conveyed from the tray supply area A1 are supplied to the inspection area A3. Note that

tray transport mechanisms

11A and 11B that transport the tray 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2.
The tray transport mechanism 11A is a moving unit that can move the tray 200 together with the IC device 90 placed on the tray 200 on the positive side in the Y direction, that is, the arrow _α11A in FIG. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, the arrow α _11B in FIG. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1.

The supply area A2 includes a temperature adjustment unit (soak plate (English notation: soak plate, Chinese notation (example): soaking plate)) 112, a device transport head 13, a tray transport mechanism 15, and a concentration sensor 800. , Is provided.

The temperature adjusting unit 112 can place a plurality of IC devices 90 and collectively heat or cool these IC devices 90, and is called a “soak plate”. With this soak plate, the IC device 90 before being inspected by the inspection unit 116 can be heated or cooled in advance and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). In the configuration shown in FIG. 11, two temperature adjusting units 112 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply region A1 by the tray transport mechanism 11A is transported to any one of the temperature adjustment units 112.

The device transport head 13 is supported so as to be movable in the X and Y directions and further in the Z direction within the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 112, and between the temperature adjustment unit 112 and a device supply unit 114 described later. It is possible to carry the IC device 90. Incidentally, in FIG. 11 shows the movement of the X-direction of the device conveying head 13 by the arrow alpha _13X, it shows a movement in the Y-direction of the device conveying head 13 by the arrow alpha _13Y.

Tray transporting mechanism 15, the positive side of the X direction empty tray 200 in a state where all of the IC devices 90 is removed in the feed region A2, i.e., a mechanism for conveying the arrow alpha ₁₅ direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

The concentration sensor 800 detects the concentration of nitrogen in the supply area A2. The density sensor 800 is electrically connected to the control unit 180, and the density information detected by the density sensor 800 is transmitted to the control unit 180. The concentration sensor may detect oxygen concentration.

The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 116 and a device transport head 117 are provided. In addition, a device supply unit 114 that moves so as to straddle the supply region A2 and the inspection region A3 and a device recovery unit 118 that moves so as to straddle the inspection region A3 and the recovery region A4 are also provided.

The device supply unit 114 is configured as a mounting unit on which the IC device 90 temperature-adjusted by the temperature adjusting unit 112 is mounted and can transport the IC device 90 to the vicinity of the inspection unit 116. "Or simply" feed shuttle ".

The device supply unit 114, between the supply region A2 and the inspection area A3 X direction, i.e., are reciprocally movably supported along an arrow alpha ₁₄ direction. In the configuration illustrated in FIG. 11, two device supply units 114 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 112 is transported to one of the device supply units 114. Similarly to the temperature adjustment unit 112, the device supply unit 114 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 114. Accordingly, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 112 can be transported to the vicinity of the inspection unit 116 in the inspection region A3 while maintaining the temperature adjustment state.

The device transport head 117 is an operation unit that grips the IC device 90 in which the temperature adjustment state is maintained and transports the IC device 90 in the inspection area A3. The device transport head 117 is supported so as to be able to reciprocate in the Y direction and the Z direction within the inspection area A3, and is a part of a mechanism called an “index arm”. Accordingly, the device transport head 117 can transport and place the IC device 90 on the device supply unit 114 carried in from the supply region A2 onto the inspection unit 116. In FIG. 11, the reciprocation of the device transport head 117 in the Y direction is indicated by an arrow _α17Y . In addition, the device transport head 117 is supported so as to be reciprocally movable in the Y direction and the Z direction, but is not limited thereto, and may be supported so as to be reciprocally movable in the X direction.

Also, the device transport head 117 is configured to be able to heat or cool the gripped IC device 90 in the same manner as the temperature adjustment unit 112. Thereby, the temperature adjustment state in the IC device 90 can be continuously maintained from the device supply unit 114 to the inspection unit 116.

The inspection unit 116 is configured as a mounting unit that mounts the IC device 90 that is an electronic component and inspects / tests (inspects) the electrical characteristics of the IC device 90. The inspection unit 116 is provided with a plurality of probe pins that are electrically connected to the terminal unit of the IC device 90. Then, the IC device 90 can be inspected when the terminal portion of the IC device 90 and the probe pin are electrically connected, that is, contacted. The inspection of the IC device 90 is performed based on a program stored in the storage unit 183 (see FIG. 12) of the control unit 180. Note that, similarly to the temperature adjustment unit 112, the inspection unit 116 can also heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for the inspection.

The device collection unit 118 is configured as a placement unit on which the IC device 90 that has been inspected by the inspection unit 116 is placed, and can transport the IC device 90 to the collection area A4. Or simply called the “recovery shuttle”.

The device collecting unit 118, X-direction between the examination region A3 and the collection area A4, i.e., are reciprocally movably supported along the arrow alpha ₁₈ direction. In the configuration shown in FIG. 11, two device collection units 118 are arranged in the Y direction similarly to the device supply unit 114, and the IC device 90 on the inspection unit 116 is one of the device collection units 118. Are transported to and placed. This transport is performed by the device transport head 117.

The collection tray 19 is configured as a placement unit on which the IC device 90 inspected by the inspection unit 116 is placed, and is fixed so as not to move in the collection region A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. Become. In the configuration shown in FIG. 11, three collection trays 19 are arranged along the X direction.

Also, three empty trays 200 are arranged along the X direction. This empty tray 200 is also a placement unit on which the IC device 90 inspected by the inspection unit 116 is placed. Then, the IC device 90 on the device recovery unit 118 that has moved to the recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

The device transport head 20 is supported so as to be movable in the X and Y directions and further in the Z direction within the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 118 to the recovery tray 19 or the empty tray 200. In FIG. 11, the movement of the device transport head 20 in the X direction is indicated by an arrow α _20X , and the movement of the device transport head 13 in the Y direction is indicated by an arrow α _20Y .

Tray transfer mechanism 21, X-direction empty tray 200 is conveyed from the tray removal area A5 in the collection area A4, i.e., a mechanism for conveying the arrow alpha ₂₁ direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

In addition,

tray transport mechanisms

22A and 22B that transport the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving unit that can reciprocate the tray 200 in the Y direction, that is, the arrow α _22A direction. Thus, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 in the Y direction positive side, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the collection area A4.

In the inspection apparatus 101, the tray supply area A1 and the supply area A2 are separated by a first partition wall 61, and the supply area A2 and the inspection area A3 are separated by a second partition wall 62. A3 and the collection area A4 are separated by a third partition wall 63, and a recovery area A4 and a tray removal area A5 are separated by a fourth partition wall 64. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65.

The inspection apparatus 101 has an outermost cover covered with a cover, and examples of the cover include a front cover 70, a side cover 71a, a side cover 72a, a rear cover 73a, and a top cover 74. By assembling the front cover 70, the side cover 71 a, the side cover 72 a, the rear cover 73 a, and the top cover 74, a housing 76 is configured, and the opening / closing part 4 is formed in the housing 76. A transport unit 6 is disposed inside the housing 76.

As shown in FIG. 11, the side cover 71a is provided with a first door 711 and a second door 712. By opening the first door 711 and the second door 712, for example, maintenance in the supply region A2 and elimination of problems can be performed. The first door 711 and the second door 712 are configured to open and close in the direction of arrow α _{71 in} FIGS. 11 and 14.

Similarly, a first door 721 and a second door 722 are provided on the side cover 72a. By opening the first door 721 and the second door 722, for example, work in the device collection area A4 can be performed. The first door 721 and the second door 722 are configured to open and close in the direction of the arrow α _{72 in} FIG.

The first cover 731, the second door 732, and the third door 733 are also provided on the rear cover 73 a. By opening the first door 731, for example, work in the supply area A 2 can be performed. By opening the third door 733, for example, work in the device collection area A4 can be performed.

Furthermore, a fourth door 75 is provided in the inner partition wall 66 that defines the inspection area A3. Then, by opening the second door 732 and the fourth door 75, for example, work in the inspection area A3 can be performed. The first door 731 opens and closes in the direction of arrow α _{731 in} FIG. 11, the second door 732 opens and closes in the direction of arrow α _{732 in} FIG. 11, and the third door 733 opens in the direction of arrow α _{733 in} FIG. The fourth door 75 opens and closes in the direction of arrow α ₇₅ in FIG.

And when each door is closed, it is possible to ensure airtightness and heat insulation in each corresponding area.

The first door 711, the second door 712, the first door 721, the second door 722, the first door 731, the second door 732, the third door 733, and the fourth door 75 can be opened and closed respectively. 4 is configured.

As shown in FIG. 12, the control unit 180 includes a drive control unit 181, an inspection control unit 182, and a storage unit 183.

The drive control unit 181 includes, for example, the tray transport mechanism 11A, the tray transport mechanism 11B, the temperature adjustment unit 112, the device transport head 13, the device supply unit 114, the tray transport mechanism 15, and the inspection unit illustrated in FIG. 116, the device transport head 117, the device collection unit 118, the device transport head 20, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B are controlled in operation.

The inspection control unit 182 inspects the electrical characteristics of the IC device 90 arranged in the inspection unit 116 based on the program stored in the storage unit 183.

The storage unit 183 includes various semiconductor memories (IC memories) such as a volatile memory such as a RAM, a nonvolatile memory such as a ROM, a rewritable (erasable and rewritable) nonvolatile memory such as an EPROM, an EEPROM, and a flash memory. Etc.

The control unit 180 is electrically connected to a monitor 300 as a display unit. The monitor 300 is configured to be able to display the operating state of the transport unit 6 and the operating states of other parts of the inspection apparatus 101. As shown in FIG. 11, the transport unit 6 includes a tray transport mechanism 11B, a device transport head 13, a device supply unit 114, a tray transport mechanism 15, a device transport head 117, a device collection unit 118, a device transport head 20, and a tray. It has a transport mechanism 21, a tray transport mechanism 22A, and a tray transport mechanism 22B.

The operator can set or confirm the operating conditions of the inspection apparatus 101 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is arranged at the upper part on the front side of the inspection apparatus 101. As shown in FIG. 10, on the right side (the positive side in the X direction) of the tray removal area A5 in the figure, there is provided a mouse table 600 on which a mouse used for operating the screen displayed on the monitor 300 is placed. It has been.

Further, an operation panel 700 is arranged on the lower right side of FIG. The operation panel 700 instructs the inspection apparatus 101 to perform a desired operation separately from the monitor 300.

Further, the control unit 180 is electrically connected to the signal lamp 400. The signal lamp 400 can notify the operating state and the like of the inspection apparatus 101 by a combination of colors that emit light. The signal lamp 400 is disposed on the upper part of the inspection apparatus 101. Note that the inspection device 101 has a built-in speaker 500, and the operation state of the inspection device 101 can also be notified by the speaker 500.

Next, the first door 711 and the second door 712 on the side cover 71a side will be described in detail. Since the 1st door 711 and the 2nd door 712 are the same structures, below, the 1st door 711 is demonstrated typically.

As shown in FIGS. 13 and 14, the first door 711 is a door that can be opened and closed with respect to the opening 713 formed in the side cover 71a. Thereby, the opening / closing part 4 can cover half of the opening 713 (the Y-direction positive side portion in the drawing) in the closed state (see FIG. 13), and can open the opening 713 in the open state. (See FIG. 14).

The first door 711 is composed of a plate member having a substantially quadrangular shape in plan view. Note that the size of the first door 711 depends on the size of the inspection apparatus 101, but for example, both the vertical length (the length in the Z direction) and the horizontal length (the length in the Y direction). 400 mm or more and 600 mm or less, more preferably 450 mm or more and 550 mm or less.

The first door 711 having a rectangular shape has a side 41a extending in the vertical direction among the four sides (edges) 41a, 41b, 41c, and 41d and is connected to the side cover 71a by the two rotation support portions 42. Has been. These two rotation support portions 42 are spaced apart in the Z direction. Moreover, each rotation support part 42 is comprised with the hinge which supports the 1st door 711 so that rotation is possible. As a result, the first door 711 can be supported so as to be rotatable in the direction of arrow α _{71 in} FIGS. 11 and 14 with the axis parallel to the vertical direction, that is, the Z direction as the rotation axis. It can be done smoothly.

In addition, each of the first door 711 and the second door 712 is provided with a handle 714 formed of a protrusion. Thereby, the 1st door 711 and the 2nd door 712 can be opened and closed easily.

As shown in FIGS. 15 and 16, a cylinder 740 is fixed near the upper portion (for example, 0 mm or more and 50 mm or less) of the opening 713 of the side cover 71a. The cylinder 740 is such that the cylinder rod 740a can freely appear and disappear.
When the cylinder rod 740a protrudes downward, the cylinder rod 740a can be engaged with the lock member 43 provided on the positive side surface of the first door 711 in the X direction (see FIG. 15). Such a cylinder 740 is electrically connected to the control unit 180, and its operation is controlled by the control unit 180.

In the present embodiment, the cylinder 740 can maintain not only the closed state of the first door 711 but also the closed state of the second door 712. That is, the cylinder rod 740 can be engaged with the lock member 43 of the first door 711 and the lock member 43 of the second door 712 in a lump. Therefore, the closed state of the 1st door 711 and the 2nd door 712 can be maintained collectively.

Further, when the cylinder rod 740a is retracted upward, the engagement with the lock member 43 is released, and the first door 711 can be opened (see FIG. 16).

As described above, the inspection apparatus 101 includes the cylinder 740 and the lock member 43 as a lock unit that switches between maintaining the closed state of the first door 711 and releasing the closed state. Thereby, for example, it is possible to prevent an operator of the inspection apparatus 101 from opening the first door 711 by mistake while the IC device 90 is being transported.

Further, on the front side of the first door 711, that is, on the surface on the positive side in the X direction in FIG. 13, an informing unit 5 for notifying whether or not the opening / closing unit 4 can be opened and closed is provided. The notification unit 5 includes a monitor 151 configured by a circular LCD (Liquid Crystal Display). The monitor 151 is electrically connected to the control unit 180, and its operation is controlled by the control unit 180.

In addition, although the alerting | reporting part 5 is provided in the 1st door 711, the 1st door 721, the 1st door 731, the 2nd door 732, and the 3rd door 733, below, it alert | reports provided in the 1st door 711. The unit 5 will be described representatively.

As shown in FIGS. 14 and 16, when the first door 711 and the second door 712 can be opened, the letters “OK” are displayed on the monitor 151. On the other hand, as shown in FIG. 13, in a state where the opening of the first door 711 and the second door 712 is restricted, the letters “NO” are displayed on the monitor 151.

In the monitor 151, it is preferable that the color of the character when “OK” is displayed is different from the color of the character when “NO” is displayed. In the monitor 151, it is preferable that the background color of the character when “OK” is displayed is different from the background color of the character when “NO” is displayed. By adopting such a configuration, it can be easily identified by the operator.

In the inspection apparatus 101, since the monitor 151 is provided in the opening / closing part 4, that is, the first door 711, when the operator performs the opening / closing operation of the first door 711 and the second door 712, It can be visually recognized with high accuracy.

Further, as shown in FIG. 13, the monitor 151 is preferably arranged at a height H of 600 mm or more and 2000 mm or less from the installation surface M on which the inspection apparatus 101 is installed, and a height of 900 mm or more and 1700 mm or less. More preferably, it is arranged at the position of height H. Accordingly, the monitor 151 can be easily seen regardless of the height of the worker, and the monitor 151 can be visually recognized by the worker with high accuracy.

Here, as described above, the inspection apparatus 101 performs a high temperature inspection or a low temperature inspection. In particular, when performing a low-temperature inspection, a cooling gas (for example, nitrogen) is enclosed in the inspection apparatus 101, so that the concentration of the cooling gas is high. For this reason, it is not preferable for the operator to perform the opening operation of the opening / closing part 4 in this state. Therefore, the present invention is effective in preventing inconvenience.

Hereinafter, the control operation of the control unit 180 will be described based on the flowchart shown in FIG. Hereinafter, a case will be described in which the inspection apparatus 101 is temporarily stopped during the low-temperature inspection, the first door 711 and the second door 712 are opened, and maintenance is performed in the supply region A2. Further, during the operation of the inspection apparatus 101, as shown in FIG. 13, characters “NO” are displayed on the notification unit 5.

First, the operator operates the operation panel 700 to stop the operation of the inspection apparatus 101 and presses a release button (not shown) for engaging the cylinder 740 and the lock member 43.

In step S101, the concentration sensor 800 detects the concentration N of the cooling gas in the supply region A2. Then, in step S102, the time required until becomes smaller than a predetermined value N ₀ concentration N is previously stored in the storage unit 183, i.e., until it is possible to open the first door 711 and second door 712 The remaining time as information is calculated. This calculation is performed based on a calibration curve (not shown) obtained by experimenting and measuring the decrease in the concentration N over time.

Next, in step S103, the time calculated in step S102 is displayed on the monitor 151 (see FIG. 15). In FIG. 15, a number “15” is displayed on the monitor 151, indicating that the remaining time is 15 seconds. The remaining time displayed on the monitor 151 is counted down with the passage of time, and the displayed number decreases.

As described above, the monitor 151 displays (notifies) the remaining time as information until the first door 711 and the second door 712 can be opened. Thereby, for example, the operator can grasp the time until the first door 711 and the second door 712 can be opened. Therefore, the worker can perform other operations before performing the operation of opening the first door 711 and the second door 712, and the work efficiency can be improved.

Then, at step S104, it compares the density N of the cooling gas concentration sensor 800 detects with a predetermined value N ₀ stored in the storage unit 183. The predetermined value N ₀ is a value indicating the concentration of the cooling gas, and is a low value that is sufficiently safe for the operator. If the concentration N of the cooling gas is determined to a predetermined value _{N 0} or more (S104; NO), it continues to perform comparison.

In step S104, if the concentration N is determined to be lower than the predetermined value _{N 0} (S104; YES), it releases the engagement of the cylinder 740 and the locking member 43 in the step S105 (see FIG. 16). In step S106, a notification is made that the first door 711 and the second door 712 can be opened.

In this embodiment, as shown in FIG. 16, the characters “OK” are displayed on the monitor 151. As a result, the operator can recognize that the first door 711 and the second door 712 can be opened. Therefore, it is possible to prevent the operator from opening the first door 711 and the second door 712 even though the decrease in the concentration N of the cooling gas is insufficient. Therefore, worker safety can be ensured.

If the operator tries to open the first door 711 and the second door 712 in the closed state in which the cylinder 740 and the lock member 43 are engaged, the cylinder 740 and the lock member 43 may be damaged depending on the force. There is. The inspection device 101 is configured such that the notification unit 5 notifies the fact after the engagement between the cylinder 740 and the lock member 43 is released and the first door 711 and the second door 712 can be opened. Yes. Thereby, it is possible to prevent the cylinder 740 and the lock member 43 from being damaged.

Further, in step S106, not only that the informing unit 5 can open the first door 711 and the second door 712, but also that fact is displayed on the monitor 300. That is, the monitor 300 displays whether the first door 711 and the second door 712 can be opened or closed. Accordingly, even if the worker is away from the first door 711 and the second door 712, the worker can recognize that the first door 711 and the second door 712 can be opened. Can do.

Moreover, in the inspection apparatus 101, since the alerting | reporting part 5 alert | reports using light, it makes a worker recognize with high accuracy whether opening and closing of the 1st door 711 and the 2nd door 712 is possible. Can do.

Further, the first door 711 and the second door 712 are made of a light transmissive material. For this reason, the operator can visually recognize the operating states of the cylinder 740 and the lock member 43. That is, it can be said that the notification unit 5 has a window portion through which the operating states of the cylinder 740 and the lock member 43 can be visually confirmed. Thereby, for example, even if the monitor 151 is omitted and the configuration of the notification unit 5 is simplified, the operator visually recognizes the operating state of the cylinder 740 and the lock member 43 to thereby detect the first door 711 and the second door. Whether or not 712 can be opened and closed can be grasped.

Thus, according to the electronic component conveying apparatus 10, it is possible to make the operator recognize whether or not the opening / closing part 4 can be opened and closed. Therefore, for example, it is possible to prevent the operator from opening the opening / closing part 4 even though the inside of the electronic component transport apparatus 10 is not preferable for the operator. Thereby, the safety of the worker can be ensured. Similarly, the inspection apparatus 101 including the electronic component transport apparatus 10 and the inspection unit 116 can ensure the safety of the operator.

<Fourth embodiment>
18 and 19 are views showing an opening / closing unit and a notification unit provided in the electronic component inspection apparatus (fourth embodiment) of the present invention.

Hereinafter, the fourth embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to these drawings. Will not be described.

In the inspection apparatus 101a of the present embodiment, the notification unit 5a includes a first display H1 “OK” provided on the first door 711a serving as a window, and a first “NO” provided on the first door 711a. 2 and an identification plate 152 as an identification unit connected to the cylinder rod 740a.

The first display H1 is provided near the corner on the positive side in the Z direction and the negative side in the Y direction of the first door 711a. The first display H1 is a display indicating that the first door 711a and the second door 712 can be opened.

The second display H2 is located on the negative side in the Z direction as an example of a different position of the first display H1. The second display H2 is a display indicating that the first door 711a and the second door 712 are restricted from being opened.

The first display H1 and the second display H2 are configured by, for example, printing with ink, an adhesive, or the like. The first display H1 and the second display H2 are preferably relatively light colors such as white.

The identification plate 152 is composed of a plate member fixed to the negative end of the cylinder rod 740a in the Z direction. The identification plate 152 has a relatively dark color such as black.

As shown in FIG. 18, the identification plate 152 has a first position that overlaps the first display H1 via the first door 711 when the cylinder rod 740a is in the retracted state or in the open state. It is comprised so that it may be located in. On the other hand, as shown in FIG. 19, the identification plate 152 is connected to the second display H2 via the first door 711 in a state where the cylinder rod 740a protrudes, that is, in a state where the opening of the cylinder rod 740a is restricted. It is comprised so that it may be located in the 2nd position which overlaps.

In a state where the first display H1 and the identification plate 152 overlap, the identification plate 152 can make the first display H1 more conspicuous than the second display H2. Thereby, the operator can recognize easily that it can be in an open state. On the other hand, in a state where the second display H2 and the identification plate 152 overlap, the identification plate 152 can make the second display H2 more conspicuous than the first display H1. Thereby, the worker can easily recognize that the opening state is restricted.

Thus, the identification plate 152 can be opened and closed by moving between the first position and the second position in conjunction with the operating state of the cylinder rod 740a. Or not.

According to this embodiment, the monitor 151 in the third embodiment can be omitted. Therefore, the configuration of the notification unit 5a can be further simplified, and the cost can be reduced.

As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

Further, the electronic component transport device and the electronic component inspection device of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

In the third and fourth embodiments described above, the notification unit notifies whether or not the opening / closing unit can be opened / closed, that is, both the fact that it can be opened and the prohibition of opening. However, the present invention is not limited to this, and it is sufficient to display at least one of the fact that it can be opened and the prohibition of opening.

In the third and fourth embodiments described above, the case where the inspection apparatus performs a low temperature inspection has been described. However, the present invention can also be applied to a case where a high temperature inspection is performed. In this case, a temperature sensor may be provided in the device supply area, and a notification that it can be opened when the temperature detected by the temperature sensor becomes lower than a predetermined value can be adopted.

Further, in the third embodiment described above, the notification unit notifies by light. However, in the present invention, the notification unit is not limited to this, and any notification is possible as long as the notification is made using at least one of light and sound. . That is, notification by light may be omitted and notification may be performed using only sound, or notification may be performed using both light and sound.

In the third and fourth embodiments described above, the notification unit is provided in the opening / closing unit. However, the notification unit is not limited to this in the present invention. For example, in the vicinity of the opening / closing unit, the notification unit is located at a position off the opening / closing unit. It may be provided.

Further, the display unit of the notification unit may be a display using LEDs (Light Emitting Diode).

In the third and fourth embodiments described above, the opening / closing part is opened and closed by turning. However, in the present invention, the present invention is not limited to this. For example, any one of the X direction, the Y direction, and the Z direction can be used. The opening / closing operation may be performed by sliding the crab.

In the third embodiment described above, the notification unit displays the remaining time as an example of information until the opening / closing unit can be opened. However, the present invention is not limited to this, for example, The remaining time may be notified by percentage display.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus (electronic component inspection apparatus), 10A ... 1st temperature adjustment unit, 10B ... 2nd temperature adjustment unit, 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 121 ... Cooling member, DESCRIPTION OF SYMBOLS 122 ... Heating member, 123 ... Electronic component arrangement part, 124 ... Pocket (concave part), 125 ... Upper surface, 13 ... Device conveyance head, 131 ... Adsorption part, 14 ... Device supply part, 141 ... Cooling member, 142 ... Heating member, 143: Electronic component placement unit, 144: Pocket (concave portion), 145 ... Upper surface, 15 ... Tray transport mechanism, 16 ... Inspection unit, 17 ... Device transport head, 18 ... Device recovery unit, 19 ... Recovery tray, 20 ... Device Transport head, 21 ... Tray transport mechanism, 22A ... Tray transport mechanism, 22B ... Tray transport mechanism, 3A ... Dry air supply unit, 3B ... Dry air supply unit 31 ... tube, 311 ... side hole, 32 ... tube, 321 ... side holes, 4A ... ion generating section, 4B ... ion generating unit, 4B 1 _... ion generating unit, 4B 2 _... ion generating unit, 5A ... injector 5B: injection unit, 5B ₁ ... injection unit, 5B ₂ ... injection unit, 5C ... injection unit, 51 ... tube body, 511 ... jet port, 52 ... tube body, 521 ... jet port, 522 ... jet port, 53 ... Pipe body, 531... Jet port, 532... Jet port, 54... Plate-like member (sheet body), 541... Jet port, 61 ... first partition wall, 62 ... second partition wall, 63 ... third partition wall, 64. Bulkhead, 65 ... Fifth bulkhead, 70 ... Front cover, 71 ... Side cover, 72 ... Side cover, 73 ... Rear cover, 74 ... Top cover, 8A ... Storage section, 8B ... Storage section, 8C ... Storage section, 81 ... Storage Main part, 82 ... Shutter, 83 ... Side wall, 84 ... Top plate, 841 ... Opening, 85 ... side wall, 86 ... top plate, 861 ... opening, 90 ... IC device, 200 ... tray (mounting member), 300 ... monitor, 301 ... display screen, 400 ... signal lamp, 500 ... speaker, 600 ... mouse 700, operation panel, 80, control unit, 900, dry air generation unit, A1, tray supply area, A2, device supply area (supply area), A3, inspection area, A4, device collection area (collection area), A5 ... tray removal area, DA ... dry air, IA ... ionized air, L 1 _... first column, L 2 _... second row, O _{16 ...} center line, _{O 511 ...} center line, _{O 521 ...} center line

Claims

A dry air supply unit capable of supplying dry air;
An ion generator capable of ionizing dry air;
An injection unit capable of injecting the ionized dry air;
An electronic component placement section that can place and cool electronic components;
A storage section that can store the electronic component placement section and has an opening through which the electronic component can pass;
The electronic component transport apparatus according to claim 1, wherein the ejection unit includes at least one ejection port capable of ejecting the ionized dry air inside the storage unit.
2. The electronic component transport apparatus according to claim 1, wherein the storage unit is provided in an exterior of the electronic component transport apparatus.
3. The electronic component transport apparatus according to claim 1, wherein the dry air from the dry air supply unit and the dry air from the ion generation unit are lower than a humidity outside the exterior, respectively.
4. The electronic component conveying apparatus according to claim 1, wherein a pressure inside the storage unit is higher than a pressure outside the storage unit.
5. The electronic component transport apparatus according to claim 1, wherein the electronic component placement unit is a soak plate capable of adjusting a temperature of the electronic component.
5. The electronic component transport apparatus according to claim 1, wherein the electronic component placement unit is a shuttle plate capable of transporting the electronic component.
The electronic component conveying apparatus according to any one of claims 1 to 6, wherein the storage unit includes a plurality of the openings and a shutter that opens and closes the plurality of openings.
The electronic component transport apparatus according to any one of claims 1 to 7, wherein an installation height of the ejection port is higher than an upper surface of the electronic component placement portion.
The electronic component transport apparatus according to any one of claims 1 to 8, wherein an installation place of the ion generation unit is higher than the electronic component placement unit.
10. The electronic component transport apparatus according to claim 1, wherein when the electronic component placement unit is viewed in plan, the number of the ion generation units installed is at least one around the electronic component placement unit.
The electronic component placement portion has a recess in which the electronic components are placed one by one,
The electronic component conveying apparatus according to any one of claims 1 to 10, wherein an installation place of the ejection port is above the concave portion.
The electronic component transport device according to claim 11, wherein an installation location of the ejection port corresponds to each of the recesses.
A plurality of the outlets are provided,
The electronic component transport apparatus according to claim 1, wherein the plurality of jet nozzles are arranged in a planar direction.
A dry air supply unit capable of supplying dry air;
An ion generator capable of ionizing dry air;
An injection unit capable of injecting the ionized dry air;
An electronic component placement section that can place and cool electronic components;
A storage portion that can store the electronic component placement portion and has an opening through which the electronic component can pass; and
An inspection unit for inspecting the electronic component,
The electronic component inspection apparatus, wherein the injection unit has at least one injection port capable of injecting the ionized dry air inside the storage unit.