TWI617819B - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can locally spray ionized dry air to a target.

The electronic component conveying apparatus of the present invention includes: a dry air supply unit 3A that supplies dry air DA; an ion generating unit that ionizes dry air; and an injection unit 5A that can be sprayed to the ion generating unit to be dried after ionization Air (ionized air IA); temperature adjustment unit 12 as an electronic component arrangement portion of configurable and coolable electronic component IC device 90; and accommodating portion 8A accommodating temperature adjustment portion 12 and having The IC device 90 passes through the opening 841; and the ejection portion 5A has at least one ejection port 511 that can eject the ionized air IA to the inside of the housing portion 8A.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

Previously, an electronic component inspection apparatus for inspecting (testing) electrical characteristics of electronic components such as semiconductor components (for example, IC devices) has been known.

In the electronic component inspection device, one of the electronic components in the inspection socket heating inspection is brought into contact with the ionized air to be sprayed (for example, refer to Patent Document 1). Further, the electrostatic neutralization of the electronic component is performed by ionizing the contact of the sprayed air.

In the electronic component inspection device, an electronic component transfer device for transporting an IC device is incorporated (for example, see Patent Document 2).

Further, in the electronic component inspection apparatus, the plurality of IC devices are placed on the tray, and the tray is fed into the apparatus, and the tray is transported to the inspection unit for inspection by the transport unit. Further, when the inspection is completed, the IC device is placed on the tray and discharged to the outside of the apparatus by the conveyance unit and the tray.

In such an electronic component conveying device, a door (opening and closing portion) is provided in the cover of the outermost layer. For example, when the operation of the conveying unit is stopped for some reason, or when maintenance is performed, the operator sometimes opens the door. .

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-223588

[Patent Document 2] Japanese Patent Laid-Open No. Hei 11-111802

However, in the electronic component inspection apparatus described in Patent Document 1, since the ionized air is filled with a specific inside, for example, the ionized sprayed air is locally blown to the cooled electronic component. In the case, it cannot be done.

Further, in the electronic component inspection apparatus described in Patent Document 2, it is difficult for the operator to fill the door with the cooling gas in the electronic component inspection device, for example, or the internal temperature is relatively high. Make a judgment as to whether the door can be opened.

The present invention has been made to solve at least a part of the above problems, and can be realized as the following aspects or application examples.

[Application Example 1] The electronic component conveying apparatus of the application example is characterized by comprising: a dry air supply unit that supplies dry air; an ion generating unit that ionizes dry air; and an injection unit that ejects the ionization Dry air; an electronic component arranging portion configurable and capable of cooling the electronic component; and a accommodating portion accommodating the electronic component arranging portion and having an opening through which the electronic component can pass; and the spraying portion has a At least one discharge port of the ionized dry air is sprayed into the inside of the accommodating portion.

In the electronic component conveying apparatus of this application example, the ionized dry air can be partially sprayed to the target by appropriately setting the position of the discharge port, so that the static electricity can be removed at the target. Further, since the inside of the accommodating portion is filled with the dry air from the dry air supply portion, it is possible to prevent the ionized dry air from being degraded by the moisture.

[Application Example 2] In the electronic component conveying device according to the application example described above, preferably, the storage portion is included in the exterior of the electronic component conveying device.

Thereby, the dry air from the dry air supply portion can be easily filled with a portion required to prevent dew condensation.

[Application Example 3] In the electronic component conveying apparatus according to the application example described above, preferably, the dry air from the dry air supply unit and the dry air from the ion generating unit are lower than the outer side of the outer casing. Humidity.

Thereby, dew condensation can be prevented from occurring in the accommodating portion regardless of the use environment of the electronic component conveying device.

[Application Example 4] In the electronic component conveying device according to the application example described above, preferably, the pressure inside the storage portion is higher than the pressure on the outer side of the storage portion.

Thereby, the dry air from the dry air supply unit is ejected through the opening of the accommodating portion, so that the relatively humid air outside the accommodating portion can be prevented from flowing into the accommodating portion through the opening.

[Application Example 5] In the electronic component conveying device according to the application example described above, preferably, the electronic component placement unit is a temperature equalization plate capable of adjusting a temperature of the electronic component.

Thereby, when the electrical inspection of the electronic component is performed in the electronic component conveying device, the electronic component can be previously cooled or heated before the inspection, and adjusted to a temperature suitable for the inspection.

[Application Example 6] In the electronic component transport device according to the application example described above, preferably, the electronic component placement unit is configured to transfer the shuttle of the electronic component.

Thereby, when the electronic component is electrically inspected in the electronic component transport apparatus, the electronic component can be transported toward the inspection unit that can perform the inspection.

[Application Example 7] In the electronic component conveying device according to the application example described above, preferably, the storage portion includes a plurality of the openings, and includes a shutter that opens and closes the plurality of openings.

Thereby, the opening can take an open state and a closed state. In the closed state, since the airtightness of the accommodating portion can be ensured, it is possible to prevent the relatively humid air outside the accommodating portion from flowing into the accommodating portion through the opening. Further, in the open state, the electronic component can be taken out to the outside of the storage portion.

[Application Example 8] In the electronic component conveying device described in the above application example, preferably Therefore, the discharge height of the discharge port is higher than the upper surface of the electronic component arrangement portion.

Thereby, the ionized dry air can pass directly above the electronic component. At this time, the surface of the electronic component is in contact with the dry air to be electrostatically removed.

[Application Example 9] In the electronic component conveying apparatus according to the application example described above, preferably, the installation portion of the ion generating portion is higher than the electronic component placement portion.

The dry air from the ion generating portion has a larger specific gravity. Therefore, when the ion generating portion is disposed at a position higher than the electronic component arrangement portion, the dry air can quickly flow down toward the electronic component placement portion.

[Application Example 10] In the electronic component conveying apparatus according to the application example described above, preferably, when the electronic component placement portion is viewed from above, the number of the ion generation portions is at least around the electronic component placement portion. There is one.

Thereby, for example, when a plurality of electronic component placement portions are provided, the ionized dry air can be oriented as evenly as possible toward the electronic components on the respective electronic component placement portions.

In the electronic component transport apparatus according to the above aspect of the invention, preferably, the electronic component placement unit includes a recessed portion in which the electronic component is disposed one by one, and the installation portion of the discharge port is above the recessed portion.

Thereby, the discharge port can be made as close as possible to the electronic component in the recess, and therefore, the static elimination effect by the ionized dry air is improved.

[Application Example 12] In the electronic component conveying device according to the application example described above, preferably, the installation portion of the discharge port corresponds to each of the concave portions.

Thereby, the ionized dry air can be individually blown to the electronic components located in the respective recesses, so that sufficient static elimination can be performed.

[Application Example 13] In the electronic component conveying device according to the application example described above, preferably, the plurality of discharge ports are provided in plural, and the plurality of discharge ports are disposed in a planar direction.

Thereby, the ionization of the electronic components located in the respective recesses can be individually blown Dry air, therefore, sufficient static removal can be performed.

[Application Example 14] The electronic component inspection apparatus of the application example is characterized by comprising: a dry air supply portion that supplies dry air; an ion generating portion that ionizes dry air; and an injection portion that ejects the ionization described above Dry air; an electronic component arranging portion configurable and capable of cooling the electronic component; a accommodating portion accommodating the electronic component arranging portion and having an opening through which the electronic component can pass; and an inspection portion for inspecting the electronic component And the injection unit has at least one discharge port that can eject the ionized dry air into the inside of the storage unit.

In the electronic component inspection apparatus of this application example, the ionized dry air can be partially sprayed to the target by appropriately setting the position of the discharge port, so that the static electricity can be removed from the target. Further, since the inside of the accommodating portion is filled with the dry air from the dry air supply portion, it is possible to prevent the ionized dry air from being degraded by the moisture.

[Application Example 15] The electronic component transport apparatus according to the application example of the present invention includes: a transport unit that can transport an electronic component; an opening and closing unit that can be opened and closed; and a display unit that can display an operation state of the transport unit; and a notification unit It informs whether the above-mentioned opening and closing unit can be opened or closed.

Thereby, the operator can be made to recognize whether the opening and closing unit can be opened or closed. Therefore, it is possible to prevent the operator from setting the opening and closing portion to the open state, for example, although the inside of the device is in a state of being unsatisfactory to the operator. As a result, the safety of the operator can be ensured.

In the electronic component conveying device according to the application example 15, the notification unit is configured to notify at least one of light and sound.

Thereby, the operator can be made to recognize whether the opening and closing portion can be opened and closed with high accuracy.

In the electronic component conveying apparatus according to the application example 15 or 16, the locking device is configured to switch between the closing state of the opening and closing portion and the releasing of the closed state.

Thereby, it is possible to prevent the operator from accidentally opening the opening and closing portion during the conveyance of the electronic component, for example.

[Application Example 18] In the electronic component conveying device described in Application Example 17, preferably The notification unit includes a window portion that visually recognizes an operation state of the lock portion.

Thereby, for example, a device such as a display device can be omitted as the notification unit, and the configuration of the notification unit can be simplified.

In the electronic component conveying device according to the application example 18, preferably, the window portion is provided with a first display for displaying the opening and closing portion, and the first display is provided The first display has a different position, and the display restricts the opening and closing portion to be the second display of the open state, and the notifying portion includes an identification portion that is interlocked with the operating state of the locking portion to intervene The window portion moves between the first position overlapping the first display and the second position that overlaps the window portion and the second display, and recognizes whether the opening and closing portion can be opened or closed.

Thereby, for example, a device such as a display device can be omitted as the notification unit, and the configuration of the notification unit can be simplified.

In the electronic component conveying apparatus according to any one of the first to fifth aspect of the invention, the information of the present invention is that the notification unit is provided in the opening and closing unit.

Thereby, when the operator performs the opening and closing operation of the opening and closing portion, the operator can recognize whether the opening and closing portion can be opened and closed with high accuracy.

In the electronic component transport apparatus according to any one of the first to fifth aspects of the invention, the notification unit is configured to notify that the information before the opening and closing portion can be opened.

Thereby, for example, when the information is in the case of time, the operator can grasp the time until the opening and closing portion can be opened. Therefore, the operator can perform other work before the work of opening the opening and closing unit is performed.

In the electronic component conveying apparatus according to any one of the first to fifth aspects of the invention, the notification unit is disposed at a distance of 600 mm or more and 2000 mm or less from the installation surface on which the electronic component conveying device is provided. The position of the height.

Therefore, when the notification unit is configured to recognize the composition by visual recognition, it may be The operator reports with higher accuracy.

In the electronic component conveying device according to any one of the first to fifth aspects of the invention, the display unit displays whether the opening and closing portion can be opened or closed.

In addition to the notification unit, the display unit also displays whether the opening and closing unit can be opened and closed, so that the operator can easily recognize it.

[Application Example 24] The electronic component inspection apparatus according to the application example of the present invention includes: a transfer unit that can transport an electronic component; an opening and closing unit that can be opened and closed; and a display unit that can display an operation state of the transport unit; and a notification unit, It notifies whether the opening and closing unit can be opened or closed, and the inspection unit checks the electronic components.

Thereby, the operator can be made to recognize whether the opening and closing unit can be opened or closed. Therefore, it is possible to prevent the operator from setting the opening and closing portion to the open state, for example, although the inside of the device is in a state of being unsatisfactory to the operator. As a result, the safety of the operator can be ensured.

1‧‧‧Inspection device (electronic parts inspection device)

1a‧‧‧Inspection device (electronic parts inspection device)

3A‧‧‧Dry Air Supply Department

3B‧‧‧Dry Air Supply Department

4‧‧‧Opening and closing department

4A‧‧‧Ion Generation Department

4B‧‧‧Ion Generation Department

4B ₁ ‧‧‧Ion Generation Department

4B ₂ ‧‧‧Ion Generation Department

5‧‧‧Notification Department

5a‧‧‧Notice

5A‧‧‧Injection Department

5B‧‧‧Injection Department

5B ₁ ‧‧‧Spray Department

5B ₂ ‧‧‧Spray Department

5C‧‧‧Injection Department

6‧‧‧Transportation Department

8A‧‧‧Storage Department

8B‧‧‧Storage Department

8C‧‧‧ Storage Department

10‧‧‧Electronic parts conveying device

10A‧‧‧1st temperature adjustment unit

10B‧‧‧2nd temperature adjustment unit

10Ba‧‧‧2nd temperature adjustment unit

11A‧‧‧Tray transport mechanism

11B‧‧‧Tray transport mechanism

12‧‧‧ Temperature Adjustment Department

13‧‧‧Device Transfer Head

14‧‧‧Device Supply Department

15‧‧‧Tray transport mechanism

16‧‧‧Inspection Department

17‧‧‧Device transfer head

18‧‧‧Device Recycling Department

19‧‧‧Recycling tray

20‧‧‧Device Transfer Head

21‧‧‧Tray transport mechanism

22A‧‧‧Tray transport mechanism

22B‧‧‧Tray transport mechanism

31‧‧‧ tube body

32‧‧‧ tube body

41a‧‧‧Edge (edge)

41b‧‧‧ edge (edge)

41c‧‧‧ side (edge)

41d‧‧‧Edge (edge)

42‧‧‧Rotation Support

43‧‧‧Locking members

51‧‧‧ tube body

52‧‧‧ tube body

53‧‧‧pipe body

54‧‧‧ Plate-like members (sheet body)

61‧‧‧1st partition

62‧‧‧2nd partition

63‧‧‧3rd partition

64‧‧‧4th partition

65‧‧‧5th partition

66‧‧‧ inside partition

70‧‧‧ front cover

71‧‧‧ side cover

71a‧‧‧ side cover

72‧‧‧ side cover

72a‧‧‧ side cover

73‧‧‧Back cover

73a‧‧‧Back cover

74‧‧‧Top cover

75‧‧‧4th door

76‧‧‧ frame

80‧‧‧Control Department

81‧‧‧Shelter body

82‧‧‧1.

83‧‧‧ side wall

84‧‧‧ top board

85‧‧‧ side wall

86‧‧‧ top board

90‧‧‧IC devices

101‧‧‧Inspection device (electronic parts inspection device)

101a‧‧‧Inspection device

112‧‧‧ Temperature Adjustment Department

114‧‧‧Device Supply Department

116‧‧‧Inspection Department

117‧‧‧Device transfer head

118‧‧‧Device Recycling Department

121‧‧‧Cooling components

122‧‧‧heating components

123‧‧‧Electronic Parts Configuration Department

124‧‧‧ Groove (recess)

125‧‧‧ upper surface

131‧‧‧Adsorption Department

141‧‧‧Cooling components

142‧‧‧heating components

143‧‧‧Electronic Parts Configuration Department

144‧‧‧ Groove (recess)

145‧‧‧ upper surface

151‧‧‧ monitor

152‧‧‧ Identification board

180‧‧‧Control Department

181‧‧‧Drive Control Department

182‧‧‧Check Control Department

183‧‧‧Memory Department

200‧‧‧Tray (placement member)

300‧‧‧ monitor

301‧‧‧Display screen

311‧‧‧ side hole

321‧‧‧ side hole

400‧‧‧Signal lights

500‧‧‧Speakers

511‧‧‧Spray outlet

521‧‧‧Spray outlet

522‧‧‧ spout

531‧‧‧Spray outlet

532‧‧‧Spray outlet

541‧‧‧Spray outlet

600‧‧‧mouse table

700‧‧‧Operator panel

711‧‧‧1st door

711a‧‧‧1st door

712‧‧‧2nd door

713‧‧‧ openings

714‧‧‧Handle

721‧‧‧1st door

722‧‧‧2nd door

731‧‧‧1st door

732‧‧‧2nd door

733‧‧‧1st door

740‧‧‧Cylinder

740a‧‧‧Piston rod

800‧‧‧ concentration sensor

841‧‧‧ openings

861‧‧‧ openings

900‧‧‧Dry air generation department

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

DA‧‧‧dry air

H‧‧‧ Height

H1‧‧‧1st display

H2‧‧‧2nd display

IA‧‧‧Ionized air

L ₁ ‧‧‧Line 1

L ₂ ‧‧‧2nd line

M‧‧‧Setting surface

O ₁₆ ‧‧‧ center line

O ₅₁₁ ‧‧‧ center line

O ₅₂₁ ‧‧‧ center line

S101~S106‧‧‧Steps

X‧‧‧ axis (direction)

Y‧‧‧ axis (direction)

Z‧‧‧ axis (direction)

α _11A ‧‧‧ arrow

α _11B ‧‧‧ arrow

α _13X ‧‧‧ arrow

α _13Y ‧‧‧ arrow

_{14 14} ‧‧‧ arrow

_{15 15} ‧‧‧ arrow

α _17Y ‧‧‧ arrow

_{18 18} ‧‧‧ arrow

α _20X ‧‧‧ arrow

α _20Y ‧‧‧ arrow

_{21 21} ‧‧‧ arrow

α _22A ‧‧‧ arrow

α _22B ‧‧‧ arrow

_{71 71} ‧‧‧ arrow

_{72 72} ‧‧‧ arrow

_{75 75} ‧‧‧ arrow

α ₉₀ ‧‧‧ arrow

₇₃₁ ‧‧‧ arrow

₇₃₂ ‧‧‧ arrow

₇₃₃ ‧‧‧ arrow

Fig. 1 is a schematic perspective view showing a first embodiment of the electronic component inspection device of the present invention as seen from the front side.

Fig. 2 is a schematic plan view showing an operation state of the electronic component inspection device shown in Fig. 1.

Fig. 3 is a horizontal cross-sectional view showing a temperature equalizing plate provided in the electronic component inspection device shown in Fig. 1 and its periphery.

Figure 4 is a cross-sectional view taken along line A-A of Figure 3 (showing the state of closing the shutter).

Figure 5 is a cross-sectional view taken along line A-A of Figure 3 (showing the state of opening the shutter).

Figure 6 is a cross-sectional view taken along line B-B of Figure 3.

Fig. 7 is a horizontal sectional view showing a supply shuttle plate provided in the electronic component inspection device shown in Fig. 1 and its periphery.

Figure 8 is a cross-sectional view taken along line C-C of Figure 7.

Fig. 9 is a view showing the supply of the electronic component inspection device (second embodiment) of the present invention. Top view of the shuttle and its surroundings.

Fig. 10 is a schematic perspective view of the electronic component inspection device (third embodiment) of the present invention as seen from the front side.

Figure 11 is a plan view of the electronic component inspection apparatus shown in Figure 10.

Figure 12 is a block diagram of the electronic component inspection apparatus shown in Figure 10.

Fig. 13 is a view showing an opening and closing portion and a notifying portion of the electronic component inspection device shown in Fig. 10.

Fig. 14 is a view showing an opening and closing portion and a notifying portion of the electronic component inspection device shown in Fig. 10.

Fig. 15 is a view showing an opening and closing portion and a notifying portion of the electronic component inspection device shown in Fig. 10.

Fig. 16 is a view showing an opening and closing portion and a notifying portion of the electronic component inspection device shown in Fig. 10.

Fig. 17 is a flow chart showing the control operation of the electronic component inspection apparatus shown in Fig. 10.

FIG. 18 is a view showing an opening and closing unit and a notifying unit included in the electronic component inspection device (fourth embodiment) of the present invention.

Fig. 19 is a view showing an opening and closing unit and a notifying unit provided in the electronic component inspection device (fourth embodiment) of the present invention.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on a preferred embodiment with reference to the additional drawings.

In the following embodiments, for convenience of explanation, the three axes orthogonal to each other shown in the drawing are referred to as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". Further, among the arrows indicating the three axes, the front end side of the arrow is referred to as "positive side (+ side)", and the base end side is referred to as "negative side (- side)". In addition, the +Z direction side in the figure may be referred to as "upper (or upper)", and the -Z direction side may be referred to as "lower (or lower)". Further, the "level" stated in the specification of the present invention is not limited to the full level, and as long as the electronic component is not hindered from being transported, it is also in a state of being slightly inclined with respect to the horizontal (for example, less than about 5 degrees).

<First embodiment>

Fig. 1 is a schematic perspective view showing a first embodiment of the electronic component inspection device of the present invention as seen from the front side. Fig. 2 is a schematic plan view showing an operation state of the electronic component inspection device shown in Fig. 1. Fig. 3 is a horizontal cross-sectional view showing a temperature equalizing plate provided in the electronic component inspection device shown in Fig. 1 and its periphery. 4 is a cross-sectional view taken along line A-A of FIG. 3 showing a state in which the shutter is closed, and FIG. 5 is a cross-sectional view taken along line A-A of FIG. 3 showing a state in which the shutter is opened. Figure 6 is a cross-sectional view taken along line B-B of Figure 3. Fig. 7 is a horizontal sectional view showing a supply shuttle plate provided in the electronic component inspection device shown in Fig. 1 and its periphery. Figure 8 is a cross-sectional view taken along line C-C of Figure 7.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 and FIG. 2 transports an IC device such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package, An electronic component such as an LCD (Liquid Crystal Display) or a CIS (CMOS Image Sensor: CMOS image sensor), which is inspected and tested (hereinafter referred to as "inspection") for electrical characteristics during transport. In the following, for convenience of explanation, a case where the IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 90".

As shown in FIG. 1 and FIG. 2, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, and a device collection area (hereinafter simply referred to as "recycling area") A4. And the tray removal area A5. Further, for example, in the normal transfer mode, the IC device 90 sequentially passes through (the respective regions) from the tray supply region A1 to the tray removal region A5, and inspects the inspection region A3 in the middle.

As described above, the inspection apparatus 1 is configured to include an electronic component transport apparatus (processor) that transports the IC device 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 80. Moreover, the inspection apparatus 1 is provided with the monitor 300, the signal light 400, and the operation panel 700 (refer FIG. 1).

In addition, the inspection apparatus 1 is provided with the tray supply area A1, the side of the tray removal area A5 (the -Y direction side in FIG. 2) as the front side, and the opposite side, that is, the side of the inspection area A3 (in FIG. 2). The +Y direction side is used as the back side.

The tray supply area A1 supplies a supply unit of a tray (mounting member) 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 supplies a plurality of IC devices 90 disposed on the tray 200 from the tray supply area A1 to the area of the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the tray 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2.

The tray transport mechanism 11A is a moving portion that can move the tray 200 together with the IC device 90 placed on the tray 200 toward the positive side in the Y direction. Thereby, the IC device 90 can be stably fed into the supply region A2. Further, the tray transport mechanism 11B can move the empty tray 200 to the negative side in the Y direction, that is, the moving portion that moves from the supply area A2 to the tray supply area A1.

The temperature adjustment unit 12, the device transfer head 13, and the tray transport mechanism 15 are provided in the supply area A2.

As shown in FIGS. 4 to 6, the temperature adjustment unit 12 has a plate-shaped cooling member 121 that can uniformly cool a plurality of IC devices 90, and a plate that is disposed on the lower side of the cooling member 121 and can uniformly heat a plurality of IC devices 90. The heating member 122 is sometimes referred to as a "leveling plate". With the temperature equalizing plate, the IC device 90 before the inspection portion 16 can be pre-cooled or heated to be adjusted to a temperature suitable for the inspection.

In the configuration shown in FIG. 2, the temperature adjustment unit 12 is disposed and fixed in the Y direction. One. The IC device 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported to any of the temperature adjustment units 12.

In addition, a plurality of IC devices 90 are arranged in a state in which the recesses (recesses) 124 of the plate-shaped electronic component placement portion 123, which is called a "change kit", are replaced one by one in each type of the IC device 90. It is placed on the cooling member 121 (see FIGS. 4 to 6). Moreover, the IC devices 90 are cooled or heated together with the electronic component placement portion 123.

The device transfer head 13 includes an adsorption unit 131 and is supported to be movable in the X direction, the Y direction, and further the Z direction in the supply region A2. Thereby, the device transfer head 13 can carry the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14 to be described later. Transfer.

The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in which the state of all the IC devices 90 is removed to the positive side in the X direction in the supply region A2. Then, after the transfer, the empty tray 200 is transported back to the tray supply area A1 from the supply area A2 by the tray transport mechanism 11B.

The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 and a device transfer head 17 are provided. Further, a device supply unit 14 that moves so as to straddle the supply area A2 and the inspection area A3, and a device recovery unit 18 that moves so as to straddle the inspection area A3 and the collection area A4 are provided.

The device supply unit 14 mounts the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12, and the IC device 90 can be transported (moved) to the moving portion in the vicinity of the inspection unit 16, and may be referred to as a “supply shuttle”. board". The device supply portion 14 is supported to be movable in the horizontal direction between the supply region A2 and the inspection region A3 in the X direction. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to any of the device supply units 14.

Further, the device supply unit 14 is configured to maintain the temperature adjustment state of the temperature-adjusted IC device 90. As shown in FIG. 8, the device supply unit 14 has a plurality of ICs that can be uniformly cooled. A plate-shaped cooling member 141 of the member 90 and a plate-shaped heating member 142 disposed on the lower side of the cooling member 141 and capable of uniformly heating the plurality of IC devices 90 are provided. Thereby, the IC device 90 can be cooled or heated, and therefore, the temperature adjustment state of the IC device 90 can be maintained.

Similarly to the temperature adjustment unit 12, the device supply unit 14 also mounts the plate-shaped electronic component placement unit 143, which is called a “change kit”, which is replaced by each type of the IC device 90, on the cooling member 141. (Refer to Figure 8). Further, the plurality of IC devices 90 transported by the device supply unit 14 are cooled or heated together with the electronic component placement portion 143 in a state of being placed one by one in the recess (recess) 144 of the electronic component placement portion 143.

As will be described later, in the present embodiment, the temperature adjustment unit 12 constitutes one of the first temperature adjustment units 10A, and the device supply unit 14 constitutes one of the second temperature adjustment units 10B.

Further, the cooling member 121 of the temperature adjustment unit 12 and the cooling member 141 of the device supply unit 14 form a flow path (not shown) through which a refrigerant such as liquid nitrogen passes, whereby the IC device 90 can be cooled. Further, the constituent members of the cooling member 121 and the cooling member 141, and the electronic component placement portion 123 and the electronic component placement portion 143 are not particularly limited, and it is preferably a metal material having a relatively high thermal conductivity such as aluminum. .

The heating member 122 of the temperature adjustment unit 12 and the heating member 142 of the device supply unit 14 are each configured by a rubber heater that generates heat by applying a voltage, whereby the IC device 90 can be heated.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 in a state of holding the IC device 90. Further, the terminal of the IC device 90 is electrically connected (contacted) to the probe pin, and the inspection of the IC device 90 is performed via the probe pin. The inspection of the IC device 90 is performed based on a program stored in the inspection control unit provided in the tester connected to the inspection unit 16. Further, in the inspection unit 16, similarly to the temperature adjustment unit 12, a plurality of IC devices 90 may be cooled or heated to adjust the IC device 90 to a temperature suitable for inspection.

The device transfer head 17 is supported to be movable in the Y direction in the inspection area A3. With this, The device transfer head 17 can transport the IC device 90 on the device supply unit 14 carried in from the supply region A2 to the inspection unit 16 and mount it. Alternatively, the device transfer head 17 may also cool or heat the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.

The device recovery unit 18 is placed on the IC device 90 after the inspection by the inspection unit 16 is completed, and the IC device 90 can be transported (moved) to the moving portion of the recovery area A4, which may be referred to as a "recycling shuttle". . The device recovery portion 18 is supported to be movable in the horizontal direction between the inspection region A3 and the recovery region A4 in the X direction. Further, in the configuration shown in FIG. 2, the device recovery unit 18 is disposed in the Y direction in the same manner as the device supply unit 14, and the IC device 90 on the inspection unit 16 is transported to any device recovery unit 18. Placed. This transfer is performed by the device transfer head 17.

In addition to the temperature adjustment unit 12, the device recovery unit 18 or the inspection unit 16 also mounts a change kit that is replaced by each type of the IC device 90.

The recovery area A4 is a region of a plurality of IC devices 90 after the end of the inspection. In the collection area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared.

The recovery tray 19 is placed on the mounting portion of the IC device 90 after inspection by the inspection unit 16, and is fixed so as not to move in the recovery area A4. As a result, even in a collection area A4 in which a plurality of movable portions such as the device transfer head 20 are disposed, the IC device 90 that has been inspected is stably placed on the recovery tray 19. Further, in the configuration shown in Fig. 2, three collection trays 19 are arranged in the X direction.

Further, three empty trays 200 are also arranged in the X direction. The empty tray 200 also serves as a mounting portion of the IC device 90 placed on the inspection unit 16 for inspection. Then, the IC device 90 that has moved to the device collection unit 18 of the recovery area A4 is transported to any one of the collection tray 19 and the empty tray 200 and placed thereon. Thereby, the IC device 90 is classified and recovered according to each inspection result.

The device transport head 20 is supported to be in the X and Y directions in the recovery area A4. It also moves in the Z direction. Thereby, the device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction in the collection area A4. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, and any one of the above three empty trays 200 can be used.

The tray removal area A5 is a discharge unit that collects and removes the tray 200 of the plurality of IC devices 90 in which the inspection state is completed. In the tray removal area A5, a plurality of trays 200 can be stacked.

Further, the tray transport mechanisms 22A and 22B that transport the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving portion that can move the tray 200 in the Y direction. Thereby, the IC device 90 that has completed the inspection can be transferred from the recovery area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can use a moving portion in which the tray 200 in which the IC device 90 is empty is moved from the tray removal area A5 to the recovery area A4.

The control unit 80 (see FIG. 1) has, for example, a drive control unit. The drive control unit controls, for example, the tray transport mechanisms 11A and 11B, the temperature adjustment unit 12, the device transport head 13, the device supply unit 14, the tray transport mechanism 15, the inspection unit 16, the device transport head 17, the device recovery unit 18, and the device transport head 20. The tray transport mechanism 21 and the respective portions of the tray transport mechanisms 22A and 22B are driven.

In addition, the inspection control unit of the tester performs inspection of electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).

The operator can set or confirm the operating conditions and the like of the inspection apparatus 1 via the monitor 300. The monitor 300 has a display screen (display portion) 301 composed of, for example, a liquid crystal screen, and is disposed on the upper portion of the front side of the inspection apparatus 1. As shown in Figure 1, in the tray removal area A5 The right side (+X direction side) of the figure is provided with a mouse pad 600 that is placed on the mouse used to operate the screen displayed on the monitor 300.

Further, an operation panel 700 is disposed on the lower right side of FIG. 1 with respect to the monitor 300. Unlike the monitor 300, the operation panel 700 commands the inspection device 1 to request the actor.

Further, the signal lamp 400 can notify the operating state of the inspection apparatus 1 or the like by a combination of colors of light emission. The signal lamp 400 is disposed on the upper portion of the inspection device 1. Further, in the inspection apparatus 1, a speaker 500 is built in, and the speaker 500 can also notify the operation state of the inspection apparatus 1 and the like.

As shown in FIG. 2, the inspection apparatus 1 is partitioned (separated) between the tray supply area A1 and the supply area A2 by the first partition plate 61, and the second partition 62 divides between the supply area A2 and the inspection area A3. The third partition plate 63 divides the inspection area A3 from the recovery area A4, and the fourth partition plate 64 divides the space between the recovery area A4 and the tray removal area A5. Further, the supply region A2 and the recovery region A4 are also divided by the fifth separator 65. These separators have a function of maintaining the airtightness of each region.

Further, the inspection device 1 is covered with a cover, and the cover includes, for example, a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74.

The inspection device 1 is provided with a first temperature adjustment unit 10A and a second temperature adjustment unit 10B. Hereinafter, a case where the first temperature adjustment unit 10A (temperature adjustment unit 12) and the second temperature adjustment unit 10B (device supply unit 14) cool the IC device 90 will be described.

First, the first temperature adjustment unit 10A will be described with reference to Figs. 3 to 6 .

As shown in FIGS. 3 to 6 , the first temperature adjustment unit 10A includes a temperature adjustment unit 12 , a dry air supply unit 3A, an ion generation unit 4A, an injection unit 5A, and a storage unit 8A.

The accommodating portion 8A has a casing for accommodating (including) the two temperature adjusting portions 12 on the inner side thereof, and has a accommodating portion main body 81 and a shutter 82.

The accommodating portion main body 81 has side walls 83 that surround the two temperature adjusting portions 12 in the circumferential direction thereof, The top plate 84 of the two temperature adjustment portions 12 is covered from above.

A plurality of openings 841 are formed in the top plate 84. The openings 841 are formed such that a plurality of grooves 124 are arranged in a matrix in the electronic component arrangement portion 123 facing the respective temperature adjustment portions 12 . Further, one IC device 90 can be passed through each opening 841. Thereby, the IC device 90 can be taken out to the outside of the accommodating portion 8A.

The shutter 82 is disposed for each opening 841 disposed in the X direction, and opens and closes the openings 841. The shutter 82 is supported to be movable in the Y direction on the inner side (lower side) of the top plate 84. Thereby, the opening 841 can take the closed state shown in FIG. 4 and the open state shown in FIG.

In the closed state shown in Fig. 4, the airtightness of the accommodating portion 8A can be ensured. Thereby, it is possible to prevent the relatively humid air (hereinafter referred to as "wet air") in the supply region A2 from flowing into the accommodating portion 8A through the opening 841. In the accommodating portion 8A, the temperature adjusting portion 12 is in the cooling operation, or the temperature adjusting portion 12 cools the IC device 90. However, when the humid air flows into the accommodating portion 8A, condensation occurs in the temperature adjusting portion 12 or the IC device 90. situation. However, in the closed state, condensation can be prevented by preventing the inflow of humid air.

In the open state shown in FIG. 5, the adsorption portion 131 of the device transfer head 13 can enter the storage portion 8A via the opening 841. Thereby, the IC device 90 can be adsorbed and transported from the temperature adjustment unit 12 to the device supply unit 14.

Further, the shutter 82 is connected to a driving source (not shown) such as a cylinder or a motor. Thereby, the shutter 82 can be moved in the Y direction.

As shown in FIG. 3, the dry air supply unit 3A has a rigid tubular body 31 that extends in the Y direction in the accommodating portion 8A and is provided in parallel with the two temperature adjustment portions 12. Further, the pipe body 31 is connected to the dry air generating portion 900 that generates the dry air DA.

As shown in Fig. 6, a side hole 311 penetrating the pipe wall is formed in the pipe body 31. The side holes 311 are arranged at a plurality of intervals along the longitudinal direction of the pipe body 31. Thereby, the dry air DA can be sufficiently supplied into the accommodating portion 8A, and the dry air DA can be filled in the accommodating portion 8A. Moreover, the pressure inside the accommodating portion 8A filled with the dry air DA becomes high. The pressure on the outer side of the accommodating portion 8A, that is, the inside of the supply region A2. As a result, as shown in FIG. 5, the opening 841 of the accommodating portion 8A is opened, and the dry air DA is ejected from the opening 841. Therefore, it is possible to prevent the humid air from flowing into the accommodating portion 8A through the opening 841. Such a configuration is preferable for preventing condensation in the accommodating portion 8A.

Further, the tubular body 31 is preferably disposed as far as possible below the accommodating portion 8A, and more preferably disposed at least below the uppermost upper surface 125 of the electronic component arranging portion 123 of the temperature adjusting portion 12. Thereby, the situation in which the dry air DA is ejected from the opening 841 can be increased, and therefore, the inflow of the humid air can be sufficiently prevented.

Further, the side hole 311 formed in the tubular body 31 faces the temperature adjustment portion 12 in the configuration shown in FIG. 6, but is not limited thereto, and may be faced upward, for example. Further, in the tubular body 31, side holes 311 facing the temperature adjustment portion 12 and side holes 311 facing upward may be formed.

The dry air DA is set to have a lower humidity than the air (atmosphere) on the outer side of the outermost (the side cover 71, etc.) of the inspection apparatus 1. Thereby, regardless of the use environment of the inspection apparatus 1, it is possible to prevent dew condensation from occurring in the accommodating portion 8A.

Further, in the inspection apparatus 1, the accommodating portion 8A is included in the inner side of the outermost casing of the inspection device 1, that is, a part of the supply region A2. Thereby, the entire supply region A2 is filled with the dry air DA, and the casing (the casing) or the accommodating portion 8A of the cover can be partially covered with the periphery of the temperature adjustment portion 12 where condensation is likely to occur, and the dry air DA can be easily prevented from being filled. Condensation required parts.

The ion generating unit 4A is an ionizer that ionizes dry air to generate the ionized dry air (hereinafter referred to as "ionized air IA"). The ion generating unit 4A is not particularly limited, and for example, a person using a corona discharge or a person using ionizing radiation can be used.

The surface of the IC device 90 has the possibility of being electrostatically charged, for example, during transport of the IC device 90. Therefore, the static electricity must be removed. Therefore, in the first temperature adjustment unit 10A, the ionized air IA generated in the ion generating portion 4A can be blown to the surface of the IC device 90 via the ejection portion 5A to remove static electricity.

As shown in FIG. 3, the ion generating unit 4A is provided one by one around each temperature adjusting unit 12 in plan view. Thereby, the ionized air IA can be made to be equal to the IC device 90 on each temperature adjustment portion 12 as evenly as possible. In the configuration shown in FIG. 3, the temperature adjusting portion 12 on the positive side in the Y direction in the drawing is provided with the ion generating portion 4A on the positive side in the Y direction, and the temperature adjusting portion 12 on the negative side in the Y direction in the figure. The ion generating portion 4A is disposed on the negative side in the Y direction. However, the arrangement portion of each of the ion generating portions 4A is of course not limited thereto.

Further, the ion generating portion 4A is preferably disposed at a position higher than the temperature adjusting portion 12. The ionized air IA, which is dry air, usually has a larger specific gravity. Therefore, the ion generating portion 4A is disposed at a position higher than the temperature adjusting portion 12, and the ionized air IA can rapidly flow from the ion generating portion 4A toward the temperature adjusting portion 12.

Further, the ionized air IA is set to have a lower humidity than the air (atmosphere) on the outer side of the inspection device 1 as in the dry air DA. Thereby, regardless of the use environment of the inspection apparatus 1, it is possible to prevent dew condensation from occurring in the accommodating portion 8A.

As shown in FIG. 3, an ejection portion 5A that ejects ionized air IA is connected to each ion generating portion 4A. The injection portion 5A has a tubular body 51 made of resin. Further, the tube body 51 depends on the positional relationship between the ion generating portion 4A and the temperature adjusting portion 12, but may be linear (see the tube body 51 on the negative side in the Y direction in Fig. 3), or may be in the middle of the longitudinal direction. Bending or bending (refer to the pipe body 51 on the positive side in the Y direction in Fig. 3).

As shown in FIGS. 4 to 6, the tubular body 51 has a discharge port 511 that is opened in the accommodating portion 8A. The ionized air IA can be ejected into the inside of the accommodating portion 8A via the discharge port 511. Further, the ejection target of the ionized air IA, that is, the ejection target is the surface of the IC device 90. Therefore, the discharge port 511 is provided such that the center line O _{511 is} higher than the upper surface 125 of the electronic component placement portion 123 of the temperature adjustment portion 12 in the vertical direction (see FIG. 4). Thereby, the ionized air IA ejected from the ejection outlet 511 can pass right above the IC device 90 in the horizontal direction, that is, along the upper surface 125. At this time, the surface of the IC device 90 is in contact with the ionized air IA to be electrostatically removed.

As described above, in the first temperature adjustment unit 10A, the ionized air IA can be partially sprayed toward the surface of the target IC device 90 by appropriately setting the position of the discharge port 511. As a result, static elimination can be performed on the surface of the IC device 90.

Further, since the inside of the accommodating portion 8A is filled with the dry air DA as described above, it is possible to prevent the static electricity removing effect of the ionized air IA due to moisture from being lowered.

Here, it is assumed that the discharge port 511 is disposed at a lower position than the upper surface 125 of the electronic component arrangement portion 123. In this case, the discharge port 511 is in a state of being opened toward the side surface of the electronic component placement portion 123 or the cooling member 121. When the ionized air IA is ejected in this state, the ions in the ionized air IA collide with the side surface made of a metal material and are absorbed. Therefore, the static elimination effect of the ionized air IA on the IC device 90 cannot be expected.

In the present embodiment, each of the injection portions 5A is configured to have one discharge port. However, the present invention is not limited thereto, and may be configured to have two or more discharge ports, for example.

Next, the second temperature adjustment unit 10B will be described with reference to Figs. 7 and 8 . Here, the difference between the second temperature adjustment unit 10B and the first temperature adjustment unit 10A will be mainly described, and the same matters will not be described.

As shown in FIG. 7 and FIG. 8 , the second temperature adjustment unit 10B includes two sets of device supply units 14 , a dry air supply unit 3B, and an ion generation unit that are symmetrically arranged with respect to the center line O _{16 of the} inspection unit 16 in the X direction. 4B, the injection unit 5B, and the storage unit 8B. Since each group has the same configuration except for the arrangement portion, the configuration of one group (the upper side in FIG. 7) is representatively described.

As described above, the device supply portion 14 is movable between the supply region A2 and the inspection region A3. Hereinafter, the stop position of the device supply unit 14 in the supply area A2 will be referred to as a “first stop position”, and the stop position of the inspection area A3 will be referred to as a “second stop position”. Further, in the electronic component placement portion 143 of the device supply portion 14, a groove 144 is arranged in a matrix in the X direction and the Y direction. And, as shown in Figure 7, in this embodiment, along the row direction X of the groove 144 has the "row ₁ L 1", "Line 2 L _2" Total 2 rows.

As shown in FIGS. 7 and 8, the accommodating portion 8B houses a casing of the component supply portion 14 located at the first stop position. The accommodating portion 8B has a side wall 85 that surrounds one of the circumferential direction of the device supply portion 14 at the first stop position, and a top plate 86 that covers the device supply portion 14 at the first stop position from above.

A plurality of openings 861 are formed in the top plate 86. The openings 861 are formed such that a plurality of grooves 144 are arranged in a matrix in the electronic component arrangement portion 143 facing the device supply portion 14 at the first stop position. Moreover, one IC device 90 can be passed through each opening 861. Thereby, the IC device 90 can be placed on the groove 144 from the outside of the accommodating portion 8B.

In addition, as shown in FIG. 2, in the inspection apparatus 1, the storage part 8C which accommodates (incorporates) each device collection part 18 is provided in the structure similar to the accommodation part 8B in the collection area A4 side. Further, the storage unit 8C may be configured to be supplied with the dry air DA or the ionized air IA.

As shown in FIG. 7, the dry air supply unit 3B has a rigid tubular body 32 that extends in the X direction in the accommodating portion 8B and is provided in parallel with the device supply portion 14 at the first stop position. Further, the pipe body 32 is connected to the dry air generating portion 900 that is common to the pipe body 31 of the dry air supply portion 3A.

As shown in Fig. 8, in the pipe body 32, a side hole 321 penetrating the pipe wall is formed in the same manner as the pipe body 31. Thereby, the dry air DA can be supplied into the accommodating portion 8B, and the inside of the accommodating portion 8B can be filled with the dry air DA. Further, the pressure inside the accommodating portion 8B filled with the dry air DA is higher than the pressure inside the accommodating portion 8B, that is, the inside of the supply region A2. Thereby, the dry air DA is prevented from being ejected from the respective openings 861 of the accommodating portion 8B, and the humid air flows into the accommodating portion 8B through the opening 861. Therefore, condensation in the accommodating portion 8B is prevented.

As shown in FIG. 7, in the plan view, two ion generating portions 4B are disposed adjacent to each other in the X direction (negative side in the Y direction) around the device supply portion 14 at the first stop position. The plasma generating unit 4B can supply the ionized air IA generated by one of the ion generating units 4B ₁ to the ionized air IA generated by the other ion generating unit 4B _{2 at} the same timing or at different timings. Inside the storage unit 8B.

Further, in the second temperature adjustment unit 10B, two injection units 5B are provided corresponding to the two ion generation units 4B. Among the ejection portions 5B, one of the ejection portions 5B _{1 is} connected to the ion generating portion 4B ₁ , and the other ejection portion 5B _{2 is} connected to the ion generating portion 4B ₂ .

The injection portion 5B ₁ has a tubular body 52. The pipe body 52 is branched into two in the longitudinal direction, and has a discharge port 521 and a discharge port 522 which are open to the side wall 85 of the accommodating portion 8B.

As shown in FIG 7, at a top, an opening direction of the outlet 521 of the discharge becomes a direction toward the line L ₁ of the first groove 144, the discharge direction of the outlet opening 522 in a direction toward the line L 2 of the recess ₂ of 144.

Further, as shown in FIG. 8, the discharge port 521 (the same as the discharge port 522) is provided such that the center line O _{521 is} higher than the upper surface 145 of the electronic component placement portion 143 of the device supply portion 14. With this arrangement, the discharge from the discharge outlet 521 of ionized air along the upper surface 145 IA may be positive by the above L ₁ IC device 90 of the first row, this time, the IC device 90 of the surface in contact with the ionized air IA And the static electricity is removed.

Similarly, the ionized air IA ejected from the ejection outlet 522 can pass directly over the IC device 90 of the second row L ₂ along the upper surface 145. At this time, the surface of the IC device 90 is contacted with the ionized air IA to be electrostatically removed. .

The injection portion 5B ₂ has a tubular body 53. The pipe body 53 has a portion along the Y direction. In this portion, a discharge port 531 and a discharge port 532 (see FIG. 7) which are open to the top plate 86 of the accommodating portion 8B, that is, open toward the Z direction are provided.

8, in the device stops the supply portion 14 from the first position to the second position of the intermediate stop, arranged on the first line L ₁ of each groove 144 of the IC device 90 and the discharge port 531 corresponds to, i.e., for The method passes through directly below the discharge port 531. And, at this time by, line 1 L IC device 90 of _a contact with the surface IA ionized air, and is further fully removed electrostatically. Similarly, the IC devices 90 disposed in the recesses 144 of the second row L _{2 are} also sequentially moved directly below the ejection port 532 by the movement of the device supply portion 14. Further, at the time of the passage, the surface of the IC device 90 of the second row L ₂ is in contact with the ionized air IA, and the static electricity is further sufficiently removed.

In the present embodiment, each of the injection portions 5B is configured to have two discharge ports. However, the present invention is not limited thereto, and may be configured to have one or three or more discharge ports, for example.

<Second embodiment>

Fig. 9 is a plan view showing a supply shuttle plate provided in the electronic component inspection device (second embodiment) of the present invention and its periphery.

In the following, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the same matters will not be described.

This embodiment is the same as the first embodiment except that the configuration of the injection unit of the second temperature adjustment unit is different.

As shown in FIG. 9, the inspection apparatus 1a of this embodiment is equipped with the injection part 5C in the 2nd temperature adjustment means 10Ba. The injection portion 5C of the inspection device 1a has one plate-shaped member (sheet body) 54 that is disposed to face the device supply portion 14 located at the first stop position. On the lower surface of the plate member 54, a plurality of discharge ports 541 penetrating in the thickness direction are formed. These discharge ports 541 are arranged in a matrix in the planar direction of the plate-like member 54. Thereby, each of the discharge ports 541 is in a state corresponding to each of the grooves 144 of the device supply portion 14 located at the first stop position. Thereby, the ionized air IA can be individually blown to the IC device 90 located in each of the grooves 144, so that sufficient static elimination can be performed.

<Third embodiment>

Hereinafter, a third embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described with reference to Figs. 10 to 17 .

The inspection device 101 (electronic component inspection device) shown in Figs. 10 and 11 is built-in electronic In the component transfer apparatus 10, for example, an electronic component such as an IC device packaged in a BGA (Ball Grid Array) package is transported, and an electrical characteristic of the test (test or simply "inspection") is carried out during the transfer.

The inspection apparatus 101 includes a transport unit 6 that can transport electronic components, an opening and closing unit 4 that can be opened and closed, a monitor 300 that serves as a display unit that can display an operation state of the transport unit 6, and a notification unit 5 that informs the opening and closing unit. 4 can open and close; and inspection unit 116, which performs inspection of electronic components.

Further, the electronic component transport apparatus 10 includes a transport unit 6 that can transport electronic components, an opening and closing unit 4 that can be opened and closed, and a monitor 300 that serves as a display unit that can display an operation state of the transport unit 6 and a notification unit 5 It informs whether the opening and closing unit 4 can be opened or closed.

In the following, for convenience of explanation, a case where an IC device is used as an electronic component will be described as a representative, and this will be referred to as "IC device 90". The IC device 90 is placed on the tray 200, that is, the mounting member.

The inspection device 101 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a device collection area A4 (hereinafter simply referred to as "recovery area"), and a tray removal area A5. Further, the IC device 90 sequentially passes through the respective regions from the tray supply region A1 to the tray removal region A5 in the direction of the arrow α ₉₀ , and inspects the inspection region A3 in the middle. As described above, the inspection apparatus 101 is configured to include an electronic component transport apparatus 10 (processing machine) that transports the IC device 90 in each of the areas A1 to A5, and an inspection unit 116 that performs inspection in the inspection area A3. Further, the inspection device 101 includes a signal lamp 400 and an operation panel 700.

Further, the inspection apparatus 101 is disposed on the side of the tray supply area A1 and the tray removal area A5, that is, the negative side in the Y direction in FIG. 11 is the front side, and the side of the inspection area A3 is disposed, that is, the Y direction in FIG. The side is used as the back side.

The tray supply area A1 is supplied to the supply unit of the tray 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 supplies a plurality of IC devices 90 on the tray 200 transported from the tray supply area A1 to the area of the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the tray 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2.

The tray transport mechanism 11A is a moving portion that can move the tray 200 together with the IC device 90 placed on the tray 200 toward the positive side in the Y direction, that is, the arrow α _11A in Fig. 11 . Thereby, the IC device 90 can be stably fed into the supply region A2. Further, the tray transport mechanism 11B is a moving portion that can move the empty tray 200 to the negative side in the Y direction, that is, the arrow α _11B in Fig. 11 . Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1.

In the supply area A2, a temperature adjustment unit (a temperature plate (English expression: a soak plate), a device transfer head 13, a tray transfer mechanism 15, and a concentration sensor 800) are provided. .

The temperature adjustment unit 112 is a "soaking plate" in which a plurality of IC devices 90 can be placed and the IC devices 90 are uniformly heated or cooled. With the temperature equalizing plate, the IC device 90 before inspection by the inspection portion 116 can be preheated or cooled, and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). In the configuration shown in FIG. 11, the temperature adjustment unit 112 is disposed and fixed in the Y direction. Further, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any of the temperature adjustment units 112.

The device transfer head 13 is supported to be movable in the X direction, the Y direction, and further the Z direction in the supply region A2. Thereby, the device transfer head 13 can carry the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 112, and the IC device 90 between the temperature adjustment unit 112 and the device supply unit 114 to be described later. Transfer. Further, in Fig. 11, the movement of the device transfer head 13 in the X direction is indicated by an arrow α _13X , and the movement of the device transfer head 13 in the Y direction is indicated by an arrow α _13Y .

Tray conveying means 15 to remove all based IC device 90 in an empty state of the tray 200, to the positive side of the supply area A2 within the X-direction, i.e. the direction of the arrow [alpha] ₁₅ of the transport mechanism. Then, after the transfer, the empty tray 200 is transported back to the tray supply area A1 from the supply area A2 by the tray transport mechanism 11B.

The concentration sensor 800 detects the concentration of nitrogen in the supply region A2. The concentration sensor 800 is electrically connected to the control unit 180, and the information of the concentration detected by the concentration sensor 800 is transmitted to the control unit 180. In addition, the concentration sensor can also be used to detect the concentration of oxygen.

The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, an inspection unit 116 and a device transfer head 117 are provided. Further, a device supply unit 114 that moves so as to straddle the supply area A2 and the inspection area A3, and a device collection unit 118 that moves so as to straddle the inspection area A3 and the collection area A4 are provided.

The device supply unit 114 is configured to mount the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 112, and the IC device 90 can be transported to the mounting portion near the inspection unit 116, and is referred to as a “supply shuttle” or Referred to as "supply shuttle".

Further, the device supply portion 114 is supported to reciprocate between the supply region A2 and the inspection region A3 in the X direction, that is, in the direction of the arrow α ₁₄ . In the configuration shown in FIG. 11, two device supply units 114 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 112 is transported to any of the device supply units 114. Further, the device supply unit 114 is configured to heat or cool the IC device 90 placed on the device supply unit 114, similarly to the temperature adjustment unit 112. Thereby, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 112 can be transported to the vicinity of the inspection unit 116 of the inspection area A3 while maintaining the temperature adjustment state.

The device transfer head 117 holds the IC device 90 that maintains the temperature adjustment state, and the IC device 90 is transported in the inspection region A3. The device transfer head 117 is supported to reciprocate in the Y direction and the Z direction in the inspection area A3, and is part of a mechanism called an "indicator arm". Thereby, the device transfer head 117 can transport the IC device 90 on the device supply unit 114 carried in from the supply region A2 to the inspection unit 116 and mount it. Further, in Fig. 11, the reciprocating movement of the device transfer head 117 in the Y direction is indicated by an arrow α _17Y . Further, although the device transfer head 117 is supported to reciprocate in the Y direction and the Z direction, the present invention is not limited thereto, and may be supported to reciprocate in the X direction.

Further, the device supply unit 117 is configured to heat or cool the held IC device 90, similarly to the temperature adjustment unit 112. Thereby, the temperature adjustment state of the IC device 90 can be continuously maintained from the device supply portion 114 to the inspection portion 116.

The inspection unit 116 is configured to mount the IC device 90, which is an electronic component, and to inspect and test (check) the mounting portion of the electrical characteristics of the IC device 90. The inspection unit 116 is provided with a plurality of probe pins electrically connected to the terminal portions of the IC device 90. Moreover, the inspection of the IC device 90 can be performed by electrically connecting or contacting the terminal portion of the IC device 90 with the probe pin. The inspection of the IC device 90 is performed based on the program stored in the memory unit 183 (see FIG. 12) of the control unit 180. Further, in the inspection unit 116, similarly to the temperature adjustment unit 112, the IC device 90 may be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

The device recovery unit 118 is configured to be placed on the IC device 90 after the inspection by the inspection unit 116, and the IC device 90 can be transported to the placement portion of the collection area A4, and is referred to as a "recycling shuttle" or simply It is a "recycling shuttle".

Further, the device collecting portion 118 is supported to reciprocate in the X direction, that is, in the direction of the arrow α ₁₈ between the inspection region A3 and the recovery region A4. Further, in the configuration shown in FIG. 11, the device recovery unit 118 is disposed in the Y direction in the same manner as the device supply unit 114, and the IC device 90 on the inspection unit 116 is transported to any device recovery unit 118. Set. This transfer is performed by the device transfer head 117.

The recovery area A4 is a region of a plurality of IC devices 90 after the end of the inspection. In the collection area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared.

The recovery tray 19 is configured to be placed on the mounting portion of the IC device 90 after inspection by the inspection unit 116, and is fixed so as not to move in the recovery area A4. As a result, even in a collection area A4 in which a plurality of movable portions such as the device transfer head 20 are disposed, the IC device 90 that has been inspected is stably placed on the recovery tray 19. In addition, in the configuration shown in FIG. 11, Three collection trays 19 are arranged in the X direction.

Further, three empty trays 200 are also arranged in the X direction. The empty tray 200 also serves as a mounting portion of the IC device 90 placed on the inspection unit 116. Then, the IC device 90 that has moved to the device collection unit 118 of the recovery area A4 is transported to any one of the collection tray 19 and the empty tray 200 and placed thereon. Thereby, the IC device 90 is classified and recovered according to each inspection result.

The device transfer head 20 is supported to be movable in the X direction, the Y direction, and further the Z direction in the recovery area A4. Thereby, the device transfer head 20 can transport the IC device 90 from the device recovery portion 118 to the recovery tray 19 or the empty tray 200. Further, in Fig. 11, the movement of the device transfer head 20 in the X direction is indicated by an arrow α _20X , and the movement of the device transfer head 13 in the Y direction is indicated by an arrow α _20Y .

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction, that is, the direction of the arrow α ₂₁ in the collection area A4. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, and any one of the three empty trays 200 can be obtained.

The tray removal area A5 is a discharge unit that collects and removes the tray 200 of the plurality of IC devices 90 in which the inspection state is completed. In the tray removal area A5, a plurality of trays 200 can be stacked.

Further, the tray transport mechanisms 22A and 22B that transport the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving portion that can reciprocate the tray 200 in the Y direction, that is, in the direction of the arrow α _22A . Thereby, the IC device 90 that has completed the inspection can be transferred from the recovery area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can be moved in the direction of the arrow α _22B by using the tray 200 in which the empty IC device 90 is collected. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the recovery area A4.

The inspection device 101 divides the tray supply area A1 and the supply area by the first partition 61 Between A2, the supply area A2 and the inspection area A3 are divided by the second partition 62, and the inspection area A3 and the collection area A4 are partitioned by the third partition 63, and the recovery area is divided by the fourth partition 64. A4 is between the tray removal area A5. Further, the supply region A2 and the recovery region A4 are also divided by the fifth separator 65.

The inspection device 101 is covered with a cover, and the cover includes, for example, a front cover 70, a side cover 71a, a side cover 72a, a rear cover 73a, and a top cover 74. The front cover 70, the side cover 71a, the side cover 72a, the rear cover 73a, and the top cover 74 are assembled to form the frame body 76, and the frame body 76 is formed with the opening and closing portion 4. Further, a conveying unit 6 is disposed inside the casing 76.

As shown in FIG. 11, the side door 71a is provided with the first door 711 and the second door 712. By opening the first door 711 or the second door 712, for example, maintenance or poor condition in the supply area A2 can be eliminated. Further, the first shutter 711 and the second shutter 712 are formed to open and close in the direction of the arrow α ₇₁ in FIGS. 11 and 14 .

Similarly, the first door 721 and the second door 722 are provided in the side cover 72a. By opening the first shutter 721 or the second shutter 722, for example, the work in the device recovery area A4 can be performed. Further, the first shutter 721 and the second shutter 722 are formed to open and close in the direction of the arrow α ₇₂ in Fig. 11 .

Further, the rear door 73a is also provided with a first door 731, a second door 732, and a third door 733. By opening the first door 731, for example, the work in the supply area A2 can be performed. By opening the third shutter 733, for example, the work in the device recovery area A4 can be performed.

Further, a fourth shutter 75 is provided in the inner partition 66 of the zone inspection area A3. Further, by opening the second door 732 and the fourth door 75, for example, the work in the inspection area A3 can be performed. Further, the first door 731 is opened and closed in the direction of the arrow α ₇₃₁ in FIG. 11 , the second door 732 is opened and closed in the direction of the arrow α ₇₃₂ in FIG. 11 , and the third door 733 is opened and closed in the direction of the arrow α ₇₃₃ in FIG. 11 . The fourth door 75 is opened and closed in the direction of the arrow α ₇₅ in Fig. 11 .

Moreover, in the state in which the shutters are closed, the airtightness or heat insulation of the respective regions can be ensured.

The first shutter 711, the second shutter 712, the first shutter 721, the second shutter 722, the first shutter 731, the second shutter 732, the third shutter 733, and the fourth shutter 75 are respectively It is constituted by an opening and closing portion 4 that can be opened and closed.

As shown in FIG. 12, the control unit 180 includes a drive control unit 181, an inspection control unit 182, and a storage unit 183.

The drive control unit 181 controls, for example, the tray transport mechanism 11A, the tray transport mechanism 11B, the temperature adjustment unit 112, the device transport head 13, the device supply unit 114, the tray transport mechanism 15, the inspection unit 116, and the device transport head 117 shown in FIG. The components recovery unit 118, the device transfer head 20, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B operate.

The inspection control unit 182 performs inspection of electrical characteristics of the IC device 90 disposed in the inspection unit 116 based on the program stored in the storage unit 183.

The memory unit 183 is a volatile memory such as a RAM (Random Access Memory), a nonvolatile memory such as a ROM (Read Only Memory), or an EPROM (Erasable and Programmable Read Only Memory). : Erasable programmable read-only memory, EEPROM (Electronically Erasable and Programmable Read Only Memory), flash memory, etc. rewritable (can be erased, heavy It is composed of non-volatile memory, etc., and various semiconductor memories (IC memory).

Further, the control unit 180 is electrically connected to the monitor 300 as a display unit. The monitor 300 is configured to be capable of displaying the operating state of the transport unit 6 or the other state of the inspection apparatus 101. As shown in FIG. 11, the transport unit 6 includes a tray transport mechanism 11B, a device transport head 13, a device supply unit 114, a tray transport mechanism 15, a device transport head 117, a device collection unit 118, and a device transport head. 20. Pallet transport mechanism 21, tray transport mechanism 22A, and tray transport mechanism 22B.

The operator can set or confirm the operating conditions of the inspection device 101 via the monitor 300. Wait. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed on the upper portion of the front side of the inspection apparatus 101. As shown in FIG. 10, on the right side (the positive side in the X direction) of the tray removal area A5, a mouse table 600 on which the mouse is used when the screen displayed on the monitor 300 is operated is provided.

Further, an operation panel 700 is disposed on the lower right side of FIG. 10 with respect to the monitor 300. Unlike the monitor 300, the operation panel 700 commands the inspection device 101 to the desired actor.

Further, the control unit 180 is electrically connected to the signal lamp 400. The signal lamp 400 can notify the operating state of the inspection device 101 or the like by a combination of colors of light emission. The signal lamp 400 is disposed on the upper portion of the inspection device 101. Further, in the inspection apparatus 101, a speaker 500 is built in, and the speaker 500 can also notify the operation state of the inspection apparatus 101 and the like.

Next, the first shutter 711 and the second shutter 712 on the side of the side cover 71a will be described in detail. Since the first shutter 711 and the second shutter 712 have the same configuration, the first shutter 711 will be representatively described below.

As shown in FIGS. 13 and 14, the first shutter 711 is a shutter that can be opened and closed with respect to the opening 713 formed in the side cover 71a. Thereby, the opening and closing portion 4 can cover one half of the opening portion 713 (the portion on the positive side in the Y direction in the drawing) in the closed state (see FIG. 13), and the opening portion 713 can be opened in the open state (refer to FIG. 14). .

The first shutter 711 is formed of a plate member having a substantially rectangular shape in plan view. Further, the size of the first shutter 711 depends on the size of the inspection device 101. For example, the longitudinal length (the length in the Z direction) and the lateral length (the length in the Y direction) are preferably 400 mm or more and 600 mm or less. More preferably, it is 450 mm or more and 550 mm or less.

Further, the first shutter 711 having a quadrangular shape is connected to the side cover 71a by the two rotation support portions 42 of the four sides (edge portions) 41a, 41b, 41c, and 41d extending in the vertical direction. The two rotation support portions 42 are arranged apart from each other in the Z direction. Further, each of the rotation support portions 42 is configured to support the first shutter 711 as a rotatable hinge. Thereby, the first shutter 711 can be supported as a rotation axis that can be parallel with the vertical direction, that is, the Z direction, and can be rotated in the direction of the arrow α ₇₁ in FIGS. 11 and 14 , and can be smoothly opened and closed.

Further, a handle 714 formed of a protrusion is provided in each of the first door 711 and the second door 712. Thereby, opening and closing of the first shutter 711 and the second shutter 712 can be easily performed.

As shown in FIGS. 15 and 16, a cylinder 740 is fixed to the vicinity of the upper portion of the opening portion 713 of the side cover 71a (for example, 0 mm or more and 50 mm or less). The cylinder 740 is a piston rod 740a free to enter and exit.

Further, when the piston rod 740a protrudes downward, the lock member 43 (see FIG. 15) provided on the front side of the first shutter 711 in the X direction can be engaged. Such a cylinder 740 is electrically connected to the control unit 180, and its operation is controlled by the control unit 180.

Further, in the present embodiment, the cylinder 740 not only maintains the closed state of the first shutter 711, but also maintains the closed state of the second shutter 712. In other words, the cylinder 740, the piston rod 740a, can be integrally engaged with the lock member 43 of the first door 711 and the lock member 43 of the second door 712. Therefore, the closed state of the first shutter 711 and the second shutter 712 can be uniformly maintained.

When the piston rod 740a is retracted upward, the engagement with the lock member 43 is released, and the first shutter 711 can be opened (see FIG. 16).

In this manner, the inspection device 101 has the cylinder 740 and the lock member 43 as the lock portions for maintaining the closed state of the first shutter 711 and the release of the closed state. Thereby, it is possible to prevent an operator of the inspection apparatus 101 from accidentally opening the first shutter 711, for example, during the conveyance of the IC device 90.

Further, on the front side of the first shutter 711, that is, the surface on the positive side in the X direction in FIG. 13, a notification portion 5 for notifying whether the opening and closing portion 4 can be opened or closed is provided. The notification unit 5 has a monitor 151 composed of a liquid crystal display (Liquid Crystal Display). Further, the monitor 151 is electrically connected to the control unit 180, and its operation is controlled by the control unit 180.

The notification unit 5 is provided in the first door 711, the first door 721, the first door 731, the second door 732, and the third door 733. However, the first door 711 is provided below. The notification unit 5 is representatively described.

As shown in FIG. 14 and FIG. 16, in the state in which the first shutter 711 and the second shutter 712 can be opened, the character "OK" is displayed on the monitor 151. On the other hand, as shown in FIG. 13, in the state in which the first shutter 711 and the second shutter 712 are restricted from being opened, the character "NO" is displayed on the monitor 151.

Further, in the monitor 151, it is preferable that the color of the character when "OK" is displayed is different from the color of the character when "NO" is displayed. Further, in the monitor 151, it is preferable that the color of the background of the character when "OK" is displayed is different from the background color of the character when "NO" is displayed. With such a configuration, the operator can easily recognize.

In the inspection apparatus 101, when the monitor 151 is provided in the opening and closing unit 4, that is, the first door 711, when the operator opens and closes the first door 711 and the second door 712, the operator can Visual recognition with higher accuracy.

Further, as shown in FIG. 13, the monitor 151 is preferably disposed at a height H of 600 mm or more and 2000 mm or less from the installation surface M of the inspection apparatus 101, and more preferably at a height H of 900 mm or more and 1700 mm or less. The location. Thereby, the monitor 151 can be easily observed regardless of the height of the operator, and the operator can visually recognize the monitor 151 with high accuracy.

Here, as described above, the inspection apparatus 101 performs a high temperature inspection or a low temperature inspection. In particular, in the case of performing the low temperature inspection, the concentration of the cooling gas is increased due to the sealing of the cooling gas (for example, nitrogen) in the inspection apparatus 101. Therefore, it is not appropriate for the operator to perform the opening operation of the opening and closing portion 4 in this state. Therefore, in the present invention, it is formed to prevent abnormality.

Hereinafter, the control operation of the control unit 180 will be described based on the flowchart shown in FIG. In the following, the inspection apparatus 101 is temporarily stopped during the low temperature inspection, and the first shutter 711 and the second shutter 712 are opened to perform maintenance in the supply area A2. Further, in the operation of the inspection apparatus 101, as shown in FIG. 13, the notification unit 5 displays a "not possible" character.

First, the operator performs an operation of the operation panel 700 to stop the operation of the inspection apparatus 101, and presses the release button (not shown) of the engagement between the cylinder 740 and the lock member 43.

In step S101, the concentration N of the cooling gas in the supply region A2 is detected by the concentration sensor 800. Then, in step S102, it is calculated that the concentration N becomes smaller than the time required before the specific value N _{0 of the} memory unit 183 is stored in advance, that is, the remaining information before the first shutter 711 and the second shutter 712 can be opened. time. This calculation was carried out as time passed and the concentration N was measured to decrease, and was carried out based on the obtained calibration curve (not shown).

Next, in step S103, the time calculated in step S102 is displayed on the monitor 151 (see Fig. 15). Further, in Fig. 15, on the monitor 151, a number of "15" is displayed, indicating that the remaining time is 15 seconds. The remaining time displayed on the monitor 151 is counted down as time elapses, and the displayed number gradually decreases.

In this manner, the monitor 151 displays (notifies) the remaining time as the information before the first shutter 711 and the second shutter 712 can be opened. Thereby, for example, the operator can grasp the time until the first shutter 711 and the second shutter 712 can be opened. Therefore, the operator can perform other operations before the operation of opening the first door 711 and the second door 712, and the work efficiency can be improved.

Then, in step S104, the concentration N of the cooling gas detected by the concentration sensor 800 and the specific value N ₀ memorized by the memory unit 183 are compared. Further, the specific value N ₀ represents the value of the concentration of the cooling gas and is as low as the degree of safety to the operator. When it is determined that the concentration N of the cooling gas is equal to or greater than the specific value N ₀ (S104; NO), the comparison is continued.

When it is determined in step S104 that the concentration N is lower than the specific value N ₀ (S104; YES), the engagement between the cylinder 740 and the lock member 43 is released in step S105 (see FIG. 16). Then, in step S106, it is notified that the first shutter 711 and the second shutter 712 can be opened.

In the present embodiment, as shown in FIG. 16, the text "可可" is displayed on the monitor 151. word. Thereby, the operator can recognize that the first door 711 and the second door 712 can be opened. Therefore, although the decrease in the concentration N of the cooling gas is insufficient, the operator can be prevented from setting the first shutter 711 and the second shutter 712 to the open state. Therefore, the safety of the operator can be ensured.

Further, when the operator wants to open the first door 711 and the second door 712 in the closed state in which the cylinder 740 and the lock member 43 are engaged, the cylinder 740 and the lock member 43 are also depending on the strength. Damaged. In the inspection apparatus 101, the engagement between the cylinder 740 and the lock member 43 is released, and the first shutter 711 and the second shutter 712 are opened, and the notification unit 5 notifies the intention. Thereby, the cylinder 740 and the lock member 43 can be prevented from being damaged.

Further, in step S106, not only the notification unit 5 notifies that the first shutter 711 and the second shutter 712 can be opened, but also displays the intention on the monitor 300. In other words, the monitor 300 displays whether or not the first shutter 711 and the second shutter 712 can be opened or closed. Thereby, even if the operator is located away from the first door 711 and the second door 712, the operator can recognize that the first door 711 and the second door 712 can be opened.

Further, in the inspection apparatus 101, since the notification unit 5 uses the light to notify the reporter, it is possible to recognize whether or not the opening and closing of the first shutter 711 and the second shutter 712 are possible with high accuracy.

Further, the first shutter 711 and the second shutter 712 are made of a material having light transparency. Therefore, the operator can recognize the operating state of the cylinder 740 and the locking member 43. In other words, it can be said that the notification unit 5 has a window portion that can recognize the operating state of the cylinder 740 and the lock member 43. Therefore, for example, even if the monitor 151 is omitted and the configuration of the notification unit 5 is simplified, the operator can grasp the opening and closing of the first shutter 711 and the second shutter 712 by visually recognizing the operating state of the cylinder 740 and the lock member 43. Is it possible.

As described above, according to the electronic component conveying device 10, the operator can recognize whether or not the opening and closing unit 4 can be opened and closed. Therefore, for example, although the inside of the electronic component conveying device 10 is in a state of being unsatisfactory to the operator, the operator can keep the opening and closing portion 4 in an open state. This ensures the safety of the operator. Moreover, the inspection apparatus includes the electronic component conveying device 10 and the inspection unit 116. Setting 101 also ensures the safety of the operator.

<Fourth embodiment>

18 and 19 are views showing an opening and closing unit and a notifying unit included in the electronic component inspection device (fourth embodiment) of the present invention.

In the following, the fourth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the third embodiment will be mainly described, and the same matters will be omitted. Description.

In the inspection apparatus 101a of the present embodiment, the notification unit 5a has a first display H1 that is provided as a "can" of the first shutter 711a of the window, and a second display that is "not available" to the first shutter 711a. H2 and an identification plate 152 connected to the piston rod 740a as an identification portion.

The first display H1 is provided in the vicinity of the corner of the first shutter 711a on the positive side and the negative side of the Y direction. The first display H1 indicates that the first shutter 711a and the second shutter 712 can be displayed in an open state.

The second display H2 is located on the negative side of the Z direction as an example of the different positions of the first display H1. The second display H2 displays a display that restricts the first shutter 711a and the second shutter 712 from being opened.

The first display H1 and the second display H2 are configured by, for example, printing by ink or an attached product. Further, the first display H1 and the second display H2 are preferably relatively light colors such as white.

The identification plate 152 is constituted by a plate member fixed to the end of the negative side of the Z-direction of the piston rod 740a. Also, the identification plate 152 has a relatively deep color such as black.

As shown in FIG. 18, the identification plate 152 is configured to be placed at a first position in which the first shutter 711 overlaps the first display H1 in a state where the piston rod 740a is retracted and can be set to the open state. On the other hand, as shown in FIG. 19, the identification plate 152 is configured to be in a state in which the piston rod 740a is protruded, that is, in a state in which the restriction is in an open state, and is located between the first shutter 711 and the second display. The second position where H2 overlaps is shown.

In a state where the first display H1 overlaps with the identification plate 152, the first display H1 can be made more noticeable than the second display H2 by the identification plate 152. Thereby, the operator can easily recognize that it can be set to the on state. On the other hand, in a state where the second display H2 overlaps with the identification plate 152, the second display H2 can be made more noticeable than the first display H1 by the identification plate 152. Thereby, the operator can easily recognize that the restriction is set to the on state.

In this manner, the identification plate 152 can move between the first position and the second position in conjunction with the actuation state of the piston rod 740a, and can recognize whether the first door 711 and the second door 712 can be opened and closed.

According to this embodiment, the monitor 151 of the third embodiment can be omitted. Therefore, the configuration of the notification unit 5a can be simplified, and the cost can be reduced.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above with reference to the embodiments shown in the drawings, the present invention is not limited thereto, and the respective components constituting the electronic component conveying device and the electronic component inspection device may be replaced with the same. Any member who performs the same function. Further, any constituent may be added.

Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be combined with any two or more of the configurations (characteristics) of the above embodiments.

Further, in the third and fourth embodiments described above, the notification unit notifies the opening and closing of the opening and closing unit, that is, the intention to open the opening and the intention to prohibit opening, but the present invention is not limited thereto. Therefore, it suffices to display at least one of the intention to open and the intention to prohibit opening.

Further, in the third and fourth embodiments described above, the case where the inspection apparatus is subjected to the low temperature inspection will be described, but the present invention can also be applied to the case where the high temperature inspection is performed. In this case, it is possible to provide a temperature sensor in the device supply region, and if the temperature detected by the temperature sensor becomes smaller than a specific value, the composition of the openable means is notified.

Further, in the third embodiment described above, the notification unit is notified by light, but the present invention is not limited thereto, and may be performed using at least one of light and sound. The informant can do it. In other words, the notification by the light can be omitted, and only the sound can be used for notification, and both the light and the sound can be used for notification.

In the third and fourth embodiments, the notification unit is provided in the opening and closing unit. However, the present invention is not limited thereto, and may be provided, for example, in the vicinity of the opening and closing unit or the position away from the opening and closing unit. .

Further, the display unit of the notification unit may be a display using an LED (Light Emitting Diode).

Further, in the third and fourth embodiments described above, the opening and closing portion is opened and closed by rotation, but the present invention is not limited thereto, and may be, for example, by the X direction, the Y direction, and the Z direction. Any one of them is slid and opened and closed.

Further, in the third embodiment, the notification unit displays the remaining time as one of the information before the opening and closing portion can be opened. However, the present invention is not limited thereto, and may be, for example, by displaying the percentage. And inform the remaining time.

Claims (13)

An electronic component conveying apparatus comprising: a dry air supply unit that supplies dry air; an ion generating unit that ionizes dry air; and an injection unit that ejects the ionized dry air; electronic components a arranging portion configurable and capable of cooling the electronic component; and a accommodating portion accommodating the electronic component arranging portion and including an opening through which the electronic component can pass; wherein the accommodating portion includes a plurality of the openings, and includes the opening and closing a plurality of openings; the injection portion includes at least one discharge port capable of ejecting the ionized dry air; and the discharge port is disposed to eject the ion between the electronic component placement portion and the shutter Dry air. The electronic component transporting apparatus of claim 1, wherein the accommodating section is included in the exterior of the electronic component transporting apparatus. The electronic component conveying apparatus according to claim 1 or 2, wherein the dry air from the dry air supply unit and the dry air from the ion generating unit are lower than the humidity on the outer side of the outer casing. The electronic component conveying apparatus according to claim 1 or 2, wherein a pressure inside the storage portion is higher than a pressure on an outer side of the storage portion. The electronic component transporting apparatus according to claim 1 or 2, wherein the electronic component disposing unit is a temperature equalizing plate capable of adjusting a temperature of the electronic component. The electronic component transporting apparatus according to claim 1 or 2, wherein the electronic component arranging unit is capable of transporting the shuttle of the electronic component. The electronic component transporting apparatus according to claim 1 or 2, wherein the discharge outlet is disposed at a height higher than an upper surface of the electronic component arranging portion. The electronic component conveying apparatus according to claim 1 or 2, wherein the installation portion of the ion generating portion is higher than the electronic component arrangement portion. The electronic component transport apparatus according to claim 1 or 2, wherein, in a plan view of the electronic component arrangement portion, at least one of the number of the ion generating portions is provided around the electronic component placement portion. The electronic component transporting apparatus according to claim 1 or 2, wherein the electronic component arrangement portion includes a concave portion for arranging the electronic components one by one; and the installation portion of the discharge port is above the concave portion. The electronic component transporting apparatus of claim 10, wherein the installation portion of the discharge port corresponds to each of the recesses. The electronic component conveying apparatus according to claim 1 or 2, wherein the plurality of discharge ports are provided in plural; and the plurality of discharge ports are disposed in a planar direction. An electronic component inspection apparatus, comprising: a dry air supply unit that supplies dry air; an ion generating unit that ionizes dry air; and an injection unit that ejects the ionized dry air; electronic components a arranging unit that can cool and cool the electronic component; a accommodating portion that accommodates the electronic component arranging portion and includes an opening through which the electronic component can pass; and an inspection portion that inspects the electronic component; and the accommodating portion includes a plurality of the openings, comprising: a shutter for opening and closing the plurality of openings; wherein the spraying portion includes at least one spray capable of spraying the ionized dry air The outlet is configured to eject the ionized dry air between the electronic component placement portion and the shutter.