JP2017032376A - Electronic component conveyance apparatus and electronic component inspection apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance apparatus and an electronic component inspection apparatus capable of preventing or suppressing accumulation of heat in the apparatus.SOLUTION: An inspection apparatus 1 includes: a cooling part capable of cooling an electronic component; a conveying part for conveying an electronic component; a supply area A2 for storing a temperature adjusting part 12 and the conveying part; and an opening 741 capable of discharging air in the supply area A2. The opening 741 is provided with an opening/closing door 744 that can be opened and closed. While the opening/closing door 744 is opened, air in the supply area A2 can be discharged, and while the opening/closing door 744 is closed, air-tightness in the supply area A2 can be maintained. The opening 741 is provided with a fan 742, which promotes discharge of air in the supply area A2.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects electrical characteristics of electronic components such as IC devices is known, and an electronic component conveyance apparatus for conveying an IC device is incorporated in the electronic component inspection apparatus. (For example, refer to Patent Document 1).
In addition, the inspection using the electronic component inspection apparatus may be performed at a normal temperature, or while the IC device is heated to a predetermined temperature or cooled to a predetermined temperature. In this case, a heating device or a cooling device is provided in the apparatus, and the IC device is inspected by heating or cooling the inside of the apparatus by these operations.

JP 2000-35458 A

  However, in general, an electronic component inspection apparatus having a cooling function has relatively high airtightness and heat insulation performance in the apparatus. For this reason, when the inspection is performed in a normal temperature atmosphere or a high temperature atmosphere with the electronic component inspection apparatus, heat may be accumulated in the apparatus, and the inside of the apparatus may become higher than the set temperature. Depending on the temperature, there is a risk that the components in the apparatus may be deformed by the influence of heat, which may hinder the transportation and inspection of electronic components.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

The electronic component transport device of the present invention includes a cooling unit capable of cooling the electronic component,
A transport unit for transporting the electronic component;
A first chamber that houses the cooling unit and the transport unit;
And a discharge portion capable of discharging the air in the first room.

  As a result, even if the temperature in the first room becomes relatively high, the high temperature air can be discharged to the outside. Therefore, it is possible to prevent or suppress heat from being accumulated in the first room. As a result, the influence of heat on the members in the first chamber can be reduced.

In the electronic component conveying apparatus according to the present invention, it is preferable that the discharge portion is a first opening provided in a first housing that defines the first chamber.
Thereby, the air in the first room can be discharged to the outside through the first opening.

  In the electronic component transport device of the present invention, it is preferable that the first opening is provided in an upper part of the first housing.

  Since hot air rises, according to the said structure, hot air can be discharged | emitted outside efficiently.

  In the electronic component transport device of the present invention, it is preferable that a door that can be opened and closed is provided in the first opening.

  Thereby, the 1st opening part can take the open state where the door opened, and the closed state where the door closed. Therefore, when the first room is at a relatively low temperature, the airtightness of the first room can be ensured by closing the opening.

  In the electronic component transport device of the present invention, it is preferable that the door opens toward the outside of the first chamber.

  In the case of a structure in which the door opens inward, it is necessary to place a member around the inside of the door, avoiding the track of the door, but when the door opens to the outside, a member is also placed inside the door. be able to.

In the electronic component transport apparatus according to the present invention, it is preferable that a fan is disposed in the first opening.
Thereby, it is possible to promote the discharge of the inner air through the first opening.

In the electronic component conveying apparatus of the present invention, the electronic component conveying apparatus has a temperature detection unit that detects the temperature in the first room,
It is preferable that the fan can be turned on / off based on the detection result of the temperature detection unit.

  Thereby, ON / OFF of a fan can be selected based on inner temperature.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the fan is in an ON state when a detection result of the temperature detection unit exceeds a preset temperature.

  Thereby, when the inside temperature becomes high enough to exceed the set temperature, the discharge of air can be automatically promoted.

In the electronic component transport device of the present invention, a resin component containing a resin material is disposed in the first chamber,
It is preferable that the temperature detection unit is disposed in the vicinity of the resin component.

  Although depending on the constituent material, the resin component has a relatively low melting point or softening point, and thus is easily deformed by an increase in temperature. If a temperature detector is installed in the vicinity of such a resin component and high temperature air is discharged based on the temperature in the vicinity of the resin component, it is possible to prevent other components from being deformed.

In the electronic component transport device of the present invention, it is preferable that the temperature detection unit is disposed in the vicinity of the electromagnetic valve including the resin component.
Thereby, it is possible to prevent the operation of the electromagnetic valve from being hindered.

In the electronic component conveying apparatus of the present invention, the electronic component conveying apparatus includes a first housing that defines the first chamber, and a second housing provided in the first housing,
Preferably, the second housing is provided with a second opening that can be opened and closed.

  Thereby, the air in a 2nd housing can be discharged | emitted outside, ie, a 1st housing. Therefore, the air in the second housing can be discharged to the outside through the first housing.

An electronic component inspection apparatus of the present invention includes a cooling unit capable of cooling an electronic component,
A transport unit for transporting the electronic component;
A first chamber that houses the cooling unit and the transport unit;
A discharge part capable of discharging air in the first room;
And an inspection unit for inspecting the electronic component.

  As a result, even if the temperature in the first room becomes relatively high, the high temperature air can be discharged to the outside. Therefore, it is possible to prevent or suppress heat from being accumulated in the first room. As a result, the influence of heat on the members in the first chamber can be reduced.

It is a schematic perspective view which shows the electronic component inspection apparatus of this invention. It is a schematic plan view of the inspection apparatus (electronic component inspection apparatus) shown in FIG. It is a block diagram which shows a part of test | inspection apparatus shown in FIG. FIG. 2 is an enlarged view (partial cross-sectional view) of the discharge unit shown in FIG. 1. It is an enlarged view (partial sectional view) of the first opening and the second opening shown in FIG. It is a flowchart for demonstrating the control action of the control part shown in FIG. It is a flowchart for demonstrating the control action of the control part shown in FIG. It is a block diagram for demonstrating the temperature adjustment part with which 2nd Embodiment of the electronic component inspection apparatus of this invention is provided.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic perspective view showing an electronic component inspection apparatus of the present invention. FIG. 2 is a schematic plan view of the inspection apparatus (electronic component inspection apparatus) shown in FIG. FIG. 3 is a block diagram showing a part of the inspection apparatus shown in FIG. FIG. 4 is an enlarged view (partially sectional view) of the discharge portion shown in FIG. FIG. 5 is an enlarged view (partially sectional view) of the first opening and the second opening shown in FIG. FIG. 6 is a flowchart for explaining the control operation of the control unit shown in FIG. FIG. 7 is a flowchart for explaining the control operation of the control unit shown in FIG.

  In the following, for convenience of explanation, as shown in the figure, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  4 and 5 is also referred to as “upper” or “upper”, and the lower side is also referred to as “lower” or “lower”.

  As shown in FIGS. 1 and 2, the inspection apparatus 1 includes an electronic component transport apparatus 10 that transports the IC device 90, an inspection unit 16, a display device (notification unit) 40, and an operation device 50. .

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes an electronic component conveyance apparatus that conveys the IC device 90 in each region, an inspection unit 16 that is provided in the middle of the conveyance path of the IC device 90, and inspects within the inspection area A3, and a display device. 40, an operating device 50, and a control unit 80. In the inspection apparatus 1, from the tray supply area A1 to the tray removal area A5, the area from the supply area A2 to which the IC device 90 is conveyed to the collection area A4 can also be referred to as “convey area (convey area)”.

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are arranged (the lower side in FIG. 2) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is arranged (FIG. 2 is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray (arrangement member) 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjusting unit (soak plate) 12, a device transport head (transport unit) 13, a tray transport mechanism (transport unit) 15, a temperature sensor (temperature detection unit) 84, and a static electricity removing unit 86 are provided. Is provided.

  The temperature adjustment unit 12 is a mounting unit on which a plurality of IC devices 90 are mounted, and can heat or cool the plurality of IC devices 90. Thereby, the IC device 90 can be adjusted to a temperature suitable for inspection. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply region A1 by the tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports an empty tray 200 in a state where all IC devices 90 have been removed in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The temperature sensor 84 detects the temperature in the supply area A2. The temperature sensor 84 is electrically connected to the control unit 80, and the detection result is transmitted to the control unit 80. The temperature sensor 84 is not particularly limited, and for example, a platinum sensor, a sensor having a thermocouple, or the like can be used.

  As shown in FIG. 2, the static electricity removal part 86 produces | generates positive / negative ion by corona discharge, for example. In addition, the static electricity removing unit 86 ejects the dehumidified dry air toward the temperature adjusting unit 12. The ions generated together with the dry air are jetted toward the temperature adjustment unit 12, and the static electricity of the IC device 90 on the temperature adjustment unit 12 can be removed.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transport head 17, a device recovery unit (recovery shuttle) 18, and a temperature sensor (temperature detection unit) 85 are provided. ing.

  The device supply unit 14 is a mounting unit on which the temperature-adjusted IC device 90 is mounted, and can transport the IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. The

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  In the present embodiment, the inspection unit 16 is provided with four pockets 161 to 164 each formed of a recess. These four pockets 161 to 164 are arranged in a matrix of 2 rows and 2 columns.

  The temperature sensor 85 detects the temperature in the inspection area A3. The temperature sensor 85 is electrically connected to the control unit 80, and the detection result is transmitted to the control unit 80. The temperature sensor 85 is not particularly limited, and for example, a platinum sensor, a sensor having a thermocouple, or the like can be used.

  The device transport head 17 is supported so as to be movable in the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16.

  In the inspection apparatus 1, the device transport head 17 has two arms 171 and 172. The IC device 90 is arranged on the inspection unit 16 by either the arm 171 or 172.

  The device collection unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed, and can transport the IC device 90 to the collection region A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 is placed, and is fixed in the collection area A4. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction. The empty trays 200 are also placement units on which the IC devices 90 are placed, and three empty trays 200 are arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200. Thus, in the inspection apparatus 1, the tray transport mechanism 21 is provided in the collection area A4, and the tray transport mechanism 15 is provided in the supply area A2. Thereby, for example, the throughput (the number of IC devices 90 to be transported per unit time) can be improved as compared to transporting an empty tray 200 in the X direction with a single transport mechanism.

  The configurations of the tray transport mechanisms 15 and 21 are not particularly limited. For example, the tray transport mechanisms 15 and 21 include a suction member that sucks the tray 200 and a support mechanism such as a ball screw that supports the suction member so as to be movable in the X direction. Is mentioned.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  In the inspection apparatus 1 as described above, in addition to the temperature adjustment unit 12 and the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 are also configured to be able to heat or cool the IC device 90. That is, the temperature adjusting unit 12, the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 are cooling units. By such a cooling unit, the temperature of the IC device 90 is maintained constant while being conveyed.

  In the following, a case will be described in which heating is performed in heating and cooling, and inspection is performed in a high temperature environment within a range of 40 ° C. to 80 ° C., for example.

  As shown in FIG. 1 and FIG. 2, the inspection apparatus 1 has a tray supply region A1 and a supply region A2 separated (partitioned) by a first partition wall 61, and the supply region A2 and the inspection region A3 are separated from each other. Is separated by a second partition wall 62, the inspection area A3 and the collection area A4 are separated by a third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by a fourth partition wall 64. Separated by. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each region. Furthermore, the outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, side covers 71 and 72, a rear cover 73, and a top plate 74. The front housing 70, the side covers 71 and 72, the rear cover 73 and the top plate 74 constitute the first housing 7.

  The supply area A2 is a first chamber R1 defined by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side cover 71, and the rear cover 73. A plurality of IC devices 90 in an uninspected state are carried into the first chamber R1 together with the tray 200.

  The inspection area A3 is a second chamber R2 defined by the second partition wall 62, the third partition wall 63, the inner partition wall 67, and the rear cover 73. In the second chamber R2, an inner partition 66 is disposed on the inner side of the rear cover 73. The second housing 6 is constituted by the second partition wall 62, the third partition wall 63, and the inner partition walls 66 and 67.

  The collection area A4 is a third chamber R3 defined by the third partition wall 63, the fourth partition wall 64, the fifth partition wall 65, the side cover 72, and the rear cover 73. A plurality of IC devices 90 that have been inspected are carried into the third chamber R3 from the second chamber R2.

  As shown in FIG. 2, the side cover 71 is provided with a first door (left first door) 711 and a second door (left second door) 712. By opening the first door 711 and the second door 712, for example, maintenance in the first chamber R1, release of jam in the IC device 90, and the like (hereinafter collectively referred to as “work”) can be performed. The first door 711 and the second door 712 are so-called “folding doors” that open and close in opposite directions. In addition, when working in the first chamber R1, movable parts such as the device transport head 13 in the first chamber R1 are stopped.

  Similarly, the side cover 72 is provided with a first door (right first door) 721 and a second door (right second door) 722. By opening the first door 721 and the second door 722, for example, work in the third chamber R3 can be performed. The first door 721 and the second door 722 are also so-called “folding doors” that open and close in opposite directions. Further, during the work in the third chamber R3, the movable part such as the device transport head 20 in the third chamber R3 stops.

  The rear cover 73 is also provided with a first door (back side first door) 731, a second door (back side second door) 732, and a third door (back side third door) 733. By opening the first door 731, for example, work in the first chamber R <b> 1 can be performed. By opening the third door 733, for example, work in the third chamber R3 can be performed. Further, the inner partition 66 is provided with a fourth door 75. Then, by opening the second door 732 and the fourth door 75, for example, work in the second chamber R2 can be performed. The first door 731, the second door 732, and the fourth door 75 open and close in the same direction, and the third door 733 opens and closes in the opposite direction to these doors. Further, during the work in the second chamber R2, the movable parts such as the device transport head 17 in the second chamber R2 are stopped.

  And by closing each door, the airtightness and heat insulation in each room | chamber corresponding can be ensured.

  The display device 40 is configured by a monitor that displays driving of each unit, inspection results, and the like. The monitor can be composed of, for example, a liquid crystal display panel that emits light or a display panel such as an organic EL. An operator can set or confirm various processes, conditions, and the like of the inspection apparatus 1 via the display device 40. As shown in FIG. 1, the display device 40 is disposed above the inspection device 1 in the drawing.

  The operation device 50 is an input device such as a mouse 51 and outputs an operation signal corresponding to the operation by the worker to the control unit 80. Therefore, the operator can use the operation device 50 to instruct the control unit 80 for various processes. As shown in FIG. 1, the mouse 51 (operation device 50) is arranged at a position close to the display device 40 on the right side of the inspection device 1 in the drawing. In the present embodiment, the mouse 51 is used as the operation device 50. However, the operation device 50 is not limited to this, and may be an input device such as a keyboard, a trackball, or a touch panel.

  As shown in FIG. 3, the control unit 80 includes a drive control unit 81, an inspection control unit 82, and a storage unit 83.

  The drive control unit 81 includes a tray transport mechanism 11A, 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, a device transport head 17, and a device. The drive of each part of the collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and tray conveyance mechanism 22A, 22B is controlled.

  The inspection control unit 82 inspects the electrical characteristics of the IC device 90 arranged in the inspection unit 16 based on the program stored in the storage unit 83.

  The storage unit 83 is a semiconductor memory (IC memory) such as a volatile memory such as a RAM, a nonvolatile memory such as a ROM, a rewritable (erasable and rewritable) nonvolatile memory such as an EPROM, an EEPROM, or a flash memory. Etc.

  As shown in FIGS. 1, 4 and 5, the top plate 74 is provided with an opening (first opening) 741 as a discharge part for discharging the air 300 in the supply area A2. The opening 741 has a rectangular shape when viewed from the Z-axis direction, and includes a through hole that penetrates the top plate 74 in the thickness direction.

  A fan 742 is provided on the top surface 740 of the top plate 74 at a position overlapping the opening 741. The fan 742 has a rotary blade 743. By rotating the rotary blade 743, the air 300 on the lower side of the fan 742 can be blown to the upper side of the fan 742. Such a fan 742 is electrically connected to the control unit 80, and ON / OFF is controlled.

  As shown in FIGS. 1, 4, and 5, an opening / closing door 744 is provided on the upper surface 740 of the top plate 74 so as to cover the opening 741 and the fan 742. The opening / closing door 744 is configured by a rectangular plate material and a side wall erected from the edge of the plate material. The open / close door 744 is rotatably fixed to the top plate 74 via a rotation support portion 745.

  Further, when the opening / closing door 744 is configured to open toward the inside, that is, downward, the arrangement of the members (for example, the temperature sensor 84) in the supply area A2 avoids the path of the opening / closing door 744. There is a need. On the other hand, in the inspection apparatus 1, since the opening / closing door 744 is configured to open outward, the member can be disposed in the supply region A2 without considering the path of the opening / closing door 744.

  Such an open / close door 744 can take a closed state indicated by a two-dot chain line in FIG. 4 and an open state indicated by a solid line in FIGS. 4 and 5. In the closed state, the opening 741 is airtightly closed, and the airtightness of the supply region A2 can be ensured. On the other hand, in the open state, the opening 741 is in an open state, and the supply region A2 and the outer region A6 of the inspection apparatus 1 are in communication with each other.

  In the present embodiment, the opening / closing door 744 is manually opened and closed. In order to easily perform this opening / closing operation, the opening / closing door 744 may be formed with a recess for catching a handle or a finger. In addition, a configuration may be adopted in which the opening / closing door 744 is automatically opened and closed by providing a driving unit. In this case, the drive source is electrically connected to the control unit 80 and its operation is controlled.

  Here, in the inspection apparatus 1, the air 300 around the temperature adjustment unit 12, which is the main heat source, particularly in the supply region A <b> 2 is warmed and becomes high temperature. This high-temperature air 300 is trapped in the supply region A2 in an airtight state during the inspection. For this reason, the member in supply area | region A2 may become high temperature excessively, and may deform | transform according to the influence of a heat | fever depending on a grade.

  In the inspection apparatus 1, when the temperature in the supply area A2 detected by the temperature sensor 84 exceeds a predetermined temperature, the open / close door 744 is opened. Moreover, the inspection apparatus 1 is configured such that the fan 742 operates when the inspection apparatus 1 is in the open state. As a result, as shown in FIG. 4, the air 300 trapped in the supply area A <b> 2 is promoted to be discharged to the outer area A <b> 6 through the opening 741 by the operation of the fan 742. Therefore, it is possible to prevent or suppress the hot air 300 from being trapped in the supply region A2. As a result, it is possible to prevent or reduce the deformation of the members in the supply region A2 due to the influence of heat.

  Moreover, the air 300 which became high temperature rises. In the inspection apparatus 1, an opening 741 and a fan 742 are provided on the top plate 74, that is, the upper portion of the first housing 7. Thereby, the high-temperature air 300 rises and gathers in the vicinity of the opening 741 and the fan 742, and the high-temperature air 300 can be efficiently discharged from the opening 741.

  Furthermore, as described above, the opening 741 and the fan 742 overlap with the temperature adjustment unit 12 when viewed from the Z-axis direction. That is, the opening 741 and the fan 742 are disposed immediately above the temperature adjustment unit 12. Thereby, the high temperature air 300 can be efficiently discharged from the opening 741.

  The temperature sensor 84 is installed on a rear cover 73 made of a resin material. By installing the temperature sensor 84 on the rear cover 73 that is relatively easily deformed by the influence of heat, air can be discharged before the rear cover 73 reaches a predetermined temperature. Therefore, the rear cover 73 can be more effectively prevented from being deformed by heat.

  Further, as described above, in the supply region A2, the static electricity removing unit 86 sprays dry air. Thereby, even if air is discharged from the opening 741 by the operation of the fan 742, the static electricity removing unit 86 can compensate for the air in the supply region A2. Therefore, in the supply region A2, air can make a flow from the static electricity removing unit 86 toward the opening 741. As a result, the air in supply area | region A2 can be discharged | emitted efficiently.

  Thus, in the inspection apparatus 1, the inside of the supply area A2 can be prevented from becoming high temperature. Furthermore, in the inspection apparatus 1, the inspection area A3 also tends to become high temperature like the supply area A2, but the inspection area A3 can be prevented from becoming excessively high temperature.

  As shown in FIGS. 2 and 5, the second partition wall 62 that partitions the supply area A2 and the inspection area A3 is provided with an opening (second opening) 621 for discharging the air 400 in the inspection area A3. Yes. The opening 621 has a rectangular shape when viewed from the X-axis direction, and is configured by a through-hole penetrating in the thickness direction of the second partition wall 62.

  A fan 622 is provided on the left side (outside) surface 620 of the second partition wall 62 in FIG. The fan 622 has a rotary blade 623. By rotating the rotary blade 623, the air 400 on the lower side of the fan 622 can be blown to the upper side of the fan 622. Such a fan 622 is electrically connected to the controller 80 and its operation is controlled.

  As shown in FIG. 5, the opening 621 is provided with a shutter (second door) 624 that can be opened and closed. The shutter 624 may be configured to open and close in the Y-axis direction, or may be configured to open and close in the Z-axis direction.

  In the closed state in which the shutter 624 is closed, the opening 621 is airtightly closed, and the airtightness of the inspection region A3 can be ensured. In the open state in which the shutter 624 is opened, the opening 621 is in an open state, and the supply area A2 and the inspection area A3 are in communication with each other.

  In the inspection apparatus 1, depending on the heating temperature of the inspection unit 16, the air 400 in the inspection area A <b> 3 is warmed to a high temperature. The inspection apparatus 1 is configured such that the shutter 624 opens and the fan 622 operates based on the temperature detected by the temperature sensor 85. As a result, as shown in FIG. 5, the air 400 trapped in the inspection area A <b> 3 is discharged to the supply area A <b> 2 through the opening 621 by the operation of the fan 622. Therefore, it is possible to prevent or suppress the hot air 400 from being trapped in the inspection area A3. As a result, it is possible to prevent the members in the inspection region A3 from being deformed by the influence of heat.

  As shown in FIG. 5, the temperature of the supply area A2 is increased by the air 400 exhausted from the inspection area A3 to the supply area A2. If the temperature of the supply area A2 becomes higher than a predetermined temperature, the supply area A2 is described above. As described above, the air 300 is discharged to the outside region A6 through the opening 741.

  Thus, according to the inspection apparatus 1, even if the inside of the supply area A2 and the inspection area A3 becomes high temperature, the high-temperature air can be discharged to the outer area A6.

  Next, the control operation of the control unit 80 will be described based on the flowcharts shown in FIGS. Hereinafter, a control operation for discharging the air 300 in the supply area A2 and a control operation for discharging the air 400 in the inspection area A3 will be described.

First, the air discharge control operation in the supply area A2 shown in FIG. 6 will be described.
In step S101, the temperature sensor 84 detects the temperature T1 in the supply area A2.

  Next, in step S102, it is determined whether or not the detected temperature T1 is equal to or lower than a set temperature T0. The set temperature T0 is a value stored in advance in the storage unit 83.

  If it is determined in step S102 that the set temperature T0 ≦ temperature T1, it is notified that the temperature in the supply area A2 is excessively high (step S103).

  This notification displays on the display device 40 shown in FIG. 1 that the temperature in the supply area A2 is excessively high. Thereby, the worker opens the open / close door 744 (see FIGS. 4 and 5).

  In the inspection apparatus 1, the fan 742 is activated together with this notification. Thereby, when the worker opens the open / close door 744, the air in the supply area A2 is efficiently discharged.

  In step S104, it is determined whether the temperature T1 has become lower than the set temperature T0. When it is determined that the temperature T1 has become lower than the set temperature T0, in step S105, a notification that air is sufficiently discharged is given. This notification is performed in the same manner as in step S103. As a result, the operator closes the open / close door 744 (see FIG. 4).

  Next, it is determined whether or not the inspection of the IC device 90 is completed (step S106). If it is determined in step S106 that the inspection has not been completed, the process returns to step S101 and the following steps are sequentially repeated. If it is determined in step S102 that the detected temperature T1 is lower than the set temperature T0, the process returns to step S101 again.

  As described above, by repeating Step S101 to Step S106, when the temperature of the supply region A2 becomes excessively high, the high-temperature air in the supply region A2 can be discharged. Therefore, it is possible to prevent the temperature in the supply region A2 from becoming excessively high.

Next, the air discharge control operation in the inspection area A3 shown in FIG. 7 will be described.
First, in step S201, the temperature sensor 85 detects the temperature T2 in the inspection area A3.

  Next, in step S202, it is determined whether or not the detected temperature T2 is equal to or lower than the set temperature T0. The set temperature T0 is a value stored in advance in the storage unit 83.

  If it is determined in step S202 that the set temperature T0 ≦ temperature T2, the temperature in the inspection area A3 is considered to be excessively high, and the discharge of air in the inspection area A3 is started (step S203). .

  In step S203, the shutter is actuated to open, and the fan 622 is actuated. Thereby, the air which became high temperature in test | inspection area | region A3 can be efficiently discharged | emitted to supply area | region A2.

  In step S204, it is determined whether or not the temperature T2 has become lower than the set temperature T0. If it is determined that the temperature T2 has become lower than the set temperature, the fan 622 is stopped and the shutter is closed in step S205. Thereby, the discharge of air in the inspection area A3 can be stopped.

  Next, it is determined whether or not the inspection of the IC device 90 is completed (step S206). If it is determined in step S206 that the inspection has not been completed, the process returns to step S201, and the following steps are sequentially repeated. If it is determined in step S202 that the detected temperature T2 is lower than the set temperature T0, the process returns to step S201 again.

  As described above, by repeating Step S201 to Step S206, when the temperature of the inspection region A3 becomes excessively high, the high-temperature air in the inspection region A3 can be discharged. Therefore, it is possible to prevent the temperature in the inspection region A3 from becoming excessively high.

  In the above description, the case where the IC device 90 is inspected while the inside of the apparatus is heated has been described. For example, even when the inspection is performed at room temperature, each part of the inspection apparatus 1 is driven to drive the apparatus. The temperature inside increases. Even in such a case, the present invention can achieve the above-described effects.

Second Embodiment
FIG. 8 is a block diagram for explaining a temperature adjustment unit provided in the second embodiment of the electronic component inspection apparatus of the present invention.

  Hereinafter, the second embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to this drawing. However, the description will focus on differences from the above-described embodiment, and the same matters will be described. Is omitted.

  The present embodiment has the same configuration as that of the first embodiment described above except that the arrangement of the temperature sensor is different.

  As illustrated in FIG. 8, in the inspection apparatus 1 </ b> A, the temperature adjustment unit 12 includes a shutter 121, an air cylinder 122, a supply line 123, and an electromagnetic valve 124.

  The shutter 121 is provided in an opening that houses the IC device 90 and is opened and closed by the air cylinder 122. The air cylinder is connected to a supply line 123 and is operated when a working fluid is supplied from the supply line 123.

  An electromagnetic valve 124 is provided in the middle of the supply line 123. This electromagnetic valve 124 is used to open and close the supply line 123. Thereby, the state which supplies a working fluid to the air cylinder 122, and the state which stops supply can be switched. The electromagnetic valve 124 is electrically connected to the control unit 80 and its operation is controlled.

  Here, a part of the electromagnetic valve 124 is made of, for example, a resin material such as polycarbonate or acrylic resin. The resin material has a relatively low melting point or softening point as compared with, for example, a metal material, although depending on the type.

  As shown in FIG. 8, in the inspection apparatus 1A, a temperature sensor 84 is disposed in the vicinity of the electromagnetic valve 124 containing a resin material. Thereby, the air in supply area | region A2 can be discharged | emitted based on the temperature around the electromagnetic valve 124 which is easy to deform | transform by the influence of heat. That is, when the temperature around the electromagnetic valve 124 rises and exceeds the set temperature, the temperature in the supply region A2 can be immediately lowered. Therefore, deformation of the electromagnetic valve 124 due to heat can be prevented, and deformation due to heat of a member having a higher melting point or softening point than the electromagnetic valve 124 can be further effectively prevented. As a result, it is possible to prevent the operation of the electromagnetic valve 124 from being hindered.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus, 1A ... Inspection apparatus, 10 ... Electronic component conveyance apparatus, 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 121 ... Shutter, 122 ... Air Cylinder, 123 ... Supply line, 124 ... Electromagnetic valve, 13 ... Device transfer head, 14 ... Device supply unit, 15 ... Tray transfer mechanism, 16 ... Inspection unit, 161 ... Pocket, 162 ... Pocket 163 ... Pocket, 164 ... Pocket, 17 ... Device transfer head, 171 ... Arm, 172 ... Arm, 18 ... Device collection unit, 19 ... Tray for collection, 20 ... Device transfer head, 21 ... Tray transfer mechanism, 22A ... Tray transfer mechanism, 22B ... Tray transfer mechanism, 40 ... Display device, 50 ... Operating device, 51 ... Mouse, 6 ... Second housing 61 61 First partition 62 62 Second partition 620 Surface 621 Opening 622 Fan 623 Rotating blade 624 Shutter 63 Third Partition wall 64... Fourth partition wall 65. Fifth partition wall 66. Inner partition wall 67 67 Inner partition wall 7... First housing 70 .. Front cover 71. First door, 712 ... Second door, 72 ... Side cover, 721 ... First door, 722 ... Second door, 73 ... Rear cover, 731 ... First door, 732 ... Second door, 733... Third door 74 74 Top plate 740 Upper surface 741 Opening 742 Fan 743 Rotary blade 744 Opening and closing door 745 Turning support 75 …… 4th door, 80 …… Control unit, 81 …… Drive control unit, 82 …… Inspection control , 83... Storage unit, 84... Temperature sensor, 85... Temperature sensor, 86 .. static elimination unit, 90... IC device, 200 .. tray, 300. Tray supply area, A2 ... device supply area (supply area), A3 ... inspection area, A4 ... device recovery area (collection area), A5 ... tray removal area, A6 ... outer area, R1 ... first Chamber, R2 ... Second chamber, R3 ... Third chamber, T0 ... Set temperature, T1 ... Temperature, T2 ... Temperature, S101 ... Step, S102 ... Step, S103 ... Step, S104 ... Step, S105 ... Step, S106 ... Step, S201 ... Step, S202 ... Step, S203 ... Step, S204 ... Step, S205 ... Step, S206 ... Tep

Claims (12)

A cooling unit capable of cooling electronic components;
A transport unit for transporting the electronic component;
A first chamber that houses the cooling unit and the transport unit;
An electronic component transport apparatus comprising: a discharge unit capable of discharging the air in the first room.   The electronic component transport apparatus according to claim 1, wherein the discharge unit is a first opening provided in a first housing that defines the first chamber.   The electronic component transport apparatus according to claim 2, wherein the first opening is provided in an upper portion of the first housing.   The electronic component conveying apparatus according to claim 2, wherein the first opening is provided with an openable / closable door.   The electronic component transport apparatus according to claim 4, wherein the door opens toward the outside of the first chamber.   The electronic component transport apparatus according to claim 2, wherein a fan is disposed in the first opening. A temperature detection unit for detecting the temperature in the first room;
The electronic component conveying apparatus according to claim 6, wherein the fan can be turned on / off based on a detection result of the temperature detection unit.   The electronic component conveying apparatus according to claim 7, wherein the fan is turned on when a detection result of the temperature detection unit exceeds a preset temperature. A resin component containing a resin material is disposed in the first chamber,
The electronic part conveyance device according to claim 7 or 8, wherein the temperature detection unit is arranged in the vicinity of the resin part.   The electronic part conveyance device according to claim 9, wherein the temperature detection unit is disposed in the vicinity of an electromagnetic valve including the resin part. A first housing that defines the first chamber; and a second housing provided in the first housing;
The electronic component conveying apparatus according to claim 1, wherein the second housing is provided with a second opening that can be opened and closed. A cooling unit capable of cooling electronic components;
A transport unit for transporting the electronic component;
A first chamber that houses the cooling unit and the transport unit;
A discharge part capable of discharging air in the first room;
An electronic component inspection apparatus comprising: an inspection unit that inspects the electronic component.

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