JP2018071971A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device capable of performing static elimination from electronic components on a mounting member even when a plurality of mounting members on which the electronic components are placed are stacked in a mounting region.SOLUTION: An electronic component conveyance device includes: a mounting region capable of mounting first and second mounting members on which electronic components are placed; a grasping portion for grasping the electronic components which are placed on the first and second mounting members and conveyed from the mounting region; a grasping region for grasping the electronic components by the grasping portion; and a mounting region static eliminating portion capable of reducing electrical charges of the electronic components mounted on the first and second mounting members in the mounting region. The second mounting member is disposed vertically above the first mounting member.SELECTED DRAWING: Figure 6

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, a production line for manufacturing an electronic circuit by mounting an electronic component such as an IC chip on an electronic circuit board is known (see, for example, Patent Document 1). The production line described in Patent Document 1 includes a plurality of mounters for mounting the electronic component on the electronic circuit board for each type of electronic component, and a reflow furnace for fixing the electronic component mounted on the electronic circuit board. Are arranged in order. In addition, an ionizer is disposed between the mounters and between the mounter and the reflow furnace to spray ions on the electronic circuit to be manufactured and prevent the electronic circuit from being charged.

JP 2002-232189 A

  However, in the production line described in Patent Document 1, static elimination is performed by an ionizer during the production of the electronic circuit, but the static elimination cannot be performed before the electronic circuit board is carried into the production line. The electronic circuit board before being carried into the production line may also be charged, and when an electronic component comes into contact with the electronic circuit board in this state, a large current exceeding the allowable value is suddenly applied to the electronic component. The electronic components may be damaged.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

The electronic component transport apparatus according to the present invention includes a mounting region in which the first mounting member and the second mounting member on which the electronic component is mounted can be mounted;
A gripping part for gripping the electronic component placed on the first placement member and the second placement member conveyed from the mounting region;
A gripping region in which the electronic component is gripped by the gripping portion;
A mounting region static elimination unit capable of reducing the charge of the electronic component mounted on the first mounting member and the second mounting member in the mounting region,
The second mounting member is arranged vertically above the first mounting member.

  In the mounting area, the electronic component placed on the placement member may be charged. In this case, the electronic component may be damaged due to electrostatic breakdown during transportation. In view of this, the mounting area neutralization unit can perform static elimination capable of reducing the electric charge of the electronic component placed on the placement member in the mounting area. Thereby, the electronic component is in a state in which the charged state is eliminated as much as possible, and therefore, damage due to electrostatic breakdown is reduced.

  In the electronic component transport apparatus according to the aspect of the invention, it is preferable that the second mounting member is transported from the mounting region to the gripping region after the first mounting member is transported from the mounting region to the gripping region. .

  As a result, it is possible to perform static elimination for each electronic component in order to reduce the charge.

In the electronic component transport device according to the aspect of the invention, it is preferable that the mounting area neutralization unit can eject a fluid capable of reducing the electric charge of the electronic component.
Thereby, the thing of a comparatively simple structure can be used as a mounting area static elimination part.

  In the electronic component transport apparatus according to the present invention, it is preferable that the mounting area static elimination unit reduces the electric charge with respect to the electronic component placed on the first placement member.

  Thereby, when the electronic component placed on the first placement member is charged, the charged state of the electronic component can be eliminated as much as possible.

  In the electronic component transport device of the present invention, it is preferable that the first mounting member is separated from the second mounting member when the charge is reduced.

  Accordingly, it is possible to prevent the charge removal to the electronic component on the first placement member by the mounting region charge removal unit from being blocked by the second placement member or the like above the first placement member.

  In the electronic component transport apparatus according to the present invention, it is preferable that the mounting area static elimination unit emits air containing ions between the first mounting member and the second mounting member.

  Thereby, even in a state where a plurality of mounting members are stacked, for example, the first mounting member at the lowest position can be separated, and coupled with a suitable installation height of the mounting region neutralizing unit, the mounting region neutralizing unit It is possible to prevent the neutralizing action on the electronic component on the first mounting member from being blocked by the second mounting member or the like above the first mounting member.

  In the electronic component transport apparatus according to the present invention, it is preferable that a plurality of the mounting area static elimination units are provided so as to surround the first mounting member.

  As a result, the electronic component is uniformly discharged by the plurality of mounting area charge removal units regardless of the placement location on the first placement member.

In the electronic component transport device of the present invention, the first placement member has an opening in which the position where the electronic component is disposed is opened.
It is preferable that the mounting area static elimination unit is installed facing the opening.

  Thereby, the static elimination effect by the mounting area static elimination part can be exerted on the electronic component through the opening, and thus the static elimination can be performed on the electronic component placed on the first placement member.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the first mounting member is transported to the gripping region before the second mounting member.

  As a result, the electronic component placed on the first placement member is neutralized until just before being transported, so that charging is reduced as much as possible. Thereafter, when the charge can be further removed in the gripping region or the like, the charge on the electronic component can be sufficiently removed. Thereby, damage to the electronic component due to electrostatic breakdown can be prevented.

  In the electronic component transport device of the present invention, it is preferable that the mounting area static elimination unit is installed at least between the mounting area and the gripping area.

  When a plurality of electronic components are mounted on the mounting member, the electronic component located on the gripping region side (hereinafter referred to as “electronic component A”) takes a longer time to be located in the mounting region than other electronic components. Also short. And since the mounting area static elimination part is installed at least between the mounting area and the gripping area, the electronic component A can be preferentially neutralized. Thereby, uniform charge removal for all the electronic components on the mounting member is possible.

  In the electronic component transport apparatus according to the present invention, it is preferable that the mounting area static elimination unit is an ionizer that emits air containing ions.

  As a result, the mounting area static elimination unit can be of a simple configuration. For example, the mounting area static elimination unit can be easily incorporated into the mounting area, or the mounting area static elimination unit can be easily controlled. I can do it.

  In the electronic component transport apparatus according to the present invention, it is preferable that the electronic component transport apparatus includes a gripping area static elimination unit that is provided in the gripping area and performs static elimination so as to reduce the electric charge of the electronic component gripped by the gripping part.

  As a result, when the electronic component is charged in the gripping region, it is possible to perform static elimination on the electronic component, thereby preventing damage to the electronic component due to electrostatic breakdown.

  In the electronic component transport apparatus according to the present invention, it is preferable that the gripping area static elimination unit is an ionizer that emits air containing ions.

  As a result, the gripping area static elimination unit can be of a simple configuration. For example, the gripping area static elimination unit can be easily incorporated into the gripping area, or the gripping area static elimination unit can be easily controlled. I can do it.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the gripping area neutralizing unit emits the air from vertically downward to vertically upward.

  Thus, when the air contains ions, the electronic component is sprayed from below in the middle of conveyance, and thus is neutralized.

The electronic component inspection apparatus according to the present invention includes a mounting region on which the first mounting member and the second mounting member on which the electronic component is mounted can be mounted,
A gripping part for gripping the electronic component placed on the first placement member and the second placement member conveyed from the mounting region;
A gripping region in which the electronic component is gripped by the gripping portion;
A mounting region static elimination unit capable of reducing the charge of the electronic component mounted on the first mounting member and the second mounting member in the mounting region;
An inspection unit for inspecting the electronic component,
The second mounting member is arranged vertically above the first mounting member.

  In the mounting area, the electronic component placed on the placement member may be charged. In this case, the electronic component may be damaged due to electrostatic breakdown during transportation depending on various conditions such as the magnitude of the charge amount. In view of this, the mounting area neutralization unit can perform static elimination capable of reducing the electric charge of the electronic component placed on the placement member in the mounting area. Thereby, the electronic component is in a state in which the charged state is eliminated as much as possible, and thus damage due to electrostatic breakdown is prevented.

  Further, the electronic component can be transported to the inspection unit, and thus the inspection for the electronic component can be performed by the inspection unit. Moreover, the electronic component after inspection can be conveyed from the inspection unit.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a plan view showing an arrangement state of ionizers in the electronic component inspection apparatus shown in FIG. FIG. 4 is a schematic partial vertical sectional view sequentially illustrating the operating states of the ionizers arranged in the tray supply region in FIG. FIG. 5 is a schematic partial vertical sectional view sequentially illustrating the operating states of the ionizers disposed in the tray supply region in FIG. 3. FIG. 6 is a schematic partial vertical sectional view sequentially showing the operating states of the ionizers arranged in the tray supply region in FIG. FIG. 7 is a schematic partial vertical cross-sectional view sequentially showing the operating state of the ionizer disposed in the tray supply region in FIG. FIG. 8 is a plan view showing an arrangement state of ionizers in the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 9 is a schematic partial vertical sectional view showing an operating state of the ionizer disposed in the tray supply region in FIG. FIG. 10 is a plan view showing an arrangement state of ionizers in the electronic component inspection apparatus (third embodiment) of the present invention. FIG. 11 is a schematic partial vertical sectional view showing an operating state of the ionizer disposed on the lower side in the device supply region in FIG. 10.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
Hereinafter, with reference to FIGS. 1-7, 1st Embodiment of the electronic component conveying apparatus and electronic component inspection apparatus of this invention is described. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as an “X direction (first direction)”, a direction parallel to the Y axis is also referred to as a “Y direction (second direction)”, and a direction parallel to the Z axis is referred to as “ Also referred to as “Z direction (third direction)”. The direction in which the arrow in each direction is directed is called “positive”, and the opposite direction is called “negative”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered. In addition, the upper side in FIGS. 1 and 4 to 7 (the same applies to FIGS. 9 and 11) may be referred to as “upper” or “upper”, and the lower side may be referred to as “lower” or “lower”.

  The electronic component conveying apparatus 10 of the present invention conveys a tray supply area A1 (mounting area) in which a plurality of trays 200, which are mounting members for placing electronic components, can be stacked and mounted, and a tray supply area A1 (mounting area). Device transport head 13 (gripping unit) that grips the electronic component placed on the tray 200 (mounting member), and device supply area A2 (grip) where the electronic component is gripped by the device transport head 13 (gripping unit) Region) and an ionizer 6 as a mounting region neutralizing unit that performs static elimination so as to reduce the electric charge of the electronic components mounted on the tray 200 (mounting member) in the tray supply region A1 (mounting region).

  As will be described later, in the tray supply region A1, the electronic component placed on the tray 200 may be charged. In this case, the electronic component may be damaged due to electrostatic breakdown during transportation depending on various conditions such as the magnitude of the charge amount. Therefore, the ionizer 6 can perform static elimination that can reduce the charge of the electronic components placed on the tray 200 in the tray supply area A1. As a result, the electronic component is in a charge-removed state in which the charged state is eliminated as much as possible, thereby preventing damage due to electrostatic breakdown.

  Moreover, the electronic component inspection apparatus 1 of this invention has the electronic component conveyance apparatus 10, and also has the test | inspection part 16 which test | inspects an electronic component. That is, the electronic component inspection apparatus 1 of the present invention has a tray supply area A1 (mounting area) and a tray supply area A1 (mounting area) in which a plurality of trays 200, which are mounting members for mounting electronic components, can be stacked and mounted. Device transport head 13 (gripping unit) that grips the electronic component placed on the tray 200 (mounting member) transported from the device, and device supply region A2 where the electronic component is gripped by the device transport head 13 (gripping unit) (Gripping area), an ionizer 6 as a mounting area static elimination section that performs static elimination so as to reduce electric charges of electronic components placed on the tray 200 (placement member) in the tray supply area A1 (mounting area), And an inspection unit 16 for inspecting parts.

  Thereby, the electronic component inspection apparatus 1 which has the advantage of the electronic component conveying apparatus 10 mentioned above is obtained. Further, the electronic component can be transported to the inspection unit 16, and therefore, the inspection unit 16 can inspect the electronic component. In addition, the inspected electronic component can be transported from the inspection unit 16.

Hereinafter, the configuration of each unit will be described.
As shown in FIGS. 1 and 2, an electronic component inspection apparatus 1 incorporating an electronic component transport apparatus 10 transports electronic components such as an IC device that is a BGA (Ball Grid Array) package, for example. This is an apparatus for inspecting and testing the electrical characteristics of parts (hereinafter simply referred to as “inspection”). In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be described as a representative, and this will be referred to as “IC device 90”. In this embodiment, the IC device 90 has a flat plate shape.

  In addition to the above-mentioned IC devices, for example, “LSI (Large Scale Integration)”, “CMOS (Complementary MOS)”, “CCD (Charge Coupled Device)”, or “modules” in which a plurality of IC devices are packaged. IC "," quartz device "," pressure sensor "," inertial sensor (acceleration sensor) "," gyro sensor "," fingerprint sensor ", and the like.

  Also, the electronic component inspection apparatus 1 (electronic component transport apparatus 10) is used by mounting in advance a so-called “change kit” that is exchanged for each type of IC device 90. This change kit includes a mounting unit on which the IC device 90 is mounted. Examples of the mounting unit include a temperature adjustment unit 12 and a device supply unit 14 described later. In addition to the change kit as described above, the mounting unit (mounting member) on which the IC device 90 is mounted includes the inspection unit 16 and the tray 200 prepared by the user.

The electronic component inspection apparatus 1 includes a tray supply area A1, a device supply area A2, an inspection area A3, a device collection area (hereinafter simply referred to as “collection area”) A4, and a tray removal area A5. The area is divided by each wall as will be described later. Then, the IC device 90 passes through the respective areas in the direction of the arrow α ₉₀ from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the electronic component inspection apparatus 1 includes the handler that is the electronic component conveyance device 10 that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 800. It has become. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIGS. 2 and 3 is the front side, and the inspection area A3 is arranged, that is, The upper side in FIGS. 2 and 3 is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray 200 in which a plurality of untested IC devices 90 are arranged is supplied. The tray supply area A1 can also be said to be a mounting area in which a plurality of trays 200 can be stacked and mounted. In the present embodiment, a plurality of recesses (pockets) 201 are arranged in a matrix on each tray 200. In each recess 201, the IC devices 90 can be placed and stored one by one.

The device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 conveyed from the tray supply area A1 are respectively conveyed and supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply region A1 and the device supply region A2. The tray transport mechanism 11A is a moving unit that can move the tray 200 together with the IC device 90 placed on the tray 200 in the positive direction in the Y direction, that is, in the direction of the arrow _α11A in FIG. As a result, the IC device 90 can be stably fed into the device supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 in the negative direction in the Y direction, that is, in the direction of the arrow _α11B in FIG. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

  In the device supply area A2, a temperature adjustment unit (soak plate (English notation: soak plate, Chinese notation (example): soaking plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. Yes.

  The temperature adjustment unit 12 is configured as a mounting unit on which a plurality of IC devices 90 are mounted, and is referred to as a “soak plate” that can heat or cool the mounted IC devices 90 in a lump. With this soak plate, the IC device 90 before being inspected by the inspection unit 16 can be heated or cooled in advance and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any one of the temperature adjustment units 12. Note that the temperature adjustment unit 12 as the mounting unit is fixed, so that the temperature can be stably adjusted with respect to the IC device 90 on the temperature adjustment unit 12. Further, the temperature adjusting unit 12 is grounded (grounded).

The device transport head 13 is a grip portion that grips the IC device 90, and is supported so as to be movable in the X direction and the Y direction within the device supply region A2 (gripping region), and further supported so as to be movable in the Z direction. Yes. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90. In FIG. 2, the movement of the device transport head 13 in the X direction is indicated by an arrow α _13X , and the movement of the device transport head 13 in the Y direction is indicated by an arrow α _13Y .

Tray transporting mechanism 15, the positive side of the X direction empty tray 200 in a state where all of the IC devices 90 is removed in the device supply area A2, i.e., a mechanism for conveying the arrow alpha ₁₅ direction. After this transport, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 for inspecting the IC device 90 and a device transport head 17 are provided. Further, a device supply unit 14 that moves so as to straddle the device supply region A2 and the inspection region A3, and a device recovery unit 18 that moves so as to straddle the inspection region A3 and the recovery region A4 are also provided.

  The device supply unit 14 is configured as a mounting unit on which the IC device 90 temperature-adjusted by the temperature adjusting unit 12 is mounted, and can transport the IC device 90 to the vicinity of the inspection unit 16 “supply shuttle plate” "Or simply called a" supply shuttle ".

The device supply unit 14 as the mounting portion is between the examination region A3 and the device supply region A2 X direction, i.e., are reciprocally movably supported along an arrow alpha ₁₄ direction. As a result, the device supply unit 14 can stably transport the IC device 90 from the device supply region A2 to the vicinity of the inspection unit 16 in the inspection region A3, and the IC device 90 can be transferred to the device transport head 17 in the inspection region A3. After being removed, the device supply area A2 can be returned again.

  In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to one of the device supply units 14. Further, like the temperature adjustment unit 12, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14. As a result, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be transported to the vicinity of the inspection unit 16 in the inspection region A3 while maintaining the temperature adjustment state. The device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

The device transport head 17 is an operation unit that grips the IC device 90 in which the temperature adjustment state is maintained and transports the IC device 90 in the inspection area A3. The device transport head 17 is supported so as to be reciprocally movable in the Y direction and the Z direction in the inspection area A3, and is a part of a mechanism called “index arm”. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the device supply region A2 onto the inspection unit 16. In FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α _17Y . The device transport head 17 is supported so as to be reciprocally movable in the Y direction, but is not limited thereto, and may be supported so as to be reciprocally movable in the X direction.

  Further, the device transport head 17 is configured to be able to heat or cool the gripped IC device 90 in the same manner as the temperature adjustment unit 12. Thereby, the temperature adjustment state in the IC device 90 can be continuously maintained from the device supply unit 14 to the inspection unit 16.

  The inspection unit 16 is configured as a mounting unit that mounts an IC device 90 that is an electronic component and inspects the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90. Then, the IC device 90 can be inspected when the terminals of the IC device 90 and the probe pins are electrically connected, that is, contacted. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. Note that, similarly to the temperature adjustment unit 12, the inspection unit 16 can also heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for the inspection.

  The device collection unit 18 is configured as a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed and can transport the IC device 90 to the collection area A4. It is simply called the “collection shuttle”.

The device collecting section 18, X-direction between the examination region A3 and the collection area A4, i.e., are reciprocally movably supported along the arrow alpha ₁₈ direction. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17. The device collection unit 18 is also grounded, like the temperature adjustment unit 12 and the device supply unit 14.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected in the inspection area A3 and completed the inspection are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed, and is fixed so as not to move in the collection region A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. Become. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

  Three empty trays 200 are also arranged along the X direction. This empty tray 200 is also a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

The device transport head 20 is supported so as to be movable in the X direction and the Y direction within the collection area A4, and further has a portion that can also move in the Z direction. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In FIG. 2, the movement of the device transport head 20 in the X direction is indicated by an arrow α _20X , and the movement of the device transport head 20 in the Y direction is indicated by an arrow α _20Y .

Tray transfer mechanism 21, X-direction empty tray 200 is conveyed from the tray removal area A5 in the collection area A4, i.e., a mechanism for conveying the arrow alpha ₂₁ direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving unit that can reciprocate the tray 200 in the Y direction, that is, the arrow α _22A direction. Thus, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 in the positive direction in the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the collection area A4.

  For example, the control unit 800 includes a tray transport mechanism 11A, a tray transport mechanism 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport. The head 17, the device recovery unit 18, the device transport head 20, the tray transport mechanism 21, the tray transport mechanism 22A, the tray transport mechanism 22B, and other parts of the ionizer 3, ionizer 4, ionizer 5, and ionizer 6 described later. Can be controlled.

  The operator can set or confirm the operating conditions of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the electronic component inspection apparatus 1. As shown in FIG. 1, a mouse table 600 on which a mouse is placed is provided on the right side of the tray removal area A5 in the drawing. This mouse is used when operating the screen displayed on the monitor 300.

  In addition, an operation panel 700 is arranged on the lower right side of FIG. The operation panel 700 instructs the electronic component inspection apparatus 1 to perform a desired operation separately from the monitor 300.

  Further, the signal lamp 400 can notify the operating state of the electronic component inspection apparatus 1 and the like by a combination of colors that emit light. The signal lamp 400 is disposed on the electronic component inspection apparatus 1. Note that the electronic component inspection apparatus 1 has a built-in speaker 500, and the operational state of the electronic component inspection apparatus 1 can also be notified by the speaker 500.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the device supply area A2 are separated by a first partition 231 and the device supply area A2 and the inspection area A3 are separated by a second partition 232. The inspection area A3 and the collection area A4 are separated by the third partition wall 233, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 234. The device supply area A2 and the collection area A4 are also separated by the fifth partition wall 235.

  The outermost exterior of the electronic component inspection apparatus 1 is covered with a cover. Examples of the cover include a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

  As shown in FIG. 3, an ionizer 3 is provided in the device supply area A2, an ionizer 4 is provided in the inspection area A3, and an ionizer 5 is provided in the recovery area A4. The ionizer 3, the ionizer 4, and the ionizer 5 are so-called “AC type ionizers” configured to alternately generate positive ions and negative ions by corona discharge and discharge the ions together with air.

  In the device supply area A2, the IC device 90 held by the device transport head 13, the IC device 90 placed on the temperature adjustment unit 12, and the IC device 90 placed on the device supply unit 14 are charged. May have. The cause of the IC device 90 being charged includes, for example, friction with the device transport head 13 that contacts the IC device 90 during the transport process. For example, if the IC device 90 held by the device transport head 13 remains charged, when the IC device 90 is placed on the device supply unit 14, a large current exceeding the tolerance is suddenly applied to the IC device 90. The IC device 90 may be damaged. The ionizer 3 performs static elimination so as to reduce the charge of the IC device in the device supply area A2, and prevents damage (electrostatic breakdown) of the IC device 90.

  In the configuration shown in FIG. 3, two ionizers 3 are arranged in the Y direction. Further, these ionizers 3 are fixed above the device transport head 13 in the device supply region A2, that is, on the top cover 245 side, and can discharge air containing ions downward.

  As described above, the electronic component inspection apparatus 1 (electronic component transport apparatus 10) is provided in the device supply area A2 (gripping area), and the IC device 90 (electronic component) gripped by the device transport head 13 (gripping part). It has an ionizer 3 as a gripping area static elimination unit that performs static elimination so as to reduce electric charges. As a result, the static electricity can be removed from the IC device 90 in the device supply area A2, and thus the IC device 90 can be prevented from being damaged.

  In addition, the ionizer 3 as the gripping area charge eliminating unit is an ionizer that discharges air containing ions as described above. As a result, the ionizer 3 can have a simple configuration. For example, the ionizer 3 can be easily incorporated into the device supply region A2, or the ionizer 3 can be easily controlled. .

  Even in the inspection area A3, the IC device 90 placed on the device supply unit 14, the IC device 90 placed on the inspection unit 16, and the IC device 90 placed on the device collection unit 18 are charged. There may be. As a cause of the IC device 90 being charged, for example, friction with the device supply unit 14 that is in contact with the IC device 90 in the conveyance process can be cited. Also in this case, the IC device 90 may be damaged due to electrostatic breakdown. The ionizer 4 is an inspection region static elimination unit that performs static elimination capable of reducing the charge of the IC device in the inspection region A3 and prevents the IC device 90 from being damaged.

  In the configuration shown in FIG. 3, two ionizers 4 are arranged in the X direction via the inspection unit 16 in a plan view. Further, these ionizers 3 are fixed to the top cover 245 side in the inspection region A3, and air containing ions can be discharged toward the inspection unit 16 side.

  Even in the collection area A4, the IC device 90 held by the device transport head 20 may be charged. As a cause of the IC device 90 being charged, for example, friction with the device transport head 20 that is in contact with the IC device 90 in the transport process may be cited. Also in this case, the IC device 90 may be damaged due to electrostatic breakdown. The ionizer 5 is a recovery area static elimination unit that performs static elimination capable of reducing the charge of the IC device in the recovery area A4 and prevents the IC device 90 from being damaged.

  In the configuration shown in FIG. 3, two ionizers 5 are arranged in the Y direction. Further, these ionizers 5 are fixed above the device transport head 20 in the collection area A4, that is, on the top cover 245 side, and can discharge air containing ions downward.

  As described above, a plurality of trays 200 on which the IC devices 90 are placed can be stacked and mounted in the tray supply region A1 (see FIGS. 4 to 7). Then, the trays 200 stacked in the tray supply area A1 pass through the opening 236 of the first partition 231 sequentially from the lowest tray 200 and are transported (transferred) to the device supply area A2. At that time, the lowermost tray 200 is transported after being separated downward from the other trays 200.

  Incidentally, even in the tray supply area A1, the IC device 90 on the tray 200 may be charged. The cause of charging of the IC device 90 includes, for example, friction with the tray 200 in contact with the IC device 90. Depending on the charge amount, the ionization of the IC device 90 may be insufficient with only the ionizer (ionizer 3, ionizer 4, ionizer 5) in the area downstream of the tray supply area A1 in the transport direction of the IC device 90. There is. In this case as well, the IC device 90 may be damaged due to electrostatic breakdown as described above.

  Therefore, the electronic component inspection apparatus 1 (electronic component transport apparatus 10) of the present invention has a configuration that can eliminate such a phenomenon. This configuration and operation will be described below with reference to FIGS.

As shown in FIG. 3, an ionizer 6 is provided in the tray supply area A1 (mounting area). The ionizer 6 is a mounting area static elimination unit that performs static elimination capable of reducing the charge of the IC device 90 placed on the tray 200 in the tray supply area A1. Similar to the ionizer 3, the ionizer 4, and the ionizer 5, the ionizer 6 is a so-called “AC type ionizer” configured to generate positive ions and negative ions alternately by corona discharge and discharge the ions together with air. Is comprised. As shown in FIGS. 4 to 7, the ionizer 6 is connected to a supply source (not shown) for supplying air via a pipe 61. The ionizer 6 has a discharge port 62 that discharges (can eject) ions (hereinafter, air (fluid) containing these ions is referred to as “air GS ₆ ”) together with the air supplied from the supply source. Yes. An adjustment valve 63 that adjusts the amount of air supplied to the ionizer 6 is installed in the middle of the pipe 61. With this adjustment valve 63, the amount of air GS ₆ released can be adjusted as appropriate according to the number of IC devices 90 placed on the tray 200, the size of the IC devices 90, and the like.

  In the present embodiment, four ionizers 6 are provided so as to surround the tray 200 on which the IC device 90 before inspection is placed in a plan view of the electronic component inspection apparatus 1. As shown in FIG. 3, among these four ionizers 6, the ionizer 6 located on the most front side may be referred to as “ionizer 6 </ b> A”. Further, the ionizer 6 on the left side as viewed from the ionizer 6A may be referred to as “ionizer 6B”. Further, the ionizer 6 on the right side as viewed from the ionizer 6A, that is, the ionizer 6 on the opposite side of the ionizer 6B through the tray 200 may be referred to as “ionizer 6C”. Further, the ionizer 6 located on the most back side, that is, the ionizer 6 on the side opposite to the ionizer 6A through the tray 200 may be referred to as “ionizer 6D”.

As shown in FIG. 4, a plurality of stacked trays 200 (mounting members) mounted in the tray supply area A <b> 1 (mounting area) are the first IC devices to be neutralized among these trays 200. The first tray 200A (first placement member) on which 90 is placed and the second tray 200B (second placement member) stacked on the first tray 200A (first placement member) are included. Yes. The IC device 90 on the second tray 200B is the second charge removal target after the IC device 90 on the first tray 200A. As shown in FIG. 6, each ionizer 6 (mounting area static elimination section) releases air GS ₆ and each IC device 90 (electronic component) placed on the first tray 200 </ b> A (first placement member). ). As a result, each IC device 90 is in a charge-removed state in which the charged state is eliminated as much as possible.

  In the next static elimination, the IC device 90 on the second tray 200B is treated as the “IC device 90 on the first tray 200A” to be eliminated, and the IC on the tray 200 stacked on the second tray 200B. The device 90 is treated as “the IC device 90 on the second tray 200B”.

  Then, from the state shown in FIG. 6, the first tray 200A (first placement member) is, as shown in FIG. 7, the device supply area A2 (gripping area) before the second tray 200B (second placement member). ). As a result, each IC device 90 on the first tray 200A stands by in the device supply area A2 while being in a charge-removed state. Thereafter, the ionizer 3, the ionizer 4, and the ionizer 5 can sufficiently neutralize each IC device 90.

  In the electronic component inspection apparatus 1, if neutralization in the middle of conveyance of the IC device 90, that is, neutralization in the device supply area A <b> 2, inspection area A <b> 3, and collection area A <b> 4 is referred to as “main static elimination”, before the IC device 90 is conveyed. This charge removal, that is, charge removal in the tray supply area A1 can be referred to as “preliminary charge removal”.

  As described above, in the electronic component inspection apparatus 1, the state in which each IC device 90 is charged can be eliminated as much as possible by preliminary neutralization, regardless of the amount of charge in the tray supply region A1. Further, the static elimination can further eliminate the state where each IC device 90 is charged. Thereby, damage to the IC device 90 due to electrostatic breakdown can be prevented.

As shown in FIG. 4 to FIG. 6, the first tray 200 </ b> A (first placement member) moves downward and is separated from the second tray 200 </ b> B (second placement member) when static elimination is performed. In this separated state, the IC device 90 on the first tray 200A is neutralized. Here, the height at which the ionizer 6A, the ionizer 6B, the ionizer 6C, and the ionizer 6D (mounting area neutralization unit) are installed, that is, the position in the Z direction, is the first tray 200A (the first tray 200A) in which at least the discharge ports 62 are separated from each other. 1 mounting member) and the height between the second tray 200B (second mounting member). Thereby, even in a state where a plurality of trays 200 are stacked, the first tray 200A at the lowest position is separated, and the air GS ₆ to the first tray 200A is second above the first tray 200A. It can be prevented from being blocked by the tray 200B or the like. Thereby, the air GS ₆ can be sufficiently blown against the IC device 90 on the first tray 200A.

As described above, a plurality of ionizers 6A, ionizers 6B, ionizers 6C, and ionizers 6D (mounting area neutralization units) are installed around the first tray 200A (first mounting member). As a result, each IC device 90 is uniformly discharged by blowing air GS ₆ from any one of the ionizer 6A, ionizer 6B, ionizer 6C and ionizer 6D regardless of the place on the first tray 200A. Is done.

  Further, the ionizer 6A, the ionizer 6B, the ionizer 6C, and the ionizer 6D (mounting area neutralization unit) are arranged at least between the tray supply area A1 (mounting area) and the device supply area A2 (gripping area). Is preferred. Moreover, it is preferable that the ionizer 6B and the ionizer 6C are unevenly arranged on the ionizer 6D side.

Among all the IC devices 90 on the first tray 200A, the IC device 90 located on the most positive side in the Y direction (hereinafter referred to as “IC device 90A”) is the time that is located in the tray supply area A1, that is, The time during which the air GS ₆ is blown is shorter than that of the other IC devices 90. Since the ionizer 6D, the ionizer 6B, and the ionizer 6C are arranged in this manner, the air GS ₆ can be preferentially blown to the IC device 90A. As a result, uniform charge removal can be performed for all the IC devices 90 on the first tray 200A.

As described above, the ionizer 6A, the ionizer 6B, the ionizer 6C, and the ionizer 6D (mounting area neutralization unit) are each an ionizer that discharges air GS ₆ (air containing ions). Thereby, the ionizer 6A, the ionizer 6B, the ionizer 6C, and the ionizer 6D can be simply configured. Therefore, for example, the ionizer 6A, the ionizer 6B, the ionizer 6C, and the ionizer 6D can be incorporated into the tray supply area A1. The ionizer 6A, the ionizer 6B, the ionizer 6C, and the ionizer 6D can be easily controlled.

  In the present embodiment, four ionizers 6, i.e., ionizer 6 </ b> A, ionizer 6 </ b> B, ionizer 6 </ b> C, and ionizer 6 </ b> D are arranged in tray supply region A <b> 1, but the present invention is not limited to this. For example, the ionizer 6A may be omitted, or the ionizer 6B and the ionizer 6C may be omitted.

As shown in FIGS. 4 to 7, in the present embodiment, the release of the air GS ₆ is performed while the first tray 200 </ b> A is separated from the second tray 200 </ b> B, but is not limited thereto. For example, the air GS ₆ may be continuously released regardless of whether the first tray 200A is separated from the second tray 200B or not.

  As described above, in each area (tray supply area A1, device supply area A2, inspection area A3, and collection area A4) where the ionizer 3, ionizer 4, ionizer 5, and ionizer 6 are installed, the area passes through (stays). The IC device 90 is neutralized (reduced charge) by the action of the ionizer 3, ionizer 4, ionizer 5, and ionizer 6. Thereby, damage to the IC device 90 due to charging can be prevented.

Second Embodiment
Hereinafter, the second embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 8 and 9. However, the difference from the above-described embodiment will be mainly described, and similar matters will be described. Will not be described.

  This embodiment is the same as the first embodiment except that the arrangement of the ionizers in the tray supply region is different.

  As shown in FIG. 9, the first tray 200 </ b> A (first mounting member) is configured so that the IC device 90 (electronic component) is opposite to the side on which the IC device 90 (electronic component) is gripped by the device transport head 13, i. It has a tray opening (opening) 202 from which a part of the electronic component) is exposed. The tray opening 202 communicates with the recess 201. Similarly, other trays 200 such as the second tray 200B have a tray opening 202.

As shown in FIG. 8, in this embodiment, one ionizer 6 is installed in the tray supply area A1 as the ionizer 6E. In the ionizer 6E (mounting area static elimination unit), the discharge ports 62 are installed so as to face (facing) the tray openings 202 all at once (see FIG. 9). In other words, the ionizer 6 </ b> E is installed such that the discharge port 62 includes the entire tray opening 202 in a plan view of the electronic component inspection apparatus 1. By such an ionizer 6E, the air GS ₆ passes through each tray opening 202 and reaches the IC device 90. As a result, it is possible to remove electricity from each IC device 90 on the first tray 200A.

<Third Embodiment>
Hereinafter, the third embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 10 and 11. However, the differences from the above-described embodiment will be mainly described and the same matters will be described. Will not be described.

  This embodiment is the same as the first embodiment except that the arrangement of ionizers in the device supply region is different.

  As shown in FIG. 10, in the present embodiment, in the device supply area A <b> 2 (gripping area), in addition to the ionizer 3, an ionizer 7 as a gripping area static elimination unit is provided. Similar to the ionizer 3, the ionizer 7 is a so-called “AC type ionizer” configured to alternately generate positive ions and negative ions by corona discharge and discharge the ions together with air. Further, unlike the ionizer 3, the ionizer 7 is disposed below the device transport head 13.

As shown in FIG. 11, such an ionizer 7 (gripping region static elimination unit) contains ions from vertically downward to vertically upward, that is, toward the positive side in the Z direction, through the discharge port 71. Air GS ₇ can be released. As a result, the IC device 90 is blown with air GS ₇ from below during the conveyance by the device conveyance head 13. And the static elimination effect with respect to the IC device 90 improves with the static elimination effect by the ionizer 3 from the upper part.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Needless to say, the number of ionizers installed in the tray supply region is not limited to the illustrated configuration.

  Moreover, each static elimination part mentioned above may be various static neutralizers (static elimination apparatus) other than an ionizer.

  Moreover, each static elimination part mentioned above is not limited to being installed in each area | region, For example, it installs outside each area | region, and supplies the air containing ion into each area | region via piping. It may be configured.

  In each of the embodiments described above, separate ionizers are installed in the tray supply area, device supply area, inspection area, and collection area, but the present invention is not limited to this. For example, two or more of a tray supply area, a device supply area, an inspection area, and a collection area may be combined with one ionizer. In this case, it can be set as the structure which supplies the air containing the ion discharge | released from one ionizer to the said 2 or more area | region via branch piping.

  In addition, after the tray on which the IC device is placed is conveyed from the tray supply area, a detection unit that detects the charge amount of the IC device may be installed. In this case, the detection result of the detection unit may be displayed on a monitor, for example, or notified by an alarm or a signal lamp.

DESCRIPTION OF SYMBOLS 1 ... Electronic component inspection apparatus, 10 ... Electronic component conveyance apparatus, 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 13 ... Device conveyance head, 14 ... Device supply part, 15 ... Tray conveyance mechanism, DESCRIPTION OF SYMBOLS 16 ... Inspection part, 17 ... Device conveyance head, 18 ... Device collection | recovery part, 19 ... Collection tray, 20 ... Device conveyance head, 21 ... Tray conveyance mechanism, 22A ... Tray conveyance mechanism, 22B ... Tray conveyance mechanism, 231 ... 1st 1 partition, 232 ... 2nd partition, 233 ... 3rd partition, 234 ... 4th partition, 235 ... 5th partition, 236 ... opening, 241 ... front cover, 242 ... side cover, 243 ... side cover, 244 ... rear cover 245 ... Top cover, 3 ... Ionizer, 4 ... Ionizer, 5 ... Ionizer, 6 ... Ionizer, 6A ... Ionizer 6B ... Ionizer, 6C ... Ionizer, 6D ... Ionizer, 6E ... Ionizer, 61 ... Piping, 62 ... Discharge port, 63 ... Regulating valve, 7 ... Ionizer, 71 ... Discharge port, 90 ... IC device, 90A ... IC device, 200 ... Tray, 200A ... First tray, 200B ... Second tray, 201 ... Recess (pocket), 202 ... Tray opening, 300 ... Monitor, 301 ... Display screen, 400 ... Signal lamp, 500 ... Speaker, 600 ... Mouse stand , 700 ... Operation panel, 800 ... Control unit, A1 ... Tray supply area, A2 ... Device supply area, A3 ... Inspection area, A4 ... Device collection area (collection area), A5 ... Tray removal area, GS ₆ ... Air, GS ₇ ... air, alpha _{11A ...} arrows, alpha _{11B ...} arrows, alpha _{13X ...} arrows, alpha _{13Y ...} arrows, alpha _{14 ...} arrow , Alpha _{15 ...} arrow, alpha _{17Y ...} arrows, alpha _{18 ...} arrow, alpha _{20X ...} arrows, alpha _{20Y ...} arrows, alpha _{21 ...} arrow, alpha _{22A ...} arrows, alpha _{22B ...} arrows, alpha _{90 ...} arrow

Claims (15)

A mounting area where the first mounting member and the second mounting member on which the electronic component is mounted can be mounted;
A gripping part for gripping the electronic component placed on the first placement member and the second placement member conveyed from the mounting region;
A gripping region in which the electronic component is gripped by the gripping portion;
A mounting region static elimination unit capable of reducing the charge of the electronic component mounted on the first mounting member and the second mounting member in the mounting region,
The electronic component transport apparatus, wherein the second mounting member is disposed vertically above the first mounting member.   The electronic component transport apparatus according to claim 1, wherein the second placement member is transported from the mounting area to the gripping area after the first placement member is transported from the mounting area to the gripping area.   3. The electronic component transport device according to claim 1, wherein the mounting region static elimination unit is capable of ejecting a fluid capable of reducing the electric charge of the electronic component.   3. The electronic component transport device according to claim 1, wherein the mounting area neutralizing unit reduces the electric charge with respect to the electronic component mounted on the first mounting member.   The electronic component transport apparatus according to claim 4, wherein the first mounting member is separated from the second mounting member when the charge is reduced.   The electronic component transport apparatus according to claim 5, wherein the mounting area static elimination unit discharges air containing ions between the first mounting member and the second mounting member.   The electronic component transport apparatus according to claim 1, wherein a plurality of the mounting area static elimination units are installed so as to surround the first mounting member. The first mounting member has an opening in which a position where the electronic component is arranged is opened,
The electronic component carrying device according to claim 1, wherein the mounting area static elimination unit is installed facing the opening.   The electronic component transport apparatus according to claim 1, wherein the first mounting member is transported to the gripping region before the second mounting member.   The electronic component transport apparatus according to claim 1, wherein the mounting area static elimination unit is installed at least between the mounting area and the gripping area.   The electronic component transport apparatus according to claim 1, wherein the mounting area static elimination unit is an ionizer that emits air containing ions.   3. The electronic component transport device according to claim 1, further comprising a gripping region static elimination unit that is provided in the gripping region and performs static elimination so as to reduce charge of the electronic component gripped by the gripping unit.   The electronic component transport apparatus according to claim 12, wherein the gripping area static elimination unit is an ionizer that emits air containing ions.   The electronic component carrying device according to claim 13, wherein the gripping area static elimination unit releases the air from vertically downward to vertically upward. A mounting area where the first mounting member and the second mounting member on which the electronic component is mounted can be mounted;
A gripping part for gripping the electronic component placed on the first placement member and the second placement member conveyed from the mounting region;
A gripping region in which the electronic component is gripped by the gripping portion;
A mounting region static elimination unit capable of reducing the charge of the electronic component mounted on the first mounting member and the second mounting member in the mounting region;
An inspection unit for inspecting the electronic component,
The electronic component inspection apparatus, wherein the second mounting member is disposed vertically above the first mounting member.

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