JP2016025125A - Electronic component transportation device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component transportation device and an electronic component inspection device capable of, when an electronic component is transported from a first arrangement part to a second arrangement part and then arranged, arranging the electronic component independently of an arrangement position on the second arrangement part.SOLUTION: An electronic component inspection device 1 comprises: a device recovery part 18 on which an IC device 90 is arranged; a recovery tray 19 provided at a position different from the device recovery part 18, and on which the IC device 90 is arranged; a base 201 that can move between the device recovery part 18 and the recovery tray 19; a holding part 202a supported by the base 201 and that holds the IC device 90; and a holding part 202d supported by the base 201 and that holds the IC device 90. In a case where the IC device 90 is transported from the device recovery part 18 to the recovery tray 19, the electronic component inspection device 1 holds the IC device 90 by the holding part 202d after the IC device 90 is released from the holding part 202a.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  Conventionally, it is known that in a manufacturing process for manufacturing various components such as electronic components and wafers, a transport device that transports the components from a first region to a second region is used.

  For example, Patent Document 1 discloses a transfer system in which a transfer robot having a hand unit that holds a substrate as the component is installed between a first transfer station and a second transfer station.

JP2013-83700A

  However, in the invention described in Patent Document 1, the movable range of the transfer robot may be limited depending on the positional relationship between the first transfer station, the second transfer station, and the transfer robot, that is, the layout. In this case, for example, when the substrate received at the first delivery station is transported and arranged at the second delivery station, the arrangement location at the second delivery station is limited, that is, the arrangement at the second delivery station. There was a problem that an impossible part occurred.

  An object of the present invention is to convey an electronic component so that the electronic component can be arranged regardless of the arrangement location in the second arrangement unit when the electronic component is conveyed from the first arrangement unit to the second arrangement unit. An apparatus and an electronic component inspection apparatus are provided.

Such an object is achieved by the present invention described below.
[Application Example 1]
The electronic component conveying apparatus of the present invention includes a first arrangement unit that arranges electronic components,
A second placement portion for placing the electronic component provided at a position different from the first placement portion;
A movable base; and
A first gripping part supported by the base and gripping the electronic component;
A second gripping part supported by the base and gripping the electronic component;
When transporting the electronic component from the first placement portion to the second placement portion, the electronic component is gripped by the second gripping portion after the electronic component is released from the first gripping portion. And

  Accordingly, when the electronic component is transported from the first placement unit to the second placement unit and placed, the electronic component can be changed from the first gripping part to the second gripping part during the transport. Whether or not to perform this holding operation can be selected depending on the arrangement location in the second arrangement section of the transport destination. Thereby, an electronic component can be arrange | positioned irrespective of the arrangement | positioning location in a 2nd arrangement | positioning part.

[Application Example 2]
In the electronic component transport device of the present invention, it is preferable that the electronic component is arranged by the second gripping portion at an arrangement position of the second placement portion where the first gripping portion cannot place the electronic component.

  Accordingly, it is possible to select whether or not to perform the electronic component changeover operation according to the arrangement location of the electronic component in the second arrangement unit.

[Application Example 3]
In the electronic component transport device according to the aspect of the invention, it is preferable that the direction in which the first gripping portion and the second gripping portion are arranged is the same as the direction in which the first placement portion and the second placement portion are arranged. .

  Thus, for example, when the former direction and the latter direction are orthogonal to each other, it is preferable to rotate one of the electronic components 90 degrees with respect to the other during the transportation of the electronic component, but the mechanism for such rotation is omitted. can do.

[Application Example 4]
In the electronic component transport device of the present invention, a plurality of the second placement portions are placed in the same direction as the direction,
It is preferable that the electronic component is arranged in a second arrangement portion that is distal to the first arrangement portion among the plurality of second arrangement portions.

  As a result, the movement limit of the base portion may be restricted on the distal side, and the configuration is suitable for the placement of the electronic component in the second placement portion with such restriction.

[Application Example 5]
In the electronic component transport device of the present invention, the electronic component transport apparatus includes a third placement unit that places the electronic component provided at a position different from the first placement unit and the second placement unit.
When the electronic component is changed, the first gripping portion places the electronic component on the third placement portion, and then the second gripping portion grips the electronic component placed on the third placement portion. It is preferable to do this.

  As a result, it is possible to perform the holding operation for the electronic component in a state where the electronic component is arranged in the third arrangement portion, and thus the operation can be performed accurately and stably.

[Application Example 6]
In the electronic component transport device of the present invention, a plurality of the first placement portions are placed,
It is preferable that the third arrangement portion is arranged between one of the first arrangement portions and the other of the first arrangement portions.

  As a result, the third placement unit is placed at an equal distance from any of the first placement units. Therefore, the transport time from the first placement unit to the third placement unit can be shortened, and throughput can be reduced. Contributes to improvement.

[Application Example 7]
In the electronic component transport apparatus of the present invention, it is preferable that the electronic component is transported from the first placement portion to the second placement portion after at least one inspection is completed on the electronic component.

  After the inspection, there may be many classifications according to the inspection result. In this case, since it may be classified also in the 2nd arrangement part used as the location where the movement limit of a base is controlled, it is effective.

[Application Example 8]
The electronic component inspection apparatus of the present invention includes a first arrangement unit for arranging electronic components,
A second placement portion for placing the electronic component provided at a position different from the first placement portion;
A movable base; and
A first gripping part supported by the base and gripping the electronic component;
A second gripping part supported by the base and gripping the electronic component;
An inspection unit for inspecting the electronic component,
When the electronic component is transported from the first placement portion to the second placement portion, the electronic component can be transferred from the first gripping portion to the second gripping portion.

  Accordingly, when the electronic component is transported from the first placement unit to the second placement unit and placed, the electronic component can be changed from the first gripping part to the second gripping part during the transport. Whether or not to perform this holding operation can be selected depending on the arrangement location in the second arrangement section of the transport destination. Thereby, an electronic component can be arrange | positioned irrespective of the arrangement | positioning location in a 2nd arrangement | positioning part.

FIG. 1 is a schematic plan view showing an embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is an image diagram for sequentially explaining the operation of conveying the electronic component from the first placement unit to the second placement unit in the electronic component inspection apparatus shown in FIG. FIG. 3 is an image diagram for sequentially explaining the operation of transporting the electronic component from the first placement unit to the second placement unit in the electronic component inspection apparatus shown in FIG. 1. FIG. 4 is an image diagram for sequentially explaining the operation of conveying the electronic component from the first placement unit to the second placement unit in the electronic component inspection apparatus shown in FIG. 1. FIG. 5 is an image diagram for sequentially explaining the operation of conveying an electronic component from the first placement unit to the second placement unit in the electronic component inspection apparatus shown in FIG. 1. FIG. 6 is an image diagram for sequentially explaining the operation of transporting an electronic component from the first placement unit to the second placement unit in the electronic component inspection apparatus shown in FIG. 1. FIG. 7 is an image diagram for sequentially explaining the operation of transporting an electronic component from the first placement unit to the second placement unit in the electronic component inspection apparatus shown in FIG. 1. FIG. 8 is an image diagram for sequentially explaining the operation of transporting an electronic component from the first placement unit to the second placement unit in the electronic component inspection apparatus shown in FIG. 1.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

  FIG. 1 is a schematic plan view showing an embodiment of an electronic component inspection apparatus of the present invention. 2 to 8 are image diagrams for sequentially explaining operations of transporting an electronic component from the first placement unit to the second placement unit in the electronic component inspection apparatus shown in FIG. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis (first axis), a Y axis (second axis), and a Z axis (third axis). Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component transport apparatus that transports the IC device 90 in each region, the inspection unit 16 that performs the inspection in the inspection region A3, and the control unit 80.

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are disposed (the lower side in FIG. 1) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is disposed (see FIG. 1). 1 is used as the back side.

  The tray supply area A1 is an area to which a tray 200 in which a plurality of IC devices 90 in an uninspected state are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjusting unit (soak plate) 12, a device transport head 13, and a tray transport mechanism (first transport device) 15 are provided.

  The temperature adjustment unit 12 is an apparatus that heats or cools the plurality of IC devices 90 to adjust the IC devices 90 to a temperature suitable for inspection. In the configuration shown in FIG. 1, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply region A1 by the tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state where all the IC devices 90 are removed in the X direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transport head 17, and a device recovery unit (recovery shuttle) 18 are provided.

  The device supply unit 14 is a device that transports the temperature-adjusted IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. The

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Each probe pin is electrically connected to an inspection circuit unit included in a tester connected to the inspection unit 16. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in the inspection control unit. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to control the IC device 90 to a temperature suitable for the inspection.

  The device transport head 17 is supported so as to be movable in the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16.

  The device collection unit 18 is a device that collects the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 1, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 includes any one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area where the IC device 90 that has been inspected is collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 1, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The control unit 80 has, for example, a drive control unit. The drive control unit includes, for example, tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and tray conveyance mechanism 22A, 22B is controlled.

  The test control unit of the tester inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a memory (not shown), for example.

  Furthermore, the inspection apparatus 1 has an outermost cover covered with a cover (wall portion), and examples of the cover include a front cover 70, side covers 71 and 72, and a rear cover 73.

  Now, the present invention is an invention characterized by a transport sequence when the IC device 90 is transported from the first placement section to the second placement section. In the present embodiment, as an example, a case will be described in which the IC device 90 is transported and arranged from the device collection unit 18 to the collection tray 19 in the collection area A4. In this case, the device collection unit 18 becomes a “first arrangement unit”, and the collection tray 19 becomes a “second arrangement unit”. Two device collection units 18 are installed, and among these device collection units 18, the device collection unit 18 on the Y axis positive side (hereinafter referred to as “device collection unit 18 </ b> A”) is used. On the other hand, three collection trays 19 are installed, and among these collection trays 19, the collection tray 19 (hereinafter referred to as “collection tray 19 </ b> A”) located closest to the X-axis positive side is used.

  As shown in FIGS. 2-8, the device collection | recovery part 18 has the four recessed parts (pocket) 181 arrange | positioned along X direction (left-right direction in a figure) in this embodiment. The IC device 90 can be placed and stored in the recess 181.

  In the present embodiment, the collection tray 19 has recesses (pockets) 191 arranged in a matrix of 3 rows along the X direction and 5 columns along the Y direction. The IC device 90 can also be disposed and stored in the recess 191.

  The device transport head 20 is used to transport the IC device 90 from the device recovery unit 18 to the recovery tray 19. In this embodiment, the device transport head 20 includes a base 201 that can move between the device recovery unit 18 and the recovery tray 19, and four gripping units 202 that are supported by the base 201 and grip the IC device 90. Have. These four gripping portions 202 are arranged along the X-axis direction, and in order from the negative side to the positive side, “gripping portion 202a”, “gripping portion 202b”, “gripping portion 202c”, “gripping portion 202d”. "

  As will be described later, in the inspection apparatus 1, one of the gripping units 202a to 202d grips the IC device 90 first. This grip 202 can be referred to as a “first grip”. Further, the remaining gripping portions 202 excluding the first gripping portion among the gripping portions 202a to 202d can be referred to as “second gripping portions”.

  In addition, it is preferable that the device conveyance head 20 is comprised so that the space | interval of the adjacent holding parts 202 can be varied. The configuration of each gripper 202 is not particularly limited, and for example, a configuration having a suction pad that can be gripped by suction can be used.

  In this description, attention is focused on one IC device 90. As shown in FIG. 2, the IC device 90 is already housed in a recess 181 (hereinafter referred to as “recess 181a”) located on the most negative side of the X axis of the device recovery portion 18A. It is assumed that the IC device 90 is also stored in the remaining recesses 181 other than the recesses 181a. As shown in FIGS. 3 and 8, the IC device 90 in the recess 181a is positioned at the most X axis positive side and the most Y axis positive side of the collection tray 19A. ”).

  As shown in FIG. 2, the gripper 202 a of the device transport head 20 approaches and comes into contact with the IC device 90 stored in the recess 181 a of the device recovery unit 18 </ b> A. Thereby, the IC device 90 is gripped. The device collection unit 18A has a movement limit to the collection region A4, and the IC device 90 is gripped by the device transport head 20 at the limit position.

  Thereafter, as shown in FIG. 3, the IC device 90 is transported toward the X axis positive side, that is, toward the concave portion 191 a of the collection tray 19 </ b> A while the grip portion 202 a of the device transport head 20 grips the IC device 90. . However, the device transport head 20 has a movement limit to the X axis positive side, and even if it moves to the movement limit, the IC device 90 does not reach the recess 191a. Here, the “movement limit” is a limit position where a collision with the side cover 72 of the device transport head 20 is avoided.

  In such normal conveyance, it may be difficult to arrange the IC device 90 depending on the arrangement location of the IC device 90 on the collection tray 19A. Further, if the IC device 90 is to be disposed in the recess 191a by normal transport, the device transport head 20 must be moved to a position where the gripper 202a reaches the recess 191a. The width in the X direction becomes large. Therefore, the inspection apparatus 1 is increased in size.

  Therefore, in the inspection apparatus 1, in order to prevent a phenomenon in which the IC device 90 is difficult to be arranged at the conveyance destination, a temporary arrangement unit (temporary arrangement unit) (temporary arrangement unit) that temporarily arranges the IC device 90 during the conveyance of the IC device 90 A placing portion) 23 is provided. The temporary arrangement unit 23 is provided at a position different from the device collection unit 18A and the collection tray 19A, and is preferably provided between two device collection units 18 adjacent in the Y direction. As a result, the temporary placement unit 23 is placed at an equal distance from any device collection unit 18, and thus the transport time from the device collection unit 18 to the temporary placement unit 23 can be shortened. The shortening of the conveyance time contributes to the improvement of the throughput of the inspection apparatus 1.

  Moreover, the temporary arrangement | positioning part 23 has the recessed part (pocket) 231 arrange | positioned in the matrix form of 2 rows along the X direction, and 2 columns along the Y direction. The IC device 90 can be disposed and stored in the recess 231.

Next, a transport sequence that passes through the temporary placement unit 23 will be described.
From the state shown in FIG. 2, as shown in FIG. 4, the device transport head 20 moves the IC device 90 to a predetermined position of the temporary placement unit 23 while the gripping unit 202 a (first gripping unit) grips the IC device 90. It conveys to the recessed part 231 and arrange | positions.

  Next, as shown in FIG. 5, the gripping of the gripper 202 a with respect to the IC device 90 is released.

  Next, as illustrated in FIG. 6, the device transport head 20 moves to the X-axis negative side and makes the gripping portion 202 d face directly above the IC device 90.

  As shown in FIG. 7, the device transport head 20 comes into contact with the IC device 90 with the gripping portion 202 d (second gripping portion) of the device transport head 20 approaching. As a result, the IC device 90 is gripped by the gripper 202d.

  Next, as shown in FIG. 8, the device transport head 20 transports the IC device 90 toward the X axis positive side, that is, toward the concave portion 191 a of the collection tray 19 </ b> A while the grip portion 202 d grips the IC device 90. To do. The gripper 202d is located closest to the X-axis positive side among the grippers 202a to 202d in the same movement direction of the device transport head 20. As a result, the IC device 90 held by the holding part 202d can be directly opposed to the concave part 191a without the device transport head 20 moving to the movement limit. Thereafter, the device transport head 20 places the IC device 90 in the recess 191a and releases the grip of the grip portion 202d on the IC device 90.

  When the IC device 90 is transported from the recess 181a of the device recovery unit 18A to the recess 191a of the recovery tray 19A by the transport sequence as described above, the IC device 90 is transferred from the gripper 202a of the device transport head 20 to the gripper 202d. It is possible to change to. Here, “possible” means that it is determined whether or not it is necessary to change the transfer according to the situation of the transport destination, and if the change is necessary as a result of the determination, it is changed.

  As described above, it is impossible to transport the IC device 90 from the recess 181a of the device recovery unit 18A to the recess 191a of the recovery tray 19A using only the gripping unit 202a of the device transport head 20. This is because the concave portion 191a is at a position where the gripper 202a cannot place the IC device 90, that is, a position where it cannot reach. At such a position, the IC device 90 can be disposed by the gripper 202d. Accordingly, in the inspection apparatus 1, when it is determined that the IC device 90 is to be disposed at a position where the single gripper 202 cannot be disposed, a transport sequence that allows the placement is performed. Of course, if the IC device 90 can be disposed at the transfer destination using only one gripper 202, the transfer sequence can be forgotten. Thereby, the IC device 90 can be arranged regardless of the arrangement place of the IC device 90 on the collection tray 19A.

  Further, when the IC device 90 is changed, the IC device 90 is temporarily arranged in the temporary arrangement unit 23 and then changed from the holding unit 202a to the holding unit 202d. As a result, the holding operation of the IC device 90 can be performed accurately and stably.

  Further, the direction in which the gripper 202a and the gripper 202d are arranged is the same as the direction in which the device collection unit 18A and the collection tray 19A are arranged. Thereby, for example, when the former direction and the latter direction are orthogonal to each other, it is preferable to rotate one with respect to the other by 90 degrees in the middle of conveyance, but omitting a mechanism for such rotation. it can.

  Further, in the inspection apparatus 1, the IC device 90 is arranged on the recovery tray 19 </ b> A that is distal to the device recovery portion 18 </ b> A among the three recovery trays 19. In a general industrial machine, the movement limit is often restricted as the distance from the center increases in the drive train. Similarly, in the inspection apparatus 1, the IC device 90 is arranged on the collection tray 19 </ b> A where the movement limit of the device transport head 20 is regulated. The transport sequence is effective for such an arrangement.

  Further, a transport sequence is used to transport the IC device 90 that has been inspected. After the inspection, there may be a number of classifications (six in the configuration shown in FIG. 1) according to the inspection result. In this case, the transfer sequence is effective because it is also classified into the collection tray 19A, which is a place where the movement limit of the device transfer head 20 is restricted.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  In addition, when the IC device is transported from the first placement unit to the second placement unit, the operation of changing the IC device from the first gripping unit to the second gripping unit is performed in the collection area in the embodiment. The present invention is not limited to this, and can be applied to, for example, a supply area or an inspection area.

  In the embodiment, the holding operation is performed by temporarily placing the IC device in the third placement portion. However, the operation is not limited to this, and the first gripping portion and the second gripping portion are not limited to the third placement portion. You may carry out directly between parts.

  In addition, the temporary placement unit may be configured to be movable in at least one of the X direction, the Y direction, and the Z direction.

1 ... Inspection equipment (electronic parts inspection equipment)
11A, 11B ...... Tray transport mechanism 12 ... Temperature adjuster (soak plate)
13 …… Device transport head 14 …… Device supply unit (supply shuttle)
15 ... Tray transfer mechanism 16 ... Inspection unit 17 ... Device transfer head 18, 18A ... Device recovery unit (recovery shuttle)
181, 181a ...... concave portion (pocket)
19, 19A ... Collection tray 191, 191a ... Recess (Pocket)
DESCRIPTION OF SYMBOLS 20 ... Device conveyance head 201 ... Base 202, 202a, 202b, 202c, 202d ... Grasping part 21 ... Tray conveyance mechanism 22A, 22B ... Tray conveyance mechanism 23 ... Temporary arrangement part (temporary placement part)
231 ...... Recess (Pocket)
70 …… Front cover 71 …… Side cover 72 …… Side cover 73 …… Rear cover 80 …… Control unit 90 …… IC device 200 …… Tray A1 …… Tray supply area A2 …… Device supply area (supply area)
A3: Inspection area A4: Device collection area (collection area)
A5 ... Tray removal area

Claims (8)

A first placement section for placing electronic components;
A second placement portion for placing the electronic component provided at a position different from the first placement portion;
A movable base; and
A first gripping part supported by the base and gripping the electronic component;
A second gripping part supported by the base and gripping the electronic component;
When transporting the electronic component from the first placement portion to the second placement portion, the electronic component is gripped by the second gripping portion after the electronic component is released from the first gripping portion. Electronic component transport device.   2. The electronic component transport apparatus according to claim 1, wherein the electronic component is disposed by the second gripping portion at an arrangement position of the second placement portion where the electronic grip is not arranged by the first gripping portion.   The electronic component transport apparatus according to claim 1, wherein a direction in which the first gripping portion and the second gripping portion are arranged is the same as a direction in which the first placement portion and the second placement portion are arranged. . A plurality of the second arrangement parts are arranged in the same direction as the direction,
The electronic component transport apparatus according to claim 3, wherein the electronic component is disposed on a second placement portion that is distal to the first placement portion among the plurality of second placement portions. A third placement portion disposed at a position different from the first placement portion and the second placement portion to place the electronic component;
When the electronic component is changed, the first gripping portion places the electronic component on the third placement portion, and then the second gripping portion grips the electronic component placed on the third placement portion. The electronic component conveying apparatus according to any one of claims 1 to 4. A plurality of the first arrangement parts are arranged,
The electronic component conveying apparatus according to claim 5, wherein the third arrangement unit is arranged between one of the first arrangement units and the other first arrangement unit.   The electronic component transport apparatus according to claim 1, wherein the electronic component is transported from the first placement portion to the second placement portion after at least one inspection for the electronic component is completed. . A first placement section for placing electronic components;
A second placement portion for placing the electronic component provided at a position different from the first placement portion;
A movable base; and
A first gripping part supported by the base and gripping the electronic component;
A second gripping part supported by the base and gripping the electronic component;
An inspection unit for inspecting the electronic component,
An electronic component configured to be able to move the electronic component from the first gripping portion to the second gripping portion when transporting the electronic component from the first placement portion to the second placement portion. Inspection device.

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