JPWO2008050442A1 - Electronic component testing equipment - Google Patents

Abstract

In the electronic component testing apparatus, the IC device is held in a state in which the rib (93) holding the IC device is held in the cover tray (9) arranged in substantially the same arrangement as the accommodating portion of the customer tray (8A). Holding the IC device by pressing the device against the socket (70) of the test head (7) to electrically contact the input / output terminal (HB) of the IC device with the contact pin (71) of the socket (70) And a transporting device for transporting the cover tray (9) to the test unit.

Description

  The present invention relates to an electronic component testing apparatus for testing an electronic component such as a semiconductor integrated circuit element (hereinafter also referred to as an IC device).

  In an electronic component testing apparatus referred to as a handler, a large number of IC devices accommodated in a tray are transported into a handler, and each IC device is brought into electrical contact with a test head, whereby an electronic component testing apparatus main body (hereinafter referred to as a tester). Test). When the test is completed, each IC device is paid out from the test head and placed on a tray according to the test result, thereby sorting into categories such as non-defective products and defective products.

  As such a handler, a tray (hereinafter referred to as a test tray) that is circulated and conveyed in the handler from a tray (hereinafter referred to as a customer tray) that is carried into and out of the handler in a state where an IC device that has been tested or has been tested is accommodated. In other cases, the IC device is tested by bringing the IC device into electrical contact with the socket of the test head in a state where the IC device is reloaded and mounted on the test tray.

  In this type of electronic component testing apparatus, the IC device is transferred from the customer tray to the test tray before the test, and the IC device is transferred from the test tray to the customer tray after the test. Spending time. For this reason, if the number that can be simultaneously tested in the test unit for throughput improvement (hereinafter referred to as the number of simultaneous measurements) increases, the pick-and-place operation of the IC device becomes a bottleneck process.

  In addition, this type of electronic component testing apparatus requires a transfer device for transferring the IC device between the customer tray and the test tray, and a dedicated test tray, which increases the cost of the electronic component testing apparatus itself. Was invited.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component testing apparatus that can reduce the cost of picking up and placing an electronic device under test and reduce the cost.

  In order to achieve the above object, according to the present invention, there is provided an electronic component testing apparatus used for testing an electronic device under test, wherein the customer tray has an accommodating portion for accommodating the electronic device under test, or The electronic device under test is stored or held in a cover tray in which a holding unit for holding the electronic device under test is arranged in substantially the same arrangement as the storage unit of the customer tray. A test unit that presses an electronic component against a socket of a test head to electrically contact an input / output terminal of the electronic device under test with a contact pin of the socket; and the customer that houses or holds the electronic device under test And an electronic component testing apparatus comprising: a conveying unit configured to convey the tray or the cover tray to the test unit (see claim 1).

  In the present invention, the customer tray or the cover tray in which the electronic device under test is accommodated or held in the accommodating portion is transported to the test portion, and the electronic device under test is stored in the socket in the customer tray or the cover tray in the test portion. Press to test the electronic device under test.

  In the present invention, the test is performed in a state where the electronic device under test is accommodated or held in the customer tray or the cover tray without using the test tray. Therefore, before and after the test, the electronic device under test is placed between the customer tray and the test tray. There is no need for replacement, and pick-and-place work can be reduced.

  In addition, since a transfer device and a dedicated test tray for transferring the electronic device under test between the customer tray and the test tray are not required, the cost of the electronic component testing device itself can be reduced.

  Although not particularly limited in the above invention, the test unit is configured to press the input / output terminal of the electronic device under test against the contact pin of the socket with the input / output terminal of the electronic device under test facing upward. Preferably, it is characterized (see claim 2).

  The orientation of the electronic device under test is set so that the input / output terminals of the electronic device under test are facing upward, so that the length of the contact pin of the socket can be shortened and the high frequency signal is used to This is useful when testing test electronic components.

  Although not particularly limited in the above invention, it is preferable that the cover tray is made of a material having a strength higher than that of the customer tray (see claim 3).

  Since the customer tray is made of synthetic resin material, etc., the strength of the electronic component under test is insufficient for the pressing force when pressing the electronic component under test against the socket, There is a problem that heat cannot be transferred or that the electronic device under test is not accurately positioned with respect to the socket when the electronic device under test contacts the socket.

  On the other hand, in the present invention, the cover tray is made of a material higher in strength than the material constituting the customer tray, such as a metal material or ceramic, so that the strength required at the time of pressing and the efficiency at the time of applying heat stress can be improved. Heat conduction can be ensured, and highly accurate positioning at the time of contact is also possible.

  Although not particularly limited in the above invention, it is preferable that an attachment means for covering the cover tray or the customer tray is further provided on the customer tray or the cover tray (see claim 4).

  The test tray is provided with a latch mechanism for preventing the stored electronic device under test from popping out, but the customer tray is not provided with means for preventing the popping out. Therefore, in the present invention, when the customer tray is transported in the electronic component testing apparatus, the cover tray is placed on the customer tray containing the electronic device under test by the attaching means, so that the electronic device under test is removed from the customer tray. Prevent parts from popping out.

  Although not particularly limited in the above invention, the attachment means includes first attachment means for covering the cover tray on the customer tray accommodating the electronic device under test before the test, and the cover after the test. And a second mounting means for covering the customer tray on the cover tray containing test electronic components (refer to claim 5).

  Although not particularly limited in the above invention, it is preferable that the customer tray further includes a reversing unit that reverses the customer tray covered with the cover tray or the cover tray covered with the customer tray. (See claim 6).

  Although not particularly limited in the above invention, the reversing means accommodates the electronic device under test before the test and reverses the customer tray covered with the cover tray, and the post-testing reversal means. And a second reversing means for reversing the cover tray covered with the customer tray. The second reversing means holds the electronic device under test.

  Although not particularly limited in the above invention, it is preferable that the apparatus further comprises a removing means for removing the customer tray or the cover tray from above the cover tray or the customer tray (see claim 8). ).

  Although not particularly limited in the above invention, the removing means includes a first removing means for removing the customer tray from above the cover tray holding the electronic device under test before the test, and a post-test. It is preferable that the cover tray is removed from above the customer tray accommodating the electronic device to be tested, and second removing means is included (see claim 9).

  Although not particularly limited in the above invention, it further comprises a forwarding means for forwarding the cover tray or the customer tray from the removing means or the attaching means to the attaching means or the removing means. It is preferable (see claim 10).

  Although not particularly limited in the above invention, the forwarding means includes a first forwarding means for forwarding the cover tray from the second detaching means to the first mounting means, and the customer tray. It is preferable to include a second forwarding means for forwarding from the first removing means to the second attaching means (see claim 11).

  Although not particularly limited in the above invention, it is preferable that the test head has a guide means for guiding the electronic device under test held on the cover tray with respect to the socket ( (See claim 8).

  By providing guide means on the test head side and guiding the electronic device under test itself held on the cover tray to the socket by this guide means, miscontact between the electronic device under test and the socket can be prevented. .

FIG. 1 is a schematic plan view showing the overall configuration of an electronic component testing apparatus according to an embodiment of the present invention. FIG. 2A is a plan view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention. FIG. 2B is a side view of the customer tray shown in FIG. 2A. 2C is an enlarged cross-sectional view showing the IIC portion of FIG. 2B. FIG. 3 is a plan view showing a mounting device for an electronic device test apparatus according to an embodiment of the present invention. FIG. 4A is a plan view showing a first reversing device of the electronic component testing apparatus according to the embodiment of the present invention. FIG. 4B is a front view of the first inverting means shown in FIG. 4A. FIG. 5 is a plan view showing an attachment / detachment device for an electronic component testing apparatus according to an embodiment of the present invention. FIG. 6A is a cross-sectional view showing a state in which the cover tray is attached on the customer tray by the attachment device in the embodiment of the present invention. FIG. 6B is a cross-sectional view illustrating a state where the customer tray and the cover tray are reversed by the first reversing device in the embodiment of the present invention. FIG. 6C is a cross-sectional view showing a state in which the customer tray on the cover tray is removed by the attaching / detaching device in the embodiment of the present invention. FIG. 6D is a cross-sectional view illustrating a state in which the IC device accommodated in the cover tray is approaching the socket of the test head in the embodiment of the present invention. FIG. 6E is a cross-sectional view showing a state where the input / output terminals of the IC device are in electrical contact with the contact pins of the socket in the embodiment of the present invention. FIG. 7A is a cross-sectional view showing a state where an IC device housed in a cover tray is approaching a socket of a test head in another embodiment of the present invention. FIG. 7B is a cross-sectional view showing a state where the input / output terminals of the IC device are in electrical contact with the contact pins of the socket in another embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Handler 101 ... 1st forwarding apparatus 200 ... Carry-in part 210 ... 1st transfer apparatus 220 ... 1st attachment apparatus 230 ... 1st conveying apparatus 300 ... Application part 310 ... 2nd conveying apparatus 320 ... 1st 1 reversing device 400 ... test unit 410 ... detaching device 420 ... first removing device 430 ... second forwarding device 440 ... second mounting device 500 ... heat removal unit 600 ... unloading unit 7 ... test head 70 ... socket 72 ... Guide posts 8A, 8B ... Customer tray 82 ... Accommodating portion 84 ... Recessed portion 85 ... Opening 9 ... Cover tray 93 ... Rib

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic plan view showing the overall configuration of an electronic component testing apparatus according to an embodiment of the present invention.

  The handler 1 according to the present embodiment allows a tester (not shown) to input / output a test signal to / from the IC device via the test head 7 in a state where high temperature or low temperature stress is applied to the IC device. Is a device for testing (inspecting) whether or not the device operates properly. The test of the IC device by the electronic component test apparatus is executed in a state where the IC device is held in the cover tray 9 in which the accommodating portion 91 is arranged in the same manner as the customer tray 8A without using the test tray.

  For this reason, the handler 1 according to the present embodiment includes a carry-in unit 200, an application unit 300, a test unit 400, a heat removal unit 500, and a carry-out unit 600, as shown in FIG.

  The carry-in unit 200 carries the customer trays 8 </ b> A supplied to the handler 1 in a stacked state one by one into the application unit 300 while covering the cover tray 9.

  In the application unit 300, the IC device is accommodated in the customer tray 8A, and after applying a high or low temperature thermal stress to the IC device, the customer tray 8A and the cover tray 9 are reversed and overlapped, and the test unit 400 Carry in.

  The test unit 400 removes the customer tray 8A from the top of the cover tray 9 and moves the customer tray 9 below the test head 7 to execute the IC device test. The tray 8A is covered and carried out to the heat removal unit 500.

  In the heat removal unit 500, the cover tray 9 and the customer tray 8 </ b> A are turned over again in an overlapped state, and then the thermal stress is removed from the IC device and carried out to the carry-out unit 600.

  In the carry-out unit 600, after the cover tray 9 is removed from the customer tray 8A, the customer tray 8A is stacked on the customer tray 8A that has already been carried out to the carry-out unit 600.

  The customer tray that contains the IC device that has been tested in this manner is transported to a dedicated classification machine different from the handler 1 by an operator in the test process or an automatic transport machine such as ADV. The test result by the electronic component testing apparatus is given to each customer tray itself as an ID such as a barcode, or transferred as data from the handler 1 to the dedicated classification machine. Then, the IC device is classified into categories according to the test results by the classification dedicated machine.

  Next, the customer tray 8A and the cover tray 9 used in the electronic component testing apparatus according to this embodiment will be described first.

  2A is a plan view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention, FIG. 2B is a side view of the customer tray shown in FIG. 2A, and FIG. 2C is an enlarged cross-sectional view showing the IIC portion of FIG. It is.

  As shown in FIGS. 2A and 2B, the customer tray 8A in the present embodiment has a large number of concave accommodating portions 82 for accommodating IC devices on the upper surface of a flat tray body 81 made of, for example, a synthetic resin material. In this embodiment, a total of 126 storage portions 82 are formed in the tray body 81 in an array of 7 rows and 18 columns.

  As shown in FIG. 2C, ribs 83 projecting downward are provided on the lower surface side of each accommodating portion 82. The rib 83 is formed so as to substantially face the periphery of the accommodating portion 82 of the other customer tray 8A when the customer tray 8A is stacked on the other customer tray 8A (described later). (See FIG. 6A).

  The cover tray 9 in the present embodiment has the same shape as the customer tray 8A, a flat tray main body 91, a large number of accommodating portions 92 provided on the tray main body 91, and the respective accommodating portions 92. And a rib 93 provided on the lower surface side.

The tray body 91 of the cover tray 9 is different from the customer tray 8A, for example, than a synthetic resin material constituting the customer tray 8A, such as a metal material such as aluminum or stainless steel, or a ceramic material such as alumina (Al ₂ 0 ₃ ). Consists of high strength materials. In this way, by configuring the cover tray 9 with a metal material, it is possible to ensure the strength necessary for pressing the IC device against the socket 70 (see FIG. 6E) of the test head 7. Further, when applying or removing thermal stress to the IC device in the application unit 300 or the heat removal unit 500, it is possible to efficiently apply thermal stress to the IC device. Further, the IC device can be positioned with high accuracy with respect to the socket 70 when the IC device and the socket 70 are contacted. The metal cover tray 9 may be subjected to a slow leak process or the like as a measure against ESD (Electro-Static Discharge).

  When the customer tray 8A and the cover tray 9 are reversed with the cover tray 9 placed on the customer tray 8A containing the IC device in the containing portion 82, the IC device is held by the rib 93 of the cover tray 9. (See FIG. 6B). Therefore, the rib 93 of the cover tray 9 in the present embodiment corresponds to an example of a cover tray holding portion in the present invention.

  Next, each part of the electronic component testing apparatus according to the present embodiment will be described in detail.

<Import-in part 200>
FIG. 3 is a plan view showing a mounting apparatus for an electronic component testing apparatus according to the present embodiment.

  As shown in FIG. 1, the carry-in unit 200 includes a first transfer device 210 that transfers the customer trays 8 </ b> A supplied to the handler 1 in a stacked state one by one to the first transfer device 230, and a customer A first attachment device 220 for covering the tray 8A with the cover tray 9 and a first transport device 230 for transferring the customer tray 8A to the application unit 300 are provided.

  As shown in FIG. 3, the first transfer device 210 includes a Y-axis direction rail 211 constructed on the device substrate of the handler 1 along the Y-axis direction, and the Y-axis direction rail 211 on the Y-axis direction rail 211. , And a holding head 213 that is provided at the tip of the movable arm 212 and that can be moved up and down by an actuator (not shown). The holding head 213 has an open / close type gripping claw 214 for gripping the customer tray 8A downward. The Y-axis direction rail 211 is provided so as to straddle the first transport device 230.

  In the first transfer device 210, the gripping head 213 grips the customer tray 8A positioned at the uppermost stage of the laminate including the customer trays 8A supplied to the handler 1 from the previous process by the gripping claws 214, and the actuator ( After the holding head 213 is lifted by (not shown), the movable arm 212 moves on the Y-axis direction rail 211 and delivers the customer tray 8A to the first transport device 230.

  As shown in FIG. 3, the first mounting device 220 includes an X-axis direction rail 221 installed on the device substrate of the handler 1 along the X-axis direction, and the X-axis direction rail 221 on the X-axis direction rail 221 in the X-axis direction. A movable arm 222 that can reciprocate along, and a gripping head 223 that is provided at the tip of the movable arm 222 and that can be moved up and down by an actuator (not shown). The gripping head 223 has an openable / closable gripping claw 224 for gripping the cover tray 9 on the lower side.

  In the first attachment device 220, the grip head 223 grips the cover tray 9 positioned at the end point of the first forwarding device 101 by the grip claws 224, and the holding head 223 is lifted by an actuator (not shown). Later, the movable arm 222 moves on the X-axis direction rail 221 so that the gripping cover tray 9 is placed on the customer tray 8A located on the first transport device 230. .

  By placing the cover tray 9 on the customer tray 8A, the IC device accommodated in the accommodating portion 82 of the customer tray 8A is suppressed by the rib 93 of the cover tray 9 (see FIG. 6A). When conveying the customer tray 8A, it is possible to prevent the IC device from jumping out of the customer tray 8A.

  The first forwarding device 101 is constituted by, for example, a belt conveyor provided on the device substrate of the handler 1, and the cover removed from the customer tray 8A by the second removal device 620 in the carry-out unit 600. The tray 9 is returned to the first attachment device 220 of the carry-in unit 200.

  As shown in FIG. 3, the first transport device 230 is configured by, for example, a large number of rotating rollers that can be driven by a motor or the like (not shown) arranged in two rows substantially in parallel. It is possible to move the customer tray 8A along.

  The first transport device 230 is moved by the first transfer device 210, and transfers the customer tray 8 </ b> A covered with the cover tray 9 by the first mounting device 220 to the application unit 300. .

<Applying unit 300>
FIG. 4A is a plan view showing a first reversing device of the electronic component testing apparatus according to this embodiment, and FIG. 4B is a front view of the first reversing device shown in FIG. 4A.

  The application unit 300 has a thermostatic chamber that applies a desired high or low temperature thermal stress to the IC device accommodated in the customer tray 8A, and as shown in FIG. 1, a state in which the vertical conveyance device conceptually shown in FIG. 1, the second conveyance device 310 that conveys the cover tray 9 and the customer tray 8A to the test unit 400, and the customer tray 8A and the cover tray 9 are overlapped. And a first reversing device 320 for reversing.

  The vertical conveying apparatus can hold a plurality of sets of customer trays 8A and cover trays 9, and can sequentially move these customer trays 8A and cover trays 9 in the Z-axis direction. Until the test unit 400 is empty, the customer tray 8A stands by in the application unit 300 while being held by the vertical transfer device, so that high-temperature or low-temperature thermal stress of about −55 to + 150 ° C. is applied to the IC device. Applied.

  The second transport device 310 is configured by, for example, a large number of rotating rollers that can be driven by a driving source (not shown) such as a motor arranged in two rows substantially in parallel, and a customer tray along the X-axis direction. 8A and the cover tray 9 can be moved.

  As shown in FIGS. 4A and 4B, the first reversing device 320 includes a pair of rotating portions 321 provided on the device substrate of the handler 1 and an extending portion provided in each rotating portion 321 so as to face each other. 322 and a chuck 323 provided at the tip of each extending portion 322.

  Each rotating part 321 is composed of, for example, a rotating motor and a gear mechanism (not shown) connected to the driving shaft thereof, and the extending part 322 can be rotated around the Y-axis direction. Yes.

  Each extending portion 322 is formed of, for example, an air cylinder, and the rod 322a can be extended along the Y-axis direction. The two extending portions 322 are arranged so that the tips of the rods 322a face each other. Therefore, the distance between the tips of the rods 322a is reduced when each of the extending portions 322 is extended, and conversely, the distance between the tips of the rods 322a is increased when each of the extending portions 322 is shortened.

  A chuck 323 is provided at the tip of the rod 322a of each extension 322. Each chuck 323 is capable of gripping the overlapping customer tray 8A and cover tray 9 by opening and closing by air pressure or the like.

  The first reversing device 320 is configured such that the customer tray 8A and the cover tray 9 are connected to the customer tray 8A while the second transport device 310 is transporting the customer tray 8A and the cover tray 9 from the vertical transport device to the test unit 400. From the state in which the cover tray 9 is covered on the cover tray 9 to the state in which the customer tray 8A is covered on the cover tray 9, it is rotated substantially 180 degrees.

  As shown in FIG. 4B, a part of the second transport device 310 is lowered during the reversal by the first reversing device 320 in order to avoid interference with the customer tray 8 </ b> A and the cover tray 9. Is possible.

<Test unit 400>
FIG. 5 is a plan view showing an attachment / detachment device for the electronic component testing apparatus according to the present embodiment.

  The test unit 400 presses the IC device held on the cover tray 9 against the socket 71 of the test head 7 while maintaining the thermal stress applied to the IC device, and the input / output terminals of the IC device and the socket 70 A test chamber is provided for performing a test of the IC device by making electrical contact with the contact pin 71. The upper portion of the test head 7 enters the inside of the test chamber through an opening (not shown) formed in the apparatus substrate, and the socket 70 is located inside the test chamber. In addition, as shown in FIG. 1, the customer tray 8A is removed from the cover tray 9 in which the IC device immediately before the test is accommodated in the test chamber, and when the IC device test is completed, An attachment / detachment device 410 for re-covering the customer tray 8A is provided.

  As shown in the figure, the attaching / detaching device 410 removes the customer tray 8A from the top of the cover tray 9, and moves the customer tray 8A to the second forwarding device 430, the first removing device 420, The second forwarding device 430 that transports the customer tray 8A moved by the removing device 420 to the second mounting device 440, and the customer tray 8A that is transported by the second forwarding device 430 are again placed on the cover tray 9. And a second mounting device 440 to be covered.

  As shown in FIG. 5, the first removal device 420 includes a Y-axis direction rail 421 installed on the device substrate of the handler 1 along the Y-axis direction, and the Y-axis direction rail 421 on the Y-axis direction rail 421. And a gripping head 423 provided at the tip of the movable arm 422 and capable of moving up and down by an actuator (not shown). The gripping head 423 has an open / close type gripping claw 424 for gripping the customer tray 8A downward. The Y-axis direction rail 421 is provided so as to straddle the second transfer device 310 and the second forwarding device 430.

  The second forwarding device 430 is configured by, for example, a belt conveyor, and can move the customer tray 8A from the operation region of the first removal device 420 to the operation region of the second attachment device 440. ing.

  As shown in the figure, the second attachment device 440 includes a Y-axis direction rail 441 erected along the Y-axis direction on the device substrate of the handler 1, and the Y-axis direction rail 421 on the Y-axis direction in the Y-axis direction. A movable arm 442 that can reciprocate along, and a gripping head 443 that is provided at the tip of the movable arm 442 and that can be moved up and down by an actuator (not shown). The gripping head 443 has an open / close type gripping claw 444 for gripping the customer tray 8A downward. The Y-axis direction rail 441 is provided so as to straddle the second forwarding device 430 and the third transport device 510.

  In the test unit 400, first, the first removal device 420 of the attachment / detachment device 410 removes the customer tray 8A from the cover tray 9 located on the second transport device 310 on the application unit 300 side, and the customer The tray 8A is moved to the second forwarding device 430.

  The cover tray 9 from which the customer tray 8A has been removed is moved onto the test head 7, and while being held on the cover tray 9, an IC is connected via a pusher (not shown) by a Z-axis drive mechanism (not shown). The device is pressed against the socket 70 of the test head 7 so that the input / output terminals of the IC device are in electrical contact with the contact pins 71 of the socket, and the IC device is tested by a tester (not shown) via the test head 7. Is done. The test result of the IC device is given to the customer tray 8A itself as an ID such as a barcode, or transferred as data from the handler 1 to the dedicated classification machine. When the test is completed, the cover tray is paid out from the test head 7 to the third transfer device 510 on the heat removal unit 500 side while holding the tested IC device.

  Simultaneously with the test of the IC device, the second forwarding device 430 moves the customer tray 8A along the X-axis direction. Next, when the cover tray 9 is positioned on the third transfer device 510 on the heat removal unit 500 side, the second mounting device 440 receives the customer tray 8A from the second forwarding device 430, and the cover tray 9 Cover the customer tray 8A again. The cover tray 9 and the customer tray 8A are transported to the heat removal unit 500 by the third transport device 510 in an overlapping state.

<Heat removal unit 500>
The heat removal unit 500 has a heat removal tank for removing the applied thermal stress from the tested IC device, and as shown in FIG. A third conveying device 510 that conveys the cover tray 9 from the test unit 400 to the heat removal unit 500 in an overlaid state, and a second inversion device 520 that inverts the cover tray 9 and the customer tray 8A in an overlaid state. And a vertical conveying device conceptually shown in FIG.

  The third transport device 510 is configured, for example, by arranging a large number of rotating rollers that can be driven by a driving source (not shown) such as a motor in two rows substantially in parallel, and the customer tray 8A along the X-axis direction. The cover tray 9 can be moved.

  The second reversing device 520 is not particularly shown, but, like the first reversing device 320 described above, a pair of rotating portions provided on the apparatus substrate of the handler 1 and each rotating portion so as to face each other. The extending part provided and the chuck | zipper provided at the front-end | tip of each extending part are provided.

  The second reversing device 520 is configured such that the customer tray 8A and the cover tray 9 are connected to the cover tray 9 while the third transport device 510 transports the customer tray 8A and the cover tray 9 from the test unit 400 to the vertical transport device. The customer tray 8A is rotated from the state where the customer tray 8A is covered to the state where the cover tray 9 is covered on the customer tray 8A.

  Although not particularly shown, a part of the third transport device 510 can be lowered by the second reversing device 520 during reversal in order to avoid interference with the customer tray 8A and the cover tray 9. It has become.

  The vertical conveying apparatus can hold a plurality of sets of customer trays 8A and cover trays 9, and can sequentially move these customer trays 8A and cover trays 9 in the Z-axis direction.

  In the heat removal unit 500, when a high temperature is applied to the IC device by the application unit 300, the IC device is cooled by air blowing and returned to room temperature, and then is carried out to the carry-out unit 600. On the other hand, when a low temperature is applied to the IC device by the application unit 300, the IC device is heated with warm air or a heater or the like to return to a temperature at which condensation does not occur, and then is carried out to the carry-out unit 600.

<Unloading unit 600>
As shown in FIG. 1, the carry-out unit 600 includes a fourth transfer device 610 that carries the customer tray 8A out of the heat removal unit 500, and a second removal device 620 that removes the cover tray 9 from above the customer tray 8A. And a second transfer device 630 for moving the customer tray 8A one by one from the fourth transport device 610 onto the stack of customer trays 8A carried out from the handler 1.

  As shown in FIG. 1, the fourth transport device 610 has the same configuration as the first transport device 210 of the carry-in unit 200, and substantially includes, for example, a number of rotating rollers that can be driven by a motor or the like. The customer tray 8A can be moved along the Y-axis direction.

  The fourth transport device 610 transports the customer tray 8A located at the top of the vertical transport device of the heat removal unit 500 to the transport unit 600.

  As shown in FIG. 1, the second removal device 620 has the same configuration as the first attachment device 220 of the carry-in unit 200, and includes an X-axis direction rail, a movable arm, a gripping head, and a gripping claw. I have.

  The second detaching device 620 removes the cover tray 9 covering the customer tray 8A located at the end point of the fourth conveying device 610 from the customer tray 8A, and the first forwarding device. Move to the start point of 101.

  As shown in FIG. 1, the second transfer device 630 has the same configuration as the first transfer device 210 of the carry-in unit 200, and includes a Y-axis direction rail, a movable arm, a gripping head, and a gripping claw. It has.

  The second transfer device 630 is located at the end point of the fourth transfer device 610, and the customer tray 8A from which the cover tray 9 has been removed by the second removal device 620 is transferred from the handler 1 to the subsequent process. It is transferred to the uppermost layer of the laminate composed of the customer tray to be carried out.

  The operation will be described below.

  6A to 6E are sectional views showing states of the customer tray and the cover tray in each process of the electronic component testing apparatus according to the present embodiment.

  First, when a laminated body constituted by laminating a plurality of customer trays 8A containing IC devices before the test is carried into the carry-in portion 200 of the handler 1, the customer tray 8A located at the top of the laminated body is loaded. The first transfer device 210 is moved onto the first transfer device 230. The customer tray 8A is loaded into the loading unit 200 of the handler 1 with the input / output terminal HB of the IC device facing downward.

  When the customer tray 8A is placed on the first transport device 230, the first mounting device 220 covers the cover tray 9 positioned at the end point of the first forwarding device 101 on the customer tray 8A. . When the cover tray 9 is put on the customer tray 8A, as shown in FIG. 6A, the lower portion of the cover tray 9 enters the upper portion of the customer tray 8A, and the IC device is accommodated in the accommodating portion 82 of the customer tray 8A. The rib 93 of the cover tray 9 presses the upper surface of the cover tray 9. Thereby, since the IC device is sandwiched between the customer tray 8A and the cover tray 9, it is possible to prevent the IC device from jumping out of the customer tray 8A during conveyance in the handler 1.

  Next, the first transport device 230 carries the customer tray 8A and the cover tray 9 into the application unit 300, and the vertical transport device sequentially raises the customer tray 8A in the application unit 300, while the IC device has high or low temperature heat. Stress is applied.

  The customer tray 8A that has been raised to the top of the vertical conveyance device is conveyed to the test unit 400 by the second conveyance device 310. During this conveyance, the first reversing device 320 rotates the customer tray 8A and the cover tray 9 that overlap each other substantially 180 degrees. When the customer tray 8A and the cover tray 9 are reversed by the first reversing device 320, as shown in FIG. 6B, the customer tray 8A is put on the cover tray 9, and the IC device has its input / output terminals. The HB is held on the cover tray 9 with the posture facing upward.

  When the customer tray 8A and the cover tray 9 are carried into the test unit 400, as shown in FIG. 6C, the first removal device 420 of the attachment / detachment device 410 removes the customer tray 8A from the top of the cover tray 9, and the cover tray 9 is conveyed below the test head 7, and the customer tray 8 </ b> A is transferred to the second forwarding device 430.

  As shown in FIG. 6D, the test head 7 in the present embodiment includes four guide posts 72 protruding downward. These guide posts 72 are provided around the socket 70 so as to surround the four corners of the IC device held by the ribs 93 of the cover tray 9 when the IC device is pressed against the socket 71. Inclined tapered surfaces 73 are formed at the tip portions of the side surfaces of the guide posts 72 facing each other.

  When the cover tray 9 from which the customer tray 8A has been removed is conveyed below the test head 7, a Z-axis drive mechanism (not shown) is connected to the IC held by the cover tray 9 via a pusher (not shown). The device is pressed against the socket 70 to bring the input / output terminal HB of the IC device into electrical contact with the contact pin 71 of the socket 70, and a tester (not shown) performs a test of the IC device via the test head 7.

  Although only one socket 70 is shown in FIGS. 6D and 6E, actually, for example, the same number (M = N) as the total number (N) of the accommodating portions 82 of the customer tray 8A, The total number (N) divided by an integer (M = N / A, where A is an integer) or an integer multiple of the total number (M = N × A, where A is an integer) socket 70 is provided on the test head 7, and a plurality of IC devices are tested simultaneously.

  A large number of sockets 70 on the test head 7 are arranged at the same pitch as the pitch between the accommodating portions 82 of the customer tray 8A or an integer multiple of the pitch. When the socket 70 is arranged at an integer multiple of the pitch of the accommodating portion 82 of the customer tray 8A, the IC device is tested by skipping one or a plurality of holding portions 92 of the cover tray 9 and as a result. In addition, the IC device is tested a plurality of times.

  At the time of this pressing, the IC device is guided to the socket 70 along the tapered surface 73 formed at the tip of each guide post 72. As shown in FIG. 6E, the input / output terminal HB of the IC device and the socket 70 are connected. Immediately before the contact pin 71 comes into contact, the IC post is positioned with respect to the socket 70 by the guide post 72 with high accuracy. As shown in FIG. 6E, in order to avoid interference between the guide post 72 and the cover tray 9 when the guide post 72 guides the IC device, the periphery of the rib 93 is formed in a concave shape in the cover tray 9. Has been.

In the present embodiment, as shown in the figure, the IC device is in such a posture that the input / output terminal HB faces upward when executing the test. For this reason, the length L ₁ (see FIG. 6D) of the contact pin 71 of the socket 70 is made shorter than when the IC device test is executed with the input / output terminal HB facing downward (see FIG. 7B). can do. Therefore, it is effective when testing an IC device using a high frequency signal.

  When the test of the IC device is completed, after the customer tray 8A is placed on the cover tray 9 holding the tested IC device by the second attachment device 440 of the attachment / detachment device 410, the second transport device It is carried out to the heat removal part 500 by 520.

  In the heat removal unit 500, after the second reversing device 520 reverses the customer tray 8A and the cover tray 9 that overlap each other, the IC device is removed from the heat, and the vertical transfer device serves as the customer tray 8A and the cover tray. 9 is sequentially lowered and delivered to the fourth transport device 610.

  When the customer tray 8A and the cover tray 9 are transported to the carry-out section 600 by the fourth transport device 610, the second removal device 620 removes the cover tray 9 from above the customer tray 8A, and the customer tray 8A Then, the second transfer device 630 transfers it to the uppermost stage of the laminate composed of the customer trays carried out from the handler 1 to the subsequent process.

  FIG. 7A is a cross-sectional view showing a state in which an IC device housed in a cover tray is approaching a socket in another embodiment of the present invention, and FIG. 7B is an input / output terminal of the IC device in another embodiment of the present invention. It is sectional drawing which shows the state which is contacting the contact pin of a socket electrically.

  In another embodiment of the present invention, the IC device is not tested while being held in the cover tray 9, but is tested while being stored in the customer tray 8B.

  As shown in FIGS. 7A and 7B, the customer tray 8B according to another embodiment of the present invention has a recess 84 into which the upper portion of the socket 70 can enter, below the accommodating portion 82 that accommodates the IC device. Yes. The recess 84 communicates with the upper accommodating portion 82 via the opening 85. The opening 85 has a size such that all the input / output terminals HB of the IC device accommodated in the accommodating portion 82 face the recess 84.

  When the Z-axis drive mechanism (not shown) is lowered during the test of the IC device, as shown in FIG. 7B, the upper portion of the socket 70 enters the recess 84 of the customer tray 8, and the input / output terminal HB of the IC device is connected to the socket 70. Electrical contact is made with the contact pin 71.

  When this customer tray 8B is used, there is no need to transfer the IC device from the customer tray 8B to the cover tray 9B, so that the first reversing device 320 of the application unit 300 and the second reversing device 520 of the heat removal unit 500 are used. Is no longer necessary. Accordingly, the first removing device 420 of the attaching / detaching device 410 removes the cover tray 9 from above the customer tray 8B, and the IC device is pressed against the socket 70 of the test head 7 while being accommodated in the customer tray 8B. Then, the second forwarding device 430 forwards the cover tray 9, and the second mounting device 440 puts the cover tray 9 on the customer tray 8B.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, the customer tray 8A is used instead of the metal cover tray 9 when the strength required for pressing can be ensured or when the IC device positioning accuracy with respect to the socket 70 at the time of contact is not required. Then, an empty customer tray 8A may be put on the customer tray 8A containing the IC devices to prevent the IC devices from being dispersed.

  In the above-described embodiment, the customer tray 8A and the cover tray 9 are described to be reversed immediately before and after the test. However, in the present invention, the present invention is not particularly limited thereto. The mounting device 220 reverses the cover tray 9 immediately after the cover tray 9 is placed on the customer tray 8A, and the unloading unit 600 reverses the cover tray 9 immediately before the cover tray 9 is removed from the customer tray 8A by the second removal device 620. You may comprise.

  Further, without providing the guide post 72 around the socket 70 or in addition to the guide post 72, the test head 7 is provided with a guide pin and a guide hole is formed in the cover tray 9, so that The cover tray 9 may be positioned.

Claims (12)

An electronic component testing apparatus used for testing an electronic device under test,
A customer tray having a housing portion for housing the electronic device under test, or a cover tray in which a holding portion for holding the electronic device under test is arranged in substantially the same arrangement as the housing portion of the customer tray, A test unit that presses the electronic device under test against a socket of a test head in a state in which the electronic device under test is accommodated or held, and electrically contacts an input / output terminal of the electronic device under test with a contact pin of the socket When,
An electronic component testing apparatus comprising: a transport unit configured to transport the customer tray or the cover tray holding or holding the electronic device to be tested to the test unit.   2. The electronic component according to claim 1, wherein the test unit presses the input / output terminal of the electronic device under test against the contact pin of the socket in a state where the input / output terminal of the electronic device under test is facing upward. Test equipment.   3. The electronic component testing apparatus according to claim 1, wherein the cover tray is made of a material having a higher strength than a material constituting the customer tray.   The electronic component testing apparatus according to claim 1, further comprising mounting means for covering the cover tray or the customer tray on the customer tray or the cover tray. The attachment means includes
First mounting means for covering the cover tray on the customer tray containing the electronic device under test before testing;
The electronic component testing apparatus according to claim 4, further comprising: a second attachment unit that covers the customer tray on the cover tray that houses the tested electronic component after the test.   The electronic component testing apparatus according to claim 4, further comprising a reversing unit configured to reverse the customer tray covered with the cover tray or the cover tray covered with the customer tray. The inversion means is
First reversing means for accommodating the electronic device under test before testing and reversing the customer tray covered with the cover tray;
The electronic component testing apparatus according to claim 6, further comprising: a second reversing unit that retains the electronic component to be tested after the test and reverses the cover tray on which the customer tray is covered.   The electronic component testing apparatus according to any one of claims 4 to 7, further comprising removing means for removing the customer tray or the cover tray from above the cover tray or the customer tray. The removing means includes
First removing means for removing the customer tray from the top of the cover tray holding the electronic device under test before testing;
9. The electronic component testing apparatus according to claim 8, further comprising: a second removing unit that removes the cover tray from above the customer tray accommodating the electronic device under test after the test.   10. The electronic component according to claim 8, further comprising a forwarding means for forwarding the cover tray or the customer tray from the removing means or the attaching means to the attaching means or the removing means. Test equipment. The forwarding means is
First feeding means for feeding the cover tray from the second removing means to the first mounting means;
Second routing means for routing the customer tray from the first removal means to the second attachment means;
The electronic component testing apparatus according to claim 10, comprising:   12. The electronic component according to claim 1, wherein the test head includes guide means for guiding the electronic device under test held on the cover tray with respect to the socket. Test equipment.

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